Substrate processing apparatus

Abstract

To provide a technique capable of miniaturizing a substrate processing apparatus that performs a supercritical dryness.SOLUTION: A substrate processing apparatus comprises: a conveyance device that conveys a substrate; and a dry unit that replaces a liquid film formed on an upper surface of the substrate with a supercritical fluid, and dries the substrate. The dry unit comprises: a pressure container that forms a dry chamber for the substrate therein; a lid body that blocks an opening of the dry chamber; and a support body that is fixed to the dry chamber and supports horizontally the substrate. The lid body can move back and forth between a closed position that blocks the opening and an open position that opens the opening. The dry unit comprises a lock key that limits the back and forth of the lid body from the closed position to the open position. The conveyance device holds horizontally the substrate where the liquid film is formed, passes through the opening of the dry chamber, and enters into the dry chamber.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] The drying processing apparatus described in Patent Document 1 replaces a liquid film formed on the upper surface of a horizontal substrate with a supercritical fluid to dry the substrate. This drying processing apparatus includes a rectangular box-shaped container body, a lid, and a substrate mounting stage. The lid and the substrate mounting stage also serve as a loading / unloading mechanism for loading and unloading the substrate, and are provided so as to be movable forward and backward. Patent Document 2 also discloses a similar technique. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-254904 A [Patent Document 2] JP 2019-67863 A Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for miniaturizing a substrate processing apparatus that performs supercritical drying. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a transport device for transporting a substrate, and a drying unit for replacing a liquid film formed on an upper surface of the substrate with a supercritical fluid to dry the substrate. The drying unit includes a pressure vessel forming a drying chamber for the substrate therein, a lid for closing an opening of the drying chamber, and a support fixed to the drying chamber for horizontally supporting the substrate. The lid is movable between a closed position for closing the opening and an open position for opening the opening. The drying unit includes a lock key for restricting the lid from moving backward from the closed position to the open position. The transport device holds the substrate on which the liquid film has been formed horizontally and enters the drying chamber through the opening of the drying chamber. Effect of the Invention

[0006] According to one aspect of the present disclosure, a substrate processing apparatus that performs supercritical drying can be made smaller. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a front view of the substrate processing apparatus according to an embodiment. [Diagram 3] FIG. 3 is a side view of the substrate processing apparatus according to an embodiment. [Figure 4] FIG. 4 is a flowchart showing a substrate processing method according to an embodiment. [Diagram 5] FIG. 5(A) is a cross-sectional view showing an example of the standby position of the lid body, FIG. 5(B) is a cross-sectional view showing an example of the open position of the lid body, and FIG. 5(C) is a cross-sectional view showing an example of the closed position of the lid body. [Figure 6] FIG. 6(A) is a horizontal cross-sectional view showing an example of a straightening plate, FIG. 6(B) is a cross-sectional view taken along line BB in FIG. 6(A), and FIG. 6(C) is a cross-sectional view taken along line CC in FIG. 6(A). [Figure 7] FIG. 7(A) is a horizontal cross-sectional view showing an example of the flow when the pressure is increased, and FIG. 7(B) is a vertical cross-sectional view showing an example of the flow when the pressure is increased. [Figure 8]FIG. 8(A) is a horizontal cross-sectional view showing an example of the flow during purging, and FIG. 8(B) is a vertical cross-sectional view showing an example of the flow during purging. [Figure 9] 9(A) is a side view showing a state of the drying unit during fluid supply, and FIG. 9(B) is a cross-sectional view taken along line BB in FIG. 9(A). [Figure 10] 10(A) is a side view showing a state when a substrate is carried in and out of the drying unit, and FIG. 10(B) is a cross-sectional view taken along line BB in FIG. 10(A). [Figure 11] FIG. 11A is a cross-sectional view showing an example of a state when the lock key starts to rise, and FIG. 11B is a cross-sectional view showing an example of a state when the lock key has finished rising. [Figure 12] FIG. 12 is a flowchart showing an example of S4 in FIG. [Figure 13] FIG. 13 is a plan view of the substrate processing apparatus according to the first modified example. [Figure 14] FIG. 14 is a front view of the substrate processing apparatus according to the first modified example. [Figure 15] FIG. 15 is a plan view of the substrate processing apparatus according to the second modified example. [Figure 16] FIG. 16 is a side view of the substrate processing apparatus according to the second modified example. [Figure 17] FIG. 17 is a plan view of a substrate processing apparatus according to a third modified example. [Figure 18] FIG. 18 is a front view of a substrate processing apparatus according to a third modified example. [Figure 19] FIG. 19 is a plan view of a substrate processing apparatus according to a fourth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding configurations are denoted by the same reference numerals, and the description may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical.

[0009] First, a substrate processing apparatus 1 according to an embodiment will be described with reference to Figures 1 to 3. As shown in Figure 1, the substrate processing apparatus 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other in the X-axis direction.

[0010] The loading / unloading station 2 includes a mounting table 21, a transport section 22, and a transfer section 23. The mounting table 21 is configured to mount a plurality of carriers C. Each of the plurality of carriers C accommodates a plurality of horizontal substrates W spaced apart in the vertical direction.

[0011] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device such as an electronic circuit formed on the surface of the semiconductor substrate or the glass substrate. The substrate W may have a concave-convex pattern on its surface.

[0012] The transport section 22 is provided adjacent to the mounting table 21. A first transport device 22a is disposed inside the transport section 22. The first transport device 22a transports the substrate W inside the transport section 22, and transports the substrate W between a plurality of devices disposed adjacent to the transport section 22.

