Transport system and transport method

Abstract

To provide a technology capable of efficiently transporting objects to a plurality of processing modules and improving the footprint.SOLUTION: A transport system includes a transport module extending in a first direction, a plurality of processing modules provided along the extension direction of the transport module, and a loader module connected to the transport module and extending along a second direction perpendicular to the first direction. The loader module includes a main housing having a load port for loading an object to be transported into the loader module, and a sub-housing formed separately from the main housing and smaller than the main housing, connected to the main housing in the second direction and connected to the transport module. The second direction is parallel to a carrier transport line that transports a carrier containing the object to be transported.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a conveying system and a conveying method.

Background Art

[0002] Patent Document 1 discloses a conveying system (probe system) that conveys a carrier containing a plurality of wafers as conveyed objects by a conveying mechanism and delivers the wafers to each of a plurality of processing modules (probe devices). This conveying system includes a loader module (receiving and delivering mechanism) for each of the plurality of processing modules. By receiving the wafers from the carrier conveyed by the conveying mechanism by the loader module and conveying the wafers to the processing module, each processing module inspects the wafers.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technology that can efficiently convey a conveyed object to a plurality of processing modules and can improve the footprint.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, there is provided a conveyance system including a conveyance module extending in a first direction, a plurality of processing modules connected to the conveyance module and provided along the extending direction of the conveyance module, and a loader module connected to the conveyance module and extending along a second direction orthogonal to the first direction. The loader module includes a main housing having a load port for loading a conveyed object into the loader module, and a sub-housing formed separately from the main housing and smaller than the main housing, the sub-housing being connected to the main housing in the second direction and connected to the conveyance module. The second direction is parallel to a carrier conveyance line for conveying a carrier containing the conveyed object.

Advantages of the Invention

[0006] According to one aspect, it is possible to efficiently convey a conveyed object to a plurality of processing modules and improve the footprint.

Brief Description of the Drawings

[0007] [Figure 1] FIG. 15 is a plan view showing an example of a work place where a conveyance system according to an embodiment is installed. [Figure 2] FIG. 18 is a plan view showing an enlarged substrate inspection unit and a ceiling conveyance device. [Figure 3] FIG. 21 is a plan view showing an enlarged loader module and an inspection device. [Figure 4] FIG. 24 is a perspective view showing a main housing and a sub-housing of a loader module. [Figure 5] FIG. 27 is a perspective view showing an enlarged X-axis negative direction side of a conveyance module and an inspection device. [Figure 6] FIG. 6(A) is a plan view exemplifying a function of adjusting the length in the extending direction of a conveyance module. FIG. 6(B) is an enlarged plan view showing the connection between divided frames. FIG. 6(C) is an enlarged side view showing the connection between divided frames. [Figure 7]FIG. 7(A) is a front view showing the energy management device. FIG. 7(B) is a side view showing the energy management device. [Figure 8] It is a flowchart showing the conveyance method according to the embodiment.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are given to the same components, and redundant descriptions may be omitted.

[0009] FIG. 1 is a plan view showing an example of a work place 2 where a conveyance system 1 according to an embodiment is installed. As shown in FIG. 1, the conveyance system 1 is constructed in a work place 2 such as a facility for manufacturing semiconductors or a facility for inspecting semiconductors. In the embodiment, a conveyance system 1 for conveying a substrate W (see FIG. 2), which is an object to be conveyed, to an inspection device 50 will be described. Examples of the substrate W to be inspected by the inspection device 50 include wafers (substrates to be inspected) in which a plurality of semiconductor devices as inspection devices (DUT: Devices Under Test) are arranged in a matrix. Note that the substrate W is not limited to a wafer, and may be a carrier having a semiconductor device, a glass substrate, a single chip, an electronic circuit board, or the like.

[0010] The conveyance system 1 includes an overhead hoist transport (OHT) 10 for conveying a carrier C, and a plurality of substrate inspection units 20. The carrier C is a container capable of accommodating a plurality (for example, 25) of substrates W. An example of this carrier C is a FOUP (Front Opening Unified Pod) with one side surface being openable and closable. The overhead hoist transport 10 conveys the carrier C in a state in which a plurality of substrates W are accommodated or in an empty state.

[0011] The ceiling conveyor device 10 includes a rail 11 fixed to the ceiling part of the work place 2, and a hoist mechanism (not shown) that travels along the rail 11 while holding the carrier C and is capable of moving the carrier C up and down. For example, the hoist mechanism has a function of holding the carrier C so as to suspend it and moving the carrier C up and down by a belt. Further, the ceiling conveyor device 10 includes a control device 19 for controlling the operation of the ceiling conveyor device 10 at an appropriate position in the work place 2.

[0012] In FIG. 1, for ease of understanding, the rail 11 is shown at a position separated from each substrate inspection unit 20, but the rail 11 is basically installed so as to pass above the loader module 30 of each substrate inspection unit 20 (see also FIG. 2). The hoist mechanism moving along the rail 11 can automatically set the carrier C on the loader module 30 by moving directly above the loader module 30 of the target substrate inspection unit 20 and lowering the carrier C. Conversely, the hoist mechanism can carry out the carrier C from the substrate inspection unit 20 by moving directly above the carrier C of the loader module 30 and holding and raising the carrier C.

[0013] For example, the rail 11 extends in the longitudinal direction at the center in the short side direction of the work place 2, and forms a carrier conveyance line that turns back at one end in the longitudinal direction and again extends in the longitudinal direction at the center in the short side direction of the work place 2. In FIG. 1, the longitudinal direction of the work place 2 refers to the horizontal direction of the drawing sheet, and the short side direction of the work place 2 refers to the vertical direction of the drawing sheet. By concentrating the rail 11 at the center in the short side direction in this way, the ceiling conveyor device 10 can efficiently convey the carrier C to all the substrate inspection units 20 in the work place 2 while shortening the moving distance of the plurality of carriers C.

