Resin composition and electronic device

Abstract

To provide a resin composition of which the performance balance of insulation property, thermal conductivity and reliability is improved.SOLUTION: Provided is a resin composition which comprises one, two or more inorganic fillers selected from a group consisting of a silicone resin, alumina, boron nitride and silica. The resin composition is subjected to temperature rising from 30°C to 175°C for 30 minutes with a constant speed, and then is subjected to heat treatment at 175°C for 60 minutes so as to obtain a cured product. The storage elastic modulus E'250 at 250°C of the cured product measured with a dynamic viscoelasticity measuring apparatus in a condition of frequency 10 Hz in a tensile mode is 25 MPa or more and 400 MPa or less.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition and an electronic device. [Background technology]

[0002] In recent years, the amount of heat generated from electronic components has increased with the increase in their performance, miniaturization, and density. Therefore, heat dissipation measures for electronic components have become a very important technology for maintaining the performance of electronic components and electrical products equipped with such electronic components. Heat dissipation measures for electronic components include a method of dissipating heat by attaching a heat sink, heat sink plate, heat sink fin, or other heat sink made of metal to the heat generating element of the electronic component. In addition, heat dissipation materials are often used between the heat generating element and the heat sink to fill the gap between the metals in order to efficiently transfer heat.

[0003] An example of such a heat dissipating material is a heat dissipating adhesive that is cured by heating. As a heat dissipating adhesive, a heat dissipating insulating adhesive composition that has heat dissipating properties and electrical insulating properties and can maintain sufficient adhesive strength when cured has been disclosed (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-212325 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the present inventors have conducted research and found that the heat dissipating insulating adhesive composition described in the above-mentioned document has room for improvement in terms of the occurrence of peeling at the interface between the adherend and the adhesive in a high temperature environment, and in terms of flexibility as measured by storage modulus, breaking strength, etc.

[0006] In view of the above circumstances, the present invention provides a resin composition having an improved balance of performance among insulation properties, thermal conductivity and reliability. [Means for solving the problem]

[0007] As a result of investigations, the present inventors have completed the invention provided below and have solved the above-mentioned problems.

[0008] [1] A silicone resin, one or more inorganic fillers selected from the group consisting of alumina, boron nitride, and silica; A resin composition comprising: The resin composition was heated from 30°C to 175°C at a constant rate over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product. The storage modulus E' at 250°C was measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. 250 The resin composition has a modulus of 25 MPa or more and 400 MPa or less. [2] In the resin composition according to the above [1], The resin composition was heated from 30°C to 175°C at a constant temperature over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product. The cured product was subjected to a tensile test using a Tensilon at 25°C and a load rate of 1.0 N / min. The breaking energy was measured to be 0.5×10 -3 J / mm 3 More than 20×10 -3 J / mm 3 A resin composition comprising: [3] In the resin composition according to the above [1] or [2], The resin composition was heated from 30°C to 175°C at a constant temperature over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product. The storage modulus E' at 25°C was measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. 25 The resin composition has a modulus of 100 MPa or more and 3000 MPa or less. [4] In the resin composition according to any one of the above [1] to [3], The resin composition is heated from 30°C to 175°C at a constant temperature rate over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product, the cured product having a breaking strength of 1 MPa or more and 50 MPa or less as measured by a tensile test using a Tensilon at 25°C and a load rate of 1.0 N / min. [5] In the resin composition according to any one of the above [1] to [4], The resin composition, wherein the silicone resin comprises an epoxy-modified silicone resin. [6] In the resin composition according to any one of the above [1] to [5], The resin composition, wherein the silicone resin comprises a resin represented by the following general formula (1): [ka] (In general formula (1), R 1 ~R 4 are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. n is an integer of 1 to 10. [7] In the resin composition according to any one of the above [1] to [6], The resin composition further comprises a curing agent. [8] In the resin composition according to the above [7], The resin composition, wherein the curing agent comprises one or more selected from the group consisting of a phenol compound, a polyamine compound, a thiol compound, and an acid anhydride. [9] In the resin composition according to any one of the above [1] to [8], The resin composition further comprises a curing accelerator.

[10] In the resin composition according to the above [9], The resin composition, wherein the curing accelerator comprises one or more selected from the group consisting of organic phosphines, tetra-substituted phosphonium compounds, tetra-substituted borate compounds, and tertiary amines.

[11] In the resin composition according to any one of the above [1] to

[10] , The resin composition further comprises a solvent.

[12] In the resin composition according to the above

[11] , A resin composition, wherein the content of the solvent is 1% by mass or more and 20% by mass or less, when the content of all components of the resin composition is taken as 100% by mass.

[13] In the resin composition according to the above

[11] or

[12] , The resin composition, wherein the solvent comprises one or more selected from the group consisting of ε-caprolactone, γ-butyrolactone, butyl carbitol acetate, tripropylene glycol monobutyl ether, ethylene glycol mono-n-butyl ether acetate, and butyl carbitol.

[14] An electronic device comprising a cured product of the resin composition according to any one of the above [1] to

[13] . Effect of the Invention

[0009] According to the present invention, it is possible to provide a resin composition and an electronic device having an improved balance of performance among insulation properties, thermal conductivity, and reliability. [Brief description of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view showing an example of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described in detail.

[0012] <Resin composition> First, the resin composition of the present embodiment will be described.

[0013] The resin composition of the present embodiment is a resin composition containing a silicone resin and one or more inorganic fillers selected from the group consisting of alumina, boron nitride, and silica. The resin composition is heated from 30° C. to 175° C. at a constant rate over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The storage modulus E' at 250° C. of the cured product is measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. 250 is 25 MPa or more and 400 MPa or less.

[0014] Conventionally, heat dissipating insulating adhesive compositions with improved heat dissipation and electrical insulation have been studied, for example, by incorporating a large amount of a filler that improves heat dissipation and electrical insulation. However, the present inventors have found that there is room for improvement in reliability, in view of the fact that, when using conventional compositions, peeling occurs at the interface between the adherend and the adhesive in harsh environments such as high temperature environments, and the adhesive breaks when used in flexible devices, etc.

