Cooling structure

Abstract

To provide a cooling structure which can efficiently cool a cooling object.SOLUTION: A cooling structure which is brought into contact with a heating element and radiates heat of the heating element includes a metal plate, and a resin laminate formed by laminating a first layer composed of a first resin body and a second layer composed of a second resin body, wherein the first layer is made by forming a gap with the one or the plurality of first resin bodies, and the second layer is made by forming a gap with the one or the plurality of second resin bodies.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cooling structure. [Background technology]

[0002] Conventionally, a known cooling structure for cooling a heat-generating body involves bringing a metal plate made of a metal with high thermal conductivity into contact with the heat-generating body and dissipating the heat from the heat-generating body through the metal plate (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-028923 [Patent Document 2] Patent No. 6726862 Summary of the Invention [Problem to be solved by the invention]

[0004] However, a cooling structure consisting only of a metal plate has a line or point contact with the object to be cooled, resulting in low heat transfer efficiency. Also, metal plates made of materials with high thermal conductivity, such as aluminum or copper, have low elasticity and are difficult to adhere closely to the object to be cooled.

[0005] The present invention has been made in consideration of the above, and has an object to provide a cooling structure that can efficiently cool an object to be cooled. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the cooling structure of the present invention is a cooling structure that comes into contact with a heat-generating element to dissipate heat from the heat-generating element, and is characterized in that it comprises a metal plate, a first layer made of a first resin body, and a resin laminate formed by laminating a second layer made of a second resin body, the first layer having gaps formed by one or more of the first resin bodies, and the second layer having gaps formed by one or more of the second resin bodies.

[0007] In addition, the cooling structure of the present invention is characterized in that, in the above invention, the first resin body is arranged in multiple numbers on the first layer, the second resin body is arranged in multiple numbers on the second layer, and the longitudinal directions of each of the first and second resin bodies intersect when viewed in a planar view from the stacking direction.

[0008] Moreover, in the cooling structure according to the present invention, in the above invention, the resin bodies in the first or second layer are arranged with the same distance between adjacent resin bodies.

[0009] Moreover, in the cooling structure according to the present invention, in the above invention, at least a part of the distance between adjacent resin bodies in the first or second layer is different.

[0010] In addition, the cooling structure of the present invention is characterized in that, in the above invention, the longitudinal directions of the first and second resin bodies intersect in directions perpendicular to each other when viewed in a planar view from the stacking direction.

[0011] In addition, in the cooling structure according to the present invention, the first and second resin bodies form a space corresponding to a shape of a contact surface of the heat generating body.

[0012] In addition, the cooling structure of the present invention is characterized in that, in the above invention, the first resin body has a multiple annular shape, and a plurality of the second resin bodies extending radially are stacked on the first resin body.

[0013] In addition, the cooling structure of the present invention is characterized in that, in the above invention, the first resin body is spirally shaped and a plurality of the second resin bodies extending radially are stacked on the first resin body.

[0014] In addition, the cooling structure according to the present invention is characterized in that, in the above invention, the metal plate is comb-shaped. Effect of the Invention

