Processing apparatus and processing process

Abstract

To provide a processing apparatus and a processing process capable of dispensing with a driving source, reducing cost, and improving productivity in processing a workpiece.SOLUTION: A processing apparatus 10 capable of performing heating, pressurization, and atmosphere control on a substrate 90 includes: a movable chamber 20 including a chamber portion 212 in which the substrate 90 is disposed. When the chamber portion 212 is evacuated in the atmosphere control, a predetermined region of the substrate 90 can be pressurized by a negative pressure generated by the evacuation.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a processing apparatus and a processing process for processing a workpiece such as a substrate. [Background technology]

[0002] In recent years, research and development has been conducted to contribute to energy efficiency so that more people can have access to affordable, reliable, sustainable and advanced energy.

[0003] There is a demand for contributions to energy efficiency in processing devices and processes for processing workpieces such as substrates. For example, Patent Document 1 describes a processing device that can reduce the pressing force required for pressure bonding. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-061487 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the processing device of Patent Document 1 requires a drive source for generating a pressing force, so there is room for improvement in terms of cost reduction and productivity.

[0006] The present invention provides a processing device and a processing process that eliminate the need for a drive source, thereby reducing costs and improving productivity in processing workpieces. [Means for solving the problem]

[0007] The first aspect of the present invention is A processing apparatus capable of applying heat, pressure, and controlling the atmosphere to a workpiece, a chamber device having a chamber portion in which the workpiece is placed, When the chamber is evacuated in the atmosphere control, a predetermined area of ​​the workpiece can be pressurized by a negative pressure caused by the evacuation. It is a processing device.

[0008] A second aspect of the present invention is A processing process in which heat, pressure, and atmospheric control are performed on a workpiece, When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized using a negative pressure generated by the evacuation. It is a processing process. Effect of the Invention

[0009] According to the present invention, a drive source for applying pressure to a predetermined area of ​​a workpiece is not required, which reduces costs and improves productivity in processing workpieces. [Brief description of the drawings]

[0010] [Figure 1] 2 is a perspective view of a movable chamber in the processing apparatus according to one embodiment of the present invention; FIG. [Diagram 2] FIG. 2 is a side view of the movable chamber of FIG. 1. [Diagram 3] FIG. 3 is a cross-sectional view of a main part of the movable chamber of FIG. 2. [Figure 4] 2 is a schematic diagram of a heating device in the processing apparatus according to one embodiment of the present invention. FIG. [Diagram 5] 5 is a flowchart showing an example of a substrate processing process using the processing apparatus shown in FIGS. 1 to 4. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of a processing device and a processing process of the present invention will be described with reference to the accompanying drawings. Note that the drawings should be viewed in the direction indicated by the reference numerals.

[0012] (Configuration of processing equipment) The processing apparatus 10 of this embodiment can apply heat, pressure, and control the atmosphere to a substrate 90, which is a workpiece. The processing apparatus 10 includes a movable chamber 20 (see FIGS. 1 to 3) and a heating device 30 (see FIG. 4).

[0013] As shown in Figures 1 to 3, the movable chamber 20 includes a base member 21, a mounting table 22 placed on the base member 21 and on which a substrate 90 is placed, a cover member 23 covering the upper part of the base member 21, a pressure shaft 24 for pressurizing the substrate 90, a vacuum pipe 25 connected to the base member 21, and a vacuum valve 26 provided on the vacuum pipe 25.

[0014] The base member 21 includes a base portion 211 , a chamber portion 212 , a flow path portion 213 , and a vacuum inlet 214 .

[0015] The base portion 211 has a bottom portion 211a having a substantially circular disk shape, and a side wall portion 211b having a substantially cylindrical shape extending upward from the outer periphery of the bottom portion 211a. Seal grooves 211c and 211d are formed in the inner periphery and upper surface of the side wall portion 211b, respectively, and O-rings 211e and 211f are disposed in the seal grooves 211c and 211d, respectively.

