Roll of wiring circuit board collective sheet and manufacturing method of wiring circuit board

Abstract

To provide a roll of a wiring circuit board collective sheet capable of suppressing deterioration of the flatness of a wiring circuit board, and provide a manufacturing method of the wiring circuit board.SOLUTION: The present invention provides a roll R of a wiring circuit board collective sheet 1. The wiring circuit board collective sheet 1 includes: a wiring circuit board 2; and a frame 3 supporting the wiring circuit board 2. The wiring circuit board 2 includes an open scheduled part 25 in which formation of an open is scheduled. The open scheduled part 25 is extended in a shaft direction of the roll R, and in a peripheral direction of the roll R. A length L11 of the open scheduled part 25 in the peripheral direction of the roll R is shorter than a length L12 of the open scheduled part 25 in the shaft direction of the roll R.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a roll of a wired circuit board assembly sheet and a method for manufacturing a wired circuit board. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a printed circuit board having an opening has been known (see, for example, Patent Document 1 below).

[0003] In addition, in the manufacture of wired circuit boards, it is known to manufacture a wired circuit board assembly sheet having a plurality of wired circuit boards (see, for example, Patent Document 2 below). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-190665 A [Patent Document 2] Patent Publication No. 2021-150625 Summary of the Invention [Problem to be solved by the invention]

[0005] Even when manufacturing a wired circuit board having an opening as described in Patent Document 1, it is possible to manufacture a wired circuit board assembly sheet as described in Patent Document 2.

[0006] In this case, it is conceivable that the wired circuit board assembly sheet may be handled in a roll state.

[0007] At this time, the curved state of the wired circuit board continues, and there is a possibility that the flatness of the wired circuit board decreases.

[0008] The present invention provides a roll of a wired circuit board assembly sheet that can suppress a decrease in the flatness of a wired circuit board, and a method for producing a wired circuit board. [Means for solving the problem]

[0009] The present invention [1] includes a roll of wired circuit board assembly sheet, the wired circuit board assembly sheet having a wired circuit board having an insulating layer and a conductor pattern disposed on the insulating layer, and a frame supporting the wired circuit board, the wired circuit board having an intended opening portion where an opening is intended to be formed, the intended opening portion extending in an axial direction and a circumferential direction of the roll, and a length of the intended opening portion in the circumferential direction of the roll being shorter than a length of the intended opening portion in the axial direction of the roll.

[0010] The present invention [2] includes a roll of the wired circuit board assembly sheet of the above [1], in which the wired circuit board has a metal support layer disposed on the opposite side of the conductor pattern with respect to the insulating layer.

[0011] The present invention [3] includes a roll of the wired circuit board assembly sheet of the above [2], in which the insulating layer has an insulating layer opening, and the opening-intended portion is made of the metal support layer and is exposed in the insulating layer opening.

[0012] The present invention [4] includes a roll of the wired circuit board assembly sheet of any one of the above [1] to [3], in which the length of the wired circuit board in the circumferential direction of the roll is shorter than the length of the wired circuit board in the axial direction of the roll.

[0013] The present invention [5] includes a roll of the wired circuit board assembly sheet of any one of the above [1] to [3], in which the length of the wired circuit board in the circumferential direction of the roll is longer than the length of the wired circuit board in the axial direction of the roll.

[0014] The present invention [6] includes a method for producing a wired circuit board, the method including: a roll production step of producing a roll of the wired circuit board assembly sheet according to any one of the above [1] to [5]; a curing step of curing the roll; and, after the curing step, an opening step of opening the intended opening portion. Effect of the Invention

[0015] According to the roll of the wired circuit board assembly sheet of the present invention, the length of the intended opening in the circumferential direction of the roll is shorter than the length of the intended opening in the axial direction of the roll.