[0014] The rail 11 may be in an endless form that can loop a plurality of hoist mechanisms. The ceiling transfer device 10 includes, for example, a carrier exchange unit (not shown) that performs recovery or replacement of the carrier C at the other longitudinal end of the endless rail 11. Note that the ceiling transfer device 10 may have a point rail that branches at an intermediate position of the rail 11 and include a carrier exchange unit on the point rail.

[0015] As the control device 19 of the ceiling transfer device 10, a computer including a processor, a memory, an input / output interface, a communication interface, etc., which are not shown, is applied. The processor is a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit composed of a plurality of discrete semiconductors, etc., and executes a program stored in the memory. The memory includes a main storage device composed of a semiconductor memory, etc., and an auxiliary storage device composed of a disk, a drive, a semiconductor memory (flash memory), etc.

[0016] The control device 19 moves the hoist mechanism to a target position on the rail 11 and controls the raising, holding, and releasing of the carrier C. Further, the control device 19 controls the carrier exchange unit to perform recovery, replacement, etc. of the carrier C and manages the states of the respective substrates W in the carrier C. Note that the control device 19 may be provided in parallel with a management computer that manages the entire transfer system 1 (workplace 2).

[0017] On one hand, each substrate inspection unit 20 of the transfer system 1 is installed so as to extend in a direction orthogonal to the extending direction of the rail 11 installed at the center in the short side direction. That is, the longitudinal direction of each substrate inspection unit 20 extends from the center in the short side direction of the work area 2 toward the end in the short side direction (the side surface of the work area 2). The work area 2 arranges the substrate inspection units 20 in pairs with the central rail 11 interposed therebetween, and arranges the substrate inspection units 20 side by side at intervals in the extending direction of the rail 11 (the longitudinal direction of the work area 2).

[0018] Each substrate inspection unit 20 is constructed as a unit that efficiently transfers each substrate W of the carrier C by combining a plurality of modules and performs inspection of the substrate W. Specifically, each substrate inspection unit 20 includes a loader module 30, a transfer module 40 connected to the loader module 30, and a plurality of inspection devices 50 connected to the transfer module 40. Each substrate inspection unit 20 takes out the substrate W from the carrier C transferred to the loader module 30 by the ceiling transfer device 10, transfers the substrate W to the target inspection device 50 via the transfer module 40, and inspects the substrate W in the inspection device 50.

[0019] FIG. 2 is a plan view showing an enlarged view of the substrate inspection unit 20 and the ceiling transfer device 10. Next, an example of the substrate inspection unit 20 will be described with reference to FIG. 2. In the description of the substrate inspection unit 20, the position and direction of each component will be described based on the direction of the arrow shown in FIG. 2. The X-axis direction in FIG. 2 is the horizontal direction of the paper surface and is the direction along the extending direction of the transfer module 40. The Y-axis direction in FIG. 2 is the vertical direction of the paper surface and is the direction along the extending direction of the loader module 30. The Z-axis direction in FIG. 2 is the front and back direction of the paper surface and is the height direction of the substrate inspection unit 20.

[0020] The loader module 30 of the substrate inspection unit 20 is provided below the rail 11 of the ceiling transfer device 10 in the vertical direction. The longitudinal direction of the loader module 30 is along the Y-axis direction. In other words, it is installed so that the longitudinal direction of the loader module 30 coincides with the rail 11 extending in the Y-axis direction.

[0021] FIG. 3 is a plan view showing a further enlarged view of the loader module 30 and the inspection device 50. FIG. 4 is a perspective view showing the main housing 35 and the sub-housing 36 of the loader module 30. As shown in FIGS. 3 and 4, the loader module 30 has a plurality (four in FIG. 2) of load ports 31 on which a plurality of carriers C can be placed, arranged side by side along the Y-axis direction.

[0022] The load port 31 of the loader module 30 receives the carrier C from the hoist mechanism of the ceiling transfer device 10 and delivers the carrier C to the hoist mechanism. The carrier C placed on the load port 31 is fixed by an engaging mechanism (not shown) of the load port 31. The carrier C can load and unload the substrate W by opening the surface in the positive X-axis direction as the shutter 32 of the load port 31 is opened.

[0023] The loader module 30 includes an in-house loader-side transfer device 33 for taking out the substrate W of the carrier C of each load port 31 and transferring it to the transfer module 40. This loader-side transfer device 33 is not particularly limited. For example, it has a base 331 movable in the longitudinal direction of the loader module 30, a plurality of arms 332 that can pivot, extend and contract, and move up and down with respect to the base 331, and a fork (end effector) 333 provided on the arm 332 on the end side. In FIG. 3, a loader-side transfer device 33 having two forks 333 is illustrated, but it is not limited to this. The loader-side transfer device 33 may have a configuration with one or three or more forks 333.

[0024] Inside the loader module 30, a passage 30s is provided along which the loader-side transport device 33 can move in the Y-axis direction. The loader module 30 may be configured to downflow clean air into the passage 30s. Also, inside the loader module 30, an aligner device 34 may be provided that detects the position and circumferential direction orientation (posture) of the substrate W and adjusts the positional deviation and posture of the substrate W in cooperation with the loader-side transport device 33. The loader module 30 in FIG. 3 has the aligner device 34 installed on the Y-axis positive side connected to the transport module 40 and on the X-axis negative side.

[0025] The loader module 30 includes a main housing 35 having each load port 31, and a sub-housing 36 formed separately from the main housing 35 and acting as an intermediate between the main housing 35 and the transfer module 40. The main housing 35 and the sub-housing 36 are installed so as to be aligned in the Y-axis direction. For example, the sub-housing 36 is connected to one end of the main housing 35 in the longitudinal direction (positive direction of the Y-axis). Note that while the internal frames of the main housing 35 and the sub-housing 36 are each formed separately, the loader module 30 may also be configured such that covers for the internal frames are continuous and integrated.

[0026] The main housing 35 is formed into a box body that is rectangular when viewed from the X-axis direction and L-shaped when viewed from the Y-axis direction by assembling a plurality of frames (not shown). The main housing 35 has the load ports 31 on the upper surface of the stepped portion of the L-shape. A door 35d is provided on the side surface of the main housing 35 in the negative Y-axis direction, allowing access to the passage 30s in the main housing 35 during maintenance or the like. The door 35d is a single-leaf door that opens and closes the opening of the main housing 35 with a single door panel. During maintenance or the like, an operator can easily access the loader-side conveying device 33 by opening the door 35d.

