Inspection device and inspection method

Abstract

To provide an inspection device and an inspection method capable of reducing damage to a sample and observing the sample with a high throughput.SOLUTION: An inspection device 1 includes: a drive section KD for driving an optical element 113a so as to move illumination light L10 exciting a sample 500 in an X-axis direction within a plane parallel to a sample surface 510 of the sample 500; a detection section 220 for detecting PL light PL generated from the sample 500; an adjustment section 130 for adjusting the illumination light L10; and a control section 300 for controlling the drive section KD and the adjustment section 130. When a direction in which the illumination light L10 travels on an orthogonal surface 610 orthogonal to an optical path L11 of the illumination light L10 is set as α-axis direction in accordance with the X-axis direction in which the illumination light L10 travels on the sample surface 510, the adjustment section 130 adjusts the illumination light L10 positioned in movement ends 620a and 620b in a movement path 620 of the illumination light L10 traveling in the α-axis direction on the orthogonal surface 610.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an inspection apparatus and an inspection method.

Background Art

[0002] Patent Document 1 describes an apparatus that irradiates a sample with excitation light and observes photoluminescence light (hereinafter referred to as PL light).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When scanning a wide area of the inspection region of a sample to observe PL light, it is required to observe with high throughput while reducing the damage to the sample.

[0005] The present disclosure has been made in view of such problems, and provides an inspection apparatus and an inspection method capable of observing a sample with high throughput while reducing the damage to the sample.

Means for Solving the Problems

[0006] An inspection apparatus according to one aspect of the present embodiment includes a driving unit that drives an optical element to move illumination light for exciting a sample in a first direction within a plane parallel to the sample surface of the sample, a detection unit that detects PL light generated from the sample illuminated by the illumination light, an adjustment unit that adjusts the illumination light, and a control unit that controls the driving unit. When a direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, the adjustment unit adjusts the illumination light located at a moving end portion in the moving path of the illumination light that moves in the second direction in the orthogonal plane.

[0007] In the above inspection apparatus, at least one of shielding the illumination light located at the moving end portion and reducing the energy of the illumination light located at the moving end portion may be performed by a shielding portion disposed at a conjugate position conjugate to the sample surface on the optical path of the illumination light, thereby adjusting the intensity of the illumination light located at the moving end portion.

[0008] In the above inspection apparatus, the adjustment unit may vary the position of the shielding portion according to the position of the moving end portion.

[0009] In the above inspection apparatus, the shielding portion is disposed so as to sandwich the illumination light from both sides in the second direction, and the adjustment unit may vary the width of the opening through which the illumination light passes by moving the shielding portion in the second direction so as to open and close the opening between the shielding portions.

[0010] In the above inspection apparatus, the shielding portion has a shape that sandwiches the illumination light from both sides in the second direction, the length of the opening between the shielding portions changes depending on the position in a third direction orthogonal to the second direction, and the adjustment unit may vary the width of the opening through which the illumination light passes by moving the shielding portion in the third direction.

[0011] In the above inspection apparatus, the adjustment unit may adjust the illumination light located at the moving end portion by causing the control unit to drive the optical element to the driving unit so that the illumination light located at the moving end portion illuminates the outside of the end portion of the sample.

[0012] In the above inspection apparatus, the energy of the illumination light incident on the moving path may be substantially constant over the moving path including the moving end portion.

[0013] In the above inspection apparatus, the adjustment unit may adjust the intensity of the illumination light located at the moving end portion by making the output of the illumination light located at the moving end portion smaller than the output of the illumination light located at the moving path other than the moving end portion.

[0014] In the above inspection apparatus, the illumination light may include a wavelength longer than the wavelength corresponding to the band gap of the material contained in the sample, and may multi-photon excite the sample.

[0015] In the above inspection apparatus, the illumination light may include a wavelength corresponding to the energy for two-photon exciting the sample.

[0016] In the above inspection apparatus, the sample may include a semiconductor or a compound semiconductor.

[0017] In the above inspection apparatus, the light source that generates the illumination light may include a pulsed laser that generates the illumination light including wavelengths in the range of 500 nm to 600 nm.

[0018] In the above inspection apparatus, when a defect of the sample is detected by the detection unit, the control unit may control the driving unit to illuminate the illumination light at the position of the defect for a predetermined time.

[0019] In the above inspection apparatus, it may further include a spectroscopic unit that spectroscopically analyzes the PL light, and a spectrum detection unit that detects the spectroscopically analyzed PL light.

