Cooling module

Abstract

To provide a heat sink and a heat sink device for an electronic device dipped in a coolant.SOLUTION: A heat sink 1 may comprise a base which is mounted on a heat conduction surface of an electronic device and transfers heat from the heat conduction surface, and a retaining wall which extends from the base to define capacity. The heat sink may have a wall device which defines the capacity where the electronic device is mounted. The heat sink may be for the electronic device which should be mounted on the surface in a container in a direction substantially perpendicular to the floor of the container. The heat is transferred from the electronic device to a coolant reserved in the heat sink capacity. A cooling module comprising the heat sink is also provided. A nozzle device may direct the coolant to the base of the heat sink.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] TECHNICAL FIELD OF THEINVENTION The present disclosure relates to a heat sink for an electronic device that is immersed in a cooling liquid, and to a cooling module for an electronic device comprising one or more such heat sinks, which allows the electronic device to be immersed in a cooling liquid. [Background technology]

[0002] 2. Background of the Invention Many types of electrical components generate heat during operation. Specifically, electrical computer components such as motherboards, central processing units (CPUs), and memory modules can dissipate large amounts of heat during use. When electrical components heat up to high temperatures, they can be damaged, affect performance, or create safety hazards. Thus, there has been a great deal of effort to find efficient, high performance systems for effectively and safely cooling electrical components.

[0003] One type of cooling system uses liquid cooling, and while a variety of liquid cooling assemblies have been demonstrated, generally the electrical components are submerged in a cooling liquid to provide a large surface area for heat exchange between the heat generating electrical components and the coolant.

[0004] US Patent No. 7,905,106 describes a liquid submersion cooling system for cooling several electronic devices in a number of cases connected to a rack system. The housing is filled with a dielectric cooling liquid in which heat-generating electronic components are submerged. The rack system includes a manifold that allows for liquid transport of the cases, and a pump system that moves the dielectric cooling liquid in and out of the rack. An external heat exchanger allows the heated dielectric cooling liquid to be cooled before being returned to the rack. Localized cooling is provided in areas where significant heat is present using directional liquid flow. A number of tubes extend from the manifold to direct the dielectric cooling liquid to specific targeted hot spots. The ends of the tubes are aligned adjacent to the desired hot spots, or the tubes can be connected to a distribution plenum to help direct the return liquid flow to the targeted hot spots. This directs or focuses the cooling fluid in each case at the expense of other components that may not be cooled as effectively. Furthermore, the heat transfer capacity of the cooling liquid may not be used efficiently. For these reasons, this technique requires that a significant amount of dielectric cooling fluid be pumped into and out of each case within the rack.

[0005] In U.S. Patent No. 8,305,759, a dielectric liquid is used to cool heat-generating electronic components located on a circuit board within a case. The liquid is poured or otherwise directed onto the electronic components with gravity assisting the liquid to flow downward onto the components, after which the liquid is collected in a sump and eventually returned to the electronic components. A plenum located above the electronic components is provided to contain the liquid as it flows over the electronic components. The intent is to allow more liquid to contact the components, thus increasing the effectiveness of the liquid cooling. This again requires a large amount of dielectric cooling liquid and relies on gravity assistance, which can reduce the flexibility of the system and introduce other design constraints that can reduce the efficiency of the system.

[0006] U.S. Pat. No. 8,014,150 discloses a cooling device coupled to a substrate for use with an electronic device. This publication describes cooling of an electronic module in which a dielectric fluid forms a sealed component around a case. A pump is positioned within the sealed compartment to pump a dielectric fluid towards the electronic device. Cooling occurs by changing the phase of the dielectric fluid from a liquid to a vapor, which then condenses as it rises towards a liquid-cooled cold plate to which a second fluid is supplied. However, this cooling system requires high pressure seals within the case and multiple cooling compartments, and thus a relatively complex piping arrangement for the second cooling fluid.

[0007] Therefore, a more efficient method for cooling electronic systems with liquid coolants is desired. Summary of the Invention [Means for solving the problem]

[0008] Summary of the Invention Against this background, heat sinks are generally provided for cooling heat-generating electronic devices (examples are provided below). The heat sinks are designed for use within a cooling module, where the electronic device is partially or fully immersed in a cooling liquid. This provides a volume, e.g., similar to a bath or reservoir, to store or hold the cooling liquid for the heat-generating electronic device. The coolant may then be pumped from a lower level within the cooling module into the volume of the heat sink, which is at a higher level. Several different configurations and embodiments of heat sinks and / or cooling modules according to this design are discussed herein.

[0009] In a first aspect there is provided a heat sink for an electronic device immersed in a cooling liquid as claimed in claim 1 and a cooling module for an electronic device as claimed in claim 8. Further features of this aspect are detailed in the dependent claims and herein.

[0010] The heat sink can be mounted to a heat generating electronic device such as an integrated circuit, computer processor, or other electronic component (which generates heat when powered during normal operation). The heat sink is designed for use in a cooling module, where the electronic device is immersed in a cooling liquid. This provides a volume, e.g., similar to a bath or reservoir, to hold or store the cooling liquid for the heat generating electronic device. In this way, the cooling liquid can be more effectively applied to the location or locations where the greatest amount of heat is generated. Thus, less coolant can be used. Since coolant is expensive and heavy, a reduced amount of coolant can improve flexibility, efficiency, and reliability (e.g., because it is less prone to coolant leaks and because the volume of coolant can withstand momentary temperature changes due to failure of other components in the system).

[0011] A cooling module for an electronic device has a container that houses the electronic device such that the electronic device can be (at least partially) immersed in a cooling liquid, the electronic device being mounted with a heat sink according to the first aspect as disclosed herein. In some embodiments, the electronic device is planar or is mounted on a circuit board that is planar, and the cooling module is configured to operate such that the plane of the electronic device and / or the circuit board is horizontal. The container may be elongated according to the plane of the electronic device and / or the circuit board, e.g., may have a shape that matches the shape of the electronic device and / or the circuit board.

[0012] For such heat sinks, the volume for storing or holding the cooling liquid may be defined by a base and a retaining wall (which may be integral or separate). The base is the part of the heat sink that is mounted to the top of the electronic device (more specifically, to the heat transfer surface of the electronic device) and transfers heat from the heat transfer surface. The base is typically a flat surface that defines the volume. The base has a surface (thus the base itself may be planar in shape). Heat transferred (typically conducted) through the base (specifically through its surfaces that define the volume) is transferred to a cooling fluid held within the volume. A retaining wall extends from the base.

[0013] One advantage of this type of heat sink is that it allows the level of coolant contained within the heat sink volume to be higher than the level outside the volume (e.g., when the cooling module is operated with the plane of the electronic device and / or circuit board horizontal and the amount of coolant in the cooling module's reservoir is lower than the height of the retaining walls), again reducing the amount of coolant required.

[0014] Advantageously, the heat sink has protrusions (such as pins and / or fins) extending from the base (or less preferably from the retaining wall) into the volume. These protrusions advantageously do not extend as far from the base (specifically perpendicularly from the base plane) as the retaining wall. This may ensure that the cooling liquid submerges all the protrusions. More preferably, the protrusions extend approximately the same distance from the base as the retaining wall. This may also avoid the creation of paths in the volume that may bypass the protrusions. The protrusions may allow the cooling liquid to spread radially away from a predefined point on the base surface (e.g. corresponding to the hottest part of the electronic device). In particular, these protrusions may be formed in a non-linear pattern.

[0015] The cooling liquid is advantageously made to flow in the container, preferably by a pump as part of the cooling module, or less preferably by a shape of the cooling module (e.g. a shape that promotes convection). This allows the cooling liquid to reach the volume of the heat sink. For example, a nozzle device may be further provided that receives the flowing or pumped cooling liquid and directs it into the volume of the heat sink. The nozzle device typically comprises one or more nozzles (which may be of a push-fit type), each of which directs the flowing or pumped cooling liquid to a respective part of the volume of the heat sink, in particular to a part of the base of the heat sink. For example, each nozzle may direct the flowing or pumped cooling liquid to a respective part of the heat sink volume adjacent to a part of the heat transfer surface of the electronic device having a maximum temperature or a temperature above a threshold level (i.e. one of the hottest parts of the device). Most preferably, the nozzle device directs the flowing or pumped cooling liquid perpendicular to the base of the heat sink. This allows the coolant to be forced directly into the volume, improving heat dissipation.

[0016] In a second aspect there is provided a cooling module for an electronic device as claimed in claim 16. Further features of the invention are detailed in the dependent claims and herein.

[0017] The cooling module is positioned such that an electronic device (such as an integrated circuit, computer processor, electronic component, or circuit board) is immersed (at least partially) in the cooling liquid and a heat sink is provided on the electronic device. The nozzles are aligned to direct the coolant to the heat sink, specifically to the base of the heat sink (the base being the portion that is mounted or configured to be mounted on the electronic device to be cooled). In a preferred embodiment, the nozzles direct the cooling liquid perpendicular to the base of the heat sink (and / or perpendicular to the plane of the electronic device, if the electronic device is planar).

[0018] The cooling module preferably comprises a container for housing the electronic device for cooling such that the electronic device can be at least partially immersed in the cooling liquid. The heat sink comprises a base for mounting to the electronic device. The nozzle is part of the nozzle arrangement. Advantageously, the cooling liquid is made to flow inside the container as part of the cooling module, preferably by a pump. The nozzle arrangement is arranged to receive the flowing or pumped cooling liquid. The nozzle arrangement may allow for direct delivery of coolant to the hottest portion of the heat sink and may thereby provide a reverse flow.

[0019] Advantageously, the nozzle arrangement is arranged to direct the flowing or pumped cooling liquid to a portion of the heat sink adjacent the hottest portion of the electronic device. The nozzle arrangement advantageously comprises one or more nozzles. The one or more nozzles may then each be configured to direct the flowing or pumped cooling liquid to a respective portion of the heat sink. In some embodiments, the nozzle arrangement comprises a plurality of nozzles. Each nozzle may then be configured to direct the flowing or pumped cooling liquid to a respective portion of the heat sink adjacent a portion of the electronic device having a temperature above a threshold level. The threshold level may be set based on the temperature of the hottest portion of the electronic device, for example based on a percentage, or set to cool a predetermined number of the hottest portions of the electronic device.

[0020] In a preferred embodiment, the cooling module further comprises at least one tube arranged to transport cooling liquid to the nozzle arrangement (preferably from the pump, if a pump is provided). The one or more nozzles may then each be configured to couple to a respective one end of the at least one tube. Preferably, the coupling is by a push fit. In other words, each nozzle may be coupled to a respective tube end by a push fit.

[0021] The cooling liquid may be a primary cooling liquid. The cooling module may thus further comprise a heat exchanger configured to receive a secondary cooling liquid and transfer heat from the primary cooling liquid to the secondary cooling liquid. The pump may be configured to flow the cooling liquid into and out of the heat exchanger. The nozzle arrangement is advantageously arranged to receive the primary cooling liquid from the heat exchanger. In this manner, the coolant directed by the nozzle arrangement to the heat sink may be the coldest coolant. This may then advantageously be directed to the hottest portion of the heat sink.

[0022] In a third aspect there is provided a heat sink for an electronic device as claimed in claim 28 and a cooling module as claimed in claim 34. Further features of the invention are detailed in the dependent claims and herein.

[0023] A heat sink may be provided in the cooling module. The heat sink includes an electronic device (e.g. a power supply unit) and allows a cooling liquid to accumulate around it, such that the electronic device is (at least partially) immersed in the cooling liquid. The heat sink advantageously has a wall arrangement defining an internal volume in which the electronic device is mounted, such that during operation the cooling liquid accumulates around the electronic device, thus transferring heat from the electronic device to the cooling liquid contained in the internal volume.

[0024] The wall arrangement may be formed from a base configured to mount the heat sink within the cooling module and a retaining wall extending from the base. The base and the retaining wall may then define an interior volume for storing the cooling fluid. The base and / or the base surface defining the interior volume are preferably planar.

[0025] A cooling module for an electronic device may comprise a container for housing an electronic device such that the electronic device may be at least partially immersed in the cooling liquid, and a heat sink according to the third aspect of the present disclosure mounted within the container. The cooling module may be further configured to cause the cooling liquid to flow within the container, preferably by means of a pump. Furthermore, the cooling module may be arranged to receive the flowing or pumped cooling liquid and direct the flowing or pumped cooling liquid therefrom into an interior volume of the heat sink. The device may include at least one tube having an outlet.

[0026] The wall device advantageously further defines a flow opening for allowing or facilitating the flow of cooling liquid out of the internal volume. This may (at least in part) define the direction of flow of cooling liquid through the internal volume. Alternatively, or additionally, the internal volume may be elongated in shape, thereby defining first and second end portions at opposite ends of the elongated internal volume. The tube outlet and flow opening are advantageously positioned at the first and second end portions, respectively.

[0027] In some embodiments, the outlet is positioned within an upper half-height of the internal volume. In other embodiments, the outlet is positioned within a lower half-height of the internal volume. The tube outlets may comprise one or more nozzles. Thus, each nozzle is preferably configured to direct the flowing or pumped cooling liquid into a respective portion of the internal volume. Optionally, the one or more nozzles are each configured to couple by a push fit to a respective end of the at least one tube.

[0028] In a fourth aspect there is provided a heat sink arrangement for an electronic device as claimed in claim 43 and a cooling module for an electronic device as claimed in claim 61. Further features of the invention are detailed in the dependent claims and herein.

[0029] The electronic device is mounted on a surface within the container in an orientation generally perpendicular to the container's floor, which is generally a flat horizontal surface such that the orientation of the electronic device is generally perpendicular. For example, the electronic device may be mounted on a printed circuit board, and the printed circuit board may be oriented generally perpendicular to the container's floor (i.e., generally perpendicular to the horizontal container's floor). The printed circuit board may be a daughterboard coupled to a motherboard, which may be oriented generally parallel to the container's floor. In other embodiments, the printed circuit board may be a motherboard, and thus there may or may not be an additional printed circuit board oriented generally parallel to the container's floor.

[0030] The heat sink device has a retaining wall configured to at least partially define an internal volume. The retaining wall cooperates (or is configured to cooperate) with a surface on which the electronic device is mounted (which may be a printed circuit board, in the case of electronic components mounted on a printed circuit board) and / or with a surface mounted on the electronic device (such as a plate) such that the cooling liquid directed into the internal volume accumulates within the internal volume. This means that the internal volume may be defined by the retaining wall cooperating with a surface on which the electronic device is mounted (in which case the internal volume may surround the electronic device) and / or with a surface mounted on the electronic device (in which case the internal volume may be mounted adjacent to and thermally coupled to the electronic device). These arrangements allow heat to be transferred from the electronic device to the cooling liquid accumulated in the internal volume.

