Liquid jet head and liquid jet device

Abstract

To provide a liquid jet head which can achieve improvement of assemblability of the liquid jet head, and to provide a liquid jet device.SOLUTION: A liquid jet head includes: a plurality of head chips configured to jet liquid in a jet direction; a holder which holds the plurality of head chips; and a support member to which the holder is fixed. The holder has one of an engaging part and an engaged part. The support member has the other of the engaging part and the engaged part. The holder is fixed to the support member by the one and the other engaging with each other. It is preferable that the one of the engaging part and the engaged part be the engaging part, the engaging part be provided so as to protrude in a protruding direction from the protruding surface of the holder, and an opening be formed at a position overlapping with a first contact portion, where the engaging part and the engaged part contact with each other, on the protruding surface when viewed in the protruding direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection device.

Background Art

[0002] Conventionally, a liquid ejection device including a liquid ejection head that ejects a liquid such as ink onto a medium such as printing paper has been proposed.

[0003] The liquid ejection head described in Patent Document 1 includes a plurality of head chips provided with a plurality of nozzles for ejecting a liquid, a long metal holder (corresponding to a support member) that holds the plurality of head chips, and a long resin flow path member having a distribution flow path for distributing the liquid to the plurality of head chips. In this document, the flow path member and the holder are fixed by screws.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a conventional liquid ejection head, since the flow path member and the holder are fixed with screws, there is a problem that the assemblability of the liquid ejection head is poor.

Means for Solving the Problems

[0006] A liquid ejection head according to one aspect of the present disclosure includes a plurality of head chips that eject a liquid in an ejection direction, a holder that holds the plurality of head chips, and a support member to which the holder is fixed. The holder has one of an engaging portion and an engaged portion, the support member has the other of the engaging portion and the engaged portion, and the holder is fixed to the support member when the one and the other are engaged with each other.

[0007] A liquid ejection device according to one aspect of the present disclosure includes a liquid ejection head and a liquid storage unit for storing a liquid to be supplied to the liquid ejection head.

Brief Description of the Drawings

[0008]

Figure 1

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Figure 22

Mode for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments according to the present disclosure will be described with reference to the accompanying drawings. Note that the dimensions and scales of each part in the drawings are appropriately different from the actual ones, and there are also parts schematically shown for easy understanding. Further, the scope of the present disclosure is not limited to these embodiments unless otherwise specified in the following description.

[0010] In the following description, the mutually intersecting X-axis, Y-axis, and Z-axis are appropriately used. Also, one direction along the X-axis is referred to as the X1 direction, and the direction opposite to the X1 direction is referred to as the X2 direction. Similarly, the directions opposite to each other along the Y-axis are referred to as the Y1 direction and the Y2 direction. Also, the directions opposite to each other along the Z-axis are referred to as the Z1 direction and the Z2 direction. Typically, the Z-axis is a vertical axis, and the Z1 direction corresponds to the downward direction in the vertical direction. However, the Z-axis does not have to be a vertical axis. Also, the X-axis, Y-axis, and Z-axis typically intersect at right angles to each other, but are not limited thereto, and for example, they may intersect at an angle within the range of 80° or more and 100° or less.

[0011] The Y1 direction or the Y2 direction is an example of the "first direction". The X1 direction or the X2 direction is an example of the "second direction". The Z1 direction is the ejection direction of the ink as the "liquid", and the Z2 direction is the direction opposite to the ejection direction of the ink. Hereinafter, viewing from the Z1 direction or the Z2 direction is referred to as "plan view".

[0012] 1. First Embodiment 1-1. Schematic Configuration of Liquid Ejection Device 100 FIG. 1 is a schematic diagram showing a configuration example of a liquid ejection device 100 according to the first embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, as droplets onto a medium M. The medium M is typically printing paper. Note that the medium M is not limited to printing paper, and may be a printing target of any material such as a resin film or a fabric, for example.

[0013] As shown in FIG. 1, the liquid ejection device 100 includes a liquid storage unit 10, a control unit 20, a conveyance unit 90, and a liquid ejection head 30.

[0014] The liquid storage unit 10 is a container that stores ink. Specific examples of the liquid storage unit 10 include, for example, a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack formed of a flexible film, and an ink tank that can be refilled with ink. Note that the type of ink stored in the liquid storage unit 10 is not particularly limited and is arbitrary.

[0015] The control unit 20 controls the operations of the respective elements of the liquid ejection device 100. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operations of the respective elements of the liquid ejection device 100.

[0016] The conveying unit 90 conveys the medium M in the direction DM under the control of the control unit 20. In this embodiment, the direction DM is the X1 direction. In the example shown in FIG. 1, the conveying unit 90 includes a long conveying roller along the Y-axis and a motor for rotating the conveying roller. Note that the conveying unit 90 is not limited to the configuration using a conveying roller, and for example, a configuration using a drum or an endless belt that conveys the medium M in a state where it is adsorbed to the outer peripheral surface by an electrostatic force or the like may also be used.

[0017] The liquid ejection head 30 ejects the ink supplied from the liquid storage unit 10 from each of the plurality of nozzles N in the Z1 direction onto the medium M under the control of the control unit 20. The liquid ejection head 30 is a line head that is long in the extending direction of the Y-axis. The liquid ejection head 30 has a plurality of head chips 3 arranged such that a plurality of nozzles N are distributed over the entire range in the direction along the Y-axis of the medium M. By ejecting the ink from the liquid ejection head 30 in parallel with the conveyance of the medium M by the conveying unit 90, an image formed by the ink is formed on the surface of the medium M.

[0018] Note that the number and arrangement of the head chips 3 of the liquid ejection head 30 are not limited to the example shown in FIG. 1 and are arbitrary. Further, when the liquid ejection head 30 is configured to be able to circulate the ink, the liquid ejection head 30 may be connected to the liquid storage unit 10 via a circulation mechanism for circulating the ink in the liquid ejection head 30.

[0019] Such a liquid ejection device 100 includes, as described above, the liquid ejection head 30 and a liquid storage unit 10 for storing the ink supplied to the liquid ejection head 30. As will be described later, the liquid ejection head 30 has a reduced risk of warpage. Therefore, according to the liquid ejection device 100 including such a liquid ejection head 30, a decrease in print quality can be suppressed.

[0020] 1-2. Liquid ejection head 30 FIG. 2 is an exploded perspective view of the liquid ejection head 30 shown in FIG. 1. FIG. 3 is a cross-sectional view of the liquid ejection head 30 shown in FIG. 1. As shown in FIGS. 1 and 2, the liquid ejection head 30 is an elongated member along the Y1 direction. The liquid ejection head 30 includes a plurality of head chips 3, a fixing plate 4, a first flow path member 5, a support member 6, an intermediate substrate 7, and a second flow path member 8. 1-2A. Head Chip 3 and Fixing Plate 4

[0021] FIG. 4 is a bottom view of the liquid ejection head 30 shown in FIG. 1. In the example shown in FIG. 4, the liquid ejection head 30 has head chips 3-1 to 3-7. Each of the head chips 3-1 to 3-7 is a head chip 3. Hereinafter, each of the head chips 3-1 to 3-7 may be referred to as the head chip 3.