[0015] Advantageous Effects of Invention According to the present invention, an effect is achieved in that an object to be cooled can be efficiently cooled. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a diagram showing a configuration of a cooling structure according to an embodiment of the present invention. [Figure 2A] FIG. 2A is a diagram (part 1) for explaining the behavior of the resin body when pressed. [Figure 2B] FIG. 2B is a diagram (part 2) for explaining the behavior of the resin body when pressed. [Diagram 3] FIG. 3 is a diagram showing a configuration of a cooling structure according to a first modified example of the embodiment of the present invention. [Figure 4] FIG. 4 is a diagram (part 1) showing a configuration of a cooling structure according to a second modified example of the embodiment of the present invention. [Diagram 5] FIG. 5 is a diagram (part 2) showing a configuration of a cooling structure according to the second modification of the embodiment of the present invention. [Figure 6] FIG. 6 is a diagram (part 1) showing a configuration of a cooling structure according to a third modified example of the embodiment of the present invention. [Figure 7] FIG. 7 is a diagram (part 2) showing a configuration of a cooling structure according to the third modified example of the embodiment of the present invention. [Figure 8] FIG. 8 is a diagram showing a configuration of a resin laminate included in a cooling structure according to a fourth modified example of the embodiment of the present invention. [Figure 9]FIG. 9 is a diagram showing a configuration of a resin laminate included in a cooling structure according to a fifth modified example of the embodiment of the present invention. [Figure 10] FIG. 10 is a diagram showing a configuration of a resin laminate included in a cooling structure according to a sixth modified example of the embodiment of the present invention. [Figure 11] FIG. 11 is a diagram showing a configuration of a resin laminate included in a cooling structure according to a seventh modified example of the embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] In the following description, a cooling structure will be described as a form for carrying out the present invention (hereinafter, referred to as an "embodiment"). The present invention is not limited to this embodiment. Furthermore, in the drawings, the same parts are given the same reference numerals. Furthermore, it should be noted that the drawings are schematic, and the relationship between the thickness and width of each member, the ratio of each member, etc., differ from reality. Furthermore, the drawings include parts with different dimensions and ratios.

[0018] (Embodiment) Fig. 1 is a plan view showing the configuration of a cooling structure according to an embodiment of the present invention. A cooling structure 1 according to the embodiment of the present invention is provided on a heat generating body 100, and dissipates heat from the heat generating body 100 to the outside. Fig. 1(a) is a plan view seen from the stacking direction of the cooling structure 1 and the heat generating body 100. Fig. 1(b) is a plan view seen from the right side to the left side of Fig. 1(a), which is perpendicular to the stacking direction.

[0019] The cooling structure 1 includes a metal plate 11 and a resin laminate 12 .

[0020] The metal plate 11 has a plurality of extending portions 111 and a flat portion 112 to which the extending portions 111 are connected, and is formed into a comb shape. The metal plate 11 is made of a metal material with high thermal conductivity. In this embodiment, an example in which the metal plate 11 is comb-shaped will be described, but the present invention is not limited to this. For example, the comb-shaped portion may be flat without notches, curved, spherical, or uneven.

[0021] The resin laminate 12 has a plurality of first resin bodies 121 arranged in a plane and a plurality of second resin bodies 122 arranged in a plane, and the first resin bodies 121 and the second resin bodies 122 are alternately laminated. In the present embodiment, the resin laminate 12 has layers (first layers) made of the first resin bodies 121 and layers (second layers) made of the second resin bodies 122 arranged alternately, and three layers of each are provided. The resin bodies (first resin bodies 121 and second resin bodies 122) of layers adjacent to each other in the lamination direction are fixed to each other by adhesion between resins or by an adhesive. Each resin body is made of a resin having elasticity, and can be made of, for example, a formed in place gasket (FIPG). Although FIG. 1 illustrates an example in which the resin bodies are arranged in a row in each layer, the resin bodies may be arranged in a plurality of rows, that is, a plurality of layers may be formed within a layer.

[0022] The first resin body 121 and the second resin body 122 each have a rod shape. The first resin bodies 121 are arranged in a row so as to face in the same direction. The second resin bodies 122 are arranged in a row so as to face in the same direction. In the first layer and the second layer, gaps are formed by the resin bodies. In the present embodiment, an example will be described in which the first resin body 121 is located on the extending portion 111 and extends along the extending direction of the extending portion 111, but the arrangement of the first resin body 121 with respect to the metal plate 11 is not limited to this. Also, in the present embodiment, an example will be described in which the multiple first resin bodies 121 are arranged so as to face in the same direction, but the term "same" includes deviation in direction due to manufacturing error, and the orientation of some resin bodies may be different from the others.

[0023] In this embodiment, the first resin body 121 and the second resin body 122 are disposed so that their longitudinal directions intersect perpendicularly to each other. Note that as long as the longitudinal directions of the first resin body 121 and the second resin body 122 adjacent to each other in the stacking direction intersect in a plan view seen from the stacking direction, and as long as the resin bodies can be stacked, the angle between the longitudinal directions of the resin bodies is not limited to being perpendicular.

