Electronic component

Abstract

To provide an electronic component that suppresses occurrence of migration even if an external electrode includes a conductive resin layer.SOLUTION: A multilayer capacitor C1 comprises: an element assembly 3 that exhibits a rectangular parallelepiped shape, and includes a pair of end faces 3e, a side face 3c, and a side face 3a; a plurality of external electrodes 5 that is arranged on both ends of the element assembly 3 in a second direction D2, and includes second electrode layers E2 located on the side face 3c and side face 3a; a plurality of internal electrodes 7, 9 that is arranged inside the element assembly 3, and electrically connected to corresponding external electrodes of the plurality of external electrodes 5; and an electrical insulation film EI that is arranged on the element assembly 3. The element assembly 3 includes a region R1 that is located separate from the side face 3c and has the plurality of internal electrodes 7, 9 arranged therein, and a region R2 that includes the side face 3c and has a dielectric constant smaller than the dielectric constant of the region R1.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes a rectangular parallelepiped element body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). Each of the plurality of external electrodes is disposed on the element body and includes a conductive resin layer. Each of the plurality of internal electrodes is disposed within the element body and is electrically connected to a corresponding one of the plurality of external electrodes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-006501 A Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer generally contains a plurality of metal particles and a resin. In this case, migration may occur in the external electrodes. Migration is considered to occur, for example, due to the following phenomena. The electric field acts on the metal particles contained in the conductive resin layer, ionizing the metal particles. The generated metal ions are attracted to the electric field generated between the external electrodes and migrate from the conductive resin layer. The electric field acting on the metal particles includes, for example, an electric field generated between an external electrode and an internal electrode. The metal ions that migrate from the conductive resin layer react with electrons caused by, for example, leakage current generated in the electronic component, and precipitate as metal on the surface of the element body. The electrons caused by the leakage current are supplied, for example, from the element body, the internal electrode, or the external electrode.

[0005] An object of each aspect of the present invention is to provide an electronic component that suppresses the occurrence of migration even when the external electrodes include a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention comprises an element body having a rectangular parallelepiped shape and including a pair of end faces facing each other and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other, a plurality of external electrodes respectively arranged on both ends of the element body in the direction in which the pair of end faces face each other and including a conductive resin layer located on the first side surface and the second side surface, a plurality of internal electrodes arranged within the element body and electrically connected to corresponding external electrodes among the plurality of external electrodes, and an electrical insulating film arranged on the element body. The element body includes a first region located away from the first side surface and in which the plurality of internal electrodes are arranged, and a second region including the first side surface and having a dielectric constant smaller than that of the first region. The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side surface.

[0007] In the above-mentioned one embodiment, the second region including the first side surface has a dielectric constant smaller than that of the above-mentioned first region. Therefore, the above-mentioned one embodiment suppresses the occurrence of leakage current in the second region. Even if metal particles contained in the conductive resin layer located on the first side surface are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the first side surface. In one embodiment, a film portion included in the electrical insulating film is located on the region between the conductive resin layers on the second side surface. Therefore, even if metal particles included in the conductive resin layer located on the second side surface are ionized, the film portion inhibits the reaction between the generated metal ions and electrons caused by leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the second side surface. As a result, the above-mentioned one aspect suppresses the occurrence of migration even in a configuration in which the external electrode includes a conductive resin layer located on both the first side surface and the second side surface.

[0008] In the above aspect, the element body may include a third side surface facing the first side surface, and a third region including the third side surface and having a dielectric constant smaller than the dielectric constant of the first region. The conductive resin layer may be located on the third side surface. The configuration in which the element body includes the above-described third region suppresses the occurrence of leakage current in the third region. Even if metal particles contained in the conductive resin layer located on the third side surface are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to precipitate on the third side surface. Therefore, the configuration in which the element body includes the above-described third region suppresses the occurrence of migration even in a configuration in which the external electrode includes a conductive resin layer located on the third side surface.

[0009] In the above aspect, the internal electrodes may face each other in a direction perpendicular to the direction in which the pair of end faces face each other and the direction in which the first side face and the third side face face each other. In a configuration in which multiple internal electrodes face each other in the above-mentioned direction, electrons tend to be supplied as leakage current from the internal electrodes to the conductive resin layer located on the second side surface. However, as described above, the film portion inhibits the reaction between the generated metal ions and the electrons. Therefore, even in this configuration, the occurrence of migration is reliably suppressed.

[0010] In the above-mentioned one aspect, the plurality of internal electrodes may include an outermost internal electrode adjacent to the second side surface, and when the outermost internal electrode and the conductive resin layer that is not electrically connected to the outermost internal electrode are viewed in a direction perpendicular to the first side surface, the outermost internal electrode may overlap with the conductive resin layer that is not electrically connected to the outermost internal electrode. In a configuration in which the outermost internal electrode overlaps with a conductive resin layer that is not electrically connected to the outermost internal electrode when viewed in a direction perpendicular to the first side surface, electrons tend to be supplied as leakage current from the outermost internal electrode to the conductive resin layer located on the first side surface. However, as described above, in the second region, electrons are difficult to supply to metal ions. Therefore, even in this configuration, the occurrence of migration is reliably suppressed. As described above, even in a configuration in which the distance between the outermost internal electrode and the second side surface is small, the occurrence of migration is reliably suppressed. That is, even in a configuration in which the number of stacked internal electrodes is increased, the occurrence of migration is reliably suppressed. The conductive resin layer may continuously cover a portion of the first side surface, a portion of the second side surface, a portion of the third side surface, and a portion of a corresponding one of the pair of end surfaces. The configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and a part of the corresponding end surface can reduce the amount of conductive resin paste used to form the conductive resin layer, compared to the configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and the entire corresponding end surface. The reduction in the amount of conductive resin paste used can reduce the length of the conductive resin layer in the direction in which the pair of end surfaces face each other, and can increase the distance between the multiple external electrodes on the first, second, and third side surfaces. The increase in the distance between the multiple external electrodes reduces the electric field generated between the multiple external electrodes. Therefore, the generated metal ions are less likely to move from the conductive resin layer. As a result, the configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and a part of the corresponding end surface can further suppress the occurrence of migration.

[0011] In the above aspect, the element body may include a fourth side surface facing the second side surface. The conductive resin layer may be located on the fourth side surface. The electrically insulating film may include a film portion located on a region between the conductive resin layers on the fourth side surface. In the above aspect, the element body may include a fourth side surface facing the second side surface. The conductive resin layer may be located on the fourth side surface. The electrically insulating film may include a film portion located on a region between the conductive resin layers on the fourth side surface. In a configuration in which a film portion included in the electrical insulating film is also located on the region between the conductive resin layers on the fourth side surface, even if metal particles included in the conductive resin layer located on the fourth side surface are ionized, the film portion inhibits the reaction between the generated metal ions and electrons resulting from leakage current. Electrons are not easily supplied to the metal ions. Metal is also not easily precipitated on the fourth side surface. As a result, this configuration suppresses the occurrence of migration even in a configuration in which the external electrode includes a conductive resin layer that is also located on the fourth side surface.

[0012] In the above aspect, the element body may include a third side face facing the first side face and a fourth side face facing the second side face, and may include a third region that includes the third side face and has a dielectric constant smaller than that of the first region. The conductive resin layer may be located on the fourth side face. The electrical insulating film may include a film portion located on a region between the conductive resin layers on the fourth side face. In a configuration in which the electrical insulating film includes a film portion located on the region between the conductive resin layers on the fourth side surface, even if metal particles contained in the conductive resin layer located on the fourth side surface are ionized, this film portion inhibits the reaction between the generated metal ions and electrons resulting from leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the fourth side surface. Thus, a configuration in which the electrical insulating film includes a film portion located on the region between the conductive resin layers on the fourth side surface suppresses the occurrence of migration even in a configuration in which the external electrode includes a conductive resin layer located on the fourth side surface.

[0013] In the above aspect, the multiple internal electrodes may face each other in a direction in which the second side surface and the fourth side surface face each other. In a configuration in which multiple internal electrodes face each other in the above-mentioned direction, electrons tend to be supplied as leakage current from the internal electrodes to the conductive resin layers located on the second side and the fourth side. However, as described above, the film portion inhibits the reaction between the generated metal ions and the electrons. Therefore, even in this configuration, the occurrence of migration is reliably suppressed.

[0014] In the above-mentioned one aspect, the multiple internal electrodes may include a first outermost internal electrode adjacent to the second side surface and a second outermost internal electrode adjacent to the fourth side surface. When the first outermost internal electrode and the conductive resin layer not electrically connected to the first outermost internal electrode are viewed in a direction perpendicular to the second side surface, the first outermost internal electrode may overlap with the conductive resin layer not electrically connected to the first outermost internal electrode. When the second outermost internal electrode and the conductive resin layer not electrically connected to the second outermost internal electrode are viewed in a direction perpendicular to the fourth side surface, the second outermost internal electrode may overlap with the conductive resin layer not electrically connected to the second outermost internal electrode. In a configuration in which the first outermost internal electrode overlaps with a conductive resin layer that is not electrically connected to the first outermost internal electrode when viewed in a direction perpendicular to the second side surface, electrons tend to be supplied as leakage current from the first outermost internal electrode to the conductive resin layer located on the second side surface. However, as described above, the film portion inhibits the reaction between the generated metal ions and the electrons caused by the leakage current. Metal is less likely to deposit on the second side surface. In a configuration in which the second outermost internal electrode overlaps with a conductive resin layer that is not electrically connected to the second outermost internal electrode when viewed in a direction perpendicular to the fourth side surface, electrons tend to be supplied as leakage current from the second outermost internal electrode to the conductive resin layer located on the fourth side surface. However, as described above, the film portion inhibits the reaction between the generated metal ions and the electrons resulting from the leakage current. Metal is less likely to deposit on the fourth side surface. Therefore, in these configurations as well, the occurrence of migration is reliably suppressed. These configurations can increase the length of the internal electrodes in the direction in which the pair of end faces face each other, and therefore can increase the capacitance.

[0015] In one aspect above, the conductive resin layer may continuously cover a portion of the first side surface, a portion of the second side surface, a portion of the fourth side surface, and a portion of a corresponding one of the pair of end surfaces. The configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and a part of the corresponding end surface can reduce the amount of conductive resin paste used to form the conductive resin layer, compared to the configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and the entire corresponding end surface. The reduction in the amount of conductive resin paste used can reduce the length of the conductive resin layer in the direction in which the pair of end surfaces face each other, and can increase the distance between the multiple external electrodes on the first, second, and fourth side surfaces. The increase in the distance between the multiple external electrodes reduces the electric field generated between the multiple external electrodes. Therefore, the generated metal ions are less likely to move from the conductive resin layer. As a result, the configuration in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and a part of the corresponding end surface can further suppress the occurrence of migration.

[0016] In the above-mentioned one aspect, each of the multiple internal electrodes may be located within the first region away from an end of the first region that faces the first side surface. In the configuration in which each of the plurality of internal electrodes is located within the first region away from an end of the first region facing the first side surface, the plurality of internal electrodes are reliably located within the first region, and therefore this configuration suppresses a decrease in capacitance.