[0031] This may mean that the surface on which the electronic device is to be mounted and / or the surface on which the electronic device is mounted (hereinafter referred to as one or both surfaces) cooperates with or forms part of the heat sink apparatus. For example, the retaining wall may be attached to and / or close enough (or sealed) to the surface on which the electronic device is to be mounted and / or the surface on which the electronic device is mounted sufficiently to allow liquid to accumulate within the internal volume, although a seal between the retaining wall and one or both surfaces need not be sufficient to prevent leakage (and thus in embodiments such a seal may not be required). The retaining wall may be provided with holes through which the cooling liquid can pass at a prescribed rate. The retaining wall and one or both surfaces preferably have at least one opening ( As indicated above, this may be distal to the floor of the container, or if provided in the form of a hole, may be at the base of the retaining wall. The surface mounted on the electronic device may be part of the electronic device (i.e. may be integral with the electronic device).

[0032] The heat sink arrangement advantageously includes a nozzle arrangement arranged to receive the cooling liquid and direct the cooling liquid into the interior volume of the heat sink, hi one embodiment the nozzle arrangement is arranged to direct the cooling liquid from an open side (top) of the interior volume distal from the floor of the vessel, for example with the nozzle positioned towards the top of the interior volume.

[0033] Generally, the retaining wall defines a cubic-shaped interior volume. The interior volume defined only by the retaining wall may be open on one or both of two sides, a first side adjacent to the electronic component and a second side (upper side) that is typically distal from the floor of the container. In some cases, the retaining wall comprises a base portion oriented generally parallel to the floor of the container. Thus, one or more (typically three) side walls may extend from the base portion (in a direction generally perpendicular to the floor of the container). In another sense, the retaining wall may be seen to comprise a side wall portion extending generally parallel to the floor of the container and a cover portion oriented generally perpendicular to the floor of the container and arranged to fit together with the side wall portion to define the interior volume. The side wall portion may be separable from the cover portion. In a particular embodiment, the retaining wall may comprise a mounting plate arranged to fit together with the side wall portion oriented generally perpendicular to the floor of the container to define the interior volume. The mounting plate may be a surface that is mounted to the electronic device.

[0034] The retaining wall and / or the surface (e.g., plate) mounted on the electronic device may have protrusions (such as pins and / or fins) extending into the internal volume. A thermal interface material may be disposed between the electronic device and the surface mounted on the electronic device. The protrusions may extend perpendicular to the plane of the electronic device (if the electronic device is substantially planar) and / or parallel to the floor of the container. The protrusions may be arranged in a linear or non-linear pattern. In some embodiments, the protrusions comprise one or more baffles for directing the flow of the cooling liquid inside the internal volume. The baffles may cause the cooling liquid to flow first (under gravity) to the lower part of the internal volume and then to the upper part of the internal volume. Alternatively, or additionally, the baffles may cause the cooling liquid to flow from a more central part of the internal volume to a more outer part of the internal volume (before exiting the internal volume). The baffles may cause the flow of the cooling liquid to split into two separate flow paths (which may be generally symmetric or asymmetric).

[0035] In an embodiment, the nozzle device comprises a piping system forming at least one channel for the flow of cooling liquid. The at least one channel has one or more holes, each of which acts as a nozzle for directing the cooling liquid from the channel into the interior volume of the heat sink. The channel is optionally oriented perpendicular to the floor of the container. The channel may be integrated into a portion of the retaining wall. Optionally, the piping system comprises first and second panels, one or both of which are molded to form at least one channel. Thus, the first and second panels may be attached to one another such that the cooling liquid can flow through the at least one channel.

[0036] A cooling module for an electronic device may include a container having an interior surface defining a floor and defining a volume for receiving an electronic component in a substantially perpendicular orientation to the floor. A heat sink device of the fourth aspect disclosed herein may be mounted within the volume of the container. In an embodiment, the electronic device is mounted within the volume of the container. A nozzle device may receive a flowing cooling liquid and direct it into an interior volume of the heat sink device. Optionally, the nozzle device may direct the flowing cooling liquid toward an interior volume of the heat sink device adjacent a hottest portion of the electronic device. The nozzle arrangement may include a plurality of nozzles, each nozzle configured to direct flowing cooling liquid to a respective portion of an interior volume of the heat sink arrangement adjacent a portion of the electronic device having a temperature above a threshold level. The pump may be configured to flow the cooling liquid within the vessel. At least one tube may be arranged to transport the cooling liquid from the pump to the nozzle arrangement. A single tube (or multiple connected tubes) may transport the cooling liquid to the first heat sink arrangement and from the first heat sink arrangement to the second heat sink arrangement (in a "daisy chain" or serial link arrangement).

[0037] For all embodiments disclosed herein, there may be further provided features of the manufacturing and / or operation methods that correspond to features in any one or more of the disclosed heat sinks and / or cooling modules. The embodiments may also be combined. Furthermore, combinations of specific features of one embodiment with the heat sinks and / or cooling modules of another embodiment are also disclosed, and such combinations are interchangeable. Specific examples of such combinations are proposed herein as examples.

[0038] The invention may be carried out in a number of ways and a preferred embodiment will now be described, by way of example only, with reference to the accompanying drawings, in which: [Brief description of the drawings]

[0039] [Figure 1] FIG. 1 illustrates one embodiment of a cooling module according to the present disclosure. [Diagram 2] FIG. 2 is an exploded view of the embodiment of FIG. [Diagram 3] FIG. 1 illustrates a first embodiment of a heat sink according to the present disclosure. [Figure 4] FIG. 4 is an exploded view of the embodiment of FIG. [Diagram 5] 4 is a cross-sectional view of the heat sink of FIG. 3 during operation. [Figure 6] FIG. 4 is a top view of the nozzle arrangement of the embodiment of FIG. 3. [Figure 7] FIG. 4 is a top view showing a first modified example of the nozzle device of the embodiment in FIG. [Figure 8] FIG. 4 is a top view showing a second modified example of the nozzle device of the embodiment in FIG. [Figure 8A] FIG. 4 is a perspective view showing a third modified example of the nozzle device of the embodiment of FIG. [Figure 8B] FIG. 8B is a cross-sectional view of the schematic of FIG. 8A. [Figure 8C] FIG. 4 is a perspective view showing a fourth modified example of the nozzle device according to the embodiment of FIG. [Figure 8D] FIG. 5 is a perspective view showing a fifth modified example of the nozzle device according to the embodiment of FIG. [Figure 8E] FIG. 11 is a perspective view showing a sixth modified example of the nozzle device according to the embodiment of FIG. [Figure 8F] FIG. 8F is a partial cross-sectional view of the schematic of FIG. 8E. [Figure 9] FIG. 4 is an enlarged top view of a portion of the embodiment of FIG. 3, showing a protrusion arrangement. [Figure 10] 4 is a top view showing a first modified example of the protrusion device according to the embodiment of FIG. 3. FIG. [Figure 11] 4 is a top view showing a second modified example of the protrusion device according to the embodiment of FIG. 3. FIG. [Figure 12] 4 is a top view showing a third modified example of the protrusion device according to the embodiment of FIG. 3. FIG. [Figure 13] 4 is a cross-sectional view of a portion of the heat sink of FIG. 3, illustrating the height of the protruding devices. [Figure 14] 4 is a cross-sectional view showing a first modification of the height of the protrusion device of the embodiment of FIG. 3. FIG. [Figure 15] 4 is a cross-sectional view showing a second modification of the height of the protrusion device of the embodiment of FIG. 3. FIG. [Figure 16] FIG. 2 is a cross-sectional view of a second embodiment of a heat sink according to the present disclosure. [Figure 17] FIG. 17 is a perspective view of the heat sink of FIG. 16. [Figure 17A] FIG. 18 is a perspective view of a cooling system incorporating a first variation of the embodiment of FIGS. 16 and 17. [Figure 17B] FIG. 17B is an exploded view of the cooling system of FIG. 17A. [Figure 17C] FIG. 18 shows a second variant of the embodiment of FIGS. 16 and 17. [Figure 17D] FIG. 17B shows a modification of the second variant shown in FIG. 17A. [Figure 18] FIG. 18 is an exploded perspective view showing a third modification of the embodiment of FIGS. 16 and 17. [Figure 19] 19 shows an exploded view of FIG. 18 with the nozzle portion removed. [Figure 20] FIG. 13 is a perspective view of a third embodiment of a heat sink according to the present disclosure. [Figure 21]FIG. 21 is an exploded perspective view showing a modification of the embodiment shown in FIG. 20. [Figure 22A] FIG. 13 is an exploded front view of a fourth embodiment of a heat sink apparatus according to the present disclosure. [Figure 22B] FIG. 22B is an assembled perspective view of the embodiment of FIG. 22A. [Figure 22C] FIG. 22B is an assembled side view of the embodiment of FIG. 22A. [Figure 22D] FIG. 22B is an exploded rear view of the embodiment of FIG. 22A. [Figure 23A] FIG. 13 is an exploded front view of a fifth embodiment of a heat sink apparatus according to the present disclosure. [Figure 23B] FIG. 23B is an assembled perspective view of the embodiment of FIG. 23A. [Figure 23C] FIG. 23B is an assembled side view of the embodiment of FIG. 23A. [Figure 23D] FIG. 23B is an exploded rear view of the embodiment of FIG. 23A. [Figure 23E] FIG. 23B is an assembled cross-sectional view of the embodiment of FIG. 23A. [Figure 23F] FIG. 13 is an assembled perspective view of a first modified example of the fifth embodiment. [Figure 23G] FIG. 23F is a cross-sectional view of a first modified example of FIG. 23F. [Figure 23H] FIG. 13 is an assembled perspective view of a second modified example of the fifth embodiment. [Figure 23I] FIG. 23H is a cross-sectional view of a first modified example of FIG. 23H. [Figure 24] FIG. 13 is an exploded front view of a sixth embodiment of a heat sink apparatus according to the present disclosure. [Figure 25A] FIG. 25 shows an exploded front view of a first variant of the embodiment of FIG. 24. [Figure 25B] FIG. 25B is a front view of a portion of the embodiment of FIG. 25A in an assembled configuration. [Figure 26A] 25 shows an exploded front view of a second variant of the embodiment of FIG. 24. FIG. [Figure 26B] FIG. 26B is a front view of a portion of the embodiment of FIG. 26A, in assembled configuration. [Figure 27A] FIG. 13 shows the heat sink arrangement assembled with additional parts to illustrate the flow of the coolant. [Figure 27B] FIG. 27B is a cutaway view of the embodiment of FIG. 27A showing the interior of the container. [Figure 28A] FIG. 27B shows the heat sink device assembled with further parts in a variant of FIG. 27A. [Figure 28B] FIG. 28B is a cutaway view of the embodiment of FIG. 28A showing the interior of the container. [Figure 29A] FIG. 1 is a perspective view of a first design in which multiple heat sinks are connected in series to receive a cooling liquid. [Figure 29B] FIG. 13 is a perspective view of a second design in which multiple heat sinks are connected in series to receive the cooling liquid. [Figure 29C] FIG. 1 is a perspective view of a first design in which multiple heat sinks are connected in parallel to receive a cooling liquid. [Figure 29D] FIG. 13 is a perspective view of a second design in which multiple heat sinks are connected in parallel to receive the cooling liquid. [Figure 29E] FIG. 29E is a partial cross-sectional view of the design of FIG. 29D. [Figure 30A] FIG. 1 is a perspective view of a design showing the transfer of coolant from a first type of heat sink to a second type of heat sink. [Figure 30B] FIG. 30B is a cross-sectional view of the design of FIG. 30A. [Figure 31A] FIG. 13 is a top perspective view showing a further adapted heat sink; [Figure 31B] FIG. 31B is a bottom perspective view of the heat sink of FIG. 31A. [Figure 31C] FIG. 31B is a side cross-sectional view of the heat sink of FIG. 31A. [Figure 31D] FIG. 31B is a bottom perspective view of a first variation of the heat sink of FIG. 31A. [Figure 31E] FIG. 31B is a bottom perspective view of a second variation of the heat sink of FIG. 31A. [Figure 32A] FIG. 1 is a top perspective view of a heat sink with a modified nozzle arrangement. [Figure 32B] FIG. 32B is a top cross-sectional view of the heat sink of FIG. 32A. [Figure 32C] FIG. 32B is a side cross-sectional view of the heat sink of FIG. 32A. [Figure 33A] FIG. 2 is a perspective view of a heat sink with coolant introduced through a base. [Figure 33B] FIG. 33B is a side cross-sectional view of the heat sink of FIG. 33A. [Figure 34A] FIG. 1 is a perspective view showing a first design of a heat-generating device integrated with a heat sink. [Figure 34B] FIG. 34B is a side cross-sectional view of the heat sink of FIG. 34A. [Figure 34C] FIG. 34B is a side cross-sectional view of the heat sink of FIG. 34A. [Fig. 34D] FIG. 1 is a perspective view of a heat generating device with a separable heat sink. [Figure 34E] FIG. 34E is a side cross-sectional view of the heat sink of FIG. 34D. [Fig. 34F] FIG. 34E is a side cross-sectional view of the heat sink of FIG. 34D. [Figure 34G] FIG. 2 is a perspective view showing a second design of a heat-generating device integrated with a heat sink. [Fig. 34H] FIG. 34F is a side cross-sectional view of the heat sink of FIG. 34E. [Fig. 34I] FIG. 1 is a perspective view of a multi-volume vertical heat sink design. [Figure 35A] FIG. 1 is a perspective view showing a first design of a heat sink apparatus for cooling multiple devices. [Figure 35B] FIG. 35B is an exploded view of the design of FIG. 35A. [Figure 35C] FIG. 13 is a perspective view showing a second design of a heat sink apparatus for cooling multiple devices. [Figure 35D] FIG. 35D is an exploded view of the design of FIG. 35C. [Figure 35E] FIG. 13 is an exploded perspective view showing a third design of a heat sink apparatus for cooling multiple devices. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0040] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, one embodiment of a cooling module (sometimes referred to as a "blade") according to the present disclosure is shown. Also consider FIG. 2, which shows an exploded view of the embodiment of FIG. 1. The cooling module 100 comprises a container 110 (shown without a lid) that houses a component 12 that produces a relatively high temperature and a component 10 that produces a relatively low temperature. Both the low temperature component 10 and the high temperature component 12 are mounted on a circuit board 15. Two such identical circuit boards 15 are shown in FIG. 1 and FIG. 2 within the container 110. A heat sink 1 is mounted on the high temperature component 12. The heat sink 1 will now be discussed in more detail.

