Tablet supply device, resin sealing device, and tablet supply method

Abstract

To provide a technology related to a tablet supply device in which dust is less likely to be diffused into a resin sealing device.SOLUTION: A tablet supply device 10 comprises a hopper 16 that supplies resin tablets for transfer molding. The hopper 16 comprises a funnel part 61 that can retain the resin tablets and a bottom part 62 that catches resin tablets that is fallen from the funnel part 61. The bottom part 62 is provided with a first sieve 11 that does not allow passage of the resin tablets but allows passage of dust that is smaller than the resin tablets.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a tablet supplying device, a resin sealing device, and a tablet supplying method using the same. [Background technology]

[0002] The resin sealing device includes a metal mold for sealing a workpiece with resin in which a resin tablet is melted, a loader for carrying the workpiece and the resin tablet into each metal mold, a tablet supplying device for supplying the resin tablet to the loader, etc. For example, Patent Document 1 discloses a resin tablet supplying unit for supplying the resin tablets. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-300978 A Summary of the Invention [Problem to be solved by the invention]

[0004] When resin tablets are manufactured by solidifying powdered resin material into tablets, the unsolidified resin material may become resin scraps and adhere to the resin tablets. When transporting the resin tablets, the resin in the resin tablets may fall off or chip due to impact, generating resin scraps. Therefore, the resin tablets fed into the tablet supplying device include resin tablets with dust such as resin scraps attached. When such resin tablets move in the resin sealing device, the dust may fall off. If the dust spreads in the resin sealing device and adheres to sensors, workpieces, dies, etc., it may cause problems in the resin sealing.

[0005] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide a technique relating to a tablet supplying device that prevents dust from diffusing inside a resin sealing device. [Means for solving the problem]

[0006] The tablet supplying device according to one aspect of the present invention includes a hopper for supplying resin tablets to be used in transfer molding. The hopper includes a funnel portion capable of storing the resin tablets and a bottom portion for receiving the resin tablets that have fallen from the funnel portion. The bottom portion is provided with a sieve that does not allow the resin tablets to pass through but allows dust particles smaller than the resin tablets to pass through.

[0007] A tablet supply method according to one embodiment of the present invention includes vibrating a funnel in which resin tablets are stored to cause the resin tablets to fall to the bottom, and using a sieve provided at the bottom to separate the resin tablets from dust that has fallen from the funnel along with the resin tablets.

[0008] A tablet supplying device according to another aspect of the present invention includes a hopper for supplying resin tablets to be used in transfer molding, and an alignment device for aligning the resin tablets supplied from the hopper. The alignment device includes a conveying path along which the resin tablets are conveyed. A sieve is provided in at least a portion of the conveying path, which does not allow the resin tablets to pass through and allows dust particles smaller than the resin tablets to pass through.

[0009] A tablet supplying method according to another aspect of the present invention includes transporting resin tablets supplied from a hopper along a conveying path, aligning the resin tablets using a guide provided on the conveying path, and sieving the resin tablets away from dust being transported along with the resin tablets using a sieve provided on the conveying path. Effect of the Invention

[0010] According to the present invention, it is possible to provide a technology relating to a tablet supplying device that prevents dust from diffusing inside a resin sealing device. [Brief description of the drawings]

[0011] [Figure 1] 1 is a rear view showing an example of a resin sealing apparatus including a tablet supplying device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a rear view showing an example of a tablet supplying device according to an embodiment of the present invention. [Diagram 3] 3 is a perspective view of the tablet supplying device shown in FIG. 2 as seen obliquely from above. [Figure 4] 3 is a side view of the tablet supplying device shown in FIG. 2 as viewed from the out-module side. [Diagram 5] 4 is a plan view showing the tablet supplying device shown in FIG. 3 with the cover removed. [Figure 6] FIG. 6 is a perspective view of the tablet supplying device shown in FIG. 5 with the funnel portion removed. [Figure 7] 6 is a plan view showing the tablet supplying device with the hopper shown in FIG. 5 removed. [Figure 8] 4 is a flowchart showing an example of a tablet supplying method using the tablet supplying device of the embodiment of the present invention. [Figure 9] 10 is a flowchart showing another example of a tablet supplying method using the tablet supplying device of the embodiment of the present invention.

