Heat radiator and apparatus using the same

Abstract

To provide a heat radiator with an excellent heat absorption property without increasing the surface area or the volume of a heat absorption surface for no purposes.SOLUTION: In a first heat radiator 11, a first surface is a heat absorption surface 11b and a second surface is a heat release surface 11c in such a manner that tapered suction holes 21 are formed to become smaller in a direction from the first surface facing a rectangular body 11a to a position which is a predetermined distance L1 ahead of the second surface. A plurality of escape holes 22 are formed to penetrate the space between both side surfaces 11d, 11d as upper and lower surfaces and both side surfaces 11e, 11e as right and left surfaces, which lead to the suction hole 21 and intersect with the heat absorption surface 11b and the heat release surface 11c.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a heat dissipation device for discharging heat from a heat source disposed inside a housing to the outside of the housing and a device using the same.

Background Art

[0002] As a heat dissipation device for dissipating heat from a heat source, for example, a heat sink device disclosed in Patent Document 1 below is known. The heat sink device disclosed in Patent Document 1 has an axial flow fan provided directly above the heat sink. More specifically, a package to be heat-dissipated is attached to the substrate of the heat sink with rectangular pins, and an axial flow fan is provided directly above the pins of the heat sink.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the structure of the conventional heat dissipation device including Patent Document 1 described above, the heat scattered in the air cannot be effectively transmitted to the heat sink, and it is necessary to increase the surface area and volume of the heat absorption surface in order to improve the heat absorption performance.

[0005] Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a heat dissipation device having excellent heat absorption performance without unnecessarily increasing the surface area and volume of the heat absorption surface and a device using the same.

Means for Solving the Problems

[0006] In order to achieve the above object, the heat dissipation device according to claim 1 of the present invention forms a plurality of tapered suction holes 21 that gradually narrow toward a position before a predetermined distance L1 from one surface to the other surface of the rectangular main body 11a, so that the one surface is the heat absorption surface 11b and the other surface is the heat dissipation surface 11c. A plurality of escape holes 22 are formed so as to communicate with the suction holes and penetrate between at least one of both side surfaces orthogonal to the heat absorption surface and the heat dissipation surface.

[0007] The heat dissipation device according to claim 2 of the present invention is the heat dissipation device according to claim 1, wherein the plurality of escape holes 22 are formed in a plurality of stages in the thickness direction of the main body 11a.

[0008] The device using the heat dissipation device according to claim 3 of the present invention is a device 2 in which a heat source 3 is arranged inside a housing 2a and the housing is covered with a cover 2b, wherein the heat dissipation device according to claim 1 or 2 is arranged such that a part of one plane of the cover serves as a heat dissipation surface.

[0009] The device using the heat dissipation device according to claim 4 of the present invention is the device using the heat dissipation device according to claim 3, a first heat dissipation device 11 composed of the heat dissipation device according to claim 1 or 2, a fan 13 attached to the heat absorption surface 11b of the first heat dissipation device and sending the heat released from the heat source 3 to the heat absorption surface, and a second heat dissipation device 12 having a heat absorption surface 12a joined and attached to the heat dissipation surface 11c of the first heat dissipation device, protruding outside the cover 2b, and releasing the heat dissipated from the heat dissipation surface of the first heat dissipation device to the outside of the housing 2a.

Effect of the Invention

[0010] According to the present invention, heat dissipation with excellent heat absorption performance can be performed without wastefully increasing the surface area and volume of the heat absorption surface.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.

[0013] As shown in FIG. 1, the heat dissipation device 1 of the present embodiment releases the heat emitted from the heat source 3 disposed inside the housing 2a of the device 2 to the outside of the housing 2a, and includes a first heat dissipation device 11, a second heat dissipation device 12, and a fan 13. The device 2 has a housing 2a covered with a cover 2b, and the first heat dissipation device 11 is disposed inside the housing 2a such that a part of one plane of the cover 2b serves as a heat dissipation surface.

