Vehicular illuminating device, and vehicular lighting fixture

Abstract

To provide a vehicular illuminating device that can reduce manufacturing cost even if a light emitting module (board) is bonded by using a thermally conductive material, and a vehicular lighting fixture.SOLUTION: A vehicular illuminating device according to an embodiment comprises: a socket; a board provided on the side of one end part of the socket; a light emitting element provided on the board; a first circuit element provided on the board, and directly and electrically connected to the light emitting element; a second circuit element provided on the board, and not directly and electrically connected to the light emitting element; and a bonding part provided between the socket and the board, and including a thermally conductive material. When viewed from a direction along a central axis of the vehicular illuminating device, the bonding part is not provided in at least one position out of a position overlapping with the vicinity of a peripheral edge of the board, a position overlapping with the vicinity of a corner part of the board, and a position overlapping with the second circuit element.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with lamps having filaments. Such vehicle lighting devices include a socket and a light emitting module provided on one end side of the socket. The light emitting module includes, for example, a substrate, and a light emitting element and a circuit element provided on the substrate.

[0003] When a light-emitting element provided in a vehicle lighting device is turned on, heat is generated along with the light. If the temperature of the light-emitting element rises due to the generated heat and exceeds the maximum junction temperature, the light-emitting element may break down or the luminous flux of the light irradiated from the light-emitting element may decrease.

[0004] For this reason, a heat transfer section made of metal may be provided between the light emitting module (substrate) and the socket. When providing a heat transfer section, the light emitting module (substrate) is bonded onto the heat transfer section using a heat conductive material such as a heat conductive adhesive.

[0005] In this case, if the entire area of ​​the end face of the heat transfer part is bonded to the light emitting module (substrate) using a thermally conductive material, the amount of the thermally conductive material will be large. Since the thermally conductive material is expensive compared to general bonding materials such as adhesives, the manufacturing cost of the vehicle lighting device will increase if the amount of the thermally conductive material is large. Therefore, there has been a demand for the development of a technique that can reduce manufacturing costs even when a light-emitting module (substrate) is joined using a thermally conductive material. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-247061 A Summary of the Invention [Problem to be solved by the invention]

[0007] The problem that the present invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can reduce manufacturing costs even when a light-emitting module (substrate) is joined using a thermally conductive material. [Means for solving the problem]

[0008] A vehicle lighting device according to an embodiment includes a socket, a substrate provided on one end of the socket, a light-emitting element provided on the substrate, a first circuit element provided on the substrate and directly and electrically connected to the light-emitting element, a second circuit element provided on the substrate and not directly and electrically connected to the light-emitting element, and a joint portion provided between the socket and the substrate and including a thermally conductive material. When viewed from a direction along the central axis of the vehicle lighting device, the joint portion is not provided at least in any of a position overlapping with a vicinity of the periphery of the substrate, a position overlapping with a vicinity of a corner of the substrate, and a position overlapping with the second circuit element. Effect of the Invention

[0009] According to the embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can reduce manufacturing costs even when a light-emitting module (substrate) is bonded using a thermally conductive material. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] 13A and 13B are schematic plan views illustrating the form of a joint according to another embodiment. [Figure 4] 1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0012] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0013] FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes a socket 10, a light emitting module 20, a power supply unit 30, a heat transfer unit 40, and a joint unit 50, for example.

[0014] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0015] The bayonet 12 is provided, for example, on a side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to a housing 101 of a vehicle lamp 100 described later. The bayonet 12 may be used for a twist lock.

[0016] The flange 13 has a plate shape. The flange 13 has, for example, a substantially circular plate shape. A side surface of the flange 13 is located outward of the vehicle lighting device 1 from a side surface of the bayonet 12.

[0017] The heat dissipating fin 14 is provided on the side of the flange 13 opposite to the mounting portion 11. At least one heat dissipating fin 14 may be provided. For example, as shown in Figs. 1 and 2, a plurality of heat dissipating fins 14 may be provided on the socket 10. The plurality of heat dissipating fins 14 may be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate or cylinder shape.

