Photosensitive transfer material, light-shielding material, LED array, and electronic apparatus

Abstract

To provide a photosensitive transfer material which can obtain a pattern excellent in rectangularity.SOLUTION: There are provided: a photosensitive transfer material which has a temporary support and a transfer layer including a photosensitive layer, wherein transmittance to light at a wavelength of 365 nm of the photosensitive layer is 0.1% or more and 30% or less or transmittance to light at a wavelength of 405 nm of the photosensitive layer is 0.05% or more and 30% or less; a light-shielding material which has a resin layer having a first surface, a second surface that is a surface opposite to the first surface and a through hole extending to the second surface from the first surface, wherein transmittance to light at a wavelength of 365 nm of the resin layer is 0.1% or more and 30% or less or transmittance to light at a wavelength of 405 nm of the resin layer is 0.05% or more and 30% or less; and an LED array including the light-shielding material and an electronic apparatus.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a photosensitive transfer material, a light-shielding material, an LED array, and an electronic device. [Background technology]

[0002] Demand for light emitting diodes (LEDs) has been explosively increasing due to their low power consumption and environmental friendliness, and they are widely used in lighting devices, backlights for liquid crystal display devices, and display devices.

[0003] Furthermore, as a conventional transfer film, the one described in Patent Document 1 is known. Patent Document 1 describes a transfer film having a temporary support, a photosensitive layer containing solids of a photosensitive resin composition, the photosensitive resin composition containing a binder having a weight average molecular weight of 4,000 to 25,000, a polymerization initiator in an amount greater than 0 mass % and less than 9 mass % with respect to the total solid content of the composition, a polymerizable monomer, and a pigment, the polymerizable monomer containing a difunctional polymerizable monomer (excluding nonaethylene glycol diacrylate), the ratio of the mass of the difunctional polymerizable monomer to the total mass of the polymerizable monomer being 50 mass % or more, and the pigment being a black pigment. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6840141 Summary of the Invention [Problem to be solved by the invention]

[0005] When multiple optical elements such as mini LEDs and micro LEDs are laid out on a substrate, a light-shielding layer is formed to suppress color mixing due to the light. The light-shielding layer is patterned on the holes along the shape of the light-emitting body of the optical element. Until now, it has been produced by coating such as inkjet, spin coating, and slit coating using black ink, but there was room for improvement in appearance due to uneven concentration caused by uneven film thickness of the black ink layer. From the viewpoint of film thickness uniformity, it is also known to form a light-shielding layer by making black ink into a dry film and transferring this (Patent Document 1). However, all light-shielding materials had room for improvement in light leakage from the end of the hole when an optical element such as an LED was made to emit light. As a result of various studies, the present inventor found that the above-mentioned light leakage is related to the rectangularity of the pattern of the light-shielding layer.

[0006] An object of one embodiment of the present invention is to provide a photosensitive transfer material that can provide a pattern with excellent rectangularity. Another problem to be solved by the present invention is to provide a light-shielding material having a pattern with excellent rectangularity. Another problem to be solved by another embodiment of the present invention is to provide an LED array and an electronic device that include the above-mentioned light blocking material. [Means for solving the problem]

[0007] Means for solving the above problems include the following aspects. <1> A photosensitive transfer material having a temporary support and a transfer layer including a photosensitive layer, the photosensitive layer having a transmittance of 0.1% or more and 30% or less for light having a wavelength of 365 nm. <2> A photosensitive transfer material having a temporary support and a transfer layer including a photosensitive layer, the photosensitive layer having a transmittance of 0.05% or more and 30% or less for light having a wavelength of 405 nm. <3> The optical density of the photosensitive layer for light having a wavelength of 550 nm is 3.0 or more. <1> or <2> 2. The photosensitive transfer material according to claim 1 . <4> The photosensitive layer contains a pigment. <1> ~ <3> 10. The photosensitive transfer material according to claim 9, <5> The pigment includes a black pigment. <4> 2. The photosensitive transfer material according to claim 1 . <6> The pigment is zirconium nitride. <4> or <5> 2. The photosensitive transfer material according to claim 1 . <7> The photosensitive layer contains a polymerizable compound and a photopolymerization initiator. <1> ~ <6> 10. The photosensitive transfer material according to claim 9, <8> The polymerizable compound includes a bifunctional polymerizable compound. <7> 2. The photosensitive transfer material according to claim 1 . <9> The content of the bifunctional polymerizable compound is 50% by mass or more based on the total mass of the polymerizable compounds. <8> 2. The photosensitive transfer material according to claim 1 . <10> The polymerizable compound contains a monomer having a bisphenol A skeleton. <7> ~ <9> 10. The photosensitive transfer material according to claim 9, <11> The photosensitive layer contains a polymer having a crosslinkable group. <1> ~ <10> 10. The photosensitive transfer material according to claim 9, <12> Photosensitive transfer material for LED arrays <1> ~ <11> 10. The photosensitive transfer material according to claim 9, <13> A light-shielding material comprising a resin layer having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, wherein the transmittance of the resin layer for light with a wavelength of 365 nm is 0.1% or more and 30% or less. <14> A light-shielding material comprising a resin layer having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, wherein the transmittance of the resin layer for light with a wavelength of 405 nm is 0.05% or more and 30% or less. <15> The through hole has an inclination in a thickness direction of the resin layer, and an inclination angle between a side surface of the through hole and the first surface is 60° or more. <13> or <14> The light-shielding material described in <16> The through holes in the first surface have an average size of 50 μm or less. <13> ~ <15> 13. A light-blocking material according to any one of the preceding claims. <17> The optical density of the resin layer with respect to light having a wavelength of 550 nm is 3.0 or more. <13> ~ <16> 13. A light-blocking material according to any one of the preceding claims. <18> Light shielding material for LED arrays <13> ~ <17> 13. A light-blocking material according to any one of the preceding claims. <19> <13> ~ <17> 13. An electronic device comprising the light-shielding material according to any one of claims 1 to 12. <20> <18> An LED array comprising the light blocking material described above. <21> <20> An electronic device comprising the LED array according to claim 1. Effect of the Invention

[0008] According to one embodiment of the present invention, it is possible to provide a photosensitive transfer material that can obtain a pattern with excellent rectangularity. According to another embodiment of the present invention, a light-shielding material having a pattern with excellent rectangularity can be provided. According to another embodiment of the present invention, an LED array and an electronic device including the above-mentioned light blocking material can be provided. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing an example of a configuration of a photosensitive transfer material according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present disclosure will be described below with reference to the accompanying drawings, in which reference numerals may be omitted. In addition, in this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower limit and upper limit. In addition, in this specification, "(meth)acrylic" refers to both or either of acrylic and methacrylic, "(meth)acrylate" refers to both or either of acrylate and methacrylate, and "(meth)acryloyl" refers to both or either of acryloyl and methacryloyl. Furthermore, in this specification, when a plurality of substances corresponding to each component are present in the composition, the amount of each component in the composition means the total amount of the corresponding substances present in the composition, unless otherwise specified. In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes as long as the intended purpose of the process is achieved. In the description of groups (atomic groups) in this specification, when there is no indication of substituted or unsubstituted, the term encompasses both unsubstituted and substituted groups. For example, the term "alkyl group" encompasses not only alkyl groups without a substituent (unsubstituted alkyl groups) but also alkyl groups with a substituent (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams. In addition, examples of light used for exposure generally include the bright line spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays (active energy rays). In addition, chemical structural formulas in this specification may be described as simplified structural formulas in which hydrogen atoms are omitted. In the present disclosure, "mass %" and "weight %" are synonymous, and "parts by mass" and "parts by weight" are synonymous. Also, in the present disclosure, combinations of two or more preferred aspects are more preferred aspects. In addition, unless otherwise specified, the weight average molecular weight (Mw) and number average molecular weight (Mn) in the present disclosure are molecular weights detected by a gel permeation chromatography (GPC) analyzer using columns of TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all product names manufactured by Tosoh Corporation) in a solvent of THF (tetrahydrofuran) and a differential refractometer, and converted using polystyrene as a standard substance. In this specification, the term "total solid content" refers to the total mass of the components excluding the solvent from the entire composition of the composition. As described above, the term "solid content" refers to the components excluding the solvent, and may be, for example, solid or liquid at 25°C.

[0011] (Photosensitive transfer material) A first embodiment of the photosensitive transfer material according to the present disclosure has a temporary support and a transfer layer including a photosensitive layer, and the transmittance of the photosensitive layer for light having a wavelength of 365 nm is 0.1% or more and 30% or less. A second embodiment of the photosensitive transfer material according to the present disclosure has a temporary support and a transfer layer including a photosensitive layer, and the transmittance of the photosensitive layer for light having a wavelength of 405 nm is 0.05% or more and 30% or less.

[0012] In this specification, unless otherwise specified, when the term "photosensitive transfer material according to the present disclosure" or "photosensitive transfer material" is used, it refers to both the first embodiment and the second embodiment.

[0013] The photosensitive transfer material according to the present disclosure can be suitably used as a photosensitive transfer material for an LED array.

[0014] Conventionally, light-shielding materials used in LED arrays and the like have poor light transmittance, and it is believed that the exposure light does not reach deep into the resist. This means that the curing properties, especially the effect in the deeper parts, are insufficient, and there are often problems with rectangularity. The photosensitive transfer material according to the present disclosure has a photosensitive layer with a transmittance of 0.1% or more and 30% or less for light with a wavelength of 405 nm, and therefore has appropriate transmittance for light with a wavelength of 365 nm or 405 nm, thereby improving curing properties and resulting patterns with excellent rectangularity.

[0015] <Transmittance to light with a wavelength of 365 nm> In a first embodiment of the photosensitive transfer material according to the present disclosure, the transmittance of the photosensitive layer for light with a wavelength of 365 nm is 0.1% or more and 30% or less, and from the viewpoints of tight blackness (suppression of reflections due to external reflected light, for example, suppression of reflections from fluorescent lamps), wide development margin, and rectangularity of the obtained pattern, it is preferably 0.12% or more and 20% or less, and more preferably 0.15% or more and 10% or less. In a second embodiment of the photosensitive transfer material according to the present disclosure, from the viewpoint of the rectangularity of the resulting pattern, the transmittance of the photosensitive layer for light having a wavelength of 365 nm is preferably 0.1% or more and 30% or less, more preferably 0.12% or more and 20% or less, and particularly preferably 0.15% or more and 10% or less.

[0016] <Transmittance to light with a wavelength of 405 nm> In a second embodiment of the photosensitive transfer material according to the present disclosure, the transmittance of the photosensitive layer for light with a wavelength of 405 nm is 0.05% or more and 30% or less, and from the viewpoints of tightness of black, wide development margin, and rectangularity of the obtained pattern, it is preferably 0.06% or more and 20% or less, and more preferably 0.10% or more and 10% or less. In a first embodiment of the photosensitive transfer material according to the present disclosure, from the viewpoints of tightness of black, wide development margin, and rectangularity of the resulting pattern, the transmittance of the photosensitive layer for light having a wavelength of 405 nm is preferably 0.05% or more and 30% or less, more preferably 0.06% or more and 20% or less, and particularly preferably 0.10% or more and 10% or less.

[0017] <Optical density at 550 nm wavelength> In the photosensitive transfer material according to the present disclosure, the optical density of the photosensitive layer at a wavelength of 550 nm is preferably 1.5 or more, more preferably 2.5 or more, even more preferably 3.0 or more, and particularly preferably 3.0 or more and 5.0 or less, from the viewpoints of tightness of black, wide development margin, and rectangularity of the obtained pattern.

[0018] In the present disclosure, the transmittance at each of the above wavelengths is measured using a spectrophotometer (UV-1800, manufactured by Shimadzu Corporation). In the present disclosure, the optical density is measured using a transmission densitometer (BMT-1, manufactured by Sakata Inx Corporation).

[0019] The photosensitive transfer material according to the present disclosure has a temporary support and a transfer layer including a photosensitive layer. Examples of the transfer layer include a thermoplastic resin layer, a water-soluble resin layer, and a functional layer in addition to a photosensitive layer. From the viewpoints of tight blackness, wide development margin, and rectangularity of the resulting pattern, the photosensitive layer preferably contains a pigment, more preferably contains a black pigment, and particularly preferably contains zirconium nitride. Moreover, from the viewpoints of pattern formability, tightness of black, wide development margin, and rectangularity of the obtained pattern, the photosensitive layer preferably contains a polymerizable compound and a photopolymerization initiator, and more preferably contains an alkali-soluble resin, a polymerizable compound, and a photopolymerization initiator. In the photosensitive transfer material, the temporary support and the photosensitive layer may be laminated directly without any other layer therebetween, or may be laminated via another layer. Also, another layer may be laminated on the surface of the photosensitive layer opposite to the surface facing the temporary support. Examples of layers other than the temporary support and the photosensitive layer include a thermoplastic resin layer, a water-soluble resin layer, a functional layer, and a protective film.

[0020] An example of the embodiment of the photosensitive transfer material according to the present disclosure is shown below, but is not limited thereto. (1) "Temporary support / photosensitive layer / protective film" (2) "Temporary support / thermoplastic resin layer / photosensitive layer / protective film" (3) "Temporary support / functional layer / photosensitive layer / protective film" (4) "Temporary support / thermoplastic resin layer / functional layer / photosensitive layer / protective film" In each of the above-mentioned configurations, the photosensitive layer is preferably a negative photosensitive layer.

[0021] In the photosensitive transfer material, when the photosensitive layer further has other layers on the side opposite the temporary support side, the total thickness of the other layers arranged on the side opposite the temporary support side of the photosensitive layer is preferably 0.1% to 30%, and more preferably 0.1% to 20%, of the thickness of the photosensitive layer.

[0022] An example of the photosensitive transfer material will be described below. The photosensitive transfer material 20 shown in FIG. 1 has a temporary support 11, a transfer layer 12 including a thermoplastic resin layer 13, a functional layer 15 and a photosensitive layer 17, and a protective film 19, in this order. Although the photosensitive transfer material 20 shown in FIG. 1 has a protective film 19 disposed thereon, the protective film 19 does not necessarily have to be disposed. Furthermore, the photosensitive transfer material 20 shown in FIG. 1 has a configuration in which the thermoplastic resin layer 13 and the functional layer 15 are disposed, but the thermoplastic resin layer 13 and the functional layer 15 do not necessarily have to be disposed. Each element constituting the photosensitive transfer material will be described below.

[0023] [Temporary Support] The photosensitive transfer material used in the present disclosure has a temporary support. The temporary support is a support that supports the photosensitive layer or a laminate including the photosensitive layer and is peelable.

[0024] The temporary support preferably has light transmittance from the viewpoint of enabling exposure of the photosensitive layer through the temporary support when the photosensitive layer is subjected to patternwise exposure. In this specification, "having light transmittance" means that the transmittance of light of the wavelength used for patternwise exposure is 50% or more. From the viewpoint of improving the exposure sensitivity of the photosensitive layer, the temporary support preferably has a transmittance of 60% or more, more preferably 70% or more, for light having a wavelength used for patternwise exposure (more preferably a wavelength of 365 nm). The transmittance of a layer of a photosensitive transfer material is the ratio of the intensity of emitted light that has passed through the layer to the intensity of incident light when light is incident in a direction perpendicular to the main surface of the layer (thickness direction), and is measured using an MCPD Series manufactured by Otsuka Electronics Co., Ltd.

[0025] Examples of materials constituting the temporary support include a glass substrate, a resin film, and paper. From the viewpoints of strength, flexibility, and light transmittance, a resin film is preferred. Examples of the resin film include a polyethylene terephthalate (PET) film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Among these, a PET film is preferable, and a biaxially stretched PET film is more preferable.

[0026] The thickness (layer thickness) of the temporary support is not particularly limited, and may be selected according to the material from the standpoints of strength as a support, flexibility required for bonding to a substrate for forming circuit wiring, and light transmittance required in the initial exposure step. The thickness of the temporary support is preferably in the range of 5 μm to 100 μm, and from the viewpoints of ease of handling and versatility, more preferably in the range of 10 μm to 50 μm, further preferably in the range of 10 μm to 35 μm, particularly preferably in the range of 10 μm to 20 μm. The thickness of the temporary support is preferably 50 μm or less, and more preferably 25 μm or less, from the viewpoints of resolution and linearity when exposure is performed through the temporary support.

[0027] Furthermore, the film used as the temporary support is preferably free from deformations such as wrinkles, scratches, defects, and the like. From the viewpoint of pattern formability during pattern exposure through the temporary support and the transparency of the temporary support, it is preferable that the number of fine particles, foreign matter, defects, precipitates, etc. contained in the temporary support is small. The number of fine particles, foreign matter, and defects with a diameter of 1 μm or more is 50 / 10 mm. 2 It is preferable that the number of pieces is less than 10 pieces / 10 mm. 2 More preferably, 3 pieces / 10 mm or less.2 More preferably, 0 pieces / 10 mm or less. 2 It is particularly preferred that:

[0028] Preferred embodiments of the temporary support are described, for example, in paragraphs 0017 to 0018 of JP 2014-85643 A, paragraphs 0019 to 0026 of JP 2016-27363 A, paragraphs 0041 to 0057 of WO 2012 / 081680 A, paragraphs 0029 to 0040 of WO 2018 / 179370 A, and paragraphs 0012 to 0032 of JP 2019-101405 A, the contents of which are incorporated herein by reference.

[0029] [Photosensitive layer] The photosensitive transfer material according to the present disclosure has a photosensitive layer. The photosensitive layer is preferably a negative photosensitive layer in which the solubility in a developer of exposed areas decreases upon exposure, and the unexposed areas are removed by development. Each component will be described in turn below.

[0030] <Pigments> The photosensitive layer preferably contains a pigment from the viewpoints of tightness of black, wide development margin, and rectangularity of the resulting pattern. The pigment may be appropriately selected according to the desired hue, and may be selected from black pigments, white pigments, and pigments of chromatic colors other than black and white. Among them, when a black pattern is to be formed, a black pigment is preferably selected as the pigment.

[0031] As the black pigment, various known black pigments can be used. The black pigment may be an inorganic pigment or an organic pigment. Examples of black inorganic pigments include metal oxides, metal nitrides, and metal oxynitrides containing one or more metal elements selected from the group consisting of metal elements of Group 4 such as titanium (Ti) and zirconium (Zr), metal elements of Group 5 such as vanadium (V) and niobium (Nb), cobalt (Co), chromium (Cr), copper (Cu), manganese (Mn), ruthenium (Ru), iron (Fe), nickel (Ni), tin (Sn), and silver (Ag). The inorganic pigment may be surface-modified. For example, inorganic particles that have been surface-modified with a surface treatment agent having both a silicone group and an alkyl group, such as the "KTP-09" series (manufactured by Shin-Etsu Chemical Co., Ltd.), may be used as particles containing other atoms. For example, they may be used as metal nitride-containing particles further containing atoms selected from the elements of Groups 13 to 17 of the Periodic Table (preferably oxygen atoms and / or sulfur atoms). The black pigment may also be carbon black. Specific examples of carbon black include organic pigments such as CI Pigment Black 1 and inorganic pigments such as CI Pigment Black 7, both of which are commercially available.

[0032] Among these, as the black pigment, a nitride or oxide of a Group 4 metal element, a nitride or oxynitride of a Group 5 metal element, or carbon black is preferred, a nitride or oxynitride of titanium, a nitride or oxynitride of zirconium, a nitride or oxynitride of vanadium, a nitride or oxynitride of niobium, or carbon black is more preferred, a nitride or oxynitride of titanium, a nitride or oxynitride of zirconium, a nitride or oxynitride of vanadium, or a nitride or oxynitride of niobium is even more preferred, a nitride or oxynitride of titanium, or a nitride or oxynitride of zirconium is particularly preferred, and zirconium nitride is most preferred. Note that the nitride of titanium is titanium nitride, the nitride of zirconium is zirconium nitride, the nitride of vanadium is vanadium nitride, and the nitride of niobium is niobium nitride. Also, the oxynitride of titanium is titanium oxynitride, the oxynitride of zirconium is zirconium oxynitride, the oxynitride of vanadium is vanadium oxynitride, and the oxynitride of niobium is niobium oxynitride. Examples of the black pigment also include commercially available "NITRBLACK UB-1" (manufactured by Mitsubishi Materials Corporation), zirconium nitride powder described in JP-A-2017-222559, and black pigments such as the fine particle low-order oxidized zirconium·zirconium nitride composite described in Japanese Patent No. 4931011.