[0016] Therefore, even if the curved state of the wired circuit board continues, it is possible to suppress the flatness of the wired circuit board from decreasing. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a roll of a wired circuit board assembly sheet according to one embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged view of the printed circuit board shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view of the printed circuit board shown in FIG. 2 taken along line AA. [Figure 4] 4A to 4C are process diagrams showing the manufacturing process of a wired circuit board, in which FIG. 4A shows the process of preparing a metal foil as a base material, FIG. 4B shows the process of forming a first insulating layer, and FIG. 4C shows the process of forming a conductor pattern. [Diagram 5] 5A and 5B are process diagrams showing the manufacturing process of the printed circuit board subsequent to FIG. 4C, where FIG. 5A shows the second insulating layer forming step and FIG. 5B shows the opening step. [Figure 6] FIG. 6 is an explanatory diagram for explaining the modified example (1). [Figure 7] 7A and 7B are explanatory views for explaining the modified example (2), in which FIG. 7A shows a second insulating layer forming step and FIG. 7B shows an opening step. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] 1. Roll of printed circuit board assembly sheet As shown in FIG. 1, a roll R of a wired circuit board assembly sheet is a roll in which a wired circuit board assembly sheet 1 is wound around a core C.

[0019] The outer diameter R1 of the roll R is, for example, 5 cm or more, preferably 10 cm or more, and for example, 100 cm or less, preferably 75 cm or less. The outer diameter R2 of the core C is, for example, 2.5 cm or more, preferably 7.5 cm or more, and for example, 50 cm or less, preferably 35 cm or less.

[0020] Wired circuit board assembly sheet 1 has a width in the axial direction of roll R and extends in the circumferential direction of roll R. As shown in FIG.

[0021] (1) Wired circuit board The multiple wired circuit boards 2 are lined up in the axial direction and the circumferential direction of the roll R. The multiple wired circuit boards 2 are arranged at intervals from one another in the axial direction and the circumferential direction of the roll R. Each of the multiple wired circuit boards 2 has the same structure. Therefore, in the following description, only one wired circuit board 2 will be described, and descriptions of the other wired circuit boards 2 will be omitted.

[0022] The wired circuit board 2 extends in the axial direction and the circumferential direction of the roll R. The shape of the wired circuit board 2 is not limited. The wired circuit board 2 has, for example, a rectangular shape. The length L1 of the wired circuit board 2 in the circumferential direction of the roll R is shorter than the length L2 of the wired circuit board 2 in the axial direction of the roll R. The wired circuit board 2 has a mounting area 20. The mounting area 20 is an area for mounting one electronic element. The mounting area 20 is located in the center of the wired circuit board 20 in the axial direction of the roll R, and is located in the center of the wired circuit board 20 in the circumferential direction of the roll R. The mounting area 20 has a substantially rectangular shape. The arrangement and shape of the mounting area 20 are not limited. The arrangement and shape of the mounting area 20 are set according to the shape of the electronic element to be mounted. In addition, the number of mounting areas 20 in the wired circuit board 2 is not limited. The number of mounting areas 20 in the wired circuit board 2 is set according to the number of electronic elements to be mounted on the wired circuit board 2.

[0023] As shown in FIG. 3, the wired circuit board 2 has a metal supporting layer 21, a first insulating layer 22, a conductor pattern 23, and a second insulating layer 24.

[0024] (1-1) Metal support layer The metal supporting layer 21 supports the first insulating layer 22, the conductive pattern 23, and the second insulating layer 24. The metal supporting layer 21 is disposed on the opposite side of the first insulating layer 22 to the conductive pattern 23. Examples of materials for the metal supporting layer 21 include stainless steel and copper alloy.

[0025] (1-2) First insulating layer The first insulating layer 22 is disposed on the metal support layer 21 in the thickness direction of the wired circuit board assembly sheet 1. The thickness direction is perpendicular to the axial direction of the roll R and the circumferential direction of the roll R. The first insulating layer 22 extends in the axial direction of the roll R and the circumferential direction of the roll R. The first insulating layer 22 is disposed between the metal support layer 21 and the conductor pattern 23 in the thickness direction. The first insulating layer 22 insulates the metal support layer 21 from the conductor pattern 23. The first insulating layer 22 is made of resin. Examples of materials for the first insulating layer 22 include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0026] (1-3) Conductor pattern The conductor pattern 23 is disposed on the first insulating layer 22 in the thickness direction. The conductor pattern 23 is located on the opposite side of the metal support layer 21 with respect to the first insulating layer 22 in the thickness direction. The conductor pattern 23 is made of metal. Examples of materials for the conductor pattern 23 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. A preferable material for the conductor pattern 23 is copper.