[0016] The chamber portion 212 is a space surrounded by side walls 211b of the base member 21 on the front, rear, left and right sides, and surrounded by a bottom portion 211a of the base member 21 below.

[0017] One end of the flow path portion 213 opens from the side wall portion 211 b of the base portion 211 , and the other end communicates with the chamber portion 212 .

[0018] The vacuum inlet 214 is provided at an opening of the flow path section 213 formed in the side wall section 211 b of the base section 211 .

[0019] The mounting table 22 is placed on the bottom 211a of the base portion 211 inside the chamber portion 212 of the base member 21. The mounting table 22 has a mounting portion 221 having a concave shape recessed downward, and the substrate 90 can be accommodated in the recess of the mounting portion 221 while being aligned.

[0020] The cover member 23 is a member having a substantially circular ring shape as viewed from above, which covers an upper portion of the chamber portion 212 of the base member 21. A shaft insertion portion 231 is formed in the center of the cover member 23, extending in a substantially cylindrical shape downward from the upper surface of the cover member 23. The shaft insertion portion 231 is formed so that the pressurizing shaft 24 can slide in the vertical direction.

[0021] The lower surface of the cover member 23 abuts against an O-ring 211e disposed in a seal groove 211c formed in the inner peripheral surface of the side wall portion 211b of the base portion 211, and the outer peripheral surface of the shaft insertion portion 231 abuts against an O-ring 211f disposed in a seal groove 211d formed in the upper surface of the side wall portion 211b of the base portion 211. As a result, the cover member 23 is fitted to the base member 21 in a sealed manner. The cover member 23 is fixed to the base member 21 by a fixing member such as a bolt. In this embodiment, the cover member 23 is fastened to the upper surface of the base member 21 by a bolt.

[0022] A bearing 231a having a shaft seal is formed on the inner circumferential surface of the shaft insertion portion 231. In this embodiment, the bearings 231a having shaft seals are formed in two stages, upper and lower.

[0023] The pressure shaft 24 has a substantially cylindrical shape having a bottom 241. The pressure shaft 24 is inserted into the shaft insertion portion 231 of the cover member 23. The pressure shaft 24 is supported by a bearing 231a having a shaft seal formed on the inner circumferential surface of the shaft insertion portion 231 of the cover member 23, and at least a portion of the pressure shaft 24 is capable of sliding up and down inside the chamber portion 212 while the pressure shaft 24 and the cover member 23 are sealed.

[0024] As a result, the upper part of the chamber section 212 of the base member 21 is closed by the cover member 23 and the pressure shaft 24, and the chamber section 212 of the base member 21 becomes an enclosed space.

[0025] One end of the vacuum pipe 25 is connected to the vacuum inlet 214 of the base member 21. The other end of the vacuum pipe 25 is detachably connected to a vacuum pump (not shown).

[0026] The vacuum valve 26 is provided in the vacuum pipe 25. The vacuum valve 26 is, for example, a diaphragm valve, and is a normally closed type valve. It is preferable that the vacuum valve 26 has a small amount of leakage when closed. In addition, the vacuum valve 26 has heat resistance so that it can function even when heated to a predetermined temperature by a heating device 30 described later.

[0027] When processing the substrate 90, after the substrate 90 is placed on the placing portion 221, the positioning member 27 is placed on the upper surfaces of the placing portion 221 and the substrate 90. The positioning member 27 has a flat plate shape, and is placed so as to cover from above the upper surfaces of the placing portion 221 and the substrate 90. A pusher arrangement hole 271 penetrating in the up-down direction is formed in the approximate center of the positioning member 27 in the front-rear and left-right directions.

[0028] When processing the substrate 90, the pusher 28 is placed, which has substantially the same shape as the pusher placement hole 271 and can be inserted into the pusher placement hole 271. The pusher 28 has a thickness greater than that of the positioning member 27 in the up-down direction.

[0029] When a vacuum pump is connected to the other end of the vacuum pipe 25 and a vacuum is drawn, air is exhausted from the chamber 212, which is an enclosed space, and the chamber 212 becomes negative pressure.

