Foreign matter synthesized image generation device, foreign matter synthesized image generation method, and data structure

Abstract

To more easily generate a defect image with which it is possible to set inspection parameters efficiently.SOLUTION: Provided is a foreign matter synthesized image generation device for generating a foreign matter synthesized image in which a foreign matter image is synthesized to a substrate image in order to adjust the inspection parameter of an inspection program applied to inspection of the substrate for presence of foreign matter on the basis of substrate images. The generation device comprises: a basic information acquisition unit for acquiring a substrate image which is the image of a substrate, a foreign matter image which is the image of foreign matter, and foreign matter related information which is information related to the foreign matter image; and a synthesis unit for synthesizing the foreign matter image to a synthesis position of the substrate image that is determined according to prescribed rules, and generating the foreign matter synthesized image.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a foreign object composite image generating device, a foreign object composite image generating method, and a data structure. [Background technology]

[0002] Regarding board inspection equipment used to inspect the quality of the soldered components mounted on printed circuit boards (hereinafter simply referred to as "boards"), there is a growing need to be able to inspect the entire surface for foreign bodies in order to guarantee the quality of the entire board.

[0003] For this reason, a technique has been proposed in which the characteristics of a defect are transferred to an image of a non-defective product to generate a pseudo image of the defect (see, for example, Patent Document 1). In full-surface substrate foreign body inspection, the inspection range is the entire substrate, and it is not known where and what type of defect will occur. Therefore, determining where and what type of defect will be transferred to generate a pseudo-defect image is important in improving inspection quality. In this regard, the technology described in Patent Document 1 requires the user to explicitly specify the transfer coordinates of the defect, and therefore requires trial and error before generating a pseudo-failure image that improves the inspection quality. Even if the user manually generates a pseudo-failure image, it may not be a pseudo-failure image that improves the inspection quality. In other words, even if the inspection parameters are adjusted using the pseudo-failure image generated in this way, there is a possibility that overlooking or overlooking may occur. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-108855 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above problems, and has an object to provide a technique for more easily generating defective images for which inspection parameters can be set efficiently. [Means for solving the problem]

[0006] To solve the above problems, the present invention provides: 1. A foreign matter composite image generating device that generates a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to an inspection for the presence or absence of a foreign matter on the substrate based on an image of the substrate, comprising: a basic information acquisition unit that acquires a substrate image that is an image of the substrate, a foreign substance image that is an image of the foreign substance, and foreign substance-related information that is information related to the foreign substance image; a synthesis unit that synthesizes the foreign matter image at a synthesis position of the substrate image that is determined according to a predetermined rule to generate the foreign matter synthetic image; The present invention is characterized by comprising:

[0007] According to this, a foreign matter composite image, which is a defective image, can be generated by compositing a foreign matter image on the substrate image at a compositing position determined in accordance with predetermined rules suitable for adjusting the inspection parameters, thereby making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0008] In the present invention, The rule may be based on an index value including the presence or absence of an oversight in the inspection. .

[0009] This makes it possible to generate a foreign matter composite image by combining a foreign matter image at a combination position on the substrate where oversight is likely to occur, making it easier to generate defect images for which inspection parameters can be set efficiently.

[0010] In the present invention, The rule may be based on an index value including a difference between a measurement value of the foreign matter and the inspection parameter.

[0011] This makes it possible to generate a foreign object composite image in which a foreign object image is combined at a combination position that takes into account the ease of detecting the foreign object, making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0012] In the present invention, the rule is based on an index value including a difference between an average color of the foreign matter and a color at a position on the substrate image where the foreign matter image is to be combined; The synthesis unit may determine the synthesis position in ascending order of the difference.

[0013] This makes it possible to generate a foreign substance composite image in which a foreign substance image is combined at a combination position where a foreign substance is difficult to detect, making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0014] In the present invention, The synthesis position may be selectable from among the periphery of the land of the substrate, a resist, and an automatic setting.

[0015] According to this, in addition to the automatic setting that automatically determines the composite position, the composite position can be limited to a position where there is a high need for detection, such as the periphery of the land on the substrate or the resist, depending on the selection, thereby reducing the processing load when determining the composite position in advance.

[0016] In the present invention, a foreign substance image display area for displaying the foreign substance image in association with the foreign substance-related information; a composite content display area for displaying a composite position for each of the foreign substance images displayed in the foreign substance image display area and the number of the foreign substance images to be composited; The device may include a display unit that displays a confirmation screen including the above.

[0017] This allows the user to visually recognize the foreign object images used to generate the foreign object composite image through a display associated with foreign object-related information on the confirmation screen, and also allows the user to confirm the details of the composite including the composite position for each foreign object image and the number of foreign object images to be composited.

[0018] In the present invention, The basic information acquisition section may acquire the foreign substance image and the foreign substance-related information from a foreign substance library that stores the foreign substance image and the foreign substance-related information in association with each other.

[0019] According to this, the foreign substance images and foreign substance image related information used to generate the foreign substance composite image can be obtained from a foreign substance library prepared in advance, making it easier to generate defective images for which inspection parameters can be set efficiently.

[0020] In the present invention, A foreign object library may be provided.

[0021] The present invention also provides a method for producing a semiconductor device comprising the steps of: 1. A foreign matter composite image generating method for generating a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to inspect the presence or absence of a foreign matter on the substrate based on an image of the substrate, comprising: acquiring a substrate image, the substrate image being an image of the substrate; acquiring a foreign object image, which is an image of the foreign object; acquiring foreign substance-related information that is information related to the foreign substance image; a step of compositing the foreign substance image at a composition position of the substrate image determined according to a predetermined rule to generate the foreign substance composite image; Includes.

[0022] According to this, a foreign matter composite image, which is a defective image, can be generated by compositing a foreign matter image on the substrate image at a compositing position determined in accordance with predetermined rules suitable for adjusting the inspection parameters, thereby making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0023] The rule may be based on an index value including the presence or absence of a missed defect in the inspection.

[0024] This makes it possible to generate a foreign matter composite image by combining a foreign matter image at a combination position on the substrate where oversight is likely to occur, making it easier to generate defect images for which inspection parameters can be set efficiently.

[0025] In the present invention, The rule may be based on an index value including a difference between a measurement value of the foreign matter and the inspection parameter.

[0026] This makes it possible to generate a foreign object composite image in which a foreign object image is combined at a combination position that takes into account the ease of detecting the foreign object, making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0027] In the present invention, The rule may be based on an index value including a difference between the average color of the foreign matter and the color of the position on the substrate image where the foreign matter image is to be composited, and the composite position may be determined in order of the smallest difference.

