Audio amplifier and method for cooling audio amplifier

Abstract

To dissipate heat in audio amplifiers in an effective manner.SOLUTION: An on-vehicle audio amplifier (1) comprises a bottom wall (12) and a shell (11) connected to the bottom wall (12) to form a housing space for housing an electronic card (15) including a plurality of electronic components. The shell (15) comprises a cooling plate (111) in parallel with the bottom wall (12) and comprises a plurality of studs (111F) projecting in the housing space from its inside face (111A) towards the bottom wall (12), where the plurality of electronic components come into contact with the plurality of studs (111F). Further, the cooling plate (111) comprises a finned portion projecting from an outside face, the finned portion being interposed between the outside face and a lid (13) fixed to the shell (11) and in parallel with the bottom wall (12) to form a duct system. A fan (14) is positioned between the lid (13) and the outside face of the cooling plate (111), for generating a flow of air through the duct system.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to an audio amplifier and a method for cooling an audio amplifier.

[0002] In particular, the technical field is that of a system for dissipating heat generated inside an audio amplifier, in particular an audio amplifier for use in a vehicle. [Background technology]

[0003] In particular, in the automotive field, the need is felt to dissipate the heat of audio amplifiers of reduced dimensions in an effective manner.

[0004] Patent document US10076062B2 shows a heat dissipation system in an audio amplifier. The described audio amplifier comprises an electronic card arranged inside a housing, the housing having fins on its outer surface. In particular, the electronic card is fixed with an associated edge to the inside of the side of the housing. Heat generated by the components of the electronic card is transferred to the housing at the contact points and passes through a duct system defined by the fins. However, since the electronic board is arranged inside the interior space of the housing, the transfer of heat from the electronic board to the fins is not very efficient. Furthermore, due to the arrangement of the fins and their general shape, the audio amplifier of US10076062B2 is not very suitable to be mounted inside a vehicle.

[0005] Patent documents WO2018 / 196141A1, EP3349555A1, and JP2022110640A describe examples of dissipation systems in audio amplifiers, but even these systems do not meet market needs. Summary of the Invention

[0006] SUMMARY OF THE PRESENT EMBODIMENT It is an object of the present invention to provide an audio amplifier and a method for cooling an audio amplifier that overcomes the above-mentioned drawbacks of the prior art.

[0007] In particular, it is an object of the present invention to provide an audio amplifier and a method for cooling the amplifier that allows heat to be dissipated efficiently.

[0008] It is also an object of the present invention to provide an audio amplifier and method for cooling the amplifier in which the electronics card is protected from factors external to the amplifier.

[0009] It is a further object of the present invention to provide a compact amplifier circuit suitable for installation in a vehicle.

[0010] Said object is fully achieved by the present invention as characterized in the appended claims.

[0011] In particular, the audio amplifier comprises a bottom wall. The audio amplifier comprises a shell. The shell is connected to the bottom wall and forms an intervening receiving space. Preferably, the receiving space is a (substantially) closed space.

[0012] The audio amplifier includes a cold plate. In particular, the shell includes the cold plate. The cold plate is parallel to the bottom wall. Preferably, the cold plate defines a front wall of the shell. The cold plate has an inner surface facing the storage space and an outer surface opposite the inner surface.

[0013] The cooling plate is provided with a finned portion. The finned portion protrudes from the outer surface. In particular, the finned portion includes a plurality of fins. Each fin has an extension (length) in (i.e., along) a plane defined by the cooling plate. Each fin extends between a first end and a second end. Each fin has a height or depth in (i.e., along) a plane transverse to (or parallel to) the plane defined by the cooling plate. Each fin protrudes from the outer surface of the cooling plate. More particularly, each fin protrudes from the outer surface in an opposite direction relative to the containment space.

[0014] The amplifier, and in particular the cooling plate, includes a number of studs that protrude from the inner surface of the receiving space toward the bottom wall.

[0015] The amplifier comprises an electronic card. The electronic card is arranged in the receiving space. The electronic card is configured to process (i.e. amplify) an audio signal. The electronic card comprises a number of electronic components. The number of studs abuts, i.e. is in contact with, the electronic card. In particular, the electronic components are arranged on the card such that the number of studs of the cooling plate abuts and contacts the electronic components. According to one example, all the electronic components are located on the electronic board. Preferably, the electronic card is arranged inside the receiving space parallel to the bottom wall. According to one example, the distance between the bottom wall and the electronic card is smaller than the distance between the electronic card and the cooling wall.