[0014] Note that the device 2 in the present embodiment is, for example, various inspection devices such as an X-ray inspection device, various measuring instruments, a terminal device (PC), etc. Further, the heat source 3 is, for example, a heat-generating component that generates heat such as an IC on a printed circuit board, various circuits, a motor, etc.

[0015] As shown in FIG. 3, in the first heat dissipation device 11 which is the main part of the present embodiment, a plurality of suction holes 21 are formed in a dot matrix (lattice) shape in a rectangular main body 11a made of a metal such as aluminum. As shown in FIGS. 3 and 4, the suction holes 21 are circular holes with openings arranged in a dot matrix (lattice) at a pitch of a constant interval H1 in the vertical and horizontal directions, and the suction holes 21 are formed in a tapered shape such that the diameter of the holes gradually decreases toward a position up to a predetermined distance (predetermined length) L1 in front of the other surface (the square surface on the back side in FIG. 3) 11b from one surface (the square surface on the front side in FIG. 3) 11b of the main body 11a facing each other.

[0016] Thereby, one surface 11b of the main body 11a functions as a heat absorption surface, and the other surface 11c functions as a heat dissipation surface. Hereinafter, the heat absorption surface will be denoted as 11b and the heat dissipation surface will be denoted as 11c for explanation. As shown in FIGS. 1 and 2, a fan 13 is attached to the heat absorption surface 11b, and a second heat dissipation device 12 is attached to the heat dissipation surface 11c.

[0017] When the heat released from the heat source 3 in the housing 2a is sucked by the fan 13, the suction holes 21 suck the sucked heat from the heat absorption surface 11b toward the flat heat dissipation surface 11c side. Further, a rectangular portion (a rectangular portion formed by the thickness of a predetermined distance L1 from the heat dissipation surface 11c toward the heat absorption surface 11b: base portion) up to a predetermined distance L1 from the heat dissipation surface 11c functions as a heat dissipation portion that dissipates the heat sucked from the suction holes 21 from the heat dissipation surface 11c toward the second heat dissipation device 12.

[0018] In addition, in the rectangular main body 11a of the first heat dissipation device 11, a vent hole 22 is formed for discharging a part of the heat sucked from the heat absorption surface 11b through the suction holes 21 to the outside of the main body 11a. The vent holes 22 shown in FIGS. 3 and 4 are composed of two-stage vent holes 22A and 22B arranged in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b. As shown in FIGS. 3 and 4, the two-stage vent holes 22A and 22B are formed so as to communicate with the suction holes 21 and penetrate between the upper and lower side surfaces 11d and 11d and between the left and right side surfaces 11e and 11e perpendicular to the heat absorption surface 11b and the heat dissipation surface 11c.

[0019] As shown in FIGS. 3 and 4, the first-stage escape holes 22A are composed of a pair of cylindrical holes arranged side by side, and communicate with the suction hole 21 at a position half the depth of the suction hole 21. The first-stage escape holes 22A are located on the front side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and are formed in a plurality of rows at a pitch of a constant interval H2 (= the pitch of the constant interval H1 of the suction holes 21) in the length direction between the upper and lower side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0020] As shown in FIGS. 3 and 4, the second-stage escape holes 22B are located on the center line C in the depth direction (thickness direction) between the two holes of the first-stage escape holes 22A, and are composed of one cylindrical hole having a larger diameter than the two holes of the first-stage escape holes 22A. As shown in FIGS. 4 and 5, the second-stage escape holes 22B communicate with the suction hole 21 at the tip position of the suction hole 21. The second-stage escape holes 22B are located on the rear side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and are formed in a plurality of rows at a pitch of a constant interval H3 (= the pitch of the constant interval H1 of the suction holes 21, the pitch of the constant interval H2 of the first-stage escape holes 22A) in the length direction between the upper and lower side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0021] When the heat from the heat source 3 is sucked from the suction hole 21 through the fan 13 and the heat absorption surface 11b, the escape holes 22 (22A, 22B) function as discharge ports for discharging a part of the sucked heat to the outside of the main body 11a, so that heat does not accumulate in the main body 11a.

