Processing device

Abstract

To provide a processing device which has an improved energy efficiency.SOLUTION: The present invention relates to a processing device 10 which can control heating, pressurizing, and atmosphere for a substrate 90. The processing device 10 has a substrate holding member 20, having a mounting part 22 for mounting or storing the substrate 90 and a seal part 24 surrounding the mounting part 22, and can form a sealed space surrounded by the seal part 24. The processing device 10 has a gas flow passage 61 in a holding member, which is connected to the inside of the sealed space, and a gas flow passage 62 in the heating unit.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a processing apparatus for processing a workpiece such as a substrate. [Background technology]

[0002] In recent years, research and development has been conducted to contribute to energy efficiency so that more people can have access to affordable, reliable, sustainable and advanced energy.

[0003] Processing devices that process workpieces such as substrates are also required to contribute to energy efficiency. For example, Patent Document 1 describes a processing device that pressurizes, heats, and controls the atmosphere of a substrate in a chamber space, and achieves energy efficiency by reliably isolating the chamber space from the outside atmosphere. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-220151 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the processing apparatus of Patent Document 1 needs to control the atmosphere in the entire chamber, and therefore there is room for improvement in terms of energy efficiency when controlling the atmosphere.

[0006] The present invention provides processing equipment with improved energy efficiency. [Means for solving the problem]

[0007] The present invention relates to A processing apparatus capable of applying heat, pressure, and controlling the atmosphere to a workpiece, a placement section on which the workpiece is placed and accommodated; a seal portion formed to surround the mounting portion; and A sealed space surrounded by the seal portion can be formed, A gas flow path communicating with the inside of the sealed space is provided. It is a processing device. Effect of the Invention

[0008] According to the present invention, the atmosphere of the workpiece can be controlled by controlling the atmosphere in the sealed space surrounded by the seal portion, so that the space in which the atmosphere is controlled can be made smaller and the energy efficiency when controlling the atmosphere in the processing device is improved. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view of a processing device according to a first embodiment of the present invention, as viewed obliquely from above. [Diagram 2] 2 is a perspective view of the processing apparatus of FIG. 1, seen obliquely from above, with a pressure shaft and a cover member removed. FIG. [Diagram 3] 3 is a perspective view of the processing device of FIG. 2, with a positioning member and a pusher further removed, as viewed obliquely from above. FIG. [Figure 4] 2 is a cross-sectional view of the processing apparatus taken along line AA in FIG. 1. [Diagram 5] 4 is a flowchart illustrating an example of a processing process of a substrate by the processing apparatus of FIG. [Figure 6] FIG. 11 is a perspective view of a processing device according to a second embodiment of the present invention, as viewed obliquely from above. [Figure 7] 7 is a cross-sectional view of the processing apparatus shown in FIG. 6 . [Figure 8] FIG. 2 is a perspective view of the pressurizing shaft as viewed obliquely from above. [Figure 9] FIG. 11 is a perspective view of a processing device according to a modified example of the second embodiment, as viewed obliquely from above. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, each embodiment of the processing apparatus of the present invention will be described with reference to the accompanying drawings. Note that the drawings should be viewed in the direction indicated by the reference numerals.

[0011] [First embodiment] (Configuration of processing equipment) The processing apparatus 10 of this embodiment can apply heat, pressure, and control the atmosphere to a substrate 90. As shown in FIG.

[0012] As shown in Figures 2 to 4, the substrate holding member 20 comprises a main surface portion 21, a mounting portion 22 on which a substrate 90 is placed and accommodated, a flow path groove portion 23 formed to surround the mounting portion 22 when viewed from above, and a sealing portion 24 formed to surround the outside of the flow path groove portion 23 when viewed from above.

[0013] The main surface portion 21 has a generally flat shape extending in the front-rear and left-right directions. The main surface portion 21 is provided with generally columnar positioning pins 25 that protrude upward. Two positioning pins 25 are provided at diagonal positions in the front-rear and left-right directions when viewed from above.

[0014] The mounting portion 22 has a recessed shape recessed downward from the main surface portion 21, and the substrate 90 can be accommodated in the recessed portion while being aligned.

[0015] The flow channel portion 23 has a recessed shape that is shallower than the mounting portion 22 and recessed downward, and is formed so as to surround the mounting portion 22 when viewed from above.

[0016] The seal portion 24 is formed so as to surround the flow path groove portion 23 when viewed from above. The seal portion 24 has a substantially flat seal surface 241 that protrudes upward from the main surface portion 21 on the outer circumferential side of the flow path groove portion 23 when viewed from above and extends in the front-rear and left-right directions, and an annular seal groove 242 that is recessed downward from the seal surface 241. An O-ring 243 is disposed in the seal groove 242.

