Power conversion device

Abstract

To provide a power conversion device in which heat can be efficiently released with a plurality of electric components including a semiconductor module as a bottom, while the connection between the semiconductor module and a substrate is kept suitable.SOLUTION: A power conversion device includes semiconductor modules 12U, 12V, and 12W, a first electric component 20, a second electric component 70, a housing 160, and a cooler 240. The semiconductor module includes a signal terminal 11D connected to a substrate 15. The housing includes a bottom 171. In a first arrangement part 177, the semiconductor modules are disposed on an inner bottom surface side and the second electric component is disposed on an outer bottom surface side. A second arrangement part 173 is disposed at a position away from the substrate relative to the first arrangement part, and the first electric component is disposed on an inner bottom surface side. The first arrangement part internally includes a second flow channel 204 on the semiconductor module side, a third flow channel 207 on the second electric component side, and a wall 211 to section them. The semiconductor module is held between the cooler and the first arrangement part.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The disclosure provided herein relates to a power conversion device. [Background technology]

[0002] The power conversion device described in Patent Document 1 includes a switching unit, a smoothing capacitor, a noise filter, a control board, a cooler, and a housing that houses these components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-107381 A Summary of the Invention [Problem to be solved by the invention]

[0004] The switching unit is housed in the housing between the bottom wall and the control board. A gate terminal of the switching unit extends to and is connected to the control board. A semiconductor module included in the switching unit is sandwiched between a cooler and cooled by a coolant flowing through the cooler. A cooling passage through which the coolant can flow is formed in the bottom wall. A capacitor is disposed on the inner bottom surface of the bottom wall, and a noise filter is disposed on the outer bottom surface of the bottom wall. The capacitor and noise filter are cooled by the coolant flowing through the cooling passage.

[0005] If the semiconductor module of Patent Document 1 is placed on the bottom wall to be cooled without using a cooler, the gate terminal becomes long. This may cause a connection failure between the gate terminal and the control board due to vibration, etc. In the structure of Patent Document 1, it is difficult to efficiently dissipate heat from the semiconductor module, capacitor, and noise filter to the bottom while maintaining a good connection between the gate terminal and the control board.

[0006] An object of the present disclosure is to provide a power conversion device that is capable of efficiently dissipating heat to the bottom from multiple electrical components, including a semiconductor module, while maintaining good connection between the semiconductor module and a substrate. [Means for solving the problem]

[0007] A power conversion device according to one aspect of the present disclosure includes: a semiconductor module (12U, 12V, 12W) having a thickness in one direction (Z) and a signal terminal (11D) extending in the one direction and connected to a substrate (15); a first electrical component (20) electrically connected to the semiconductor module; a conductive member (111, 121, 112, 122) that connects the battery (2) and the first electric component; a second electrical component (70) electrically or magnetically connected to the conductive member; a housing (160) having a bottom (171) including an inner bottom surface (171A) facing the substrate and an outer bottom surface (171B) located on the reverse side of the inner bottom surface, the housing having a bottom (171) to which a semiconductor module, a first electric component, and a second electric component are thermally connected; a cooler (240) including a first flow path (205) for cooling the semiconductor module; The bottom is a first arrangement section (177) in which a semiconductor module is arranged on an inner bottom surface side and a second electric component is arranged on an outer bottom surface side; a second arrangement portion (173) provided at a position farther from the substrate in one direction than the first arrangement portion, and having a first electric component arranged on an inner bottom surface side thereof; A connecting portion (175) that connects the first arrangement portion and the second arrangement portion, The first arrangement part is a second flow path (204) provided on the semiconductor module side, a third flow path (207) provided on the second electric component side, and a wall (211) separating the second flow path and the third flow path; The semiconductor module is sandwiched between the cooler and the first arrangement.

[0008] Heat from the semiconductor module (12U, 12V, 12W) is dissipated to the cooler (240) and the first arrangement section (177). Heat from the first electric component (20) is dissipated to the second arrangement section (173). Heat from the second electric component (70) is dissipated to the first arrangement section. In addition, since the semiconductor module is provided close to the board (15) when arranged in the first arrangement section, good connection between the signal terminal (11D) and the board can be maintained against vibrations, etc. It has become possible to efficiently cool multiple electric components including the semiconductor module at the bottom while maintaining good connection between the signal terminal and the board.

[0009] It should be noted that the reference numbers in parentheses above merely indicate the corresponding relationship with the configurations described in the embodiments described below, and do not in any way limit the technical scope. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is an electrical circuit diagram illustrating an in-vehicle system. [Diagram 2] FIG. 2 is a plan view of the power conversion device as viewed from the cover side. [Diagram 3] 3 is a plan view showing the configuration of FIG. 2 from which the cover, the board, and the bracket are removed. [Figure 4] FIG. 4 is a plan view of the main body as viewed from the cover side. [Diagram 5] FIG. 3 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 4 is a plan view of the first forming portion as viewed from the cover side. [Figure 7] FIG. 4 is a plan view of the first forming portion as seen from the flat portion side. [Figure 8] FIG. 3 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 11 is a cross-sectional view of a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, the other embodiment described previously may be applied to the other parts of the configuration.

[0012] In addition to combinations of parts that are explicitly stated as possible in each embodiment, it is also possible to partially combine embodiments, embodiments and variations, and variations together, even if not explicitly stated, provided that there are no particular problems with the combination.

[0013] (First embodiment) <In-vehicle systems> 1 is an electric circuit diagram for explaining an in-vehicle system 1. This in-vehicle system 1 constitutes a system for an electric vehicle. The in-vehicle system 1 has a battery 2 and an electromechanical integrated unit. The electromechanical integrated unit has a power conversion device 10 and a motor 4.

[0014] The vehicle-mounted system 1 also has multiple ECUs (not shown). These multiple ECUs transmit and receive signals to each other via a bus line. The multiple ECUs cooperate to control the electric vehicle. The power running and regeneration of the motor 4 are controlled according to the SOC of the battery 2 by the control of the multiple ECUs.

[0015] The ECU has at least one central processing unit (CPU) and at least one memory device (MMR) as a storage medium for storing programs and data. The ECU is provided by a microcomputer equipped with a storage medium readable by a computer or a processor. The storage medium is a non-transient substantial storage medium that non-temporarily stores a program readable by a computer or a processor. The storage medium may be provided by a semiconductor memory, a magnetic disk, or the like. Below, the components of the in-vehicle system 1 will be individually outlined.

[0016] The battery 2 has multiple secondary batteries. These multiple secondary batteries are connected in series to form a battery stack. The SOC of this battery stack corresponds to the SOC of the battery 2. As the secondary batteries, lithium ion secondary batteries, nickel hydride secondary batteries, organic radical batteries, etc. can be used.

[0017] The power conversion device 10 performs power conversion between the battery 2 and the motor 4. The power conversion device 10 converts DC power of the battery 2 into AC power. The power conversion device 10 converts AC power generated by power generation (regeneration) of the motor 4 into DC power.

[0018] The motor 4 is connected to an output shaft of the electric vehicle (not shown). The rotational energy of the motor 4 is transmitted to the running wheels of the electric vehicle via the output shaft. Conversely, the rotational energy of the running wheels is transmitted to the motor 4 via the output shaft. The motor 4 is powered by AC power supplied from the power conversion device 10. This provides propulsive force to the running wheels. The motor 4 regenerates power using the rotational energy transmitted from the running wheels. The AC power generated by this regeneration is converted to DC power by the power conversion device 10. This DC power is supplied to the battery 2. The DC power is also supplied to various electrical loads mounted on the electric vehicle.