[0017] In the above-mentioned one aspect, each of the multiple internal electrodes may be located within the first region away from an end of the first region that faces the third side surface. In the configuration in which each of the plurality of internal electrodes is located within the first region away from an end of the first region facing the third side surface, the plurality of internal electrodes are reliably located within the first region, thereby suppressing a decrease in capacitance.

[0018] In the above-mentioned embodiment, the conductive resin layer may contain a plurality of Ag particles.

[0019] An electronic component according to another aspect of the present invention comprises an element body having a rectangular parallelepiped shape and including a pair of end faces facing each other and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other, a plurality of external electrodes respectively arranged on both ends of the element body in the direction in which the pair of end faces face each other and including a conductive resin layer located on the first side surface and the second side surface, a plurality of internal electrodes arranged within the element body and electrically connected to corresponding ones of the plurality of external electrodes, and an electrical insulating film arranged on the element body. The first side surface has a surface resistivity greater than that of the second side surface. The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side surface.

[0020] In the above-mentioned another aspect, the first side has a surface resistivity greater than that of the second side. Therefore, the above-mentioned another aspect suppresses the occurrence of leakage current on the first side. Even if metal particles contained in the conductive resin layer located on the first side are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the first side. In another embodiment, a film portion included in the electrical insulating film is located on the region between the conductive resin layers on the second side surface. Therefore, even if metal particles included in the conductive resin layer located on the second side surface are ionized, the film portion inhibits the reaction between the generated metal ions and electrons caused by leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the second side surface. As a result, the above-mentioned another aspect suppresses the occurrence of migration even in a configuration in which the external electrode includes a conductive resin layer located on both the first side surface and the second side surface. Effect of the Invention

[0021] An object of each aspect of the present invention is to provide an electronic component that suppresses the occurrence of migration even when the external electrodes include a conductive resin layer. [Brief description of the drawings]

[0022] [Figure 1]FIG. 1 is a perspective view showing an electronic component according to a first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Diagram 5] FIG. 5 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Figure 6] FIG. 6 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Figure 7] FIG. 7 is a diagram showing a cross-sectional configuration of an electronic component according to a first modified example of the first embodiment. [Figure 8] FIG. 8 is a diagram showing a cross-sectional configuration of an electronic component according to a first modified example of the first embodiment. [Figure 9] FIG. 9 is a diagram showing a cross-sectional configuration of an electronic component according to a first modified example of the first embodiment. [Figure 10] FIG. 10 is a perspective view showing an electronic component according to the second embodiment. [Figure 11] FIG. 11 is a diagram showing a cross-sectional configuration of the electronic component according to the second embodiment. [Figure 12] FIG. 12 is a diagram showing a cross-sectional configuration of the electronic component according to the second embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional configuration of the electronic component according to the second embodiment. [Figure 14] FIG. 14 is a diagram showing a cross-sectional configuration of the electronic component according to the second embodiment. [Figure 15] FIG. 15 is a perspective view showing an electronic component in accordance with the third embodiment. [Figure 16] FIG. 16 is a diagram showing a cross-sectional configuration of the electronic component according to the third embodiment. [Figure 17] FIG. 17 is a diagram showing a cross-sectional configuration of the electronic component according to the third embodiment. [Figure 18] FIG. 18 is a diagram showing a cross-sectional configuration of the electronic component according to the third embodiment. [Figure 19] FIG. 19 is a diagram showing a cross-sectional configuration of the electronic component according to the third embodiment. [Figure 20] FIG. 20 is a perspective view showing an electronic component according to the fourth embodiment. [Figure 21] FIG. 21 is a diagram showing a cross-sectional configuration of the electronic component according to the fourth embodiment. [Figure 22] FIG. 22 is a diagram showing a cross-sectional configuration of the electronic component according to the fourth embodiment. [Figure 23] FIG. 23 is a diagram showing a cross-sectional configuration of the electronic component according to the fourth embodiment. [Figure 24] FIG. 24 is a diagram showing an electronic component device according to the fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, an embodiment and a modified example of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0024] First embodiment The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described with reference to Figs. 1 to 6. Fig. 1 is a perspective view showing the electronic component in accordance with the first embodiment. Figs. 2 to 6 are views showing the cross-sectional configuration of the electronic component in accordance with the first embodiment. In the first embodiment, the electronic component is, for example, a multilayer capacitor C1. The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described below.

[0025] 1, the multilayer capacitor C1 includes an element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7 and 9, and an electrical insulating film EI. The element body 3 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0026] The element body 3 includes a pair of side surfaces 3a, 3b facing each other, a pair of side surfaces 3c, 3d facing each other, and a pair of end surfaces 3e facing each other. The pair of side surfaces 3a, 3b, the pair of side surfaces 3c, 3d, and the pair of end surfaces 3e are rectangular. The rectangular shape includes, for example, a shape in which each corner is chamfered or a shape in which each corner is rounded. The direction in which the pair of side surfaces 3a, 3b face each other includes a first direction D1. The direction in which the pair of side surfaces 3c, 3d face each other includes a third direction D3. The direction in which the pair of end surfaces 3e face each other includes a second direction D2. In the first embodiment, for example, when the side surface 3a includes the second side surface, the side surface 3b includes the fourth side surface. For example, when the side surface 3c includes the first side surface, the side surface 3d includes the third side surface.

[0027] The side surfaces 3a, 3b face each other in a first direction D1. The first direction D1 includes a direction perpendicular to the side surfaces 3a, 3b, and is perpendicular to the third direction D3. The pair of side surfaces 3c, 3d face each other in the third direction D3. The third direction D3 includes a direction perpendicular to each side surface 3c. The pair of side surfaces 3c, 3d face each other in a second direction D2. The second direction D2 includes a direction parallel to each side surface 3a, 3b and each side surface 3c, 3d, and is perpendicular to the first direction D1 and the third direction D3. The second direction D2 includes a direction perpendicular to each end face 3e. The pair of side surfaces 3c, 3d extend in the first direction D1 to connect the pair of side surfaces 3a, 3b. The pair of side surfaces 3c, 3d also extend in the second direction D2. The pair of end surfaces 3e extend in the first direction D1 to connect the pair of side surfaces 3a, 3b. The pair of end surfaces 3e also extend in the third direction D3. The side surface 3a and the side surface 3c are adjacent to a pair of end surfaces 3e and are adjacent to each other. The side surface 3a and the side surface 3c may be adjacent to each other directly, or may be adjacent to each other indirectly via a ridge portion. The side surface 3a and the side surface 3d are adjacent to a pair of end surfaces 3e and are adjacent to each other. The side surface 3a and the side surface 3d may be adjacent to each other directly, or may be adjacent to each other indirectly via a ridge portion. The multilayer capacitor C1 is solder-mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, a side surface 3a faces the electronic device. The side surface 3a is disposed so as to constitute a mounting surface. The side surface 3a is the mounting surface.

[0028] The length of the element body 3 in the second direction D2 is greater than the length of the element body 3 in the first direction D1 and is greater than the length of the element body 3 in the third direction D3. The second direction D2 includes the longitudinal direction of the element body 3. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be different from each other.

[0029] The length of the element body 3 in the first direction D1 is, for example, 0.1 to 3.2 mm. The length of the element body 3 in the second direction D2 is, for example, 0.2 to 7.5 mm. The length of the element body 3 in the third direction D3 is, for example, 0.1 to 6.3 mm. For example, the third direction D3 is the longitudinal direction of the element body 3. The length of the element body 3 in the first direction D1 is the height of the element body 3. The length of the element body 3 in the second direction D2 is the length of the element body 3. The length of the element body 3 in the third direction D3 is the width of the element body 3. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the length of the element body 3 is 3.2 mm.

[0030] The element body 3 includes four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between each end face 3e and each side face 3a, 3b. The ridges 3i are located between the end face 3e and each side face 3c. The ridges 3j are located between each side face 3a, 3b and each side face 3c, 3d. For example, the ridges 3g, 3i, 3j are rounded to be curved. The element body 3 is subjected to so-called R chamfering. The end faces 3e and the side faces 3a, 3b are indirectly adjacent to each other via the ridges 3g. The end faces 3e and the side faces 3c, 3d are indirectly adjacent to each other via the ridges 3i. The side faces 3a, 3b and the side faces 3c, 3d are indirectly adjacent to each other via the ridges 3j.

[0031] As shown in Figures 2 to 6, the element body 3 includes a region R1, a region R2, and a region R3. Region R1 does not include side 3c and side 3d. Region R2 includes side 3c. Region R2 includes, for example, the entire side 3c. Region R3 includes side 3d. Region R3 includes, for example, the entire side 3d. Region R1 is located between region R2 and region R3 in the third direction D3. Region R1 is located away from side 3c and side 3d. The height of region R2 is equal to the height of region R3. The height of region R2 is the length of region R2 in the first direction D1. The height of region R3 is the length of region R3 in the first direction D1. The width of region R2 is equal to the width of region R3. The width of region R2 is the length of region R2 in the second direction D2. The width of region R3 is the length of region R3 in the second direction D2. The thickness of region R2 is equal to the thickness of region R3. The thickness of region R2 is the length of region R2 in the third direction D3. The thickness of region R3 is the length of region R3 in the third direction D3. The thickness of region R2 does not have to be equal to the thickness of region R3. The thickness of region R2 may be different from the thickness of region R3.

[0032] The element body 3 includes a dielectric material. The region R1 includes a first dielectric material. The first dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. The regions R2 and R3 include a second dielectric material different from the first dielectric material. The second dielectric material includes, for example, a CaZrO3-based, SrTiO3-based, or (Ca,Sr)(Zr,Ti)O3-based dielectric ceramic. The element body 3 is configured by stacking a plurality of dielectric layers in a first direction D1. The element body 3 includes a plurality of dielectric layers that are stacked. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the first direction D1. Each dielectric layer is configured, for example, from a sintered ceramic green sheet containing a dielectric material. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible. The process of obtaining the element body 3 includes, for example, preparing a ceramic green sheet containing a first dielectric material and a ceramic green sheet containing a second dielectric material, and combining these ceramic green sheets to obtain a sheet laminate. Thus, one dielectric layer includes, for example, a portion containing the first dielectric material and a portion containing the second dielectric material.

[0033] As shown in FIGS. 1 to 6, the electrical insulating film EI is disposed on the element body 3. The electrical insulating film EI is disposed directly on the element body 3. The electrical insulating film EI includes a film portion EIa. In the first embodiment, the electrical insulating film EI includes only the film portion EIa. The film portion EIa is disposed on the side surface 3a. The film portion EIa covers the side surface 3a and is in direct contact with the side surface 3a. The film portion EIa is located only on the side surface 3a.