[0033] In this specification, titanium nitride is intended to mean TiN, and may contain oxygen atoms that are inevitable in production (for example, those in which the surface of TiN particles is oxidized unintentionally, etc.). In this specification, titanium nitride is intended to mean a compound in which the diffraction angle 2θ of the peak derived from the (200) plane is 42.5° to 42.8° when CuKα rays are used as the X-ray source. Also, in this specification, titanium oxynitride is intended to mean a compound in which the diffraction angle 2θ of the peak derived from the (200) plane is more than 42.8° when CuKα rays are used as the X-ray source. The upper limit value of the diffraction angle 2θ of titanium oxynitride is not particularly limited, but is preferably 43.5° or less. Examples of titanium oxynitride include titanium black, etc. More specifically, for example, TiO 2 , Ti n O 2n-1 (1 ≤ n ≤ 20) and / or a form containing titanium oxynitride represented by TiNxOy (0 < x < 2.0, 0.1 < y < 2.0). In the following description, titanium nitride (the diffraction angle 2θ is 42.5° to 42.8°) and titanium oxynitride (the diffraction angle 2θ is more than 42.8°) are collectively referred to as titanium nitride, and the form thereof will be described. Titanium nitride may also be used as particles further containing other atoms. For example, titanium nitride may also be used as titanium nitride-containing particles further containing an atom (preferably a sulfur atom) selected from the group consisting of elements of groups 13 to 17 of the periodic table. The same is true for other metal nitrides, and metal nitrides, which are collectively referred to as metal nitrides and metal oxynitrides, may also be used as particles further containing other atoms. For example, metal nitrides may also be used as metal nitride-containing particles further containing an atom (preferably a sulfur atom) selected from the group consisting of elements of groups 13 to 17 of the periodic table.

[0034] From the viewpoint of dispersion stability, the average primary particle size of the pigment is preferably from 0.005 μm to 1 μm, more preferably from 0.01 μm to 0.5 μm, and particularly preferably from 0.01 μm to 0.2 μm.

[0035] The average primary particle size of the pigment can be measured using a transmission electron microscope (TEM), such as a transmission electron microscope HT7700 manufactured by Hitachi High-Technologies Corporation. The maximum length of a particle image obtained using a transmission electron microscope (Dmax: the maximum length at two points on the outline of the particle image) and the maximum perpendicular length (DV-max: the shortest length perpendicularly connecting two lines when the image is sandwiched between two lines parallel to the maximum length) are measured, and the geometric mean value (Dmax x DV-max) / 2 is taken as the particle size. The particle sizes of 100 particles are measured using this method, and the arithmetic mean value is taken as the average particle size, which is the average primary particle size of the pigment.

[0036] As a pigment other than the black pigment, the white pigment described in paragraphs 0015 and 0114 of JP-A-2005-007765 can be used. Specifically, among the white pigments, the inorganic pigment is preferably titanium oxide, zinc oxide, lithopone, precipitated calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, or barium sulfate, more preferably titanium oxide or zinc oxide, and even more preferably titanium oxide. As the inorganic pigment, rutile or anatase titanium oxide is more preferable, and rutile titanium oxide is particularly preferable. The surface of titanium oxide may be subjected to a silica treatment, an alumina treatment, a titania treatment, a zirconia treatment, or an organic treatment, or may be subjected to two or more of these treatments, which suppresses the catalytic activity of titanium oxide and improves heat resistance, fading resistance, etc. From the viewpoint of reducing the thickness of the photosensitive layer after heating, the surface treatment of the titanium oxide is preferably at least one of alumina treatment and zirconia treatment, and particularly preferably both alumina treatment and zirconia treatment.

[0037] The photosensitive layer may further contain a chromatic pigment other than the black pigment and the white pigment. Examples of chromatic pigments include Victoria Pure Blue BO (Color Index (CI) 42595), Auramine (CI 41000), Fat Black HB (CI 26150), Monolight Yellow GT (CI Pigment Yellow 12), Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Hoster Balm Red ESB (CI Pigment Violet 19), Permanent Ruby FBH (CI Pigment Red 11), Fastel Pink B Supra (CI Pigment Red 81), Monastral Fast Blue (CI Pigment Red 146 ... Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Permanent Yellow GR (CI Pigment Yellow 17), Permanent Yellow HR (CI Pigment Yellow 83), Permanent Carmine FBB (CI Pigment Red 146), Permanent Yellow Pigment Blue 15), Monolight Fast Black B (CI Pigment Black 1) and Carbon, CI Pigment Red 97, CI Pigment Red 122, CI Pigment Red 149, CI Pigment Red 168, CI Pigment Red 177, CI Pigment Red 180, CI Pigment Red 192, CI Pigment Red 215, CI Pigment Green 7, CI Pigment Blue 15:1, CI Pigment Blue 15:4, CI Pigment Blue 22, CI Pigment Blue 60, CI Pigment Blue 64, and CI Pigment Violet 23.

[0038] From the viewpoints of tightness of black, wide development margin, and rectangularity of the obtained pattern, the content of the pigment is preferably 10% by mass to 70% by mass, more preferably 15% by mass to 60% by mass, and particularly preferably 15% by mass to 50% by mass, relative to the total mass of the photosensitive layer.

[0039] When the photosensitive layer contains pigments other than the black pigment (white pigment and chromatic pigments), the content of the pigments other than the black pigment is preferably 30% by mass or less, more preferably 1% by mass to 20% by mass, and even more preferably 3% by mass to 15% by mass, relative to the black pigment.

[0040] In addition, when the photosensitive layer contains a black pigment and is formed from a photosensitive resin composition, the black pigment (preferably zirconium nitride) is preferably introduced into the photosensitive resin composition in the form of a pigment dispersion. The dispersion may be prepared by adding a mixture of a black pigment and a pigment dispersant to an organic solvent (or vehicle) and dispersing the mixture with a dispersing machine. The pigment dispersant may be selected according to the pigment and the solvent, and for example, a commercially available dispersant may be used. The vehicle refers to the medium portion in which the pigment is dispersed when the pigment dispersion is prepared, and is liquid, and includes a binder component that holds the black pigment in a dispersed state and a solvent component (organic solvent) that dissolves and dilutes the binder component.

[0041] The dispersing machine is not particularly limited, and examples thereof include known dispersing machines such as kneaders, roll mills, attritors, super mills, dissolvers, homomixers, and sand mills. Furthermore, fine pulverization may be performed by utilizing frictional force through mechanical grinding. For details of dispersing machines and fine pulverization, see the description in "Encyclopedia of Pigments" (written by Kunizo Asakura, 1st Edition, Asakura Shoten, 2000, pp. 438 and 310).

[0042] <Alkali-soluble resin> The photosensitive layer preferably contains an alkali-soluble resin. In this specification, the term "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous solution of sodium carbonate at 22°C is 0.1 g or more. Examples of the alkali-soluble resin include (meth)acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy acrylate resin obtained by reacting an epoxy resin with (meth)acrylic acid, and acid-modified epoxy acrylate resin obtained by reacting an epoxy acrylate resin with an acid anhydride.

[0043] One preferred embodiment of the alkali-soluble resin is a (meth)acrylic resin, which has excellent alkali developability and film formability. In this specification, the (meth)acrylic resin means a resin having a structural unit derived from a (meth)acrylic compound. The content of the structural unit derived from a (meth)acrylic compound is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more, based on the total structural units of the (meth)acrylic resin. The (meth)acrylic resin may be composed only of structural units derived from (meth)acrylic compounds, or may contain structural units derived from polymerizable monomers other than (meth)acrylic compounds. That is, the upper limit of the content of structural units derived from (meth)acrylic compounds is 100% by mass or less based on the total structural units of the (meth)acrylic resin.

[0044] Examples of the (meth)acrylic compound include (meth)acrylic acid, (meth)acrylic acid esters, (meth)acrylamide, and (meth)acrylonitrile. Examples of the (meth)acrylic acid ester include (meth)acrylic acid alkyl ester, (meth)acrylic acid tetrahydrofurfuryl ester, (meth)acrylic acid dimethylaminoethyl ester, (meth)acrylic acid diethylaminoethyl ester, (meth)acrylic acid glycidyl ester, (meth)acrylic acid benzyl ester, 2,2,2-trifluoroethyl (meth)acrylate, and 2,2,3,3-tetrafluoropropyl (meth)acrylate, and (meth)acrylic acid alkyl ester is preferred. Examples of (meth)acrylamides include acrylamides such as diacetoneacrylamide.

[0045] Examples of the (meth)acrylic acid alkyl ester include (meth)acrylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate. As the (meth)acrylic acid ester, a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferred, and methyl (meth)acrylate or ethyl (meth)acrylate is more preferred.

[0046] The (meth)acrylic resin may have a structural unit other than the structural unit derived from the (meth)acrylic compound. The polymerizable monomer that forms the above-mentioned structural unit is not particularly limited as long as it is a compound other than a (meth)acrylic compound that is copolymerizable with a (meth)acrylic compound, and examples thereof include styrene compounds that may have a substituent at the α-position or aromatic ring, such as styrene, vinyl toluene, and α-methylstyrene, vinyl alcohol esters such as acrylonitrile and vinyl-n-butyl ether, maleic acid monoesters such as maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, and crotonic acid. These polymerizable monomers may be used alone or in combination of two or more.

[0047] In order to improve the alkali developability, the (meth)acrylic resin preferably has a structural unit having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group. Among these, the (meth)acrylic resin more preferably has a structural unit having a carboxy group, and even more preferably has a structural unit derived from the above-mentioned (meth)acrylic acid.

[0048] The content of the structural unit having an acid group in the (meth)acrylic resin (preferably a structural unit derived from (meth)acrylic acid) is preferably 10% by mass or more based on the total mass of the (meth)acrylic resin in terms of excellent developability. The upper limit is not particularly limited, but is preferably 50% by mass or less, more preferably 40% by mass or less, in terms of excellent alkali resistance.

[0049] Moreover, the (meth)acrylic resin more preferably has a structural unit derived from the above-mentioned (meth)acrylic acid alkyl ester. The content of structural units derived from an alkyl (meth)acrylate in the (meth)acrylic resin is preferably 50% by mass to 90% by mass, more preferably 60% by mass to 90% by mass, and even more preferably 65% ​​by mass to 90% by mass, based on all structural units of the (meth)acrylic resin.

[0050] As the (meth)acrylic resin, a resin having both a structural unit derived from (meth)acrylic acid and a structural unit derived from a (meth)acrylic acid alkyl ester is preferred, and a resin composed only of a structural unit derived from (meth)acrylic acid and a structural unit derived from a (meth)acrylic acid alkyl ester is more preferred. Furthermore, as the (meth)acrylic resin, an acrylic resin having a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, and a structural unit derived from ethyl acrylate is also preferred.

[0051] In addition, in terms of achieving better effects in the present disclosure, the (meth)acrylic resin preferably has at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester, and preferably has both structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester. The total content of the structural units derived from methacrylic acid and the structural units derived from methacrylic acid alkyl ester in the (meth)acrylic resin is preferably 40% by mass or more, more preferably 60% by mass or more, based on the total structural units of the (meth)acrylic resin, from the viewpoint of obtaining better effects in the present disclosure. The upper limit is not particularly limited, and may be 100% by mass or less, and is preferably 80% by mass or less.

[0052] In addition, in terms of achieving better effects in the present disclosure, it is also preferable that the (meth)acrylic resin has at least one selected from the group consisting of structural units derived from methacrylic acid and structural units derived from an alkyl methacrylate ester, and at least one selected from the group consisting of structural units derived from acrylic acid and structural units derived from an alkyl acrylate ester. In order to obtain better effects in the present disclosure, the total content of the structural units derived from methacrylic acid and the structural units derived from an alkyl methacrylate ester is preferably 60 / 40 to 80 / 20 in mass ratio relative to the total content of the structural units derived from acrylic acid and the structural units derived from an alkyl acrylate ester.

[0053] The (meth)acrylic resin preferably has an ester group at the end, in view of excellent developability of the photosensitive layer after transfer. The terminal portion of the (meth)acrylic resin is composed of a portion derived from the polymerization initiator used in the synthesis. The (meth)acrylic resin having an ester group at the terminal can be synthesized by using a polymerization initiator that generates a radical having an ester group.

[0054] Moreover, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, for example, from the viewpoint of developability. Moreover, the alkali-soluble resin is more preferably a resin having a carboxy group with an acid value of 60 mgKOH / g or more (so-called carboxy group-containing resin), and even more preferably a (meth)acrylic resin having a carboxy group with an acid value of 60 mgKOH / g or more (so-called carboxy group-containing (meth)acrylic resin), from the viewpoint of, for example, being thermally crosslinked with the crosslinking component by heating and easily forming a strong film. When the alkali-soluble resin has a carboxy group, the three-dimensional crosslinking density can be increased by, for example, adding a thermally crosslinkable compound such as a blocked isocyanate compound to thermally crosslink the resin. In addition, when the carboxy group of the resin having a carboxy group is dehydrated and hydrophobized, the humidity and heat resistance can be improved.

[0055] The carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited as long as it satisfies the above-mentioned acid value condition, and can be appropriately selected from known (meth)acrylic resins. For example, among the polymers described in paragraph 0025 of JP-A-2011-095716, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more, and among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, carboxyl group-containing acrylic resins having an acid value of 60 mgKOH / g or more can be preferably used.

[0056] Another preferred embodiment of the alkali-soluble resin is a styrene-acrylic copolymer. In this specification, the styrene-acrylic copolymer refers to a resin having a structural unit derived from a styrene compound and a structural unit derived from a (meth)acrylic compound, and the total content of the structural unit derived from the styrene compound and the structural unit derived from the (meth)acrylic compound is preferably 30% by mass or more, more preferably 50% by mass or more, based on the total structural units of the copolymer. The content of the structural units derived from a styrene compound is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 5 to 80% by mass, based on all the structural units of the copolymer. The content of the structural units derived from the (meth)acrylic compound is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass to 95% by mass, based on all structural units of the copolymer.

[0057] The alkali-soluble resin preferably has an aromatic ring structure, and more preferably has a constituent unit having an aromatic ring structure, in terms of achieving better effects in the present disclosure. Examples of monomers that form structural units having an aromatic ring structure include styrene compounds such as styrene, tert-butoxystyrene, methylstyrene, and α-methylstyrene, as well as benzyl (meth)acrylate. Of these, styrene compounds are preferred, and styrene is more preferred. In addition, the alkali-soluble resin more preferably has a constitutional unit represented by the following formula (S) (a constitutional unit derived from styrene), in terms of achieving better effects in the present disclosure.

[0058] [ka]

[0059] When the alkali-soluble resin has a structural unit having an aromatic ring structure, the content of the structural unit having an aromatic ring structure is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 70% by mass, and further preferably 20% by mass to 60% by mass, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural units having an aromatic ring structure in the alkali-soluble resin is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 60 mol%, and even more preferably 20 mol% to 60 mol%, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural unit represented by the above formula (S) in the alkali-soluble resin is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 60 mol%, even more preferably 20 mol% to 60 mol%, and particularly preferably 20 mol% to 50 mol%, based on all structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. In this specification, when the content of the "structural unit" is specified by a molar ratio, the "structural unit" is synonymous with the "monomer unit". In addition, in this specification, the "monomer unit" may be modified after polymerization by a polymer reaction or the like. The same applies hereinafter.

[0060] The alkali-soluble resin preferably has an aliphatic hydrocarbon ring structure in terms of better effects in the present disclosure. That is, the alkali-soluble resin preferably has a structural unit having an aliphatic hydrocarbon ring structure. In particular, the alkali-soluble resin more preferably has a ring structure in which two or more aliphatic hydrocarbon rings are condensed.

[0061] Examples of the ring that constitutes the aliphatic hydrocarbon ring structure in the structural unit having an aliphatic hydrocarbon ring structure include a tricyclodecane ring, a cyclohexane ring, a cyclopentane ring, a norbornane ring, and an isoborone ring. Among these, from the viewpoint of more excellent effects in the present disclosure, a ring in which two or more aliphatic hydrocarbon rings are condensed is preferred, and a tetrahydrodicyclopentadiene ring (tricyclo[5.2.1.0 2,6 ]decane ring) is more preferred. Examples of monomers that form a structural unit having an aliphatic hydrocarbon ring structure include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate. In addition, in terms of better effects in the present disclosure, the alkali-soluble resin more preferably has a constitutional unit represented by the following formula (Cy), and more preferably has a constitutional unit represented by the above formula (S) and a constitutional unit represented by the following formula (Cy).

[0062] [ka]

[0063] In the formula (Cy), R M represents a hydrogen atom or a methyl group, R Cy represents a monovalent group having an aliphatic hydrocarbon ring structure.

[0064] R in formula (Cy) M is preferably a methyl group. R in formula (Cy) Cy is preferably a monovalent group having an aliphatic hydrocarbon ring structure having 5 to 20 carbon atoms, more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 6 to 16 carbon atoms, and even more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 8 to 14 carbon atoms, in terms of achieving better effects in the present disclosure. R in formula (Cy) Cy The aliphatic hydrocarbon ring structure in may be a monocyclic structure or a polycyclic structure. In addition, R in formula (Cy) Cy In terms of achieving better effects in the present disclosure, the aliphatic hydrocarbon ring structure in is preferably a cyclopentane ring structure, a cyclohexane ring structure, a tetrahydrodicyclopentadiene ring structure, a norbornane ring structure, or an isoborone ring structure, more preferably a cyclohexane ring structure or a tetrahydrodicyclopentadiene ring structure, and even more preferably a tetrahydrodicyclopentadiene ring structure. Furthermore, R in formula (Cy) Cy In terms of achieving better effects in the present disclosure, the aliphatic hydrocarbon ring structure in is preferably a ring structure in which two or more aliphatic hydrocarbon rings are condensed, and more preferably a ring in which two to four aliphatic hydrocarbon rings are condensed. Furthermore, R in formula (Cy) Cyis preferably a group in which the oxygen atom of -C(=O)O- in formula (Cy) is directly bonded to an aliphatic hydrocarbon ring structure, i.e., an aliphatic hydrocarbon ring group, more preferably a cyclohexyl group or a dicyclopentanyl group, and even more preferably a dicyclopentanyl group, in terms of achieving better effects in the present disclosure.

[0065] The alkali-soluble resin may have one type of structural unit having an aliphatic hydrocarbon ring structure, or may have two or more types of structural units having an aliphatic hydrocarbon ring structure. When the alkali-soluble resin has a structural unit having an aliphatic hydrocarbon ring structure, the content of the structural unit having an aliphatic hydrocarbon ring structure is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural units having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural unit represented by the above formula (Cy) in the alkali-soluble resin is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure.

[0066] When the alkali-soluble resin has a structural unit having an aromatic ring structure and a structural unit having an aliphatic hydrocarbon ring structure, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 40% by mass to 75% by mass, relative to all structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, in terms of obtaining superior effects in the present disclosure, the total content of the structural units having an aromatic ring structure and the structural units having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is preferably 10 mol% to 80 mol%, more preferably 20 mol% to 70 mol%, and even more preferably 40 mol% to 60 mol%, relative to all the structural units in the alkali-soluble resin. Furthermore, in terms of obtaining superior effects in the present disclosure, the total content of the structural units represented by the formula (S) and the structural units represented by the formula (Cy) in the alkali-soluble resin is preferably 10 mol% to 80 mol%, more preferably 20 mol% to 70 mol%, and even more preferably 40 mol% to 60 mol%, relative to all structural units of the alkali-soluble resin. In addition, in order to obtain better effects in the present disclosure, it is preferable that the molar amount nS of the constitutional unit represented by the above formula (S) in the alkali-soluble resin and the molar amount nCy of the constitutional unit represented by the above formula (Cy) satisfy the relationship shown in the following formula (SCy), more preferably the relationship shown in the following formula (SCy-1), and even more preferably the relationship shown in the following formula (SCy-2). 0.2≦nS / (nS+nCy)≦0.8 Formula (SCy) 0.30≦nS / (nS+nCy)≦0.75 Formula (SCy-1) 0.40≦nS / (nS+nCy)≦0.70 Formula (SCy-2)

[0067] The alkali-soluble resin preferably has a structural unit having an acid group, since the effects of the present disclosure are more excellent. Examples of the acid group include a carboxy group, a sulfo group, a phosphonic acid group, and a phosphoric acid group, with the carboxy group being preferred. As the structural unit having an acid group, a structural unit derived from (meth)acrylic acid shown below is preferred, and a structural unit derived from methacrylic acid is more preferred.

