Adjustment method

Abstract

To provide a new adjustment method capable of adjusting the angle between a mounting surface and a holding surface with high precision.SOLUTION: An adjustment method used to adjust the angle between a mounting surface and a holding surface of an apparatus that overlaps a first member and a second member and applies a pressure by bringing a mounting portion having a mounting surface on which a first member is placed and a holding portion having a holding surface facing the mounting surface and on which a second member is held, closer together, includes a measurement preparation step of holding a first surface side of a length measurement reference object having a first surface and a second surface facing the opposite side to the first surface on the holding surface of the holding portion, a measurement step of locating a measuring instrument on the mounting surface side of the length measurement reference object held on the holding surface and measuring the distance between the first surface or the second surface of the length measurement reference object and the mounting surface, or a distance equivalent thereto, at the plurality of positions on the mounting surface, and an adjustment step of adjusting the angle between the mounting surface and the holding surface so as to approach zero on the basis of the distances measured at the plurality of positions.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for adjusting the angle between a placement surface on which one member is placed and a holding surface on which the other member is held in an apparatus for overlapping two members and applying pressure thereto. [Background technology]

[0002] Semiconductor wafers used in the manufacture of semiconductor devices are generally produced by cutting cylindrical semiconductor ingots with a wire saw, etc. Due to this manufacturing method, in the state called as-sliced ​​wafers immediately after being cut from the semiconductor ingot, the semiconductor wafers may be warped or the cut surface of the semiconductor wafer may be wavy.

[0003] Therefore, a semiconductor wafer cut from a semiconductor ingot is planarized by a method such as grinding before semiconductor devices are formed on or inside the surface of the semiconductor wafer. When grinding the semiconductor wafer, a liquid resin is supplied to the entire surface of the semiconductor wafer opposite to the surface to be ground, and then hardened to form a protective member for protecting the semiconductor wafer (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2023-127753 A Summary of the Invention [Problem to be solved by the invention]

[0005] A protective member forming device for forming a protective member has, for example, a mounting section on which a resin film is placed on an upper mounting surface, and a holding section disposed above the mounting section and holding a semiconductor wafer by the suction force of negative pressure acting on a lower holding surface. When liquid resin is supplied to the upper surface of the film placed on the mounting section and the holding section holding the semiconductor wafer is lowered, the film and the semiconductor wafer overlap, applying pressure to the liquid resin, and spreading the liquid resin. When the spread liquid resin is cured, the protective member is completed.

[0006] However, if the holding surface of the holding part is significantly inclined relative to the mounting surface of the mounting part of the protective member forming apparatus, the semiconductor wafer is fixed in a significantly inclined state relative to the film, which is likely to cause problems when grinding the semiconductor wafer. Specifically, if the semiconductor wafer is significantly inclined relative to the film, the amount of semiconductor wafer removed by grinding must be increased in order to achieve the target flatness of the semiconductor wafer. In some cases, it may even be impossible to achieve the target flatness of the semiconductor wafer.

[0007] Therefore, before the protective member forming device is shipped, for example, a measuring device is placed at multiple positions on the mounting surface, and the distance to the holding surface is measured at multiple positions on the mounting surface to confirm the inclination of the holding surface relative to the mounting surface. If the inclination of the holding surface relative to the mounting surface is large, the inclination of the holding surface relative to the mounting surface is then adjusted so that the angle between the mounting surface and the holding surface becomes sufficiently small.

[0008] However, with this method, the measuring device may not be able to measure the distance to the holding surface with sufficient accuracy due to the shape of the holding surface, etc. Therefore, up until now, it has not always been possible to adjust the angle between the placement surface and the holding surface with sufficiently high accuracy.

[0009] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a new adjustment method capable of adjusting the angle between the placement surface and the holding surface with high accuracy. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided an adjustment method used to adjust the angle between a mounting surface and a holding surface of an apparatus that overlaps a first member and a second member and applies pressure by bringing a mounting section having a mounting surface on which a first member is placed and a holding section having a holding surface facing the mounting surface and on which a second member is held, the adjustment method including a measurement preparation step of holding a first surface side of a length measurement reference object having a first surface and a second surface facing the opposite side to the first surface on the holding surface of the holding section, a measurement step of placing a measuring instrument on the mounting surface side of the length measurement reference object held on the holding surface and measuring the distance between the first surface or the second surface of the length measurement reference object and the mounting surface, or a distance equivalent thereto, at a plurality of positions on the mounting surface, and an adjustment step of adjusting the angle between the mounting surface and the holding surface to approach zero based on the distances measured at the plurality of positions.