[0012] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are attached to the same or similar configurations. In each drawing, an orthogonal coordinate system consisting of an X-axis, a Y-axis, and a Z-axis is conveniently attached to clarify the relationship between the drawings and to help understand the positional relationship of each member. The plane including the X-axis and the Y-axis is referred to as the "XY plane", and the direction of the Z-axis arrow is upward and the opposite direction to the Z-axis arrow is downward. When viewed from the front side of the resin sealing device 1, the X-axis direction is, for example, the left-right direction, and the Y-axis direction is, for example, the front-rear direction. Hereinafter, the present invention will be described in detail with reference to the drawings.

[0013] Fig. 1 is a rear view showing an example of a resin sealing apparatus 1 equipped with a tablet supplying device 10 according to one embodiment of the present invention. The resin sealing apparatus 1 according to this embodiment is a resin sealing apparatus for sealing a work with resin, and includes at least a tablet supplying device (tablet loader) 10, as shown in Fig. 1. The resin sealing apparatus 1 may further include a work supplying device 20, a press module 3, a loader 51, an unloader 52, a degager 41, a work storage device 42, etc., as optional configurations.

[0014] The tablet supplying device 10 supplies a resin tablet to the loader 51. The resin constituting the resin tablet is, for example, a thermosetting resin such as an epoxy resin. The resin tablet is a resin material shaped to a predetermined size and shape, and in this embodiment, the resin tablet is shaped into a cylindrical shape of a predetermined height and diameter by tableting (compressing a powdered resin material).

[0015] The work supply device 20 takes out the work before being resin-sealed from the supply magazine 21 and supplies it to the loader 51. The loader 51 transports the work and the resin tablet supplied from the work supply device 20 and the tablet supply device 10 to the die (resin sealing die) 30 of the press module 3.

[0016] The press module 3 clamps and pressurizes the supplied workpiece to seal it with resin (molding). The die 30 is a die for transfer molding, and when a heated resin tablet is supplied to a pot in the die 30 and pressurized by a plunger and further heated and pressurized by a cull, the resin molded into the tablet shape softens and melts, and moves from the cull into a cavity that communicates with the cull via a runner. The workpiece is placed in the cavity by a loader 51. If the resin continues to be heated further in the cavity, the resin hardens over time and seals the workpiece.

[0017] The unloader 52 removes the resin-sealed workpiece from the mold 30 and transports it to the degator 41. The degator 41 separates unnecessary resin from the resin-sealed workpiece. The workpiece storage device 42 receives the workpiece from which the unnecessary resin has been separated from the degator 41 and stores it in a storage magazine 43. In the following description, the part combining the tablet supply device 10 and the workpiece supply device 20 may be referred to as the in-module 2, and the part combining the degator 41 and the workpiece storage device 42 may be referred to as the out-module 4.

[0018] In the illustrated example, the in-module 2, multiple press modules 3, and the out-module 4 are aligned along the X-axis direction. The multiple press modules 3 are aligned in a row from the in-module 2 to the out-module 4. In the illustrated example, the resin sealing apparatus 1 includes four press modules 3. The number of press modules 3 is not limited to the illustrated example and may be changed as appropriate.

[0019] The out-module 4 is disposed on the opposite side to the in-module 2 as viewed from any press module 3. The in-module 2 and the out-module 4 may be disposed on the same side as viewed from any press module 3. The loader 51 and the unloader 52 are configured to be movable along a guide rail 50 extending in the X-axis direction.

[0020] 1, the in-module 2 is divided into upper and lower parts by a horizontally extending frame 91. Similarly, each of the press modules 3 and the out-modules 4 is divided into upper and lower parts by horizontally extending frames 92 and 93. In the illustrated example, the resin sealing apparatus 1 is divided into upper and lower parts by frames 91, 92, and 93 of the same height.

[0021] The above-mentioned tablet supply device 10 is disposed in the lower space. The tablet supply device 10 includes a hopper 16 for supplying resin tablets, an alignment device 17 for aligning the resin tablets supplied from the hopper 16 in a predetermined direction, and a lifting device 18 for receiving the resin tablets from the alignment device 17 and delivering them to a loader 51 waiting in the upper space of the in-module 2. In this embodiment, the alignment device 17 aligns the cylindrical resin tablets in a row so that their central axes face the same direction.