[0030] Then, the negative pressure in the chamber section 212 causes the pressure shaft 24 to be drawn into the chamber section 212 and slide downward. Since the thickness of the pusher 28 in the vertical direction is greater than that of the positioning member 27, the pressure shaft 24 comes into contact with the pusher 28 before the positioning member 27 does, and presses the pusher 28 downward. This allows the pusher 28 to apply pressure to a predetermined area of ​​the substrate 90 via the pressure shaft 24.

[0031] In this manner, a predetermined area of ​​the substrate 90 can be pressurized by the negative pressure in the chamber section 212 caused by evacuation.

[0032] This eliminates the need for a drive source for operating the pressure shaft 24, reducing costs and improving productivity in processing the substrate 90.

[0033] Furthermore, pressure can be applied to a predetermined area of ​​the substrate 90 without the need for a drive source and with a simple structure.

[0034] At this time, the bottom area S1 of the bottom 241 of the pressure shaft 24 is 7 times or more, preferably 99 times or more, the area S2 of the pressure-receiving portion of the substrate 90 that is pressured by the pressure shaft 24 via the plunger .

[0035] After the chamber section 212 is in an approximate vacuum state, the vacuum pump is removed from the other end of the vacuum pipe 25. At this time, even if the vacuum pump is removed from the other end of the vacuum pipe 25, the approximate vacuum state of the chamber section 212 is maintained by the vacuum valve 26. This allows the movable chamber 20 to move while maintaining the approximate vacuum state of the chamber section 212.

[0036] This allows one vacuum pump to sequentially put the chamber sections 212 of multiple movable chambers 20 into an approximately vacuum state, thereby reducing the number of vacuum pumps and / or making the vacuum pumps smaller, thereby reducing costs.

[0037] As shown in FIG. 4, the heating device 30 includes a conveyor 31 capable of transporting the movable chamber 20, and an in-line oven 32 capable of heating the substrate 90 contained in the movable chamber 20 by the movable chamber 20 being transported by the conveyor 31 passing through the in-line oven 32.

[0038] The vacuum pump is removed from the other end of the vacuum pipe 25, and the movable chamber 20, which is now movable while maintaining the approximate vacuum state of the chamber section 212, is placed on the conveyor 31, and the conveyor 31 is driven. Then, the movable chamber 20 passes through the in-line oven 32, whereby the substrate 90 accommodated in the movable chamber 20 is heated to a predetermined temperature.

[0039] In this way, while maintaining an approximately vacuum state in the chamber section 212 and pressurizing the substrate 90 by the pressure shaft 24 via the plunger 28, the substrate 90 contained in the movable chamber 20 can be heated to a predetermined temperature, so that heating, pressurization, and atmospheric control can be performed on the substrate 90 simultaneously.

[0040] This further improves the productivity when processing the substrate 90.

[0041] The heating device 30 for heating the substrate 90 is provided separately from the movable chamber 20 having the chamber section 212 for accommodating the substrate 90 and forming an enclosed space, and the pressure shaft 24 for pressurizing the substrate 90. The substrate 90 is heated by the heating device 30 which is separate from the movable chamber 20 having the chamber section 212 for accommodating the substrate 90 and forming an enclosed space, and the pressure shaft 24 for pressurizing the substrate 90.

[0042] This allows one heating device 30 to heat substrates 90 housed in a plurality of movable chambers 20, thereby further improving productivity when processing substrates 90.

[0043] (An example of a substrate processing process using a processing device) Next, a processing process of the substrate 90 by the processing apparatus 10 will be described with reference to Fig. 5. Here, an example of a processing process will be described in which an element is bonded to the substrate 90 on which an integrated circuit made of copper is formed by diffusion bonding of a bonding material made of gold and nickel.

[0044] First, a substrate 90 having an integrated circuit made of copper is prepared by applying gold and nickel as bonding materials onto the integrated circuit made of copper, and elements are temporarily bonded to the substrate 90 by the bonding materials. The bonding materials are diffusion bonded by heating and pressurizing, and the elements are bonded to the substrate 90.