[0022] The head chips 3-1 to 3-7 are arranged in the Y1 direction. Specifically, the head chips 3-1 to 3-7 are arranged in a staggered pattern along the Y1 direction when viewed in the Z1 direction. The head chips 3-1, 3-3, 3-5, 3-7 are arranged in a row in the Y1 direction in this order. The head chips 3-1, 3-3, 3-5, 3-7 are arranged so that their positions align with each other in the direction along the X axis. Also, the head chips 3-2, 3-4, 3-6 are arranged in a row in the Y1 direction in this order. The head chips 3-2, 3-4, 3-6 are arranged at a position in the X1 direction relative to the head chips 3-1, 3-3, 3-5, 3-7 so that their positions align with each other in the direction along the X axis.

[0023] Each head chip 3 includes a plurality of nozzles N arranged along the Y axis. The plurality of nozzles N are divided into a nozzle row La and a nozzle row Lb that are arranged side by side at intervals from each other along the X axis. Each of the nozzle row La and the nozzle row Lb is a set of a plurality of nozzles N linearly arranged along the Y axis.

[0024] The fixed plate 4 has a plurality of openings 4h. Each opening 4h is a hole that penetrates the fixed plate 4 in the direction along the Z-axis. The plurality of openings 4h are arranged in a staggered pattern along the Y1 direction. A plurality of nozzles N of each head chip 3 are exposed from each opening 4h. The material of the fixed plate 4 is, for example, a metal such as stainless steel.

[0025] FIG. 5 is a cross-sectional view of the head chip 3 shown in FIG. 2. The liquid injection head 30 has a structure in which elements related to each nozzle N of the nozzle row La and elements related to each nozzle N of the nozzle row Lb are arranged in a substantially plane-symmetrical manner. The nozzles N on the right side in FIG. 5 belong to the nozzle row La, and the nozzles N on the left side in FIG. 5 belong to the nozzle row Lb. In the following description, elements corresponding to the nozzle row La will be mainly described, and the description of elements corresponding to the nozzle row Lb will be omitted as appropriate. Also, hereinafter, when the nozzle row La and the nozzle row Lb are not distinguished, they will be denoted as the nozzle row L.

[0026] As shown in FIG. 5, the head chip 3 includes a communication plate 31, a pressure chamber substrate 32, a diaphragm 33, a nozzle plate 37, a vibration absorber 38, a plurality of drive elements 34, a sealing substrate 35, a housing portion 36, and a flexible substrate 39.

[0027] Each of the communication plate 31, the pressure chamber substrate 32, the diaphragm 33, the nozzle plate 37, and the vibration absorber 38 is a long plate-like member along the Y-axis. The pressure chamber substrate 32 and the housing portion 36 are installed on the surface of the communication plate 31 in the Z2 direction. The nozzle plate 37 and the vibration absorber 38 are installed on the surface of the communication plate 31 in the Z1 direction. Each member is fixed to each other, for example, by an adhesive.

[0028] The nozzle plate 37 is a plate-like member in which a plurality of nozzles N are formed. Each of the plurality of nozzles N is a circular through-hole for injecting ink. The nozzle plate 37 is manufactured by processing a single-crystal substrate of silicon (Si) using semiconductor manufacturing techniques such as photolithography and etching.

[0029] The communication plate 31 is formed with a plurality of throttling portions 312, a plurality of communication channels 314, a communication space Ra, and a common channel Rb. Each of the throttling portion 312 and the communication channel 314 extends in the Z1 direction and is a through hole formed for each nozzle N. The communication channel 314 overlaps the nozzle N in a plan view. The communication space Ra is an opening formed in a long shape along the Y axis. The communication space Ra extends along the Y axis. The common channel Rb communicates with the communication space Ra and overlaps the communication space Ra in a plan view. The common channel Rb extends along the Y axis. The common channel Rb communicates with the plurality of throttling portions 312. Further, the communication space Ra communicates the common channel Rb and the external channel of the head chip 3 via a space Rc and a supply port 361 described later.

[0030] A plurality of pressure chambers C1 are formed in the pressure chamber substrate 32. The pressure chamber C1 is a space located between the communication plate 31 and the diaphragm 33 and formed by the wall surface 320 of the pressure chamber substrate 32. The pressure chamber C1 is formed for each nozzle N. The pressure chamber C1 is a long space extending in the X1 direction. The plurality of pressure chambers C1 are arranged along the Y axis. Further, the pressure chamber C1, the nozzle N, the communication channel 314, and the throttling portion 312 constitute an individual flow path for each nozzle N.

[0031] The communication plate 31 and the pressure chamber substrate 32 are manufactured by processing a semiconductor substrate such as a single crystal silicon substrate.

[0032] An elastically deformable diaphragm 33 is disposed above the pressure chamber C1. The diaphragm 33 is laminated on the pressure chamber substrate 32 and contacts the surface of the pressure chamber substrate 32 opposite to the communication plate 31. The diaphragm 33 is a plate-like member formed in a long rectangular shape along the Y axis in a plan view. The pressure chamber C1 communicates with the communication channel 314 and the throttling portion 312. Therefore, the pressure chamber C1 communicates with the nozzle N via the communication channel 314 and communicates with the communication space Ra via the throttling portion 312. In FIG. 5, for ease of explanation, the pressure chamber substrate 32 and the diaphragm 33 are illustrated as separate substrates, but actually they are laminated on one silicon substrate.

[0033] On the surface of the diaphragm 33 on the side opposite to the pressure chamber C1, drive elements 34 are formed for each pressure chamber C1. The drive element 34 is a long piezoelectric element along the X-axis in plan view. The drive element 34 includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. Note that the drive element 34 may be an electrothermal conversion element that generates thermal energy.

[0034] The housing portion 36 is a case for storing the ink supplied to the plurality of pressure chambers C1, and is formed, for example, by injection molding of a resin material. A space Rc and a supply port 361 are formed in the housing portion 36. The supply port 361 is a pipe through which ink is supplied from the liquid storage portion 10 and communicates with the space Rc. The space Rc of the housing portion 36 and the communication space Ra of the communication plate 31 communicate with each other. The common space R common to the plurality of nozzles N is constituted by the aforementioned communication space Ra, the common flow path Rb, and the space Rc. The common space R functions as a liquid storage chamber for storing the ink supplied to the plurality of pressure chambers C1. The ink stored in the common space R branches to each throttle portion 312 and is supplied and filled in parallel to the plurality of pressure chambers C1.

[0035] The vibration absorber 38 is a flexible film that constitutes the wall surface of the communication space Ra and absorbs the pressure fluctuations of the ink in the common space R. By providing the vibration absorber 38, the natural frequency of the flow path from the nozzle N through the pressure chamber C1 to the throttle portion 312 is stabilized regardless of the nozzle N to be driven.

[0036] A frame body 45 is joined to the surface of the vibration absorber 38 facing the Z1 direction by an adhesive or the like. The frame body 45 is a frame-shaped member along the outer periphery of the vibration absorber 38. The frame body 45 is made of, for example, a metal material. A fixing plate 4 is joined to the surface of the frame body 45 facing the Z1 direction by an adhesive or the like as shown by the two-dot chain line in the figure.

[0037] The sealing substrate 35 is a structure that protects the plurality of drive elements 34 and reinforces the mechanical strength of the pressure chamber substrate 32 and the diaphragm 33, and is fixed to the surface of the diaphragm 33 with, for example, an adhesive. The plurality of drive elements 34 are accommodated inside the recess formed on the surface of the sealing substrate 35 facing the diaphragm 33.