[0068] [ka]

[0069] The alkali-soluble resin may have one type of structural unit having an acid group alone, or may have two or more types of structural units having an acid group. When the alkali-soluble resin has a structural unit having an acid group, the content of the structural unit having an acid group is preferably 5% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 10% by mass to 30% by mass, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural units having an acid group in the alkali-soluble resin is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 50 mol%, and even more preferably 20 mol% to 40 mol%, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the (meth)acrylic acid-derived structural units in the alkali-soluble resin is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 50 mol%, and even more preferably 20 mol% to 40 mol%, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure.

[0070] The alkali-soluble resin preferably has a crosslinkable group, and more preferably has a constitutional unit having a crosslinkable group, in terms of achieving better effects in the present disclosure. In addition, from the viewpoints of the strength, black tightness, wide development margin, and rectangularity of the obtained pattern, the photosensitive layer preferably contains, as the alkali-soluble resin, a polymer having a crosslinkable group, and more preferably contains a polymer having a structural unit having a crosslinkable group. The crosslinkable group is preferably a radical polymerizable group, more preferably an ethylenically unsaturated group. In addition, when the alkali-soluble resin has an ethylenically unsaturated group, the alkali-soluble resin preferably has a structural unit having an ethylenically unsaturated group in a side chain. In this specification, the term "main chain" refers to the relatively longest bond chain in the molecule of the polymer compound that constitutes the resin, and the term "side chain" refers to an atomic group branching off from the main chain. The ethylenically unsaturated group is more preferably an allyl group or a (meth)acryloxy group. Examples of the structural unit having a crosslinkable group include, but are not limited to, those shown below.

[0071] [ka]

[0072] The alkali-soluble resin may have one type of structural unit having a crosslinkable group alone, or may have two or more types of structural units having a crosslinkable group. When the alkali-soluble resin has a structural unit having a crosslinkable group, the content of the structural unit having a crosslinkable group is preferably 5% by mass to 70% by mass, more preferably 10% by mass to 50% by mass, and even more preferably 20% by mass to 40% by mass, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure. Furthermore, the content of the structural unit having a crosslinkable group in the alkali-soluble resin is preferably 5 mol % to 70 mol %, more preferably 10 mol % to 60 mol %, and even more preferably 20 mol % to 50 mol %, based on the total structural units of the alkali-soluble resin, in terms of better effects in the present disclosure.

[0073] Examples of a method for introducing a crosslinkable group into an alkali-soluble resin include a method in which a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, or a sulfo group is reacted with a compound such as an epoxy compound, a blocked isocyanate compound, an isocyanate compound, a vinyl sulfone compound, an aldehyde compound, a methylol compound, or a carboxylic acid anhydride. A preferred example of a method for introducing a crosslinkable group into an alkali-soluble resin is to synthesize a polymer having a carboxy group by polymerization, and then react a part of the carboxy group of the obtained resin with glycidyl (meth)acrylate by a polymer reaction to introduce a (meth)acryloxy group into the polymer. By this method, an alkali-soluble resin having a (meth)acryloxy group in the side chain can be obtained. The polymerization reaction is preferably carried out at a temperature of 70°C to 100°C, and more preferably at a temperature of 80°C to 90°C. The polymerization initiator used in the polymerization reaction is preferably an azo-based initiator, and more preferably, for example, V-601 (trade name) or V-65 (trade name) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. The polymer reaction is preferably carried out at a temperature of 80°C to 110°C. In the polymer reaction, it is preferable to use a catalyst such as an ammonium salt.

[0074] As the alkali-soluble resin, the resins shown below are preferred in terms of achieving better effects in the present disclosure. The content ratios (a to d) of each of the structural units shown below and the weight average molecular weight Mw can be appropriately changed depending on the purpose.

[0075] [ka]

[0076] [ka]

[0077] The alkali-soluble resin may also contain a polymer having a structural unit with a carboxylic acid anhydride structure (hereinafter, also referred to as "polymer X"). The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, but is preferably a cyclic carboxylic acid anhydride structure. The ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5- or 6-membered ring, and even more preferably a 5-membered ring.

[0078] The structural unit having a carboxylic acid anhydride structure is preferably a structural unit containing a divalent group obtained by removing two hydrogen atoms from a compound represented by the following formula P-1 in its main chain, or a structural unit in which a monovalent group obtained by removing one hydrogen atom from a compound represented by the following formula P-1 is bonded to the main chain directly or via a divalent linking group.

[0079] [ka]

[0080] In formula P-1, R A1a represents a substituent, n 1a R A1a may be the same or different, Z 1a represents a divalent group forming a ring containing -C(=O)-OC(=O)-, n 1a represents an integer greater than or equal to 0.

[0081] R A1a Examples of the substituent represented by the formula (I) include an alkyl group. Z 1a As the alkylene group, an alkylene group having 2 to 4 carbon atoms is preferable, an alkylene group having 2 or 3 carbon atoms is more preferable, and an alkylene group having 2 carbon atoms is even more preferable. n 1a represents an integer equal to or greater than 0. 1a When represents an alkylene group having 2 to 4 carbon atoms, n 1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0. n 1a If represents an integer of 2 or more, there are multiple R A1a may be the same or different. In addition, if there are multiple R A1a may be bonded to each other to form a ring, but preferably do not bond to each other to form a ring.

[0082] As a structural unit having a carboxylic acid anhydride structure, a structural unit derived from an unsaturated carboxylic acid anhydride is preferable, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferable, a structural unit derived from an unsaturated aliphatic cyclic carboxylic acid anhydride is even more preferable, a structural unit derived from maleic anhydride or itaconic anhydride is particularly preferable, and a structural unit derived from maleic anhydride is most preferable.

[0083] Specific examples of structural units having a carboxylic acid anhydride structure are given below, but the structural units having a carboxylic acid anhydride structure are not limited to these specific examples. In the following structural units, Rx represents a hydrogen atom, a methyl group, CH 2 OH group or CF 3 group, and Me represents a methyl group.

[0084] [ka]

[0085] [ka]

[0086] The structural unit having a carboxylic acid anhydride structure in the polymer X may be of one type alone, or of two or more types.

[0087] The total content of the structural units having a carboxylic acid anhydride structure relative to all the structural units of polymer X is preferably from 0 mol % to 60 mol %, more preferably from 5 mol % to 40 mol %, and even more preferably from 10 mol % to 35 mol %.

[0088] The photosensitive layer may contain only one type of polymer X, or may contain two or more types. When the photosensitive layer contains polymer X, the content of polymer X is preferably 0.1% by mass to 30% by mass, more preferably 0.2% by mass to 20% by mass, even more preferably 0.5% by mass to 20% by mass, and still more preferably 1% by mass to 20% by mass, relative to the total mass of the photosensitive layer, in terms of better effects of the present disclosure.

[0089] The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 5,000 or more, more preferably 10,000 or more, further preferably from 10,000 to 100,000, and particularly preferably from 20,000 to 80,000, in terms of achieving better effects in the present disclosure.

[0090] The acid value of the alkali-soluble resin is preferably from 10 mgKOH / g to 200 mgKOH / g, and more preferably from 60 mgKOH / g to 200 mgKOH / g. The acid value of the alkali-soluble resin is a value measured according to the method described in JIS K0070:1992.

[0091] The photosensitive layer may contain only one type of alkali-soluble resin, or may contain two or more types. The content of the alkali-soluble resin is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 30% by mass to 70% by mass, relative to the total mass of the photosensitive layer, in terms of obtaining better effects in the present disclosure.

[0092] <Polymerizable compound> The photosensitive layer preferably contains a polymerizable compound. In this specification, the term "polymerizable compound" refers to a compound that undergoes polymerization under the action of a photopolymerization initiator described below, and is different from the above-mentioned alkali-soluble resin.

[0093] The polymerizable compound is preferably an ethylenically unsaturated compound. The ethylenically unsaturated group is preferably a (meth)acryloxy group. The ethylenically unsaturated compound in this specification is a compound other than the above-mentioned alkali-soluble resins, and preferably has a molecular weight of less than 5,000. Moreover, preferred embodiments of the ethylenically unsaturated compound used in the second embodiment include the preferred embodiments of the ethylenically unsaturated compound used in the first embodiment described above.

[0094] One preferred embodiment of the ethylenically unsaturated compound is a compound represented by the following formula (M) (also simply referred to as "compound M"). Q 2 -R 1 -Q 1 Formula (M) In formula (M), Q 1 and Q 2each independently represents a (meth)acryloyloxy group; R 1 represents a divalent linking group having a chain structure.

[0095] Q in formula (M) 1 and Q 2 From the viewpoint of ease of synthesis, Q 1 and Q 2 are preferably the same group. In addition, Q in formula (M) 1 and Q 2 is preferably an acryloyloxy group from the viewpoint of reactivity. R in formula (M) 1 As the alkylene group, an alkyleneoxyalkylene group (-L 1 -OL 1 -), or a polyalkyleneoxyalkylene group (-(L 1 -O) p -L 1 -) is preferred, a hydrocarbon group having 2 to 20 carbon atoms or a polyalkyleneoxyalkylene group is more preferred, an alkylene group having 4 to 20 carbon atoms is further preferred, and a linear alkylene group having 6 to 18 carbon atoms is particularly preferred. The hydrocarbon group may have a chain structure at least in a portion thereof, and the portion other than the chain structure is not particularly limited and may be, for example, a branched, cyclic, or linear alkylene group having 1 to 5 carbon atoms, an arylene group, an ether bond, or a combination thereof. An alkylene group or a group combining two or more alkylene groups and one or more arylene groups is preferable, an alkylene group is more preferable, and a linear alkylene group is even more preferable. In addition, the above L 1 each independently represents an alkylene group, preferably an ethylene group, a propylene group, or a butylene group, more preferably an ethylene group or a 1,2-propylene group. p represents an integer of 2 or more, and is preferably an integer of 2 to 10.

[0096] In addition, Q in compound M 1 and Q 2The number of atoms in the shortest linking chain between and is preferably 3 to 50, more preferably 4 to 40, even more preferably 6 to 20, and particularly preferably 8 to 12, in terms of achieving better effects in the present disclosure. As used herein, "Q 1 and Q 2 The number of atoms in the shortest chain connecting Q 1 R to be connected 1 Q from atoms in 2 R to be connected 1 is the shortest number of atoms that can connect to an atom in

[0097] Specific examples of the compound M include 1,3-butanediol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,4-cyclohexanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, hydrogenated bisphenol A di(meth)acrylate, hydrogenated bisphenol F di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, poly(ethylene glycol / propylene glycol) di(meth)acrylate, and polybutylene glycol di(meth)acrylate. The above ester monomers may also be used as mixtures. Among the above compounds, in terms of better effects in the present disclosure, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate is preferred, at least one compound selected from the group consisting of 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,10-decanediol di(meth)acrylate is more preferred, and at least one compound selected from the group consisting of 1,9-nonanediol di(meth)acrylate and 1,10-decanediol di(meth)acrylate is even more preferred.

[0098] One of the preferred embodiments of the ethylenically unsaturated compound is a di- or higher functional ethylenically unsaturated compound. In this specification, the term "di- or higher functional ethylenically unsaturated compound" means a compound having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group in the ethylenically unsaturated compound, a (meth)acryloyl group is preferred. As the ethylenically unsaturated compound, a (meth)acrylate compound is preferred.

[0099] The difunctional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. Examples of the difunctional ethylenically unsaturated compound other than the compound M include tricyclodecane dimethanol di(meth)acrylate and tricyclodecane dimenanol di(meth)acrylate.

[0100] Commercially available bifunctional ethylenically unsaturated compounds include tricyclodecane dimethanol diacrylate (trade name: NK Ester A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimenanol dimethacrylate (trade name: NK Ester DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (trade name: NK Ester A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (trade name: NK Ester A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0101] The tri- or higher functional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. Examples of the tri- or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds having a glycerin tri(meth)acrylate skeleton.

[0102] Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

[0103] Examples of the ethylenically unsaturated compound include caprolactone-modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide-modified (meth)acrylate compounds (KAYARAD (registered trademark) RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Co., Ltd., etc.), and ethoxylated glycerin triacrylate (NK Ester A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.).

[0104] The ethylenically unsaturated compounds also include urethane (meth)acrylate compounds. Examples of the urethane (meth)acrylate include urethane di(meth)acrylate, such as propylene oxide modified urethane di(meth)acrylate, and ethylene oxide and propylene oxide modified urethane di(meth)acrylate. In addition, the urethane (meth)acrylate may be a trifunctional or higher urethane (meth)acrylate. The lower limit of the number of functional groups is more preferably 6 or more, and even more preferably 8 or more. The upper limit of the number of functional groups is preferably 20 or less. Examples of trifunctional or higher urethane (meth)acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), AH-600 (trade name) manufactured by Kyoeisha Chemical Co., Ltd., and UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

[0105] One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an acid group. Acid groups include phosphate groups, sulfo groups, and carboxy groups. Among these, the acid group is preferably a carboxy group. Examples of the ethylenically unsaturated compound having an acid group include a trifunctional or tetrafunctional ethylenically unsaturated compound having an acid group [a carboxy group has been introduced into a pentaerythritol tri- or tetraacrylate (PETA) skeleton (acid value: 80 mg KOH / g to 120 mg KOH / g)], a pentafunctional or hexafunctional ethylenically unsaturated compound having an acid group (a carboxy group has been introduced into a dipentaerythritol penta- or hexaacrylate (DPHA) skeleton (acid value: 25 mg KOH / g to 70 mg KOH / g)], and the like. These trifunctional or higher ethylenically unsaturated compounds having an acid group may be used in combination with a difunctional ethylenically unsaturated compound having an acid group, if necessary.

[0106] The ethylenically unsaturated compound having an acid group is preferably at least one selected from the group consisting of di- or higher functional ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof. When the ethylenically unsaturated compound having an acid group is at least one selected from the group consisting of di- or higher functional ethylenically unsaturated compounds having a carboxy group and carboxylic acid anhydrides thereof, the developability and film strength are further improved. The di- or higher functional ethylenically unsaturated compound having a carboxy group is not particularly limited and can be appropriately selected from known compounds. Examples of difunctional or higher ethylenically unsaturated compounds having a carboxy group include ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and ARONIX (registered trademark) M-510 (manufactured by Toagosei Co., Ltd.).

[0107] As the ethylenically unsaturated compound having an acid group, the polymerizable compounds having an acid group described in paragraphs 0025 to 0030 of JP-A No. 2004-239942 are preferred, and the contents of this publication are incorporated herein by reference.

[0108] Examples of the ethylenically unsaturated compound include compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid, compounds obtained by reacting a glycidyl group-containing compound with an α,β-unsaturated carboxylic acid, urethane monomers such as (meth)acrylate compounds having a urethane bond, phthalic acid compounds such as γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, and β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, and (meth)acrylic acid alkyl esters. These may be used alone or in combination of two or more.

[0109] Examples of compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid include bisphenol A-based (meth)acrylate compounds such as 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane; polyethylene glycol di(meth)acrylates having 2 to 14 ethylene oxide groups; polypropylene glycol di(meth)acrylates having 2 to 14 propylene oxide groups; polyethylene polypropylene glycol di(meth)acrylates having 2 to 14 ethylene oxide groups and 2 to 14 propylene oxide groups; trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate, trimethylolpropane diethoxy tri(meth)acrylate, trimethylolpropane triethoxy tri(meth)acrylate, trimethylolpropane tetraethoxy tri(meth)acrylate, trimethylolpropane pentaethoxy tri(meth)acrylate, di(trimethylolpropane) tetraacrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. Among these, ethylenically unsaturated compounds having a tetramethylolmethane structure or a trimethylolpropane structure are preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate are more preferred.

[0110] Examples of the ethylenically unsaturated compound include caprolactone-modified ethylenically unsaturated compounds (e.g., KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide-modified ethylenically unsaturated compounds (e.g., KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Corporation, etc.), and ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd., etc.).

[0111] As the ethylenically unsaturated compound, those containing an ester bond are also preferred in terms of excellent developability of the photosensitive layer after transfer. The ethylenically unsaturated compound containing an ester bond is not particularly limited as long as it contains an ester bond in the molecule, but in terms of excellent effects in the present disclosure, an ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure is preferred, and tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, trimethylolpropane tri(meth)acrylate, or di(trimethylolpropane)tetraacrylate is more preferred. From the viewpoint of providing reliability, the ethylenically unsaturated compound preferably contains an ethylenically unsaturated compound having an aliphatic group having 6 to 20 carbon atoms and the above-mentioned ethylenically unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure. Examples of ethylenically unsaturated compounds having an aliphatic structure having 6 or more carbon atoms include 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and tricyclodecane dimethanol di(meth)acrylate.

[0112] One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure (preferably a difunctional ethylenically unsaturated compound). The above-mentioned ethylenically unsaturated compound is preferably an ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are condensed (preferably a structure selected from the group consisting of a tricyclodecane structure and a tricyclodecene structure), more preferably a bifunctional ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are condensed, and even more preferably tricyclodecane dimethanol di(meth)acrylate. As the aliphatic hydrocarbon ring structure, a cyclopentane structure, a cyclohexane structure, a tricyclodecane structure, a tricyclodecene structure, a norbornane structure, or an isoborone structure is preferred in terms of achieving better effects in the present disclosure.

[0113] -Ethylenically unsaturated compounds B1- The photosensitive layer preferably contains an ethylenically unsaturated compound B1 having an aromatic ring and two ethylenically unsaturated groups. The ethylenically unsaturated compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule among the above-mentioned ethylenically unsaturated compounds.

[0114] In the photosensitive layer, the mass ratio of the content of the ethylenically unsaturated compound B1 to the content of the polymerizable compound is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferably 60% by mass or more, from the viewpoint of superior resolution. The upper limit is not particularly limited, but is preferably 99% by mass or less, more preferably 95% by mass or less, from the viewpoint of peelability.

[0115] The aromatic ring of the ethylenically unsaturated compound B1 can be exemplified by aromatic hydrocarbon rings such as benzene ring, naphthalene ring and anthracene ring, aromatic heterocycles such as thiophene ring, furan ring, pyrrole ring, imidazole ring, triazole ring and pyridine ring, and condensed rings thereof, preferably aromatic hydrocarbon ring, more preferably benzene ring.The aromatic ring may have a substituent. The ethylenically unsaturated compound B1 may have only one aromatic ring or may have two or more aromatic rings.

[0116] The ethylenically unsaturated compound B1 preferably has a bisphenol structure, since this suppresses swelling of the photosensitive layer due to a developer, thereby improving the resolution. Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis(4-hydroxyphenyl)propane), a bisphenol F structure derived from bisphenol F (2,2-bis(4-hydroxyphenyl)methane), and a bisphenol B structure derived from bisphenol B (2,2-bis(4-hydroxyphenyl)butane), with the bisphenol A structure being preferred.

[0117] The ethylenically unsaturated compound B1 having a bisphenol structure includes, for example, a compound having a bisphenol structure and two polymerizable groups (preferably (meth)acryloyl groups) bonded to both ends of the bisphenol structure. Both ends of the bisphenol structure may be directly bonded to the two polymerizable groups, or may be bonded via one or more alkyleneoxy groups. The alkyleneoxy groups added to both ends of the bisphenol structure are preferably ethyleneoxy or propyleneoxy, more preferably ethyleneoxy. The number of alkyleneoxy groups added to the bisphenol structure is not particularly limited, but is preferably 4 to 16, more preferably 6 to 14 per molecule. The ethylenically unsaturated compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP2016-224162A, the contents of which are incorporated herein by reference.

[0118] As the ethylenically unsaturated compound B1, a difunctional ethylenically unsaturated compound having a bisphenol A structure is preferable, and 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane is more preferable. Examples of 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (FA-324M, Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (BPE-500, Shin-Nakamura Chemical Co., Ltd.), and 2,2-bis(4-(methacryloxydodecaethoxy)phenyl)propane. Examples of the ethoxylated bisphenol A diacrylate include 2,2-bis(4-(tetrapropoxy)phenyl)propane (FA-3200MY, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (BPE-1300, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (BPE-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK Ester A-BPE-10, manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0119] As the ethylenically unsaturated compound B1, from the viewpoints of the delay time line width change, the development temperature line width change, and the sensitivity, it is preferable to include a compound represented by the following formula (Bis).

