Temperature adjustment apparatus and sensing system

Abstract

To sense a state of a distribution channel through which cooling water is distributed.SOLUTION: Provided is a temperature adjustment apparatus that performs thermal exchange with one or more objects by means of cooling water. The temperature adjustment apparatus comprises: a distribution portion including a distribution channel through which the cooling water is distributed; and a sensing system that senses a state of the distribution channel. Therein the sensing system includes: a pressure sensor that is provided at least at one position in the distribution channel, and that senses pressure of the cooling water; and a sensing unit that senses a state of the distribution channel on the basis of the pressure sensed by the pressure sensor.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a temperature regulation device and sensing system. [Background technology]

[0002] 2. Description of the Related Art Conventionally, thermal management systems using a cooling liquid are known (see, for example, Patent Documents 1 and 2). Patent Document 1: JP 2014-80123 A Patent Document 2: JP 2011-255879 A Summary of the Invention [Problem to be solved by the invention]

[0003] In a thermal management system, it is preferable to be able to detect the state of the path through which the coolant flows. [Means for solving the problem]

[0004] In order to solve the above problem, one aspect of the present invention provides a temperature adjustment device that performs heat exchange between cooling water and one or more objects. The temperature adjustment device may include a circulation section including a circulation path through which the cooling water flows. Any of the temperature adjustment devices may include a detection system that detects a state of the circulation path. In any of the temperature adjustment devices, the detection system may include a pressure sensor provided at at least one position of the circulation path and that detects the pressure of the cooling water. In any of the temperature adjustment devices, the detection system may include a detection section that detects the state of the circulation path based on the pressure detected by the pressure sensor.

[0005] In any of the above temperature adjustment devices, the flow path may have a plurality of pipes. In any of the above temperature adjustment devices, the flow path may have a connection control unit that controls which of the plurality of pipes are to be connected to each other. In any of the above temperature adjustment devices, the connection control unit may have a plurality of connecting pipes that are connected to the plurality of pipes. In any of the above temperature adjustment devices, the connection control unit may have a switching unit that switches which of the connecting pipes are to be connected to each other. In any of the above temperature adjustment devices, at least one of the pressure sensors may be provided in at least one of the connecting pipes.

[0006] In any of the above temperature control devices, the circulation path may have a main path. In any of the above temperature control devices, the circulation path may have a plurality of branch paths. In any of the above temperature control devices, the circulation path may have a connection control unit that controls which of the plurality of branch paths the main path is connected to. In any of the above temperature control devices, the pressure sensor may be provided in the main path. In any of the above temperature control devices, the detection unit may compare the pressure detected by the pressure sensor with a reference value and detect the state of the circulation path based on the comparison result. In any of the above temperature control devices, the detection unit may correct the reference value depending on which branch path the connection control unit selects.

[0007] In any of the above temperature control devices, the circulation path may have a plurality of annular paths. In any of the above temperature control devices, the circulation path may have a connection control unit capable of connecting two or more of the plurality of annular paths to each other. In any of the above temperature control devices, the detection unit may compare the pressure detected by the pressure sensor with a reference value and detect the state of the circulation path based on the comparison result. In any of the above temperature control devices, the detection unit may correct the reference value depending on which of the annular paths the connection control unit has connected.

[0008] In any of the above temperature control devices, the circulation path may have a direction control unit that controls a direction in which the cooling water flows. In any of the above temperature control devices, the detection unit may detect a state of the circulation path based on the pressure detected by the pressure sensor and the direction in which the cooling water flows that is controlled by the direction control unit.

[0009] In any one of the temperature adjustment devices described above, the pressure sensor may have a sensor cell that generates a detection signal corresponding to the pressure of the cooling water. In any one of the temperature adjustment devices described above, at least a portion of the sensor cell may be covered with a protective film that is connected to a reference potential.

[0010] In any of the above temperature adjustment devices, the flow path may include a wall portion surrounding a space through which the cooling water passes. In any of the above temperature adjustment devices, an opening may be provided in the wall portion. In any of the above temperature adjustment devices, the pressure sensor may have an intake portion connected to the opening in the wall portion and taking in the cooling water. In any of the above temperature adjustment devices, the pressure sensor may have a sensor cell that detects the pressure of the cooling water taken in by the intake portion.

[0011] In any of the above temperature adjustment devices, the flow path may include a wall surrounding a space through which the cooling water passes. In any of the above temperature adjustment devices, the wall may have a recess provided on a surface opposite to the space. In any of the above temperature adjustment devices, the wall may have an opening connecting the recess and the space. In any of the above temperature adjustment devices, the pressure sensor may have a sensor cell disposed inside the recess and detecting the pressure of the cooling water.

[0012] In any of the above temperature adjustment devices, the pressure sensor may have a sensor cell including an output terminal that outputs a detection signal corresponding to the pressure of the cooling water and a power supply terminal to which a power supply voltage is applied. In any of the above temperature adjustment devices, the sensor cell may include a chip capacitor that connects the output terminal and the power supply terminal.

[0013] Any of the above temperature adjustment devices may include a plurality of the pressure sensors. In any of the above temperature adjustment devices, each of the pressure sensors may have a sensor cell including an output terminal that outputs a detection signal corresponding to the pressure of the cooling water and a power supply terminal to which a power supply voltage is applied. In any of the above temperature adjustment devices, the detection system may be provided for two or more of the sensor cells, and may have signal wiring connected to each of the output terminals. In any of the above temperature adjustment devices, the detection system may be provided in common to two or more of the sensor cells, and may have power supply wiring to which the power supply terminals are commonly connected.

[0014] Any of the above temperature adjustment devices may include a sensor module including a plurality of the sensor cells, the signal wiring, and the power supply wiring. In any of the above temperature adjustment devices, the sensor module may have a main body in which the plurality of the sensor cells, the signal wiring, and the power supply wiring are provided. In any of the above temperature adjustment devices, the sensor module may be provided for each sensor cell and may have an inlet pipe for introducing the cooling water into the main body. In any of the above temperature adjustment devices, the sensor module may be provided inside the main body, extending from the inlet pipe to a position facing the sensor cell, and may have a reservoir for storing the cooling water. In any of the above temperature adjustment devices, each of the sensor cells may detect the pressure of the cooling water in the reservoir.

[0015] In any of the temperature adjustment devices described above, the storage portion may terminate inside the main body portion.

[0016] In any of the above temperature adjustment devices, the main body may have a connection hole connecting the storage section and the sensor cell. In any of the above temperature adjustment devices, the main body may have a surge tank provided at a position closer to the inlet pipe than the connection hole. In any of the above temperature adjustment devices, the detection system may include a plurality of the circulation paths having different pressures of the cooling water. In any of the above temperature adjustment devices, the detection system may include a plurality of the pressure sensors provided in each of the plurality of circulation paths and having different sensitivities depending on the pressure of the cooling water. In any of the above temperature adjustment devices, the detection system may include a plurality of the pressure sensors having different sensitivities. In any of the above temperature adjustment devices, each of the pressure sensors may be provided in one circulation path.

[0017] In a second aspect of the present invention, there is provided a detection system for detecting a state of a distribution channel through which the cooling water flows. The detection system may include a pressure sensor provided at at least one position of the distribution channel and detecting a pressure of the cooling water. The detection system may include a detection unit for detecting the state of the distribution channel based on the pressure detected by the pressure sensor.

