Manufacturing method for MIM structure substrate and MIM structure substrate

Abstract

To provide a manufacturing method for a MIM structure substrate capable of stably forming a single layer structure of a metal colloidal crystal on the surface of an insulation member.SOLUTION: A manufacturing method for a MIM structure substrate 1 comprises the steps of: preparing an insulation member containing an insulating substrate, an insulator film, and a second metal layer provided on the second principal plane of the insulating substrate; charging a first metal layer with a first charge having the opposite sign as the surface charge of the insulator film, and charging the second metal layer with a second charge having the same sign as the surface charge of the insulator film; preparing a colloidal dispersion in which metal particles with a charge having opposite sign to the surface charge of an insulator film are dispersed in a dispersion medium; contacting the colloidal dispersion with the surface of the insulation member close to the first metal layer; forming a metal colloidal crystal composed of metal particles in the colloidal dispersion; and adsorbing metal particles onto the surface of the insulation member close to the first metal layer 12 to form a single layer structure of the metal colloidal crystal.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing an MIM structure substrate and an MIM structure substrate. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a substrate for SPR measurement, which comprises an insulating member preparation step of preparing an insulating member having a positive or negative charge on its surface, a colloidal crystal dispersion preparation step of preparing a charged colloidal crystal dispersion in which colloidal crystals made of metal colloidal particles having an opposite charge to the surface charge of the insulating member are dispersed in a dispersion medium, and a surface formation step of bringing the charged colloidal crystal dispersion into contact with the insulating member to form a monolayer structure of metal colloidal crystals on the insulating member.

[0003] Fig. 4 of Patent Document 1 describes the following manufacturing method as one embodiment. First, a metal film substrate is prepared by forming a metal film on a substrate made of insulating glass, ceramic, or the like by a method such as vapor deposition, sputtering, or chemical plating. Then, a metal substrate with an insulating film is prepared by forming an insulating film having a positive charge on the metal film substrate.

[0004] On the other hand, a charged colloidal crystal dispersion is prepared in which colloidal crystals made of negatively charged metal colloidal particles are dispersed in a dispersion medium. In the dispersion, the metal colloidal particles are three-dimensionally crystallized to form a charged colloidal crystal structure, and the metal colloidal particles are arranged at a predetermined interval.

[0005] The charged colloidal crystal dispersion is then dropped onto a metal substrate with an insulating film, and the negatively charged metal colloidal particles are electrostatically attracted to one layer of the crystal lattice (three-dimensional crystal), after which the excess charged colloidal crystal dispersion is washed away by a solvent such as water. In this way, a two-dimensional charged metal colloidal crystal made of metal particles is formed on the insulating member. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2020-34543 A Summary of the Invention [Problem to be solved by the invention]

[0007] In the manufacturing method described in Patent Document 1, a substrate having a metal-insulator-metal (MIM) structure can be formed by using an insulating film formed on a metal film as the insulating member.

[0008] Furthermore, Patent Document 1 describes that it is preferable to treat the insulating film with an alkali before carrying out the surface formation step. - The carbonyl groups are formed on the insulating film, which are gradually neutralized by carbonate ions in the air over time, gradually increasing the positive surface charge. This slows down the growth of the two-dimensional charged metal colloidal crystals in the surface formation process, resulting in the formation of two-dimensional charged metal colloidal crystals with fewer defects.

[0009] However, by treating the insulating film with alkali before carrying out the surface formation process, it is likely to be difficult to crystallize the metal particles in three dimensions, and if the amount of carbonate ions dissolved in the insulating film increases, it is likely to be difficult to maintain the two-dimensional crystallization of the metal particles. Therefore, with the method of treating the insulating film with alkali, it is difficult to improve the reproducibility of adsorbing the metal particles in a two-dimensional crystal state, and problems arise, such as, for example, the metal particles being randomly adsorbed on the insulating member, and the area of ​​two-dimensional crystallization becoming smaller.

