Light-emitting device

By optimizing the design of light emitting devices, including bases, frames, covers, light emitting elements and lens sections, the challenges of existing equipment in terms of production efficiency, weight reduction and packaging stability, and stability of the welding process, achieving more efficient, lighter and more stable equipment.

JP2025070129APending Publication Date: 2025-05-02NICHIA CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2023180215
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-10-19
Publication Date
2025-05-02

AI Technical Summary

Technical Problem

Existing light-emitting equipment has challenges in terms of production efficiency, weight reduction and packaging stability, and stability of the welding process.

Method used

A light emitting device is designed, which includes a base, a frame, a cover, a light emitting element and a lens portion. By optimizing the shape and position of the cover, production efficiency is improved, weight is reduced, and packaging stability and welding process stability are achieved by adjusting the welding mode.

Benefits of technology

It improves the production efficiency of light emitting equipment, reduces the weight of the equipment, and ensures the stability of the packaging and the stability of the welding process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025070129000001_ABST
    Figure 2025070129000001_ABST
Patent Text Reader

Abstract

To improve the production efficiency of a light-emitting device.SOLUTION: A light-emitting device comprises: a substrate that has a base having a first upper face, and a frame part having a second upper face surrounding the first upper face; a lid body that has an upper face, and a lower face joined to the second upper face of the substrate; one or more light-emitting elements that are arranged on the first upper face; and a lens member that has a lower face joined to the upper face of the lid body. The outer edge shape of the second upper face of the substrate is a rectangle having a first side and a second side parallel to the first side. The outer edge shape of the lower face of the lid body is a rectangle having a first side and a second side parallel to the first side of the lid body. In top view, the distance from the second side of the substrate to the second side of the lid body is longer than the distance from the first side of the substrate to the first side of the lid body. The lens member has a lens part that has a lens surface, and a non-lens part that does not overlap the lens surface in top view. In top view, the distance from the first side of the lid body to the one or more lens surfaces is shorter than the distance from the second side of the lid body to the one or more lens surfaces.SELECTED DRAWING: Figure 4
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] JP 2021-97216 A discloses a light emitting device including a package having a base and a lid member joined to the base, a semiconductor laser element, and an optical member joined to the lid member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-97216 Summary of the Invention [Problem to be solved by the invention]

[0004] An invention is disclosed that solves the problem of improving the production efficiency of light emitting devices.

[0005] Alternatively, an invention is disclosed that solves the problem of reducing the weight of a light emitting device instead of the above problem.

[0006] Alternatively, instead of the above-mentioned problems, an invention is disclosed that solves the problem of realizing a package with a stable bonding balance between the base and the lid.

[0007] Alternatively, instead of the above-mentioned problems, an invention is disclosed that solves the problem of realizing a stable bonding process in the manufacture of a light emitting device.

[0008] In addition, this specification also discloses an invention that solves two or more of the above-mentioned problems in a composite manner. [Means for solving the problem]

[0009] The light emitting device disclosed in the embodiment includes a base having a base portion having a first upper surface, and a frame portion having a second upper surface located higher than the first upper surface and surrounding the first upper surface in a top view, a lid body having an upper surface and a lower surface bonded to the second upper surface of the base, one or more light emitting elements arranged on the first upper surface, and a lens member having a lower surface bonded to the upper surface of the lid body, wherein an outer edge shape of the second upper surface of the base is a rectangle having a first side and a second side parallel to the first side, and an outer edge shape of the lower surface of the lid body is a rectangle having a first side parallel to the first side of the base and a second side parallel to the first side of the lid body, the first side of the lid body is disposed closer to the first side of the base than the second side of the lid body, and the second side of the lid body is positioned closer to the second side of the base than the first side of the lid body, and the shortest distance from the second side of the base to the second side of the lid body in a top view is greater than the shortest distance from the first side of the base to the first side of the lid body; the lens member has a lens portion having one or more lens surfaces and a non-lens portion that does not overlap with the one or more lens surfaces in a top view, and the shortest distance from the first side of the lid body to the one or more lens surfaces in a top view is smaller than the shortest distance from the second side of the lid body to the one or more lens surfaces; and the maximum width of the one or more lens surfaces in a direction perpendicular to the first side of the base in a top view is 65% or more of the maximum width of the lens member.

[0010] In at least one of the one or more inventions disclosed in the embodiments, the production efficiency of light emitting devices can be improved. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Diagram 2] FIG. 2 is a side view of the light emitting device according to the embodiment as viewed from the Y positive direction. [Diagram 3] FIG. 3 is a side view of the light emitting device according to the embodiment as viewed from the positive X direction. [Figure 4] FIG. 4 is a top view of the light emitting device according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV of FIG. [Figure 6] FIG. 6 is a top view for explaining a bonding state of a bonding member of the light emitting device according to the embodiment. [Figure 7] FIG. 7 is a perspective view for explaining components arranged in the internal space of the light emitting device according to the embodiment. [Figure 8] FIG. 8 is a top view for explaining components arranged in the internal space of the light emitting device according to the embodiment. [Figure 9] FIG. 9 is a perspective view of a package according to the embodiment. [Figure 10] FIG. 10 is a top view of the package according to the embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 12 is a top view of the base body according to the embodiment. [Figure 13] FIG. 13 is a bottom view of the base body according to the embodiment. [Figure 14] FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. [Figure 15] FIG. 15 is a perspective view of the cover according to the embodiment as viewed from the bottom side. [Figure 16] FIG. 16 is a bottom view of the lid according to the embodiment. [Figure 17] FIG. 17 is a top view for explaining the appearance of a light emitting element and the like mounted on the submount according to the embodiment. [Figure 18] FIG. 18 is a side view for explaining the appearance of a light emitting element and the like mounted on the submount according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] In this specification and claims, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this specification and claims.

[0013] This is not limited to polygons, but also applies to words expressing specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0014] In addition, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and back (front / rear), front and back, etc., merely describe relationships such as relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0015] In addition, directions such as the X direction, the Y direction, and the Z direction may be indicated by using arrows in the drawings. The directions of these arrows are consistent among multiple drawings relating to the same embodiment. In addition, the direction of the arrows marked with X, Y, and Z in the drawings is the positive direction, and the opposite direction is the negative direction. For example, the direction marked with X at the tip of the arrow is the X direction and the positive direction. In this specification, the direction that is the X direction and the positive direction is referred to as the "positive X direction", and the opposite direction is referred to as the "negative X direction". When referring to the "X direction", it includes both the positive and negative directions. The same applies to the Y and Z directions.

[0016] In addition, in this specification, when an object is specified as "one or more" and the object is described, both the form in which the object is one and the form in which the object is multiple are described together. Thus, the description specifying "one or more" supports any of the following embodiments: an embodiment with one or more objects, an embodiment with at least one object, and an embodiment with multiple objects.

[0017] In addition, in this specification, the description of the "one or each" object is a description that combines a description of one object in an embodiment having one object, a description of one object in an embodiment having multiple objects, and a description of each of the objects in an embodiment having multiple objects. Therefore, the description of the "one or each" object supports all of the following: in an embodiment having one object, this one object has explanatory content; in an embodiment having multiple objects, at least one of these objects has explanatory content; in an embodiment having multiple objects, each of these multiple objects has explanatory content; and in an embodiment having one or multiple objects, all of the objects have explanatory content.

[0018] Furthermore, in this specification, the terms "component" and "part" may be used when explaining components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, a "part" is used when referring to a portion of a single component, or when referring to multiple components collectively as a single object.

[0019] The distinction between "component" and "part" above does not indicate any intention to consciously limit the scope of the right in the interpretation of the doctrine of equivalents. In other words, even if there is a component described as a "component" in the scope of the patent claim, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0020] In addition, in this specification or claims, when there are multiple elements of a certain type and each element needs to be expressed separately, the elements may be distinguished by adding "first" or "second" to the beginning of the element. In addition, the objects to be distinguished may differ between this specification and the claims. Therefore, even if the claims describe an element with the same notation as this specification, the object identified by this element may not be the same between this specification and the claims.

[0021] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements to which "first" and "third" are attached in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims from the viewpoint of readability. In this case, the elements to which "first" and "second" are attached in the claims refer to the elements to which "first" and "third" are attached in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0022] Hereinafter, the embodiment for carrying out the present invention will be described. Furthermore, a specific embodiment for carrying out the present invention will be described with reference to the drawings. Note that the embodiment for carrying out the present invention is not limited to this specific embodiment. In other words, the illustrated embodiment is not the only embodiment in which the present invention can be realized. Note that the size and positional relationship of the members shown in each drawing may be exaggerated for ease of understanding.