[0022] Fig. 2 is a rear view showing an example of the tablet supplying device 10 according to an embodiment of the present invention. As shown in Fig. 2, the above-mentioned hopper 16 includes a funnel portion 61 capable of storing resin tablets, a bottom portion (receiving portion) 62 for receiving the resin tablets dropped from the funnel portion 61, a first vibration device 63 for vibrating the funnel portion 61 to cause the resin tablets in the funnel portion 61 to drop to the bottom portion 62, and the like.

[0023] Fig. 3 is a perspective view of the tablet supply device 10 shown in Fig. 2, seen from diagonally above. The alignment device 17 described above includes a conveying path 71 provided with a guide 72 for regulating the orientation of the resin tablets, a second vibration device 73 for vibrating the conveying path 71 to convey the resin tablets in the conveying path 71, and the like.

[0024] The resin tablets supplied from the hopper 16 are transported along the transport path 71. The transport path 71 includes a first straight portion 71A, a corner portion 71B, and a second straight portion 71C. The first straight portion 71A extends substantially parallel to the X-axis and has a band-shaped surface that is slightly inclined upward as it proceeds from the outer module 4 to the inner module 2. The second straight portion 71C extends parallel to the X-axis direction and has a band-shaped surface parallel to the XY plane.

[0025] The corner portion 71B has a 90° sector surface parallel to the XY plane, and connects an end of the first straight portion 71A to an end of the second straight portion 71C. The conveying path 71 conveys the resin tablet toward the guide 72 provided on the second straight portion 71C, so that the resin tablet is rotated counterclockwise within the conveying path 71 in the order of the first straight portion 71A, the corner portion 71B, and the second straight portion 71C.

[0026] Fig. 4 is a side view of the tablet supplying device 10 shown in Fig. 2 as viewed from the outer module 4 side. As shown in Fig. 4, the second vibration device 73 includes a first vibration section 73A and a second vibration section 73C. The first vibration section 73A and the second vibration section 73C transport the resin tablets in mutually opposite directions so that the resin tablets rotate.

[0027] In detail, the first vibrating section 73A vibrates the first straight section 71A to transport the resin tablet in the direction from the out-module 4 to the in-module 2 (leftward when viewed from the front side of the resin sealing apparatus 1). The second vibrating section 73C vibrates the second straight section 71C to transport the resin tablet in the direction from the in-module 2 to the out-module 4 (rightward when viewed from the front side of the resin sealing apparatus 1).

[0028] 4, the conveying path 71 includes an area V that does not overlap a connection portion 74 between the conveying path 71 and the second vibration device 73 in a plan view, and an area W that overlaps the connection portion 74 in a plan view. Second sieves 12A and 12B, which will be described later, are provided in the area V that does not overlap the connection portion 74 in a plan view.

[0029] Next, the sieve according to the present invention will be further described with reference to Fig. 5 to Fig. 7. One of the features of the tablet supplying device 10 according to each embodiment of the present invention is that it is provided with a sieve with holes that does not allow resin tablets to pass, but allows dust particles smaller than the resin tablets to pass, and does not affect the transport of the resin tablets. Various types of sieves can be used for the present invention as long as they can sift out dust.

[0030] For example, it may be a punched metal (punched wire mesh) in which holes are drilled in a metal plate. It may be an industrial screen in which wavy metal wires are arranged flat, shifted by 1 / 2 wavelength so that the gaps between adjacent metal wires open in a roughly diamond shape, and the crests of the waves are bonded together with resin or the like. It may be a wire mesh (welded wire mesh) in which metal wires are arranged vertically and the intersections are welded. It may be a woven wire mesh in which metal wires are woven. It may be other types of sieves. The sieve according to the present invention is preferably one with small irregularities and a shape that is unlikely to damage the resin tablet by contact with the sieve. The sieve according to the present invention is not limited to a metal material and may be formed from a resin material.