[0019] <Power conversion device> Next, the power converter 10 will be described. The power converter 10 of this embodiment includes components of an inverter 11. The power converter 10 may include components of a converter in addition to the components of the inverter 11. FIG. 2 is a plan view of the power converter 10 as viewed from the cover 190 side. FIG. 3 is a plan view of FIG. 2 excluding the cover 190, the control board 15, and the bracket 180. FIG. 4 is a plan view of the main body 170 as viewed from the cover 190 side. FIG. 5 is a cross-sectional view of the power converter 10 along the line VV in FIG. 2. FIG. 6 is a plan view of the first forming portion 184 as viewed from the cover 190 side. FIG. 7 is a plan view of the first forming portion 184 as viewed from the flat portion 185 side. FIG. 8 is a cross-sectional view along the line VIII-VIII in FIG. 2. Note that the cross-sectional lines are drawn in FIG. 3 at the same positions as in FIG. 2.

[0020] The power conversion device 10 includes a high-potential side bus bar 110 and a low-potential side bus bar 120 as wiring. The high-potential side bus bar 110 is electrically connected to the positive electrode of the battery 2. The low-potential side bus bar 120 is electrically connected to the negative electrode of the battery 2. The power conversion device 10 also includes a U-phase bus bar 130U, a V-phase bus bar 130V, and a W-phase bus bar 130W that are connected to the motor 4. The U-phase bus bar 130U, the V-phase bus bar 130V, and the W-phase bus bar 130W may be collectively referred to as a coupling bus bar 130.

[0021] In addition to the above-mentioned wiring, the power conversion device 10 has an inverter 11, a control board 15, a smoothing capacitor 20, a noise filter 70, a heat dissipation member 80, a motor connector 140, a terminal block 150, and a housing 160 that houses these components. The noise filter 70 has a Y capacitor 30 and a magnetic core 60. The power conversion device 10 may also have a current sensor, not shown. The noise filter 70 may have only one of the Y capacitor 30 and the magnetic core 60. The smoothing capacitor 20 may be referred to as a first electric component. The noise filter 70 may be referred to as a second electric component. The control board 15 may simply be referred to as a board.

[0022] An inverter 11, a smoothing capacitor 20, and a noise filter 70 are connected in parallel to the high potential side busbar 110 and the low potential side busbar 120. The high potential side busbar 110 has a first high potential side connection portion 111, a second high potential side connection portion 112, and a third high potential side connection portion 113. The three high potential side connection portions 111, 112, and 113 are continuous in this order. Similarly, the low potential side busbar 120 has a first low potential side connection portion 121, a second low potential side connection portion 122, and a third low potential side connection portion 123. The low potential side connection portions 121, 122, and 123 are continuous in this order.

[0023] The high potential side first connection part 111 and the low potential side first connection part 121 may be collectively referred to as the first connection parts 111, 121. The high potential side second connection part 112 and the low potential side second connection part 122 may be collectively referred to as the second connection parts 112, 122. The high potential side third connection part 113 and the low potential side third connection part 123 may be collectively referred to as the third connection parts 113, 123. The battery 2 and the noise filter 70 are connected via the first connection parts 111, 121. The noise filter 70 and the smoothing capacitor 20 are connected via the second connection parts 112, 122. The smoothing capacitor 20 and the inverter 11 are connected via the third connection parts 113, 123. The battery 2 and the smoothing capacitor 20 are electrically connected via the first connection parts 111, 121, the noise filter 70, and the second connection parts 112, 122. The first connecting portions 111, 121 and the second connecting portions 112, 122 may be referred to as conductive members.

[0024] Specifically speaking about the first connection parts 111 and 121 in this embodiment, the battery 2 and the Y capacitor 30 described later are connected via the first connection parts 111 and 121. A magnetic core 60 described later surrounds the first connection parts 111 and 121 in a ring shape. Specifically speaking about the second connection parts 112 and 122, the Y capacitor 30 and the smoothing capacitor 20 are connected via the second connection parts 112 and 122. The position where the magnetic core 60 is provided is not limited to the first connection parts 111 and 121. As another example, the magnetic core 60 may be provided at the second connection parts 112 and 122.

[0025] The inverter 11 has three-phase semiconductor modules 12U, 12V, and 12W. The three-phase semiconductor modules 12U, 12V, and 12W are a U-phase semiconductor module 12U, a V-phase semiconductor module 12V, and a W-phase semiconductor module 12W. The U-phase semiconductor module 12U is electrically connected to a U-phase winding of the motor 4 via a U-phase bus bar 130U. The V-phase semiconductor module 12V and the W-phase semiconductor module 12W are also electrically connected to the corresponding windings of the motor 4 via corresponding coupling bus bars 130.

[0026] Each of the semiconductor modules 12U, 12V, and 12W has two switching elements 13 and two diodes 13A. The two switching elements 13 are connected in series between a high potential side bus bar 110 and a low potential side bus bar 120. A high potential side input terminal 11A connected to the high potential side bus bar 110 is connected to a collector electrode of one of the two switching elements 13 provided on the high potential side. A low potential side input terminal 11B connected to the low potential side bus bar 120 is connected to an emitter of one of the two switching elements 13 provided on the low potential side. The anode of the diode 13A is connected to the emitter of the corresponding switching element 13. The cathode of the diode 13A is connected to the collector of the corresponding switching element 13.

[0027] A motor terminal 11C connected to the motor 4 is connected to the emitter of the high-potential side switching element 13 and the collector of the N-side switching element 13. The multiple switching elements 13 convert DC power supplied from the battery 2 into AC power capable of driving the motor 4. The converted power is supplied to the motor 4 via a connecting bus bar 130.

[0028] Furthermore, the two switching elements 13 have a signal terminal 11D electrically connected to the control board 15. The signal terminal 11D is connected to the gate electrode of the switching element 13. An on / off signal for the switching element 13 is input from the control board 15 via the signal terminal 11D. Hereinafter, the high potential side input terminal 11A, the low potential side input terminal 11B, the motor terminal 11C, and the signal terminal 11D may be collectively referred to simply as terminals 11A, 11B, 11C, and 11D.

[0029] In addition to the switching elements 13, diodes 13A, and terminals 11A, 11B, 11C, and 11D described above, the semiconductor modules 12U, 12V, and 12W also have a sealing member 14 that seals them. The sealing member 14 is mainly made of resin. All of the switching elements 13, all of the diodes 13A, and some of the terminals 11A, 11B, 11C, and 11D are housed in the sealing member 14. The remaining terminals 11A, 11B, 11C, and 11D are exposed from the sealing member 14. The mechanical configuration of the semiconductor modules 12U, 12V, and 12W will be described in detail later.

[0030] The control board 15 controls the on / off of the multiple switching elements 13. A control circuit that controls the on / off of the multiple switching elements 13 is mounted on the control board 15. The above-mentioned ECU may be mounted on the control board 15. Signal terminals 11D of the multiple switching elements 13 extend toward the control board 15. The signal terminals 11D of the multiple switching elements 13 are inserted into the control board 15 and soldered.

[0031] Smoothing capacitor 20 mainly smoothes the DC voltage supplied from battery 2. Smoothing capacitor 20 has capacitor element 21, capacitor case 22, and sealing resin 23. Capacitor element 21 and sealing resin 23 are housed inside capacitor case 22. Capacitor element 21 is fixed to the inner surface of capacitor case 22 by sealing resin 23. As an example, capacitor element 21 is a film capacitor. A film capacitor is formed by providing metal vapor deposition electrodes on a dielectric film, and winding the dielectric film so that the metal vapor deposition electrodes face each other. Metallicon electrodes are formed on both end faces of the film capacitor by spraying metal. The metal vapor deposition electrode is electrically connected to one of the metallicon electrodes.