[0023] <Embodiment> A light emitting device 1 according to an embodiment will be described. FIGS. 1 to 18 are drawings for explaining an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a side view of the light emitting device 1 as viewed from the Y direction. FIG. 3 is a side view of the light emitting device 1 as viewed from the X direction. FIG. 4 is a top view of the light emitting device 1. In FIG. 4, the region where the bonding member 80 is formed is indicated by hatching surrounded by a dashed line. Also, the inner frame of the second upper surface 11C of the base 11 is indicated by a dotted line. FIG. 5 is a cross-sectional view of the light emitting device 1 taken along the VV cross-sectional line in FIG. 4. FIG. 6 is a top view for explaining the bonding state of the bonding member 80 of the light emitting device 1. In FIG. 6, the first region R1 to the fourth region R4 are indicated by hatching oriented in a different direction from the first bonding member 81 to the fourth bonding member 84. Also, the outer edge of the upper surface 14A of the lid 14, which overlaps with the optical member 70 in a top view, is indicated by a dotted line. 7 and 8 are a perspective view and a top view for explaining components arranged in the internal space of the light emitting device 1. In FIG. 8, the wiring 60 shown in FIG. 7 is omitted. FIG. 9 is a perspective view of the package 10. FIG. 10 is a top view of the package 10. In FIG. 10, the inner frame of the second upper surface 11C of the base 11 is shown by a dotted line, and the bonding pattern 14D and the buffer line pattern 14E of the lid 14 are shown by a dashed line. FIG. 11 is a cross-sectional view of the package 10 taken along the XI-XI cross-sectional line in FIG. 10. FIG. 12 is a top view of the base 11. FIG. 13 is a bottom view of the base 11. FIG. 14 is a cross-sectional view of the base 11 taken along the XIV-XIV cross-sectional line in FIG. 12. FIG. 15 is a perspective view of the lid 14 as viewed from the bottom surface 14B side. FIG. 16 is a bottom view of the lid 14. In FIG. 16, the buffer line 14E1 is hatched. 17 and 18 are a top view and a side view for explaining the state of the light emitting element 20 and the like mounted on the submount 30. FIG.

[0024] The light emitting device 1 includes a plurality of components, including a package 10, one or more light emitting elements 20, one or more submounts 30, one or more reflective members 40, one or more protective elements 50, a plurality of wirings 60, an optical member 70, and one or more bonding members 80.

[0025] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the one or more light emitting elements 20. The light emitting device 1 may not include some of the components listed here.

[0026] First, each component will be described.

[0027] (Package 10) The package 10 includes a base 11 and a lid 14. The lid 14 is joined to the base 11 to form the package 10. An internal space is defined in the package 10 in which other components are disposed. This internal space is a closed space surrounded by the base 11 and the lid 14. In addition, this internal space can be a space sealed in a vacuum or airtight state.

[0028] When viewed from above, the outer edge shape of the package 10 is rectangular. This rectangle can be a rectangle having a long side and a short side. In the illustrated package 10, the long side direction of this rectangle is the same as the X direction, and the short side direction is the same as the Y direction. Note that when viewed from above, the outer edge shape of the package 10 does not have to be rectangular.

[0029] In the package 10, an internal space is formed in which other components are disposed. The first upper surface 11A of the package 10 is a part of an area that defines the internal space. In addition, each of the inner side surfaces 11E and the lower surface 14B of the package 10 is also a part of an area that defines the internal space.

[0030] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect with the second upper surface 11C. The one or more outer surfaces 11D intersect with the lower surface 11B. The one or more inner surfaces 11E intersect with the second upper surface 11C.

[0031] When viewed from above, the outer edge shape of base 11 is rectangular. When viewed from above, the outer edge shape of base 11 is the outer edge shape of package 10. When viewed from above, the outer edge shape of first top surface 11A is rectangular. This rectangle can be a rectangle having long sides and short sides. The long side direction of first top surface 11A and the long side direction of the outer edge shape of base 11 are parallel. Note that when viewed from above, the outer edge shape of first top surface 11A does not have to be rectangular.

[0032] In top view, first top surface 11A is surrounded by second top surface 11C. Second top surface 11C is an annular surface surrounding first top surface 11A in top view. Second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of second top surface 11C is referred to as the inner frame of second top surface 11C, and the frame defined by the outer edge of second top surface 11C is referred to as the outer frame of second top surface 11C.

[0033] The outer edge shape of the second upper surface 11C is a rectangle. This rectangle may have a long side and a short side. This rectangle has a first side 11C1, a second side 11C2, a third side 11C3, and a fourth side 11C4. The second side 11C2 is parallel to the first side 11C1. The third side 11C3 is perpendicular to the first side 11C1. The fourth side 11C4 is parallel to the third side 11C3. The first side 11C1 is the long side of this rectangle.

[0034] The inner edge shape of the second upper surface 11C is a rectangle. This rectangle may have a long side and a short side. This rectangle has a first side 11C5, a second side 11C6, a third side 11C7, and a fourth side 11C8. The second side 11C6 is parallel to the first side 11C5. The third side 11C7 is perpendicular to the first side 11C5. The fourth side 11C8 is parallel to the third side 11C7. The first side 11C5 is the long side of this rectangle. For convenience, the sides of the rectangle of the outer edge shape and the sides of the rectangle of the inner edge shape are called the outer edge sides and the inner edge sides, respectively, to distinguish them from each other.

[0035] The base 11 has a recess surrounded by a frame by the second top surface 11C. The recess defines a portion of the base 11 that is recessed below the second top surface 11C. The first top surface 11A is a part of the recess. The one or more inner surfaces 11E are a part of the recess. The second top surface 11C is located above the first top surface 11A.

[0036] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, one step portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0037] The or each step portion 11F is provided inside the inner frame of the second top surface 11C in top view. The or each step portion 11F is formed along a part or all of the inner side surface 11E in top view. In the base 11, the side surface 11H is an inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. The or each inner side surface 11E and the or each side surface 11H are perpendicular to the first top surface 11A. Here, the perpendicular allows a difference of ±3 degrees.

[0038] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions where their respective side surfaces 11H face each other. The first step portion 11F1 and the second step portion 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0039] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be members made of different materials. The base 11 may be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0040] The base 11M includes a first upper surface 11A. The frame 11N includes a second upper surface 11C. The frame 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame 11N includes one or more step portions 11F.

[0041] The lower surface of base 11M constitutes a part or the entire area of ​​lower surface 11B of base 11. When the lower surface of base 11M constitutes a part of the area of ​​lower surface 11B of base 11, the lower surface of frame 11N constitutes the remaining area of ​​lower surface 11B of the base.

[0042] The base 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more first wiring portions 12A1 disposed in the internal space of the package 10 and one or more second wiring portions 12A2 provided on the outer surface of the package 10.

[0043] The or each first wiring portion 12A1 is provided on the upper surface 11G of the step portion 11F. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the first step portion 11F1. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0044] The or each second wiring portion 12A2 is provided on the bottom surface 11B of the package 10. The or each second wiring portion 12A2 is provided on the bottom surface of the frame portion 11N. Note that the second wiring portion 12A2 may be provided on an outer surface of the package 10 different from the bottom surface 11B.

[0045] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the first step portion 11F1 when the base 11 is divided into two regions by a virtual line passing through the side surface 11H of the first step portion 11F1 and parallel to this side surface 11H.

[0046] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the second step portion 11F2 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the second step portion 11F2 and is parallel to this side surface 11H.

[0047] In the base 11, one or each of the first wiring portions 12A1 is electrically connected to the second wiring portion 12A2. One or more of the first wiring portions 12A1 are electrically connected to different second wiring portions 12A2.

[0048] The base 11 has a bonding pattern 13A. The bonding pattern 13A is provided on the second upper surface 11C. The bonding pattern 13A is provided in an annular shape. The bonding pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0049] The base 11 can be formed, for example, using ceramic as the main material. Examples of the ceramic that is the main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0050] Here, the main material refers to the material that occupies the largest proportion of the mass or volume of the target structure. Note that when the target structure is formed from one material, that material is the main material. In other words, when a material is the main material, it includes the possibility that the proportion of that material can be 100%.

[0051] The base 11 may be formed using a base member and a frame member formed using different main materials. The base member may be formed using, for example, a material having excellent heat dissipation properties, such as a metal or a metal-containing composite, graphite, or diamond, as the main material. Examples of metals that are the main material of the base member include copper, aluminum, and iron. Examples of metal-containing composites that are the main material of the base member include copper molybdenum and copper tungsten. The frame member may be formed using, for example, the ceramics listed above as the main material of the base 11 as the main material.

[0052] The wiring portion 12A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the wiring portion 12A include simple metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, and alloys containing these metals. The wiring portion 12A can be composed of, for example, one or more metal layers.

[0053] The bonding pattern 13A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the bonding pattern 13A include simple metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, and alloys containing these metals. The bonding pattern 13A can be formed, for example, by one or more metal layers.

[0054] The lid body 14 has an upper surface 14A and a lower surface 14B. The lid body 14 also has one or more side surfaces 14C. The lid body 14 is configured in a rectangular parallelepiped flat plate shape. The shape of the lid body 14 does not have to be a rectangular parallelepiped.

[0055] The outer edge shape of the upper surface 14A of the cover 14 is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 14A1, a second side 14A2, a third side 14A3, and a fourth side 14A4. The second side 14A2 is parallel to the first side 14A1. The third side 14A3 is perpendicular to the first side 14A1. The fourth side 14A4 is parallel to the third side 14A3. The first side 14A1 is the long side of this rectangle.

[0056] The outer edge shape of the lower surface 14B of the lid 14 is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 14B1, a second side 14B2, a third side 14B3, and a fourth side 14B4. The second side 14B2 is parallel to the first side 14B1. The third side 14B3 is perpendicular to the first side 14B1. The fourth side 14B4 is parallel to the third side 14B3. The first side 14B1 is the long side of this rectangle.