[0017] The substrate holding member 20 is provided with a gas flow passage 61 within the holding member through which an inert gas, described later, flows. The gas flow passage 61 within the holding member penetrates the substrate holding member 20 in the vertical direction. An upper end of the gas flow passage 61 within the holding member is formed with an upper opening 61a that opens upward from the flow passage groove portion 23, and a lower end of the gas flow passage 61 within the holding member is formed with a lower opening 61b that opens downward from the lower surface of the substrate holding member 20. In this manner, the gas flow passage 61 within the holding member is provided so as to communicate with the flow passage groove portion 23.

[0018] The pressure shaft 30 is provided above the substrate holding member 20. The pressure shaft 30 has a generally cylindrical shape with a bottom extending in the vertical direction. The pressure shaft 30 is capable of moving up and down. The pressure shaft 30 is a hollow heat-insulating shaft made of a heat-insulating material. The pressure shaft 30 is a hollow shaft made of a heat-conducting material, and a heater may be housed inside the hollow shaft. The pressure shaft 30 is preferably configured such that heat generated in a heating unit 50 (described later) is not dissipated from the substrate holding member 20 via the pressure shaft 30.

[0019] The cover member 40 is detachably fixed to the upper surface of the substrate holding member 20 by fixing members such as bolts. The cover member 40 surrounds the lower end of the pressure shaft 30 and extends in the vertical direction like a hollow cylinder, and has a support part 41 through which the pressure shaft 30 is inserted, and a cover part 42 extending in the front-rear and left-right directions from the lower end of the support part 41 like a flange.

[0020] The cover member 40 is fixed to the upper surface of the substrate holding member 20 with the cover portion 42 pressing downwardly against the O-ring 243 arranged in the seal groove 242 of the substrate holding member 20. This maintains the gap between the cover member 40 and the substrate holding member 20 sealed by the O-ring 243 arranged in the seal groove 242.

[0021] An annular seal groove 411 recessed toward the outer periphery is formed on the inner circumferential surface near the upper end of the support part 41. An O-ring 412 is disposed in the seal groove 411. Therefore, the gap between the support part 41 of the cover member 40 and the pressure shaft 30 is sealed by the O-ring 412.

[0022] The pressure shaft 30 is capable of sliding vertically along the inner surface of the support portion 41 of the cover member 40 while maintaining the gap between the pressure shaft 30 and the support portion 41 of the cover member 40 sealed by the O-ring 412.

[0023] As described above, the gap between the cover member 40 and the substrate holding member 20 is sealed by an O-ring 243 arranged in the seal groove 242, and the gap between the support portion 41 of the cover member 40 and the pressure shaft 30 is sealed by an O-ring 412 arranged in the seal groove 411, so that an airtight space is formed surrounded by the cover portion 42 of the cover member 40, the seal portion 24 of the substrate holding member 20, and the substrate holding member 20.

[0024] In this manner, when the substrate 90 is processed, the placement portion 22 on which the substrate 90 is placed can be made into an enclosed space by the cover member 40 and the substrate holding member 20.

[0025] As a result, when processing the substrate 90, the atmosphere of the substrate 90 can be controlled by controlling the atmosphere of the sealed space surrounded by the cover portion 42 of the cover member 40, the seal portion 24 of the substrate holding member 20, and the substrate holding member 20, so that the space for performing atmospheric control can be made smaller and the energy efficiency of the processing apparatus 10 when processing the substrate 90 is improved.

[0026] Furthermore, the cover member 40, which is detachable from the substrate holding member 20, can make the space surrounded by the seal portion 24, the substrate holding member 20, and the cover member 40 into an airtight space, so that the airtight space can be easily formed after the substrate 90 is placed on the substrate holding member 20. This improves productivity when processing the substrate 90.

[0027] The heating section 50 has a substantially rectangular parallelepiped shape. Inside the heating section 50 having a substantially rectangular parallelepiped shape, a heating section internal gas flow passage 62 through which an inert gas described later flows is provided. One end of the heating section internal gas flow passage 62 is formed with an upper opening 62a that opens upward from the upper surface of the heating section 50, and the other end of the heating section internal gas flow passage 62 is formed with a lateral opening 62b that opens in a substantially horizontal direction from the side surface that forms the front, rear, left and right surfaces of the heating section 50. The upper opening 62a of the heating section internal gas flow passage 62 is connected to a lower opening 61b of the holding member internal gas flow passage 61 of the substrate holding member 20, and the heating section internal gas flow passage 62 and the holding member internal gas flow passage 61 are in communication with each other.