[0032] Capacitor element 21 has a three-dimensional shape with a certain volume. Capacitor element 21 may be provided in the form of a three-dimensional shape such as a cylinder or an elliptical cylinder. Capacitor element 21 has at least two end faces 24, 25 and a side face 26. One end face of capacitor element 21 is called first end face 24. A metallikon electrode is provided on first end face 24. A first terminal 24A and a second terminal 24B are connected to the metallikon electrode provided on first end face 24. The other end face of capacitor element 21 is called second end face 25. A metallikon electrode is provided on second end face 25. A third terminal 25A and a fourth terminal 25B are connected to the metallikon electrode provided on second end face 25.

[0033] High potential side second connection portion 112 is connected to first terminal 24A. High potential side third connection portion 113 is connected to second terminal 24B. Low potential side second connection portion 122 is connected to third terminal 25A. Low potential side third connection portion 123 is connected to fourth terminal 25B. Capacitor element 21 and parts of first terminal 24A to fourth terminal 25B are sealed in sealing resin 23, and the remainders of first terminal 24A to fourth terminal 25B are exposed from sealing resin 23.

[0034] The noise filter 70 has a Y capacitor 30 and a magnetic core 60. The Y capacitor 30 removes noise components caused by currents flowing through the first connecting portions 111, 121 and the second connecting portions 112, 122. The Y capacitor 30 has two capacitor elements 31, 32, two capacitor bus bars 41, 42, and a ground bus bar 50. Of the two capacitor elements 31, 32, one located on the side of the high potential side bus bar 110 may be referred to as the high potential side capacitor element 31. Of the two capacitor elements 31, 32, one located on the side of the low potential side bus bar 120 may be referred to as the low potential side capacitor element 32.

[0035] Of the two capacitor busbars 41, 42, the one connected to the high potential side capacitor element 31 may be referred to as the high potential side capacitor busbar 41. The high potential side capacitor element 31 is electrically connected to the high potential side busbar 110 via the high potential side capacitor busbar 41. Of the two capacitor busbars 41, 42, the one connected to the low potential side capacitor element 32 may be referred to as the low potential side capacitor busbar 42. The low potential side capacitor element 32 is electrically connected to the low potential side busbar 120 via the low potential side capacitor busbar 42.

[0036] The ground bus bar 50 has a high potential side GND terminal connected to the high potential side capacitor element 31, a low potential side GND terminal connected to the low potential side capacitor element 32, and a GND connection terminal connected to the ground via the housing 160. The ground bus bar 50 extends to connect the high potential side GND terminal, the low potential side GND terminal, and the GND connection terminal. The ground bus bar 50 is connected to the capacitor elements 31 and 32 and is also electrically connected to the ground. The capacitor elements 31 and 32 remove the above-mentioned noise components from the inverter 11 by flowing them to the body ground via the ground bus bar 50.

[0037] The magnetic core 60 removes noise components caused by the current flowing through the first connection parts 111 and 121. The main material of the magnetic core 60 is ferrite, electromagnetic steel sheet, amorphous, etc. The magnetic core 60 is formed by sealing a magnetic material in an insulating member. As an example, the magnetic core 60 is formed in a ring shape. The high potential side first connection part 111 and the low potential side first connection part 121 are passed through holes surrounded by the magnetic core 60. This allows the magnetic core 60 to remove noise components caused by the current flowing through the first connection parts 111 and 121.

[0038] The heat dissipation member 80 is a heat dissipation sheet, a gap filler, a heat dissipation grease, or the like. The heat dissipation member 80 has a higher thermal conductivity than air. The heat dissipation member 80 has an insulating property. The heat dissipation member 80 is provided between the smoothing capacitor 20 and a lower base 173 described later, between the smoothing capacitor 20 and a connecting portion 175 described later, and between the noise filter 70 and an upper base 174 described later. This allows efficient heat dissipation from the smoothing capacitor 20 and the noise filter 70 to a bottom 171 described later. The smoothing capacitor 20 and the lower base 173, the smoothing capacitor 20 and the connecting portion 175, and the noise filter 70 and the upper base 174 are in close contact with each other via the heat dissipation member 80. The noise filter 70 is thermally connected to the upper base 174. The smoothing capacitor 20 is thermally connected to the lower base 173 and the connecting portion 175. The heat dissipation member 80 does not have to be provided in all three places described above. It is sufficient that the sensor is provided in at least one of the three locations described above.

[0039] <Mechanical configuration of the power conversion device> In the following, the thickness direction of the bottom 171 of the housing 160 is referred to as the Z direction, and one direction perpendicular to the Z direction is referred to as the X direction. The Z direction may be referred to as one direction. The X direction may be referred to as the arrangement direction. The direction perpendicular to both the Z direction and the X direction is referred to as the Y direction. The direction perpendicular to the Z direction may be referred to as the planar direction. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X direction and the Y direction, is referred to as the planar shape. Also, the planar view from the Z direction may be simply referred to as the planar view.

[0040] The housing 160 has a main body 170, a bracket 180, and a cover 190. The main body 170, the bracket 180, and the cover 190 are manufactured by, for example, aluminum die casting. The main body 170 has a box shape having a bottom 171 and a side wall 172. A storage space is defined inside by the bottom 171 and the side wall 172. The bracket 180 is provided at the tip of the side wall 172 so as to close an opening defined by the side wall 172. The cover 190 is provided on the opposite side of the main body 170 with the bracket 180 interposed therebetween. The bracket 180 is covered by the cover 190. A space is defined between the bracket 180 and the cover 190.

[0041] Hereinafter, the high potential side bus bar 110, the low potential side bus bar 120, and the connecting bus bar 130 may be collectively referred to as the bus bars 110, 120, and 130. The smoothing capacitor 20, the three semiconductor modules 12U, 12V, and 12W, a part of the terminal block 150, a part of the motor connector 140, and a part of the bus bars 110, 120, and 130 are stored in the storage space of the main body 170. The noise filter 70 and the remaining bus bars 110, 120, and 130 are provided outside the storage space of the main body 170. The noise filter 70, the high potential side bus bar 110, and the remaining low potential side bus bar 120 are fixed to an outer bottom surface 171B described later. The remaining connecting bus bar 130 extends away from the bottom 171 and is connected to the motor 4. The control board 15 is provided in a space partitioned between the bracket 191 and the cover 192. The control board 15 is fixed to the bracket 191. The bracket 191 is also provided with an insertion hole through which the signal terminal 11D passes. The signal terminal 11D is soldered to the control board 15 and passes through the insertion hole.

[0042] The bottom 171 of the main body 170 has an inner bottom surface 171A and an outer bottom surface 171B aligned in the Z direction. The inner bottom surface 171A faces the control board 15 in the Z direction. The side wall 172 stands upright in the Z direction from the inner bottom surface 171A. The side wall 172 forms an annular shape in the circumferential direction around the Z direction. The side wall 172 has a first side wall 172A, a second side wall 172B, a third side wall 172C, and a fourth side wall 172D. The first side wall 172A and the third side wall 172C are aligned and spaced apart in the X direction. The second side wall 172B and the fourth side wall 172D are aligned and spaced apart in the Y direction. The first to fourth side walls 172A to 172D are arranged clockwise in the order of first side wall 172A, second side wall 172B, third side wall 172C, and fourth side wall 172D. The area where the space surrounded by the inner circumferential surfaces of the side walls 172 overlaps with the projection area of ​​the inner bottom surface 171A of the bottom 171 in the Z direction corresponds to the storage space of the main body 170.