[0041] During operation, the vessel 110 is filled with a dielectric cooling liquid (not shown), which may be referred to as a primary coolant. The cooling liquid is not electrically conductive, but is typically thermally conductive, and can transport heat by conduction and / or convection. The amount of cooling liquid in the vessel 110 is sufficient to at least partially cover or immerse the cryogenic component 10, but not necessarily to completely immerse the cryogenic component 10. The level of cooling liquid used during operation is described below. The cooling liquid is pumped through tube 5 by pump 11 to heat exchanger 19, which receives a secondary cooling liquid (typically water or water-based) and transfers heat from the cooling liquid in the vessel 110 to the secondary cooling liquid. The secondary cooling liquid is provided to and exits the heat exchanger 19 via interface connection 18. The cooled primary cooling liquid is pumped out of the heat exchanger 19 via tube 5 by pump 11 and exits via nozzle 2. The tubes 5 and nozzles 2 are aligned to direct the coolant directly onto the heat sink 1 .

[0042] The cooling module 100 is typically a rack-mounted module, and the electronic components within the enclosure 110 are preferably at least a portion of a computer server circuit, including, for example, a motherboard and associated components. The height of the cooling module may therefore be one rack unit (1U, equivalent to 44.45 mm) or an integer number of rack units. The cooling module 100 may be installed or uninstalled within a corresponding rack housing multiple such cooling modules (one, some or all of which may have different internal configurations than the cooling module 100 disclosed herein). In this configuration, the secondary cooling fluid may be shared between the cooling modules arranged in series or parallel. Plenum chambers and / or manifolds may be provided within the rack to allow this. Other components may be provided within the rack for efficiency and safety purposes, such as a power regulator, one or more pumps or similar devices.

[0043] With reference to Figure 3, a first embodiment of a heat sink according to the present disclosure is shown. With reference to Figure 4, an exploded view of the embodiment of Figure 3 is shown. This is an enlarged view of the heat sink shown in Figures 1 and 2. The heat sink 1 comprises a base consisting of a mount 16 and a planar substrate 17 fixed to the mount 16, a retaining wall 7 attached to the planar substrate 17, protrusions 6 (shown in the form of pins) and fixing screws 13 attaching the substrate 17 to the mount 16. In this way, the planar substrate 17 rests directly on the high temperature component 12 and transfers heat from the high temperature component 12 to the volume defined by the planar substrate 17 and the retaining wall 7 and in which the protrusions 6 are provided.

[0044] The heat sink 1 can be manufactured from a single component, for example by die casting, lost wax casting, metal injection molding (MIM), additive manufacturing or forging. It can also be machined or milled from a block of material. The heat sink 1 may be formed from any material that is thermally conductive, such as a metal or other thermal conductor. Some examples may include aluminum, copper or carbon.

[0045] Also shown in Figures 3 and 4 are tubes 5 and nozzles 2. Coolant is delivered to the heat sink 1 via nozzles 2, which are positioned to direct the coolant perpendicular to the plane of the substrate 17. This forces a jet or stream of coolant directly into the volume defined by the substrate 17 and retaining wall 7 of the heat sink 1, resulting in improved heat dissipation. This is particularly the case in comparison to systems such as air-cooled systems, where the coolant is oriented parallel to the plane of the heat sink substrate so that it flows over the heat sink.

[0046] 3 and 4, the nozzle 2 delivers the coolant directly to the center of the volume defined by the substrate 17 and the retaining wall 7. In this example, the center of the volume corresponds to the hottest portion of the substrate 17 area adjacent to (and directly above) the hot component 12. This creates a counter flow such that the coldest coolant is directed to contact the hottest area of ​​the heat sink. The coolant moves radially outward from the hottest portion.

[0047] The nozzle 2 is designed to have a push-fit connection 3 to the tube 5, which does not require tools and therefore allows for easy installation and removal. As a result, the circuit board 15, which may be a computer motherboard, and all components can be easily and quickly replaced. The nozzle is further provided with an earth point 4 that can be bonded to earth or a ground point to eliminate static electricity build-up on the tube 5 and nozzle 2.

[0048] Referring to FIG. 5, a cross-sectional view of the heat sink of FIG. 3 during operation is shown. The same features as shown in the previous figures are identified with the same reference numerals. The arrows indicate the flow of coolant inside the tubes 5 to provide coolant 8 in the volume defined by the substrate 17 and the retaining wall 7 of the heat sink 1, and coolant 9 to the outside of the heat sink 1. As shown above, the coolant emerging from the nozzles 2 is directed towards the centre of the volume (corresponding to the centre of the surface area of ​​the substrate 17) from where it travels radially outwards towards the retaining wall 7. The coolant is pumped through the nozzles 2 into the volume sufficiently that it overflows the retaining wall 7 and collects outside the heat sink 1 with the remaining coolant 9.

[0049] The retaining walls 7 acting as side walls enable different levels of coolant: the coolant 8 within the volume of the heat sink 1 is at a relatively high level, and the coolant 9, which at least partially immerses the low temperature component 10 (not shown in this figure), is at a lower level. This allows the use of a much smaller amount of coolant than other similar systems that cover all components at the same height.

[0050] This realizes several advantages: First, significant cost savings are possible since less dielectric coolant is used, and this coolant can be expensive.

[0051] Dielectric cooling liquid is typically quite heavy. Using less cooling liquid may make the cooling module 100 easier to install and / or lift. Also, less infrastructure may be required to install the cooling module 100. Additionally, the cooling module 100 is easier to handle than similar devices and systems that use significantly more primary cooling liquid. The level of the primary cooling liquid 9 in most of the vessel 110 is not near the top of the vessel. As a result, it is less likely to spill during maintenance or replacement of components. Also, the risk of leakage is reduced.

[0052] The retaining wall 7 provides a damming effect. The coolant 9 at a relatively low level cools a cryogenic component 10 which would normally be cooled by air in the absence of the coolant. The cryogenic component 10 does not need to be completely immersed in the coolant.

[0053] A further advantage of the volume bounded by the substrate 17 and the retaining wall 7 is temporary cooling redundancy. Even if the pump 11 or another component critical to the flow of coolant fails, there is a certain amount of coolant trapped within the volume of the heat sink 1. This coolant is sufficient to continue to cool the hot components 12, at least for a short period of time. This counters and potentially prevents momentary temperature changes on the hot components 12, thus reducing the onset and giving time for these components to shut down.

[0054] One aspect of the invention will now be discussed more generally. For example, one may consider a heat sink for an electronic device immersed in a cooling liquid, comprising a base configured to be mounted on top of and transfer heat from a heat transfer surface of the electronic device, and a retaining wall extending from the base. Specifically, the base and the retaining wall define a volume for storing a portion of the cooling liquid, such that heat transferred through the base is transferred to the cooling liquid stored within the volume. This volume advantageously allows heat to be retained adjacent to the heat transfer surface.

[0055] A smaller amount of dielectric coolant may be used than with existing cooling systems or modules. The base and retaining wall are preferably arranged such that the level of coolant stored within the volume is higher than the level of coolant outside the volume. For example, this may be implemented by a base comprising a mount, which may raise the volume above the bottom of the base. The base may further comprise a substrate integral with or attached to the mount, which defines a portion of the volume. The base and retaining wall may be separate parts or may be integral.

[0056] In a preferred embodiment, the surface of the base (such as the substrate portion of the base) that defines the volume is planar or essentially or substantially planar. However, this is not required. The base (which may be the surface that is mounted on the electronic device) may be attached to a retaining wall and / or be integral with the electronic device. In some cases, the retaining wall may be configured to define a volume that is substantially equal to the internal volume. The cooling chamber cooperates with the base to have at least one opening therein to allow the exit of cooling fluid that accumulates therein.

[0057] Advantageously, within the volume, protrusions extend from the base and / or the retaining wall. In particular, these protrusions may extend from the base (perpendicular to the base plane) at approximately the same distance as the retaining wall. The protrusions may comprise pins and / or fins. The protrusions preferably extend perpendicular to the base plane (the protrusions are advantageously straight). In particular, the protrusions may be arranged to spread the cooling liquid radially away from a predefined point on the base surface (such as a point coinciding with or adjacent to the hottest part of the electronic device). The protrusions are preferably formed in a non-linear pattern. This may allow the coolant to spread radially from the predefined point.

[0058] In another aspect, a (sealable) cooling module for an electronic device is provided, comprising a container for housing the electronic device such that the electronic device can be at least partially immersed in the cooling liquid, and a heat sink as described herein mounted on the electronic device. The cooling module may further comprise a cooling liquid. The cooling liquid is advantageously a dielectric material. It is advantageously thermally conductive and electrically insulating.

[0059] The cooling module may further be configured to cause the cooling liquid to flow within the vessel. In particular, the cooling module may further comprise a pump for causing the cooling liquid to flow within the vessel. Alternatively, or additionally, the cooling liquid may be caused to flow within the vessel by the configuration of the cooling module (e.g., by enabling or promoting convection of the cooling liquid). In either case, the cooling liquid may be a primary coolant. The cooling module may comprise a heat exchanger configured to receive a secondary cooling liquid and transfer heat from the primary cooling liquid to the secondary cooling liquid. The heat exchanger is preferably present within the vessel. The pump may be configured to cause the cooling liquid to flow into and out of the heat exchanger. Optionally, multiple such heat exchangers may be provided.

[0060] Beneficially, the cooling module may further comprise a nozzle arrangement arranged to receive and direct the flowing or pumped cooling liquid into the volume of the heat sink. The nozzle arrangement may be arranged to direct the flowing or pumped cooling liquid into a portion of the base of the heat sink and / or a portion of the volume of the heat sink adjacent the hottest portion of the heat transfer surface of the electronic device. The nozzle arrangement is advantageously arranged to direct the flowing or pumped cooling liquid in a direction perpendicular to the base of the heat sink.

[0061] The nozzle arrangement preferably comprises one or more nozzles. The one or more nozzles may each be configured to direct a flowing or pumped cooling liquid to a respective portion of the volume of the heat sink. In some embodiments, the nozzle arrangement comprises a plurality of nozzles. Each nozzle may then be configured to direct a flowing or pumped cooling liquid to a respective portion of the volume of the heat sink adjacent to a portion of the heat transfer surface of the electronic device having a temperature above a threshold level. The threshold level may be set based on the temperature of the hottest portion of the heat transfer surface of the electronic device, e.g., based on a percentage, or may be set to cool a predetermined number of the hottest portions of the heat transfer surface.

[0062] The cooling module may further comprise at least one tube arranged to transport cooling liquid to the nozzle arrangement (preferably from the pump, if a pump is provided). The one or more nozzles may then each be configured to couple to a respective one end of the at least one tube. Preferably, the coupling is by a push fit. In other words, each nozzle may be coupled to a respective tube end by a push fit.

[0063] Referring now to Figure 6, there is shown a top view of the nozzle arrangement of the embodiment of Figure 3. As previously mentioned, the nozzle 2 (with its push-fit connection 3 visible) is coupled to a tube 5. The nozzle 2 is aligned to face the center of the surface area of ​​the substrate 17 (not shown in this view). The arrows in this view indicate the radial flow of coolant.

[0064] Alternative positions for the nozzle 2 are possible. Some of these positions will now be described with reference to FIG. 7, in which a top view of a first variant of the nozzle arrangement of the embodiment of FIG. 3 is shown, and with reference to FIG. 8, in which a top view of a second variant of the nozzle arrangement of the embodiment of FIG. 3 is shown. First, with reference to FIG. 7, the nozzle 2 is shown off-center. Such an arrangement can be provided when the hottest part of the temperature component 12 is not adjacent to the center of the substrate 17. With reference to FIG. 8, two nozzles are shown. The two nozzles 2 are aligned over the surface area of ​​the substrate 17 (not shown) adjacent to the two hottest parts of the lower high-temperature component 12 (not shown).

[0065] Referring now to Figure 8A, a perspective view of a third variant of the nozzle arrangement of the embodiment of Figure 3 is shown. In this variant, a number of pins 6 are shown on the inside of the retaining wall 7. The tubes 5a are directly bonded to openings in the planar substrate 17. This can be seen better with reference to Figure 8B, where a cross-sectional view of the diagram of Figure 8A is shown. The tubes 5a may thereby provide coolant directly into the volume defined by the retaining wall 7. In a further variant (not shown), the tubes 5a may be directly bonded to openings or gaps in the side of the retaining wall 7.

[0066] Referring now to Figure 8C, there is shown a perspective view of a fourth variation of the nozzle arrangement of the embodiment of Figure 3. This variation is similar to the design shown in Figure 7. The tube 5 and nozzle 3 are aligned such that the nozzle 3 is more centrally positioned with respect to the volume defined by the retaining wall 7.

[0067] Additionally, a partial lid 7a is provided to cover a portion of the internal volume. One or more gaps in the partial lid 7a may allow coolant from the nozzle 3 to reach the internal volume. The partial lid 7a may be attached to a portion of the nozzle 3, but this is not required.

[0068] The partial lid may allow for an increase in the pressure and flow rate of the coolant. In other words, it may stop the coolant from exiting the volume directly over the side of the retaining wall 7. In this variation, the partial wall is bonded to the retaining wall 7. However, it is recognized that this may be adjusted based on the desirability and / or requirements of the individual heat sink. For example, one or more of the shape and position of the lid and whether, how and where it bonds to the retaining wall 7 may be adapted to change the flow of the coolant and set or adjust where the coolant overflows the retaining wall 7. Referring to FIG. 8D, a perspective view of a fifth variation of the nozzle arrangement of the embodiment of FIG. 3 is shown, similar to the fourth variation shown in FIG. 8C, but the partial lid 7b is smaller than the partial lid 7a and is not bonded to the retaining wall 7.

[0069] Referring now to Figure 8E, there is shown a perspective view of a sixth variant of the nozzle arrangement of the embodiment of Figure 3, in which the nozzle is integrated with the tube 5b. This can be seen more clearly with reference to Figure 8F, in which a partial cross-sectional view of the schematic of Figure 8E is shown.

[0070] Gaps or holes 3a in the underside of the tubes 5b allow the coolant to be directed and / or distributed to the volume defined by the retaining wall 7 without the need for separate nozzles. Such an arrangement allows a single tube 5b to be used to more evenly distribute the coolant to different locations. One or more of the position, number, pitch and size of the holes 3a may be set or adjusted to suit the desired performance. For example, in FIG. 8F, it can be seen that at least one of the holes 3a has a larger diameter than the others, resulting in a higher flow rate of coolant through that hole. The tubes 5b may have a closed end 3b on one side, although this is not required (more on this below). In some further variations (not shown), the tubes 5b may be tapered or otherwise vary in cross-sectional area to control and / or balance the distribution of coolant between different portions.