[0024] Here, the behavior of the resin body when a load is applied to the cooling structure 1 will be described with reference to Fig. 2A and Fig. 2B. Fig. 2A and Fig. 2B are diagrams for explaining the behavior of the resin body when pressed. Fig. 2A and Fig. 2B will be described using the first resin body 121 as an example, but the second resin body 122 behaves similarly.

[0025] As shown in FIG. 2A, when the distance between adjacent first resin bodies 121 is sufficient (see FIG. 2A (a)), when a load is applied and the first resin bodies 121 are deformed (see FIG. 2A (b)), the first resin bodies 121 do not come into contact with each other and the spring constant is constant.

[0026] On the other hand, as shown in Figure 2B, when the distance between adjacent first resin bodies 121 is short (see (a) of Figure 2B), when a load is applied and the first resin bodies 121 are deformed (see (b) of Figure 2B), the first resin bodies 121 come into contact with each other, and the spring constant increases.

[0027] In the resin laminate 12, the load characteristics of the resin laminate 12 can be adjusted by changing the distance between adjacent first resin bodies 121 in each layer.

[0028] In the above-described embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element 100 by the elastic resin laminate 12, so that the contact area of ​​the metal plate 11 with the heating element 100 can be increased compared to the conventional case. According to the present embodiment, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0029] Furthermore, according to the embodiment, by laminating the first resin body 121 and the second resin body 122 extending in different directions, gaps are generated between the resin bodies, ensuring the breathability of the resin laminate 12 and paths for the cooling fluid (see the dashed arrow in (b) of FIG. 1), thereby improving the cooling effect of the heat generating body 100. Furthermore, by defining the direction of the laminated resin and controlling the direction of ventilation through the gaps, a high cooling effect can be obtained by utilizing the effect of scooping out high-temperature gas by Karman vortexes.

[0030] Furthermore, according to the embodiment, by using a resin body as the cooling structure 1, it is possible to obtain a damping effect against vibrations and the like.

[0031] Moreover, according to the embodiment, by using a resin body as the cooling structure 1, an electrical insulating effect can be obtained.

[0032] (Variation 1) Next, a first modified example of the present embodiment will be described with reference to Fig. 3. Fig. 3 is a diagram showing the configuration of a cooling structure according to a first modified example of the embodiment of the present invention. In the first modified example, the arrangement of the first resin body 121 is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment are given the same reference numerals, and the description will be omitted.

[0033] A cooling structure 1A according to the present first modification includes a metal plate 11 and a resin laminate 12A.

[0034] The resin laminate 12A has a plurality of first resin bodies 121 arranged in a plane and a plurality of second resin bodies 122 arranged in a plane, and the first resin bodies 121 and the second resin bodies 122 are alternately laminated. In this modification 1, the resin laminate 12A has layers (first layers) made of the first resin bodies 121 and layers (second layers) made of the second resin bodies 122 arranged alternately, with three layers of each being provided. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0035] In the present modified example 1, the first resin bodies 121 have different distances (pitches) between adjacent first resin bodies 121 for each layer. Specifically, the pitch becomes narrower toward the metal plate 11, and the number of first resin bodies 121 in a layer increases.

[0036] In the above-described first modification, similarly to the embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element 100 by the elastic resin laminate 12A, so that the contact area of ​​the metal plate 11 with the heating element 100 can be increased as compared to the conventional case. According to the first modification, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0037] Furthermore, according to the first modification, the pitch of the first resin body 121 is changed for each layer, so that a multi-stage load characteristic can be obtained.

[0038] (Variation 2) Next, a second modified example of the present embodiment will be described with reference to Figs. 4 and 5. Figs. 4 and 5 are diagrams showing the configuration of a cooling structure according to a second modified example of the present embodiment. In the second modified example, the arrangement of the second resin body 122 is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment are given the same reference numerals, and the description will be omitted. Also, in the second modified example, the heat generating body 100A will be described as having an uneven surface with a stepped contact surface.