[0043] The bottom 171 has a lower bottom 173 and an upper bottom 174, the positions of which are different from each other in the outer bottom surface 171B. The outer bottom surface 171B of the upper bottom 174 is disposed closer to the control board 15 than the outer bottom surface 171B of the lower bottom 173. The inner bottom surface 171A of the lower bottom 173 is farther from the control board 15 in the Z direction than the outer bottom surface 171B of the upper bottom 174. The bottom 171 also has a connecting portion 175 that connects the lower bottom 173 and the upper bottom 174. The lower bottom 173 and the upper bottom 174 are integrally connected via the connecting portion 175. The lower bottom 173 may be referred to as a second arrangement portion. The connecting portion 175 may extend along the Z direction, or may not extend along the Z direction. The connecting portion 175 may extend in any direction as long as it connects the lower bottom 173 and the upper bottom 174.

[0044] In plan view, the upper base 174 expands in a substantially L-shape so as to surround the lower base 173. The space surrounded by the lower base 173 and the connecting portion 175 is a recess 176 recessed from the upper base 174. The smoothing capacitor 20 is housed in this recess 176. The upper base 174 has a flow path forming portion 177 and a continuous portion 178 that continuously expands in the planar direction from the flow path forming portion 177. In plan view, the recess 176 is provided in the corner between the third side wall 172C and the fourth side wall 172D in the bottom 171. The flow path forming portion 177 is provided in the upper base 174 so as to be adjacent to the recess 176 in the X direction. The flow path forming portion 177 may be referred to as a first arrangement portion.

[0045] In plan view, the continuous portion 178 expands in a substantially L-shape so as to surround the recess 176 and the flow path forming portion 177. The continuous portion 178 is provided with three holes 181, 182, and 183 penetrating the inner bottom surface 171A and the outer bottom surface 171B. The three holes 181, 182, and 183 are a bus bar insertion hole 181, a motor connector arrangement hole 182, and a terminal block arrangement hole 183. The bus bar insertion hole 181 is aligned with the recess 176 in the Y direction. The motor connector arrangement hole 182 is aligned with the flow path forming portion 177 in the X direction on the opposite side to the recess 176. The terminal block arrangement hole 183 is provided in a corner between the first side wall 172A and the second side wall 172B. Terminal block arrangement hole 183 is provided in a region where a projection area in the X direction of bus bar insertion hole 181 and a projection area in the Y direction of motor connector arrangement hole 182 overlap. None of the three holes 181, 182, 183 are formed between semiconductor modules 12U, 12V, 12W and smoothing capacitor 20 in the X direction. Note that bus bar insertion hole 181 may be simply referred to as insertion hole 181.

[0046] The second connection portions 112, 122 are passed through the bus bar insertion holes 181. The motor connector 140 is passed through the motor connector arrangement hole 182. The motor connector 140 has a connecting bus bar 130 and a sealing resin that seals the connecting bus bar 130. The terminal block 150 is passed through the terminal block arrangement hole 183. The terminal block 150 has first connection portions 111, 121 and a sealing resin that seals the first connection portions 111, 121. Details will be described later.

[0047] In addition to the components described above, the power conversion device 10 has a first connecting pipe 220, a second connecting pipe 230, and a cooler 240. The first connecting pipe 220, the second connecting pipe 230, the cooler 240, and the flow path forming portion 177 may be collectively referred to as a cooling module 200. The cooling module 200 and the components that make up the cooling module 200 will be specifically described below.

[0048] <Cooling module> The cooling module 200 has a flow path forming section 177, a first connecting pipe 220, a second connecting pipe 230, and a cooler 240. As will be described in detail later, the cooler 240 has a first flow path 205. The flow path forming section 177 has a second flow path 204, a third flow path 207, a fourth flow path 202, a supply flow path 201, and a discharge flow path 208. The first connecting pipe 220 has a first connecting flow path 203. The second connecting pipe 230 has a second connecting flow path 206.

[0049] Flow path forming portion 177 has first forming portion 184 and second forming portion 187. First forming portion 184 is a portion that is continuous with connecting portion 178 and is made of the same material. First forming portion 184 and connecting portion 178 may be separate bodies. A part of first forming portion 184 and connecting portion 178 may be integral, and the remainder of first forming portion 184 and connecting portion 178 may be separate bodies.

[0050] The first forming portion 184 has a planar portion 185 and a structural portion 188. As an example, the planar portion 185 and the structural portion 188 are continuous and made of the same material. The planar portion 185 and the structural portion 188 do not have to be continuous and made of the same material. The planar portion 185 and the structural portion 188 may be connected via a connecting member. The planar portion 185 has a flat shape with a thin thickness in the Z direction. The planar portion 185 is continuous with the continuous portion 178 in the planar direction. The plate thickness of the planar portion 185 and the plate thickness of the continuous portion 178 are the same. The plate thickness of the planar portion 185 and the plate thickness of the continuous portion 178 may be different. The planar portion 185 has an outer bottom surface 171B. The outer bottom surface 171B of the planar portion 185 and the outer bottom surface 171B of the continuous portion 178 are flush with each other.

[0051] The structural portion 188 is a portion that constitutes the second flow path 204, the third flow path 207, and the fourth flow path 202 through which the refrigerant flows. The second flow path 204, the third flow path 207, and the fourth flow path 202 will be described later. The structural portion 188 has a base portion 211, a first rising portion 186A, a second rising portion 186B, a partition wall 212, a supply pipe 200A, and an exhaust pipe 200B. The base portion 211 is a plate-like shape that is flat in the Z direction. The base portion 211 is provided closer to the control board 15 in the Z direction than the flat portion 185. The base portion 211 may also be simply referred to as a wall. The base portion 211 and the flat portion 185 are disposed so as to be spaced apart in the Z direction. The base portion 211 has a front surface 211A that faces the control board 15, and a back surface 211B that faces the flat portion 185.

[0052] As shown in Figures 5 and 8, a first rising portion 186A is connected to the surface 211A. The first rising portion 186A extends in the Z direction away from the surface 211A. The first rising portion 186A extends in an annular shape around an axis along the Z direction. A space through which a refrigerant can flow is defined by the base portion 211 and the first rising portion 186A. A second forming portion 187 is provided at the tip of the first rising portion 186A.

[0053] Second forming portion 187 has a flat shape with a small thickness in the Z direction. Second forming portion 187 is provided at the tip of first rising portion 186A so as to close the opening defined by first rising portion 186. Second forming portion 187 closes the space defined by base portion 211 and first rising portion 186A. Base portion 211, first rising portion 186A, and second forming portion 187 define second flow path 204 through which a refrigerant can flow.

[0054] The second forming portion 187 has an inner bottom surface 171A facing the control board 15. The inner bottom surface 171A of the continuous portion 178 and the inner bottom surface 171A of the second forming portion 187 are located at different positions in the Z direction. The inner bottom surface 171A of the second forming portion 187 is provided farther from the outer bottom surface 171B of the upper base 174 than the inner bottom surface 171A of the continuous portion 178. The inner bottom surface 171A of the second forming portion 187 is provided closer to the control board 15 than the inner bottom surface 171A of the continuous portion 178. The second forming portion 187 also has a main surface 187A facing the base portion 211. The first main surface 187A is provided with a plurality of protrusions 189 extending away from the first main surface 187A. The protrusions 189 are sometimes referred to as fins. The second forming portion 187 is efficiently cooled by the protrusions 189 coming into contact with the refrigerant. It is to be noted that the protrusion 189 does not necessarily have to be formed on the second forming portion 187 .

