Wire bonding device

Abstract

To automatically perform a replacement work of a capillary.SOLUTION: A wire bonding device 100 comprises: a wire bonding unit 1 that detachably grips a capillary 10, and includes an ultrasonic horn 11 to which a fixture insertion hole H2 is provided; a fixture 41 that is inserted into the fixture insertion hole H2, and releases the gripping of the capillary 10 by the ultrasonic horn 11; a camera unit 2 that detects the fixture 41 on the basis of an imaging image of the fixture 41; and a manipulator 45. The wire bonding unit 1 moves the ultrasonic horn 11 to a position of the fixture 41 to be detected, and releases the gripping of the capillary 10 by the ultrasonic horn 11 by an operation of the fixture 41. The manipulator 45 replaces the capillary 10 in a state where the gripping of the capillary 10 is released.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a wire bonding apparatus. [Background technology]

[0002] Patent Document 1 discloses a wire bonding apparatus having a capillary as a bonding tool, and connects the wire to an electrode by applying heat or ultrasonic vibration to the wire using the capillary. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 08-306732 Summary of the Invention [Problem to be solved by the invention]

[0004] In an electronic device manufacturing factory, a plurality of manufacturing devices are operated to manufacture a large number of electronic devices. Increasing the number of manufacturing devices can increase the number of productions. On the other hand, the manufacturing devices require various maintenance operations. In this case, the number of maintenance operations required is equal to the number of manufacturing devices. Therefore, an increase in the number of productions and the burden of maintenance operations are in a contradictory relationship. Therefore, if maintenance operations can be performed automatically without the manual intervention of workers, it is possible to reduce the burden of maintenance operations.

[0005] The wire bonding apparatus has a capillary replacement operation as one of the above-mentioned maintenance operations. Therefore, in this technical field, there has been a demand for automation of the capillary replacement operation, specifically, automation of the operation of removing a used capillary from a horn and attaching a new capillary to the horn.

[0006] In view of the above background, the present disclosure describes a wire bonding apparatus capable of automating the capillary replacement operation. [Means for solving the problem]

[0007] A wire bonding apparatus according to one aspect of the present disclosure includes a horn unit having a horn that detachably holds a capillary and has a jig insertion hole, a jig that is inserted into the jig insertion hole and releases the capillary from its grip by the horn, a camera unit that detects the position of the jig based on an image of the jig, and a manipulator that replaces the capillary held by the horn, wherein the horn unit moves the horn to the position of the jig detected by the camera unit and releases the capillary from its grip by the horn through the operation of the jig, and the manipulator replaces the capillary when its grip is released.

[0008] In a wire bonding apparatus equipped with a horn for gripping such a capillary, when replacing the capillary, it is necessary to release the grip of the capillary by the horn. Therefore, the wire bonding apparatus detects the position of the jig based on a captured image of the jig. As a result, the wire bonding apparatus can move the horn to the position of the jig based on the detected position of the jig so that the jig can be inserted into the jig insertion hole. Then, the wire bonding apparatus causes the jig to release the grip of the capillary by the horn. In this state, the wire bonding apparatus can replace the capillary by the manipulator. In this way, the wire bonding apparatus can automatically perform the capillary replacement work.

[0009] In the above-mentioned wire bonding apparatus, the horn is provided with a jig insertion hole and a capillary mounting hole formed smaller than the capillary, the jig insertion hole and the capillary mounting hole are connected to each other, the horn grasps the capillary inserted into the capillary mounting hole by elastic force by pushing open the capillary mounting hole, and the jig may push open the jig insertion hole and the capillary mounting hole to release the grasp of the capillary.

[0010] The capillary mounting hole provided in the horn communicates with the jig insertion hole. In this case, by pushing the jig insertion hole wider, the capillary mounting hole is also pushed wider. Therefore, the wire bonding device pushes the jig insertion hole wider with the jig. As a result, as the jig insertion hole is pushed wider, the capillary mounting hole is pushed wider and the grip of the capillary is released. In this way, the wire bonding device can easily release the grip of the capillary by the horn by pushing the jig insertion hole wider using the jig.

[0011] In the wire bonding apparatus, the camera unit may detect the position of the jig based on an image of the end face of the tip side of the jig. In this case, the wire bonding apparatus can detect the position of the jig based on the image of the end face of the jig and move the horn to the detected position of the jig.

[0012] In the above-mentioned wire bonding apparatus, the camera unit may move the camera that captures the jig based on the captured image of the jig so that a predetermined image reference point in the captured image coincides with a predetermined jig reference point on the jig. By moving the camera in this manner, the jig and the camera are in a predetermined positional relationship. This allows the wire bonding apparatus to more accurately detect the position of the jig based on the captured image captured by the camera.