[0027] The sub-housing 36 is formed into a rectangular parallelepiped having a length that is long in the X-axis direction and short in the Y-axis direction in a plan view and having a predetermined height in the Z-axis direction by assembling a plurality of frames (not shown). This sub-housing 36 is formed smaller than the main housing 35. The loader module 30 according to the embodiment aligns the length of the sub-housing 36 in the longitudinal direction (X-axis direction) with the width of the main housing 35 in the short-side direction (X-axis direction). Also, the width of the sub-housing 36 in the Y-axis direction is set to match (or be greater than or equal to) the width of the transport module 40.

[0028] Inside the sub-housing 36, the above-described aligner device 34 is provided. Also, on the side surface of the sub-housing 36 in the positive Y-axis direction, a door 36d that can expose the inside of the sub-housing 36 during maintenance or the like is provided. The door 36d is a double-opening door that opens and closes the opening of the sub-housing 36. Specifically, the door 36d includes a first door panel 36d1 located on the negative X-axis side and a second door panel 36d2 located on the positive X-axis side. The first door panel 36d1 is pivotally supported by a hinge on the side on the negative X-axis side, and opens and closes the opening by rotation. The second door panel 36d2 is pivotally supported by a hinge on the side on the positive X-axis side, and opens and closes the opening by rotation. A locking mechanism capable of switching between mutual closing and opening is provided at the boundary between the first door panel 36d1 and the second door panel 36d2.

[0029] Also, as shown in FIGS. 3 and 4, the width of the second door panel 36d2 (the length along the X-axis direction in the closed state) is shorter than the width of the first door panel 36d1 (the length along the X-axis direction in the closed state). That is, while the first door panel 36d1 can largely open the opening of the sub-housing 36, the second door panel 36d2 can slightly open the opening of the sub-housing 36. Thereby, the second door panel 36d2 does not largely protrude outward when opened, and can surely avoid interference with the tester moving mechanism 54 described later. Note that the door 36d is not limited to the double-opening door as described above, and a folding door or the like may be used.

[0030] Inside the sub-housing 36, a controller 90 that controls the operation of each component of the board inspection unit 20 is installed. For example, the board inspection unit 20 arranges the controller 90 at an adjacent position to the door 36d (on the positive Y-axis side of the sub-housing 36), so that when the operator opens the door 36d, the controller 90 can be easily accessed.

[0031] Furthermore, the sub-housing 36 has a control panel 37 operable by the user on the side surface in the positive Y-axis direction. By installing the control panel 37 on the side surface in the positive Y-axis direction, the opportunity for the operator to work on the negative X-axis side where each load port 31 is located can be reduced, and the contact between the carrier C conveyed by the ceiling transfer device 10 and the operator can be reduced.

[0032] Inside the main housing 35 and inside the sub-housing 36, passages 30s of the loader-side transfer device 33 described above are respectively provided. The main housing 35 has an opening 35o communicating with the passage 30s on the side surface in the positive Y-axis direction. The sub-housing 36 has an opening 36o communicating with the passage 30s on the side surface in the negative Y-axis direction. The loader module 30 connects the openings 35o of the main housing 35 and the openings 36o of the sub-housing 36 so as to communicate with each other, enabling the loader-side transfer device 33 to be movable between the housings.

[0033] The above loader module 30 gives the main housing 35 among the two housings versatility applicable to various board inspection units 20. That is, even if the type of the board inspection unit 20 changes, the same main housing 35 can be applied. On the other hand, the loader module 30 gives the sub-housing 36 among the two housings customizability with which the configuration and shape can be changed according to the needs of each customer. For example, when the aligner device 34 is not required by the customer, it can be changed to a sub-housing 36 without the aligner device 34. By making the main housing 35 have the same standard while making the sub-housing 36 customizable in this way, the loader module 30 can suppress changes in the specifications of the entire module and respond to the needs of various customers.

[0034] The transfer module 40 is connected to the side surface on the positive X-axis side of the sub-housing 36 in the loader module 30 and extends linearly along the X-axis direction. That is, the extending direction of the longitudinal direction of the transfer module 40 is perpendicular to the extending direction of the longitudinal direction of the loader module 30. As shown in FIG. 2, a plurality (three) of inspection devices 50 are respectively connected to positions on both sides in the extending direction of the transfer module 40 (that is, the side surface in the positive Y-axis direction and the side surface in the negative Y-axis direction). Each inspection device 50 is connected so as to be perpendicular to the extending direction of the transfer module 40 (at an angle of 90°). However, each inspection device 50 may be connected to the transfer module 40 at an angle of, for example, about 45° to 90°.

[0035] The transfer module 40 receives and delivers the substrate W to and from the loader module 30, transfers the substrate W to the target inspection device 50 among the plurality of inspection devices 50, and delivers and receives the substrate W to and from the stage 52 of the target inspection device 50.

[0036] Specifically, the transfer module 40 includes a transfer housing 41 extending in the X-axis direction, a buffer portion 42 provided on the negative X-axis side of the transfer housing 41, and a transfer device 43 reciprocating along the X-axis direction within the transfer housing 41. Note that the transfer module 40 may be a vacuum transfer module that transfers the substrate W in a state where the transfer space 41s of the transfer housing 41 is decompressed to a vacuum atmosphere.

[0037] FIG. 5 is a perspective view showing an enlarged view of the negative X-axis side of the transfer module 40 and the inspection device 50. As shown in FIG. 5, the transfer housing 41 has its skeleton formed by assembling a base plate 411 and a plurality of frames 412. The transfer housing 41 constructs a sealed transfer space 41s by attaching panels (not shown) to these base plate 411 and the plurality of frames 412.