[0018] The connector holder 15 is provided on the opposite side of the flange 13 to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0019] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. The socket 10 can be made of a metal such as an aluminum alloy, for example.

[0020] The socket 10 can also be made of, for example, a highly thermally conductive resin. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or Nylon mixed with a filler using carbon or aluminum oxide. If the socket 10 contains a highly thermally conductive resin, the heat generated in the light-emitting module 20 can be efficiently dissipated. Also, the weight of the socket 10 can be reduced. The socket 10 illustrated in FIG. 1 and FIG. 2 is a socket made of a highly thermally conductive resin.

[0021] The light emitting module 20 (substrate 21) is provided on one end side of the socket 10. As shown in Figures 1 and 2, the light emitting module 20 has, for example, the substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, and a circuit element 25.

[0022] The substrate 21 is joined to an end face of the heat transfer section 40 by, for example, a joint 50. When the heat transfer section 40 is omitted, the substrate 21 is joined to the bottom surface 11a1 of the recess 11a by, for example, a joint 50. The details of the joint 50 will be described later.

[0023] The substrate 21 has a plate shape. The planar shape of the substrate 21 (the shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially rectangular. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride) or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0024] The substrate 21 also has a wiring pattern 21a. The wiring pattern 21a is provided, for example, on the surface of the substrate 21 opposite to the socket 10. The wiring pattern 21a is formed, for example, from a material containing silver as a main component or a material containing copper as a main component. In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor described later, etc. The covering portion may include, for example, a glass material.

[0025] The light-emitting element 22 is provided on the substrate 21. The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. The vehicle lighting device 1 (light-emitting module 20) illustrated in Figs. 1 and 2 is provided with a plurality of light-emitting elements 22. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series.

[0026] The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like.

[0027] The light emitting element 22 may be any of a chip-shaped light emitting element, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, and a light emitting element having leads such as a bullet type. However, if the light emitting element 22 is a chip-shaped light emitting element, the light emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller.

[0028] In the following, as an example, a case where the light emitting element 22 is a chip-shaped light emitting element will be described. The chip-shaped light-emitting element 22 can be electrically connected to the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 may be any of an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip chip type light-emitting element.

[0029] The frame portion 23 has a frame shape and surrounds the light emitting element 22. The frame portion 23 can be bonded onto the substrate 21 using an adhesive. The outline (outline of the planar shape) of the frame portion 23 when viewed from a direction along the central axis 1a of the vehicle lighting device 1 can be appropriately changed according to the required light distribution characteristics, luminance distribution, etc. For example, the outline of the planar shape of the frame portion 23 can be a circle, a rectangle, an ellipse, etc. The outline of the planar shape of the frame portion 23 illustrated in Figs. 1 and 2 is a circle.

[0030] The frame 23 is formed of, for example, a resin. The resin may be, for example, a thermoplastic resin such as polybutylene terephthalate (PBT), polycarbonate (PC), PET, nylon, polypropylene (PP), polyethylene (PE), or polystyrene (PS).

[0031] The frame portion 23 has a function of a reflector that reflects the light irradiated from the light emitting element 22, and a function of defining the formation range of the sealing portion 24. Therefore, if the frame portion 23 is provided, it is possible to improve the extraction efficiency of the light irradiated from the light emitting element 22. Furthermore, if the frame portion 23 is provided, it is possible to reduce the formation range of the sealing portion 24, so that the light emitting module 20 and, therefore, the vehicle lighting device 1 can be made more compact.

[0032] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, silicone resin. The sealing portion 24 may also contain a phosphor. When the light emitting element 22 is a surface mount type light emitting element or a bullet type light emitting element having a lead wire, the frame portion 23 and the sealing portion 24 can be omitted.

