Wiring sheet and manufacturing method thereof

Abstract

To provide a wiring sheet which accurately detects moisture without complicating work even while protecting conductive wires formed on a base material, and its manufacturing method.SOLUTION: A wiring sheet includes: a base material 11; covering sheets 14 laid on one surface of the base material 11; two conductive wires 12a, 12b formed spaced apart from each other on the one surface of the base material 11; and adhesive layers 17 provided between the base material 11 and the covering sheets 14 in a form of isolated islands. The covering sheets 14 are provided on the surface of the base material 11, on which the conductive wires 12a, 12b are formed, in a manner to cover the conductive wires 12a, 12b, and are pasted on the base material 11 with the adhesive layers 17.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wiring sheet and a method for manufacturing the same. [Background technology]

[0002] Conventionally, there has been considered a technology for detecting leakage of moisture or oil by forming conductive wiring on a base substrate and shorting or breaking the conductive wiring or changing its resistance value when moisture or oil adheres to the conductive wiring. For example, this technology is disclosed in Patent Document 1.

[0003] In such a technique, if the conductive wiring is broken by a physical external force, it becomes impossible to detect moisture or oil thereafter. In the technique disclosed in Patent Document 1, a protective layer having fine holes is attached to the entire surface of the base layer on which the conductive lines are formed. By attaching the protective layer to the entire surface of the base material on which the conductive wiring is formed in this way, oil is allowed to flow onto the base layer through the fine holes, and the conductive wiring is protected from physical external forces. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-525380 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the structure disclosed in Patent Document 1 allows moisture and oil to flow onto the base substrate through minute holes provided in the protective layer, which poses the problem that precise alignment between the minute holes and the conductive wiring is required when attaching the protective layer to the base substrate, making the work complicated.

[0006] The present invention has been made in consideration of the problems associated with the conventional technology as described above, and aims to provide a wiring sheet and a manufacturing method thereof that can accurately detect moisture without complicating operations while protecting the conductive wiring formed on a base substrate. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention provides A base material; A covering sheet laminated on one surface of the base substrate; Two conductive wirings formed at an interval from each other on the one surface of the base material; An adhesive layer is provided between the base substrate and the covering sheet in an island shape, The covering sheet is a wiring sheet that is disposed on the one surface of the base substrate so as to cover the two conductive wires and is attached to the base substrate by the adhesive layer.

[0008] In the present invention configured as described above, the two conductive wires formed on the base substrate are protected from scratches and the like caused by external influences by being covered with the covering sheet. In addition, although the covering sheet is attached to the base substrate by an adhesive layer, the adhesive layer is provided in an island shape between the base substrate and the covering sheet, so that when moisture penetrates, the two conductive wires can be easily made conductive by the moisture that has penetrated. This makes it possible to detect moisture with high accuracy without the need for precise alignment between the base substrate and the covering sheet.

[0009] The covering sheet may be divided into two regions, one covering one of the two conductive wires and the other covering the other conductive wire, which makes it easier for moisture to enter between the two conductive wires.

[0010] The base substrate and the cover sheet may be formed from a single sheet, which is a simpler structure.

[0011] The method for producing the wiring sheet includes the steps of: forming the two conductive wires on the one sheet; providing the adhesive layer in an island shape in each of the outer regions between the two conductive wirings on the surface of the one sheet on which the conductive wirings are formed; folding the single sheet so that the area of ​​the single sheet that does not have the conductive wiring covers the conductive wiring; The method may further include a step of folding the single sheet to bond opposing regions to each other with the adhesive layer.

[0012] By manufacturing the wiring sheet in this manner, it is possible to easily realize a configuration in which two conductive wires formed on a base substrate are covered and protected by a cover sheet. Effect of the Invention

[0013] According to the present invention, the two conductive wires formed on the base substrate are protected from scratches and the like caused by external influences by the covering sheet, but the covering sheet is attached to the base substrate by an adhesive layer provided in an island shape between the base substrate and the covering sheet, so that the two conductive wires can easily become conductive when moisture penetrates. Therefore, while protecting the conductive wires formed on the base substrate, moisture can be accurately detected without complicating the operation.

