Multilayer electronic component

Abstract

To provide a multilayer electronic component with a high reliability and an improved capacity and resisting characteristic to voltages per unit volume.SOLUTION: In the multilayer electronic component according to an embodiment of the present invention, at least two third internal electrode layers EL3 including a third internal electrode 123 separate from a first external electrode 131 and a second external electrode are arranged between a first internal electrode layer EL1 including a first internal electrode 121 and a first dummy electrode 121d and a second internal electrode layer EL2 including a second internal electrode 122 and a second dummy electrode 122d.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor mounted on the printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Due to its advantages of being small in size, ensuring high capacitance, and being easy to mount, the multilayer ceramic capacitor can be used as a component in various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have higher output power, the requirements for miniaturization and higher capacitance of multilayer ceramic capacitors are increasing.

[0004] In order to improve the withstand voltage characteristics of multilayer ceramic capacitors, a structure that divides the voltage using floating electrodes has been developed. However, in the conventional floating electrode structure, due to the lengthwise gap between the floating electrodes, the overlap area may decrease, resulting in a significant reduction in capacitance.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of the various objects of the present invention is to provide a multilayer electronic component with excellent reliability. One of the various objects of the present invention is to provide a multilayer electronic component with improved capacitance per unit volume. One of the various objects of the present invention is to provide a multilayer electronic component with improved withstand voltage characteristics. One of the various objects of the present invention is to provide a multilayer electronic component having a structure capable of efficient production.

[0006] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0007] A multilayer electronic component according to an embodiment of the present invention includes a first internal electrode layer including a first dielectric layer and a first internal electrode and a first dummy electrode that are disposed separately from each other on the first dielectric layer, a second dielectric layer, and a second internal electrode and a second dummy electrode that are disposed separately from each other on the second dielectric layer, a second internal electrode layer, a third dielectric layer, and a third internal electrode layer including a third internal electrode disposed on the third dielectric layer, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, a main body including a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in the third direction, a first external electrode disposed on the third surface and connected to the first internal electrode and the second dummy electrode, and a second external electrode disposed on the fourth surface and connected to the second internal electrode and the first dummy electrode, the third internal electrode is disposed separately from the third surface and the fourth surface, the first internal electrode layer and the second internal electrode layer are alternately disposed in the first direction, and two or more third internal electrode layers can be disposed between the first internal electrode layer and the second internal electrode layer.

Effects of the Invention

[0008] One of the various effects of the present invention is that it is possible to improve the capacitance per unit volume while improving the withstand voltage characteristics of the multilayer electronic component.

[0009] One of the various effects of the present invention is that it is possible to provide a multilayer electronic component having a structure capable of efficient production.

[0010] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, for the sake of clearer explanation, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified), and elements indicated by the same reference numerals in the drawings are the same elements.

[0013] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the size and thickness of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation. Therefore, the present invention is not necessarily limited to what is shown in the drawings. Also, for components with the same function within the scope of the same concept, the same reference numerals are used for explanation. Furthermore, throughout the specification, when a certain part "includes" a certain component, this means that other components can be further included, rather than excluding other components, unless there is a particularly contrary description.

[0014] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0015] Stacked electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 3 schematically shows a cross-sectional view taken along line II-II' of FIG. 1, and FIG. 4 shows a plan view of the first internal electrode layer, the second internal electrode layer, and the third internal electrode layer.

[0016] Hereinafter, with reference to FIGS. 1 to 4, a laminated electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the laminated electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto.

[0017] The laminated electronic component 100 according to an embodiment of the present invention includes a first internal electrode layer EL1 including a first dielectric layer 111-1, a first internal electrode 121 and a first dummy electrode 121d that are disposed separately from each other on the first dielectric layer, a second dielectric layer 111-2, and a second internal electrode 122 and a second dummy electrode 122d that are disposed separately from each other on the second dielectric layer, a second internal electrode layer EL2, a third dielectric layer 111-3, and a third internal electrode 123 disposed on the third dielectric layer, a third internal electrode layer EL3. The laminated electronic component 100 includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in the third direction, a main body 110, a first external electrode 131 disposed on the third surface and connected to the first internal electrode and the second dummy electrode, and a second external electrode 132 disposed on the fourth surface and connected to the second internal electrode and the first dummy electrode. The third internal electrode 123 is disposed separately from the third surface and the fourth surface. The first internal electrode layer EL1 and the second internal electrode layer EL2 are alternately disposed in the first direction, and two or more third internal electrode layers EL3 can be disposed between the first internal electrode layer EL1 and the second internal electrode layer EL2.