[0015] Here, the present inventors have found that the resin composition of this embodiment can solve the above problem by containing a specific resin and having a storage modulus measured under specific conditions within a specific numerical range. This is thought to be because, for example, in a high-temperature environment, the resin composition absorbs deformation stress caused by thermal contraction and the like, and suppresses peeling that occurs at the interface between the adherend and the adhesive, due to the resin composition containing a specific resin and having a storage modulus within a specific numerical range. In addition, when bending stress is applied to the resin composition, the resistance to bending stress is improved, and therefore the occurrence of breakage in the resin composition is suppressed. In other words, the resin composition of the present embodiment has a storage modulus measured under specific conditions within a specific numerical range, and therefore can provide a resin composition with an improved performance balance of high insulation, thermal conductivity, and reliability.

[0016] At this time, the resin composition was heated from 30° C. to 175° C. at a constant rate over 30 minutes, and then heat-treated at 175° C. for 60 minutes. The storage modulus E' at 250° C. of the cured product was measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. 250 is 25 MPa or more, preferably 40 MPa or more, and more preferably 50 MPa or more. 250 When the resin composition is equal to or larger than the lower limit, peeling or breakage is suppressed, and reliability is improved. In addition, the storage elastic modulus E' 250 is 400 MPa or less, preferably 350 MPa or less, and more preferably 300 MPa or less. 250 When the viscosity of the resin composition of the present embodiment is equal to or less than the upper limit, the viscosity of the resin composition of the present embodiment is suitable, and the adhesive strength to other materials is more suitable.

[0017] The components of the resin composition of the present embodiment will be described in more detail below.

[0018] [Silicone resin] The resin composition of the present embodiment contains a silicone resin. By including a silicone resin in the resin composition of the present embodiment, it is possible to provide a resin composition with an improved balance of performance among insulation properties, thermal conductivity, and reliability.

[0019] In the resin composition of the present embodiment, the silicone resin is specifically a polymer chain having a main skeleton formed by siloxane bonds. More specifically, the silicone resin includes vinyl group-containing organopolysiloxane, organohydrogenpolysiloxane, epoxy-modified silicone resin, dimethyl silicone resin, phenylmethyl silicone resin, alkyl-aralkyl-modified silicone resin, fluorosilicone resin, polyether-modified silicone resin, fatty acid ester-modified silicone resin, methyl hydrogen silicone resin, silanol group-containing silicone resin, alkoxy group-containing silicone resin, phenol group-containing silicone resin, methacryl-modified silicone resin, acrylic-modified silicone resin, amino-modified silicone resin, carboxylic acid-modified silicone resin, carbinol-modified silicone resin, mercapto-modified silicone resin, fluorine-modified silicone resin, polyether-modified silicone resin, etc. Among these, it is preferable to contain an epoxy-modified silicone resin. As the silicone resin, one or a combination of two or more of the above specific examples can be used.

[0020] In the resin composition of the present embodiment, from the viewpoint of improving the balance of performance among insulation, thermal conductivity, and reliability, it is preferable that the silicone resin contains a resin represented by the following general formula (1).

[0021] [ka]

[0022] In general formula (1), R 1 ~R 4 are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and n is an integer of 1 to 10.

[0023] In the above general formula (1), R 1 ~R 4Examples of the alkyl group having 1 to 10 carbon atoms that can constitute the above group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group.

[0024] R 1 , R 2 , R 3 and R 4 The hydrogen atoms in the alkyl group having 1 to 10 carbon atoms may be substituted with any atomic group. For example, they may be substituted with a fluorine atom, a hydroxyl group, a carboxyl group, or the like. More specifically, R 1 , R 2 , R 3 and R 4 As the alkyl group having 1 to 10 carbon atoms, a fluorinated alkyl group or the like may be selected. In the above general formula (1), from the viewpoint of improving the performance balance of insulation, thermal conductivity, and reliability, n is preferably 1 or more and 8 or less, more preferably 1 or more and 5 or less, even more preferably 1 or more and 3 or less, even more preferably 1 or more and 2 or less, and even more preferably 1.

[0025] In the silicone resin in the resin composition of the present embodiment, from the viewpoint of improving the performance balance of insulation, thermal conductivity, and reliability, R 1 ~R 4 is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, even more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, still more preferably a hydrogen atom or a methyl group, and even more preferably a methyl group.

[0026] An example of such a silicone resin is TSL-9906 (a silicone resin represented by the following formula (2)) manufactured by Momentive Corporation.

[0027] [ka]

[0028] From the viewpoint of improving the performance balance of insulation, thermal conductivity, and reliability, the content of the silicone resin in the resin composition of this embodiment, when the content of all components of the resin composition is taken as 100 mass%, is preferably 1 mass% or more, more preferably 2 mass% or more, even more preferably 3 mass% or more, even more preferably 4 mass% or more, even more preferably 5 mass% or more, and is preferably 20 mass% or less, more preferably 15 mass% or less, even more preferably 10 mass% or less, and even more preferably 7 mass% or less.

[0029] [Inorganic filler] The resin composition of the present embodiment contains one or more members selected from the group consisting of alumina, boron nitride, and silica. By including the inorganic filler as described above, the resin composition has favorable insulating properties and thermal conductivity.

[0030] The average particle size D at 50% cumulative volumetric particle size distribution of inorganic fillers measured by the laser diffraction scattering method 50 From the viewpoint of improving the performance balance of insulation, thermal conductivity, and reliability, the thickness is preferably 0.01 μm or more, more preferably 0.1 μm or more, even more preferably 0.5 μm or more, and is preferably 150 μm or less, more preferably 50 μm or less, even more preferably 15 μm or less, even more preferably 10 μm or less. The inorganic filler in the resin composition of the present embodiment has a different average particle diameter D 50 Two or more kinds of inorganic fillers having the above formula may be used together.

[0031] The above average particle size D 50 For example, the value at which the integrated value in the volume-based particle size distribution measured by a laser diffraction scattering measurement method is 50%, which is measured using a laser diffraction particle size distribution analyzer (SALD-7000, manufactured by Shimadzu Corporation), can be used.

