Semiconductor manufacturing device, manufacturing method of semiconductor device, and semiconductor device

Abstract

To provide a semiconductor manufacturing device that is capable of spreading resin paste in a rectangular shape.SOLUTION: A nozzle 3 of a semiconductor manufacturing device 100 includes a cross-shaped groove 12 provided in a bottom surface 17, a supply hole 11 provided in the center of a cross-shaped groove 12, and an exhaust groove 13 that extends from each end portion 14 of the cross-shaped groove 12 to the outside of the bottom surface 17 and is shallower than the cross-shaped groove 12. The semiconductor manufacturing device 100 includes a nozzle 3, a syringe 2 connected to the nozzle 3, and a dispenser 1 that fills the cross-shaped groove 12 with resin paste 6 in the syringe 2 through the supply hole 11 by gas pressure or air pressure.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, a method for manufacturing a semiconductor device, and a semiconductor device. [Background technology]

[0002] Patent Document 1 discloses a semiconductor manufacturing device equipped with a nozzle with a cross groove on the bottom surface. The resin paste is cross-shaped immediately after being discharged, and the resin paste in the center of the cross spreads isotropically from there. Meanwhile, the resin paste at each end of the cross remains almost unspread. As a result, the resin paste is spread in a square shape. Since semiconductor elements to be bonded in a later process are often square in plan view, the device of Patent Document 1 has the advantage of being able to apply the resin paste so as to conform to the shape of the semiconductor elements to be bonded. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 02-288241 Summary of the Invention [Problem to be solved by the invention]

[0004] When filling the cross groove with resin paste, the air released from the dispenser escapes from the center of the cross groove toward the end. At this time, the resin paste to be filled will overflow from the end of the cross groove together with the air. As a result, the spread resin paste will have an unintended shape.

[0005] In order to solve the above-mentioned problems, a first object of the present disclosure is to provide a semiconductor manufacturing apparatus that is capable of spreading resin paste in a rectangular shape.

[0006] A second object of the present disclosure is to provide a method for manufacturing a semiconductor device that enables a resin paste to be spread in a rectangular shape.

[0007] A third object of the present disclosure is to provide a semiconductor device that enables a resin paste to be spread in a quadrangular shape. [Means for solving the problem]

[0008] The first aspect of the present disclosure is a nozzle having a cross groove provided on a bottom surface, a supply hole provided at the center of the cross groove, and an exhaust groove extending from each end of the cross groove to the outside of the bottom surface and shallower than the cross groove; A syringe containing a resin paste and connected to the nozzle; a dispenser that fills the resin paste in the syringe into the cross-shaped groove by gas pressure or air pressure through the supply hole; It is preferable that the semiconductor manufacturing apparatus is provided with the above structure.

[0009] In addition, the second aspect is a step of bringing a bottom surface of a nozzle having a cross groove provided on a bottom surface, a supply hole provided at the center of the cross groove, and an exhaust groove extending from each end of the cross groove to the outside of the bottom surface and shallower than the cross groove into contact with an object to be coated; filling the cross-shaped groove with a resin paste from the supply hole by gas pressure or air pressure; A step of moving the nozzle away from the object to be coated and discharging the resin paste in a cross shape onto the object to be coated; a step of adhering a semiconductor element having a quadrangle shape in a plan view such that the vertices of the quadrangle coincide with the ends of the cross of the resin paste discharged in a cross shape; The present invention preferably provides a method for manufacturing a semiconductor device, comprising the steps of:

[0010] Moreover, the third aspect is A step of discharging a resin paste onto an area including a center of a cross-shaped block formed on a die pad but not including an end portion of the block; a step of placing a semiconductor element having a rectangular shape in a plan view on the upper surface of the block such that each vertex of the rectangle coincides with each end of the cross of the block, and bonding the die pad and the semiconductor element with the resin paste; The present invention preferably provides a method for manufacturing a semiconductor device, comprising the steps of:

[0011] Moreover, the fourth aspect is forming a die pad having four grooves on an upper surface thereof, the grooves extending along respective sides of a rectangle; discharging a resin paste into an area including a center of the rectangle formed by the four grooves but not including the four grooves; a step of placing a semiconductor element having a rectangular shape in a plan view on the upper surface of the die pad such that vertices of a rectangle formed by the semiconductor element coincide with vertices of a rectangle formed by the four grooves, and adhering the die pad and the semiconductor element with the resin paste; Including, In the method for manufacturing a semiconductor device, the four grooves are preferably present at the center of the side of the bonded semiconductor element in a plan view, and are not present at both ends of the side of the semiconductor element.