[0013] The first transfer device 22a includes a first transfer arm that holds the substrate W. The first transfer arm is capable of moving in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of first transfer arms may be one or more.

[0014] The delivery section 23 is provided adjacent to the transport section 22. The delivery section 23 has a transition device 23a that temporarily accommodates the substrate W. As shown in Fig. 2, a plurality of transition devices 23a may be stacked in the vertical direction. However, the arrangement and number of the transition devices 23a are not particularly limited.

[0015] The processing station 3 includes a transport block 31 and a plurality of processing blocks 32. The transport block 31 is provided adjacent to the transfer section 23. The transport block 31 has a rectangular parallelepiped shape. A second transport device 31a is disposed inside the transport block 31. The second transport device 31a transports the substrate W between a plurality of devices disposed adjacent to the transport block 31.

[0016] The second transfer device 31a includes a second transfer arm that holds the substrate W. The second transfer arm is capable of moving in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of the second transfer arms may be one or more.

[0017] The processing block 32 is provided adjacent to the transport block 31. A plurality of processing blocks 32 may be provided. As shown in Fig. 1, if a plurality of processing blocks 32 are arranged symmetrically on both sides of the transport block 31 in the Y-axis direction, the variation in the processing time of the substrate W between the plurality of processing blocks 32 can be reduced, and the variation in the processing quality of the substrate W can be reduced. Furthermore, as shown in Fig. 2, if a plurality of processing blocks 32 are stacked in the vertical direction, the installation area of ​​the processing blocks 32 can be reduced. However, the arrangement and number of the processing blocks 32 are not particularly limited.

[0018] When multiple processing blocks 32 are stacked vertically, multiple transport blocks 31 may be stacked vertically as shown in Fig. 3. The number of transport blocks 31 is the same as the number of processing blocks 32. Multiple substrates W can be transported simultaneously at different heights, and the number of substrates W processed per unit time can be increased. However, the arrangement and number of transport blocks 31 are not particularly limited.

[0019] The processing block 32 includes a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32c. The processing block 32 may have a plurality of sets (for example, two sets) of the liquid film forming unit 32a, the drying unit 32b, and the supply unit 32c. As described later, according to this embodiment, the drying unit 32b can be made small, so that even if the number of various units is increased, the processing block 32 can be prevented from becoming large.

[0020] The liquid film forming unit 32a supplies liquid to the upper surface of the horizontal substrate W. The liquid film forming unit 32a includes, for example, a spin chuck that holds the substrate W horizontally, and a nozzle that ejects liquid onto the upper surface of the substrate W. The nozzle supplies liquid to the center of the upper surface of the rotating substrate W. The liquid spreads from the center to the periphery of the upper surface of the substrate W by centrifugal force. As the liquid, for example, a chemical liquid, a rinsing liquid, and a drying liquid are supplied in this order. A plurality of types of chemical liquids may be supplied, and a rinsing liquid may be supplied between the supply of one chemical liquid and the supply of another chemical liquid.

[0021] The liquid film forming unit 32a, for example, forms a liquid film of a chemical liquid on the upper surface of the horizontal substrate W, then replaces the liquid film of the chemical liquid with a liquid film of a rinsing liquid, and then replaces the liquid film of the rinsing liquid with a liquid film of a drying liquid. The chemical liquid is, for example, SC1 (aqueous solution of ammonia and hydrogen peroxide) or DHF (dilute hydrofluoric acid), etc. The rinsing liquid is, for example, DIW (deionized water), etc. The drying liquid is, for example, an organic solvent such as IPA (isopropyl alcohol).

[0022] The drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid, and dries the substrate W. A supercritical fluid is a fluid that is at a temperature equal to or higher than its critical temperature and at a pressure equal to or higher than its critical pressure, and is in a state in which it is difficult to distinguish between liquid and gas. By replacing a liquid film such as a drying liquid with a supercritical fluid, it is possible to prevent the concave-convex pattern of the substrate W from collapsing due to surface tension. Details of the drying unit 32b will be described later.

[0023] The supply unit 32c supplies a fluid to the drying unit 32b. Specifically, the supply unit 32c includes a group of supply devices including a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing that houses the group of supply devices. The supply unit 32c supplies, for example, CO2 as a fluid to the drying unit 32b.

[0024] In a plan view, the liquid film formation unit 32a and the drying unit 32b included in the same processing block 32 are adjacent to the long side of the rectangular transport block 31. The liquid film formation units 32a included in the same processing block 32 are adjacent to each other and are disposed closer to the transition device 23a than the drying unit 32b.

[0025] In a plan view, the drying units 32b and the supply units 32c included in the same processing block 32 are arranged alternately in the X-axis direction. The supply unit 32c supplies a fluid to the adjacent drying unit 32b on the negative side of the X-axis. The supply unit 32c may or may not be adjacent to the transport block 31. This is because the substrate W is not carried in or out of the supply unit 32c.

[0026] In a plan view, the processing block 32 protrudes in the positive direction of the X-axis further than the transport block 31. The supply unit 32c is disposed in the protruding portion. Three sides of the supply unit 32c (the positive direction of the Y-axis, the negative direction of the Y-axis, and the positive direction of the X-axis) are open, which improves workability during maintenance.