[0032] From the viewpoint of improving the performance balance of insulation, thermal conductivity, and reliability, the content of the inorganic filler in the resin composition of this embodiment, when the content of all components of the resin composition is 100 mass%, is preferably 50 mass% or more, more preferably 60 mass% or more, even more preferably 70 mass% or more, and even more preferably 80 mass% or more, and is preferably 97 mass% or less, more preferably 95 mass% or less, even more preferably 92 mass% or less, even more preferably 90 mass% or less, and even more preferably 87 mass% or less.

[0033] The resin composition of the present embodiment may contain a conventionally known inorganic filler other than alumina, boron nitride, and silica in combination, as long as the effect of the resin composition of the present embodiment is not impaired.

[0034] [Other ingredients] The encapsulating resin composition of the present embodiment may contain the following components in addition to the above components.

[0035] (thermosetting resin) The resin composition of the present embodiment may contain a thermosetting resin. In the resin composition of the present embodiment, a conventionally known thermosetting resin can be used as the thermosetting resin. Examples of the thermosetting resin include epoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, phenol resin, melamine resin, urethane resin, cyanate resin, maleimide resin, acrylic resin, phenol derivatives, and derivatives thereof. As these thermosetting resins, monomers, oligomers, and polymers having two or more reactive functional groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited. Among them, from the viewpoints of compatibility with silicone resin, thermal conductivity, and reliability, it is preferable to include one or more types selected from the group consisting of epoxy resin, maleimide resin, acrylic resin, and urethane resin.

[0036] Examples of epoxy resins that can be used in the present embodiment include known epoxy resins that are generally used in resin compositions. Examples of known epoxy resins include phenol novolac epoxy resins, cresol novolac epoxy resins, and other novolac resins obtained by condensing or co-condensing phenols such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and / or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst; diglycidyl ethers of bisphenol A, bisphenol F, bisphenol S, and bisphenol A / D; biphenyl epoxy resins, which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; phenol aralkyl epoxy resins and biphenyl aralkyl epoxy resins synthesized from phenols and dimethoxy-paraxylene or bis(methoxymethyl)biphenyl; naphthol aralkyl epoxy resins, which are synthesized from phenols and dimethoxy-paraxylene or bis(methoxymethyl)biphenyl; epoxidized products of aralkyl-type resins such as epoxy resins; aromatic polyfunctional epoxy resins such as polyfunctional epoxy resins having a fluorene skeleton; stilbene-type epoxy resins; hydroquinone-type epoxy resins; glycidyl ester-type epoxy resins obtained by reacting polybasic acids such as phthalic acid and dimer acid with epichlorohydrin; glycidylamine-type epoxy resins obtained by reacting polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin; dicyclopentadiene-type epoxy resins which are epoxidized products of co-condensation resins of dicyclopentadiene and phenols; triphenolmethane-type epoxy resins, trimethylolpropane-type epoxy resins; terpene-modified epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; aliphatic polyfunctional epoxy resins; polyfunctional alicyclic epoxy resins; and epoxy resins obtained by modifying these epoxy resins with silicone, acrylonitrile, butadiene, isoprene-based rubber, polyamide-based resin, or the like.Among these, from the viewpoint of improving the bending strength of the resin composition, it is preferable to contain one or more compounds selected from the group consisting of biphenyl-type epoxy resins, biphenyl aralkyl-type epoxy resins, cresol novolac-type epoxy resins, aromatic polyfunctional epoxy resins, aliphatic polyfunctional epoxy resins, and polyfunctional alicyclic epoxy resins. As the epoxy resin, one or a combination of two or more of the above specific examples can be used.

[0037] Examples of the maleimide resin that can be used in the present embodiment include known maleimide resins that are generally used in resin compositions. Examples of known maleimide resins include 4,4'-diphenylmethane bismaleimide, m-phenylene bismaleimide, p-phenylene bismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane, 4-methyl-1,3-phenylene bismaleimide, N,N'-ethylene dimaleimide, N,N'-hexamethylene dimaleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, and compounds having two maleimide groups in the molecule, such as bisphenol A diphenyl ether bismaleimide, and compounds having three or more maleimide groups in the molecule, such as polyphenylmethane maleimide. As the maleimide resin, one or a combination of two or more of the above specific examples can be used.

[0038] The acrylic resin that can be used in this embodiment is a compound having a radically polymerizable (meth)acryloyl group in the molecule, and is a compound that can form a three-dimensional network structure and harden by reacting with the (meth)acryloyl group. The molecule must have at least one (meth)acryloyl group, but it is preferable that the molecule has at least two (meth)acryloyl groups in order to form a three-dimensional network structure. Examples of compounds having a radically polymerizable (meth)acryloyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 1,2-cyclohexanediol mono(meth)acrylate, 1,3-cyclohexanediol mono(meth)acrylate, 1,4-cyclohexanediol mono(meth)acrylate, 1,2-cyclohexanedimethanol mono(meth)acrylate, 1,3-cyclohexanedimethanol mono(meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, 1,2-cyclohexane Examples of the hydroxyl group-containing (meth)acrylate include diethanol mono(meth)acrylate, 1,3-cyclohexane diethanol mono(meth)acrylate, 1,4-cyclohexane diethanol mono(meth)acrylate, glycerin mono(meth)acrylate, glycerin di(meth)acrylate, trimethylolpropane mono(meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol mono(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, and neopentyl glycol mono(meth)acrylate, as well as carboxyl group-containing (meth)acrylates obtained by reacting these hydroxyl group-containing (meth)acrylates with dicarboxylic acid or a derivative thereof. Examples of dicarboxylic acids that can be used herein include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and derivatives thereof. As the acrylic resin, one or a combination of two or more of the above specific examples can be used.

[0039] Examples of the urethane resin that can be used in the present embodiment include known urethane resins that are generally used in resin compositions, such as polyether-based urethane resins, polycarbonate-based urethane resins, polyester-based urethane resins, and modified products thereof. As the urethane resin, one or a combination of two or more of the above specific examples can be used.