[0057] A first side 14A1 of the upper surface 14A and a first side 14B1 of the lower surface 14B form the upper and lower sides of a common side surface 14C. The outer edge shape of the upper surface 14A and the inner edge shape of the lower surface 14B are the same. Here, "the same shape" includes a difference within ±25 μm.

[0058] The lid 14 is bonded to the base 11. The lower surface 14B of the lid 14 is bonded to the second upper surface 11C of the base 11. The lid 14 is bonded to the bonding pattern 13A of the base 11. The lid 14 is bonded to the base 11 via an adhesive.

[0059] The lid 14 has a bonding pattern 14D. The bonding pattern 14D is provided on the lower surface 14B of the lid 14. The bonding pattern 14D has a rectangular ring shape. The bonding pattern 14D of the lid 14 and the bonding pattern 13A of the base 11 are bonded to the base 11 via an adhesive. For example, AuSn solder can be used as the adhesive.

[0060] The outer edge shape of the lower surface of the lid 14 is smaller than the outer frame of the second upper surface 11C of the base 11, and larger than the inner frame of the second upper surface 11C. The outer edge shape of the rectangular annular region of the bonding pattern 14D is smaller than the outer frame of the second upper surface 11C of the base 11, and larger than the inner frame of the second upper surface 11C. The inner edge shape of the rectangular annular region of the bonding pattern 14D is the same as or smaller than the inner frame of the second upper surface 11C.

[0061] The outer edge shape of the bonding pattern 14D is a rectangle. This rectangle has a first side 14D1, a second side 14D2, a third side 14D3, and a fourth side 14D4 as the sides of the outer edge. The second side 14D2 is parallel to the first side 14D1. The third side 14D3 is perpendicular to the first side 14D1. The fourth side 14D4 is parallel to the third side 14D3.

[0062] The first side 14D1 of the bonding pattern 14D is closer to the first side 14B1 of the lower surface 14B than the second side 14D2. The second side 14D2 of the bonding pattern 14D is closer to the second side 14B2 of the lower surface 14B than the first side 14D1. The third side 14D3 of the bonding pattern 14D is closer to the third side 14B3 of the lower surface 14B than the fourth side 14D4. The fourth side 14D4 of the bonding pattern 14D is closer to the fourth side 14B4 of the lower surface 14B than the third side 14D3.

[0063] The inner edge shape of the joint pattern 14D is a rectangle. This rectangle has a first side 14D5, a second side 14D6, a third side 14D7, and a fourth side 14D8 as the sides of the inner edge. The second side 14D6 is parallel to the first side 14D5. The third side 14D7 is perpendicular to the first side 14D5. The fourth side 14D8 is parallel to the third side 14D7.

[0064] The first side 14D5 of the bonding pattern 14D is closer to the first side 14B1 of the lower surface 14B than the second side 14D6. The second side 14D6 of the bonding pattern 14D is closer to the second side 14B2 of the lower surface 14B than the first side 14D5. The third side 14D7 of the bonding pattern 14D is closer to the third side 14B3 of the lower surface 14B than the fourth side 14D8. The fourth side 14D8 of the bonding pattern 14D is closer to the fourth side 14B4 of the lower surface 14B than the third side 14D7.

[0065] The distance from the first side 14D1 of the outer edge to the first side 14D5 of the inner edge of the bonding pattern 14D is the same as the distance from the second side 14D2 of the outer edge to the second side 14D6 of the inner edge. Here, "same" includes a difference of ±20 μm or less. In this specification, the term "distance" refers to the shortest distance unless otherwise specified.

[0066] The distance from the third side 14D3 of the outer edge to the third side 14D7 of the inner edge of the bonding pattern 14D is the same as the distance from the fourth side 14D4 of the outer edge to the fourth side 14D8 of the inner edge. Here, "the same" includes a difference of within ±20 μm.

[0067] The distance from the first side 14D1 of the outer edge to the first side 14D5 of the inner edge of the bonding pattern 14D is the same as the distance from the third side 14D3 of the outer edge to the third side 14D7 of the inner edge. Here, "the same" includes a difference of within ±20 μm.

[0068] In bottom view, a virtual line passing through the center of the first side 14B1 of the bottom surface 14B of the lid 14 and perpendicular to the first side 14B1 includes a first line segment and a second line segment overlapping the bonding pattern 14D. The first line segment and the second line segment have the same length. This allows a balance between the bonding force on the first side 14D1 side and the bonding force on the second side 14D2 side when bonding the lid 14 to the base 11, and a stable bonding process can be performed.

[0069] The outer edge shape of the bonding pattern 14D is smaller than the shape of the outer frame of the base 11. The bonding pattern 14D of the lid 14 is provided so as to match the inner frame rather than the outer frame of the base 11. This makes it easier to adjust the outer edge shape of the lid 14.

[0070] In bottom view, the distance from the rectangular annular region of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from this region to the second side 14B2 of the bottom surface 14B. In bottom view, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the bottom surface 14B. This allows for a bonding pattern 14D that can balance the bonding on the first side 14D1 side and the bonding on the second side 14D2 side in response to the asymmetry, even if there is asymmetry between the arrangement position of the first side 14D1 side and the arrangement position of the second side 14D2 side of the lid 14 relative to the base 11.

[0071] In bottom view, the distance from the rectangular annular region of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from this region to the third side 14B3 of the bottom surface 14B. In bottom view, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from the third side 14D3 of the outer edge of the bonding pattern 14D to the third side 14B3 of the bottom surface 14B.

[0072] In bottom view, the distance from the rectangular annular region of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from this region to the fourth side 14B4 of the bottom surface 14B. In bottom view, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the bottom surface 14B is greater than the distance from the fourth side 14D4 of the outer edge of the bonding pattern 14D to the fourth side 14B4 of the bottom surface 14B.

[0073] When viewed from the bottom, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is 300 μm or more and 800 μm or less. When viewed from the bottom, the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the lower surface 14B is more than 0 μm and 200 μm or less. When viewed from the bottom, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is 3 times or more and 10 times or less than the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the lower surface 14B.

[0074] The cover 14 has a buffer line pattern 14E. The buffer line pattern 14E is provided on the lower surface 14B of the cover 14. The buffer line pattern 14E has a buffer line 14E1 that is a straight line located at a predetermined distance from a first side 14D1 of the outer edge of the bonding pattern 14D. The buffer line pattern 14E is provided between the first side 14B1 of the lower surface 14B and the first side 14D1 of the outer edge of the bonding pattern 14D. This makes it possible to confirm that the first side 14B1, which is the outer edge of the lower surface 14B of the cover 14, is at least a predetermined distance away from the first side 14D1, which is the outer edge of the bonding pattern 14D.

[0075] By ensuring a predetermined distance based on the buffer line pattern 14E, it is possible to confirm that the necessary buffer is secured between the outer edge of the bonding pattern 14D and the outer edge of the underside 14B of the lid body 14 in order to secure an area for applying adhesive when bonding the lid body 14 and the optical member 70, thereby realizing a stable bonding process.

[0076] In the cover 14, the buffer line pattern 14E is not provided between the second side 14B2 of the lower surface 14B and the second side 14D2 of the outer edge of the bonding pattern 14D. In the bottom view, the distance from the second side 14B2 of the lower surface 14B to the second side 14D2 of the outer edge of the bonding pattern 14D is smaller than a predetermined distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the buffer line 14E1.

[0077] The lid 14 is joined to the base 11 such that a first side 14B1 of the lower surface 14B of the lid 14 is positioned closer to a first side 11C1 of the outer edge of the base 11 than a second side 14B2 of the lower surface 14B. The lid 14 is joined to the base 11 such that a second side 14B2 of the lower surface 14B of the lid 14 is positioned closer to a second side 11C2 of the outer edge of the base 11 than the first side 14B1 of the lower surface 14B.

[0078] The lid 14 is joined to the base 11 such that, in top view, the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the bottom surface 14B of the lid 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the bottom surface 14B of the lid 14. By employing a lid 14 that satisfies this requirement, the size of the lid 14 can be reduced, improving production efficiency. Furthermore, the reduction in size of the lid 14 also reduces the weight of the lid 14, and the weight of the light-emitting device 1 can be reduced.

[0079] The difference between the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the lower surface 14B of the lid 14 and the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the lower surface 14B of the lid 14 is 300 μm or more. Alternatively, this difference can be 500 μm or more. Alternatively, this difference can be 600 μm or more. The greater this difference, the more it contributes to the miniaturization of the lid 14.

[0080] In top view, the outer edge of the lower surface 14B of the lid 14 is on the second upper surface 11C of the base 11. As a result, by joining the lid 14 to the base 11, a closed space is formed inside the package 10. It can be said that the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the lower surface 14B of the lid 14 is smaller than the distance from the second side 11C2 of the outer edge of the base 11 to the second side 11C6 of the inner edge of the base 11.

[0081] The lid 14 is joined to the base 11 such that, in a top view, the distance from a third side 11C3 of the outer edge of the base 11 to a third side 14B3 of the bottom surface 14B of the lid 14 is greater than the distance from a first side 11C1 of the outer edge of the base 11 to a first side 14B1 of the bottom surface 14B of the lid 14. By employing a lid 14 that satisfies this, the size of the lid 14 can be reduced.