[0055] As shown in FIG. 6, the first rising portion 186A is included in the Z-direction projection area of ​​the base portion 211. The first rising portion 186A is disposed closer to the center than the edge of the base portion 211. In particular, the first rising portion 186A is disposed farther toward the center than the edge of the base portion 211 in the Y direction. A first through hole 213 penetrating the base portion 211 in the Z direction is formed between the edge of one end of the base portion 211 in the Y direction and the first rising portion 186A. A second through hole 214 penetrating the base portion 211 in the Z direction is formed between the edge of the other end of the base portion 211 in the Y direction and the first rising portion 186A. It can also be said that the first through hole 213 is provided on one end side of the base portion 211 in the Y direction. It can also be said that the second through hole 214 is provided on the other end side of the base portion 211 in the Y direction.

[0056] 5 and 8, the second rising portion 186B and the partition wall 212 are connected to the rear surface 211B. The second rising portion 186B and the partition wall 212 extend in the Z direction so as to move away from the rear surface 211B.

[0057] The inner bottom surface 171A of the second forming portion 187 and the inner bottom surface 171A of the flat portion 185 are connected by a side surface of the first rising portion 186A, a side surface of the second rising portion 186B, and a side surface of the second forming portion 187. The first rising portion 186A and the second rising portion 186B may be collectively referred to as the rising portion 186. The rising portion 186 extends in the Z direction. The rising portion 186 corresponds to the side wall of the first forming portion 184.

[0058] At upper bottom 174, the Z-direction thickness of continuous portion 178 is different from the Z-direction thickness of flow path forming portion 177. The thickness of flow path forming portion 177 is thicker than the thickness of continuous portion 178. The distance from inner bottom surface 171A of flow path forming portion 177 to control board 15 is shorter than the distance from inner bottom surface 171A of continuous portion 178 to control board 15.

[0059] 7, the second rising portion 186B extends in an annular shape around an axis along the Z direction. The first through hole 213 and the second through hole 214 are surrounded by the second rising portion 186B. The base portion 211 and the second rising portion 186B define a space through which the refrigerant can flow.

[0060] Furthermore, the partition wall 212 is connected to the inner surface of the second rising portion 186B. The partition wall 212 divides the above-mentioned space into a space overlapping the first through hole 213 and a space overlapping the second through hole 214. As an example, the sizes of the two divided spaces are different. Note that the sizes of the two divided spaces do not have to be different. Furthermore, the tip of the second rising portion 186B and the tip of the partition wall 212 face the flat portion 185.

[0061] The space overlapping the first through hole 213 and the space overlapping the second through hole 214 are closed by the flat portion 185. The space overlapping the first through hole 213 and closed by the flat portion 185 may be referred to as a fourth flow path 202. The space overlapping the second through hole 214 and closed by the flat portion 185 may be referred to as a third flow path 207. A refrigerant can flow through the third flow path 207 and the fourth flow path 202.

[0062] In a plan view, the supply pipe 200A and the discharge pipe 200B are provided at the edge of one end of the base portion 211 in the Y direction. The supply pipe 200A and the discharge pipe 200B are provided so as to straddle the rising portion 186 at the edge of one end of the base portion 211 in the Y direction. As shown in FIG. 6, the supply pipe 200A and the discharge pipe 200B are cylinders having a hollow inside. The hollow of the supply pipe 200A can be referred to as a supply flow path 201 which is a flow path through which the refrigerant is supplied. The hollow of the discharge pipe 200B can be referred to as a discharge flow path 208 which is a flow path through which the refrigerant is discharged. The supply pipe 200A and the discharge pipe 200B are arranged side by side and spaced apart in the X direction.

[0063] Fourth flow path 202 and a part of third flow path 207 are provided in supply pipe 200A so as to overlap in the X direction. Fourth flow path 202 has a substantially rectangular shape in a plan view. Fourth flow path 202 is provided on one end side of base portion 211 in the Y direction. Fourth flow path 202 is disposed adjacent to supply pipe 200A in the X direction. Supply flow path 201 has two ends. A refrigerant is supplied from one end of supply flow path 201. The other end of supply flow path 201 and fourth flow path 202 are connected in a manner that allows a refrigerant to flow therethrough.

[0064] In plan view, the third flow path 207 is substantially Z-shaped. A part of the third flow path 207 is provided on the other end side of the base portion 211 in the Y direction. The third flow path 207 has a first flow path piece 207A that overlaps the supply pipe 200A in the X direction, a third flow path piece 207C that overlaps the discharge pipe 200B in the X direction, and a second flow path piece 207B that connects them. The first flow path piece 207A and the third flow path piece 207C extend along the X direction. The second flow path piece 207B extends along the Y direction. The third flow path piece 207C is disposed adjacent to the discharge pipe 200B in the X direction. The refrigerant is discharged from one end of the discharge flow path 208. Another end of the discharge flow path 208 and the third flow path piece 207C are connected in a manner that allows the refrigerant to flow.

[0065] The third flow path 207 and the fourth flow path 202 are separated by a partition wall 212. More specifically, the first flow path segment 207A and the fourth flow path 202 are separated in the X direction by the partition wall 212. The third flow path segment 207C and the fourth flow path 202 are separated in the Y direction by the partition wall 212. The second flow path segment 207B and the fourth flow path 202 are separated in the X direction and the Y direction by the partition wall 212.

[0066] Semiconductor modules 12U, 12V, and 12W are arranged on the inner bottom surface 171A of second forming portion 187. A cooler 240 is arranged on the opposite side of second forming portion 187 across semiconductor modules 12U, 12V, and 12W. Semiconductor modules 12U, 12V, and 12W are sandwiched between cooler 240 and flow path forming portion 177 in the Z direction. Cooler 240 has a plate-like shape having first flow path 205 through which a refrigerant can flow.

[0067] Also, the first connecting pipe 220 is passed through the first through hole 213. It can also be said that the first connecting pipe 220 is connected to the first forming portion 184. The first connecting pipe 220 is a cylinder having a hollow inside. The first connecting pipe 220 extends in the Z direction. The hollow inside of the first connecting pipe 220 can also be said to be a first connecting flow path 203 through which the refrigerant flows. An end of the first connecting flow path 203 branches into three. One end of the first connecting flow path 203 and the fourth flow path 202 are connected in a manner that allows the refrigerant to flow therethrough. Another end of the first connecting flow path 203 and the second flow path 204 are connected in a manner that allows the refrigerant to flow therethrough. Yet another end of the first connecting flow path 203 and the first flow path 205 are connected in a manner that allows the refrigerant to flow therethrough.

[0068] The second connecting pipe 230 is passed through the second through hole 214. It can also be said that the second connecting pipe 230 is connected to the first forming portion 184. The second connecting pipe 230 is a cylinder having a hollow inside. The second connecting pipe 230 extends in the Z direction. The hollow of the second connecting pipe 230 can also be said to be the second connecting flow path 206 through which the refrigerant flows. An end of the second connecting flow path 206 branches into three. One end of the second connecting flow path 206 and the third flow path 207 are connected in a manner that allows the refrigerant to flow therethrough. Another end of the second connecting flow path 206 and the second flow path 204 are connected in a manner that allows the refrigerant to flow therethrough. Yet another end of the second connecting flow path 206 and the first flow path 205 are connected in a manner that allows the refrigerant to flow therethrough.

[0069] In the cooling module 200, the refrigerant first flows from the supply flow path 201 to the fourth flow path 202. Next, the refrigerant flows from the fourth flow path 202 to the first connecting flow path 203. Next, the refrigerant flows from the first connecting flow path 203 to the second flow path 204 and the first flow path 205. Next, the refrigerant flows from the second flow path 204 and the first flow path 205 to the second connecting flow path 206. The refrigerant that has passed through the second flow path 204 and the first flow path 205 merges at the second connecting flow path 206. Next, the refrigerant flows from the second connecting flow path 206 to the first flow path piece 207A of the third flow path 207. Next, the refrigerant flows from the first flow path piece 207A through the second flow path piece 207B to the third flow path piece 207C. Next, the refrigerant flows from the third flow path piece 207C to the discharge flow path 208. The refrigerant that has passed through the discharge flow path 208 is discharged to the outside. In this manner, the refrigerant flows through the cooling module 200. The coolant is supplied from the supply port, passes through the flow path, and is discharged from the discharge port, so that the cool coolant constantly flows through the flow path.