[0120] [ka]

[0121] In the formula (Bis), R 1 and R 2 each independently represents a hydrogen atom or a methyl group; A is C 2 H 4 and B is C 3 H 6 and n 1 and n 3 are each independently an integer from 1 to 39, and 1 +n 3 is an integer from 2 to 40, and n 2 and n 4 are each independently an integer from 0 to 29, and 2 +n 4is an integer of 0 to 30, and the arrangement of the repeating units of -(AO)- and -(BO)- may be random or block. In the case of a block, either -(AO)- or -(BO)- may be on the bisphenol structure side. In one embodiment, n 1 +n 2 +n 3 +n 4 is preferably an integer of 2 to 20, more preferably an integer of 2 to 16, and further preferably an integer of 4 to 12. 2 +n 4 is preferably an integer of 0 to 10, more preferably an integer of 0 to 4, still more preferably an integer of 0 to 2, and particularly preferably 0.

[0122] Among these, from the viewpoints of tight blackness, wide development margin, and rectangularity of the obtained pattern, the polymerizable compound preferably contains a monomer having a bisphenol A skeleton, and more preferably contains a bifunctional monomer having a bisphenol A skeleton.

[0123] The ethylenically unsaturated compound B1 may be used alone or in combination of two or more kinds. The content of the ethylenically unsaturated compound B1 in the photosensitive layer is preferably 10% by mass or more, more preferably 20% by mass or more, based on the total mass of the photosensitive layer, from the viewpoint of better resolution. The upper limit is not particularly limited, but is preferably 70% by mass or less, more preferably 60% by mass or less, from the viewpoint of transferability and edge fusion (phenomenon in which components in the photosensitive layer bleed out from the edge of the photosensitive transfer material).

[0124] The molecular weight of the polymerizable compound, preferably the ethylenically unsaturated compound, is preferably from 200 to 3,000, more preferably from 250 to 2,600, further preferably from 280 to 2,200, and particularly preferably from 300 to 2,200. Of the ethylenically unsaturated compounds contained in the photosensitive layer, the proportion of the ethylenically unsaturated compound having a molecular weight of 300 or less is preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less with respect to the content of all the ethylenically unsaturated compounds contained in the photosensitive layer.

[0125] As one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains an ethylenically unsaturated compound having two or more functional groups, more preferably contains an ethylenically unsaturated compound having three or more functional groups, and still more preferably contains an ethylenically unsaturated compound having three or four functional groups.

[0126] Further, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure and an alkali-soluble resin having a structural unit having an aliphatic hydrocarbon ring.

[0127] Further, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a compound represented by formula (M) and an ethylenically unsaturated compound having an acid group, more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, and still more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a succinic acid-modified product of dipentaerythritol pentaacrylate.

[0128] Further, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a compound represented by formula (M), an ethylenically unsaturated compound having an acid group, and a thermally crosslinkable compound described later, and more preferably contains a compound represented by formula (M), an ethylenically unsaturated compound having an acid group, and a blocked isocyanate compound described later.

[0129] In addition, as one of the preferred embodiments of the photosensitive layer, the photosensitive layer preferably contains a difunctional ethylenically unsaturated compound (preferably a difunctional (meth)acrylate compound) and a trifunctional or higher ethylenically unsaturated compound (preferably a trifunctional or higher (meth)acrylate compound).

[0130] From the viewpoints of tightness of black and rectangularity of the resulting pattern, the polymerizable compound preferably contains a bifunctional polymerizable compound. In addition, from the viewpoints of tightness of black and rectangularity of the resulting pattern, the content of the bifunctional polymerizable compound is preferably 50% by mass or more, more preferably 50% by mass or more and 100% by mass or less, and particularly preferably 50% by mass or more and 90% by mass or less, based on the total mass of the polymerizable compounds.

[0131] In one preferred embodiment of the photosensitive layer, the photosensitive layer preferably contains a compound M and a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure from the viewpoint of rust prevention. In addition, as one of the preferred embodiments of the photosensitive layer, from the viewpoints of substrate adhesion, suppression of development residue, and rust prevention, the photosensitive layer preferably contains a compound M and an ethylenically unsaturated compound having an acid group, more preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, and an ethylenically unsaturated compound having an acid group, still more preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, and an ethylenically unsaturated compound having an acid group, and particularly preferably contains a compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, a tri- or higher functional ethylenically unsaturated compound, an ethylenically unsaturated compound having an acid group, and a urethane (meth)acrylate compound. In addition, as one of the preferred embodiments of the photosensitive layer, from the viewpoints of substrate adhesion, development residue suppression, and rust prevention, the photosensitive layer preferably contains 1,9-nonanediol diacrylate and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, more preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, dipentaerythritol hexaacrylate, and an ethylenically unsaturated compound having a carboxylic acid group, and particularly preferably contains 1,9-nonanediol diacrylate, tricyclodecane dimethanol diacrylate, an ethylenically unsaturated compound having a carboxylic acid group, and a urethane acrylate compound.

[0132] The photosensitive layer may contain a monofunctional ethylenically unsaturated compound as the ethylenically unsaturated compound. The content of the difunctional or higher ethylenically unsaturated compound in the above ethylenically unsaturated compound is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass, based on the total content of all ethylenically unsaturated compounds contained in the photosensitive layer.

[0133] The ratio Mm / Mb of the content Mm of the polymerizable compound in the photosensitive layer to the content Mb of the alkali-soluble resin in the photosensitive layer is, from the viewpoints of tightness of black, rectangularity and resolution of the obtained pattern, and peelability of the protective film of the photosensitive transfer material, preferably less than 1.0, more preferably less than 0.8, even more preferably 0.05 or more and 0.75 or less, and particularly preferably 0.10 or more and 0.50 or less. From the viewpoints of curability and resolution, the ethylenically unsaturated compound in the photosensitive layer preferably contains a (meth)acrylic compound. Furthermore, from the viewpoints of curability, resolution and linearity, it is more preferable that the polymerizable compound in the photosensitive layer contains a (meth)acrylic compound, and that the content of the acrylic compound relative to the total mass of the (meth)acrylic compounds contained in the photosensitive layer is 60 mass% or less.

[0134] The polymerizable compounds may be used alone or in combination of two or more kinds. The content of the polymerizable compound in the photosensitive layer is preferably 1% by mass to 50% by mass, and more preferably 5% by mass to 40% by mass, relative to the total mass of the photosensitive layer, from the viewpoints of tightness of black, rectangularity and resolution of the obtained pattern, and peelability of the protective film of the photosensitive transfer material.

[0135] <Photopolymerization initiator> The photosensitive layer preferably contains a photopolymerization initiator. The photopolymerization initiator is a compound that initiates polymerization of an ethylenically unsaturated compound when exposed to active light such as ultraviolet light, visible light, and X-rays. The photopolymerization initiator is not particularly limited, and any known photopolymerization initiator can be used. The photopolymerization initiator in the present disclosure also includes a sensitizer. Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferred.

[0136] Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an α-aminoalkylphenone structure, a photopolymerization initiator having an α-hydroxyalkylphenone structure, a photopolymerization initiator having an acylphosphine oxide structure, a photopolymerization initiator having an N-phenylglycine structure, and a biimidazole compound.

[0137] Among these, from the viewpoints of suppression of line width variation, change in line width with delay time, rectangularity of the obtained pattern, and sensitivity, it is preferable that the photopolymerization initiator contains a biimidazole compound, and it is more preferable that the photopolymerization initiator contains a biimidazole compound and a benzophenone compound. As the biimidazole compound, a hexaarylbiimidazole compound is preferably used. Examples of the biimidazole compound include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0138] The photosensitive layer may contain, as a photopolymerization initiator, one type of biimidazole compound alone or two or more types of biimidazole compounds. From the viewpoints of suppression of line width variation, change in line width with delay time, cross-sectional shape of the resin pattern, and sensitivity, the content of the biimidazole compound is preferably 1 mass % or more, more preferably 2 mass % or more, and even more preferably 3 mass % to 10 mass %, relative to the total mass of the photosensitive layer.

[0139] From the viewpoints of suppression of line width variation, change in line width with delay time, cross-sectional shape of the resin pattern, and sensitivity, the photopolymerization initiator preferably contains a benzophenone compound, and more preferably contains a dialkylaminobenzophenone compound. Examples of the benzophenone compound include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 4-methoxybenzophenone, 2-chlorobenzophenone, 4-chlorobenzophenone, 4-bromobenzophenone, 2-carboxybenzophenone, 2-ethoxycarbonylbenzophenone, benzophenonetetracarboxylic acid or its tetramethyl ester, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(dicyclohexylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(dihydroxyethylamino)benzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 4,4'-dimethoxybenzophenone, 4-dimethylaminobenzophenone, 4-phenylbenzophenone, isophthalophenone, and 4-benzoyl-4'-methylphenyl sulfide.

[0140] The photosensitive layer may contain, as a photopolymerization initiator, one type of benzophenone compound alone or two or more types of benzophenone compounds. From the viewpoints of suppression of line width variation, change in line width with delay time, cross-sectional shape of the resin pattern, and sensitivity, the content of the benzophenone compound is preferably 0.05% by mass to 5% by mass, more preferably 0.1% by mass to 2% by mass, even more preferably 0.2% by mass to 1.5% by mass, and particularly preferably 0.4% by mass to 0.8% by mass, relative to the total mass of the photosensitive layer. In addition, when a biimidazole compound and a benzophenone compound are contained as a photopolymerization initiator, the content of the benzophenone compound is preferably less than the content of the biimidazole compound from the viewpoints of suppression of line width variation, change in line width with delay time, cross-sectional shape of the resin pattern, and sensitivity.

[0141] As the photoradical polymerization initiator, for example, the polymerization initiators described in paragraphs 0031 to 0042 of JP-A No. 2011-95716 and paragraphs 0064 to 0081 of JP-A No. 2015-14783 may be used.

[0142] Examples of the photoradical polymerization initiator include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p,p'-dimethoxybenzyl), TAZ-110 (trade name: manufactured by Midori Chemical Co., Ltd.), benzophenone, TAZ-111 (trade name: manufactured by Midori Chemical Co., Ltd.), Irgacure OXE01, OXE02, OXE03, OXE04 (manufactured by BASF), Omnirad 651 and 369 (trade names: manufactured by IGM Resins BV), and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.).

[0143] Commercially available photoradical polymerization initiators include, for example, 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: IRGACURE OXE02, manufactured by BASF), IRGACURE OXE03 (manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, manufactured by IGM Resins BV), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907, manufactured by IGM Resins BV), and the like. BV), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127, IGM Resins BV), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 (trade name: Omnirad 369, IGM Resins BV), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, IGM Resins BV), 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184, IGM Resins BV), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651, IGM Resins BV). BV), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, IGM Resins BV), bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819, IGM Resins BVExamples of photopolymerization initiators include oxime ester-based photopolymerization initiators (trade name: Lunar 6, manufactured by DKSH Japan Co., Ltd.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) (trade name: B-CIM, manufactured by Hampford Chemical Industry Co., Ltd.), and 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer (trade name: BCTB, manufactured by Tokyo Chemical Industry Co., Ltd.).

[0144] A photocationic polymerization initiator (photoacid generator) is a compound that generates an acid when exposed to actinic rays. As the photocationic polymerization initiator, a compound that responds to actinic rays having a wavelength of 300 nm or more, preferably 300 to 450 nm, and generates an acid is preferred, but the chemical structure is not limited. In addition, even if a photocationic polymerization initiator is not directly sensitive to actinic rays having a wavelength of 300 nm or more, it can be preferably used in combination with a sensitizer as long as it responds to actinic rays having a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. As the photocationic polymerization initiator, a photocationic polymerization initiator that generates an acid having a pKa of 4 or less is preferable, a photocationic polymerization initiator that generates an acid having a pKa of 3 or less is more preferable, and a photocationic polymerization initiator that generates an acid having a pKa of 2 or less is particularly preferable. The lower limit of the pKa is not particularly set, but is preferably, for example, -10.0 or more.

[0145] The photocationic polymerization initiator includes an ionic photocationic polymerization initiator and a nonionic photocationic polymerization initiator. Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, as well as quaternary ammonium salts. As the ionic photocationic polymerization initiator, the ionic photocationic polymerization initiators described in paragraphs 0114 to 0133 of JP-A-2014-85643 may be used.

[0146] Examples of nonionic photocationic polymerization initiators include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. As trichloromethyl-s-triazines, diazomethane compounds, and imide sulfonate compounds, compounds described in paragraphs 0083 to 0088 of JP 2011-221494 A may be used. As oxime sulfonate compounds, compounds described in paragraphs 0084 to 0088 of WO 2018 / 179640 may be used.

[0147] The sensitizer is not particularly limited, and known sensitizers, dyes and pigments can be used. Examples of sensitizers include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0148] The photosensitive layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators. The content of the photopolymerization initiator in the photosensitive layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, based on the total mass of the photosensitive layer. The upper limit is not particularly limited, but is preferably 10% by mass or less, and more preferably 8% by mass or less, based on the total mass of the photosensitive layer.

[0149] <Heterocyclic compounds> The photosensitive layer may contain a heterocyclic compound. The heterocycle contained in the heterocyclic compound may be either a monocyclic or polycyclic heterocycle. Examples of the heteroatom contained in the heterocyclic compound include a nitrogen atom, an oxygen atom, and a sulfur atom. The heterocyclic compound preferably contains at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom, and a sulfur atom, and more preferably contains a nitrogen atom.

[0150] Examples of heterocyclic compounds include imidazole compounds, triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, benzoxazole compounds, and pyrimidine compounds. Among the above, from the viewpoints of tightness of black and rectangularity of the obtained pattern, the heterocyclic compound is preferably at least one compound selected from the group consisting of imidazole compounds, triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzimidazole compounds, and benzoxazole compounds, more preferably at least one compound selected from the group consisting of imidazole compounds, triazole compounds, and tetrazole compounds, and particularly preferably a triazole compound.

[0151] Preferable specific examples of the heterocyclic compound are shown below. Examples of the imidazole compound include imidazole, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, and 2,4,5-triphenylimidazole.

[0152] Examples of the triazole compound and benzotriazole compound include the following compounds.

[0153] [ka]

[0154] [ka]

[0155] Examples of the tetrazole compound include the following compounds.

[0156] [ka]

[0157] [ka]

[0158] Examples of the thiadiazole compound include the following compounds.

[0159] [ka]

[0160] Examples of the triazine compound include the following compounds.

[0161] [ka]

[0162] Examples of rhodanine compounds include the following compounds.

[0163] [ka]

[0164] Examples of the thiazole compound include the following compounds.

[0165] [ka]

[0166] Examples of the benzothiazole compound include the following compounds.

[0167] [ka]

[0168] Examples of the benzimidazole compound include the following compounds.

[0169] [ka]

[0170] [ka]

[0171] Examples of the benzoxazole compound include the following compounds.

[0172] [ka]

[0173] The heterocyclic compounds may be used alone or in combination of two or more. When the photosensitive layer contains a heterocyclic compound, the content of the heterocyclic compound is preferably 0.01% by mass to 20.0% by mass, more preferably 0.02% by mass to 10.0% by mass, still more preferably 0.05% by mass to 8.0% by mass, and particularly preferably 0.10% by mass to 5.0% by mass, relative to the total mass of the photosensitive layer.

[0174] <Aliphatic thiol compounds> The photosensitive layer may contain an aliphatic thiol compound. When the photosensitive layer contains an aliphatic thiol compound, the aliphatic thiol compound undergoes an ene-thiol reaction with the ethylenically unsaturated compound, thereby suppressing the cure shrinkage of the film formed and reducing stress.

[0175] The aliphatic thiol compound is preferably a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (that is, a di- or higher functional aliphatic thiol compound). Among the above, as the aliphatic thiol compound, polyfunctional aliphatic thiol compounds are more preferable from the viewpoint of adhesion of the pattern to be formed (particularly adhesion after exposure). In this specification, the term "polyfunctional aliphatic thiol compound" refers to an aliphatic compound having two or more thiol groups (also called "mercapto groups") in the molecule.

[0176] The polyfunctional aliphatic thiol compound is preferably a low molecular weight compound having a molecular weight of at least 100. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and further preferably 150 to 1,000.

[0177] The number of functional groups of the polyfunctional aliphatic thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from the viewpoint of adhesion of the formed pattern.

[0178] Examples of polyfunctional aliphatic thiol compounds include trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetrakis(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolethane tris(3-mercaptobutyrate), tris[(3-mercaptopropionyloxy)ethyl]isocyanurate, trimethylolpropane tris(3-mercaptopropionyloxy)ethyl]isocyanurate, ester), pentaerythritol tetrakis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,4-bis(3-mercaptobutyryloxy)butane, 1,2-ethanedithiol, 1,3-propanedithiol, 1,6-hexamethylenedithiol, 2,2'-(ethylenedithio)diethanethiol, meso-2,3-dimercaptosuccinic acid, and di(mercaptoethyl)ether.

[0179] Among the above, the polyfunctional aliphatic thiol compound is preferably at least one compound selected from the group consisting of trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, and 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

[0180] Examples of monofunctional aliphatic thiol compounds include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.

[0181] The photosensitive layer may contain one kind of aliphatic thiol compound alone, or may contain two or more kinds of aliphatic thiol compounds. When the photosensitive layer contains an aliphatic thiol compound, the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5% by mass to 50% by mass, even more preferably 5% by mass to 30% by mass, and particularly preferably 8% by mass to 20% by mass, relative to the total mass of the photosensitive layer.

[0182] <Thermal crosslinkable compound> The photosensitive layer preferably contains a thermally crosslinkable compound from the viewpoints of the strength of the obtained cured film and the adhesion of the obtained uncured film. In this specification, the thermally crosslinkable compound having an ethylenically unsaturated group described later is not treated as an ethylenically unsaturated compound but as a thermally crosslinkable compound. Examples of the thermally crosslinkable compound include methylol compounds and blocked isocyanate compounds. Among these, blocked isocyanate compounds are preferred from the viewpoints of the strength of the resulting cured film and the adhesion of the resulting uncured film. Since the blocked isocyanate compound reacts with a hydroxy group and a carboxy group, for example, when an alkali-soluble resin and / or an ethylenically unsaturated compound has at least one of a hydroxy group and a carboxy group, the hydrophilicity of the formed film tends to decrease, and the functionality tends to be enhanced when the film obtained by curing the photosensitive layer is used as a protective film. The blocked isocyanate compound refers to a compound having a structure in which the isocyanate group of an isocyanate is protected (so-called masked) with a blocking agent.

[0183] The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably from 100°C to 160°C, and more preferably from 130°C to 150°C. The dissociation temperature of a blocked isocyanate means "the temperature of an endothermic peak accompanying the deprotection reaction of a blocked isocyanate when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter." As the differential scanning calorimeter, for example, a differential scanning calorimeter (model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited to this.

[0184] Examples of blocking agents having a dissociation temperature of 100°C to 160°C include active methylene compounds [malonic acid diesters (dimethyl malonate, diethyl malonate, di-n-butyl malonate, di-2-ethylhexyl malonate, etc.)] and oxime compounds (compounds having a structure represented by -C(=N-OH)- in the molecule, such as formaldoxime, acetaldoxime, acetoxime, methylethylketoxime, and cyclohexanoneoxime). Among these, the blocking agent having a dissociation temperature of 100° C. to 160° C. preferably contains an oxime compound, for example, from the viewpoint of storage stability.

[0185] The blocked isocyanate compound preferably has an isocyanurate structure from the viewpoints of, for example, improving the brittleness of the film and improving the adhesive strength to the transfer target. A blocked isocyanate compound having an isocyanurate structure can be obtained, for example, by protecting hexamethylene diisocyanate by converting it into an isocyanurate. Among blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure in which an oxime compound is used as a blocking agent is preferred from the viewpoints that the dissociation temperature can be set in a preferred range more easily and development residues can be reduced more easily than a compound not having an oxime structure.

[0186] The blocked isocyanate compound may have a polymerizable group. The polymerizable group is not particularly limited, and any known polymerizable group can be used, with a radically polymerizable group being preferred. Examples of the polymerizable group include ethylenically unsaturated groups such as a (meth)acryloxy group, a (meth)acrylamide group, and a styryl group, as well as groups having an epoxy group such as a glycidyl group. Among these, as the polymerizable group, an ethylenically unsaturated group is preferable, a (meth)acryloxy group is more preferable, and an acryloxy group is even more preferable.

[0187] As the blocked isocyanate compound, commercially available products can be used. Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP, and the like (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, and the like, manufactured by Asahi Kasei Chemicals Corporation). In addition, as the blocked isocyanate compound, a compound having the following structure can also be used.

