Information processing device, wiring pattern formation system, information processing method, and control program

Abstract

To provide an information processing device capable of presenting appropriate irradiation conditions of laser beams irradiating a material arranged on a surface of a base material, a wiring pattern formation system, an information processing method, and a control program.SOLUTION: An information processing device comprises: an acquisition unit which acquires physical property value information of a physical property value of a base material in which a wiring pattern is formed by irradiating the material arranged on a surface of the base material with a laser beam; a calculation unit which inputs the physical property value acquired by the acquisition unit to a learning model learned so as to output information on laser beam irradiation to the material arranged on a surface of a prescribed base material when physical property information of a physical property value of the prescribed base material is input, and calculates irradiation conditions of laser beams irradiated onto the material arranged on the surface of the base material on the basis of the information output from the learning model; and an output unit which outputs the irradiation conditions.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an information processing device, a wiring pattern forming system, an information processing method, and a control program. [Background technology]

[0002] 2. Description of the Related Art A wiring pattern forming system has been developed that forms a wiring pattern on the surface of a substrate by irradiating a laser beam in a pattern onto a substance such as a metal oxide that is disposed on the surface of the substrate.

[0003] For example, Patent Document 1 describes a method for producing metal wiring in which a desired wiring pattern is formed on a substrate by repeatedly irradiating a surface of a base material containing metal particles with light to thermally sinter the metal particles. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-140284 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a wiring pattern forming system, in order to properly form a wiring pattern on the surface of a substrate, it is necessary to obtain appropriate irradiation conditions for the laser light to be irradiated onto a substance placed on the surface of the substrate.

[0006] The present disclosure aims to provide an information processing device, a wiring pattern forming system, an information processing method, and a control program that can present appropriate irradiation conditions for laser light to be irradiated onto a substance placed on the surface of a substrate. [Means for solving the problem]

[0007] An information processing device according to one aspect of the present disclosure is characterized in having an acquisition unit that acquires physical property information relating to the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material arranged on the surface with laser light, a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that is trained to output information relating to laser light irradiation on a material arranged on the surface of a specified substrate when physical property information of a specified substrate is input, and calculates irradiation conditions for the laser light to be irradiated onto the material arranged on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions.

[0008] An information processing device according to one aspect of the present disclosure is characterized in having an acquisition unit that acquires physical property information regarding the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material arranged on the surface with laser light and information regarding laser light irradiation to the material arranged on the surface of the substrate, a calculation unit that inputs the physical property information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that is trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of a substrate with laser light based on the information regarding laser light irradiation when physical property information of a predetermined substrate and information regarding laser light irradiation to a material arranged on the surface of the substrate are input, and calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions.

[0009] In an information processing device according to one aspect of the present disclosure, it is preferable that the physical property information includes at least one of information relating to the mechanical properties of the substrate, information relating to the optical properties or electrical properties of the substrate, and information relating to the thermal properties of the substrate.

[0010] In an information processing device according to one aspect of the present disclosure, it is preferable that the physical property information includes at least one of information relating to the mechanical properties of the substrate, at least one of information relating to the optical properties or electrical properties of the substrate, and at least one of information relating to the thermal properties of the substrate.

[0011] In the information processing device according to one aspect of the present disclosure, the information on the mechanical properties of the substrate includes material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile strain at break, tensile yield stress, tear strength, bending stress, bending strength, bending modulus, yield strain, molding shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness, the information on the optical properties or electrical properties of the substrate includes color, absorbance, haze, total light transmittance, refractive index, volume resistivity, surface resistivity, dielectric tangent, dielectric strength, relative dielectric constant, arc resistance, tracking resistance, reflectance, or gloss, and the information on the thermal properties of the substrate preferably includes heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, linear expansion coefficient, deflection temperature under load, melting point, melt mass flow rate, or melt volume flow rate.

[0012] In an information processing device relating to one aspect of the present disclosure, it is preferable that the acquisition unit further acquires thickness information regarding a thickness of a material arranged on the surface of the substrate and wiring pattern information regarding the wiring pattern on the substrate, and the learning model is trained to output information regarding laser light irradiation of a material arranged on the surface of a specified substrate when thickness information of a material arranged on the surface of a specified substrate and wiring pattern information of a wiring pattern on a specified substrate are input in addition to physical property information of the specified substrate, and the calculation unit inputs the physical property information, thickness information, and wiring pattern information acquired by the acquisition unit to the learning model, and calculates irradiation conditions based on the information output from the learning model.

[0013] In an information processing device relating to one aspect of the present disclosure, it is preferable that the acquisition unit further acquires thickness information regarding a thickness of a material placed on the surface of the substrate and wiring pattern information regarding the wiring pattern on the substrate, and the learning model is trained to output information regarding quality when thickness information of a material placed on the surface of the substrate and wiring pattern information of a wiring pattern on the substrate are input in addition to physical property information of a specified substrate and information regarding laser light irradiation, and the calculation unit inputs the physical property information, thickness information, wiring pattern information, and information regarding laser light irradiation acquired by the acquisition unit to the learning model, and calculates irradiation conditions based on the information output from the learning model.

[0014] In the information processing device according to the aspect of the present disclosure, the irradiation conditions preferably include an intensity of the laser light or a scanning speed of the laser light.

[0015] In the information processing device according to one aspect of the present disclosure, the substance preferably includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with laser light.

[0016] A wiring pattern formation system according to one aspect of the present disclosure is a wiring pattern formation system having an information processing device and a laser light irradiation device, wherein the information processing device has an acquisition unit that acquires physical property information regarding the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a material arranged on the surface with laser light, a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that has been trained to output information regarding laser light irradiation of a material arranged on the surface of a specified substrate when physical property information of a specified substrate is input, and calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions, and the laser light irradiation device has a formation unit that forms a wiring pattern by irradiating a material arranged on the surface of the substrate with laser light based on the irradiation conditions output from the output unit.

[0017] A wiring pattern formation system according to one aspect of the present disclosure is a wiring pattern formation system having an information processing device and a laser light irradiation device, wherein the information processing device has an acquisition unit that acquires physical property value information regarding the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance arranged on the surface of the substrate with laser light and information regarding laser light irradiation of the substance arranged on the surface of the substrate, a calculation unit that inputs the physical property value information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a substance arranged on the surface of the substrate with laser light based on the information regarding laser light irradiation when physical property value information of a predetermined substrate and information regarding laser light irradiation of the substance arranged on the surface of the substrate are input, and calculates irradiation conditions of the laser light to be irradiated to the substance arranged on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions, and the laser light irradiation device has a formation unit that forms a wiring pattern by irradiating a substance arranged on the surface of the substrate with laser light based on the irradiation conditions output from the output unit.

[0018] An information processing method according to one aspect of the present disclosure is characterized in that a computer acquires physical property information relating to the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the substrate with laser light, inputs the acquired physical property information into a learning model trained to output information relating to laser light irradiation of a material placed on the surface of a specified substrate when physical property information of a specified substrate is input, calculates irradiation conditions for the laser light to be irradiated to the material placed on the surface of the substrate based on the information output from the learning model, and outputs the irradiation conditions.