[0010] The present invention has been made to solve the above problems, and aims to provide a method for manufacturing an MIM structure substrate capable of stably forming a monolayer structure of metal colloidal crystals on the surface of an insulating member. Another aim of the present invention is to provide an MIM structure substrate in which a monolayer structure of metal colloidal crystals is stably formed on the surface of an insulating member. [Means for solving the problem]

[0011] The method for manufacturing an MIM structure substrate of the present invention includes the steps of: preparing an insulating member including an insulating substrate having a first main surface and a second main surface opposing each other in a thickness direction; a first metal layer provided on the first main surface of the insulating substrate; an insulating film provided on a surface of the first metal layer, the insulating film having a positive or negative surface charge; and a second metal layer provided on the second main surface of the insulating substrate; applying a DC voltage to the first metal layer and the second metal layer to charge the first metal layer with a first charge having an opposite sign to the surface charge of the insulating film and to charge the second metal layer with a second charge having the same sign as the surface charge of the insulating film; preparing a colloidal dispersion in which metal particles having a charge opposite to the surface charge of the insulating film are dispersed in a dispersion medium; and the first metal layer is charged with the second charge and the second metal layer is charged with the second charge, respectively; forming a metal colloidal crystal consisting of the metal particles in the colloidal dispersion in the colloidal dispersion that is in contact with the insulating member by three-dimensionally crystallizing the metal particles in the colloidal dispersion that is in contact with the insulating member; and adsorbing the metal particles to the surface of the insulating member facing the first metal layer by discharging the first charge from the first metal layer or charging the first metal layer with the second charge instead of the first charge, with respect to the insulating member in a state in which the colloidal dispersion containing the metal colloidal crystal is in contact with the insulating member, thereby forming a monolayer structure of the metal colloidal crystal.

[0012] In a first aspect, the MIM structure substrate of the present invention comprises an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction, an insulating member including a first metal layer provided on the first main surface of the insulating substrate, an insulating film provided on a surface of the first metal layer and having a positive or negative charge on its surface, and a second metal layer provided on the second main surface of the insulating substrate, and metal particles arranged on the surface of the insulating member on the first metal layer side. The metal particles are arranged in a single layer in at least a partial region of the surface of the insulating member on the first metal layer side.

[0013] In a second aspect, the MIM structure substrate of the present invention includes an insulating member including an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction, a first metal layer provided on the first main surface of the insulating substrate, and an insulating film provided on a surface of the first metal layer and having a positive or negative charge on its surface, and metal particles arranged on the surface of the insulating member on the first metal layer side. The metal particles are arranged selectively only on the surface of the insulating film on the first metal layer among the surface of the insulating member on the first metal layer side, and are arranged in a single layer in at least a partial region of the surface of the insulating member on the first metal layer side. Effect of the Invention

[0014] According to the present invention, it is possible to provide a manufacturing method for an MIM structure substrate capable of stably forming a monolayer structure of metal colloidal crystals on the surface of an insulating member. Furthermore, according to the present invention, it is possible to provide an MIM structure substrate in which a monolayer structure of metal colloidal crystals is stably formed on the surface of an insulating member. [Brief description of the drawings]

[0015] [Figure 1] 1A to 1E are schematic views illustrating a method for manufacturing an MIM structure substrate according to a first embodiment of the present invention. [Diagram 2] 2A to 2E are schematic views for explaining a method for manufacturing an MIM structure substrate according to a second embodiment of the present invention. [Diagram 3]FIG. 3 is a cross-sectional view showing a schematic example of an MIM structure substrate of the present invention. [Figure 4] FIG. 4 is a cross-sectional view that illustrates a schematic diagram of another example of the MIM structure substrate of the present invention. [Diagram 5] FIG. 5 is a plan view that illustrates a schematic diagram of still another example of the MIM structure substrate of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The method for producing an MIM structure substrate and the MIM structure substrate of the present invention will be described below. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied within the scope of the present invention. The present invention also includes a combination of two or more of the individual preferable configurations of the present invention described in the following embodiments.

[0017] The use of the MIM structure substrate of the present invention is not particularly limited, but for example, it is used as a substrate for optical measurements such as a substrate for measuring Surface Plasmon Resonance (SPR).

[0018] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same reference numerals will be used for the same or corresponding parts. In addition, the same reference numerals will be used for the same elements in each drawing, and duplicate explanations will be omitted.

[0019] [First embodiment] In the manufacturing method of the MIM structure substrate according to the first embodiment of the present invention, after a colloidal dispersion liquid is brought into contact with the surface of the insulating member facing the first metal layer, the application of DC voltage to the first metal layer and the second metal layer is stopped before the metal particles are adsorbed.

[0020] 1A to 1E are schematic views illustrating a method for manufacturing an MIM structure substrate according to a first embodiment of the present invention.