[0018] In order to improve the withstand voltage characteristics, a structure that divides the voltage using a floating electrode has been developed. However, in the conventional floating electrode structure, due to the lengthwise gap between the floating electrodes, the overlap area may decrease and the capacitance may be greatly reduced.

[0019] Referring to FIG. 7 showing the first-direction cross-section and the second-direction cross-section of the multilayer electronic component 10 having a conventional floating electrode structure, a first internal electrode 21a connected to the first external electrode 131, a second internal electrode 21b connected to the second external electrode 132, and a first floating electrode 21c disposed between the first internal electrode and the second internal electrode are arranged on the same plane, and a first electrode portion; and a second electrode portion in which a second floating electrode 22a and a third floating electrode 22b are arranged on the same plane are alternately arranged in the stacking direction.

[0020] In such a conventional floating electrode structure, an attempt was made to improve the breakdown voltage characteristics by reducing the voltage applied to the ends of the electrodes 21a, 21b, 21c, 22a, and 22b. However, due to the gaps between the electrodes 21a, 21b, 21c, 22a, and 22b, the capacitance formation region decreases and the capacitance per unit volume decreases. When the number of stacked layers is increased to compensate for this, the number of electrode ends increases too much, and rather, the breakdown voltage characteristics may deteriorate.

[0021] On the other hand, in the present invention, by arranging two or more third internal electrode layers EL3 including a third internal electrode 123 separated from the first external electrode and the second external electrode between a first internal electrode layer EL1 including a first internal electrode 121 and a second internal electrode layer EL2 including a second internal electrode 122, it is possible to improve the capacitance per unit volume while improving the breakdown voltage characteristics of the multilayer electronic component 100.

[0022] FIG. 8 is a drawing for explaining the capacitance formation region of the multilayer electronic component according to an embodiment of the present invention, and FIG. 9 is a drawing for explaining the capacitance formation region of the multilayer electronic component having a conventional floating electrode structure. Referring to FIGS. 8 and 9, it can be confirmed that the capacitance formation regions A1, A2, and A3 indicated by dotted lines in the multilayer electronic component 100 according to an embodiment of the present invention are much wider than the capacitance formation region A' of the conventional multilayer electronic component 10. Therefore, when the multilayer electronic component 100 according to an embodiment of the present invention is designed to have a capacitance per unit volume improved compared to the conventional multilayer electronic component 10 and have the same capacitance, it can be manufactured in a smaller size than the conventional multilayer electronic component 10.

[0023] Also, generally, the maximum electrostrictive stress occurs at the electrode ends, and the deterioration of the withstand voltage characteristics also occurs first at the electrode ends. According to one embodiment of the present invention, since the number of electrode ends is reduced by about 25% compared to the conventional laminated electronic component 10, not only are the vulnerable parts where the deterioration of the withstand voltage characteristics occurs reduced, but also the distance that the crack generated at the electrode end should propagate is increased because it is connected to the leakage current path, so that the breakdown of the withstand voltage can be delayed.

[0024] Hereinafter, each configuration included in the laminated electronic component 100 according to one embodiment of the present invention will be described.

[0025] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. In the firing process, due to the shrinkage of the ceramic powder contained in the main body 110, the main body 110 can have a substantially hexahedron shape although it does not have a perfect hexahedron shape with straight lines.

[0026] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in a third direction.

[0027] By overlapping a margin region where the internal electrodes 121, 122, and 123 are not disposed on the dielectric layer 111, a step due to the thickness of the internal electrodes 121, 122, and 123 is generated, and the corners connecting the first surface and the third, fourth, and fifth surfaces and / or the corners connecting the second surface and the third, fourth, and fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Or, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third, fourth, fifth, and sixth surfaces and / or the corners connecting the second surface 2 and the third, fourth, fifth, and sixth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Or, in order to prevent chipping defects or the like, by rounding the corners connecting the respective surfaces of the main body 110 in a separate process, the corners connecting the first surface and the third, fourth, fifth, and sixth surfaces and / or the corners connecting the second surface and the third, fourth, fifth, and sixth surfaces can have a rounded form.