[0028] This makes it possible to generate a foreign substance composite image in which a foreign substance image is combined at a combination position where a foreign substance is difficult to detect, making it easier to generate a defective image for which inspection parameters can be set efficiently.

[0029] In the present invention, The synthesis position may be selectable from among the periphery of the land of the substrate, a resist, and an automatic setting.

[0030] According to this, in addition to the automatic setting that automatically determines the composite position, the composite position can be limited to a position where there is a high need for detection, such as the periphery of the land on the substrate or the resist, depending on the selection, thereby reducing the processing load when determining the composite position in advance.

[0031] In the present invention, The foreign substance image and the foreign substance-related information may be acquired from a foreign substance library that stores the foreign substance image and the foreign substance-related information in association with each other.

[0032] According to this, the foreign substance images and foreign substance image related information used to generate the foreign substance composite image can be obtained from a foreign substance library prepared in advance, making it easier to generate defective images for which inspection parameters can be set efficiently.

[0033] The present invention also provides a method for producing a method for manufacturing a semiconductor device comprising the steps of: A foreign matter image which is an image of a foreign matter present on a substrate; foreign substance-related information including information related to the foreign substance image used to determine a synthesis position at which the foreign substance image is synthesized when a foreign substance synthesized image is generated by synthesizing the foreign substance image with an image of a substrate, the foreign substance-related information being used to adjust an inspection parameter of an inspection program applied to an inspection for the presence or absence of a foreign substance on the substrate based on the image of the substrate; and It is a data structure that associates

[0034] According to this, when generating a foreign object composite image, foreign object-related information including information related to the foreign object image used to determine a synthesis position for synthesizing the foreign object image with the substrate image is provided as a data structure associated with the foreign object image, thereby making it easier to generate a foreign object composite image, which is a defective image for which inspection parameters can be set efficiently. Effect of the Invention

[0035] According to the present invention, it is possible to more easily generate a defective image for which inspection parameters can be set efficiently. [Brief description of the drawings]

[0036] [Figure 1] FIG. 1 is a functional block diagram of an inspection system according to an embodiment of the present invention. [Diagram 2] 1 is an overall configuration diagram of a production line according to an embodiment of the present invention; [Diagram 3] FIG. 2 is a diagram showing a hardware configuration of an inspection device and the like according to an embodiment of the present invention. [Figure 4] 10 is a flowchart illustrating a procedure for a foreign substance defective composite image generation process according to an embodiment of the present invention. [Diagram 5] FIG. 13 is a diagram showing a display example of a basic image setting screen according to an embodiment of the present invention. [Figure 6] 13A and 13B are diagrams illustrating an example of a display of a defective-composite image generation preparation screen according to an embodiment of the present invention. [Figure 7] 13A and 13B are diagrams illustrating an example of a display of a defective-composite image generation preparation screen according to a modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] [Application example] Hereinafter, application examples of the present invention will be described with reference to the drawings. Fig. 1 is a functional block diagram of the inspection system 1. Fig. 2 is an overall configuration diagram of a production line 2 including the inspection system 1. Fig. 3 is a hardware configuration diagram of an inspection device 10 and the like. The production line 2 is a surface mounting line in which electronic components are soldered onto the surface of a printed circuit board, and includes a solder printing device X1, a mounter X2, a reflow furnace X3, a solder print inspection device Y1, a component inspection device Y2, an appearance inspection device Y3, an X-ray inspection device Y4, a management server 20, and a teaching terminal 30. Of these, the solder print inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4, as well as the management server 20 and the teaching terminal 30, constitute the inspection system 1. The inspection device 10 shown in FIG. 1 collectively refers to the solder print inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4.

[0038] In the inspection device 10, the image of the board is captured by the imaging unit 12, and the inspection unit 13 performs a predetermined inspection logic. The inspection device 10 judges pass / fail based on the captured image using an inspection program including a learning AI model (hereinafter, simply referred to as an "AI model"). The captured image is stored in the image storage unit 14, and the inspection result of pass / fail is stored in the inspection result storage unit 15 in association with the captured image. The inspection device 10 includes a control unit 11 that controls each unit in order to execute a predetermined inspection process.

[0039] The management server 20 includes a work information storage unit 21, an inspection parameter storage unit 22, a board image storage unit 23, an inspection result storage unit 24, a foreign substance image storage unit 25, a foreign substance image metadata storage unit 26, and a foreign substance library 27. The foreign substance image storage unit 25 stores images of areas including foreign substances (foreign substance images) cut out from images of boards that have been judged to be NG in the inspection and visual inspection by the inspection device 10. The foreign substance image metadata stored in the foreign substance image metadata storage unit 26 is information related to the foreign substance images, and is stored in association with the foreign substance images stored in the foreign substance image storage unit 25. The foreign substance image metadata includes the inspection time, the type of foreign substance (defect type), the position of the foreign substance (defect position), the process in which the foreign substance occurred, the place (base) where the extraction target board was produced, and the like. The defect types include, for example, solder balls, waste, chip flying, and component flying.

[0040] The work information storage unit 21 is a predetermined area of ​​the storage 20d that stores information such as lot, part number, and vendor related to the work such as the substrate to be inspected. The inspection parameter storage unit 22 is a predetermined area of ​​the storage 20d that stores parameters such as thresholds of the inspection logic used in each inspection device. The substrate image storage unit 23 is a predetermined area of ​​the storage 20d that stores images of the substrate captured by each inspection device. The inspection result storage unit 24 is a predetermined area of ​​the storage 20d that stores the inspection results of each inspection device. The foreign substance image storage unit 25 is a predetermined area of ​​the storage 20d that stores foreign substance images. The foreign substance image metadata storage unit 26 is a predetermined area of ​​the storage 20d that stores foreign substance image metadata, which is metadata related to the foreign substance images, in association with the foreign substance images. The foreign substance images and the foreign substance image metadata associated therewith constitute a foreign substance library 27.

[0041] The teaching terminal 30 is a device that allows a user to set parameters such as thresholds of a predetermined inspection logic used for inspection in the inspection device 10 and feature quantities of an AI model. The teaching terminal 30 has an inspection parameter adjustment unit 31 that adjusts the above-mentioned parameters, a transfer unit 32, and an image reading unit 33. The teaching terminal 30 also has an inspection unit 34 that performs inspection (test) on a model image using the currently set logic and thresholds.