[0027] As shown in FIG. 2, the conductor pattern 23 has a plurality of terminals 231A, 231B, 231C, 231D, 231E, 231F, 231G, and 231H, a plurality of terminals 232A, 232B, 232C, 232D, 232E, 232F, 232G, and 232H, and a plurality of wirings 233A, 233B, 233C, 233D, 233E, 233F, 233G, and 233H.

[0028] At least a portion of each of the terminals 231A to 231H is disposed within the mounting area 20. The terminals 231A to 231H are electrically connected to the electronic element when the electronic element is mounted on the mounting area 20. The terminals 231A to 231D are located at one end of the mounting area 20 in the axial direction of the roll R. The terminals 231A to 231D are lined up in the circumferential direction of the roll R. The terminals 231E to 231H are located at the other end of the mounting area 20 in the axial direction of the roll R. The terminals 231E to 231H are lined up in the circumferential direction of the roll R. Each of the terminals 231A to 231H has a square land shape.

[0029] The terminals 232A to 232H are disposed away from the mounting area 20. The terminals 232A to 232D are located at one end of the wired circuit board 1 in the axial direction of the roll R. The terminals 232A to 232D are disposed away from the terminals 231A to 231D in the axial direction of the roll R. The terminals 232A to 232D are lined up in the circumferential direction of the roll R. The terminals 232E to 232H are located at the other end of the wired circuit board 1 in the axial direction of the roll R. The terminals 232E to 232H are disposed away from the terminals 231E to 231H in the axial direction of the roll R. The terminals 232E to 232H are lined up in the circumferential direction of the roll R. Each of the terminals 232A to 232H has a square land shape.

[0030] The wiring 233A electrically connects the terminal 231A and the terminal 232A. One end of the wiring 233A is connected to the terminal 231A. The other end of the wiring 233A is connected to the terminal 232A. The wiring 233B electrically connects the terminal 231B and the terminal 232B. One end of the wiring 233B is connected to the terminal 231B. The other end of the wiring 233B is connected to the terminal 232B. The wiring 233C electrically connects the terminal 231C and the terminal 232C. One end of the wiring 233C is connected to the terminal 231C. The other end of the wiring 233C is connected to the terminal 232C. The wiring 233D electrically connects the terminal 231D and the terminal 232D. One end of the wiring 233D is connected to the terminal 231D. The other end of the wiring 233D is connected to the terminal 232D. The wiring 233E electrically connects the terminal 231E and the terminal 232E. One end of the wiring 233E is connected to the terminal 231E. The other end of the wiring 233E is connected to the terminal 232E. The wiring 233F electrically connects the terminal 231F and the terminal 232F. One end of the wiring 233F is connected to the terminal 231F. The other end of the wiring 233F is connected to the terminal 232F. The wiring 233G electrically connects the terminal 231G and the terminal 232G. One end of the wiring 233G is connected to the terminal 231G. The other end of the wiring 233G is connected to the terminal 232G. The wiring 233H electrically connects the terminal 231H and the terminal 232H. One end of the wiring 233H is connected to the terminal 231H, and the other end of the wiring 233H is connected to the terminal 232H.

[0031] (1-4) Second insulating layer 3, the second insulating layer 24 covers the wirings 233A-233H. The second insulating layer 24 is disposed on the first insulating layer 22 in the thickness direction. The second insulating layer 24 does not cover the terminals 231A-231H and the terminals 232A-232H. The second insulating layer 24 is made of resin. Examples of materials for the second insulating layer 24 include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0032] (1-5) Opening area As shown in FIG. 2, the wired circuit board 2 has a portion 25 to be opened.

[0033] The intended opening portion 25 is a portion where an opening OP (see FIG. 5B) is planned to be formed. The intended opening portion 25 is disposed at the center of the wired circuit board 2 in the axial direction of the roll R, and is also disposed at the center of the wired circuit board 2 in the circumferential direction of the roll R. The intended opening portion 25 is disposed within the mounting area 20. The intended opening portion 25 extends in the axial direction of the roll R and in the circumferential direction of the roll R. The shape of the intended opening portion 25 is not limited. For example, the intended opening portion 25 has a rectangular shape.

[0034] A length L11 of the portion to be an opening 25 in the circumferential direction of the roll R is shorter than a length L12 of the portion to be an opening 25 in the axial direction of the roll R.