[0012] In addition, the fifth aspect is A die pad having a cross-shaped block on an upper surface thereof, and a semiconductor element bonded to the block by a resin paste, It is preferable that the semiconductor element is a quadrangle in a plan view, and is bonded so that each vertex of the quadrangle of the semiconductor element coincides with an end of the cross of the block.

[0013] In addition, the sixth aspect is A die pad; a semiconductor element that is attached to the die pad by a resin paste and has four sides that form a quadrangle in a plan view; Equipped with the die pad has four grooves extending along each of the sides on the surface to which the semiconductor element is attached; It is preferable that the semiconductor device has a groove that is present at the center of the side portion in a plan view and that is not present at both ends of the side portion. Effect of the Invention

[0014] According to the first and second aspects of the present disclosure, a cross groove and exhaust grooves extending from each end of the cross groove to the outside of the bottom surface are formed on the bottom surface of the nozzle. The exhaust grooves are shallower than the cross grooves. This allows only air from the supply hole to escape to the outside of the nozzle via the exhaust grooves while the resin paste is being filled into the cross grooves. This makes it possible to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device that are capable of spreading the resin paste in a square shape.

[0015] According to the third and fifth aspects, a cross-shaped block is formed on the upper surface of the die pad. Resin paste is discharged onto an area including the center of the block but not including the end portion, and a semiconductor element is placed on top of the block, so that the resin paste can be selectively permeated into the gap between the upper surface of the block and the semiconductor element. This makes it possible to provide a semiconductor device and a method for manufacturing a semiconductor device that allow the resin paste to be spread in a quadrangle.

[0016] According to the fourth and sixth aspects, the die pad has four grooves extending along each side of the semiconductor element in plan view. The grooves are configured to be in the center of the sides but not at both ends in plan view. By forming the grooves, the progress of the resin paste in the groove direction can be delayed. This makes it possible to provide a semiconductor device that allows the resin paste to be spread in a quadrangle, and a method for manufacturing the semiconductor device. [Brief description of the drawings]

[0017] [Figure 1] 1 is a diagram showing a semiconductor manufacturing apparatus according to a first embodiment of the present disclosure. [Diagram 2] 2 is a diagram showing a bottom surface of a nozzle of a semiconductor manufacturing apparatus in accordance with a first embodiment of the present disclosure. FIG. [Diagram 3] 3 is a cross-sectional view of the nozzle taken along line AA' of FIG. 2. [Figure 4] FIG. 11 is a diagram showing a bottom surface of a nozzle according to a second embodiment of the present disclosure. [Diagram 5] 5 is a cross-sectional view of the nozzle taken along the line AA' of FIG. [Figure 6] FIG. 11 is a top view of a die pad in accordance with a third embodiment of the present disclosure. [Figure 7] FIG. 7 is a side view of the die pad of FIG. 6. [Figure 8] FIG. 11 is a side view of a semiconductor device according to a third embodiment of the present disclosure. [Figure 9] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a third embodiment of the present disclosure. [Figure 10] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a third embodiment of the present disclosure. [Figure 11] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a third embodiment of the present disclosure. [Figure 12] FIG. 11 is a top view of a die pad according to a fourth embodiment of the present disclosure. [Figure 13] 13 is a cross-sectional view of the die pad taken along the line AA' in FIG. 12. [Figure 14] FIG. 11 is a side view of a semiconductor device according to a fourth embodiment of the present disclosure. [Figure 15] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a fourth embodiment of the present disclosure. [Figure 16] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a fourth embodiment of the present disclosure. [Figure 17] 13A to 13C are diagrams illustrating a method for manufacturing a semiconductor device according to a fourth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present disclosure will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0019] First embodiment 1 is a diagram showing a semiconductor manufacturing apparatus 100 according to a first embodiment of the present disclosure. The semiconductor manufacturing apparatus 100 includes a dispenser 1, a syringe 2 that contains a resin paste 6, a nozzle 3 connected to the syringe 2, and an elevator 4.

[0020] The nozzle 3 ejects the resin paste 6 filled from the syringe 2. The nozzle 3 includes a base 7 and a tip 8 formed in the center of the base 7. A cross groove 12 is provided on a bottom surface 17 of the tip 8. The detailed configuration of the nozzle 3 will be described later.

[0021] The dispenser 1 is a gas pressure or air pressure type discharging device that fills the resin paste 6 in the syringe 2 into the cross groove 12 through a supply hole 11.