[0020] In the above-described inspection apparatus, the spectrum detection unit is disposed at a position where the PL light is condensed, and the control unit may control the drive unit so that the condensing point of the illumination light is located at the position of the defect detected by the detection unit.

[0021] In the above-described inspection apparatus, the control unit may move the illumination light to the moving end portion in the second direction by controlling the drive unit, and then move it in a third direction orthogonal to the second direction.

[0022] In the above-described inspection apparatus, the optical element includes a first optical element that moves the illumination light in the second direction and a second optical element that moves the illumination light in a third direction orthogonal to the second direction. The second optical element is disposed between the sample and the first optical element on the optical path of the illumination light, and the shielding portion may be disposed between the first optical element and the second optical element.

[0023] In the above-described inspection apparatus, the control unit moves the condensing position of the illumination light in the thickness direction of the sample, and the adjustment unit may make the energy of the illumination light when the condensing position is located at a first depth from the sample surface larger than the energy of the illumination light when the condensing position is located at a second depth shallower than the first depth from the sample surface.

[0024] In the above-described inspection apparatus, when the detection unit detects a specific defect, the control unit controls the drive unit so that the illumination light illuminates the vicinity of the defect, and the adjustment unit may form a marking in the vicinity of the defect by the illumination light.

[0025] The inspection method according to one aspect of the present embodiment includes a step of driving an optical element by a driving unit so as to move illumination light for exciting a sample in a first direction in a plane parallel to the sample surface of the sample, a step of adjusting the illumination light by an adjustment unit, and a step of detecting PL light generated from the sample illuminated by the illumination light by a detection unit. When a direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, in the step of adjusting the illumination light by the adjustment unit, the adjustment unit adjusts the illumination light located at a moving end portion in the moving path of the illumination light moving in the second direction in the orthogonal plane.

[0026] The inspection apparatus according to one aspect of the present embodiment includes a driving unit that drives an optical element so as to move illumination light for exciting a sample in a first direction in a plane parallel to the sample surface of the sample, a detection unit that detects PL light generated from the sample illuminated by the illumination light, a control unit that controls the driving unit, and a shielding unit disposed at a conjugate position conjugate to the sample surface. When a direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, the shielding unit restricts transmission of the illumination light located at a moving end portion in the moving path of the illumination light moving in the second direction in the orthogonal plane.

Advantages of the Invention

[0027] According to the present disclosure, it is possible to provide an inspection apparatus and an inspection method capable of observing a sample with high throughput while reducing damage to the sample.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0029] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description shows preferred embodiments of the present disclosure, and the scope of the present disclosure is not limited to the following embodiments. In the following description, those denoted by the same reference numerals indicate substantially the same content.

[0030] (Embodiment 1) An inspection apparatus and an inspection method according to Embodiment 1 will be described. FIG. 1 is a configuration diagram illustrating an inspection apparatus 1 according to Embodiment 1. As shown in FIG. 1, the inspection apparatus 1 includes an illumination optical system 100 and a detection optical system 200. In addition to this, the inspection apparatus 1 may further include a light source 400. Note that the inspection apparatus 1 does not necessarily need to include the light source 400 as long as it is configured to introduce illumination light L10.

[0031] The illumination optical system 100 illuminates the sample 500 with the illumination light L10. The sample 500 is placed on the stage STG. The stage STG may be an XYZ drive stage that can move in the directions of three orthogonal axes. Also, the stage STG may have a function of being rotatable around the three axes. The light source 400 generates the illumination light L10. The illumination light L10 may include excitation light that excites the sample 500. That is, the illumination light L10 may excite the material contained in the sample 500. Note that the illumination light L10 is not limited to light including excitation light as long as it is light that illuminates the sample 500. Hereinafter, the illumination light L10 will be described as light including excitation light.

[0032] The illumination light L10 may include wavelengths longer than the wavelength corresponding to the bandgap of the material contained in the sample 500. Therefore, the illumination light L10 may multi-photon excite the sample 500. Specifically, the illumination light L10 may include a wavelength corresponding to the energy for two-photon exciting the sample 500, or may include a wavelength corresponding to the energy for three-photon exciting the sample 500. For example, when the sample 500 includes a semiconductor or a compound semiconductor, the illumination light L10 may include wavelengths of 500 nm to 600 nm.

[0033] For example, when the sample 500 includes silicon carbide (SiC), it may be two-photon excited using the illumination light L10 including a wavelength of 520 nm. In this case, when the illumination light L10 including wavelengths of 800 nm and 1040 nm is used, three-photon excitation can be performed.