[0071] Another generalized aspect of the present disclosure will now be discussed, where a cooling module is provided that includes a container for housing an electronic device for cooling such that the electronic device may be at least partially submerged in a cooling liquid, a heat sink with a base mounted on the electronic device, and a nozzle arrangement arranged to receive and direct the cooling liquid to the base of the heat sink. Specifically, the nozzle arrangement may be arranged to direct the received cooling liquid to the heat sink in a direction perpendicular to the base. In some embodiments, the nozzle arrangement may be arranged to direct the received cooling liquid to the base of the heat sink through an interior (reservoir) volume of the heat sink. Directing the flow of the cooling liquid in these ways may facilitate cooling of the electronic device through the heat sink because the cooler cooling liquid is efficiently directed to the hottest portions.

[0072] The nozzle arrangement may comprise a tube arranged to receive the cooling liquid, for example from a pump. One end of the tube may be outside the volume defined by the heat sink. In this case, the nozzle may be attached, mounted or positioned at this end of the tube to direct the cooling liquid. The nozzle may be integrated with the tube by providing one or more holes in the tube to appropriately direct the coolant. If multiple holes are provided in the tube, one or more of the position, number, pitch and size of the holes may vary from hole to hole. The volume defined by the retaining wall may be provided with a lid covering a portion thereof, which may optionally be joined to the retaining wall. The lid may be aligned and / or configured to allow the cooling liquid to reach the volume, but to prevent some coolant from leaving the volume through openings not bounded by the base and / or the retaining wall. In another embodiment, the tube may be coupled to the base of the heat sink (so that the coolant is directed to the base) or to a sidewall of the heat sink adjacent to the base.

[0073] Advantageously, the cooling liquid is made to flow within the container. In some embodiments, the cooling module further comprises a pump for making the cooling liquid flow within the container. The nozzle arrangement may be arranged to receive the flowing or pumped cooling liquid. The nozzle arrangement may enable the delivery of the coolant directly to the hottest part of the heat sink and may thereby provide a counter flow.

[0074] Advantageously, the nozzle arrangement is arranged to direct the flowing or pumped cooling liquid to a portion of the heat sink adjacent the hottest portion of the electronic device. The nozzle arrangement advantageously comprises one or more nozzles. The one or more nozzles may then each be configured to direct the flowing or pumped cooling liquid to a respective portion of the heat sink. In some embodiments, the nozzle arrangement comprises a plurality of nozzles. Each nozzle may then be configured to direct the flowing or pumped cooling liquid to a respective portion of the heat sink adjacent a portion of the electronic device having a temperature above a threshold level. The threshold level may be set based on the temperature of the hottest portion of the electronic device, for example based on a percentage, or set to cool a predetermined number of the hottest portions of the electronic device.

[0075] In a preferred embodiment, the cooling module pumps the cooling fluid (if a pump is provided, The nozzle arrangement further comprises at least one tube arranged to transport the nozzles (preferably from a pump). The one or more nozzles may then each be configured to couple to a respective one end of the at least one tube. Preferably, the coupling is by a push fit. In other words, each nozzle may be coupled to a respective tube end by a push fit. As previously mentioned, alternative arrangements are possible.

[0076] The heat sink of this embodiment may be any of the other heat sink embodiments described above. For example, the base of the heat sink may be configured to mount on top of and transfer heat from a heat transfer surface of an electronic device. The heat sink may further include a retaining wall extending from the base, the base and the retaining wall defining a volume for storing a portion of the cooling liquid, such that heat transferred through the base is transferred to the cooling liquid stored in the volume. The base and the retaining wall may be arranged such that the level of the cooling liquid stored in the volume is higher than the level of the coolant outside the volume. The surface of the base defining the volume is flat. The volume of the heat sink may be configured such that coolant received in the volume from the nozzle arrangement moves radially outward from the portion of the volume receiving the coolant therein. The heat sink may further include a protrusion extending from the base and / or the retaining wall within the volume.

[0077] Preferably, the protrusions extend approximately the same distance from the base as the retaining wall. The protrusions advantageously comprise pins and / or fins. In an embodiment, the protrusions extend perpendicular to the base plane. The protrusions may be arranged to spread the cooling liquid radially away from a predefined point on the base surface (such as the hottest part). For example, the protrusions may be formed in a non-linear pattern.

[0078] The cooling liquid may be a primary cooling liquid. The cooling module may thus further comprise a heat exchanger configured to receive a secondary cooling liquid and transfer heat from the primary cooling liquid to the secondary cooling liquid. The pump may be configured to flow the cooling liquid into and out of the heat exchanger. The nozzle arrangement is advantageously arranged to receive the primary cooling liquid from the heat exchanger. In this manner, the coolant directed by the nozzle arrangement to the heat sink may be the coldest coolant. This may then advantageously be directed to the hottest portion of the heat sink.

[0079] The protrusions 6 (as pins and / or fins) may be integrally formed with the remainder of the heat sink 1 or may be manufactured from a separate component from the remainder of the heat sink 1. The protrusions 6 may be tolerance fitted, glued or brazed in place. Alternatively or additionally, the retaining wall 7 may be integrally formed with the remainder of the heat sink 1, for example by extrusion, or may be manufactured separately from the remainder, or may be an assembled sheet metal part. The retaining wall 7 may then be tolerance fitted and glued, brazed or welded in place.

[0080] Referring to Figure 9, there is depicted an enlarged top view of a portion of the embodiment of Figure 3, showing the projection arrangement. As can be seen in this embodiment, the projections 6 are regularly spaced pins.

[0081] Although the protrusions 6 are shown as pins, other arrangements are possible and may in fact be advantageous. The protrusions 6 may be fins or a combination of pins and fins. Some of these variations are described below. For example, the pins and / or fins may be arranged non-linearly (non-linearly). This may improve the radial flow of the coolant. The variations described are examples of possible alternative implementations, and further options may be readily contemplated by one of ordinary skill in the art.

[0082] Referring to Figure 10, a top view of a first variation of the projection device of the embodiment of Figure 3 is shown. The projections in this case comprise pins 6 and fins 6' arranged in a helical design. These projections also promote radial flow of the cooling liquid.

[0083] Referring to Figure 11, a top view of a second variation of the projection device of the embodiment of Figure 3 is shown. The projections comprise pins 6 and fins 6'' arranged in a "spider" design. Like the previous design, this also further promoted radial flow.

[0084] 12, there is shown a top view of a third variation of the projection device embodiment of FIG. 3, in which the projections comprise pins 6 and pin-fins 6'''. These are arranged in a "burst" design, which also promotes radial flow.

[0085] 13, a cross-sectional view of a portion of the heat sink of FIG. 3 is shown showing the height of the protrusion arrangement. As can be seen in this figure, the pins 6 are flush with the height of the retaining wall 7. This has several advantages. The retaining wall 7 can ensure complete wetting of all the protrusions 6. In other words, all of the protrusions 6 (whether pins, fins, or a combination of both) are intended to be submerged in the coolant 8. This can help ensure that every possible surface is used for heat dissipation. Furthermore, because the protrusions 6 are flush with the retaining wall 7, the coolant cannot go around or over the protrusions 6. It is not necessary that the protrusions 6 are pins as shown in FIG. 13, and such a design can be possible regardless of how the protrusions 6 are formed.

[0086] With reference now to Figure 14, a cross-sectional view of a first variant of the height of the protrusion device of the embodiment of Figure 3 is shown, in which the protrusions 6a are at a lower height than the retaining wall 7. In this case, the advantage of complete wetting of the protrusions is preserved, but without the advantage that the coolant can bypass them. With reference to Figure 15, a cross-sectional view of a second variant of the height of the protrusion device of the embodiment of Figure 3 is shown, in which the protrusions 6b are at a higher height than the retaining wall 7. This preserves the advantage that the coolant cannot bypass the protrusions 6b, but without the advantage that all protrusions 6b are completely wetted.

[0087] Referring again to Figures 1 and 2, another portion of the cooling module 100 (most clearly shown in Figure 1) will now be discussed. Located in the center of the enclosure 110 is the electronic device 24. This is typically a power supply. It is located in a separate portion of the base portion of the enclosure 110 from the circuit board 15, bounded by a retaining wall 27. Referring now to Figure 16, there is shown a cross-sectional view of a second embodiment of a heat sink according to the present disclosure, corresponding to a variation of the electronic device 24 and retaining wall 27 shown in Figure 1. Figure 17 shows a perspective view of the heat sink of Figure 16. Figure 17 shows a perspective view of the heat sink of Figure 16.

[0088] In this embodiment, the heat sink 20 is disposed on a base 120 of the container 110. The heat sink 20 comprises a base 21 and a retaining wall 27. An electronic device, such as a power supply 24, is located on the base 21 of the heat sink 20 within a volume (internal volume) defined by the base 21 and the retaining wall 27. The construction process and / or materials for the heat sink 20 may be the same or similar to those used for the heat sink 1 described above.

[0089] Coolant is carried into this volume by tubes 22. As shown in Figure 16, this coolant flows from the ends of the tubes directly into the lower part of the volume defined by the base 21 and the retaining wall 27. The electronic device 24 is shown fully submerged in the coolant, however, it may only need to be partially submerged depending on the most efficient scenario in terms of heat extraction and amount of coolant.

[0090] As with other embodiments in this disclosure, coolant can flow over retaining wall 27, allowing for multiple cooling levels. The same advantages identified above for this feature apply equally to this embodiment. Additionally, this can provide two cooling levels, with the low temperature component 10 being cooled by a layer level of coolant that is not the level of coolant within the volume of the heat sink 20. Again, this provides the advantage of temporary cooling redundancy.

[0091] The notch 25 is used to create a flow opening at the other end of the volume opposite the coolant inlet tube 22. This provides direction to the coolant flow and can ensure that components do not end up in stagnant coolant as the colder coolant is pumped straight over the sidewall.

[0092] Various designs are possible for this. Referring to FIG. 17A, a perspective view of a cooling system incorporating a first variant of the embodiment of FIG. 16 and FIG. 17 is shown. Referring also to FIG. 17B, an exploded view of the cooling system of FIG. 17A is shown. The heat-generating (or heat-dissipating) components or devices of the cooling system are mounted on a substrate 112, typically a circuit board (such as a PCB or a motherboard). Some of these components or devices cannot be easily cooled by a low level of cooling liquid. A solution may be possible with the general design of the heat sink 20 shown in FIG. 16 and FIG. 17. However, a base (such as the base 21 of the heat sink 20) ​​is not necessary.

[0093] Instead, retaining side walls are provided, which act as dam walls to create a volume for retaining the coolant. The base of the volume is provided by the substrate 112. Examples include a first retaining wall 113, a second retaining wall 114, and a third retaining wall 115. The retaining walls can be made of any material (metal, plastic, silicone, etc.) and can be glued, adhered, screwed, or otherwise fixed or attached to the substrate. The side walls can also be overmolded, silicone cast, or 3D printed. The joint between the side walls and the substrate can also be sealed with a gasket or adhesive tape. The heat sink formed by the retaining walls and substrate can be of any shape or height depending on the cooling requirements or footprint of the component to be cooled.

[0094] Coolant is supplied from a pump (not shown) to the volume formed by substrate 112 and first retaining wall 113 using a first tube 116, to the volume formed by substrate 112 and second retaining wall 114 using a second tube 117, and to the volume formed by substrate 112 and third retaining wall 115 using a third tube 118. Although the design shown in Figures 17A and 17B shows each tube supplying coolant to the top of a respective retaining wall, it will be appreciated that other methods of coolant delivery (e.g., as disclosed further herein) can be used.

[0095] In a second variation of this design, the base 21 does not have to be a separate component of the design, but can be the base of the container or the base of the circuit board. With reference to FIG. 17C, a second variation of the embodiment of FIGS. 16 and 17 along these lines is shown. The substrate 121 is an existing part of the container, for example the container base 120 (as shown in FIG. 16) or the circuit board 15 (as shown in FIG. 2). The retaining wall is formed in part by a vertical circuit board 122 that is perpendicular to the substrate 121. The parts of the retaining wall that are not formed by the vertical circuit board 122 are formed by a side wall 123. In this case, the two vertical circuit boards 122 are provided to form opposing walls, forming a rectangular internal volume 125 together with the side wall 123 that also forms an opposing wall. The vertical circuit boards 122 and the side wall 123 are partially sealed against the substrate 121, thus forming the internal volume 125. Cooling liquid directed to the inner volume 125 is kept between components (not shown) within the inner volume 125. A partial seal may allow some liquid to flow out of the inner volume 125 through gaps in the seal, but the flow rate is typically much less than the liquid supply (50%, 30%, 25%, 20%, 10%, 5% or 1% of the liquid supplied to the inner volume 125). In some cases, the sealing of the vertical circuit board 122 and sidewalls 123 to the substrate 121 may be tighter or more complete. Means for directing cooling liquid (not shown) into the inner volume may include any of those described herein, for example with reference to Figures 7, 8, 8A-8F or 16, or further options described below.

[0096] 17D, a modification of the second variation shown in FIG. 17C is shown. Here, only one vertical circuit board 122 is provided with three side walls 123, which together provide an internal volume 125 for the board 121. It will be appreciated that the number of vertical circuit boards 122 and side walls 123 may be further varied (the retaining wall need not be square in shape), and thus in fact all of the retaining wall may be provided entirely by the side walls 123 or entirely by the vertical circuit board 122. Such a design may be space-efficient and may be optimized for a particular component configuration. For example, some or all of the retaining wall may be formed using existing components. This creates the internal volume 125 using a damming effect.

[0097] With reference to FIG. 18, an exploded perspective view of a third variation of the embodiment of FIGS. 16 and 17 is shown. In this embodiment, the heat sink 20' includes a volume defined by a base 21 and a retaining wall 27. An electronic device 24 is provided inside the volume. Coolant is delivered to the volume via a tube 22. However, instead of being fed to the bottom of the volume, the coolant is fed to the top of the volume via a nozzle attachment 23. This allows better control of the direction of the coolant flow. A flow port 25 at the other end of the volume, opposite the coolant inlet tube 22, can again provide direction to the coolant flow. This variation also provides other advantages associated with the flow port 25. With reference to FIG. 19, an exploded view of FIG. 18 is shown with the nozzle portion 3 removed. No nozzles need to be provided and the coolant can flow directly from the end of the tube.

[0098] 20, there is shown a perspective view of a third embodiment of a heat sink according to the present disclosure. It is similar to the second embodiment in that it comprises a base 31 and a retaining wall 37 that define a volume in which an electronic device 34 is provided. The coolant reaches the volume via a tube 32, and at the other end of the volume opposite the tube 32, a flow opening 35 is provided for the coolant to flow.

[0099] Figure 21 shows an exploded perspective view of a variation of the embodiment shown in Figure 20. Where like features are indicated, like reference numerals are used. In this variation, tubes 32 are equipped with nozzle attachments 33 so that coolant is supplied to the top of the volume defined by base 31 and retaining wall 37.

[0100] In this regard, a further variant may also be provided in which the nozzle attachment 33 is omitted.