[0028] In this way, at least a portion (gas flow path 62 within the heating section) of the gas flow path (gas flow path 62 within the heating section and gas flow path 61 within the holding member) that communicates with the sealed space surrounded by the sealing portion 24, the substrate holding member 20, and the cover member 40 is integrally formed with the heating section 50, thereby reducing the manufacturing cost of the processing apparatus 10.

[0029] In addition, at least a part of the gas flow path (gas flow path 62 inside the heating section and gas flow path 61 inside the holding member) (gas flow path 62 inside the heating section) passes through the inside of the heating section 50 and communicates with the sealed space surrounded by the seal section 24, the substrate holding member 20, and the cover member 40, thereby making it possible to reduce the size of the processing apparatus 10.

[0030] Furthermore, at least a portion of the gas flow path (gas flow path 62 inside the heating section and gas flow path 61 inside the holding member) (gas flow path 61 inside the holding member) passes through the inside of the substrate holding member 20 and communicates with the sealed space surrounded by the seal section 24, the substrate holding member 20, and the cover member 40, thereby making it possible to reduce the size of the processing apparatus 10.

[0031] A seal groove 201 is formed in the lower surface of the substrate holding member 20 so as to surround the lower opening 61b of the holding member internal gas flow path 61. An O-ring 202 is disposed in the seal groove 201. This makes the connection between the heating unit internal gas flow path 62 and the holding member internal gas flow path 61 tightly sealed.

[0032] This makes it possible to form sealed gas flow paths (gas flow path 62 inside the heating part and gas flow path 61 inside the holding member) even if the heating part 50 and the substrate holding member 20 are separate parts, making it easier to manufacture the processing apparatus 10.

[0033] Furthermore, the gas flow paths (gas flow path 62 inside the heating section and gas flow path 61 inside the holding member) are connected to the flow path groove portion 23 formed to surround the mounting portion 22, so that the substrate 90 can be stably held on the mounting portion 22 while the atmosphere around the substrate 90 can be controlled in an energy-efficient manner.

[0034] An intake / exhaust pipe 63 is connected to the side opening 62b of the heating unit gas flow path 62. When processing the substrate 90, the placement portion 22 of the substrate holding member 20 is made into an airtight space, and then an inert gas, which will be described later, is intake / exhaust through the intake / exhaust pipe 63, thereby controlling the atmosphere around the substrate 90.

[0035] The heater housing 51 is provided inside the heating unit 50 having a substantially rectangular parallelepiped shape, and houses a heater (not shown) serving as a heat source. In this embodiment, the heater housing 51 extends in a substantially horizontal tubular shape, and one end opens substantially horizontally from the side surfaces that form the front, rear, left and right surfaces of the heating unit 50. The heater is inserted from this opening. The heater housed in the heater housing 51 is, for example, a cartridge heater. A cartridge heater is a heater in which a heating element such as a nichrome wire is covered with a metal pipe.

[0036] A thermocouple accommodating section 52 that accommodates a thermocouple (not shown) that functions as a temperature sensor is provided inside the heating section 50 having a substantially rectangular parallelepiped shape. In this embodiment, the thermocouple accommodating section 52 is provided above the heater accommodating section 51, i.e., between the heater accommodating section 51 and the substrate holding member 20 in the up-down direction, extends in a tubular shape in a substantially horizontal direction, and one end opens in a substantially horizontal direction from the side surfaces that form the front, rear, left and right surfaces of the heating section 50. The thermocouple is inserted from this opening.

[0037] In this embodiment, the substrate holding member 20 is also provided with a thermocouple accommodating section 28 for accommodating a thermocouple. The thermocouple accommodating section 28 is provided below the mounting section 22, i.e., between the heater accommodating section 51 and the mounting section 22 in the up-down direction, extends in a tubular shape in a substantially horizontal direction, and one end opens in a substantially horizontal direction from the side surfaces that form the front, rear, left and right surfaces of the heating section 50. The thermocouple is inserted from this opening.

[0038] When processing the substrate 90, a positioning member 26 is placed on the upper surface of the substrate holding member 20. The positioning member 26 has a flat plate shape and is placed so as to cover the main surface portion 21, the mounting portion 22, and the flow path groove portion 23 from above. The positioning member 26 is provided with two positioning holes 261 penetrating in the up-down direction at diagonal positions in the front-rear and left-right directions when viewed from above. When the positioning member 26 is placed on the upper surface of the substrate holding member 20, the positioning member 26 is placed so that two positioning pins 25 provided on the main surface portion 21 of the substrate holding member 20 are inserted into the two positioning holes 261 of the positioning member 26, respectively. As a result, the positioning member 26 is positioned and placed on the upper surface of the substrate holding member 20.