[0022] In the present embodiment, the opening of the suction hole 21 is described as a tapered shape with a circle, but it is not limited to this shape. For example, the suction hole 21 can also be formed with a tapered shape of an ellipse, a polygon such as a triangle or a quadrilateral. Also, in the example of FIG. 3, the suction holes 21 are arranged in a dot matrix (lattice) shape, but they may be arranged in a staggered pattern, for example.

[0023] Further, as shown in FIG. 1, when the fan 13 is directly attached to the heat absorption surface 11b of the first heat dissipation device 11, since the wind force distribution of the fan 13 is stronger toward the outside, it is preferable to set the pitch of the suction holes 21 to be denser toward the outside so that the inside is coarser and the outside is denser.

[0024] Furthermore, the escape holes 22 are not limited to the two-stage configuration shown in FIGS. 3 and 4. In addition to the configuration with only the first-stage escape holes 22A, for example, the configurations shown in FIGS. 6(a) and (b) can also be adopted.

[0025] The escape holes 22 in FIG. 6(a) have a configuration in which the first stage and the second stage of the escape holes 22 in FIGS. 3 and 4 are reversed. That is, in the configuration of FIG. 6(a), the first-stage escape hole 22A consists of one cylindrical hole, and the second-stage escape hole 22B consists of a set of two cylindrical holes with a smaller diameter than the hole of the first-stage escape hole 22A.

[0026] More specifically, as shown in FIG. 6(a), the first-stage escape hole 22A consists of one cylindrical hole located on the center line C in the depth direction (thickness direction) between the two holes of the second-stage escape hole 22B, and communicates with the suction hole 21 at a position half the depth of the suction hole 21. The first-stage escape hole 22A is located on the front side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and a plurality of them are formed side by side at a pitch of a constant interval H2 (= the pitch of the constant interval H1 of the suction hole 21) in the length direction between the upper and lower side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0027] The second-stage escape hole 22B consists of a set of two cylindrical holes arranged side by side, is formed with a smaller diameter than the hole of the first-stage escape hole 22A, and communicates with the suction hole 21 at the tip position of the suction hole 21. The second-stage escape hole 22B is located on the back side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and a plurality of them are formed side by side at a pitch of a constant interval H3 (= the pitch of the constant interval H1 of the suction hole 21, the pitch of the constant interval H2 of the first-stage escape hole 22A) in the length direction between the side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0028] The through holes 22 in Fig. 6(b) are composed of three rows of through holes 22A, 22B, and 22C arranged in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b. In the configuration of Fig. 6(b), the first-row through holes 22A and the second-row through holes 22B are composed of a set of two cylindrical holes, and the third-row through hole 22C is composed of one cylindrical hole with a larger diameter than the holes of the first-row and second-row through holes 22A and 22B.

[0029] More specifically, as shown in Fig. 6(b), the first-row through holes 22A are composed of a set of two cylindrical holes arranged side by side, and communicate with the suction hole 21 at a position 1 / 3 of the depth of the suction hole 21. The first-row through holes 22A are located on the frontmost side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and a plurality of them are formed side by side at a pitch of a constant interval H3 (= the pitch of the constant interval H1 of the suction hole 21) in the length direction between the two side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0030] The second-row through holes 22B are composed of a set of two cylindrical holes arranged side by side, are formed with the same diameter as the first-row through holes 22A, and communicate with the suction hole 21 at a position 2 / 3 of the depth of the suction hole 21. The second-row through holes 22B are located on the back side of the first-row through holes 22A as viewed from the heat absorption surface 11b, and a plurality of them are formed side by side at a pitch of a constant interval H3 (= the pitch of the constant interval H1 of the suction hole 21, the pitch of the constant interval H2 of the first-row through holes 22A) in the length direction between the two side surfaces 11d, 11d of the main body 11a and in the width direction between the left and right side surfaces 11e, 11e.