[0082] The lid 14 is joined to the base 11 such that, in a top view, the distance from a fourth side 11C4 of the outer edge of the base 11 to a fourth side 14B4 of the bottom surface 14B of the lid 14 is greater than the distance from a first side 11C1 of the outer edge of the base 11 to a first side 14B1 of the bottom surface 14B of the lid 14. By employing a lid 14 that satisfies this, the size of the lid 14 can be reduced.

[0083] The lid body 14 has a translucency that transmits light. Here, translucency means that the transmittance of light incident on the lid body 14 is 80% or more. The lid body 14 may have a non-translucent region (a region that does not have translucency) in part.

[0084] The lid 14 can be formed, for example, using glass as a main material. The lid 14 can also be formed, for example, using sapphire as a main material. The lid 14 can be formed by providing a bonding pattern 14D and a buffer line pattern 14E on a light-transmitting member formed using a main material.

[0085] The bonding pattern 14D can be formed, for example, using a metal material as the main material. Examples of the metal material that is the main material of the bonding pattern 13A include simple metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 14D can be composed of, for example, one or more metal layers. The buffer line pattern 14E can be formed using the same material as the bonding pattern 14D.

[0086] (Light emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has long sides and short sides. The outer shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has long sides and short sides. Note that the shape of the upper surface 21A and the outer shape of the light-emitting element 20 when viewed from above are not limited to this.

[0087] The light-emitting element 20 has a light emitting surface 22 that emits light. For example, the side surface 21C can be the light emitting surface 22. The side surface 21C that becomes the light emitting surface 22 intersects with a short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light emitting surface 22. The light-emitting element 20 has one or more light emitting surfaces 22.

[0088] For example, a light emitting element that emits blue light can be used as the light emitting element 20. Also, for example, a light emitting element that emits green light can be used as the light emitting element 20. Also, for example, a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of other colors or wavelengths may also be used as the light emitting element 20.

[0089] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0090] The light emitting element 20 that emits blue light or the light emitting element 20 that emits green light may be a light emitting element containing a nitride semiconductor. For example, a GaN-based semiconductor such as GaN, InGaN, or AlGaN may be used as the nitride semiconductor. The light emitting element 20 that emits red light may be a light emitting element containing an InAlGaP-based, GaInP-based, or GaAs-based semiconductor such as GaAs or AlGaAs.

[0091] For example, a semiconductor laser element can be used as the light emitting element 20. A single-emitter semiconductor laser element having one emitter can be used as the light emitting element 20. A multi-emitter semiconductor laser element having multiple emitters can be used as the light emitting element 20. Note that the light emitting element 20 is not limited to a semiconductor laser element, and a light emitting diode or the like may also be used.

[0092] Here, a semiconductor laser element, which is an example of the light emitting element 20, will be described.

[0093] The semiconductor laser element emits directional laser light. Diverging light with a spread is emitted from the light emission surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission surface 22. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emission surface of the semiconductor laser element.

[0094] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the peak intensity value is 1 / e 2 The light having an intensity equal to or greater than this will be referred to as the main portion of the light.

[0095] The shape of the FFP of the light emitted from the semiconductor laser element is an ellipse in which the stacking direction is longer than the direction perpendicular to the stacking direction on a plane parallel to the light emitting surface 22. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0096] Based on the light intensity distribution of FFP, the peak light intensity is 1 / e 2 The angle at which the light of the semiconductor laser element spreads is defined as the spread angle of the light. Here, the spread angle of the light is the angle between the light of the peak light intensity (light passing through the optical axis) and 1 / e of the peak light intensity. 2 The spread angle of light is expressed as the angle between the light with a peak light intensity of 1 / e 2 In addition to the light intensity at half the peak light intensity, the light intensity may also be calculated from the light intensity at half the peak light intensity. 2This refers to the spread angle of light at a light intensity of

[0097] The divergence angle of the light emitted from the semiconductor laser element in the fast axis direction can be 15 degrees or more and less than 40 degrees. The divergence angle of this light in the slow axis direction can be more than 0 degrees and less than 10 degrees. The divergence angle of this light in the fast axis direction is larger than the divergence angle of the light in the slow axis direction.

[0098] For example, the spread angle in the fast axis direction of blue light emitted from the semiconductor laser element can be 15 degrees or more and less than 30 degrees, and the spread angle in the slow axis direction can be more than 0 degrees and less than 10 degrees. For example, the spread angle in the fast axis direction of green light emitted from the semiconductor laser element can be 15 degrees or more and less than 30 degrees, and the spread angle in the slow axis direction can be more than 0 degrees and less than 10 degrees. For example, the spread angle in the fast axis direction of red light emitted from the semiconductor laser element can be 20 degrees or more and less than 40 degrees, and the spread angle in the slow axis direction can be more than 0 degrees and less than 10 degrees.

[0099] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be said to be a mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A can have short sides and long sides. It should be noted that the shape of the upper surface 31A does not have to be rectangular.

[0100] The outer shape of the submount 30 when viewed from above is rectangular. This rectangle of the submount 30 may have a short side and a long side. It should be noted that the outer shape of the submount 30 when viewed from above does not have to be rectangular. The submount 30 may have an outer shape in which the length in one direction (hereinafter, this direction will be referred to as the short side direction of the submount 30) when viewed from above is smaller than the length in the direction perpendicular to the short side direction (hereinafter, this direction will be referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0101] The submount 30 may be configured to include a substrate 32A and an upper metal member 32B. The submount 30 may further be configured to include a lower metal member 32C. The upper metal member 32B is provided on the upper surface side of the substrate 32A. The lower metal member 32C is provided on the lower surface side of the substrate 32A. The submount 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal member 32B.

[0102] The substrate 32A has insulating properties. The substrate 32A is made of, for example, silicon nitride, aluminum nitride, or silicon carbide. It is preferable to select ceramic, which has relatively good heat dissipation properties (high thermal conductivity), as the main material of the substrate 32A.

[0103] The upper metal member 32B is mainly made of a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers made of different metals as main materials.

[0104] The lower metal member 32C is mainly made of a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers made of different metals as main materials.

[0105] The wiring layer 33 can be formed using a metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0106] (Reflective member 40) The reflecting member 40 has a lower surface 41A and a light reflecting surface 41B that reflects light. The light reflecting surface 41B is inclined with respect to the lower surface 41A. A straight line connecting the lower end and the upper end of the light reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light reflecting surface 41B is inclined with respect to the lower surface 41A is referred to as the inclination angle of the light reflecting surface 41B.

[0107] The light reflecting surface 41B is a flat surface. The light reflecting surface 41B may be a curved surface. The inclination angle of the light reflecting surface 41B is 45 degrees. The inclination angle of the light reflecting surface 41B does not have to be 45 degrees.

[0108] The main material of the reflective member 40 may be glass, metal, or the like. It is preferable to use a heat-resistant material as the main material of the reflective member 40. The main material may be, for example, glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 may also be formed using Si as the main material.

[0109] If the main material is a reflective material such as Al, the light reflecting surface 41B can be formed from the main material. Instead of forming the light reflecting surface 41B from the main material, the outline of the reflecting member 40 may be formed from the main material, and the light reflecting surface 41B may be formed on the surface of the outline. In this case, the light reflecting surface 41B may be formed from a metal layer such as Ag or Al, or a Ta 2 O 5 / SiO 2 , TiO 2 / SiO 2 , Nb 2 O 5 / SiO 2 The dielectric multilayer film may be formed using the above dielectric multilayer films.

[0110] The light reflecting surface 41B has a reflectance of 90% or more for the peak wavelength of light irradiated onto the light reflecting surface 41B. This reflectance may be 95% or more. This reflectance can also be 99% or more. The light reflectance is 100% or less or less than 100%.

[0111] (Protection element 50) The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The shape of the protection element 50 is a rectangular parallelepiped. Note that the shape of the protection element 50 does not have to be a rectangular parallelepiped.

[0112] The protective element 50 is intended to prevent an excessive current from flowing through a specific element (such as a semiconductor laser element) and causing the element to be destroyed. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0113] (Wiring 60) The wiring 60 is a linear conductive material having joints at both ends. The joints at both ends become joints with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0114] (Optical member 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical member 70 provides an optical effect to light incident on the optical member 70. Examples of the optical effects provided to light by the optical member 70 include light collection, collimation, diffusion, polarization, diffraction, wave combining, light guiding, reflection, and wavelength conversion.

[0115] The optical member 70 has an optically active surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optically active surface. Alternatively, the optically active surface may be located at a position different from the upper surface 71A, the lower surface 71B, or the side surface 71C. For example, the optically active surface may be formed inside the optical member 70, rather than on the surface thereof.

[0116] The optical member 70 may have one or more lens surfaces 71D. The lens surface 71D is an optically active surface of the optical member 70. The optical member 70 having the lens surface 71D may be called a lens member. The optical member 70 provides the optical effect of focusing, diffusing, or collimating the light that passes through the lens surface 71D and is emitted from the optical member 70. For example, the optical member 70 is a collimating lens that converts the light that is incident on the optical member 70 into collimated light and emits it.