[0018] The above summary of the invention does not list all of the features of the present invention. In addition, subcombinations of these features may also be inventions. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a temperature adjustment device 300 according to an embodiment of the present invention. [Diagram 2] 1A and 1B are diagrams showing examples of mounting a pressure sensor 110 to a flow path. [Diagram 3] 3 is a top view of the pressure sensor 110 shown in FIG. 2. [Figure 4] 3 is a cross-sectional view showing an example of the structure of the pressure sensor 110 shown in FIG. 2. [Diagram 5] 3 is a cross-sectional view showing another example of the structure of the pressure sensor 110 shown in FIG. 2. [Figure 6] 2 is an example of a top view of a sensor cell 140. FIG. [Figure 7] 13 is a diagram showing another example of mounting the pressure sensor 110 to the flow path. FIG. [Figure 8] 1 shows an example of a top view of the sensor cell 140. [Figure 9] 2 is a schematic diagram illustrating an example of a connection control unit 202. FIG. [Figure 10] 2 is a schematic diagram illustrating an example of a connection control unit 202. FIG. [Figure 11] 2 is a top view illustrating an example of a sensor module 160. FIG. [Figure 12] 12 is an example of a cross-sectional view of the sensor module 160 shown in FIG. 11. [Figure 13] 13 is a diagram showing another example of the configuration of the circulation unit 200. FIG. [Figure 14] 13 is a diagram showing another example of the configuration of the circulation unit 200. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The present invention will be described below through the embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention. In this specification and drawings, elements having substantially the same functions and configurations are given the same reference numerals to avoid repeated explanations, and elements not directly related to the present invention are not shown. In addition, in one drawing, elements having the same functions and configurations may be given the same reference numerals as representative elements, and the reference numerals may be omitted for the others.

[0021] In this specification, when the term "same" or "equal" is used, it may include cases where there is an error due to manufacturing variations, etc. The error is, for example, within 10%.

[0022] FIG. 1 is a diagram showing an example of the configuration of a temperature adjustment device 300 according to an embodiment of the present invention. The temperature adjustment device 300 exchanges heat with one or more objects using cooling water (also called coolant liquid). This adjusts the temperature of each object. The cooling water may be mainly composed of a liquid that is more resistant to freezing than water. In this specification, the main component refers to a component that accounts for more than 50% by weight of the entire cooling water. The main component of the cooling water may be ethylene glycol or propylene glycol. The main component of the cooling water may be water. A rust inhibitor may be added to the cooling water.

[0023] Although the temperature adjustment device 300 in this example is used in a vehicle, the temperature adjustment device 300 may be used for other purposes. The vehicle in this example generates at least a portion of its power from electric power. The objects to be cooled in this example are an air conditioner 251, a radiator 252, a battery 253, a power train 254, and the like, which are used in the vehicle. The objects to be cooled are not limited to these. The air conditioner 251 adjusts the temperature inside the vehicle.

[0024] The temperature adjustment device 300 includes a circulation section 200 including a circulation path through which the cooling water flows, and a detection system 100 that detects the state of the circulation path. The circulation path includes a plurality of pipes 210 through which the cooling water flows. The pipes 210 may be formed of metal, resin, or the like. In addition to the pipes 210, the circulation path may include devices such as a pump 201 and a connection control section 202 that control the flow rate, flow rate, circulation path, and the like of the cooling water. The circulation path may include a heat exchanger that exchanges heat between the cooling water and another medium, and the like.

[0025] The piping 210 may connect between the devices. The flow path in this example includes a ring-shaped portion through which the cooling water circulates. In FIG. 1, the piping 210 between the devices is indicated by a solid line. The piping 210 passes near an object such as the battery 253. This causes heat exchange between the object such as the battery 253 and the cooling water, thereby cooling the object. The piping 210 may be provided in contact with the object.

[0026] The pump 201 takes in cooling water from the pipe 210 and sends the cooling water to the pipe 210. This causes the cooling water to circulate in the circulation path. A plurality of pumps 201 may be provided in the circulation path.

[0027] The connection control unit 202 controls which of the multiple pipes 210 are to be connected to each other. The connection control unit 202 is connected to three or more pipes 210, and may connect any two of the pipes 210 to each other. This makes it possible to control which pipes 210 the cooling water is to be circulated to. The connection control unit 202 in the example of FIG. 1 switches whether the cooling water from the pump 201 is circulated to the pipe 210 that cools the air conditioner 251 or to another pipe 210. The connection control unit 202 may be an electromagnetic valve that switches the connection of the internal path by an electromagnet, may be an electronic valve that switches the connection of the internal path by an electric signal, or may be a valve of another type.

[0028] The detection system 100 includes at least one pressure sensor 110 and a detection unit 150. The pressure sensor 110 is provided at least at one installation position 111 in the flow path, and detects the pressure of the cooling water at the installation position 111. The pressure sensor 110 in this example is provided at a position in contact with the cooling water.

[0029] Pressure sensor 110 may be provided in pipe 210, or may be provided in devices on the distribution path, such as pump 201 and connection control unit 202. In the example of Fig. 1, pressure sensors 110-1, 110-2, and 110-3 are provided at installation positions 111-1, 111-2, and 111-3 of pipe 210. Pressure sensor 110 may be a semiconductor pressure sensor having a diaphragm formed on a semiconductor substrate, or may be a pressure sensor of another structure.

[0030] The detection unit 150 detects the state of the distribution path based on the pressure detected by the pressure sensor 110. For example, the detection unit 150 compares the pressure detected by each pressure sensor 110 with a set reference value. The reference value may be a value of 80 kPa or more and 300 kPa or less. When the difference between the detected pressure and the reference value falls outside an allowable range, the detection unit 150 may notify a user, such as a driver of the vehicle, of a warning.

[0031] For example, components contained in the cooling water may precipitate in the flow path such as the pipe 210, or foreign matter mixed in the cooling water may adhere to the flow path. When these substances accumulate, the inner diameter of the flow path becomes smaller, making it difficult for the cooling water to flow. If the inner diameter of the flow path becomes too small, the target object cannot be cooled. When the inner diameter of the flow path becomes smaller, the pressure of the cooling water upstream of the corresponding point increases. Therefore, by monitoring the pressure detected by the pressure sensor 110, it is possible to detect the reduction in the inner diameter of the flow path. In addition, it is possible to detect an abnormality in the flow path before the flow path is completely clogged. In addition, when the cooling water leaks from the flow path, the pressure of the cooling water decreases. Therefore, by monitoring the pressure detected by the pressure sensor 110, it is possible to detect the leakage of the cooling water.

[0032] The detection unit 150 may identify the location where the reduction in the inner diameter has occurred based on the detection results of the multiple pressure sensors 110. For example, when a downstream pressure sensor 110 detects a pressure increase while a more upstream pressure sensor 110 detects no pressure increase, it may determine that a reduction in the inner diameter has occurred in the distribution path between the two pressure sensors 110. Similarly, the detection unit 150 may identify the location where the cooling water leak has occurred based on the detection results of the multiple pressure sensors 110. The detection unit 150 may notify the user of the location where the abnormality has been detected.

[0033] The detection unit 150 may be set with a common reference value for each pressure sensor 110. On the other hand, it is also conceivable that the pressure of the cooling water in a normal state differs depending on the position of the flow path. For example, the normal pressure value may differ depending on the distance from the pump 201, the distance from a curved portion of the flow path, or the initial value of the inner diameter of the flow path. The detection unit 150 may be set with an individual reference value for each pressure sensor 110.