[0038] The base plate 411 of the transport housing 41 is fixed to the floor of the work area 2 via a plurality of legs 413. Each of the plurality of legs 413 has a level adjuster (not shown) capable of adjusting the height in the Z-axis direction. By adjusting each level adjuster when installing the transport module 40, the upper surface of the base plate 411 is adjusted to be horizontal.

[0039] A slide mechanism 44 of the transport device 43 is provided on the base plate 411 of the transport housing 41. The slide mechanism 44 includes a pair of rails 441 extending in the X-axis direction, an endless belt 442 extending laterally of the rails 441, a drive source 443 for rotating the belt 442, and a movable body 444 that moves in accordance with the movement of the belt 442. The movable body 444 bridges between the pair of rails 441, and by installing the transport device 43 on its upper surface, it serves as a base for supporting the transport device 43. The drive source 443 is connected to the controller 90 of the substrate inspection unit 20, and by controlling the drive by the controller 90, the belt 442 is rotated to reciprocally move the movable body 444 along the extending direction of the pair of rails 441. Note that the transport device 43 is not limited to the slide mechanism 44 including the belt 442 and the drive source 443, and various mechanisms may be adopted. As an example, the slide mechanism 44 may be configured to slide the movable body 444 by a linear motor.

[0040] FIG. 6(A) is a plan view illustrating a function of adjusting the length of the transport module 40 in the extending direction. FIG. 6(B) is an enlarged plan view showing the connection between the divided frames 415. FIG. 6(C) is an enlarged side view showing the connection between the divided frames 415. As shown in FIG. 6(A), the transport module 40 according to the embodiment is configured to be expandable in the extending direction (X-axis direction).

[0041] Specifically, the transport housing 41 is a split frame 415 adjusted according to the number of inspection devices 50 installed for the base plate 411 and the frame 412 (see FIG. 5). By connecting a plurality of split frames 415, a continuous form is achieved. Note that the belt 442 of the slide mechanism 44 is replaced with one that matches the moving range of the transport device 43 (the number of split frames 415), enabling the transport device 43 to move over substantially the entire length in the X-axis direction. Also, a pair of rails 441 are installed so as to be linearly aligned with respect to the pair of rails 441 of the adjacent split frame 415, for example, by being pre-attached to the set position of the base plate 411 of the split frame 415. Each rail 441 of one split frame 415 and each rail 441 of the other split frame 415 are connected, for example, by a connecting rail 454.

[0042] The adjacent split frames 415 are connected by an appropriate connecting structure 45. As the connecting structure 45, for example, as shown in FIG. 6(B), a V-block 451 may be provided on one split frame 415 while a pin 452 to be inserted into the V-block 451 is provided on the other split frame 415. In this case, by inserting the pin 452 into the V-shaped space of the V-block 451, one split frame 415 and the other split frame 415 can be easily positioned. Also, the height of each split frame 415 (base plate 411 and frame 412) can be adjusted using the level adjuster of the leg portion 413 described above.

[0043] Furthermore, as shown in FIG. 6(C), the connecting structure 45 installs a connecting plate 453 to eliminate the joint between the base plates 411 that support the pair of rails 441. The connecting structure 45 may be configured to continuously connect each rail 441 and the connecting rail 454 in series by fixing the connecting plate 453 to each base plate 411 using the connecting plate 453 with the above-mentioned connecting rail 454 pre-attached.

[0044] Returning to FIG. 5, the buffer unit 42 provided in the above-described transport housing 41 is disposed at an appropriate height position by a stand 421 placed on a base plate 411. This buffer unit 42 temporarily accommodates the substrate W conveyed by the loader-side transfer device 33 of the loader module 30 and delivers it to the transfer device 43. Further, the buffer unit 42 temporarily accommodates the substrate W conveyed by the transfer device 43 and delivers it to the loader-side transfer device 33. The buffer unit 42 may be provided with a load lock function capable of switching the internal space between an air atmosphere and a vacuum atmosphere.

[0045] A gate valve 46 for opening and closing the opening of the buffer unit 42 is provided on the side surface of the buffer unit 42 on the negative X-axis direction side. The gate valve may be provided on the side surface on the positive X-axis direction side. The substrate inspection unit 20 enables the transfer of the substrate W between the loader module 30 and the buffer unit 42 by opening the gate valve 46 on the negative X-axis direction side, and enables the decompression of the inside of the transfer module 40 including the buffer unit 42 by closing each gate valve 46. Further, the substrate inspection unit 20 enables the transfer of the substrate W between the transfer device 43 and the buffer unit 42 by opening the gate valve on the positive X-axis direction side.

[0046] Then, the transfer device 43 of the transfer module 40 loads and unloads the substrate W to and from the buffer unit 42. By moving in the X-axis direction by the movable body 444 of the slide mechanism 44, this transfer device 43 moves to the opposing position of the target inspection device 50 among the plurality of inspection devices 50 connected to the transfer module 40. The transfer device 43 advances into the opposing inspection device 50 and loads and unloads the substrate W to and from the inspection device 50.

[0047] The transfer device 43 is not particularly limited, but a device having an end effector 431 for holding the substrate W and a moving part 432 for moving the end effector 431 is applicable. As an example, the moving part 432 includes a telescopic arm (not shown) and a shaft part (not shown) that can rotate around an axis with the base end of the arm as a pivot point. Further, the moving part 432 includes a lifting mechanism 433 that can move up and down in the Z-axis direction, and is configured to be able to adjust the height position of the end effector 431. The moving part 432 of the transfer device 43 rotates the arm and the end effector 431 within a range of 180° or more. Thereby, the transfer device 43 can extend the end effector 431 toward each inspection device 50 connected to both side surfaces of the transfer module 40 respectively.

[0048] Further, the transfer device 43 may integrally travel on a pair of rails 441 and include a container 47 for temporarily accommodating the substrate W. For example, the container 47 is mounted on the movable body 444 of the slide mechanism 44 and is disposed on the positive X-axis side of the moving part 432. The container 47 has one or more openings 471 on the side surface on the negative X-axis side facing the moving part 432 through which the substrate W can be loaded and unloaded. The transfer device 43 rotates and moves up and down the moving part 432 so that the end effector 431 faces the opening 471, and then expands and contracts the arm to load and unload the substrate W between the inside of the container 47 through the opening 471.