[0039] A pusher arrangement hole 262 that penetrates the positioning member 26 in the vertical direction and has a substantially rectangular shape when viewed from above is formed in the approximate center of the positioning member 26 in the front-rear and left-right directions.

[0040] When processing the substrate 90, the pusher 27 is placed, which has a substantially rectangular shape that is substantially the same as the pusher placement hole 262 and can be inserted into the pusher placement hole 262. The pusher 27 has a thickness greater than that of the positioning member 26 in the up-down direction.

[0041] (An example of a substrate processing process using a processing device) Next, an example of a processing process of the substrate 90 by the processing apparatus 10 will be described with reference to FIG.

[0042] First, a substrate 90 coated with a bonding material for bonding elements is prepared (step S101). The bonding material is, for example, a bonding material used for sinter bonding. The bonding material is in a paste form when applied to the substrate 90. The bonding material is then sintered by heating and pressurization, and the elements are sinter-bonded to the substrate 90. The bonding material is, for example, a silver (Ag) sinter bonding material. Then, as shown in Figs. 3 and 4, the substrate 90 coated with the bonding material is placed on the placement portion 22 of the substrate holding member 20 (step S102).

[0043] 2, the positioning pin 25 of the substrate holding member 20 is inserted into the positioning hole 261 of the positioning member 26, thereby positioning the positioning member 26 on the upper surface of the substrate holding member 20 (step S103). Then, the pusher 27 is placed in the pusher placement hole 262 of the positioning member 26.

[0044] Then, an element (not shown) to be bonded to the substrate 90 is positioned with respect to the substrate 90 and placed in the pusher placement hole 262 of the positioning member 26 (step S104). Next, the pusher 27 is placed in the pusher placement hole 262 of the positioning member 26 (step S105).

[0045] Next, the cover member 40 and the pressure shaft 30 are set on the substrate holding member 20 (step S106). At this time, the cover member 40 may be fixed to the upper surface of the substrate holding member 20 by a fixing member such as a bolt, and then the pressure shaft 30 may be inserted into the support portion 41 of the cover member 40, or the cover member 40 may be fixed to the upper surface of the substrate holding member 20 by a fixing member such as a bolt with the pressure shaft 30 inserted into the support portion 41 of the cover member 40. Note that in step S106, in the state where the pressure shaft 30 is inserted into the support portion 41 of the cover member 40, there is a clearance between the pressure shaft 30 and the plunger 27, and the plunger 27 is maintained in a state where it is not pressed by the pressure shaft 30.

[0046] 4, when the cover member 40 is set on the substrate holding member 20, the cover portion 42 presses downward the O-ring 243 arranged in the seal groove 242 of the substrate holding member 20, and the gap between the cover member 40 and the substrate holding member 20 is sealed by the O-ring 243 arranged in the seal groove 242. Furthermore, as described above, the gap between the support portion 41 of the cover member 40 and the pressure shaft 30 is sealed by the O-ring 412. As a result, the placement portion 22 becomes an enclosed space surrounded by the cover portion 42 of the cover member 40, the seal portion 24 of the substrate holding member 20, and the substrate holding member 20.

[0047] In this way, the pressure shaft 30 can slide up and down along the inner circumferential surface of the support part 41 of the cover member 40 while maintaining a state in which the gap between the pressure shaft 30 and the support part 41 of the cover member 40 is sealed by the O-ring 412, so that an enclosed space surrounded by the cover part 42 of the cover member 40, the seal part 24 of the substrate holding member 20, and the substrate holding member 20 can be formed with a simple configuration. This allows the processing device 10 to be reduced in cost and size.

[0048] Thereafter, in a state in which the mounting portion 22 has become an enclosed space, the atmosphere of the mounting portion 22 is controlled via the intake and exhaust pipe 63 (step S107). As one example, the air filling the mounting portion 22, which has become an enclosed space, is exhausted from the intake and exhaust pipe 63, thereby placing the mounting portion 22 in a substantially vacuum state. As another example, an inert gas, for example, nitrogen gas, is filled from the intake and exhaust pipe 63 into the mounting portion 22, which has become an enclosed space. This allows the mounting portion 22, which has become an enclosed space, to be a deoxidized space.

[0049] Next, the pressure shaft 30 is moved downward to perform pressure control on the element and the substrate 90 (step S108). Since the pusher 27 has a thickness in the vertical direction greater than that of the positioning member 26, when the pressure shaft 30 is moved downward, the pressure shaft 30 comes into contact with the pusher 27 before the positioning member 26 does, and presses the pusher 27 downward. As a result, a predetermined load is applied to the element and the substrate 90 by the pressure shaft 30 via the pusher 27. Note that step S108 may be performed in parallel with the atmosphere control of the placement unit 22 in step S107. That is, the atmosphere control of the placement unit 22 in step S107 may be performed in a state in which the pressure shaft 30 applies a preliminary load smaller than the predetermined load to the element and the substrate 90 via the pusher 27.