[0034] 2 is a diagram showing an example of mounting the pressure sensor 110 to a flow path. The flow path in this example is a pipe 210, but the pressure sensor 110 can be similarly mounted to a device other than the pipe 210.

[0035] The pressure sensor 110 of this example has an intake portion 114, a sensor cell 140, a housing 112, a connector 116, and wiring 118. Furthermore, the pipe 210 has a wall portion 212 that surrounds a space 211 through which the cooling water passes. FIG. 2 shows a cross section of the wall portion 212. The wall portion 212 may be formed of metal, resin, or the like. An opening 214 is provided in the wall portion 212. The position of the opening 214 corresponds to the installation position 111 in FIG. 1.

[0036] The intake portion 114 is connected to the opening 214. The wall portion 212 in this example has a protruding portion 213 that protrudes from the opening 214. The protruding portion 213 has a cylindrical shape. The internal space surrounded by the protruding portion 213 is connected to the space 211 via the opening 214. The intake portion 114 is inserted into the internal space of the protruding portion 213 and takes in the cooling water into the housing 112. A sealing member 120 such as an O-ring may be provided between the housing 112 and the protruding portion 213.

[0037] Sensor cell 140 is housed inside housing 112. Housing 112 is formed of an insulating material such as resin. Sensor cell 140 detects the pressure of the cooling water taken in by take-in unit 114. Sensor cell 140 comes into contact with the cooling water inside housing 112.

[0038] The sensor cell 140 is electrically connected to a wiring 118 via a connector 116. The sensor cell 140 outputs an electrical signal indicating the magnitude of the pressure of the cooling water to a detection unit 150 via the wiring 118. With this configuration, the pressure of the cooling water flowing through the distribution path can be detected.

[0039] Fig. 3 is a top view of pressure sensor 110 shown in Fig. 2. Although omitted in Fig. 2, protruding portion 213 in this example has a flange at a portion that connects to pressure sensor 110. Pressure sensor 110 may be fixed to the flange of protruding portion 213 by screws 124 or the like. Housing 112 may have protruding portion 122 on which screws 124 are arranged.

[0040] Fig. 4 is a cross-sectional view showing an example of the structure of the pressure sensor 110 shown in Fig. 2. The pressure sensor 110 of this example has a housing 112, an intake portion 114, a sensor cell 140, and a connector .

[0041] The sensor cell 140 is accommodated in the internal space of the housing 112. The housing 112 may have a main part 128 having a recess for accommodating the sensor cell 140, and a lid part 126 for covering the recess. The lid part 126 and the main part 128 may be sealed with an adhesive 130.

[0042] The sensor cell 140 in this example is an absolute pressure sensor that measures the absolute pressure of the cooling water, but may be a relative pressure sensor that measures the relative pressure of the cooling water. The absolute pressure is the pressure when the magnitude of the vacuum pressure is zero. The relative pressure is the pressure difference between the pressure to be measured and a predetermined reference pressure. The sensor cell 140 in this example has a housing portion 141, a base material 142, a semiconductor substrate 143, wiring 145, a terminal 149, and a sealing portion 144. The housing portion 141 houses the base material 142, the semiconductor substrate 143, and the sealing portion 144. The housing portion 141 may be formed of an insulating material such as a resin. The housing portion 141 may contain polyphenylene sulfide (PPS). By containing PPS in the housing portion 141, it is possible to suppress swelling or deterioration of the housing portion 141 due to the cooling water. The housing portion 141 is fixed to the housing 112. The storage section 141 of this example has a protrusion that is inserted into a recess 132 provided in the housing 112. The recess 132 is filled with an adhesive material 134 that fixes the protrusion.

[0043] The base material 142 is fixed to the housing portion 141 by an adhesive or the like. A semiconductor substrate 143 is provided on the surface of the base material 142. The base material 142 may be a glass substrate, or may be a substrate made of another material.

[0044] In this example, at least a portion of the semiconductor substrate 143 is thinned. The thinned region functions as a diaphragm. The diaphragm is pressed by the cooling water taken in by the intake portion 114, causing distortion. In this example, the diaphragm is disposed opposite the intake portion 114. The resistance value of the diaphragm changes according to the magnitude of distortion. The semiconductor substrate 143 may be provided with a circuit that generates a detection signal having a signal level according to the resistance value. The detection signal is transmitted to a terminal 149 by wiring 145 such as a wire.

[0045] The sealing portion 144 seals the semiconductor substrate 143, the base material 142, and the wiring 145. The sealing portion 144 is formed of an insulating material. The sealing portion 144 is made of, for example, but is not limited to, silicone gel. The sealing portion 144 comes into contact with the cooling water taken in by the intake portion 114.

[0046] The terminal 149 is a wiring exposed to the outside of the sealing portion 144 and the housing portion 141. The terminal 149 may be a plate-shaped lead frame. The sensor cell 140 may have a plurality of terminals 149. Any of the terminals 149 may transmit a detection signal. Any of the terminals 149 may apply a power supply voltage to a circuit that generates the detection signal. Any of the terminals 149 may apply a reference voltage, such as a ground voltage, to a circuit that generates the detection signal. The circuit that generates the detection signal may be formed on a semiconductor substrate other than the semiconductor substrate 143. The other semiconductor substrate may also be disposed within the sensor cell 140.

[0047] The pressure sensor 110 may have a wiring 152. The wiring 152 connects the terminal 149 and the connector 116. The wiring 152 may be connected to the wiring 118 shown in FIG. 2 and the like. The wiring 152 may be a plate-shaped lead frame.

[0048] The sensor cell 140 may further include a chip capacitor 148. The chip capacitor 148 connects two terminals 149. This makes it possible to suppress noise superimposition on the detection signal and prevent malfunction when strong electromagnetic field noise is induced in the wiring. The chip capacitor 148 may be connected to the terminal 149 inside the housing portion 141, or may be connected to the terminal 149 outside the housing portion 141.

[0049] 5 is a cross-sectional view showing another example of the structure of the pressure sensor 110 shown in FIG. 2. The sensor cell 140 of this example is a relative pressure sensor that detects the difference between a reference pressure such as atmospheric pressure and the pressure of the cooling water. Other than the structure of the sensor cell 140, it may be the same as the example shown in FIG. 4. However, the cover 126 of this example is provided with a through hole 136 for introducing air into the internal space in which the sensor cell 140 is provided. The sensor cell 140 of this example measures a relative pressure when the reference pressure is atmospheric pressure. Note that a configuration in which absolute pressure is measured without providing the through hole 136 may also be used.

[0050] In the sensor cell 140 of this example, a through hole 146 is provided in a base material 142. The through hole 146 exposes the back surface of the diaphragm. The diaphragm is distorted according to the difference between the pressure applied to the front surface covered by the sealing portion 144 and the pressure applied to the back surface exposed through the through hole 146. The sensor cell 140 generates a detection signal according to the magnitude of the distortion. In the sensor cell 140 of this example, the pressure of the cooling water is applied to the back surface of the diaphragm, and a reference pressure such as atmospheric pressure is applied to the front surface of the diaphragm. The housing 112 of this example has a structure that separates a space into which the air is introduced and a space into which the cooling water is introduced. The other structures of the sensor cell 140 are the same as those in the example of FIG. 4.