[0117] One or each lens surface 71D is provided on the upper surface 71A side. Alternatively, lens surface 71D may be provided on the lower surface 71B side. Upper surface 71A and lower surface 71B are flat surfaces. One or each lens surface 71D intersects with upper surface 71A. In top view, one or each lens surface 71D is surrounded by upper surface 71A.

[0118] The optical member 70 has a rectangular outer shape when viewed from above. The outer shape of the optical member 70 does not have to be rectangular when viewed from above. The lower surface 71B is a flat surface. No lens surface 71D is formed on the lower surface 71B side of the optical member 70.

[0119] The outer edge shape of the lower surface 71B of the optical member 70 is rectangular. This rectangle may have a long side and a short side. This rectangle has a first side 71B1, a second side 71B2, a third side 71B3, and a fourth side 71B4. The second side 71B2 is parallel to the first side 71B1. The third side 71B3 is perpendicular to the first side 71B1. The fourth side 71B4 is parallel to the third side 71B3. The first side 71B1 is the long side of this rectangle.

[0120] In the optical member 70, in a top view, the distance from a first side 71B1 of the optical member 70 to one or more lens surfaces 71D is the same as the distance from a second side 71B2 of the optical member 70 to one or more lens surfaces 71D. Here, "same" includes a difference within ±60 μm.

[0121] In the optical member 70, in a top view, the distance from the third side 71B3 of the optical member 70 to one or more lens surfaces 71D is the same as the distance from the fourth side 71B4 of the optical member 70 to one or more lens surfaces 71D. Here, "same" includes a difference within ±60 μm.

[0122] In optical member 70, in a top view, the maximum width of one or more lens surfaces 71D in a direction perpendicular to first side 71B1 of optical member 70 is 65% or more of the maximum width of optical member 70. Alternatively, the former maximum width is 70% or more of the latter maximum width. Or, alternatively, the former maximum width is 75% or more of the latter maximum width. The greater the proportion of the width occupied by lens surfaces 71D in optical member 70, the smaller the proportion of the blank space other than the lenses, which contributes to making optical member 70 smaller or lighter.

[0123] In optical member 70, a portion overlapping with lens surface 71D in top view is defined as lens portion 72A. In optical member 70, a portion overlapping with top surface 71A in top view is defined as non-lens portion 72B. Lens portion 72A overlaps with one or more lens surfaces 71D in top view. Non-lens portion 72B does not overlap with one or more lens surfaces 71D in top view. Bottom surface 71B has a region that constitutes the bottom surface of one or each lens portion 72A, and a region that constitutes the bottom surface of non-lens portion 72B.

[0124] The optical member 70 may have a plurality of lens surfaces 71D formed in a line in one direction. The direction in which the plurality of lens surfaces 71D are arranged in a top view is referred to as the lens connection direction. In the illustrated optical member 70, the connection direction is the same as the X direction.

[0125] The lens surfaces 71D are formed such that the vertices of the lens surfaces 71D are aligned in a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that "parallel" here includes a difference of ±5 degrees or less.

[0126] The curvature of two or more lens surfaces 71D, which may be part or all of the multiple lens surfaces 71D, may be the same. All of the multiple lens surfaces 71D may have the same curvature.

[0127] The optical member 70 is translucent. The optical member 70 has a transmittance of 80% or more for the peak wavelength of light incident on the optical member 70. The optical member 70 may have a region having translucency and a region not having translucency (hereinafter referred to as a non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical member 70 is 50% or less. The optical member 70 can be formed using glass such as BK7.

[0128] (Joint member 80) The joining member 80 is formed by hardening an adhesive. The adhesive is used to join a plurality of components. For example, an ultraviolet curing resin adhesive can be used as the adhesive. Also, for example, a thermosetting resin adhesive can be used as the adhesive. An epoxy resin or acrylate resin adhesive can be used as the ultraviolet curing resin adhesive. An epoxy resin or silicone resin adhesive can be used as the thermosetting resin adhesive.

[0129] Next, the light emitting device 1 will be described.

[0130] (Light emitting device 1) In the light emitting device 1, one or more light emitting elements 20 are arranged in the internal space of the package 10. The one or more light emitting elements 20 are arranged on a first upper surface 11A of the base 11. The or each light emitting element 20 is arranged on the first upper surface 11A via a submount 30.

[0131] The or each light emitting element 20 emits light in a predetermined direction from the light exit surface 22. Light travels along an optical axis in this predetermined direction from the light exit surface 22 of the or each light emitting element 20. This predetermined direction is, for example, the positive Y direction in the light emitting device 1 shown in the figure.

[0132] A first side 11C5 of the inner edge of the base 11 is located away from the light-emitting element 20 in the positive Y direction. A second side 11C6 of the inner edge of the base 11 is located away from the light-emitting element 20 in the negative Y direction. A third side 11C7 of the inner edge of the base 11 is located away from the light-emitting element 20 in the negative X direction. A fourth side 11C8 of the inner edge of the base 11 is located away from the light-emitting element 20 in the positive X direction.

[0133] In the illustrated light emitting device 1, a first side 11C1 of the outer edge of the base 11 is parallel to the X direction. A first side 11C5 of the inner edge of the base 11 is parallel to the X direction. A third side 11C3 of the outer edge of the base 11 is parallel to the Y direction. A third side 11C7 of the inner edge of the base 11 is parallel to the Y direction. Note that the "parallel" here includes a difference of ±3 degrees.

[0134] In the illustrated light emitting device 1, a first side 14A1 of an upper surface 14A of the lid 14 is parallel to the X direction. A first side 14B1 of a lower surface 14B of the lid 14 is parallel to the X direction. A third side 14A3 of the upper surface 14A of the lid 14 is parallel to the Y direction. A third side 14B3 of the lower surface 14B of the lid 14 is parallel to the Y direction. Note that the "parallel" here includes a difference of ±3 degrees.

[0135] In the illustrated light emitting device 1, a first side 11D1 of the outer edge of the bonding pattern 14D is parallel to the X direction. A first side 11D5 of the inner edge of the bonding pattern 14D is parallel to the X direction. A third side 11D3 of the outer edge of the bonding pattern 14D is parallel to the Y direction. A third side 11D7 of the inner edge of the bonding pattern 14D is parallel to the Y direction. The buffer line 14E1 is parallel to the X direction. Note that the "parallel" here includes a difference of ±3 degrees.

[0136] The light emitting device 1 may include a plurality of light emitting elements 20. The plurality of light emitting elements 20 are arranged side by side in one direction. The plurality of light emitting elements 20 are arranged side by side in a second direction that is a direction perpendicular to the first direction in a top view. Each of the plurality of light emitting elements 20 emits light in the first direction from a light emitting surface 22. The plurality of light emitting elements 20 are arranged at equal intervals in the second direction.

[0137] In the light emitting device 1, one or more submounts 30 are disposed in the internal space of the package 10. The one or more submounts 30 are disposed on the first upper surface 11A of the base 11. The width of the submount 30 in the first direction is larger than the width in the second direction.

[0138] The light emitting device 1 may include a plurality of submounts 30. In the light emitting device 1, one submount 30 corresponds to one light emitting element 20. The plurality of submounts 30 are arranged side by side in the second direction.

[0139] In the light emitting device 1, one or more reflective members 40 are disposed in the internal space of the package 10. The one or more reflective members 40 are disposed on a first upper surface 11A of the base 11. The one or more reflective members 40 are disposed at positions spaced apart in the first direction from the one or more light emitting elements 20. When viewed from above, the one or more reflective members 40 are disposed between the one or more light emitting elements 20 and a first side 11C5 of the inner edge of the base 11.

[0140] The one or more reflecting members 40 reflect light emitted from the one or more light-emitting elements 20. The one or each reflecting member 40 reflects 90% or more of the light from the light-emitting elements 20 that is irradiated onto the light reflecting surface 41B. Light traveling in the first direction from the light emitting surface 22 of the light-emitting element 20 is reflected upward by the light reflecting surface 41B.

[0141] The light emitting device 1 may include a plurality of reflective members 40. In the light emitting device 1, one reflective member 40 corresponds to one light emitting element 20. The plurality of reflective members 40 are arranged side by side in the second direction.

[0142] In the light emitting device 1, one or more protective elements 50 are arranged in the internal space of the package 10. The one or more protective elements 50 are arranged on a first upper surface 11A of the base 11. The one or each protective element 50 is arranged on the first upper surface 11A via a submount 30. The one or each protective element 50 protects the light emitting element 20.

[0143] In one or each submount 30, a light emitting element 20 and a protective element 50 are mounted on an upper surface 31A of the submount 30. The light emitting element 20 is disposed on the wiring layer 33 of the submount 30. The protective element 50 is disposed on the wiring layer 33 of the submount 30. The protective element 50 may be disposed on the same wiring layer 33 as the wiring layer 33 on which the light emitting element 20 is disposed. In other words, one wiring layer 33 may be provided with a region in which the light emitting element 20 is disposed and a region in which the protective element 50 is disposed.

[0144] In the light emitting device 1, one or more light emitting elements 20 are provided in the internal space of the package 10. The multiple wirings 60 include wirings 60 joined to the first wiring portion 12A1. The multiple wirings 60 include wirings 60 joined to the first wiring portion 12A1 provided on the upper surface 11G of the first step portion 11F1, and wirings 60 joined to the first wiring portion 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0145] The multiple wirings 60 included in the light emitting device 1 include two or more wirings 60 provided to electrically connect one or more light emitting elements 20 to the package 10. In this way, the one or more light emitting elements 20 are electrically connected to the package 10.