[0028] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0029] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO 3)Powder can be used. More specifically, for example, the ceramic powder can be barium titanate (BaTiO 3 )-based powder, CaZrO 3 base relative permittivity powder, etc. More specifically, for example, the barium titanate (BaTiO 3 )-based powder can be BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O 3 (0 < y < 1) can be one or more of them, and the CaZrO 3 base relative permittivity powder can be (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).

[0030] Therefore, the dielectric layer 111 can be BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O 3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O 3It can include one or more of (0 < x < 1, 0 < y < 1). In one embodiment, the dielectric layer 111 can include (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 and can mainly include (0 < x < 1, 0 < y < 1).

[0031] The dielectric layer 111 can include a first dielectric layer 111-1, a second dielectric layer 111-2, and a third dielectric layer 111-3. At this time, the first dielectric layer 111-1, the second dielectric layer 111-2, and the third dielectric layer 111-3 can be formed of the same material.

[0032] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode layer EL1, a second internal electrode layer EL2, and a third internal electrode layer EL3 to form a capacitance, and cover portions 112 and 113 formed above and below the capacitance forming portion Ac in the first direction.

[0033] The cover portions 112 and 113 can include an upper cover portion 112 disposed above the capacitance forming portion Ac in the first direction and a lower cover portion 113 disposed below the capacitance forming portion Ac in the first direction.

[0034] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0035] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0036] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, can include a barium titanate (BaTiO 3 )-based ceramic material.

[0037] In addition, margin portions 114 and 115 can be disposed on the side surface of the capacitance forming portion Ac.

[0038] The margin portions 114 and 115 can include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the main body 110.

[0039] As shown in FIG. 3, the margin portions 114 and 115 can mean regions between both ends of the internal electrodes 121, 122, and 123 and the boundary surface of the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness W-T direction.

[0040] The margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0041] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except for the places where the margin portions are formed on the ceramic green sheet.

[0042] The first internal electrode layer EL1 can include a first dielectric layer 111-1 and a first internal electrode 121 and a first dummy electrode 121d that are spaced apart from each other on the first dielectric layer. The second internal electrode layer EL2 can include a second dielectric layer 111-2 and a second internal electrode 122 and a second dummy electrode 122d that are spaced apart from each other on the second dielectric layer. The third internal electrode layer EL3 can include a third dielectric layer 111-3 and a third internal electrode 123 disposed on the third dielectric layer.

[0043] The first internal electrode layer EL1 and the second internal electrode layer EL2 are alternately arranged in the first direction, and two or more of the third internal electrode layers EL3 can be arranged between the first internal electrode layer EL1 and the second internal electrode layer EL2. By arranging two or more of the third internal electrode layers EL3, the withstand voltage characteristics can be improved, and even if cracks occur at the electrode ends, it is possible to delay the connection to the leakage current path.

[0044] The first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4, and the third internal electrode 123 can be arranged separated from the third surface 3 and the fourth surface 4.

[0045] A first external electrode 131 is arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0046] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Also, the first internal electrode 121 and the second internal electrode 122 can be arranged separated from the fifth surface and the sixth surface of the main body 110.

[0047] The first dummy electrode 121d can be connected to the second external electrode 132, and the second dummy electrode 122d can be connected to the first external electrode 131. The first dummy electrode 121d and the second dummy electrode 122d do not have to contribute to capacitance formation, but can play a role in compensating for the step by the internal electrodes.

[0048] The conductive metals included in the internal electrodes 121, 122, 123 and the dummy electrodes 121d, 122d can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0049] In one embodiment, the first internal electrode 121, the second internal electrode 122, and the third internal electrode 123 overlap in the first direction in at least a partial region, and the first dummy electrode 121d and the second dummy electrode 122d do not have to overlap with the third internal electrode 125 in the first direction. Thereby, the first internal electrode 121, the second internal electrode 122, and the third internal electrode 123 contribute to capacitance formation, and the first dummy electrode 121d and the second dummy electrode 122d do not have to contribute to capacitance formation.