[0011] In one aspect of the present invention, for example, the porosity of the measurement reference object is lower than the porosity of the holding portion. Also, a laser measurement device can be used as the measurement device. In this case, the measurement reference object may be made of a material that transmits a laser beam emitted by the laser measurement device. Also, a contact type measurement device can be used as the measurement device. The holding surface is made of, for example, porous ceramics. Effect of the Invention

[0012] In an adjustment method according to one aspect of the present invention, the first surface side of a measurement reference object having a first surface and a second surface is held on the holding surface of the holding part, and then the distance between the first surface or the second surface of this measurement reference object and the mounting surface of the mounting part, or a distance equivalent thereto, is measured from the mounting surface side by a measuring device, so that the accuracy of the distance measurement is mainly affected by the measurement reference object and is less likely to be affected by the shape of the holding surface, etc. Therefore, according to the adjustment method according to one aspect of the present invention, by using an appropriate measurement reference object, the angle between the mounting surface and the holding surface can be adjusted with high accuracy. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a protective member forming apparatus. [Diagram 2] FIG. 2 is a cross-sectional view that illustrates a first state of the protective member forming apparatus. [Diagram 3] FIG. 3 is a cross-sectional view illustrating the protective member forming apparatus in a second state. [Figure 4] FIG. 4 is a flow chart of the adjustment method. [Diagram 5] FIG. 5 is a cross-sectional view that illustrates a state in which a length measurement reference object is held on the lower surface of a holding plate. [Figure 6] FIG. 6 is a cross-sectional view that illustrates a state in which a distance is being measured by a measuring device. [Figure 7] FIG. 7 is a cross-sectional view that illustrates a state in which a distance is being measured by a measuring device according to the second embodiment. [Figure 8] FIG. 8 is a cross-sectional view that illustrates a state in which a distance is being measured by a measuring device according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a cross-sectional view showing a protective member forming apparatus 2, which is an example of an apparatus in which an adjustment method according to this embodiment is adopted. In Fig. 1, some elements of the protective member forming apparatus 2 are expressed by functional blocks. In addition, the X-axis, Y-axis, and Z-axis used in the following description are perpendicular to each other.

[0015] 1, the protective member forming apparatus 2 includes a base 4 that supports various elements that constitute the protective member forming apparatus 2. A concave storage section 4b that opens to an upper surface 4a of the base 4 is formed in the center of the base 4. A plurality of support members 6 configured, for example, in a rectangular parallelepiped shape are arranged in the bottom of the storage section 4b, and the lower end of a cylindrical support structure 8 is fixed to the upper end of each support member 6.

[0016] A table 10 on which a resin film (first member) 21 (see FIG. 2) that is to be a part of the protective member is placed is disposed at the upper end of the support structure 8. The table 10 includes an annular frame 12 having a circular opening in the center, a disk-shaped mounting plate (mounting portion) 14 that is placed in the hole of the frame 12, and a fastener 16 that fastens the mounting plate 14 to the frame 12 by pressing the outer edge of the mounting plate 14 from above.

[0017] The mounting plate 14 is made of a material such as quartz glass that transmits light (ultraviolet light) having a predetermined wavelength in the ultraviolet range, and has a generally flat upper surface (mounting surface) 14a that is generally parallel to the X-axis and Y-axis. The film 21 is placed on this upper surface 14a. The upper end of the table 10 including the upper surface 14a of the mounting plate 14 is located higher than the upper surface 4a of the base 4.

[0018] A resin supply mechanism (not shown) including a nozzle is disposed on the side of (outside) the base 4. When the film 21 is placed on the upper surface 14a of the mounting plate 14, the nozzle moves above the table 10 and supplies, onto the upper surface of the film 21, a liquid resin (ultraviolet-curable resin) 31 (see FIG. 2) that has the property of being cured when irradiated with light having a predetermined wavelength in the ultraviolet range.