[0070] <Layout of electrical components inside the case> Each of the semiconductor modules 12U, 12V, and 12W is sealed in a sealing member 14. The semiconductor modules 12U, 12V, and 12W have two main surfaces 14A and a side surface connecting the two main surfaces 14A. The length between the two main surfaces 14A may be referred to as the thickness of the semiconductor modules 12U, 12V, and 12W. The three semiconductor modules 12U, 12V, and 12W are disposed in the flow path forming portion 177 such that the main surface 14A of the sealing member 14 overlaps with the second forming portion 187. The three semiconductor modules 12U, 12V, and 12W are thermally connected to the flow path forming portion 177. It can also be said that the semiconductor modules 12U, 12V, and 12W have a thickness in the Z direction.

[0071] As an example, the three semiconductor modules 12U, 12V, and 12W are arranged from the fourth side wall 172D toward the second side wall 172B in the order of U-phase semiconductor module 12U, V-phase semiconductor module 12V, and W-phase semiconductor module 12W. Note that the arrangement order is not limited to this. The semiconductor modules 12U, 12V, and 12W each have a first side surface 14B on the smoothing capacitor 20 side and a second side surface 14C on the motor connector 140 side as side surfaces.

[0072] The high potential side input terminal 11A, the low potential side input terminal 11B, and the signal terminal 11D are exposed from the first side surface 14B. The high potential side input terminal 11A and the low potential side input terminal 11B extend in the X direction toward the smoothing capacitor 20. The signal terminal 11D has a first extension portion 11E extending toward the smoothing capacitor 20 and a second extension portion 11F extending from the tip of the first extension portion 11E toward the control board 15. As an example, the first extension portion 11E extends in the X direction. The second extension portion 11F extends in the Z direction. The motor terminal 11C is exposed from the second side surface 14C. The motor terminal 11C extends in the X direction toward the motor connector 140.

[0073] The motor connector 140 has a connecting bus bar 130 and a sealing resin that seals the connecting bus bar 130. An end of the connecting bus bar 130 and a motor terminal 11C are electrically and mechanically connected via a bolt or the like. The connecting bus bar 130 extends to the outside of the storage space through a motor connector arrangement hole 182. The other end of the connecting bus bar 130 is connected to the winding of the corresponding motor 4.

[0074] The smoothing capacitor 20 is housed in a recess 176 of the main body 170. In a plan view, the semiconductor modules 12U, 12V, and 12W and the smoothing capacitor 20 are arranged in the housing 160 in a manner that they are aligned in the X direction. The upper surface 20A of the smoothing capacitor 20 facing the control board 15 is provided closer to the control board 15 in the Z direction than the main surface 14A of the semiconductor modules 12U, 12V, and 12W facing the control board 15. In addition, the smoothing capacitor 20 is provided, as an example, such that the second end surface 25 of the capacitor element 21 faces the bottom of the capacitor case 22. The first end surface 24 of the capacitor element 21 faces the opening of the capacitor case 22. The main surface 14A may be referred to as a first upper surface. The upper surface 20A may be referred to as a second upper surface.

[0075] As shown in FIG. 3, one end of the first terminal 24A and one end of the second terminal 24B are provided on the first end surface 24 of the smoothing capacitor 20. The first terminal 24A extends in the Y direction toward the bus bar insertion hole 181. The second terminal 24B extends in the X direction toward the semiconductor modules 12U, 12V, and 12W. One end of the third terminal 25A and one end of the fourth terminal 25B are provided on the second end surface 25. The third terminal 25C extends along the bottom surface and side surface of the capacitor element 21, and then extends in the Y direction toward the bus bar insertion hole 181. The fourth terminal 25B extends along the bottom surface and side surface of the capacitor element 21, and then extends in the X direction toward the semiconductor modules 12U, 12V, and 12W. One end of the high potential side second connection part 112 is connected to the other end of the first terminal 24A. The high potential side input terminal 11A is connected to the other end of the second terminal 24B. The other end of the third terminal 25A is connected to one end of the low potential side second connection part 122. The other end of the fourth terminal 25B is connected to the low potential side input terminal 11B.

[0076] The noise filter 70 is provided on the opposite side of the semiconductor modules 12U, 12V, and 12W via the flow path forming portion 177. The noise filter 70 is fixed to the outer bottom surface 171B of the flow path forming portion 177. The noise filter 70 overlaps the flow path forming portion 177 in the Z direction and overlaps the connecting portion 175 in the X direction. The noise filter 70 is provided in an overlapping region where a projected region of the flow path forming portion 177 in the Z direction and a projected region of the connecting portion 175 in the X direction overlap. In this embodiment, more strictly speaking, the entire noise filter 70 overlaps the flow path forming portion 177 in the X direction. Note that the entire noise filter 70 does not have to overlap the flow path forming portion 177 in the X direction.

[0077] As an example, in the noise filter 70, the Y capacitor 30 is disposed adjacent to the bus bar insertion hole 18 in the X direction, and the magnetic core 60 is disposed adjacent to the motor connector arrangement hole 182 in the X direction. Both the Y capacitor 30 and the magnetic core 60 are fixed to the outer bottom surface 171B of the flow path forming portion 177.

[0078] The other ends of second connection portions 112, 122 are connected to one end of Y capacitor 30. Second connection portions 112, 122 extend toward bus bar insertion hole 181 and are then electrically connected to terminals 24A, 24B through bus bar insertion hole 181. First connection portions 111, 121 are connected to the other end of Y capacitor 30. First connection portions 111, 121 extend toward terminal block arrangement hole 183. Terminal block 150 is passed through terminal block arrangement hole 183. Terminal block 150 has first connection portions 111, 121 and a sealing resin that seals first connection portions 111, 121.

[0079] One end of the first connection parts 111, 121 and the other end of the second connection parts 112, 122 are electrically and mechanically connected via a bolt or the like. The first connection parts 111, 121 extend into the storage space through the terminal block arrangement hole 183 and the sealing resin. The other ends of the first connection parts 111, 121 are electrically connected to a battery connector 2A that is connected to the battery 2 inside the storage space. The magnetic core 60 is provided in a ring shape to cover the area between the connection part of the first connection parts 111, 121 with the Y capacitor 30 and the terminal block 150.

[0080] <Action and effect> The power converter 10 includes semiconductor modules 12U, 12V, and 12W, a noise filter 70, a smoothing capacitor 20, a high-potential side bus bar 110, a low-potential side bus bar 120, a housing 160, and a cooler 240. The semiconductor modules 12U, 12V, and 12W have a thickness in the Z direction and a signal terminal 11D extending in the Z direction and connected to a control board 15. The smoothing capacitor 20 is electrically connected to the semiconductor modules 12U, 12V, and 12W. The smoothing capacitor 20 and the battery 2 are connected via the high-potential side bus bar 110 and the low-potential side bus bar 120. The noise filter 70 is electrically or magnetically connected to the high-potential side bus bar 110 and the low-potential side bus bar 120. More specifically, the noise filter 70 is electrically or magnetically connected to the first connection parts 111 and 121 and the second connection parts 112 and 122.