[0027] When a plurality of processing blocks 32 are provided, the second transfer device 31a transfers one substrate W between a plurality of units (for example, between the liquid film forming unit 32a and the drying unit 32b) included in the same processing block 32. The second transfer device 31a does not transfer the substrate W between a plurality of processing blocks 32.

[0028] The substrate processing apparatus 1 includes a control device 4. The control device 4 is, for example, a computer, and includes a CPU (Central Processing Unit) 41 and a storage medium 42 such as a memory. The storage medium 42 stores programs that control various processes executed in the substrate processing apparatus 1. The control device 4 controls the operation of the substrate processing apparatus 1 by causing the CPU 41 to execute the programs stored in the storage medium 42.

[0029] Next, the operation of the substrate processing apparatus 1 will be described with reference to Fig. 4. Steps S1 to S4 shown in Fig. 4 are performed under the control of the control device 4.

[0030] First, the first transfer device 22a takes out the substrate W from the carrier C, and transfers the taken-out substrate W to the transition device 23a. Next, the second transfer device 31a takes out the substrate W from the transition device 23a, and transfers the taken-out substrate W to the liquid film formation unit 32a.

[0031] Next, the liquid film forming unit 32a supplies (S1) a chemical liquid to the upper surface of the horizontal substrate W. The chemical liquid is supplied to the center of the upper surface of the rotating substrate W and spreads over the entire radial direction of the upper surface by centrifugal force, forming a liquid film.

[0032] Next, the liquid film forming unit 32a supplies a rinsing liquid to the upper surface of the horizontal substrate W (S2). The rinsing liquid is supplied to the center of the upper surface of the rotating substrate W and spreads over the entire radial direction of the upper surface by centrifugal force to form a liquid film. The liquid film of the chemical liquid is replaced with a liquid film of the rinsing liquid.

[0033] Next, the liquid film forming unit 32a supplies a drying liquid to the upper surface of the horizontal substrate W (S3). The drying liquid is supplied to the center of the upper surface of the rotating substrate W and spreads over the entire radial direction of the upper surface by centrifugal force to form a liquid film. The liquid film of the rinsing liquid is replaced with a liquid film of the drying liquid.

[0034] Next, the second transfer device 31a takes out the substrate W from the liquid film forming unit 32a, and transfers the taken-out substrate W to the drying unit 32b.

[0035] Next, the drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid, and dries the substrate W (S4). By replacing a liquid film such as a drying liquid with a supercritical fluid, it is possible to prevent an interface between liquid and gas from appearing in the uneven pattern of the substrate W. As a result, it is possible to prevent the occurrence of surface tension and the collapse of the uneven pattern.

[0036] Finally, the second transfer device 31a takes the substrate W out of the drying unit 32b and transfers it to the transition device 23a. Then, the first transfer device 22a takes the substrate W out of the transition device 23a and stores it in the carrier C.

[0037] Next, the drying unit 32b will be described with reference to Fig. 5. The drying unit 32b shown in Fig. 5 is disposed on the Y-axis positive side of the transport block 31. In describing the drying unit 32b, the direction in which the substrate W is carried into the drying chamber S (the Y-axis positive direction in Fig. 5) is defined as the front, and the direction in which the substrate W is carried out from the drying chamber S (the Y-axis negative direction in Fig. 5) is defined as the rear.

[0038] The drying unit 32b includes a pressure vessel 51 that defines a drying chamber S for the substrate W therein, a lid 52 that closes a first opening Sa of the drying chamber S, and a support 53 that holds the substrate W horizontally in the drying chamber S. The first opening Sa is an entrance / exit for the substrate W. The substrate W is loaded into the drying chamber S through the first opening Sa, dried in the drying chamber S, and then loaded out of the drying chamber S through the first opening Sa.

[0039] The pressure vessel 51 includes, for example, a lower wall 51a, an upper wall 51b, a front wall 51c, a rear wall 51d, and a pair of side walls 51e and 51f (see FIG. 6, etc.), and defines a drying chamber S therein. The drying chamber S has, for example, a rectangular parallelepiped shape. A rectangular first opening Sa is formed in the rear wall 51d, and a rectangular second opening Sb is formed in the front wall 51c.

[0040] The lid body 52 is provided behind the rear wall 51d. The lid body 52 is movable between a closed position (see FIG. 5(C)) and an open position (see, for example, FIG. 5(B)). The closed position is a position where the lid body 52 closes the first opening Sa. The open position is a position behind the closed position where the lid body 52 opens the first opening Sa.

[0041] Incidentally, in Patent Documents 1 and 2, the support 53 is fixed to the lid body 52 and moves forward and backward together with the lid body 52. ​​The support 53 is not fixed to the drying chamber S, and the support 53 and the second transfer device 31a transfer the substrate W outside the pressure vessel 51. Therefore, an area for transferring the substrate W is provided outside the pressure vessel 51.

[0042] In contrast, in this embodiment, the support 53 is fixed to the pressure vessel 51 and does not move back and forth together with the lid 52. The support 53 is fixed to the drying chamber S, and the second transport device 31a and the support 53 transfer the substrate W in the drying chamber S. Therefore, there is no need to provide an area for transferring the substrate W outside the pressure vessel 51, and the drying unit 32b can be made smaller.

[0043] Moreover, according to this embodiment, the support 53 is fixed to the drying chamber S, and no backlash occurs between the sliding parts, unlike when the support 53 advances and retreats relative to the pressure vessel 51. As a result, vibration of the support 53 can be suppressed, vibration of the substrate W can be suppressed, and spillage of the liquid film LF can be suppressed.