[0034] The electrical insulating film EI has, for example, an electrical resistivity higher than that of the element body 3. The electrical resistivity of the element body 3 includes the volume resistivity of the element body 3 or the surface resistivity of the element body 3. The electrical insulating film EI may have an electrical resistivity higher than the volume resistivity of the element body 3 and higher than the surface resistivity of the element body 3. The electrically insulating film EI includes, for example, an electrically insulating thin film. The electrically insulating thin film includes, for example, a sputtered film or a silicon oxide film. The silicon oxide film includes, for example, a silicon dioxide film. The electrically insulating film EI may include an aluminum oxide film. The average thickness of the film portion EIa is, for example, 0.02 μm or more. The average thickness may be 0.05 μm or more.

[0035] A plurality of external electrodes 5 are arranged on the element body 3. In the first embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. Each external electrode 5 is arranged on both ends of the element body 3 in the second direction D2. Each external electrode 5 is arranged on a corresponding one of the pair of end faces 3e. In the first embodiment, each external electrode 5 is arranged on the side faces 3a, 3b, the side faces 3c, 3d, and the four faces of one end face 3e, the ridge portions 3g, 3i, 3j, and the electrical insulating film EI. Each external electrode 5 is indirectly arranged on the side face 3a via the electrical insulating film EI.

[0036] Each external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. The electrode portion 5a is disposed on the side surface 3a and on the ridge portion 3g. The electrode portion 5b is disposed on the side surface 3b and on the ridge portion 3g. The electrode portion 5c is disposed on the side surface 3c and on the ridge portion 3i. The electrode portion 5d is disposed on the side surface 3d and on the ridge portion 3i. The electrode portion 5e is disposed on the end surface 3e. The external electrode 5 also includes an electrode portion disposed on the ridge portion 3j. The electrode portions 5a, 5b, 5c, 5d, and 5e adjacent to each other are connected and electrically connected.

[0037] Each external electrode 5 includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each electrode portion 5a, 5c, 5d, 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion 5b includes a first electrode layer E1 and a third electrode layer E3. In the first embodiment, the second electrode layer E2 includes a conductive resin layer. The conductive resin layer included in the second electrode layer E2 is located on the side surface 3a and the side surface 3c. The conductive resin layer included in the second electrode layer E2 is located on the side surface 3a and the side surface 3d.

[0038] The first electrode layer E1 of the electrode unit 5a is disposed on the electrical insulating film EI and on the ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is formed on the electrical insulating film EI so as to cover a portion of the electrical insulating film EI, and is also formed on the element body 3 so as to cover the entire ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is in contact with the portion of the electrical insulating film EI and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit 5a is formed on the element body 3 so as to cover a portion of the ridge portion 3j. The first electrode layer E1 of the electrode unit 5a is in contact with the portion of the ridge portion 3j. In the electrode unit 5a, the first electrode layer E1 is in direct contact with the electrical insulating film EI (film portion EIa) and is in direct contact with the element body 3. The portion of the electrical insulating film EI is covered by the first electrode layer E1, and the remaining portion excluding the portion is exposed from the first electrode layer E1. The portion of the electrical insulating film EI includes a region of the electrical insulating film EI near the end face 3e. The first electrode layer E1 of the electrode portion 5a is located on the electrical insulating film EI. The side surface 3a includes a portion indirectly covered by the first electrode layer E1 and a portion exposed from the first electrode layer E1. The first electrode layer E1 does not have to be formed on the electrical insulating film EI. The first electrode layer E1 does not have to be disposed on the electrical insulating film EI. The second electrode layer E2 of the electrode unit 5a is disposed on the first electrode layer E1 and the electrical insulating film EI. The second electrode layer E2 of the electrode unit 5a is formed on the first electrode layer E1 so as to cover the first electrode layer E1 of the electrode unit 5a, and is also formed on the electrical insulating film EI so as to cover a part of the electrical insulating film EI. The second electrode layer E2 of the electrode unit 5a is in contact with the part of the electrical insulating film EI and the entire first electrode layer E1. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layer E2 on the side surface 3a. In the electrode unit 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the electrical insulating film EI (film portion EIa). In the electrode unit 5a, the second electrode layer E2 indirectly covers the side surface 3a so that the first electrode layer E1 and the electrical insulating film EI are located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode unit 5a is located on the side surface 3a. The portion of the second electrode layer E2 that is included in the second electrode layer E2 and is located on the side surface 3a constitutes a layer portion located on the side surface 3a. The second electrode layer E2 includes a layer portion located on the side surface 3a. The second electrode layer E2 of the electrode portion 5a has an edge E2a located on the electrical insulating film EI. e Includes. The third electrode layer E3 of the electrode unit 5a is disposed on the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the electrical insulating film EI.

[0039] The first electrode layer E1 of the electrode unit 5b is disposed on the side surface 3b and the ridge portion 3g. The first electrode layer E1 of the electrode unit 5b is formed so as to cover a part of the side surface 3b and the entire ridge portion 3g. The first electrode layer E1 of the electrode unit 5b is in contact with the part of the side surface 3b and the entire ridge portion 3g. In the electrode unit 5b, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3b is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3b includes a part of the side surface 3b near the end face 3e. The first electrode layer E1 of the electrode unit 5b is located on the side surface 3b. The first electrode layer E1 does not have to be formed on the side surface 3b. The first electrode layer E1 does not have to be disposed on the side surface 3b. The third electrode layer E3 of the electrode unit 5b is disposed on the first electrode layer E1. In the electrode unit 5b, the third electrode layer E3 covers the first electrode layer E1. In the electrode unit 5b, the third electrode layer E3 is in contact with the first electrode layer E1. In the electrode unit 5b, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5b is located on the side surface 3b. The electrode unit 5b does not include the second electrode layer E2. The side surface 3b is not covered by the second electrode layer E2.

[0040] The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the part of the side surface 3c and the entire ridge portion 3i. In the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3c is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3c includes a part of the side surface 3c near the end face 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. The first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode unit 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 and a part of the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1 and the part of the side surface 3c. The second electrode layer E2 of the electrode unit 5c is formed so as to cover the part of the first electrode layer E1 of the electrode unit 5c. The part of the side surface 3c includes, for example, a corner region of the side surface 3c near the side surface 3a and the end surface 3e. In the electrode unit 5c, the second electrode layer E2 indirectly covers the part of the side surface 3c such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The part of the first electrode layer E1 of the electrode unit 5c is covered by the second electrode layer E2, and the remaining part except for the part is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. The portion of the second electrode layer E2 that is included in the second electrode layer E2 and located on the side surface 3c constitutes a layer portion located on the side surface 3c. The second electrode layer E2 includes a layer portion located on the side surface 3c. The second electrode layer E2 of the electrode portion 5c includes an edge E2c located on the side surface 3c. e Includes. The third electrode layer E3 of the electrode unit 5c is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5c, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire part of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire part of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5c is located on the side surface 3c.

[0041] The electrode portion 5c includes a plurality of regions 5c1 and 5c2. In the first embodiment, the electrode portion 5c includes only two regions 5c1 and 5c2. The region 5c2 is located closer to the side surface 3a than the region 5c1. The region 5c1 includes the first electrode layer E1 and the third electrode layer E3. The region 5c1 does not include the second electrode layer E2. The region 5c2 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The region 5c1 includes a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5c2 includes a region where the first electrode layer E1 is covered with the second electrode layer E2.

[0042] The first electrode layer E1 of the electrode unit 5d is disposed on the side surface 3d and the ridge portion 3i. The first electrode layer E1 of the electrode unit 5d is formed so as to cover a portion of the side surface 3d and the entire ridge portion 3i. The first electrode layer E1 of the electrode unit 5d is in contact with the portion of the side surface 3d and the entire ridge portion 3i. In the electrode unit 5d, the first electrode layer E1 is in direct contact with the element body 3. The portion of the side surface 3d is covered by the first electrode layer E1, and the remaining portion excluding the portion is exposed from the first electrode layer E1. The portion of the side surface 3d includes a partial region of the side surface 3d near the end face 3e. The first electrode layer E1 of the electrode unit 5d is located on the side surface 3d. The first electrode layer E1 does not have to be formed on the side surface 3d. The first electrode layer E1 does not have to be disposed on the side surface 3d. The second electrode layer E2 of the electrode unit 5d is disposed on the first electrode layer E1 and the side surface 3d. In the electrode unit 5d, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 and a part of the side surface 3d. In the electrode unit 5d, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1 and the part of the side surface 3d. The second electrode layer E2 of the electrode unit 5d is formed so as to cover the part of the first electrode layer E1 of the electrode unit 5d. The part of the side surface 3d includes, for example, a corner region of the side surface 3d near the side surface 3a and the end surface 3e. In the electrode unit 5d, the second electrode layer E2 indirectly covers the part of the side surface 3d such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3d. The part of the first electrode layer E1 of the electrode unit 5d is covered by the second electrode layer E2, and the remaining part except for the part is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode unit 5d is located on the side surface 3d. The portion of the second electrode layer E2 that is included in the second electrode layer E2 and located on the side surface 3d constitutes a layer portion located on the side surface 3d. The second electrode layer E2 includes a layer portion located on the side surface 3d. The second electrode layer E2 of the electrode unit 5d has an edge E2d located on the side surface 3d. e Includes. The third electrode layer E3 of the electrode unit 5d is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5d, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5d, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5d, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5d is located on the side surface 3d.

[0043] The electrode portion 5d includes a plurality of regions 5d1 and 5d2. In the first embodiment, the electrode portion 5d includes only two regions 5d1 and 5d2. The region 5d2 is located closer to the side surface 3a than the region 5d1. The region 5d1 includes the first electrode layer E1 and the third electrode layer E3. The region 5d1 does not include the second electrode layer E2. The region 5d2 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The region 5d1 includes a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5d2 includes a region where the first electrode layer E1 is covered with the second electrode layer E2.

[0044] The first electrode layer E1 of the electrode unit 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode unit 5e is formed so as to cover the entire end surface 3e. The first electrode layer E1 of the electrode unit 5e is in contact with the entire end surface 3e. In the electrode unit 5e, the first electrode layer E1 is in direct contact with the end surface 3e. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5e is formed so as to cover the part of the first electrode layer E1 of the electrode unit 5e. In the electrode unit 5e, the second electrode layer E2 indirectly covers a part of the end face 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The part of the end face 3e includes, for example, a part of the end face 3e near the side face 3a. The first electrode layer E1 of the electrode unit 5e is covered by the second electrode layer E2 in the part, and is exposed from the second electrode layer E2 in the remaining part excluding the part. The part included in the second electrode layer E2 and located on the end face 3e constitutes a layer part located on the end face 3e. The second electrode layer E2 includes a layer portion located on the end surface 3e. The third electrode layer E3 of the electrode unit 5e is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e. The electrode unit 5e may not include the second electrode layer E2. In a configuration in which the electrode unit 5e does not include the second electrode layer E2, the third electrode layer E3 included in the electrode unit 5e covers the entire first electrode layer E1 and is in direct contact with the first electrode layer E1.