[0146] The multiple wirings 60 included in the light emitting device 1 include two or more wirings 60 provided to electrically connect one or more protective elements 50 to the package 10. In this way, the one or more protective elements 50 are electrically connected to the package 10.

[0147] In the light emitting device 1, the optical member 70 is fixed to the package 10. The optical member 70 is bonded to the lid body 14. The bottom surface 71B of the optical member 70 is bonded to the top surface 14A of the lid body 14. The optical member 70 is bonded to the lid body 14 via an adhesive. This adhesive is interposed between the top surface 14A of the lid body 14 and the bottom surface 71B of the optical member 70. The adhesive hardens to form a bonding member 80. One or more bonding members 80 bond the lid body 14 and the optical member 70.

[0148] The light emitted from the upper surface of the lid 14 is incident on the optical member 70. The light emitted from the upper surface of the lid 14 is incident on the optical action surface 71D and is given an optical action. The light to which the optical action has been given is emitted from the optical member 70.

[0149] Light emitted from one or more light-emitting elements 20 passes through one or more lens surfaces 71D. By passing through one or more lens surfaces 71D, for example, collimated light is emitted from the optical member 70. The light emitted from the optical member 70 can be said to be light emitted from the light-emitting device 1.

[0150] The optical member 70 is bonded to the base 11 such that a first side 71B1 of the lower surface 71B is located closer to a first side 11C1 of the outer edge of the base 11 than a second side 71B2 of the lower surface 71B. The optical member 70 is bonded to the base 11 such that a second side 71B2 of the lower surface 71B is located closer to a second side 11C2 of the outer edge of the base 11 than the first side 71B1 of the lower surface 71B.

[0151] In the illustrated light emitting device 1, a first side 71B1 of the optical member 70 is parallel to the X direction. A third side 71B3 of the optical member 70 is parallel to the Y direction. Note that the term "parallel" here includes a difference of ±3 degrees.

[0152] One or more bonding members 80 are provided in an area including the vicinity of the four corners of the rectangular outer edge of the lower surface 71B of the optical member 70 in a top view. In this way, adhesive is provided mainly to the non-lens portion 72B, and therefore, the bonding members 80 are prevented from interfering with light passing through the lens surface 71D.

[0153] It can be said that the one or more bonding members 80 are provided on the underside 71B of the optical member 70 in a first region R1 including the vicinity of a first angle E1, which is the corner where the first side 71B1 and the third side 71B3 intersect, a second region R2 including the vicinity of a second angle E2, which is the corner where the second side 71B2 and the third side 71B3 intersect, a third region R3 including the vicinity of a third angle E3, which is the corner where the first side 71B1 and the fourth side 71B4 intersect, and a fourth region R4 including the vicinity of a fourth angle E4, which is the corner where the second side 71B2 and the fourth side 71B4 intersect.

[0154] Here, the "region including the vicinity of the corner" does not necessarily include the corner. In the illustrated light emitting device 1, it may happen that one or more of the bonding members 80 do not overlap with the first corner E1, the second corner E2, the third corner E3, and the fourth corner E4. Alternatively, it may happen that one or more of the bonding members 80 overlap with some of the first corner E1, the second corner E2, the third corner E3, and the fourth corner E4.

[0155] In addition, when the corners of the lower surface 71B of the optical member 70 are processed so that the sides do not directly intersect, the point where the extension lines passing through the sides intersect is defined as the corner, and the area including the vicinity of this point is identified as the "area including the vicinity of the corner."

[0156] Here, the "vicinity of the corner" on the lower surface 71B of the optical member 70 can be defined as a region of a portion of a circular region having a center at the corner and a radius equal to the maximum length that does not overlap with one or more lens surfaces 71D in a top view, the portion overlapping with the lower surface 71B. Note that the interpretation of the "vicinity of the corner" is not limited to this definition. For example, the "vicinity of the corner" may be defined as a region of a portion of a circular region having a radius equal to 1 / 2 of the maximum length, the portion overlapping with the lower surface 71B. The "vicinity of the corner" may also be defined based on a radius that is even smaller than 1 / 2 of the maximum length.

[0157] The one or more bonding members 80 have a first bonding portion provided in the first region R1, a second bonding portion provided in the second region R2, a third bonding portion provided in the third region R3, and a fourth bonding portion provided in the fourth region R4. In these bonding portions, the bonding members 80 forming each bonding portion may be spaced apart from each other.

[0158] The one or more joining members 80 include a first joining member 81 including a first joining portion. The one or more joining members 80 include a second joining member 82 including a second joining portion. The one or more joining members 80 include a third joining member 83 including a third joining portion. The one or more joining members 80 include a fourth joining member 84 including a fourth joining portion.

[0159] The first bonding member 81, the second bonding member 82, the third bonding member 83, and the fourth bonding member 84 can each be arranged to extend outside the first region R1, the second region R2, the third region R3, and the fourth region R4 when viewed from above.

[0160] In top view, the first bonding member 81 may overlap a portion of the lens surface 71D. In top view, the second bonding member 82 may overlap a portion of the lens surface 71D. In top view, the third bonding member 83 may overlap a portion of the lens surface 71D. In top view, the fourth bonding member 84 may overlap a portion of the lens surface 71D. In top view, the first bonding member 81, the second bonding member 82, the third bonding member 83, and the fourth bonding member 84 each overlap only a portion of one lens surface 71D.

[0161] The lens surface 71D overlapping with the first bonding member 81 in top view and the lens surface 71D overlapping with the second bonding member 82 in top view are the same lens surface 71D. The lens surface 71D overlapping with the third bonding member 83 in top view and the lens surface 71D overlapping with the fourth bonding member 84 in top view are the same lens surface 71D. The lens surface 71D overlapping with the first bonding member 81 in top view and the lens surface 71D overlapping with the third bonding member 83 in top view can be different lens surfaces 71D.

[0162] In a top view, the vertex of one or each lens surface 71D is located closer to the first side 11C1 than to the second side 11C2 of the outer edge of the base 11. In other words, in a top view, in one or each lens surface 71D, the distance from the first side 11C1 of the outer edge of the base 11 to the vertex of the lens surface 71D is smaller than the distance from the second side 11C2 of the outer edge of the base 11 to the vertex of the lens surface 71D. In this way, the lens portion 72A of the optical member 70 is disposed closer to the first side 11C1 than to the second side 11C2 of the base 11.

[0163] The first joint member 81 has a first end point EP11 which is an end point on the first side 14A1 side and a second end point EP12 which is an end point on the third side 14A3 side. The first end point EP11 is on the first side 14A1 of the cover 14 in the area where the cover 14 and the first joint member 81 overlap in a top view, and is the point farthest from the first corner E1. The second end point EP12 is on the third side 14A3 of the cover 14 in the area where the cover 14 and the first joint member 81 overlap in a top view, and is the point farthest from the first corner E1.

[0164] In top view, the distance from the second end point EP12 to the one or more lens surfaces 71D is shorter than the distance from the first end point EP11 to the one or more lens surfaces 71D. By making the cover 14 smaller, the first bonding member 81 can have such a bonding form.

[0165] The third joint member 83 has a first end point EP31 which is an end point on the first side 14A1 side and a second end point EP32 which is an end point on the fourth side 14A4 side. The first end point EP31 is on the first side 14A1 of the cover 14 in the area where the cover 14 and the third joint member 83 overlap in a top view, and is the farthest point from the third angle E3. The second end point EP32 is on the fourth side 14A4 of the cover 14 in the area where the cover 14 and the third joint member 83 overlap in a top view, and is the farthest point from the third angle E3.

[0166] In top view, the distance from the second end point EP32 to the one or more lens surfaces 71D is shorter than the distance from the first end point EP31 to the one or more lens surfaces 71D. By making the cover 14 smaller, the third bonding member 83 can have such a bonding form.

[0167] The second joint member 82 has a first end point EP21 and a second end point EP22, which are end points on the third side 14A3 side. The first end point EP21 is on the third side 14A3 of the cover 14 in the area where the cover 14 and the second joint member 82 overlap in a top view, and is the point farthest from the second corner E2. The second end point EP22 is on the third side 14A3 of the cover 14 in the area where the cover 14 and the second joint member 82 overlap in a top view, and is the point closest to the second corner E2. The area where the cover 14 and the second joint member 82 overlap does not overlap with the second side 14A2 of the cover 14 in a top view.

[0168] The fourth joint member 84 has a first end point EP41 and a second end point EP42, which are end points on the fourth side 14A4 side. The first end point EP41 is on the fourth side 14A4 of the cover 14 in the area where the cover 14 and the fourth joint member 84 overlap in a top view, and is the point farthest from the fourth corner E4. The second end point EP42 is on the fourth side 14A4 of the cover 14 in the area where the cover 14 and the fourth joint member 84 overlap in a top view, and is the point closest to the fourth corner E4. The area where the cover 14 and the fourth joint member 84 overlap does not overlap with the second side 14A2 of the cover 14 in a top view.