[0013] In the above wire bonding apparatus, the camera unit may also function as a wire bonding camera that captures an image of a semiconductor chip to position a capillary when wire bonding the semiconductor chip. In this case, the wire bonding apparatus can capture an image of a jig and detect the position of the jig using the camera unit provided for wire bonding. This allows the configuration of the wire bonding apparatus to be simplified.

[0014] In the above wire bonding apparatus, the height position of the end face at the tip side of the jig may be substantially the same as the bonding height position when wire bonding is performed on the semiconductor chip. This allows the wire bonding apparatus to capture a clearer image of the end face of the jig when capturing an image of the jig using the bonding camera unit. Therefore, the wire bonding apparatus can detect the position of the jig with higher accuracy based on the captured image of the jig that is captured clearly. Effect of the Invention

[0015] According to one aspect of the present disclosure, the capillary replacement operation can be performed automatically. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a side view of the wire bonding apparatus according to the embodiment. [Diagram 2] FIG. 2 is an enlarged side view of the capillary exchange unit and its surroundings. [Diagram 3] Fig. 3(a) is a diagram showing the jig as viewed from above, and Fig. 3(b) is a diagram showing an image of the jig captured by a camera. [Figure 4] FIG. 4 is a top view of the ultrasonic horn. [Diagram 5] 5(a) to 5(d) are diagrams showing the states of the capillary attachment hole and the jig insertion hole when a gripping release operation is performed by the jig. [Figure 6] FIG. 6 is a block diagram showing the functional configuration of the controller. [Figure 7] FIG. 7 is a flowchart showing the flow of a capillary replacement process performed by the wire bonding apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding elements are denoted by the same reference numerals, and duplicated description will be omitted.

[0018] As shown in Fig. 1, the wire bonding apparatus 100 bonds a bonding wire Y to a semiconductor chip C. The wire bonding apparatus 100 has, as main components, a wire bonding unit (horn unit) 1, a camera unit 2, a bonding stage 3, a capillary exchange unit 4, and a controller 5. The wire bonding unit 1 bonds the bonding wire Y to the semiconductor chip C. The camera unit 2 obtains captured images for controlling the operation of the wire bonding unit 1. The controller 5 has various control units that control the operation of each part of the wire bonding apparatus 100 and perform various processes.

[0019] <Wire bonding unit> The wire bonding unit 1 includes a capillary 10, an ultrasonic horn 11, a wire clamper 12, a horn holder 13, a Z-axis drive unit 14, a tool XY stage 15, and a horn control unit 52 (see FIG. 6).

[0020] A capillary 10, which is a bonding tool, bonds a bonding wire Y to a semiconductor chip C. An ultrasonic horn 11 detachably holds the capillary 10 at its tip end. The base end of the ultrasonic horn 11 is attached to the tip end of a horn holder 13. In addition to the ultrasonic horn 11, the base end of a wire clamper 12 is also attached to the tip end of the horn holder 13. The tip end of the wire clamper 12 is located roughly above the capillary 10.

[0021] The base end side of the horn holder 13 is attached to a Z-axis drive unit 14. The Z-axis drive unit 14 is attached to a tool XY stage 15. Therefore, the capillary 10, ultrasonic horn 11, wire clamper 12, horn holder 13 and Z-axis drive unit 14, which are attached directly or indirectly to the Z-axis drive unit 14, can move parallel to the XY plane. The tool XY stage 15 is a high-speed, high-precision stage that uses a servo motor. The XY plane is, for example, a horizontal plane.

[0022] The Z-axis driver 14 moves the horn holder 13 in an arc. The arc movement of the horn holder 13 also moves the capillary 10, ultrasonic horn 11, and wire clamper 12, which are attached directly or indirectly to the horn holder 13, in an arc. That is, the position of the capillary 10, etc. in the Z-axis direction changes. The Z-axis is an axis perpendicular to the XY plane. The arc movement of the capillary 10 causes the capillary 10 to perform a bonding operation. A torch arm 16 is also attached to the Z-axis driver 14. An adapter 17 for a torch (not shown) is attached to the tip of the torch arm 16.

[0023] In this manner, in the wire bonding unit 1, the capillary 10, which is a bonding tool attached to the ultrasonic horn 11, and the Z-axis drive unit 14, which moves the capillary 10 in an arc to perform bonding operations, are installed on the tool XY stage 15. The horn control unit 52 controls various operations of the wire bonding unit 1 and executes various processes. Details of the control performed by the horn control unit 52 will be described later.