[0038] The flexible substrate 39 is inserted through the through-hole 362 of the housing portion 36 and the through-hole 353 of the sealing substrate 35. The flexible substrate 39 is joined to the surface of the diaphragm 33. The flexible substrate 39 is a mounting component on which a plurality of wirings are formed for electrically connecting the relay substrate 7 electrically connected to the control unit 20 and the head chip 3. The flexible substrate 39 includes a driving IC (not shown). The driving IC is a circuit including a switching element that selects whether to supply the driving signal Com to the driving element 34. As the flexible substrate 39, for example, a TCP (Tape Carrier Package) or an FPC (Flexible Printed Circuit) is used. A driving signal and a reference voltage for driving the driving element 34 are supplied from the flexible substrate 39 to each driving element 34.

[0039] When the driving element 34 contracts due to energization, the diaphragm 33 is bent and deflected in a direction in which the volume of the pressure chamber C1 decreases, the pressure in the pressure chamber C1 rises, and ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C1 toward the throttle portion 312, and ink also flows through the throttle portion 312 into the common flow path Rb. After the ink is ejected, the driving element 34 returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, when the meniscus of the nozzle N is restored, ink is supplied from the throttle portion 312. Through the above series of operations, ink is ejected from the nozzle N.

[0040] 1-2B. First flow path member 5 As shown in FIGS. 2 and 3, the first flow path member 5 is located in the Z2 direction of the plurality of head chips 3. The first flow path member 5 is a member for distributing and supplying ink to the plurality of head chips 3. The first flow path member 5 has a holder 51 and a flow path substrate 52. The holder 51 is located in the Z1 direction with respect to the flow path substrate 52. The material of each part of the first flow path member 5 may be, for example, resin or metal. Further, the flow path substrate 52 has a first member 521 and a second member 522.

[0041] FIG. 6 is a bottom-side perspective view of the holder 51 shown in FIG. 2. FIG. 7 is a top-side perspective view of the holder 51 shown in FIG. 2. As shown in FIGS. 6 and 7, the holder 51 is an elongated member extending along the Y1 direction. A plurality of head chips 3 are fixed to the first flow path member 5. The holder 51 includes a holding portion 514, a fourth side wall portion 512, and two flange portions 513. The holding portion 514 includes a flat plate portion 510 and a third side wall portion 511.

[0042] The holding portion 514 is a portion that holds the plurality of head chips 3. The flat plate portion 510 of the holding portion 514 is a flat plate-like portion of the holder 51 along the X-Y plane and extends in the Y1 direction. A plurality of wiring holes 51h and a plurality of flow paths 50h are provided in the flat plate portion 510. Each of the plurality of wiring holes 51h and the plurality of flow paths 50h is a hole that penetrates the flat plate portion 510 along the Z axis.

[0043] The plurality of wiring holes 51h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 51h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 51h. Further, the flow path 50h is provided for each supply port 361 of the head chip 3. The flow path 50h communicates with the common space R of the head chip 3 through the supply port 361. Also, for example, the head chip 3 and the holder 51 are fixed by liquid-tightly connecting the wall portion constituting the supply port 361 of each head chip 3 and the wall portion constituting the flow path 50h of the holder 51 with an adhesive.

[0044] As shown in FIGS. 3 and 6, the third side wall portion 511 protrudes from the flat plate portion 510 in the Z1 direction. As shown in FIG. 6, the third side wall portion 511 is formed in a frame shape so as to surround the plurality of head chips 3 when viewed in the direction along the Z axis. As shown in FIG. 3, the fixing plate 4 contacts the third side wall portion 511. Further, the third recessed portion 511r is defined by the flat plate portion 510 and the third side wall portion 511. A plurality of head chips 3 are arranged inside the third recessed portion 511r. The plurality of head chips 3 are accommodated in the space formed by the third recessed portion 511r and the fixing plate 4.

[0045] As shown in FIGS. 3 and 7, the fourth side wall portion 512 protrudes from the flat plate portion 510 in the Z2 direction. As shown in FIG. 7, the fourth side wall portion 512 is formed in a frame shape along the outer edge of the flat plate portion 510 when viewed in the direction along the Z axis. As shown in FIG. 3, the fourth side wall portion 512 contacts the support member 6. Further, the fourth recessed portion 512r is defined by the flat plate portion 510 and the fourth side wall portion 512. The flow path substrate 52 is arranged inside the fourth recessed portion 512r. The flow path substrate 52 is accommodated in the space formed by the fourth recessed portion 512r and the support member 6. The flow path substrate 52 contacts the flat plate portion 510.

[0046] As shown in FIGS. 6 and 7, the two flange portions 513 project outward from the flat plate portion 510 along the X-Y plane. One of the two flange portions 513 is provided in the X1 direction of the flat plate portion 510, and the other is provided in the X2 direction of the flat plate portion 510. Each flange portion 513 extends in the Y1 direction. A plurality of engaging portions 515 are provided on each flange portion 513. Each engaging portion 515 protrudes from the flange portion 513 in the Z2 direction. The plurality of engaging portions 515 are spaced apart from each other and are provided on the flange portion 513 at substantially equal intervals. Note that the plurality of engaging portions 515 do not have to be arranged at equal intervals. Each engaging portion 515 is used to fix the first flow path member 5 and the support member 6.

[0047] As shown in FIG. 2, the flow path substrate 52 is a member extending along the Y1 direction. The flow path substrate 52 is disposed between the holder 51 and the support member 6. The flow path substrate 52 includes a first member 521 and a second member 522 as described above. The first member 521 is located in the Z2 direction with respect to the second member 522.

[0048] The first member 521 has a plurality of wiring holes 521h. The plurality of wiring holes 521h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 521h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 521h. Similarly, the second member 522 has a plurality of wiring holes 522h. The plurality of wiring holes 522h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 522h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 522h. The wiring holes 521h and 522 overlap when viewed in the direction along the Z axis.

[0049] Further, the first member 521 has a recess 521r opening in the Z1 direction. The recess 521r is a depression formed in the first member 521. Similarly, the second member 522 has a recess 522r opening in the Z2 direction. The recess 522r is a depression formed in the second member 522. The recess 521r and the recess 522r form the distribution flow path 52h shown in FIG. 3. The distribution flow path 52h is a flow path for distributing the ink supplied through the second flow path member 8 described later to each head chip 3. The distribution flow path 52h communicates with each of the plurality of flow paths 50h of the holder 51 shown in FIG. 6 described above.

[0050] Also, as shown in FIG. 2, a flow path tube 50 having a hole communicating with the distribution flow path 52h inside projects in the Z2 direction on the surface of the first member 521 facing the Z2 direction.

[0051] 1-2C. Support Member 6 As shown in FIGS. 2 and 3, the support member 6 is located in the Z2 direction with respect to the first flow path member 5. Further, the support member 6 is disposed between the first flow path member 5 and the second flow path member 8. The support member 6 is a member that supports the first flow path member 5. The material of the support member 6 is a metal such as aluminum or stainless steel, but it may also be a resin. The support member 6 is an elongated member extending in the Y1 direction. The support member 6 is a member that supports the first flow path member 5. The support member 6 has a bottom wall 60, a first side wall portion 61, and a second side wall portion 62.

[0052] FIG. 8 is a bottom-side perspective view of the support member 6 shown in FIG. 2. FIG. 9 is a top-side perspective view of the support member 6 shown in FIG. 2. As shown in FIGS. 8 and 9, the bottom wall 60 is a flat plate-like portion of the support member 6 along the X-Y plane and extends in the Y1 direction. A plurality of wiring holes 601h, through holes 602h, and a plurality of through holes 6h are provided in the bottom wall 60. Each of the plurality of wiring holes 601h, the through holes 602h, and the plurality of through holes 6h is a hole penetrating the bottom wall 60 along the Z axis.