[0188] [ka]

[0189] The thermally crosslinkable compounds may be used alone or in combination of two or more. When the photosensitive layer contains a thermally crosslinkable compound, the content of the thermally crosslinkable compound is preferably from 1 to 50% by mass, and more preferably from 5 to 30% by mass, based on the total mass of the photosensitive layer.

[0190] <Surfactant> The photosensitive layer may contain a surfactant. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, with nonionic surfactants being preferred. Examples of the surfactant include those described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of JP-A-2009-237362.

[0191] The surfactant is preferably a fluorine-based surfactant or a silicone-based surfactant. Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-444, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, and F-56 5, F-563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Futergent Examples of such products include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation).

[0192] As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. The fluorine-based surfactant may be a block polymer. The fluorine-based surfactant may be a fluorine-containing polymer compound that includes a structural unit derived from a (meth)acrylate compound having a fluorine atom and a structural unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups, propyleneoxy groups). The fluorine-based surfactant may be a fluorine-containing polymer having an ethylenically unsaturated group in the side chain, such as Megafac (trade name) RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0193] Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, and Pluronic (trade name) L10. , L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic (trade name) 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), Solsperse (trade name) 20000 (all manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin (trade name) D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil Co., Ltd.), Olfin E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.). In recent years, the use of perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS) has been restricted due to concerns about the environmental compatibility of compounds having a linear perfluoroalkyl group with 7 or more carbon atoms. Therefore, it is preferable to use surfactants that use alternative materials to PFOA and PFOS.

[0194] Examples of silicone surfactants include linear polymers formed from siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or ends. Specific examples of silicone surfactants include DOWSIL (trade name) 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Toray Dow Corning Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, and KF -945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Chemical Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie), and the like.

[0195] The surfactants may be used alone or in combination of two or more. When the photosensitive layer contains a surfactant, the content of the surfactant is preferably 0.01% by mass to 3.0% by mass, more preferably 0.01% by mass to 1.0% by mass, and further preferably 0.05% by mass to 0.80% by mass, based on the total mass of the photosensitive layer.

[0196] <Polymerization inhibitor> The photosensitive layer may contain a polymerization inhibitor. The polymerization inhibitor means a compound having a function of delaying or inhibiting a polymerization reaction. As the polymerization inhibitor, for example, a known compound used as a polymerization inhibitor can be used.

[0197] Examples of the polymerization inhibitor include phenothiazine compounds such as phenothiazine, bis(1-dimethylbenzyl)phenothiazine, and 3,7-dioctylphenothiazine; bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylene bis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl), 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, and pentaerythritol tetrakis 3-(3,5-di-tert-butyl)propionic acid. nitroso compounds or salts thereof, such as 4-nitrosophenol, N-nitrosodiphenylamine, N-nitrosocyclohexylhydroxylamine, and N-nitrosophenylhydroxylamine; quinone compounds, such as methylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, and 4-benzoquinone; phenol compounds, such as 4-methoxyphenol, 4-methoxy-1-naphthol, and t-butylcatechol; and metal salt compounds, such as copper dibutyldithiocarbamate, copper diethyldithiocarbamate, manganese diethyldithiocarbamate, and manganese diphenyldithiocarbamate. Among them, in terms of superior effects in the present disclosure, the polymerization inhibitor is preferably at least one selected from the group consisting of a phenothiazine compound, a nitroso compound or a salt thereof, and a hindered phenol compound, and more preferably phenothiazine, bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylene bis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), and N-nitrosophenylhydroxylamine aluminum salt.

[0198] The polymerization inhibitor may be used alone or in combination of two or more kinds. When the photosensitive layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 10.0% by mass, more preferably 0.01 to 5.0% by mass, and further preferably 0.04 to 3.0% by mass, based on the total mass of the photosensitive layer.

[0199] <Hydrogen donor compound> The photosensitive layer may contain a hydrogen donating compound. The hydrogen donor compound has the effect of further improving the sensitivity of the photopolymerization initiator to actinic rays and suppressing the inhibition of polymerization of the ethylenically unsaturated compound by oxygen. Examples of hydrogen donor compounds include amines and amino acid compounds.

[0200] Examples of amines include compounds described in MR Sander et al., Journal of Polymer Society, Vol. 10, p. 3173 (1972), JP-B-020189 / 1969, JP-A-51-082102, JP-A-52-134692, JP-A-59-138205, JP-A-60-084305, JP-A-62-018537, JP-A-64-033104, and Research Disclosure No. 33825. More specifically, 4,4'-bis(diethylamino)benzophenone, tris(4-dimethylaminophenyl)methane (also known as leuco crystal violet), triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline. Among these, in terms of achieving better effects in the present disclosure, the amine is preferably at least one selected from the group consisting of 4,4'-bis(diethylamino)benzophenone and tris(4-dimethylaminophenyl)methane.

[0201] Examples of the amino acid compound include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine. Among these, N-phenylglycine is preferred as the amino acid compound in that it provides superior effects in the present disclosure.

[0202] Further, examples of hydrogen donor compounds include organometallic compounds (such as tributyltin acetate) described in JP-B-48-042965, hydrogen donors described in JP-B-55-034414, and sulfur compounds (such as trithiane) described in JP-A-6-308727.

[0203] The hydrogen donor compounds may be used alone or in combination of two or more kinds. When the photosensitive layer contains a hydrogen donor compound, the content of the hydrogen donor compound is preferably 0.01% by mass to 10.0% by mass, more preferably 0.01% by mass to 8.0% by mass, and even more preferably 0.03% by mass to 5.0% by mass, relative to the total mass of the photosensitive layer, from the viewpoint of improving the curing rate through a balance between the polymerization growth rate and chain transfer.

[0204] <Other ingredients> The photosensitive layer may contain components other than those described above (hereinafter, also referred to as "other components"). Examples of the other components include antioxidants and particles (e.g., metal oxide particles). Examples of the other components include other additives described in paragraphs 0058 to 0071 of JP-A-2000-310706.

[0205] -Antioxidants- Examples of antioxidants include 3-pyrazolidones such as 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorohydroquinone; paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, and paraphenylenediamine. Among these, the antioxidant is preferably 3-pyrazolidone, and more preferably 1-phenyl-3-pyrazolidone.

[0206] When the photosensitive layer contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and even more preferably 0.01% by mass or more, based on the total mass of the photosensitive layer. There is no upper limit, but it is preferably 1% by mass or less.

[0207] -particle- The particles are particles other than the above-mentioned pigments, and metal oxide particles are preferred. The metals in the metal oxide particles include metalloids such as B, Si, Ge, As, Sb, and Te. The average primary particle size of the particles is, for example, preferably from 1 nm to 200 nm, and more preferably from 3 nm to 80 nm, from the viewpoint of the transparency of the cured film. The average primary particle size of particles is calculated by measuring the particle sizes of 200 random particles using an electron microscope and taking the arithmetic mean of the measurement results. If the particle shape is not spherical, the longest side is used as the particle size.

[0208] When the photosensitive layer contains particles, it may contain only one type of particles having different metal species, sizes, etc., or may contain two or more types of particles. The photosensitive layer does not contain particles, or if it contains particles, the particle content is preferably more than 0 mass % and 35 mass % or less, relative to the total mass of the photosensitive layer, more preferably the photosensitive layer does not contain particles or the particle content is more than 0 mass % and 10 mass % or less, relative to the total mass of the photosensitive layer, even more preferably the photosensitive layer does not contain particles or the particle content is more than 0 mass % and 5 mass % or less, relative to the total mass of the photosensitive layer, still more preferably the photosensitive layer does not contain particles or the particle content is more than 0 mass % and 1 mass % or less, relative to the total mass of the photosensitive layer, and it is particularly preferable that the photosensitive layer does not contain particles.

[0209] <Impurities, etc.> The photosensitive layer may contain a certain amount of impurities. Specific examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among them, halide ions, sodium ions, and potassium ions are easily mixed in as impurities, so the following contents are preferable.

[0210] The content of impurities in the photosensitive layer is preferably 80 ppm or less, more preferably 10 ppm or less, and even more preferably 2 ppm or less, by mass. The content of impurities can be 1 ppb or more, and may be 0.1 ppm or more, by mass.

[0211] Methods for keeping the amount of impurities within the above range include selecting raw materials for the composition that contain a small amount of impurities, preventing impurities from being mixed in during the preparation of the photosensitive layer, and removing the impurities by washing. By such methods, the amount of impurities can be kept within the above range.

[0212] Impurities can be quantified by known methods such as ICP (Inductively Coupled Plasma) emission spectrometry, atomic absorption spectrometry, and ion chromatography.

[0213] The content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive layer is preferably small. The content of these compounds relative to the total mass of the photosensitive layer is preferably 100 ppm or less, more preferably 20 ppm or less, and even more preferably 4 ppm or less, by mass. The lower limit, based on mass, can be 10 ppb or more, and can be 100 ppb or more, based on the total mass of the photosensitive layer. The content of these compounds can be suppressed in the same manner as the above-mentioned metal impurities. Also, they can be quantified by known measurement methods.

[0214] The water content in the photosensitive layer is preferably from 0.01% by mass to 1.0% by mass, and more preferably from 0.05% by mass to 0.5% by mass, from the viewpoint of improving reliability and lamination properties.

[0215] <Residual monomer> The photosensitive layer may contain residual monomers corresponding to the respective structural units of the alkali-soluble resin described above. From the viewpoints of patterning property and reliability, the content of the residual monomer is preferably 5,000 ppm by mass or less, more preferably 2,000 ppm by mass or less, and even more preferably 500 ppm by mass or less, based on the total mass of the alkali-soluble resin. Although there is no particular lower limit, it is preferably 1 ppm by mass or more, and more preferably 10 ppm by mass or more. From the viewpoints of patterning property and reliability, the residual monomer of each structural unit of the alkali-soluble resin is preferably 3,000 mass ppm or less, more preferably 600 mass ppm or less, and even more preferably 100 mass ppm or less, based on the total mass of the photosensitive layer. Although there is no particular lower limit, it is preferably 0.1 mass ppm or more, and more preferably 1 mass ppm or more.

[0216] The amount of residual monomers in the synthesis of an alkali-soluble resin by a polymer reaction is also preferably within the above range. For example, when the alkali-soluble resin is synthesized by reacting glycidyl acrylate with a carboxylic acid side chain, the content of glycidyl acrylate is preferably within the above range. The amount of the residual monomer can be measured by a known method such as liquid chromatography or gas chromatography.

[0217] <Thickness of photosensitive layer> The thickness of the photosensitive layer is not particularly limited, but is often 30 μm or less, and is preferably 20 μm or less, more preferably 15 μm or less, and particularly preferably 10 μm or less, in terms of superior effects in the present disclosure. The lower limit is preferably 0.60 μm or more, and more preferably 1.5 μm or more, in terms of superior strength of the film obtained by curing the photosensitive layer. The thickness of the photosensitive layer can be calculated, for example, as the average value of any five points measured by cross-sectional observation using a scanning electron microscope (SEM).

[0218] <Formation method> The method for forming the photosensitive layer is not particularly limited as long as it is a method capable of forming a layer containing the above-mentioned components. Examples of methods for forming the photosensitive layer include a method in which a photosensitive resin composition containing a pigment, an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, a solvent, etc. is prepared, the photosensitive resin composition is applied to a surface of a temporary support or the like, and the coating film of the photosensitive resin composition is dried to form the photosensitive layer.

[0219] Examples of the photosensitive resin composition used to form the photosensitive layer include compositions containing a pigment, an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, the above-mentioned optional components, and a solvent. The photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive layer.

[0220] -solvent- The solvent contained in the photosensitive resin composition is not particularly limited as long as it can dissolve or disperse the pigment, the alkali-soluble resin, the polymerizable compound, the photopolymerization initiator, and the above-mentioned optional components, and any known solvent can be used. Examples of the solvent include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (methanol, ethanol, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), cyclic ether solvents (tetrahydrofuran, etc.), ester solvents, amide solvents, lactone solvents, and mixed solvents containing two or more of these. When preparing a photosensitive transfer material having a temporary support, a thermoplastic resin layer, a functional layer and a photosensitive layer, the photosensitive resin composition preferably contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. Among them, a mixed solvent containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent is more preferable, and a mixed solvent containing at least two of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, and a ketone solvent is even more preferable.

[0221] Examples of alkylene glycol ether solvents include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, and dipropylene glycol dialkyl ethers. Examples of alkylene glycol ether acetate solvents include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, and dipropylene glycol monoalkyl ether acetate. As the solvent, the solvents described in paragraphs 0092 to 0094 of International Publication No. 2018 / 179640 and the solvents described in paragraph 0014 of JP-A-2018-177889 may be used, the contents of which are incorporated herein by reference.

[0222] The photosensitive resin composition may contain one type of solvent alone or two or more types of solvents. The content of the solvent when applying the photosensitive resin composition is preferably 50 to 1,900 parts by mass, and more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the photosensitive resin composition.

[0223] The method for preparing the photosensitive resin composition is not particularly limited, and examples thereof include a method in which each component is dissolved in the above-mentioned solvent to prepare a solution in advance, and the obtained solutions are mixed in a predetermined ratio to prepare the photosensitive resin composition. The photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 μm to 30 μm before forming the photosensitive layer.

[0224] The method for applying the photosensitive resin composition is not particularly limited, and may be a known method, such as printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (i.e., slit coating). The photosensitive layer may also be formed by applying a photosensitive resin composition onto a protective film described below and drying it.

[0225] As a method for drying the coating film of the photosensitive resin composition, heat drying and reduced pressure drying are preferred. The drying temperature is preferably 80° C. or higher, and more preferably 90° C. or higher. The upper limit is preferably 130° C. or lower, and more preferably 120° C. or lower. Drying can also be performed by continuously changing the temperature. The drying time is preferably 20 seconds or more, more preferably 40 seconds or more, and even more preferably 60 seconds or more. Although there is no particular upper limit, the drying time is preferably 600 seconds or less, and more preferably 300 seconds or less.

[0226] [Thermoplastic resin layer] The photosensitive transfer material may include a thermoplastic resin layer. The photosensitive transfer material preferably has a thermoplastic resin layer between the temporary support and the photosensitive layer, because the photosensitive transfer material has a thermoplastic resin layer between the temporary support and the photosensitive layer, which improves conformability to the substrate, suppresses the inclusion of air bubbles between the substrate and the photosensitive transfer material, and improves adhesion to an adjacent layer (e.g., temporary support).

[0227] <Alkali-soluble resin> The thermoplastic resin layer preferably contains an alkali-soluble resin as the thermoplastic resin. Examples of the alkali-soluble resin include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, polyamide resin, epoxy resin, polyacetal resin, polyhydroxystyrene resin, polyimide resin, polybenzoxazole resin, polysiloxane resin, polyethyleneimine, polyallylamine, and polyalkylene glycol.

[0228] As the alkali-soluble resin, from the viewpoints of developability and adhesion to adjacent layers, an acrylic resin is preferred. Here, the acrylic resin refers to a resin having at least one type of structural unit selected from the group consisting of structural units derived from (meth)acrylic acid, structural units derived from (meth)acrylic acid esters, and structural units derived from (meth)acrylic acid amides. The acrylic resin preferably contains a total content of constituent units derived from (meth)acrylic acid, constituent units derived from (meth)acrylic acid ester, and constituent units derived from (meth)acrylic acid amide of 50 mass% or more relative to the total mass of the acrylic resin. In particular, the total content of the structural units derived from (meth)acrylic acid and the structural units derived from (meth)acrylic acid esters is preferably 30% by mass to 100% by mass, and more preferably 50% by mass to 100% by mass, relative to the total mass of the acrylic resin.

[0229] The alkali-soluble resin is preferably a polymer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group, with the carboxy group being preferred. From the viewpoint of developability, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and more preferably a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more. The upper limit of the acid value of the alkali-soluble resin is not particularly limited, but is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less.

[0230] The carboxyl group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited, and can be appropriately selected from known resins. Examples of the alkali-soluble resin include a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraph 0025 of JP-A 2011-95716, a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraphs 0033 to 0052 of JP-A 2010-237589, and a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the alkali-soluble resins described in paragraphs 0053 to 0068 of JP-A 2016-224162. The copolymerization ratio of the structural unit having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and even more preferably 12% by mass to 30% by mass, based on the total mass of the acrylic resin. As the alkali-soluble resin, from the viewpoints of developability and adhesion to adjacent layers, an acrylic resin having a structural unit derived from (meth)acrylic acid is particularly preferred.

[0231] The alkali-soluble resin may have a crosslinkable group. The crosslinkable group may be any group capable of addition polymerization, and examples of the crosslinkable group include ethylenically unsaturated groups, polycondensable groups such as hydroxyl groups and carboxyl groups, and polyaddition reactive groups such as epoxy groups and (blocked) isocyanate groups.

[0232] The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably from 10,000 to 100,000, and even more preferably from 20,000 to 50,000.

[0233] The thermoplastic resin layer may contain one type of alkali-soluble resin alone or two or more types of alkali-soluble resins. From the viewpoints of developability and adhesion to adjacent layers, the content of the alkali-soluble resin is preferably 10% by mass to 99% by mass, more preferably 20% by mass to 90% by mass, even more preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, relative to the total mass of the thermoplastic resin layer.

[0234] <Dye> The thermoplastic resin layer preferably contains a dye (also simply referred to as "dye B") that has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm when colored and whose maximum absorption wavelength changes depending on an acid, a base, or a radical.

[0235] From the viewpoints of visibility of exposed and unexposed areas and resolution, dye B is preferably a dye whose maximum absorption wavelength changes in response to an acid or a radical, and more preferably a dye whose maximum absorption wavelength changes in response to an acid. From the viewpoints of visibility and resolution of exposed and unexposed areas, it is preferable that the thermoplastic resin layer contains both a dye B whose maximum absorption wavelength changes in response to acid, and a compound that generates an acid when exposed to light, as described below.

[0236] In this specification, the dye "whose maximum absorption wavelength changes due to an acid, a base, or a radical" may mean any of an embodiment in which a dye in a colored state is decolorized by an acid, a base, or a radical, a dye in a decolorized state is colored by an acid, a base, or a radical, and a dye in a colored state is changed to a colored state of another hue. Specifically, the dye B may be a compound that changes from a decolorized state to develop a color upon exposure, or may be a compound that changes from a colored state to decolorize upon exposure. In this case, the dye may be a dye whose coloring or decoloring state changes when an acid, base, or radical is generated and acts in the photosensitive layer upon exposure, or a dye whose coloring or decoloring state changes when the state (e.g., pH) in the photosensitive layer changes due to an acid, base, or radical. Alternatively, the dye may be a dye whose coloring or decoloring state changes when it is directly stimulated by an acid, base, or radical without exposure.

[0237] Among these, from the viewpoints of visibility and resolution of exposed and unexposed areas, dye B is preferably a dye whose maximum absorption wavelength changes in response to an acid or a radical, and more preferably a dye whose maximum absorption wavelength changes in response to a radical. From the viewpoints of the visibility of exposed and unexposed areas and the resolution, the photosensitive layer preferably contains both a dye whose maximum absorption wavelength changes in response to radicals as dye B, and a photoradical polymerization initiator. From the viewpoint of visibility of exposed and unexposed areas, dye B is preferably a dye that develops color in response to an acid, a base, or a radical.

[0238] An example of the color-developing mechanism of dye B in the present disclosure is an embodiment in which a photoradical polymerization initiator, a cationic photopolymerization initiator (photoacid generator), or a photobase generator is added to the photosensitive layer, and after exposure, a radical-reactive dye, an acid-reactive dye, or a base-reactive dye (for example, a leuco dye) develops color due to a radical, acid, or base generated from the photoradical polymerization initiator, the photocationic photopolymerization initiator, or the photobase generator.

[0239] From the viewpoint of visibility of exposed and unexposed areas, dye B preferably has a maximum absorption wavelength of 550 nm or more in the wavelength range of 400 nm to 780 nm upon color development, more preferably 550 nm to 700 nm, and even more preferably 550 nm to 650 nm. Furthermore, dye B may have only one or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when developing a color. When dye B has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm when developing a color, the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.

[0240] The maximum absorption wavelength of dye B is obtained by measuring the transmission spectrum of a solution containing dye B (liquid temperature 25°C) in the range of 400 nm to 780 nm using a spectrophotometer UV3100 (manufactured by Shimadzu Corporation) in an atmospheric environment and detecting the wavelength at which the light intensity is minimal (maximum absorption wavelength).