[0045] The electrode portion 5e includes a plurality of regions 5e1 and 5e2. In the first embodiment, the electrode portion 5e includes only two regions 5e1 and 5e2. The region 5e2 is located closer to the side surface 3a than the region 5e1. The region 5e1 includes the first electrode layer E1 and the third electrode layer E3. The region 5e1 does not include the second electrode layer E2. The region 5e2 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. In the electrode portion 5e, the third electrode layer E3 is formed so as to cover the entire end surface 3e when viewed from the first direction D1. In the first embodiment, the third electrode layer E3 indirectly covers the entire end surface 3e. The region 5e1 includes a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5e2 includes a region where the first electrode layer E1 is covered with the second electrode layer E2.

[0046] The electrical insulating film EI includes a portion covered by the external electrode 5 and a portion exposed from the external electrode 5. The film portion EIa includes a portion covered by the electrode portion 5a and a portion exposed from the electrode portion 5a. The portion of the electrical insulating film EI (film portion EIa) exposed from the external electrode 5 (electrode portion 5a) is located on the region between the pair of external electrodes 5 (pair of electrode portions 5a) on the side surface 3a. The electrical insulating film EI includes at least a film portion located on the region between the pair of external electrodes 5 on the side surface 3a. The electrical insulating film EI includes at least a film portion EIa located on the region exposed from the pair of external electrodes 5 on the side surface 3a.

[0047] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the above-mentioned parts of the side surfaces 3a and 3b, the above-mentioned parts of the side surfaces 3c and 3d, one end face 3e, and the ridge portions 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 includes a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the element body 3. In the first embodiment, the first electrode layer E1 includes a sintered metal layer containing Cu. The first electrode layer E1 may include a sintered metal layer containing Ni. The first electrode layer E1 includes a base metal. The conductive paste includes, for example, particles containing Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 included in each of the electrode portions 5a, 5b, 5c, 5d, and 5e is integrally formed.

[0048] The second electrode layer E2 is formed by hardening a conductive resin paste applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 includes a base metal layer for forming the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. The conductive resin paste includes, for example, a resin, a conductive material, and an organic solvent. The resin includes, for example, a thermosetting resin. The conductive material includes, for example, metal particles. The metal particles include, for example, silver particles or copper particles. In the first embodiment, the second electrode layer E2 includes a plurality of Ag particles. The thermosetting resin includes, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 included in each of the electrode portions 5a, 5c, 5d, and 5e is integrally formed.

[0049] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (a portion exposed from the second electrode layer E2) by plating. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 includes, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal included in the second electrode layer E2. The third electrode layer E3 may include a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 included in each of the electrode portions 5a, 5b, 5c, 5d, and 5e is integrally formed.

[0050] The second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding end surface of the pair of end surfaces 3e. For example, the second electrode layer E2 continuously covers only a part of each of the side surfaces 3c and 3d, only a part of the side surface 3a, and only a part of the end surface 3e. The second electrode layer E2 includes a part that is provided so as to continuously cover only a part of each of the side surfaces 3c and 3d, only a part of the side surface 3a, and only a part of the end surface 3e. The above-mentioned part of the end surface 3e includes a part of the end surface 3e closer to the side surface 3a. The above-mentioned parts of the side surfaces 3c and 3d include a part of the side surfaces 3c and 3d closer to the side surface 3a. The second electrode layer E2 covers the entire one of the ridge portions 3g, only a part of the ridge portion 3i, and only a part of the ridge portion 3j. A part of the part of the first electrode layer E1 that covers the ridge portion 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 included in each of the regions 5c1, 5d1, and 5e1 is exposed from the second electrode layer E2. In a configuration in which the electrode portion 5e does not include the second electrode layer E2, the second electrode layer E2 continuously covers only a portion of each of the side surfaces 3c and 3d and only a portion of the side surface 3a. The second electrode layer E2 includes a portion provided so as to continuously cover only a portion of the side surface 3a and only a portion of the side surfaces 3c and 3d.

[0051] The film portion EIa is disposed at least on a region between the pair of external electrodes 5 on the side surface 3a. The side surfaces 3c and 3d, the pair of end faces 3e, and the ridges 3g, 3i, and 3j are exposed from the electrical insulating film EI. The electrical insulating film EI includes the film portion EIa located on a region between the second electrode layers E2 on the side surface 3a.

[0052] The multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed in the element body 3. Each of the internal electrodes 7, 9 is electrically connected to a corresponding one of a pair of external electrodes 5. Each of the internal electrodes 7, 9 includes a conductive material that is typically used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste including the conductive material. In the first embodiment, each of the internal electrodes 7, 9 includes Ni.

[0053] The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged in the element body 3 so as to be aligned in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged in different positions (layers) in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other with a gap in between in the first direction D1. The internal electrodes 7 and the internal electrodes 9 have mutually different polarities. Each of the internal electrodes 7, 9 is located in a plane substantially parallel to each of the side surfaces 3a, 3b. The internal electrodes 7 and 9 face each other in a first direction D1. The direction in which the internal electrodes 7 and 9 face each other (first direction D1) is perpendicular to the directions (second direction D2 and third direction D3) parallel to each of the side surfaces 3a, 3b. The internal electrodes 7 and 9 face each other in a direction (first direction D1) perpendicular to the direction in which the pair of end faces 3e face each other (second direction D2) and the direction in which the side surfaces 3c and 3d face each other (third direction D3).

[0054] Each of the multiple internal electrodes 7, 9 includes one end exposed at a corresponding one of the pair of end faces 3e. The one end included in each of the multiple internal electrodes 7, 9 is covered by the corresponding electrode portion 5e. In the first embodiment, all of the one ends are covered by the corresponding electrode portion 5e. The internal electrodes 7 and 9 are directly connected to the corresponding electrode portion 5e. The internal electrodes 7 and 9 are electrically connected to the corresponding external electrodes 5. Each of the multiple internal electrodes 7 includes an end 7c closer to the side surface 3c and an end 7d closer to the side surface 3d. Each of the multiple internal electrodes 9 includes an end 9c closer to the side surface 3c and an end 9d closer to the side surface 3d. The ends 7c, 7d and the ends 9c, 9d are not exposed to the outer surface of the element body 3. Each end face 3e is exposed from the electrical insulating film EI (film portion EIa), and the one end of each of the multiple internal electrodes 7, 9 includes a region exposed from the electrical insulating film EI. In the first embodiment, the one end of each of the multiple internal electrodes 7, 9 includes only a region exposed from the electrical insulating film EI. The entire one end of each of the multiple internal electrodes 7, 9 is exposed from the electrical insulating film EI. The electrical insulating film EI (film portion EIa) faces the multiple internal electrodes 7, 9 in the first direction D1.

[0055] As shown in FIG. 3 to FIG. 6, the multiple internal electrodes 7, 9 are arranged in the region R1. The end 7c of each of the multiple internal electrodes 7 extends in the second direction D2 along the end B1 facing the side surface 3c in the region R1. The end 9c of each of the multiple internal electrodes 9 extends in the second direction D2 along the end B1. The end 7d of each of the multiple internal electrodes 7 extends in the second direction D2 along the end B2 facing the side surface 3d in the region R1. The end 9d of each of the multiple internal electrodes 9 extends in the second direction D2 along the end B2. In the first embodiment, when viewed from the first direction D1, the ends 7c and 9c overlap the end B1, and the ends 7d and 9d overlap the end B2. The multiple internal electrodes 7, 9 are not arranged in the region R2 and the region R3. In the first embodiment, the region R2 is in contact with the ends 7c, 9c of the internal electrodes 7, 9. Thus, the region R2 includes the region between an imaginary plane including the ends 7c, 9c and the side surface 3c. The region R3 is in contact with the ends 7d, 9d of the internal electrodes 7, 9. Thus, the region R3 includes the region between an imaginary plane including the ends 7d, 9d and the side surface 3d. The length of the region R1 in the third direction D3 is, for example, equal to the length of the internal electrodes 7, 9 in the third direction D3.

[0056] As shown in Fig. 2 and Fig. 6, the multiple internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3a. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction (third direction D3) perpendicular to the side surface 3c, the outermost internal electrode 9p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 9p. In the first embodiment, the multiple internal electrodes 7 may include an outermost internal electrode 7p adjacent to the side surface 3a. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are viewed in a direction (third direction D3) perpendicular to the side surface 3d, the outermost internal electrode 7p may overlap with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p.

[0057] In the multilayer capacitor C1, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 suppresses the occurrence of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the side surface 3c. In the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the region between the second electrode layers E2 on the side surface 3a. Therefore, even if metal particles included in the second electrode layer E2 located on the side surface 3a are ionized, the film portion EIa inhibits the reaction between the generated metal ions and electrons caused by leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the side surface 3a. As a result, the multilayer capacitor C1 suppresses the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on both the side surface 3c and the side surface 3a. In the multilayer capacitor C1, the electrical insulating film EI is disposed only on the side surface 3a. The electrical insulating film EI can be formed more easily than when it is disposed on the side surface 3a, the side surface 3c, and the side surface 3d.

[0058] In the multilayer capacitor C1, the element body 3 includes a side surface 3d facing the side surface 3c, and also includes a region R3 that includes the side surface 3d and has a dielectric constant smaller than the dielectric constant of the region R1. The second electrode layer E2 is located on the side surface 3d. The multilayer capacitor C1 suppresses the occurrence of leakage current in the region R3. Even if metal particles contained in the second electrode layer E2 located on the side surface 3d are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to precipitate on the side surface 3d. Therefore, the multilayer capacitor C1 suppresses the occurrence of migration even in a configuration in which the external electrode 5 includes the second electrode layer E2 located on the side surface 3d.

[0059] In the multilayer capacitor C1, the internal electrodes 7, 9 face each other in a first direction D1 perpendicular to the direction in which the pair of end faces 3e face each other and the direction in which the side faces 3c and 3d face each other. In the multilayer capacitor C1, electrons tend to be supplied as leakage current from the internal electrodes 7 and 9 facing each other in the first direction D1 to the second electrode layer E2 located on the side surface 3a. However, as described above, the film portion EIa inhibits the reaction between the generated metal ions and the electrons. Therefore, the occurrence of migration is reliably suppressed in the multilayer capacitor C1 as well.

[0060] In the multilayer capacitor C1, the multiple internal electrodes 7, 9 include outermost internal electrodes 7p, 9p adjacent to the side surface 3a. When the outermost internal electrodes 7p, 9p and the second electrode layer E2 that is not electrically connected to the outermost internal electrodes 7p, 9p are viewed in a direction perpendicular to the side surface 3c, the outermost internal electrodes 7p, 9p overlap with the second electrode layer E2 that is not electrically connected to the outermost internal electrodes 7p, 9p. In the multilayer capacitor C1, electrons tend to be supplied as leakage current from the outermost internal electrode 9p to the second electrode layer E2 located on the side surface 3c. However, as described above, in the region R2, electrons are less likely to be supplied to metal ions. Therefore, the occurrence of migration is reliably suppressed in the multilayer capacitor C1 as well. As described above, even in a configuration in which the distance between the outermost internal electrode 9p and the side surface 3a is small, the occurrence of migration is reliably suppressed. That is, even in a configuration in which the number of stacked internal electrodes 7, 9 is increased, the occurrence of migration is reliably suppressed.