[0021] Prior to the step shown in FIG. 1A, an insulating member 10 is prepared.

[0022] The insulating member 10 includes an insulating substrate 11, a first metal layer 12, an insulating film 13, and a second metal layer 14.

[0023] The insulating substrate 11 has a first main surface 11a and a second main surface 11b that face each other in the thickness direction (the vertical direction in FIG. 1A).

[0024] The insulating substrate 11 is, for example, a glass substrate, or may be a ceramic substrate, a resin substrate, or the like, as long as it has insulating properties.

[0025] The first metal layer 12 is provided on a first main surface 11a of the insulating substrate 11.

[0026] The first metal layer 12 is, for example, a metal film. The metal film can be formed by a method such as vapor deposition, sputtering, or chemical plating.

[0027] The first metal layer 12 is made of, for example, gold. The type of the first metal layer 12 is preferably a noble metal such as gold or silver.

[0028] The thickness of the first metal layer 12 is not particularly limited, but when the first metal layer 12 is a metal film, it is, for example, 1 nm or more.

[0029] The insulating film 13 is provided on the surface of the first metal layer 12. Specifically, the insulating film 13 is provided on the surface of the first metal layer 12 opposite the insulating substrate 11. Although not shown in Fig. 1A, the insulating film 13 may also be provided on the surface of the second metal layer 14. In that case, the insulating film 13 is provided on the surface of the second metal layer 14 opposite the insulating substrate 11.

[0030] The insulating film 13 has a surface with positive or negative charges.

[0031] 1A, the surface of the insulating film 13 has a positive charge. An example of the insulating film 13 having a positive charge is a silica film having an amino group.

[0032] The positively charged insulating film 13 can be formed, for example, by forming a silica layer on the surface of the first metal layer 12 using a first silane coupling agent having a mercapto group such as 3-mercaptopropyltrimethoxysilane (MEPTMS), and then binding an amino group to the silane layer using a second silane coupling agent such as 3-aminopropyltriethoxysilane (APTES), or by adsorbing a polymer having a cationic group such as polyethyleneimine or poly(2-vinylpyridine) onto the surface.

[0033] The thickness of the insulating film 13 is not particularly limited, and may be smaller than the thickness of the first metal layer 12 , may be the same as the thickness of the first metal layer 12 , or may be larger than the thickness of the first metal layer 12 .

[0034] The second metal layer 14 is provided on the second main surface 11b of the insulating substrate 11.

[0035] The second metal layer 14 is, for example, a metal film. The metal film can be formed by a method such as vapor deposition, sputtering, chemical plating, etc. Alternatively, the second metal layer 14 may be a metal plate.

[0036] The second metal layer 14 is made of, for example, gold. The type of the second metal layer 14 may be, for example, a precious metal such as gold or silver, or may not be a precious metal. The type of the second metal layer 14 may be the same as or different from the type of the first metal layer 12. As described above, the second metal layer 14 may be a metal film having high conductivity, or may be a metal plate.

[0037] The thickness of the second metal layer 14 is not particularly limited, but when the second metal layer 14 is a metal film, it is, for example, 1 nm or more. The thickness of the second metal layer 14 may be the same as or different from the thickness of the first metal layer 12.

[0038] Next, as shown in FIG. 1A, a DC voltage is applied to the first metal layer 12 and the second metal layer 14, so that a first charge having an opposite sign to the surface charge of the insulating film 13 is applied to the first metal layer 12, and a second charge having the same sign as the surface charge of the insulating film 13 is applied to the second metal layer 14.

[0039] In the example shown in FIG. 1A, since the surface of the insulating film 13 has a positive charge, the first charge is a negative charge and the second charge is a positive charge.

[0040] Before the step shown in FIG. 1B, a colloidal dispersion (not shown) is prepared separately in which metal particles 20 having an electric charge opposite in sign to the surface electric charge of the insulating film 13 are dispersed in a dispersion medium.

[0041] The metal particles 20 are, for example, gold particles.

[0042] In the example shown in FIG. 1B, the surface of the insulating film 13 has a positive charge, and therefore the surfaces of the metal particles 20 have a negative charge.

[0043] 1B, in a state in which the first metal layer 12 is charged with a first charge (e.g., negative charge) and the second metal layer 14 is charged with a second charge (e.g., positive charge), a colloidal dispersion is brought into contact with the surface of the insulating member 10 on the first metal layer 12 side. For example, the colloidal dispersion is dripped onto the surface of the first metal layer 12 of the insulating member 10.