[0035] The length L11 (L11 / R1) of the intended opening portion 25 in the circumferential direction of the roll R relative to the outer diameter R1 of the roll R is, for example, 0.005 or more, preferably 0.01 or more, and for example, 0.1 or less, preferably 0.075 or less.

[0036] The terminals 231A to 231H are arranged around the intended opening portion 25. The terminals 231A to 231D are arranged on one side of the peripheral edge of the intended opening portion 25 in the axial direction of the roll R. The terminals 231E to 231H are arranged on the other side of the peripheral edge of the intended opening portion 25 in the axial direction of the roll R.

[0037] The terminals 231A to 231H are disposed within a range of 1.0 mm from the intended opening portion 25.

[0038] 3, in this embodiment, the intended opening portion 25 is made of the metal support layer 21. The first insulating layer 22 has a first insulating layer opening 26, and the second insulating layer 24 has a second insulating layer opening 27. The intended opening portion 25 is exposed in the first insulating layer opening 26 and the second insulating layer opening 27.

[0039] (2) Frame As shown in Fig. 2, the frame 3 is disposed around the wired circuit board 2. As shown in Fig. 3, the frame 3 is connected to the metal support layer 21 of the wired circuit board 2. In this way, the frame 3 supports the wired circuit board 2. The frame 3 is made of the same material as the metal support layer 21 of the wired circuit board 2.

[0040] 2. Manufacturing method of printed circuit board Next, a method for manufacturing the wired circuit board 2 will be described.

[0041] The method for producing the wired circuit board 2 includes a roll production step (see FIGS. 4A to 5A and FIG. 1), a heating step, and an opening step (see FIG. 5B).

[0042] (1) Roll manufacturing process In the roll manufacturing process, a roll R of a wired circuit board assembly sheet is manufactured. The roll manufacturing process includes a first insulating layer forming process (see FIGS. 4A and 4B), a conductor pattern forming process (see FIG. 4C), and a second insulating layer forming process (see FIG. 5A).

[0043] (1-1) First insulating layer formation process As shown in FIGS. 4A and 4B, in the first insulating layer forming step, a first insulating layer 12 is formed on a base material S. The base material S is the material of the metal support layer 21 (see FIG. 3) of the wiring circuit board 2 and the frame 3. The base material S is a metal foil. A product area A1 and an intended opening area A2 are set in the base material S. The product area A1 is an area where the wiring circuit board 2 is formed. The intended opening area A2 is an area where the intended opening portion 25 is formed. The intended opening area A2 is set within the product area A1.

[0044] In the first insulating layer forming step, the first insulating layer 22 is formed on the product area A1 of the substrate S. In detail, first, a photosensitive resin solution (varnish) is applied onto the substrate S and dried to form a coating film of the photosensitive resin. Next, the coating film of the photosensitive resin is exposed to light and developed. As a result, the first insulating layer 22 is formed on the substrate S.

[0045] (1-2) Conductor pattern formation process Next, as shown in FIG. 4C, in the conductive pattern formation step, conductive pattern 23 is formed on first insulating layer 22.

[0046] More specifically, in the conductive pattern forming step, a seed layer is first formed on the surfaces of the first insulating layer 22 and the substrate S. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0047] Next, a plating resist is attached onto the first insulating layer 22 on which the seed layer is formed and the base material S. Next, the plating resist is exposed to light while the portion where the conductive pattern 23 is to be formed is shielded from light. Next, the exposed plating resist is developed.

[0048] As a result, the plating resist in the shaded portion, i.e., the portion where the conductive pattern 23 is to be formed, is removed to expose the seed layer. On the other hand, the plating resist in the exposed portion, i.e., the portion where the conductive pattern 23 is not to be formed, remains.

[0049] Next, the conductive pattern 23 is formed on the exposed seed layer by electrolytic plating.

[0050] After the electrolytic plating is completed, the plating resist is stripped off and the exposed seed layer is removed by etching.

[0051] (1-3) Second insulating layer formation process Next, as shown in FIG. 5A, in the second insulating layer formation step, second insulating layer 24 is formed on first insulating layer 22 and conductive pattern 23.

[0052] In the second insulating layer forming process, first, a photosensitive resin solution (varnish) is applied onto the first insulating layer 22 and the conductive pattern 23 and dried to form a coating film of the photosensitive resin. Next, the coating film of the photosensitive resin is exposed to light and developed. As a result, the second insulating layer 24 is formed.