[0051] FIG. 6 is an example of a top view of the sensor cell 140. In FIG. 6, structures other than the terminal 149, the housing portion 141, and the chip capacitor 148 are omitted. As described above, the terminal 149 is provided extending from the inside to the outside of the housing portion 141. The sensor cell 140 of this example has three terminals 149 arranged side by side on the same side of the housing portion 141. The sensor cell 140 of this example has a terminal 149 to which a power supply voltage Vcc is applied (sometimes referred to as a power supply terminal Vcc in this specification), a terminal 149 to which a reference voltage GND is applied (sometimes referred to as a power supply terminal GND in this specification), and a terminal 149 to which a detection signal Vout is transmitted (sometimes referred to as an output terminal Vout in this specification).

[0052] The chip capacitor 148 is provided between the two terminals 149. The sensor cell 140 may have a plurality of chip capacitors 148. In the example of Fig. 6, a chip capacitor 148 that connects the power supply terminal GND and the output terminal Vout, and a chip capacitor 148 that connects the power supply terminal Vcc and the output terminal Vcc are provided. The chip capacitor 148 may be provided outside the accommodation portion 141 as shown by the solid line in Fig. 6, or may be provided inside the accommodation portion 141 as shown by the dashed line in Fig. 6.

[0053] The sensor cell 140 may be provided in a device such as the pump 201 or the connection control unit 202. These devices may have a noise source such as a solenoid valve. In this example, by providing the chip capacitor 148 in the sensor cell 140, it is possible to suppress noise from being superimposed on the detection signal Vout and prevent malfunction. Therefore, even if the sensor cell 140 is placed near a noise source, it is possible to accurately detect the pressure of the cooling water.

[0054] FIG. 7 is a diagram showing another example of mounting the pressure sensor 110 to the flow path. The pressure sensor 110 of this example does not include a housing 112 for housing the sensor cell 140. The sensor cell 140 of this example is housed in a recess 222 provided in a wall 212 of the flow path, such as a pipe 210. The sensor cell 140 may have a structure similar to that of the example shown in FIG. 4 or that of the example shown in FIG. 5. According to this example, the pressure sensor 110 can be made smaller. Also, in a device in which a plurality of pipes 210 are closely arranged, such as the connection control unit 202, it becomes easier to arrange the pressure sensor 110 in each pipe 210. Therefore, the state of the flow path can be detected with high accuracy.

[0055] The wall portion 212 has an inner surface 215 facing the space 211 and an outer surface 217 which is the surface opposite to the inner surface 215. The recess 222 is provided in the outer surface 217 of the wall portion 212. The recess 222 is connected to the space 211 by an opening 214 provided in the wall portion 212.

[0056] The sensor cell 140 comes into contact with the cooling water through the opening 214. The sensor cell 140 of this example measures the absolute pressure of the cooling water. The recess 222 may be filled with a sealant 224 that seals the entire sensor cell 140. The sealant 224 is, for example, a silicone gel. Alternatively, instead of filling the recess 222 with the sealant 224, a lid that covers the recess 222 may be provided as in FIG. 4, or a lid that covers the recess 222 and has a through-hole may be provided as in FIG. 5.

[0057] The wiring 152 in this example connects the terminal 149 and the outside of the recess 222. The wiring 152 may penetrate the wall 212 surrounding the recess 222. When the wall 212 is made of a resin material, the wiring 152 may be provided in the wall 212 by insert molding. Also, a chip capacitor may be disposed in each pair of adjacent wirings of the wiring 152 so as to connect the adjacent wirings. This chip capacitor may be provided instead of the chip capacitor 148 provided in the sensor cell 140 or together with the chip capacitor 148. When the wall 212 is made of a conductive material, an insulating portion is provided to insulate the wiring 152 from the wall 212. The wiring 152 may have a distance from the wall 212.

[0058] The wall portion 212 may have a thick portion 220 that is thicker than adjacent regions. The recess 222 may be provided in the thick portion 220. The thick portion 220 may be a part of a flange that connects the pipes 210 together. The thick portion 220 may be provided at a position different from the flange. The thick portion 220 may be provided with a connector 226. The wall portion 212 may be a part of the connector 226.

[0059] FIG. 8 shows an example of a top view of the semiconductor substrate 143 of the sensor cell 140. At least a part of the sensor cell 140 of this example is covered with a protective film 21 that has anti-static properties and is connected to a reference potential. The protective film 21 of this example may be applied to the sensor cell 140 of any of the embodiments. Depending on the components of the cooling water, the sensor cell 140 that comes into contact with the cooling water is likely to be charged. For example, if the viscosity of the cooling water is high, the sensor cell 140 is likely to be charged due to friction between the cooling water and the sensor cell 140. If the sensor cell 140 is charged, the signal level of the detection signal may fluctuate, and the pressure of the cooling water may not be detected accurately. By providing the protective film 21, the sensor cell 140 of this example detects the pressure of the cooling water with high accuracy.

[0060] The charge resistance performance is resistance to charges attached to the upper surface of the sensor cell 140. The charge resistance performance may be a function of suppressing charging of the sensor cell 140. If charges accumulate on the upper surface of the sensor cell 140, the sensor cell 140 may malfunction. The protective film 21 functions as a shielding film that prevents the sensor cell 140 from malfunctioning due to the charges when charges accumulate on the upper surface of the sensor cell 140. The protective film 21 may drain the charges on the sensor cell 140 to a ground potential or the like.

[0061] The protective film 21 may have anti-corrosion properties in addition to anti-electrostatic properties. The anti-corrosion properties are resistance to corrosive substances attached to the upper surface of the sensor cell 140. This can protect the sensor cell 140 from corrosion caused by the cooling water. In one example, the protective film 21 includes an acid-resistant material.

[0062] The protective film 21 in this example includes at least one of gold and platinum. For example, the protective film 21 is Cr / Pt / Au in which chromium (Cr), platinum (Pt), and gold (Au) are stacked from the semiconductor substrate 143 side. Alternatively, the protective film 21 may be Ti / Pt / Au in which titanium (Ti), platinum (Pt), and gold (Au) are stacked from the semiconductor substrate 143 side.

[0063] The sensor cell 140 of this example includes a circuit unit 30, a sensor unit 60, a first pad 41, and a second pad 42 formed on a semiconductor substrate 143. The semiconductor substrate 143 is, for example, a substrate made of Si or SiC. The sensor unit 60 is a diaphragm formed on the semiconductor substrate 143. The sensor unit 60 may be a thin-film region on the semiconductor substrate. The circuit unit 30 generates a detection signal whose signal level changes in response to a change in the resistance value of the sensor unit 60.

[0064] The sensor section 60 has a resistor section 11 for detecting a change in the amount of distortion of the diaphragm. The sensor section 60 of this example is provided on a semiconductor substrate 143, and is integrated with the circuit section 30 into a single chip.

[0065] The resistor section 11 includes four resistor sections 11a to 11d that form a Wheatstone bridge. In this example, the resistor sections 11a to 11d are semiconductor strain gauges that use piezoresistance elements whose resistance changes according to the strain of the diaphragm. This allows the sensor section 60 to detect the pressure applied to the diaphragm as a change in resistance.

[0066] The insulating region 16 is an insulating region provided on the upper surface of the semiconductor substrate 143 in the sensor unit 60. In one example, the insulating region 16 is a region in which an insulating film is provided on the upper surface of the semiconductor substrate 143. For example, the insulating region 16 has a LOCOS (Local Oxidation of Silicon) film or a polysilicon film formed by oxidizing the semiconductor substrate 143. The insulating region 16 is provided in a comb shape on the upper surface of the semiconductor substrate 143. This forms the meandering pattern of the resistor unit 11.