[0045] Then, the substrate 90 to which the elements have been temporarily bonded by the bonding material is placed in a recess of the mounting portion 221 of the mounting table 22 provided inside the chamber portion 212 of the base member 21 while being aligned (step S101).

[0046] After the substrate 90 is placed on the placement portion 221, the positioning member 27 is positioned and aligned with the upper surfaces of the placement portion 221 and the substrate 90 (step S102). Then, the pusher 28 is placed in the pusher placement hole 271 formed in the positioning member 27 (step S103).

[0047] Next, the cover member 23 with the pressure shaft 24 inserted into the shaft insertion portion 231 is fitted to the base member 21 in a sealed state, and the cover member 23 is fastened to the upper surface of the base member 21 by bolts (step S104).

[0048] In this way, the movable chamber 20 is assembled, in which the substrate 90 is accommodated in the chamber portion 212 which is an enclosed space.

[0049] Thereafter, a vacuum pump (not shown) is attached to the other end of the vacuum pipe 25 of the movable chamber 20 (step S105). Then, the vacuum pump is driven to evacuate the chamber section 212 (step S106).

[0050] Then, the pressure shaft 24 is drawn into the chamber portion 212 by the negative pressure in the chamber portion 212 and slides downward. Then, the pressure shaft 24 comes into contact with the plunger 28 before the positioning member 27 does, and presses the plunger 28 downward. As a result, a predetermined area of ​​the substrate 90 is pressurized at a predetermined pressure by the pressure shaft 24 via the plunger 28.

[0051] This eliminates the need for a drive source for operating the pressure shaft 24, reducing costs and improving productivity in processing the substrate 90.

[0052] Furthermore, pressure can be applied to a predetermined area of ​​the substrate 90 without the need for a drive source and with a simple structure.

[0053] At this time, the bottom area S1 of the bottom 241 of the pressure shaft 24 is 7 times or more, preferably 99 times or more, the pressure-receiving area S2, which is the predetermined area of ​​the substrate 90 pressed by the pusher 28 via the pressure shaft 24.

[0054] After the chamber section 212 is in a substantially vacuum state and a predetermined area of ​​the substrate 90 is pressurized at a predetermined pressure by the pressure shaft 24 via the plunger 28, the vacuum pump is removed from the other end of the vacuum pipe 25 of the movable chamber 20 (step S107). At this time, even if the vacuum pump is removed from the other end of the vacuum pipe 25, the vacuum valve 26 maintains the substantially vacuum state of the chamber section 212. This allows the movable chamber 20 to move while maintaining the substantially vacuum state of the chamber section 212.

[0055] This allows one vacuum pump to sequentially put the chamber sections 212 of multiple movable chambers 20 into an approximately vacuum state, thereby reducing the number of vacuum pumps and / or making the vacuum pumps smaller, thereby reducing costs.

[0056] Next, the movable chamber 20 is placed on the conveyor 31 while maintaining a state in which the chamber section 212 is in a substantially vacuum state and a predetermined area of ​​the substrate 90 is pressurized at a predetermined pressure (step S108).

[0057] Then, the conveyor 31 is driven at a predetermined speed so that the movable chamber 20 placed on the conveyor 31 passes through the in-line oven 32 in a predetermined time (step S109). As a result, the substrate 90 accommodated in the chamber portion 212 of the movable chamber 20 passing through the in-line oven 32 is heated to a predetermined temperature.

[0058] Therefore, the substrate 90 is heated by a heating device 30 separate from the movable chamber 20 having a chamber section 212 that accommodates the substrate 90 and forms a sealed space, and a pressure shaft 24 that pressurizes the substrate 90 .

[0059] This allows one heating device 30 to heat substrates 90 housed in a plurality of movable chambers 20, thereby further improving productivity when processing substrates 90.

[0060] In this way, while maintaining an approximately vacuum state in the chamber section 212 and pressurizing the substrate 90 by the pressure shaft 24 via the plunger 28, the substrate 90 contained in the movable chamber 20 can be heated to a predetermined temperature, so that heating, pressurization, and atmospheric control can be performed on the substrate 90 simultaneously.