[0053] By completing the second insulating layer forming step, the wired circuit board assembly sheet 1 is obtained.

[0054] After the second insulating layer forming step is completed, the wired circuit board assembly sheet 1 is wound up around a core C as shown in FIG.

[0055] (2) Curing process Next, in the curing step, the roll R of the wired circuit board assembly sheet 1 is cured. Specifically, the roll R is heated at a constant temperature for a predetermined time to cure the first insulating layer 22 and the second insulating layer 24.

[0056] When the first insulating layer 22 and the second insulating layer 24 are made of polyimide, the heating temperature is, for example, 300° C. or more, preferably 350° C. or more, and, for example, 500° C. or less, preferably 450° C. or less.

[0057] When the first insulating layer 22 and the second insulating layer 24 are made of polyimide, the heating time is, for example, 1 hour or more and, for example, 9 hours or less.

[0058] (3) Opening process Next, as shown in Fig. 5B, after the curing step, in the opening step, the intended opening portion 25 is opened. To open the intended opening portion 25, for example, the intended opening portion 25 is removed by etching. Note that in the opening step, the periphery of the wired circuit board 2 may be etched. In this way, the wired circuit board 2 is obtained.

[0059] 3. Effects In the wired circuit board assembly sheet roll R, as shown in Figs. 1 and 2, the length L1 of the intended opening portion 25 in the circumferential direction of the roll R is shorter than the length L2 of the intended opening portion 25 in the axial direction of the roll.

[0060] Therefore, even if the curved state of the wired circuit board 2 continues, the flatness of the wired circuit board 2 can be prevented from decreasing.

[0061] In particular, even if the wired circuit board assembly sheet 1 is cured in the form of a roll R, it is possible to prevent the flatness of the wired circuit board 2 from decreasing.

[0062] 4. Variations Next, modified examples will be described. In the following modified examples, the same members as those in the above embodiment are given the same reference numerals, and the description thereof will be omitted. (1) As shown in Fig. 6, a length L21 of the wired circuit board 2 in the circumferential direction of the roll R may be longer than a length L22 of the wired circuit board 2 in the axial direction of the roll R. Note that a length L11 of the intended opening portion 25 in the circumferential direction of the roll R is shorter than a length L12 of the intended opening portion 25 in the axial direction of the roll R.

[0063] Even in this case, the length L11 of the intended opening portion 25 in the circumferential direction of the roll R is shorter than the length L12 of the intended opening portion 25 in the axial direction of the roll R, so that the flatness of the wired circuit board 2 can be prevented from decreasing. (2) As shown in Fig. 7A, the intended opening portion 25 may be composed of a first insulating layer 22, a second insulating layer 24, and a metal supporting layer 21. In this case, as shown in Fig. 7B, in the opening step, the intended opening portion 25 may be cut out with, for example, a cutter. (3) The wired circuit board 2 does not need to have the metal supporting layer 21 . EXAMPLES

[0064] Next, the present invention will be described based on examples and comparative examples. The present invention is not limited by the following examples. In addition, the specific numerical values ​​of physical properties, parameters, etc. used in the following description can be replaced with the upper limit values ​​(numerical values ​​defined as "less than" or "less than") or lower limit values ​​(numerical values ​​defined as "more than" or "greater than") of the corresponding physical properties, parameters, etc. described in the above "Form for carrying out the invention".

[0065] 1. Manufacturing of printed circuit boards (1) Example 1 By the method described in the above embodiment, a roll of a wired circuit board assembly sheet (sheet width: 1 m, roll outer diameter: 30 cm, core outer diameter: 10 cm) was produced.

[0066] In the obtained roll, the length of the wired circuit board in the axial direction of the roll was 10 cm, the length of the wired circuit board in the circumferential direction of the roll was 5 cm, the length of the intended opening portion in the axial direction of the roll was 0.9 cm, and the length of the intended opening portion in the circumferential direction of the roll was 0.6 cm.

[0067] The resulting roll was then cured at 400° C. for 5 hours.

[0068] Next, the wired circuit board assembly sheet was pulled out from the roll, and the base material was etched along the outline of the wired circuit board, and the portions to be opened were removed to obtain a wired circuit board having an opening in the center (opening step, see FIG. 5B).