[0024] <Camera unit> The camera unit 2 captures an image of the semiconductor chip C. The captured image of the semiconductor chip C is used to position the capillary 10 when wire bonding is performed on the semiconductor chip C. In this way, the camera unit 2 functions as a wire bonding camera unit used to perform wire bonding. The camera unit 2 also captures an image of a jig 41 (see FIG. 2) for replacing the capillary 10 in the capillary replacement unit 4. The captured image of the jig 41 is used to position the ultrasonic horn 11 when the capillary replacement unit 4 replaces the capillary 10.

[0025] The camera unit 2, which is an optical system for positioning, has a camera 21 having an image sensor, an arm section 22 supporting the camera 21, the tool XY stage 15, and a camera control section 51 (see FIG. 6). The base end of the arm section 22 is attached to the tool XY stage 15. The camera 21 is attached to the tip end of the arm section 22. The arm section 22 supports the camera 21 at a position above the bonding stage 3.

[0026] The camera 21 and the arm section 22 are installed on the tool XY stage 15. That is, the camera 21 and the arm section 22 can move parallel along the XY plane together with the capillary 10 and the like by being driven by the tool XY stage 15. In this manner, the tool XY stage 15 functions as a part of the components of the wire bonding unit 1 and also functions as a part of the components of the camera unit 2. The camera control section 51 controls various operations of the camera unit 2 and executes various processes. Details of the control performed by the camera control section 51 will be described later.

[0027] <Bonding stage> The bonding stage 3 is disposed below the capillary 10. The bonding stage 3 holds the semiconductor chip C below the capillary 10.

[0028] <Capillary exchange unit> The capillary replacement unit 4 retrieves the capillary 10 attached to the ultrasonic horn 11 and attaches a new capillary 10 to the ultrasonic horn 11. In other words, the capillary 10 replacement operation includes the operation of retrieving the capillary 10 and the operation of attaching the capillary 10. This capillary 10 replacement operation is automatically performed when a preset condition is satisfied. For example, the condition may be the number of bonding operations. In other words, the capillary 10 replacement operation may be performed every time a predetermined number of bonding operations are performed.

[0029] As shown in FIG. 2, the capillary replacement unit 4 has a grip release unit 40 and a manipulator 45. The grip release unit 40 releases the grip of the capillary 10 by the ultrasonic horn 11. More specifically, the grip release unit 40 has a jig 41, a jig drive unit 42, and a jig control unit 53 (see FIG. 6). The jig 41 is inserted into a jig insertion hole H2 provided in the ultrasonic horn 11, and releases the grip of the capillary 10 by the ultrasonic horn 11. A rod-shaped insertion part 41a is provided at the upper tip of the jig 41. The insertion part 41a is a part that is inserted into the jig insertion hole H2 of the ultrasonic horn 11. The insertion part 41a extends along the Z axis.

[0030] 3(a), the cross-sectional shape of the insertion portion 41a has a length L1 in a first direction that is longer than a length L2 in a second direction perpendicular to the first direction. In this embodiment, the cross-sectional shape of the insertion portion 41a is an ellipse.

[0031] 2, a base end (lower end) of the jig 41 is attached to the jig driving unit 42. The jig driving unit 42 drives the jig 41 based on an instruction from the jig control unit 53. The jig driving unit 42 can rotate the jig 41 around the Z axis. In addition, the jig driving unit 42 can move the jig 41 along the Z axis.

[0032] Here, the details of the configuration of the ultrasonic horn 11 gripping the capillary 10 will be described. As shown in Fig. 4, a capillary mounting hole H1 and a jig insertion hole H2 are formed at the tip of the ultrasonic horn 11. The capillary mounting hole H1 and the jig insertion hole H2 penetrate the ultrasonic horn 11 along the Z axis. In this embodiment, the capillary mounting hole H1 is provided on the tip side of the ultrasonic horn 11 relative to the jig insertion hole H2. However, the jig insertion hole H2 may be provided on the tip side of the ultrasonic horn 11 relative to the capillary mounting hole H1.

[0033] The capillary mounting hole H1 and the jig insertion hole H2 are in communication with each other. In this embodiment, the capillary mounting hole H1 and the jig insertion hole H2 are in communication with each other via a slit S1. The slit S1 penetrates the ultrasonic horn 11 in the Z-axis direction.