[0101] Further generalized aspects of the present disclosure will now be considered. A heat sink for an electronic device may be provided that is positioned within the cooling module and immersed in a cooling liquid. The heat sink has a wall arrangement that defines an internal volume within which an electronic device is mounted and within which the cooling liquid accumulates around the electronic device during operation, such that heat is transferred from the electronic device to the cooling liquid that accumulates within the internal volume. Optionally, an electronic device may be mounted within the internal volume and further provided. In a preferred embodiment, an electronic device may be mounted within the internal volume and immersed in a cooling liquid. The child device is a power supply unit.

[0102] Typically, the wall device comprises a base configured to mount the heat sink in the cooling module and a retaining wall extending from the base, the base and the retaining wall defining an internal volume for accumulating the cooling liquid. The wall device may thus define a rectangular or prismatic structure with an open top (or partially enclosed). In particular, the base or base surface defining the internal volume is planar. For example, the surface of the base may be flush with the surface of the container on which the heat sink is eventually mounted. A flat base surface may also allow the electronic device to be flush with the base within the internal volume, especially if the electronic device also has a flat mounting surface.

[0103] In some cases, the base may be provided by a surface of a container housing the cooling module, or a circuit board within the cooling module. Alternatively, or in addition, some or all of the retaining wall may be formed by a side of a container housing the cooling module, or a circuit board within the cooling module. Thus, the base and / or retaining wall may not need to be separate parts of the heat sink, but may be integrated with other parts or components of the cooling module.

[0104] As noted with respect to other aspects or embodiments of the present disclosure, the wall device is advantageously positioned such that the level of coolant pooling within the interior volume is higher than the level of coolant outside the interior volume, and the advantages (and, in some cases, implementations) are generally the same as for the other embodiments or aspects.

[0105] In a preferred embodiment, the wall device further defines a flow opening, which may allow the cooling liquid to flow out of the internal volume. It may also (at least partially) define the flow of the cooling liquid through and / or within the internal volume of the heat sink. The flow opening may be, for example, a cutout in the wall device or the retaining wall.

[0106] Further, a cooling module for an electronic device may be contemplated, comprising a container for housing an electronic device such that the electronic device may be at least partially submerged in the cooling liquid, and a heat sink as described herein in connection with this embodiment. The cooling module may be further configured to cause the cooling liquid to flow within the container, particularly by comprising a pump (although alternatives discussed elsewhere herein may be used instead). Furthermore, the cooling module may comprise at least one tube positioned to receive and flow the pumped cooling liquid, or having an outlet through which the pumped cooling liquid exits and is directed into the interior volume of the heat sink.

[0107] The shape of the internal volume may be elongated (e.g., having a rectangular profile), thereby defining first and second end portions at opposite ends of the elongated internal volume. Thus, the tube outlet is preferably positioned at the first end portion, and the flow opening is preferably positioned at the second end portion. This promotes flow of the cooling fluid along the elongated dimension of the internal volume, allowing for more efficient contact with the electronic device.

[0108] In some embodiments, the outlet is positioned in the top half of the internal volume (or in other words, in the top half of the internal volume), which allows the flow of the coolant to be better directed than if the outlet were positioned in the bottom half. In other embodiments, the outlet is positioned in the bottom half of the internal volume, which allows the coldest coolant to spend more time in contact with the electronic device, which may be more efficient than if the outlet were in the top half. In less preferred embodiments, the outlet is positioned about halfway through the internal volume.

[0109] The outlets of the tubes may include one or more nozzles, each configured to direct flowing or pumped cooling liquid into a respective portion of the interior volume. For example, this arrangement may be as (and / or may be implemented similarly to) those described with respect to other embodiments or aspects of the disclosure. For example, the one or more nozzles may each be configured to couple by a push fit to a respective end of the at least one tube.

[0110] The cooling liquid is advantageously a primary cooling liquid. The cooling module may thus comprise a heat exchanger configured to receive a secondary cooling liquid and transfer heat from the primary cooling liquid to the secondary cooling liquid. Details regarding the primary and secondary cooling liquids are discussed above in relation to other aspects. The pump may be configured to flow the cooling liquid into and out of the heat exchanger. The one or more nozzles are preferably arranged to receive the primary cooling liquid from the heat exchanger.

[0111] While specific embodiments have been described above, those skilled in the art will recognize that various modifications and alternatives are possible. The design of the container 110 may be shaped and / or structured differently than shown (e.g., not rectangular). Any of the thermally conductive components of the designs disclosed herein may be formed using any thermally conductive material, such as copper or aluminum. Various plantings or coatings, such as gold plating, may also be used to improve thermal performance. Various material structures, such as laser sintering, honeycones, or foams, may also be used to increase surface area.

[0112] As for the heat sink 1, the base structure may be different. For example, the mount 16 may be provided in a different way. The substrate 17 does not have to be planar.

[0113] Alternatives such as adhesives, rivets or other attachment forms may be considered for the fixing screws 13. The retaining walls 17, 37 may be provided as a single (integral) wall or as multiple walls. The shape and / or size of the retaining walls 17, 37 may also be adjusted.

[0114] The design of the heat sink 20 may also be varied with different shapes, sizes and / or implementations. For example, it may be formed with multiple retaining walls and / or with a non-planar base. The base 120 and retaining walls 27 (or variations thereof) may be integral or separate components. It is typical for electronic devices or components, such as the high-temperature component 12 and the electronic device 24, to have at least one (or some or all) flat surface, particularly the surface (the mounting surface) on which the heat sink is mounted, located or secured. However, embodiments of the present disclosure can be readily adapted for use with electronic devices and / or components that do not have flat surfaces. For example, the mounting surface can have bumps, be curved, and include points (e.g., shaped into a triangle or other polygonal shape).

[0115] For what is shown as high temperature component 12 and / or electronic device 24, alternative electronic devices having, for example, different shapes, structures or uses may be used. In some embodiments, low temperature component 10 may not be provided and / or a differently designed circuit board 15 may be present (or may not even be present). The arrangement of circuit board 15 and / or components may vary significantly. For example, the location of electronic device 24 may be different than that shown.

[0116] The flow of cooling liquid inside the vessel is preferably achieved by means of a pump 11. While there may be more or less pumps than shown, and in fact some embodiments may provide as little as one pump. Alternatively, the flow of the cooling liquid may be achieved and / or promoted without a pump. For example, this is possible if the configuration of the vessel 110 and / or the cooling liquid allows for the flow of the cooling liquid in some other way. One approach is to take advantage of the natural consequence of the operation of the cooling module, namely, that the electronic components and / or devices, when operated, cause the cooling liquid to heat up and convect. When the cooling liquid convects, the cooling liquid flows. With the proper orientation or design of the vessel 110, the cooling liquid convection can be circulated within the vessel 110. The flow of the cooling liquid can then be further promoted by baffle plates or other suitable structures inside the vessel 110. Other designs for flowing the cooling liquid would also be suitable.

[0117] A further embodiment of the heat sink device of the present disclosure is designed to fit on or around a heat-generating electronic device (to be cooled) mounted on a vertically oriented printed circuit board (PCB). The features of this embodiment may be applied to other embodiments disclosed herein, if applicable. The electronic device may be a processor, an application specific integrated circuit (ASIC), or other electronic device with significant heat output during operation. The printed circuit board of this embodiment may be mounted in the enclosure of the cooling module (sometimes referred to as a "blade", not shown in the figures below), and may be, for example, a daughterboard mounted on (or adjacent to) a motherboard mounted horizontally in the enclosure. As used herein, the terms vertical and horizontal refer to the enclosure of the cooling module, which includes a floor and sidewalls extending from the floor. Horizontal implies parallel to the floor, and vertical implies perpendicular to the floor (typically parallel to one or more sidewalls). Upper implies distal from the floor of the enclosure, and lower implies proximate to the floor of the enclosure. The cooling module enclosure may have a lid for sealing the interior volume of the cooling module.

[0118] Referring to FIG. 22A, an exploded front view of a fourth embodiment of a heat sink device is shown. The heat sink device comprises a thermal interface material 41, a heat sink protrusion 42, a retaining wall 46, and a tube 49. The heat sink protrusion 42 comprises a mounting surface 42a (to be mounted on the thermal interface material 41, or directly on the surface of the electronic device 43 if the thermal interface material 41 is not present) and a protrusion 44. Coolant is supplied via the tube 49 and passes into an internal volume formed by the retaining wall 46 and the mounting surface 42a. The thermal interface material 41 thermally bonds the heat sink protrusion 42 to the electronic device 43. The retaining wall 46 may be formed from a thermally conductive material such as metal. The protrusion 44 is shown as a linear fin in this embodiment, but a range of types of fins, pins, or combinations of pins and fins can be used instead. Also provided on the PCB 45 are additional devices 61, which in this case are random access memory (RAM) devices.

[0119] 22B shows an assembled perspective view of the embodiment of FIG. 22A, and FIG. 22C shows an assembled side view of the embodiment of FIG. 22A. From these figures, the relative alignment of the retaining wall 46 and the tube 49 can be seen. In use, the cooling liquid is provided from the tube 49 and accumulates in the internal volume defined by the retaining wall 46 and the mounting surface 42a. FIG. 22C also shows the cooling liquid level 54 of the container in normal operation. The depth of the cooling liquid in the container can be kept low (lower than the height of the electronic device 43 and / or the retaining wall 46) since it is not necessary to submerge any electronic device. Rather, the cooling liquid is held against the heat sink protrusions 42 (thermally coupled to the electronic device 43 via the thermal interface material 41), but the top of the internal volume defined by the retaining wall 46 is open. This allows the cooling liquid to overflow from the internal volume.

[0120] Referring also to FIG. 22D, an exploded rear view of the embodiment of FIG. 22A is shown. 4 details the flow of coolant from tube 49 through a series of coolant delivery holes 50 in tube 49 to the interior volume defined by retaining wall 46. The alignment and spacing of coolant delivery holes 50 may be set as desired to deliver coolant to specific portions of the interior volume. Other tubes (not shown) are used to deliver coolant to other components on PCB 45, such as RAM 61.

[0121] The base (i.e., bottom) of the retaining wall 46 is provided with small holes 48 for the coolant. The size of these holes and / or the flow rate of the coolant through the tubes 49 may be configured to retain the coolant within the interior volume for at least a predetermined duration. Such holes may also be applied to other embodiments and designs described herein (e.g., with reference to FIG. 3 and / or FIG. 16) for similar purposes.

[0122] Generally speaking, a heat sink apparatus for an electronic device to be mounted on a surface within an enclosure in a generally perpendicular orientation with respect to the floor of the enclosure may be envisaged. The heat sink apparatus comprises a retaining wall configured to at least partially define an internal volume. The retaining wall cooperates (or is configured to cooperate) with a surface (such as a plate or another surface, which may be planar or of other shape) mounted on the electronic device such that cooling liquid directed into the internal volume accumulates in the internal volume. The heat sink apparatus may further comprise a nozzle arrangement arranged to receive the cooling liquid and direct the cooling liquid into the internal volume of the heat sink. In particular, the internal volume may be defined and / or arranged such that heat is transferred from the electronic device to the cooling liquid accumulated in the internal volume. Optionally, the surface mounted on the electronic device is attached to the retaining wall.

[0123] Advantageously, the retaining wall comprises a base portion oriented substantially parallel to the floor of the container. The retaining wall may further comprise a surface (mounting surface) for mounting on the electronic device. The surface for mounting on the electronic device and the retaining wall (or the remaining part of the retaining wall) advantageously cooperate (or are configured to cooperate) such that the internal volume has at least one opening (preferably distal to the floor of the container) for exiting cooling liquid accumulated in the internal volume. The heat sink device may further comprise a thermal interface material arranged between the electronic device and the surface for mounting on the electronic device.

[0124] The heat sink apparatus may further comprise protrusions extending into the interior volume from the retaining wall and / or a surface (such as a mounting surface) that is mounted on the electronic device. The protrusions optionally comprise pins and / or fins. The protrusions may extend in a direction perpendicular to the plane of the electronic device (particularly when the electronic device is substantially planar). In an embodiment, the protrusions extend into the interior volume from a surface that is mounted on the electronic device, such as a mounting surface.

[0125] In some designs, the retaining wall comprises a sidewall portion (which may include a base portion) that extends generally parallel to the floor of the container. Thus, the retaining wall may further comprise a mounting plate or surface portion oriented generally perpendicular to the floor of the container and positioned to fit within the sidewall portion to at least partially define the interior volume. The mounting surface or plate may be configured to be mounted adjacent to and / or on (and in particular in thermal communication with) the electronic device. Thus, the mounting surface or plate may be a surface that is mounted on the electronic device.

[0126] The nozzle arrangement optionally comprises at least one nozzle positioned on a side of the interior volume distal from the floor of the vessel (at the top of the interior volume). In some designs, the nozzle arrangement comprises a piping system (e.g., tubular) that forms at least one channel through which the cooling liquid flows. Thus, the at least one channel has one or more holes, each of which functions as a nozzle for directing the cooling liquid from the channel into the interior volume of the heat sink. At least one channel is optionally oriented parallel to the floor of the vessel.

[0127] The retaining wall (particularly the portion of the retaining wall adjacent the floor of the vessel) may be provided with at least one gap to allow coolant to flow through the retaining wall and exit the interior volume.

[0128] Next, a fifth embodiment will be described with reference to FIGS. 23A to 23E. 23A, an exploded front view of a fifth embodiment of a heat sink device is shown. Several aspects of this fifth embodiment are similar to the fourth embodiment, and therefore like reference numerals are used to indicate like components. The structure of the PCB 45, electronic device 43, heat sink protrusion 42 and RAM 51 are the same as in the fourth embodiment.

[0129] The main difference is in the delivery of the cooling fluid. Panel 52 is mounted vertically facing other components on the board such as retaining wall 46a and RAM 51. Panel 52 is provided with channels 53 which are sealed by plate 56. Referring to Figure 23B, an assembled perspective view of the embodiment of Figure 23A is shown where panel 52 is positioned over retaining wall 46a and RAM 51.

[0130] Reference is now made to FIG. 23C, which shows an assembled side view of the embodiment of FIG. 23A, FIG. 23D, which shows an exploded rear view of the embodiment of FIG. 23A, and FIG. 23E, which shows an assembled cross-sectional view of the embodiment of FIG. 23A. The channels 53 receive and distribute coolant through the coolant delivery holes 50a. These pour or spray jets 55 of coolant into the interior volume defined by the retaining wall 46a (and base portion 42a) and onto other components on the board, such as the RAM 51. The coolant delivery holes 50a can be adjusted and repositioned to vary the delivery of coolant. The assembly of the panel 52 and plate assembly 56 can also be separately mounted to a motherboard or other components.