[0049] Further, the container 47 may internally include an attitude adjustment device (aligner device: not shown) that cooperates with the transfer device 43 to adjust the position and attitude of the accommodated substrate W. By providing the attitude adjustment device at a position adjacent to the transfer device 43 in this way, when a misalignment or the like occurs in the substrate W, time loss such as the transfer device 43 moving and the aligner device 34 adjusting the misalignment of the substrate W can be shortened. Alternatively, the substrate inspection unit 20 can also be configured without the aligner device 34 of the loader module 30.

[0050] Incidentally, the storage body 47 may be configured to be installed at an appropriate position of the transfer module 40 in addition to moving integrally with the transfer device 43. For example, the transfer module 40 may include the storage body 47 at the end on the positive X-axis side (the end opposite to the loader module 30).

[0051] Also, as shown in FIG. 2, the transfer module 40 includes a plurality of detection sensors 48 for the transfer device 43 to recognize its position in the X-axis direction. The plurality of detection sensors 48 are installed, for example, at positions where the transfer device 43 can transfer the substrate W with respect to each of the plurality of inspection devices 50. However, the positions of the detection sensors 48 are not limited to this, and may be installed at equal intervals along the X-axis direction, for example. Also, the detection sensors 48 are not limited to being provided in plurality, and may be provided only one on the path of the transfer device 43. This is because the position of the transfer device 43 in the X-axis direction can be calibrated even by one detection sensor 48 detecting the position of the transfer device 43.

[0052] Each detection sensor 48 may be fixed to any of the ceiling, side wall, floor, etc. of the transfer housing 41. As the detection sensor 48, an optical sensor capable of optically detecting the presence or absence of the transfer device 43 can be applied. For example, the detection sensor 48 has a light projecting unit that irradiates inspection light and a light receiving unit that receives the reflected light of the inspection light, and outputs information on the presence or absence of the transfer device 43 by detecting a detection surface (not shown) installed on the transfer device 43. Note that as long as the position of the transfer device 43 can be detected, the type of the detection sensor 48 is not particularly limited, and it may be a distance sensor or the like, or a contact type sensor.

[0053] The controller 90 holds information on the position (X-axis coordinate) in the X-axis direction corresponding to the installation positions of the plurality of detection sensors 48. The controller 90 recognizes the X-axis coordinate of the transfer device 43 moving in the transfer housing 41 based on the timing when the detection sensor 48 acquires information on the presence of the transfer device 43 and the information on the X-axis coordinate it holds. Based on the recognition of the position of the transfer device 43, the controller 90 can accurately perform position control in the movement of the transfer device 43.

[0054] As shown in FIG. 5, the inspection device 50 connected to the above-described transfer module 40 inspects the electrical characteristics of the substrate W transferred by the transfer module 40. This inspection device 50 includes an inspection device housing 51 (only the frame is shown in FIG. 5) and a stage 52 that supports the substrate W inside the inspection device housing 51. The stage 52 has a moving mechanism (not shown) that moves the substrate W to a target three-dimensional coordinate position.

[0055] Returning to FIG. 2, the inspection device 50 includes a tester 53 that holds a probe card (not shown) having a plurality of probes that contact the substrate W above the inspection device housing 51 and performs an inspection of the substrate W. Further, the inspection device 50 includes a tester moving mechanism 54 that holds the tester 53 and moves the tester 53 between a test position (see the dashed line in FIG. 2) and a retracted position (see the two-dot chain line in FIG. 2). A support base 55 that supports the tester 53 is provided at the retracted position. Also, during inspection, the inspection device 50 installs each component such as a chiller (not shown) that adjusts the temperature of the substrate W and a suction mechanism (not shown) that depressurizes the inside of the inspection device housing 51 around the inspection device housing 51 and the tester moving mechanism 54.

[0056] The inspection device 50 is connected to the transfer module 40 in a direction perpendicular to (at a 90° angle) via a connection buffer unit 60. The connection buffer unit 60 allows the tester moving mechanism 54 and the like to be installed without interfering with the transfer housing 41 by disposing the inspection device housing 51 at a position away from the transfer housing 41. As shown in FIG. 5, the connection buffer unit 60 is configured by assembling a plurality of frames 61 and a panel (not shown). The connection buffer unit 60 is formed in a rectangular parallelepiped shape smaller than the moving part 432 of the transfer device 43 of the transfer module 40, and allows the moving part 432 to enter. Although not shown, a gate valve that closes the inspection device housing 51 may be provided inside the connection buffer unit 60.

[0057] The conveying module 40 sets the length of the split frame 415 according to the size of the entire inspection apparatus 50 including the inspection apparatus housing 51 and the tester moving mechanism 54 etc. connected to the connection buffer unit 60. For this reason, the conveying module 40 can install each inspection apparatus 50 at equal intervals by connecting the split frames 415 along the X-axis direction.

[0058] Also, the loader module 30, the conveying module 40, and each inspection apparatus 50 of the substrate inspection unit 20 require necessary energy such as power supply, gas supply (positive pressure), and gas suction (negative pressure) during the conveyance and inspection of the substrate W. The power is used for purposes such as operating various components of the substrate inspection unit 20, supplying inspection power and signals to the substrate W during inspection. The gas suction is used for purposes such as fixing the substrate W. The gas supply is used for purposes such as purification of the loader module 30 and pressure adjustment in the space. For this reason, the substrate inspection unit 20 has respective sources of power, gas suction, gas supply, etc., and includes an energy management device 70 for collectively managing (distributing, providing, shutting off, etc.) various required energies as shown in FIG. 2. That is, each source and each component of the substrate inspection unit 20 are connected via a path passing through the energy management device 70 once.

[0059] The energy management device 70 is provided, for example, one by one for each of a plurality of substrate inspection units 20, and is installed near the outside of the area where a plurality of inspection apparatuses 50 are arranged (also refer to FIG. 1). However, the system of the work place 2 may be configured to manage the required energy of a plurality (for example, two) of substrate inspection units 20 by one energy management device 70. Also, the installation position of the energy management device 70 is not particularly limited, and it may be installed, for example, on the loader module 30 side.