[0034] Further, a slit S2 is formed in the ultrasonic horn 11. The slit S2 is in communication with the jig insertion hole H2. The jig insertion hole H2 is formed closer to the base end side of the ultrasonic horn 11 than the jig insertion hole H2. The slit S2 passes through the ultrasonic horn 11 in the Z-axis direction. In this manner, the capillary mounting hole H1, the slit S1, the jig insertion hole H2, and the slit S2 are in communication with one another.

[0035] The capillary 10 is inserted into the capillary mounting hole H1. Here, the ultrasonic horn 11 is formed of an elastically deformable material. As shown in FIG. 5(a), the capillary mounting hole H1 is smaller than the outer diameter of the capillary 10 when the capillary 10 is not inserted. The ultrasonic horn 11 can hold the capillary 10 inserted into the capillary mounting hole H1 by its elastic force, by pushing the capillary mounting hole H1 open. In other words, the capillary 10 is inserted into the capillary mounting hole H1 in a state where the capillary mounting hole H1 is pushed open.

[0036] As shown in FIG. 5(a), the jig insertion hole H2 is an elliptical hole. The insertion portion 41a of the jig 41 can be inserted into the jig insertion hole H2. The insertion portion 41a is inserted into the jig insertion hole H2 to release the grip of the capillary 10 by the ultrasonic horn 11. As shown in FIG. 4 and FIG. 5(a), the inner wall surface of the jig insertion hole H2 includes a first surface portion W1 and a second surface portion W2 that face each other. The first surface portion W1 and the second surface portion W2 face each other in the short-side direction of the elliptical jig insertion hole H2. The slit S1 and the slit S2 face each other in the long-side direction of the elliptical jig insertion hole H2. When the insertion portion 41a of the jig 41 is not inserted into the jig insertion hole H2, the short-side length of the jig insertion hole H2 is shorter than the length L1 of the insertion portion 41a in the first direction (long-side direction). The capillary attachment hole H1 communicates with an end portion in the longitudinal direction of the elliptical jig insertion hole H2 via a slit S1.

[0037] Next, a grip releasing operation for releasing the grip of the capillary 10 by the ultrasonic horn 11 will be described. This grip releasing operation is performed by a jig 41. As shown in Fig. 4, the ultrasonic horn 11 grips the capillary 10 inserted in the capillary mounting hole H1 by elastic force. When releasing this grip, the insertion portion 41a of the jig 41 is inserted into the jig insertion hole H2 of the ultrasonic horn 11. The insertion operation of the jig 41 into the jig insertion hole H2 is performed by a jig driving unit 42.

[0038] As shown in FIG. 5(b), with the insertion portion 41a inserted into the jig insertion hole H2, the insertion portion 41a is rotated 90 degrees around the Z axis. As a result, the first surface W1 and the second surface W2 are pressed by both ends in the first direction of the insertion portion 41a (both ends in the longitudinal direction of the elliptical shape). The ultrasonic horn 11 is elastically deformed by the insertion portion 41a pressing the first surface W1 and the second surface W2. As a result, the distance between the first surface W1 and the second surface W2 of the jig insertion hole H2 becomes wider. The rotational operation of the jig 41 is performed by the jig driving unit 42.

[0039] Here, the jig insertion hole H2 and the capillary mounting hole H1 communicate with each other via the slit S1. Therefore, the insertion part 41a widens the gap between the first surface W1 and the second surface W2, and the capillary mounting hole H1 is also widened. The capillary mounting hole H1 is widened, and the grip of the capillary 10 by the ultrasonic horn 11 is released. That is, the grip releasing operation is an operation of rotating the jig 41 with the insertion part 41a inserted into the jig insertion hole H2. The grip releasing operation is an operation of pressing the first surface W1 and the second surface W2 with both ends in the first direction (both ends in the longitudinal direction of the elliptical shape) of the insertion part 41a to widen the gap between the first surface W1 and the second surface W2 and to widen the capillary mounting hole H1. In this manner, the jig 41 pushes open the jig insertion hole H2 and the capillary attachment hole H1, and the grip of the capillary 10 by the ultrasonic horn 11 is released.

[0040] As shown in FIG. 5(b), in a state where the capillary mounting hole H1 is pushed open by the jig 41, the capillary 10 is removed from the ultrasonic horn 11, and a new capillary 10 is inserted into the capillary mounting hole H1. This replacement of the capillary 10 is performed by the manipulator 45. Thereafter, as shown in FIG. 5(c), the insertion part 41a is rotated 90 degrees around the Z axis, and the pressure applied by the insertion part 41a to the first surface part W1 and the second surface part W2 is released. In other words, the grip release operation is released. As a result, the jig insertion hole H2 and the capillary mounting hole H1 try to return to their original shapes shown in FIG. 5(a). Due to the elastic force trying to return to their original shapes, the capillary 10 inserted into the capillary mounting hole H1 is gripped by the inner wall surface of the capillary mounting hole H1.