[0014] Furthermore, when the covering sheet is divided into two, with an area covering one of the two conductive wirings and an area covering the other conductive wiring, moisture is likely to penetrate between the two conductive wirings.

[0015] Furthermore, when the base material and the covering sheet are formed from a single sheet, the structure is simplified. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 shows a first embodiment of a wiring sheet of the present invention, in which (a) is a diagram showing the surface configuration, (b) is an AA cross-sectional view shown in (a), (c) is a diagram showing the internal configuration, and (d) is a diagram showing the sheet when opened. [Diagram 2] 2 is a diagram showing an example of a detection system using the wiring sheet shown in FIG. 1. [Diagram 3] 2 is a diagram for explaining a method of connecting the conductive wiring of the wiring sheet shown in FIG. 1 to a connector. FIG. [Figure 4] 2 is a diagram showing a state when a water leak is detected by the wiring sheet shown in FIG. 1. FIG. [Diagram 5] 2A to 2C are diagrams illustrating a method for manufacturing the wiring sheet shown in FIG. [Figure 6] 5A and 5B are diagrams showing a second embodiment of the wiring sheet of the present invention, where (a) is a diagram showing the surface configuration, (b) is a cross-sectional view taken along line AA of (a), and (c) is a diagram showing the internal configuration. [Figure 7] 11A and 11B are diagrams showing a third embodiment of the wiring sheet of the present invention, in which (a) is a diagram showing the surface configuration, (b) is an AA cross-sectional view shown in (a), (c) is a diagram showing the internal configuration, and (d) is a diagram showing the sheet when opened. [Figure 8] 10A and 10B are diagrams showing a fourth embodiment of the wiring sheet of the present invention, in which (a) is a diagram showing the surface configuration, (b) is a cross-sectional view taken along line AA shown in (a), and (c) is a diagram showing the internal configuration. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0018] (First embodiment) <Wiring sheet configuration> FIG. 1 shows a first embodiment of the wiring sheet of the present invention, where (a) is a diagram showing the surface configuration, (b) is an AA cross-sectional view shown in (a), (c) is a diagram showing the internal configuration, and (d) is a diagram showing the sheet 1 when opened.

[0019] As shown in FIG. 1, this embodiment is a wiring sheet 10 having one sheet 1, two conductive wires 12a and 12b, and an adhesive layer 17.

[0020] The sheet 1 is made of an insulating material such as a film, and has a long rectangular shape. The sheet 1 is preferably water resistant. The sheet 1 has one base substrate part 11 and two covering sheet parts 14. The base substrate part 11 and the covering sheet part 14 are arranged in the short direction of the sheet 1 with a folding line 15 interposed between the two covering sheet parts 14. The base substrate part 11 is an example of a base substrate in the present invention, and the covering sheet part 14 is an example of a covering sheet in the present invention.

[0021] Two conductive wirings 12a, 12b are formed on one surface of the sheet 1, and an adhesive layer 17 is laminated by applying an adhesive. The conductive wirings 12a, 12b are formed extending parallel to each other in the longitudinal direction of the sheet 1 in a region that will become the base substrate portion 11 of the sheet 1. The adhesive layer 17 constitutes an example of an adhesive layer in the present invention, and is laminated in an island shape along both end edges extending in the longitudinal direction of the sheet 1 in a region that will become the covering sheet portion 14 of the sheet 1.