[0044] Unlike Patent Documents 1 and 2, the first opening Sa of the drying chamber S is arranged facing the transport block 31. The substrate W can be loaded into the drying chamber S without rotating the second transport arm of the second transport device 31a about the vertical axis. The substrate W can be loaded into the drying chamber S without rotating the substrate W, and the drying liquid can be prevented from being shaken off from the upper surface of the substrate W.

[0045] The lid body 52 rotates between an open position and a standby position (see FIG. 5(A)) so that the second transport device 31a can easily enter the drying chamber S. The standby position is a position off the loading / unloading path of the substrate W. When the substrate W is loaded / unloaded, the lid body 52 waits at the standby position. This makes it possible to avoid interference between the lid body 52 and the substrate W.

[0046] 6(A) to 6(C), the support 53 includes a current plate 53a that straightens the flow of fluid in the drying chamber S, and a mounting portion 53b fixed to the upper surface of the current plate 53a. The current plate 53a is fixed to the drying chamber S. The substrate W is mounted on the mounting portion 53b.

[0047] 6(B), the mounting portion 53b forms a gap between the substrate W and the current plate 53a, and prevents the bottom surface of the substrate W from becoming dirty. The mounting portion 53b includes, for example, a plurality of support pins. The plurality of support pins support the bottom surface of the substrate W, but may also support the periphery of the substrate W.

[0048] The straightening plate 53a is formed in a U-shape when viewed from the first opening Sa of the drying chamber S, and includes a horizontal plate 53a1 placed on the lower wall 51a of the pressure vessel 51, and a pair of vertical plates 53a2, 53a3 provided at both ends of the horizontal plate 53a1 in the X-axis direction. The pair of vertical plates 53a2, 53a3 are fixed to the side walls 51e, 51f of the pressure vessel 51. For example, a screw hole is provided in each of the pair of vertical plates 53a2. The screw 54 is screwed into the screw holes of the vertical plates 53a2, 53a3 and the screw holes of the side walls 51e, 51f to fix the straightening plate 53a to the pressure vessel 51.

[0049] 6(A), in a plan view, the straightening plate 53a includes an outlet 53a4 on the outer side of the substrate W supported by the support 53. The outlet 53a4 is a hole that discharges a fluid from above to below the straightening plate 53a. The position of the outlet 53a4 determines the flow of the fluid in the drying chamber S. The outlet 53a4 is provided linearly on the rear edge of the horizontal plate 53a1, for example. The length of the outlet 53a4 is longer than the diameter of the substrate W.

[0050] Further, in a plan view, the rectifying plate 53a includes a supply port 53a5 on the outer side of the substrate W supported by the support 53. The supply port 53a5 is a hole that supplies a fluid from below to above the rectifying plate 53a. The position of the supply port 53a5 determines the flow of the fluid in the drying chamber S. For example, a plurality of supply ports 53a5 are provided at each of the four corners of the horizontal plate 53a1. The position and number of the supply ports 53a5 are not particularly limited. For example, a plurality of supply ports 53a5 may be arranged in a ring shape along the periphery of the substrate W.

[0051] 6(C), the pressure vessel 51 includes a discharge port 51g for discharging the fluid from the drying chamber S, and a supply port 51h for supplying the fluid to the drying chamber S. The discharge port 51g and the supply port 51h are formed in a lower wall 51a of the pressure vessel 51. A straightening plate 53a is placed on the lower wall 51a.

[0052] A first flow path CH1 connecting the discharge port 53a4 and the discharge port 51g, and a second flow path CH2 connecting the supply port 53a5 and the supply port 51h are independently formed on the lower surface of the straightening plate 53a. The first flow path CH1 and the second flow path CH2 are grooves formed on the lower surface of the straightening plate 53a. Since the first flow path CH1 and the second flow path CH2 are not connected, the discharge of the fluid from the drying chamber S and the supply of the fluid to the drying chamber S can be performed separately.

[0053] The supply port 51h is formed, for example, in the center of the lower wall 51a. The second flow paths CH2 are formed, for example, radially from the center of the straightening plate 53a toward the four corners. Since the distances from the center to the four corners of the straightening plate 53a are equal, the fluid can be evenly distributed toward the four corners of the straightening plate 53a.

[0054] On the other hand, the discharge port 51g is formed behind the supply port 51h. The first flow path CH1 is formed so as not to be connected to the second flow path CH2, and is formed linearly from the discharge port 51g to the rear. The discharge outlet 53a4 is disposed behind the discharge port 51g.

[0055] 9 and 10, the drying unit 32b includes a support frame 54 that supports a pressure vessel 51. The support frame 54 includes, for example, a horizontal base plate 54a, a plurality of pillars 54b protruding upward from the base plate 54a, and a horizontal plate 54c fixed to the upper surfaces of the plurality of pillars 54b. A pair of the horizontal plates 54c are provided with a gap between them in the X-axis direction. The pressure vessel 51 is fixed onto the pair of horizontal plates 54c.

[0056] The drying unit 32b includes a linear motion mechanism 55 that moves the lid body 52 back and forth between a closed position and an open position, and a rotation mechanism 56 that rotates the lid body 52 between the open position and a standby position. The rotation mechanism 56 includes, for example, a rotation shaft 56a of the lid body 52 and a rotary actuator 56b that rotates the rotation shaft 56a. On the other hand, the linear motion mechanism 55 includes, for example, a slider 55a that holds a bearing of the rotation shaft 56a, and a linear motion actuator 55b that moves the slider 55a back and forth.