[0041] 5(d), the insertion portion 41a is removed from the jig insertion hole H2. In this manner, the ultrasonic horn 11 can use the jig 41 to grip and release the capillary 10.

[0042] 2, the manipulator 45 performs an exchange operation to exchange the capillary 10 when the gripping of the capillary 10 is released. The exchange operation of the capillary 10 is an operation of receiving the capillary 10 from the ultrasonic horn 11 and inserting a new capillary 10 into the jig insertion hole H2 of the ultrasonic horn 11. There is no particular limitation on the configuration of the manipulator 45 as long as it can perform the exchange operation of the capillary 10.

[0043] <Controller> Next, the controller 5 will be described in detail. The controller 5 controls the wire bonding unit 1 based on the captured image captured by the camera unit 2. The control of the wire bonding unit 1 includes a series of operations such as position control of the tip of the capillary 10 with respect to the semiconductor chip C and control of the wire bonding operation by the capillary 10. The controller 5 also controls the capillary replacement operation by the capillary replacement unit 4 based on the captured image captured by the camera unit 2. The control of each part performed by the controller 5 when replacing the capillary 10 will be described below.

[0044] The controller 5 is a computer and an electronic circuit connected to the computer, and functional components are realized by executing a predetermined program by the CPU. The controller 5 is provided with a control unit for each unit. As shown in Fig. 6, the controller 5 functionally has a camera control unit 51 for the camera unit 2, a horn control unit 52 for the wire bonding unit 1, and a jig control unit 53 for the grip release unit 40. The controller 5 may also be provided with a control unit for the manipulator 45.

[0045] The camera control unit 51 controls the imaging by the camera 21 and the movement of the camera 21. The camera control unit 51 controls the movement of the camera 21 in the XY plane by issuing an instruction to the tool XY stage 15. Here, when replacing the capillary 10 held by the ultrasonic horn 11, it is necessary to insert the jig 41 into the jig insertion hole H2 of the ultrasonic horn 11. For this reason, the camera control unit 51 causes the camera 21 to image the insertion part 41a so that the position of the insertion part 41a can be detected based on the captured image. The camera 21 images the end face of the tip side of the insertion part 41a in the insertion direction into the jig insertion hole H2. That is, the camera 21 images the end face of the upper side of the insertion part 41a.

[0046] In addition, in order to insert the insertion portion 41a into the jig insertion hole H2, it is necessary to grasp the position of the insertion portion 41a with high accuracy. Therefore, the camera control unit 51 moves the camera 21 so that the camera 21 and the insertion portion 41a can be imaged in a state where they are in a predetermined positional relationship. Specifically, the camera control unit 51 moves the camera 21 so that a predetermined image reference point P2 in the captured image D shown in FIG. 3(b) coincides with a jig reference point P1 predetermined on the end face of the insertion portion 41a based on the captured image of the insertion portion 41a captured by the camera 21. For example, the center point of the captured image D may be set as the image reference point P2 in the captured image D. For example, the center point of the end face of the insertion portion 41a may be set as the jig reference point P1. The camera control unit 51 can recognize the jig reference point P1 based on the image of the end face of the insertion portion 41a.

[0047] Also, for example, depending on the position of the camera 21, the insertion portion 41a may be located outside the imaging range of the camera 21. In this case, the wire bonding apparatus 100 cannot move the camera 21 based on the image of the insertion portion 41a captured by the camera 21. Therefore, for example, an operator or the like may move the camera 21 so that the insertion portion 41a is included in the imaging range of the camera 21. After the camera 21 becomes capable of capturing an image of the insertion portion 41a, the camera control unit 51 may move the camera 21 so that the jig reference point P1 and the image reference point P2 coincide with each other based on the image of the insertion portion 41a captured by the camera 21.

[0048] Here, the camera unit 2 is also used to position the capillary 10 when wire bonding is performed on the semiconductor chip C. For this reason, the position of the focal point of the camera 21 in the Z-axis direction is set to the bonding height position when wire bonding is performed on the semiconductor chip C. When the camera 21 images the insertion part 41a, the height position of the end face of the insertion part 41a on the camera 21 side is approximately the same as the bonding height position. The height position of the end face of the insertion part 41a and the bonding height position being approximately the same includes both being completely the same and both being slightly shifted. If the shift between the height position of the end face of the insertion part 41a and the bonding height position becomes large, the captured image of the end face of the insertion part 41a captured by the camera 21 becomes unclear. For this reason, the allowable range of shift between the two may be a range in which the camera control unit 51 can detect the position of the insertion part 41a with a predetermined accuracy or higher based on the captured image of the end face of the insertion part 41a.