[0042] FIG. 4 is a flowchart illustrating the procedure of the defective composition image generation process. First, foreign matter transfer settings are made for each substrate ID and field of view number (step S1). The substrate ID is identification information for identifying a substrate, and an image of one substrate is divided into multiple fields of view, and a field of view number is assigned to identify each field of view. Foreign matter images are stored in the foreign matter image storage unit 25 constituting the foreign matter library 27 of the management server 20, and are identified by the foreign matter ID.

[0043] Upon receiving an instruction from the user, transcription is started (step S2). Here, the foreign matter image is transferred by the processes of steps S6 to S10 for each substrate ID (steps S3 to S13), each field of view No. (steps S4 to S12), and each foreign matter ID (steps S5 to S11).

[0044] In step S6, the transfer unit 32 determines whether the defective transfer location is in the vicinity of the land, automatically, or in the resist, and the process branches depending on which of these the defective transfer location is. If the defective transfer location is in the vicinity of the land, the presence or absence of oversight at each coordinate in the range around the land and the degree of deviation are calculated (step S7). The difference between the measured value of the foreign object and the inspection parameter is the difference between the measured value of the foreign object and the inspection parameter.

[0045] When the defective transfer location is automatically detected, the presence or absence of oversight at each coordinate within the range of the entire surface of the substrate and the degree of deviation are calculated (step S8).

[0046] If the defective transfer portion is a resist, the presence or absence of an oversight at each coordinate within the range of the resist and the degree of deviation are calculated (step S9).

[0047] Then, the transfer positions are determined in descending order of the number of overlooked images or the smallest deviation, and a set number of foreign matter images are transferred (step S10).

[0048] After the above-mentioned processes from step S6 to step S10 have been performed for each substrate ID (step S3 to step S13), for each field of view No. (step S4 to step S12), and for each foreign object ID (step S5 to step S11), the generated result image is displayed on the output section 30f of the teaching terminal 30 for the user to confirm (step S14).

[0049] Then, the user judges whether the quality of the resulting image is OK or not (step S15). If it is judged that there is a problem with the quality of the resulting image (NG), the process returns to step S1, and if it is judged that there is no problem (OK), the process proceeds to step S15.

[0050] In step S16, the user adjusts the inspection parameters using the inspection parameter adjustment unit 31. The parameter adjustment may be performed, for example, by changing the value in the inspection parameter field 140 of the basic image setting screen 100 shown in Fig. 5 by operating the input unit 30e.

[0051] Then, the user executes a simulation test on the resultant image based on the adjusted inspection parameters (step S17).

[0052] The user determines whether the inspection parameters are optimal or not based on the results of the simulation test (step S18).

[0053] If the user determines that the inspection parameters are not optimal, the process returns to step S16 and the inspection parameters are adjusted again. If the user determines that the inspection parameters are optimal, the inspection parameters are applied to mass production inspection (step S19).

[0054] Then, mass production inspection is carried out based on the optimized inspection parameters (step S20). This makes it possible to easily generate a foreign substance defect image for which inspection parameters can be set efficiently.

[0055] Example 1 In the following, an inspection system 1 according to a first embodiment of the present invention will be described in more detail with reference to the drawings. However, the configurations of the device and system described in this embodiment should be appropriately modified depending on various conditions. In other words, it is not intended to limit the scope of the present invention to the following embodiment.

[0056] Fig. 1 is a functional block diagram of an inspection system 1. Fig. 2 is an overall configuration diagram of a production line 2 including the inspection system 1. Production line 2 is a surface mounting line that solders electronic components onto the surface of a printed circuit board, and mainly includes three processes: solder printing, component mounting, and reflow (solder deposition). The production line 2 includes manufacturing equipment such as a solder printing device X1, a mounter X2, and a reflow furnace X3, inspection equipment such as a solder printing inspection device Y1, a component inspection device Y2, an appearance inspection device Y3, and an X-ray inspection device Y4, a management server 20, and a teaching terminal 30. Of these, the solder printing inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4, the management server 20, and the teaching terminal 30 constitute an inspection system 1. The inspection device 10 shown in FIG. 1 collectively refers to the solder printing inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4, and actually corresponds to individual inspection devices such as the appearance inspection device Y3 or a combination of them.

[0057] The production line 2 is provided with a solder printing device X1, a mounter X2, and a reflow furnace X3 in this order from the upstream side. The solder printing device X1 is a device that prints solder paste on electrode portions (called lands) on a printed circuit board by screen printing. The mounter X2 is a device that picks up electronic components to be mounted on the board and places the components on the solder paste at the corresponding location, and is also called a chip mounter. The reflow furnace X3 is a heating device that heats and melts the solder paste, cools it, and solders the electronic components onto the board. When there are a large number and types of electronic components to be mounted on the board, multiple mounters X2 may be provided on the surface mounting line.

[0058] Also, on production line 2, an inspection system 1 is installed, which includes inspection equipment that inspects the condition of the board at the exit of each process from solder printing to component mounting to reflow and automatically detects defects or possible defects. In addition to automatically separating good and defective products, inspection system 1 also has a function of providing feedback to the operation of manufacturing equipment such as solder printing device X1 that constitutes production line 2 based on the inspection results and the analysis results (for example, changing the mounting program, etc.).

[0059] In the inspection system 1, a solder print inspection device Y1, a component inspection device Y2, a visual inspection device Y3, and an X-ray inspection device Y4 are provided in this order from the upstream side. The inspection device 10 shown in Fig. 1 collectively refers to a solder print inspection device Y1, a component inspection device Y2, an appearance inspection device Y3, and an X-ray inspection device Y4, and actually corresponds to an individual inspection device such as the appearance inspection device Y3 or a combination of them. Moreover, the inspection device 10 is not limited to the one included in the production line 2 illustrated in Fig. 2. Moreover, the inspection system 1 is further provided with a management server 20 and a teaching terminal 30, which will be described later.

[0060] The solder printing device X1, the mounter X2, the reflow furnace X3, the solder print inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, the X-ray inspection device Y4, the management server 20, and the teaching terminal 30 are communicatively connected via a network NW.

