Catalyst-providing liquid for electroless plating, method for providing catalyst, and electroless plating method

Abstract

To provide a catalyst-providing liquid useful for forming an electroless plating film having excellent pattern properties and plating-deposition properties on a metal material.SOLUTION: The present invention provides a catalyst-providing liquid for electroless plating, the liquid comprising: (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants; and (B) a metal catalyst.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a catalyst imparting solution for electroless plating, a catalyst imparting method, and an electroless plating method. [Background technology]

[0002] In the field of electronics, such as printed wiring boards, semiconductor packages, and electronic components, one of the final processes during manufacturing is electroless plating of conductor circuits, terminals, etc. When electroless plating is performed on the metal material of the substrate, a catalyst imparting process is sometimes performed to deposit a metal catalyst, such as palladium, which serves as a catalyst nucleus, on the metal material by a substitution reaction in order to improve plating deposition properties, etc. (see, for example, Patent Document 1).

[0003] When performing electroless plating on a metal material such as a copper circuit, it is necessary to immerse the plated material in a catalyst imparting solution containing, for example, 10 to 100 mg / L of palladium. However, due to the recent increase in the price of metal catalysts such as palladium, there is a demand for lower concentrations of metal catalysts in the catalyst imparting solution. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2011-058062 A Summary of the Invention [Problem to be solved by the invention]

[0005] The inventors have found that if the palladium concentration is reduced, sufficient catalytic nuclei are not formed on the copper circuit, and therefore the catalyst does not function sufficiently to deposit electroless plating, resulting in a problem of reduced deposition properties of the plating.

[0006] Furthermore, the present inventors have found that when the immersion time in the palladium catalyst imparting solution is extended in order to improve the deposition properties of the plating, it is possible to cause a sufficient amount of palladium catalyst to be adsorbed onto the copper circuit, but at the same time, the palladium catalyst is also more likely to be adsorbed onto the surface of the insulator, causing the plating to spread, making it difficult to obtain sufficient patterning.

[0007] As described above, in the case of a conventional catalyst imparting solution, when the metal catalyst concentration in the catalyst imparting solution is low, either the plating deposition property on the metal material or the plating patternability is insufficient.

[0008] The present invention has been made in consideration of the current state of the prior art described above, and has as its main object to provide a catalyst imparting solution that is useful for forming an electroless plating film that has excellent plating deposition properties and patternability on a metal material. [Means for solving the problem]

[0009] The present inventors have conducted extensive research to achieve the above-mentioned object. As a result, they have found that by using a catalyst imparting solution for electroless plating containing (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants, and (B) a metal catalyst, it is possible to form an electroless plating film having excellent plating deposition properties and patternability on a metal material. Based on this finding, the present inventors have conducted further research and have completed the present invention. That is, the present invention includes the following configurations.

[0010] Item 1. (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants, and (B) Metal catalyst A catalyst imparting solution for electroless plating comprising:

[0011] Item 2. The catalyst-imparting liquid according to Item 1, wherein the (A) cationic compound includes at least one selected from the group consisting of polyethyleneimine, diallyldimethylammonium chloride-sulfur dioxide copolymer, methyldiallylamine hydrochloride polymer, diallyldimethylammonium chloride polymer, dicyandiamide-polyalkylenepolyamine polycondensate, allylamine hydrochloride-diallylamine hydrochloride polymer, allylamine hydrochloride polymer, allylamine polymer, O-[2-hydroxy-3-(trimethylammonio)propyl]hydroxyethylcellulose chloride, polylysine, cationized guar gum, coconut amine acetate, tetradecylamine acetate, octadecylamine acetate, didecyldimethylammonium chloride, coconut alkyltrimethylammonium chloride, hexadecyltrimethylammonium chloride, and stearyltrimethylammonium chloride.

[0012] Item 3. The catalyst-imparting solution according to Item 1 or 2, wherein the content of the cationic compound (A) is 0.01 to 10,000 mg / L.