[0131] The panels 52 may be conductive and in equilibrium with the electronic components to dissipate any charge generated at the coolant delivery holes 50a. An extra panel 52 may be added on the opposite side of the PCB to cool components mounted on the back side of the PCB.

[0132] With reference to FIG. 23F, an assembled perspective view of a first variant of the fifth embodiment is shown. In this view, a retaining wall 46 similar or identical to that shown in the previously described embodiment is visible. The heat sink projection 42' comprises a vertical fin projection. The tube 49' is directly connected to an opening in the lower base of the retaining wall 46. This is more easily seen with reference to FIG. 23G, in which a cross-sectional view of the first variant of FIG. 23F is shown. This allows the tube 49' to provide a coolant directly into the volume defined by the retaining wall 46. This is similar to the design shown for example in FIG. 8A. With reference to FIG. 23H, an assembled perspective view of a second variant of the fifth embodiment is shown, similar to the design of FIG. 23F, but in which the heat sink projection 42'' is formed with a pin projection. In FIG. 23I, a cross-sectional view of the first variant of FIG. 23H is shown, in which the tube 49' can be seen more clearly. In a further variation (not shown) to either of the two variations described here, the tube 49 ′ may be directly bonded to an opening or gap in the side of the retaining wall 46 .

[0133] In the general discussion above, it may be considered that at least one channel is oriented vertically relative to the floor of the vessel. Alternatively, or in addition, the piping system may include first and second panels, one or both of which may include at least The retaining wall may be shaped to form at least one channel, and the first and second panels may be attached to one another to allow cooling liquid to flow through the at least one channel. The first or second panel (particularly the at least one channel) may be provided with one or more holes that allow cooling liquid to flow from the at least one channel into the interior volume. Openings in the retaining wall (e.g. along an edge of a portion perpendicular to the floor of the container) may allow cooling liquid to enter the interior volume through one or more of the holes.

[0134] 24, an exploded front view of a sixth embodiment of a heat sink device according to the present disclosure is shown. In this embodiment, only the components that make up the heat sink are shown. From the fourth and fifth embodiments described herein, it will be understood how the heat sink is mated and / or coupled to the electronic device and any other components in the coolant module (e.g., in conjunction with the use of thermal interface materials). The heat sink device comprises a mounting surface portion 61, a protrusion (in the form of a pin) 62, a baffle 63, a retaining wall 64, and a cover portion 65.

[0135] The pattern of pins 62 and baffles 63 on the mounting surface 61 creates two symmetrical channels for the coolant to flow through. The retaining wall 64 and cover 65 together with the mounting surface 61 define the interior volume of the heat sink. The coolant is supplied to the interior volume using the nozzle arrangement of the fourth and / or fifth embodiment (as described above) or alternative embodiments. In this way, the coolant flows into the interior volume either parallel or perpendicular to the vertically oriented PCB. The coolant is delivered towards the top and centre of the interior volume. In this way, the coolant is forced into both channels. This forces the coolant down to the bottom of the pins 62 and then rises again to exit the interior volume at the top (corners). Beneficially, this ensures that the coolant contacts a larger (and potentially as large as possible) surface area of ​​the electronic device and / or surfaces that are mounted on or thermally coupled to the electronic device (such as the mounting surface 61) and also allows the coolant to flow through and cool the entire surface of the electronic device.

[0136] This may be combined with other embodiments or variations thereof disclosed herein, for example, the manner in which the cooling liquid is supplied to the internal volume may be implemented according to the fourth embodiment, the fifth embodiment, or a combination thereof.

[0137] Referring now to FIG. 25A, an exploded front view of a first variation of the embodiment of FIG. 24 is shown. Similar to the embodiment of FIG. 24, the heat sink device comprises a mounting surface portion 61, a protrusion (in the form of a pin) 62a, a baffle 63a, a retaining wall 64a, and a cover portion 65a. The configuration and / or structure of the other components, except for the mounting surface portion 61, are different from those shown in FIG. 24. Specifically, in FIG. 25A, a single spiral baffle 63a is shown. The pins 62a and the retaining wall 64a are adapted to correspond to the design of the baffle 63a. The mounting surface portion 61, the retaining wall 64a, and the cover portion 65a cooperate to define an internal volume. Furthermore, the cover portion 65a includes a hole 66 that can act as an inlet or nozzle for receiving the cooling liquid and / or directing the cooling liquid into the internal volume. The cooling liquid is directed into the internal volume from a central portion of the cover portion 65a (relative to the size of the width and / or height of the cover portion 65a).

[0138] Referring to Figure 25B, a front view of a portion of the embodiment of Figure 25A is shown in assembled configuration. The coolant enters the interior volume perpendicular to the central portion of the area of ​​the mounting surface 61 within the interior volume. It can therefore be seen how the coolant is forced around the helical path formed by the baffle 63a, eventually passing through the entire interior volume before exiting the interior volume.

[0139] Referring now to FIG. 26A, there is shown an exploded front view of a second variation of the embodiment of FIG. As in the embodiment of FIG. 24, the heat sink device includes a mounting surface portion 61, protrusions (in the form of pins) 62, a baffle 63b, a retaining wall 64b, and a cover portion 65b. Except for the mounting surface portion 61 and the pins 62, the configuration and / or structure of the other components differ from those shown in FIGS. 24, 25A, and 25B. However, the baffle 63b is similar to the baffle 62 shown in FIG. 24.

[0140] The primary changes are in the retaining wall 64b and the cover portion 65b. Specifically, the cover portion 65b includes an opening 67 that can act as an inlet or nozzle for receiving and / or directing coolant into the interior volume. The coolant is directed into the interior volume from a top central portion (top relative to height, center relative to width) of the cover portion 65a.

[0141] Referring now to Figure 26B, a front view of a portion of the embodiment of Figure 26A is shown in assembled form. This configuration is similar (or the same) as the corresponding configuration of the embodiment of Figure 24 (where the baffles form two channels for the flow of cooling liquid into the interior volume). In the design of Figure 24, the cooling liquid is directed downward into the interior volume, i.e., approximately perpendicular to the floor of the vessel. In contrast, the embodiment of Figure 26A directs the cooling liquid sideways into the interior volume, i.e., approximately parallel to the floor of the vessel. In both embodiments, the cooling liquid is directed into the interior volume from the top of the interior volume (distal to the vessel floor). Specifically, the coolant is directed centrally relative to the width of the interior volume (the dimension parallel to the vessel floor).

[0142] In the general terms above, the retaining wall may be considered to comprise a sidewall portion (which may include a base portion) that extends generally parallel to the floor of the container. The retaining wall may thus further comprise a cover portion that is oriented generally perpendicular to the floor of the container and is arranged to mate with the sidewall portion to define the interior volume. The sidewall portion and the cover portion may be separable. Certain such embodiments may be combined with a mounting surface portion as described above.

[0143] In an embodiment, the protrusion comprises one or more baffles configured to direct the flow of the cooling liquid within the internal volume. For example, the one or more baffles may be configured to direct the cooling liquid to flow (e.g., under gravity) to a first portion of the internal volume that is proximate to the floor of the vessel, and subsequently to a second portion of the internal volume that is distal from the floor of the vessel. This may enable circulation of the cooling liquid around the internal volume, specifically by utilizing gravity to drive the movement of the cooling liquid. Alternatively, or additionally, the one or more baffles are advantageously configured to direct the cooling liquid from a more central portion of the internal volume to a more outer portion of the internal volume, specifically before exiting the internal volume. In some designs, the one or more baffles are configured to direct the cooling liquid to flow in serpentine and / or spiral shaped channels.

[0144] In certain embodiments, the one or more baffles are configured to allow coolant received from the nozzle arrangement into the interior volume of the heat sink to flow through two separate flow paths. In particular, when the coolant is directed into the interior volume from its top (distal from the floor of the vessel), this may allow the coolant to reach all portions of the interior volume, particularly the surface areas adjacent the electronic device within the interior volume. Each of the two separate flow paths may generally be symmetrical or asymmetrical depending on the electronic device and other configuration aspects.

[0145] The nozzle location may be at the top of the interior volume or at the center of the surface area of ​​the interior volume (specifically along a dimension perpendicular to the vessel floor). Preferably, the nozzle is aligned to direct the cooling liquid to the center of the interior volume along a dimension of the interior volume parallel to the vessel floor (specifically along the longer of such dimension). The nozzle location optionally allows for directing the cooling liquid to the hottest portion of the interior volume during operation.

[0146] It will be understood that the heat sink device according to the present disclosure is mounted within a tank. Details of possible tank (container or cooling module) configurations can be found in the previous discussion with reference to Figures 1-21, as well as in International Patent Publication Nos. WO 2018 / 096362 and WO 2018 / 096360. The tank (sometimes referred to as a "blade") is typically a generally rectangular parallelepiped shaped container defining an internal volume for holding one or more electronic devices and a cooling fluid, at least one of which is mounted vertically therein. Such a tank configuration typically includes one or more of a pump, a heat exchanger for transferring heat from the cooling fluid as a primary coolant to a secondary coolant outside the tank, and a piping system for transporting the cooling fluid within the container volume. The container is typically sealed to prevent leakage of the cooling fluid from the inside. The amount of coolant inside the enclosure is typically not enough to cover the electronic devices if the coolant remained in the enclosure without being pumped (this may be true for some, most, or preferably all electronic devices mounted horizontally in the enclosure closer to the enclosure floor than any electronic devices mounted vertically). This is referred to as immersion liquid cooling, in contrast to submersion liquid cooling, where the level of coolant is sufficient to cover the electronic devices if the coolant remained in the enclosure without being pumped. With the heat sink device according to the present disclosure, multiple coolant levels are created during operation, which allows the coolant to be directed to enhance heat transfer efficiency.

[0147] Such immersion cooling provides many advantages. First, costs can be significantly reduced since less dielectric coolant is used, which can be expensive. Dielectric coolants are typically quite heavy. Using less coolant can make the tank easier to install and / or lift. It can also reduce the infrastructure required to install the tank. Additionally, the tank can be easier to handle than a similar device or system that uses a much larger amount of primary coolant. The level of the primary coolant in most of the vessel is not near the top of the vessel. As a result, it is less likely to spill during maintenance or replacement of components. It also reduces the risk of leakage.

[0148] Referring now to FIG. 27A, a heat sink device is shown assembled with additional parts to show the flow of cooling liquid. The heat sink device shows a vertical PCB 45, a RAM device 51, and a panel 52 for directing cooling liquid to the internal volume of the heat sink device and / or to the RAM device 51. The heat sink device may therefore conform to those shown in FIGS. 23A, 23B, 23C, 23D and 23E. The heat sink device and other parts are mounted on a substrate 70, which in some embodiments is a motherboard, baseboard or carrier board. The vertical PCB 45 is plugged into the substrate 70. In some cases, multiple such vertical PCBs may be provided. In some embodiments, the substrate 70 may be omitted.

[0149] Other parts include a pump 72 and a heat exchanger 74. Coolant (within a vessel, referred to as the "primary" coolant) is received by the pump 72 via a primary coolant inlet 73, which directs the coolant to the heat exchanger via a first tube 76. The primary coolant is cooled in the heat exchanger, and the cooled primary coolant is transported via a second tube 82 to a panel inlet 84 of the panel 52, where it is directed into the interior volume of the heat sink apparatus and / or over the RAM device 51.

[0150] The heat exchanger 74 includes a secondary coolant inlet 78 for receiving a secondary coolant (usually a liquid, e.g., water, which may come from the building's main supply), and a secondary coolant outlet 80. The secondary coolant receives heat from the primary coolant via the heat exchanger 74, thus cooling the primary coolant. The heated secondary coolant exits the heat exchanger (and possibly the vessel) via the secondary coolant outlet 80.

[0151] Referring to Figure 27B, a cutaway view of the interior of the container of the embodiment of Figure 27A is shown. The container's sidewalls 90 and floor 91 are visible. In some designs, the substrate 70 may be omitted, and thus the PCB 45 (or equivalent) may be mounted on the floor 91 or sidewall 90.

[0152] Referring now to Fig. 28A, a heat sink device is shown assembled with additional parts in the variant of Fig. 27A. It has some similarities to the design shown in Fig. 27A, in particular the heat sink device includes a vertical PCB 45, a RAM device 51, and a panel 52 (similar to that shown in Fig. 23A, 23B, 23C, 23D and 23E) for directing cooling liquid to the internal volume of the heat sink device and / or to the RAM device 51. The heat sink device and other parts are also mounted on a substrate 70, which may be a motherboard, baseboard or carrier board. A hole through the cold plate 95 allows the vertical PCB 45 to be attached to the substrate 70. Optionally, multiple such PCBs may be provided.

[0153] A pump 92 is also provided with a primary coolant inlet 93 for receiving a primary coolant. The pump directs the coolant to the panel 52 where it is directed into the interior volume of the heat sink apparatus and / or over the RAM device 51.

[0154] The main difference is in the type of heat exchanger provided as a cold plate 95. The main surface (conduction surface) of the cold plate 95 acts as a thermal conductor to transfer heat from the primary coolant in contact with it to a secondary coolant (advantageously liquid, such as water from the building's main supply). The cold plate 95 includes a secondary coolant inlet 97 and a secondary coolant outlet 99 for receiving the secondary coolant (usually liquid, such as water taken in). The secondary coolant cools the primary coolant by receiving heat from the primary coolant through the cold plate 90 and transferring this heat to the secondary coolant (which may pass through tubes or channels adjacent to the conduction surface of the cold plate 90). The heated secondary coolant leaves the cold plate (and possibly the vessel) through the secondary coolant outlet 99.

[0155] 28B, a cutaway view of the embodiment of FIG. 28A is shown inside the vessel. Again, the alignment of the device relative to the vessel sidewall 90 and floor 91 can be seen. In an alternative embodiment, the substrate 70 may be omitted and the cold plate 95 may be mounted on the floor 91 or sidewall 90. Thus, holes in the cold plate 95 may not be necessary.

[0156] Thus, generally speaking, a cooling module for an electronic device may be conceived, comprising a container having an inner surface defining a floor and defining a volume for receiving an electronic component in a substantially perpendicular orientation relative to the floor, and a heat sink apparatus as disclosed herein mounted within the volume of the container. The cooling mode may also include an electronic device mounted within the volume of the container. The electronic device may be mounted on a printed circuit board, oriented substantially perpendicular to the floor of the container. The printed circuit board is optionally a daughter board that may be oriented substantially parallel to the floor of the container (and preferably mounted within the container) and coupled to a motherboard.

[0157] In a preferred embodiment, the nozzle arrangement is arranged to receive and direct a flow of cooling liquid into the interior volume of the heat sink arrangement. For example, the nozzle arrangement may be arranged to direct the flow of cooling liquid into a portion of the interior volume of the heat sink arrangement adjacent a hottest portion of the electronic device. In some embodiments, the nozzle arrangement comprises a plurality of nozzles, each nozzle configured to direct the flow of cooling liquid into a respective portion of the interior volume of the heat sink arrangement adjacent a portion of the electronic device having a temperature above a threshold level.