[0031] Fig. 5 is a plan view showing the tablet supplying device 10 with the cover 61L of the funnel portion 61 shown in Fig. 3 removed. Fig. 6 is a perspective view showing the tablet supplying device 10 with the funnel portion 61 shown in Fig. 5 removed. As shown in Figs. 5 and 6, a first sieve 11 is provided at the bottom 62 of the hopper 16, which does not allow the resin tablet to pass but allows dust particles smaller than the resin tablet to pass in a plan view. An example of a resin tablet is shown by the symbol T in Fig. 5. The first sieve 11 is an example of a sieve according to the present invention.

[0032] The bottom 62 may be provided with a removable first tray 13 (shown in FIG. 3) for receiving the dust that has passed through the first sieve 11. By removing the first tray 13, the dust can be collected all at once. The first tray 13 is not an essential component. Instead of the first tray 13, or together with the first tray 13, a suction port 15A connected to a dust collector capable of sucking dust by a tubular member such as a duct or a hose may be provided below (preferably directly below) the first sieve 11. When the dust received by the first tray 13 is sucked by the suction port 15A, the first tray 13 may be structured so as not to be removable from the tablet supplying device 10. The suction port 15A is an example of a suction mechanism for sucking the dust that has passed through the first sieve 11.

[0033] Fig. 7 is a plan view showing the tablet supplying device 10 with the hopper 16 shown in Fig. 5 removed. As shown in Fig. 7, second sieves 12A, 12B are provided in at least a part of the area of ​​the conveying path 71. The second sieves 12A, 12B do not allow resin tablets to pass through, but allow dust particles smaller than the resin tablets to pass through in a plan view. The second sieves 12A, 12B are an example of a sieve according to the present invention.

[0034] The conveying path 71 may be provided with a removable second tray for receiving the dust that has passed through the second sieves 12A and 12B. In the illustrated example, the conveying path 71 is provided with a second tray 14B for receiving the dust that has passed through the second sieve 12B. The second tray 14B is not an essential component. Instead of the second tray 14B, or together with the second tray 14B, a suction port 15B (shown in FIG. 6) of a dust collector may be provided below (preferably directly below) the second sieve 12. The suction port 15B is connected to a dust collector capable of sucking dust by a tubular member such as a duct or a hose, similar to the suction port 15A. When the dust received by the second tray 14 is sucked by the suction port 15B, the second tray 14 may be structured not to be removable from the tablet supplying device 10. The suction port 15B is an example of a suction mechanism for sucking the dust that has passed through the second sieve 12.

[0035] 7, the second straight portion 71C is further provided with a groove 72R extending toward the guide 72 and a flap 72F for guiding the resin tablet toward the groove 72R, in addition to the above-mentioned guide 72. The cross section of the groove 72R is formed into a concave cylindrical surface that follows the cylindrical surface of the resin tablet.

[0036] 8 is a flow chart showing an example of a tablet supplying method using the tablet supplying device 10 of one embodiment of the present invention. In the illustrated example, the tablet supplying method includes an optional step S13. In the tablet supplying method, in step S11, the funnel portion 61 in which the resin tablets are stored is vibrated to drop the resin tablets to the bottom portion 62.

[0037] In step S12, the resin tablets are separated from the dust that has fallen together with the resin tablets from the funnel portion 61 by the first sieve 11 provided on the bottom portion 62. The resin tablets and the dust can be efficiently separated by the vibrations propagated from the funnel portion to the bottom portion. In optional step S13, the dust that has passed through the first sieve 11 is received by the first tray.

[0038] The tablet supplying method shown in Fig. 8 can sift off dust adhering to the resin tablets in the hopper 16 by repeating a series of steps S11 to S12. The sifted off dust may be collected by an optional step S13. The tablet supplying method shown in Fig. 8 may omit step S13. Instead of step S13, a step of sucking up the dust by a suction port connected to a dust collector may be included.

[0039] 9 is a flow chart showing another example of a tablet supplying method using the tablet supplying device 10 of one embodiment of the present invention. In the illustrated example, the tablet supplying method includes an optional step S24. In the tablet supplying method, in step S21, a resin tablet supplied from the hopper 16 is transported and circulated within the transport path 71 along the transport path 71.