[0067] Voltages Va to Vd change according to changes in the resistance of resistor portion 11a to resistor portion 11d. Voltage Va is the voltage at the terminal between resistor portion 11a and resistor portion 11c. Voltage Vb is the voltage at the terminal between resistor portion 11a and resistor portion 11b. Voltage Vc is the voltage at the terminal between resistor portion 11c and resistor portion 11d. Voltage Vd is the voltage at the terminal between resistor portion 11b and resistor portion 11d.

[0068] The circuit section 30 is provided around the sensor section 60. The circuit section 30 is electrically connected to the sensor section 60. The circuit section 30 has a circuit such as an IC that processes a signal detected by the sensor section 60. Detailed components of the circuit section 30 are omitted in FIG. 8. The circuit section 30 detects the pressure applied to the diaphragm by processing the signal output by the sensor section 60. For example, when the diaphragm is distorted by the applied pressure, a potential difference occurs in the output of the Wheatstone bridge. The circuit section 30 converts the pressure applied to the diaphragm into an electric signal by amplifying the potential difference between the voltages Va to Vd output by the Wheatstone bridge.

[0069] The first pad 41 and the second pad 42 are conductive pads provided above the semiconductor substrate 143. The pads such as the first pad 41 and the second pad 42 are made of a base material such as aluminum or an aluminum alloy provided on the semiconductor substrate 143. The pads such as the first pad 41 and the second pad 42 may be formed of the same material as the wiring on the semiconductor substrate 143. In one example, the first pad 41 and the second pad 42 are provided in openings formed by etching an insulating film above the circuit section 30.

[0070] A protective film 21 is provided above the semiconductor substrate 143 of the sensor cell 140. Another passivation film may be provided between the protective film 21 and the semiconductor substrate 143. A sealing portion 144 may be provided between the protective film 21 and the semiconductor substrate 143. In another example, the protective film 21 may be provided between the sealing portion 144 and the semiconductor substrate 143.

[0071] In this example, the protective film 21 is provided above the circuit section 30, the sensor section 60, the first pads 41, and the second pads 42. Moreover, it is preferable that the protective film 21 covers the entire circuit section 30. Covering the entire circuit section 30 means covering the entire upper part of the circuits provided in the circuit section 30. Moreover, in this example, the protective film 21 covers the entire sensor section 60, but it is not necessary for the protective film 21 to cover a part of the sensor section 60.

[0072] The protective film 21 on the second pad 42 and the protective film 21 on the first pad 41 are separated, and the second pad 42 is a pad electrically separated from the first pad 41. That is, the protective film 21 provided on the second pad 42 is electrically separated from the protective film 21 provided on the circuit section 30 other than on the second pad 42. The second pad 42 may be electrically connected to the outside of the sensor cell 140 by wire bonding or the like, or may be electrically connected to a circuit provided in the circuit section 30. The first pad 41 may be a ground terminal that sets the protective film 21 to a ground potential. In addition to the pads shown in the figure, pads corresponding to the first pad 41 and the second pad 42 may be provided.

[0073] The protective film 21 provided above the circuit section 30 is set to a predetermined reference potential. The protective film 21 may be set to the same potential as the semiconductor substrate 143 of the sensor cell 140. For example, the protective film 21 is set to the ground potential. This allows the protective film 21 to block the electric field generated by the charge even if an electrified charge adheres to the upper surface of the sensor cell 140.

[0074] In this example, the protective film 21 is provided not only above the circuit unit 30 but also on the first pad 41. This allows the protective film 21 to improve the anti-corrosion performance while also improving the anti-electrostatic performance of the circuit unit 30. In this case, the sensor cell 140 covers the circuit unit 30 with the same material as the protective film that covers the upper surface of the first pad 41, eliminating the need for an additional film formation process.

[0075] The protective film 21 may be formed of different materials for the first pads 41 and the circuit section 30 and the second pads 42. However, by forming the protective film 21 of the same material for the first pads 41, the circuit section 30 and the second pads 42, the number of film formation steps can be reduced.

[0076] 9 is a schematic diagram illustrating an example of the connection control unit 202. The connection control unit 202 is connected to a plurality of pipes 210. The connection control unit 202 of this example has a plurality of connection pipes 216. Each of the connection pipes 216 is connected to a pipe 210. The connection control unit 202 switches the connection between the connection pipes 216, thereby switching the connection between the pipes 210.

[0077] The connection control unit 202 in this example switches whether the pipe 210-1 is connected to one of the multiple pipes 210-2 and 210-3. The pipe 210-1 is an example of a main path, and the pipes 210-2 and 210-3 are examples of branch paths. The connection control unit 202 in this example switches whether the cooling water flows from the main path to one of the branch paths. The main path is, for example, the pipe 210 that connects the pump 201 and the connection control unit 202.

[0078] In this example, the main path is provided with at least one pressure sensor 110. The pressure sensor 110 may be provided in the pipe 210-1, or may be provided in a connecting pipe 216-1 connected to the pipe 210-1.

[0079] The detection unit 150 compares the pressure detected by the pressure sensor 110 with a set reference value and detects the state of the distribution path based on the comparison result. The pressure detected by the pressure sensor 110 varies depending on the state of the branch path connected to the main path. The detection unit 150 of this example detects the state of the branch path selected by the connection control unit 202 from among the multiple branch paths based on the pressure detected by the pressure sensor 110.

[0080] The pressure that the pressure sensor 110 should detect in a normal state varies for each branch path depending on the structure of each branch path, such as the length and pipe diameter. The detection unit 150 may correct the reference value depending on which branch path the connection control unit 202 has selected. Information indicating the selection state in the connection control unit 202 may be input to the detection unit 150. When the selection state of the connection control unit 202 is controlled by an electric signal, the electric signal may be input to the detection unit 150. A reference value to be used for each branch path may be set in advance in the detection unit 150 by a user or the like. The reference value to be used may be calculated from the structure of the distribution path, or may be determined by measuring the pressure when the cooling water is caused to flow through the distribution path in a normal state.

[0081] FIG. 10 is a schematic diagram for explaining an example of the connection control unit 202. The connection control unit 202 is connected to a plurality of pipes 210. The connection control unit 202 controls which of the plurality of pipes 210 are to be connected to each other. The connection control unit 202 may have a function to connect any two of the plurality of pipes 210. The connection control unit 202 may have a function to simultaneously connect a plurality of sets of pipes 210. For example, as shown in FIG. 10, when eight pipes 210 are connected to the connection control unit 202, the connection control unit 202 may simultaneously connect four sets of pipes 210, each set including two pipes 210.

[0082] The connection control unit 202 of this example has a main body 203, a plurality of connection pipes 216, and a switching unit 218. The plurality of connection pipes 216 are connected to the plurality of pipes 210 in a one-to-one relationship. The switching unit 218 switches which connection pipes 216 are to be connected to each other. This makes it possible to control which pipes 210 are to be connected to each other. The switching unit 218 may switch the connections between the connection pipes 216 by controlling a plurality of solenoid valves.

[0083] The main body 203 houses the switching unit 218. The main body 203 is provided with a connection pipe 216. One end of the connection pipe 216 is connected to the piping 210 outside the main body 203. The other end of the connection pipe 216 is connected to the switching unit 218 inside the main body 203.

[0084] At least one pressure sensor 110 may be provided in at least one connecting pipe 216. The pressure sensor 110 may be provided in the connecting pipe 216 outside the main body portion 203, or may be provided in the connecting pipe 216 inside the main body portion 203.