[0061] This further improves the productivity when processing the substrate 90.

[0062] In this manner, the substrate 90 accommodated in the chamber portion 212 of the movable chamber 20 passing through the in-line oven 32 is pressurized at a predetermined pressure in a predetermined area while being in a substantially vacuum state and heated to a predetermined temperature. This allows the heating, pressurization, and atmosphere control of the substrate 90 to be performed simultaneously, and the bonding material is diffusion bonded to bond the element to the substrate 90.

[0063] The moving chamber 20 then passes through the in-line oven 32 and is cooled, completing the process.

[0064] In this process, as shown in FIG. 3, the bottom area S1 of the pressure shaft 24 is seven times or more the area S2 of the pressure-receiving portion, which is a predetermined area of ​​the substrate 90 that is pressed by the pusher 28 via the pressure shaft 24, so that the bonding material can be reliably diffusion-bonded.

[0065] Furthermore, since the bottom area S1 of the pressure shaft 24 is 99 times or more the area S2 of the pressurized portion, which is a predetermined area of ​​the substrate 90 pressed by the pusher 28 via the pressure shaft 24, the bonding material can be diffusion bonded more firmly, and the element can be bonded to the substrate 90 with a high bonding rate.

[0066] Although one embodiment of the present invention has been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such an embodiment. It is clear that a person skilled in the art can come up with various modified or revised examples within the scope of the claims, and it is understood that these also naturally belong to the technical scope of the present invention. In addition, the components in the above embodiment may be arbitrarily combined within the scope of the invention.

[0067] For example, in this embodiment, one pressurizing shaft 24 is provided in one movable chamber 20, but multiple pressurizing shafts 24 may be provided in one movable chamber 20. In this case, it is preferable that the same number of mounting tables 22 as the number of pressurizing shafts 24 are provided inside the chamber section 212, and that the same number of substrates 90 as the number of pressurizing shafts 24 can be accommodated. Then, the same number of positioning members 27 and plungers 28 as the number of pressurizing shafts 24 and mounting tables 22 are arranged. This makes it possible to further increase the processing amount per unit time, and further improves productivity.

[0068] This specification describes at least the following items. In parentheses, components corresponding to the above-described embodiment are shown as examples, but the present invention is not limited to these.

[0069] (1) A processing apparatus (processing apparatus 10) capable of applying heat, pressure, and controlling the atmosphere to a workpiece (substrate 90), The workpiece is placed in a chamber unit (movable chamber 20) having a chamber unit (chamber unit 212), When the chamber is evacuated in the atmosphere control, a predetermined area of ​​the workpiece can be pressurized by a negative pressure caused by the evacuation.

[0070] According to (1), a drive source for applying pressure to a predetermined area of ​​the workpiece is not required, which reduces costs and improves productivity in processing the workpiece.

[0071] (2) The processing apparatus according to (1), The chamber device includes: Further, the pressure shaft (pressure shaft 24) is supported by a bearing (bearing 231a) having a shaft seal, and at least a portion of the pressure shaft (pressure shaft 24) is slidable inside the chamber portion, When the chamber is evacuated, the pressure shaft slides due to the negative pressure caused by the evacuation, and pressurizes the predetermined area of ​​the workpiece. Processing equipment.

[0072] According to (2), a drive source is not required and pressure can be applied to a predetermined area of ​​the workpiece with a simple structure.

[0073] (3) The processing apparatus according to (2), The pressurizing shaft is cylindrical and has a bottom (bottom 241). The area of ​​the bottom of the pressure shaft (bottom area S1) is 7 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2). Processing equipment.

[0074] According to (3), when the element is bonded to the workpiece by diffusion bonding with a bonding material, the bonding material can be diffusion bonded reliably.

[0075] (4) The processing apparatus according to (2), The pressurizing shaft is cylindrical and has a bottom (bottom 241). The area of ​​the bottom of the pressure shaft (bottom area S1) is 99 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2). Processing equipment.