[0039] A cooling structure 1B according to the present modified example 2 includes a metal plate 11A and a resin laminate 12B.

[0040] The metal plate 11A has a flat plate shape and is made of a metal material having high thermal conductivity. In the second modification, an example in which the metal plate 11A is flat will be described, but the metal plate 11A is not limited to this, and may be comb-shaped like the metal plate 11 according to the embodiment.

[0041] The resin laminate 12B has a plurality of first resin bodies 121 arranged in a plane and a plurality of second resin bodies 122 arranged in a plane, and the first resin bodies 121 and the second resin bodies 122 are alternately laminated. In the present modified example 2, the resin laminate 12B has layers (first layers) made of the first resin bodies 121 and layers (second layers) made of the second resin bodies 122 arranged alternately, and three layers are provided for each. Furthermore, the first resin body 121 and the second resin body 122 each include resin bodies having different lengths. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0042] In the present modified example 2, the first resin body 121 and the second resin body 122 are arranged in the resin laminate 12B so as to form a space corresponding to the shape of the contact surface of the heat generating body 100A. For example, in a state where no load other than gravity is applied to the resin laminate 12B (see FIG. 4), the first resin body 121 and the second resin body 122 form a space having a shape that is an inverted shape of the heat generating body 100A.

[0043] When the cooling structure 1B is brought into close contact with the heat generating body 100A, the back plate 13 is disposed on the opposite side of the heat generating body 100A via the cooling structure 1B, and the cooling structure 1B is sandwiched between the back plate 13 and the heat generating body 100A. In the cooling structure 1B, the first resin body 121 and the second resin body 122 are deformed by the load from the back plate 13 and the heat generating body 100A (see FIG. 5). This deformation allows the resin laminate 12B to be uniformly brought into close contact with the heat generating body 100A, even if the heat generating body 100A has a stepped surface.

[0044] In the above-described modified example 2, similarly to the embodiment, the metal plate 11A having high thermal conductivity is brought into close contact with the heating element 100A by the elastic resin laminate 12B, so that the contact area of ​​the metal plate 11A with the heating element 100A can be increased compared to the conventional case. According to the modified example 2, the increase in the contact area by the metal plate 11A enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0045] Furthermore, according to variant example 2, the first resin body 121 and the second resin body 122 are arranged in the resin laminate 12B so that a space is formed corresponding to the shape of the contact surface of the heating element 100A, thereby ensuring close contact even with heating elements 100A of irregular shapes.

[0046] Moreover, according to the second modification, the adhesive effect of the resin can ensure the positioning of the resin body to the back plate 13. This fixing of the position reduces friction between the resin body and the back plate 13, or between the resin body and the heating body 100A, and can suppress the occurrence of contamination.

[0047] (Variation 3) Next, a third modification of the present embodiment will be described with reference to Figs. 6 and 7. Figs. 6 and 7 are diagrams showing the configuration of a cooling structure according to a third modification of the present embodiment. In the third modification, the arrangement of the second resin body 122 is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment are given the same reference numerals, and the description will be omitted. Also, in the third modification, as in the second modification, the heat generating body 100A will be described as having a contact surface with an uneven surface having a stepped shape.

[0048] A cooling structure 1C according to the third modification includes a metal plate 11B and a resin laminate 12C.

[0049] The metal plate 11B is formed by bending a flat member into a shape corresponding to the contact surface of the heat generating element 100A. The metal plate 11B is made of a metal material having high thermal conductivity. In the third modified example, the metal plate 11B may be, for example, comb-shaped like the metal plate 11 according to the embodiment.