[0053] The plurality of wiring holes 601h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 601h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 601h. Further, the flow path tube 50 is inserted into the through hole 602h. The through hole 602h is disposed near the center of the support member 6 on the Y axis in the illustrated example. The plurality of through holes 6h are spaced apart from each other and are arranged at substantially equal intervals along the Y1 direction. The plurality of through holes 6h are formed at positions corresponding to the plurality of engagement portions 515 described above. A part of the engagement portion 515 described above is disposed in each through hole 6h.

[0054] Further, as shown in FIG. 3, a plurality of protruding pins 63 protruding in the Z1 direction are provided on the bottom wall 60 from the surface facing the Z1 direction. A metal leaf spring 40 for electrically connecting the fixing plate 4 and the support member 6 is attached to each protruding pin 63. The end of the leaf spring 40 opposite to the end fixed to the protruding pin 43 is inserted between the third side wall portion 511 of the holder 51 and the bent portion of the outer peripheral end of the fixing plate 4.

[0055] As shown in FIGS. 3 and 8, the first side wall portion 61 protrudes in the Z1 direction from the bottom wall 60. As shown in FIG. 8, the first side wall portion 61 is in a frame shape along the outer edge of the bottom wall 60 when viewed in the direction along the Z axis. As will be described later, the holder 51 is fixed to the support member 6 by the engagement of the first side wall portion 61 and the engaging portion 515.

[0056] Also, as shown in FIG. 3, a first recess 61r is defined by the first side wall portion 61 and the bottom wall 60. A part of the flow path substrate 52 is disposed inside the first recess 61r. Further, a first surface 601, which is the bottom surface of the first recess 61r, is spaced apart from the flow path substrate 52. The first surface 601 is the surface of the bottom wall 60 facing the Z1 direction.

[0057] As shown in FIGS. 3 and 9, the second side wall portion 62 protrudes in the Z2 direction from the bottom wall 60. As shown in FIG. 9, the second side wall portion 62 is in a frame shape along the outer edge of the bottom wall 60 when viewed in the direction along the Z axis. The second side wall portion 62 is located outside the aforementioned first side wall portion 61 when viewed in the direction along the Z axis.

[0058] As shown in FIG. 3, a second recess 62r having a concave shape is defined by the second side wall portion 62 and the bottom wall 60. A relay substrate 7 and a part of the second flow path member 8, which will be described later, are disposed in an accommodation space S, which is the space inside the second recess 62r. Further, a second surface 602, which is the bottom surface of the second recess 62r, is where the relay substrate 7 is disposed. The second surface 602 is the surface of the bottom wall 60 facing the Z2 direction.

[0059] As shown in FIG. 9, a plurality of fastening locations 620 and a plurality of positioning pins 621 are provided on the second side wall portion 62. For example, screw holes are provided at the plurality of fastening locations 620. The plurality of fastening locations 620 are used to fix a second flow path member 8 described later to the support member 6 by, for example, screw fastening. Also, each positioning pin 621 protrudes in the Z2 direction from the second side wall portion 62. Each positioning pin 621 is used for alignment of the support member 6 with the second flow path member 8 described later.

[0060] 1-2D. Relay Substrate 7 FIG. 10 is a top view showing a relay substrate 7 disposed within the support member 6 shown in FIG. 2. As shown in FIGS. 2 and 10, the relay substrate 7 is a long substrate along the Y1 direction. Also, as shown in FIGS. 3 and 10, the relay substrate 7 is disposed within the second recess 62r of the support member 6 and laminated on the second surface 602. Further, the relay substrate 7 is disposed so as to close the plurality of through holes 6h described above. Note that it is preferable not to dispose electronic components such as wiring on the surface of the relay substrate 7 in the Z1 direction. This makes it easier to dispose the relay substrate 7 flat on the second surface 602, thereby preventing ink mist or the like from entering the accommodation space S through the plurality of through holes 6h.

[0061] Also, as described above, the support member 6 is made of metal. Therefore, in order to ensure the insulation of the relay substrate 7, it is preferable that the relay substrate 7 is disposed on the second surface 602 of the support member 6 via an insulating sheet or the like. Note that “the relay substrate 7 is laminated on the second surface 602” includes that the relay substrate 7 is disposed indirectly on the second surface 602 of the support member 6 via an insulating sheet or the like.

[0062] Also, as shown in FIG. 10, a plurality of wiring holes 71h and through holes 70h are provided in the relay substrate 7. Each of the plurality of wiring holes 71h and through holes 70h is a hole that penetrates the relay substrate 7 along the Z axis.

[0063] The plurality of wiring holes 71h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 71h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 71h. Then, the flexible substrate 39 is connected to the relay substrate 7. Also, in the example shown in the figure, the through hole 70h is arranged near the center of the support member 6 on the Y axis. The through hole 70h communicates with the through hole 602h provided in the support member 6 described above. The flow path tube 50 is inserted into the through hole 70h.

[0064] Also, on the surface of the relay substrate 7 facing the Z2 direction, a plurality of connectors 71 are provided. The control unit 20 and the relay substrate 7 are electrically connected by a wiring member (not shown) via these connectors 71.

[0065] 1-2E. Second flow path member 8 As shown in FIGS. 2 and 3, the second flow path member 8 is located in the Z2 direction of the relay substrate 7 and is a member elongated in the Y1 direction. The second flow path member 8 has a flow path for supplying ink to the first flow path member 5. The material of the second flow path member 8 is, for example, resin, but it may also be metal. The second flow path member 8 has a cover 81 and a flow path substrate 82. The cover 81 is arranged in the Z2 direction with respect to the flow path substrate 82.

[0066] FIG. 11 is a top view of the second flow path member 8 shown in FIG. 2. As shown in FIGS. 2 and 11, the cover 81 is a member elongated along the Y1 direction. As shown in FIG. 3, the cover 81 is arranged so as to close the opening in the Z2 direction of the support member 6. The cover 81 is a lid member that closes the accommodation space S of the support member 6. The cover 81 covers the opening of the second recess 62r by being fixed to the support member 6.

[0067] The cover 81 is fixed to the support member 6, for example, by being fastened with screws. Specifically, as shown in FIG. 11, the cover 81 has a plurality of screw holes 80h and a plurality of screw holes 82h. The plurality of screw holes 80h and the plurality of screw holes 82h are provided corresponding to the plurality of fastening locations 620. By inserting screws (not shown) through one screw hole 80h and the screw hole provided at one fastening location 620, the cover 81 is fixed to the support member 6.

[0068] Also, each screw hole 82h functions as a positioning hole for positioning the cover 81 with respect to the support member 6. Specifically, a positioning pin 621 is inserted through each screw hole 82h. By inserting the positioning pin 621 through the screw hole 82h, the cover 81 can be positioned with respect to the support member 6.

[0069] Note that the cover 81 may be fixed to the support member 6 by an L-shaped or T-shaped pin. The method of fixing with an L-shaped or T-shaped pin is, for example, the following method. For example, one of the cover 81 or the support member 6 has an L-shaped or T-shaped pin, and the other has a hole through which the pin is inserted. By inserting the pin through the hole and rotating the pin, the pin is prevented from coming out of the hole. Thereby, the cover 81 can be fixed to the support member 6.