[0061] In the multilayer capacitor C1, the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding one of the pair of end surfaces 3e. In the multilayer capacitor C1, the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding end surface 3e, and the amount of conductive resin paste used to form the second electrode layer E2 can be reduced compared to the case where the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and the entirety of the corresponding end surface 3e. The reduction in the amount of conductive resin paste used can reduce the length of the second electrode layer E2 in the direction in which the pair of end surfaces 3e face each other, and can increase the distance between the pair of external electrodes 5 on the side surfaces 3c, 3a, and 3d. The increase in the distance between the pair of external electrodes 5 reduces the electric field generated between the pair of external electrodes 5. Therefore, the generated metal ions are less likely to move from the second electrode layer E2. As a result, the configuration in which the second electrode layer E2 continuously covers part of the side surface 3c, part of the side surface 3a, part of the side surface 3d, and part of the corresponding end surface 3e can further suppress the occurrence of migration. The multilayer capacitor C1 has a lower ESR (equivalent series resistance) than a configuration in which the second electrode layer E2 continuously covers the entire side surface 3c, part of the side surface 3a, part of the side surface 3d, and the entire corresponding end surface 3e.The multilayer capacitor C1 has a lower ESR than a configuration in which the second electrode layer E2 continuously covers the entire side surface 3c, the entire side surface 3a, the entire side surface 3d, and the entire corresponding end surface 3e.

[0062] The multilayer capacitor C1 has a rectangular parallelepiped shape and includes an element body 3 including a pair of end faces 3e facing each other and side faces 3c and 3a adjacent to the pair of end faces 3e and adjacent to each other, a pair of external electrodes 5 arranged on both ends of the element body 3 in the direction in which the pair of end faces 3e face each other and including second electrode layers E2 located on the side faces 3c and 3a, a plurality of internal electrodes 7 and 9 arranged in the element body 3 and electrically connected to corresponding ones of the pair of external electrodes, and an electrical insulating film EI arranged on the element body 3. The side faces 3c have a surface resistivity higher than that of the side faces 3a. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layers E2 on the side faces 3a.

[0063] In the multilayer capacitor C1, the side surface 3c has a surface resistivity higher than that of the side surface 3a. Therefore, the multilayer capacitor C1 suppresses the occurrence of leakage current at the side surface 3c. Even if metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the side surface 3c. In the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the region between the second electrode layers E2 on the side surface 3a. Therefore, even if metal particles included in the second electrode layer E2 located on the side surface 3a are ionized, the film portion EIa inhibits the reaction between the generated metal ions and electrons caused by leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the side surface 3a. As a result, the multilayer capacitor C1 suppresses the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on both the side surface 3c and the side surface 3a.

[0064] A multilayer capacitor C1 according to a first modified example of the first embodiment will be described with reference to Figs. 7 to 9. Figs. 7 to 9 are diagrams showing the cross-sectional configuration of an electronic component according to a first modified example of the first embodiment. The multilayer capacitor C1 according to the first modified example is generally similar to or the same as the multilayer capacitor C1 according to the first embodiment described above, but the multilayer capacitor C1 according to the first modified example differs from the multilayer capacitor C1 according to the first embodiment in terms of the configurations of the regions R1, R2, and R3 included in the element body 3. The differences from the multilayer capacitor C1 according to the first embodiment will be mainly described below.

[0065] The multilayer capacitor C1 according to the first modification includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9, similar to the multilayer capacitor C1 according to the first embodiment. The element body 3 includes regions R1, R2, and R3. The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are arranged in the region R1. Each of the plurality of internal electrodes 7, 9 is electrically connected to a corresponding one of the pair of external electrodes 5.

[0066] The length in the third direction D3 of each of regions R1, R2, and R3 according to the first modified example is different from the length in the third direction D3 of each of regions R1, R2, and R3 according to the first embodiment. The length in the third direction D3 of region R2 according to the first modified example is smaller than the length in the third direction D3 of region R2 according to the first embodiment. The length in the third direction D3 of region R3 according to the first modified example is smaller than the length in the third direction D3 of region R2 according to the first embodiment. The length in the third direction D3 of region R1 according to the first modified example is larger than the length in the third direction D3 of region R1 according to the first embodiment by the amount of the reduction in the lengths of regions R2 and R3.

[0067] Each of the internal electrodes 7 and 9 is located in the region R1 away from the end B1. The end 7c of each of the internal electrodes 7 extends in the second direction D2 in the region R1 away from the end B1. The end 9c of each of the internal electrodes 9 extends in the second direction D2 in the region R1 away from the end B1. Each of the internal electrodes 7 and 9 is located in the region R1 away from the end B2. The end 7d of each of the internal electrodes 7 extends in the second direction D2 in the region R1 away from the end B2. The end 9d of each of the internal electrodes 9 extends in the second direction D2 in the region R1 away from the end B2. The internal electrodes 7 and 9 are not disposed in the region R2 and the region R3.

[0068] In the multilayer capacitor C1, each of the plurality of internal electrodes 7, 9 is located within the region R1 away from the end B1 that faces the side surface 3c in the region R1. In the multilayer capacitor C1, the multiple internal electrodes 7 and 9 are reliably positioned within the region R1, thereby preventing the multilayer capacitor C1 from decreasing in capacitance.

[0069] In the multilayer capacitor C1, each of the internal electrodes 7 and 9 is located within the region R1 away from the end B2 that faces the side surface 3d in the region R1. In the multilayer capacitor C1, the internal electrodes 7 and 9 are reliably located within the region R1, and therefore the multilayer capacitor C1 suppresses a decrease in capacitance.

[0070] Second Embodiment The multilayer capacitor C1 in accordance with the second embodiment will be described with reference to Figs. 10 to 14. Fig. 10 is a perspective view showing the electronic component in accordance with the second embodiment. Figs. 11 to 14 are views showing the cross-sectional configuration of the electronic component in accordance with the second embodiment. The multilayer capacitor C1 in accordance with the second embodiment is generally similar to or the same as the multilayer capacitor C1 in accordance with the first embodiment described above, but the multilayer capacitor C1 in accordance with the second embodiment differs from the multilayer capacitor C1 in accordance with the first embodiment in the configurations of the regions R1, R2, and R3 included in the element body 3, the configurations of the multiple internal electrodes 7, 9, and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 in accordance with the first embodiment.

[0071] 10 to 14, the multilayer capacitor C1 in accordance with the second embodiment includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9, similar to the multilayer capacitor C1 in accordance with the first embodiment. The side surface 3a is the mounting surface. In the second embodiment, for example, when the side surface 3a includes the first side surface, the side surface 3b includes the third side surface. For example, when the side surface 3c includes the second side surface, the side surface 3d includes the fourth side surface.

[0072] The element body 3 includes a region R1, a region R2, and a region R3. Region R1 does not include the side surface 3a and the side surface 3b. Region R2 includes the side surface 3a. Region R2 includes, for example, the entire side surface 3a. Region R3 includes, for example, the entire side surface 3a. Region R1 is located between regions R2 and R3 in the first direction D1. Region R1 is located away from the side surface 3a and the side surface 3b.

[0073] The height of region R2 is equal to the height of region R3. The height of region R2 is the length of region R2 in the third direction D3. The height of region R3 is the length of region R3 in the third direction D3. The width of region R2 is equal to the width of region R3. The width of region R2 is the length of region R2 in the second direction D2. The width of region R3 is the length of region R3 in the second direction D2. The thickness of region R2 is equal to the thickness of region R3. The thickness of region R2 is the length of region R2 in the first direction D1. The thickness of region R3 is the length of region R3 in the first direction D1. The thickness of region R2 may not be equal to the thickness of region R3. The thickness of region R2 may be different from the thickness of region R3. Regions R2 and R3 have a dielectric constant smaller than the dielectric constant of region R1. Regions R2 and R3 have a surface resistivity larger than region R1. Sides 3a and 3b have a surface resistivity greater than the surface resistivity of sides 3c and 3d.

[0074] The second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding end surface of the pair of end surfaces 3e. For example, the second electrode layer E2 continuously covers only a part of each of the side surfaces 3c and 3d, only a part of the side surface 3a, and only a part of the end surface 3e. The second electrode layer E2 includes a part that is provided so as to continuously cover only a part of each of the side surfaces 3c and 3d, only a part of the side surface 3a, and only a part of the end surface 3e. The above-mentioned part of the end surface 3e includes a part of the end surface 3e closer to the side surface 3a. The above-mentioned parts of the side surfaces 3c and 3d include a part of the side surfaces 3c and 3d closer to the side surface 3a. The second electrode layer E2 covers the entire one of the ridge portions 3g, only a part of the ridge portion 3i, and only a part of the ridge portion 3j. A part of the part of the first electrode layer E1 that covers the ridge portion 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 included in each of the regions 5c1, 5d1, and 5e1 is exposed from the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer.

[0075] The internal electrodes 7 and 9 are disposed at different positions in the third direction D3. The internal electrodes 7 and 9 face each other in a direction (third direction D3) perpendicular to the direction (second direction D2) in which the pair of end faces 3e face each other and the direction (first direction D1) in which the side faces 3a and 3b face each other. The internal electrodes 7 and 9 are disposed alternately in the element body 3 so as to face each other with a gap in the third direction D3. Each of the internal electrodes 7, 9 is located in a plane substantially parallel to each of the side faces 3c, 3d.

[0076] Each of the multiple internal electrodes 7, 9 includes one end exposed to a corresponding one of the pair of end faces 3e. The one end included in each of the multiple internal electrodes 7, 9 is covered by the corresponding electrode portion 5e. In the second embodiment, all of the one ends are covered by the corresponding electrode portion 5e. The internal electrodes 7 and 9 are directly connected to the corresponding electrode portion 5e. The internal electrodes 7 and 9 are electrically connected to the corresponding external electrodes 5. Each of the multiple internal electrodes 7 includes an end 7a closer to the side surface 3a and an end 7b closer to the side surface 3b. Each of the multiple internal electrodes 9 includes an end 9a closer to the side surface 3a and an end 9b closer to the side surface 3b. The ends 7a, 7b and the ends 9a, 9b are not exposed to the outer surface of the element body 3.

[0077] The multiple internal electrodes 7, 9 are arranged in the region R1. The ends 7a of the multiple internal electrodes 7 are aligned in the second direction D2 along the ends B1 facing the side surfaces 3a in the region R1. The ends 9a of the multiple internal electrodes 9 are aligned in the second direction D2 along the ends B1. The ends 7b of the multiple internal electrodes 7 are aligned in the second direction D2 along the ends B2 facing the side surfaces 3b in the region R1. The ends 9b of the multiple internal electrodes 9 are aligned in the second direction D2 along the ends B2. In the second embodiment, when viewed from the second direction D2, the ends 7a and 9a overlap the ends B1, and the ends 7b and 9b overlap the ends B2. The multiple internal electrodes 7, 9 are not arranged in the region R2 and the region R3.