[0019] An information processing method according to one aspect of the present disclosure is characterized in that a computer acquires physical property information relating to the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material arranged on the surface with laser light and information relating to the laser light irradiation of the material arranged on the surface of the substrate, inputs the acquired physical property information and information relating to the predetermined laser light irradiation into a learning model that is trained to output information relating to the quality of a wiring pattern formed by irradiating a material arranged on the surface of a substrate with laser light based on information relating to the laser light irradiation when physical property information of a predetermined substrate and information relating to the laser light irradiation of the material arranged on the surface of the substrate are input, calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model, and outputs the irradiation conditions.

[0020] A control program according to one aspect of the present disclosure is a control program for a computer having an output unit, which causes the computer to acquire physical property information relating to the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the substrate with laser light, input the acquired physical property information into a learning model that has been trained to output information relating to laser light irradiation onto a material placed on the surface of a specified substrate when physical property information of a specified substrate is input, calculate irradiation conditions for the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and output the irradiation conditions by the output unit.

[0021] A control program according to one aspect of the present disclosure is a control program for a computer having an output unit, which acquires physical property information regarding the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material arranged on the surface with laser light and information regarding laser light irradiation to the material arranged on the surface of the substrate, inputs the acquired physical property information and information regarding predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of a substrate with laser light based on information regarding laser light irradiation when physical property information of a predetermined substrate and information regarding laser light irradiation to a material arranged on the surface of the substrate are input, calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on information output from the learning model, and outputs the irradiation conditions by the output unit. Effect of the Invention

[0022] The information processing device, wiring pattern formation system, information processing method, and control program according to the embodiments can present appropriate irradiation conditions for laser light to be irradiated onto a substance disposed on the surface of a substrate.

[0023] The objects and advantages of the disclosure will be realized and obtained by means of the elements and combinations particularly pointed out in the claims. Both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the disclosure as claimed. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a diagram showing an example of a schematic configuration of a wiring pattern forming system. [Diagram 2] 1 is a block diagram showing a schematic configuration of a laser light irradiation device. [Diagram 3] 1 is a block diagram showing a schematic configuration of an information processing device; [Figure 4]13 is a flowchart illustrating an example of a calculation process of the information processing device. [Diagram 5] 13(A) to 13(C) are diagrams showing an example of experimental results regarding physical property information, laser light irradiation conditions, and wiring pattern characteristics. [Figure 6] FIG. 13 is a diagram illustrating a schematic configuration of an information processing device according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, various embodiments of the present disclosure will be described with reference to the drawings. It should be noted that the technical scope of the present disclosure is not limited to these embodiments, but covers the invention described in the claims and their equivalents.

[0026] FIG. 1 is a diagram showing an example of a schematic configuration of a wiring pattern forming system 1. As shown in FIG.

[0027] As shown in FIG. 1, the wiring pattern forming system 1 irradiates a substance 101 arranged on the surface of a substrate 100 placed on a mounting table 200 with a laser beam La to form a conductive wiring pattern 102, thereby manufacturing a substrate such as a circuit board. The substrate 100 is an ABS (Acrylonitrile Butadiene Styrene) substrate, a polycarbonate substrate, a polyimide substrate, or the like. The substance 101 includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with a laser beam La. The substance 101 is arranged on the surface of the substrate 100 by a method such as coating, lamination, or deposition. The wiring pattern forming system 1 includes a laser beam irradiating device 2 and an information processing device 3.

[0028] The laser light irradiation device 2 is connected to the information processing device 3 so as to be able to transmit and receive data and information. The laser light irradiation device 2 irradiates a substance 101 arranged on a surface of a substrate 100 placed on a mounting table 200 with laser light La. The laser light irradiation device 2 has a laser light oscillator 21, a galvano scanner 22, and a controller 23. The laser light oscillator 21, the galvano scanner 22, and / or the controller 23 are an example of a forming unit.

[0029] The laser oscillator 21 is electrically connected to the controller 23. The laser oscillator 21 irradiates the substrate 100 with the laser light La in response to a control signal transmitted from the controller 23. The intensity of the laser light La output from the laser oscillator 21, the spot diameter of the laser light La, or the pitch width of the laser light La can be controlled by the controller 23. As the laser light La irradiated from the laser oscillator 21, a known laser light such as YAG (Yttrium Aluminum Garnet), YVO4 (Yttrium Vanadate), Yb (Ytterbium), semiconductor (GaAs, GaAlAs, GaInAs), carbon dioxide gas, fiber laser, etc. may be used. As the laser light La, not only the fundamental wave but also a harmonic wave may be extracted and used.

[0030] The galvano scanner 22 includes a first mirror 221 , a first motor 222 , a second mirror 223 , a second motor 224 , and a condenser lens 225 .

[0031] The first mirror 221 is attached to the first motor 222 so as to rotate in accordance with the rotation of the first motor 222. The first mirror 221 is disposed at a predetermined position so as to form a predetermined angle with the laser beam oscillator 21 and the condenser lens 225. The first mirror 221 reflects the laser beam La emitted from the laser beam oscillator 21 toward the second mirror 223.

[0032] The first motor 222 is electrically connected to the controller 23. The first motor 222 rotates in a predetermined direction (the direction of the arrow α in FIG. 1) in response to a control signal transmitted from the controller 23. As a result, the first motor 222 disposes the first mirror 221 at a predetermined position so as to form a predetermined angle with respect to the laser light oscillator 21 and / or the condenser lens 225.

[0033] The second mirror 223 is attached to the second motor 224 so as to rotate in accordance with the rotation of the second motor 224. The second mirror 223 is disposed at a predetermined position so as to form a predetermined angle with respect to the first mirror 221 and the condenser lens 225. The second mirror 223 reflects the laser light La, which is irradiated from the laser light oscillator 21 and reflected by the first mirror 221, toward the condenser lens 225.

[0034] The second motor 224 is electrically connected to the controller 23. The second motor 224 rotates in a predetermined direction (the direction of the arrow β in FIG. 1) in response to a control signal transmitted from the controller 23. As a result, the second motor 224 disposes the second mirror 223 at a predetermined position so as to form a predetermined angle with respect to the first mirror 221 and the condenser lens 225.

[0035] The condenser lens 225 condenses the laser light La emitted from the laser light oscillator 21 and reflected by the first mirror 221 and the second mirror 223, and irradiates the laser light La towards the substrate 100 placed on the placement table 200.

[0036] The first mirror 221, the second mirror 223, and / or the condenser lens 225 may be omitted, and the laser light La may be irradiated toward the substrate 100 without passing through the first mirror 221, the second mirror 223, and / or the condenser lens 225. The galvano scanner 22 may have a mirror and a condenser lens that reflect the laser light La output from the laser light oscillator 21 in a fixed direction and at a fixed position, instead of the first mirror 221, the first motor 222, the second mirror 223, the second motor 224, and the condenser lens 225. In this case, the mounting table 200 is provided so as to be movable along at least one of the X direction and the Y direction shown in FIG. 1. The X direction and the Y direction are parallel to the mounting surface of the mounting table 200 and perpendicular to each other.