[0070] The cover 81 has two protruding portions 811 that protrude in the Z2 direction from the surface in the Z2 direction thereof. Each protruding portion 811 is a tubular body and communicates with a filter chamber (not shown) formed between the cover 81 and the flow path substrate 82. Ink is supplied to each protruding portion 811 from the liquid storage portion 10 in FIG. 1. Note that the ink supplied through the protruding portion 811 is discharged from a flow path tube 83 provided at the tip in the Z1 direction of the flow path substrate 82 through a filter (not shown) for capturing foreign matter in the filter chamber. When the liquid ejecting device 100 has a circulation mechanism for circulating the ink, one of the two protruding portions 811 may function as a tube for supplying the ink, and the other may function as a tube for discharging the ink.

[0071] As shown in FIG. 11, a plurality of wiring connection holes 81h are provided in the cover 81. The wiring connection holes 81h are holes that penetrate the cover 81 along the Z-axis. The plurality of wiring connection holes 81h are provided corresponding to the plurality of connectors 71. A wiring member (not shown) for electrically connecting the relay substrate 7 and the control unit 20 is inserted into the wiring connection holes 81h.

[0072] As shown in FIGS. 2 and 3, the flow path substrate 82 is smaller than the cover 81 when viewed in the direction along the Z-axis. The flow path substrate 82 is disposed in the second concave portion 62r of the support member 6. Ink flowing in through the protrusion 811 is supplied to the flow path substrate 82. In the illustrated example, the flow path substrate 82 has a funnel shape. The flow path tube 50 of the first member 521 is liquid-tightly connected to the tip of the flow path tube 83 of the flow path substrate 82 via an elastic seal member 89. That is, the ink that has flowed into the flow path substrate 82 flows into the flow path tube 50.

[0073] In the liquid ejection head 30 described above, ink is supplied from the protrusion 811. The ink flows into the distribution flow path 52h of the first flow path member 5 through a filter chamber (not shown) between the cover 81 and the flow path substrate 82, the flow path tube 83, the seal member 89, and the flow path tube 50. Then, the ink is distributed from the distribution flow path 52h corresponding to each head chip 3.

[0074] As shown in FIG. 3, the liquid ejection head 30 described above includes a plurality of head chips 3 arranged in Y1, a first flow path member 5 that distributes ink to the plurality of head chips 3, and a support member 6 that supports the first flow path member 5.

[0075] The material of the first flow path member 5 is preferably resin, and the material of the support member 6 is preferably metal. Since the first flow path member 5 is made of resin, the weight and cost of the liquid ejection head 30 can be reduced. On the other hand, when the first flow path member 5 is made of resin, the liquid ejection head 30 is likely to warp due to linear expansion, swelling, etc. A metal support member 6 is provided to reduce the influence of this warping. By supporting the resin-made first flow path member 5 with the metal support member 6 as a base, the influence of the warping can be reduced.

[0076] Furthermore, the first flow path member 5 is arranged in the Z1 direction with respect to the support member 6. Therefore, the support member 6, the first flow path member 5, and the plurality of head chips 3 are arranged in this order in the Z1 direction. Therefore, it is only necessary for the first flow path member 5 to have a distribution flow path 52h for distributing ink to the plurality of head chips 3, and it is not necessary for the support member 6 to have a large number of holes that serve as flow paths for distributing ink. In the present embodiment, the flow path provided in the support member 6 is only one through hole 602h.

[0077] If the first flow path member 5 having the distribution flow path 52h is arranged above the support member 6, a plurality of through holes must be formed in the support member 6 for the flow path connection between the distribution flow path 52h and the plurality of supply ports 361. On the other hand, in the present embodiment, since the first flow path member is arranged below the support member 6, it is not necessary to form the plurality of through holes in the support member 6. For this reason, the rigidity of the support member 6 can be improved. As a result, the warping of the liquid ejection head 30 can be reduced. Therefore, it is possible to suppress a decrease in printing quality due to the influence of the warping.

[0078] For example, when the flow path substrate 52 is fixed to the support member 6, the flow path substrate 52 is less likely to warp due to the support member 6. However, since the holder 51 is not supported by the metal support member 6, the holder 51 to which the plurality of head chips 3 are fixed is likely to warp with respect to the flow path substrate 52. Therefore, when the flow path substrate 52 is fixed to the support member 6, there is a risk of misalignment of the nozzles N between the head chips 3. On the other hand, when the holder 51 is fixed to the support member 6 as in the present embodiment, the influence of the warping of the holder 51 can be reduced. Therefore, the influence of the misalignment of the nozzles N between the head chips 3 can be reduced.

[0079] Note that when the holder 51 is fixed to the support member 6, the flow path substrate 52 is likely to warp with respect to the holder 51. However, since this warping does not affect the alignment of the nozzles N, this warping can be tolerated. Also, in the present embodiment, the holder 51 is fixed to the support member 6, but the flow path substrate 52 may be fixed to the support member 6. Further, both the holder 51 and the flow path substrate 52 may be fixed to the support member 6.

[0080] Furthermore, in the present embodiment, the flow path substrate 52 is smaller than the holder 51 when viewed in the Z1 direction. Specifically, the planar area of the flow path substrate 52 is smaller than the planar area of the holder 51.

[0081] As described above, for example, a method of fixing both the holder 51 and the flow path substrate 52 to the support member 6 is also conceivable. However, in the case of this method, it is necessary to clamp the holder 51 and the flow path substrate 52 together with a fixture such as a screw. Therefore, for example, it is necessary to form a through hole for clamping on the flow path substrate 52. As a result, the flow path substrate 52 becomes larger. On the other hand, as described above, in the present embodiment, the holder 51 is fixed to the support member 6. Therefore, it is not necessary to form the above-mentioned through hole in the flow path substrate 52, and the flow path substrate 52 can be miniaturized. Therefore, the liquid ejection head 30 can be miniaturized.

[0082] Note that the holder 51 and the flow path substrate 52 are fixed, for example, by an adhesive. Also, the flow path substrate 52 and the holder 51 may be fixed to each other by fixtures such as screws, L-shaped or T-shaped pins, etc.

[0083] Also, as described above, each of the plurality of head chips 3 has a flexible substrate 39. Further, the support member 6 supports the second flow path member 8 and is disposed between the first flow path member 5 and the second flow path member 8. Also, the relay substrate 7 is disposed between the support member 6 and the second flow path member 8. Therefore, the second flow path member 8 is disposed above the support member 6 and the relay substrate 7. Also, the first flow path member 5 is disposed below the support member 6 and the relay substrate 7. By arranging the first flow path member 5 and the second flow path member 8 in this way, the length of the flexible substrate 39 can be shortened and the cost can be reduced compared to the case where both the first flow path member 5 and the second flow path member 8 are disposed below the support member 6 and the relay substrate 7.

[0084] Also, as described above, the support member 6 includes a bottom wall 60 disposed between the first flow path member 5 and the second flow path member 8, a first side wall portion 61 extending from the bottom wall 60 in the Z1 direction, and a second side wall portion 62 extending from the bottom wall 60 in the Z2 direction.

[0085] Since the support member 6 has the bottom wall 60, the first side wall portion 61, and the second side wall portion 62, the rigidity of the support member 6 can be increased compared to the case where the support member 6 is composed of only the bottom wall 60. Therefore, the warping of the liquid ejection head 30 described above can be further reduced.