[0022] The elevator 4 raises and lowers the syringe 2 and the nozzle 3 automatically or manually.

[0023] The method of bonding a semiconductor element 50 using the semiconductor manufacturing apparatus 100 of the present disclosure is as follows. First, the bottom surface 17 of the tip portion 8 is brought into contact with the workpiece, such as the die pad 5, by the elevator 4. Then, the resin paste 6 is filled into the cross groove 12 from the supply hole 11 by the dispenser 1. Then, the nozzle 3 is moved away from the workpiece by the elevator 4. As a result, the cross-shaped resin paste 6 is applied to the workpiece. Then, the semiconductor element 50, which is quadrangular in plan view, is bonded so that the vertices of the quadrangle formed by the semiconductor element coincide with the ends of the cross of the resin paste 6 discharged in the shape of a cross. This allows the semiconductor element 50 to be bonded.

[0024] Fig. 2 is a diagram showing a bottom surface 17 of a tip portion 8 of a nozzle 3 according to the first embodiment of the present disclosure. Fig. 3 is a cross-sectional view of the nozzle 3 taken along the line A-A' in Fig. 2. Note that in order to explain a state in which the bottom surface 17 is in contact with a die pad 5, Fig. 3 shows a die pad 5 that is not shown in Fig. 2.

[0025] 2, the bottom surface 18 of the base portion 7 is circular, and the bottom surface 17 of the tip portion 8 is square with rounded corners.

[0026] Supply hole 11 is provided in the center of cross groove 12 on bottom surface 17 of tip portion 8 , and communicates with syringe 2 via tip portion 8 and base portion 7 .

[0027] The size of the cross groove 12 in plan view is approximately the same as the size of the semiconductor element 50 to be bonded in a later process in plan view. The cross groove 12 is formed on the diagonal of a square formed by the bottom surface 17 of the tip portion 8. The width of the cross groove 12 narrows from the center to the end portion. This allows the resin paste 6 supplied from the supply hole 11 to reach the end portion 14 without spilling out.

[0028] The exhaust grooves 13 extend from each end 14 of the cross groove 12 in the extending direction of the cross groove 12 on the bottom surface 17 of the tip portion 8 to the outside of the bottom surface 17. In other words, the exhaust grooves 13 exist on the diagonals of the square formed by the bottom surface 17 of the tip portion 8. The exhaust grooves 13 are narrower and shallower than the cross grooves 12.

[0029] By providing exhaust groove 13, as shown in FIG. 3, even when bottom surface 17 of tip portion 8 is in contact with die pad 5, a gap can be created between bottom surface 17 and die pad 5 to allow air to escape.

[0030] In addition, since the exhaust groove 13 is shallower than the cross groove 12, the resin paste 6 filled in the cross groove 12 does not enter the exhaust groove 13. That is, in this embodiment, while filling the cross groove 12 with the resin paste 6, only the air from the supply hole 11 can be released to the outside via the exhaust groove 13. Therefore, it is possible to prevent the resin paste 6 from overflowing to the outside from the end portion 14 of the cross groove 12 together with the air, as in the prior art. Furthermore, it is possible to suppress the occurrence of air traps (air pockets) in the cross groove 12, and to prevent the occurrence of air bubbles in the resin paste 6. As a result, it is possible to spread the resin paste 6 in a square shape.

[0031] As already mentioned, the corners of the bottom surface 17 of the tip portion 8 through which the exhaust groove 13 passes are R-chamfered. It should be noted that if the corners are not chamfered, metal powder may be generated from the die pad 5 due to contact between the sharp corners and the die pad 5. In this case, there is a concern that poor adhesion may occur due to the metal powder adhering to the resin paste 6 in the cross groove 12 through the exhaust groove 13. In this embodiment, the corners are R-chamfered to prevent the generation of such metal powder and the occurrence of poor adhesion.

[0032] As described above, in this embodiment, the cross groove 12 and the exhaust grooves 13 extending from each end portion 14 of the cross groove 12 to the outside of the bottom surface 17 are formed in the bottom surface 17 of the nozzle 3. The exhaust grooves 13 are narrower and shallower than the cross groove 12. This allows only the air from the supply hole 11 to escape to the outside of the nozzle via the exhaust grooves 13 while the resin paste 6 is being filled into the cross groove 12. This makes it possible to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device that are capable of spreading the resin paste in a square shape.