[0037] The controller 23 is a device that controls the overall operation of the laser light irradiation device 2, and has one or more processors and their peripheral circuits. The controller 23 has, for example, a CPU (Central Processing Unit). The controller 23 may have a GPU (Graphics Processing Unit), a DSP (Digital Signal Processor), an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or the like. The controller 23 controls the operation of each component and executes various processes so that various processes of the laser light irradiation device 2 are executed in an appropriate order based on a program stored in a first storage unit 24 described later and inputs from a first communication unit 25 and a first operation unit 27 described later. For example, the controller 23 controls the intensity of the laser light La generated by the laser light oscillator 21, the spot diameter of the laser light La, or the pitch width of the laser light La. In addition, the controller 23 controls the rotation angle and rotation speed of the first motor 222 and the second motor 224 to adjust the position and angle of the first mirror 221, and adjust the irradiation direction of the laser light La irradiated from the focusing lens 225, the scanning speed of the laser light La, or the scanning period of the laser light La.

[0038] FIG. 2 is a block diagram showing a schematic configuration of the laser light irradiation device 2. As shown in FIG.

[0039] In addition to the above-mentioned configuration, the laser light irradiation device 2 further includes a first storage unit 24, a first communication unit 25, a first display unit 26, a first operation unit 27, a first interface unit 28, and the like.

[0040] The first storage unit 24 stores programs or data. The first storage unit 24 has, for example, a semiconductor memory device. The first storage unit 24 stores an operating system program, a driver program, an application program, data, etc., used in processing by the controller 23. Programs are installed in the first storage unit 24 from a computer-readable, non-transitory, portable storage medium, such as a CD (Compact Disc)-ROM (Read Only Memory) or a DVD (Digital Versatile Disc)-ROM, using a known setup program or the like.

[0041] The first communication unit 25 enables the laser light irradiating device 2 to communicate with other devices. The first communication unit 25 has a communication interface circuit. The communication interface circuit of the first communication unit 25 is a communication interface circuit such as a wired LAN (Local Area Network) or a wireless LAN. The first communication unit 25 receives data from other devices and supplies the data to the controller 23, and transmits data supplied from the controller 23 to other devices.

[0042] The first display unit 26 displays an image. The first display unit 26 has, for example, a liquid crystal display or an organic EL (Electro-Luminescence) display. The first display unit 26 displays an image based on display data supplied from the controller 23.

[0043] The first operation unit 27 accepts an input operation by an operator to the laser light irradiation device 2. The first operation unit 27 has, for example, a button or a keypad. The first operation unit 27 may have a touch panel integrated with the first display unit 26. The first operation unit 27 generates a signal according to the input operation by the operator and supplies the signal to the controller 23.

[0044] The first interface unit 28 has an interface circuit conforming to a serial bus such as a Universal Serial Bus (USB). The first interface unit 28 is electrically connected to the information processing device 3 to transmit and receive various information. Instead of the first interface unit 28, the first communication unit 25 may be used.

[0045] FIG. 3 is a block diagram showing a schematic configuration of the information processing device 3. As shown in FIG.

[0046] The information processing device 3 is connected to the laser light irradiating device 2 so as to be able to transmit and receive data and information. The information processing device 3 outputs irradiation conditions of the laser light La irradiated from the laser light irradiating device 2. As shown in FIG. 3, the information processing device 3 has a second storage unit 31, a second communication unit 32, a second display unit 33, a second operation unit 34, a second interface unit 35, a processing unit 36, and the like. The second storage unit 31, the second communication unit 32, the second display unit 33, the second operation unit 34, the second interface unit 35, and the processing unit 36 ​​are electrically connected to each other via a bus. The second communication unit 32 and the second display unit 33 are examples of an output unit.

[0047] The second storage unit 31 stores programs or data. The second storage unit 31 has, for example, a semiconductor memory device. The second storage unit 31 stores an operating system program, a driver program, an application program, data, etc., used for processing by the processing unit 36. Programs are installed in the second storage unit 31 from a computer-readable, non-transitory portable storage medium such as a CD-ROM or DVD-ROM using a known setup program or the like.

[0048] The second communication unit 32 enables the processing unit 36 ​​to communicate with other devices. The second communication unit 32 has a communication interface circuit. The communication interface circuit of the second communication unit 32 is a communication interface circuit such as a wired LAN or a wireless LAN. The second communication unit 32 receives data from other devices and supplies the data to the processing unit 36, and transmits data supplied from the processing unit 36 ​​to the other devices.

[0049] The second display unit 33 displays an image. The second display unit 33 has, for example, a liquid crystal display or an organic EL display. The second display unit 33 displays an image based on the display data supplied from the processing unit .

[0050] The second operation unit 34 accepts an input operation by the operator to the information processing device 3. The second operation unit 34 has, for example, a keypad, a keyboard, or a mouse. The second operation unit 34 may have a touch panel integrated with the second display unit 33. The second operation unit 34 generates a signal according to the input operation by the operator and supplies the signal to the processing unit 36.

[0051] The second interface unit 35 has an interface circuit conforming to a serial bus such as USB. The second interface unit 35 is electrically connected to the laser light irradiation device 2 to transmit and receive various information. Instead of the second interface unit 35, the second communication unit 32 may be used.

[0052] The processing unit 36 ​​is a device that comprehensively controls the operation of each component included in the information processing device 3, and has one or more processors and their peripheral circuits. The processing unit 36 ​​has, for example, a CPU. The processing unit 36 ​​may have a GPU, a DSP, an LSI, an ASIC, an FPGA, or the like. The processing unit 36 ​​controls the operation of each component and executes various processes so that various processes of the information processing device 3 are executed in an appropriate order based on the programs stored in the second storage unit 31 and inputs from the second communication unit 32 and the second operation unit 34.

[0053] The processing unit 36 ​​has, as functional blocks, an acquisition unit 361, a calculation unit 362, and an output control unit 363. Each of these units is a functional module realized by a program executed by the processing unit 36. Each of these units may be implemented in the information processing device 3 as firmware.

[0054] 4 is a flowchart showing an example of the calculation process of the information processing device 3. The calculation process is executed mainly by the processing unit 36 ​​in cooperation with each element of the information processing device 3 based on a program stored in advance in the second storage unit 31.

[0055] First, the acquiring unit 361 acquires physical property information (step S101). The physical property information is pre-stored in the second storage unit 31, and the acquiring unit 361 acquires the pre-stored physical property information by reading it from the second storage unit 31. The acquiring unit 361 may acquire the physical property information by receiving it from an external information processing device via the second communication unit 32.