[0034] Also, when the sample 500 includes gallium nitride (GaN), it may be two-photon excited using the illumination light L10 including a wavelength of 520 nm. In this case, when the illumination light L10 including wavelengths of 800 nm and 1040 nm is used, three-photon excitation can be performed.

[0035] Also, when the sample 500 includes gallium oxide (Ga 2 O 3When it contains , two-photon excitation may be performed using illumination light L10 including a wavelength of 520 nm. In this case, when illumination light L10 including a wavelength of 800 nm is used, three-photon excitation can be performed, and when illumination light L10 including a wavelength of 1040 nm is used, four-photon excitation can be performed.

[0036] Also, when the sample 500 contains diamond, three-photon excitation may be performed using illumination light L10 including a wavelength of 520 nm. In this case, when illumination light L10 including a wavelength of 800 nm is used, four-photon excitation can be performed, and when illumination light L10 including a wavelength of 1040 nm is used, five-photon excitation can be performed.

[0037] The light source 400 that generates the illumination light L10 may include a pulse laser that generates the illumination light L10 including a wavelength of 500 nm to 600 nm. For example, as the light source 400, a femtosecond laser that generates excitation light with a wavelength of 520 nm may be used.

[0038] Patent Document 1 describes observing internal defects of a compound semiconductor by PL light generated by multiphoton excitation using a femtosecond laser with a wavelength of 800 nm or 1030 nm. However, in an indirect-transition type semiconductor, the emission of PL light is weak. For this reason, the SN ratio of the PL light is not good. Also, the PL light of the compound semiconductor to be observed has wavelengths in the ultraviolet to visible regions. Therefore, an apparatus such as that in Patent Document 1 requires an objective lens that transmits from the wavelength range of the PL light to the infrared region, which is the wavelength of the femtosecond laser, such as 800 nm or 1030 nm. However, it is difficult to prepare an objective lens that corrects aberrations from such PL light to light in the infrared region. This also hinders the improvement of the SN ratio of the PL light.

[0039] In the present embodiment, for example, by using illumination light L10 including a wavelength of 500 nm to 600 nm, the aberration correction of the lens can be set from the wavelength range of the PL light to the wavelength range of 500 nm to 600 nm. Therefore, the SN ratio of the PL light can be improved.

[0040] On the one hand, when the sample surface 510 of the sample 500 is scanned in one direction using the illumination light L10 having a wavelength in the range of 500 nm to 600 nm, the sample 500 may be damaged at the folded-back portion of the scan. Therefore, the inspection apparatus 1 of the present embodiment has a mechanism for adjusting the illumination light L10 at the folded-back portion. Note that in the present embodiment, the wavelength of the illumination light L10 is not limited to 500 nm to 600 nm.

[0041] Here, for the sake of convenience in explaining the inspection apparatus 1, an XYZ orthogonal coordinate axis system is introduced. A plane parallel to the sample surface 510 (for example, the upper surface of the sample 500) of the sample 500 is defined as the XY plane. One direction in the plane parallel to the sample surface 510 is defined as the X-axis direction, and a direction orthogonal to the X-axis direction is defined as the Y-axis direction. A direction orthogonal to the sample surface 510 is defined as the Z-axis direction. The +Z-axis direction may be referred to as the upward direction, and the -Z-axis direction may be referred to as the downward direction. Note that the upward and downward directions are for convenience in explaining the inspection apparatus 1 and do not indicate the direction in which the actual inspection apparatus 1 is arranged.

[0042] Also, for the sake of convenience in explaining the direction in which the illumination light L10 moves, an αβγ orthogonal coordinate axis system is introduced. On the optical path L11 of the illumination light L10, at the conjugate position conjugate to the sample surface 510, an orthogonal plane 610 orthogonal to the optical path L11 of the illumination light L10 is defined as the αβ plane. A direction orthogonal to the αβ plane is defined as the γ-axis direction. For example, the optical axes of the lenses 116a and 116b extend in the γ-axis direction.

[0043] The illumination optical system 100 includes an optical member 110, a drive unit KD, a control unit 120, and an adjustment unit 130. The optical member 110 includes, for example, an attenuator 111, a mirror 112, an optical element 113a, lenses 114a and 114b, an optical element 115a, lenses 116a and 116b, a λ / 4 plate 117, a dichroic mirror 118, an objective lens 119, and the like. Note that the optical member 110 may further include other optical members 110, or some of these optical members 110 may be omitted.