[0050] In one embodiment, three or more of the third internal electrode layers EL3 can be arranged between the first internal electrode layer EL1 and the second internal electrode layer EL2. Thereby, the withstand voltage characteristics can be further improved, and even if cracks occur at the electrode ends, it is possible to further delay the connection to the leakage current path.

[0051] In one embodiment, when the second-direction sizes of the first internal electrode, the second internal electrode, and the third internal electrode are Li1, Li2, and Li3, respectively, Li3 > Li2 and Li3 > Li2 can be satisfied. Thereby, it is possible to have a structure capable of efficient production, and even when there are two or more third internal electrode layers EL3 arranged between the first internal electrode layer EL1 and the second internal electrode layer EL2, the laminated electronic component 100 can be manufactured using only the printed sheet GS1 printed with one type of printing pattern.

[0052] Referring to FIGS. 5 and 6 for explaining the manufacturing method of the multilayer electronic component according to an embodiment of the present invention, the multilayer electronic component 100 according to an embodiment of the present invention can be manufactured using only a printed sheet GS1 on which one type of printed pattern 120 is printed. Since the cover parts 112 and 113 are formed by laminating ceramic green sheets GS on which no printed pattern is printed, the multilayer electronic component 100 can be manufactured without separately using a waste sheet.

[0053] When printing a printed pattern A for forming the first internal electrode 121 and the second internal electrode 122 on the ceramic green sheet and a printed pattern B for forming the third internal electrode 123 separately, the printed pattern A and the printed pattern B are repeatedly printed. For example, when printing in the order of printed pattern A, printed pattern B, printed pattern A, printed pattern B and manufacturing a structure in which two or more layers of the third internal electrode 123 are laminated between the first internal electrode 121 and the second internal electrode 122, the printed pattern A printed between the printed patterns B cannot be used and is wasted.

[0054] On the other hand, referring to FIG. 6, after laminating a part of the printed sheet GS1 during lamination, by laminating so as to be offset by a certain distance D1 and D2 with respect to the cutting line CL, a structure having the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, the first dummy electrode 121d, and the second dummy electrode 122d can be realized only with the printed sheet GS1 on which one type of printed pattern 120 is printed, and thereby Li3>Li2 and Li3>Li2 can be achieved.

[0055] In one embodiment, when the distances between the third internal electrode and the third surface and the fourth surface are LG3a and LG3b respectively, and the second-direction sizes of the first dummy electrode and the second dummy electrode are Ld1 and Ld2 respectively, LG3a>Ld2 and LG3b>Ld1 can be satisfied.

[0056] At this time, Ld1 can be 85 μm or more and 115 μm or less, and Ld2 can be 85 μm or more and 115 μm or less.

[0057] Also, the above LG3a can be 190 μm or more and 275 μm or less, and the above LG3b can be 190 μm or more and 275 μm or less.

[0058] In one embodiment, when the distance between the first internal electrode and the first dummy electrode is LG1, the distance between the second internal electrode and the second dummy electrode is LG2, and the distances between the third internal electrode and the third surface and the fourth surface are LG3a and LG3b, respectively, LG1 > LG3a, LG1 > LG3b, LG2 > LG3a, and LG2 > LG3b can be satisfied.

[0059] At this time, the above LG1 can be 380 μm or more and 550 μm or less, and the above LG2 can be 380 μm or more and 550 μm or less. Also, the above LG3a can be 190 μm or more and 275 μm or less, and the above LG3b can be 190 μm or more and 275 μm or less.

[0060] On the other hand, when the second-direction size of the main body is Lb, LG1 / Lb can be 0.12 or more and 0.18 or less, but it is not limited thereto. Also, LG2 / Lb can be 0.12 or more and 0.18 or less, but it is not limited thereto.

[0061] As described above, when laminating using only the printed sheet GS1 on which one type of printed pattern 120 is printed, after laminating a part of the printed sheet GS1, when laminating so as to be offset by a certain distance D1 and D2 with respect to the cutting line CL, the sum (G3a + G3b) of the distances between the third internal electrode 123 and the third surface and the fourth surface can be substantially the same as the distance G1 between the first internal electrode and the first dummy electrode. However, it is not limited thereto, and deviations may occur due to manufacturing errors, differences in shrinkage rates depending on positions during firing, and the like.