[0056] The physical property information is information on the physical property values ​​of the substrate 100 on which the wiring pattern 102 is formed by irradiating the substance 101 arranged on the surface with the laser light La, and includes one or more types of physical property values. The physical property information includes at least one of information on the mechanical properties of the substrate 100, information on the optical properties or electrical properties of the substrate 100, and information on the thermal properties of the substrate 100. The physical property information includes at least one of information on the mechanical properties of the substrate 100, at least one of information on the optical properties or electrical properties of the substrate 100, and at least one of information on the thermal properties of the substrate 100. In particular, since the influence of thermal damage to the substrate 100 itself due to heat generated by irradiation with the laser light La is large, it is preferable to include information on thermal properties as the physical property information.

[0057] The information on the mechanical properties of the substrate 100 includes material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile fracture strain, tensile yield stress, tear strength, bending stress, bending strength, bending modulus, yield strain, molding shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness. In particular, the material, tensile strength, density, and surface roughness include information on the surface state of the substrate 100 and the response to stress generated in response to the formation of the wiring pattern on the substrate 100 surface, and have a large effect on the quality of the wiring pattern 102, so it is preferable to include the material, tensile strength, density, and surface roughness as information on the mechanical properties of the substrate 100.

[0058] If the material is soluble in a solvent, its chemical structure is analyzed by solution NMR, GC-MS, and FT-IR. If the material is insoluble in a solvent, its chemical structure is analyzed by pyrolysis GC-MS and FT-IR. Based on the type and ratio of the chemical structure of the resin, it is classified as polypropylene (PP), polyimide (PI), polyester (polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc.), polyethersulfone (PES), polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyrate (PBT), etc. Polyvinyl chloride (PVB), polyacetal (POM), polyarylate (PAR), polyamide (PA) (PA6, PA66, PA612, etc.), polyamide-imide (PAI), polyetherimide (PEI), polyphenylene ether (PPE), modified polyphenylene ether (m-PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyether ether ketone (PEEK), polyphthalamide (PPA), polyether nitrile (PENt), polybenzimidazole (PBI), polycarbodiimide, Polymethacrylamide, nitrile rubber, acrylic rubber, polyethylene tetrafluoride, epoxy resin, phenolic resin, melamine resin, urea resin, polymethyl methacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer, polyethylene (PE), polyvinyl chloride (PVC), They are classified into polyvinylidene fluoride (PVDF), phenol novolac, benzocyclobutene, polyvinylphenol, polychloropyrene, polyoxymethylene, polysulfone (PSF), polyphenylsulfone resin (PPSU), cycloolefin polymer (COP), acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene resin (AS), polytetrafluoroethylene resin (PTFE), polychlorotrifluoroethylene (PCTFE), and silicone resin (polysiloxane), among others.

[0059] The Izod impact strength is measured by an Izod impact test according to ASTM D256 for samples prepared according to ISO2818 and JIS K7144.

[0060] The Charpy impact strength is measured by a Charpy impact test in accordance with ISO179-1 for samples prepared in accordance with ISO2818 and JIS K7144.

[0061] The tensile elongation, tensile strength, tensile modulus, tensile strain at break, tensile yield stress, and yield strain are the elongation at break, strength at break, modulus of elasticity, strain at break, yield stress, and yield strain measured by a tensile test in accordance with ISO527 for a sample prepared in accordance with JIS K7139.

[0062] The tear strength is measured by a tear test according to JIS K7128-3 using a right-angle test piece punched in the MD direction.

[0063] The bending stress, bending strength and bending modulus are measured by a three-point bending test according to JIS K7171 using a sample prepared according to JIS K7139.

[0064] The molding shrinkage is the larger of the molding shrinkage in MD and TD measured in a molding test in accordance with JIS K7152-4.

[0065] The water absorption rate is measured by the dry weight method in accordance with JIS K7209, Method A, on a sample of the same dimensions as ISO 294-3, Type D1.

[0066] The density is measured in accordance with JIS K7112, Method A.

[0067] The surface hardness is a Vickers hardness measured in accordance with JIS Z2244 for the surface of a sample on which wiring is to be formed.

[0068] The Rockwell hardness is measured by a Rockwell hardness test in accordance with JIS K7202-2 on a flat plate sample having a thickness of at least 6 mm.

[0069] The surface roughness is the value of the arithmetic mean roughness Ra measured by a surface roughness meter in accordance with JIS B0601 for the sample surface on which wiring is to be formed.

[0070] The information on the optical or electrical properties of the substrate 100 includes color, absorbance, haze, total light transmittance, refractive index, volume resistivity, surface resistivity, dielectric loss tangent, dielectric strength, dielectric constant, arc resistance, tracking resistance, reflectance, or glossiness. In particular, the color, absorbance, haze, total light transmittance, refractive index, dielectric constant, reflectance, and glossiness include information on the response of the substrate to light transmitted through the coating film, and have a large effect on the quality of the wiring pattern 102 formed on the surface of the substrate 100. Therefore, it is preferable that the information on the optical or electrical properties of the substrate 100 includes color, absorbance, haze, total light transmittance, refractive index, dielectric constant, reflectance, and glossiness.

[0071] The color is a lab value measured on the surface of a sample on which wiring is to be formed using a colorimeter capable of measuring with a D65 light source, a method in which light is applied at an angle of 45° under optical geometric conditions, and a field of view of 10°.

[0072] The absorbance is measured at a wavelength of 355 nm using a spectrophotometer at a measurement wavelength of 190 to 1100 nm for a sample prepared to a thickness of 100 μm.

[0073] The haze and total light transmittance are the haze value and the total light transmittance in the wavelength range of 400 to 700 nm, measured with a haze meter in accordance with JIS K7136 and JIS K7361-1.

[0074] The refractive index is measured by a refractometer in accordance with JIS K7142 for a sample prepared to have a width of 8 mm, a length of 20 to 40 mm, and a thickness of 2 μm to 5 mm.

[0075] The volume resistivity and surface resistivity are measured in accordance with JIS C2139 by the voltmeter-ammeter method using a galvanometer.

[0076] The dielectric loss tangent and the relative dielectric constant are measured by an LCR meter in accordance with JIS C2138 for a sheet or plate sample having a thickness of 1.5 mm or more.

[0077] The dielectric strength is measured by a dielectric strength test in accordance with JIS C2110-1 on samples prepared in accordance with ISO mold type D1 of ISO295, JIS K7154, and JIS K7152-3.

[0078] The arc resistance is measured by an arc discharge deterioration test in accordance with JIS C2135.

[0079] The tracking resistance is measured by a tracking test in accordance with JIS C2137 using a circular rod-shaped sample having an outer diameter of 25 mm±1 mm.

[0080] The reflectance is the reflectance at 355 nm measured by a reflectometer for the surface of a sample on which wiring is to be formed.

[0081] The glossiness of the sample surface on which wiring is to be formed is measured by a glossiness meter in accordance with JIS Z8741.