[0013] Item 4. The catalyst-imparting solution according to any one of Items 1 to 3, wherein the metal catalyst (B) contains Pd.

[0014] Item 5. The catalyst-imparting liquid according to any one of Items 1 to 4, wherein the content of the metal catalyst (B) is 0.01 to 1000 mg / L.

[0015] Item 6. The catalyst-imparting liquid according to any one of Items 1 to 5, which is acidic.

[0016] Item 7. The catalyst imparting solution according to Item 6, wherein the pH is 5 or less.

[0017] Item 8. The catalyst-imparting liquid according to any one of Items 1 to 7, further comprising (C) at least one acid selected from the group consisting of organic acids and inorganic acids.

[0018] Item 9. The catalyst-imparting solution according to Item 8, wherein the (C) acid includes at least one selected from the group consisting of acetic acid, formic acid, malonic acid, succinic acid, adipic acid, maleic acid, fumaric acid, glycolic acid, lactic acid, malic acid, citric acid, gluconic acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, methanesulfonic acid, glutamic acid, aspartic acid, and boric acid.

[0019] Item 10. The catalyst-imparting liquid according to any one of Items 1 to 9, further comprising (D) a chloride.

[0020] Item 11. The catalyst-imparting solution according to Item 10, wherein the (D) chloride comprises at least one selected from the group consisting of potassium chloride, sodium chloride, ammonium chloride, calcium chloride, magnesium chloride, lithium chloride, trichloroacetaldehyde, and chlorine dioxide.

[0021] Item 12. The catalyst-imparting solution according to Item 10 or 11, wherein the content of the chloride (D) is 0.01 to 200 g / L.

[0022] Item 13. The catalyst-imparting solution according to any one of Items 1 to 12, wherein the electroless plating is at least one selected from the group consisting of electroless palladium plating, electroless palladium alloy plating, electroless nickel plating, electroless nickel alloy plating, electroless silver plating, electroless silver alloy plating, electroless gold plating, and electroless gold alloy plating.

[0023] Item 14. The catalyst-imparting solution according to any one of Items 1 to 13, wherein the electroless plating is performed on a substrate having an insulating region and a conductive region on a surface thereof.

[0024] Item 15. (1) A method for applying a catalyst for electroless plating, comprising a step of contacting an object to be plated with the catalyst application liquid according to any one of items 1 to 14.

[0025] Item 16. (1) A step of contacting an object to be plated with the catalyst imparting solution according to any one of items 1 to 14; and (2) Electroless plating process The electroless plating method comprises, in order: Effect of the Invention

[0026] The electroless plating catalyst imparting solution of the present invention is useful for forming an electroless plating film having excellent plating deposition properties and patternability on a metal material. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] In this specification, the expressions "contain" and "comprise" include any of "contain," "comprise," "consist only of," "consist essentially only of," and "consist only of."

[0028] In this specification, the expression of a numerical range "A to B" means "greater than or equal to A and less than or equal to B."

[0029] 1. Catalyst application solution The catalyst imparting solution for electroless plating of the present invention (hereinafter, in this specification, it may be referred to as "catalyst imparting solution of the present invention" or "catalyst imparting solution") contains (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants (hereinafter, it may be simply referred to as "(A) cationic compound"), and (B) a metal catalyst. The catalyst imparting solution of the present invention having the above-mentioned configuration contains (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants together with (B) a metal catalyst, so that the catalyst can be sufficiently imparted to the surface of the plated object, and therefore excellent plating deposition properties can be exhibited, and the adsorption of the palladium catalyst to the surface of the insulator can be suppressed, so that the spreading of the plating can be suppressed, sufficient patternability can be exhibited, and corrosion of the copper surface can be suppressed. Hereinafter, the present invention will be described in detail.