[0069] (2) Example 2 A roll of a wired circuit board assembly sheet (sheet width: 1 m, roll outer diameter: 30 cm, core outer diameter: 10 cm) was produced in the same manner as in Example 1 described above.

[0070] In the obtained roll, the length of the wired circuit board in the axial direction of the roll was 5 cm, the length of the wired circuit board in the circumferential direction of the roll was 10 cm, the length of the intended opening portion in the axial direction of the roll was 0.9 cm, and the length of the intended opening portion in the circumferential direction of the roll was 0.6 cm.

[0071] The obtained roll was cured under the same conditions as in Example 1, and then the substrate was etched along the outline of the wiring circuit board, and the portions to be opened were removed to obtain a wiring circuit board.

[0072] (3) Comparative Example A roll of a wired circuit board assembly sheet (sheet width: 1 m, roll outer diameter: 30 cm, core outer diameter: 10 cm) was produced in the same manner as in Example 1 described above.

[0073] In the obtained roll, the length of the wired circuit board in the axial direction of the roll was 5 cm, the length of the wired circuit board in the circumferential direction of the roll was 10 cm, the length of the intended opening portion in the axial direction of the roll was 0.6 cm, and the length of the intended opening portion in the circumferential direction of the roll was 0.9 cm.

[0074] The obtained roll was cured under the same conditions as in Example 1, and then the substrate was etched along the outline of the wiring circuit board, and the portions to be opened were removed to obtain a wiring circuit board.

[0075] 2. Flatness evaluation The wired circuit board obtained in each of the Examples and Comparative Examples was placed on a flat surface. When the wired circuit board was curved, a gap was generated between the wired circuit board and the flat surface in the direction perpendicular to the flat surface.

[0076] Next, the distance between the wiring circuit board and the flat surface in the direction perpendicular to the flat surface was measured using an image measuring system. The difference between the minimum and maximum values ​​of the distance between the wiring circuit board and the flat surface was taken as the displacement. Note that the distance between the wiring circuit board and the flat surface was minimum (zero) at the portion in contact with the flat surface.

[0077] When the displacement of the comparative example was taken as 1, the displacement of the example 1 was 0.5, and the displacement of the example 2 was 0.7. The smaller the displacement, the higher the flatness. [Explanation of symbols]

[0078] 1 Wiring circuit board assembly sheet 2 Wiring circuit board 21 Metal support layer 22 First insulating layer (insulating layer) 23 Conductor Pattern 25 Opening area 26 First insulating layer opening (insulating layer opening) R Roll L1: Length of the printed circuit board in the circumferential direction of the roll L2 Length of the printed circuit board in the axial direction of the roll L11: Length of the opening in the circumferential direction of the roll L12 Length of the opening in the axial direction of the roll

Claims

1. A roll of a wiring circuit board assembly sheet, The wired circuit board assembly sheet is A printed circuit board having an insulating layer and a conductor pattern disposed on the insulating layer; a frame for supporting the printed circuit board; having the printed circuit board has an intended opening portion in which an opening is to be formed, The intended opening portion extends in an axial direction of the roll and a circumferential direction of the roll, A roll of wired circuit board assembly sheet, wherein a length of the intended opening portion in a circumferential direction of the roll is shorter than a length of the intended opening portion in an axial direction of the roll.

2. The printed circuit board is 2. The roll of the wired circuit board assembly sheet according to claim 1, further comprising a metal supporting layer disposed on the opposite side of the insulating layer from the conductor pattern.

3. the insulating layer has an insulating layer opening; 3. The wired circuit board assembly sheet roll according to claim 2, wherein the opening-intended portion is made of the metal supporting layer and is exposed in the insulating layer opening.

4. 2. The roll of wired circuit board assembly sheet according to claim 1, wherein a length of the wired circuit board in a circumferential direction of the roll is shorter than a length of the wired circuit board in an axial direction of the roll.

5. 2. The roll of wired circuit board assembly sheet according to claim 1, wherein a length of the wired circuit board in a circumferential direction of the roll is longer than a length of the wired circuit board in an axial direction of the roll.

6. A roll production process for producing a roll of the wired circuit board assembly sheet according to any one of claims 1 to 5; a curing step of curing the roll; an opening step of opening the intended opening portion after the curing step; A method for manufacturing a wired circuit board, comprising:

Images