[0082] The information on the thermal properties of the substrate 100 includes heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, linear expansion coefficient, deflection temperature under load, melting point, melt mass flow rate or melt volume flow rate. In particular, the heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, linear expansion coefficient, deflection temperature under load and melting point include information on the response of the substrate to heat generated during light irradiation, and have a large effect on the quality of the wiring pattern 102 formed on the surface of the substrate 100. Therefore, it is preferable that the information on the thermal properties of the substrate 100 includes the heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, linear expansion coefficient, deflection temperature under load and melting point.

[0083] The heat resistance temperature is measured by a heat sag test in accordance with JIS K7195 for a rectangular sample having a width of 9.8 to 12.8 mm, a length of 125±0.5 mm, and a thickness of 3.2±0.2 mm.

[0084] The glass transition temperature and melting point are measured on a sample having a diameter or each side length of 0.5 mm or less using a differential scanning calorimeter (DSC) according to JIS K7121 at a heating rate of 20° C. / min.

[0085] The Vicat softening temperature is measured by a Vicat test in accordance with JIS K7206 for a square plate sample having a thickness of 3 mm or more and 6.5 mm or less, and a side length of 10 mm or more, or a circular plate sample having a diameter of 10 mm or more.

[0086] The specific heat and thermal conductivity are measured by the flash method in accordance with JIS R1611 for a disk or convex polygonal flat plate sample with the diameters of the inscribed and circumscribed circles of the sample being 4 mm or more and 15 mm or less.

[0087] The flammability is measured by a horizontal burning test and a vertical burning test in accordance with JIS C60695-11-20 using samples prepared in accordance with JIS K7151 and JIS K7152.

[0088] The oxygen index is measured using an oxygen index tester in accordance with JIS K7201-3 for a sample prepared in accordance with 7.2 of JIS K7201-2.

[0089] The linear expansion coefficient is measured in compression mode using a thermomechanical analyzer (TMA) in accordance with JIS K7197 for a cylindrical or prismatic sample having a length of 10 mm and a diameter or length of one side of about 5 mm.

[0090] The deflection temperature under load is measured on a sample prepared in accordance with JIS K7191-1 using a deflection temperature under load tester in accordance with JIS K7191-2, Method B.

[0091] The melt mass flow rate and the melt volume flow rate are measured using a melt indexer in accordance with Method A of JIS K7210-1.

[0092] Next, the acquisition unit 361 acquires thickness information regarding the thickness of the substance 101 disposed on the surface of the substrate 100 (step S102). The thickness information is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the pre-stored thickness information by reading it out from the second storage unit 31. The acquisition unit 361 may acquire the thickness information by receiving it from an external information processing device via the second communication unit 32. The thickness information indicates the thickness (film thickness) of the substance 101 disposed on the surface of the substrate 100. The thickness information may indicate statistics such as the average value, median, minimum value, or maximum value of the thickness at multiple positions of the substance 101 disposed on the surface of the substrate 100.

[0093] Next, the acquisition unit 361 acquires wiring pattern information related to the wiring pattern 102 on the substrate 100 (step S103). The wiring pattern information is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the wiring pattern information by reading the pre-stored wiring pattern information from the second storage unit 31. The acquisition unit 361 may acquire the wiring pattern information by receiving it from an external information processing device via the second communication unit 32.

[0094] The wiring pattern information indicates, for example, the distribution positions of the wiring pattern 102 on the mounting surface of the mounting table 200 (or on the surface of the substrate 100) formed by the laser light irradiation device 2. The wiring pattern information is indicated by a group of coordinates of the positions where the wiring pattern 102 is formed in an orthogonal coordinate system in which, for example, one of the squares of the mounting surface of the mounting table 200 is set as the origin and the straight lines of the end portions of the mounting surface of the mounting table 200 are set as the coordinate axes. The wiring pattern information may be a predetermined feature value for the distribution positions of the wiring pattern 102. In this case, the acquisition unit 361 may acquire the wiring pattern information by calculating the feature value based on the distribution positions of the wiring pattern 102 stored in advance in the second storage unit 31 or received from an external information processing device. The feature value is each size of one or more blocks formed from the wiring connected in the wiring pattern 102. The size is, for example, the maximum length of each block in each axis direction of the above-mentioned orthogonal coordinate system. The size may be the length of the wiring included in each block, or the area of ​​the circumscribed rectangle of each block. The feature amount may also be the length or area of ​​the entire wiring pattern 102, etc.

[0095] Next, the acquisition unit 361 acquires the learning model (step S104). The learning model is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the learning model by reading it from the second storage unit 31. The acquisition unit 361 may acquire the learning model by receiving it from an external information processing device via the second communication unit 32.

[0096] The learning model is trained to output information related to laser light irradiation of a material arranged on the surface of a predetermined substrate when physical property information of the predetermined substrate, thickness information of a material arranged on the surface of the predetermined substrate, and wiring pattern information of a wiring pattern on the predetermined substrate are input. The predetermined substrate is a substrate on which a wiring pattern is formed by irradiating a material arranged on the surface with laser light La. The information related to laser light irradiation includes the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La.

[0097] The learning model is trained by supervised learning such as neural network or deep learning. As training data, a set of physical property value information, thickness information, and wiring pattern information of each substrate, and information on ideal laser light irradiation for forming a high-quality wiring pattern on the surface of each substrate (intensity of laser light La, scanning speed of laser light La, spot diameter of laser light La, pitch width of laser light La, and scanning period of laser light La) is used for various types of substrates. The learning model is trained so that when physical property value information, thickness information, and wiring pattern information included in each training data are input, the intensity of laser light La and scanning speed of laser light La included in each training data are output.

[0098] In particular, the learning model is trained such that the thicker the material placed on the surface of a predetermined base material input to the learning model, the greater the intensity of the laser light La output from the learning model, the slower the scanning speed of the laser light La, the larger the spot diameter of the laser light La, the larger the pitch width of the laser light La, and / or the smaller the scanning period of the laser light La. Also, the learning model is trained such that the thinner the material placed on the surface of a predetermined base material input to the learning model, the smaller the intensity of the laser light La output from the learning model, the faster the scanning speed of the laser light La, the smaller the spot diameter of the laser light La, the smaller the pitch width of the laser light La, and / or the larger the scanning period of the laser light La.

[0099] The learning model is trained such that the thicker the wiring pattern on a predetermined substrate input to the learning model, the faster the scanning speed of the laser light La output from the learning model, the larger the spot diameter of the laser light La, the larger the pitch width of the laser light La, and / or the larger the scanning period of the laser light La. The learning model is trained such that the thinner the wiring pattern on a predetermined substrate input to the learning model, the slower the scanning speed of the laser light La output from the learning model, the smaller the spot diameter of the laser light La, the smaller the pitch width of the laser light La, and / or the smaller the scanning period of the laser light La.

[0100] The learning model is trained so that the longer the length of the wiring pattern on a predetermined substrate input to the learning model, the faster the scanning speed of the laser light La output from the learning model and / or the longer the scanning period of the laser light La. The learning model is trained so that the shorter the length of the wiring pattern on a predetermined substrate input to the learning model, the slower the scanning speed of the laser light La output from the learning model and / or the shorter the scanning period of the laser light La.