[0076] According to (4), when the element is bonded to the workpiece by diffusion bonding the bonding material, the bonding material can be diffusion bonded more firmly, and the element can be bonded to the workpiece with a high bonding rate.

[0077] (5) A processing apparatus according to (1) or (2), By heating the workpiece while maintaining the vacuum state of the chamber, it is possible to simultaneously heat, pressurize, and control the atmosphere of the workpiece. Processing equipment.

[0078] According to (5), the productivity in processing the workpiece is further improved.

[0079] (6) The processing apparatus according to (1) or (2), The chamber device includes a vacuum valve (vacuum valve 26) capable of maintaining the chamber in a vacuum state, A vacuum pump can be detachably connected to the chamber device while maintaining the chamber in a vacuum state. Processing equipment.

[0080] According to (6), since a single vacuum pump can sequentially fill the chambers of multiple chamber devices with an approximately vacuum state, the number of vacuum pumps can be reduced and / or the vacuum pumps can be made smaller, thereby reducing costs.

[0081] (7) A processing apparatus according to (1) or (2), A heating device (heating device 30) is provided separately from the chamber device. Processing equipment.

[0082] According to (7), since workpieces housed in a plurality of chamber devices can be heated by one heating device, productivity in processing the workpieces is improved.

[0083] (8) A processing process in which heat, pressure, and atmospheric control are performed on a workpiece (substrate 90), When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized using a negative pressure generated by the evacuation. Machining process.

[0084] According to (8), a drive source for applying pressure to a predetermined area of ​​the workpiece is not required, which reduces costs and improves productivity in processing the workpiece.

[0085] (9) The process according to (8), Pressurizing the predetermined area of ​​the workpiece using a slidable pressurizing shaft (pressurizing shaft 24) supported by a bearing (bearing 231a) having a shaft seal; When the atmosphere around the workpiece is evacuated, the pressure shaft is caused to slide by the negative pressure caused by the evacuation, and the predetermined area of ​​the workpiece is pressurized. Machining process.

[0086] According to (9), a drive source is not required and pressure can be applied to a predetermined area of ​​the workpiece with a simple structure.

[0087] (10) The process according to (9), The pressurizing shaft is cylindrical and has a bottom (bottom 241). The area of ​​the bottom of the pressure shaft (bottom area S1) is 7 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2). Machining process.

[0088] According to (10), when the element is bonded to the workpiece by diffusion bonding with a bonding material, the bonding material can be diffusion bonded reliably.

[0089] (11) The process according to (9), The pressurizing shaft is cylindrical and has a bottom (bottom 241). The area of ​​the bottom of the pressure shaft (bottom area S1) is 99 times or more the area of ​​the predetermined region of the workpiece (pressurized portion area S2). Machining process.

[0090] According to (11), when an element is bonded to a workpiece by diffusion bonding a bonding material, the bonding material can be diffusion bonded more firmly, and the element can be bonded to the workpiece with a high bonding rate.

[0091] (12) The process according to (8) or (9), By heating the workpiece while maintaining the atmosphere of the workpiece in a vacuum state, the workpiece is simultaneously heated, pressurized, and atmospherically controlled. Machining process.

[0092] According to (12), the productivity in processing the workpiece is further improved.

[0093] (13) A processing method according to (8) or (9), comprising the steps of: The workpiece is processed in a chamber device (movable chamber 20) having a vacuum valve (vacuum valve 26) capable of maintaining the atmosphere of the workpiece in a vacuum state; and removing a vacuum pump from the chamber apparatus while maintaining the atmosphere around the workpiece in a vacuum state by the vacuum valve before heating the workpiece. Machining process.

[0094] According to (13), since a single vacuum pump can sequentially fill the chambers of multiple chamber devices with an approximately vacuum state, the number of vacuum pumps can be reduced and / or the vacuum pumps can be made smaller, resulting in cost reduction.

[0095] (14) A processing method according to (8) or (9), comprising the steps of: A chamber device (movable chamber 20) that accommodates the workpiece can perform pressurization and atmospheric control of the workpiece, The workpiece is heated using a heating device (heating device 30) provided separately from the chamber device; Machining process.