[0050] The resin laminate 12C has a plurality of first resin bodies 121 arranged in a plane and a plurality of second resin bodies 122 arranged in a plane, and the first resin bodies 121 and the second resin bodies 122 are alternately laminated. In the present modification 3, the resin laminate 12C has layers (first layers) made of the first resin bodies 121 and layers (second layers) made of the second resin bodies 122 arranged alternately, and three layers are provided for each. Furthermore, the first resin body 121 and the second resin body 122 each include resin bodies having different lengths. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0051] In the present modified example 3, the resin laminate 12C has the first resin body 121 and the second resin body 122 arranged so as to correspond to the shape of the metal plate 11B and the contact surface of the back plate 13. For example, in a state where no load other than gravity is applied to the resin laminate 12C (see FIG. 6), a space is formed in a part between the metal plate 11B and the resin body due to the elastic force of the first resin body 121 and the second resin body 122.

[0052] When the cooling structure 1C is brought into close contact with the heat generating body 100A, the back plate 13 is disposed on the opposite side of the heat generating body 100A via the cooling structure 1C, and the cooling structure 1C is sandwiched between the back plate 13 and the heat generating body 100A. The cooling structure 1C is brought into close contact with the heat generating body 100A as the first resin body 121 and the second resin body 122 are deformed by the load from the back plate 13 and the heat generating body 100A (see FIG. 7). This deformation allows the resin laminate 12C to be uniformly brought into close contact with the heat generating body 100A even when the heat generating body 100A has a stepped surface.

[0053] In the above-mentioned modification 3, similarly to the embodiment and modification 2, the metal plate 11B having high thermal conductivity is brought into close contact with the heating element 100A by the elastic resin laminate 12C, so that the contact area of ​​the metal plate 11B with the heating element 100A can be increased compared to the conventional case. According to this modification 3, the increase in the contact area by the metal plate 11B enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0054] Furthermore, according to variant example 3, in the resin laminate 12C, the first resin body 121 and the second resin body 122 are arranged to correspond to the shape of the metal body 11B, so that they can be reliably adhered to the heating body 100A having an irregular shape.

[0055] Moreover, according to the third modification, the adhesive effect of the resin can ensure the positioning of the resin body to the back plate 13. This fixing of the position reduces friction between the resin body and the back plate 13, or between the resin body and the heating body 100A, and can suppress the occurrence of contamination.

[0056] In the second and third modified examples, the metal plates 11A and 11B are made of a metal fiber cloth, so that the adhesion to a heat generating element having a shape other than a flat surface, such as an uneven or spherical shape, can be improved.

[0057] (Variation 4) Next, a fourth modified example of the present embodiment will be described with reference to Fig. 8. Fig. 8 is a diagram showing the configuration of a resin laminate provided in a cooling structure according to a fourth modified example of the present embodiment. In the fourth modified example, the configuration of the resin laminate is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment are given the same reference numerals, and the description thereof will be omitted.

[0058] The resin laminate 12D according to the present modification 4 has a first resin group 121A forming multiple annular rings and a plurality of second resin bodies 122A arranged radially, and the first resin groups 121A and the second resin bodies 122A are alternately laminated. In the present modification 3, the resin laminate 12D has layers (first layers) made of the first resin group 121A and layers (second layers) made of the second resin bodies 122A arranged alternately. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0059] The first resin group 121A has a plurality of first resin bodies (first annular resin 1211, second annular resin 1212, and third annular resin 1213) having different sizes. Specifically, in the first resin group 121A, the sizes increase in the order of the first annular resin 1211, the second annular resin 1212, and the third annular resin 1213. The diameter of the outer periphery of the first annular resin 1211 is smaller than the diameter of the inner periphery of the second annular resin 1212. In addition, the diameter of the outer periphery of the second annular resin 1212 is smaller than the diameter of the inner periphery of the third annular resin 1213. As a result, in the first layer made of the first resin group 121A, an internal space is formed by the annular resins, and gaps are formed by the annular resins arranged at a distance.

[0060] Each second resin body 122A is rod-shaped and extends in the radial direction of the annular resin of the first resin group 121A. Each second resin body 122A is arranged at equal intervals. In the example shown in FIG. 8, there are eight second resin bodies 122A, which are arranged at intervals of 45°. As a result, in the second layer consisting of the plurality of second resin bodies 122A, gaps are formed by each resin body.

