Component mounting device, and suction tool

Abstract

To provide a component mounting device capable of improving the good product ratio of circuit boards produced by preventing air from being trapped between the component and the circuit board while reducing the occurrence of mounting failure when mounting the component on the circuit board, and a suction tool.SOLUTION: The component mounting device includes a mounting head that sucks a component BH supplied from a component supply unit by the suction tool 16 for mounting the same on the circuit board. The suction tool 16 includes: a component opposing surface 31 that is opposite to the component BH to be sucked; a suction opening (concave groove 32M) formed in a second area R2 located outside a first region R1 facing the center of component BH in the component opposing surface 31; and an internal negative pressure piping 32 communicating with the suction opening. When negative pressure is supplied to the internal negative pressure piping 32, an adhesive force that attracts the component BH is generated in the suction opening, a part located outside the center of the component BH is adhered with a relatively larger adsorption force.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a component mounting device in which a mounting head picks up components supplied by a component supply unit using a suction tool and mounts the components on a substrate, and to the suction tool. [Background technology]

[0002] Conventionally, there is known a component mounting device in which components supplied by a component supply unit are picked up by a mounting head and mounted on a board. The mounting head is equipped with a suction tool, and the components are picked up by the suction tool and held. A suction opening is provided on the underside (component facing surface) of the suction tool, and when negative pressure is supplied to an internal negative pressure pipe connected to the suction opening, a suction force that picks up the component is generated at the suction opening. The suction opening is usually located on the component facing surface facing the center of the component, so that the center of the component can be firmly picked up and held (for example, see Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-311679 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, if the component to be picked up is very thin and has low rigidity, when the center of the component is picked up, that part will be depressed in a convex shape toward the top (inward of the suction opening), and there is a risk that air will get trapped between the component and the board when the component is mounted on the board, causing mounting defects. This type of problem is particularly likely to occur when no adhesive is used between the component and the board.

[0005] Therefore, an object of the present invention is to provide a component mounting device and a suction tool that can prevent air from becoming trapped between a component and a board when mounting the component on the board, reduce the occurrence of mounting defects, and improve the yield rate of produced boards. [Means for solving the problem]

[0006] The component mounting device of the present invention is a component mounting device comprising a component supply unit that supplies components, and a mounting head that uses a suction tool to pick up the components supplied by the component supply unit and mount them on a substrate, wherein the suction tool has a component facing surface that faces the component to be picked up, a suction opening provided in a second region of the component facing surface that is located outside a first region that faces a central portion of the component, and an internal negative pressure pipe that communicates with the suction opening, and when negative pressure is supplied to the internal negative pressure pipe, a suction force that picks up the component is generated in the suction opening, and a portion of the component that is located outside the central portion is picked up with a relatively greater suction force.

[0007] The suction tool of the present invention is a suction tool provided on a mounting head which picks up a component and mounts it on a substrate, and has a component-facing surface facing the component to be picked up, a suction opening provided in a second region of the component-facing surface which is located outside a first region which faces the center of the component, and an internal negative pressure piping which communicates with the suction opening, and when negative pressure is supplied to the internal negative pressure piping, a suction force which picks up the component is generated in the suction opening, and the portion of the component which is located outside of the center is picked up with a relatively greater suction force. Effect of the Invention