[0096] According to (14), since workpieces housed in a plurality of chamber devices can be heated by one heating device, the productivity in processing the workpieces is further improved. [Explanation of symbols]

[0097] 10 Processing equipment 20 Movable chamber (chamber device) 212 Chamber section 231a Bearing 24 Pressure shaft 241 Bottom 26 Vacuum valve 30 Heating device 90 Substrate (workpiece) S1 Bottom area (area) S2 Area of ​​pressurized part (area)

Claims

1. A processing apparatus capable of applying heat, pressure, and controlling the atmosphere to a workpiece, a chamber device having a chamber portion in which the workpiece is placed, When the chamber is evacuated in the atmosphere control, a predetermined area of ​​the workpiece can be pressurized by a negative pressure caused by the evacuation.

2. The processing apparatus according to claim 1, The chamber device includes: a pressure shaft supported by a bearing having a shaft seal and at least a portion of which is slidable inside the chamber; When the chamber is evacuated, the pressure shaft slides due to the negative pressure caused by the evacuation, and pressurizes the predetermined area of ​​the workpiece. Processing equipment.

3. The processing apparatus according to claim 2, The pressurizing shaft is cylindrical and has a bottom. The area of ​​the bottom of the pressure shaft is 7 times or more the area of ​​the predetermined region of the workpiece. Processing equipment.

4. The processing apparatus according to claim 2, The pressurizing shaft is cylindrical and has a bottom. The area of ​​the bottom of the pressure shaft is 99 times or more the area of ​​the predetermined region of the workpiece. Processing equipment.

5. The processing apparatus according to claim 1 or 2, By heating the workpiece while maintaining the vacuum state of the chamber, it is possible to simultaneously heat, pressurize, and control the atmosphere of the workpiece. Processing equipment.

6. The processing apparatus according to claim 1 or 2, the chamber device includes a vacuum valve capable of maintaining the chamber in a vacuum state; A vacuum pump can be detachably connected to the chamber device while maintaining the chamber section in a vacuum state. Processing equipment.

7. The processing apparatus according to claim 1 or 2, A heating device is provided separately from the chamber device. Processing equipment.

8. A processing process in which heat, pressure, and atmospheric control are performed on a workpiece, When the atmosphere of the workpiece is evacuated, a predetermined region of the workpiece is pressurized using a negative pressure generated by the evacuation. Machining process.

9. 9. The process of claim 8, applying pressure to the predetermined area of ​​the workpiece using a slidable pressure shaft supported by a bearing having a shaft seal; When the atmosphere around the workpiece is evacuated, the pressure shaft is caused to slide by the negative pressure caused by the evacuation, and the predetermined area of ​​the workpiece is pressurized. Machining process.

10. 10. The process of claim 9, The pressurizing shaft is cylindrical and has a bottom. The area of ​​the bottom of the pressure shaft is 7 times or more the area of ​​the predetermined region of the workpiece. Machining process.

11. 10. The process of claim 9, The pressurizing shaft is cylindrical and has a bottom. The area of ​​the bottom of the pressure shaft is 99 times or more the area of ​​the predetermined region of the workpiece. Machining process.

12. 10. The process according to claim 8 or 9, by heating the workpiece while maintaining the atmosphere of the workpiece in a vacuum state, heating, pressurizing, and controlling the atmosphere of the workpiece are performed simultaneously; Machining process.

13. 10. The process according to claim 8 or 9, The workpiece is processed in a chamber device having a vacuum valve capable of maintaining an atmosphere of the workpiece in a vacuum state; and removing a vacuum pump from the chamber apparatus while maintaining the atmosphere around the workpiece in a vacuum state by the vacuum valve before heating the workpiece. Machining process.

14. 10. The process according to claim 8 or 9, A chamber device that accommodates the workpiece can perform pressurization and atmospheric control of the workpiece, heating the workpiece using a heating device provided separately from the chamber device; Machining process.

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