[0022] Then, the sheet 1 is folded along the fold line 15 so that the surface on which the conductive wirings 12a, 12b of the sheet 1 are formed and the adhesive layer 17 is laminated is on the inside, and the base substrate portion 11 and the covering sheet portion 14 are laminated and attached by the adhesive layer 17. At this time, the fold line 15 is provided at a position such that when the sheet 1 is folded along the fold line 15, the conductive wirings 12a, 12b are covered by the covering sheet portion 14, and the region between the conductive wirings 12a, 12b of the base substrate portion 11 is exposed without being covered by the covering sheet portion 14. Moreover, the conductive wirings 12a, 12b are formed in a region such that the adhesive layer 17 is located between the conductive wirings 12a, 12b when the sheet 1 is folded along the fold line 15.

[0023] As a result, in the wiring sheet 10 in this embodiment, two conductive wirings 12a, 12b are formed on one surface of the base substrate portion 11, and a covering sheet portion 14 is disposed to cover the conductive wirings 12a, 12b. The covering sheet portion 14 is attached to the base substrate portion 11 by an adhesive layer 17 laminated in an island shape between the two conductive wirings 12a, 12b. At this time, the region of the base substrate portion 11 between the conductive wirings 12a, 12b is exposed without being covered by the covering sheet portion 14.

[0024] Usage of the wiring sheet 10 Wiring sheet 10 configured as described above can be used to detect water leakage in, for example, pipes.

[0025] Fig. 2 is a diagram showing an example of a detection system using wiring sheet 10 shown in Fig. 1. Fig. 3 is a diagram for explaining a method of connecting conductive wiring 12a, 12b of wiring sheet 10 shown in Fig. 1 to connector 20.

[0026] When the wiring sheet 10 shown in Fig. 1 is used to detect water leakage as described below, a connector 20 is attached to one end in the longitudinal direction of the wiring sheet 10 as shown in Fig. 2. At this time, since the conductive wires 12a, 12b are covered with the covering sheet portion 14, the conductive wires 12a, 12b cannot be connected to the connector 20 in this state. Therefore, as shown in Fig. 3(a), first, an area (A in the figure) that matches the shape of the connector 20 is cut from the end of the fold line 15 that is connected to the connector 20 with a cutter, scissors, or the like.

[0027] 3(b), the region of the covering sheet portion 14 where the fold line 15 is cut is peeled off from the base substrate portion 11 and rolled up. At this time, although the covering sheet portion 14 is attached to the base substrate portion 11 by the adhesive layer 17, the adhesive layer 17 is provided in an island shape, so that the covering sheet portion 14 can be peeled off from the base substrate portion 11.

[0028] Then, the conductive wirings 12a and 12b are exposed, and the conductive wirings 12a and 12b can be connected to the connector 20.

[0029] In this manner, the conductive wires 12a, 12b can be exposed to match the shape of the connector 20 and connected to the connector 20.

[0030] The connector 20 has two connection terminals (not shown) provided therein, and when the connector 20 is attached to the wiring sheet 10 with the conductive wires 12a, 12b exposed, the connection terminals of the connector 20 are electrically connected to the conductive wires 12a, 12b. The connection terminals of the connector 20 are also electrically connected to the lead wires 40a, 40b connected to the RFID tag 30. As a result, by attaching the connector 20 to the wiring sheet 10, the conductive wires 12a, 12b of the wiring sheet 10 are electrically connected to the RFID tag 30 via the connector 20 and the lead wires 40a, 40b.

[0031] The wiring sheet 10 in which the conductive wires 12a, 12b are electrically connected to the RFID tag 30 via the connector 20 and the lead wires 40a, 40b is attached to a pipe, and the conduction state between the two conductive wires 12a, 12b is inspected. Specifically, power is supplied to the RFID tag 30 from an inspection device 50 capable of non-contact communication with the RFID tag 30, and a current is supplied from the RFID tag 30 to the conductive wires 12a, 12b via the lead wires 40a, 40b and the connector 20 to detect the resistance value. At this time, the conductive wires 12a, 12b are protected from scratches due to external influences by being covered with the covering sheet portion 14.

[0032] FIG. 4 is a diagram showing a state when water leakage is detected in wiring sheet 10 shown in FIG.