[0040] The content of the thermosetting resin in the resin composition of this embodiment is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 5% by mass or more, and even more preferably 7% by mass or more, when the content of all components of the resin composition is 100% by mass. By having the content of the thermosetting resin be equal to or more than the above lower limit, the adhesive strength with other materials becomes more suitable. As a result, the occurrence of peeling or breakage in the resin composition is suppressed, and the reliability becomes more suitable. The content of the thermosetting resin in the resin composition is preferably 50% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less, even more preferably 20% by mass or less, and even more preferably 10% by mass or less, when the content of all components of the resin composition is 100% by mass. By making the content of the thermosetting resin equal to or less than the upper limit, the viscosity of the resin composition of the present embodiment becomes suitable.

[0041] (hardening agent) The resin composition of the present embodiment preferably further contains a curing agent, which improves the curability of the resin composition and provides more suitable adhesive strength to other materials.

[0042] Examples of the curing agent that can be used in the resin composition of the present embodiment include known curing agents that are generally used in resin compositions. Examples of known curing agents include novolac-type phenolic resins obtained by condensing or co-condensing phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol and / or naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthalene with compounds having aldehyde groups such as formaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst, polyfunctional phenolic resins such as triphenylmethane-type phenolic resins and biphenylene skeleton-containing polyfunctional phenolic resins, phenol aralkyl-type phenolic resins synthesized from phenols and / or naphthols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl, dicyclopentadiene-type phenolic resins, and terpene-modified phenolic resins; aliphatic polyphenols such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylenediamine (MXDA); Examples of the polyamine compounds include aromatic polyamines such as amines, diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diaminodiphenylsulfone (DDS), as well as dicyandiamide (DICY) and organic acid dihydralazides; thiol compounds including 1,4-benzenedithiol, 4,4'-biphenyldithiol, and p-xylylenedithiol; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA); polyphenol compounds such as novolac-type phenolic resins and phenol polymers; polymercaptan compounds such as polysulfides, thioesters, and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and organic acids such as carboxylic acid-containing polyester resins. Among these, from the viewpoint of compatibility with other resins such as silicone resins, it is preferable to contain one or more compounds selected from the group consisting of phenol compounds, polyamine compounds, thiol compounds, and acid anhydrides, and it is more preferable to contain a phenol compound. These may be used alone or in combination of two or more.

[0043] The content of the curing agent in the resin composition of this embodiment is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, even more preferably 1.5% by mass or more, and even more preferably 2.0% by mass or more, when the content of all components of the resin composition is 100% by mass. By the content of the curing agent being equal to or more than the above lower limit, the adhesive strength with other materials becomes more suitable. As a result, the occurrence of peeling or breakage in the resin composition is suppressed, and the reliability becomes more suitable. In addition, the content of the curing agent in the resin composition of this embodiment is preferably 10% by mass or less, more preferably 8% by mass or less, even more preferably 5% by mass or less, and even more preferably 3% by mass or less, when the content of all components of the resin composition is 100% by mass. By making the content of the curing agent equal to or less than the upper limit, the balance between the curing speed and the viscosity of the resin composition becomes favorable, and the workability when using the resin composition becomes more favorable.

[0044] (Cure accelerator) The resin composition of the present embodiment preferably further contains a curing accelerator, which improves the curability of the resin composition and provides more suitable adhesive strength to other materials. The curing accelerator has a function of accelerating the reaction between the reactive groups of the silicone resin and the reactive groups of the curing agent, and any conventionally known curing accelerator can be used.

[0045] Examples of the curing accelerator include phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds; boron atom-containing compounds such as tetra-substituted borate compounds such as tetraphenylphosphonium tetraphenylborate; amidines such as 1,8-diazabicyclo(5,4,0)undecene-7, tertiary amines such as benzyldimethylamine, 2-methylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole, and nitrogen atom-containing compounds such as quaternary salts of the above amidines and amines, and these may be used alone or in combination of two or more. Among these, from the viewpoint of compatibility with silicone resins, it is preferable to use one or more selected from the group consisting of organic phosphines, tetra-substituted phosphonium compounds, tetra-substituted borate compounds, and tertiary amines, and it is more preferable to use tertiary amines.

[0046] Examples of organic phosphines that can be used in the resin composition of this embodiment include primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; and tertiary phosphines such as trimethylphosphine, triethylphosphine, tributylphosphine, and triphenylphosphine.

[0047] Specific examples of the curing accelerator in the resin composition of this embodiment include TPP, TPP-K, TPP-S, TPTP-S (manufactured by Hokko Chemical Industry Co., Ltd.), Curesol 2MZ, 2E4MZ, 2PZ, 1B2PZ, Cl1Z, Cl1Z-CN, Cl1Z-CNS, Cl1Z-A, 2MZ-OK, 2MA-OK, 2PHZ, 2PHZ-PW (manufactured by Shikoku Chemical Industry Co., Ltd.), and the like.

[0048] In the resin composition of the present embodiment, only one type of curing accelerator may be used, or two or more types of curing accelerators may be used in combination.

[0049] From the viewpoint of suppressing the occurrence of peeling or breakage and improving reliability, the content of the curing accelerator in the resin composition of this embodiment is preferably 0.01 mass % or more, more preferably 0.03 mass % or more, even more preferably 0.05 mass % or more, and is preferably 5.0 mass % or less, more preferably 3.0 mass % or less, even more preferably 1.0 mass % or less, and even more preferably 0.5 mass % or less, when the content of all components of the resin composition is 100 mass %.

[0050] (Adhesion aid) The resin composition of the present embodiment preferably further contains an adhesion assistant, which improves the reliability of the resin composition. Examples of the adhesion aid include coupling agents containing, as a functional group, an amino group, an epoxy group, a (meth)acrylic group, a mercapto group, a vinyl group, a ureido group, a sulfide group, etc. These may be used alone or in combination.

[0051] Among these, examples of amino group-containing coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldiethoxysilane, and N-phenyl-γ-aminopropyltrimethoxysilane.

[0052] Examples of epoxy group-containing coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, and γ-glycidylpropyltrimethoxysilane.

[0053] Examples of the (meth)acrylic group-containing coupling agent include γ-(methacryloxypropyl)trimethoxysilane, γ-(methacryloxypropyl)methyldimethoxysilane, and γ-(methacryloxypropyl)methyldiethoxysilane. An example of a mercapto group-containing coupling agent is 3-mercaptopropyltrimethoxysilane.