[0085] In FIG. 10, the pressure sensor 110 is provided for all the connecting pipes 216. In another example, the pressure sensor 110 may not be provided for at least one connecting pipe 216. For example, the pressure sensor 110 may be provided for the connecting pipe 216 corresponding to the piping 210 connected to the pump 201, and the pressure sensor 110 may not be provided for any of the other connecting pipes 216. Also, the pressure sensor 110 may not be provided for one connecting pipe 216, and the pressure sensor 110 may be provided for all the other connecting pipes 216. The switching unit 218 of this example connects four sets of connecting pipes 216. Even if the pressure sensor 110 is not provided for any one connecting pipe 216, at least one pressure sensor 110 can be provided for each set of connecting pipes 216. As a result, the pressure of the cooling water in the flow path through each set of connecting pipes 216 can be detected with a small number of pressure sensors 110.

[0086] 7, the pressure sensor 110 of this example may not have a housing 112. A recess 222 may be provided in the wall of each connection pipe 216, and a pressure sensor 110 may be provided in each recess 222. With this structure, multiple pressure sensors 110 can be provided even in a device with relatively little space. In another example, the multiple pressure sensors 110 provided in the connection control unit 202 may be provided inside one sensor module.

[0087] FIG. 11 is a top view illustrating an example of the sensor module 160. The sensor module 160 has a plurality of sensor cells 140. The sensor module 160 may be provided in the connection control unit 202. In this case, the plurality of sensor cells 140 of the sensor module 160 detect the pressure of the cooling water in the plurality of connection pipes 216 of the connection control unit 202. In another example, the sensor module 160 may be provided in a location other than the connection control unit 202. For example, the plurality of sensor cells 140 of the sensor module 160 may detect the pressure of the cooling water at a plurality of installation positions 111 of the distribution path. In this example, the sensor cell 140 has a structure similar to that of the example shown in FIG. 4, but may have a structure similar to that of the example shown in FIG. 5.

[0088] The sensor module 160 of this example has a main body 162, a plurality of sensor cells 140, a plurality of introduction tubes 172, a plurality of storage portions 174, a plurality of signal wires 168, a power supply wire 164, a power supply wire 166, and a connector 176. The plurality of sensor cells 140 are provided in the main body 162. The main body 162 may be formed of an insulating material such as resin. The main body 162 may be provided with a recess 170 that accommodates the plurality of sensor cells 140.

[0089] The main body 162 is provided with a plurality of inlet pipes 172. The inlet pipes 172 are connected to a flow path of the measurement target, such as the piping 210 or the connecting pipe 216. A relay pipe that connects the inlet pipes 172 to the flow path, such as the piping 210 or the connecting pipe 216, may be further provided. A portion of the cooling water flowing in the flow path, such as the piping 210 or the connecting pipe 216, is introduced into the inlet pipe 172. The multiple inlet pipes 172 may be arranged on a common surface of the main body 162.

[0090] The storage portions 174 are provided individually for the respective introduction pipes 172. The storage portions 174 may be spaces provided inside the main body portion 162. The storage portions 174 store the cooling water from the corresponding introduction pipes 172. The storage portions 174 are provided extending from the introduction pipes 172 to a position facing the sensor cell 140. The sensor cell 140 is disposed so as to be in contact with the cooling water in the storage portions 174, and detects the pressure of the cooling water in the storage portions 174.

[0091] A signal wiring 168 is provided for each sensor cell 140 of the sensor module 160. In the example of Fig. 11, signal wirings 168-1 to 168-4 are provided for the sensor cells 140-1 to 140-4. Each signal wiring 168 is connected to the output terminal Vout of the corresponding sensor cell 140 (see Fig. 6).

[0092] The power supply wiring 164 is provided in common to two or more sensor cells 140 of the sensor module 160. To the power supply wiring 164, the power supply terminals Vcc of the respective sensor cells 140 are commonly connected.

[0093] The power supply wiring 166 is provided in common to two or more sensor cells 140 of the sensor module 160. To the power supply wiring 166, the power supply terminals GND of the respective sensor cells 140 are commonly connected.

[0094] Each wiring and each terminal are connected by wiring 182 such as a wire. The signal wirings 168, the power wiring 164, and the power wiring 166 may be provided in the recess 170. The signal wirings 168, the power wiring 164, and the power wiring 166 may be a plate-shaped lead frame arranged on the bottom surface of the recess 170. A wiring board including the signal wirings 168, the power wiring 164, and the power wiring 166 may be arranged on the bottom surface of the recess 170. A chip capacitor may be arranged in each pair of adjacent wirings of the signal wirings 168, the power wiring 164, and the power wiring 166 so as to connect the adjacent wirings. This chip capacitor may be provided instead of the chip capacitor 148 provided in the sensor cell 140 or together with the chip capacitor 148.

[0095] The recess 170 may be filled with a sealing material made of an insulating material that seals the multiple sensor cells 140 and each wiring, or may be filled with a sealing material made of an insulating material to a thickness sufficient to cover the multiple signal wirings 168, the power wirings 164, the power wirings 166, and the terminals 149, and a lid portion that covers the recess 170 may be provided as in Figures 4 and 5. Alternatively, only a lid portion that covers the recess 170 may be provided as in Figure 4 without using a sealing material made of an insulating material, or only a lid portion that covers the recess 170 and has a through hole may be provided as in Figure 5. As the insulating material, for example, silicone gel may be used.

[0096] The multiple signal wirings 168, the power supply wirings 164, and the power supply wirings 166 may be provided extending in a predetermined extension direction (the X-axis direction in FIG. 11). The multiple signal wirings 168 may be disposed between the power supply wirings 164 and the power supply wirings 166 in the Y-axis direction. The multiple sensor cells 140 in this example are disposed side by side along the extension direction of the wirings. An end side on which each terminal is provided in the accommodation portion 141 of each sensor cell 140 may be disposed to face the multiple signal wirings 168, the power supply wirings 164, and the power supply wirings 166.

[0097] The plurality of signal wires 168, the power supply wire 164, and the power supply wire 166 are connected to a connector 176. The connector 176 connects the plurality of signal wires 168, the power supply wire 164, and the power supply wire 166 to the detection unit 150.

[0098] According to this example, the power supply wiring 164 and the power supply wiring 166 are provided in common to the multiple sensor cells 140, thereby making it possible to reduce the size of the sensor module 160. Furthermore, the multiple sensor cells 140 can be provided close to each other in the recess 170, thereby making it possible to reduce the space required to install the multiple sensor cells 140. Each of the length, width and height dimensions of the main body 162 may be 500 mm or less, 400 mm or less, or 300 mm or less.

[0099] Fig. 12 is an example of a cross-sectional view of the sensor module 160 shown in Fig. 11. As described in Fig. 11, the storage section 174 is provided so as to extend to a position facing the sensor cell 140. The storage section 174 and the sensor cell 140 are connected by a connection hole 178. The cooling water stored in the storage section 174 passes through the connection hole 178 and comes into contact with the sensor cell 140. The sensor cell 140 detects the pressure of the cooling water at the connection hole 178.

[0100] In this example, the storage portion 174 terminates inside the main body portion 162. The storage portion 174 is not connected to the outside of the main body portion 162 except for the points where it is connected to the inlet pipe 172 and the sensor cell 140. Since the storage portion 174 terminates inside the main body portion 162, the movement of the cooling water inside the storage portion 174 is suppressed. This suppresses friction between the cooling water and the sensor cell 140, and makes it possible to suppress charging of the sensor cell 140. Meanwhile, since the storage portion 174 is connected to the pipe 210 etc. via the inlet pipe 172, the pressure of the cooling water in the pipe 210 etc. can be detected by the sensor cell 140.