[0044] The optical element 113a includes, for example, the galvanometer mirror X113, and the optical element 115a includes, for example, the galvanometer mirror Y115. Hereinafter, the optical element 113a will be described as the galvanometer mirror X113, and the optical element 115a will be described as the galvanometer mirror Y115. For example, the driving frequency of the galvanometer mirror X113 may be higher (the driving speed may be faster) than that of the galvanometer mirror Y115. For example, the galvanometer mirror X113 may be a resonant type galvanometer mirror. Note that the optical elements 113a and 115a are not limited to the galvanometer mirrors X113 and Y115 as long as they can scan the illumination light L10 in the α-axis direction and the β-axis direction, respectively. For example, a polygon mirror or the like may be used. When the optical element 113a includes the galvanometer mirror X113, the galvanometer mirror X113 has a driving unit KD. When the optical element 115a includes the galvanometer mirror Y115, the galvanometer mirror Y115 has a driving unit KD.

[0045] The illumination light L10 generated by the light source 400 is adjusted to a predetermined intensity by the attenuator 111. The attenuator 111 may adjust the energy of the illumination light L10. The adjusted illumination light L10 is reflected by the mirror 112. The mirror 112 may be a prism or a polarization beam splitter or the like. The illumination light L10 reflected by the mirror 112 is incident on the galvanometer mirror X113. The illumination light L10 may be incident on the galvanometer mirror X113 as parallel light. The galvanometer mirror X113 reflects the incident illumination light L10. The galvanometer mirror X113 changes the angle of the reflecting surface by the driving unit KD. Thereby, the galvanometer mirror X113 changes the direction in which the illumination light L10 is reflected with respect to the direction in which the illumination light L10 is incident.

[0046] FIG. 2 is a diagram illustrating the illumination light L10 moving on the sample surface 510 in the inspection apparatus 1 according to Embodiment 1. FIG. 3 is a diagram illustrating the illumination light L10 moving on the orthogonal plane 610 in the inspection apparatus 1 according to Embodiment 1.

[0047] As shown in FIGS. 2 and 3, for example, the galvanometer mirror X113 changes the reflecting surface so that the illumination light L10 moves in the X-axis direction in a plane parallel to the sample surface 510 of the sample 500. Corresponding to the X-axis direction in which the illumination light L10 moves on the sample surface 510, the direction in which the illumination light L10 moves in the orthogonal plane 610 orthogonal to the optical path L11 of the illumination light L10 is defined as the α-axis direction.

[0048] When the illumination light L10 moves in the X-axis direction on the sample surface 510, the illumination light L10 moves in the α-axis direction in the orthogonal plane 610. Therefore, the galvanometer mirror X113 changes the reflecting surface so that the illumination light L10 moves in the α-axis direction in the orthogonal plane 610 orthogonal to the optical path L11.

[0049] Note that, corresponding to the X-axis direction in which the illumination light L10 moves on the sample surface 510, the direction in which the illumination light L10 moves in the orthogonal plane 610 is defined as the α-axis direction, but it is not limited to this. Depending on the number and type of the optical members 110 arranged on the optical path L11 of the illumination light L10, the X-axis direction on the sample surface 510 may correspond to a direction other than the α-axis direction, such as the β-axis direction in the orthogonal plane 610.

[0050] The paths along which the illumination light L10 moves in the X-axis direction on the sample surface 510 are referred to as moving paths 521 to 523. The galvanometer mirror X113 may change the reflecting surface so that the illumination light L10 moves along a plurality of moving paths 521 to 523 on the sample surface 510. The moving paths 521 to 523 are collectively referred to as a moving path 520.

[0051] The paths along which the illumination light L10 moves in the α-axis direction in the orthogonal plane 610 are referred to as moving paths 621 to 623. The galvanometer mirror X113 may change the reflecting surface so that the illumination light L10 moves along a plurality of moving paths 621 to 623 in the orthogonal plane 610. The moving paths 621 to 623 are collectively referred to as a moving path 620.

[0052] The ends of the movement path 621 in the -α axis direction and the +α axis direction are respectively referred to as movement ends 621a and 621b, the ends of the movement path 622 in the -α axis direction and the +α axis direction are respectively referred to as movement ends 622a and 622b, and the ends of the movement path 623 in the -α axis direction and the +α axis direction are respectively referred to as movement ends 623a and 623b. The movement ends 621a to 623a are collectively referred to as movement end 620a, and the movement ends 621b to 623b are collectively referred to as movement end 620b.