[0040] As described above, the conveying path 71 is provided with the guide 72. In step S22, the resin tablets are aligned by the guide 72 that regulates the orientation of the resin tablets. In this embodiment, the guide (gate) 72 selectively allows the resin tablets to pass through. The guide 72 has an opening slightly larger than the diameter of the resin tablet when viewed from the conveying direction of the resin tablet.

[0041] If the central axis of the cylindrical resin tablet is parallel to the X-axis direction, the resin tablet can pass through the guide 72. If the central axis of the resin tablet is not parallel to the X-axis direction, the resin tablet cannot pass through the guide 72. A resin tablet that is oriented in such a way that it cannot pass through the guide 72 abuts against the guide 72 and falls from the second straight section 71C to the first straight section 71A. The method by which the guide 72 regulates the orientation of the resin tablet is not particularly limited. It may be another method other than a method of selectively passing the resin tablet.

[0042] In step S23, the resin tablets are separated from the dust transported together with the resin tablets by the second sieves 12A and 12B provided on the transport path 71. In optional step S24, the dust that has passed through the second sieves 12A and 12B is received by the second tray 14B or the like.

[0043] In the tablet supply method shown in Fig. 9, by repeating a series of steps S21 to S23, dust adhering to the resin tablets can be sifted off in the alignment device 17. The sifted off dust may be collected in an optional step S24. As in the tablet supply method shown in Fig. 8, step S24 may be omitted, or instead of step S24, a step of sucking the dust by a suction port connected to a dust collector may be included.

[0044] According to the tablet supply device 10 of the present embodiment configured as described above, the resin sealing apparatus 1 including the device, and the tablet supply method using them, the resin tablets supplied from the hopper 16 can be sieved away from dust by the first sieve 11. In addition, the resin tablets aligned in the alignment device 17 can be sieved away from dust by the second sieves 12A, 12B. Since the dust adhering to the resin tablets is unlikely to diffuse within the resin sealing apparatus 1, it is possible to prevent dust from adhering to the sensor and causing malfunction, or dust from getting into the workpiece or mold and causing defective products.

[0045] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those shown as examples and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other.

[0046] [Appendix 1] The tablet supplying device 10 is equipped with a hopper 16 that supplies resin tablets to be used in transfer molding. The hopper 16 is equipped with a funnel portion 61 capable of storing resin tablets, and a bottom portion 62 that receives the resin tablets that have dropped from the funnel portion 61. The bottom portion 62 is provided with a first sieve 11 that does not allow the resin tablets to pass through but allows dust particles smaller than the resin tablets to pass through.

[0047] According to the above-mentioned supplementary note 1, the resin tablets supplied from the hopper 16 can be sieved away from dust by the first sieve 11, thereby making it possible to provide a tablet supplying device 10 in which dust adhering to the resin tablets is less likely to diffuse within the resin sealing device 1.

[0048] [Appendix 2] In the above Supplementary Note 1, the bottom 62 may be provided with a first tray 13 that receives dust that has passed through the first sieve 11.

[0049] According to the above supplementary note 2, since the dust is collected in the first tray 13, the sifted dust can be easily collected when cleaning the hopper 16. The bottom 62 is less likely to become dirty, and the hopper 16 can be easily cleaned.

[0050] [Appendix 3] In the above-mentioned supplementary note 1 or 2, the bottom portion 62 may be provided with a suction port 15A for sucking in the dust that has passed through the first sieve 11.

[0051] According to the above-mentioned supplementary note 3, since the dust is collected through the suction port 15A, it is easy to collect the sifted dust when cleaning the hopper 16. The bottom 62 is less likely to get dirty, and the hopper 16 is easy to clean.

[0052] [Appendix 4] In any one of the above-mentioned supplementary notes 1 to 3, the hopper 16 may further include a first vibration device 63 that vibrates the funnel portion 61 to cause the resin tablet in the funnel portion 61 to fall to the bottom portion 62.

[0053] According to the above-mentioned supplementary note 4, since the funnel portion 61 is vibrated, the resin tablets are less likely to clog the foot of the funnel portion 61. The resin tablets can be reliably dropped from the funnel portion 61 to the bottom portion 62. The vibration propagated from the funnel portion to the bottom portion can efficiently sift out the resin tablets and dust.