[0044] As shown in FIG. 1C, metal particles 20 in the colloidal dispersion liquid in contact with the insulating member 10 are three-dimensionally crystallized, thereby forming metal colloidal crystals made of the metal particles 20 in the colloidal dispersion liquid.

[0045] 1C, metal particles 20 are not yet adsorbed to the surface of first metal layer 12 of insulating member 10. In the colloidal dispersion, metal particles 20 are arranged three-dimensionally at predetermined intervals due to electrostatic repulsion between metal particles 20. As a result, metal colloidal crystals made of metal particles 20 are formed in the colloidal dispersion.

[0046] After the step shown in FIG. 1C, the application of the DC voltage to the first metal layer 12 and the second metal layer 14 is stopped, as shown in FIG. 1D or FIG. 1E.

[0047] Thereafter, a first charge (e.g., a negative charge) is discharged from the first metal layer 12 (see FIG. 1D) with respect to the insulating member 10 in contact with a colloidal dispersion liquid containing metal colloidal crystals, or a second charge (e.g., a positive charge) is applied to the first metal layer 12 instead of the first charge (see FIG. 1E), thereby adsorbing metal particles 20 onto the surface of the insulating member 10 facing the first metal layer 12, thereby forming a monolayer structure of metal colloidal crystals.

[0048] 1D, at least the first metal layer 12 of the first metal layer 12 and the second metal layer 14 is connected to ground, thereby discharging a first charge (e.g., a negative charge) from the first metal layer 12. In this case, the first metal layer 12 and the second metal layer 14 may be connected to ground, or only the first metal layer 12 may be connected to ground.

[0049] On the other hand, in the example shown in Figure 1E, a DC voltage in the opposite direction to that in the process shown in Figure 1A is applied to the first metal layer 12 and the second metal layer 14, thereby charging the first metal layer 12 with a second charge (e.g., a positive charge) instead of the first charge.

[0050] 1D or 1E, only one layer of three-dimensional metal colloidal crystals can be adsorbed onto the surface of the insulating member 10 by electrostatic attraction. The excess colloidal dispersion is then washed away by washing with a solvent such as water. As a result, a single layer structure of metal colloidal crystals is formed on the surface of the insulating member 10 on the side of the first metal layer 12.

[0051] For example, when a first metal layer 12 is provided on a portion of the first main surface 11a of the insulating substrate 11, it is preferable that the single layer structure of metal colloidal crystals is selectively formed only on the surface of the insulating film 13 on the first metal layer 12, among the surfaces of the insulating member 10 facing the first metal layer 12.

[0052] After the step shown in FIG. 1D or FIG. 1E, the second metal layer 14 may be removed from the insulating substrate 11.

[0053] [Second embodiment] In the manufacturing method of an MIM structure substrate according to the second embodiment of the present invention, after a DC voltage is applied to the first metal layer and the second metal layer, the application of the DC voltage to the first metal layer and the second metal layer is stopped before the colloidal dispersion liquid is brought into contact with the surface of the insulating member facing the first metal layer.

[0054] 2A to 2E are schematic views for explaining a method for manufacturing an MIM structure substrate according to a second embodiment of the present invention.

[0055] The manufacturing method of the MIM structure substrate shown in Figures 2A to 2E is common to the manufacturing method of the MIM structure substrate shown in Figures 1A to 1E, except that after the step shown in Figure 2A, the application of DC voltage to the first metal layer 12 and the second metal layer 14 is stopped, as shown in Figure 2B.

[0056] After the step shown in FIG. 2D or FIG. 2E, the second metal layer 14 may be removed from the insulating substrate 11.

[0057] FIG. 3 is a cross-sectional view showing a schematic example of an MIM structure substrate of the present invention.

[0058] The MIM structure substrate 1 shown in FIG.

[0059] The insulating member 10 includes an insulating substrate 11 having a first main surface 11a and a second main surface 11b opposed in the thickness direction (the up-down direction in FIG. 3), a first metal layer 12 provided on the first main surface 11a of the insulating substrate 11, an insulating film 13 provided on the surface of the first metal layer 12 and having a positive or negative charge on its surface, and a second metal layer 14 provided on the second main surface 11b of the insulating substrate 11.