[0033] In addition, optical elements and the like can be provided as necessary. Examples of the optical elements include a convex lens, a concave lens, a light guide, etc. The optical elements can be provided on the sealing portion 24, for example.

[0034] The circuit element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided on the substrate 21. The circuit element 25 is provided, for example, on the periphery of the frame portion 23 and is electrically connected to the wiring pattern 21a.

[0035] The circuit elements 25 illustrated in FIG. 1 include a resistor 25a, a control element 25b, a protection element 25b1, a setting resistor 25b2, and a pull-down resistor 25c. In this case, the resistor 25a and the control element 25b (corresponding to an example of a first circuit element) are directly electrically connected to the light-emitting element 22. The protective element 25b1, the setting resistor 25b2, and the pull-down resistor 25c (corresponding to an example of a second circuit element) are not directly electrically connected to the light-emitting element 22. However, the type of the circuit element 25 is not limited to the exemplified ones, and can be changed appropriately depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, a computing element, etc., in addition to those mentioned above.

[0036] The resistor 25a may be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), a film resistor formed by using a screen printing method, etc. The resistor 25a illustrated in FIG. 1 is a film resistor.

[0037] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0038] When the resistor 25a is a surface mount resistor or a resistor with leads, the resistor 25a is selected to have an appropriate resistance value according to the forward voltage characteristics of the light emitting element 22. When the resistor 25a is a film resistor, the resistance value can be increased by removing a part of the resistor 25a. For example, a part of the film resistor can be easily removed by irradiating the film resistor with laser light. The number, arrangement, size, etc. of the resistors 25a are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0039] The control element 25b is provided, for example, to switch the voltage applied to the light-emitting element 22, to perform temperature derating, and to control the current flowing through the light-emitting element 22. However, the functions and uses of the control element 25b are not limited to those exemplified. The control element 25b can be, for example, a transistor or an integrated circuit. The control element 25b exemplified in FIG. 1 is a surface-mounted integrated circuit.

[0040] The protective element 25b1 is provided to prevent an excessive voltage from being applied to the control element 25b. The protective element 25b1 may be, for example, a Zener diode. The protective element 25b1 illustrated in FIG. 1 is a surface-mount Zener diode.

[0041] The setting resistor 25b2 is provided, for example, to set a control current to be applied to the control element 25b. The setting resistor 25b2 illustrated in FIG.

[0042] The pull-down resistor 25c is provided to detect continuity of the light-emitting element 22, prevent erroneous lighting, etc. The pull-down resistor 25c illustrated in Fig. 1 is a surface-mount resistor.

[0043] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The power supply terminals 31 may be rod-shaped. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, and the like of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

[0044] When the socket 10 is formed using, for example, a highly thermally conductive resin containing a filler using carbon, or a metal, the socket 10 becomes conductive. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. Note that when the socket 10 is formed using an insulating highly thermally conductive resin (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. For example, the holding portion 32 can be pressed into a hole provided in the socket 10 or adhered to the inner wall of the hole.

[0045] The heat transfer part 40 has a plate shape and is provided between the socket 10 and the joint part 50. As shown in Fig. 1 and Fig. 2, the heat transfer part 40 can be bonded to the bottom surface 11a1 of the recess 11a using, for example, an adhesive. The heat transfer part 40 can be bonded to the inside of a recess provided in the bottom surface 11a1 of the recess 11a, attached to the inside of the recess via heat conductive grease (heat dissipation grease), or embedded in the inside of the recess by insert molding.

[0046] The heat transfer unit 40 is made of a material with high thermal conductivity. For example, the heat transfer unit 40 is made of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. Note that if the socket 10 is made of a metal or if the amount of heat generated in the light-emitting module 20 is small, the heat transfer unit 40 can be omitted.

[0047] Next, the joint 50 will be further described. As described above, the substrate 21 provided in the light-emitting module 20 is joined by the joint 50 to the end face of the heat transfer part 40 or the bottom surface 11a1 of the recess 11a of the socket 10. The joint 50 may be, for example, a layer formed by hardening a thermally conductive adhesive. The thermally conductive adhesive may include a filler using an inorganic material such as aluminum oxide. The thermal conductivity of the joint 50 may be, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less.