[0241] Examples of the dye that develops or loses color upon exposure to light include leuco compounds. Examples of dyes that are decolorized by exposure to light include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes. As dye B, a leuco compound is preferred from the viewpoint of visibility of exposed and unexposed areas.

[0242] Examples of the leuco compound include leuco compounds having a triarylmethane skeleton (triarylmethane-based dyes), leuco compounds having a spiropyran skeleton (spiropyran-based dyes), leuco compounds having a fluoran skeleton (fluoran-based dyes), leuco compounds having a diarylmethane skeleton (diarylmethane-based dyes), leuco compounds having a rhodamine lactam skeleton (rhodamine lactam-based dyes), leuco compounds having an indolylphthalide skeleton (indolylphthalide-based dyes), and leuco compounds having a leucoauramine skeleton (leucoauramine-based dyes). Among these, triarylmethane dyes or fluoran dyes are preferred, and leuco compounds having a triphenylmethane skeleton (triphenylmethane dyes) or fluoran dyes are more preferred.

[0243] From the viewpoint of visibility of the exposed and non-exposed parts, the leuco compound preferably has a lactone ring, a sultine ring, or a sultone ring. This allows the lactone ring, the sultine ring, or the sultone ring of the leuco compound to react with a radical generated from a photoradical polymerization initiator or an acid generated from a photocationic polymerization initiator, thereby changing the leuco compound to a ring-closed state to cause discoloration, or changing the leuco compound to a ring-open state to cause color development. The leuco compound is preferably a compound having a lactone ring, a sultine ring, or a sultone ring, which is opened by a radical or an acid to develop color, and more preferably a compound having a lactone ring, which is opened by a radical or an acid to develop color.

[0244] Examples of the dye B include the following dyes and leuco compounds. Specific examples of dyes among the pigment B include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, metanil yellow, thymolsulfophthalein, xylenol blue, methyl orange, paramethyl red, Congo red, benzopurpurin 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, parafuchsin, Victoria Pure Blue-naphthalenesulfonate, Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Industry Co., Ltd.), Oil Blue #603 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Pink #312 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red 5B (manufactured by Orient Chemical Industry Co., Ltd.), Oil Scarlet #308 (manufactured by Orient Chemical Industry Co., Ltd.), Examples of the oil-soluble pigments that can be used include Orient Chemical Industry Co., Ltd.), Oil Red OG (Orient Chemical Industry Co., Ltd.), Oil Red RR (Orient Chemical Industry Co., Ltd.), Oil Green #502 (Orient Chemical Industry Co., Ltd.), Spiron Red BEH Special (Hodogaya Chemical Industry Co., Ltd.), m-Cresol Purple, Cresol Red, Rhodamine B, Rhodamine 6G, Sulforhodamine B, Auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-pN,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, and 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone.

[0245] Specific examples of the leuco compound among the dyes B include p,p',p"-hexamethyltriaminotriphenylmethane (leuco crystal violet), Pergascript Blue SRB (manufactured by Ciba-Geigy), crystal violet lactone, malachite green lactone, benzoyl leucomethylene blue, 2-(N-phenyl-N-methylamino)-6-(Np-tolyl-N-ethyl)aminofluoran, 2-anilino-3-methyl-6-(N-ethyl-p-toluidino)fluoran, 3,6-dimethoxyfluoran, 3-(N,N-diethylamino)-5-methyl-7-(N,N-dibenzylamino)fluoran, 3-(N-cyclohexyl-N-methylamino)-6-(N-cyclohexyl-N-methylamino)fluoran, and the like. -methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-xylidinofluoran, 3-(N,N-diethylamino)-6-methyl-7-chlorofluoran, 3-(N,N-diethylamino)-6-methoxy-7-aminofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)- 3-(N,N-diethylamino)-7-benzylaminofluoran, 3-(N,N-diethylamino)-7,8-benzofluoran, 3-(N,N-dibutylamino)-6-methyl-7-anilinofluoran, 3-(N,N-dibutylamino)-6-methyl-7-xylidinofluoran, 3-piperidino-6-methyl-7-anilinofluoran, 3-pyrrolidino-6-methyl-7-anilinofluoran, 3,3-bis(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(1-n-butyl-2-methylindol-3-yl)phthalide 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, and 3',6'-bis(diphenylamino)spiroisobenzofuran-1(3H),9'-[9H]xanthen-3-one.

[0246] From the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, dye B is preferably a dye whose maximum absorption wavelength changes in response to radicals, and more preferably a dye that develops color in response to radicals. As dye B, leuco crystal violet, crystal violet lactone, brilliant green, or Victoria Pure Blue-naphthalenesulfonate is preferred.

[0247] The dye B may be used alone or in combination of two or more kinds. From the viewpoint of visibility of exposed and non-exposed areas, the content of dye B is preferably 0.2 mass% or more, more preferably 0.2 mass% to 6 mass%, even more preferably 0.2 mass% to 5 mass%, and particularly preferably 0.25 mass% to 3.0 mass%, relative to the total mass of the thermoplastic resin layer.

[0248] Here, the content of dye B means the content of dye when all of dye B contained in the thermoplastic resin layer is in a colored state. A method for quantifying the content of dye B will be described below using a dye that develops color by radicals as an example. Prepare solutions by dissolving 0.001 g and 0.01 g of dye in 100 mL of methyl ethyl ketone. Add a photoradical polymerization initiator Irgacure OXE01 (product name, BASF Japan Co., Ltd.) to each of the obtained solutions, and irradiate with 365 nm light to generate radicals and make all the dyes colored. Then, measure the absorbance of each solution at a liquid temperature of 25°C using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation) in an air atmosphere, and create a calibration curve. Next, the absorbance of the solution in which all the dye has been colored is measured in the same manner as above, except that 0.1 g of the thermoplastic resin layer is dissolved in methyl ethyl ketone instead of the dye. The amount of the dye contained in the thermoplastic resin layer is calculated based on the calibration curve from the absorbance of the solution containing the thermoplastic resin layer obtained.

[0249] <Compounds that generate acids, bases, or radicals when exposed to light> The thermoplastic resin layer may contain a compound that generates an acid, a base or a radical when exposed to light (also simply referred to as "compound C"). Compound C is preferably a compound that generates an acid, a base, or a radical upon exposure to actinic rays such as ultraviolet light and visible light. Known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators) can be used as the compound C. Among them, photoacid generators are preferred.

[0250] -Photoacid generator- From the viewpoint of resolution, the thermoplastic resin layer preferably contains a photoacid generator. Examples of the photoacid generator include the above-mentioned cationic photopolymerization initiators which may be contained in the photosensitive layer, and preferred embodiments are also the same except for the points described below.

[0251] From the viewpoints of sensitivity and resolution, the photoacid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and from the viewpoints of sensitivity, resolution and adhesion, it is more preferable that the photoacid generator contains an oxime sulfonate compound. As the photoacid generator, a photoacid generator having the following structure is also preferred.

[0252] [ka]

[0253] -Photoradical polymerization initiator- The thermoplastic resin layer may contain a photoradical polymerization initiator (photoradical polymerization initiator). As the photoradical polymerization initiator, the above-mentioned photoradical polymerization initiators which may be contained in the photosensitive layer can be mentioned, and the preferred embodiments are also the same.

[0254] -Photobase generator- The thermoplastic resin layer may contain a photobase generator. The photobase generator is not particularly limited as long as it is a known photobase generator, and examples thereof include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoylhydroxylamide, O-carbamoyloxime, {[(2,6-dinitrobenzyl)oxy]carbonyl}cyclohexylamine, bis{[(2-nitrobenzyl)oxy]carbonyl}hexane-1,6-diamine, 4-(methylthiobenzoyl)-1-methyl-1-morpholinoethane, (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, hexaamminecobalt(III) tris(triphenylmethylborate), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4-(2,4-dinitrophenyl)-1,4-dihydropyridine.

[0255] The thermoplastic resin layer may contain one type of compound C alone, or may contain two or more types. The content of compound C is preferably 0.1 to 10% by mass, and more preferably 0.5 to 5% by mass, based on the total mass of the thermoplastic resin layer, from the viewpoints of visibility and resolution of exposed and non-exposed areas.

[0256] <Plasticizer> The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to adjacent layers, and developability. The plasticizer preferably has a smaller molecular weight (weight average molecular weight (Mw) in the case of an oligomer or polymer) than the alkali-soluble resin. The molecular weight (weight average molecular weight (Mw)) of the plasticizer is preferably 200 to 2,000. The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity, but from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

[0257] From the viewpoints of resolution and storage stability, the plasticizer preferably contains a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion to adjacent layers, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound. Examples of the (meth)acrylate compound used as the plasticizer include the (meth)acrylate compounds described above as the ethylenically unsaturated compound contained in the photosensitive layer. In the photosensitive transfer material, when the thermoplastic resin layer and the photosensitive layer are laminated in direct contact with each other, it is preferable that both the thermoplastic resin layer and the photosensitive layer contain the same (meth)acrylate compound, because the thermoplastic resin layer and the photosensitive layer each contain the same (meth)acrylate compound, which suppresses component diffusion between the layers and improves storage stability.

[0258] When the thermoplastic resin layer contains a (meth)acrylate compound as a plasticizer, it is preferable that the (meth)acrylate compound does not polymerize even in the exposed area after exposure, from the viewpoint of adhesion to adjacent layers. In addition, the (meth)acrylate compound used as a plasticizer is preferably a polyfunctional (meth)acrylate compound having two or more (meth)acryloyl groups in one molecule, from the viewpoints of resolution, adhesion to adjacent layers, and developability. Furthermore, as the (meth)acrylate compound used as the plasticizer, a (meth)acrylate compound having an acid group or a urethane (meth)acrylate compound is also preferred.

[0259] The thermoplastic resin layer may contain one type of plasticizer alone, or may contain two or more types of plasticizers. From the viewpoints of resolution, adhesion to adjacent layers, and developability, the content of the plasticizer is preferably 1% by mass to 70% by mass, more preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass, relative to the total mass of the thermoplastic resin layer.

[0260] <Surfactant> From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant. As the surfactant, the surfactant which may be contained in the photosensitive layer described above can be used, and the preferred embodiments are also the same.

[0261] The thermoplastic resin layer may contain one type of surfactant alone, or may contain two or more types of surfactants. The content of the surfactant is preferably from 0.001% by mass to 10% by mass, and more preferably from 0.01% by mass to 3% by mass, based on the total mass of the thermoplastic resin layer.

[0262] <Sensitizer> The thermoplastic resin layer may contain a sensitizer. The sensitizer is not particularly limited, and examples thereof include the sensitizers that may be contained in the photosensitive layer described above.

[0263] The thermoplastic resin layer may contain one type of sensitizer alone or two or more types of sensitizers. The content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoints of improving sensitivity to the light source and visibility of exposed and non-exposed areas, it is preferably in the range of 0.01 mass % to 5 mass %, and more preferably in the range of 0.05 mass % to 1 mass %, relative to the total mass of the thermoplastic resin layer.

[0264] <Additives, etc.> The thermoplastic resin layer may contain known additives, if necessary, in addition to the above components. In addition, the thermoplastic resin layer is described in paragraphs

[0189] to

[0193] of JP2014-85643A, the contents of which are incorporated herein by reference.

[0265] <Physical properties, etc.> The thickness of the thermoplastic resin layer is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of adhesion with adjacent layers. The upper limit is not particularly limited, but is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less, from the viewpoint of developability and resolution.

[0266] <Formation method> The method for forming the thermoplastic resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above-mentioned components. Examples of methods for forming the thermoplastic resin layer include a method in which a thermoplastic resin composition containing the above-mentioned components and a solvent is prepared, the thermoplastic resin composition is applied to a surface of a temporary support or the like, and a coating of the thermoplastic resin composition is dried to form the layer. The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

[0267] -solvent- The solvent contained in the thermoplastic resin composition is not particularly limited as long as it can dissolve or disperse the above-mentioned components contained in the thermoplastic resin layer. As the solvent contained in the thermoplastic resin composition, the solvent which may be contained in the photosensitive resin composition described above can be mentioned, and the preferred embodiments are also the same.

[0268] The solvent contained in the thermoplastic resin composition may be one type alone or two or more types. The content of the solvent when applying the thermoplastic resin composition is preferably 50 to 1,900 parts by mass, and more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the thermoplastic resin composition.

[0269] The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out in accordance with the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive layer. For example, a solution is prepared in advance by dissolving each component contained in the thermoplastic resin layer in the above-mentioned solvent, and the obtained solutions are mixed in a predetermined ratio to prepare a thermoplastic resin composition, and then, The obtained thermoplastic resin composition is applied to the surface of a temporary support, and the coating of the thermoplastic resin composition is dried to form a thermoplastic resin layer. In addition, after forming a photosensitive layer and a water-soluble resin layer on a protective film described below, a thermoplastic resin layer may be formed on the surface of the water-soluble resin layer.

[0270] [Water-soluble resin layer] The photosensitive transfer material preferably has a water-soluble resin layer between the thermoplastic resin layer and the photosensitive layer. By providing the water-soluble resin layer, it is possible to suppress mixing of components when applying multiple layers and during storage after application. The water-soluble resin layer is preferably a water-soluble layer from the viewpoints of developability and suppressing mixing of components when applying a plurality of layers and during storage after application. In this specification, the term "water-soluble" means that the solubility in 100 g of water having a liquid temperature of 22°C and a pH of 7.0 is 0.1 g or more.

[0271] The water-soluble resin layer may be an oxygen-blocking layer having an oxygen-blocking function, which is described as a "separation layer" in JP-A-5-72724. When the water-soluble resin layer is an oxygen-blocking layer, the sensitivity during exposure is improved, the time load of the exposure machine is reduced, and productivity is improved, which is preferable. The oxygen barrier layer used as the water-soluble resin layer may be appropriately selected from known layers described in the above publications, etc. Among them, an oxygen barrier layer that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution (a 1% by mass aqueous solution of sodium carbonate at 22° C.) is preferred.

[0272] The water-soluble resin layer preferably contains a resin. Examples of the resin contained in the water-soluble resin layer include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and copolymers thereof. The resin contained in the water-soluble resin layer is preferably a water-soluble resin. In addition, from the viewpoint of suppressing mixing of components between multiple layers, it is preferable that the resin contained in the water-soluble resin layer is a resin different from both the alkali-soluble resin contained in the photosensitive layer and the thermoplastic resin (e.g., an alkali-soluble resin) contained in the thermoplastic resin layer.

[0273] From the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application, the water-soluble resin layer preferably contains polyvinyl alcohol, and more preferably contains both polyvinyl alcohol and polyvinylpyrrolidone.

[0274] The water-soluble resin layer may contain one type of the above resin alone, or may contain two or more types. The resin content in the water-soluble resin layer is not particularly limited, but from the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application, the resin content is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, even more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass, relative to the total mass of the water-soluble resin layer. The water-soluble resin layer may contain additives such as a surfactant, if necessary.

[0275] The thickness of the water-soluble resin layer is not particularly limited, but is preferably from 0.1 μm to 5 μm, and more preferably from 0.5 μm to 3 μm. When the thickness of the water-soluble resin layer is within the above range, the oxygen barrier properties are not reduced, mixing of components can be suppressed when multiple layers are applied and during storage after application, and an increase in the time required to remove the water-soluble resin layer during development can be suppressed.

[0276] The method for forming the water-soluble resin layer is not particularly limited, and examples thereof include a method in which a water-soluble resin layer composition containing the above-mentioned resin and any additives is prepared, applied to the surface of the thermoplastic resin layer or the photosensitive layer, and the coating of the water-soluble resin layer composition is dried to form a water-soluble resin layer. The water-soluble resin layer composition preferably contains a solvent in order to adjust the viscosity of the water-soluble resin layer composition and facilitate the formation of the water-soluble resin layer.

[0277] The solvent contained in the water-soluble resin layer composition is not particularly limited as long as it is capable of dissolving or dispersing the above-mentioned resin, and is preferably at least one selected from the group consisting of water and water-miscible organic solvents, and more preferably water or a mixed solvent of water and a water-miscible organic solvent. Examples of the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin, with alcohols having 1 to 3 carbon atoms being preferred, and methanol or ethanol being more preferred.

[0278] [Functional layer] The photosensitive transfer material may have a functional layer between the temporary support or the thermoplastic resin layer and the photosensitive layer. An example of the functional layer is an oxygen barrier film having an oxygen barrier function described in paragraph 0027 of Japanese Patent No. 4,502,784. The oxygen barrier film is preferably one that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution, and may be appropriately selected from known films. Among them, an oxygen barrier film containing a combination of polyvinyl alcohol and polyvinylpyrrolidone is preferred. The dry thickness of the functional layer is preferably from 0.2 μm to 5 μm, more preferably from 0.5 μm to 3 μm, and even more preferably from 1 μm to 2.5 μm.

[0279] [Protective film] The photosensitive transfer material preferably has a protective film in contact with the surface of the photosensitive layer that does not face the temporary support.

[0280] Examples of materials constituting the protective film include resin films and paper, and resin films are preferred from the viewpoints of strength and flexibility. Examples of resin films include polyethylene films, polypropylene films, polyethylene terephthalate films, triacetyl cellulose films, polystyrene films, and polycarbonate films. Among them, polyethylene films, polypropylene films, or polyethylene terephthalate films are preferred.

[0281] The thickness (layer thickness) of the protective film is not particularly limited, but is preferably 5 μm to 100 μm, and more preferably 10 to 50 μm. In addition, the arithmetic mean roughness Ra value of the surface in contact with the photosensitive layer of the protective film (hereinafter also simply referred to as "the surface of the protective film") is preferably 0.3 μm or less, more preferably 0.1 μm or less, and still more preferably 0.05 μm or less from the viewpoint of excellent resolution. It is considered that when the Ra value of the surface of the protective film is within the above range, the uniformity of the layer thickness of the photosensitive layer and the formed resin pattern is improved. The lower limit of the Ra value of the surface of the protective film is not particularly limited, but is preferably 0.001 μm or more.

[0282] The Ra value of the surface of the protective film is measured by the following method. Using a three-dimensional optical profiler (New View7300, manufactured by Zygo), measure the surface of the protective film under the following conditions to obtain the surface profile of the optical film. As measurement and analysis software, use the Microscope Application of MetroPro ver8.3.2. Next, display the Surface Map screen with the above analysis software, and obtain histogram data in the Surface Map screen. Calculate the arithmetic mean roughness from the obtained histogram data to obtain the Ra value of the surface of the protective film. When the protective film is laminated on the photosensitive transfer material, the protective film may be peeled off from the photosensitive transfer material, and the Ra value of the surface on the peeled side may be measured.

[0283] The method for bonding the protective film to the photosensitive layer or the like is not particularly limited, and any known method can be used. Examples of a device for laminating the protective film to the photosensitive layer and the like include known laminators such as a vacuum laminator and an autocut laminator. The laminator is preferably equipped with any heatable roller, such as a rubber roller, and is capable of applying pressure and heat.

[0284] The photosensitive transfer material may include layers other than the above-mentioned layers (hereinafter, also referred to as "other layers"). Examples of the other layers include a contrast enhancement layer. The contrast enhancement layer is described in paragraph 0134 of WO 2018 / 179640. The other layers are described in paragraphs 0194 to 0196 of JP 2014-85643 A. The contents of these publications are incorporated herein by reference.

[0285] In order to better exert the effects of the present disclosure, the total thickness of each layer in the photosensitive transfer material, excluding the temporary support and the protective film, is preferably 20 μm or less, more preferably 10 μm or less, even more preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less. In addition, from the viewpoint of better exerting the effects of the present disclosure, the total thickness of the photosensitive layer, the water-soluble resin layer, and the thermoplastic resin layer in the photosensitive transfer material is preferably 20 μm or less, more preferably 10 μm or less, even more preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

[0286] The photosensitive transfer material according to the present disclosure can be suitably used in various applications requiring precise microfabrication by photolithography. After patterning the photosensitive layer, etching may be performed using the photosensitive layer as a coating, or electroforming mainly using electroplating may be performed. The cured film obtained by patterning may be used as a permanent film, for example, as an interlayer insulating film, a wiring protective film, or a wiring protective film having an index matching layer. The photosensitive transfer material according to the present disclosure can be suitably used in applications such as various wiring formation applications for semiconductor packages, printed circuit boards, and sensor boards, LED arrays, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealants, and the formation of structures in the fields of micromachines and microelectronics.