[0033] <Modification of the First Embodiment> In the above description, the bottom surface 17 of the tip portion 8 is a square with rounded corners. However, as long as the above-mentioned cross groove 12 and exhaust groove 13 are formed, the shape of the bottom surface 17 is not limited, and may be, for example, circular. Also, the lengths of the exhaust grooves 13 extending from each end portion 14 of the cross groove 12 to the outside of the bottom surface 17 may differ depending on the shape of the bottom surface 17. Even in this case, the same effect as described above can be obtained.

[0034] Embodiment 2 In this embodiment, pins 15 are arranged around the bottom surface 17. In the following, changes from the first embodiment will be described. Fig. 4 is a diagram showing the bottom surface of the nozzle 3 of the semiconductor manufacturing apparatus 100 according to the second embodiment of the present disclosure. Fig. 5 is a cross-sectional view of the nozzle 3 taken along line A-A' in Fig. 4. Note that Fig. 5 shows a die pad 5 that is not shown in Fig. 4.

[0035] Pins 15 that are 40 to 100 μm higher than tip 8 are disposed on bottom surface 18 of base 7. Note that, although pins 15 are disposed on all four sides of tip 8 here, the number of pins 15 may be one.

[0036] By arranging one or more pins 15, as shown in Fig. 5, the bottom surface 17 of the tip portion 8 and the die pad 5 do not come into contact with each other, and a gap corresponding to the height of the pin 15 is generated between them. Since the size of the gap is at most 40 to 100 µm, the resin paste 6 discharged from the nozzle 3 in this state is partially adsorbed to the die pad 5, and the remainder is adsorbed to the nozzle 3 side. By utilizing this phenomenon of the resin paste 6 being adsorbed to the nozzle 3 side, the discharge time can be shortened.

[0037] As described above, in the semiconductor manufacturing apparatus 100 of this embodiment, in addition to the effects described in the first embodiment, it is also possible to shorten the discharge time.

[0038] <Modification of the second embodiment> In the above, a case has been described in which the rod-shaped pin 15 is disposed on the bottom surface 18 of the base portion 7. However, the shape and location of the pin 15 are not limited to this. For example, an L-shaped pin may be disposed on the side of the tip portion 8 so as to protrude from the bottom surface 17. Alternatively, the pin may be disposed on the bottom surface 17 of the tip portion 8 itself, or another configuration may be used. In this case as well, the same effect as described above can be obtained.

[0039] Third embodiment In the above embodiments, a technique has been described in which the resin paste 6 is spread in a quadrangular shape by modifying the nozzle 3 of the semiconductor manufacturing apparatus 100. On the other hand, in the present embodiment, a technique has been described in which the resin paste 6 is spread in a quadrangular shape by modifying the die pad of the semiconductor device.

[0040] Fig. 6 is a top view of a die pad 30 according to a third embodiment of the present disclosure. Fig. 7 is a side view of the die pad 30 of Fig. 6. The die pad 30 has a cross-shaped block 32 on an upper surface 31. The size of the block 32 in a plan view is approximately the same as the size, in a plan view, of the semiconductor element 50 to be bonded in a later process.

[0041] 8 is a side view of a semiconductor device 200 according to a third embodiment of the present disclosure. The semiconductor device 200 includes a die pad 30 and a semiconductor element 50 bonded to a block 32 of the die pad 30 with a resin paste 6. The semiconductor element 50 is quadrangular in plan view, and is bonded such that the vertices of the quadrangle coincide with the ends 33 of the cross of the block 32.

[0042] 8, it is clear that the first gap 51 between the upper surface 34 of the block 32 and the semiconductor element 50 is narrower than the second gap 52 between the upper surface 31 of the die pad 30 and the semiconductor element 50. In manufacturing the semiconductor device 200, the resin paste 6 is discharged near the center of the cross-shaped block 32, and the semiconductor element 50 is placed thereon. Since the first gap 51 is narrower than the second gap 52, the resin paste 6 selectively penetrates into the first gap 51. More specifically, the resin paste 6 spreads isotropically through the second gap 52 as well, but spreads faster toward each end portion 33 of the block 32 through the first gap 51. As a result, the resin paste 6 can be spread in a quadrangle.

[0043] 9 to 11 are diagrams showing a manufacturing method of a semiconductor device 200 according to a third embodiment of the present disclosure. Here, a top view of the semiconductor device 200 is shown. First, as shown in Fig. 9, resin paste 6 is discharged onto an area including the center of the cross of block 32 of die pad 30 but not including end portion 33.