[0057] The rotation shafts 56a of the lid body 52 are arranged symmetrically on both sides in the X-axis direction with the lid body 52 in between. The sliders 55a are also arranged symmetrically on both sides in the X-axis direction with the lid body 52 in between. Guides 55c of the sliders 55a are respectively placed on the pair of horizontal plates 54c. The rotary actuator 56b is fixed to one of the sliders 55a and can advance and retreat together with the slider 55a. The linear actuator 55b is fixed to one of the horizontal plates 54c.

[0058] The linear actuator 55b is, for example, a pneumatic cylinder, and presses the lid 52 against the pressure vessel 51 by the pressure of compressed air. A sealing member (not shown) that seals between the lid 52 and the pressure vessel 51 can be crushed by the driving force of the linear actuator 55b, and this prevents the lid 52 from interfering with the movement of the lock key 57, which will be described later, when the lock key 57 is fitted into the fitting hole 51i in the upper wall 51b of the pressure vessel 51. The linear actuator 55b may include a motor and a ball screw that converts the rotational motion of the motor into linear motion of the lid 52.

[0059] The drying unit 32b includes a lock key 57 that restricts the lid body 52 from moving backward from the closed position to the open position. The lock key 57 is fitted into a fitting hole 51i of the pressure vessel 51 to restrict the backward movement of the lid body 52. ​​Even if a fluid is supplied to the drying chamber S to increase the pressure in the drying chamber S, the backward movement of the lid body 52 can be restricted, and leakage of the fluid can be suppressed.

[0060] The fitting hole 51i is formed penetrating the lower wall 51a and the upper wall 51b in the Z-axis direction. The lower wall 51a and the upper wall 51b protrude rearward beyond the rear wall 51d. The fitting hole 51i is formed in the protruding portion. A plurality of fitting holes 51i are formed at intervals in the X-axis direction. A plurality of lock keys 57 are also provided at intervals in the X-axis direction. The plurality of lock keys 57 are fitted into both the fitting hole 51i of the lower wall 51a and the fitting hole 51i of the upper wall 51b.

[0061] The number of the lock keys 57 is not particularly limited, but is, for example, three. Unlike the case where the number of the lock keys 57 is two, the central portion of the lid body 52 in the X-axis direction can also be pressed. As a result, when a fluid is supplied to the drying chamber S to increase the pressure in the drying chamber S, the central portion of the lid body 52 in the X-axis direction can be prevented from expanding rearward beyond the ends in the X-axis direction.

[0062] The drying unit 32b includes a film thickness meter 58 for measuring the film thickness of the liquid film LF formed on the upper surface of the substrate W. The film thickness meter 58 irradiates the substrate W with a laser from a fitting hole 51i of the pressure vessel 51 (more specifically, the upper wall 51b) and measures the film thickness of the liquid film LF. For example, the film thickness meter 58 measures the phase difference between the light reflected on the upper surface of the liquid film LF and the light reflected on the interface between the liquid film LF and the substrate W, and measures the film thickness of the liquid film LF. It is possible to inspect the state of coverage of the substrate W with the liquid film LF, and to confirm that the concave-convex pattern of the substrate W is covered with the liquid film LF. It is sufficient that the maximum film thickness of the liquid film LF is greater than the height difference of the concave-convex pattern.

[0063] The fitting hole 51i of the pressure vessel 51 is placed near the first opening Sa of the drying chamber S. The film thickness meter 58 irradiates the substrate W with a laser from the fitting hole 51i, and therefore can measure the thickness of the liquid film LF immediately before the substrate W is accommodated in the drying chamber S. Therefore, the coating state of the substrate W with the liquid film LF can be inspected immediately before the liquid film LF is replaced with a supercritical fluid. Since the drying liquid is a highly volatile organic solvent, it is effective to measure the thickness of the liquid film LF immediately before the entire substrate W is accommodated in the drying chamber S.

[0064] The film thickness meter 58 measures the film thickness of the liquid film LF in the process of carrying the substrate W into the drying chamber S by the second transport device 31a. The film thickness meter 58 may repeatedly measure the film thickness while changing the film thickness measurement point by the second transport device 31a. Since the film thickness of the liquid film LF can be measured at multiple points, the entire upper surface of the substrate W can be inspected.

[0065] The drying unit 32b includes an elevation mechanism 59 that raises and lowers the lock key 57 between a locked position (see FIG. 9(B)) and an unlocked position (see FIG. 10(B)). The locked position is a position where the lock key 57 restricts the retraction of the lid body 52, and where the lock key 57 is fitted into the fitting holes 51i of both the lower wall 51a and the upper wall 51b. The unlocked position is a position where the lock key 57 allows the retraction of the lid body 52, and where the lock key 57 is pulled downward from the fitting hole 51i of the upper wall 51b. The unlocked position is set below the path for loading and unloading the substrate W to prevent interference between the lock key 57 and the substrate W.

[0066] The lifting mechanism 59 includes, for example, a lifting platform 59a on which the multiple lock keys 57 are placed, and a linear actuator 59b that raises and lowers the lifting platform 59a. The lifting platform 59a has a horizontal surface 59a1 on which the lock keys 57 are placed. The linear actuator 59b is, for example, a pneumatic cylinder, and raises and lowers the lifting platform 59a, thereby raising and lowering the multiple lock keys 57. The linear actuator 59b may include a motor and a ball screw that converts the rotational motion of the motor into the linear motion of the lifting platform 59a.