[0019] Typically, the fixture 16 is configured so that the height of its upper surface is equal to the height of the upper surface 14a of the mounting plate 14, but the height of the upper surface may be configured so that it is higher than the height of the upper surface 14a of the mounting plate 14. In this case, the possibility that the liquid resin 31 will leak out of the table 10 is reduced.

[0020] A light irradiation unit 18 is disposed in a region below the table 10 inside the support structure 8 for irradiating the liquid resin 31 supplied to the upper surface of the film 21 with light having an ultraviolet wavelength. The light irradiation unit 18 includes a support leg 20 disposed at the bottom of the storage section 4b and a light source (UV lamp) 22 supported on the upper end of the support leg 20.

[0021] Light source 22 is configured to emit light of a predetermined wavelength capable of curing liquid resin 31 supplied to the upper surface of film 21. Light source 22 is also configured to irradiate light onto a wide range of film 21 placed on upper surface 14a of mounting plate 14, typically the entire film 21.

[0022] A plurality of (typically, two sets of) lifting mechanisms 24 are disposed at the end located on the side of the base 4. Each lifting mechanism 24 includes a guide pillar 26 that is fixed to the base 4 and is long along the Z axis. A common moving part 28 is attached to each guide pillar 26 in such a manner that it can slide along each guide pillar 26, i.e., along the Z axis.

[0023] Nut units 30 constituting a ball screw are provided at positions adjacent to each guide pillar 26 of the moving unit 28. A long screw shaft 32 is connected to each nut unit 30 in a manner that allows it to rotate along the Z axis. A motor (not shown) is connected to the end of each screw shaft 32 as a rotation drive source.

[0024] When the screw shaft 32 is rotated by this motor, the moving part 28 moves together with the nut part 30 along the guide pillar 26, i.e., along the Z axis. Note that both ends of each screw shaft 32 are supported by bearings 34 or the like whose positions are fixed relative to the base 4, and the height of the screw shaft 32 relative to the base 4 does not change even when the screw shaft 32 is rotated.

[0025] An annular support plate 38 is connected to the underside of the moving part 28 via an angle adjustment mechanism 36. The angle adjustment mechanism 36 typically includes two sets of adjustment connecting parts 36a, which are formed of bolts or the like and have the function of adjusting the distance between the moving part 28 and the support plate 38, and one set of connecting parts 36b that do not have the function of adjusting the distance.

[0026] The two sets of adjustable connecting parts 36a adjust the distance between the moving part 28 and the support plate 38 at two points, thereby freely adjusting the inclination (angle) of the support plate 38 relative to the moving part 28. The two sets of adjustable connecting parts 36a and the one set of connecting parts 36b are disposed, for example, at approximately equal intervals (approximately equal angular intervals).

[0027] A holding unit 42 that holds the wafer (second member) 11 is connected to the underside of the support plate 38 via a plurality of load sensors 40. Each load sensor 40 is formed of, for example, a piezoelectric element, and measures the magnitude of the upward force (load) acting on the holding unit 42 from the table 10 when the holding unit 42 is lowered together with the moving part 28 by each lifting mechanism 24.

[0028] The holding unit 42 includes, for example, a disk-shaped frame 44. A recess 44a having a circular opening at the bottom end is formed on the lower surface side of the frame 44. A porous disk-shaped holding plate (holding portion) 46 made of, for example, ceramics and having air permeability is fixed to the recess 44a. A lower surface (holding surface) 46a of the holding plate 46 faces the upper surface 14a of the mounting plate 14.

[0029] The upper surface side of the holding plate 46 is connected to a suction source (not shown) via a pipe (not shown) or a valve (not shown) connected to the frame 44. For example, when the valve is opened while the suction source is activated, a negative pressure generated by the suction source acts on the lower surface 46a side of the holding plate 46.

[0030] Therefore, when the valve is opened with the wafer 11 in contact with the lower surface 46a of the holding plate 46, the wafer 11 is held on the lower surface 46a of the holding plate 46 by suction force caused by the negative pressure generated by the suction source. As the suction source, for example, a vacuum pump combining an air supply source and an ejector is used.