[0287] [Method of producing photosensitive transfer material] The method for producing the photosensitive transfer material used in the present disclosure is not particularly limited, and any known production method, for example, any known method for forming each layer, can be used. Hereinafter, a method for producing a photosensitive transfer material according to the present disclosure will be described with reference to Fig. 1. However, the photosensitive transfer material according to the present disclosure is not limited to the configuration shown in Fig. 1. Fig. 1 is a schematic cross-sectional view showing an example of a layer structure in one embodiment of the photosensitive transfer material according to the present disclosure. The photosensitive transfer material 20 shown in Fig. 1 has a structure in which a temporary support 11, a thermoplastic resin layer 13, a functional layer 15, a transfer layer 12 including a photosensitive layer 17, and a protective film 19 are laminated in this order.

[0288] Examples of a manufacturing method for the above-mentioned photosensitive transfer material 20 include a method including a step of applying a thermoplastic resin composition to the surface of the temporary support 11 and then drying the coating of the thermoplastic resin composition to form a thermoplastic resin layer 13, a step of applying a composition for forming a functional layer to the surface of the thermoplastic resin layer 13 and then drying the coating of the composition for forming a functional layer to form a functional layer 15, and a step of applying a photosensitive resin composition to the surface of the functional layer 15 and then drying the coating of the photosensitive resin composition to form a photosensitive layer 17. In the above manufacturing method, it is preferable to use a thermoplastic resin composition containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, a functional layer forming composition containing at least one selected from the group consisting of water and a water-miscible organic solvent, and a photosensitive resin composition containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. This can suppress the mixing of the components contained in the thermoplastic resin layer 13 and the components contained in the functional layer 15 during the application of the functional layer forming composition to the surface of the thermoplastic resin layer 13 and / or the storage period of the laminate having the coating film of the functional layer forming composition, and can also suppress the mixing of the components contained in the functional layer 15 and the components contained in the photosensitive layer 17 during the application of the photosensitive resin composition to the surface of the functional layer 15 and / or the storage period of the laminate having the coating film of the photosensitive resin composition.

[0289] A protective film 19 is pressure-bonded to the photosensitive layer 17 of the laminate produced by the above-mentioned production method, thereby producing a photosensitive transfer material 20. A manufacturing method for the photosensitive transfer material used in the present disclosure preferably includes a step of providing a protective film 19 in contact with the second surface of the photosensitive layer 17, thereby manufacturing a photosensitive transfer material 20 having a temporary support 11, a thermoplastic resin layer 13, a functional layer 15, a photosensitive layer 17 and a protective film 19. After the photosensitive transfer material 20 is produced by the above-mentioned production method, a photosensitive transfer material in a roll form may be produced and stored by winding up the photosensitive transfer material 20. The photosensitive transfer material in a roll form can be provided in that form as it is to the step of laminating the material to a substrate in a roll-to-roll system described later.

[0290] The photosensitive transfer material according to the present disclosure can be suitably used for producing a light-shielding material, in particular a light-shielding material for an LED array.

[0291] (shading material) A first embodiment of a light-blocking material according to the present disclosure comprises a resin layer having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, wherein the transmittance of the resin layer for light having a wavelength of 365 nm is 0.1% or more and 30% or less. A second embodiment of the light-blocking material according to the present disclosure has a resin layer having a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface, and the transmittance of the resin layer for light with a wavelength of 405 nm is 0.05% or more and 30% or less.

[0292] In this specification, unless otherwise specified, when the term "light-blocking material according to the present disclosure" or "light-blocking material" is used, it refers to both the first embodiment and the second embodiment.

[0293] The light-shielding material according to the present disclosure can be suitably used as a light-shielding material for LED arrays.

[0294] [Base material] The light-shielding material according to the present disclosure has a substrate. As the substrate used in the light-shielding material according to the present disclosure, a known substrate or a known substrate may be used. The substrate may include, for example, glass, silicon, and a film. The substrate is preferably transparent. In this specification, the term "transparent" means that the transmittance of light having a wavelength of 400 nm to 700 nm is 80% or more. The refractive index of the substrate constituting the substrate is preferably 1.50 to 1.52.

[0295] The transparent glass substrate may be a tempered glass such as Gorilla Glass manufactured by Corning Inc. In addition, the transparent glass substrate may be made of the materials described in JP-A-2010-86684, JP-A-2010-152809, and JP-A-2010-257492.

[0296] When a film is used as the substrate, it is preferable to use a film with small optical distortion and / or high transparency. Examples of the material of such a film include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose, polyimide, and cycloolefin polymer.

[0297] When the substrate is produced by a roll-to-roll method, a film is preferable.

[0298] When a substrate is used, the base material is preferably a substrate having a conductive layer, and more preferably a substrate having a conductive layer on the surface thereof. The substrate may have any layer other than the conductive layer, if necessary. Examples of the substrate include a resin substrate, a glass substrate, and a semiconductor substrate.

[0299] The conductive layer of the substrate may be a conductive layer such as a circuit wiring used in an LED array. From the viewpoints of electrical conductivity and fine line formability, the conductive layer is preferably at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer, more preferably a metal layer, and even more preferably a copper layer or a silver layer. The substrate may have one conductive layer or two or more conductive layers. When the substrate has two or more conductive layers, the conductive layers are preferably made of different materials.

[0300] Materials for the conductive layer include metals and conductive metal oxides. Metals include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag and Au. Conductive metal oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and SiO 2 Examples include: In this specification, "conductive" means a material having a volume resistivity of 1×10 6The volume resistivity of conductive metal oxides is less than 1×10 4 Less than Ωcm is preferred.

[0301] When a light-shielding material is produced using a substrate having a plurality of conductive layers, at least one of the plurality of conductive layers preferably contains a conductive metal oxide.

[0302] The substrate having a conductive layer may have a transparent electrode. The transparent electrode can function suitably as an electrode for a touch panel. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) or IZO (indium zinc oxide), a metal mesh, or a metal thin wire such as silver nanowire. Examples of the thin metal wires include thin wires of silver, copper, etc. Among them, conductive silver materials such as silver mesh and silver nanowires are preferred.

[0303] [Resin Layer] The light-shielding material according to the present disclosure has a resin layer on the above-mentioned substrate. The resin layer in the light-shielding material according to the present disclosure is preferably a layer obtained by curing the photosensitive layer in the photosensitive transfer material according to the present disclosure. The resin layer preferably has a desired pattern shape.

[0304] Preferred aspects of each component of the resin layer are the same as the preferred aspects of each component of the photosensitive layer in the photosensitive transfer material according to the present disclosure, except for those described below and except for those components whose chemical structure changes before and after curing. From the viewpoints of black tightness and strength, the content of the resin in the resin layer is preferably 30% by mass to 90% by mass, more preferably 40% by mass to 80% by mass, and particularly preferably 55% by mass to 80% by mass, relative to the total mass of the resin layer.

[0305] <Transmittance to light with a wavelength of 365 nm> In a first embodiment of the light-shielding material according to the present disclosure, the transmittance of the resin layer for light having a wavelength of 365 nm is 0.1% or more and 30% or less, and from the viewpoints of tightness of black and rectangularity of the pattern, it is preferably 0.12% or more and 20% or less, and more preferably 0.15% or more and 10% or less. In a second embodiment of the light-shielding material according to the present disclosure, from the standpoint of tightness of black and rectangularity of the pattern, the transmittance of the resin layer for light with a wavelength of 365 nm is preferably 0.1% or more and 30% or less, more preferably 0.12% or more and 20% or less, and particularly preferably 0.15% or more and 10% or less.

[0306] <Transmittance to light with a wavelength of 405 nm> In a second embodiment of the light-shielding material according to the present disclosure, the transmittance of the resin layer for light having a wavelength of 405 nm is 0.05% or more and 30% or less, and from the viewpoints of tightness of black and rectangularity of the pattern, it is preferably 0.06% or more and 20% or less, and more preferably 0.10% or more and 10% or less. In a first embodiment of the light-shielding material according to the present disclosure, from the viewpoints of tightness of black and rectangularity of the pattern, the transmittance of the resin layer for light having a wavelength of 405 nm is preferably 0.05% or more and 30% or less, more preferably 0.06% or more and 20% or less, and particularly preferably 0.10% or more and 10% or less.

[0307] <Optical density at 550 nm wavelength> In the light-shielding material according to the present disclosure, the optical density of the resin layer at light with a wavelength of 550 nm is preferably 1.5 or more, more preferably 2.5 or more, even more preferably 3.0 or more, and particularly preferably 3.0 or more and 5.0 or less, from the viewpoints of tightness of black and rectangularity of the pattern.

[0308] The resin layer has a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface. The shape of the through hole is not particularly limited, and examples thereof include a cylindrical shape, a polygonal cylindrical shape, an elliptical cylindrical shape, a circular truncated cone shape, an inverted circular truncated cone shape, a polygonal truncated pyramid shape, an inverted polygonal truncated pyramid shape, an elliptical truncated cone shape, and an inverted elliptical truncated cone shape, and the like. The through hole may also have an irregular cross-sectional shape in a plane perpendicular to the thickness direction of the resin layer. In addition, from the viewpoint of the rectangularity of the resulting pattern, the inclination angle between the side surface of the through hole and the surface of the substrate is preferably 60° or more, more preferably 70° or more and 110° or less, and particularly preferably 80° or more and 100° or less. From the viewpoints of the rectangularity of the resulting pattern, the brightness of the LED, and the luminous efficiency of the LED, the average size of the through holes on the surface in contact with the substrate is preferably 100 μm, more preferably 60 μm or less, even more preferably 50 μm or less, and particularly preferably 1 μm or more and 50 μm or less.

[0309] The thickness of the resin layer is not particularly limited, but is often 30 μm or less, and is preferably 20 μm or less, more preferably 15 μm or less, and particularly preferably 10 μm or less, in terms of superior effects in the present disclosure. The lower limit is preferably 0.60 μm or more, and more preferably 1.5 μm or more, in terms of superior strength. The average values ​​of the thickness of the resin layer, the inclination angle, and the size of the through holes can be calculated, for example, as the average values ​​of any five points measured by cross-sectional observation using a scanning electron microscope (SEM).

[0310] <Manufacturing method of light-shielding material> The method for producing the light-shielding material according to the present disclosure is not particularly limited, but is preferably a production method in which a resin layer is formed on a substrate using the photosensitive transfer material according to the present disclosure. As a manufacturing method for a light-shielding material, a method including, in the photosensitive transfer material according to the present disclosure, in the order mentioned, a step of contacting the outermost layer having the photosensitive layer with the temporary support and laminating it to a substrate (hereinafter also referred to as the "lamination step"), a step of pattern-exposing the photosensitive layer (hereinafter also referred to as the "exposure step"), and a step of developing the exposed photosensitive layer to form a resin layer (hereinafter also referred to as the "development step"). Furthermore, in order to better exert the effects of the present disclosure, the method for producing a light-shielding material according to the present disclosure preferably includes a hole pattern (through hole) in at least a portion of the resin layer, and more preferably includes a hole pattern (through hole) having a maximum opening diameter of 100 μm or less in at least a portion of the resin pattern.

[0311] - Bonding process - The method for producing the light-shielding material preferably includes a lamination step. In the lamination step, it is preferable to bring the substrate (or the conductive layer, if a conductive layer is provided on the surface of the substrate) into contact with the outermost layer of the photosensitive transfer material on the side having the photosensitive layer relative to the temporary support, and to press the photosensitive transfer material and the substrate together. In this embodiment, the adhesion between the outermost layer of the photosensitive transfer material on the side having the photosensitive layer relative to the temporary support and the substrate is improved.

[0312] When the photosensitive transfer material has a protective film, the protective film may be removed from the surface of the photosensitive layer before lamination. Furthermore, in the case where the photosensitive transfer material further comprises a layer other than the protective film (e.g., a high refractive index layer and / or a low refractive index layer) on the surface of the photosensitive layer that does not face the temporary support, the lamination process is carried out in such a manner that the surface of the photosensitive layer that does not have the temporary support is laminated to the substrate via that layer.

[0313] The method for bonding the substrate and the photosensitive transfer material by pressure is not particularly limited, and known transfer methods and lamination methods can be used. The photosensitive transfer material is preferably laminated to the substrate by overlapping the outermost layer of the photosensitive transfer material on the side having the photosensitive layer with the temporary support and the substrate, and applying pressure and heat using a roll or other means. For the lamination, a known laminator such as a laminator, a vacuum laminator, or an autocut laminator that can further increase productivity can be used. The lamination temperature is not particularly limited, but is preferably from 70°C to 130°C, for example.

[0314] The method for producing the light-shielding material, including the lamination step, is preferably carried out by a roll-to-roll method. The roll-to-roll method will be described below. The roll-to-roll method refers to a method in which a substrate that can be wound up and unwound is used as the substrate, and includes a step of unwinding the substrate or a structure including the substrate (also referred to as an "unwinding step") before any step included in the method for manufacturing a resin pattern or a method for manufacturing a circuit wiring, and a step of winding up the substrate or the structure including the substrate (also referred to as a "winding step") after any step, in which at least any step (preferably all steps, or all steps other than the heating step) is performed while the substrate or the structure including the substrate is being transported. The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and any known method may be used in a production method that employs a roll-to-roll system.

[0315] -Exposure process- The method for producing the light-shielding material preferably includes, after the laminating step, a step of pattern-exposing the photosensitive layer (exposure step). Here, the term "pattern exposure" refers to a form of exposure in a pattern, that is, exposure in a form in which exposed areas and non-exposed areas exist. The positional relationship between the exposed and unexposed regions in the pattern exposure is not particularly limited and may be appropriately adjusted.

[0316] The detailed arrangement and the specific size of the pattern in the pattern exposure are not particularly limited. For example, in order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having a circuit wiring manufactured by the manufacturing method for circuit wiring, and to reduce the area occupied by the lead wiring, at least a part of the pattern (preferably the electrode pattern of the touch panel and / or the lead wiring part) preferably includes a thin line having a width of 20 μm or less, more preferably includes a thin line having a width of 10 μm or less.

[0317] The light source used for exposure can be appropriately selected and used as long as it irradiates light with a wavelength (e.g., 365 nm or 405 nm) that can expose the photosensitive layer. Specific examples include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, and LEDs (Light Emitting Diodes). The exposure dose was 5 mJ / cm 2 ~500mJ / cm 2 is preferred, and 10 mJ / cm 2 ~300mJ / cm 2 is more preferred. Preferred embodiments of the light source, exposure dose, and exposure method used for exposure are described, for example, in paragraphs 0146 to 0147 of WO 2018 / 155193, the contents of which are incorporated herein by reference.

[0318] In the exposure step, the photosensitive layer may be exposed to pattern light after the temporary support is peeled off from the photosensitive layer, or the temporary support may be exposed to pattern light through the temporary support before peeling off the temporary support, and then the temporary support may be peeled off. When the temporary support is peeled off before exposure, the mask may be exposed in contact with the photosensitive layer, or may be exposed in close proximity without contact. When the temporary support is not peeled off and the mask is exposed, the mask may be exposed in contact with the temporary support, or may be exposed in close proximity without contact. In order to prevent mask contamination due to contact between the photosensitive layer and the mask, and to avoid the influence of foreign matter attached to the mask on the exposure, it is preferable to perform pattern exposure without peeling off the temporary support. In the case of contact exposure, the exposure method may be a contact exposure method, and in the case of non-contact exposure, a proximity exposure method, a lens system or mirror system projection exposure method, a direct exposure method using an exposure laser, etc. may be appropriately selected and used. In the case of lens system or mirror system projection exposure, an exposure machine having an appropriate lens numerical aperture (NA) may be used according to the required resolution and focal depth. In the case of the direct exposure method, drawing may be performed directly on the photosensitive layer, or reduction projection exposure may be performed on the photosensitive layer through a lens. Exposure may be performed not only in the atmosphere but also under reduced pressure or vacuum, and exposure may be performed by interposing a liquid such as water between the light source and the photosensitive layer.

[0319] - Peeling process - The method for producing the light-shielding material may include a peeling step of peeling off the temporary support between the laminating step and the exposure step, or between the exposure step and the development step. The method for peeling off the temporary support is not particularly limited, and a mechanism similar to the cover film peeling mechanism described in paragraphs 0161 to 0162 of JP-A No. 2010-072589 can be used.

[0320] -Developing process- The method for producing the light-shielding material preferably includes, after the above-mentioned exposure step, a step of developing the exposed photosensitive layer to form a resin layer (development step). When the photosensitive transfer material has a thermoplastic resin and a functional layer or a water-soluble resin layer, the thermoplastic resin layer and the functional layer or the water-soluble resin layer in the non-exposed area are also removed together with the photosensitive layer in the non-exposed area in the development step. In addition, the thermoplastic resin layer and the functional layer or the water-soluble resin layer in the exposed area may also be removed in a form dissolved or dispersed in the developer in the development step.

[0321] The development of the exposed photosensitive layer in the development step can be carried out using a developer. The developer is not particularly limited as long as it can remove the non-image areas (non-exposed areas) of the photosensitive layer, and known developers such as the developer described in JP-A-5-72724 can be used. The developer is preferably an aqueous alkaline developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 mol / L to 5 mol / L (liter). The developer may contain a water-soluble organic solvent and / or a surfactant. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide). Preferred examples of the developer include the developer described in paragraph 0194 of WO 2015 / 093271. Preferred examples of the development method include the development method described in paragraph 0195 of WO 2015 / 093271.

[0322] The developing method is not particularly limited, and may be any of paddle development, shower development, shower and spin development, and dip development. Shower development is a developing treatment in which a developing solution is sprayed by shower onto the photosensitive layer after exposure to remove the unexposed area. After the development step, it is preferable to remove development residues by spraying a cleaning agent by showering and scrubbing with a brush. The temperature of the developer is not particularly limited, but is preferably from 20°C to 40°C.

[0323] -Protection film peeling process- When the photosensitive transfer material has a protective film, the method for producing the light-shielding material preferably includes a step of peeling off the protective film from the photosensitive transfer material. The method for peeling off the protective film is not limited, and a known method can be applied.

[0324] -Post-exposure process and post-bake process- The method for producing the light-shielding material may include a step of exposing the resin layer obtained in the above-mentioned developing step (a post-exposure step) and / or a step of heating the resin layer (a post-bake step). When both a post-exposure step and a post-bake step are included, it is preferable to carry out the post-bake step after the post-exposure step.

[0325] -Other processes- The method for producing the light-shielding material may include any steps (other steps) other than the steps described above. For example, the following steps can be mentioned, but the method is not limited to these steps. Moreover, examples of the exposure step, development step and other steps that can be applied to the method for producing circuit wiring include the steps described in paragraphs 0035 to 0051 of JP-A No. 2006-23696. Further, other steps include, for example, a step of reducing visible light reflectance described in paragraph 0172 of WO 2019 / 022089, a step of forming a new conductive layer on the insulating film described in paragraph 0172 of WO 2019 / 022089, and the like, but are not limited to these steps.

[0326] -Process to reduce visible light reflectance- The method for producing the light-shielding material may include a step of performing a treatment to reduce the visible light reflectance of some or all of the multiple conductive layers of the substrate. Examples of treatments for reducing the visible light reflectance include oxidation treatments. When the substrate has a conductive layer containing copper, the visible light reflectance of the conductive layer can be reduced by oxidizing the copper to copper oxide and blackening the conductive layer. Treatments for reducing visible light reflectance are described in paragraphs 0017 to 0025 of JP 2014-150118 A, and paragraphs 0041, 0042, 0048, and 0058 of JP 2013-206315 A, and the contents of these publications are incorporated herein by reference.

[0327] - A process for forming an insulating film, and a process for forming a new conductive layer on the surface of the insulating film - The method for producing the light-shielding material preferably includes the steps of forming an insulating film on the surface of the circuit wiring, and forming a new conductive layer on the surface of the insulating film. By the above steps, a second electrode pattern insulated from the first electrode pattern can be formed. The step of forming the insulating film is not particularly limited, and may be a known method for forming a permanent film. Alternatively, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having insulating properties. The step of forming a new conductive layer on the insulating film is not particularly limited, and for example, a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.

[0328] In the method for producing the light-shielding material, a substrate having a plurality of conductive layers on both surfaces of the substrate is used, and circuits are formed on the conductive layers formed on both surfaces of the substrate, either sequentially or simultaneously. With this configuration, a circuit wiring can be formed in which a first conductive pattern is formed on one surface of the substrate and a second conductive pattern is formed on the other surface. It is also preferable to form the circuit wiring of this configuration from both sides of the substrate by roll-to-roll.