[0048] If a joint 50 is provided between the substrate 21 and the heat transfer section 40 or between the substrate 21 and the socket 10, the heat generated in the light-emitting element 22 and the circuit element 25 can be dissipated to the socket 10 via the joint 50. Therefore, the temperature of the light-emitting element 21 can be prevented from exceeding the maximum junction temperature.

[0049] However, simply applying the thermally conductive adhesive to the end face of the heat transfer part 40 or the bottom face 11a1 of the recess 11a of the socket 10 results in a large amount of thermally conductive adhesive. Since the thermally conductive adhesive is more expensive than general adhesives, the manufacturing cost of the vehicle lighting device 1 increases when the amount of thermally conductive adhesive increases.

[0050] Here, the heat sources when the vehicle lighting device 1 is turned on are the light emitting element 21 and the circuit element 25. Therefore, if the joint portion 50 is provided at a position overlapping with the light emitting element 21 and the circuit element 25 when viewed from the direction along the central axis 1a of the vehicle lighting device 1, the heat generated in the light emitting element 21 and the circuit element 25 can be transferred to the heat transfer portion 40 or the socket 10 via the joint portion 50.

[0051] The regions of the substrate 21 where the light emitting element 21 and the circuit element 25 are not provided are regions that transmit heat generated in the light emitting element 21 and the circuit element 25. Therefore, the temperature of these regions is lower than the temperature of the regions where the light emitting element 21 and the circuit element 25 are provided. Therefore, it is possible to avoid providing the joint 50 in a position that does not overlap with the light emitting element 21 and the circuit element 25 when viewed from the direction along the central axis 1a of the vehicle lighting device 1. In this way, the amount of thermally conductive adhesive can be reduced, and the manufacturing cost of the vehicle lighting device 1 can be reduced.

[0052] Furthermore, the amount of heat generated by the circuit element 25 varies depending on the application and type of the circuit element 25 . For example, a circuit element directly and electrically connected to the light-emitting element 21 generates a large amount of heat because the current flowing through the light-emitting element 21 flows through the circuit element. In the vehicle lighting device 1 illustrated in FIG. 1, the circuit elements directly and electrically connected to the light-emitting element 21 are the resistor 25a and the control element 25b.

[0053] On the other hand, a control current or the like flows through the circuit elements that are not directly and electrically connected to the light-emitting element 21, and therefore a current that is smaller than the current that flows through the light-emitting element 21 flows through the circuit elements. Therefore, the amount of heat generated by the circuit elements that are not directly and electrically connected to the light-emitting element 22 is smaller than the amount of heat generated by the circuit elements that are directly and electrically connected to the light-emitting element 22. In the vehicle lighting device 1 illustrated in FIG. 1, the circuit elements that are not directly and electrically connected to the light-emitting element 21 are the protection element 25b1, the setting resistor 25b2, and the pull-down resistor 25c.

[0054] Therefore, when viewed from the direction along the central axis 1a of the vehicle lighting device 1, the joint 50 can be avoided from being provided at a position overlapping with the circuit element 25 that generates less heat. In this way, the amount of thermally conductive adhesive can be further reduced.

[0055] For example, when viewed from a direction along the central axis 1a of the vehicle lighting device 1, a joint 50 can be provided at a position overlapping with the light-emitting element 22, the resistor 25a, and the control element 25b, and a joint 50 can be not provided at a position overlapping with the protection element 25b1, the setting resistor 25b2, and the pull-down resistor 25c.

[0056] Furthermore, in many cases, the circuit elements 25 are not provided near the periphery of the substrate 21 or near the corners of the substrate 21. Therefore, when viewed from the direction along the central axis 1a of the vehicle lighting device 1, the joints 50 may not be provided at positions overlapping with the periphery of the substrate 21 or near the corners of the substrate 21.