[0061] In the above-described fourth modification, similarly to the embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element by the elastic resin laminate 12C, so that the contact area of ​​the metal plate 11 with the heating element can be increased as compared to the conventional case. According to the fourth modification, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0062] (Variation 5) Next, a fifth modified example of the present embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram showing the configuration of a resin laminate provided in a cooling structure according to a fifth modified example of the present embodiment. In the fifth modified example, the configuration of the resin laminate is different from that of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment and fourth modified example will be given the same reference numerals, and description thereof will be omitted.

[0063] The resin laminate 12E according to the present modification 5 has a first resin body 121B in a spiral shape and a plurality of second resin bodies 122A arranged radially, and the first resin bodies 121B and the second resin bodies 122A are alternately laminated. In the present modification 5, the resin laminate 12E has layers (first layers) made of the first resin bodies 121B and layers (second layers) made of the second resin bodies 122A arranged alternately. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0064] As the first resin body 121B turns, it extends in a curved shape that moves away from the center. As a result, in the first layer made of the first resin body 121B, the turning wire materials are spaced apart from each other, so that gaps are formed.

[0065] Each of the second resin bodies 122A has a rod shape and extends in a direction away from the center of the first resin body 121B. The second resin bodies 122A are arranged at equal intervals. In the example shown in FIG. 9, there are eight second resin bodies 122A, which are arranged at intervals of 45°.

[0066] In the above-described modification 5, similarly to the embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element by the elastic resin laminate 12E, so that the contact area of ​​the metal plate 11 with the heating element can be increased compared to the conventional case. According to the modification 5, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0067] (Variation 6) Next, a sixth modified example of the present embodiment will be described with reference to Fig. 10. Fig. 10 is a diagram showing the configuration of a resin laminate provided in a cooling structure according to the sixth modified example of the present embodiment. In the sixth modified example, the configuration of the resin laminate is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment will be given the same reference numerals, and the description will be omitted.

[0068] A cooling structure 1D according to the sixth modification includes a metal plate 11 and a resin laminate 12F.

[0069] The resin laminate 12F has a first resin body 121C having a zigzag shape and a second resin body 122B having a zigzag shape, and the first resin body 121C and the second resin body 122B are alternately laminated. In the present modification 6, the resin laminate 12D has a layer (first layer) made of the first resin body 121C and a layer (second layer) made of the second resin body 122B alternately arranged. The first resin body 121C and the second resin body 122B are shifted in zigzag shape by 90°. In this case, the first resin body 121C is arranged in the layer that is closest to the metal body 11 and in contact with the metal body 11 in the resin laminate 12D, and the first resin body 121C is arranged so as to contact the metal body 11 with the zigzag shape aligned along the extension portion 111. In the first layer made of the zigzag-shaped first resin body 121C and the zigzag-shaped second resin body 122B, gaps are formed by the bent linear resin bodies. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0070] In the above-described sixth modification, similarly to the embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element by the elastic resin laminate 12F, so that the contact area of ​​the metal plate 11 with the heating element can be increased as compared to the conventional case. According to the sixth modification, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0071] (Variation 7) Next, a seventh modified example of the present embodiment will be described with reference to Fig. 11. Fig. 11 is a diagram showing the configuration of a resin laminate provided in a cooling structure according to the seventh modified example of the present embodiment. In the seventh modified example, the configuration of the resin laminate is different from the configuration of the cooling structure 1 according to the embodiment. Hereinafter, the same components as those in the embodiment will be given the same reference numerals, and the description will be omitted.

[0072] A cooling structure 1E according to the seventh modification includes a metal plate 11 and a resin laminate 12G.

[0073] The resin laminate 12G has a first resin group consisting of the first resin bodies 121, 121D and a second resin body 122C, and the first resin group and the second resin body 122C are alternately laminated. In the seventh modification, the resin laminate 12D has a layer (first layer) consisting of the first resin bodies 121, 121D and a layer (second layer) consisting of a plurality of second resin bodies 122C arranged alternately.