[0030] (A) Cationic compound The cationic compound (A) is not particularly limited as long as it can be adsorbed onto the insulating part via electrostatic interaction. Specific examples of the cationic compound (A) include polyethyleneimine, diallyldimethylammonium chloride sulfur dioxide copolymer, methyldiallylamine hydrochloride polymer, diallyldimethylammonium chloride polymer, dicyandiamide-polyalkylenepolyamine polycondensate, allylamine hydrochloride-diallylamine hydrochloride polymer, allylamine hydrochloride polymer, allylamine polymer, O-[2-hydroxy3-(trimethylammonio)propyl]hydroxyethylcellulose chloride, polylysine, cationized guar gum, coconut amine acetate, tetradecylamine acetate, octadecylamine acetate, didecyldimethylammonium chloride, coconut alkyl trimethylammonium chloride, hexadecyl trimethylammonium chloride, stearyl trimethylammonium chloride, etc. Among these, from the viewpoint of forming an electroless plating film having excellent plating deposition properties and patternability on a metal material, cationic polymers are preferred, and diallyldimethylammonium chloride / sulfur dioxide copolymers, methyldiallylamine hydrochloride polymers, diallyldimethylammonium chloride polymers, allylamine hydrochloride / diallylamine hydrochloride polymers, allylamine hydrochloride polymers, and allylamine polymers are more preferred.

[0031] Specific examples of the (A) cationic compound include compounds represented by the following general formula:

[0032] [ka] TIFF2025074825000002.tif114159 [In the formula, n represents an integer of 10 to 1500, l represents an integer of 1 or more, and m represents an integer of 2 or more. The upper limits of the numerical ranges of l and m are not particularly limited as long as they do not conflict with the numerical range of the preferred weight average molecular weight of the cationic polymer described below. In addition, R represents an alkyl group having 8 to 18 carbon atoms.]

[0033] The molecular weight of the (A) cationic compound is not particularly limited. When the (A) cationic compound is a cationic polymer, the weight average molecular weight is preferably 1,000 to 1,000,000.

[0034] The (A) cationic compound can be used alone or in combination of two or more kinds.

[0035] The content of the (A) cationic compound in the catalyst imparting solution of the present invention is not particularly limited. The content of the (A) cationic compound is preferably 0.01 to 10,000 mg / L, more preferably 0.1 to 5,000 mg / L, and even more preferably 1 to 1,000 mg / L, from the viewpoint of forming an electroless plating film with excellent plating deposition property and patternability on a metal material. When the content is within the above range, foaming of the plating solution can be suppressed, and the production cost can also be reduced.

[0036] (B) Metal catalyst The metal contained in the (B) metal catalyst is not particularly limited as long as it can catalyze electroless plating. Examples of the metal contained in the (B) metal catalyst include transition metals, more specifically, Pd, Cu, Au, Ag, Pt, etc. Among these, Pd is preferred from the viewpoint of forming an electroless plating film with excellent plating deposition properties and patternability on metal materials.

[0037] The (B) metal catalyst may be used alone or in combination of two or more kinds.

[0038] The content of the (B) metal catalyst in the catalyst imparting solution of the present invention is not particularly limited. The content of the (B) metal catalyst is preferably 0.01 to 1000 mg / L, more preferably 0.05 to 500 mg / L, and even more preferably 0.1 to 100 mg / L, from the viewpoint of forming an electroless plating film with excellent plating deposition properties and patternability on a metal material. According to the catalyst imparting solution of the present invention, even when the amount of the metal catalyst used is small (for example, the content in the catalyst imparting solution is 20 mg / L or less), an electroless plating film with excellent plating deposition properties and patternability on a metal material can be formed, so that the cost of forming the electroless plating film can be reduced.

[0039] (C) Acid The catalyst imparting solution of the present invention is preferably acidic. By the catalyst imparting solution of the present invention being acidic, the cationicity of the (A) cationic compound can be more effectively utilized, specifically, the (B) metal catalyst can be inhibited from being adsorbed on an insulating material, so that an electroless plating film having excellent plating deposition properties and patternability on a metal material can be easily formed. In this specification, being acidic means that the pH is less than 7, and preferably means that the pH is 6.9 or less or 6.8 or less.