[0067] 11, the drying unit 32b may include a rolling element 60 that is rotatably held by the lock key 57. The rolling element 60 is, for example, a ball, and is held rotatably around the center of the ball. The rolling element 60 may be a roller.

[0068] When the lifting mechanism 59 raises the lock key 57 from the unlocked position to the locked position, the rolling body 60 rolls while in contact with the lid body 52 or the pressure vessel 51. The rolling body 60 can reduce frictional resistance, and can suppress the generation of particles due to friction.

[0069] Unlike Patent Document 2, a plurality of rolling elements 60 are also provided on the underside 57a of the lock key 57, and roll while in contact with the horizontal surface 59a1 of the elevating mechanism 59. When the lock key 57 is elevated, the lock key 57 can move horizontally inside the fitting hole 51i, reducing frictional resistance.

[0070] The lock key 57 may be raised and lowered with its rear surface 57b standing vertically. This is because, when the lock key 57 is raised with its rear surface 57b tilted forward as in Patent Document 2, a corner 57c at the front end of the upper surface of the lock key 57 may hit the rear surface 52a of the cover body 52.

[0071] Unlike Patent Document 2, multiple rolling elements 60 are provided at intervals in the Z-axis direction on rear surface 57b of lock key 57. Compared to when only one rolling element is provided, this can reduce friction between lock key 57 and pressure vessel 51. This is particularly effective when rear surface 57b of lock key 57 is set vertically.

[0072] The lock key 57 may have, on its front surface, an inclined surface 57d that inclines forward from the upper end downward, and a vertical surface 57e that extends directly downward from the lower end of the inclined surface 57d. The inclined surface 57d prevents the corner 57c at the front end of the upper surface of the lock key 57 from hitting the rear surface 52a of the cover body 52.

[0073] The rolling elements 60 are also provided on the inclined surface 57d of the lock key 57, and roll while in contact with the rear surface 52a of the cover body 52. ​​The rear surface 52a of the cover body 52 faces the inclined surface 57d of the lock key 57, and is inclined forward from the upper end downward.

[0074] Next, details of S4 will be described with reference to Fig. 12. Steps S41 to S45 shown in Fig. 12 are performed under the control of the control device 4.

[0075] First, the second transfer device 31a horizontally holds the substrate W on which the liquid film LF of the drying liquid is formed, and transfers the substrate W into the drying chamber S inside the pressure vessel 51 (S41). During this process, the film thickness meter 58 measures the film thickness of the liquid film LF. It can be confirmed that the concave-convex pattern of the substrate W is covered with the liquid film LF.

[0076] Next, the support body 53 fixed to the drying chamber S receives the substrate W from the second transfer device 31a, and horizontally supports the received substrate W. Subsequently, the second transfer device 31a exits the drying chamber S from the first opening Sa to the outside.

[0077] Next, the rotation mechanism 56 rotates the lid body 52 from the standby position to the open position. Then, the linear motion mechanism 55 advances the lid body 52 from the open position to the closed position. As a result, the lid body 52 closes the first opening Sa of the drying chamber S.

[0078] Next, the lifting mechanism 59 lifts the lock key 57 from the unlocked position to the locked position. The lock key 57 presses the lid body 52 from behind, restricting the retreat of the lid body 52. ​​Fluid leakage can be suppressed in S42 described later.

[0079] Next, the supply unit 32c supplies a fluid such as CO2 to the drying chamber S to increase the pressure of the drying chamber S (S42). At this time, the fluid is supplied to the drying chamber S from the supply port 51h of the lower wall 51a as shown in FIG. 7(B). The fluid is ejected upward from the supply port 53a5 of the straightening plate 53a. In a plan view, as shown in FIG. 7(A), a plurality of supply ports 53a5 are formed at the four corners of the straightening plate 53a, and the fluid flows from the outside to the inside of the substrate W. Above the substrate, a flow is formed from the periphery of the substrate to the center. Therefore, the liquid film LF can be prevented from spilling out of the substrate W due to the flow of the fluid. In a plan view, the supply port 53a5 is disposed on the outside of the substrate W, so that even if the supply port 53a5 ejects the fluid directly upward, the substrate W is not stirred up. The fluid is not discharged from the drying chamber S and is stored in the drying chamber S while the pressure of the drying chamber S is being increased. The pressure in the drying chamber S is increased to a set pressure that is equal to or greater than the critical pressure.

[0080] Next, the supply unit 32c supplies the fluid to the drying chamber S, and the exhaust unit (not shown) exhausts the fluid from the drying chamber S, and the drying liquid dissolved in the supercritical fluid is purged while maintaining the pressure of the drying chamber S at a set pressure (S43). At this time, the fluid is supplied to the drying chamber S from the discharge port 61a of the second cover body 61 as shown in FIG. 8(B). The second cover body 61 closes the second opening Sb of the drying chamber S and is disposed opposite the cover body 52. ​​The discharge ports 61a of the second cover body 61 are provided at intervals in the X-axis direction as shown in FIG. 8(A), and form a curtain-like air flow above the substrate W. The fluid dissolves the drying liquid in the liquid film LF while passing above the substrate W. After passing above the substrate W, the fluid that has dissolved the drying liquid passes through the discharge port 53a4 of the straightening plate 53a and is exhausted to the outside of the drying chamber S. As a result, the liquid film LF is replaced with the supercritical fluid.