[0081] The housing 160 has a bottom 171 that is thermally connected to the semiconductor modules 12U, 12V, and 12W, the noise filter 70, and the smoothing capacitor 20. The cooler 240 cools the semiconductor modules 12U, 12V, and 12W. The bottom 171 has an inner bottom surface 171A on the control board 15 side and an outer bottom surface 171B on the back side thereof. The bottom 171 has a flow path forming portion 177, a lower bottom 173, and a connecting portion 175. The lower bottom 173 is provided at a position farther away from the control board 15 in the Z direction than the flow path forming portion 177. The connecting portion 175 connects the flow path forming portion 177 and the lower bottom 173. The flow path forming portion 177 includes a second flow path 204 provided on the semiconductor modules 12U, 12V, and 12W side, a third flow path 207 provided on the noise filter 70 side, and a base portion 211 that separates these flow paths. The semiconductor modules 12U, 12V, and 12W are sandwiched between the cooler 240 and the flow path forming portion 177.

[0082] The entire bottom 171 is cooled by the refrigerant. More specifically, the flow path forming portion 177 and the lower bottom 173 are cooled by the refrigerant. The heat of the semiconductor modules 12U, 12V, and 12W is dissipated to the inner bottom surface 171A of the flow path forming portion 177 and the cooler 240. The heat of the noise filter 70 is dissipated to the outer bottom surface 171B of the flow path forming portion 177. The heat of the smoothing capacitor 20 is dissipated to the inner bottom surface 171A of the lower bottom 173. In addition, since the semiconductor modules 12U, 12V, and 12W are provided near the control board 15 in a state where they are arranged on the flow path forming portion 177, the connection between the signal terminal 11D and the control board 15 can be maintained good even if vibrations or the like occur during use. It is now possible to efficiently dissipate heat from the three components, namely, the semiconductor modules 12U, 12V, and 12W, the smoothing capacitor 20, and the noise filter 70, to the bottom 171 while maintaining good connection between the signal terminal 11D and the control board 15. In addition, since it is now possible to dissipate heat from both sides of the semiconductor modules 12U, 12V, and 12W, which are the main heat generating components, the semiconductor modules 12U, 12V, and 12W can be efficiently cooled. Furthermore, the dead space between the flow path forming portion 177 and the control board 15 can be reduced, suppressing an increase in size in the Z direction.

[0083] In this embodiment, the noise filter 70 has a Y capacitor 30 and a magnetic core 60. The Y capacitor 30 and the magnetic core 60 remove noise components caused by the currents flowing through the first connecting portions 111, 121 and the second connecting portions 112, 122. This makes it possible to suppress the radiation noise emitted from the first connecting portions 111, 121 and the second connecting portions 112, 122. The propagation of the radiation noise to the semiconductor modules 12U, 12V, 12W and the control board 15 is suppressed.

[0084] The power converter 10 further includes a heat dissipation member 80 having a higher thermal conductivity than air. In this embodiment, the heat dissipation member 80 is provided between the noise filter 70 and the outer bottom surface 171B of the flow path forming portion 177, and between the smoothing capacitor 20 and the inner bottom surface 171A of the lower bottom 173. This allows the heat of the noise filter 70 and the smoothing capacitor 20 to be efficiently dissipated to the bottom 171.

[0085] In the X direction, the entire noise filter 70 overlaps the connecting portion 175. In other words, the entire noise filter 70 is provided in the X direction projection area of ​​the connecting portion 175. This prevents the size of the power conversion device 10 from increasing in the Z direction.

[0086] The continuous portion 178 is formed with a busbar insertion hole 181 penetrating the inner bottom surface 171A and the outer bottom surface 171B. The busbar insertion hole 181 is a hole through which the second connection portions 112 and 122 are passed. The busbar insertion hole 181 is not formed between the semiconductor modules 12U, 12V, and 12W and the smoothing capacitor 20 in the X direction. In addition, a heat dissipation member 80 is provided between the smoothing capacitor 20 and the connecting portion 175. The connecting portion 175 and the smoothing capacitor 20 are in close contact with each other via the heat dissipation member 80. This allows the heat of the smoothing capacitor 20 to be efficiently dissipated to the connecting portion 175. Furthermore, it is possible to suppress an increase in the size of the power conversion device 10 in the X direction. It is possible to suppress the shape of the lower base 173 from becoming complicated.

[0087] The power converter 10 has two connecting pipes 220, 230 connected to the first forming section 184. The flow path forming section 177 has a fourth flow path 202 that is not continuous with the third flow path 207 and to which the refrigerant is first supplied. The first connecting pipe 220 includes therein a first connecting flow path 203 that communicates with the first flow path 205, the second flow path 204, and the fourth flow path 202. This allows the heat of the semiconductor modules 12U, 12V, and 12W to be dissipated to both the refrigerant flowing through the first flow path 205 and the refrigerant flowing through the second flow path 204. The heat of the semiconductor modules 12U, 12V, and 12W can be dissipated efficiently.

[0088] The second connecting pipe 230 includes therein a second connecting flow path 206 that communicates with the first flow path 205, the second flow path 204, and the third flow path 207. A flow path through which a refrigerant that cools the semiconductor modules 12U, 12V, and 12W flows is provided upstream of the third flow path 207 that cools the noise filter 70. In the power conversion device 10, the semiconductor modules 12U, 12V, and 12W are the main heat generating components. Since the first flow path 205 and the second flow path 204 are provided upstream of the third flow path 207, the heat of the semiconductor modules 12U, 12V, and 12W can be efficiently dissipated.

[0089] The flow path forming portion 177 has a supply pipe 200A and a discharge pipe 200B. The supply pipe 200A is a pipe connected to the fourth flow path 202 and through which the refrigerant is supplied. The discharge pipe 200B is a pipe connected to the third flow path 207 and through which the refrigerant is discharged. The supply pipe 200A and the discharge pipe 200B are provided on the edge of one end side in the Y direction of the base portion 211. This makes it possible to gather the inlet and outlet of the refrigerant in one place. Also, an increase in the size of the flow path forming portion 177 can be suppressed.

[0090] Second embodiment FIG. 9 is a cross-sectional view of the power converter 10 of the second embodiment. The semiconductor modules 12U, 12V, and 12W have a main surface 14A facing the control board 15. The smoothing capacitor 20 has an upper surface 20A facing the control board 15. In the second embodiment, the main surface 14A is provided closer to the control board 15 in the Z direction than the upper surface 20A. In order to achieve this, the second embodiment uses a smoothing capacitor 20 that is smaller in size in the Z direction than the first embodiment, for example, to make the second embodiment possible. As another method, not shown, the first end surface 24 and the second end surface 25 are arranged to face each other in the X direction or the Y direction. With these configurations, the second embodiment also has the same effects as the first embodiment. In addition, the increase in size of the power converter 10 in the Z direction can be suppressed.

[0091] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one, or less than one element are also within the scope and concept of the present disclosure.

[0092] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple dependent claims. Some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. Furthermore, some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. The claims described in these multiple dependent forms define multiple technical ideas.

[0093] (Technical thought 1) a semiconductor module (12U, 12V, 12W) having a thickness in one direction (Z) and a signal terminal (11D) extending in said one direction and connected to a substrate (15); a first electrical component (20) electrically connected to the semiconductor module; a conductive member (111, 121, 112, 122) that connects the battery (2) and the first electric component; a second electrical component (70) electrically or magnetically connected to the conductive member; a housing (160) having a bottom (171) including an inner bottom surface (171A) facing the substrate and an outer bottom surface (171B) located on the back side of the inner bottom surface, the housing having a bottom (171) to which the semiconductor module, the first electric component, and the second electric component are thermally connected; a cooler (240) including a first flow path (205) for cooling the semiconductor module; The bottom is a first arrangement portion (177) in which the semiconductor module is arranged on the inner bottom surface side and the second electric component is arranged on the outer bottom surface side; a second arrangement portion (173) provided at a position farther from the substrate in the one direction than the first arrangement portion, and in which the first electrical component is arranged on the inner bottom surface side; A connecting portion (175) that connects the first arrangement portion and the second arrangement portion, The first arrangement section is a second flow path (204) provided on the semiconductor module side, a third flow path (207) provided on the second electric component side, and a wall (211) separating the second flow path and the third flow path, The power conversion device, wherein the semiconductor module is sandwiched between the cooler and the first arrangement portion.