[0101] The learning model is generated by the information processing device 3 or an external learning device communicatively connected to the information processing device 3 via the second communication unit 32.

[0102] The inventor has found that the ideal irradiation conditions of the laser light La for forming a high-quality wiring pattern on the surface of a substrate depend not only on the material irradiated with the laser light La but also on the physical properties of the substrate on which the material is disposed. "High quality" refers to, for example, low resistance and high surface smoothness. Specifically, "high quality" refers to "a volume resistivity of 100 μΩcm or less and a smooth wiring pattern 102 is formed in an area of ​​50% or more of the irradiated portion." The inventor has also found that there are various types of physical properties that affect the ideal irradiation conditions of the laser light La, and that each physical property affects each other. However, the physical property value of each physical property and the ideal irradiation conditions do not have a simple relationship such as linear or monotonically increasing, and the ideal irradiation conditions differ depending on the combination of each physical property. Therefore, it is difficult to create a formula that derives the ideal irradiation conditions from each physical property value. The information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various types of physical properties with various combinations with high accuracy and efficiency by using a learning model to calculate the ideal irradiation conditions of the laser light La. Moreover, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La without storing the ideal irradiation conditions of the laser light for various combinations of various types of physical properties, thereby reducing the storage capacity of the second storage unit 31. Furthermore, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La without performing complex judgments according to various combinations of various types of physical properties, thereby reducing the calculation time for the irradiation conditions and the processing load.

[0103] The inventors have also found that the ideal irradiation conditions of the laser light La for forming a high-quality wiring pattern on the surface of the substrate depend on the thickness (film thickness) of the substance on the substrate in addition to the physical properties of the substrate on which the substance is disposed. The information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various combinations of the physical properties of the substrate and the film thickness of the substance with high accuracy and efficiency by calculating the ideal irradiation conditions of the laser light La using a learning model. Furthermore, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various combinations of the physical properties of the substrate and the film thickness of the substance without storing the ideal irradiation conditions of the laser light La themselves by using the learning model, so that the storage capacity of the second storage unit 31 can be reduced. Furthermore, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La without performing complex judgment according to various combinations of the physical properties of the substrate and the film thickness of the substance by using the learning model, so that the calculation time of the irradiation conditions and the processing load can be reduced.

[0104] The inventors have also found that the ideal irradiation conditions of the laser light La for forming a high-quality wiring pattern on the surface of the substrate depend on the wiring pattern on the substrate in addition to the physical properties of the substrate on which the substance is disposed. The information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various combinations of the physical properties of the substrate and the wiring pattern with high accuracy and efficiency by calculating the ideal irradiation conditions of the laser light La using a learning model. Furthermore, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various combinations of the physical properties of the substrate and the wiring pattern without storing the ideal irradiation conditions of the laser light itself by using the learning model, so that the storage capacity of the second storage unit 31 can be reduced. Furthermore, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La without performing complex judgments according to various combinations of the physical properties of the substrate and the wiring pattern by using the learning model, so that the calculation time for the irradiation conditions and the processing load can be reduced.

[0105] Next, the calculation unit 362 inputs the physical property information, thickness information, and coordinate information acquired by the acquisition unit 361 to the learning model, and acquires information output from the learning model. Based on the information output from the learning model, the calculation unit 362 calculates the irradiation conditions of the laser light La to be irradiated to the substance 101 arranged on the surface of the base material 100 (step S105). The irradiation conditions of the laser light La include the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La.

[0106] For example, the calculation unit 362 calculates the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La itself output from the learning model as the irradiation conditions of the laser light La. The calculation unit 362 also generates control information for controlling the operation of each component of the laser light irradiating device 2 from the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La output from the learning model. The calculation unit 362 may calculate this control information as the irradiation conditions of the laser light La. The control information includes the intensity of the laser light La output from the laser light oscillator 21, and the rotation angles and rotation speeds of the first motor 222 and the second motor 224, etc.

[0107] Finally, the output control unit 363 outputs the irradiation conditions (step S106) and ends a series of calculation processes. The output control unit 363 outputs the irradiation conditions of the laser light La calculated by the calculation unit 362 by displaying them on the second display unit 33. The output control unit 363 may output the irradiation conditions of the laser light La calculated by the calculation unit 362 by transmitting them to the laser light irradiating device 2 via the second communication unit 32.

[0108] The laser light irradiation device 2 forms a wiring pattern 102 by irradiating the substance 101 arranged on the surface of the substrate 100 with the laser light La based on the irradiation conditions output from the second display unit 33 or the second communication unit 32. The laser light irradiation device 2 controls the operations of the laser light oscillator 21, the first motor 222, and the second motor 224 by the controller 23 according to the irradiation conditions of the laser light La output from the information processing device 3. The laser light irradiation device 2 irradiates the substrate 100 placed on the placement table 200 with the laser light La to thermally bake the substance 101 arranged on the surface of the substrate 100. In this way, the wiring pattern forming system 1 forms the wiring pattern 102 on the surface of the substrate 100.

[0109] The acquisition unit 361 may omit the processing of steps S102 and / or S103. In this case, the calculation unit 362 inputs the physical property value information acquired by the acquisition unit 361 to the learning model, and calculates the irradiation conditions of the laser light La to be irradiated to the material 101 arranged on the surface of the substrate 100 based on the information output from the learning model. Furthermore, the learning model is trained to output information on the laser light irradiation to the material arranged on the surface of a predetermined substrate when the physical property value information of the predetermined substrate is input.

[0110] Furthermore, the learning model acquired in the process of step S104 may be trained to output information on the quality of the wiring pattern formed by irradiating the material arranged on the surface of the predetermined substrate with laser light La based on the information on the laser light irradiation when information on the laser light irradiation to the material arranged on the surface of the predetermined substrate is input in addition to the physical property information of the predetermined substrate, the thickness information of the material arranged on the surface of the predetermined substrate, and the wiring pattern information of the wiring pattern on the predetermined substrate. The information on the quality of the wiring pattern includes the volume resistivity and surface smoothness of the wiring pattern.

[0111] The learning model may be trained by supervised learning such as neural network or deep learning. As the training data, a set of the physical property value information, thickness information, wiring pattern information, and information on laser light irradiation of each substrate, and information on quality (volume resistivity and surface smoothness of the wiring pattern) is used for various types of substrates. The learning model is trained so that the volume resistivity and surface smoothness of the wiring pattern included in each training data are output when the physical property value information, thickness information, wiring pattern information, and information on laser light irradiation included in each training data are input. The learning model can determine the most ideal information on laser light irradiation from the information on quality output when a certain physical property value information, thickness information, wiring pattern information, and information on laser light irradiation are input.