[0061] The solder print inspection device Y1 is a device for inspecting the printed state of the solder paste on the board carried out from the solder printing device X1. The following will be described with reference to the functional blocks of the inspection device 10 shown in FIG. 1. In the solder print inspection device Y1, the solder paste printed on the board is captured by an imaging unit 12 such as an image sensor (camera), and an inspection unit 13 judges the quality of the solder paste based on the captured image using an inspection program including a predetermined inspection logic and a trained AI model. The captured image is stored in an image storage unit 14, and the inspection result of quality is stored in an inspection result storage unit 15 in association with the captured image. The solder print inspection device Y1 includes a control unit 11 that controls each unit of the inspection device 10 in order to execute a predetermined inspection process.

[0062] The component inspection device Y2 is a device for inspecting the arrangement of electronic components on the board carried out from the mounter X2. The configuration of the functional parts in the component inspection device Y2 is similar to that of the solder print inspection device Y1, so a detailed description will be omitted.

[0063] The appearance inspection device Y3 is a device for inspecting the quality of soldering on the board carried out from the reflow furnace X3. The configuration of the functional parts in the appearance inspection device Y3 is similar to that of the solder print inspection device Y1, so a detailed description will be omitted.

[0064] The X-ray inspection device Y4 is a device for inspecting the state of soldering on a circuit board using X-ray images. The configuration of the functional parts in the X-ray inspection device Y4 is the same as that of the solder print inspection device Y1 except that X-rays are used for imaging, so a detailed description will be omitted.

[0065] 3 is a hardware configuration diagram of the inspection device 10. The inspection device 10 has the same configuration as a general computer (information processing device), and includes a CPU (Central Processing Unit) 10a, a ROM (Read Only Memory) 10b, a RAM (Random Access Memory) 10c, a storage 10d, an input unit 10e, an output unit 10f, and a communication interface 10g. Each component is connected to each other via a bus 10h so that they can communicate with each other. The management server 20 and the teaching terminal 30 also have the same hardware configuration as the inspection device 10, so the corresponding components of each device are shown in parentheses, and detailed explanations of each component are omitted.

[0066] The CPU 10a is a central processing unit, and executes various programs and controls each configuration to realize each of the above-mentioned functional units. That is, the CPU 10a reads a program from the ROM 10b or the storage 10d, and executes the program using the RAM 10c as a working area. The CPU 10a controls each configuration and performs various arithmetic processing according to the program recorded in the ROM 10b or the storage 10d. Here, the CPU 10a and the RAM 10c constitute the control unit 11. The ROM 10b stores various programs and various data. The RAM 10c temporarily stores programs or data as a working area. The storage 10d is composed of a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a flash memory, and stores various programs including an operating system and various data. The input unit 10e is, for example, a keyboard and / or a mouse, and is used to perform various inputs. The output unit 10f is, for example, a display, and displays a user interface. The output unit 10f may adopt a touch panel system to function as the input unit 10e. The communication interface 10g is an interface for communicating with other devices, and uses standards such as Ethernet (registered trademark), FDDI, or Wi-Fi (registered trademark).

[0067] The management server 20 is a computer device that manages the production line 2 including the inspection system 1. The management server 20 may be configured with one computer or multiple computers. Alternatively, all or part of the functions of the management server 20 may be implemented in a computer built into any of the devices such as the solder printing device X1 or the solder print inspection device Y1. Alternatively, part of the functions of the management server 20 may be realized by a server on a network (such as a cloud server).

[0068] The management server 20 includes a work information storage unit 21, an inspection parameter storage unit 22, a substrate image storage unit 23, an inspection result storage unit 24, a foreign substance image storage unit 25, a foreign substance image metadata storage unit 26, and a foreign substance library 27. Each of these storage units is configured by the storage 20d.

[0069] The work information storage unit 21 is a predetermined area of ​​the storage 20d that stores information such as lot, part number, vendor, etc., related to the workpieces such as the substrates to be inspected. The inspection parameter storage unit 22 is a predetermined area of ​​the storage 20d that stores parameters such as thresholds of the inspection logic used in each inspection device. The substrate image storage unit 23 is a predetermined area of ​​the storage 20d that stores images of the substrates captured by each inspection device. The inspection result storage unit 24 stores the inspection results of each inspection device. The foreign substance image storage unit 25 is a predetermined area of ​​the storage 20d that stores the foreign substance images. The foreign substance images may be images generated from images captured by each inspection device, or may be images prepared in advance. The foreign substance image metadata storage unit 26 is a predetermined area of ​​the storage 20d that stores foreign substance image metadata, which is metadata related to the foreign substance images, in association with the foreign substance images. The foreign substance images and the foreign substance image metadata associated therewith constitute a foreign substance library 27. The foreign substance image storage unit 25 stores images of areas containing foreign substances (foreign substance images) cut out from images of substrates that have been determined to be NG in the inspection and visual inspection by the inspection device 10. The foreign substance image metadata stored in the foreign substance image metadata storage unit 26 is information related to the foreign substance images, and is stored in association with the foreign substance images stored in the foreign substance image storage unit 25. The foreign substance image metadata includes, but is not limited to, the inspection time, the type of foreign substance (defect type), the position of the foreign substance (defect position), the process in which the foreign substance occurred, the place (base) where the extraction target board was produced, etc. Here, the defect type includes, but is not limited to, for example, solder balls, debris, chip flying, component flying, etc. Furthermore, the foreign substance image metadata may include information such as the conditions of the manufacturing device in which the foreign substance occurred and lot information of the extraction target board, which can be identified from the inspection time, in addition to the time. Here, the foreign substance image metadata corresponds to the foreign substance related information of the present invention. Furthermore, the foreign substance library 27 corresponds to the data structure of the present invention.

[0070] The teaching terminal 30 is a device for a user to set parameters such as thresholds of a predetermined inspection logic used in the inspection in the inspection device 10 and features of an AI model. The teaching terminal 30 has an inspection parameter adjustment unit 31 that adjusts the above-mentioned parameters, a transfer unit 32, and an image reading unit 33. The teaching terminal 30 also has an inspection unit 34 that performs an inspection (test) on a model image using the logic and thresholds currently set. The teaching terminal 30 may have a learning unit that trains an AI model so that the inspection device 10 can determine whether a printed circuit board is good or bad based on learning data in advance. Here, the image reading unit 33 corresponds to the basic information acquisition unit of the present invention. Also, the transfer unit 32 corresponds to the synthesis unit of the present invention. Here, the foreign object library 27 is provided in the management server 20, but may be provided in the teaching terminal 30.

[0071] FIG. 4 is a flowchart illustrating the procedure of the defective composition image generation process. First, a foreign matter transfer setting is performed for each substrate ID and field of view No. (Step S1) This process will be described below with reference to FIGS.