[0031] A controller (control unit) 48 is connected to elements such as the resin supply mechanism, the light source 22 of the light irradiation unit 18, the motor of the lifting mechanism, and the valve of the holding unit 42. This controller 48 is configured by a computer including, for example, a processing device and a storage device, and controls the operation of each element of the protective member forming apparatus 2 described above so that an appropriate protective member is formed.

[0032] The processing device is typically a CPU (Central Processing Unit) and performs various processes required to control the above-mentioned elements. The storage device includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or a flash memory. The functions of this controller 48 are realized, for example, by the processing device operating in accordance with a program stored in the storage device.

[0033] Fig. 2 is a cross-sectional view that typically shows a first state of the protective member forming apparatus 2. When forming a protective member on the wafer 11, as shown in Fig. 2, first, the distance between the upper surface 14a and the lower surface 46a of the holding plate 46 that faces the upper surface 14a of the mounting plate 14 is adjusted by the lifting mechanism 24 so that the lower surface 46a is sufficiently separated from the upper surface 14a. Next, one surface (upper surface) of the wafer 11 is held by the lower surface 46a of the holding plate 46 provided in the holding unit 42.

[0034] Then, the film 21 is placed on the upper surface 14a of the mounting plate 14 so that one surface (lower surface) of the film 21 contacts the upper surface 14a of the mounting plate 14 included in the table 10. Thereafter, liquid resin 31 is supplied onto the other surface (upper surface) of the film 21 from a nozzle of the resin supply mechanism.

[0035] The wafer 11 is typically a semiconductor wafer called an as-sliced ​​wafer immediately after being sliced ​​from a cylindrical semiconductor ingot made of a semiconductor such as silicon. However, the wafer 11 does not necessarily have to be a semiconductor wafer immediately after being sliced ​​from a semiconductor ingot. For example, the wafer 11 may have a semiconductor device or the like formed thereon.

[0036] 3 is a cross-sectional view that typically shows a second state of the protective member forming apparatus 2. After the liquid resin 31 is supplied to the other surface of the film 21, the lifting mechanism 24 lowers the holding unit 42 so that the other surface (lower surface) of the wafer 11 approaches close enough to contact the liquid resin 31. In this manner, by bringing the upper surface 14a and the lower surface 46a sufficiently close to each other, the film 21 and the wafer 11 are stacked vertically, and pressure is applied to the liquid resin 31 between them, causing the liquid resin 31 to be spread out.

[0037] After the liquid resin 31 has been spread out, the light source 22 of the light irradiation unit 18 irradiates light with an ultraviolet wavelength toward the liquid resin 31. As a result, as shown in Fig. 3, the spread liquid resin 31 hardens, and a protective member 41 composed of the resin film 21 and the hardened resin 33 is completed.

[0038] In this embodiment, the liquid resin 31 is used, which has a property of being hardened when irradiated with light having a wavelength in the ultraviolet region, but a liquid resin (thermosetting resin) which has a property of being hardened when heat is applied may be used instead of the liquid resin 31. In this case, a heating unit including a heater or the like is used instead of the light irradiation unit 18 including the light source 22, and the mounting plate 14 does not necessarily have to be made of a material that transmits light.

[0039] However, if the lower surface 46a of the holding plate 46 is significantly inclined relative to the upper surface 14a of the mounting plate 14 included in the protective member forming apparatus 2, the wafer 11 will be fixed in a significantly inclined state relative to the film 21. Therefore, for example, before the protective member forming apparatus 2 is shipped, an adjustment is made so that the angle between the upper surface 14a and the lower surface 46a approaches zero (0°).

[0040] 4 is a flowchart of the adjustment method according to this embodiment. In the adjustment method of this embodiment, the inclination of the lower surface 46a relative to the upper surface 14a is confirmed by measuring a distance corresponding to the distance between the upper surface 14a of the mounting plate 14 and the lower surface 46a of the holding plate 46 at multiple positions, and the angle between the upper surface 14a and the lower surface 46a is adjusted based on this inclination.

[0041] As described above, the holding plate 46 is made of porous ceramics, and its lower surface 46a has many fine irregularities caused by the pores in the holding plate 46. Therefore, even if an attempt is made to measure the distance to the lower surface 46a with a measuring device, the measuring device is affected by the irregularities of the lower surface 46a and is unable to measure this distance with sufficiently high accuracy.