[0078] Each of the multiple internal electrodes 7, 9 may be located in the region R1 away from the end B1. The end 7a of each of the multiple internal electrodes 7 may be arranged in the second direction D2 in the region R1 away from the end B1. The end 9a of each of the multiple internal electrodes 9 may be arranged in the second direction D2 in the region R1 away from the end B1. Each of the multiple internal electrodes 7, 9 may be located in the region R1 away from the end B2. The end 7b of each of the multiple internal electrodes 7 may be arranged in the second direction D2 in the region R1 away from the end B2. The end 9b of each of the multiple internal electrodes 9 may be arranged in the second direction D2 in the region R1 away from the end B2. In these cases, the length of each of the regions R2, R3 in the first direction D1 is reduced, and the length of the region R1 in the first direction D1 is larger by the amount of the reduction in the length of each of the regions R2, R3 in the first direction D1. The internal electrodes 7 and 9 are not disposed in the region R2 and the region R3.

[0079] The multiple internal electrodes 7 include an outermost internal electrode 7p adjacent to the side surface 3d. When the outermost internal electrode 7p and the second electrode layer E2 that is not electrically connected to the outermost internal electrode 7p are viewed in a direction perpendicular to the side surface 3d (third direction D3), the outermost internal electrode 7p overlaps with the second electrode layer E2 that is not electrically connected to the outermost internal electrode 7p. The multiple internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3c. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction perpendicular to the side surface 3c (third direction D3), the outermost internal electrode 9p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 9p. For example, when the outermost internal electrode 7p includes the second outermost internal electrode, the outermost internal electrode 9p includes the first outermost internal electrode.

[0080] The electrical insulating film EI is disposed on the side surface 3c and the side surface 3d. The film portion EIa is disposed at least on the region between the pair of external electrodes 5 on the side surfaces 3c and 3d. The film portion EIa covers the side surface 3c and is in direct contact with the side surface 3c. The film portion EIa covers the side surface 3d and is in direct contact with the side surface 3d. The film portion EIa is located only on the side surfaces 3c and 3d. Each end face 3e is exposed from the electrical insulating film EI (film portion EIa). Therefore, the one end of each of the multiple internal electrodes 7, 9 includes a region exposed from the electrical insulating film EI. In the second embodiment, the one end of each of the multiple internal electrodes 7, 9 includes only a region exposed from the electrical insulating film EI. The entire one end of each of the multiple internal electrodes 7, 9 is exposed from the electrical insulating film EI. The side surfaces 3a, 3b and each ridge portion 3g, 3i, 3j are exposed from the electrical insulating film EI. The electrical insulating film EI (film portion EIa) faces the multiple internal electrodes 7, 9 in the third direction D3.

[0081] In the multilayer capacitor C1, the element body 3 includes a side 3d facing the side 3c and a side 3b facing the side 3a, and also includes a region R3 that includes the side 3d and has a dielectric constant smaller than that of the region R1. The second electrode layer E2 is located on the side 3d. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layers E2 on the side 3b. In the multilayer capacitor C1, even if metal particles contained in the second electrode layer E2 located on the side surface 3d are ionized, the film portion EIa inhibits a reaction between the generated metal ions and electrons resulting from leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the side surface 3d. Therefore, a configuration in which the electrical insulating film EI includes the film portion EIa located on the region between the second electrode layers E2 on the side surface 3d suppresses the occurrence of migration even in a configuration in which the external electrode 5 includes the second electrode layer E2 located on the side surface 3d. In the multilayer capacitor C1, the electrical insulating film EI is disposed only on the side surface 3c and the side surface 3d. The electrical insulating film EI can be formed more easily than when it is disposed on the side surfaces 3a and 3b, and on the side surfaces 3c and 3d, for example.

[0082] In the multilayer capacitor C1, the internal electrodes 7 and 9 face each other in the direction in which the side surface 3c and the side surface 3d face each other. In the multilayer capacitor C1, electrons tend to be supplied as leakage current from the internal electrodes 7 and 9 to the second electrode layers E2 located on the side surfaces 3c and 3d. However, as described above, the film portion EIa inhibits the reaction between the generated metal ions and the electrons. Therefore, the occurrence of migration is reliably suppressed in the multilayer capacitor C1 as well.

[0083] In the multilayer capacitor C1, the multiple internal electrodes 7, 9 include an outermost internal electrode 9p adjacent to the side surface 3c and an outermost internal electrode 7p adjacent to the side surface 3d. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction perpendicular to the side surface 3c, the outermost internal electrode 9p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 9p. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are viewed in a direction perpendicular to the side surface 3d, the outermost internal electrode 7p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p. In the multilayer capacitor C1, electrons tend to be supplied as leakage current from the outermost internal electrode 9p to the second electrode layer E2 located on the side surface 3c. However, as described above, the film portion EIa inhibits the reaction between the generated metal ions and the electrons caused by the leakage current. Metal is less likely to deposit on the side surface 3c. In the multilayer capacitor C1, electrons tend to be supplied as leakage current from the outermost internal electrode 7p to the second electrode layer E2 located on the side surface 3d. However, as described above, the film portion EIa inhibits the reaction between the generated metal ions and the electrons caused by the leakage current. Metal is less likely to deposit on the side surface 3d. Therefore, the occurrence of migration is also reliably suppressed in the multilayer capacitor C1. In the multilayer capacitor C1, the length of the internal electrodes 7, 9 in the direction in which the pair of end faces 3e face each other can be increased, and therefore the capacitance of the multilayer capacitor C1 can be increased.

[0084] In the multilayer capacitor C1, the second electrode layer E2 continuously covers part of the side surface 3a, part of the side surface 3c, part of the side surface 3d, and part of the corresponding one of the pair of end surfaces 3e. The multilayer capacitor C1 can reduce the amount of conductive resin paste used to form the second electrode layer E2 compared to a configuration in which the second electrode layer E2 continuously covers a part of the side surface 3a, a part of the side surface 3c, a part of the side surface 3d, and the entire corresponding end surface 3e. The reduction in the amount of conductive resin paste used can reduce the length of the second electrode layer E2 in the direction in which the pair of end surfaces 3e face each other, and can increase the distance between the pair of external electrodes 5 on the side surfaces 3a, 3c, and 3d. The increase in the distance between the pair of external electrodes 5 reduces the electric field generated between the pair of external electrodes 5. Therefore, the generated metal ions are less likely to move from the second electrode layer E2. As a result, the multilayer capacitor C1 can further suppress the occurrence of migration. The multilayer capacitor C1 has a lower ESR than a configuration in which the second electrode layer E2 continuously covers a part of the side surface 3a, a part of the side surface 3c, a part of the side surface 3d, and the entire corresponding end surface 3e.The multilayer capacitor C1 has a lower ESR than a configuration in which the second electrode layer E2 continuously covers the entire side surface 3a, the entire side surface 3c, the entire side surface 3d, and the entire corresponding end surface 3e.

[0085] Third embodiment The multilayer capacitor C1 in accordance with the third embodiment will be described with reference to Figs. 15 to 19. Fig. 15 is a perspective view showing an electronic component in accordance with the third embodiment. Figs. 16 to 19 are views showing the cross-sectional configuration of the electronic component in accordance with the third embodiment. The multilayer capacitor C1 in accordance with the third embodiment has the same cross-sectional configuration as the cross-sectional configuration shown in Fig. 8. The multilayer capacitor C1 in accordance with the third embodiment is generally similar to or the same as the multilayer capacitor C1 in accordance with the first embodiment described above, but the multilayer capacitor C1 in accordance with the third embodiment differs from the multilayer capacitor C1 in accordance with the first embodiment in terms of the configuration of the external electrodes 5 and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 in accordance with the first embodiment.

[0086] The multilayer capacitor C1 according to the third embodiment includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9, as in the multilayer capacitor C1 according to the first embodiment. The side surface 3a is a mounting surface. Each of the pair of external electrodes 5 includes a second electrode layer E2 located on the side surface 3c and the side surface 3a. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layer E2 on the side surface 3a. Each of the pair of external electrodes 5 includes a second electrode layer E2 located on the side surface 3c and the side surface 3b. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layer E2 on the side surface 3b. In the third embodiment, for example, when the side surface 3a includes the second side surface, the side surface 3b includes the fourth side surface. For example, when the side surface 3c includes the first side surface, the side surface 3d includes the third side surface.

[0087] Each of the external electrodes 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. Each of the electrode portions 5a, 5b, 5c, 5d, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 includes a conductive resin layer. The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and the electrical insulating film EI. In the electrode portion 5b, the second electrode layer E2 is formed on the first electrode layer E1 so as to cover the first electrode layer E1 of the electrode portion 5b, and is also formed on the electrical insulating film EI so as to cover a part of the electrical insulating film EI. The second electrode layer E2 of the electrode portion 5b is in contact with the part of the electrical insulating film EI and the entire first electrode layer E1. In the electrode portion 5b, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the electrical insulating film EI. In the electrode portion 5b, the second electrode layer E2 indirectly covers the side surface 3b so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3b. The second electrode layer E2 of the electrode portion 5b is located on the side surface 3b. The second electrode layer E2 of the electrode portion 5b is formed on the edge E2b located on the side surface 3b. e Includes.

[0088] The third electrode layer E3 of the electrode unit 5b is disposed on the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5b is located on the side surface 3b.

[0089] In the electrode portion 5c, the second electrode layer E2 is formed so as to cover the part of the first electrode layer E1 and the part of the side surface 3c, and to cover another part of the first electrode layer E1 and another part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the other part of the first electrode layer E1 and the other part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c covers the other part of the first electrode layer E1 of the electrode portion 5c. The area included in the side surface 3c and covered by the second electrode layer E2 is located, for example, near the side surface 3a and the end surface 3e, and near the side surface 3b and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the other part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode portion 5c is covered with the second electrode layer E2 at the above-mentioned portion and the other portion, and is exposed from the second electrode layer E2 at the remaining portion excluding the above-mentioned portion and the other portion.

[0090] The electrode portion 5c includes a plurality of regions 5c1, 5c2, and 5c3. For example, the electrode portion 5c includes only three regions 5c1, 5c2, and 5c3. The region 5c3 is located closer to the side surface 3b than the region 5c1. The region 5c3 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The region 5c3 includes a region where the first electrode layer E1 is covered with the second electrode layer E2. In the first direction D1, the region 5c1 is located between the region 5c2 and the region 5c3.