[0049] Furthermore, the camera control unit 51 detects the position of the insertion portion 41a of the jig 41 based on the captured image of the jig captured by the camera 21. More specifically, the camera control unit 51 detects the position of the insertion portion 41a in the XY plane as the position of the insertion portion 41a.

[0050] Here, when the jig reference point P1 and the image reference point P2 coincide in the captured image, the insertion part 41a and the camera 21 are in a predetermined positional relationship. In addition, the position of the camera 21 moved by the tool XY stage 15 is grasped. Therefore, the camera control unit 51 can detect the position of the insertion part 41a based on the position of the camera 21 when the captured image in which the jig reference point P1 and the image reference point P2 coincide is captured.

[0051] In addition, the imaging of the insertion portion 41a by the camera 21 and the detection of the position of the insertion portion 41a by the camera control unit 51 may be performed each time the capillary 10 is replaced or after a specified number of replacement operations are performed, or may be performed when the wire bonding apparatus 100 is installed.

[0052] The horn control unit 52 controls the movement of the ultrasonic horn 11. The horn control unit 52 controls the movement of the horn control unit 52 in the XY plane by issuing instructions to the tool XY stage 15. The horn control unit 52 moves the horn to the position of the jig 41 detected by the camera control unit 51.

[0053] More specifically, the horn control unit 52 moves the ultrasonic horn 11 to the jig insertion position based on the detected position of the insertion portion 41a of the jig 41. The jig insertion position is a position for inserting the insertion portion 41a into the jig insertion hole H2 as shown in FIG. 2. In this embodiment, the jig insertion position is a position where the ultrasonic horn 11 is present above the jig 41. The jig insertion position is a position of the ultrasonic horn 11 where the jig insertion hole H2 and the insertion portion 41a coincide with each other when viewed along the Z axis. In other words, the jig insertion position is a position where the insertion portion 41a can be inserted into the jig insertion hole H2 by moving the insertion portion 41a along the Z axis relative to the ultrasonic horn 11 located at the jig insertion position.

[0054] The jig control unit 53 controls the operation of the jig 41. The jig control unit 53 controls the operation of the jig 41 by issuing instructions to the jig driving unit 42. More specifically, the jig control unit 53 moves the jig 41 so that it is inserted into the jig insertion hole H2 of the ultrasonic horn 11 that has been moved to the jig insertion position. Here, the jig control unit 53 raises the jig 41 along the Z axis and inserts the insertion portion 41a into the jig insertion hole H2. Note that when inserting the insertion portion 41a, the orientation of the insertion portion 41a is adjusted in advance so that it can be inserted into the jig insertion hole H2.

[0055] The jig control unit 53 causes the jig 41 to perform a grip release operation to release the grip of the capillary 10 by the ultrasonic horn 11 while the insertion portion 41a is inserted into the jig insertion hole H2. Here, the jig control unit 53 rotates the jig 41 by 90 degrees around the Z axis. As a result, the gap between the first surface portion W1 and the second surface portion W2 of the jig insertion hole H2 is widened, and the capillary attachment hole H1 is also widened. The capillary attachment hole H1 is widened, and thus the grip of the capillary 10 by the ultrasonic horn 11 is released. Note that the jig control unit 53 rotates the insertion portion 41a by 90 degrees, but is not limited to rotating it by 90 degrees. The jig control unit 53 may rotate the insertion portion 41a by a predetermined angle so that the gap between the first surface portion W1 and the second surface portion W2 is widened by the insertion portion 41a.

[0056] After the manipulator 45 has performed the replacement operation of the capillary 10, the jig control unit 53 releases the gripping release operation by the insertion unit 41a and causes the ultrasonic horn 11 to grip the capillary 10 by its elastic force.

[0057] Next, a flow of the capillary 10 replacement operation performed by the wire bonding apparatus 100 will be described. As shown in Fig. 7, the camera control unit 51 causes the camera unit 2 to capture an image of the insertion portion 41a of the jig 41 (S101: imaging step). The camera control unit 51 detects the position of the insertion portion 41a based on the captured image of the insertion portion 41a (S102: position detection step). The horn control unit 52 moves the ultrasonic horn 11 to the jig insertion position based on the detected position of the insertion portion 41a (S103: horn movement step).