[0040] The pH of the catalyst imparting solution of the present invention is not particularly limited, but from the viewpoint of forming an electroless plating film having excellent plating deposition properties and patternability on a metal material, it is preferably 5 or less, more preferably 3 or less, and even more preferably 1 or less.

[0041] From the viewpoint of making the catalyst-imparting liquid of the present invention acidic as described above, the catalyst-imparting liquid of the present invention may contain, in addition to the (A) cationic compound and the (B) metal catalyst, (C) at least one acid selected from the group consisting of organic acids and inorganic acids (also referred to simply as "(C) acid" in this specification). By containing the (C) acid, the catalyst-imparting liquid of the present invention can effectively utilize the cationic property of the (A) cationic compound, specifically, can suppress the (B) metal catalyst from being adsorbed onto the insulating region, and therefore can easily form an electroless plating film having excellent plating deposition properties and patternability on the metal material.

[0042] The (C) acid is not particularly limited as long as it is soluble in the catalyst imparting solution.Specific examples of the (C) acid include acetic acid, formic acid, malonic acid, succinic acid, adipic acid, maleic acid, fumaric acid, glycolic acid, lactic acid, malic acid, citric acid, gluconic acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, methanesulfonic acid, glutamic acid, aspartic acid, and boric acid.Among these, glycolic acid, sulfuric acid, hydrochloric acid, and methanesulfonic acid are preferred from the viewpoint of forming an electroless plating film having excellent plating deposition properties and patternability on metal materials.

[0043] The (C) acids can be used alone or in combination of two or more.

[0044] When the (C) acid is contained, the content thereof is not particularly limited as long as it is within the above pH range.

[0045] (D) Chloride The catalyst imparting solution of the present invention may contain (D) chloride in addition to the above compounds. Usually, when a metal material is immersed in the catalyst imparting solution for a long time, corrosion due to the metal catalyst may occur. However, when the catalyst imparting solution of the present invention contains (D) chloride, it is possible to form an electroless plating film having excellent plating deposition properties and patternability on the metal material while further suppressing the corrosion of the metal material in the treatment process. Furthermore, when a catalyst imparting solution containing (D) chloride is used, the patternability of the electroless plating film on the metal material can be further improved compared to when no (D) chloride is used.

[0046] The (D) chloride is not particularly limited as long as it is soluble in the catalyst imparting solution. Examples of the (D) chloride include potassium chloride, sodium chloride, ammonium chloride, calcium chloride, magnesium chloride, lithium chloride, trichloroacetaldehyde, and chlorine dioxide. Among these, sodium chloride, potassium chloride, and ammonium chloride are preferred from the viewpoint of forming an electroless plating film having excellent plating deposition properties and patternability on a metal material.

[0047] (D) The chlorides can be used alone or in combination of two or more.

[0048] (D) When chloride is contained, its content is not particularly limited, but is preferably 0.01 to 200 g / L, more preferably 1 to 100 g / L, and even more preferably 3 to 50 g / L. If the chloride content is too high, the metal material itself becomes easily dissolved, which accelerates the progress of corrosion, or chloride is formed on the metal material, which hinders the substitution reaction of the metal catalyst. If the chloride content is too low, the chloride ions in the catalyst-imparting solution are insufficient, making it difficult to sufficiently suppress the corrosion of the metal material.