[0158] The cooling module may further comprise a pump configured to cause the cooling liquid to flow within the container. At least one tube may be arranged to transport the cooling liquid from the pump to the nozzle arrangement.

[0159] Although specific embodiments have been described above, those skilled in the art will recognize that various modifications and alternatives are possible. For example, the nozzle arrangement may vary in the number, type, shape and / or style of nozzles provided. Multiple nozzles may be used to direct the cooling liquid to particularly hot portions of the internal volume during operation. The cooling liquid may be delivered to multiple nozzle arrangements, each for a separate heat sink device. This may be done in parallel. Alternatively, multiple nozzle arrangements for separate heat sink devices may be connected in series, in a so-called "daisy chain" configuration. Thus, a tube delivering coolant to a first heat sink device may continue to a second heat sink device, if appropriate.

[0160] The electronic device does not have to be mounted on a PCB in the container, but on another component or on a side wall of the container. The PCB can be a motherboard (i.e., not necessarily a daughterboard). There may be one or more additional PCBs in the container. These additional PCBs may be oriented generally parallel to the floor of the container or generally perpendicular to the floor of the container. The surface mounted on the electronic device may be a separate component attached to the electronic device, although those skilled in the art may recognize that the surface mounted on the electronic device may be integral with or part of the electronic device. Thus, the retaining wall may be directly attached to the electronic device.

[0161] The protrusions within the interior volume of the heat sink device may be in a variety of patterns. Linear, non-linear and random patterns of protrusions are possible. The alignment and shape of the baffles may vary from that shown.

[0162] Alternative baffle designs that allow coolant to flow through all parts of the internal volume may use one, two or more channels to allow coolant to flow through the internal volume. For improved performance, porous open cell metal foam may be used in conjunction with or as a replacement for protrusions. This may be cast to increase density in certain areas of the volume.

[0163] In the above embodiment, the mounting surface is used to define the internal volume. However, it may be possible for other components (in cooperation with the retaining wall) to define the internal volume. For example, the PCB (i.e. the surface on which the electronic device is or is to be mounted) may define the internal volume by cooperating with the retaining wall 6. Thus, in this case, the electronic device 3, possibly the thermal interface material 1 and the heat sink protrusions 2 would all be located within the internal volume.

[0164] Generally speaking, one variant of the most general aspect may be considered as a heat sink device for an electronic device to be mounted on a surface within a container, in a substantially perpendicular orientation with respect to the container's floor. The heat sink device comprises a retaining wall configured to at least partially surround the electronic device to define an internal volume. The retaining wall cooperates (or is configured to cooperate) with a surface (such as a plate or a housing or wall of the container, or another surface, which may be planar or otherwise shaped) on which the electronic device is or is to be mounted, such that cooling liquid directed into the internal volume accumulates in the internal volume. The surface on which the electronic device is or is to be mounted may be attached to the retaining wall. All other features described herein, whether optional or not, may be used in this variant.

[0165] Any of the thermally conductive components of the design disclosed herein may be formed using any thermally conductive material, such as copper or aluminum or a combination thereof. Various platings or coatings, such as gold plating, may be used to improve thermal performance. Various material structures, such as laser sintering, honey cones, or foams, may be used to increase surface area.

[0166] The heat sink device may be structured differently than shown. For example, it may be mounted in a different manner. The retaining wall or walls may be provided as a single (integral) wall or as multiple walls. The shape and / or size of the retaining wall or walls may also be adjusted.

[0167] The design of the heat sink may also vary with various shapes, sizes and / or implementations, including the use of a single integral component or separate components. It is typical for electronic devices or components to have at least one (or some or all) flat surface, particularly the surface (the mounting surface) on which the heat sink protrusions are mounted, located or secured. However, aspects of the present disclosure can be readily adapted for use with electronic devices and / or components that do not have flat surfaces. For example, the mounting surface can have bumps, be curved, or include points (e.g., shaped into a triangle or other polygonal shape).

[0168] Of what is shown or described, alternative electronic devices may be used, for example having different shapes, structures, or uses. In some embodiments, there may be a differently designed printed circuit board 45 (or indeed there may be no printed circuit board at all). The layout of the circuit board 45 and / or components may be significantly altered. For example, the location of RAM 51 may be different than that shown, and other components may be provided in place of or in addition to RAM 51, or in fact no other components need be provided.

[0169] Other details of the heat sink arrangement may be found in relation to other aspects as previously discussed.

[0170] Further combinations and variations related to all embodiments will now be discussed. For improved efficiency, multiple heat sinks can be connected together. For example, referring to FIG. 29A, a perspective view of a first design is shown in which multiple heat sinks are connected to receive coolant in series. Four heat sinks 201 are shown, each generally conforming to that shown in FIG. 3 (although it will be recognized that any other heat sink design disclosed herein may be substituted). Tubes 202 provide coolant (from a pump, not shown), and each heat sink receives coolant in series from the tubes via individual nozzles 203. The gap size within each nozzle 203 may be varied to allow for uniform coolant distribution to each heat sink 201. For example, nozzles 203 closer to the pump outlet may have smaller gap sizes than nozzles 203 further from the pump outlet.

[0171] The number of heat sinks 201 and nozzles 203 may be varied as appropriate. Referring to FIG. 29B, a perspective view of a second design in which multiple heat sinks are coupled in series to receive a cooling fluid is shown, in which two heat sinks 201 are provided in series.

[0172] Alternatively, or additionally, cooling fluid may be supplied in parallel to the heat sinks 201. Referring to FIG. 29C, multiple heat sinks may be connected to receive cooling fluid in parallel. A perspective view of a first design is shown in which the tube 204 branches off to a first tube 205 that delivers coolant to the heat sink 201 through a nozzle 203, and to a second tube 206 that delivers coolant to the heat sink 201 through a nozzle 203. The nozzle gap size may not need to be changed, or may not need to be changed as much as in the series connected heat sink case described above.

[0173] Referring now to FIG. 29D, a perspective view of a second design is shown in which multiple heat sinks are coupled in parallel to receive coolant. A tube 206 feeds the heat sink 201 through a nozzle 203 and branches out to a first tube 207 which feeds further components 212 through a nozzle 212, and a second tube 208 which feeds a vertical substrate 209 (vertical DIMM) through individual nozzles 203. Referring to FIG. 29E, a partial cross-sectional view of a modification of the design of FIG. 29D is shown in which the further components 212 receive coolant through a modified nozzle 210, and the vertical substrate 209 receives coolant through a modified nozzle 211. The design of the modified nozzle 210 and the modified nozzle 211 are similar to those of, for example, FIG. 8E and FIG. 8F.

[0174] Now referring to FIG. 30A, a perspective view of a design showing the transfer of coolant from a first type of heat sink to a second type of heat sink is shown. In particular, the coolant goes from a first heat sink 201 generally according to that shown in FIG. 3 (and typically for cooling a relatively hot component) to a second heat sink 230 generally according to FIG. 16 (and typically for cooling a device 235 that operates at a relatively low temperature). The first heat sink 201 is placed on a first substrate 221 at a first level, and the second heat sink 230 is placed on a second substrate 222 at a second level lower than the first level (so that the flow of the coolant is directed by gravity). A tube 225 is arranged to carry the coolant. The heat sink 230 is provided with an inlet 231 that allows the coolant to enter the internal volume of the second heat sink 230. Referring to Figure 30B, a cross-sectional view of the design of Figure 30A is shown, from which one can see the outlet 223 in the first heat sink 201 that provides access from the interior volume of the first heat sink 201 to the tube 225. The tube 225 could be replaced by a hose, channel, or other device suitable for carrying a cooling fluid.

[0175] In a further adaptation specifically related to the heat sink of FIG. 3 and its variations (but also applicable to other heat sinks disclosed herein), heat pipes or equivalents such as vapor conduits, vapor chambers or Peltier elements may be provided to facilitate heat transfer. Referring to FIG. 31A, a top perspective view of such a further adapted heat sink is shown. The heat sink is based on that shown in FIG. 3 and has a retaining wall 250 and protrusions 251. The heat sink also has a base 252, which is not visible in this view and can be seen by referring to FIG. 31B, which shows a bottom perspective view of the heat sink of FIG. 31A.

[0176] On or within the base 252 are heat pipes 253. These arrangements are similar to those found in existing air-cooled heat sinks. The heat pipes 252 may allow for better heat transfer across the heat sink and thus better spread the heat. This may allow for more efficient use of the surface area of ​​the heat sink or may allow for the use of a heat sink with a larger surface area than would otherwise be possible. This feature is also seen more clearly by reference to FIG. 31C, in which a side cross-sectional view of the heat sink of FIG. 31A is shown.

[0177] The arrangement of the heat pipes may be varied considerably. As an example, the bottom bevel of the first variant Referring now to Fig. 31D, a perspective view is shown of the retaining wall 250 and base 251, where the heat pipes 254 are "X" shaped. Referring now to Fig. 31E, a bottom perspective view of the second variation is shown, where the heat pipes 255 are formed as parallel lines.

[0178] For example, the panel nozzle arrangement shown with reference to Figures 23A-23E may be applied to other heat sink arrangements. An example is shown with reference to Figure 32A, in which a top perspective view of a heat sink with such a modified nozzle arrangement is shown. The heat sink 301 is generally in accordance with Figure 3, but may be replaced by any such modified or alternative heat sink disclosed herein. The tube 302 supplies coolant to the panel nozzle arrangement 303, which is configured to direct the coolant into the interior volume of the heat sink 301.

[0179] 32B, a top cross-sectional view of the heat sink of FIG. 32A is shown, revealing further details of the panel nozzle arrangement 303.

[0180] Coolant from the tubes 302 is directed along a number of channels 304. At the base of each channel 304, a nozzle hole 305 is formed, which routes the coolant from the nozzle arrangement 303 into the heat sink 301. Referring also to FIG. 32C, which shows a side cross-sectional view of the heat sink of FIG. 32A, the nozzle holes 305 are visible. One or more of the size, position and pitch of each nozzle hole 305 may be varied. Alternatively, or additionally, one or more of the number, position and diameter of the channels 304 may be varied. Also, variations in these parameters of the channels 304 and / or nozzle holes 305 across a single panel 303 are possible, including, for example, varying the size of the channels 304 by tapering. These may allow for control and / or balancing of the coolant supply, for example, allowing for uniform coolant distribution. It will be appreciated that a wide variety of methods of supplying coolant to the heat sink may be employed, including various types of nozzle designs.

[0181] So far, the introduction of coolant through the base of the heat sink has been discussed, for example, with reference to Figures 8A, 8B and 32F-32I. A further variation on such an embodiment will now be detailed with reference to Figure 33A, which shows a perspective view of a heat sink with coolant introduction through the base. The heat sink has a retaining wall 320 with a base 321 (which in this figure generally follows the design shown in Figure 3, but may be modified according to any of the alternatives shown or discussed herein). In the base, holes 322 are formed to supply coolant into the internal volume formed by the retaining wall 320 and the base 321. The coolant arrives via tubes 325. Protrusions (pins and / or fins) are not shown, but are merely for reasons of clarity, and thus such protrusions may be provided, for example, as disclosed in connection with other embodiments herein.

[0182] Referring to FIG. 33B, a cross-sectional side view of the heat sink of FIG. 33A is shown, with holes 323 visible. Coolant arriving from tubes 325 is fed into channels 322 formed between base 321 and lower base 326. The coolant then passes through holes 323 into the interior volume. One or more of the size, position and pitch of each hole 323 may be varied within a single heat sink and / or between multiple heat sinks. Alternatively, or additionally, the size and / or shape of channels 323 may be varied. Varying parameters of holes 322 and / or channels 323 across a single heat sink may allow for control and / or balancing of the coolant supply, for example, for uniform coolant distribution. This may include, for example, tapering channels 304. This may include resizing.

[0183] An advantage of the design shown with reference to Figures 33A and 33B is that the coolant is delivered to the base 321. In the case of a horizontal heat sink (e.g., as shown with reference to Figure 3), the base is typically the hottest part of the heat sink during operation. Such a system may be particularly beneficial, for example, when the depth of the heat sink internal volume is large and high cooling capacity may be possible.

[0184] The integration of the heat sink with the component can be an additional advantage. Referring to FIG. 34A, a perspective view of a first design of a heat-generating device integrated with a heat sink is shown, and referring to FIG. 34B, a cross-sectional side view of the heat sink of FIG. 34A is shown. The component and heat sink arrangement 310 is mounted on a substrate 300 (e.g., a circuit board). The heat sink and the component are in an integrated form 315, such that the retaining wall is integrally formed with the component housing. The component in this design is a processor, but this design can be suitable for any type of heat-generating component or device. Referring to FIG. 34C, a cross-sectional side view of the heat sink of FIG. 34A is shown, where this integration can be seen more clearly.

[0185] Referring now to Fig. 34D, a perspective view of a heat generating device with a separable heat sink is shown, and referring to Fig. 34E, a side cross-sectional view of the heat sink of Fig. 34D is shown. In this design, the heat sink and component assembly 320 have a separable form, such that the retaining wall 327 is attached (e.g., by adhesive or the like) to the component housing 325. The component in this design is a processor, but this design may be suitable for any type of heat generating component or device. Referring now to Fig. 34F, a side cross-sectional view of the heat sink of Fig. 34D is shown, where the separation between the retaining wall 327 and the component housing 325 can be more clearly seen.

[0186] Referring to Fig. 34G, a perspective view of a second design of a heat generating device integrated with a heat sink is shown. The integrated component and heat sink 330 is mounted on a substrate. Referring to Fig. 34H, a side cross-sectional view of the heat sink of Fig. 34G is shown. This design is in the form of a solid state drive (SSD) memory.

[0187] Referring to FIG. 34I, a perspective view of a multi-volume vertical heat sink design is shown. A vertical substrate 350 (which may be, for example, the side of a cooling module housing or a vertically mounted circuit board) has multiple heat sinks 351, 352, 353 mounted thereon. The first heat sink 351 is on top, and the second heat sink 352 is mounted below and slightly offset laterally from the first heat sink 351 such that coolant is directed overflowing from the first heat sink 351 to the second heat sink 352. Similarly, the third heat sink 353 is mounted below and slightly offset laterally from the second heat sink 352 such that coolant is directed overflowing from the second heat sink 352 to the third heat sink 353. This may be referred to as a cascade arrangement. Slots (not shown) may be provided in the substrate 350 to direct the overflow from each upper heat sink to the proper location of the respective lower heat sink.