[0042] In the adjustment method of the present embodiment, as shown in Fig. 4, first, in preparation for measuring the distance, a measurement reference object to be the target of distance measurement is held by the lower surface 46a of the holding plate 46 instead of the lower surface 46a (measurement preparation step ST1). Fig. 5 is a cross-sectional view showing a state in which the measurement reference object 51 is held by the lower surface 46a of the holding plate 46.

[0043] The measurement reference object 51 is a plate-like member having a first surface 51a and a second surface 51b facing the opposite side to the first surface 51a, and is configured, for example, so that its porosity is lower than the porosity of the holding plate 46. In other words, the number of irregularities on the first surface 51a and the second surface 51b caused by the pores of the measurement reference object 51 is smaller than the number of irregularities on the lower surface 46a caused by the pores of the holding plate 46. The measurement reference object 51 is typically a wafer polished to a mirror surface (mirror wafer).

[0044] In this embodiment, the first surface 51a side of the measurement reference object 51 is held by the lower surface 46a of the holding plate 46. When the distance from the upper surface 14a of the mounting plate 14 to the second surface 51b (or the first surface 51a) of the measurement reference object 51 is measured in this state, the measurement result is significantly affected by the measurement reference object 51 but is unlikely to be affected by the shape of the lower surface 46a, etc.

[0045] Therefore, by using a measurement reference object 51 with a porosity lower than that of the holding plate 46 and measuring the distance from the upper surface 14a to the second surface 51b (or the first surface 51a), the accuracy of the distance measurement is improved compared to measuring the distance from the upper surface 14a to the lower surface 46a.

[0046] Here, the porosity of the holding plate 46 made of porous ceramics, in other words, the ratio of gaps per unit volume, is typically about 5%. Therefore, the porosity of the measurement reference object 51 is typically less than 5%. In order to sufficiently increase the accuracy of the distance measurement, the porosity of the measurement reference object 51 is preferably less than 3%, and more preferably less than 1%.

[0047] Furthermore, in order to sufficiently increase the accuracy of distance measurement, it is preferable that there is sufficiently small variation in the thickness of the measurement reference object 51. Specifically, for example, if the maximum height (Ry) of the first surface 51a and the second surface 51b as defined in JIS B 0601 is 0.5 μm or less, the variation in the thickness of the measurement reference object 51 is sufficiently small, and the accuracy of distance measurement is sufficiently high.

[0048] However, the first surface 51a and the second surface 51b of the length measurement reference object 51 do not necessarily have to be parallel. For example, if the angle between the first surface 51a and the second surface 51b is constant, the angle can be adjusted with sufficiently high accuracy even if the first surface 51a and the second surface 51b are not parallel. On the other hand, in order to realize a simple angle adjustment that does not require calculations or the like due to the angle between the first surface 51a and the second surface 51b, it is preferable that the first surface 51a and the second surface 51b are substantially parallel.

[0049] After the first surface 51a side of the measurement reference object 51 is held by the lower surface 46a of the holding plate 46, the distance (or a distance equivalent thereto) between the second surface 51b (or the first surface 51a) of the measurement reference object 51 and the upper surface 14a of the mounting plate 14 is measured at a plurality of positions on the upper surface 14a (measurement step ST2). Fig. 6 is a cross-sectional view that typically shows a state in which the distance is being measured by the measuring device 50.

[0050] Specifically, first, the measuring device 50 is placed at an arbitrary position on the upper surface 14a of the mounting plate 14, that is, at an arbitrary position on the upper surface 14a side of the length measurement reference object 51. There is no significant limitation on the specific position where the measuring device 50 is placed, but in this embodiment, in order to increase the accuracy of adjusting the angle between the upper surface 14a and the lower surface 46a, the measuring device 50 is placed at three positions close to the adjustment connector 36a and the connector 36b used for adjusting the angle. It is more preferable to place the measuring device 50 directly below the adjustment connector 36a and the connector 36b.