[0060] FIG. 7(A) is a front view showing an example of the energy management device 70. FIG. 7(B) is a side view showing an example of the energy management device 70. In FIGS. 7(A) and 7(B), for convenience of explanation, the state where the door of the openable device is removed is shown. The energy management device 70 includes a management device housing 71 and an operation panel 72 provided in the management device housing 71 and accessible to an operator in the open state of the door.

[0061] The management device housing 71 is formed into a rectangular parallelepiped that is long in the Z-axis direction (vertical direction) by assembling a plurality of frames and a plurality of panels. At the bottom of the management device housing 71, a plurality of casters 71a that facilitate the movement of the management device housing 71 and a plurality of fixing bodies 71b that fix the management device housing 71 to an installation location are provided. Inside the management device housing 71, a part of the cables and pipes connected to the power generation source of the required energy and a part of the cables and pipes connected to each of the plurality of inspection devices 50 are accommodated. Further, the management device housing 71 has an openable door (not shown) on each of the front and side surfaces. The energy management device 70 has the door closed during operation, and the door is opened by an operator during installation, maintenance, etc.

[0062] The operation panel 72 mounts various devices operated by an operator. The operation panel 72 exposes various devices in the state where the front door of the management device housing 71 is opened. The operation panel 72 is fixed closer to the front inside the management device housing 71 so that an operator can easily access it in the state where the front door is opened (see FIG. 7(B)). The operation panel 72 includes a power distribution board 73 that distributes power, a gas supply and distribution board 74 that distributes the supplied gas, and a gas suction and distribution board 75 that distributes the suction force. Note that the position of the operation panel 72 is not limited to the front inside the management device housing 71, and may be at the back, or may be at both the front and the back.

[0063] The power distribution board 73 is provided, for example, at a substantially middle position in the vertical direction of the management device housing 71. The power distribution board 73 is connected to the power generation source (power supply) via the main cable 76, and is also connected to each component of the substrate inspection unit 20 via a plurality of distribution cables. Further, on the front surface of the power distribution board 73, power cut-off devices such as breakers provided on the main cable 76 and each distribution cable are provided. The main cable 76 and each distribution cable accommodated in the management device housing 71 are routed through the vertical partition wall 711 partitioning the operation panel 72 to the space on the side of the operation panel 72. Thereby, the energy management device 70 can reduce the interference between each cable and the gas piping.

[0064] The gas supply and distribution board 74 is provided, for example, at an adjacent position below the power distribution board 73. The gas supply and distribution board 74 is connected to the gas generation source (supply pump etc.) via one primary side pipe 741, and is also connected to each component of the substrate inspection unit 20 via a plurality of secondary side pipes 742. Further, on the front surface of the gas supply and distribution board 74, valves 743 for opening and closing the flow paths of the primary side pipe 741 and each secondary side pipe 742, connectors (not shown) for connecting each secondary side pipe 742, etc. are provided. The primary side pipe 741 and each secondary side pipe 742 extend outside through the bottom of the management device housing 71.

[0065] The gas suction and distribution board 75 is provided, for example, at an adjacent position below the gas supply and distribution board 74. The gas suction and distribution board 75 is connected to the suction source (suction pump etc.) via one primary side pipe 751, and is also connected to each component of the substrate inspection unit 20 via a plurality of secondary side pipes 752. Further, on the front surface of the gas suction and distribution board 75, valves 753 for opening and closing the flow paths of the primary side pipe 751 and each secondary side pipe 752, connectors (not shown) for connecting each secondary side pipe 752, etc. are provided. The primary side pipe 751 and each secondary side pipe 752 extend outside through the bottom of the management device housing 71.

[0066] The above energy management device 70 can centrally manage the required energy (power supply, gas supply, gas suction). For example, before installing the device body, an operator can connect each cable and pipe by accessing the operation panel 72 once. Thereby, the man-hour can be reduced and the construction period when starting the operation of the device can be shortened. Further, the energy management device 70 can manage at one location the paths for shutting off and supplying dangerous energy such as electricity and gas. Furthermore, the energy management device 70 can shut off only the module in case of an abnormality in each module, and can avoid a decrease in the operation rate due to maintenance and troubleshooting.

[0067] Returning to FIG. 3, the controller 90 installed in the loader module 30 is configured as a computer having a processor, a memory, an input / output interface, and a communication interface (not shown). The controller 90 is connected to the above control panel 37, which is a user interface, via the input / output interface.

[0068] The control panel 37 has an input device operated by a user, such as a touch panel, buttons, a keyboard, etc. Further, the control panel 37 has a monitor including a touch panel, a speaker, a lamp, etc. as an output device.

[0069] Based on the content input by the operator via the control panel 37, the controller 90 controls each component of the loader module 30 and the transfer module 40 to transfer the substrate W within the substrate inspection unit 20. Further, the controller 90 issues a command to the inspection device 50 that has transferred the substrate W, and executes the inspection of the substrate W by the inspection device 50.

[0070] The transfer system 1 according to the embodiment is basically configured as described above, and its operation (transfer method) will be described below with reference to FIG. 8. FIG. 8 is a flowchart showing the transfer method according to the embodiment.

[0071] Based on the control of the control device 19 of the ceiling transfer device 10 and the controller 90 of the substrate inspection unit 20, the transfer system 1 executes the processing flow of steps S101 to S110 shown in FIG. 8.

[0072] Specifically, the control device 19 of the ceiling transfer device 10 conveys the carrier C by the hoist mechanism and sets the carrier C on the load port 31 of the target substrate inspection unit 20 (loader module 30) (step S101). For example, the control device 19 previously holds the coordinate positions of each load port 31 of each substrate inspection unit 20, reads out the coordinate position of the target load port 31, controls the movement of the hoist mechanism, and moves the carrier C directly above the load port 31. Then, after the control device 19 lowers the carrier C by the hoist mechanism and places the carrier C on the target load port 31, it releases the holding of the carrier C. Also, the controller 90 of the substrate inspection unit 20 acquires information indicating that the carrier C has been set from the load port 31 (or the control device 19) where the carrier C is set, and then proceeds to transfer the substrate W within the substrate inspection unit 20.