[0091] In the electrode unit 5d, the second electrode layer E2 is formed so as to cover the part of the first electrode layer E1 and the part of the side surface 3d, and to cover another part of the first electrode layer E1 and another part of the side surface 3d. In the electrode unit 5d, the second electrode layer E2 is in direct contact with the other part of the first electrode layer E1 and the other part of the side surface 3d. The second electrode layer E2 of the electrode unit 5d covers the other part of the first electrode layer E1 of the electrode unit 5d. The region included in the side surface 3d and covered by the second electrode layer E2 is located, for example, near the side surface 3a and the end surface 3e, and near the side surface 3b and the end surface 3e. In the electrode unit 5d, the second electrode layer E2 indirectly covers the other part of the side surface 3d so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3d. The first electrode layer E1 of the electrode unit 5d is covered with the second electrode layer E2 at the above-mentioned portion and the other portion, and is exposed from the second electrode layer E2 at the remaining portion excluding the above-mentioned portion and the other portion.

[0092] The electrode portion 5d includes a plurality of regions 5d1, 5d2, and 5d3. For example, the electrode portion 5d includes only three regions 5d1, 5d2, and 5d3. The region 5d3 is located closer to the side surface 3b than the region 5d1. The region 5d3 includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The region 5d3 includes a region where the first electrode layer E1 is covered with the second electrode layer E2. In the first direction D1, the region 5d1 is located between the region 5d2 and the region 5d3.

[0093] In the electrode unit 5e, the second electrode layer E2 is formed so as to cover the part of the first electrode layer E1 and cover another part of the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the other part of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5e covers the other part of the first electrode layer E1 of the electrode unit 5e. In the electrode unit 5e, the second electrode layer E2 indirectly covers the other part of the end face 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The other part of the end face 3e is located, for example, closer to the side face 3b of the end face 3e. The first electrode layer E1 of the electrode unit 5e is covered by the second electrode layer E2 in the part and the other part, and is exposed from the second electrode layer E2 in the remaining part excluding the part and the other part.

[0094] The electrode portion 5e includes a plurality of regions 5e1, 5e2, and 5e3. For example, the electrode portion 5e includes only three regions 5e1, 5e2, and 5e3. The region 5e3 is located closer to the side surface 3b than the region 5e1. The region 5e3 includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The region 5e3 is a region where the first electrode layer E1 is covered with the second electrode layer E2. In the first direction D1, the region 5e1 is located between the region 5e2 and the region 5e3.

[0095] In the multilayer capacitor C1 according to the third embodiment, the second electrode layer E2 continuously covers only a part of the side surface 3a, only a part of the end surface 3e, and only a part of each of the side surfaces 3c and 3d, and also continuously covers only a part of the side surface 3b, only another part of the end surface 3e, and only another part of each of the side surfaces 3c and 3d. The second electrode layer E2 may continuously cover only a part of the side surfaces 3a and 3b, only a part of the end surface 3e, and only a part of each of the side surfaces 3c and 3d. The second electrode layer E2 may continuously cover only a part of the side surfaces 3a and 3b, and only a part of each of the side surfaces 3c and 3d, in which case the second electrode layer E2 includes a plurality of parts that are separated from each other. The second electrode layer E2 includes a first portion provided so as to continuously cover only a part of the side surface 3a, only a part of the end surface 3e, and only a part of each of the side surfaces 3c and 3d, and a second portion provided so as to continuously cover only a part of the side surface 3b, only another part of the end surface 3e, and only another part of each of the side surfaces 3c and 3d. The part of the end surface 3e is located closer to the side surface 3a. The parts of each of the side surfaces 3c and 3d are located closer to the side surface 3a. The other part of the end surface 3e is located closer to the side surface 3b. The other part of each of the side surfaces 3c and 3d is located closer to the side surface 3b. The second electrode layer E2 covers the entirety of one ridge line portion 3g, only a part of the ridge line portion 3i, and only a part of the ridge line portion 3j, and covers the entirety of the other ridge line portion 3g, only another part of the ridge line portion 3i, and only another part of the ridge line portion 3j. A part of the portion of the first electrode layer E1 covering the ridge portion 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 included in each of the regions 5c1, 5d1, and 5e1 is exposed from the second electrode layer E2. In a configuration in which the electrode portion 5e does not include the second electrode layer E2, the second electrode layer E2 continuously covers only a portion of each of the side surfaces 3c, 3d and only a portion of each of the side surfaces 3a, 3b. The second electrode layer E2 includes a portion provided so as to continuously cover only a portion of each of the side surfaces 3a, 3b and only a portion of each of the side surfaces 3c, 3d.

[0096] The film portion EIa is disposed at least on a region between the pair of external electrodes 5 on the side surfaces 3a and 3b. The side surfaces 3c and 3d, the pair of end faces 3e, and the ridges 3g, 3i, and 3j are exposed from the electrical insulating film EI. The electrical insulating film EI includes the film portion EIa located on a region between the second electrode layers E2 on each of the side surfaces 3a and 3b.

[0097] The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the first direction D1. The multiple internal electrodes 7 include an outermost internal electrode 7p adjacent to the side surface 3b. When the outermost internal electrode 7p and the second electrode layer E2 that is not electrically connected to the outermost internal electrode 7p are viewed in a direction perpendicular to the side surface 3c (third direction D3), the outermost internal electrode 7p overlaps with the second electrode layer E2 that is not electrically connected to the outermost internal electrode 7p. The multiple internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3a. When the outermost internal electrode 9p and the second electrode layer E2 that is not electrically connected to the outermost internal electrode 9p are viewed in a direction perpendicular to the side surface 3c (third direction D3), the outermost internal electrode 9p overlaps with the second electrode layer E2 that is not electrically connected to the outermost internal electrode 9p. In the third embodiment, the multiple internal electrodes 7 and the multiple internal electrodes 9 may be arranged alternately in the third direction D3.

[0098] In the multilayer capacitor C1, the element body 3 includes a side surface 3b opposite to the side surface 3a. The second electrode layer E2 is located on the side surface 3b. The electrically insulating film EI includes a film portion EIa located on a region between the second electrode layers E2 on the side surface 3b. In the multilayer capacitor C1, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 suppresses the occurrence of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the side surface 3c. In the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the region between the second electrode layers E2 on the side surfaces 3a and 3b. Therefore, even if metal particles included in the second electrode layer E2 located on the side surfaces 3a and 3b are ionized, the film portion EIa inhibits the reaction between the generated metal ions and electrons resulting from leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the side surfaces 3a and 3b. As a result, the multilayer capacitor C1 suppresses the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on the side surface 3a and the side surface 3b.

[0099] Fourth embodiment The multilayer capacitor C1 in accordance with the fourth embodiment will be described with reference to Figs. 20 to 23. Fig. 20 is a perspective view showing the electronic component in accordance with the fourth embodiment. Figs. 21 to 23 are views showing the cross-sectional configuration of the electronic component in accordance with the fourth embodiment. The multilayer capacitor C1 in accordance with the fourth embodiment is generally similar to or the same as the multilayer capacitor C1 in accordance with the first embodiment described above, but the multilayer capacitor C1 in accordance with the fourth embodiment differs from the multilayer capacitor C1 in accordance with the first embodiment in terms of the configuration of the external electrodes 5 and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 in accordance with the first embodiment.

[0100] The multilayer capacitor C1 in accordance with the fourth embodiment includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9, similar to the multilayer capacitor C1 in accordance with the first embodiment. The side surface 3a is the mounting surface. In the fourth embodiment, for example, when the side surface 3a includes the second side surface, the side surface 3b includes the fourth side surface. For example, when the side surface 3c includes the first side surface, the side surface 3d includes the third side surface. Each of the external electrodes 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. Each of the electrode portions 5a, 5b, 5c, 5d, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 includes a conductive resin layer. The second electrode layer E2 of the electrode unit 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is formed on the first electrode layer E1 so as to cover the first electrode layer E1 of the electrode unit 5c, and is also formed on the side surface 3c so as to cover a portion of the side surface 3c. In the electrode unit 5c, the second electrode layer E2 is in contact with the portion of the side surface 3c and the entire first electrode layer E1. The first electrode layer E1 of the electrode unit 5c is entirely covered by the second electrode layer E2. The first electrode layer E1 of the electrode unit 5c does not include an area exposed from the second electrode layer E2. The second electrode layer E2 of the electrode unit 5d is disposed on the first electrode layer E1 and the side surface 3d. In the electrode unit 5d, the second electrode layer E2 is formed on the first electrode layer E1 so as to cover the first electrode layer E1 of the electrode unit 5d, and is also formed on the side surface 3d so as to cover a portion of the side surface 3d. In the electrode unit 5d, the second electrode layer E2 is in contact with the portion of the side surface 3d and the entire first electrode layer E1. The first electrode layer E1 of the electrode unit 5d is entirely covered by the second electrode layer E2. The first electrode layer E1 of the electrode unit 5d does not include a region exposed from the second electrode layer E2. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed on the first electrode layer E1 so as to cover the first electrode layer E1 of the electrode unit 5e. In the electrode unit 5e, the second electrode layer E2 is in contact with the entire first electrode layer E1. The first electrode layer E1 of the electrode unit 5e is entirely covered by the second electrode layer E2. The first electrode layer E1 of the electrode unit 5e does not include a region exposed from the second electrode layer E2. The multiple internal electrodes 7 and the multiple internal electrodes 9 are alternately arranged in the first direction D1. In the fourth embodiment, the multiple internal electrodes 7 and the multiple internal electrodes 9 may be alternately arranged in the third direction D3.

[0101] In the multilayer capacitor C1, the element body 3 includes a side surface 3b opposite to the side surface 3a. The second electrode layer E2 is located on the side surface 3b. The electrically insulating film EI includes a film portion EIa located on a region between the second electrode layers E2 on the side surface 3b. In the multilayer capacitor C1, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 suppresses the occurrence of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, electrons are unlikely to be supplied to the metal ions. Metal is unlikely to deposit on the side surface 3c. In the multilayer capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the region between the second electrode layers E2 on the side surfaces 3a and 3b. Therefore, even if metal particles included in the second electrode layer E2 located on the side surfaces 3a and 3b are ionized, the film portion EIa inhibits the reaction between the generated metal ions and electrons resulting from leakage current. Electrons are not easily supplied to the metal ions. Metal is not easily precipitated on the side surfaces 3a and 3b. As a result, the multilayer capacitor C1 suppresses the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on the side surface 3a and the side surface 3b.

[0102] Fifth embodiment An electronic component device according to a fifth embodiment will be described with reference to Fig. 24. Fig. 24 is a diagram showing the electronic component device according to the fifth embodiment. In the fifth embodiment, the electronic component device ECD includes the multilayer capacitor C1 according to the first embodiment and an electronic device ED. The multilayer capacitor C1 is mounted on the electronic device ED. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED includes, for example, a circuit board or an electronic component. The electronic component device ECD may include the multilayer capacitor C1 according to the modified example of the first embodiment and the second to fourth embodiments, and the electronic device ED. The electronic device ED includes a side surface EDa. The electronic device ED includes a pair of pad electrodes PE arranged on the side surface EDa. The pair of pad electrodes PE are electrically connected to the multilayer capacitor C1. Each of the pair of pad electrodes PE is electrically connected to a corresponding one of the pair of external electrodes 5. The pair of pad electrodes PE are spaced apart from each other in the second direction D2. The multilayer capacitor C1 is arranged in the electronic device ED such that the side surface EDa and the side surface 3a face each other. Each of the internal electrodes 7, 9 is located in a plane substantially perpendicular to the side surface EDa. The side surface 3a is a mounting surface. When the multilayer capacitor C1 is solder-mounted, molten solder wets and rises up the external electrodes 5 (third electrode layers E3). When the wetted solder solidifies, solder fillets SF are formed on the external electrodes 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillets SF.