[0050] Next, the heating unit 50 performs heating control to heat the substrate 90 placed on the placement unit 22 (step S109). Specifically, the heater housed in the heater housing unit 51 is caused to generate heat to heat the substrate 90 placed on the placement unit 22. Note that step S109 may be performed in parallel with the pressure control on the elements and substrate 90 in step S108. That is, the pressure control on the elements and substrate 90 in step S108 may be performed in a state in which the substrate 90 is preheated by the heating unit 50.

[0051] As a result, substrate 90 to which the element has been temporarily bonded by the bonding material is heated to a predetermined temperature by heating unit 50 in a state in which the element is pressed against substrate 90 with a predetermined pressure, sandwiching the bonding material, by pusher 27 via pressure shaft 30. As a result, the bonding material is sintered, and the element is sinter-bonded to substrate 90 (step S110).

[0052] Thereafter, the substrate 90 is cooled as necessary (step S111), the placement section 22, which is an enclosed space, is opened to the atmosphere (step S112), the pressure shaft 30 is moved upward (step S113), and the cover member 40 is removed (step S114). Then, the pusher 27 is removed (step S115), the positioning member 26 is removed (step S116), and the substrate 90 to which the element is bonded is taken out (step S117), completing the series of processing steps.

[0053] [Second embodiment] Next, a processing device 10 according to a second embodiment will be described with reference to Figures 6 to 8. In the following description, configurations common to the processing device 10 according to the first embodiment will be denoted by the same reference numerals in the specification and drawings.

[0054] As shown in Figs. 6 and 7, the processing apparatus 10 of the second embodiment includes a substrate holding member 20, a plurality of pressure shafts 30, a cover member 40, and a heating unit 50. In the processing apparatus 10 of the second embodiment, an enclosed space is formed by the cover portion 42 of the cover member 40, the seal portion 24 of the substrate holding member 20, and the substrate holding member 20, and the atmosphere of the substrate 90 can be controlled by controlling the atmosphere of the enclosed space. Although the substrate holding member 20, the cover member 40, and the heating unit 50 have different shapes from the processing apparatus 10 of the first embodiment, the basic configuration is the same, so repeated explanations will be omitted. In addition, the processing process of the substrate by the processing apparatus described above is also the same as in the first embodiment, so repeated explanations will be omitted.

[0055] A plurality of substrates 90 are placed on the substrate holding member 20, and the plurality of pressure shafts 30 are capable of applying pressure to the corresponding plurality of substrates 90. Here, an example in which two pressure shafts 30 are provided will be described, but three or more pressure shafts 30 may be provided. Note that the plurality of pressure shafts 30 may be configured to be capable of applying pressure to different regions of a single substrate 90.

[0056] A common pressurizing unit 37 that applies pressure to all of the pressurizing shafts 30 is provided above the multiple pressurizing shafts 30 , and the multiple pressurizing shafts 30 are pressurized by the common pressurizing unit 37 .

[0057] To explain the configuration of the pressure shafts 30 in detail, each pressure shaft 30 has a hollow upper shaft portion 31 extending in the vertical direction, a lower shaft portion 32 extending in the vertical direction, and an elastic member 33 disposed between the upper shaft portion 31 and the lower shaft portion 32. The elastic member 33 is, for example, a coil spring.

[0058] The upper end of the upper shaft portion 31 is formed with a pressure-receiving surface 31b that is pressurized by the pressure applying portion 37. The lower end of the upper shaft portion 31 is formed with an expanded diameter portion 31a whose outer periphery is expanded, and the elastic member 33 abuts against the expanded diameter portion 31a from below.

[0059] The upper end of the lower shaft portion 32 is inserted into the internal space S of the upper shaft portion 31 from below, and is provided so as to be slidable relative to the upper shaft portion 31 in the internal space S.

[0060] An expanded diameter portion 32a having an expanded outer diameter is formed in the vertical center of the lower shaft portion 32. An elastic member 33 is attached between the expanded diameter portion 32a of the lower shaft portion 32 and the expanded diameter portion 31a of the upper shaft portion 31. The elastic member 33 is provided so as to be able to urge the lower shaft portion 32 downward relative to the upper shaft portion 31.

[0061] 6 and 7, a single support part 41 is provided with a plurality of through holes through which the plurality of lower shaft parts 32 are respectively inserted, that is, the single support part 41 supports a plurality of lower shaft parts 32. An O-ring 412 is disposed on the inner circumferential surface of the support part 41, and the gap between the support part 41 and the lower shaft part 32 is sealed by the O-ring 412.