[0169] In top view, the width from the first side 71B1 to the second side 71B2 of the optical member 70 is smaller than the width from the first side 11C1 to the second side 11C2 of the outer edge of the base 11. In top view, the width from the first side 71B1 to the second side 71B2 of the optical member 70 is smaller than the width from the first side 14A1 to the second side 14A2 of the upper surface 14A of the lid 14.

[0170] In a top view, the width from the third side 71B3 to the fourth side 71B4 of the optical member 70 is smaller than the width from the third side 11C3 to the fourth side 11C4 of the outer edge of the base 11. In a top view, the width from the third side 71B3 to the fourth side 71B4 of the optical member 70 is larger than the width from the third side 14A3 to the fourth side 14A4 of the upper surface 14A of the lid 14.

[0171] In top view, one or more bonding members 80 are provided in a region sandwiched between a virtual line parallel to and passing through a first side 11C1 of the outer edge of the base 11, and a virtual line parallel to and passing through a second side 11C6 of the inner edge of the base 11. In addition, in top view, one or more bonding members 80 are not provided in a region sandwiched between a virtual line parallel to and passing through a second side 11C2 of the outer edge of the base 11, and a virtual line parallel to and passing through the second side 11C2 of the inner edge of the base 11.

[0172] In top view, the ratio of the area of ​​the first bonding member 81 provided in the region sandwiched between a virtual line parallel to the third side 71B3 of the optical member 70 and passing through the third side 71B3 and a virtual line parallel to the third side 11C7 of the inner edge of the base 11 and passing through the third side 11C7 to the area where the first bonding member 81 is provided is 50% or more and 100% or less. In addition, this ratio is preferably 50% or more and 80% or less. If this ratio is small, the width of the optical member 70 in the direction parallel to the second side 71B2 tends to increase, and if this ratio is large, the width of the optical member 70 in the direction parallel to the first side 71B1 tends to increase, so it is preferable to adjust the first bonding member 81 to an appropriate ratio.

[0173] In top view, the ratio of the area of ​​the third bonding member 83 provided in a region sandwiched between a virtual line parallel to and passing through the fourth side 71B4 of the optical member 70 and a virtual line parallel to and passing through the fourth side 11C8 of the inner edge of the base 11 is 50% or more and 100% or less to the area where the third bonding member 83 is provided. Moreover, this ratio is preferably 50% or more and 80% or less.

[0174] It is desirable that the one or more bonding members 80 do not obstruct the optical path of light passing through the lens portion 72A, so it is preferable that the area where the one or more bonding members 80 overlap with the lens portion 72A in the top view is small. Since the distance from the end point EP12 to the one or more lens surfaces 71D in the top view is smaller than the distance from the end point EP11 to the one or more lens surfaces 71D, by increasing the width from the third side 71B3 to the fourth side 71B4 of the optical member 70, the application area of ​​the adhesive on the lower surface 71B of the optical member 70 can be increased, and the bonding balance is improved.

[0175] In top view, the width from the first side 71B1 to the second side 71B2 of the optical member 70 is smaller than the width from the first side 14B1 to the second side 14B2 of the lower surface 14B of the lid 14. In top view, the width from the third side 71B3 to the fourth side 71B4 of the optical member 70 is larger than the width from the third side 14B3 to the fourth side 14B4 of the lower surface 14B of the lid 14.

[0176] The optical element 70 is fixed to the package 10 such that, in a top view, a first side 71B1 of the optical element 70 is located between a first side 11C1 of the outer edge of the base 11 and a first side 11C5 of the inner edge, and a second side 71B2 of the optical element 70 is located between a second side 11C2 of the outer edge of the base 11 and a second side 11C6 of the inner edge.

[0177] The optical element 70 is fixed to the package 10 such that, in a top view, the third side 71B3 of the optical element 70 is located between the third side 11C3 of the outer edge of the base 11 and the third side 11C7 of the inner edge, and the fourth side 71B4 of the optical element 70 is located between the fourth side 11C4 of the outer edge of the base 11 and the fourth side 11C8 of the inner edge.

[0178] In a top view, the outer edge of the optical member 70 is contained inside the outer edge of the outer frame of the base 11. By preventing the side surface 71C of the optical member 70 from protruding laterally from the package 10, it is possible to make it difficult for the optical member 70 to peel off from the package 10 due to an external force.

[0179] The optical member 70 is fixed to the package 10 such that, in a top view, a first side 71B1 of the optical member 70 is located between the first side 14A1 of the lid 14 and the first side 11C5 of the inner edge of the base 11. The optical member 70 is fixed to the package 10 such that, in a top view, a first side 71B1 of the optical member 70 is located between the first side 14B1 of the lid 14 and the first side 11C5 of the inner edge of the base 11. This ensures an area for adhesive to be applied to the first side 71B1, and achieves stable bonding of the optical member 70.

[0180] The optical member 70 is fixed to the package 10 such that, in a top view, the second side 71B2 of the optical member 70 is located between the second side 14A2 of the lid 14 and the second side 11C6 of the inner edge of the base 11. The optical member 70 is fixed to the package 10 such that, in a top view, the second side 71B2 of the optical member 70 is located between the first side 14B1 of the lid 14 and the first side 11C5 of the inner edge of the base 11.

[0181] The optical element 70 is fixed to the package 10 such that, in a top view, the third side 71B3 of the optical element 70 is located between the third side 11C3 of the outer edge of the base 11 and the third side 11C7 of the inner edge, and the fourth side 71B4 of the optical element 70 is located between the fourth side 11C4 of the outer edge of the base 11 and the fourth side 11C8 of the inner edge.

[0182] The optical member 70 is fixed to the package 10 such that, in a top view, the third side 71B3 of the optical member 70 is located between the third side 14A3 of the lid 14 and the third side 11C3 of the outer edge of the base 11. The optical member 70 is fixed to the package 10 such that, in a top view, the third side 71B3 of the optical member 70 is located between the third side 14B3 of the lid 14 and the third side 11C3 of the outer edge of the base 11.

[0183] The optical member 70 is fixed to the package 10 such that, in a top view, the fourth side 71B4 of the optical member 70 is located between the fourth side 14A4 of the lid 14 and the fourth side 11C4 of the outer edge of the base 11. The optical member 70 is fixed to the package 10 such that, in a top view, the fourth side 71B4 of the optical member 70 is located between the fourth side 14B4 of the lid 14 and the fourth side 11C4 of the outer edge of the base 11.

[0184] The optical member 70 is joined to the lid body 14 such that, in a top view, the distance from the first side 14A1 of the upper surface 14A of the lid body 14 to the one or more lens surfaces 71D is smaller than the distance from the second side 14A2 of the upper surface 14A of the lid body 14 to the one or more lens surfaces 71D. In this manner, the optical member 70 is disposed closer to the first side 14A1 than to the second side 14A2 of the upper surface 14A of the lid body 14.

[0185] The optical member 70 is joined to the lid body 14 such that, in a top view, the distance from the first side 14B1 of the lower surface 14B of the lid body 14 to the one or more lens surfaces 71D is smaller than the distance from the second side 14B2 of the lower surface 14B of the lid body 14 to the one or more lens surfaces 71D. In this manner, the optical member 70 is disposed closer to the first side 14B1 than to the second side 14B2 of the lower surface 14B of the lid body 14. By disposing it in this manner, in a small light emitting device 1, for example, the lens surface 71D can be disposed in correspondence with the position of the reflecting member 40.

[0186] When viewed from above, the second side 71B2 of the optical member 70 is not located between a virtual line parallel to the second side 11C2 of the outer edge of the base 11 and passing through the second side 11C2, and a virtual line parallel to the second side 11C6 of the inner edge of the base 11 and passing through the second side 11C6, but is located between a virtual line parallel to the second side 11C6 of the inner edge of the base 11 and passing through the second side 11C6, and a virtual line parallel to the first side 11C5 of the inner edge of the base 11 and passing through the first side 11C5.

[0187] Although the embodiment of the present invention has been described above, the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in the embodiment. The present invention can be applied without necessarily having all the components. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, the freedom of design by those skilled in the art, such as substitution, omission, modification of shape, and change of material, is recognized for those some components, and the invention described in the claims is specified to be applied.