[0044] 10, a semiconductor element 50 having a rectangular shape in plan view is placed on the upper surface 34 of the block 32, and the die pad 30 and the semiconductor element 50 are bonded together with the resin paste 6. At this time, each vertex of the rectangle formed by the semiconductor element 50 is aligned with each end portion 33 of the block 32. This makes it possible to utilize the selective penetration phenomenon of the resin paste 6 described above. As a result, a semiconductor device 200 is obtained in which the resin paste 6 is spread in a rectangular shape, as shown in FIG.

[0045] As described above, in this embodiment, a cross-shaped block 32 is formed on the upper surface 31 of the die pad 30. Resin paste 6 is discharged onto an area including the center of the block 32 but not including the end portion 33, and the semiconductor element 50 is placed on top of it, so that the resin paste 6 can be selectively permeated into the gap between the upper surface 34 of the block 32 and the semiconductor element 50. This makes it possible to provide a semiconductor device 200 and a manufacturing method for the semiconductor device 200 that enable the resin paste 6 to be spread in a quadrangle.

[0046] Fourth embodiment In this embodiment, too, a technique for spreading the resin paste 6 in a quadrangular shape by devising a shape of the die pad will be described.

[0047] Fig. 12 is a top view of a die pad 40 according to the fourth embodiment of the present disclosure. Fig. 13 is an A-A' cross-sectional view of the die pad 40 of Fig. 12. The die pad 40 has four grooves 43 extending along each side of a square 42 on an upper surface 41. Note that the square 42 depicted in Fig. 12 is a virtual figure provided for the purpose of explanation, and the square 42 is not actually formed on the upper surface of the die pad 40. Note that the square 42 formed by the four grooves 43 in a plan view has a size equivalent to that of a semiconductor element 50 to be bonded in a later process in a plan view.

[0048] In a plan view, each of the four grooves 43 is located at the center of a side of the square 42 but not at both ends. Specifically, it is desirable that the length of each of the four grooves 43 be approximately half the length of the side of the square 42.

[0049] Moreover, it is preferable that the four grooves 43 are formed at equal positions from both ends of the side.

[0050] 14 is a side view of a semiconductor device 300 according to a fourth embodiment of the present disclosure. Semiconductor device 300 includes a semiconductor element 50 having four side portions 53 that form a rectangle in a plan view, and a die pad 40 having an upper surface 41 to which the semiconductor element 50 is attached with a resin paste 6. The semiconductor element 50 is attached such that the vertices of the rectangle formed by the semiconductor element 50 coincide with the vertices of a square 42 formed by the four grooves.

[0051] 15 to 17 are diagrams illustrating a manufacturing method of a semiconductor device 300 according to the fourth embodiment of the present disclosure. First, as shown in Fig. 15, resin paste 6 is discharged onto an area including the center of a square 42 formed by grooves 43 of a die pad 40 but not including the grooves 43.

[0052] Next, a semiconductor element 50 having a rectangular shape in a plan view is placed on the discharged resin paste 6, and the die pad 40 and the semiconductor element 50 are bonded by the resin paste 6. At this time, the direction of the rectangle formed by the semiconductor element 50 is made to coincide with the direction of the square 42 formed by the groove 43. Since the resin paste 6 spreads isotropically, it reaches the direction of the groove 43 first on the square 42 as shown in FIG. 16. However, the resin paste 6 that has reached it is poured into the groove 43, and further progress can be delayed. On the other hand, since there is no groove 43 in the direction in which the resin paste 6 advances toward the vertex of the square 42, a semiconductor device 300 in which the resin paste 6 is spread in a rectangular shape is obtained as a result, as shown in FIG. 17.

[0053] As described above, the square 42 formed by the four grooves 43 formed on the upper surface 41 of the die pad 40 has a size equivalent to that of the semiconductor element 50 in a plan view. Therefore, in a plan view of the semiconductor device 300 shown in FIG. 17, the four grooves 43 extend along each of the side portions 53 of the semiconductor element 50. Furthermore, in a plan view, the grooves 43 are formed at the center of the side portions 53 but not at both ends, and are formed at equal positions from both ends of the side portions 53. Note that, in order to pour only the resin paste 6 toward the center of the side of the square 42, it is desirable that the length of the grooves 43 is half the length of the side portions 53. It is also desirable that the four grooves 43 are formed at equal positions from both ends of the side portions 53.