[0054] Examples of the vinyl group-containing coupling agent include vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane. An example of a ureido group-containing coupling agent is 3-ureidopropyltriethoxysilane.

[0055] Examples of sulfide group-containing coupling agents include bis(3-(triethoxysilyl)propyl) disulfide, bis(3-(triethoxysilyl)propyl) tetrasulfide, and the like.

[0056] From the viewpoint of suppressing the occurrence of peeling or breakage and improving reliability, the content of the adhesion aid in the resin composition of this embodiment, when the content of all components of the resin composition is taken as 100 mass%, is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.10 mass% or more, even more preferably 0.15 mass% or more, even more preferably 0.20 mass% or more, and is preferably 1.0 mass% or less, more preferably 0.8 mass% or less, even more preferably 0.5 mass% or less, and even more preferably 0.3 mass% or less.

[0057] (Initiator) The resin composition of the present embodiment preferably further contains an initiator. The initiator is typically a radical initiator or a cationic initiator, and an appropriate initiator may be selected based on the type of silicone resin or thermosetting resin.

[0058] Examples of the radical initiator include ketone peroxides such as methyl ethyl ketone peroxide, peroxyketals such as n-Butyl 4,4-di-(t-butylperoxy)valerate, hydroperoxides such as p-Menthane hydroperoxide, dialkyl peroxides such as di-α-cumyl peroxide and 1,1-bis(1,1-dimethylethylperoxy)cyclohexane, diacyl peroxides, peroxyesters such as t-Butyl peroxybenzoate, peroxydicarbonates, benzophenones, and acetophenones. Specific examples include Perhexa (registered trademark) C(S) (manufactured by NOF Corp.). Of course, the radical initiator is not limited to these. Any radical initiator can be used as long as it can generate radicals by heating to initiate a crosslinking reaction.

[0059] Specific examples of cationic initiators include Lewis acid generating initiators such as diazonium salts, Bronsted acid generating initiators such as iodonium salts and sulfonium salts, etc. Specific examples include Adeka Optomer SP-170 (manufactured by ADEKA), San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), Rhodorsil 2074 (manufactured by Rhodia Japan Co., Ltd.), etc.

[0060] In the resin composition of the present embodiment, only one type of initiator may be used, or two or more types of initiators may be used in combination. From the viewpoint of suppressing the occurrence of peeling or breakage and improving reliability, the content of the initiator in the resin composition of this embodiment is preferably 0.01 mass% or more, more preferably 0.03 mass% or more, even more preferably 0.05 mass% or more, and is preferably 5.0 mass% or less, more preferably 3.0 mass% or less, even more preferably 1.0 mass% or less, even more preferably 0.5 mass% or less, and even more preferably 0.3 mass% or less, when the content of all components of the resin composition is 100 mass%.

[0061] (Low stress agent) The resin composition of the present embodiment preferably further contains a stress reducing agent, which can improve the balance of performance among insulation properties, thermal conductivity, and reliability. The stress reducing agent is not particularly limited as long as it can reduce the stress of the resin composition of the present embodiment, and examples thereof include acrylic rubber, silicone rubber, urethane rubber, styrene-butadiene rubber, butadiene rubber, and modified products thereof. These can be used alone or in combination of two or more.

[0062] Specific examples of such low stress agents include RICOBOND 1731 (manufactured by Cray Valley).

[0063] From the viewpoint of improving workability when using the resin composition and suppressing the occurrence of peeling or breakage to improve reliability, the content of the low stress agent in the resin composition of this embodiment is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, even more preferably 0.5 mass% or more, even more preferably 0.7 mass% or more, and is preferably 3.0 mass% or less, more preferably 2.0 mass% or less, and even more preferably 1.0 mass% or less, when the content of all components in the resin composition is 100 mass%.

[0064] (solvent) The resin composition of the present embodiment preferably further contains a solvent. This can improve the flowability of the resin composition and contribute to improving workability. The solvent is typically an organic solvent. Examples of the solvent include the following: Of course, the solvent is not limited to these.

[0065] Alcohols such as ethyl alcohol, propyl alcohol, butyl alcohol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, nonyl alcohol, decyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, methyl methoxybutanol, α-terpineol, β-terpineol, hexylene glycol, benzyl alcohol, 2-phenylethyl alcohol, isopalmityl alcohol, isostearyl alcohol, lauryl alcohol, ethylene glycol, propylene glycol, and glycerin.

[0066] Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diacetone alcohol (4-hydroxy-4-methyl-2-pentanone), 2-octanone, isophorone (3,5,5-trimethyl-2-cyclohexen-1-one) and diisobutyl ketone (2,6-dimethyl-4-heptanone).

[0067] Esters such as ethyl acetate, butyl acetate, diethyl phthalate, dibutyl phthalate, acetoxyethane, methyl butyrate, methyl hexanoate, methyl octanoate, methyl decanoate, methyl cellosolve acetate, butyl carbitol acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, 1,2-diacetoxyethane, tributyl phosphate, tricresyl phosphate, and tripentyl phosphate.

[0068] Ethers such as tetrahydrofuran, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, tripropylene glycol monobutyl ether, propylene glycol dimethyl ether, ethoxyethyl ether, 1,2-bis(2-diethoxy)ethane, and 1,2-bis(2-methoxyethoxy)ethane.

[0069] Ester ethers such as 2-(2-butoxyethoxy)ethane acetate; and ether alcohols such as 2-(2-methoxyethoxy)ethanol (also called butyl carbitol). Hydrocarbons such as toluene, xylene, n-paraffin, isoparaffin, dodecylbenzene, turpentine, kerosene, and diesel. Nitriles such as acetonitrile and propionitrile; amides such as acetamide and N,N-dimethylformamide. Lactones such as ε-caprolactone, δ-valerolactone, and γ-butyrolactone. Silicone oils such as low molecular weight volatile silicone oils and volatile organic modified silicone oils.