[0053] The illumination light L10 reflected by the galvanometer mirror X113 is incident on the lens 114a. The lens 114a condenses the incident illumination light L10. The illumination light L10 condensed by the lens 114a is condensed at the condensing point IF1. The condensing point IF1 may be at a position conjugate to the sample surface 510. The position conjugate to the sample surface 510 may be referred to as the conjugate position. The illumination light L10 condensed at the condensing point IF1 spreads while passing through the condensing point IF1 and is incident on the lens 114b. The lens 114b converts the incident illumination light L10 into parallel light.

[0054] The illumination light L10 converted into parallel light by the lens 114b is incident on the galvanometer mirror Y115. The galvanometer mirror Y115 reflects the incident illumination light L10. The galvanometer mirror Y115 changes the angle of the reflecting surface by the driving unit KD. Thereby, the galvanometer mirror Y115 changes the direction in which the illumination light L10 is reflected with respect to the direction in which the illumination light L10 is incident.

[0055] As shown in FIG. 3, for example, the galvanometer mirror Y115 changes the reflecting surface so that the illumination light L10 moves in the -β axis direction in a plane parallel to the orthogonal plane 610 at the movement end 621b in the +α axis direction, for example, in the movement path 621. Also, the galvanometer mirror Y115 changes the reflecting surface so that the illumination light L10 moves in the -β axis direction at the movement end 622a in the -α axis direction, for example, in the movement path 622. Thus, the galvanometer mirror Y115 changes the reflecting surface so that the illumination light L10 moves in the β axis direction in the orthogonal plane 610.

[0056] The illumination light L10 reflected by the galvanometer mirror Y115 is incident on the lens 116a. The lens 116a condenses the incident illumination light L10. The illumination light L10 condensed by the lens 116a is condensed at the condensing point IF2. The condensing point IF2 may be at a position conjugate to the sample surface 510. The illumination light L10 condensed at the condensing point IF2 spreads while passing through the condensing point IF2 and is incident on the lens 116b. The lens 116b converts the incident illumination light L10 into parallel light.

[0057] The illumination light L10 converted into parallel light by the lens 116b is incident on the λ / 4 plate 117. The λ / 4 plate 117 changes the polarization state of the incident illumination light L10. For example, the λ / 4 plate 117 converts the incident linearly polarized light into circularly polarized light. Also, the λ / 4 plate 117 converts the incident circularly polarized light into linearly polarized light. The illumination light L10 whose polarization state has been changed by the λ / 4 plate 117 is reflected by the dichroic mirror 118. The dichroic mirror 118 reflects light of a predetermined wavelength in the illumination light L10 and transmits light of another predetermined wavelength. The illumination light L10 reflected by the dichroic mirror 118 is incident on the objective lens 119. The objective lens 119 condenses the incident illumination light L10 onto the sample 500.

[0058] The drive unit KD of the galvanometer mirror X113 drives the galvanometer mirror X113 so as to move the illumination light L10 for exciting the sample 500 in the first direction in a plane parallel to the sample surface 510 of the sample 500. Specifically, the drive unit KD drives the galvanometer mirror X113 so that the condensing portion where the illumination light L10 is condensed on the sample surface 510 of the sample 500 has a component in the X-axis direction. By driving the galvanometer mirror X113, the drive unit KD moves the position of the condensing point on the optical path L11 of the illumination light L10 so that the condensing portion of the illumination light L10 moves while having a component in the X-axis direction. Thereby, the illumination light L10 moves, for example, in the α-axis direction in the orthogonal plane 610.

[0059] Also, the drive unit KD of the galvanometer mirror Y115 drives the galvanometer mirror Y115 so as to move the illumination light L10 for exciting the sample 500 in the Y-axis direction within a plane parallel to the sample surface 510 of the sample 500. Specifically, the drive unit KD drives the galvanometer mirror Y115 so that the condensing portion where the illumination light L10 is condensed on the sample surface 510 of the sample 500 has a component in the Y-axis direction. By driving the galvanometer mirror Y115, the drive unit KD moves the position of the condensing point on the optical path L11 of the illumination light L10 so that the condensing portion of the illumination light L10 moves while having a component in the Y-axis direction. Thereby, the illumination light L10 moves, for example, in the β-axis direction in the orthogonal plane 610.