[0062] The tip of the lower end of the lower shaft portion 32 presses against an element (not shown) and the substrate 90. It is preferable that a heat insulating material such as ceramic or high heat resistant resin is provided at the tip of the lower end of the lower shaft portion 32. A pusher 27 may be provided at the tip of the lower end of the lower shaft portion 32.

[0063] According to the pressure shaft 30 having the above-described configuration, the pressure input from the pressure section 37 is transmitted in this order to the upper shaft section 31, the elastic member 33, and the lower shaft section 32, thereby pressing the element and the substrate 90.

[0064] In this manner, since the processing apparatus 10 of the present embodiment is provided with a plurality of pressure shafts 30, it is possible to apply pressure to a plurality of substrates 90 or to apply pressure to different regions of a single substrate 90.

[0065] The pressure applying portion 37 moves up and down by being driven by, for example, a motor or a hydraulic / air cylinder (not shown), and applies pressure to both of the two pressure applying shafts 30 .

[0066] To explain the configuration of the pressure applying portion 37 in detail, the pressure applying portion 37 is provided so as to be able to apply pressure to the pressure receiving surfaces 31b of the upper ends of the plurality of upper shaft portions 31. The pressure applying portion 37 also has a plurality of holding portions (bushes) 37a through which the upper ends of the plurality of upper shaft portions 31 are inserted and which hold the upper shaft portions 31 so as to be slidable in the up-down direction.

[0067] In this way, pressure is applied to all of the multiple pressure shafts 30 from the common pressure unit 37, so that the entire pressure application process by the processing device 10 can be simplified.

[0068] It is not necessary for the pressure applying unit 37 to apply pressure to all of the pressure applying shafts 30, and for example, a plurality of pressure applying units 37 may be provided corresponding to each of the pressure applying shafts 30. In such a case, the pressure applying units 37 can be operated independently, and as a result, each of the pressure applying shafts 30 can be operated independently.

[0069] A pressure acquisition unit 38 is provided at a pressurizing location in the pressurizing unit 37 where each pressurizing shaft 30 is pressurized. The pressure acquisition unit 38 is a pressure sensor that acquires the pressure applied to each pressurizing shaft 30 from the pressurizing unit 37. The processing device 10 can acquire the pressure applied to the substrate 90 from each pressurizing shaft 30 by calculation or by referring to a predetermined map, based on the pressure applied to each pressurizing shaft 30 from the pressurizing unit 37. In other words, the pressure acquisition unit 38 can also be said to be a pressure sensor that acquires the pressure applied to the substrate 90 from each pressurizing shaft 30.

[0070] In this manner, since the pressure acquisition unit 38 that acquires the pressure applied to the substrate 90 from the pressure shaft 30 is provided, it is possible to appropriately apply pressure while grasping the pressure state of the substrate 90.

[0071] As shown in Fig. 7 and Fig. 8, the upper shaft portion 31 is provided with a fluid inlet / outlet hole 31c. The fluid inlet / outlet hole 31c is provided penetrating the pressurized surface 31b in the vertical direction and communicates with the internal space S of the upper shaft portion 31. With this configuration, an escape route for air is secured from the internal space S of the upper shaft portion 31 into which the lower shaft portion 32 is inserted to the outside, so that it is possible to prevent an increase in the internal pressure of the internal space S due to the relative vertical movement of the lower shaft portion 32, and to prevent an unintended repulsive force from being generated between the upper shaft portion 31 and the lower shaft portion 32. Note that the upper shaft portion 31 may be provided with a cutout portion capable of suppressing an increase in the internal pressure of the internal space S, instead of the fluid inlet / outlet hole 31c.

[0072] (Modification) In the above-described embodiment, the multiple pressure shafts 30 are supported by a single support portion 41. However, as shown in Fig. 9, the multiple pressure shafts 30 may be supported by multiple corresponding support portions 41. In such a configuration, a height adjustment member (e.g., a plate-shaped member) for adjusting the height may be sandwiched between the expanded diameter portion 32a of the lower shaft portion 32 and the elastic member 33. For example, the pressure applied from the pressure shaft 30 to the substrate 90 can be changed between a pressure shaft 30 provided with a height adjustment member and a pressure shaft 30 not provided with a height adjustment member.

[0073] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such embodiments. It is clear that a person skilled in the art can come up with various modifications or alterations within the scope of the claims, and it is understood that these also naturally belong to the technical scope of the present invention. In addition, the components in the above embodiments may be arbitrarily combined within the scope of the invention.