[0073] Specifically, the controller 90 controls the loader-side transfer device 33 of the loader module 30, takes out the substrate W from the carrier C, and carries it into the main housing 35 (step S102). Further, the controller 90 moves the loader-side transfer device 33 to the sub-housing 36 and conveys the held substrate W to the aligner device 34 (step S103). Then, the controller 90 controls the aligner device 34 and the loader-side transfer device 33 to adjust the position deviation and posture of the substrate W (step S104).

[0074] After that, the controller 90 takes out the substrate W from the aligner device 34 by the loader-side transfer device 33 and conveys the substrate W to the buffer unit 42 of the transfer module 40 (step S105). Therefore, the substrate W with its position deviation and posture adjusted is accommodated inside the buffer unit 42.

[0075] Next, the controller 90 controls the transfer device 43 and the slide mechanism 44 of the transfer module 40 to carry out the substrate W from the buffer unit 42 and transfer the substrate W to the facing position of the target inspection device 50 (step S106). In the movement of the transfer device 43, each detection sensor 48 arranged in the X-axis direction detects the presence or absence of the transfer device 43 and transmits detection information to the controller 90. The controller 90 can appropriately control the movement of the transfer device 43 by accurately recognizing the position of the transfer device 43 based on the detection information of each detection sensor 48.

[0076] Then, at the facing position of the inspection device 50, the controller 90 advances the substrate W into the inside of the inspection device housing 51 by the transfer device 43 and places the substrate W on the stage 52 of the inspection device 50 (step S107).

[0077] After the substrate W is placed, the controller 90 operates the tester 53 of the inspection device 50 to inspect the substrate W by the tester 53 (step S108).

[0078] After the inspection of the substrate W, when the controller 90 makes the end effector 431 of the transfer device 43 enter again to receive the substrate W on the stage 52, it carries out the substrate W from the inspection device 50 (step S109). Then, the controller 90 moves the transfer device 43 to transfer the substrate W to the buffer unit 42, operates the loader-side transfer device 33 to receive the substrate W in the buffer unit 42, and loads the substrate W into an appropriate carrier C (step S110). Thereby, the inspection of the substrate W by the substrate inspection unit 20 is completed.

[0079] The substrate inspection unit 20 repeats the inspection by transferring each of the plurality of substrates W accommodated in the carrier C to each inspection device 50, and stores the inspected substrate W in the carrier C. Then, the control device 19 of the ceiling transfer device 10 controls the hoist mechanism to hold the carrier C containing the plurality of inspected substrates W, raises (detaches) the carrier C from the substrate inspection unit 20, and transfers it along the rail 11.

[0080] By arranging the loader module 30 of the substrate inspection unit 20 along the extending direction of the rail 11 in the above-described conveying system 1, the carrier C can be smoothly set to the load port 31 at the target position. In particular, by adopting the same specifications for the main housing 35 in the loader module 30, changes in the configuration on the ceiling conveying device 10 side can be reduced, and the conveyance of the carrier C can be stabilized. On the other hand, since the sub-housing 36 of the loader module 30 can be customized, it is possible to easily respond to customer needs.

[0081] Note that the conveying system 1 and the conveying method of the present disclosure are not limited to the above-described embodiments, and various modifications are possible. For example, in the embodiment, the conveying system 1 in which the substrate inspection unit 20 having a plurality of inspection devices 50 as processing modules is arranged has been described. However, it is not limited to this, and the conveying system 1 may be applied with a substrate processing unit having a substrate processing device instead of part or all of the substrate inspection unit 20. Examples of the substrate processing device include processing modules that perform substrate processing such as film formation, etching, cleaning, bonding, and peeling on the substrate W. Further, the substrate processing device may be a device that processes the substrate W in a process after the substrate W is manufactured, such as a repair device, a marking device, a reflow device, and an appearance inspection device. In other words, the conveying system 1 can be applied to a configuration that conveys the substrate W to processing modules that perform various actions on the substrate W in the process of manufacturing the substrate W.

[0082] Also, the conveyed object conveyed by the conveying system is not limited to the substrate W, and may be, for example, a probe card, a polishing plate, or the like. Further, the conveyed object may be a consumable member applied to the processing module. An example of this consumable member includes a ring (such as a focus ring, an edge ring, etc.) arranged around the substrate W in the processing module.

[0083] Further, the device for conveying the carrier C is not limited to the ceiling conveyor 10 that conveys directly above the loader module 30, and may be a device that slides in the horizontal adjacent position of the loader module 30. Also, the transfer module 40 is not limited to being connected to the positive X-axis side of the sub-housing 36, and may be connected to the positive Y-axis side of the sub-housing 36, for example.

[0084] The technical idea and effects of the present disclosure described in the above embodiments will be described below.

[0085] A first aspect of the present disclosure includes a transfer module 40 extending in a first direction, a plurality of processing modules (inspection device 50) connected to the transfer module 40 and provided along the extending direction of the transfer module 40, and a loader module 30 connected to the transfer module 40 and extending along a second direction orthogonal to the first direction. The loader module 30 includes a main housing 35 having a load port 31 for loading the substrate W into the loader module 30, and a sub-housing 36 formed separately from the main housing 35 and smaller than the main housing 35, which is connected to the main housing 35 in the second direction and connected to the transfer module 40. The second direction is a direction parallel to the carrier transfer line (rail 11) that conveys the carrier C accommodating the substrate W.

[0086] According to the above, the transfer system 1 can efficiently transfer the substrate W to a plurality of processing modules (inspection device 50). Specifically, the transfer system 1 can stably transfer the carrier C containing the substrate W to the load port 31 of the main housing 35 of the loader module 30. Then, by transferring the substrate W to the transfer module 40 via the sub-housing 36 connected in the second direction of the main housing 35, it is possible to smoothly direct it to the target processing module. In particular, since the transfer system 1 does not need to install a mechanism for transferring the substrate W from the carrier C for each of the plurality of processing modules, the footprint of the entire system can be improved. In addition, since the transfer system 1 has a sub-housing 36 smaller than the main housing 35, the loader module 30 can be easily customized in a small range, making it easy to apply to various systems.