[0054] As described above, the die pad 40 of this embodiment has four grooves 43 extending along each of the side portions 53 of the semiconductor element 50 in a plan view. The grooves 43 are configured to be located at the center of the side portions 53 in a plan view but not at both ends. By forming the grooves 43, it is possible to slow down the progress of the resin paste 6 in the direction of the grooves 43. This makes it possible to provide a semiconductor device 300 and a manufacturing method for the semiconductor device 300 that enable the resin paste 6 to be spread in a quadrangle.

[0055] The present disclosure is not limited to the above-described embodiment, and various modifications can be made in the implementation stage without departing from the spirit of the present disclosure. In addition, the embodiments may be implemented in appropriate combination, and in that case, the combined effect can be obtained.

[0056] In addition, in this disclosure, a rectangle includes a square and an approximate square. [Explanation of symbols]

[0057] 1 Dispenser 2 Syringes 3 Nozzles 4. Elevators 5 Die pad 6 Resin Paste 7 Base 8 Tip 11 Supply hole 12 cross groove 13 Exhaust duct 14 End 15-pin 17 Bottom 18 Bottom 30 Die pad 31 Top side 32 blocks 33 End 34 Top surface 40 Die pad 41 Top side 42 squares 43 Groove 50 Semiconductor elements 51 First Gap 52 The Second Gap 53 Side 100 Semiconductor manufacturing equipment 200 Semiconductor device 300 Semiconductor device

Claims

1. a nozzle having a cross-shaped groove formed on a bottom surface, a supply hole formed at the center of the cross-shaped groove, and exhaust grooves extending from each end of the cross-shaped groove to the outside of the bottom surface and shallower than the cross-shaped groove; a syringe containing a resin paste and connected to the nozzle; a dispenser that fills the resin paste in the syringe into the cross-shaped groove by gas pressure or air pressure through the supply hole; A semiconductor manufacturing device comprising:

2. The bottom surface is a quadrangle with rounded corners, 2. The semiconductor manufacturing apparatus according to claim 1, wherein the cross groove and the exhaust groove are formed on diagonals of the rectangle.

3. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the nozzle includes a pin that protrudes from the periphery of the bottom surface or from the bottom surface, and the pin protrudes from the bottom surface by 40 to 100 [mu]m.

4. a step of bringing a bottom surface of a nozzle having a cross groove provided on a bottom surface, a supply hole provided at the center of the cross groove, and exhaust grooves extending from each end of the cross groove to the outside of the bottom surface and shallower than the cross groove into contact with an object to be coated; filling the resin paste into the cross-shaped groove through the supply hole by gas pressure or air pressure; a step of moving the nozzle away from the object to be coated and discharging the resin paste in a cross shape onto the object to be coated; a step of adhering a semiconductor element that is quadrangular in plan view so that the vertices of the quadrangle coincide with the ends of the cross of the resin paste that has been discharged in a cross shape; A method for manufacturing a semiconductor device, comprising:

5. a step of discharging a resin paste onto an area including the center of a cross-shaped block formed on a die pad but excluding an end portion thereof; a step of placing a semiconductor element having a rectangular shape in a plan view on the upper surface of the block so that each vertex of the rectangle coincides with each end of the cross of the block, and bonding the die pad and the semiconductor element with the resin paste; A method for manufacturing a semiconductor device, comprising:

6. forming a die pad having four grooves on its top surface extending along each side of a rectangle; a step of discharging a resin paste into an area including a center of the quadrangle formed by the four grooves but excluding the four grooves; a step of placing a semiconductor element having a quadrangular shape in a plan view on the upper surface of the die pad so that vertices of the quadrangle formed by the semiconductor element coincide with vertices of the quadrangle formed by the four grooves, and bonding the die pad and the semiconductor element with the resin paste; Including, A method for manufacturing a semiconductor device, wherein the four grooves are present at the center of the side of the bonded semiconductor element in a plan view, and are not present at both ends of the side of the semiconductor element.

7. A die pad having a cross-shaped block on its upper surface, and a semiconductor element bonded to the block with a resin paste, The semiconductor element is quadrangular in plan view, and is bonded so that each vertex of the quadrangle of the semiconductor element coincides with an end of the cross of the block.

8. A die pad; a semiconductor element that is bonded to the die pad with a resin paste and has four sides that form a quadrangle in a plan view; Equipped with the die pad has four grooves extending along the respective sides on the surface to which the semiconductor element is attached; The semiconductor device, wherein the groove is present at the center of the side portion in a plan view, and is not present at both ends of the side portion.

9. the length of the groove is half the length of the side portion; 9. The semiconductor device according to claim 8, wherein said grooves are formed at equal distances from both ends of said side portions.

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