[0072] FIG. 5 shows a basic image setting screen 100 displayed on the output unit 30f of the teaching terminal 30. The basic image setting screen 100 displays an image 110 of a substrate to which a foreign object is to be transferred. A substrate ID list 120 is displayed in the upper center of the basic image setting screen 100. The substrate ID list 120 consists of a substrate ID column 120a and a storage date column 120b. The substrate ID column 120a displays a substrate ID such as 9001, 9002, etc. in each row. The storage date column 120b displays the date and time when the image of the substrate identified by the substrate ID was saved, such as 2022 / 11 / 11 11:22:33, 2022 / 11 / 11 11:23:34, etc. In this example, the row 120c of the substrate ID 9001 is displayed in a different display mode from the other rows, such as with a background color and white characters, indicating that the substrate ID 9001 is selected. In addition, since the boards with board IDs 9901 to 9007 are boards that were produced in the past, the storage date and time are displayed. Here, the teaching terminal 30 corresponds to the foreign object composite image generating device of the present invention, and the output unit 30f corresponds to the display unit of the present invention.

[0073] A simulation test result list 130 is displayed on the upper right side of the basic image setting screen 100. The simulation test result list 130 displays the simulation test results for each visual field number of the board specified by the selected board ID. The simulation test result list 130 is made up of a visual field No. column 130a, a number of missed images column 130b, a number of detections column 130c, and a number of missed images column 130d. In the visual field No. column 130a, visual field Nos. such as 1, 2, etc. are displayed in each row. In the number of missed images column 130b, the number of detections column 130c, and the number of missed images column 130d, the number of missed images, the number of detected images, and the number of missed images are displayed, respectively, in the simulation test results for the image of the visual field No. displayed in the leftmost visual field No. column 130a. Here, the number of missed images is 2, the number of detections is 0, and the number of missed images is 0 as the simulation test results for the image of visual field No. 1, and the number of missed images is 3, the number of detections is 0, and the number of missed images is 0 as the simulation test results for the image of visual field No. 2, respectively, and the rows for visual fields Nos. 3 to 7 also display the simulation test results. Here, the row 130e of the visual field No. 1 is displayed in a different display mode from the other rows, for example, with a background color and white characters, thereby indicating that the visual field No. 1 has been selected.

[0074] An inspection parameter field 140 is displayed in the center of the bottom of the basic image setting screen 100. The top of the inspection parameter field 140 displays "inspection standard," and below that, a check box 140a for "full surface foreign body inspection" is checked, indicating that full surface foreign body inspection is set. Also, below that, each inspection parameter 140b is displayed. Here, it is shown that the inspection parameters are set as follows: color height logical formula: color OR height, area (mm2): 0.1, area ratio (%), long / short axis ratio (%): 60, height standard (mm): 0.01, and color margin: 3. Of these, area, area ratio, long / short axis ratio, and height are physical quantities, and color margin is an inspection parameter related to color.

[0075] A simulation test button 150 and a composite defective image generation button 160 are displayed on the lower right side of the basic image setting screen 100. When a user operates the input unit 30e to press the simulation test button 150, a simulation test is executed in the inspection unit 34. When a user operates the input unit 30e to press the composite defective image generation button 160, the image reading unit 33 reads out the foreign substance image from the foreign substance library 27 as described below, and the transfer unit 32 transfers the foreign substance image onto the image of the selected field of view No. Here, the substrate ID and field of view No. used for transferring the foreign substance image are selected manually, but they may be selected automatically.

[0076] When the user presses the defective composition image generation button 160, the display on the output section 30f of the teaching terminal 30 transitions to a defective composition image generation preparation screen 200 shown in FIG.

[0077] A foreign object image field 210 is displayed at the top of the composite defect image generation preparation screen 200. An item row 211 labeled "defect type" is displayed at the top of the foreign object image field 210, and the lower part of the item row 211 is divided into multiple columns, and from the left, a solder ball field 212, a rubbish field 213, a chip skip field 214, and a component skip field 215 are arranged. The defect types are solder balls, rubbish, chip skip, and component skip. In the solder ball field 212, solder ball images 212a, 212b, and 212c are displayed from the top, with ID:1, ID:5, and ID:9, respectively, given as identification numbers. Similarly, in the rubbish field 213, rubbish images 213a, 213b, and 213c are displayed from the top, with ID:2, ID:6, and ID:10 given as identification numbers. Similarly, in the chip skip field 214, chip skip images 214a, 214b, and 214c with identification numbers ID:3, ID:7, and ID:11 are displayed in order from the top. Similarly, in the component skip field 215, component skip images 215a, 215b, and 215c with identification numbers ID:4, ID:8, and ID:12 are displayed in order from the top. Solder ball images 212a to 212c, dust images 213a to 213c, chip skip images 214a to 214c, and component skip images 215a to 215c displayed in the foreign object image field 210 are examples of foreign object images registered in the foreign object image storage unit 25. Here, the composite failure image generation preparation screen 200 corresponds to the confirmation screen of the present invention. The foreign object image field 210 corresponds to the foreign object image display area of ​​the present invention.

[0078] A board ID list 220 is displayed on the lower left side of the composite failure image generation preparation screen 200. In the board ID list 220, board IDs are written in each row, such as 9001, 9002, etc. Here, the row 221 of the board ID 9001 is displayed in a different display mode from the other rows, such as with a background color and with white characters, indicating that the board ID 9001 has been selected. A view No. list 230 is displayed on the right side of the board ID list 220. In the view No. list 230, view Nos. such as 1, 2, etc. are displayed in each row. Here, the row 231 of the view No. 1 is displayed in a different display mode from the other rows, such as with a background color and with white characters, indicating that the view No. 1 has been selected.