[0087] Further, the carrier transfer line (rail 11) extends along the second direction, and a plurality of units (substrate inspection unit 20) having the transfer module 40, a plurality of processing modules (inspection device 50), and the loader module 30 are provided at positions on both sides sandwiching the carrier transfer line. Thereby, the transfer system 1 can shorten the transfer distance of the carrier C and transfer the carrier C to the unit more efficiently.

[0088] Further, the sub-housing 36 includes an aligner device 34 inside for adjusting the displacement or posture of the substrate W. Thereby, the transfer system 1 can transfer the substrate W whose displacement and posture have been adjusted in the sub-housing 36 to the transfer module 40.

[0089] Further, the sub-housing 36 has a control panel 37 that can be operated by an operator on the side opposite to the connection portion with the main housing 35. Thereby, the transfer system 1 can reduce the opportunity for the operator to move to the load port 31 side and reduce the contact between the carrier C and the operator.

[0090] Further, the sub-housing 36 has a door 36d on the opposite side of the connection location with the main housing 35, which can expose the inside of the sub-housing 36. As a result, the conveying system 1 can easily access the inside of the loader module 30, and maintenance and the like can be efficiently performed.

[0091] Further, a plurality of processing modules (inspection devices 50) are respectively connected to both side surfaces in the second direction of the conveying module 40. As a result, the conveying system 1 can install many processing modules with respect to the conveying module 40, and the footprint can be further improved.

[0092] Further, the plurality of processing modules (inspection devices 50) respectively provided on both side surfaces in the second direction are connected while being shifted from each other in the first direction of the conveying module 40. As a result, even when the tester moving mechanism 54 that moves the tester 53 between the test position and the retracted position and the tester 53 are aligned in the first direction, compared with the case where the inspection device 50 is installed so as to face both side surfaces of the conveying module 40, the footprint in the first direction can be further improved.

[0093] Further, the plurality of processing modules are inspection devices 50 that inspect the substrate W which is the object to be conveyed. As a result, the conveying system 1 can efficiently perform the inspection of the substrate W by the inspection device 50.

[0094] Moreover, a second aspect of the present disclosure is a conveyance method of a conveyance system 1 including a conveyance module 40 extending in a first direction, a plurality of processing modules (inspection device 50) connected to the conveyance module 40 and provided along the extending direction of the conveyance module 40, and a loader module 30 connected to the conveyance module 40 and extending along a second direction orthogonal to the first direction, the method including: (A) conveying a carrier C accommodating a substrate W along a direction parallel to the second direction by a carrier conveyance line (rail 11) and placing the carrier on a load port 31 provided in a main housing 35 of the loader module 30; (B) after the step (A), taking out the substrate W from the carrier C of the load port 31 and conveying the substrate W to a sub-housing 36 that is separate from the main housing 35, smaller than the main housing 35, connected to the main housing 35 in the second direction, and connected to the conveyance module 40, and loading the substrate into the conveyance module 40; and (C) after the step (B), conveying the substrate W in the conveyance module 40 and conveying the substrate W to the processing module. Even in this case, the conveyance method can efficiently convey the substrate W to a plurality of processing modules and can improve the footprint.

[0095] The conveyance system 1 and the conveyance method according to the embodiments disclosed this time are illustrative in all respects and not restrictive. The embodiments can be modified and improved in various forms without departing from the scope and gist of the appended claims. The matters described in the above plurality of embodiments can adopt other configurations and can be combined within a non-contradictory range.

Description of Reference Numerals

[0096] 1 Conveyance system 11 Rail 30 Loader module 35 Main housing 36 Sub-housing 40 Conveyance module 50 Inspection device W Substrate

Claims

1. a transfer module extending in a first direction; a plurality of processing modules connected to the transfer module and arranged along the extension direction of the transfer module; a loader module connected to the transfer module and extending along a second direction perpendicular to the first direction; The loader module a main housing having a load port for loading an object into the loader module; a sub-casing that is separate from the main casing and smaller than the main casing, that is connected to the main casing in the second direction, and that is connected to the transfer module; the second direction is a direction parallel to a carrier transport line that transports the carrier containing the transported object; Conveying system.

2. the carrier transport line extends along the second direction, a plurality of units each including the transfer module, the plurality of processing modules, and the loader module are provided at positions on both sides of the carrier transfer line; The transport system according to claim 1 .

3. the sub-housing includes an aligner device therein for adjusting the positional deviation or posture of the transported object; 3. The transport system according to claim 1 or 2.

4. The sub-casing has a control panel that can be operated by an operator on the opposite side of the connection point with the main casing.

3. The transport system according to claim 1 or 2.

5. The sub-housing has a door on the opposite side of the connection point with the main housing, the door being able to expose the inside of the sub-housing.

3. The transport system according to claim 1 or 2.

6. the plurality of processing modules are connected to both side surfaces of the transfer module in the second direction, respectively; 3. The transport system according to claim 1 or 2.

7. the plurality of processing modules are inspection devices that inspect the substrates that are the transported objects; 3. The transport system according to claim 1 or 2.

8. a transfer module extending in a first direction; a plurality of processing modules connected to the transfer module and arranged along the extension direction of the transfer module; a loader module connected to the transport module and extending along a second direction perpendicular to the first direction, (A) transporting a carrier accommodating an object to be transported along a direction parallel to the second direction by a carrier transport line, and placing the carrier on a load port provided in a main housing of the loader module; (B) after the step (A), removing the transported object from the carrier of the load port, transporting the transported object to a sub-casing that is separate from the main casing and smaller than the main casing, that is connected to the main casing in the second direction, and that is connected to the transport module, and loading the transported object into the transport module; (C) after the step (B), transporting the object in the transport module to the processing module, Transportation method.

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