[0016] In one example, the amplifier comprises a lid. The lid is fixed to the shell, in particular to the front wall of the shell. The lid is disposed parallel to the bottom wall, whereby the finned portion is interposed between the lid and the outer surface of the cold plate to define a duct system. The purpose of the plurality of studs is to transfer heat generated by the electronic card (i.e. by the electronic components) to the cold plate in an efficient manner.

[0017] The amplifier comprises a fan configured to generate an air flow. The fan is configured to generate an air flow through the dust system. In particular, the fan is configured to generate an outgoing air flow towards the fan through the duct system. In particular, the fan is configured to generate a return air flow from the fan. The purpose of the air flow generated by the fan is to transfer, through the duct system, the heat generated by the electronic card and transferred to the cooling plate by the multiple studs. It is to be noted in particular that the air flow is outside the accommodation space, so that it does not directly contact the electronic card or the electronic components located in the accommodation space. In other words, the path of the air flow is away from the electronic components. This feature provides the advantage of protecting the electronic card and its components from contamination by external factors, such as dirt and moisture.

[0018] In one embodiment, the lid is attached to the shell to define a cooling volume. The cooling volume is at least partially open to an environment external to the amplifier. Preferably, the cooling volume and the containment space are isolated from each other. The containment volume is isolated from the environment external to the amplifier.

[0019] The lid may be attached to the shell such that the fan is at least partially covered, in other words, the fan is interposed between the lid and the shell.

[0020] According to an exemplary embodiment, the studs are (only) located on the finned portion of the cooling plate, thus optimizing the transfer of heat as the studs abut the electronic card with the electronic components, confining it to the zone where the heat is most generated.

[0021] The cold plate may comprise one or more non-finned (and therefore fin-free) portions, i.e. one or more flat portions. Preferably, the non-finned portions are free of studs.

[0022] For example, the shell includes a sidewall. The sidewall protrudes from the cold plate (i.e., from the front wall). The sidewall is perpendicular to the development plane of the cold plate (i.e., the front wall). The sidewall is connected to the cold plate (i.e., to the front wall) along the periphery of the cold plate. The sidewall may have a front surface. The amplifier includes one or more electrical connectors connected to the electronic card. The one or more electrical connectors may be located on the front surface of the sidewall.

[0023] The amplifier includes an air outlet opening that is in fluid communication with the finned portion, and in particular in communication with the plurality of fins.

[0024] According to one embodiment, the front face of the side wall defines an outlet opening in fluid communication with the duct system. In other words, the front face of the side wall comprises the outlet opening (said outlet opening). The fan may be disposed between the finned portion and the outlet opening.

[0025] Preferably, the lid comprises a grid, which may be arranged at the outlet opening.

[0026] In particular, the lid may be coupled to the shell such that the grid is disposed at the outlet opening in the side wall.

[0027] Thus, the airflow generated by the fan exits through the outlet opening.

[0028] Preferably, the grid is made integral with the lid.

[0029] In one embodiment, the duct system is radially arranged.

[0030] The duct system has a plurality of inlet openings such that airflow generated by the fan enters the duct system through the plurality of inlet openings, passes through the duct system, and exits through an exit opening.

[0031] The sidewall may have a first side and a second side. The second side is opposite the first side. The first and second sides are spaced from the front side. The sidewall may have a rear side opposite the front side. The first and second sides are spaced from the rear side. The first and second sides, the front and the rear define a sidewall having a rectangular shape.

[0032] Preferably, the plurality of inlet holes are located on the rear face and / or the first side face and / or the second side face.

[0033] More preferably, the multiple inlet holes are located on the rear face, the first side face and the second side face. The inlet holes are located on three separate faces of the side wall to facilitate the ingress of fresh air even when the amplifier is not optimally positioned, for example when one face of the side wall is partially blocked by the placement of the amplifier in the vehicle.

[0034] In one embodiment, the plurality of fins are radially arranged. Each fin extends between a first end and a second end. The first end is proximal to the fan. The second end is proximal to the sidewall of the shell. In one embodiment, the second end is proximal to at least one of the rear surface, the first side surface, and the second side surface. In other words, the second end of the fin may be distributed by at least one of the rear surface, the first side surface, and the second side surface.

[0035] According to one example, the outlet opening is located at a central position on the front surface. The duct system includes a plurality of ducts.

[0036] The duct system includes a plurality of inlet holes. In one example, each duct is defined by an adjacent pair of fins. Each duct defines an inlet hole. Specifically, the inlet hole is defined by a second end of an adjacent pair of fins. The inlet hole may be disposed in a sidewall of the shell. In one embodiment, the inlet hole is disposed in at least one of the rear face, the first side face, and the second side face.