[0079] A foreign substance transfer list 240 is displayed in the center of the bottom of the composite defective image generation preparation screen 200. The foreign substance transfer list 240 is composed of a foreign substance ID column 241, a defective transfer location column 242, and a transfer number column 243. In the foreign substance ID column 241, a foreign substance ID is displayed in each row, such as 1, 2, etc. This foreign substance ID is an ID given to each foreign substance image in the foreign substance image column 210. In the defective transfer location column 242, the transfer position of the selected image (here, field of view No. 1 of substrate ID 9001) of the foreign substance displayed in the foreign substance ID column 241 at the left end is shown. Here, land periphery, resist, automatic, etc. are displayed in each row. Detailed settings of the transfer position will be described later. The display of this defective transfer location column 242 is set to automatic by default, and if a past occurrence location is registered in the foreign substance library 27, that location is displayed by default. In this way, by transferring to the location where the foreign object image registered in the foreign object library 27 occurs, it is possible to transfer to an area similar to a case that occurred in the past, and a realistic defective image can be generated. The user may operate the input unit 30e to select an appropriate location from a drop-down list. Also, the transfer position may be set for each defect mode (defect type) of the foreign object library 27. In this way, the transfer position can be set collectively. The transfer number column 243 displays the number of foreign objects displayed in the foreign object ID column 241 on the left end to be transferred to the position selected in the defect transfer location column 242 in the center of the selected image. Here, a numerical value such as 10 is displayed in each row. The display of this transfer number column 243 may be set by the user operating the input unit 30e by selecting an appropriate numerical value from a drop-down list, or the value of the transfer number may be held internally and set automatically. Also, when transferring the selected foreign object, the foreign object may be converted by changing its size or rotating it before being transferred. Here, the foreign object transfer list 240 corresponds to the composite content display area of ​​the present invention. The processing described above with reference to FIGS. 5 and 6 is carried out in step S1.

[0080] A generate button 250 is displayed on the lower right side of the composite defect image generation preparation screen 200. When the user operates the input unit 30e to press the generate button 250, a defect image of the substrate is generated in which the foreign substance image of the foreign substance ID selected in the foreign substance transfer list 240 is transferred to the selected location and in the selected number of positions on the images displayed in the substrate ID list 220 and the field of view No. list 230. When the transfer is completed, a new substrate ID is assigned and the substrate is added to the substrate ID list 120. Here, a substrate image to which the substrate ID 9008 in the substrate ID list 120 of FIG. 5 has been added in this manner is shown.

[0081] Returning to the explanation of the flowchart in Fig. 4, when the generate button 250 is pressed, transcription starts (step S2). Here, the foreign matter image is transferred by the processes of steps S6 to S10 for each substrate ID (steps S3 to S13), each field of view No. (steps S4 to S12), and each foreign matter ID (steps S5 to S11).

[0082] In step S6, the transfer unit 32 determines whether the defective transfer location is in the vicinity of the land, automatic, or resist. A determination is made, and the process branches depending on which of these the defective transcription portion is. If the defective transfer location is around the land, the presence or absence of oversight and the degree of deviation at each coordinate in the range around the land are calculated (step S7). Here, a foreign object is transferred onto the substrate around the land, a simulation test is performed on the generated image with the current inspection parameters in the inspection unit 34, the presence or absence of oversight and the degree of deviation are calculated, and the process moves to the next coordinate is performed comprehensively. Here, the degree of deviation is the difference between the measurement value of the foreign object registered in the foreign object library 27 and the inspection parameters. The measurement value of the foreign object refers to the area, height standard, etc. displayed in the inspection parameter column 140 in FIG. 5. In this way, by limiting the defective transfer location to the range around the land, the search processing time for the transfer position can be shortened, and a realistic defective image can be generated by transferring the foreign object to a possible location. Here, the presence or absence of oversight and the degree of deviation correspond to the index value of the present invention, and being based on these corresponds to the predetermined rule of the present invention.

[0083] If the defective transfer location is automatic, the presence or absence of oversight at each coordinate within the range of the entire substrate and the deviation are calculated (step S8). Here, foreign matter is transferred onto the entire substrate, a simulation test is performed on the generated image with the current inspection parameters in the inspection unit 34, the presence or absence of oversight and the deviation are calculated, and then the process proceeds to the next coordinate. The case where the defective transfer location is automatic corresponds to the automatic setting of the synthesis position of the present invention.

[0084] If the defective transfer location is the resist, the presence or absence of oversight and the degree of deviation at each coordinate within the resist range are calculated (step S9). Here, a foreign object is transferred to the resist, a simulation test is performed on the generated image with the current inspection parameters in the inspection unit 34, the presence or absence of oversight and the degree of deviation are calculated, and the process moves to the next coordinate. In this way, by limiting the defective transfer location to the resist range, the search processing time for the transfer position can be shortened, and a realistic defective image can be generated by transferring foreign objects to possible locations.

[0085] Then, the transfer positions are determined in descending order of the number of oversights or the smallest deviation, and a set number of foreign matter images are transferred to generate a poorly composed image (step S10). In this way, foreign matter can be transferred to locations with a high risk of being overlooked. Here, the poorly composed image corresponds to the foreign matter composite image of the present invention. Also, the transfer positions correspond to the composition positions of the present invention.

[0086] The method of determining the transfer position is not limited to the method of steps S7 to S10 described above, but may be to calculate the difference between the average color of the foreign matter and the color of the transfer candidate position, and determine the transfer position in ascending order of difference. Here, the transfer candidate position corresponds to the position where the foreign matter image of the present invention should be synthesized. Also, the difference between the average color of the foreign matter and the color of the transfer candidate position corresponds to the index value of the present invention, and being based on this corresponds to the predetermined rule of the present invention. At this time, the average color of the multiple substrates may be used as the color of the transfer candidate position. That is, the difference between the average color of the foreign matter and the average color of the multiple substrates is calculated, and the transfer position is determined in ascending order of difference. In this way, even if there is color variation depending on the substrate, the transfer position can be determined taking into consideration the true color of the substrate of that type. In this case, the average color of the foreign matter and the substrate with the average color of the transfer candidate positions of the multiple substrates correspond to the index value of the present invention, and being based on this corresponds to the predetermined rule of the present invention. Also, a position where the color variation among multiple substrates is large may be determined as the transfer position. Since it is difficult to detect an area where the components, resist color, and resist pattern position vary due to manufacturing, if the transfer position is determined as described above, a foreign matter composite image that is useful for adjusting the inspection parameters can be generated. In this case, the color variation among multiple substrates corresponds to the index value of the present invention, and being based on this corresponds to the predetermined rule of the present invention. Also, a position where the variation in height of a plurality of substrates is large may be determined as the transfer position. Since it is difficult to detect an area where there is a height measurement error or where the positions of components and resist patterns vary due to manufacturing, By determining the transfer position in this manner, it is possible to generate a foreign matter composite image that is useful for adjusting the inspection parameters. In this case, the variation in height of a plurality of substrates corresponds to the index value of the present invention, and being based on this corresponds to the predetermined rule of the present invention. In addition, the transfer position may be determined by combining at least two or more of the above-mentioned index values. For example, by combining an index value related to color and an index value related to height, the transfer position can be determined by comprehensively determining positions that are difficult to inspect.