[0329] (LED array) The LED array according to the present disclosure includes the light blocking material according to the present disclosure. Furthermore, the LED array according to the present disclosure may be an array of two or more LEDs or LED elements. The shape of the arrangement of the LEDs or LED elements in the LED array of the present disclosure is not particularly limited, and the arrangement can be in any shape desired, such as a straight line, curved line, cross, lattice, circle, ellipse, star, or irregular shape. The number of LEDs or LED elements in the LED array according to the present disclosure may be two or more, and may be appropriately selected as desired, for example, from 10 to 1,000,000. Furthermore, there are no particular limitations on the size and shape of the LED array according to the present disclosure, and these can be appropriately selected as desired. Furthermore, there are no particular limitations on the size and shape of the LEDs or LED elements in the LED array according to the present disclosure, and they can be appropriately selected as desired. The color of the LEDs or LED elements in the LED array according to the present disclosure is not particularly limited and may be red, blue, green, etc., and may be a single-color LED array or an LED array having two or more colors, or may be a white LED array having red, blue, and green LEDs or LED elements.

[0330] (electronic equipment) An electronic device according to the present disclosure includes an LED array according to the present disclosure. The electronic device according to the present disclosure is not particularly limited and can be used in known electronic devices that use LED arrays, such as lighting equipment, exposure light sources, sensors, and displays. EXAMPLES

[0331] The following examples further illustrate the embodiments of the present invention. The materials, amounts, ratios, processing contents, and processing procedures shown in the following examples can be changed as appropriate without departing from the spirit of the embodiments of the present invention. Therefore, the scope of the embodiments of the present invention is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are based on mass.

[0332] (Examples 1 to 21 and Comparative Example 1) <Preparation of Photosensitive Layer Forming Composition> Photosensitive layer coating solutions 1 to 13 (photosensitive layer forming compositions) were prepared by stirring and mixing these components according to the formulations shown in Table 1. The details of the compounds and their contents shown in Table 1 are as follows.

[0333] [Table 1]

[0334] Details of the compounds listed in Table 1 are shown below. Black pigment dispersion 1: Black pigment dispersion 1 prepared by the following method Black pigment dispersion 2: Black pigment dispersion 2 prepared by the following method Black pigment dispersion 3: Black pigment dispersion 3 prepared by the following method Black pigment dispersion 4: FDK-017 (Tokyo Ink Co., Ltd., contains carbon black, pigment concentration 20%, additive 7%, PGMEA solution), primary particle size of black pigment 35 nm BPE-500: 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd. DPHA: Dipentaerythritol hexaacrylate, KAYARAD DPHA manufactured by Nippon Kayaku Co., Ltd. A-DCP: Tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd. Polymer 1: PGMEA solution of benzyl methacrylate / methacrylic acid copolymer (70 mol% / 30 mol%, Mw 12,000, acid value 113 mg KOH / g, solid content 37.8%) Polymer 2: P-3 below B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, photopolymerization initiator, manufactured by Kurogane Kasei Co., Ltd. SB-PI 701: 4,4'-bis(diethylamino)benzophenone, sensitizer, obtained from Sanyo Trading Co., Ltd. N-Phenylglycine: Tokyo Chemical Industry Co., Ltd. TDP-G: Phenothiazine, manufactured by Kawaguchi Chemical Industry Co., Ltd. Leuco Crystal Violet: Tokyo Chemical Industry Co., Ltd. MMPG-Ac: Propylene glycol monomethyl ether acetate (Showa Denko K.K.) MEK: Methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd.) F-552: Fluorosurfactant, Megafac F552, manufactured by DIC Corporation

[0335] <Synthesis of zirconia nitride pigment> A zirconia nitride pigment was synthesized with reference to Japanese Patent No. 6561948. 7.3g of metallic magnesium powder having an average primary particle size of 150μm and 3.0g of magnesium nitride powder having an average primary particle size of 200nm were added to 7.4g of monoclinic zirconium dioxide powder having an average primary particle size of 50nm calculated from the specific surface area measured by the BET method, and mixed uniformly in a reaction device having a graphite boat inside a quartz glass tube. The amount of metallic magnesium added was 5.0 times the amount of zirconium dioxide by mole, and the amount of magnesium nitride added was 0.5 times the amount of zirconium dioxide by mole. This mixture was fired at a temperature of 700℃ for 60 minutes under a nitrogen gas atmosphere to obtain a fired product. This fired product was dispersed in 1 liter of water, washed by gradually adding 10% hydrochloric acid to keep the pH at 1 or more and the temperature at 100℃ or less, and then adjusted to pH 7-8 with 25% ammonia water and filtered. The filtered solid was redispersed in water at 400 g / L, and once again, the same procedure as above was repeated: acid washing, pH adjustment with ammonia water, and filtration. After repeating the acid washing and pH adjustment with ammonia water twice, the filtered material was dispersed in ion-exchanged water at 500 g / L in terms of solid content, heated and stirred at 60°C, and adjusted to pH 7, filtered with a suction filtration device, washed with an equal amount of ion-exchanged water, and dried in a hot air dryer at a set temperature of 120°C, to obtain a zirconium nitride pigment.

[0336] <Preparation of black pigment dispersion 1> The following components were mixed in the following composition ratio (parts by mass), and the resulting mixture was dispersed under the following conditions using an NPM-Pilot manufactured by Shinmaru Enterprises, Ltd., to obtain black pigment dispersion 1.

[0337] -Composition of black pigment dispersion 1- The zirconium nitride pigment obtained above: 10.5 parts by mass Dispersant A (compound synthesized below) 30% solution in propylene glycol monomethyl ether acetate (PGMEA): 12.33 parts by weight (solid content 3.7 parts by weight) ·PGMEA: 23.57 parts by mass

[0338] -Dispersion conditions- Bead diameter: φ0.05mm (Nikkato zirconia beads, YTZ) Beads filling rate: 65% by volume Mill peripheral speed: 10 or 12 m / sec Separator peripheral speed: 13m / s Amount of mixed liquid to be dispersed: 15kg ·Circulation flow rate (pump supply amount): 90kg / hour Treatment solution temperature: 19℃~21℃ ·Cooling water: water Processing time: 22 hours

[0339] <Preparation of black pigment dispersion 2> Black pigment dispersion 2 was prepared by using NITRBLACK UB-1 (manufactured by Mitsubishi Materials Corporation, inorganic black pigment, highly ultraviolet light transmittance) instead of the zirconia nitride pigment in the preparation of black pigment dispersion 1.

[0340] <Preparation of black pigment dispersion 3> The following components were mixed in the following composition ratio (parts by mass), and the resulting mixture was dispersed under the same conditions as those for the above black pigment dispersion 1 using an NPM-Pilot manufactured by Shinmaru Enterprises, Ltd., to obtain black pigment dispersion 3.

[0341] -Composition of black pigment dispersion 3- Titanium black (Mitsubishi Materials Corporation): 10.5 parts by weight Dispersant A (compound synthesized below) in 30% by weight solution in PGMEA: 18.33 parts by weight (solid content 5.5 parts by weight) ·PGMEA: 17.4 parts by mass

[0342] <Synthesis of Macromonomer A-1> Into a three-neck flask, ε-caprolactone (1044.2 parts), δ-valerolactone (184.3 parts), and 2-ethyl-1-hexanol (71.6 parts) were introduced to obtain a mixture. Next, the mixture was stirred while blowing in nitrogen. Next, Disperbyk111 (12.5 parts, BYK-Chemie, phosphoric acid resin) was added to the mixture, and the resulting mixture was heated to 90°C. After 6 hours, 1 After confirming the disappearance of the signal derived from 2-ethyl-1-hexanol in the mixture using H-NMR (nuclear magnetic resonance), the mixture was heated to 110° C. After the polymerization reaction was continued at 110° C. for 12 hours under nitrogen, 1 The disappearance of signals derived from ε-caprolactone and δ-valerolactone was confirmed by H-NMR, and the molecular weight of the obtained compound was measured by GPC. After it was confirmed that the molecular weight of the compound reached the desired value, 2,6-di-t-butyl-4-methylphenol (0.35 parts) was added to the mixture containing the above compound, and then 2-methacryloyloxyethyl isocyanate (87.0 parts) was added dropwise to the obtained mixture over 30 minutes. Six hours after the end of the dropwise addition, 1 After confirming the disappearance of the signal derived from 2-methacryloyloxyethyl isocyanate (MOI) by H-NMR, propylene glycol monomethyl ether acetate (PGMEA) (1,387.0 parts) was added to the mixture to obtain a macromonomer A-1 solution (2,770 parts) with a concentration of 50% by mass. The weight average molecular weight of the obtained macromonomer A-1 was 6,000.

[0343] <Synthesis of dispersant A> Into a three-necked flask, the above macro monomer A-1 solution (200.0 parts), methacrylic acid (hereinafter also referred to as "MAA", 60.0 parts), benzyl methacrylate (hereinafter also referred to as "BzMA", 40.0 parts), and PGMEA (366.7 parts) were introduced to obtain a mixture. While blowing nitrogen, the above mixture was stirred. Next, while flowing nitrogen into the flask, the mixture was heated to 75°C. Next, dodecyl mercaptan (5.85 parts) and then 2,2'-azobis(2-methylpropionic acid methyl) (1.48 parts, hereinafter also referred to as "V-601".) were added to the mixture to initiate the polymerization reaction. After heating the mixture at 75°C for 2 hours, V-601 (1.48 parts) was further added to the mixture. After 2 hours, V-601 (1.48 parts) was further added to the mixture. After reacting for another 2 hours, the mixture was heated to 90°C and stirred for 3 hours. By the above operation, the polymerization reaction was completed, and then the solid content was purified to obtain dispersant A. Thereafter, dispersant A was used as a 30 mass% solution (solvent: PGMEA) for the preparation of the dispersion composition.

[0344] <Preparation of P-3> A solution of polymer P-3 with a solid content of 36.2% by mass was prepared as P-3 solution according to the following method. Polymer P-3 is the resin shown below, and is an alkali-soluble resin. 113.5 g of propylene glycol monomethyl ether was charged into a flask and heated to 90° C. under a nitrogen gas flow. A solution of 172 g of styrene, 4.7 g of methyl methacrylate, and 112.1 g of methacrylic acid dissolved in 30 g of propylene glycol monomethyl ether, and a solution of 27.6 g of polymerization initiator V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) dissolved in 57.7 g of propylene glycol monomethyl ether were simultaneously dropped into this liquid over a period of 3 hours. After the dropwise addition was completed, 2.5 g of V-601 was added three times at 1-hour intervals. The mixture was then allowed to react for another 3 hours. The mixture was then diluted with 160.7 g of propylene glycol monomethyl ether acetate and 233.3 g of propylene glycol monomethyl ether. The reaction solution was heated to 100°C under air flow, and 1.8g of tetraethylammonium bromide and 0.86g of p-methoxyphenol were added. 71.9g of glycidyl methacrylate (Blenmer G, NOF Corp.) was added dropwise over 20 minutes. This was reacted at 100°C for 7 hours to obtain a solution of polymer P-3. The solid content concentration of the obtained solution was 36.3%. For polymer P-3, the weight average molecular weight in standard polystyrene equivalent in GPC was 18000, the dispersity was 2.3, and the acid value was 124mgKOH / g. The amount of residual monomer measured by gas chromatography was less than 0.1% by mass relative to the solid content of polymer P-3 for each monomer. The structure of polymer P-3 is shown below. The molar ratio of the repeating units in the formula was 55.1:26.5:1.6:16.8, starting from the repeating unit on the left.

[0345] [ka]

[0346] <Preparation of Photosensitive Transfer Material 1 (Examples 1 to 18, Comparative Example 1)> A coating solution for a thermoplastic (non-photosensitive) resin layer having the following formulation H1 was applied onto a 30 μm-thick polyethylene terephthalate film temporary support using a slit nozzle, and then dried to form a thermoplastic (non-photosensitive) resin layer. Next, the functional layer coating solution having the following formulation P1 was applied onto the thermoplastic (non-photosensitive) resin layer and dried to obtain a functional layer. Furthermore, the above-mentioned photosensitive layer forming composition was applied onto the functional layer and dried to obtain a photosensitive layer. By the method already described, a thermoplastic (non-photosensitive) resin layer with a dry thickness of 6.6 μm, a functional layer with a dry thickness of 1.1 μm, and a photosensitive layer with a dry thickness as shown in Table 1 were provided on the temporary support, and finally a protective film (12 μm thick polypropylene film) was pressure-bonded to the surface of the photosensitive layer. In this way, photosensitive transfer materials having a temporary support, a thermoplastic (non-photosensitive) resin layer, a functional layer (oxygen barrier film), a photosensitive layer containing a photosensitive resin composition, and a protective film were each produced.

[0347] <Preparation of Photosensitive Transfer Material 2 (Examples 19 to 21)> On a 16 μm thick polyethylene terephthalate film temporary support, the above-mentioned photosensitive layer forming composition was applied onto the functional layer using a slit nozzle, and dried to obtain a photosensitive layer. Finally, a protective film (12 μm thick polypropylene film) was pressed onto the surface of the photosensitive layer. In this way, a photosensitive transfer material having a temporary support, a photosensitive layer containing a photosensitive resin composition, and a protective film was prepared.

[0348] ~Coating solution for thermoplastic (non-photosensitive) resin layer: Formulation H1~ Methanol: 11.1 parts Propylene glycol monomethyl ether acetate: 6.36 parts Methyl ethyl ketone: 52.4 parts Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymer composition ratio (molar ratio) = 55 / 11.7 / 4.5 / 28.8, weight average molecular weight = 100,000, glass transition temperature (Tg) ≒ 70 ° C): 5.83 parts Styrene / acrylic acid copolymer (copolymer composition ratio (molar ratio) = 63 / 37, weight average molecular weight = 10,000, Tg ≒ 100 ° C): 13.6 parts 2,2-bis[4-(methacryloxypolyethoxy)phenyl]propane (manufactured by Shin-Nakamura Chemical Co., Ltd.): 9.1 parts Fluorine-based surfactant (methyl ethyl ketone solution with a solid content of 30% by mass, DIC Corporation, Megafac (registered trademark) F780F): 0.54 parts

[0349] ~Functional layer coating solution: Formulation P1~ PVA205 (polyvinyl alcohol, manufactured by Kuraray Co., Ltd., saponification degree = 88%, polymerization degree 550): 32.2 parts Polyvinylpyrrolidone (ISP Japan, K-30): 14.9 parts Distilled water: 524 parts Methanol: 429 parts

[0350] <Optical performance measurement> The optical density and transmittance were measured by the methods described above.

[0351] <Evaluation of blackening> (1) The photosensitive transfer material from which the protective film had been peeled off was attached to a silane coupling-treated glass (thickness 700 μm, manufactured by Corning Inc.) using a laminator (roll temperature: 100° C., linear pressure: 1.0 MPa, linear speed: 0.5 m / min). (2) The obtained laminate was subjected to pressure degassing under conditions of 0.6 MPa and 60° C. for 30 minutes using an autoclave. (3) Using an ultra-high pressure mercury lamp, the photosensitive layer was exposed through a square hole pattern mask (each side of which changed in steps of 10 μm from 10 μm to 100 μm) without peeling off the temporary support. (4) After peeling off the temporary support, the film was developed. Development was performed by shower development using a 1.0% by mass aqueous solution of sodium carbonate at 25° C. The development time was 1.5 times the dissolution time of the unexposed area in a 1.0% by mass aqueous solution of sodium carbonate at 25° C. By the above method, steps (3) and (4) were repeated until one side of the resin pattern of the photosensitive resin composition corresponding to the 50 μm square hole pattern of the mask was exactly 50 μm. (5) Then, a high-pressure mercury lamp is used to irradiate 400 mJ / cm 2 The film was exposed to light and then treated in an oven at 150° C. for 30 minutes.

[0352] The resist pattern obtained above was examined in the vicinity of the square holes by illuminating them with light from a three-wavelength fluorescent lamp in various directions and visually observing the area with an optical microscope. The degree of black appearance was evaluated according to the following criteria. A: The outline of the hole appears black. B: There are angles around the hole where the outline can be faintly seen. C: There is an angle around the hole outline where the outline can be seen.

[0353] <Resist shape evaluation> -Angle with the substrate- Among the resin patterns obtained in the evaluation of black tightness, the cross-sectional shape of the resin pattern of a square hole at a location with one side measuring 50 μm was observed using a scanning electron microscope (SEM), and the curve constituting the inclined surface of the inclined portion was approximated to a straight line, and this straight line was taken as the inclination angle θ. The closer θ is to 90°, the better the rectangularity. A: The inclination angle is between 80° and 100°. B: The inclination angle is greater than 70° and less than 80°. C: The inclination angle is greater than or equal to 60° and less than 70°. D: The inclination angle is less than 60°.

[0354] <Development margin evaluation> Under the conditions for evaluating tight black, the development time was doubled to obtain a resin pattern. The cross-sectional shape of the resin pattern with a square hole having a side length of 50 μm was observed using an optical microscope to evaluate peeling near the hole. A: No peeling was observed. B: Peeling was observed in one or two places. C: Peeling was confirmed in three or more places.

[0355] The evaluation results are summarized in Table 2.

[0356] [Table 2]

[0357] The photosensitive transfer materials of Examples 19 to 21 are photosensitive transfer materials that do not have a thermoplastic resin layer as an intermediate layer and a functional layer.

[0358] As shown in Table 2 above, the photosensitive transfer materials of Examples 1 to 21, compared with the photosensitive transfer material of Comparative Example 1, provided patterns with excellent rectangularity. Furthermore, when the photosensitive transfer materials of Examples 1 to 21 were used, patterns having excellent visibility and tight black were obtained. When the photosensitive transfer materials of Examples 1 to 21 are used, the black tightness is excellent, and in particular, overlapping images around the through-holes can be prevented from being seen, so that the materials can be suitably used for LED arrays. In addition, the photosensitive transfer materials of Examples 1 to 4, 6, 7, 9, and 11 to 21, in which the content of the bifunctional polymerizable compound was 50% by mass or more based on the total mass of the polymerizable compound, exhibited suppressed pattern peeling after development. This indicates that when a light-shielding material is formed, leakage of light from the LED array caused by areas where the desired hole pattern is not formed is suppressed, and the light-shielding material has excellent light-shielding properties. Furthermore, for the photosensitive transfer materials of Examples 1 to 11, 13 to 15, and 18 to 21, which contain a monomer having a bisphenol A skeleton, when a light-shielding material was formed, light leakage from the LED array caused by areas where the desired hole pattern was not formed was suppressed, and the light-shielding properties were excellent, and pattern peeling after development was suppressed. Furthermore, for the photosensitive transfer materials of Examples 1 to 12 and 14 to 21, which contain a polymer having a crosslinkable group, when a light-shielding material was formed, light leakage from the LED array caused by areas where the desired hole pattern was not formed was suppressed, and the light-shielding properties were excellent, and pattern peeling after development was suppressed. [Explanation of symbols]

[0359] 11: temporary support, 12: transfer layer, 13: thermoplastic resin layer, 15: functional layer, 17: photosensitive layer, 19: protective film, 20: photosensitive transfer material

Claims

1. A temporary support; A transfer layer including a photosensitive layer, The transmittance of the photosensitive layer with respect to light having a wavelength of 405 nm is 0.05% or more and 30% or less. Photosensitive transfer material.

2. 2. The photosensitive transfer material according to claim 1, wherein the photosensitive layer has an optical density of 3.0 or more for light having a wavelength of 550 nm.

3. The photosensitive transfer material according to claim 1 or 2, wherein the photosensitive layer contains a pigment.

4. The photosensitive transfer material according to claim 3 , wherein the pigment comprises a black pigment.

5. 5. The photosensitive transfer material according to claim 3, wherein the pigment is zirconium nitride.

6. 6. The photosensitive transfer material according to claim 1, wherein the photosensitive layer contains a polymerizable compound and a photopolymerization initiator.

7. The photosensitive transfer material according to claim 6 , wherein the polymerizable compound comprises a bifunctional polymerizable compound.

8. 8. The photosensitive transfer material according to claim 7, wherein the content of the bifunctional polymerizable compound is 50% by mass or more based on the total mass of the polymerizable compounds.

9. 9. The photosensitive transfer material according to claim 6, wherein the polymerizable compound contains a monomer having a bisphenol A skeleton.

10. 10. The photosensitive transfer material according to claim 1, wherein the photosensitive layer contains a polymer having a crosslinkable group.

11. The photosensitive transfer material according to any one of claims 1 to 10, which is a photosensitive transfer material for an LED array.

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