[0037] The duct system has a plurality of exit holes, and in one example, each duct defines an exit hole, particularly defined by first ends of a pair of adjacent fins.

[0038] The inlet holes are disposed in the sidewalls of the shell and the outlet holes are in fluid communication with the outlet opening via the fan, so that air enters through the inlet holes, passes through a duct to the outlet holes, and is forced by the fan to exit through the outlet opening.

[0039] In one embodiment, the duct system is arranged radially, in particular the ducts are arranged radially.

[0040] Preferably, the ducts are radially arranged and communicate the outlet openings with the inlet openings of the duct system.

[0041] According to one embodiment, the shell is made of a thermally conductive metallic material. According to one embodiment, the shell is made in one piece, i.e., the shell is made of a thermally conductive solid material. According to one embodiment, the shell is made by die casting.

[0042] According to one embodiment, the electronic component abutting the plurality of studs includes a power supply. The electronic component (i.e., the power supply) may include a power switch and / or an integrated electronic power component.

[0043] According to an exemplary embodiment, the amplifier, in particular the shell and / or the bottom wall, comprises a set of fastening studs (protruding from an inner side) connected to the electronic card and to the shell and / or bottom wall of the amplifier. In particular, the studs of the set of fastening studs are configured for fastening the electronic card to the shell and / or the bottom wall by means of a fastening screw. Preferably, the set of fastening studs protrudes from the inner side towards the bottom wall into the receiving space and is configured for fastening the electronic card to the shell by means of a fastening screw.

[0044] The fan is configured to rotate about an axis of rotation, preferably perpendicular to the plane defined by the cooling plate, in particular perpendicular to the direction of deployment of the fins (in other words, perpendicular to the duct system).

[0045] According to one example, the fan comprises a plurality of blades arranged in a circle around an axis of rotation and configured to rotate around the axis of rotation. Preferably, the axis of rotation is perpendicular to the plane defined by the cooling plate. The fan may comprise a housing, and the plurality of blades may be arranged inside the housing. The housing is preferably box-shaped. The housing may be elongated mainly along a plane of development parallel to the plane defined by the cooling plate. In other words, the housing may be elongated mainly along a plane of development perpendicular to the axis of rotation of the plurality of blades. By rotating the blades, the fan generates an air flow. In particular, the fan is configured to generate an outflow towards the fan and a return flow away from the fan by the rotation of the blades.

[0046] The housing has an air inlet and an air outlet. The outflow enters the housing through the inlet and exits through the outlet. Preferably, the inlet is arranged in a development plane of the housing. The inlet may have a circular shape. The inlet may be arranged in a plurality of blades aligned with the axis of rotation. Preferably, the outlet is arranged in a plane perpendicular to the development plane of the housing (i.e. parallel to the axis of rotation). When the fan is arranged in the audio amplifier, the outlet of the housing is arranged at the outlet opening. The fan is configured to draw air from the inlet. The fan is configured to diffuse the air radially with respect to the axis of rotation and convey the outlet air in a predetermined direction through the outlet of the housing. This feature has the objective of having a reduced space for arranging the fan and increasing the efficiency of forced circulation by the fan.

[0047] According to one example, the shell comprises a seat between the finned portion and the outlet opening, the seat defining a recess (i.e. a recess) towards the bottom wall with respect to a plane defined by the cooling plate (i.e. with respect to the finned portion), the seat being configured to house the fan, i.e. the fan is at least partially housed in the seat of the shell.

[0048] In particular, the sheet has a first space and a second space. The first space and the second space are aligned along an axis perpendicular to the plane defined by the cooling plate. In particular, the first space is configured to accommodate a fan, i.e. the housing of the fan is located in the first space. The second space is isolated from the external environment. The second space constitutes a compensation space for the air arriving from the duct system and entering the housing of the fan.

[0049] The sheet of the shell comprises one or more support elements in the first space configured to support the fan housing in the first space. For example, the shell comprises a pair of pins located in the sheet near the finned portion. The pair of pins may be configured to couple to a corresponding pair of pins on the fan housing. The shell may comprise a support element located in the sheet near the front surface to support the fan housing. The fan is accommodated in the sheet (particularly in the first space) such that the outlet of the housing coincides with the outlet opening.

[0050] The present invention also provides a method of cooling an audio amplifier, preferably the amplifier being manufactured in accordance with one or more aspects of the present invention.