[0008] According to the present invention, it is possible to prevent air from being trapped between a component and a substrate when mounting the component on the substrate, thereby reducing the occurrence of mounting defects and improving the yield rate of produced substrates. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a side view of a component mounting device according to a first embodiment of the present invention. [Diagram 2] FIG. 1 is a perspective view showing a component supply unit provided in a component mounting device according to a first embodiment of the present invention together with a pickup head; [Diagram 3] FIG. 2 is a block diagram showing a control system of the component mounting device according to the first embodiment of the present invention. [Figure 4] FIG. 1 is a cross-sectional side view of a suction tool provided in a component mounting device according to a first embodiment of the present invention; [Diagram 5] 1A is a cross-sectional side view showing a state in which a component is adsorbed by a suction tool provided in a component mounting device according to a first embodiment of the present invention; FIG. [Figure 6] 1A and 1B are cross-sectional side views showing a suction tool provided in a component mounting device according to a first embodiment of the present invention, together with a component picked up by the suction tool. [Figure 7] FIG. 1 is a bottom view of a suction tool provided in a component mounting device according to a first modified example of the first embodiment of the present invention; [Figure 8] FIG. 13A is a bottom view of a second modified example of a suction tool provided in the component mounting device according to the first embodiment of the present invention; FIG. [Figure 9] FIG. 1 is a side view of a component mounting device according to a first embodiment of the present invention. [Figure 10] FIG. 1 is a side view of a component mounting device according to a first embodiment of the present invention. [Figure 11] FIG. 1 is a side view of a component mounting device according to a first embodiment of the present invention. [Figure 12] FIG. 13A is a cross-sectional side view of a suction tool provided in a component mounting device according to a second embodiment of the present invention; FIG. 13B is a perspective view of the suction tool in an upside-down state; [Figure 13] 13A and 13B are cross-sectional side and bottom views showing a state in which a component is adsorbed by a suction tool provided in a component mounting device according to a second embodiment of the present invention; [Figure 14] 13A and 13B are cross-sectional side and bottom views showing a state in which a component is adsorbed by a suction tool provided in a component mounting device according to a second embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] (Embodiment 1) Fig. 1 shows a component mounting device 1 in a first embodiment of the present invention. The component mounting device 1 is a device that mounts components BH on a board KB, and includes a component supply unit 12, a mounting stage 13, a pickup head 14, and a mounting head 15 on a base 11. In the first embodiment, the direction perpendicular to the plane of Fig. 1 is defined as the X direction, and the left-right direction of Fig. 1 is defined as the Y direction. The up-down direction is defined as the Z direction.

[0011] 1, the component supply unit 12 is made of a table-shaped member. The component supply unit 12 is moved within an XY plane (horizontal plane) by a component supply unit moving unit 12M.

[0012] 1 and 2, the component supply unit 12 holds on its upper surface a number of components BH formed by cutting a semiconductor wafer WF. The components BH are formed by cutting the semiconductor wafer WF into a lattice pattern, and therefore the outer edge GE of the components BH has a rectangular shape (almost a square shape). Each component BH is very thin and has low bending rigidity, so it can be easily bent and deformed.

[0013] 1, the mounting stage 13 is provided adjacent to the component supply unit 12. The mounting stage 13 holds the substrate KB in a horizontal position. The mounting stage 13 is moved in the XY plane by a mounting stage moving unit 13M.

[0014] 1, a substrate heating section 13H is provided inside the mounting stage 13. The substrate heating section 13H heats the mounting stage 13, thereby heating the substrate KB mounted on the mounting stage 13.

[0015] 1, the pick-up head 14 is provided at a position between the component supply unit 12 and the mounting stage 13. The pick-up head 14 is equipped with a nozzle 14N for picking up the component BH supplied from the component supply unit 12 by suction.

[0016] In Fig. 1, the mounting head 15 has a shaft member 15F extending downward. An external conduit GK that is connected to a negative pressure source VP is connected to the shaft member 15F. A control valve VV is interposed in the external conduit GK. By opening the control valve VV, negative pressure sent from the negative pressure source VP can be supplied to the internal space of the shaft member 15F through the external conduit GK.

[0017] A suction tool 16 is attached to the lower end of the shaft member 15F (FIG. 1). The suction tool 16 is a tool for suctioning and holding the part BH (described in detail later).

[0018] 1, a component heating section 16H is provided within the suction tool 16. The component heating section 16H heats the suction tool 16, thereby heating the component BH that is sucked onto the suction tool 16.

[0019] 1, an ultrasonic oscillator 17 is provided inside the mounting head 15. The ultrasonic oscillator 17 applies ultrasonic vibration to the component BH via the suction tool 16 by oscillating ultrasonic waves.

[0020] 1, a pressure sensor 18 is provided within the mounting head 15. The pressure sensor 18 detects the pressing pressure when the mounting head 15 presses the component BH picked up by the suction tool 16 against the board KB.

[0021] The shaft member 15F is raised and lowered by a tool lifting unit 15C provided in the mounting head 15. When the shaft member 15F is raised and lowered by the tool lifting unit 15C, the suction tool 16 is raised and lowered integrally with the shaft member 15F. The mounting head 15 is moved in the Y direction between the component supply unit 12 and the placement stage 13 by a mounting head moving unit 15M.