[0054] [Appendix 5] In any one of the above appendices 1 to 4, the apparatus may further include an alignment device 17 for aligning the resin tablets supplied from the hopper 16, the alignment device 17 including a conveying path 71 for conveying the resin tablets toward a guide 72 for regulating the orientation of the resin tablets, and second sieves 12A, 12B may be provided in at least a portion of the conveying path 71 which do not allow the resin tablets to pass but allow dust particles smaller than the resin tablets to pass.

[0055] According to the above supplementary note 5, dust attached to the resin tablets can be collected not only by the hopper 16 but also by the aligning device 17. The dust can be prevented from diffusing inside the resin sealing apparatus 1 more reliably.

[0056] [Appendix 6] In the above-mentioned supplementary note 5, the conveying path 71 may be provided with a second tray 14B for receiving the dust that has passed through the second sieve 12B.

[0057] According to the above supplementary note 6, since the dust is collected in the second tray 14B, the sifted dust can be easily collected when cleaning the aligning device 17. The second vibration device 73 and the like are less likely to become dirty, and the aligning device 17 can be easily cleaned.

[0058] [Appendix 7] In the above-mentioned supplementary note 5 or 6, the conveying path 71 may be provided with a suction port 15B for sucking in the dust that has passed through the second sieve 12B.

[0059] According to the above supplementary note 7, since the dust is collected through the suction port 15B, the sifted dust can be easily collected when cleaning the alignment device 17. The second vibration device 73 and the like are less likely to become dirty, and the alignment device 17 can be easily cleaned.

[0060] [Appendix 8] In any one of the above appendices 5 to 7, the alignment device 17 further includes a second vibration device 73 that transports the resin tablets in the conveying path 71 by vibrating the conveying path 71, and the second sieves 12A, 12B may be provided in an area V that does not overlap with the connection portion 74 between the conveying path 71 and the second vibration device 73 in a planar view.

[0061] According to the above-mentioned supplementary note 8, since the connection portion 74 does not occupy the space directly below the non-overlapping area V, the second tray 14B, the suction port of the dust collecting device, etc. can be placed in the empty space to collect dust.

[0062] [Appendix 9] The tablet supply device 10 includes a hopper 16 that supplies resin tablets to be used in transfer molding, and an alignment device 17 that aligns the resin tablets supplied from the hopper 16. The alignment device 17 includes a conveying path that conveys the resin tablets toward a guide that regulates the orientation of the resin tablets. A second sieve that does not allow the resin tablets to pass and allows dust particles smaller than the resin tablets to pass is provided in at least a portion of the conveying path.

[0063] According to the above-mentioned supplementary note 9, the resin tablets aligned in the alignment device 17 can be sieved away from dust by the second sieves 12A, 12B, so that a tablet supplying device 10 can be provided in which dust adhering to the resin tablets is less likely to diffuse within the resin sealing device 1.

[0064] [Appendix 10] The molding machine may further include a mold 30 having a tablet supplying device 10 described in any one of Appendices 1 to 9 above, which melts the resin tablet to resin seal the electronic component, and a loader 51 which transports the resin tablet supplied from the tablet supplying device 10 into the mold 30.

[0065] According to the above supplementary note 10, it is possible to provide a resin sealing apparatus 1 in which dust is less likely to diffuse inside the resin sealing apparatus 1. It is possible to prevent dust from adhering to a sensor and causing a malfunction, or dust from getting into a workpiece or a mold and causing a defective product.

[0066] [Appendix 11] The tablet supply method includes vibrating a funnel portion 61 in which resin tablets are stored to cause the resin tablets to fall to a bottom portion 62, and using a first sieve 11 provided at the bottom portion 62 to separate the resin tablets from dust that has fallen from the funnel portion 61 along with the resin tablets.

[0067] According to the above-mentioned supplementary note 11, the resin tablets supplied from the hopper 16 can be sieved away from dust by the first sieve 11, thereby providing a tablet supply method in which dust adhering to the resin tablets is less likely to diffuse within the resin sealing apparatus 1.

[0068] [Appendix 12] The tablet supply method includes transporting resin tablets supplied from a hopper 16 along a conveying path 71, aligning the resin tablets by a guide 72 provided on the conveying path 71, and sieving the resin tablets away from dust being transported along with the resin tablets by second sieves 12A, 12B provided on the conveying path 71.