[0049] The catalyst imparting liquid of the present invention preferably contains water as a solvent. The catalyst imparting liquid of the present invention may also contain a solvent other than water. The solvent other than water that can be contained in the catalyst imparting liquid of the present invention is not particularly limited as long as it does not impair the effects of the present invention, and examples thereof include alcohols such as methanol, ethanol, isopropanol, isobutanol, sec-butanol, tert-butanol, ethylene glycol, and glycerin; ethers such as ethylene glycol dimethyl ether, 1,4-dioxane, and tetrahydrofuran; and ketones such as acetone and methyl ethyl ketone. When a solvent other than water is contained, its content is not particularly limited, but is preferably 5% by mass or less, and more preferably 0.5% by mass or less, relative to 100% by mass of the solvent. By setting the upper limit of the content of the solvent other than water within the above range, the decrease in the effect of the cationic compound due to the hydrophobicity of the solvent is further suppressed.

[0050] The catalyst imparting solution of the present invention may further contain various additives as necessary, such as a stabilizer, a pH buffer, a surfactant, etc.

[0051] As the stabilizer, for example, lead salts such as lead nitrate and lead acetate, bismuth salts such as bismuth nitrate and bismuth acetate, sulfur compounds such as sodium thiosulfate, etc. can be added alone or in combination of two or more kinds. When a stabilizer is added, the amount of the stabilizer added is not particularly limited, but can be, for example, about 0.01 to 100 mg / L.

[0052] As the pH buffer, for example, acetic acid, boric acid, phosphoric acid, phosphorous acid, carbonic acid, citric acid, phthalic acid, oxalic acid, their sodium salts, potassium salts, ammonium salts, etc. can be added alone or in combination of two or more. When a pH buffer is added, the amount added is not particularly limited, but from the viewpoint of bath stability, etc., it can be about 0.002 to 1 mol / L.

[0053] As the surfactant, in addition to the cationic surfactant, various surfactants such as nonionic, anionic, amphoteric, etc. can be used. For example, aromatic or aliphatic sulfonic acid alkali salt, aromatic or aliphatic carboxylic acid alkali metal salt, etc. can be mentioned. The surfactant can be used alone or in combination of two or more. When adding a surfactant, the amount of addition is not particularly limited, but can be, for example, about 0.01 to 1000 mg / L.

[0054] 2. Catalyst application method In one aspect, the present invention relates to (1) a method for producing a material to be electrolessly plated that contains catalytic nuclei, or a method for subjecting a material to be electrolessly plated to a catalyst imparting treatment, comprising a step of contacting a catalyst imparting solution of the present invention with an object to be plated (also referred to as "method 1 of the present invention" in this specification). This will be described below.

[0055] The object to be plated is not particularly limited as long as it is a material with metal exposed on the surface. For example, the material may be one or a combination of materials such as glass fiber reinforced epoxy, polyimide, plastics such as PET, glass, ceramic, metal oxide, metal, paper, synthetic or natural fiber, and the shape of the material may be any of a plate, a film, a cloth, a fiber, a tube, etc.

[0056] Specific examples of objects to be plated include printed wiring boards, semiconductor packages, electronic components, ceramic substrates, etc. In these materials, metal exposed on the surface can form wiring.

[0057] Examples of metals exposed on the surface include copper, copper alloys, nickel, nickel alloys, silver, silver alloys, gold, gold alloys, platinum, platinum alloys, molybdenum, tungsten, etc. Among these, the copper alloys, silver alloys, gold alloys, and platinum alloys can be applied to alloys containing, for example, 50 mass% or more of copper, nickel, silver, gold, or platinum, respectively.

[0058] As described above, the object to be plated preferably has an insulating region and a conductive region on its surface. In this case, by the method 1 of the present invention, the (A) cationic compound is preliminarily adsorbed on the insulating region, and a part or all of the (B) metal catalyst used is efficiently adsorbed on the conductive region. That is, by the method 1 of the present invention, a catalytic nucleus containing the (B) metal catalyst is efficiently formed on the conductive region (particularly the surface metal) of the object to be plated. Therefore, according to the method 1 of the present invention, in the subsequent electroless plating process, it is easy to form an electroless plating film with excellent patternability while ensuring plating deposition on the metal material.