[0060] The metal particles 20 are arranged on the surface of the insulating member 10 on the first metal layer 12 side.

[0061] Specifically, the metal particles 20 are arranged in a single layer on the surface of the insulating member 10 facing the first metal layer 12. In other words, the metal particles 20 are arranged two-dimensionally on the surface of the insulating member 10 facing the first metal layer 12. It is sufficient that the metal particles 20 are arranged in a single layer in at least a partial region of the surface of the insulating member 10 facing the first metal layer 12.

[0062] For example, when observing the MIM structure substrate 1 using a microscope such as an optical microscope or an electron microscope, if the metal particles 20 are observed only when the height of the sample stage is set to a certain height, it can be confirmed that the metal particles 20 are arranged in a single layer on the surface of the insulating member 10.

[0063] In the MIM structure substrate 1 shown in Figure 3, when a first metal layer 12 is provided on a portion of the first main surface 11a of the insulating substrate 11, it is preferable that the metal particles 20 are selectively arranged only on the surface of the insulating film 13 on the first metal layer 12, among the surface of the insulating member 10 on the first metal layer 12 side.

[0064] 3, for example, when the surface of the insulating member 10 (the surface of the insulating film 13 in the example shown in FIG. 3) has a positive charge and the surface of the metal particles 20 has a negative charge, the metal particles 20 are arranged at intervals on the surface of the insulating member 10 due to electrostatic repulsion acting between the metal particles 20. On the other hand, since the surface of the insulating member 10 has a positive charge, the negatively charged metal particles 20 are adsorbed to the surface of the insulating member 10 by electrostatic attraction.

[0065] As in the MIM structure substrate 1 shown in Fig. 3, a two-dimensional colloidal crystal in which metal particles 20 are regularly arranged is preferably formed on the surface of an insulating member 10. In this case, the metal particles 20 are preferably arranged two-dimensionally and regularly on the surface of the insulating member 10 with spaces between each other.

[0066] FIG. 4 is a cross-sectional view that illustrates a schematic diagram of another example of the MIM structure substrate of the present invention.

[0067] The MIM structure substrate 1A shown in FIG.

[0068] The insulating member 10A includes an insulating substrate 11 having a first main surface 11a and a second main surface 11b facing each other in the thickness direction (the up-down direction in FIG. 4), a first metal layer 12 provided on the first main surface 11a of the insulating substrate 11, and an insulating film 13 provided on the surface of the first metal layer 12, the surface of which has a positive or negative charge.

[0069] The MIM structure substrate 1A shown in FIG. 4 has a common configuration with the MIM structure substrate 1 shown in FIG.

[0070] In the MIM structure substrate 1A shown in Figure 4, when a first metal layer 12 is provided on a portion of the first main surface 11a of the insulating substrate 11, it is preferable that the metal particles 20 are selectively arranged only on the surface of the insulating film 13 on the first metal layer 12, among the surface of the insulating member 10 on the first metal layer 12 side.

[0071] FIG. 5 is a plan view that illustrates a schematic diagram of still another example of the MIM structure substrate of the present invention.

[0072] As in the MIM structure substrate 2 shown in FIG. 5, a region (domain) in which metal particles 20 are regularly arranged two-dimensionally may change direction and aggregate to form a polycrystalline state.

[0073] Although not shown in Figures 3 to 5, when a two-dimensional colloidal crystal of metal particles 20 is formed on the surface of insulating member 10, there may be only regions in which metal particles 20 are regularly arranged, or in addition to the regions in which metal particles 20 are regularly arranged, there may be regions in which metal particles 20 are irregularly arranged.

[0074] The distance between the metal particles 20 is not particularly limited.

[0075] The distance between metal particles 20 is measured as the average interparticle distance for 100 to 200 metal particles 20 in a plan view as shown in FIG.

[0076] The average particle size of the metal particles 20 is not particularly limited.

[0077] The average particle size of the metal particles 20 is measured as the average value of particle sizes (diameters) of 100 or more and 200 or less metal particles 20 in a plan view such as that shown in FIG.