[0022] Fig. 3 shows a control system of the component mounting device 1. As shown in Fig. 3, a control unit 19 (also see Fig. 1) provided in the component mounting device 1 controls each of the operations of movement of the component supply unit 12 in the XY plane by the component supply unit movement unit 12M, movement of the mounting stage 13 in the XY plane by the mounting stage movement unit 13M, movement and up-down inversion of the pickup head 14 by the pickup head movement unit 14M, suction of the component BH by the pickup head 14, lifting and lowering of the shaft member 15F (suction tool 16) by the tool lifting unit 15C, movement of the mounting head 15 by the mounting head movement unit 15M and suction of the component BH by the mounting head 15.

[0023] The control unit 19 also controls the operations of heating the mounting stage 13 by the substrate heating unit 13H, heating the suction tool 16 by the component heating unit 16H, and transmitting ultrasonic waves by the ultrasonic oscillator 17. The control unit 19 also receives information about the pressing pressure of the mounting head 15, which is detected by the pressure sensor 18, pressing the component BH against the substrate KB.

[0024] 4(a) and (b), the suction tool 16 includes a main body 21 having a rectangular block shape, and a shaft member mounting portion 22 extending upward from the center of the upper surface of the main body 21. As shown in FIG. 4(a), the shaft member mounting portion 22 is inserted from below and mounted on the shaft member 15F of the mounting head 15 (see also FIG. 1). When the shaft member mounting portion 22 is mounted on the shaft member 15F, a mounting portion inner conduit 22K provided inside the shaft member mounting portion 22 communicates with the internal space 15S of the shaft member 15F (FIG. 4(a)).

[0025] 4(a) and 4(b), the lower surface of the main body 21 is a component facing surface 31 that faces the component BH to be sucked. An internal negative pressure pipe 32 that is connected to the mounting portion internal pipe 22K is provided inside the main body 21.

[0026] In Figures 4(a) and (b), the internal negative pressure piping 32 has a horizontal pipe 32a extending in a cross shape in a horizontal plane, and multiple (four) vertical pipes 32b extending vertically from several points (four points in this case) of the horizontal pipe 32a.

[0027] 4(a) and 4(b), the main body 21 is provided with a recessed groove 32M as a suction opening that opens toward the component-facing surface 31 and extends in a substantially rectangular ring shape. The four vertical ducts 32b each communicate with the recessed groove 32M, and when negative pressure from the negative pressure source VP is supplied to the internal negative pressure piping 32 through the mounting unit internal duct 22K, a suction force that suctions the component BH to the component-facing surface 31 is generated through the recessed groove 32M.

[0028] 4(a) and (b), the island-like region located inside (surrounded by) the recessed groove 32M on the component facing surface 31 is a region facing the center of the component BH, and is hereinafter referred to as the "first region R1." The first region R1 does not have a suction opening for suctioning the center of the component BH, and therefore does not generate a suction force.

[0029] 4(a) and (b), the recessed groove 32M surrounding the first region R1 corresponds to a region located outside the first region R1, and hereinafter, this region is referred to as the "second region R2." In the first embodiment, the second region R2 is made of the recessed groove 32M and is the suction opening itself, so that an attraction force is generated in the second region R2. That is, in the first embodiment, the second region R2 is a region (here, the recessed groove 32M) outside the first region R1 that generates an attraction force.

[0030] Thus, in embodiment 1, the suction tool 16 has a component facing surface 31 facing the component BH to be suctioned, an suction opening (here, a concave groove 32M) provided in a second region R2 of the component facing surface 31 that is located outside a first region R1 facing the center of the component BH, and an internal negative pressure piping 32 communicating with the suction opening, and when negative pressure is supplied to the internal negative pressure piping 32, an suction force is generated in the suction opening (concave groove 32M) to suction the component BH.

[0031] 4(a) and (b), the component facing surface 31 has an area located on the same plane as the first area R1 at a position outside the second area R2 (here, the recessed groove 32M). This area does not have a suction opening, and therefore no suction force is generated. This area outside the second area R2 where no suction force is generated is hereinafter referred to as the "third area R3."

[0032] The suction tools 16 are prepared for each size of the component BH to be picked up, and are attached to the shaft member 15F of the mounting head 15 in correspondence with the component BH to be picked up. When the suction tool 16 corresponds to the component BH to be picked up, when the center of the component BH is opposed to the center of the first region R1 of the component facing surface 31, the outer edge GE of the component BH faces the second region R2 (concave groove 32M) (FIGS. 5(a) and 5(b)).