[0057] However, the vehicle lighting device 1 is subjected to vibrations associated with driving, etc. Also, as the vehicle lighting device 1 is turned on and off, thermal stress is generated in the joint 50. Therefore, if the area of ​​the joint 50 is made too small, the light-emitting module 20 may fall off or become displaced. Therefore, it is preferable to consider the heat dissipation and bonding strength when determining the location of the bonding portion 50. In this case, the amount of heat generated varies depending on the number of light emitting elements 22 and circuit elements, and the required luminous flux. Therefore, it is preferable to appropriately determine the location of the bonding portion 50 by performing experiments and simulations.

[0058] 1, for example, in consideration of the vibration and thermal stress described above, the joint 50 is provided at a position overlapping the pull-down resistor 25c in addition to the positions overlapping the light emitting element 21, resistor 25a, and control element 25b. The joint 50 is not provided at positions overlapping the protective element 25b1 and setting resistor 25b2, positions overlapping the vicinity of the edge of the substrate 21, and positions overlapping the vicinity of the corners of the substrate 21. In this way, it is possible to maintain the heat dissipation property and the joint strength.

[0059] For example, when viewed from a direction along the central axis 1a of the vehicle lighting device 1, the joint 50 can be avoided at least in any of the following positions: a position overlapping with the vicinity of the periphery of the substrate 21, a position overlapping with the vicinity of the corner of the substrate 21, and a position overlapping with a circuit element that is not directly electrically connected to the light-emitting element 22. In this case, in the positions where the joints 50 are not provided, the surface of the heat transfer section 40 on the joint 50 side is exposed from the joints 50 .

[0060] The joint 50 can be formed, for example, by supplying a thermally conductive adhesive using a dispenser, etc. In this way, the shape of the joint 50 can be changed as desired.

[0061] 3(a) and (b) are schematic plan views illustrating the configuration of joints 50a and 50b according to another embodiment. 3(a) and 3(b) are schematic plan views of the joints 50a and 50b as viewed from a direction along the central axis 1a of the vehicle lighting device 1. The heat transfer section 40a has a rectangular parallelepiped shape.

[0062] 3(a), when viewed from a direction along the central axis 1a of the vehicle lighting device 1, the joint 50a may not be provided at a position overlapping the vicinity of the periphery of the substrate 21 and at a position overlapping the vicinity of one corner of the substrate 21. In this case, the one corner of the joint 50a may be linear.

[0063] 3(b), when viewed from a direction along the central axis 1a of the vehicle lighting device 1, the joints 50a may not be provided at positions overlapping with the vicinity of the periphery of the substrate 21 and at positions overlapping with the vicinity of the four corners of the substrate 21. In this case, the four corners of the joints 50b may be curved.

[0064] In this way, the area of ​​the bonding portions 50a, 50b can be increased, thereby improving resistance to vibration and thermal stress and heat dissipation. In this case, the bonding portions 50a, 50b are not provided near the periphery and near the corners of the substrate 21, so the amount of thermally conductive adhesive can be reduced.

[0065] The shape of the joint is not limited to the example shown, and can be changed as appropriate depending on the number and arrangement of the light-emitting elements 21 and circuit elements 25, the vibrations and thermal stresses applied to the vehicle lighting device 1, etc.

[0066] In the above, the light emitting module 20 (substrate 21) is joined and the joint is formed by curing the applied thermally conductive adhesive, but the joint may be, for example, a viscous sheet containing a thermally conductive resin. The thermal conductivity of the sheet-like joint may be, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less. The sheet-like joint can improve the work efficiency, while the thermally conductive adhesive can be hardened to form the joint, making it easy to change the shape of the joint.

[0067] That is, the joint portion may be any portion provided between the socket 10 and the light-emitting module 20 (substrate 21) and containing a thermally conductive material.