[0074] For example, in each of the above-described embodiments, the substrate holding member 20 and the heating unit 50 are separate members, and the O-ring 202 disposed in the seal groove 201 seals and communicates with the gas flow passage 62 inside the heating unit and the gas flow passage 61 inside the holding member, but the substrate holding member 20 and the heating unit 50 may be integrally molded by machining such as cutting. This eliminates the need to dispose an O-ring or the like between the substrate holding member 20 and the heating unit 50, reduces the number of parts, and more reliably seals and communicates with the gas flow passage 62 inside the heating unit and the gas flow passage 61 inside the holding member.

[0075] Furthermore, the processing apparatus 10 of each of the above-described embodiments may have a function of cooling the sealed space when controlling the atmosphere in the sealed space. For example, the processing apparatus 10 may further include a cooling mechanism such as an air-cooled fin, a Peltier element, or a water-cooled pipe.

[0076] This specification describes at least the following items. In parentheses, components corresponding to the above-described embodiment are shown as examples, but the present invention is not limited to these.

[0077] (1) A processing apparatus (processing apparatus 10) capable of applying heat, pressure, and controlling the atmosphere to a workpiece (substrate 90), a placement section (placement section 22) on which the workpiece is placed and accommodated; a base member (substrate holding member 20) having a seal portion (seal portion 24) formed so as to surround the mounting portion, A sealed space surrounded by the seal portion can be formed, The gas flow path (the gas flow path 61 in the holding member and the gas flow path 62 in the heating unit) is connected to the inside of the sealed space. Processing equipment.

[0078] According to (1), the atmosphere of the workpiece can be controlled by controlling the atmosphere in the sealed space surrounded by the seal portion, so that the space for performing the atmosphere control can be made smaller and the energy efficiency of performing the atmosphere control in the processing device can be improved.

[0079] (2) The processing apparatus according to (1), A cover member (cover member 40) capable of sealing the space surrounded by the seal portion and detachable from the base member is further provided, The sealed space is a space surrounded by the seal portion, the base member, and the cover member. Processing equipment.

[0080] According to (2), the space surrounded by the seal portion, the base member, and the cover member can be made into an airtight space by the cover member that is detachable from the base member, so that the airtight space can be easily formed after the workpiece is placed on the base member, thereby improving productivity when processing the workpiece.

[0081] (3) The processing apparatus according to (1) or (2), The apparatus further includes a heating unit (heating unit 50) for heating the workpiece, At least a portion of the gas flow path is integrally formed with the heating unit. Processing equipment.

[0082] According to (3), at least a part of the gas flow passage communicating with the sealed space is integrally formed with the heating section, thereby reducing the manufacturing cost of the processing device.

[0083] (4) The processing apparatus according to (3), At least a portion of the gas flow path passes through the inside of the heating unit and communicates with the sealed space. Processing equipment.

[0084] According to (4), at least a part of the gas flow passage communicating with the sealed space passes through the inside of the heating unit and communicates with the sealed space, so that the processing device can be made compact.

[0085] (5) The processing apparatus according to (3), At least a portion of the gas flow path passes through the inside of the base member and communicates with the sealed space. Processing equipment.

[0086] According to (5), at least a part of the gas flow passage communicating with the sealed space passes through the inside of the base member and communicates with the sealed space, whereby the processing device can be made compact.

[0087] (6) The processing apparatus according to (3), The gas flow path is A heating section internal gas flow path (heating section internal gas flow path 62) passing through the inside of the heating section; a base portion internal gas flow path (holding member internal gas flow path 61) passing through the inside of the base member, A connection between the heating portion internal gas flow passage and the base portion internal gas flow passage is sealed. Processing equipment.

[0088] According to (6), even if the heating portion and the base member are separate members, a sealed gas flow path can be formed, which makes it easy to manufacture the processing device.

[0089] (7) The processing apparatus according to (3), The base member and the heating portion are integrally molded. Processing equipment.

[0090] According to (7), it is not necessary to place a sealing member such as an O-ring between the base member and the heating portion, the number of parts can be reduced, and the gas flow path between the base member and the heating portion can be more reliably sealed.

[0091] (8) The processing apparatus according to (3), The base member has a flow channel portion (flow channel portion 23) formed so as to surround the placement portion, The seal portion is formed to surround the flow path groove portion, The flow passage groove portion is in communication with the gas flow passage. Processing equipment.

[0092] According to (8), the gas flow path is connected to the flow path groove portion which is formed so as to surround the mounting portion. Therefore, the workpiece can be stably held on the mounting portion while the atmosphere around the workpiece can be controlled in an energy-efficient manner.