[0033] When negative pressure is supplied to the internal negative pressure pipe 32 with the center of the part BH to be picked up facing the center of the first region R1, a suction force is generated in the second region R2 (recessed groove 32M), and the outer edge GE of the part BH is pulled toward the recessed groove 32M. As a result, the part BH is picked up by the suction tool 16 with the part facing surface 31 serving as the part suction surface (FIGS. 5(a) and 5(b)).

[0034] At this time, no suction force is generated in the first region R1 of the component-facing surface 31 of the suction tool 16, so that the part of the component BH located outside the center is suctioned with a relatively greater suction force than the center. In addition, there is no suction opening in the first region R1, so the center of the component BH facing the first region R1 is not drawn toward the suction tool 16, and the center of the component BH does not become concave upward (FIGS. 6(a) and 6(b)). Therefore, the component BH suctioned by the suction tool 16 maintains its entire flat shape (FIG. 6(a)), or the center of the component BH becomes bent and convex downward (FIG. 6(b)), so that there is no risk of air being trapped between the component BH and the board KB when the component BH is mounted on the board KB, as described below. When the part BH is adsorbed by the suction tool 16, its outer edge portion GE may be located outside the concave groove 32M of the part facing surface 31, i.e., the outer edge portion GE may be facing the third region R3 that does not have an suction opening.

[0035] In the first embodiment, the second region R2 (concave groove 32M) does not necessarily have to surround and be continuously connected to the first region R1. The second region R2 (concave groove 32M) may be provided near a pair of opposing vertical pipes 32b among the four vertical pipes 32b, or the first region R1 may be provided near the four vertical pipes 32b as shown in the first modified example of FIG. 7. That is, the second region R2 (concave groove 32M) may exist in a discontinuous state outside the first region R1. In this case (when a plurality of second regions R2 exist discontinuously outside the first region R1), the third region R3 is not only located adjacent to the outside of the second region R2 as shown in FIG. 7, but also located adjacent to the outside of the first region R1.

[0036] The suction tool 16 may have a number of vertical ducts 32b (whose inner diameter is extremely small compared to the size of the part BH) arranged in a ring shape around the first region R1 as suction openings arranged in the second region R2, as shown in the second modified example shown in FIG. 8(a). Also, as shown in the third modified example shown in FIG. 8(b), a number of vertical ducts 32b may be arranged in the entire area outside the first region R1 as suction openings arranged in the second region R2. In the third modified example, the outer edge portion GE does not warp upward as shown in FIGS. 6(a) and (b). In the third modified example, the third region R3, which is an area outside the second region R2 where no suction force is generated, does not exist.

[0037] Next, we will explain the operation of the component mounting device 1. When the component mounting device 1 performs an operation of mounting components BH on the substrate KB (component mounting operation), first, the control unit 19 operates the mounting stage moving unit 13M to position the target mounting position on the mounting stage 13 at a preset mounting position PT (FIG. 1).

[0038] After positioning the target mounting position on the mounting stage 13 at the mounting position PT, the control unit 19 actuates the component supply unit moving unit 12M to move the component supply unit 12 in the XY plane. Then, of the components BH on the mounting stage 13, the component BH to be mounted on the board KB is positioned at a preset pick-up position PP (FIG. 1).

[0039] After positioning the part BH at the pick-up position PP, the control unit 19 actuates the pick-up head moving unit 14M to position the pick-up head 14 with the nozzle 14N facing downward above the pick-up position PP. This positions the part BH to be picked up below the nozzle 14N of the pick-up head 14.

[0040] When the pickup head 14 is positioned above the pickup position PP, the control unit 19 causes the nozzle 14N of the pickup head 14 to pick up the component BH (FIG. 1). Then, once the component BH has been picked up by the nozzle 14N, the pickup head 14 is turned upside down (and therefore the component BH is turned upside down), and the component BH is positioned at the component receiving position PU (FIG. 9).