[0188] Through the contents described so far in this specification, the following technical matters are disclosed. (Section 1) A base body having a base portion having a first upper surface and a frame portion having a second upper surface located above the first upper surface and surrounding the first upper surface in a top view; a lid having an upper surface and a lower surface that is joined to the second upper surface of the base; one or more light emitting elements disposed on the first top surface; a lens member having a lower surface that is bonded to an upper surface of the lid; Equipped with an outer edge shape of the second upper surface of the base is a rectangle having a first side and a second side parallel to the first side, an outer edge shape of the lower surface of the lid is a rectangle having a first side parallel to a first side of the base and a second side parallel to the first side of the lid; a first side of the lid body is disposed closer to a first side of the base body than a second side of the lid body; a second side of the lid body is disposed closer to the second side of the base body than the first side of the lid body; When viewed from above, the shortest distance from the second side of the base to the second side of the lid is greater than the shortest distance from the first side of the base to the first side of the lid, the lens member has a lens portion having one or more lens surfaces and a non-lens portion that does not overlap with the one or more lens surfaces in a top view, When viewed from above, a shortest distance from a first side of the lid to the one or more lens surfaces is shorter than a shortest distance from a second side of the lid to the one or more lens surfaces; A light emitting device, wherein, in a top view, a maximum width of the one or more lens surfaces in a direction perpendicular to a first side of the base is 65% or more of a maximum width of the lens member. (Section 2) The lid has a rectangular annular joining pattern provided on a lower surface of the lid, 2. The light emitting device according to item 1, wherein, in a bottom view, the shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid is greater than the shortest distance from the region to a second side of the lid. (Section 3) an outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side; an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; 3. The light emitting device according to item 2, wherein the shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid body in a bottom view is greater than the shortest distance from the region to a third side of the lid body. (Section 4) 4. The light emitting device according to item 3, wherein the shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid body in a bottom view is greater than the distance from the region to a fourth side of the lid body. (Section 5) When viewed from below, a virtual line passing through a center of a first side of the lid body and perpendicular to the first side of the lid body includes a first line segment and a second line segment overlapping the bonding pattern, Item 5. The light emitting device according to any one of items 2 to 4, wherein the first line segment and the second line segment have the same length. (Section 6) The lens member may further include one or more bonding members that bond the cover and the lens member together. an outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side; an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; The lens member has a rectangular outer shape in a top view, the one or more bonding members are provided in an area including the vicinities of four corners of a rectangle of the lens member in a top view, 6. The light emitting device according to any one of items 1 to 5, wherein, in a top view, the shortest distance from a third side of the base to a third side of the lid is greater than the shortest distance from a first side of the base to the first side of the lid. (Section 7) 7. The light emitting device according to item 6, wherein the shortest distance from the fourth side of the base to the fourth side of the lid is greater than the shortest distance from the first side of the base to the first side of the lid in a top view. (Section 8) an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; an outer edge shape of a lower surface of the lens member is a rectangle having a first side parallel to a first side of the cover body, a second side parallel to the first side of the lens member, a third side perpendicular to the first side of the lens member, and a fourth side parallel to the third side of the lens member; When viewed from above, a width from the first side to the second side of the lens member is smaller than a width from the first side to the second side of the cover body, Item 8. The light emitting device according to any one of items 1 to 7, wherein a width from the third side to the fourth side of the lens member is larger than a width from the third side to the fourth side of the lid body when viewed from above. (Section 9) The lens member may further include one or more bonding members that bond the cover and the lens member together. the one or more bonding members include a first bonding member provided in a region including a vicinity of a first corner, which is a corner where a first side and a third side of the optical member 70 intersect, an outer edge shape of the upper surface of the lid is a rectangle having a first side parallel to the first side of the base, a second side parallel to the first side of the upper surface of the lid, a third side perpendicular to the first side of the upper surface of the lid, and a fourth side parallel to the third side of the upper surface of the lid, the first joint member has, in a region where the lid and the first joint member overlap in a top view, a first end point that is on a first side of an upper surface of the lid and is a point farthest from a first corner, and a second end point that is on a third side of the lid and is a point farthest from the first corner; Item 9. The light emitting device according to any one of items 1 to 8, wherein a distance from the second end point to the one or more lens surfaces is shorter than a distance from the first end point to the one or more lens surfaces 71D in a top view. [Industrial Applicability]

[0189] The light-emitting device described in the embodiment can be used in a projector. In other words, a projector can be said to be one application form to which the present invention can be applied. However, the present invention is not limited to this, and can be used in various applications such as illumination, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of symbols]

[0190] 1 Light emitting device 10 Packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11C1, 11C5 1st side 11C2, 11C6 2nd side 11C3, 11C7 Third side 11C4, 11C8 4th side 11D External surface 11E Inside surface 11F Step 11F1 First step 11F2 Second step 11G top surface 11H side 11M base 11N frame 12A wiring section 12A1 1st wiring section 12A2 2nd wiring section 13A Joint Pattern 14 Lid 14A Top 14A1 Side 1 14A2 Side 2 14A3 Third side 14A4 Side 4 14B Bottom 14B1 Side 1 14B2 Side 2 14B3 Third side 14B4 Side 4 14C side 14D Joint Pattern 14D1, 14D5 1st side 14D2, 14D6 2nd side 14D3, 14D7 Third side 14D4, 14D8 4th side 14E Buffer Line Pattern 14E1 Buffer Line 20 Light emitting element 21A Top 21B Bottom surface 21C side 22 Light exit surface 30 Submount 31A Top 31B Bottom surface 31C side 32A board 32B Upper metal member 32C Lower metal part 33 Wiring layer 40 Reflective material 41A Bottom 41B Light reflective surface 50 Protection element 51A Top 51B Bottom side 51C side 60 Wiring 70 Optical components (lens components) 71A Top 71B Bottom side 71B1 Side 1 71B2 Side 2 71B3 Third side 71B4 Side 4 71C side 71D Lens surface (optical surface) 72A Lens section 72B Non-lens part 80 Joint materials 81 First joining member 82 Second Joint Member 83 Third Joint Member 84 Fourth Joint Member

Claims

1. a base body having a base portion having a first upper surface and a frame portion having a second upper surface located above the first upper surface and surrounding the first upper surface in a top view; a lid having an upper surface and a lower surface that is joined to the second upper surface of the base; one or more light emitting elements disposed on the first top surface; a lens member having a lower surface that is bonded to an upper surface of the lid; Equipped with an outer edge shape of the second upper surface of the base is a rectangle having a first side and a second side parallel to the first side, an outer edge shape of the lower surface of the lid is a rectangle having a first side parallel to a first side of the base and a second side parallel to the first side of the lid, a first side of the lid body is disposed closer to the first side of the base body than a second side of the lid body; a second side of the lid body is disposed closer to the second side of the base body than the first side of the lid body; When viewed from above, a shortest distance from a second side of the base to a second side of the lid is greater than a shortest distance from a first side of the base to a first side of the lid, the lens member has a lens portion having one or more lens surfaces and a non-lens portion that does not overlap with the one or more lens surfaces in a top view, When viewed from above, a shortest distance from a first side of the lid body to the one or more lens surfaces is shorter than a shortest distance from a second side of the lid body to the one or more lens surfaces; A light emitting device, wherein a maximum width of the one or more lens surfaces in a direction perpendicular to a first side of the base in a top view is 65% or more of a maximum width of the lens member.

2. The lid has a rectangular annular joining pattern provided on a lower surface of the lid, The light emitting device according to claim 1 , wherein a shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid is greater than a shortest distance from the region to a second side of the lid in a bottom view.

3. an outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side; an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; The light emitting device according to claim 2 , wherein a shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid is greater than a shortest distance from the region to a third side of the lid in a bottom view.

4. The light emitting device according to claim 3 , wherein a shortest distance from the rectangular annular region of the bonding pattern to a first side of the lid is greater than a distance from the region to a fourth side of the lid in a bottom view.

5. When viewed from below, a virtual line passing through a center of a first side of the lid body and perpendicular to the first side of the lid body includes a first line segment and a second line segment overlapping the bonding pattern, The light emitting device according to claim 2 , wherein the first line segment and the second line segment have the same length.

6. The lens member may further include one or more bonding members that bond the lid and the lens member together. an outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side; an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; The lens member has a rectangular outer shape in a top view, the one or more bonding members are provided in a region including the vicinities of four corners of a rectangle of the lens member in a top view, The light emitting device according to claim 1 , wherein the shortest distance from a third side of the base to a third side of the lid is greater than the shortest distance from a first side of the base to the first side of the lid in a top view.

7. The light emitting device according to claim 6 , wherein the shortest distance from a fourth side of the base to a fourth side of the lid is greater than the shortest distance from a first side of the base to a first side of the lid in a top view.

8. an outer edge shape of the lower surface of the lid body is a rectangle having a third side perpendicular to the first side of the lid body and a fourth side parallel to the third side of the lid body; an outer edge shape of a lower surface of the lens member is a rectangle having a first side parallel to a first side of the cover body, a second side parallel to the first side of the lens member, a third side perpendicular to the first side of the lens member, and a fourth side parallel to the third side of the lens member, When viewed from above, a width from the first side to the second side of the lens member is smaller than a width from the first side to the second side of the cover body, The light emitting device according to claim 1 , wherein a width from the third side to the fourth side of the lens member is larger than a width from the third side to the fourth side of the lid body in a top view.

9. The lens member may further include one or more bonding members that bond the lid and the lens member together. the one or more bonding members include a first bonding member provided in a region including a vicinity of a first corner, which is a corner where a first side and a third side of the lens member intersect, an outer edge shape of the upper surface of the lid is a rectangle having a first side parallel to the first side of the base, a second side parallel to the first side of the upper surface of the lid, a third side perpendicular to the first side of the upper surface of the lid, and a fourth side parallel to the third side of the upper surface of the lid, the first joint member has, in a region where the lid body and the first joint member overlap in a top view, a first end point that is on a first side of an upper surface of the lid body and is a point farthest from a first corner, and a second end point that is on a third side of the lid body and is a point farthest from the first corner; The light emitting device according to claim 8 , wherein, in a top view, a distance from the second end point to the one or more lens surfaces is smaller than a distance from the first end point to the one or more lens surfaces.

Citation Information

Patent Citations

  • Light-emitting device

    JP2021097216A