[0093] (9) The processing apparatus according to (2), The pressurizing shaft (pressurizing shaft 30) is further provided to pressurize a predetermined area of ​​the workpiece, The cover member has a support portion (support portion 41) through which the pressurizing shaft is inserted, The pressure shaft is slidable while maintaining a gap between the pressure shaft and the support portion sealed. Processing equipment.

[0094] According to (9), since the pressure shaft is slidable while maintaining a sealed gap between the pressure shaft and the support part of the cover member, the sealed space surrounded by the seal part can be formed with a simple structure, which can reduce the cost and size of the processing device.

[0095] (10) The processing apparatus according to (9), The pressure shaft includes a plurality of pressure shafts, The plurality of pressure shafts can pressurize the corresponding plurality of workpieces, or can pressurize different regions of a single workpiece. Processing equipment.

[0096] According to (10), since a plurality of pressure shafts are provided, it is possible to apply pressure to a plurality of workpieces or to apply pressure to different regions of a single workpiece.

[0097] (11) The processing apparatus according to (10), Further, a common pressurizing unit (pressurizing unit 37) is provided for applying pressure to all of the plurality of pressurizing shafts, The plurality of pressure shafts are pressurized by the common pressure unit. Processing equipment.

[0098] According to (11), since pressure is applied to all of the multiple pressure shafts from a common pressure unit, the entire pressure process can be simplified.

[0099] (12) A processing apparatus according to any one of (9) to (11), Further, a pressure acquisition unit (pressure acquisition unit 38) is provided to acquire the pressure applied to the workpiece from the pressure shaft. Processing equipment.

[0100] According to (12), since a pressure acquisition unit that acquires the pressure applied to the workpiece from the pressure shaft is provided, it is possible to appropriately apply pressure while grasping the pressure state of the workpiece. [Explanation of symbols]

[0101] 10 Processing equipment 20 Substrate holding member (base member) 22 Placement section 23 Flow channel 24 Seal part 30 Pressure shaft 37 Pressurizing section 38 Pressure acquisition unit 40 Cover member 41 Support part 50 Heating section 61 Gas flow path in holding member (gas flow path in base portion) 62 Gas flow path in heating section 90 Substrate (workpiece)

Claims

1. A processing apparatus capable of applying heat, pressure, and controlling the atmosphere to a workpiece, a placement section on which the workpiece is placed and accommodated; a seal portion formed to surround the mounting portion; and A sealed space surrounded by the seal portion can be formed, A gas flow path communicating with the inside of the sealed space is provided. Processing equipment.

2. The processing apparatus according to claim 1, a cover member capable of sealing a space surrounded by the seal portion and detachable from the base member; The sealed space is a space surrounded by the seal portion, the base member, and the cover member. Processing equipment.

3. The processing apparatus according to claim 1 or 2, Further, a heating unit for heating the workpiece is provided, At least a portion of the gas flow path is integrally formed with the heating unit. Processing equipment.

4. The processing apparatus according to claim 3, At least a portion of the gas flow path passes through the inside of the heating unit and communicates with the sealed space. Processing equipment.

5. The processing apparatus according to claim 3, At least a portion of the gas flow path passes through the inside of the base member and communicates with the sealed space. Processing equipment.

6. The processing apparatus according to claim 3, The gas flow path is A gas flow path in the heating section that passes through the inside of the heating section; a base portion internal gas flow path passing through the inside of the base member, A connection between the heating portion internal gas flow passage and the base portion internal gas flow passage is sealed. Processing equipment.

7. The processing apparatus according to claim 3, The base member and the heating portion are integrally molded. Processing equipment.

8. The processing apparatus according to claim 3, the base member has a flow channel portion formed to surround the placement portion, The seal portion is formed to surround the flow path groove portion, The flow passage groove portion is in communication with the gas flow passage. Processing equipment.

9. The processing apparatus according to claim 2, A pressure shaft is further provided for applying pressure to a predetermined area of ​​the workpiece, the cover member has a support portion through which the pressurizing shaft is inserted, The pressure shaft is slidable while maintaining a gap between the pressure shaft and the support portion sealed. Processing equipment.

10. The processing apparatus according to claim 9, The pressure shaft includes a plurality of pressure shafts, The plurality of pressure shafts can pressurize the corresponding plurality of workpieces, or can pressurize different regions of a single workpiece. Processing equipment.

11. The processing apparatus according to claim 10, Further comprising a common pressurizing unit that applies pressure to all of the plurality of pressurizing shafts, The plurality of pressure shafts are pressurized by the common pressure unit. Processing equipment.

12. The processing device according to any one of claims 9 to 11, The pressure acquisition unit further acquires a pressure applied to the workpiece from the pressure shaft. Processing equipment.

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