[0078] The present specification discloses the following:

[0079] <1> A step of preparing an insulating member including an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction, a first metal layer provided on the first main surface of the insulating substrate, an insulating film provided on a surface of the first metal layer and having a surface with a positive or negative charge, and a second metal layer provided on the second main surface of the insulating substrate; applying a DC voltage to the first metal layer and the second metal layer to charge the first metal layer with a first charge having an opposite sign to a surface charge of the insulating film, and charge the second metal layer with a second charge having the same sign as the surface charge of the insulating film; preparing a colloidal dispersion in which metal particles having an electric charge of an opposite sign to the surface electric charge of the insulating film are dispersed in a dispersion medium; a step of contacting the colloidal dispersion with a surface of the insulating member on the side of the first metal layer, with the first metal layer being charged with the first charge and the second metal layer being charged with the second charge; forming a metal colloidal crystal made of the metal particles in the colloidal dispersion by three-dimensionally crystallizing the metal particles in the colloidal dispersion that is in contact with the insulating member; and a step of discharging the first charge from the first metal layer, or charging the first metal layer with the second charge instead of the first charge, with respect to the insulating member in contact with the colloidal dispersion liquid containing the metal colloidal crystals, thereby adsorbing the metal particles onto the surface of the insulating member facing the first metal layer, thereby forming a monolayer structure of the metal colloidal crystals. Manufacturing method for MIM structure substrate.

[0080] <2> after the colloidal dispersion liquid is brought into contact with the surface of the insulating member facing the first metal layer, application of the DC voltage to the first metal layer and the second metal layer is stopped before the metal particles are adsorbed; <1> A method for producing the MIM structure substrate described above.

[0081] <3> After applying the DC voltage to the first metal layer and the second metal layer, the application of the DC voltage to the first metal layer and the second metal layer is stopped before the colloidal dispersion liquid is brought into contact with the surface of the insulating member on the first metal layer side. <1> A method for producing the MIM structure substrate described above.

[0082] <4> In the step of forming the monolayer structure of the metal colloidal crystal, at least the first metal layer of the first metal layer and the second metal layer is connected to a ground, thereby discharging the first charge from the first metal layer. <1> ~ <3> 13. A method for producing an MIM structure substrate according to claim 12.

[0083] <5> In the step of forming a monolayer structure of the metal colloidal crystal, a DC voltage in a direction opposite to that in the metal layer charging step is applied to the first metal layer and the second metal layer, thereby charging the first metal layer with the second charge instead of the first charge. <1> ~ <3> 13. A method for producing an MIM structure substrate according to claim 12.

[0084] <6> The method further comprises the step of removing the second metal layer from the insulating substrate after the step of forming the monolayer structure of the metal colloidal crystal. <1> ~ <5> 13. A method for producing an MIM structure substrate according to claim 12.

[0085] <7> The first charge is a negative charge and the second charge is a positive charge. <1> ~ <6> 13. A method for producing an MIM structure substrate according to claim 12.

[0086] <8> The insulating film is a silica film having an amino group. <7> A method for producing the MIM structure substrate described above.

[0087] <9> the metal particles are gold particles, The first metal layer and the second metal layer are both made of gold. <1> ~ <8> 13. A method for producing an MIM structure substrate according to claim 12.

[0088] <10> The first metal layer and the second metal layer are both metal films. <1> ~ <9> 13. A method for producing an MIM structure substrate according to claim 12.

[0089] <11> The first metal layer is a metal film, and the second metal layer is a metal plate. <1> ~ <9> 13. A method for producing an MIM structure substrate according to claim 12.

[0090] <12> an insulating member including: an insulating substrate having a first main surface and a second main surface opposing each other in a thickness direction; a first metal layer provided on the first main surface of the insulating substrate; an insulating film provided on a surface of the first metal layer, the insulating film having a positive or negative charge on its surface; and a second metal layer provided on the second main surface of the insulating substrate; metal particles arranged on a surface of the insulating member on the first metal layer side, the metal particles are arranged in a single layer in at least a portion of a surface of the insulating member facing the first metal layer; MIM structure board.

[0091] <13> an insulating member including an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction, a first metal layer provided on the first main surface of the insulating substrate, and an insulating film provided on a surface of the first metal layer, the surface having a positive or negative charge; metal particles arranged on a surface of the insulating member on the first metal layer side, the metal particles are selectively arranged only on a surface of the insulating film on the first metal layer among the surface of the insulating member on the first metal layer side, and are arranged in a single layer in at least a partial region of the surface of the insulating member on the first metal layer side. MIM structure board.