[0033] When water leakage occurs in the pipe to which the wiring sheet 10 is attached, as shown in FIG. 4, water 2 due to the water leakage is pasted between the base substrate 11 and the covering sheet 14 from the region where the base substrate 11 is exposed, and the conductive wirings 12a and 12b are electrically connected by the water 2. As a result, when a current is supplied from the inspection device 50 to the conductive wirings 12a and 12b via the RFID tag 30, a current flows through the conductive wirings 12a and 12b, and a certain resistance value is detected by the inspection device 50 via the RFID tag 30. Here, the conductive wirings 12a and 12b are covered by the covering sheet 14, and the base substrate 11 and the covering sheet 14 are attached between the conductive wirings 12a and 12b by the adhesive layer 17. However, since the adhesive layer 17 is provided in an island shape, the water 2 attached to the wiring sheet 10 enters the region between the island-shaped adhesive layer 17, and electrically connects the conductive wirings 12a and 12b. Furthermore, although the conductive wirings 12a, 12b are covered by the covering sheet portion 14, there is an area where the base substrate portion 11 is exposed between the conductive wirings 12a, 12b. That is, the covering sheet portion 14 is divided into an area covering the conductive wiring 12a and an area covering the conductive wiring 12b. For this reason, water 2 is likely to enter between the two conductive wirings 12a, 12b between the base substrate portion 11 and the covering sheet portion 14 from the area where the base substrate portion 11 is exposed.

[0034] On the other hand, when no water leakage occurs in the piping, there is no electrical continuity between the two conductive wires 12a, 12b, so even if a current is supplied from the inspection device 50 to the conductive wires 12a, 12b via the RFID tag 30, no current flows through the conductive wires 12a, 12b, and the resistance value detected by the inspection device 50 via the RFID tag 30 becomes almost infinite.

[0035] In the inspection device 50, based on the resistance value detected in this manner via the RFID tag 30, it is determined whether or not a water leak has occurred in the piping.

[0036] Thus, in this embodiment, the two conductive wirings 12a, 12b formed on the base substrate 11 are protected from scratches and the like due to external influences by the covering sheet 14, while the covering sheet 14 is attached to the base substrate 11 by the adhesive layer 17 provided in an island shape between the two conductive wirings 12a, 12b. This allows the two conductive wirings 12a, 12b to be easily conductive by the water 2 that has entered, and while protecting the conductive wirings 12a, 12b formed on the base substrate 11, moisture can be detected accurately without complicating the work.

[0037] Furthermore, the water 2 that has entered between the base substrate portion 11 and the covering sheet portion 14 accumulates at the location where the sheet 1 is folded by the fold line 15, and after the water leakage is detected as described above, the location where the water leakage has occurred can be visually confirmed.

[0038] Furthermore, water 2 adhering to wiring sheet 10 remains on base substrate portion 11. This eliminates the need to provide a receiving member for retaining moisture due to water leakage from objects suspended in air, such as pipes.

[0039] Furthermore, even when detecting leakage of a highly volatile organic solvent, the organic solvent penetrates between the base substrate portion 11 and the covering sheet portion 14, and particularly accumulates at the portion where the sheet 1 is folded by the fold line 15, making it difficult to volatilize, and thus preventing a decrease in detection accuracy.

[0040] 1 is not limited to detecting water 2 as described above, but also includes detecting other liquids that can conduct electricity, such as chemicals containing ions, such as hydrochloric acid and sodium hydroxide. Even in this case, the two conductive wires 12a and 12b are not electrically connected when no liquid is attached, and become electrically conductive via the liquid when the liquid is attached.