[0059] By the method 1 of the present invention, it is possible to obtain a material to which such a catalyst is applied, specifically, a base material having an insulating region and a conductive region on its surface, and a material (substrate) having a metal catalyst 1 on the conductive region and suppressing adhesion of the metal catalyst 1 to the insulating region. By subjecting an object to be plated, which is a material to which such a catalyst is applied, to electroless plating treatment, it is possible to form an electroless plating film having better plating deposition properties and patternability (selective deposition properties). The catalyst core containing the metal catalyst is intended for surface activation, and therefore its thickness can be, for example, 0.05 μm or less, 0.005 to 0.05 μm.

[0060] The object to be plated is preferably subjected to pretreatment such as degreasing and soft etching.

[0061] The specific method for bringing the catalyst imparting solution of the present invention into contact with the object to be plated is not particularly limited, but usually, the object to be plated may be immersed in the catalyst imparting solution of the present invention. Alternatively, the catalyst imparting treatment may be performed by applying or spraying the catalyst imparting solution onto the surface of the object to be plated.

[0062] When the catalyst imparting solution of the present invention is used by the immersion method, the liquid temperature of the catalyst imparting solution of the present invention is usually preferably about 10 to 90°C, more preferably about 20 to 40°C, and even more preferably 25 to 35°C.

[0063] The treatment time is preferably about 10 seconds to 20 minutes, more preferably about 30 seconds to 5 minutes, and even more preferably 1 minute to 3 minutes.

[0064] 3. Electroless plating method In one aspect, the present invention relates to a method for producing a material including an electroless plating film, or a method for electroless plating an object to be plated (sometimes referred to as "Method 2 of the present invention" in this specification), which comprises the steps of (1) contacting an object to be plated with the catalyst imparting solution of the present invention, and (2) carrying out an electroless plating treatment, in that order. This will be described below.

[0065] Step (1) is as described above in "2. Method for providing catalyst."

[0066] (2) The electroless plating process in the electroless plating process can be carried out by contacting the material (object to be plated) to which the catalyst has been applied obtained in step (1) with an electroless plating solution.

[0067] Before the electroless plating treatment, the cationic compound (A) on the object to be plated may be partially or entirely removed by a normal water washing treatment.

[0068] The electroless plating solution is not particularly limited, and an autocatalytic electroless plating solution can be used. For example, an electroless palladium plating solution, an electroless palladium alloy plating solution, an electroless copper plating solution, an electroless copper alloy plating solution, an electroless nickel plating solution, an electroless nickel alloy plating solution, an electroless silver plating solution, an electroless silver alloy plating solution, an electroless gold plating solution, an electroless gold alloy plating solution, etc. can be used. The specific composition of these electroless plating solutions is not particularly limited, and an autocatalytic electroless plating solution having a known composition containing a reducing agent component can be used. The plating conditions can also be in accordance with normal plating conditions depending on the type of plating solution used.

[0069] In step (2) of the method 2 of the present invention, suitable electroless plating solutions include electroless palladium plating solution, electroless palladium alloy plating solution, electroless nickel plating solution, electroless nickel alloy plating solution, electroless silver plating solution, electroless silver alloy plating, electroless gold plating solution, and electroless gold alloy plating solution. When electroless nickel plating solution or electroless nickel alloy plating solution is used in step (2), it is preferable to further perform electroless silver plating, electroless silver alloy plating, electroless gold plating, or electroless gold alloy plating. When electroless nickel plating solution or electroless nickel alloy plating solution is used in step (2), it is preferable to further perform electroless palladium plating or electroless palladium alloy plating, and more preferably to further perform electroless gold plating or electroless gold alloy plating following this. When electroless palladium plating solution or electroless palladium alloy plating solution is used in step (2), it is preferable to further perform electroless gold plating or electroless gold alloy plating. It is also possible to use only an electroless palladium plating solution, an electroless palladium alloy plating solution, an electroless nickel plating solution, an electroless nickel alloy plating solution, an electroless silver plating solution, an electroless silver alloy plating solution, an electroless gold plating solution, or an electroless gold alloy plating solution in step (2).