[0094] (Technical thought 2) The power conversion device according to Technical Idea 1, wherein the second electric component includes at least one of a capacitor (30) and a magnetic core (60) for removing noise flowing through the conductive member.

[0095] (Technical Thought 3) Further comprising a heat dissipation member (80) having a higher thermal conductivity than air, A power conversion device described in technical idea 1 or 2, wherein the heat dissipation member is provided at least either between the outer bottom surface of the first arrangement portion and the second electrical component, or between the inner bottom surface of the second arrangement portion and the first electrical component.

[0096] (Technical Thought 4) The power conversion device according to any one of Technical Ideas 1 to 3, wherein the entire second electric component overlaps with the connecting portion with respect to an arrangement direction (X) in which the first electric component and the second electric component are arranged.

[0097] (Technical Thought 5) The device further includes two connecting pipes (220, 230) connected to the first arrangement portion, the first arrangement portion further includes a fourth flow path (202) that is discontinuous with the third flow path and to which the refrigerant is initially supplied, on the third flow path side of the wall; A power conversion device described in any one of technical ideas 1 to 4, wherein one of the two connecting pipes includes a connecting flow path (203) therein that connects the first flow path, the second flow path, and the fourth flow path and supplies the refrigerant from the fourth flow path to the first flow path and the second flow path.

[0098] (Technical Thought 6) A power conversion device as described in technical idea 5, wherein another of the two connecting pipes includes a second connecting flow path (206) therein, which is different from the first connecting flow path, which is the connecting flow path, and connects the first flow path, the second flow path, and the third flow path, and discharges the refrigerant from the first flow path and the second flow path to the third flow path.

[0099] (Technical Thought 7) a supply pipe (200A) connected to the fourth flow path to receive the refrigerant; a discharge pipe (200B) connected to the third flow path and through which the refrigerant is discharged, The power conversion device according to technical idea 5 or 6, wherein the supply pipe and the discharge pipe are provided on the same edge of the first arrangement portion.

[0100] (Technical Thought 8) The bottom is provided with an insertion hole (181) for passing the conductive member through, the insertion hole is not formed between the first electrical component and the second electrical component in the arrangement direction, the heat dissipation member is further provided between the connecting portion and the first electric component, The power conversion device according to Technical Concept 4, wherein the connecting portion and the first electric component are in close contact with each other via the heat dissipation member.

[0101] (Technical Thought 9) A power conversion device described in any one of technical ideas 1 to 8, wherein a second upper surface (20A) of the first electrical component facing the substrate is farther from the substrate in the one direction than a first upper surface (14A) of the semiconductor module facing the substrate. [Explanation of symbols]

[0102] 111, 112 first connection portion, 11D signal terminal, 121, 122 second connection portion, 12U, 12V, 12W semiconductor module, 14A main surface, 15 control board, 160 housing, 171 bottom, 171A inner bottom surface, 171B outer bottom surface, 173 lower bottom, 175 connecting portion, 177 flow path forming portion, 181 bus bar insertion hole, 184 first forming portion, 187 second forming portion, 188 flow path, 189 protrusion, 2 battery, 20 smoothing capacitor, 20A upper surface, 200A supply pipe, 200B discharge pipe, 202 fourth flow path, 203 first connecting flow path, 204 second flow path, 205 first flow path, 206 Second connecting flow path, 207 third flow path, 211 base, 220 first connecting pipe, 230 second connecting pipe, 30 Y capacitor, 60 magnetic core, 70 noise filter, 80 heat dissipation member, X arrangement direction, Z one direction.

Claims

1. a semiconductor module (12U, 12V, 12W) having a thickness in one direction (Z) and a signal terminal (11D) extending in said one direction and connected to a substrate (15); a first electrical component (20) electrically connected to the semiconductor module; a conductive member (111, 121, 112, 122) that connects the battery (2) and the first electric component; a second electrical component (70) electrically or magnetically connected to the conductive member; a housing (160) including an inner bottom surface (171A) facing the substrate and an outer bottom surface (171B) located on the back side of the inner bottom surface, the housing having a bottom (171) to which the semiconductor module, the first electrical component, and the second electrical component are thermally connected; a cooler (240) including a first flow path (205) for cooling the semiconductor module; The bottom is a first arrangement portion (177) in which the semiconductor module is arranged on the inner bottom surface side and the second electric component is arranged on the outer bottom surface side; a second arrangement portion (173) provided at a position farther from the substrate in the one direction than the first arrangement portion, and in which the first electrical component is arranged on the inner bottom surface side; A connecting portion (175) that connects the first arrangement portion and the second arrangement portion, The first arrangement unit is a second flow path (204) provided on the semiconductor module side, a third flow path (207) provided on the second electric component side, and a wall (211) separating the second flow path and the third flow path; The power conversion device, wherein the semiconductor module is sandwiched between the cooler and the first arrangement portion.

2. 2. The power conversion device according to claim 1, wherein the second electric component includes at least one of a capacitor (30) and a magnetic core (60) for removing noise flowing through the conductive member.

3. Further comprising a heat dissipation member (80) having a higher thermal conductivity than air, The power conversion device according to claim 2 , wherein the heat dissipation member is provided at least one between the outer bottom surface of the first arrangement portion and the second electrical component, and between the inner bottom surface of the second arrangement portion and the first electrical component.

4. The power conversion device according to claim 3 , wherein the entire second electric component overlaps the connecting portion in an arrangement direction (X) in which the first electric component and the second electric component are arranged.

5. The device further includes two connecting pipes (220, 230) connected to the first arrangement portion, The first arrangement portion further includes a fourth flow path (202) that is discontinuous with the third flow path and to which the refrigerant is initially supplied, on the third flow path side of the wall, The power conversion device according to any one of claims 1 to 4, wherein one of the two connecting pipes includes a connecting flow path (203) therein that connects the first flow path, the second flow path, and the fourth flow path and supplies the refrigerant from the fourth flow path to the first flow path and the second flow path.

6. 6. The power conversion device of claim 5, wherein another of the two connecting pipes includes a second connecting flow path (206) therein, which is different from the first connecting flow path, which is the connecting flow path, and connects the first flow path, the second flow path, and the third flow path, and discharges the coolant from the first flow path and the second flow path to the third flow path.

7. a supply pipe (200A) connected to the fourth flow path to which the refrigerant is supplied; a discharge pipe (200B) connected to the third flow path and through which the refrigerant is discharged, The power conversion device according to claim 6 , wherein the supply pipe and the discharge pipe are provided on the same edge of the first arrangement portion.

8. The bottom is provided with an insertion hole (181) for passing the conductive member through, the insertion hole is not formed between the first electrical component and the second electrical component in the arrangement direction, the heat dissipation member is further provided between the connecting portion and the first electrical component, The power conversion device according to claim 4 , wherein the connecting portion and the first electric component are in close contact with each other via the heat dissipation member.

9. A power conversion device according to any one of claims 1 to 4, wherein a second upper surface (20A) of the first electrical component facing the substrate is farther from the substrate in the one direction than a first upper surface (14A) of the semiconductor module facing the substrate.

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