[0041] In addition, the wiring sheet 10 shown in FIG. 1 can be used not only to detect water leakage as described above, but also to detect leakage of chemicals such as oil and organic solvents. When detecting leakage of chemicals such as oil and organic solvents, the leakage of chemicals such as oil and organic solvents is detected by detecting that the conductive wirings 12a and 12b are disconnected by the leaked oil or organic solvent. Therefore, when using the detection system shown in FIG. 2, the conductive wirings 12a and 12b are electrically connected on the opposite side of the connector 20. Then, when a current is supplied from the inspection device 50 to the conductive wirings 12a and 12b via the RFID tag 30 in a state where no leakage of chemicals such as oil or organic solvents occurs, a current flows through the conductive wirings 12a and 12b, and a certain resistance value is detected by the inspection device 50 via the RFID tag 30. On the other hand, in a state where a leakage of a chemical such as oil or an organic solvent occurs, the conductive wires 12a and 12b are disconnected by the leaked oil or organic solvent, so that even if a current is supplied from the inspection device 50 to the conductive wires 12a and 12b via the RFID tag 30, no current flows through the conductive wires 12a and 12b, and as a result, the resistance value detected by the inspection device 50 via the RFID tag 30 becomes almost infinite. In the inspection device 50, it is determined whether or not a leakage of a chemical such as oil or an organic solvent occurs based on the resistance value detected through the RFID tag 30 in this manner. Note that the liquid for electrically connecting the two conductive wires 12a and 12b in this manner and then detecting the occurrence of a leakage by disconnecting the conductive wires 12a and 12b is not limited to a chemical such as oil or an organic solvent, and may be any liquid that does not conduct electricity and disconnects the conductive wires 12a and 12b when attached to the conductive wires 12a and 12b.

[0042] In the present embodiment, the RFID tag 30 detects the resistance value between the conductive wires 12a, 12b, and for example, transmits flag information corresponding to this resistance value to the inspection device 50 to determine the conduction state between the conductive wires 12a, 12b. However, the means for wirelessly transmitting the resistance value between the conductive wires 12a, 12b is not limited to using the RFID tag 30, and for example, a wireless system using Wi-Fi, Bluetooth, or LPWA may be used.

[0043] <Method of Manufacturing Interconnect Sheet 10> A method for producing the above-described wiring sheet 10 will now be described.

[0044] Fig. 5 is a diagram for explaining a method for manufacturing wiring sheet 10 shown in Fig. 1. Note that Fig. 5(c) shows the internal configuration for ease of understanding.

[0045] 5(a), two conductive wires 12a, 12b are formed on one surface of a single sheet 1. At this time, the conductive wires 12a, 12b are formed in a region that will become the base substrate portion 11 of the sheet 1 so as to be parallel to each other in the longitudinal direction of the sheet 1 with a gap therebetween.

[0046] 5(b), an adhesive is applied to the surface of the sheet 1 on which the conductive wirings 12a, 12b are formed, thereby laminating an adhesive layer 17. At this time, the adhesive layer 17 is laminated in an island shape along both end edges extending in the longitudinal direction of the sheet 1 in the region that will become the covering sheet portion 14 of the sheet 1. As a result, the adhesive layer 17 is provided in an island shape in each of the outer regions between the two conductive wirings 12a, 12b on the surface of the sheet 1 on which the conductive wirings 12a, 12b are formed.

[0047] Next, as shown in FIG. 5(c), the sheet 1 is folded along the fold line 15 so that the surface of the sheet 1 on which the conductive wirings 12a and 12b are formed and the adhesive layer 17 is laminated faces the inside. This causes the base substrate 11 and the covering sheet 14 to face each other. At this time, the fold line 15 is provided at a position such that when the sheet 1 is folded along the fold line 15, the conductive wirings 12a and 12b are covered by the covering sheet 14, and the region between the conductive wirings 12a and 12b of the base substrate 11 is exposed without being covered by the covering sheet 14. Therefore, when the sheet 1 is folded along the fold line 15, the conductive wirings 12a and 12b are covered by the covering sheet 14, but the region between the conductive wirings 12a and 12b of the base substrate 11 is exposed without being covered by the covering sheet 14.