[0041] When the component BH is located at the component receiving position PU, the control unit 19 operates the mounting head moving unit 15M to position the mounting head 15 above the component receiving position PU. Then, when the mounting head 15 is located above the component receiving position PU, the tool lifting unit 15C lowers the suction tool 16 so that the component facing surface 31 faces the component BH that has been turned upside down by the pickup head 14. At this time, the component facing surface 31 of the suction tool 16 is arranged so that the first region R1 faces the center of the component BH and the second region R2 (the concave grooves 32M or the multiple vertical pipes 32b) faces the outer edge GE of the part BH.

[0042] When the component facing surface 31 faces the component BH, the control unit 19 operates (opens) the control valve VV to supply negative pressure from the negative pressure source VP to the mounting unit internal duct 22K. This generates a suction force in the suction openings (concave grooves 32M or multiple vertical ducts 32b) provided facing the component facing surface 31 of the suction tool 16, and the component BH is picked up by the suction tool 16, with the component facing surface 31 as its component suction surface. This puts the mounting head 15 in a state of receiving the component BH from the pickup head 14 (FIG. 10).

[0043] When mounting head 15 receives component BH, control unit 19 moves mounting head 15 in the Y direction using mounting head moving unit 15M, and positions component BH picked up by suction tool 16 above mounting position PT. Then control unit 19 operates component heating unit 16H to heat component BH, operates board heating unit 13H to heat board KB, and operates ultrasonic oscillator 17 to apply ultrasonic vibration to suction tool 16. Then, in this state, tool lift unit 15C lowers suction tool 16 (arrow P shown in FIG. 11), and presses component BH picked up by suction tool 16 against board KB to apply pressure (FIG. 11).

[0044] The control unit 19 maintains the above-mentioned pressed and pressurized state for a fixed period of time. More specifically, the state in which the component BH is pressed against the board KB is maintained for a predetermined period of time when the pressing pressure detected by the pressure sensor 18 reaches a specified pressure value. This causes localized plastic deformation at the bonding surface between the component BH and the board KB, and the component BH is bonded (ultrasonic bonded) to the board KB.

[0045] In this mounting process of component BH, as described above, the center of component BH picked up by suction tool 16 does not become concave upward (FIGS. 5(a) and 5(b)). This prevents air from being trapped between component BH and board KB when mounting component BH on board KB, thereby reducing the occurrence of mounting defects of component BH.

[0046] Thus, in the component mounting device 1 of the first embodiment, the suction tool 16 is adapted to suction the portion (outer edge GE) of the component BH located outside of its center with a relatively greater suction force (the suction force of the center of the component BH is "0" here), and this prevents the center of the component BH picked up by the suction tool 16 from becoming concave upward. This makes it possible to prevent air from being trapped between the component BH and the board KB when mounting the component BH on the board KB, thereby reducing the occurrence of mounting defects and improving the yield rate of produced boards.

[0047] (Embodiment 2) Next, a description will be given of a second embodiment of the present invention. The component mounting device in the second embodiment is different only in the configuration of the suction tool, and the other configurations are the same as those of the component mounting device 1 in the first embodiment.

[0048] 12(a) and 12(b), a suction tool (reference numeral 16A) in the second embodiment has a component facing surface 31 made of a porous material, and its surface 40M (the surface opposite to the side in contact with the component facing surface 31) is covered by a flat-formed cover member 40. Note that, here, a concave groove 32M is provided as a suction opening in the second region R2.

[0049] 12(a) and (b), in the second embodiment, the suction opening (recessed groove 32M) in the second region R2 is not exposed to the outside, and the suction tool 16A suctions the component BH using the surface 40M (here, the lower surface) of the cover member 40 as the component suction surface (FIGS. 13(a) and (b)). At this time, the suction tool 16A suctions the component BH by the suction force generated on the surface 40M of the cover member 40 through the porous pores that make up the cover member 40.

[0050] Here, as described above, since surface 40M of cover member 40 is formed flat, the picked-up component BH maintains a planar shape as shown in Fig. 13(a). Therefore, as in the case of embodiment 1, it is possible to prevent air from being trapped between component BH and board KB when mounting component BH on board KB, thereby reducing the occurrence of mounting defects.