[0051] The method includes the steps of providing a bottom wall. The method includes the steps of providing a shell. The shell is connected to the bottom wall to form an interposed containment space. Preferably, the containment space is a (substantially) closed space.

[0052] The shell includes a cold plate. The cold plate is disposed parallel to the bottom wall, i.e., the method includes the step of providing a cold plate parallel to the bottom wall. The cold plate has an inner surface facing the storage space and an outer surface opposite the inner surface.

[0053] The method may include providing a cooling plate having an interior surface facing the containment space.

[0054] The cooling plate is provided with a finned portion. In other words, the method may comprise the step of providing a finned portion on the cooling plate. The finned portion protrudes from an outer surface. In particular, the finned portion comprises a plurality of fins. Each fin has an extension (length) in (i.e. along) a plane defined by the cooling plate. Each fin has a height or depth in (i.e. along) a plane transverse (or parallel) to the plane defined by the cooling plate. Each fin protrudes from an outer surface of the cooling plate. More particularly, each fin protrudes from the outer surface in an opposite direction to the accommodation space.

[0055] The cooling plate includes a plurality of studs, the studs protruding from an inner surface of the receiving space toward a bottom wall. In other words, the method may include the step of providing a plurality of studs protruding from the inner surface into the receiving space toward the bottom wall.

[0056] The method includes the step of preparing an electronic card. The electronic card is placed in the receiving space, i.e. the step of preparing the electronic card includes placing the electronic card in the receiving space. The electronic card processes (i.e. amplifies) the audio signal.

[0057] The electronic board includes a number of electronic components. The number of studs abuts, i.e. is in contact with, the electronic card. In particular, the electronic components are arranged on the card such that the number of studs of the cooling plate abuts and contacts the electronic components.

[0058] According to one example, the method includes providing a lid, the lid being secured to the shell, the lid being positioned parallel to the bottom wall such that a finned portion is interposed between the lid and an exterior surface of the cold plate to define a duct system.

[0059] The method includes generating an airflow with a fan. The method may include providing a fan. Preferably, the fan is located between the lid and an exterior surface of the cold plate. The airflow passes through a duct system.

[0060] There may be the step of passing the airflow generated by the fan through a duct system.

[0061] The method may include transferring heat generated by an electronic component of the electronic card from the electronic component to a cold plate. The method may include transporting the heat through a duct system of the cold plate by an airflow generated by a fan.

[0062] According to an exemplary embodiment, the plurality of studs are (only) located on the finned portion of the cooling plate. The method may include transferring heat from an electronic component of the electronic card to the finned portion of the cooling plate by the plurality of studs.

[0063] The cooling plate may comprise one or more portions that are unfinned (and therefore devoid of fins), i.e. one or more flat portions. Preferably, the non-finned portions are devoid of studs.

[0064] For example, the shell includes a sidewall. The sidewall is connected to the cold plate along a perimeter of the cold plate (i.e., to a front wall). The sidewall may have a front surface. The amplifier includes one or more electrical connectors connected to an electronic card. The one or more electrical connectors may be disposed on the front surface of the sidewall.

[0065] According to one embodiment, the front surface of the sidewall defines an outlet opening in fluid communication with the duct system. The fan may be disposed between the fin and the outlet opening. The method may include providing a sidewall with a front surface on the shell and providing one or more electrical connectors connected to an electronic card and disposed on the front surface of the sidewall. The method may include disposing the fan between the outlet opening provided on the front surface of the sidewall and the fin. The method may include providing fluid communication between the outlet opening and the fin via the fan.

[0066] In particular, the shell includes a sidewall having a front surface defining an outlet opening, and the method includes passing air between the fins and the outlet opening via a fan disposed between the fins and the outlet opening.

[0067] According to one embodiment, the outlet opening is located at a central position on the front surface. The duct system comprises a plurality of ducts. Preferably, the ducts are radially arranged and communicate the outlet opening with an inlet hole of the duct system.

[0068] According to one embodiment, the shell is made of a thermally conductive metallic material. According to one embodiment, the shell is made in one piece, i.e., the shell is made of a thermally conductive solid material. According to one embodiment, the shell is made by die casting.

[0069] The sidewall may have a first side and a second side. The second side is opposite the first side. The first and second sides are spaced from the front side. The sidewall may have a rear side opposite the front side. The first and second sides are spaced from the rear side. The first and second sides, the front and the rear define a sidewall having a rectangular shape.