[0087] After the above-mentioned processes from step S6 to step S10 have been performed for each substrate ID (step S3 to step S13), for each field of view No. (step S4 to step S12), and for each foreign object ID (step S5 to step S11), the generated result image is displayed on the output section 30f of the teaching terminal 30 for the user to confirm (step S14).

[0088] Then, the user judges whether the quality of the resultant image is OK or not (step S15). If it is judged that there is a problem with the quality of the resultant image (NG), the process returns to step S1, and if it is judged that there is no problem (OK), the process proceeds to step S15. Here, for example, an OK button and an NG button are displayed on the display screen of the resultant image of the output unit 30f of the teaching terminal 30, and the input of the user's judgment result is accepted.

[0089] In step S16, the user adjusts the inspection parameters using the inspection parameter adjustment unit 31. The parameter adjustment may be performed, for example, by changing the value in the inspection parameter field 140 of the basic image setting screen 100 shown in Fig. 5 by operating the input unit 30e.

[0090] The user then performs a simulation test on the resultant image based on the adjusted inspection parameters (step S17). Here, a new board ID is assigned to the board image (resultant image) generated by the processing of steps S1 to S13, and registered as board ID 9008 at the bottom of board ID list 120 on basic image setting screen 100 shown in Fig. 5. Therefore, the user can select board ID 9008 and press simulation test button 150 to perform a simulation test based on the adjusted inspection parameters.

[0091] The results of the simulation test are displayed in the visual field No. list 230 on the basic image setting screen 100 shown in Fig. 5. The user judges whether the inspection parameters are optimal or not based on the results of the simulation test (step S18). Here, for example, an OK button and an NG button are displayed on the display screen of the output unit 30f of the teaching terminal 30 to accept input of the user's judgment result.

[0092] If the user determines that the inspection parameters are not optimal, the process returns to step S16 to adjust the inspection parameters again, and if the user determines that the inspection parameters are optimal, the inspection parameters are applied to mass production inspection (step S19). Here, the adjusted inspection parameters are stored in the inspection parameter storage unit 22 of the management server 20, and are reflected in the inspection logic, etc., in the inspection unit 13 of the corresponding inspection device 10.

[0093] Then, mass production inspection is carried out based on the optimized inspection parameters (step S20). This makes it possible to easily generate a foreign substance defect image for which inspection parameters can be set efficiently.

[0094] [Modifications] FIG. 7 shows a display example of a defective composition image generation preparation screen 201 according to a modification of the first embodiment. For configurations common to Example 1, common reference numerals are used and detailed explanations are omitted.

[0095] In the first embodiment, as described with reference to the flowchart shown in Fig. 4, depending on whether the defective transfer location is around the land, automatic, or resist (step S6), the presence or absence of oversight at each coordinate and the degree of deviation are calculated (steps S7 to S9), and the transfer position is determined in order of the number of oversights or the smallest deviation degree (step S10). The method of determining the transfer position is not limited to this, and in this modified example, a foreign object image can be transferred to a random position in each location depending on whether the defective transfer location is around the land, automatic, or resist.

[0096] 7, the configurations of the foreign object image field 210, the substrate ID list 220, and the field of view No. list 230 are the same as those of the composite defective image generation preparation screen 200 according to the embodiment 1. The foreign object transfer list 240 of the composite defective image generation preparation screen 201 is different from that of the composite defective image generation preparation screen 200 according to the embodiment 1, and includes a condition field 244 in addition to a foreign object ID field 241, a defective transfer location field 242, and a transfer number field 243.

[0097] The condition column 244 indicates the conditions for determining the transfer position of the foreign object displayed in the foreign object ID column 241. Here, for foreign object IDs 1 to 10, it is displayed that the foreign object is transferred to a place with high detection difficulty such as a high number of oversights or a small deviation, as described in the first embodiment, and for foreign object IDs 11 and 12, it is displayed that the foreign object is transferred randomly. The display of this condition column 244 may be displayed as "Transfer to a place with high detection difficulty" by default, and the user may operate the input unit 30e to select "Transfer randomly". In addition, the conditions that can be selected as the conditions for determining the transfer position are not limited to these, and the user may select an appropriate condition from a drop-down list and display it in the condition column 244. In addition, the place with high detection difficulty is not limited to the place with high number of oversights or a small deviation as described above. Here, the order of the number of oversights or the order of the smallest deviation corresponds to the predetermined rule of the present invention, and the location with high detection difficulty also corresponds to the predetermined rule of the present invention. In addition, random also corresponds to the predetermined rule of the present invention.