[0081] Next, the supply unit 32c stops supplying the fluid to the drying chamber S, and the exhaust unit (not shown) exhausts the fluid from the drying chamber S to reduce the pressure in the drying chamber S (S44). The exhaust unit may include a vacuum pump or an ejector to shorten the decompression time. The pressure in the drying chamber S is reduced to approximately atmospheric pressure.

[0082] Next, the lifting mechanism 59 lowers the lock key 57 from the lock position to the unlock position.

[0083] Next, the linear motion mechanism 55 moves the lid 52 back from the closed position to the open position, and then the rotation mechanism 56 rotates the lid 52 from the standby position to the open position.

[0084] Next, the second transfer device 31a enters the drying chamber S inside the pressure vessel 51, receives the substrate W from the support 53, and carries the received substrate W out (S45).

[0085] Next, a substrate processing apparatus 1 according to a first modified example will be described with reference to Fig. 13 and Fig. 14. The following mainly describes the differences between this modified example and the above embodiment. As shown in Fig. 13 and Fig. 14, the processing block 32 of this modified example further includes an inspection unit 32d in addition to a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32c.

[0086] The inspection unit 32d inspects the coating state of the liquid film LF on the substrate W. The inspection unit 32d includes, for example, a weight meter, and measures the weight of the substrate W to confirm that the concave-convex pattern of the substrate W is coated with the liquid film LF. The inspection unit 32d may include a thickness meter.

[0087] Even if the drying unit 32b does not include the film thickness meter 58, if the processing block 32 includes the inspection unit 32d, the coating state of the substrate W with the liquid film LF can be inspected before the supercritical drying. However, both the inspection unit 32d and the film thickness meter 58 may be used.

[0088] The formation of the liquid film LF, the inspection of the coating state, and the drying of the substrate W are performed in this order. Therefore, as shown in Fig. 13, in a plan view, the liquid film formation unit 32a, the inspection unit 32d, and the drying unit 32b included in the same processing block 32 are arranged in a line in this order in the longitudinal direction of the rectangular transport block 31. The inspection of the coating state can be performed during the transport of the substrate W from the liquid film formation unit 32a to the drying unit 32b, and the transport path of the substrate W can be shortened.

[0089] 14, the processing block 32 may further include a cleaning unit 32e. The cleaning unit 32e irradiates the substrate W with ultraviolet rays to remove organic matter and the like adhering to the substrate W. The irradiation of ultraviolet rays is performed after drying the substrate W to remove residues of the drying liquid or supercritical fluid.

[0090] 14, if the cleaning unit 32e and the inspection unit 32d are stacked vertically, it is possible to reduce the installation area of ​​the processing block 32. Either the cleaning unit 32e or the inspection unit 32d may be placed on top.

[0091] The processing block 32 includes one each of a liquid film forming unit 32a, a drying unit 32b, a supply unit 32c, an inspection unit 32d, and a cleaning unit 32e. However, the type, number, and arrangement of the units constituting the processing block 32 are not particularly limited. For example, the processing block 32 in this modification includes both the inspection unit 32d and the cleaning unit 32e, but may include only one of them.

[0092] When the processing block 32 includes the cleaning unit 32e, in a plan view, the liquid film formation unit 32a, the cleaning unit 32e, and the drying unit 32b included in the same processing block 32 are arranged in a line in this order in the longitudinal direction of the rectangular transport block 31. The substrate W can be cleaned during transport from the drying unit 32b to the transition device 23a, thereby shortening the transport path of the substrate W.

[0093] Next, a substrate processing apparatus 1 according to a second modification will be described with reference to Fig. 15 and Fig. 16. The following mainly describes the differences between this modification and the above-mentioned embodiment. As shown in Fig. 15, the substrate processing apparatus 1 of this modification further includes a second processing block 33 in addition to a transfer block 31 and a processing block 32.

[0094] 15, the second processing block 33 is surrounded on three sides by two processing blocks 32, 32 arranged symmetrically on both sides in the Y-axis direction with the transport block 31 in between, in a plan view. The second processing block 33 includes an inspection unit 33a.

[0095] The inspection unit 33a inspects the state of coverage of the liquid film LF on the substrate W. The inspection unit 33a includes, for example, a weight meter, and measures the weight of the substrate W to confirm that the concave-convex pattern of the substrate W is covered with the liquid film LF. The inspection unit 33a may include a thickness meter.

[0096] Even if the drying unit 32b does not include the film thickness meter 58, if the second processing block 33 includes the inspection unit 33a, the coating state of the substrate W with the liquid film LF can be inspected before the supercritical drying. However, both the inspection unit 33a and the film thickness meter 58 may be used.

[0097] The processing block 32 includes a plurality of sets (e.g., two sets) of a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32c, and the second processing block 33 also includes a plurality of inspection units 33a (e.g., two). If the inspection units 33a are stacked vertically as shown in Fig. 16, the installation area of ​​the processing block 32 can be reduced.

[0098] Next, a substrate processing apparatus 1 according to a third modified example will be described with reference to Fig. 17 and Fig. 18. The following mainly describes the differences between this modified example and the above-mentioned embodiment. In this modified example, as shown in Fig. 17, in a plan view, a set of a liquid film formation unit 32a and a drying unit 32b and another set of a liquid film formation unit 32a and a drying unit 32b are provided in the same processing block 32, which are symmetrical with respect to a virtual line L. As a result, the lengths of the transport paths for the substrates W in each set are equal. Therefore, the variation in processing quality of the substrates W between each set can be reduced.