[0070] Among the above-mentioned solvents, in the resin composition of the present embodiment, it is preferable that the solvent contains one or more selected from the group consisting of ε-caprolactone, γ-butyrolactone, butyl carbitol acetate, tripropylene glycol monobutyl ether, ethylene glycol mono-n-butyl ether acetate, and butyl carbitol. In the resin composition of the present embodiment, only one type of solvent may be used, or two or more types of solvents may be used in combination.

[0071] From the viewpoint of improving workability when using the resin composition and suppressing the occurrence of peeling or breakage to improve reliability, the content of the solvent in the resin composition of this embodiment is preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, even more preferably 7 mass% or more, and is preferably 20 mass% or less, more preferably 18 mass% or less, even more preferably 15 mass% or less, even more preferably 13 mass% or less, and even more preferably 10 mass% or less, when the content of all components in the resin composition is 100 mass%.

[0072] The resin composition of the present invention may further contain known additives, if necessary. The additives are not particularly limited, but examples thereof include dispersants, plasticizers, softeners, antioxidants, antiaging agents, ultraviolet absorbers, polymerization inhibitors, phosphate ester-based and other flame retardants, surfactants, and antistatic agents.

[0073] (Properties of the composition) The resin composition of the present embodiment is preferably in a paste form at 20° C. That is, the resin composition of the present embodiment can be applied to an object to be adhered, etc., like a paste at 20° C. This allows the resin composition of the present embodiment to be preferably used as a heat dissipating insulating adhesive. Of course, depending on the process to be applied, the resin composition of the present embodiment may be in the form of a varnish having a relatively low viscosity.

[0074] [Physical properties of resin composition] The resin composition of the present embodiment is heated from 30° C. to 175° C. at a constant rate over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The storage modulus E' at 25° C. is measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. 25 is 100 MPa or more, preferably 500 MPa or more, and more preferably 1000 MPa or more. 25 When the resin composition is equal to or larger than the lower limit, peeling or breakage is suppressed, and reliability is improved. In addition, the storage elastic modulus E' 25 is 3000 MPa or less, preferably 2750 MPa or less, and more preferably 2500 MPa or less. 25 When the viscosity of the resin composition of the present embodiment is equal to or less than the upper limit, the viscosity of the resin composition of the present embodiment is suitable, and the adhesive strength to other materials is more suitable.

[0075] The resin composition of this embodiment is heated from 30°C to 175°C at a constant rate over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product, which is measured by a tensile test using a Tensilon at 25°C and a load rate of 1.0 N / min to have a breaking strength of preferably 1 MPa or more, more preferably 2 MPa or more, and even more preferably 3 MPa or more. By having a breaking strength equal to or greater than the above lower limit, peeling or breakage in the resin composition is suppressed, and reliability is improved. Further, the upper limit of the breaking strength is not particularly limited, but is, for example, 50 MPa or less, 40 MPa or less, 30 MPa or less, 20 MPa or less, 10 MPa or less, or 5 MPa or less.

[0076] The resin composition of the present embodiment is heated from 30° C. to 175° C. at a constant temperature over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The breaking energy of the cured product is preferably 0.5×10 -3 J / mm 3 More preferably, 0.7×10 -3 J / mm 3 More preferably, 1.0×10 -3 J / mm 3 More preferably, 2.0×10 -3 J / mm 3 More preferably, 3.0×10 -3 J / mm 3 More preferably, 4.0×10 -3 J / mm 3 More preferably, 5.0×10 -3 J / mm 3More preferably, 6.0×10 -3 J / mm 3 When the breaking energy is equal to or greater than the above lower limit, the occurrence of peeling or breaking in the resin composition is suppressed, and reliability becomes more favorable. The upper limit of the breaking energy is not particularly limited, but is, for example, 20×10 -3 J / mm 3 is less than or equal to 15 x 10 -3 J / mm 3 is less than or equal to 10 x 10 -3 J / mm 3 is less than or equal to 8 x 10 -3 J / mm 3 The following is the result.

[0077] <Method of producing resin composition> The method for producing the resin composition of the present embodiment is not particularly limited, but for example, the above-mentioned components are premixed, then kneaded using a three-roll mill, and further vacuum degassed to obtain a paste-like resin composition. In this case, by appropriately adjusting the preparation conditions, for example, by performing premixing under reduced pressure, the long-term workability of the resin composition can be improved.

[0078] The viscosity of the resin composition of the present embodiment can be adjusted depending on the application. The viscosity of the resin composition can be controlled by adjusting the types of components used and the amounts of the components.

[0079] <Electronic equipment> The electronic device of the present embodiment preferably contains a cured product of the resin composition, which has an improved balance of performance in terms of insulation, thermal conductivity, and reliability, thereby suppressing peeling of electronic components and providing an electronic device with improved reliability. Examples of the electronic device of this embodiment include semiconductor chips, semiconductor elements, printed wiring boards, flexible devices, electric circuits, display devices such as television receivers and monitors, information and communication terminals, light-emitting diodes, physical batteries, chemical batteries, and other elements, devices, final products, and other electrical equipment in general that apply electronic engineering technology.

[0080] An example of the electronic device according to the present embodiment will be specifically described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of an electronic device according to the present embodiment. The electronic device 100 of the present embodiment preferably includes a substrate 30, an adhesive layer 10 on the substrate 30, and an electronic component 20 on the adhesive layer 10, and the adhesive layer 10 contains a cured product of the resin composition of the present embodiment. This can improve the reliability of the electronic device 100.

[0081] The substrate 30 in the electronic device 100 of this embodiment may be a known member used as a substrate for a wiring board of an electronic device, such as a silicon wafer, a ceramic substrate, an aluminum substrate, a SiC wafer, a GaN wafer, and a cured product of a resin composition containing silicone rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, ethylene propylene rubber, urethane rubber, or the like. The substrate 30 may be an unprocessed substrate, or may be a substrate having a semiconductor element or a display element formed on the surface. It may also be a printed wiring board or the like. In order to improve adhesion, the surface of the substrate 30 may be treated with an adhesive assistant such as a silane coupling agent.

[0082] From the viewpoint of obtaining an electronic device with improved reliability, the thickness of the adhesive layer 10 in the electronic device 100 of this embodiment is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, even more preferably 15 μm or more, and is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, even more preferably 25 μm or less.