[0051] As the measuring device 50, for example, a laser length measuring device is used which has an emission part which emits a laser beam 61 of an infrared wavelength toward an object to be measured, and an incidence part into which the laser beam 61 reflected by the object is incident, and which measures the distance to the object based on the laser beam 61 incident on the incidence part. Note that the measuring device 50 may be connected to the controller 48 and operated under the control of the controller 48, or may not be connected to the controller 48 and may be operated in a manner independent of the controller 48.

[0052] 6, in this embodiment, the distance (or a distance equivalent thereto) between the second surface 51b and the top surface 14a of the measurement reference object 51 is measured based on the laser beam 61 reflected on the second surface 51b of the measurement reference object 51. However, when a measurement reference object 51 made of a material that transmits the laser beam 61 is used, the distance (or a distance equivalent thereto) between the first surface 51a and the top surface 14a of the measurement reference object 51 may be measured based on the laser beam 61 reflected on the first surface 51a of the measurement reference object 51.

[0053] The measuring device 50 does not necessarily measure the distance between the second surface 51b (or the first surface 51a) and the top surface 14a of the measurement reference object 51. For example, when a laser measuring device having a function of measuring the distance from the emitting part or the incident part to the target is used as the measuring device 50, the measuring device 50 measures the distance between the second surface 51b (or the first surface 51a) and the emitting part or the incident part of the measurement reference object 51.

[0054] On the other hand, the difference between the distance between the second surface 51b (or the first surface 51a) and the radiation portion or the incident portion and the distance between the second surface 51b (or the first surface 51a) and the top surface 14a coincides with the distance from the top surface 14a of the mounting plate 14 to the radiation portion or the incident portion, and is always constant in the adjustment method of this embodiment in which the measuring device 50 is placed on the top surface 14a. Therefore, even if the measuring device 50 does not measure the distance between the second surface 51b (or the first surface 51a) and the top surface 14a of the length measurement reference object 51, there is no problem in adjusting the angle as long as the distance corresponding to the distance between the second surface 51b (or the first surface 51a) and the top surface 14a is measured.

[0055] After the distance (or an equivalent distance) between the second surface 51b (or the first surface 51a) and the upper surface 14a is measured at multiple positions, the angle between the upper surface 14a and the lower surface 46a is adjusted based on the measured distance so as to approach zero (0°) (adjustment step ST3).

[0056] For example, if the first surface 51a and the second surface 51b are substantially parallel, the state of the angle adjustment mechanism 36, that is, the state of the two sets of adjustment connectors 36a, is adjusted so that the distances between the second surface 51b (or the first surface 51a) and the upper surface 14a are equal at multiple positions. As a result, the angle between the upper surface 14a and the lower surface 46a approaches zero (0°).

[0057] As described above, in the adjustment method according to the present embodiment, the first surface 51a side of the measurement reference object 51 having the first surface 51a and the second surface 51b is held on the lower surface (holding surface) 46a of the holding plate (holding section) 46, and the distance between the first surface 51a or the second surface 51b of the measurement reference object 51 and the upper surface (mounting surface) 14a of the mounting plate (mounting section) 14, or a distance equivalent thereto, is measured from the upper surface 14a side by the measuring device 50, so that the accuracy of the distance measurement is mainly affected by the measurement reference object 51 and is unlikely to be affected by the shape of the lower surface 46a, etc. Therefore, according to the adjustment method according to the present embodiment, by using an appropriate measurement reference object 51, the angle formed between the upper surface 14a of the mounting plate 14 and the lower surface 46a of the holding plate 46 can be adjusted with high accuracy.

[0058] The present invention is not limited to the above-described embodiment, and may be modified in various ways. For example, in the above-described adjustment method, after the adjustment of the angle between the upper surface 14a and the lower surface 46a (adjustment step ST3), the measurement of the distance (measurement step ST2) and the adjustment of the angle (adjustment step ST3) may be performed again.

[0059] In the above embodiment, in order to adjust the angle between the upper surface (mounting surface) 14a and the lower surface (holding surface) 46a, the inclination of the lower surface 46a is adjusted by the angle adjustment mechanism 36, but the inclination of the upper surface 14a may be adjusted. In this case, an arbitrary angle adjustment mechanism is disposed below the mounting plate (mounting portion) 14.