[0086] Further, the support member 6 has a first recess 61r defined by a bottom wall 60 and a first side wall portion 61. By having the first recess 61r in the support member 6, a gap can be formed between the flow path substrate 52 and the support member 6. That is, the surface of the flow path substrate 52 facing the first surface 601 is arranged with a gap with respect to the first surface 601. In other words, the flow path substrate 52 and the support member 6 are separated. Since the flow path substrate 52 and the support member 6 are separated, heat from the relay substrate 7 laminated on the second surface 602 of the support member 6 can be reduced from being transmitted to the flow path substrate 52 having the distribution flow paths 52h with a high arrangement density. Therefore, it is possible to suppress a change in the ejection characteristics due to a change in the viscosity of the ink flowing through the distribution flow paths 52h.

[0087] Further, the support member 6 has a second recess 62r defined by a bottom wall 60 and a second side wall portion 62. In other words, the support member 6 has a second recess 62r for accommodating the relay substrate 7 between the second flow path member 8. By having the second recess 62r in the support member 6, heat of the relay substrate 7 can be radiated from the second side wall portion 62 to the outside from the inner wall surface of the second recess 62r through the second surface 602 which is the bottom wall surface of the second recess 62r. Therefore, it is possible to reduce the heat from the relay substrate 7 from being transmitted to the first flow path member 5. Thus, it is possible to prevent a change in the ejection characteristics due to a change in the viscosity of the ink in the distribution flow paths 52h.

[0088] Furthermore, the second flow path member 8 is arranged to cover the opening of the second recess 62r. Therefore, it is possible to prevent ink mist or paper powder of the medium from entering the second recess 62r.

[0089] Further, the second flow path member 8 includes a cover 81 that covers the opening of the second recess 62r and a flow path substrate 82 disposed in the second recess 62r. The cover 81 is fixed to the support member 6. Since the long and easily warped cover 81 disposed far from the bottom wall 60 of the support member 6 is fixed to the support member 6, the influence of the warping of the cover 81 can be reduced.

[0090] Furthermore, the flow path substrate 82 is smaller than the cover 81 when viewed in the Z1 direction. Specifically, the planar area of the flow path substrate 82 when viewed in the Z1 direction is smaller than the planar area of the cover 81 when viewed in the Z1 direction. Since the planar area of the flow path substrate 82 is smaller than the planar area of the cover 81, it is easy to arrange the flow path substrate 82 within the second concave portion 62r. When the flow path substrate 82 is accommodated within the second concave portion 62r, the miniaturization in the stacking direction of each member of the liquid ejection head 30 can be achieved as compared with the case where the flow path substrate 82 is not arranged within the second concave portion 62r and is arranged in the Z2 direction with respect to the second concave portion 62r.

[0091] Also, the relay substrate 7 is accommodated within the second concave portion 62r of the support member 6. The depth D2 of the second concave portion 62r is larger than the depth D1 of the first concave portion 61r. Since the depth D2 is larger than the depth D1, the distance between the relay substrate 7 and the cover 81 of the second flow path member 8, which are arranged on the same side with reference to the bottom wall 60, can be increased as compared with the case where the depth D2 is smaller than the depth D1. Therefore, it is possible to suppress the cover 81 from being heated by the heat of the relay substrate 7. Thus, the warping of the cover 81 can be reduced.

[0092] 1-3. Fixing of the Holder 51 to the Support Member 6 FIG. 12 is an enlarged view of the engaging portion 515 shown in FIG. 3. As described above, the holder 51 has the engaging portion 515. The engaging portion 515 includes a first portion 5150 and a second portion 5151. The first portion 5150 is a portion extending in the Z2 direction from the flange portion 513. The second portion 5151 is a portion extending from the first portion 5150 along the X-Y plane and inward of the first portion 5150. The first portion 5150 and the second portion 5151 are connected to each other. The extending direction of the first portion 5150 and the extending direction of the second portion 5151 intersect.

[0093] On one hand, the support member 6 has a first side wall portion 61. The first side wall portion 61 includes a connecting portion 612 and an engaged portion 611. The connecting portion 612 is a portion extending in the Z1 direction from the bottom wall 60 and connecting the bottom wall 60 and the engaged portion 611. The engaged portion 611 is a portion extending outward along the X-Y plane from the connecting portion 612. The engaging portion 515 engages with the engaged portion 611. Note that the connecting portion 612 may be omitted. In this case, the engaged portion 611 is connected to the bottom wall 60.

[0094] The holder 51 is fixed to the support member 6 when the engaging portion 515 engages with the engaged portion 611 of the first side wall portion 61. By fixing the holder 51 to the support member 6 through the engagement between the engaging portion 515 and the engaged portion 611, the attachment and detachment of the holder 51 can be easily performed. Therefore, the assemblability of the liquid ejection head 30 is improved. In addition, since the replacement of the unit including the head chip 3 and the holder 51 becomes easier, the repair of the liquid ejection head 30 can be easily performed.

[0095] As shown in FIG. 12, a first contact portion 60a where the engaging portion 515 and the engaged portion 611 contact each other and a second contact portion 60b where the support member 6 and the holder 51 contact at a position different from the first contact portion 60a do not overlap when viewed in the Z1 direction. The first contact portion 60a is a contact portion between the second portion 5151 of the engaging portion 515 and the engaged portion 611.

[0096] The second contact portion 60b is a contact portion between the fourth side wall portion 512 of the holder 51 and the first side wall portion 61 of the support member 6. The presence of the second contact portion 60b enables the support member 6 and the holder 51 to be stably fixed in a state of being in contact with each other. In addition, since the first contact portion 60a and the second contact portion 60b do not overlap when viewed in the Z1 direction, the attachability and detachability of the holder 51 with respect to the support member 6 can be improved.

[0097] FIG. 13 is a side view of the engaging portion 515 shown in FIG. 3. FIG. 14 is a perspective view of the engaging portion 515 shown in FIG. 13. FIG. 15 is a perspective view of the engaging portion 515 shown in FIG. 13.

[0098] As shown in FIGS. 13, 14, and 15, a plurality of engaging portions 515 are provided on the flange portion 513 of the holder 51. The surface of the flange portion 513 facing the Z2 direction has a protruding surface 5130 and a peripheral surface 5131 surrounding the protruding surface 5130. The peripheral surface 5131 is a portion other than the protruding surface 5130 among the surfaces of each flange portion 513 facing the Z2 direction, and is a surface adjacent to the protruding surface 5130. The protruding surface 5130 is the surface on which the engaging portion 515 is provided. Therefore, the engaging portion 515 protrudes in the Z2 direction, which is the protruding direction, from the protruding surface 5130 of the holder 51.

[0099] Furthermore, the protruding surface 5130 is recessed in the Z2 direction with respect to the peripheral surface 5131. In other words, the thickness D01 of the portion of the flange portion 513 where the engaging portion 515 is provided is thinner than the thickness D02 of the other portions. The thickness D01 is the length along the Z-axis in the portion where the protruding surface 5130 is provided. The thickness D02 is the length along the Z-axis in the portion where the peripheral surface 5131 is provided. For this reason, the engaging portion 515 can be lengthened and is easily deformed. Thus, the attachment and detachment of the holder 51 to and from the support member 6 can be easily performed.

[0100] As shown in FIGS. 12, 14, and 15, an opening 513h is formed in the protruding surface 5130. The opening 513h is provided at a position overlapping a first contact portion 60a where the engaging portion 515 and the engaged portion 611 come into contact when viewed in the Z2 direction. By providing the opening 513h, the engaging portion 515 is more easily deformed than when the opening 513h is not provided. Also, for example, by inserting a jig through the opening 513h, the engagement between the engaging portion 515 and the engaged portion 611 can be easily released.