[0062] Similarly, when the second-direction sizes of the first internal electrode, the first dummy electrode, and the third internal electrode are Li1, Ld1, and Li3, respectively, Li3 can be substantially the same as Li1 + Ld1. Also, Li3 can be substantially the same as Li2 + Ld2. However, it is not limited thereto, and deviations may occur due to manufacturing errors, differences in shrinkage rates according to positions during firing, and the like.

[0063] In one embodiment, when the space between the first internal electrode 121 and the first dummy electrode 121d is the first space G1, and the space between the second internal electrode 122 and the second dummy electrode 122d is the second space G2, one end of the third internal electrode 123 in the second direction can be arranged to overlap with the first space G1 in the first direction, and the other end of the third internal electrode 123 in the second direction can be arranged to overlap with the second space G2 in the first direction.

[0064] In one embodiment, when the spaces between the third internal electrode 123 and the third and fourth surfaces are the third a space G3a and the third b space G3b, respectively, one end of the first dummy electrode 121d in the main body can be arranged to overlap with the third b space G3b in the first direction, and one end of the second dummy electrode 122d in the main body can be arranged to overlap with the third a space G3a in the first direction.

[0065] On the one hand, the average thickness of the dielectric layer 111 does not need to be particularly limited, but for example, it can be 0.1 μm to 10 μm. The average thickness of the internal electrodes 121, 122, and 123 does not need to be particularly limited, but for example, it can be 0.05 μm to 2.0 μm. Also, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122, and 123 can be arbitrarily set according to desired characteristics and applications. For example, in the case of an electronic component for high-voltage electrical equipment in order to achieve miniaturization and high capacitance, the average thickness of the dielectric layer 111 can be less than 2.8 μm, and the average thickness of the internal electrodes 121, 122, and 123 can be less than 1 μm. Also, in the case of an electronic component for small IT in order to achieve miniaturization and high capacitance, the average thickness of the dielectric layer 111 can be 0.4 μm or less, and the average thickness of the internal electrodes 121, 122, and 123 can be 0.4 μm or less.

[0066] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122, and 123 can respectively mean the size in the first direction of the dielectric layer 111 and the internal electrodes 121, 122, and 123. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the cross-sections in the first direction and the second direction of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness of the dielectric layer 111 can be measured by measuring the thickness at a number of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. Also, the average thickness of the internal electrodes 121 and 122 can be measured by measuring the thickness at a number of points of one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points can be specified by the capacitance forming portion Ac. On the other hand, if the measurement of such average values is respectively carried out for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 and then the average value is measured, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be further generalized.

[0067] The first external electrode 131 is disposed on the third surface of the main body 110 and can be connected to the first internal electrode 121 and the second dummy electrode 122d. The second external electrode 132 is disposed on the fourth surface of the main body 110 and can be connected to the second internal electrode 122 and the first dummy electrode 121d.

[0068] On the other hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal. A specific material can be determined in consideration of electrical characteristics, structural stability, etc., and furthermore, it can have a multilayer structure.

[0069] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0070] More specific examples of the electrode layers 131a and 132a are that the electrode layers 131a and 132a can be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin.

[0071] Also, the electrode layers 131a and 132a can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layers 131a and 132a can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0072] Although a material excellent in electrical conductivity can be used as the conductive metal contained in the electrode layers 131a and 132a, it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0073] The plating layers 131b and 132b play a role in improving the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and they can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed of multiple layers.

[0074] To give a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or can be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0075] The size of the multilayer electronic component 100 does not need to be particularly limited. For example, the length L of the multilayer electronic component 100 can be 2900 to 3100 mm, the thickness T of the multilayer electronic component 100 can be 1500 to 1700 mm, and the width W of the multilayer electronic component 100 can be 1450 to 1550 mm.

[0076] Here, the length L of the multilayer electronic component 100 means the maximum size in the second direction of the multilayer electronic component 100, the thickness T of the multilayer electronic component 100 means the maximum size in the first direction of the multilayer electronic component 100, and the width W of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.

[0077] Although the embodiments of the present invention have been described in detail above, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0078] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain each different and unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific one embodiment is not described in other embodiments, it can be understood as an explanation related to other embodiments as long as there is no explanation contrary to or conflicting with that matter in other embodiments.