[0070] Preferably, the plurality of inlet holes are located on the rear face and / or the first side face and / or the second side face.

[0071] More preferably, the plurality of inlet holes are located on the rear surface, the first side surface and the second side surface.

[0072] The method may include admitting the air flow through a plurality of inlet openings. The method may include passing the air flow through a duct system. The method may include allowing the air flow to escape through an outlet opening.

[0073] According to one example, the electronic component abutting the plurality of studs comprises a power supply. The electronic component (i.e., the power supply) may include a power switch and / or an integrated electronic power component.

[0074] According to an exemplary embodiment, the method includes providing the shell and / or bottom wall with a set of fastening studs connected to the electronic card and the shell and / or bottom wall. The method may include fastening the electronic card to the shell and / or bottom wall using fastening screws.

[0075] Preferably, the method includes the steps of providing a group of fastening studs protruding from the inner surface into the receiving space toward the bottom wall, and fastening the electronic card to the shell via the fastening studs by means of fastening screws.

[0076] According to one example, the fan includes a plurality of blades arranged in a circular fashion around a rotation axis. The method may include the step of rotating the plurality of blades around the rotation axis. Preferably, the rotation axis is perpendicular to a plane defined by the cooling plate. The fan may include a housing, and the plurality of blades may be arranged in the housing. The housing is preferably box-shaped. The housing may be elongated mainly along a plane of development parallel to the plane defined by the cooling plate. In other words, the housing may be elongated mainly along a plane of development perpendicular to the rotation axis of the plurality of blades. By rotating the blades, the fan generates an airflow. In particular, the fan generates an outflow toward the fan and a return flow away from the fan due to the rotation of the blades.

[0077] The housing has an air inlet and an air outlet. The outflow enters the housing at the inlet and exits at the outlet. Preferably, the inlet is arranged in a plane of development of the housing. The inlet may have a circular shape. The inlet may be arranged on a plurality of blades aligned with the axis of rotation. Preferably, the outlet is arranged in a plane perpendicular to the plane of development of the housing (i.e. parallel to the axis of rotation). When the fan is placed in the audio amplifier, the outlet of the housing is located at the outlet opening. The method may include drawing air from the inlet of the housing by the fan. The method may include diffusing the air radially relative to the axis of rotation. The method may include conveying or passing the air in a predetermined direction through the outlet of the housing.

[0078] According to one example, the shell comprises a sheet between the finned portion and the outlet opening, the sheet defining a recess (i.e. a recess) towards the bottom wall with respect to a plane defined by the cold plate (i.e. with respect to the finned portion).

[0079] The fan may be at least partially housed within the sheet of the shell.

[0080] In particular, the sheet has a first space and a second space. The first space and the second space are aligned along an axis perpendicular to the plane defined by the cooling plate. In particular, the housing of the fan is located in the first space. The second space is isolated from the external environment. The second space constitutes a compensation space for the air arriving from the duct system and entering the housing of the fan.

[0081] The sheet of the shell comprises, in the first space, one or more support elements for supporting the housing of the fan in the first space. For example, the shell comprises a pair of pins located in the sheet near the finned portion. The pair of pins may be coupled to a corresponding pair of pins of the housing of the fan. The shell may comprise a support element located in the sheet near the front surface for supporting the housing of the fan. The fan is accommodated in the sheet (particularly in the first space) such that the outlet of the housing coincides with the outlet opening. [Brief description of the drawings]

[0082] This and other features will become more apparent from the following description of preferred embodiments of the invention, illustrated by way of non-limiting example in the accompanying drawings, in which: [Figure 1A-1B] 1 illustrates an exploded view of an audio amplifier according to one or more embodiments of the present invention. [Figure 1C] FIG. 1C shows an enlarged view of a detail of FIG. [Figure 2A-2C] 1 illustrates an audio amplifier according to one or more embodiments of the present invention. [Diagram 3] 1 illustrates an audio amplifier according to one or more embodiments of the present invention, with the airflow direction shown diagrammatically. [Figure 4A-4C] 1 illustrates a fan of an audio amplifier according to one or more embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0083] In the accompanying drawings, numeral 1 denotes an audio amplifier. The audio amplifier 1 comprises a shell 11 and a bottom wall 12. The shell 11 and the bottom wall 12 are connected to each other to form a housing space that is substantially closed off from the outside environment.