[0101] Also, a through hole 6h is provided in the partition wall portion 610 of the support member 6. The through hole 6h is a hole that opens to the second surface 602 and the first surface 601 of the support member 6. A part of the engaging portion 515 is located in the through hole 6h. For this reason, an opening is formed in the second surface 602 of the support member 6 where the engaging portion 515 is located inside when viewed in the Z1 direction. By providing the through hole 6h, the engagement can be easily released by accessing the engaging portion 515 from above.

[0102] Further, the relay substrate 7 closes the opening of the support member 6. That is, the relay substrate 7 is disposed so as to overlap the opening on the second surface 602 side of the through hole 6h when viewed in the Z1 direction. By the relay substrate 7 closing the through hole 6h, it is possible to prevent the intrusion of ink mist into the through hole 6h.

[0103] Also, as described above, the support member 6 is preferably made of metal. On the other hand, the holder 51 is preferably made of resin. By making the support member 6 with a low replacement frequency into metal and the holder 51 for fixing the head chip 3 with a high replacement frequency into resin, the engaged portion 611 of the support member 6 is difficult to break, and the holder 51 can be easily replaced. The support member 6 can be reused without replacement.

[0104] 2. Second Embodiment For elements whose functions are the same as those in the first embodiment in the following examples, the reference numerals used in the description of the first embodiment are reused, and the detailed description of each is appropriately omitted.

[0105] FIG. 16 is a perspective view of a part of the liquid ejection head 30A according to the second embodiment. FIG. 17 is a cross-sectional view of a part of the liquid ejection head 30A shown in FIG. 16. As shown in FIGS. 16 and 17, in the present embodiment, it is different that the second flow path member 8 is fixed to the support member 6 by engagement.

[0106] As shown in FIG. 17, the cover 81 of the second flow path member 8 has a second engaging portion 813. The second engaging portion 813 is connected to the cover 81 of the second flow path member 8. The second engaging portion 813 extends in the Z2 direction from the cover 81. Note that the second engaging portion 813 may be integral with the cover 81 or may be formed separately and joined.

[0107] The second engaging portion 813 includes a third portion 8130 and a fourth portion 8131. The third portion 8130 is a portion extending in the Z2 direction from the second engaging portion 813. The fourth portion 8131 is a portion extending outward from the third portion 8130 along the X-Y plane and beyond the third portion 8130. The third portion 8130 and the fourth portion 8131 are connected to each other. The extending direction of the third portion 8130 and the extending direction of the fourth portion 8131 intersect each other.

[0108] As shown in FIGS. 16 and 17, a through hole 613h is provided in the second side wall portion 62 of the support member 6. The through hole 613h penetrates the second side wall portion 62 along the X-Y plane. The second engaging portion 813 is engaged with the inner wall surface defining the through hole 613h. Accordingly, the second side wall portion 62 corresponds to the "second engaged portion".

[0109] As described above, the cover 81 of the second flow path member 8 has the second engaging portion 813. Further, the support member 6 has a second side wall portion 62 which is the "second engaged portion". The cover 81 is fixed to the support member 6 by the engagement of the second engaging portion 813 and the second side wall portion 62 which is the "second engaged portion". For this reason, the attachment and detachment of the cover 81 to and from the support member 6 become easy, and thus the assemblability of the liquid ejection head 30 is further improved as compared with the first embodiment.

[0110] Also, similar to the first embodiment, the support member 6 is preferably made of metal. In addition, the holder 51 and the cover 81 are preferably made of resin. By making the support member 6 with a low replacement frequency made of metal, and making the holder 51 for fixing the head chip 3 and the cover 81 for fixing the second flow path member 8 made of resin, the second side wall portion 62 which is the "second engaged portion" of the support member 6 is difficult to break, and the holder 51 and the cover 81 are easy to replace. The second side wall portion 62 which is the "second engaged portion" can be reused without replacement.

[0111] Further, the through hole 613h is a space within the second side wall portion 62 provided independently of the accommodation space S. By providing the through hole 613h independently of the accommodation space S, it is easy to release the engagement between the second engaging portion 813 and the second side wall portion 62 which is the "second engaged portion". Further, by providing the through hole 613h independently of the accommodation space S, it is difficult for mist such as ink to enter the accommodation space S. Further, for example, by providing a member that closes the through hole 613h, it is possible to prevent the entry of ink mist or the like from the through hole 613h into the accommodation space S.

[0112] 3. Modification Each of the embodiments illustrated above can be variously modified. Specific modification modes applicable to each of the above embodiments are illustrated below. Two or more modes arbitrarily selected from the following illustrations can be appropriately combined within a range that does not conflict with each other.

[0113] 3-1. First Modification FIG. 18 is a partial cross-sectional view of the liquid ejection head 30B according to the first modification. In the example shown in FIG. 18, the support member 6 has a second through hole 614h in addition to the through hole 613h. The second through hole 614h is a hole that penetrates the second side wall portion 62 of the support member 6 along the Z axis. The through hole 613h and the second through hole 614h communicate with each other. The second through hole 614h intersects the through hole 613h and opens to the first surface 601 which is the lower surface of the bottom wall 60. And the second engaging portion 813 is disposed within the second through hole 614h.

[0114] Also with the configuration of the support member 6 of the first modification, as in the second embodiment, the second engaging portion 813 and the second side wall portion 62 which is the "second engaged portion" engage with each other, so that the cover 81 is fixed to the support member 6. For this reason, the attachment and detachment of the cover 81 to and from the support member 6 become easy, so that the assemblability of the liquid ejection head 30 is further improved as compared with the first embodiment.

[0115] 3-2. Second Modification FIG. 19 is a perspective view of the leaf spring 40A according to the second modification. As shown in FIG. 19, the leaf spring 40A includes a first spring portion 401, a second spring portion 402, and a third spring portion 403. Note that the leaf spring 40 in the above-described embodiment similarly includes the first spring portion 401, the second spring portion 402, and the third spring portion 403.

[0116] The first spring portion 401 is a portion extending from the fixed plate 4 to the protruding pin 63 of the support member 6. The second spring portion 402 is a portion that contacts the fixed plate 4 and is disposed between the fixed plate 4 and the first flow path member 5. The third spring portion 403 is a portion that contacts the support member 6 and is fixed by the protruding pin 63. The third spring portion 403 extends along the X-Y plane. A hole is provided in the third spring portion 403, and a part of the protruding pin 63 is inserted into the hole.

[0117] In the leaf spring 40A of the second modification shown in FIG. 19, the third spring portion 403 has a plurality of holding portions 405 that abut against the protruding pin 63. The plurality of holding portions 405 make it difficult for the third spring portion 403 to come off from the protruding pin 63. Therefore, the leaf spring 40A can be stably fixed to the support member 6.

[0118] 3-3. Third Modification FIG. 20 is a cross-sectional view of the engaging portion 515C according to the third modification. FIG. 21 is a top view of the engaging portion 515C shown in FIG. 20. FIG. 22 is a top view of the engaging portion 515C shown in FIG. 20. FIG. 22 shows a state in which the engaging portion 515C of FIG. 21 is rotated 90° in the X-Y plane. Further, FIG. 22 corresponds to a top view of the state of the engaging portion 515C of FIG. 20.