[0112] In this case, the acquiring unit 361 acquires information on the laser light irradiation in addition to the physical property information, thickness information, and coordinate information. Information on a plurality of different laser light irradiations is pre-stored in the second storage unit 31, and the acquiring unit 361 acquires the information on the laser light irradiation by reading out the pre-stored information from the second storage unit 31. The information on the laser light irradiation may be stored in, for example, an external information processing device, and the acquiring unit 361 may acquire the information on the laser light irradiation by receiving it from the external information processing device via the second communication unit 32.

[0113] In the process of step S105, the calculation unit 362 inputs information on each laser light irradiation to the learning model in addition to the physical property value information, thickness information, and coordinate information acquired by the acquisition unit 361 while changing the information on the laser light irradiation, and acquires information on the quality output from the learning model. The calculation unit 362 calculates information on the laser light irradiation when the quality indicated in the information output from the learning model is the highest as the irradiation condition of the laser light La. For example, the calculation unit 362 calculates information on the laser light irradiation when the volume resistivity of the wiring pattern 102 is the lowest as the irradiation condition of the laser light La. Alternatively, the calculation unit 362 may calculate information on the laser light irradiation when the area of ​​the smooth wiring pattern 102 occupying the irradiated portion is the largest as the irradiation condition of the laser light La. Alternatively, the calculation unit 362 may calculate information on the laser light irradiation when the sum or weighted sum of the inverse of the volume resistivity of the wiring pattern 102 and the area of ​​the smooth wiring pattern 102 occupying the irradiated portion is the largest as the irradiation condition of the laser light La. Alternatively, the calculation unit 362 may calculate, as the irradiation conditions of the laser light La, information on a plurality of laser light irradiations that satisfy the above-mentioned "high quality" from among the qualities indicated in the information output from the learning model.

[0114] Furthermore, the calculation unit 362 may calculate control information generated from the information on the laser light irradiation as the irradiation conditions of the laser light La. In this manner, the calculation unit 362 calculates the irradiation conditions of the laser light La to be irradiated to the substance 101 arranged on the surface of the base material 100, based on the information output from the learning model.

[0115] In this case, the acquisition unit 361 may omit the processing of steps S102 and / or S103. In this case, the calculation unit 362 inputs the physical property value information and information on each laser light irradiation acquired by the acquisition unit 361 to the learning model, and calculates the irradiation conditions of the laser light La to be irradiated to the substance 101 arranged on the surface of the base material 100 based on the information output from the learning model. In addition, the learning model is trained to output information on quality when predetermined physical property value information of the base material and predetermined information on each laser light irradiation are input.

[0116] 5(A) to 5(C) are diagrams showing an example of experimental results relating to physical property information, irradiation conditions of the laser light La, and characteristics of the wiring pattern 102. In FIG.

[0117] 5(A) to (C) show an example of the characteristics of the wiring pattern 102 formed on the surface of the substrate 100 according to the physical property information input to the learning model, the intensity of the laser light La and the scanning speed of the laser light La calculated by the calculation unit 362, and the intensity and scanning speed of the laser light La in the calculation process shown in FIG. 4. "Experiment No." shows the management number. "Physical property value (input)" shows an example of the physical property information of the substrate 100. "Irradiation condition (output) of the laser light La" shows an example of the intensity of the laser light La and the scanning speed of the laser light La. "Experiment result" shows the characteristics of the wiring pattern 102 formed on the surface of the substrate 100. The characteristics are the volume resistivity of the wiring pattern 102 and the characteristics of the wiring pattern 102 when the wiring pattern 102 is viewed visually or by a microscope image.

[0118] 5(A) shows the experimental results of a learning model trained using mechanical properties such as "material" and "density", optical or electrical properties such as "dielectric strength", and thermal properties such as "deflection temperature under load" and "specific heat" as physical property information of the substrate 100. As shown in FIG. 5(A), it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no unevenness was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculates ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0119] FIG. 5(B) shows the experimental results for a learning model trained using mechanical properties such as "tensile strength" and "flexural modulus," optical or electrical properties such as "volume resistivity," and thermal properties such as "deflection temperature under load" and "thermal conductivity" as physical property information of the substrate 100. As shown in FIG. 5(B), it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no irregularities was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculates ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0120] 5(C) shows the experimental results for a learning model trained using mechanical properties such as "water absorption coefficient" and "density", optical or electrical properties such as "dielectric constant", and thermal properties such as "linear expansion coefficient" and "thermal conductivity" as physical property value information of the substrate 100. As shown in FIG. 5(C), it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no unevenness was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculates ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0121] 5(A) to 5(C), the inventors have confirmed that ideal irradiation conditions can be derived for combinations of other physical properties in addition to the combinations of physical properties shown in Fig. 5(A) to 5(C), and in particular, the inventors have confirmed that ideal irradiation conditions can be derived for combinations of various mechanical properties, optical properties or electrical properties, and thermal properties of the substrate 100.

[0122] As described above in detail, the wiring pattern forming system 1 uses a learning model to calculate the irradiation conditions of the laser light La to be irradiated to the material 101 arranged on the surface of the substrate 100 from the physical property value information of the substrate 100. This allows the wiring pattern forming system 1 to present appropriate irradiation conditions of the laser light La to be irradiated to the material 101 arranged on the surface of the substrate 100. Furthermore, the wiring pattern forming system 1 irradiates the substrate 100 with the laser light La according to the presented irradiation conditions. This allows the wiring pattern forming system 1 to form a high-quality wiring pattern 102.

[0123] Furthermore, the wiring pattern forming system 1 can input the physical property information of not only a known substrate but also an unknown substrate into the learning model, thereby calculating appropriate irradiation conditions of the laser light La from the physical property information of a substrate close to the physical property information of the unknown substrate. Therefore, the wiring pattern forming system 1 can propose appropriate irradiation conditions of the laser light La for an unknown substrate.

[0124] FIG. 6 is a diagram showing a schematic configuration of an information processing device 300 according to another embodiment.

[0125] As shown in Fig. 6, the information processing device 300 has each configuration of the information processing device 3 shown in Fig. 3 and each configuration of the laser light irradiation device 2 shown in Fig. 2. The second storage unit 31, the second communication unit 32, the second display unit 33, and the second operation unit 34 of the information processing device 300 shown in Fig. 6 function as the first storage unit 24, the first communication unit 25, the first display unit 26, and the first operation unit 27 of the laser light irradiation device 2 shown in Fig. 2. The processing unit 36 ​​of the information processing device 300 shown in Fig. 6 has an acquisition unit 361, a calculation unit 362, and an output control unit 363 as functional blocks, similar to the processing unit 36 ​​of the information processing device 3 shown in Fig. 3.

[0126] In this case as well, the wiring pattern forming system 1 uses the learning model to calculate the irradiation conditions of the laser light La to be irradiated to the substance 101 arranged on the surface of the substrate 100 from the physical property value information of the substrate 100. This allows the wiring pattern forming system 1 to present appropriate irradiation conditions of the laser light La to be irradiated to the substance 101 arranged on the surface of the substrate 100. Furthermore, the wiring pattern forming system 1 irradiates the substrate 100 with the laser light La according to the presented irradiation conditions. This allows the wiring pattern forming system 1 to form a high-quality wiring pattern 102.