[0084] The shell 11 comprises a cold plate 111 forming a front wall of the shell 11. The cold plate 111 (i.e. the front wall) is arranged parallel to the bottom wall 12. The cold plate 111 and the bottom wall 12 have substantially the same development. The shell 11 comprises a side wall 112. The side wall 112 is connected to the front wall (i.e. the cold plate 111) along the periphery of the front wall and is arranged perpendicular to the front wall (i.e. the cold plate 111) and the bottom wall 12.

[0085] The side wall 112 has a front surface 112A and a rear surface 112B opposite the front surface 112A. The side wall 112 has a first side surface 112C and a second side surface 112D opposite the first side surface 112C. The first side surface 112C and the second side surface 112D are spaced apart from the front surface 112A and the rear surface 112B. The shell 11 and the bottom wall 12 together define a body having a box shape.

[0086] In particular, the side wall 112 comprises four corner elements 112E disposed at corners defined by faces 112A, 112B, 112C and 112D of the side wall 112. The corner elements 112E protrude from the corners of the side wall 112 along a plane perpendicular to the side wall 112 (i.e. parallel to the bottom wall 12 or the cooling plate 111). Each corner element 112E comprises a slot. Each slot is configured to receive a fastening screw for fastening the audio amplifier 1 to a support surface, for example, of a vehicle.

[0087] The cooling plate 111 has an inner surface 111A facing the storage space and an outer surface 111B opposite the inner surface 111A. The cooling plate 111 includes a finned portion 111C protruding from the outer surface 111B and including a plurality of fins A. Each fin A extends along a plane defined by the cooling plate 111, and the height of each fin A extends in a plane transverse (or parallel) to the plane defined by the cooling plate 111. In particular, each fin A is spaced apart from an adjacent fin A.

[0088] The audio amplifier 1 comprises a lid 13. The lid 13 is preferably fixed to the front wall (i.e., the cooling plate 111) of the shell 11 and is disposed parallel to the bottom wall 12 (i.e., the front wall). In this manner, a finned portion 111C is interposed between the lid 13 and the outer surface 112B of the cooling plate 111 to define a duct system. In particular, the duct system is formed by adjacent pairs of fins A.

[0089] The audio amplifier 1 includes a fan 14 configured to generate airflow through the duct system.

[0090] In particular, the front surface 112A of the side wall 112 has an outlet opening 121 in fluid communication with the duct system such that the duct system is in communication with the outside environment. The fan 14 is disposed between the fins (duct system) and the outlet opening 121.

[0091] In particular, the lid 13 comprises a grid 131. The lid 13 comprises a main wall that is parallel to the cold plate 11 when attached to the shell 11. The grid 131 projects vertically from the main wall of the lid 13 such that the grid 131 is located at the outlet opening 121 when the lid 13 is coupled to the shell 11.

[0092] The duct system has a plurality of inlet holes 111D, i.e., each duct comprises an inlet hole 111D. The airflow generated by the fan 14 enters through the plurality of inlet holes 111D and passes through the duct system (particularly through the ducts). The plurality of inlet holes 111D are arranged on the rear face 112B, the first and second side faces 112C, 112D. The duct system has a plurality of outlet holes 111E. The outlet holes 111E are located on the fan 14. Particularly, the ducts of the duct system are arranged radially between the outlet holes 111E and the inlet holes 111D. The outlet openings 121 are in fluid communication with the outlet holes 111E through the fan 14 and in fluid communication with the inlet holes 111D through the duct system. The airflow enters the duct system from the inlet holes 111D, passes through the duct system and leaves the duct system through the outlet holes 111E. The airflow then enters the fan 14 and exits the audio amplifier 1 through the outlet opening 121. In particular, the fan 14 may include a plurality of blades 141 and a housing 142. The plurality of blades 141 are arranged inside the housing 142, arranged in a circular shape around a rotation axis, and configured to rotate around the rotation axis to generate an airflow. The rotation axis of the blades 141 is arranged perpendicular to the cooling plate 111. Preferably, the housing 142 is box-shaped and elongated mainly along a development plane parallel to the plane defined by the cooling plate 111 (in other words, the housing 142 is elongated along a development plane perpendicular to the rotation axis of the blades 141). The housing 142 has an air inlet 142A and an air outlet 142B. The fan 14 is configured to generate an outgoing flow toward the fan 14 and a return flow 14 from the fan 14. The outgoing flow enters the housing 142 from the inlet 142A and exits from the housing outlet 142B. Preferably, the inlet 142A is disposed on the development plane of the housing 142. In particular, the inlet 142A is a circular opening located on the blades 142 about the axis of rotation. Preferably, the outlet 142A of the housing 142 is disposed on a plane perpendicular to the development plane of the housing 142 at the outlet opening 121. The fan 14 is a "fan unit."