[0048] As a result, the conductive wires 12a, 12b are covered by the areas of the sheet 1 where the conductive wires 12a, 12b are not formed.

[0049] Thereafter, the sheet 1 is folded to adhere the opposing base substrate portion 11 and covering sheet portion 14 to each other via the adhesive layer 17. At this time, the conductive wirings 12a, 12b are formed in an area such that the adhesive layer 17 is located between the conductive wirings 12a, 12b when the sheet 1 is folded along the fold line 15. Therefore, when the sheet 1 is folded along the fold line 15, the base substrate portion 11 and covering sheet portion 14 are adhered to each other by the adhesive layer 17 between the conductive wirings 12a, 12b.

[0050] In this embodiment, the base substrate portion 11 on which the conductive wires 12a, 12b are formed and the covering sheet portion 14 covering the conductive wires 12a, 12b are formed from a single sheet 1. This allows the configuration to be simplified, and a configuration for covering and protecting the two conductive wires 12a, 12b can be easily realized.

[0051] Second embodiment FIG. 6 is a diagram showing a second embodiment of the wiring sheet of the present invention, where (a) is a diagram showing the surface configuration, (b) is a cross-sectional view taken along line AA of (a), and (c) is a diagram showing the internal configuration.

[0052] As shown in FIG. 6, this embodiment is wiring sheet 110 which differs from that shown in FIG. 1 in that base substrate 111 and covering sheets 114a and 114b are separate bodies.

[0053] Two conductive wirings 12a, 12b are formed on one surface of the base substrate 111, similar to that shown in Fig. 1. Moreover, the covering sheets 114a, 114b are laminated on the surface of the base substrate 111 on which the conductive wirings 12a, 12b are formed, and are attached to the base substrate 111 by an adhesive layer 17. As a result, the conductive wiring 12a is covered by the covering sheet 114a, and the conductive wiring 12b is covered by the covering sheet 114b. Moreover, the covering sheets 114a, 114b are arranged at a distance from each other, so that the base substrate 111 is exposed between the covering sheets 114a, 114b.

[0054] The wiring sheet 110 thus configured can also detect water leakage by attaching it to a pipe or the like, similarly to the one shown in FIG. 1. In this case, the two conductive wirings 12a, 12b formed on the base material 111 are covered with the covering sheets 114a, 114b, so that they can be protected from scratches caused by the external environment. The covering sheets 114a, 114b are also attached to the base material 111 by an adhesive layer 17 provided in an island shape between the two conductive wirings 12a, 12b. This allows the two conductive wirings 12a, 12b to be easily conductive due to the moisture that has entered, and while protecting the conductive wirings 12a, 12b formed on the base material 111, moisture can be detected accurately without complicating the work.

[0055] In this embodiment, the adhesive layer 17 is provided between the two conductive wirings 12a, 12b. However, as long as the adhesive layer 17 is provided in an island shape between the base substrate 111 and the covering sheets 114a, 114b, the same effect can be obtained even if the adhesive layer 17 is provided outside the two conductive wirings 12a, 12b.

[0056] (Third embodiment) FIG. 7 is a diagram showing a third embodiment of the wiring sheet of the present invention, in which (a) is a diagram showing the surface configuration, (b) is an AA cross-sectional view shown in (a), (c) is a diagram showing the internal configuration, and (d) is a diagram showing the sheet 1 when opened.

[0057] As shown in FIG. 7, this embodiment is a wiring sheet 210 in which conductive wires 212a, 212b have different shapes from that shown in FIG.

[0058] In this embodiment, the conductive wirings 212a, 212b have a width that allows them to overlap with the adhesive layer 17 when the sheet 1 is folded along the fold line 15. Therefore, when the sheet 1 is folded along the fold line 15, the adhesive layer 17 overlaps the regions of the conductive wirings 212a, 212b that are along the opposing ends. In the present invention, including such a state, the adhesive layer 17 is defined as being provided in an island shape between the two conductive wirings 212a, 212b.