[0031] As shown in Fig. 6(b), the third-stage through hole 22C is located on the center line C in the depth direction (thickness direction) between the two holes of the first-stage and second-stage through holes 22A and 22B, and consists of a single cylindrical hole with a larger diameter than the holes of the first-stage and second-stage through holes 22A and 22B, and communicates with the suction hole 21 at the tip position of the suction hole 21. The third-stage through hole 22C is located on the innermost side in the depth direction (thickness direction) of the main body 11a as viewed from the heat absorption surface 11b, and a plurality of them are formed side by side at a pitch of a constant interval H4 (= the pitch of the constant interval H1 of the suction hole 21, the pitches of the constant intervals H2 and H3 of the first-stage and second-stage through holes 22A and 22B) in the length direction between the upper and lower side surfaces 11d and 11d of the main body 11a and in the width direction between the left and right side surfaces 11e and 11e.

[0032] In the example of Fig. 3, the through hole 22 (see Fig. 5 for 22A and 22B) is formed so as to penetrate between the upper and lower side surfaces 11d and 11d and between the left and right side surfaces 11e and 11e of the main body 11a in a state of communicating with the suction hole 21, but it is not limited to this. That is, the through hole 22 may be formed in communication with the suction hole 21 so as to penetrate between the upper and lower side surfaces 11d and 11d or between the left and right side surfaces 11e and 11e of the main body 11a, including the configurations of Figs. 6(a) and (b).

[0033] Also, in the illustrated example, each hole of the through hole 22 has a cylindrical shape, but it is not limited to this. That is, the through hole 22 can be formed in a cylindrical shape of a polygon such as an ellipse, a triangle, or a quadrilateral according to the opening shape of the suction hole 21. Further, the pitch H1 of the suction hole 21 and the pitches H2, H3, and H4 of the holes of the through hole 22 (22A, 22B, 22C) are set at the same pitch and at equal intervals in the illustrated example, but it is not limited to this, and the shapes, pitches, opening diameters (φ diameters), and layouts of the suction hole 21 and the through hole 22 can be freely changed according to the required heat dissipation performance.

[0034] The second heat dissipation device 12 is a well-known heat dissipation device, and is provided to protrude outside the cover 2b with respect to one plane of the cover 2b of the housing 2a of the device 2. The second heat dissipation device 12 includes a rectangular metal substrate 12b having a flat heat absorption surface 12a that is joined and attached to the heat dissipation surface 11c of the first heat dissipation device 11, and a number of rectangular bar-shaped metal pins 12c that are erected on the opposite surface (outer surface) of the heat absorption surface of the substrate 12b. The second heat dissipation device 12 releases the heat dissipated from the heat dissipation surface 11c of the first heat dissipation device 11 to the outside of the housing 2a of the device 2 through the heat absorption surface 12a of the substrate 12b and the pins 12c.

[0035] The fan 13 is attached to the heat absorption surface 11b of the first heat dissipation device 11 by being screwed and fixed at, for example, four positions of up, down, left, and right. The fan 13 sucks the heat released from the heat source 3 disposed in the housing 2a and sends it to the heat absorption surface 11b side of the first heat dissipation device 11.

[0036] Thus, according to the present embodiment, a plurality of tapered suction holes 21 are formed at a position in front of the flat heat dissipation surface 11c by a predetermined distance L1 from the heat absorption surface 11b of the first heat dissipation device 11. Thereby, more heat in the housing 2a can be absorbed from the heat absorption surface 11b and sufficiently stored in the main body 11a, and the flow rate of the heat absorbed from the heat absorption surface 11b can be increased to improve the efficiency of heat transfer on the heat dissipation surface 11c side.