[0093] The fan 14 is positioned on the shell 11 such that the housing 142 is spaced from the upper surface of the cooling plate 111, thus defining an air volume between the upper surface of the cooling plate 111 and the fan housing 142 which acts as a manifold, the manifold being in fluid communication with the duct system defined by the fins and in fluid communication with the suction of the fan 14. The shell defines a central support surface 17 located distally from the duct system and a pair of spacer studs 18 located proximal to the duct system, the fan housing 142 resting on the central support surface and the spacer studs. Preferably, the spacer studs 18 include a contact pin 181 protruding towards the lid 13, the contact pin 181 being operatively inserted into a corresponding hole in the fan housing 142 to ensure correct positioning of the fan 14. When the lid 13 is secured to the shell 11, the fan 14 is interposed between the lid located above and the central support surface 17 and the spacer studs 18 located below. A manifold air space is defined below the housing 142 (i.e. below the fan 14). The purpose of the manifold air space is to collect air from the ducts of the duct system and create a zone of uniform pressure into which the fan draws air (axially) and pushes it radially (relative to the fan impeller) out of an outlet opening (protected by grid 131). The length of the spacer studs 18 defines the height of the manifold air space measured parallel to the axis of rotation of the fan 14.

[0094] The audio amplifier 1 includes an electronic card 15 configured to process (i.e., amplify) an audio signal. The electronic card 15 is disposed in the receiving space parallel to the bottom wall 12. The electronic card 15 includes a number of electronic components.

[0095] The cooling plate 111 includes a number of studs 111F protruding from the inner surface 111A into the receiving space toward the bottom wall 12. The studs 111F are in contact with and abut corresponding electronic components among the electronic components of the electronic card 15. In particular, the studs 111F extend between a first end disposed on the inner surface 111A of the cooling plate 111 and a second end disposed in contact with the electronic components of the electronic card 15, so as to transfer heat generated by the electronic components to the cooling plate 111. The studs 111F are located on fins A (i.e., finned portion) of the cooling plate 111.

[0096] The shell 11 (cooling plate 111) includes a group of fastening studs 111G protruding from the inner surface 111A into the receiving space. The fastening studs 111G are configured to connect the shell 11 to the bottom wall 12. In particular, the fastening studs 111G are configured to fasten the electronic card 15 between the shell 11 (cooling plate 11) and the bottom wall 12 in the receiving space, for example by means of fastening screws.

[0097] The audio amplifier 1 comprises, on the front surface 112A of the side wall 112, one or more electrical connectors 16 arranged on either side of the outlet opening 121. The electrical connectors 16 are connected to an electronic card 15.

[0098] During operation of the audio amplifier 1, heat generated by the electronic card 15, and in particular by the electronic components (more specifically the power supply of the electronic card 15), is transferred from the studs 111F towards the finned portion of the cooling plate 15. The fan 14 generates an air flow through the duct system. Outside air enters through the inlet holes 111D of the duct system and is transported through the duct system by the air flow generated by the fan 14. While passing through the duct system, the air is heated in contact with the heat transferred from the electronic components to the cooling plate 111 through the studs 111F. The air flow thus heated then exits the duct system through the outlet holes 111E and enters the fan 14. In particular, the heated air flow following the outgoing flow enters the fan 14 through the inlet 142A and continues with the return flow that leaves the fan through the outlet 142B. Finally, the air flow exits from the fan 14 through the outlet opening 121 towards the external environment. [Prior art documents] [Patent documents]

[0099] [Patent Document 1] US10076062B2 [Patent Document 2] WO2018 / 196141A1 [Patent Document 3] EP3349555A1 [Patent Document 4] JP2022110640A

Claims

1. An in-vehicle audio amplifier (1), a bottom wall (12), a shell (11) connected to said bottom wall (12) and forming between them a storage space which is a closed space, said shell (11) comprising a cooling plate (11) having an inner side (111A) parallel to said bottom wall (12) and facing said storage space, and an outer side (111B) opposite said inner side (111A), said cooling plate (111) comprising a finned portion (111C) protruding from said outer side (111B) and a number of studs (111F) protruding from said inner side (111A) towards said bottom wall (12) into said storage space; an electronic card (15) arranged in said receiving space and including a plurality of electronic components, said plurality of electronic components being arranged on said card (15) such that said plurality of studs (111F) of said cooling plate (111) abut against them, said electronic card (15) being configured to amplify audio signals; a lid (13) fixed to said shell (11) and arranged parallel to said bottom wall (12), said finned portion (111C) being interposed between said lid (13) and said outer face (111B) of said cooling plate (111) to define a duct system; a fan (14) mounted between said lid (13) and said outer face (111B) of said cooling plate (111) for generating an air flow through said duct system.