[0074] The first resin body 121D and the second resin body 122C are annular in shape forming openings with different lengths in two perpendicular directions. In the example shown in FIG. 11, the resin body is annular in shape forming a long hole. In this case, the first layer is made up of a plurality of (two in this case) first resin bodies 121D and one first resin body 121. The second layer is made up of a plurality of (three in this case) second resin bodies 122C. The first resin body 121D and the second resin body 122C are offset from each other in the longitudinal direction by 90°. In the first layer consisting of the first resin body 121 and the first resin body 121D, and the second layer consisting of the second resin body 122C, gaps are formed by the internal space formed by the annular resin and the resin bodies arranged at a distance. Each resin body is made of a resin having elasticity, and can be made of, for example, FIPG.

[0075] In the above-described seventh modification, similarly to the embodiment, the metal plate 11 having high thermal conductivity is brought into close contact with the heating element by the elastic resin laminate 12G, so that the contact area of ​​the metal plate 11 with the heating element can be increased as compared to the conventional case. According to the seventh modification, the increase in the contact area by the metal plate 11 enables efficient heat dissipation, and as a result, the cooling target can be efficiently cooled.

[0076] In this manner, the present invention may include various embodiments not described here, and various design modifications may be made without departing from the technical idea defined by the claims.

[0077] In the above-described embodiment and modifications 1 to 7, the resin body may be formed of different materials for each layer.

[0078] In the above-mentioned embodiment and modifications 1 to 7, the cooling structure may be formed by laminating metal plates on both sides of the resin body in the lamination direction, or the cooling structure may be formed by laminating a metal plate on one side and a plate of a material other than metal on the other side. By providing a plate at the end in the lamination direction, the resin body is not exposed in the lamination direction, making it easier to handle the cooling structure.

[0079] As described above, the cooling structure according to the present invention is suitable for efficiently cooling an object to be cooled. [Explanation of symbols]

[0080] 1, 1A~1E cooling structure 11, 11A metal plate 12, 12A to 12G Resin laminate 13 Back plate 100, 100A heating element 111 Extension 112 Flat plate part 121, 121B to 121D First resin body 121A 1st resin group 122, 122A~122C 2nd resin body 1211 First cyclic resin 1212 Second cyclic resin 1213 Third Ring Resin

Claims

1. A cooling structure that comes into contact with a heat generating body and dissipates heat from the heat generating body, A metal plate; a resin laminate including a first layer made of a first resin body and a second layer made of a second resin body laminated together; Equipped with the first layer is formed by one or more of the first resin bodies, and a gap is formed between the first resin body and the first layer; The second layer has gaps formed by one or more of the second resin bodies. A cooling structure comprising:

2. The first resin body is arranged in a plurality of layers in the first layer, The second resin body is arranged in a plurality of layers in the second layer, The first and second resin bodies have longitudinal directions intersecting each other in a plan view seen from the stacking direction. The cooling structure according to claim 1 .

3. In the first or second layer, the resin bodies are arranged with the same distance between adjacent resin bodies. The cooling structure according to claim 2 .

4. In the first or second layer, at least a part of the distance between adjacent resin bodies is different; The cooling structure according to claim 2 .

5. The first and second resin bodies have longitudinal directions that intersect perpendicularly to each other in a plan view seen from the stacking direction. The cooling structure according to claim 2 .

6. The first and second resin bodies form a space corresponding to the shape of the contact surface of the heat generating body. The cooling structure according to claim 1 .

7. The first resin body has a multiple annular shape, A plurality of the second resin bodies extending radially are laminated on the first resin body. The cooling structure according to claim 1 .

8. The first resin body has a spiral shape, A plurality of the second resin bodies extending radially are laminated on the first resin body. The cooling structure according to claim 1 .

9. The metal plate is comb-shaped. The cooling structure according to claim 1 .

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