[0058] The processes of S101 and S102 are performed each time the capillary 10 is replaced or each time a predetermined number of replacement operations are performed, or are performed when the wire bonding apparatus 100 is installed. If the processes of S101 and S102 are not performed each time the capillary 10 is replaced, the horn control unit 52 may move the ultrasonic horn 11 based on the position of the insertion portion 41a detected in the previous process of S102.

[0059] The jig control unit 53 causes the jig 41 to perform a gripping release operation. As a result, the wire bonding unit 1 releases the grip of the capillary 10 by the ultrasonic horn 11 through the gripping release operation of the jig 41 (S104: gripping release step). The manipulator 45 performs an exchange operation of the capillary 10 (S105: capillary exchange step). After the exchange of the capillary 10 is completed, the jig control unit 53 causes the jig 41 to release the gripping release operation. As a result, the ultrasonic horn 11 grips the new capillary 10 inserted into the jig insertion hole H2 (S106: gripping step).

[0060] As described above, in the wire bonding apparatus 100 including the ultrasonic horn 11 for gripping the capillary 10, when replacing the capillary 10, it is necessary to release the grip of the capillary 10 by the ultrasonic horn 11. Therefore, the wire bonding apparatus 100 detects the position of the jig 41 based on the captured image of the jig 41. As a result, the wire bonding apparatus 100 can move the ultrasonic horn 11 to the position of the jig 41 so that the jig 41 can be inserted into the jig insertion hole H2 based on the detected position of the jig 41. Then, the wire bonding apparatus 100 causes the jig 41 to release the grip of the capillary 10 by the ultrasonic horn 11. In this state, the wire bonding apparatus 100 can replace the capillary 10 by the manipulator 45. In this manner, the wire bonding apparatus 100 can automatically perform the replacement work of the capillary 10.

[0061] The capillary mounting hole H1 provided in the ultrasonic horn 11 communicates with the jig insertion hole H2. In this case, by pushing and widening the jig insertion hole H2, the capillary mounting hole H1 is also pushed and widened. Therefore, the wire bonding apparatus 100 pushes and widens the jig insertion hole H2 by the jig 41. As a result, as the jig insertion hole H2 is pushed and widened, the capillary mounting hole H1 is pushed and widened, and the grip of the capillary 10 is released. In this way, the wire bonding apparatus 100 can easily release the grip of the capillary 10 by the ultrasonic horn 11 by pushing and widening the jig insertion hole H2 using the jig 41.

[0062] Camera 21 captures an image of the end face on the tip side of insertion portion 41a of jig 41. Camera control unit 51 detects the position of insertion portion 41a based on the captured image of the end face of insertion portion 41a. In this case, wire bonding apparatus 100 can detect the position of jig 41 based on the captured image of the end face of jig 41, and move ultrasonic horn 11 to the detected position of jig 41.

[0063] The camera control unit 51 moves the camera 21 so that an image reference point P2 in the captured image D captured by the camera 21 coincides with a jig reference point P1 on the end face of the insertion part 41a of the jig 41. In this case, the jig 41 and the camera 21 are in a predetermined positional relationship. This allows the wire bonding apparatus 100 to detect the position of the jig 41 with higher accuracy based on the captured image captured by the camera 21.

[0064] The camera unit 2 that images the jig 41 also functions as a camera unit for wire bonding that images the semiconductor chip C in order to position the capillary 10 when wire bonding is performed on the semiconductor chip C. In this case, the wire bonding apparatus 100 can image the jig 41 and detect the position of the jig 41 using the camera unit 2 provided for wire bonding. This allows the wire bonding apparatus 100 to have a simplified configuration.

[0065] The height position of the end face of the insertion part 41a of the jig 41 on the camera unit 2 side is substantially the same as the bonding height position when wire bonding is performed on the semiconductor chip C. This allows the wire bonding apparatus 100 to capture a clearer image of the end face of the insertion part 41a when capturing an image of the jig 41 using the camera unit 2 provided for bonding. Therefore, the wire bonding apparatus 100 can detect the position of the jig 41 with higher accuracy based on the captured image of the jig 41 that is captured clearly.

[0066] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-mentioned embodiments. For example, the configuration of the ultrasonic horn 11 is not limited to a configuration including all of the capillary mounting hole H1, the jig insertion hole H2, the slit S1, and the slit S2. For example, the capillary mounting hole H1 and the jig insertion hole H2 may be directly connected to each other without the slit S1. Also, the ultrasonic horn 11 may not be provided with the slit S2.