[0127] It should be understood by those skilled in the art that various changes, substitutions, and modifications can be made thereto without departing from the spirit and scope of the present disclosure. For example, the processes of the above-described parts may be executed in different orders as appropriate within the scope of the present disclosure. In addition, the above-described embodiments and modifications may be implemented in appropriate combinations as appropriate within the scope of the present disclosure. [Explanation of symbols]

[0128] 1. Wiring pattern formation system 3,300 Information processing equipment 361 Acquisition Department 362 Calculation Unit 363 Output Control Section

Claims

1. an acquisition unit that acquires physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light; a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that has been trained to output information regarding laser light irradiation of a substance arranged on a surface of a predetermined substrate when physical property information of the predetermined substrate is input, and calculates irradiation conditions of the laser light to be irradiated onto the substance arranged on the surface of the substrate based on the information output from the learning model; An output unit that outputs the irradiation conditions; 13. An information processing device comprising:

2. an acquisition unit that acquires physical property information on physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface of the substrate with laser light, and information on the irradiation of the substance disposed on the surface of the substrate with laser light; a calculation unit that inputs the physical property information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on a surface of the predetermined substrate with a laser light based on the information regarding the laser light irradiation when physical property value information of a predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input, and calculates irradiation conditions of the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; An output unit that outputs the irradiation conditions; 13. An information processing device comprising:

3. The information processing device according to claim 1 , wherein the physical property information includes at least one of information on a mechanical property of the substrate, information on an optical property or an electrical property of the substrate, and information on a thermal property of the substrate.

4. The information processing device according to claim 3 , wherein the physical property information includes at least one of information relating to mechanical properties of the substrate, at least one of information relating to optical properties or electrical properties of the substrate, and at least one of information relating to thermal properties of the substrate.

5. The information on the mechanical properties of the substrate includes material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile fracture strain, tensile yield stress, tear strength, bending stress, bending strength, bending modulus, yield strain, molding shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness; The information regarding the optical or electrical properties of the substrate includes color, absorbance, haze, total light transmittance, refractive index, volume resistivity, surface resistivity, dielectric tangent, dielectric strength, relative dielectric constant, arc resistance, tracking resistance, reflectance, or gloss; The information on the thermal properties of the substrate includes heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, linear expansion coefficient, deflection temperature under load, melting point, melt mass flow rate, or melt volume flow rate; The information processing device according to claim 4.

6. the acquiring unit further acquires thickness information relating to a thickness of a substance disposed on a surface of the base material, and wiring pattern information relating to a wiring pattern on the base material; the learning model is trained to output information regarding laser light irradiation of the material disposed on the surface of the specified substrate when thickness information of the material disposed on the surface of the specified substrate and wiring pattern information of the wiring pattern on the specified substrate are input in addition to physical property value information of the specified substrate, the calculation unit inputs the physical property information, thickness information, and wiring pattern information acquired by the acquisition unit into the learning model, and calculates the irradiation conditions based on the information output from the learning model. The information processing device according to claim 1 .

7. the acquiring unit further acquires thickness information relating to a thickness of a substance disposed on a surface of the base material, and wiring pattern information relating to a wiring pattern on the base material; the learning model is trained to output information about the quality when thickness information of a material disposed on a surface of the predetermined substrate and wiring pattern information of a wiring pattern on the predetermined substrate are input in addition to physical property information of the predetermined substrate and information about the laser light irradiation, the calculation unit inputs the physical property information, thickness information, wiring pattern information, and information on laser light irradiation acquired by the acquisition unit into the learning model, and calculates the irradiation conditions based on the information output from the learning model. The information processing device according to claim 2 .

8. The information processing apparatus according to claim 1 , wherein the irradiation conditions include an intensity of a laser beam or a scanning speed of the laser beam.

9. The information processing device according to claim 1 , wherein the substance includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with laser light.

10. A wiring pattern forming system having an information processing device and a laser light irradiation device, The information processing device includes: an acquisition unit that acquires physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light; a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that has been trained to output information regarding laser light irradiation of a substance arranged on a surface of a predetermined substrate when physical property information of the predetermined substrate is input, and calculates irradiation conditions of the laser light to be irradiated onto the substance arranged on the surface of the substrate based on the information output from the learning model; An output unit that outputs the irradiation conditions, the laser light irradiation device has a forming unit that forms a wiring pattern by irradiating a material disposed on a surface of the base material with laser light based on the irradiation conditions output from the output unit; A wiring pattern forming system comprising:

11. A wiring pattern forming system having an information processing device and a laser light irradiation device, The information processing device includes: an acquisition unit that acquires physical property information on physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface of the substrate with laser light, and information on the irradiation of the substance disposed on the surface of the substrate with laser light; a calculation unit that inputs the physical property information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with a laser light based on the information regarding the laser light irradiation when physical property value information of a predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input, and calculates irradiation conditions of the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; An output unit that outputs the irradiation conditions, the laser light irradiation device has a forming unit that forms a wiring pattern by irradiating a material disposed on a surface of the base material with laser light based on the irradiation conditions output from the output unit; A wiring pattern forming system comprising:

12. By computer, acquiring physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light; inputting the acquired physical property information into a learning model that has been trained to output information regarding laser light irradiation of a substance arranged on a surface of a predetermined substrate when physical property information of the predetermined substrate is input; and calculating irradiation conditions of the laser light to be irradiated onto the substance arranged on the surface of the substrate based on the information output from the learning model; Outputting the irradiation conditions.

23. An information processing method comprising:

13. By computer, Acquiring physical property information on physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface of the substrate with laser light, and information on the irradiation of the substance disposed on the surface of the substrate with laser light; inputting the acquired physical property information and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with a laser light based on the information regarding the laser light irradiation when physical property information of the physical property values ​​of a predetermined substrate and information regarding the laser light irradiation to a material arranged on the surface of the predetermined substrate are input; and calculating irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; Outputting the irradiation conditions.

23. An information processing method comprising:

14. A control program for a computer having an output unit, acquiring physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light; inputting the acquired physical property information into a learning model that has been trained to output information regarding laser light irradiation of a substance arranged on a surface of a predetermined substrate when physical property information of the predetermined substrate is input; and calculating irradiation conditions of the laser light to be irradiated onto the substance arranged on the surface of the substrate based on the information output from the learning model; The irradiation conditions are output by the output unit. A control program that causes the computer to execute the above steps.

15. A control program for a computer having an output unit, Acquiring physical property information on physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface of the substrate with laser light, and information on the irradiation of the substance disposed on the surface of the substrate with laser light; inputting the acquired physical property information and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with a laser light based on the information regarding the laser light irradiation when physical property information of the physical property values ​​of a predetermined substrate and information regarding the laser light irradiation to a material arranged on the surface of the predetermined substrate are input; and calculating irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; The irradiation conditions are output by the output unit. A control program that causes the computer to execute the above steps.

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