[0069] According to the above-mentioned supplementary note 12, the resin tablets aligned in the alignment device 17 can be sieved away from dust by the second sieves 12A, 12B, thereby providing a tablet supply method in which dust adhering to the resin tablets is less likely to diffuse within the resin sealing device 1. [Explanation of symbols]

[0070] 1...resin sealing device, 2...in module, 3...press module, 4...out module, 10...tablet supply device, 11...first sieve (one example of a sieve), 12A, 12B...second sieve (another example of a sieve), 13...first tray (one example of a tray), 14B...second tray (another example of a tray), 15A, 15B...suction port (one example of a suction mechanism), 16...hopper, 17...alignment device, 18...lifting device, 20...work supply device, 21...supply magazine, 30...mold, 41...degater, 4 2...work storage device, 43...storage magazine, 50...guide rail, 51...loader, 52...unloader, 61...funnel portion, 61L...lid body, 62...bottom, 63...first vibration device, 71...conveying path, 71A...first straight portion, 71B...corner portion, 71C...second straight portion, 72...guide, 72F...flap, 72R...concave strip, 73...second vibration device, 73A...first vibration portion, 73C...second vibration portion, 74...connection portion, 91, 92, 93...frame, T...resin tablet, V...non-overlapping area, W...overlapping area.

Claims

1. Equipped with a hopper for supplying resin tablets used in transfer molding, The hopper is A funnel portion capable of storing a resin tablet; A bottom portion for receiving the resin tablet dropped from the funnel portion, The bottom is provided with a sieve that does not allow the resin tablet to pass through and allows dust smaller than the resin tablet to pass through. Tablet supply device.

2. The bottom portion is provided with a tray for receiving dust that has passed through the sieve.

2. The tablet dispensing device of claim 1.

3. The bottom portion is provided with a suction mechanism for sucking up dust that has passed through the sieve.

2. The tablet dispensing device of claim 1.

4. The hopper further includes a vibration device that vibrates the funnel portion to cause the resin tablet in the funnel portion to fall to the bottom.

2. The tablet dispensing device of claim 1.

5. The resin tablet supplying device further includes an alignment device for aligning the resin tablets supplied from the hopper. The alignment device includes: A conveying path is provided for conveying the resin tablet toward a guide that regulates the orientation of the resin tablet, A second sieve that does not allow the resin tablet to pass and allows dust smaller than the resin tablet to pass is provided in at least a part of the conveying path.

2. The tablet dispensing device of claim 1.

6. The conveying path includes a second tray for receiving dust that has passed through the second sieve.

6. The tablet dispensing apparatus of claim 5.

7. The conveying path is provided with a suction mechanism for sucking up the dust that has passed through the second sieve.

6. The tablet dispensing apparatus of claim 5.

8. The alignment device further includes a second vibration device that vibrates the conveying path to convey the resin tablets in the conveying path, The second sieve is provided in an area that does not overlap with a connection portion between the conveying path and the second vibration device in a plan view.

6. The tablet dispensing apparatus of claim 5.

9. The method includes: a hopper for supplying resin tablets to be used in transfer molding; and an alignment device for aligning the resin tablets supplied from the hopper; The alignment device includes: A conveying path is provided for conveying the resin tablet toward a guide that regulates the orientation of the resin tablet, A sieve is provided in at least a part of the conveying path, which does not allow the resin tablet to pass through and allows dust smaller than the resin tablet to pass through. Tablet supply device.

10. A tablet supplying device according to any one of claims 1 to 9, A mold for melting a resin tablet to resin-seal electronic components; A loader that transports the resin tablets supplied from the tablet supply device into the mold is further provided. Resin sealing equipment.

11. Vibrating the funnel in which the resin tablets are stored to cause the resin tablets to fall to the bottom; and The resin tablet and the dust that has fallen from the funnel together with the resin tablet are separated by a sieve provided at the bottom. Tablet supply method.

12. Conveying the resin tablets supplied from the hopper along a conveying path; Aligning the resin tablets by a guide provided on the conveying path; and The resin tablets are separated from the dust transported together with the resin tablets by a sieve provided in the transport path. Tablet supply method.

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