[0098] In the following, the components of the present invention will be described with reference to the reference numerals in the drawings in order to make it possible to compare the components of the present invention with the configurations of the embodiments. <Appendix 1> A foreign matter composite image generating device (30) for generating a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to an inspection for the presence or absence of a foreign matter on the substrate based on an image of the substrate, a basic information acquisition unit (33) that acquires a substrate image that is an image of the substrate, a foreign substance image that is an image of the foreign substance, and foreign substance-related information that is information related to the foreign substance image; a synthesis unit (32) that synthesizes the foreign matter image at a synthesis position of the substrate image that is determined according to a predetermined rule to generate the foreign matter synthetic image; A foreign object composite image generating device (30) comprising: <Appendix 2> The foreign object composite image generating device (30) according to appendix 1, wherein the rule is based on an index value including the presence or absence of an oversight in the inspection. <Appendix 3> The foreign object composite image generating device (30) according to appendix 1 or 2, wherein the rule is based on an index value including a difference between a measurement value of the foreign object and the inspection parameter. <Appendix 4> the rule is based on an index value including a difference between an average color of the foreign matter and a color at a position on the substrate image where the foreign matter image is to be combined; The synthesis unit determines the synthesis position in ascending order of the difference. 4. A foreign object composite image generating device (30) according to any one of claims 3 to 3. <Appendix 5> 5. The foreign matter composite image generating device (30) according to any one of claims 1 to 4, wherein the composite position can be selected from the periphery of the land of the substrate, the resist, and an automatic setting. <Appendix 6> a foreign substance image display area (210) for displaying the foreign substance image in association with the foreign substance-related information; a composite content display area (240) for displaying a composite position for each of the foreign substance images displayed in the foreign substance image display area and the number of the foreign substance images to be composited; 6. A foreign object composite image generating device (30) according to any one of claims 1 to 5, comprising a display unit (30f) for displaying a confirmation screen (200) including the above. <Appendix 7> The foreign object composite image generating device (30) described in any one of appendix 1 to 6, wherein the basic information acquisition unit (33) acquires the foreign object image and the foreign object-related information from a foreign object library (27) that stores the foreign object image and the foreign object-related information in association with each other. <Appendix 8> A foreign object composite image generating device (30) according to appendix 7, comprising the foreign object library (27). <Appendix 9> 1. A foreign matter composite image generating method for generating a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to inspect the presence or absence of a foreign matter on the substrate based on an image of the substrate, comprising: acquiring a substrate image, the substrate image being an image of the substrate; acquiring a foreign object image, which is an image of the foreign object; acquiring foreign substance-related information that is information related to the foreign substance image; a step of compositing the foreign substance image at a composition position of the substrate image determined according to a predetermined rule to generate the foreign substance composite image; A method for generating a foreign object composite image comprising the steps of: <Appendix 10> The foreign object composite image generating method according to claim 9, wherein the rule is based on an index value including the presence or absence of an oversight in the inspection. <Appendix 11> 11. The foreign object composite image generating method according to claim 9 or 10, wherein the rule is based on an index value including a difference between the measurement value of the foreign object and the inspection parameter. <Appendix 12> The foreign matter composite image generating method according to any one of claims 9 to 11, characterized in that the rule is based on an index value including a difference between an average color of the foreign matter and a color of a position on the substrate image where the foreign matter image is to be composited, and the composite position is determined in ascending order of the difference. <Appendix 13> 13. The foreign object composite image generating method according to claim 9, wherein the synthesis position can be selected from the periphery of the land of the substrate, a resist, and an automatic setting. <Appendix 14> The foreign object composite image generating method according to any one of appendices 9 to 13, characterized in that the foreign object image and the foreign object-related information are acquired from a foreign object library (27) that stores the foreign object image and the foreign object-related information in association with each other. <Appendix 15> A foreign matter image which is an image of a foreign matter present on a substrate; A foreign matter composite image used for adjusting an inspection parameter of an inspection program applied to inspect the presence or absence of a foreign matter on the substrate based on the image of the substrate is generated by combining the foreign matter image with the image of the substrate. foreign substance-related information including information related to the foreign substance image used for determining a synthesis position for synthesizing the foreign substance image when synthesizing the foreign substance image and generating the foreign substance-related information; (27) A data structure that associates [Explanation of symbols]

[0099] 30: Teaching terminal 32: Transfer section 33: Image reading unit

Claims

1. 1. A foreign matter composite image generating device that generates a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to an inspection for the presence or absence of a foreign matter on the substrate based on an image of the substrate, comprising: a basic information acquisition unit that acquires a substrate image that is an image of the substrate, a foreign substance image that is an image of the foreign substance, and foreign substance-related information that is information related to the foreign substance image; a synthesis unit that synthesizes the foreign matter image at a synthesis position of the substrate image that is determined according to a predetermined rule to generate the foreign matter synthetic image; A foreign object composite image generating device comprising:

2. 2. The foreign object composite image generating apparatus according to claim 1, wherein the rule is based on an index value including the presence or absence of an oversight in the inspection.

3. 2. The foreign matter composite image generating apparatus according to claim 1, wherein the rule is based on an index value including a difference between a measurement value of the foreign matter and the inspection parameter.

4. the rule is based on an index value including a difference between an average color of the foreign matter and a color at a position on the substrate image where the foreign matter image is to be combined; 2. The foreign object composite image generating device according to claim 1, wherein the composition unit determines the composition position in ascending order of the difference.

5. 2. The foreign matter composite image generating device according to claim 1, wherein the composite position can be selected from among a periphery of a land of the substrate, a resist, and an automatic setting.

6. a foreign substance image display area for displaying the foreign substance image in association with the foreign substance-related information; a composite content display area for displaying a composite position for each of the foreign substance images displayed in the foreign substance image display area and the number of the foreign substance images to be composited; 2. The foreign object composite image generating device according to claim 1, further comprising a display unit for displaying a confirmation screen including the confirmation screen.

7. 2. The foreign substance composite image generating device according to claim 1, wherein the basic information acquisition unit acquires the foreign substance image and the foreign substance-related information from a foreign substance library that stores the foreign substance image and the foreign substance-related information in association with each other.

8. The foreign object composite image generating apparatus according to claim 7 , further comprising the foreign object library.

9. 1. A foreign matter composite image generating method for generating a foreign matter composite image by combining an image of a substrate with an image of a foreign matter, in order to adjust an inspection parameter of an inspection program applied to inspect the presence or absence of a foreign matter on the substrate based on an image of the substrate, comprising: acquiring a substrate image, the substrate image being an image of the substrate; acquiring a foreign object image, which is an image of the foreign object; acquiring foreign substance-related information that is information related to the foreign substance image; a step of compositing the foreign substance image at a composition position of the substrate image determined according to a predetermined rule to generate the foreign substance composite image; A method for generating a foreign object composite image comprising the steps of:

10. The method for generating a composite foreign object image according to claim 9 , wherein the rule is based on an index value including the presence or absence of an oversight in the inspection.

11. 10. The foreign matter composite image generating method according to claim 9, wherein the rule is based on an index value including a difference between a measurement value of the foreign matter and the inspection parameter.

12. The foreign matter composite image generating method according to claim 9, characterized in that the rule is based on an index value including a difference between an average color of the foreign matter and a color of a position on the substrate image where the foreign matter image is to be composited, and the composite position is determined in order of the smallest difference.

13. 10. The foreign matter composite image generating method according to claim 9, wherein the composite position can be selected from among a periphery of a land of the substrate, a resist, and an automatic setting.

14. 10. The foreign substance composite image generating method according to claim 9, wherein the foreign substance image and the foreign substance-related information are acquired from a foreign substance library in which the foreign substance image and the foreign substance-related information are stored in association with each other.

15. A foreign matter image which is an image of a foreign matter present on a substrate; foreign substance-related information including information related to the foreign substance image used to determine a synthesis position at which the foreign substance image is synthesized when a foreign substance synthesized image is generated by synthesizing the foreign substance image with an image of a substrate, the foreign substance-related information being used to adjust an inspection parameter of an inspection program applied to an inspection for the presence or absence of a foreign substance on the substrate based on the image of the substrate; and A data structure that associates

Images