[0119] As shown in FIG. 20, the engaging portion 515C of the third modification further includes an attachment portion 5152. The attachment portion 5152 is located on the side opposite to the second portion 5151 in the first portion 5150. As shown in FIGS. 21 and 22, the attachment portion 5152 has an elongated shape when viewed in the direction along the Z-axis. Further, the engaging portion 515C is not joined to the holder 51 and is configured to be detachable from the holder 51. The attachment portion 5152 is used to attach the engaging portion 515C to the holder 51.

[0120] The flat plate portion 510 of the first flow path member 5 has an opening 513h. The opening 513h is a hole that penetrates the flat plate portion 510 along the Z-axis. The opening 513h includes a first hole 5132 and a second hole 5133. The first hole 5132 is located in the Z2 direction with respect to the second hole 5133. The first hole 5132 overlaps the second hole 5133 when viewed in the direction along the Z-axis. The planar area of the first hole 5132 is smaller than the planar area of the second hole 5133. Therefore, the inner wall surface defining the opening 513h has a stepped surface 513r between the first hole 5132 and the second hole 5133. The stepped surface 513r is a surface parallel to the X-Y plane. Further, as shown in FIGS. 21 and 22, the opening 513h has an elongated shape along the Y-axis when viewed in the direction along the Z-axis.

[0121] In FIG. 21, the longitudinal direction of the engaging portion 515C coincides with the longitudinal direction of the opening 513h. In FIG. 22, the longitudinal direction of the engaging portion 515C is orthogonal to the longitudinal direction of the opening 513h when viewed in the direction along the Z-axis. As shown in FIG. 21, after inserting the engaging portion 515C into the opening 513h, as shown in FIG. 22, the engaging portion 515C is rotated 90° in the X-Y plane. As a result, as shown in FIGS. 20 and 22, the engaging portion 515C abuts against the stepped surface 513r, and the engaging portion 515C engages with the engaged portion 611.

[0122] By having the attachment portion 5152, the engaging portion 515C can be configured to be detachable from the first flow path member 5. Therefore, the replacement of the engaging portion 515C is easy.

[0123] 3-4. Other Modifications In the foregoing description, the holder 51 of the first flow path member 5 has the engaging portion 515, and the support member 6 has the engaged portion 611. However, the first flow path member 5 may have an "engaged portion", and the support member 6 may have an "engaging portion". Similarly, in the foregoing description, the support member 6 has the second side wall portion 62 which is the "second engaged portion", and the cover 81 has the second engaging portion 813. However, the support member 6 may have a "second engaging portion", and the cover 81 may have a "second engaged portion". The cover 81

[0124] In the foregoing description, the flow path substrate 52 had the first member 521 and the second member 522, but the flow path substrate 52 may be composed of only the first member 521, or may be composed of three or more plate-like members.

[0125] The "liquid ejecting device" can be adopted not only for devices dedicated to printing, but also for various devices such as facsimile machines and copying machines. The use of the liquid ejecting device is not limited to printing. For example, a liquid ejecting device that ejects a solution of a coloring material is used as a manufacturing device for forming a color filter of a display device such as a liquid crystal display panel. Also, a liquid ejecting device that ejects a solution of a conductive material is used as a manufacturing device for forming wirings and electrodes of a relay substrate. Further, a liquid ejecting device that ejects a solution of an organic substance related to a living body is used, for example, as a manufacturing device for manufacturing a biochip.

[0126] The present invention has been described based on the preferred embodiments, but the present invention is not limited to the foregoing embodiments. Also, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as that of the foregoing embodiments, and any configuration can be added.

Explanation of Reference Numerals

[0127] 3... head chip, 4... fixing plate, 4h... opening, 5... first flow path member, 6... support member, 7... relay substrate, 8... second flow path member, 10... liquid storage section, 20... control unit, 30... liquid ejection head, 34... drive element, 39... flexible substrate, 40... leaf spring, 51... holder, 60... bottom wall, 60a... first contact portion, 60b... second contact portion, 61... first side wall portion, 62... second side wall portion, 63... protruding pin, 70... tubular member, 71... connector, 71h... wiring hole, 81... cover, 100... liquid ejection device, 401... first spring portion, 402... second spring portion, 403... third spring portion, 405... restraining portion, 510... flat plate portion, 511... third side wall portion, 511r... third recess, 512... fourth side wall portion, 512r... fourth recess, 513... flange portion, 513h... opening, 513r... stepped surface, 514... holding portion, 515... engaging portion, 601... first surface, 602... second surface, 610... partition wall portion, 611... engaged portion, 612... connecting portion, 613h... through hole, 614h... second through hole, 811... protruding portion, 813... second engaging portion, 5130... protruding surface, 5131... peripheral surface, 5132... first hole, 5133... second hole, D01... thickness, D02... thickness, D1... depth, D2... depth, S... accommodation space.

Claims

1. A plurality of head tips that eject liquid in an ejection direction; A holder for holding the plurality of head chips; a support member to which the holder is fixed; Equipped with The holder has one of an engaging portion and an engaged portion, the support member has the other of the engaging portion and the engaged portion, The holder is fixed to the support member by the engagement between the engaging portion and the engaged portion. A liquid jet head comprising:

2. the one of the engaging portion and the engaged portion is the engaging portion, The engagement portion is provided so as to protrude in a protruding direction from a protruding surface of the holder, an opening is formed in the protruding surface at a position overlapping a first contact portion where the engaging portion and the engaged portion come into contact with each other as viewed in the protruding direction; The liquid jet head according to claim 1 .

3. the holder has a flange portion that protrudes outward from a holding portion that holds the plurality of head chips, The engagement portion is provided on the flange portion, The protruding surface is recessed in a direction opposite to the protruding direction with respect to a surface facing the protruding direction of the flange portion and adjacent to the protruding surface when viewed in a direction opposite to the protruding direction. The liquid jet head according to claim 2 .

4. the support member is made of metal; The holder is made of resin. The liquid jet head according to claim 1 .

5. the one of the engaging portion and the engaged portion is the engaging portion, The engagement portion is provided so as to protrude in a protruding direction from a protruding surface of the holder, a first contact portion where the engaging portion and the engaged portion come into contact with each other and a second contact portion where the supporting member and the holder come into contact with each other at a position different from the first contact portion do not overlap with each other when viewed in the protruding direction. The liquid jet head according to claim 1 .

6. a relay substrate electrically connected to the plurality of head chips, the one of the engaging portion and the engaged portion is the engaging portion, The holder is disposed in the ejection direction relative to the support member, the relay substrate is placed on a surface of the support member facing in a direction opposite to the ejection direction, an opening is formed in the surface of the support member, the opening having the engagement portion positioned therein as viewed in the ejection direction; The relay substrate closes the opening of the support member. The liquid jet head according to claim 1 .

7. a cover disposed in a direction opposite to the ejection direction of the support member; the cover has one of a second engaging portion and a second engaged portion, the support member has the other of the second engaging portion and the second engaged portion, The cover is fixed to the support member by the second engaging portion and the second engaged portion engaging with each other. The liquid jet head according to claim 1 .

8. the support member is made of metal; The holder and the cover are made of resin. The liquid jet head according to claim 7 .

9. a relay substrate electrically connected to the plurality of head chips, The support member has a bottom wall and a side wall protruding from the bottom wall in a direction opposite to the ejection direction, the relay board is disposed in a recessed accommodation space defined by the bottom wall and the side wall; the second engaging portion and the second engaged portion engage with each other in a space within the side wall that is provided independently of the accommodation space; The liquid jet head according to claim 7 .

10. A liquid jet head according to claim 1 , a liquid reservoir for storing a liquid to be supplied to the liquid jet head; A liquid ejection apparatus comprising:

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