[0083] Examples of the electronic component 20 in the electronic device 100 of this embodiment include known components used as components of electronic devices, such as integrated circuits, large-scale integrated circuits, transistors, thyristors, diodes, semiconductor elements such as solid-state imaging elements, capacitors, coils, and sensors.

[0084] (Electronic device manufacturing method) An example of a method for manufacturing the electronic device 100 according to this embodiment will be described. First, the resin composition of the present embodiment is applied onto the substrate 30, and then the electronic component 20 is placed thereon. That is, the substrate 30, the resin composition of the present embodiment, and the electronic component 20 are laminated in this order. The method for applying the resin composition of the present embodiment is not limited, and specifically, dispensing, printing, inkjet method, etc. can be used. Next, the entire assembly including the resin composition of the present embodiment is heat-treated to cure the resin composition of the present embodiment, thereby bonding the substrate 30 and the electronic component 20 via the adhesive layer 10 to obtain the electronic device 100.

[0085] Although the resin composition of the present embodiment has been described above, the present embodiment is not limited thereto. For example, any component capable of exerting the same function may be added to the resin composition of the present embodiment. EXAMPLES

[0086] The present embodiment will be described in detail below with reference to examples and comparative examples, but the present embodiment is not limited to the descriptions of these examples.

[0087] <Examples and Comparative Examples> (Preparation of Resin Composition) For each of the Examples and Comparative Examples, a resin composition was prepared as follows. First, a mixture of resin compositions was obtained by stirring each component according to the formulation shown in Table 1. Next, this mixture was premixed and then kneaded with a three-roll mill to obtain a resin composition in which the inorganic filler was uniformly dispersed. Details of each component in Table 1 are as follows: The blending ratio of each component shown in Table 1 indicates the blending ratio (mass %) to the entire resin composition.

[0088] (raw materials) (Silicone resin) Silicone resin 1: Epoxy-modified silicone resin represented by the following formula (2) (manufactured by Momentive Corp., TSL-9906)

[0089] [ka]

[0090] (thermosetting resin) Thermosetting resin 1: Bisphenol-F-diglycidyl ether (Nippon Kayaku Co., Ltd., RE-403S) Thermosetting resin 2: Ethylene glycol dimethacrylate (Kyoeisha Chemical Co., Ltd., Light Ester EG)

[0091] (hardening agent) Hardener 1: Bisphenol F (DIC, DIC-BPF)

[0092] (Cure accelerator) Curing accelerator 1: 2-phenyl-4,5-dihydroxymethylimidazole (Shikoku Chemical Industry Co., Ltd., 2PHZ-PW) Curing accelerator 2: Tetraphenylphosphonium tetraphenylborate (Hokko Chemical Industry Co., Ltd., TPP-K)

[0093] (Adhesion aid) Adhesion aid 1: 3-glycidyloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-403E)

[0094] (Initiator) Initiator 1: 1,1-bis(1,1-dimethylethylperoxy)cyclohexane (NOF Corporation, Perhexa (registered trademark) C(S))

[0095] (Low stress agent) Low stress agent 1: Polybutadiene maleic anhydride adduct (Cray Valley, RICOBOND 1731)

[0096] (Inorganic filler) Inorganic filler 1: spherical alumina (Denka, DAW-10, D 50 :10μm) Inorganic filler 2: spherical alumina (Denka, DAW-0310, D 50 :3.5μm) Inorganic filler 3: spherical silica (AEROSIL (registered trademark) R-805, manufactured by Japan Aerosil Co., Ltd.) 50 :0.01μm)

[0097] The average particle size D of the above inorganic filler 50 was determined as the value when the integrated value in the volume-based particle size distribution measured by the laser diffraction scattering measurement method using a laser diffraction particle size distribution analyzer (Shimadzu Corporation, SALD-7000) was 50%.

[0098] (solvent) Solvent 1: Tripropylene glycol mono n-butyl ether (BFTG), boiling point 270°C, manufactured by Nippon Nyukazai Co., Ltd.

[0099] (Physical Properties) The physical properties of the resin compositions obtained in each of the Examples and Comparative Examples were evaluated by the following methods. The results are shown in Table 1.

[0100] (Storage modulus E') The storage modulus E' of the resin composition of each of the Examples and Comparative Examples was measured by the following method. The resin compositions of each Example and Comparative Example were heated from 30°C to 175°C at a constant rate over 30 minutes, and then heat-treated at 175°C for 60 minutes to form test pieces with a length of 40 mm, a width of 4 mm, and a thickness of 0.3 mm. The storage modulus E' at 25°C of each test piece was measured using a dynamic viscoelasticity measuring device (Seiko Instruments Inc.'s "DMS6100") in a tensile mode at a frequency of 10 Hz. 25 and storage modulus E' at 250°C 250 was measured.

[0101] (breaking strength, breaking energy) For each of the Examples and Comparative Examples, the breaking strength and breaking energy of the resulting resin composition were measured. The resin compositions of each Example and Comparative Example were heated at a constant rate from 30°C to 175°C over 30 minutes, and then heat-treated at 175°C for 60 minutes to form rectangular test pieces with a length of 40 mm, a width of 4 mm, and a thickness of 0.3 mm. The test pieces were subjected to a tensile test at 25°C and a load speed of 1.0 N / min using a Tensilon ("Micro Autograph" micro component strength evaluation device manufactured by Shimadzu Corporation) to measure the breaking strength. The breaking strength was measured in units of MPa.

[0102] The breaking energy was calculated in the following way. First, a curve (stress-strain curve) was created by graphing the relationship between the normal stress and normal strain during the tensile test. Next, the integral value of the stress from the start point of the tensile test to the breaking point was calculated using the strain as a variable. The unit is x 10 -3 J / mm 3 It was decided.

[0103] (evaluation) The resin compositions obtained in the respective Examples and Comparative Examples were evaluated by the following methods. The results are shown in Table 1.