[0070] According to the method 2 of the present invention, an electroless plating film having better plating deposition properties and patterning properties (selective deposition properties) can be formed. According to the method 2 of the present invention, a material having such an electroless plating film, specifically, a material (substrate) having a base material having an insulating region and a conductive region on its surface, a metal catalyst 1 on the conductive region, and a film 2 on the metal catalyst 1, in which formation of the metal catalyst 1 and / or the film 2 on the insulating region is suppressed, can be obtained. EXAMPLES

[0071] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0072] (Preparation of catalyst imparting solution) The raw materials shown in Table 1 were added in the order shown in Table 1 to water as a solvent, to prepare 500 mL of a catalyst-imparting solution for each of the Examples and Comparative Examples.

[0073] (Evaluation test) In the following evaluation tests, the plated object was pretreated (acid degreasing, soft etching), and then catalytic nuclei were formed on the metal surface using the catalyst imparting solution prepared above, followed by electroless nickel plating or electroless palladium plating, and finally electroless gold plating, in that order. Details of each treatment are as follows unless otherwise specified. Between each process, a 1-minute rinse with running water was performed.

[0074] (a) Acid degreasing The plate was immersed in an acidic degreasing solution (trade name: ICP Clean S-135K) containing sulfuric acid and a surfactant at 40° C. for 5 minutes.

[0075] (b) Soft etching The sample was immersed in an aqueous solution containing 100 g / L sodium persulfate and 10 mL / L 98% sulfuric acid at room temperature for 1 minute.

[0076] (c) Catalyst addition treatment The catalyst-imparting liquid was immersed under the conditions shown in Table 1. Specifically, the pH was 1 or less in Examples 1 to 41 and Comparative Examples 1 to 5, and 6.8 in Examples 42 to 48 and Comparative Example 6. The immersion time was 1 minute in Examples 1 to 34 and Comparative Examples 1 to 4, and 3 minutes in Examples 35 to 48 and Comparative Examples 5 and 6. The treatment temperature was 30°C in all catalyst-imparting liquids.

[0077] (d-1) Electroless nickel plating The plate was immersed in an electroless nickel plating solution (trade name: ICP Nicoron FPF, manufactured by Okuno Chemical Industries Co., Ltd.) at 84° C. for 25 minutes to obtain a plating film having a thickness of 4 μm.

[0078] (d-2) Electroless palladium plating The plate was immersed in an electroless palladium plating solution (trade name: Top Pallas PD, manufactured by Okuno Chemical Industries Co., Ltd.) at 65° C. for 5 minutes to obtain a plating film having a thickness of 0.1 μm.

[0079] (e) Electroless gold plating The plated film was immersed in an electroless gold plating solution (trade name: Top Pallas AU, manufactured by Okuno Chemical Industries Co., Ltd.) at 80° C. for 1 minute to obtain a plating film having a thickness of 0.05 μm.

[0080] Test Example 1: Evaluation of plating deposition properties A BGA resin substrate having overresist type micro copper pads (φ60-130μm, 30 pads) on a resin base material was prepared as the object to be plated. Electroless plating was applied to the BGA resin substrate using the above-mentioned processing steps. The micro pads after electroless plating were observed under a microscope (300x) to check the deposition state of the electroless plating. Evaluation was made according to the following evaluation criteria. ◯: No unprecipitated matter △: A small amount of unprecipitated material was observed. ×: A large amount of unprecipitated material was generated.