[0188] A single heat sink can be used to cool multiple components or devices. To illustrate this, several examples will be discussed. In all these examples, the heat sink generally conforms to FIG. 3, although one skilled in the art will recognize that this may be replaced by any of the variations or alternatives of the heat sink disclosed herein. Wax.

[0189] Referring now to Fig. 35A, a perspective view of a first design of a heat sink arrangement for cooling multiple devices is shown. A heat sink 401 is mounted on a substrate 400. Referring to Fig. 35B, an exploded view of the design of Fig. 35A is shown. Under the single heat sink 401, a large component 402 (such as a processor) and multiple smaller components 403 are provided, all of which are cooled by the single heat sink 401. Such an arrangement is typical for (GPUs), for example.

[0190] The arrangement shown in Figures 35A and 35B may be expanded. Referring to Figure 35C, a perspective view of a second design of a heat sink apparatus for cooling multiple devices is shown. A heat sink 410 is mounted on a substrate 400. Referring to Figure 35D, an exploded view of the design of Figure 35C is shown. Under the single heat sink 410, multiple large components 412 (each of which may be a processor) and multiple smaller components 413 are provided, all of which are cooled by the single heat sink 410.

[0191] Figure 35E shows an exploded perspective view of a third design of a heat sink apparatus for cooling multiple devices. It is similar to the second design (shown in Figures 35C and 35D). Under a single heat sink 410, multiple large components 412 are provided, each of which is typically a processor. Such an arrangement is typical for exascale computers, where processors may be loaded in batches of four for increased performance.

[0192] All features disclosed herein may be combined in any combination, except where at least some of such features and / or steps are mutually exclusive. In particular, preferred features of each aspect of the disclosure are generally applicable to all aspects of the disclosure, and features of all aspects may be used in any combination. Similarly, features described in non-essential combinations may be used separately (not in combination).

[0193] Also provided are methods of manufacturing and / or operating any of the devices disclosed herein, which may include providing each of the disclosed features and / or configuring each individual feature to its described function.

Claims

1. 1. A heat sink for an electronic device that is immersed in a cooling liquid, comprising: a base configured to mount on top of a heat transfer surface of the electronic device and to transfer heat from the heat transfer surface; and a retaining wall extending from the base, the base and the retaining wall defining a volume for storing a portion of the cooling liquid such that heat transferred through the base is transferred to the cooling liquid stored within the volume.

2. The heat sink of claim 1 , wherein the base and the retaining wall are positioned such that a level of coolant stored within the volume is greater than a level of coolant outside the volume.

3. 10. A heat sink as claimed in any preceding claim, further comprising a protrusion extending from the base and / or the retaining wall within the volume.

4. The heat sink of claim 3 , wherein the projection extends approximately the same distance from the base as the retaining wall.

5. The heat sink of claim 3 or claim 4, wherein the protrusions comprise pins and / or fins.

6. The heat sink of claim 3 , wherein the protrusions extend perpendicular to the plane of the base.

7. The heat sink of claim 3 , wherein the protrusions are arranged to spread the cooling liquid radially away from a predetermined point on a surface of the base.

8. The heat sink of claim 3 , wherein the protrusions are arranged in a non-linear pattern.

9. 1. A cooling module for an electronic device, comprising: a container for receiving the electronic device such that the electronic device can be at least partially immersed in a cooling liquid; A heat sink according to any preceding claim mounted on said electronic device; A cooling module comprising:

10. further configured to flow the cooling liquid within the vessel; and A nozzle arrangement positioned to receive and direct a flowing cooling fluid into the volume of the heat sink. The cooling module of claim 9 further comprising:

11. The cooling module of claim 10 , wherein the nozzle arrangement is positioned to direct the flowing cooling liquid into a portion of the volume of the heat sink adjacent a hottest portion of a heat transfer surface of the electronic device.

12. The cooling module of claim 10 or 11, wherein the nozzle arrangement comprises one or more nozzles, each of the one or more nozzles configured to direct the flowing cooling liquid into a respective portion of the volume of the heat sink.

13. The nozzle arrangement includes a plurality of nozzles, each nozzle directing the flow of cooling fluid to a threshold The cooling module of claim 12 , configured to direct heat to a respective portion of the volume of the heat sink adjacent a portion of the heat transfer surface of the electronic device having a temperature above a level.

14. a pump configured to cause the cooling liquid to flow within the vessel; at least one tube arranged to transport a cooling liquid from said pump to said nozzle arrangement; Further equipped with The cooling module of claim 12 or 13, wherein each of the one or more nozzles is configured to couple to a respective end of the at least one tube by a push fit.

15. The cooling module of claim 10 , wherein the nozzle arrangement is arranged to direct the flowing cooling liquid perpendicular to the base of the heat sink.

16. A cooling module comprising: a container for housing an electronic device for cooling such that the electronic device can be at least partially immersed in a cooling liquid, the cooling module being configured to cause the cooling liquid to flow within the container; a heat sink having a base mounted on the electronic device; a nozzle arrangement positioned to receive and direct a flowing cooling fluid toward the base of the heat sink; A cooling module comprising:

17. The cooling module of claim 16 , wherein the nozzle arrangement is configured to direct the flowing cooling liquid into the base of the heat sink in a direction perpendicular to the base.

18. 18. The cooling module of claim 16 or 17, wherein the nozzle arrangement is arranged to direct the flowing cooling liquid towards a portion of the base adjacent a hottest portion of the electronic device.

19. 19. The cooling module of claim 16, wherein the nozzle arrangement comprises one or more nozzles, each of the one or more nozzles configured to direct the flowing cooling liquid towards a respective portion of the base.

20. 20. The cooling module of claim 19, wherein the nozzle arrangement comprises a plurality of nozzles, each nozzle configured to direct the flowing cooling liquid toward a respective portion of the base adjacent a portion of the electronic device having a temperature above a threshold level.

21. at least one pipe arranged to transport coolant from said pump to said nozzle arrangement; Further equipped with 21. The cooling module of claim 19 or claim 20, wherein each of the one or more nozzles is configured to couple to a respective end of the at least one tube by a push fit.

22. 22. The cooling module of claim 16, wherein the base of the heat sink is configured to be mounted on top of and to transfer heat from a heat transfer surface of the electronic device.

23. 23. The cooling module of any one of claims 16 to 22, wherein the heat sink is a heat sink as defined in any one of claims 1 to 8.

24. A pump configured to move the cooling liquid through the container 24. The cooling module of claim 16, further comprising:

25. The cooling liquid is a primary cooling liquid, and the cooling module comprises: a heat exchanger configured to receive a secondary cooling fluid and transfer heat from the primary cooling fluid to the secondary cooling fluid; 25. The cooling module of claim 16, further comprising:

26. A pump configured to move the cooling liquid through the container Further equipped with The cooling module of claim 25 , wherein the pump is configured to flow the cooling fluid into and out of the heat exchanger.

27. 27. The cooling module of claim 25 or claim 26, wherein the nozzle arrangement is positioned to receive the primary cooling liquid from the heat exchanger.

28. A heat sink for an electronic device positioned within a cooling module and immersed in a cooling liquid, the heat sink having a wall arrangement defining an internal volume within which the electronic device is mounted and within which the cooling liquid accumulates around the electronic device during operation, whereby heat is transferred from the electronic device to the cooling liquid that accumulates within the internal volume.

29. The wall device comprises: a base configured to mount the heat sink within the cooling module; a retaining wall extending from the base; 30. The heat sink of claim 28, wherein said base and said retaining wall define said interior volume for storing said cooling liquid.

30. 30. The heat sink of claim 29, wherein a surface of the base defining the interior volume is planar.

31. 31. A heat sink as claimed in any one of claims 28 to 30, wherein the wall device is arranged such that a level of coolant stored within the internal volume is higher than a level of coolant outside the internal volume.

32. 32. The heat sink of any one of claims 28 to 31, wherein the wall device further defines a flow opening for allowing or facilitating the flow of the cooling liquid out of the interior volume.

33. 33. The heat sink of any one of claims 28 to 32, further comprising the electronic device mounted within the interior volume.

34. 1. A cooling module for an electronic device, comprising: a container for containing the electronic device such that the electronic device can be at least partially immersed in a cooling liquid; The heat sink according to any one of claims 28 to 33, mounted within the container. Q and A cooling module comprising:

35. further configured to flow the cooling liquid within the vessel; and 35. The cooling module of claim 34, further comprising at least one tube positioned to receive a flow of cooling liquid and having an outlet, the flow of cooling liquid being directed from the at least one tube into an interior volume of the heat sink.

36. 36. The cooling module of claim 35 when dependent on claim 32, wherein the shape of the internal volume is elongated thereby defining first and second end portions at opposite ends of the elongated internal volume, and the tube outlets and spouts are positioned at the first and second end portions, respectively.

37. 37. A cooling module according to claim 35 or claim 36, wherein the outlet is positioned at an upper half height of the internal volume.

38. 37. A cooling module according to claim 35 or claim 36, wherein the outlet is positioned at half height below the internal volume.

39. 39. The cooling module of any one of claims 35 to 38, wherein the outlets of the tubes comprise one or more nozzles, each nozzle configured to direct the flowing cooling liquid into a respective portion of the interior volume.

40. 40. The cooling module of claim 39, wherein the one or more nozzles are each configured to couple to a respective end of the at least one tube by a push fit.

41. 41. The cooling module of any one of claims 34 to 40, wherein the electronic device is a power supply unit.

42. The cooling liquid is a primary cooling liquid, and the cooling module comprises: a heat exchanger configured to receive a secondary cooling fluid and transfer heat from the primary cooling fluid to the secondary cooling fluid; 42. The cooling module of any one of claims 34 to 41, further comprising:

43. 1. A heat sink apparatus for an electronic device to be mounted on a surface within a container in a generally perpendicular orientation with respect to a floor of the container, comprising: a retaining wall configured to at least partially define an interior volume; a nozzle arrangement positioned to receive a cooling fluid and direct said cooling fluid into the interior volume of the heat sink; Equipped with A heat sink arrangement, wherein the retaining wall cooperates with a surface on which the electronic device is to be mounted and / or a surface mounted on the electronic device such that cooling liquid directed into the interior volume accumulates within the interior volume.

44. 44. A heat sink arrangement as claimed in claim 43, wherein the retaining wall cooperates with a surface on which the electronic device is to be mounted and / or a surface on which the electronic device is mounted such that the internal volume has at least one opening allowing the exit of cooling liquid accumulated within the internal volume.

45. The surface on which the electronic device is mounted is attached to the retaining wall and / or The heat sink arrangement of claim 43 or claim 44, wherein said heat sink arrangement is integrated with said electronic device.

46. 46. ​​A heat sink arrangement according to any one of claims 43 to 45, further comprising a protrusion extending into the interior volume from the retaining wall and / or the surface mounted on the electronic device.

47. 47. The heat sink arrangement of claim 46, wherein the protrusions comprise pins and / or fins.

48. 48. A heat sink arrangement according to claim 46 or claim 47, wherein the protrusions extend perpendicular to the plane of the electronic device.

49. 49. The heat sink apparatus of any one of claims 46 to 48, wherein the protrusions comprise one or more baffles configured to direct a flow of the cooling liquid within the interior volume.

50. The one or more baffles may direct the cooling fluid to into a first portion of the interior volume adjacent the bed of the vessel, and subsequently into a second portion of the interior volume distal to the bed of the vessel; or 50. The heat sink apparatus of claim 49, configured to direct the heat along a spiral shaped flow path.

51. 51. A heat sink apparatus as claimed in claim 49 or claim 50, wherein the one or more baffles are configured to direct the cooling liquid from a more central portion of the internal volume to a more outer portion of the internal volume before exiting the internal volume.

52. 52. A heat sink arrangement as claimed in any one of claims 49 to 51, wherein the one or more baffles are configured such that cooling fluid received from the nozzle arrangement into the interior volume of the heat sink flows via two separate flow paths.

53. 53. The heat sink apparatus of claim 52, wherein the one or more baffles are configured such that the two separate flow paths are generally symmetrical.

54. 54. The heat sink apparatus of any one of claims 43 to 53, further comprising a thermal interface material disposed between the electronic device and a surface mounted on the electronic device.

55. 55. The heat sink apparatus of any one of claims 43 to 54, wherein the nozzle arrangement comprises at least one nozzle positioned on a side of the interior volume distal from the floor of the vessel.

56. 56. A heat sink apparatus as claimed in any one of claims 43 to 55, wherein the nozzle apparatus comprises a piping system forming at least one channel through which coolant flows, the at least one channel having one or more holes each functioning as a nozzle for directing coolant from the channel into the interior volume of the heat sink.

57. 57. The heat sink apparatus of claim 56, wherein the at least one channel is oriented vertically relative to the floor of the container.

58. The piping system includes a first and a second panel, 58. The heat sink of claim 56 or claim 57, wherein one or both of the first and second panels are molded to form the at least one channel, and the first and second panels are attached to one another to allow cooling fluid to flow through the at least one channel.

59. The retaining wall is a sidewall extending generally parallel to the floor of the container; a cover portion oriented generally perpendicular to the floor of the container and disposed to fit snugly against the sidewall portion to define the interior volume; 59. A heat sink arrangement according to any one of claims 43 to 58, comprising:

60. 60. The heat sink apparatus of claim 59, wherein the sidewall portion and the cover portion are separable.

61. 1. A cooling module for an electronic device, comprising: a container having an interior surface defining the floor and defining a volume for receiving an electronic component in a substantially perpendicular orientation relative to the floor; A heat sink arrangement according to any one of claims 43 to 60 mounted within the volume of the container; A cooling module comprising:

62. 62. The cooling module of claim 61 further comprising the electronic device mounted within the volume of the enclosure.

63. 63. The cooling module of claim 62, further comprising a printed circuit board oriented generally perpendicular to a floor of the enclosure on which the electronic device is mounted.

64. 64. The cooling module of claim 63, wherein the printed circuit board is a daughter board coupled to a motherboard oriented generally parallel to the floor of the enclosure.

65. 65. The cooling module of any one of claims 61 to 64, wherein the nozzle arrangement is arranged to receive and direct a flowing cooling liquid into the interior volume of the heat sink arrangement.

66. 66. The cooling module of claim 65, wherein the nozzle arrangement is positioned to direct the flowing cooling liquid into a portion of the interior volume of the heat sink arrangement adjacent a hottest portion of the electronic device.

67. 67. The cooling module of claim 66, wherein the nozzle arrangement comprises a plurality of nozzles, each nozzle configured to direct the flowing cooling liquid into a respective portion of the interior volume of the heat sink arrangement adjacent a portion of the electronic device having a temperature above a threshold level.

68. a pump configured to cause the cooling liquid to flow within the vessel; at least one pipe arranged to transport coolant from said pump to said nozzle arrangement; 68. The cooling module of claim 66 or claim 67, further comprising:

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