[0051] Even in the case where the component facing surface 31 is covered by the cover member 40 made of a porous material as in the second embodiment, when the component BH is picked up by the suction tool 16, the outer edge GE of the component facing surface 31 can be positioned outside the groove 32M, that is, the outer edge GE can be opposed to the third region R3 that does not have a suction opening (FIGS. 14(a) and 14(b)). If the groove 32M is not covered by the cover member 40 and the outer edge GE of the component BH is opposed to the third region R3 and the component BH is picked up, the part of the component BH inside the outer edge GE (the side closer to the center) may enter the groove 32M and air may be trapped inside. However, in the second embodiment, the groove 32M is covered by the cover member 40, so this does not occur (FIG. 14(a)), and the component BH can be mounted on the board KB without air being trapped between the component BH and the board KB.

[0052] As described above, in the component mounting device 1 in the first and second embodiments, the suction tool 16 is adapted to suction the portion of the component BH located outside the center (the outer edge GE or the area in the vicinity of the outer edge GE) with a relatively greater suction force than the center of the component BH, and this makes it possible to prevent the center of the component BH picked up by the suction tool 16 from becoming concave upward. This makes it possible to prevent air from being trapped between the component BH and the board KB when mounting the component BH on the board KB, thereby reducing the occurrence of mounting defects and improving the yield rate of the boards KB produced.

[0053] Although the embodiments of the present invention have been described above, the present invention is not limited to the above and various modifications are possible. For example, the configuration of the internal negative pressure pipe 32 of the suction tool 16, 16A shown in the above-mentioned embodiments 1 and 2 is one example, and any configuration is possible as long as it is provided in communication with a suction opening provided facing the component-facing surface 31 and generates a suction force for suctioning the component BH at the suction opening when negative pressure is supplied. [Industrial Applicability]

[0054] To provide a component mounting device and a suction tool capable of preventing air from being trapped between a component and a substrate when mounting the component on the substrate, reducing the occurrence of mounting defects, and improving the yield rate of produced substrates. [Explanation of symbols]

[0055] 1. Parts mounting equipment 12 Parts Supply Department 15 Mounting head 16,16A Suction tool 21 Main body 22 Shaft member mounting portion 22K Inner pipe of fitting 31 Part facing surface 32 Internal negative pressure piping 32M concave groove (suction opening) 40 Cover member 40M surface R1 1st area R2 2nd area R3 3rd area BH Parts GE Outer Edge KB board

Claims

1. A component mounting device including: a component supply unit that supplies components; and a mounting head that uses a suction tool to pick up the components supplied by the component supply unit and mount them on a substrate, The suction tool is a component facing surface facing the component to be attracted; a suction opening provided in a second region of the component facing surface, the second region being positioned outside a first region facing a center portion of the component; an internal negative pressure pipe communicating with the suction opening; When negative pressure is supplied to the internal negative pressure piping, a suction force that suctions the component is generated in the suction opening, and a portion of the component that is positioned outside the central portion is suctioned with a relatively greater suction force.

2. 2. The component mounting device according to claim 1, wherein the first region is not provided with a suction opening for suctioning a central portion of the component.

3. The component mounting device according to claim 1 , wherein the suction opening is disposed so as to surround the first region.

4. 4. The component mounting device according to claim 3, wherein the suction opening is formed of a recessed groove provided in an annular shape surrounding the first region.

5. The component mounting device according to claim 1 , wherein the component is attracted to the second region with an outer edge of the component facing the second region.

6. 2. The component mounting device according to claim 1, wherein the component-facing surface is covered with a cover member made of a porous material.

7. 7. The component mounting device according to claim 6, further comprising a third region on the component facing surface outside the second region where the suction opening is not provided, and the component is sucked with an outer edge of the component facing the third region.

8. A suction tool provided on a mounting head that picks up a component and mounts it on a substrate, a component facing surface facing the component to be attracted; a suction opening provided in a second region of the component facing surface, the second region being positioned outside a first region facing a center portion of the component; an internal negative pressure pipe communicating with the suction opening; When negative pressure is supplied to the internal negative pressure piping, a suction force that sucks the component is generated in the suction opening, and a portion of the component that is positioned outside the central portion is sucked with a relatively greater suction force.

9. The suction tool according to claim 8 , wherein the first region is not provided with a suction opening for suctioning a central portion of the component.

10. The suction tool according to claim 8 , wherein the suction openings are arranged to surround the first region.

11. The suction tool according to claim 10 , wherein the suction opening is a recessed groove provided in an annular shape surrounding the first region.

12. The suction tool according to claim 9 , wherein the component-facing surface is covered with a cover member made of a porous material.

Images