[0037] Further, a through hole 22 is formed to penetrate between both side surfaces (between upper and lower and / or left and right side surfaces) of the main body 11a in communication with the plurality of tapered suction holes 21 of the first heat dissipation device 11. Thereby, a part of the heat sucked from the plurality of tapered suction holes 21 is discharged to the outside from the main body 11a, and the heat can be efficiently transported to the entire heat dissipation surface 11c without heat being trapped in the main body 11a. Moreover, the heat absorption performance can be improved by increasing the surface area and volume that hit the base portion of the main body 11a by the through hole 22 communicating with the suction hole 21.

[0038] As a result, unlike the prior art, it is possible to provide a heat dissipation device with excellent heat absorption performance while minimizing the surface area and volume without increasing them unnecessarily, and the heat dissipation device can be configured more compactly than a heat exchanger.

[0039] In addition, in the first heat dissipation device 1, the shape, pitch, opening diameter (φ diameter), and layout of the suction holes 21 and the discharge holes 22 can be changed according to the required heat dissipation performance.

[0040] And, in addition to the first heat dissipation device 1 described above, according to a configuration in which a second heat dissipation device 12 composed of a substrate and a large number of pins, which has been well-known conventionally, and a fan 13 are combined, a heat dissipation device more suitable for heat absorption can be constructed, and the heat released from the heat source 3 inside the housing 2a of the device 2 can be efficiently released outside the housing 2a to dissipate heat.

[0041] Regarding specific numerical values showing the performance of the heat dissipation device 1 of the present embodiment, for example, compared with the second heat dissipation device 12 of 90 degrees and 90 W attached to the outside of the housing 2a of the device 2 in FIG. 1, the volume is 0.8 times and equivalent heat exchange performance can be obtained.

[0042] As described above, the best mode of the heat dissipation device and the device using the heat dissipation device according to the present invention has been described, but the present invention is not limited by the description and drawings in this mode. That is, of course, all other modes, examples, operation techniques, etc. made by those skilled in the art based on this mode are included in the scope of the present invention.

Explanation of reference numerals

[0043] 1 Heat dissipation device 2 Device 2a Housing 3 Heat source 11 First heat dissipation device 11a Main body 11b One surface (heat absorption surface) 11c The other surface (heat dissipation surface) 11d Upper and lower side surfaces 11e Left and right side surfaces 12 Second heat dissipation device 12a Heat absorption surface 12b Substrate 12c Pin 13 Fan 21 Suction hole 22(22A, 22B, 22C) Drain hole L1 Predetermined distance (predetermined length) C Center line H1 Pitch of suction holes H2, H3, H4 Pitch of drain holes

Claims

1. A plurality of tapered intake holes (21) are formed in a rectangular body (11a) so as to gradually narrow from one opposing surface of the body to a position a predetermined distance (L1) before the other surface of the body, so that the one surface is a heat absorbing surface (11b) and the other surface is a heat radiating surface (11c); A heat dissipation device characterized in that a plurality of holes (22) are formed so as to communicate with the suction holes and penetrate between at least one of both side surfaces perpendicular to the heat absorption surface and the heat dissipation surface.

2. The heat dissipation device according to claim 1, wherein the plurality of holes (22) are formed in a plurality of stages in the thickness direction of the body (11a).

3. An apparatus (2) in which a heat source (3) is disposed inside a housing (2a) and the housing is covered with a cover (2b), 3. An apparatus using a heat dissipation device, comprising: the heat dissipation device according to claim 1 or 2, disposed so that a part of one flat surface of said cover serves as a heat dissipation surface.

4. A first heat dissipation device (11) comprising the heat dissipation device of claim 1 or 2; a fan (13) attached to the heat absorbing surface (11b) of the first heat dissipation device and configured to send heat radiated from the heat source (3) to the heat absorbing surface; and a second heat dissipation device (12) having a heat absorption surface (12a) joined to and attached to the heat dissipation surface (11c) of the first heat dissipation device, protruding outside the cover (2b), and dissipating heat radiated from the heat dissipation surface of the first heat dissipation device to the outside of the housing (2a).

Images