[0101] Storage portion 174 may extend from introduction pipe 172 to connection hole 178 and terminate at a position past connection hole 178. A portion of storage portion 174 beyond connection hole 178 may function as an air reservoir for storing gas such as air. A portion of storage portion 174 beyond connection hole 178 may have a portion that protrudes upward in the direction of gravity. Providing an air reservoir can prevent gas from being stored in the path from pipe 210 etc. to sensor cell 140. This can prevent loss of pressure transmission from pipe 210 etc. to sensor cell 140.

[0102] The main body 162 may further include a surge tank 180. The surge tank 180 is a portion in which the cross-sectional area of ​​the storage portion 174 is expanded in a plane perpendicular to the extension direction of the storage portion 174 (the Y-axis direction in this example). The surge tank 180 may be provided at a position closer to the introduction pipe 172 than the connection hole 178. The cross-sectional area of ​​the storage portion 174 at the position where the surge tank 180 is provided may be larger than the cross-sectional area of ​​the storage portion 174 between the surge tank 180 and the connection hole 178, and may be two or more times larger. By providing the surge tank 180, it is possible to reduce the impact of the cooling water on the sensor cell 140 even if the flow rate or pressure of the cooling water flowing through the pipe 210 or the like changes suddenly.

[0103] For example, when the main body portion 162 does not have the surge tank 180, it can be formed by integrally molding a plurality of signal wires 168, power supply wires 164, and power supply wires 166 with a resin mold. When the surge tank 180 is to be included, the main body portion 162 can be formed by forming a through hole that reaches the storage portion 174 in the Z direction from the surface of the main body portion 162 opposite to the recessed portion 170 shown in FIG. 12 after forming the main body portion 162 without the surge tank 180, and then providing a lid portion so as to cover the opening of the through hole.

[0104] FIG. 13 is a diagram showing another configuration example of the circulating unit 200. The circulating unit 200 of this example has a first cooling system 280 and a second cooling system 290. The first cooling system 280 cools the object 260 by circulating cooling water through the circulation path, similar to the circulating unit 200 described in FIG. 1 to FIG. 12. The second cooling system 290 cools the object by circulating a refrigerant different from the cooling water through the circulation path. The circulating refrigerant in the second cooling system 290 may include a gas such as water vapor. The pressure sensor 110 is provided in the first cooling system 280. The pressure sensor 110 may not be provided in the second cooling system 290.

[0105] The first cooling system 280 and the second cooling system 290 are thermally coupled by one or more heat exchangers 262. Each heat exchanger 262 exchanges heat between the cooling water of the first cooling system 280 and the refrigerant of the second cooling system 290.

[0106] The first cooling system 280 of this example has a plurality of annular paths 270-1 to 270-4. Each annular path 270 is a flow path having two ends. The cooling water that enters one end of the annular path 270 passes through the flow path and is discharged from the other end. Both ends of the annular path 270 are connected to the connection pipe 216 of the connection control unit 202. Each annular path 270 may be provided with a pump 201, a tank 263 that stores cooling water, an object 260 to be cooled, a heat exchanger 262, or two or more of these.

[0107] The connection control unit 202 of this example can connect two or more of the multiple circular paths 270 to each other. The connection control unit 202 may connect two or more of the circular paths 270 to form one circular path. The circular path is a path through which the cooling water circulates.

[0108] 10, the connection control section 202 of this example is provided with one or more pressure sensors 110. Depending on which annular path 270 the connection control section 202 connects, the structure of the flow path downstream of each pressure sensor 110 changes. Therefore, the pressure that each pressure sensor 110 should detect under normal conditions changes depending on the state of the connection control section 202. The detection section 150 may correct the reference value for each pressure sensor 110 depending on which annular paths the connection control section 202 connects. The detection section 150 may set a reference value for each pressure sensor 110 for each connection state in the connection control section 202.

[0109] The flow path may be provided with a direction control unit that controls the direction in which the cooling water flows. For example, the direction in which the cooling water flows can be controlled by switching between the inlet and the outlet of the pump 201. In this case, the pump 201 functions as the direction control unit. Also, when the connection control unit 202 exchanges the connection destinations of both ends of one annular path 270 with each other, the cooling water flows in the opposite direction in the annular path 270. In this case, the connection control unit 202 functions as the direction control unit.

[0110] When the coolant flow direction changes, the downstream direction of each pressure sensor 110 changes, and the structure downstream of the pressure sensor 110 changes. Therefore, the pressure that each pressure sensor 110 should detect under normal conditions changes depending on the direction of the coolant flow. The detection unit 150 may correct the reference value for each pressure sensor 110 depending on the direction of the coolant flow. The detection unit 150 may set a reference value for each pressure sensor 110 for each direction of the coolant flow.

[0111] In each of the embodiments described in this specification, the detection unit 150 may correct the reference value according to the operating state of the flow-through unit 200. For example, according to the operating state of the pump 201, the appropriate pressure of the cooling water at each position in the flow path varies. The detection unit 150 may correct the reference value according to the operating state of the pump 201. The operating state of the pump 201 may be, for example, at least one of the discharge pressure, suction pressure, discharge flow rate, and suction flow rate of the pump 201.

[0112] FIG. 14 is a diagram showing another configuration example of the flow-through unit 200. The flow-through unit 200 of this example includes a first cooling system 280, a second cooling system 290, and a third cooling system 282. The second cooling system 290 is the same as the example in FIG. 13. The third cooling system 282 cools the object 260 by circulating the cooling water through the flow path, similar to the flow-through unit 200 described in FIGS. 1 to 12. The cooling water flowing through the third cooling system 282 may be at a higher temperature than the cooling water flowing through the first cooling system 280.

[0113] The first cooling system 280 and the second cooling system 290 are thermally coupled by one or more heat exchangers 262. The third cooling system 282 and the second cooling system 290 may also be thermally coupled by one or more heat exchangers 262. Further, the first cooling system 280 and the third cooling system 282 may also be thermally coupled by one or more heat exchangers 262.

[0114] The pressure sensor 110 may be provided in both the first cooling system 280 and the third cooling system 282. The detection unit 150 monitors the state of the flow path in each of the first cooling system 280 and the third cooling system 282.

[0115] In each of the embodiments described in this specification, each sensor cell 140 may have the same structure or may have different structures. As an example, the detection system 100 may be provided with a sensor cell 140 in which the thickness or material of the sealing portion 144 is different from that of other sensor cells 140.

[0116] Each sensor cell 140 may include a pressure sensor with a different sensitivity. As an example, in a detection system having a plurality of flow paths, when the flow paths of cooling water with different pressures are provided, a pressure sensor with an optimal sensitivity for each pressure may be used. In this case, one flow path may refer to one pipe 210, one device such as a connection control unit 202, or one continuous space 211 in which the pressure of the cooling water is equal. In addition, when a plurality of pumps 201 are included in the cooling system, the path between two pumps 201 may be treated as one flow path. Different sensitivities may refer to, for example, different pressure values ​​at which the sensitivity is highest, different measurable pressure ranges, or different pressure measurement resolutions.

[0117] As another example, for the same flow path, a pressure sensor with sensitivity to measure the cooling water pressure during normal operation, for example 300 kPa or less, and a pressure sensor with higher sensitivity to measure in the range of, for example 10 kPa, for diagnostic purposes to detect leaks or clogging in the flow path may be used in combination.