[0099] In this modification, two liquid film forming units 32a are adjacent to each other, two drying units 32b are provided outside of them, and two supply units 32c are provided further outside of them. The arrangement of the liquid film forming units 32a and the supply unit 32c may be reversed. In other words, two supply units 32c may be adjacent to each other, two drying units 32b are provided outside of them, and two liquid film forming units 32a are provided further outside of them.

[0100] In this modification, as shown in FIG. 18, the inspection unit 32d and the drying unit 32b are stacked vertically. Either the inspection unit 32d or the drying unit 32b may be placed on top. By stacking the inspection unit 32d and the drying unit 32b vertically, the installation area of ​​the processing block 32 can be reduced. In addition, the inspection unit 32d is arranged line-symmetrically about the virtual line L, and as a result, the length of the transport path of the substrate W in each group is equal. Therefore, the variation in the processing quality of the substrate W between each group can be reduced. The substrate W is transported to the liquid film forming unit 32a, the inspection unit 32d, and the drying unit 32b in this order, as shown by the arrows in FIG. 17 and FIG. 18.

[0101] The inspection unit 32d measures the weight of the substrate W after the liquid film LF is formed. The weight of the substrate W before the formation of the liquid film LF is measured, for example, by the transition device 23a. In the above embodiment and the like, as in this modified example, the transition device 23a may measure the weight of the substrate W before the formation of the liquid film LF. The weight of the liquid film LF can be calculated from the weight difference before and after the formation of the liquid film LF, and it can be confirmed that the uneven pattern of the substrate W is covered by the liquid film LF. If the weight of the liquid film LF does not reach a threshold value, an alarm or the like may be issued.

[0102] In addition, the inspection unit 32d may be arranged between the drying unit 32b and the liquid film forming unit 32a in a plan view, instead of being arranged above or below the drying unit 32b. In the latter case, the liquid film forming unit 32a, the inspection unit 32d, and the drying unit 32b may be arranged in a line in the negative direction of the X-axis in this order, or may be arranged in a line in the positive direction of the X-axis in this order, in a plan view.

[0103] Next, a substrate processing apparatus 1 according to a fourth modified example will be described with reference to Fig. 19. The following mainly describes the differences between this modified example and the above-mentioned embodiment. In this modified example, as shown in Fig. 19, a corner of the rectangular loading / unloading station 2 is missing in a plan view, and a part of the processing block 32, more specifically, the supply unit 32c, is disposed in the missing portion. This allows the substrate processing apparatus 1 to be made smaller.

[0104] The transfer section 23 of the loading / unloading station 2 contacts the short side of the transport block 31 which is rectangular in plan view, and transfers the substrate W to the second transport device 31a. The processing block 32 contacts the long side of the transport block 31 and the transfer section 23. The supply unit 32c contacts the transfer section 23. Since the substrate W is not loaded or unloaded from the supply unit 32c, the supply unit 32c does not need to contact the transport block 31, and even if the supply unit 32c contacts the transfer section 23, no problem occurs in terms of transport of the substrate W. Furthermore, as described above, the substrate processing apparatus 1 can be made smaller.

[0105] In this modification, similarly to the above three modifications, each processing block 32 includes a plurality of pairs of liquid film formation units 32a and drying units 32b, but may include only one pair. For example, each processing block 32 may include only one side (the negative side of the X-axis) of the imaginary line L. In this case, too, if a corner of the rectangular loading / unloading station 2 is cut off in a plan view and the supply unit 32c is disposed in the cut off portion, the substrate processing apparatus 1 can be made compact.

[0106] Although the embodiments of the substrate processing apparatus and the substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. Naturally, these also fall within the technical scope of the present disclosure. [Explanation of symbols]

[0107] 1. Substrate Processing Equipment 31 Transport Block 31a Second conveying device (conveying device) 32 Processing Blocks 32a Liquid film forming unit 32b Drying unit 51 Pressure Vessels 52 Lid 53 Support LF liquid film S drying room W substrate

Claims

1. a transport device that transports a substrate; and a drying unit that replaces a liquid film formed on an upper surface of the substrate with a supercritical fluid and dries the substrate, the drying unit includes a pressure vessel forming a drying chamber for the substrate therein, a lid for closing an opening of the drying chamber, and a support body fixed to the drying chamber for horizontally supporting the substrate, The lid body is movable between a closing position at which the opening is closed and an opening position at which the opening is opened, the drying unit includes a lock key that restricts the lid from moving backward from the closed position to the open position; The transport device horizontally holds the substrate on which the liquid film is formed, and passes through the opening of the drying chamber to enter the drying chamber.

2. a transport block in which the transport device is disposed, and a processing block adjacent to the transport block; the processing block includes a liquid film forming unit that forms the liquid film on an upper surface of the horizontal substrate, and the drying unit; In a plan view, the liquid film formation unit and the drying unit included in the same processing block are in contact with a long side of the rectangular transport block, The substrate processing apparatus according to claim 1 , wherein the opening of the drying chamber is disposed facing the transport block.

3. The substrate processing apparatus according to claim 2 , wherein the liquid film formation unit and the drying unit are disposed on either side of the transport block in a plan view.

4. The substrate processing apparatus according to claim 2 , wherein a plurality of said liquid film forming units are stacked in a vertical direction, and a plurality of said drying units are stacked in a vertical direction.

5. The transport block is provided in plurality, The substrate processing apparatus according to claim 2 , wherein the transport blocks are stacked in a vertical direction.

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