[0060] In the above-described embodiment, a laser distance measuring instrument that measures the distance to an object based on the laser beam 61 is used as the measuring instrument 50, but a measuring instrument of another aspect may be used. Fig. 7 is a cross-sectional view that shows a schematic state in which a distance is being measured by a measuring instrument 52 according to a second aspect.

[0061] 7, the measuring device 52 according to the second embodiment is a contact type length measuring device having a housing 54 and a probe 56 that can move up and down relative to the housing 54. Like the measuring device 50 described above, this measuring device 52 is used in a state where it is placed on the upper surface (mounting surface) 14a of the mounting plate 14. Specifically, the housing 54 is placed on the upper surface 14a of the mounting plate 14, and the upper end of the probe 56 is brought into contact with the second surface 51b of the length measurement reference object 51, thereby measuring the distance from the upper surface 14a to the second surface 51b (or a distance equivalent thereto).

[0062] Fig. 8 is a cross-sectional view showing a state where a distance is measured by a measuring device 58 according to the third embodiment. As shown in Fig. 8, the measuring device 58 according to the third embodiment is a laser distance measuring device configured similarly to the measuring device 50 described above. However, the measuring device 58 according to the third embodiment is disposed below the mounting plate 14, and the emitting portion emits a laser beam 63 having a wavelength that passes through the mounting plate 14.

[0063] 8, the measuring device 58 is fixed to the end of the light source 122, but the arrangement of the measuring device 58 is not limited to this. The measuring device 58 may be fixed to the lower surface of the mounting plate 14. The measuring device 58 may also be arranged so as to be movable below the mounting plate 14.

[0064] In addition, the structures, methods, and the like according to the above-described embodiment and each modified example may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0065] 11: Wafer (second component) 21: Film (first member) 31: Liquid resin (UV-curable resin) 33: Resin after hardening 41: Protective material 51: Measurement standard 51a: 1st page 51b: 2nd side 61: Laser beam 63: Laser beam 2: Protective member forming device 4: Base 4a:Top surface 4b: Storage section 6: Support member 8:Support structure 10: Table 12:Frame body 14: Mounting plate (mounting part) 14a: Upper surface (mounting surface) 16: Fixture 18: Light irradiation unit 20: Support leg 22: Light source (UV lamp) 24: Lifting mechanism 26: Guide pillar 28: Moving section 30: Nut part 32: Screw shaft 34: Bearing 36: Angle adjustment mechanism 36a:Adjustment connection part 36b:Connection part 38: Support plate 40: Load sensor 42: Holding unit 44:Frame body 44a: Recess 46: Holding plate (holding part) 46a: Bottom surface (holding surface) 48: Controller (control unit) 50: Measuring instrument 52: Measuring instrument 54: Housing 56: Probe 58: Measuring instrument ST1: Measurement preparation step ST2: Measurement step ST3: Adjustment step

Claims

1. An adjustment method for adjusting an angle between a placement surface and a holding surface of an apparatus for overlapping a first member and a second member and applying pressure by bringing a placement section having a placement surface on which a first member is placed and a holding section having a holding surface facing the placement surface and holding a second member close to each other, the method comprising the steps of: a measurement preparation step of holding a first surface of a length measurement reference object having a first surface and a second surface facing an opposite side to the first surface on the holding surface of the holding part; a measuring step of arranging a measuring device on the placement surface side of the measurement reference object held on the holding surface, and measuring a distance between the first surface or the second surface of the measurement reference object and the placement surface, or a distance equivalent thereto, at a plurality of positions on the placement surface; and an adjusting step of adjusting the angle between the placement surface and the holding surface so as to approach zero based on the distances measured at the multiple positions.

2. 2. The adjustment method according to claim 1, wherein the porosity of the measurement reference object is lower than the porosity of the holding portion.

3. 3. The adjustment method according to claim 2, wherein the measuring device is a laser length measuring device.

4. 4. The adjustment method according to claim 3, wherein the measurement reference object is made of a material that transmits the laser beam emitted by the laser measurement device.

5. 3. The adjustment method according to claim 2, wherein the measuring device is a contact type length measuring device.

6. 6. The adjusting method according to claim 1, wherein the holding surface is made of porous ceramics.

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