[0118] The flow path may have some locations where air bubbles are likely to occur in the cooling water. For example, air bubbles are relatively likely to occur in locations where the pressure of the cooling water changes abruptly, such as near pump 201, or in locations where the flow path terminates. When air bubbles occur in the cooling water, the sealing portion 144 of sensor cell 140 may be ground by the air bubbles.

[0119] The first sensor cell 140, which is located at a relatively short distance from the pump 201 or the terminal end of the flow path, may have a thicker sealing portion 144 than the second sensor cell 140, which is located at a relatively long distance from the pump 201 or the terminal end of the flow path. At least a portion of the sealing portion 144 of the first sensor cell 140 may be formed of a material having a higher hardness than the sealing portion 144 of the second sensor cell 140. The sealing portion 144 of the first sensor cell 140 may be covered with a material having a higher hardness than the sealing portion 144 of the second sensor cell 140. This can improve the reliability of the first sensor cell 140.

[0120] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the claims that such modifications and improvements can also be included in the technical scope of the present invention. [Explanation of symbols]

[0121] REFERENCE SIGNS LIST 11 resistor portion, 16 insulating region, 21 protective film, 30 circuit portion, 41 first pad, 42 second pad, 60 sensor portion, 100 detection system, 110 pressure sensor, 111 installation position, 112 housing, 114 intake portion, 116 connector, 118 wiring, 120 sealing member, 122 protrusion, 124 screw, 126 cover portion, 128 main portion, 130 adhesive, 132 recess, 134 adhesive, 136 through hole, 140 sensor cell, 141 housing, 142 base material, 143 semiconductor substrate, 144 sealing portion, 145 wiring, 146 through hole, 148 chip capacitor, 149 terminal, 150 detection portion, 152 wiring, 160 sensor module, 162 main body, 164 power supply wiring, 166 power supply wiring , 168...signal wiring, 170...recess, 172...inlet pipe, 174...storage section, 176...connector, 178...connection hole, 180...surge tank, 182...wiring, 200...circulation section, 201...pump, 202...connection control section, 203...main body, 210...piping, 211...space, 212...wall section, 213...projection section, 214...opening, 215...inner surface, 216...connection pipe, 217... ·Outer surface, 218···Switching portion, 220···Thick portion, 222···Recess, 224···Sealant, 226···Connector, 251···Air conditioner, 252···Radiator, 253···Battery, 254···Power train, 260···Object, 262···Heat exchanger, 263···Tank, 270···Annular path, 280···First cooling system, 282···Third cooling system, 290···Second cooling system, 300···Temperature adjustment device

Claims

1. A temperature control device that performs heat exchange between cooling water and one or more objects, A circulation section including a circulation path through which the cooling water flows; A detection system for detecting a state of the distribution channel; Equipped with The detection system comprises: a pressure sensor provided at least at one position in the flow path and configured to detect a pressure of the cooling water; a detection unit that detects a state of the distribution path based on the pressure detected by the pressure sensor; A temperature control device having

2. The distribution channel is Multiple pipes and a connection control unit that controls which of the plurality of pipes are to be connected to each other; having The connection control unit is A plurality of connection pipes connected to the plurality of pipes; a switching unit that switches which of the plurality of connecting pipes are to be connected to each other; having At least one of the pressure sensors is provided in at least one of the connecting pipes. The temperature adjustment device according to claim 1 .

3. The distribution channel is The main route, Multiple branching paths; a connection control unit that controls which of the plurality of branch paths the main path is to be connected to; having The pressure sensor is provided in the main path, The detection unit compares the pressure detected by the pressure sensor with a reference value and detects a state of the distribution channel based on a comparison result. The detection unit corrects the reference value depending on which branch route is selected by the connection control unit. The temperature adjustment device according to claim 1 .

4. The distribution channel is A plurality of circular paths; a connection control unit capable of connecting two or more of the plurality of circular paths to each other; having The detection unit compares the pressure detected by the pressure sensor with a reference value and detects a state of the distribution channel based on a comparison result. The detection unit corrects the reference value depending on which of the circular paths the connection control unit has connected. The temperature adjustment device according to claim 1 .

5. The flow path has a direction control unit that controls a direction in which the cooling water flows, The detection unit detects the state of the flow path based on the pressure detected by the pressure sensor and the direction of the cooling water flow controlled by the direction control unit. The temperature adjustment device according to claim 1 .

6. the pressure sensor has a sensor cell that generates a detection signal corresponding to the pressure of the cooling water, At least a portion of the sensor cell is covered with a protective film connected to a reference potential. The temperature adjustment device according to any one of claims 1 to 5.

7. The flow path includes a wall portion surrounding a space through which the cooling water passes, The wall portion is provided with an opening, The pressure sensor includes: an intake portion connected to the opening of the wall portion and configured to take in the cooling water; a sensor cell that detects the pressure of the cooling water taken in by the intake portion; The temperature adjustment device according to claim 1 , further comprising:

8. The flow path includes a wall portion surrounding a space through which the cooling water passes, The wall portion is A recess provided on a surface opposite to the space; an opening connecting the recess and the space; having The pressure sensor is disposed inside the recess and has a sensor cell that detects the pressure of the cooling water. The temperature adjustment device according to any one of claims 1 to 5.

9. the pressure sensor has a sensor cell including an output terminal that outputs a detection signal corresponding to the pressure of the cooling water and a power supply terminal to which a power supply voltage is applied; The sensor cell includes a chip capacitor that connects the output terminal and the power supply terminal. The temperature adjustment device according to any one of claims 1 to 5.

10. A plurality of the pressure sensors are provided, Each of the pressure sensors has a sensor cell including an output terminal for outputting a detection signal corresponding to the pressure of the cooling water and a power supply terminal to which a power supply voltage is applied, The detection system comprises: signal wiring provided for each of the two or more sensor cells and connected to the output terminal of each of the sensor cells; a power supply wiring provided in common for two or more of the sensor cells and commonly connected to the power supply terminals of the sensor cells; The temperature adjustment device according to claim 1 , further comprising:

11. a sensor module including a plurality of the sensor cells, the signal wiring, and the power supply wiring; The sensor module includes: a main body portion in which a plurality of the sensor cells, the signal wiring, and the power supply wiring are provided; an inlet pipe provided for each of the sensor cells, for introducing the cooling water into the body portion; a reservoir portion that is provided inside the main body portion and extends from the inlet pipe to a position facing the sensor cell, and that stores the cooling water; having Each of the sensor cells detects the pressure of the cooling water in the storage portion. The temperature adjustment device according to claim 10.

12. The reservoir terminates within the body. The temperature adjustment device according to claim 11.

13. The main body portion is a connection hole that connects the storage portion and the sensor cell; a surge tank provided at a position closer to the inlet pipe than the connection hole; The temperature adjustment device according to claim 12 .

14. The detection system comprises: A plurality of the flow paths having different pressures of the cooling water; a plurality of pressure sensors each having a different sensitivity depending on a pressure of the cooling water, the pressure sensors being provided in each of the plurality of flow paths; The temperature adjustment device of claim 1 .

15. The detection system includes a plurality of pressure sensors having different sensitivities, Each of the pressure sensors is provided in one flow path. The temperature adjustment device according to claim 10.

16. A detection system for detecting a state of a flow path through which cooling water flows, a pressure sensor provided at least at one position in the flow path and configured to detect a pressure of the cooling water; a detection unit that detects a state of the distribution path based on the pressure detected by the pressure sensor; A detection system comprising:

Images