[0079] The terms used in the present invention are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes plural expressions unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0080] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin part 121, 122, 123: Internal electrode 121d, 122d: dummy electrode 131, 132: External electrode 131a, 132a: Electrode layer 131b, 132b: Plating layer

Claims

1. a first internal electrode layer including a first dielectric layer and a first internal electrode and a first dummy electrode spaced apart from each other on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a second internal electrode and a second dummy electrode spaced apart from each other on the second dielectric layer, a third dielectric layer and a third internal electrode layer including a third internal electrode disposed on the third dielectric layer, the main body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; a first external electrode disposed on the third surface and connected to the first internal electrode and the second dummy electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the first dummy electrode; the third internal electrode is disposed apart from the third surface and the fourth surface, the first internal electrode layers and the second internal electrode layers are alternately arranged in the first direction, and two or more of the third internal electrode layers are arranged between the first internal electrode layers and the second internal electrode layers. Multilayer electronic components.

2. the first internal electrode, the second internal electrode, and the third internal electrode overlap in a first direction in at least a partial region, and the first dummy electrode and the second dummy electrode do not overlap with the third internal electrode in the first direction; The multilayer electronic component according to claim 1 .

3. Three or more of the third internal electrode layers are disposed between the first internal electrode layer and the second internal electrode layer. The multilayer electronic component according to claim 1 .

4. When the second direction sizes of the first internal electrode, the second internal electrode, and the third internal electrode are Li1, Li2, and Li3, respectively, Li3>Li2 and Li3>Li2 are satisfied; The multilayer electronic component according to claim 1 .

5. When the distances of the third internal electrode from the third surface and the fourth surface are respectively LG3a and LG3b, and the sizes of the first dummy electrode and the second dummy electrode in the second direction are respectively Ld1 and Ld2, LG3a>Ld2 and LG3b>Ld1 are satisfied; The multilayer electronic component according to claim 1 .

6. The Ld1 is 85 μm or more and 115 μm or less, and the Ld2 is 85 μm or more and 115 μm or less. The multilayer electronic component according to claim 5 .

7. The LG3a is 190 μm or more and 275 μm or less, and the LG3b is 190 μm or more and 275 μm or less. The multilayer electronic component according to claim 5 .

8. When the distance between the first internal electrode and the first dummy electrode is LG1, the distance between the second internal electrode and the second dummy electrode is LG2, and the distances between the third internal electrode and the third surface and the fourth surface are LG3a and LG3b, respectively, The relationships LG1>LG3a, LG1>LG3b, LG2>LG3a, and LG2>LG3b are satisfied. The multilayer electronic component according to claim 1 .

9. The LG1 is 380 μm or more and 550 μm or less, and the LG2 is 380 μm or more and 550 μm or less. The multilayer electronic component according to claim 8 .

10. The LG3a is 190 μm or more and 275 μm or less, and the LG3b is 190 μm or more and 275 μm or less. The multilayer electronic component according to claim 9 .

11. When a space between the first internal electrode and the first dummy electrode is defined as a first space, and a space between the second internal electrode and the second dummy electrode is defined as a second space, one end of the third internal electrode in a second direction is disposed to overlap the first space in the first direction, and the other end of the third internal electrode in the second direction is disposed to overlap the second space in the first direction. The multilayer electronic component according to claim 1 .

12. When a space separated from the third internal electrode and the third surface and a space separated from the fourth surface are respectively referred to as a third a space and a third b space, one end of a first dummy electrode in the main body is arranged to overlap the third b space in the first direction, and one end of a second dummy electrode in the main body is arranged to overlap the third a space in the first direction; The multilayer electronic component according to claim 1 .

13. a sum of distances by which the third internal electrode is spaced from the third surface and the fourth surface is substantially equal to a distance by which the first internal electrode is spaced from the first dummy electrode; The multilayer electronic component according to claim 1 .

14. When the sizes of the first internal electrode, the first dummy electrode, and the third internal electrode in the second direction are Li1, Ld1, and Li3, respectively, Li3 is substantially equal to Li1+Ld1; The multilayer electronic component according to claim 1 .

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