[0067] The camera unit 2 may be configured to be translated along the XY plane by a drive source different from the tool XY stage 15.

[0068] In the above embodiment, the wire bonding unit 1 moves the ultrasonic horn 11 to the position of the jig 41 detected based on the captured image. At that time, the wire bonding unit 1 moves the ultrasonic horn 11 to the jig insertion position. Without being limited to this, the wire bonding unit 1 may move the ultrasonic horn 11 based on the detected position of the jig 41 so that the jig 41 is inserted into the jig insertion hole H2. In this case, the jig driving unit 42 of the grip release unit 40 does not need to move the jig 41 in the Z-axis direction.

[0069] The present disclosure includes the following configurations.

[0070] The present disclosure relates to a horn unit that detachably holds a capillary and has a horn having a jig insertion hole; a jig that is inserted into the jig insertion hole and releases the capillary from the horn; a camera unit for detecting a position of the jig based on a captured image of the jig; a manipulator for replacing the capillary held by the horn; Equipped with The horn unit moves the horn to the position of the jig detected by the camera unit, and releases the grip of the capillary by the horn due to the operation of the jig; The manipulator replaces the capillary in a state in which the capillary is released from its grip. The present disclosure states, [2] "The horn is provided with the jig insertion hole and a capillary attachment hole formed smaller than the capillary, the jig insertion hole and the capillary attachment hole are in communication with each other, the horn presses and widens the capillary attachment hole to grip the capillary inserted into the capillary attachment hole by elastic force; The wire bonding apparatus according to the above item [1], wherein the jig pushes open the jig insertion hole and the capillary attachment hole, thereby releasing the grip of the capillary." The present disclosure is [3] "The wire bonding apparatus described in [1] or [2] above, wherein the camera unit detects the position of the jig based on the captured image of the end face at the tip side of the jig." The present disclosure is [4] "A wire bonding apparatus described in any of [1] to [3] above, wherein the camera unit moves a camera that images the jig based on the captured image of the jig so that a predetermined image reference point in the captured image coincides with a predetermined jig reference point on the jig." The present disclosure is [5] "A wire bonding apparatus according to any one of the above [1] to [4], wherein the camera unit also functions as a wire bonding camera unit that images the semiconductor chip in order to position the capillary when wire bonding to the semiconductor chip." The present disclosure is [6] "The wire bonding apparatus described in [5] above, wherein the height position of the end face at the tip side of the jig is approximately the same as the bonding height position when wire bonding is performed on the semiconductor chip." [Explanation of symbols]

[0071] 1...wire bonding unit (horn unit), 2...camera unit, 10...capillary, 11...ultrasonic horn (horn), 21...camera, 41...jig, 41a...insertion part, 45...manipulator, 100...wire bonding device, C...semiconductor chip, D...captured image, H1...capillary mounting hole, H2...jig insertion hole, P1...jig reference point, P2...image reference point.

Claims

1. a horn unit that detachably holds the capillary and has a horn that is provided with a jig insertion hole; a jig that is inserted into the jig insertion hole and releases the capillary from the horn; a camera unit for detecting a position of the jig based on a captured image of the jig; a manipulator for replacing the capillary held by the horn; Equipped with The horn unit moves the horn to the position of the jig detected by the camera unit, and releases the grip of the capillary by the horn due to the operation of the jig; The manipulator replaces the capillary in a state in which the capillary is released from its grip.

2. the horn is provided with the jig insertion hole and a capillary attachment hole formed smaller than the capillary, the jig insertion hole and the capillary attachment hole are in communication with each other, the horn presses and widens the capillary attachment hole to grip the capillary inserted into the capillary attachment hole by elastic force; 2. The wire bonding apparatus according to claim 1, wherein the jig expands the jig insertion hole and the capillary attachment hole, thereby releasing the grip of the capillary.

3. The wire bonding apparatus according to claim 1 , wherein the camera unit detects a position of the jig based on the captured image of an end face on a tip side of the jig.

4. 2. The wire bonding apparatus of claim 1, wherein the camera unit moves a camera that images the jig so that a predetermined image reference point in the captured image coincides with a predetermined jig reference point on the jig based on the captured image of the jig.

5. 2. The wire bonding apparatus according to claim 1, wherein said camera unit also functions as a camera unit for wire bonding that captures an image of said semiconductor chip in order to position said capillary when wire bonding is performed on said semiconductor chip.

6. 6. The wire bonding apparatus according to claim 5, wherein the height position of the end face on the tip side of said jig is substantially the same as the bonding height position when wire bonding is performed on said semiconductor chip.

Images