[0068] (Vehicle lighting fixtures) In one embodiment of the present invention, a vehicle lamp 100 can be provided that includes a vehicle lighting device 1. The above-mentioned description of the vehicle lighting device 1 and modified versions of the vehicle lighting device 1 (for example, a device in which a person skilled in the art appropriately adds, deletes, or modifies components and has the features of the present invention) can all be applied to the vehicle lamp 100.

[0069] In the following, as an example, a case where the vehicular lamp 100 is a rear combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a rear combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0070] FIG. 4 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 4, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0071] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that, although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0072] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0073] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0074] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Fig. 4 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0075] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0076] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from coming off the housing 101.

[0077] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like provided outside the vehicle lamp 100 is electrically connected to the connector 105. Therefore, by fitting the connector 105 to ends of the multiple power supply terminals 31, the lighting circuit or the like can be electrically connected to the light-emitting element 22.

[0078] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0079] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other.

[0080] Below, additional notes regarding the above-described embodiment are given.

[0081] (Appendix 1) Socket and; A substrate provided on one end side of the socket; A light emitting element provided on the substrate; a first circuit element disposed on the substrate and directly electrically connected to the light emitting element; a second circuit element disposed on the substrate and not directly electrically connected to the light emitting element; a joint provided between the socket and the substrate, the joint including a thermally conductive material; Equipped with A vehicle lighting device in which, when viewed from a direction along the central axis of the vehicle lighting device, the joint is not provided at least in any of the positions overlapping with the vicinity of the periphery of the substrate, the position overlapping with the vicinity of the corner of the substrate, and the position overlapping with the second circuit element.

[0082] (Appendix 2) the socket includes a highly thermally conductive resin; 2. The vehicle lighting device according to claim 1, further comprising a heat transfer portion including a metal, the heat transfer portion being provided between the socket and the joint portion.

[0083] (Appendix 3) 3. The vehicle lighting device according to claim 2, wherein a surface of the heat transfer portion facing the joint is exposed from the joint at a position where the joint is not provided.

[0084] (Appendix 4) 3. The vehicle lighting device according to claim 1, wherein the thermal conductivity of the joint is not less than 0.5 W / (m·K) and not more than 10 W / (m·K).

[0085] (Appendix 5) A vehicle lighting device according to any one of appendix 1 to 4; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with: [Explanation of symbols]

[0086] REFERENCE SIGNS LIST 1 Vehicle lighting device, 1a central axis, 10 socket, 20 light emitting module, 21 substrate, 22 light emitting element, 25 circuit element, 25a resistor, 25b control element, 25b1 protection element, 25b2 setting resistor, 25c pull-down resistor, 40 heat transfer section, 50 joint section, 50a joint section, 50b joint section, 100 vehicle lamp, 101 housing

Claims

1. A socket; A substrate provided on one end side of the socket; A light emitting element provided on the substrate; a first circuit element disposed on the substrate and directly electrically connected to the light emitting element; a second circuit element disposed on the substrate and not directly electrically connected to the light emitting element; a joint provided between the socket and the substrate, the joint including a thermally conductive material; Equipped with A vehicle lighting device in which, when viewed from a direction along the central axis of the vehicle lighting device, the joint is not provided at least in any of the positions overlapping with the vicinity of the periphery of the substrate, the position overlapping with the vicinity of the corner of the substrate, and the position overlapping with the second circuit element.

2. the socket includes a highly thermally conductive resin; 2. The vehicle lighting device according to claim 1, further comprising a heat transfer portion including a metal, the heat transfer portion being provided between the socket and the joint portion.

3. The vehicle lighting device according to claim 2 , wherein a surface of the heat transfer portion facing the joint is exposed from the joint at a position where the joint is not provided.

4. 3. The vehicle lighting device according to claim 1, wherein the thermal conductivity of the joint is not less than 0.5 W / (m·K) and not more than 10 W / (m·K).

5. The vehicle lighting device according to claim 1; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

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