[0059] The wiring sheet 210 thus configured can also detect water leakage by attaching it to a pipe or the like, similarly to the one shown in FIG. 1. In this case, too, the two conductive wirings 212a, 212b formed on the base substrate 11 can be protected from scratches and the like caused by the external environment by being covered with the covering sheet 14. In addition, the covering sheet 14 is attached to the base substrate 11 by an adhesive layer 17 provided in an island shape between the two conductive wirings 212a, 212b. This allows the two conductive wirings 212a, 212b to be easily conductive due to the moisture that has entered, and while protecting the conductive wirings 212a, 212b formed on the base substrate 11, moisture can be detected accurately without complicating the work.

[0060] (Fourth embodiment) FIG. 8 is a diagram showing a fourth embodiment of the wiring sheet of the present invention, where (a) is a diagram showing the surface configuration, (b) is an AA cross-sectional view shown in (a), and (c) is a diagram showing the internal configuration.

[0061] As shown in FIG. 8, this embodiment is wiring sheet 310 which is different from that shown in FIG. 6 in the shape of cover sheet 314 and the position where adhesive layer 317 is laminated.

[0062] In the present embodiment, the covering sheet 314 has a single sheet shape in which the area covering the conductive wiring 12a and the area covering the conductive wiring 12b are formed, and therefore the base material 111 is not exposed between the two conductive wirings 12a, 12b. In addition, the adhesive layer 317 is laminated in an island shape between the two conductive wirings 12a, 12b so as to be aligned in parallel to the conductive wirings 12a, 12b.

[0063] The wiring sheet 310 thus configured can also detect water leakage by attaching it to a pipe or the like, similarly to the one shown in Fig. 1. In this case, moisture adhering to the wiring sheet 310 will penetrate between the base substrate 111 and the covering sheet 314 from an end edge extending in the longitudinal direction of the wiring sheet 310. Then, the moisture that has penetrated adheres to one of the conductive wires 12a, 12b, and then adheres to the other of the conductive wires 12a, 12b through the island-shaped adhesive layer 317, since the adhesive layer 317 is laminated between the conductive wires 12a, 12b but is island-shaped. As a result, the two conductive wires 12a, 12b are electrically connected via the moisture.

[0064] In this manner, in this embodiment too, the two conductive wirings 12a, 12b can easily become conductive due to the infiltration of moisture, and moisture can be detected accurately without complicating the operation while protecting the conductive wirings 12a, 12b formed on the base material 111. [Explanation of symbols]

[0065] 1 sheet 2 water 10,110,210,310 Wiring sheet 11 Base substrate section 12a,12b,212a,212b Conductive wiring 14 Covering sheet section 15 Fold lines 17,317 Adhesive layer 20 Connector 30 RFID tags 40a, 40b Lead wire 50 Inspection Equipment 111 Base material 114a, 114b, 314 Covering sheet

Claims

1. A base material; A covering sheet laminated on one surface of the base substrate; Two conductive wires formed at an interval from each other on the one surface of the base material; An adhesive layer is provided between the base substrate and the covering sheet in an island shape, The covering sheet is disposed on the one surface of the base substrate so as to cover the two conductive wirings, and is attached to the base substrate by the adhesive layer, forming a wiring sheet.

2. The wiring sheet according to claim 1 , The covering sheet is divided into two regions, one covering one of the two conductive wirings and the other covering the other conductive wiring.

3. The wiring sheet according to claim 1 , The wiring sheet, wherein the base material and the covering sheet are formed from a single sheet.

4. A method for producing the wiring sheet according to claim 3, comprising the steps of: forming the two conductive traces on the one sheet; providing the adhesive layer in an island shape in each of the outer regions between the two conductive wirings on the surface of the one sheet on which the conductive wirings are formed; folding the single sheet so that the area of ​​the single sheet that does not have the conductive traces covers the conductive traces; and folding the single sheet to bond opposing areas together with the adhesive layer.

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