[0103] In the above-described embodiments and modifications, a multilayer capacitor has been described as an example of an electronic component, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, and multilayer composite components, or electronic components other than multilayer electronic components.

[0104] When the outermost internal electrodes 7p, 9p and the second electrode layer E2 not electrically connected to the outermost internal electrodes 7p, 9p are viewed in a direction perpendicular to the side surface 3c, the outermost internal electrodes 7p, 9p may not overlap with the second electrode layer E2 not electrically connected to the outermost internal electrodes 7p, 9p. When the outermost internal electrodes 7p, 9p and the second electrode layer E2 not electrically connected to the outermost internal electrodes 7p, 9p are viewed in a direction perpendicular to the side surface 3c, the outermost internal electrodes 7p, 9p overlap with the second electrode layer E2 not electrically connected to the outermost internal electrodes 7p, 9p. As described above, in the configuration in which the outermost internal electrodes 7p, 9p and the second electrode layer E2 not electrically connected to the outermost internal electrodes 7p, 9p overlap with the second electrode layer E2 located on the side surface 3c, electrons tend to be supplied as leakage current from the outermost internal electrodes 9p to the second electrode layer E2 located on the side surface 3c. However, as described above, in the region R2, electrons are difficult to be supplied to metal ions. Therefore, the occurrence of migration is reliably suppressed in the multilayer capacitor C1. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction perpendicular to the side surface 3c, the outermost internal electrode 9p may not overlap with the second electrode layer E2 not electrically connected to the outermost internal electrode 9p. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction perpendicular to the side surface 3c, in a configuration in which the outermost internal electrode 9p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 9p, as described above, electrons tend to be supplied as leakage current from the outermost internal electrode 9p to the second electrode layer E2 located on the side surface 3c. However, the film portion EIa inhibits the reaction between the generated metal ions and the electrons caused by the leakage current. Metal is unlikely to deposit on the side surface 3c. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are viewed in a direction perpendicular to the side surface 3d, the outermost internal electrode 7p may not overlap with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are viewed in a direction perpendicular to the side surface 3d, the outermost internal electrode 7p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p. In this configuration, electrons tend to be supplied as leakage current from the outermost internal electrode 7p to the second electrode layer E2 located on the side surface 3d. However, the film portion EIa inhibits the reaction between the generated metal ions and the electrons caused by the leakage current. Metal is unlikely to deposit on the side surface 3d. Therefore, in the multilayer capacitor C1, the occurrence of migration is reliably suppressed.

[0105] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) An element body having a rectangular parallelepiped shape, including a pair of end faces facing each other, and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes each including a conductive resin layer located on the first side surface and the second side surface, the external electrodes being disposed on both ends of the element body in a direction in which the pair of end surfaces face each other; a plurality of internal electrodes disposed within the element body and electrically connected to corresponding ones of the plurality of external electrodes; an electrical insulating film disposed on the element body; The element body is a first region located away from the first side surface and in which the plurality of internal electrodes are disposed; a second region including the first side and having a dielectric constant less than the dielectric constant of the first region; The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side. (Appendix 2) the element body further includes a third side surface opposing the first side surface, and a third region including the third side surface and having a dielectric constant smaller than a dielectric constant of the first region, 2. The electronic component described in claim 1, wherein the conductive resin layer is further located on the third side surface. (Appendix 3) The electronic component of claim 2, wherein the internal electrodes face each other in a direction perpendicular to the direction in which the pair of end faces face each other and the direction in which the first side surface and the third side surface face each other. (Appendix 4) the plurality of internal electrodes includes an outermost internal electrode adjacent to the second side surface, The electronic component described in Appendix 3, wherein when the outermost internal electrode and the conductive resin layer that is not electrically connected to the outermost internal electrode are viewed in a direction perpendicular to the first side surface, the outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the outermost internal electrode. (Appendix 5) The electronic component described in any one of Appendices 2 to 4, wherein the conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the third side surface, and a portion of a corresponding one of the pair of end surfaces. (Appendix 6) The electronic component described in Appendix 1, wherein the electrical insulating film further includes a film portion located on a fourth side surface opposite the second side surface and located on a region between the conductive resin layers on the fourth side surface. (Appendix 7) the element body further includes a third side face opposing the first side face and a fourth side face opposing the second side face, and further includes a third region including the third side face and having a dielectric constant smaller than a dielectric constant of the first region; the conductive resin layer is further located on the fourth side surface, The electronic component described in Appendix 1, wherein the electrical insulating film further includes a film portion located on a region between the conductive resin layers on the fourth side surface. (Appendix 8) 8. The electronic component of claim 7, wherein the internal electrodes face each other in a direction in which the second side surface and the fourth side surface face each other. (Appendix 9) the plurality of internal electrodes include a first outermost internal electrode adjacent to the second side surface and a second outermost internal electrode adjacent to the fourth side surface, When the first outermost internal electrode and the conductive resin layer that is not electrically connected to the first outermost internal electrode are viewed in a direction perpendicular to the second side surface, the first outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the first outermost internal electrode, the second outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the second outermost internal electrode when the second outermost internal electrode and the conductive resin layer that is not electrically connected to the second outermost internal electrode are viewed in a direction perpendicular to the fourth side surface. (Appendix 10) The electronic component described in any one of Appendices 7 to 9, wherein the conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the fourth side surface, and a portion of a corresponding one of the pair of end surfaces. (Appendix 11) 7. The electronic component according to claim 1, wherein each of the internal electrodes is located within the first region away from an end of the first region that faces the first side surface. (Appendix 12) The electronic component described in Appendix 2 or 7, wherein each of the multiple internal electrodes is located within the first region away from an end of the first region that faces the third side surface. (Appendix 13) 13. The electronic component according to any one of claims 1 to 12, wherein the conductive resin layer contains a plurality of Ag particles. (Appendix 14) An element body having a rectangular parallelepiped shape, including a pair of end faces facing each other, and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes each including a conductive resin layer located on the first side surface and the second side surface, the external electrodes being disposed on both ends of the element body in a direction in which the pair of end surfaces face each other; a plurality of internal electrodes disposed within the element body and electrically connected to corresponding ones of the plurality of external electrodes; an electrical insulating film disposed on the element body; the first side has a surface resistivity greater than a surface resistivity of the second side; The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side. [Explanation of symbols]

[0106] 3...Element body, 3a, 3b, 3c, 3d...side surface, 3e...end surface, 5...external electrode, 7...internal electrode, 9...internal electrode, B1, B2...edge, C1...multilayer capacitor, EI...electrical insulating film, EIa...membrane part, R1, R2, R3...area.

Claims

1. An element body having a rectangular parallelepiped shape, including a pair of end faces facing each other, and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes each including a conductive resin layer located on the first side surface and the second side surface, the external electrodes being disposed on both ends of the element body in a direction in which the pair of end surfaces face each other; a plurality of internal electrodes disposed within the element body and electrically connected to corresponding ones of the plurality of external electrodes; an electrical insulating film disposed on the element body; The element body is a first region located away from the first side surface and in which the plurality of internal electrodes are disposed; a second region including the first side and having a dielectric constant less than the dielectric constant of the first region; The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side.

2. the element body further includes a third side surface opposing the first side surface, and a third region including the third side surface and having a dielectric constant smaller than a dielectric constant of the first region, The electronic component according to claim 1 , wherein the conductive resin layer is further located on the third side surface.

3. The electronic component according to claim 2 , wherein the internal electrodes face each other in a direction perpendicular to a direction in which the pair of end faces face each other and a direction in which the first side surface and the third side surface face each other.

4. the plurality of internal electrodes includes an outermost internal electrode adjacent to the second side surface, 4. The electronic component according to claim 3, wherein when the outermost internal electrode and the conductive resin layer that is not electrically connected to the outermost internal electrode are viewed in a direction perpendicular to the first side surface, the outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the outermost internal electrode.

5. The electronic component according to claim 2 , wherein the conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the third side surface, and a portion of a corresponding one of the pair of end surfaces.

6. The body further includes a fourth side surface opposite to the second side surface, the conductive resin layer is further located on the fourth side surface, The electronic component according to claim 1 , wherein the electrical insulating film further includes a film portion located on a region between the conductive resin layers on the fourth side surface.

7. the element body further includes a third side face opposing the first side face and a fourth side face opposing the second side face, and further includes a third region including the third side face and having a dielectric constant smaller than a dielectric constant of the first region; the conductive resin layer is further located on the fourth side surface, The electronic component according to claim 1 , wherein the electrical insulating film further includes a film portion located on a region between the conductive resin layers on the fourth side surface.

8. The electronic component according to claim 7 , wherein the internal electrodes face each other in a direction in which the second side surface and the fourth side surface face each other.

9. the plurality of internal electrodes include a first outermost internal electrode adjacent to the second side surface and a second outermost internal electrode adjacent to the fourth side surface, When the first outermost internal electrode and the conductive resin layer that is not electrically connected to the first outermost internal electrode are viewed in a direction perpendicular to the second side surface, the first outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the first outermost internal electrode, 9. The electronic component according to claim 8, wherein when the second outermost internal electrode and the conductive resin layer that is not electrically connected to the second outermost internal electrode are viewed in a direction perpendicular to the fourth side surface, the second outermost internal electrode overlaps with the conductive resin layer that is not electrically connected to the second outermost internal electrode.

10. The electronic component according to any one of claims 7 to 9, wherein the conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the fourth side surface, and a portion of a corresponding one of the pair of end surfaces.

11. The electronic component according to claim 1 , wherein each of the plurality of internal electrodes is located within the first region away from an end of the first region facing the first side surface.

12. The electronic component according to claim 2 or 7, wherein each of the plurality of internal electrodes is located within the first region away from an end of the first region facing the third side surface.

13. The electronic component according to claim 1 , wherein the conductive resin layer contains a plurality of Ag particles.

14. An element body having a rectangular parallelepiped shape, including a pair of end faces facing each other, and a first side surface and a second side surface adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes each including a conductive resin layer located on the first side surface and the second side surface, the external electrodes being disposed on both ends of the element body in a direction in which the pair of end surfaces face each other; a plurality of internal electrodes disposed within the element body and electrically connected to corresponding ones of the plurality of external electrodes; an electrical insulating film disposed on the element body; the first side has a surface resistivity greater than a surface resistivity of the second side; The electrical insulating film includes a film portion located on a region between the conductive resin layers on the second side.

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