2. The audio amplifier (1) of claim 1, wherein the plurality of studs (111F) are located on the finned portion (111C) of the cooling plate (111).

3. 3. The audio amplifier (1) of claim 1 or 2, wherein the shell (11) includes a side wall (112) having a front surface (112A), and the amplifier (1) includes one or more electrical connectors (16) attached to the front surface (112A) of the side wall (112) and connected to the electronic card (15).

4. 4. The audio amplifier (1) of claim 3, wherein the front surface (112A) of the side wall (112) defines an outlet opening (121) in fluid communication with the duct system, and the fan (14) is mounted between the finned portion (111C) and the outlet opening (121).

5. 5. Audio amplifier (1) according to claim 4, characterized in that the lid (13) comprises a grid (131) located at the outlet opening (121) and made integral with the lid (13).

6. 6. The audio amplifier (1) of claim 3, wherein the side wall (112) of the shell (11) has a first side (112C), a second side (112D), and a rear side (112B) opposite the front side (112A), and the duct system has a plurality of inlet holes (111D) located on the first side (112C), the second side (112D), and the rear side (112B).

7. 6. The audio amplifier of claim 5, wherein the outlet opening (121) is located at a central position of the front surface (112A), and the duct system includes a plurality of radially outwardly extending ducts for fluidly connecting the outlet opening (121) and the inlet holes (111D) of the duct system to each other.

8. 8. The audio amplifier (1) according to any one of claims 1 to 7, wherein the shell (11) is made of a thermally conductive metallic material and is of monolithic construction.

9. 9. An audio amplifier (1) according to any one of claims 1 to 8, wherein the electronic components abutting the plurality of studs (111F) include a power switch and / or an integrated electronic power component.

10. 10. The audio amplifier (1) according to claim 1, wherein the shell (11) is provided with a group of fastening studs (111G) protruding from the inner surface (111A) towards the bottom wall (12) into the accommodating space and configured to fasten the electronic card (15) to the shell (15) by means of a fastening screw.

11. A method for cooling an audio amplifier (1), comprising the steps of: - providing a bottom wall (12) and a shell (11) connected to said bottom wall (12) and forming a storage space therebetween, which is a closed space, said shell (11) including a cooling plate (11) having an inner side (111A) parallel to said bottom wall (12) and facing said storage space, and an outer side (111B) opposite said inner side (111A), said cooling plate (111) comprising a finned portion (111C) protruding from said outer side (111B) and a number of studs (111F) protruding from said inner side (111A) towards said bottom wall (12) into said storage space; - preparing an electronic card (15) arranged in said receiving space and including a number of electronic components, said number of electronic components being arranged on said card (15) such that said number of studs (111F) of said cooling plate (111) abut against them, said electronic card (15) being configured to amplify an audio signal; - providing a lid (13) fixed to said shell (11) and arranged parallel to said bottom wall (12), said finned portion (111C) being interposed between said lid (13) and said outer side (111B) of said cooling plate (111) to define a duct system; generating an air flow through said duct system via a fan (14) mounted between said lid (13) and said outer surface (111B) of said cooling plate (111).

12. The method of claim 11, wherein the plurality of studs (111F) are located on the finned portion (111C) of the cooling plate (111).

13. 13. The method according to claim 11 or 12, wherein the shell (13) includes a side wall (112) having a front surface (112A) defining an outlet opening (121), the method comprising the step of causing air to flow between the finned portion (111C) and the outlet opening (121) via the fan (14) mounted between the finned portion (111C) and the outlet opening (121).

14. 14. The method of claim 13, wherein the side wall (112) of the shell (11) has a first side (112C), a second side (112D) and a rear side (112B) opposite the front side (112A), the duct system has a plurality of inlet holes (111D) located in the first side (112C), the second side (112D) and the rear side (112E), the outlet opening (121) is located at a central position of the front side (112A), and the duct system includes a plurality of radially outwardly extending ducts for fluidly connecting the outlet openings (121) and the inlet holes (111D) of the duct system with each other.

15. 15. The method according to any one of claims 11 to 14, wherein the electronic components abutting the plurality of studs (111F) include a power switch and / or an integrated electronic power component.

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