[0104] (Insulating) The insulating properties of the resin compositions obtained in each of the Examples and Comparative Examples were evaluated using the volume resistivity of the resulting resin compositions. The resin compositions obtained in each Example and Comparative Example were applied to a substrate to a thickness of 0.05 mm x width of 4 mm x length of 40 mm, and the temperature was raised at a constant rate from 30°C to 175°C over 30 minutes, and then heated at 175°C for 60 minutes. Next, measuring probes were placed on the top and bottom ends of the substrate to measure the resistance. The measurement length was 40 mm. The measured resistance was then converted into volume resistivity (Ω·cm). Using the volume resistivity, the insulation was evaluated according to the following criteria. A: The volume resistivity is 1.0×10 9 Ω cm or more B: The volume resistivity is 1.0×10 9 Less than Ω cm

[0105] (Thermal Conductivity) For each of the Examples and Comparative Examples, the thermal conductivity of the resulting resin composition was measured. The resin compositions obtained in each of the Examples and Comparative Examples were heated at a constant rate from 30°C to 175°C over 30 minutes, and then heat-treated at 175°C for 60 minutes to form test pieces measuring 10 mm in length, 10 mm in width, and 1 mm in thickness. The thermal diffusivity of these test pieces was measured using a laser flash thermal constant measuring device LFA467 manufactured by NETZSCH, and the thermal conductivity (W / mK) was calculated from the specific heat and specific gravity.

[0106] (MSL peelability) For each of the Examples and Comparative Examples, the releasability from each material was evaluated by the following method as an index of reliability (releasability under high temperature environment). The resin compositions obtained in each Example and Comparative Example were applied to the surfaces of a silver (Ag) lead frame, a copper (Cu) lead frame, and a nickel-palladium-gold plated (PPF) lead frame so that the thickness after curing was 20 μm, and a silicon chip of length 4 mm x width 4 mm x height 0.2 mm was mounted on the applied paste. Next, in an oven under a nitrogen atmosphere, the temperature was raised at a constant rate from 30°C to 175°C over 30 minutes, and then heated at 175°C for 1 hour to obtain a test piece for evaluation. The above test pieces for evaluation were prepared by using the resin compositions obtained in each Example and Comparative Example, 12 pieces each. The evaluation test piece obtained by the above method was sealed with an epoxy-based sealant and heat-treated in an oven at 175° C. for 4 hours to perform post-mold curing, thereby obtaining a package structure. The package structure obtained by the above method was placed in a constant temperature and humidity chamber at a temperature of 85°C and a relative humidity of 85% for 168 hours, and then passed through a reflow furnace at 260°C three times at a speed of 67 cm / min to obtain a package structure that had passed the Moisture Sensitivity Level (MSL) test. The MSL tested package structure obtained by the above method was subjected to an ultrasonic flaw detection test to check the state of peeling, and was evaluated according to the following criteria. A: 9 or more MSL tested package structures with no delamination B: 8 or fewer MSL tested package structures without delamination

[0107] (Overall reliability assessment) The resin compositions obtained in the respective Examples and Comparative Examples were evaluated for overall reliability according to the following criteria. A: All of the above evaluation results (MSL peelability) are A. B: At least one of the above (MSL peelability) evaluation results is B

[0108] [Table 1]

[0109] The resin compositions of the examples had an improved balance of performance among insulation properties, thermal conductivity, and reliability. [Explanation of symbols]

[0110] 10 Adhesive layer 20 Electronic Components 30 Base material 100 Electronic equipment

Claims

1. A silicone resin, one or more inorganic fillers selected from the group consisting of alumina, boron nitride, and silica; A resin composition comprising: The resin composition was heated from 30° C. to 175° C. at a constant rate over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The storage modulus E′ at 250° C. was measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. ２５０ The resin composition,

2. The resin composition according to claim 1, The resin composition was heated from 30° C. to 175° C. at a constant temperature over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The cured product was subjected to a tensile test using a Tensilon under conditions of 25° C. and a load rate of 1.0 N / min. The breaking energy was measured to be 0.5×10 －３ J / mm ３ Above 20 x 10 －３ J / mm ３ A resin composition comprising:

3. The resin composition according to claim 1 or 2, The resin composition was heated from 30° C. to 175° C. at a constant rate over 30 minutes, and then heat-treated at 175° C. for 60 minutes to obtain a cured product. The storage modulus E′ at 25° C. was measured using a dynamic viscoelasticity measuring device under conditions of a tensile mode and a frequency of 10 Hz. ２５ The resin composition,

4. The resin composition according to claim 1 or 2, The resin composition is heated from 30°C to 175°C at a constant temperature over 30 minutes, and then heat-treated at 175°C for 60 minutes to obtain a cured product, the cured product having a breaking strength of 1 MPa or more and 50 MPa or less as measured by a tensile test using a Tensilon at 25°C and a load rate of 1.0 N / min.

5. The resin composition according to claim 1 or 2, The resin composition, wherein the silicone resin comprises an epoxy-modified silicone resin.

6. The resin composition according to claim 1 or 2, The resin composition, wherein the silicone resin comprises a resin represented by the following general formula (1): 【Chemistry 1】 (In general formula (1), R １ ~R ４ are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and n is an integer of 1 to 10.

7. The resin composition according to claim 1 or 2, The resin composition further comprises a curing agent.

8. The resin composition according to claim 7, The resin composition, wherein the curing agent comprises one or more selected from the group consisting of a phenol compound, a polyamine compound, a thiol compound, and an acid anhydride.

9. The resin composition according to claim 1 or 2, The resin composition further comprises a curing accelerator.

10. The resin composition according to claim 9, The resin composition, wherein the curing accelerator comprises one or more selected from the group consisting of organic phosphines, tetra-substituted phosphonium compounds, tetra-substituted borate compounds, and tertiary amines.

11. The resin composition according to claim 1 or 2, The resin composition further comprises a solvent.

12. The resin composition according to claim 11, A resin composition, wherein the content of the solvent is 1% by mass or more and 20% by mass or less, when the content of all components of the resin composition is 100% by mass.

13. The resin composition according to claim 11, The resin composition, wherein the solvent comprises one or more selected from the group consisting of ε-caprolactone, γ-butyrolactone, butyl carbitol acetate, tripropylene glycol monobutyl ether, ethylene glycol mono-n-butyl ether acetate, and butyl carbitol.

14. An electronic device comprising a cured product of the resin composition according to claim 1 or 2.

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