[0092] <14> The insulating member further includes a second metal layer provided on the second main surface of the insulating substrate. <13> The MIM structure substrate according to claim 1. [Explanation of symbols]

[0093] 1, 1A, 2 MIM structure board 10, 10A Insulation material 11 Insulating substrate 11a 1st main surface 11b 2nd principal surface 12 1st metal layer 13. Insulating film 14 Second metal layer 20 metal particles

Claims

1. A step of preparing an insulating member including an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction, a first metal layer provided on the first main surface of the insulating substrate, an insulating film provided on a surface of the first metal layer and having a positive or negative charge on its surface, and a second metal layer provided on the second main surface of the insulating substrate; applying a DC voltage to the first metal layer and the second metal layer to charge the first metal layer with a first charge having an opposite sign to a surface charge of the insulating film, and charge the second metal layer with a second charge having the same sign as the surface charge of the insulating film; preparing a colloidal dispersion in which metal particles having an electric charge opposite in sign to the surface electric charge of the insulating film are dispersed in a dispersion medium; a step of contacting the colloidal dispersion with a surface of the insulating member facing the first metal layer in a state in which the first metal layer is charged with the first charge and the second metal layer is charged with the second charge; forming a metal colloidal crystal made of the metal particles in the colloidal dispersion by three-dimensionally crystallizing the metal particles in the colloidal dispersion that is in contact with the insulating member; and a step of adsorbing the metal particles onto a surface of the insulating member facing the first metal layer by discharging the first charge from the first metal layer or by charging the first metal layer with the second charge instead of the first charge, while the insulating member is in contact with the colloidal dispersion liquid containing the metal colloidal crystals, thereby forming a monolayer structure of the metal colloidal crystals. A method for manufacturing a MIM structure substrate.

2. after the colloidal dispersion liquid is brought into contact with the surface of the insulating member on the side of the first metal layer, application of the DC voltage to the first metal layer and the second metal layer is stopped before the metal particles are adsorbed. A method for producing the MIM structure substrate according to claim 1.

3. after applying the DC voltage to the first metal layer and the second metal layer, stopping the application of the DC voltage to the first metal layer and the second metal layer before contacting the colloidal dispersion with the surface of the insulating member on the first metal layer side; A method for producing the MIM structure substrate according to claim 1.

4. In the step of forming the monolayer structure of the metal colloidal crystal, at least the first metal layer of the first metal layer and the second metal layer is connected to a ground, thereby discharging the first charge from the first metal layer. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

5. In the step of forming a monolayer structure of the metal colloidal crystal, a DC voltage in a direction opposite to that in the metal layer charging step is applied to the first metal layer and the second metal layer, thereby charging the first metal layer with the second charge instead of the first charge. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

6. The method further comprises the step of removing the second metal layer from the insulating substrate after the step of forming the monolayer structure of the metal colloidal crystal. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

7. the first charge is a negative charge and the second charge is a positive charge; A method for producing the MIM structure substrate according to any one of claims 1 to 3.

8. The insulating film is a silica film having an amino group. The method for producing the MIM structure substrate according to claim 7.

9. the metal particles are gold particles; The first metal layer and the second metal layer are both made of gold. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

10. The first metal layer and the second metal layer are both metal films. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

11. The first metal layer is a metal film, and the second metal layer is a metal plate. A method for producing the MIM structure substrate according to any one of claims 1 to 3.

12. an insulating member including: an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction; a first metal layer provided on the first main surface of the insulating substrate; an insulating film provided on a surface of the first metal layer, the insulating film having a positive or negative charge on its surface; and a second metal layer provided on the second main surface of the insulating substrate; metal particles arranged on a surface of the insulating member on the first metal layer side, the metal particles are arranged in a single layer in at least a portion of a surface of the insulating member on the first metal layer side; MIM structure substrate.

13. an insulating member including: an insulating substrate having a first main surface and a second main surface opposed to each other in a thickness direction; a first metal layer provided on the first main surface of the insulating substrate; and an insulating film provided on a surface of the first metal layer, the insulating film having a positive or negative charge on the surface; metal particles arranged on a surface of the insulating member on the first metal layer side, the metal particles are selectively arranged only on a surface of the insulating film on the first metal layer among the surface of the insulating member on the first metal layer side, and are arranged in a single layer in at least a partial region of the surface of the insulating member on the first metal layer side. MIM structure substrate.

14. The insulating member further includes a second metal layer provided on the second main surface of the insulating substrate. The MIM structure substrate according to claim 13.

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