[0081] Test Example 2: Evaluation of Pattern A BGA resin substrate having fine wiring (L / S=50 / 50μm) on a resin base material was prepared as the object to be plated. The BGA resin substrate was subjected to electroless plating by the above-mentioned processing steps. The wiring pattern portion of L / S=50 / 50μm after electroless plating was observed under a microscope (1000x) to check whether the electroless plating had spread. Evaluation was made according to the following evaluation criteria. ○: No plating spread at all △: Slight plating spread was observed ×: A large amount of plating spread occurred

[0082] The results are shown in Tables 1 to 7.

[0083] [Table 1]

[0084] [Table 2]

[0085]

Table 3

[0086]

Table 4

[0087]

Table 5

[0088]

Table 6

[0089]

Table 7

Claims

1. (A) at least one cationic compound selected from the group consisting of a cationic polymer and a cationic surfactant, and (B) Metal catalyst A catalyst imparting solution for electroless plating comprising:

2. The catalyst imparting liquid according to claim 1, wherein the (A) cationic compound includes at least one selected from the group consisting of polyethyleneimine, diallyldimethylammonium chloride sulfur dioxide copolymer, methyldiallylamine hydrochloride polymer, diallyldimethylammonium chloride polymer, dicyandiamide-polyalkylenepolyamine polycondensate, allylamine hydrochloride-diallylamine hydrochloride polymer, allylamine hydrochloride polymer, allylamine polymer, O-[2-hydroxy-3-(trimethylammonio)propyl]hydroxyethylcellulose chloride, polylysine, cationized guar gum, coconut amine acetate, tetradecylamine acetate, octadecylamine acetate, didecyldimethylammonium chloride, coconut alkyltrimethylammonium chloride, hexadecyltrimethylammonium chloride, and stearyltrimethylammonium chloride.

3. 2. The catalyst imparting solution according to claim 1, wherein the content of the cationic compound (A) is 0.01 to 10,000 mg / L.

4. The catalyst imparting solution according to claim 1 , wherein the metal catalyst (B) contains Pd.

5. 2. The catalyst imparting solution according to claim 1, wherein the content of the metal catalyst (B) is 0.01 to 1000 mg / L.

6. The catalyst imparting solution according to claim 1, which is acidic.

7. The catalyst imparting solution according to claim 6, having a pH of 5 or less.

8. The catalyst-imparting liquid according to claim 1 , further comprising (C) at least one acid selected from the group consisting of organic acids and inorganic acids.

9. 9. The catalyst imparting solution according to claim 8, wherein the acid (C) includes at least one selected from the group consisting of acetic acid, formic acid, malonic acid, succinic acid, adipic acid, maleic acid, fumaric acid, glycolic acid, lactic acid, malic acid, citric acid, gluconic acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, hydrofluoric acid, methanesulfonic acid, glutamic acid, aspartic acid, and boric acid.

10. The catalyst imparting solution according to claim 1 , further comprising (D) a chloride.

11. The catalyst-imparting solution according to claim 10, wherein the (D) chloride comprises at least one selected from the group consisting of potassium chloride, sodium chloride, ammonium chloride, calcium chloride, magnesium chloride, lithium chloride, trichloroacetaldehyde, and chlorine dioxide.

12. The catalyst-imparting solution according to claim 10, wherein the content of the chloride (D) is 0.01 to 200 g / L.

13. 2. The catalyst imparting solution according to claim 1, wherein the electroless plating is at least one selected from the group consisting of electroless palladium plating, electroless palladium alloy plating, electroless nickel plating, electroless nickel alloy plating, electroless silver plating, electroless silver alloy plating, electroless gold plating, and electroless gold alloy plating.

14. The catalyst imparting solution according to claim 1 , wherein the electroless plating is performed on a substrate having an insulating region and a conductive region on a surface thereof.

15. (1) A method for applying a catalyst for electroless plating, comprising the step of contacting an object to be plated with the catalyst application liquid according to any one of claims 1 to 14.

16. (1) A step of contacting a substrate to be plated with the catalyst application liquid according to any one of claims 1 to 14; and (2) Electroless plating process The electroless plating method comprises, in order:

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