[0060] The control unit 120 controls the drive unit KD of the galvanometer mirror X113 and the galvanometer mirror Y115. By controlling the drive unit KD, the control unit 120 moves the illumination light L10 along the movement path 620 in the α-axis direction in the orthogonal plane 610. Further, by controlling the drive unit KD, the control unit 120 moves the illumination light L10, for example, to the movement end portions 620a and 620b in the α-axis direction in the orthogonal plane 610, and then moves the illumination light L10 in the β-axis direction orthogonal to the α-axis direction. Note that "after moving to the movement end portions 620a and 620b in the α-axis direction" may include not only immediately after moving to the movement end portions 620a and 620b in the α-axis direction, but also after the elapse of a predetermined short time thereafter, and after returning the path by a predetermined amount after moving to the movement end portions 620a and 620b in the α-axis direction. Further, before and after the illumination light L10 moves in the β-axis direction orthogonal to the α-axis direction due to the operation of the galvanometer mirror Y115, it is preferable that the illumination light L10 is at positions such as the shielding portions 131 to 135 described later. The adjustment unit 130 may determine and adjust the positions of the shielding portions 131 to 135 and the like in accordance with the movement position of the illumination light L10 in the β-axis direction.

[0061] The adjustment unit 130 adjusts the illumination light L10. For example, the adjustment unit 130 adjusts the characteristics of the illumination light L10. The characteristics of the illumination light L10 include, for example, the intensity of the illumination light L10 and the energy of the illumination light L10. The energy of the illumination light L10 may include the magnitude of the output of the illumination light L10 output from the light source 400, or may include the energy related to hc / λ derived from the wavelength λ of the illumination light L10.

[0062] The adjustment unit 130 adjusts the illumination light L10 located at the moving end portions 620a and 620b in the moving path 620 of the illumination light L10 that moves in the α-axis direction on the orthogonal plane 610 orthogonal to the optical path L11 of the illumination light L10.

[0063] Specifically, the adjustment unit 130 arranges the shielding portions 131 and 132 at conjugate positions conjugate to the sample surface 510 on the optical path L11 of the illumination light L10, thereby performing at least one of shielding the illumination light L10 located at the moving end portions 620a and 620b and reducing the energy of the illumination light L10 located at the moving end portions 620a and 620b. The shielding portions 131 and 132 have, for example, a moving mechanism that moves in the α-axis direction, and under the control of the adjustment unit 130, the shielding portions 131 and 132 move to positions including the moving end portions 620a and 620b, respectively.

[0064] The adjustment unit 130 varies the positions of the shielding portions 131 and 132 according to the positions of the moving end portions 620a and 620b. The shielding portions 131 and 132 are arranged so as to sandwich the illumination light L10 from both sides in the α-axis direction. The adjustment unit 130 varies the width of the opening through which the illumination light L10 passes by moving the shielding portions 131 and 132 in the α-axis direction so as to open and close the space between the shielding portions 131 and 132.

[0065] For example, when the length between the moving ends 620a and 620b on the moving path 620 is large, the adjustment unit 130 varies the positions of the shielding parts 131 and 132 so that the space between the shielding parts 131 and 132 expands. Also, when the length between the moving ends 620a and 620b on the moving path 620 is small, the adjustment unit 130 varies the positions of the shielding parts 131 and 132 so that the space between the shielding parts 131 and 132 narrows. Note that the length between the moving ends 620a and 620b on the moving path 620 is determined by, for example, the driving amount of the galvanometer mirror X113 via the driving unit KD by the control unit 120, and the driving amount may be determined according to, for example, the length or area to be inspected by one X-direction scan with respect to the sample 500.

[0066] The shielding parts 131 and 132 may include a member that does not transmit any illumination light L10, or may include a member that transmits even a little illumination light L10. FIG. 4 is a diagram illustrating a shielding part 133 that transmits illumination light L10 in the inspection apparatus 1 according to Embodiment 1. As shown in FIG. 4, the shielding part 133 may include a gradation part in which the transmittance of the illumination light L10 gradually changes depending on the location. For example, the shielding part 133 is in the shape of a rectangular plate, and the transmittance of the illumination light L10 in the -α-axis direction side part and the +α-axis direction side part is low, and the transmittance of the illumination light L10 is higher toward the central part. In the figure, the gradation indicating the transmittance changes stepwise from the -α-axis direction side and the +α-axis direction side toward the central part, but the gradation may change gradually and smoothly.

[0067] FIG. 5 and FIG. 6 are diagrams illustrating the shielding portions 134 and 135 that shield the illumination light L10 in the inspection apparatus 1 according to the first embodiment. As shown in FIGS. 5 and 6, the shielding portions 134 and 135 may have openings 139 with different widths in the β-axis direction in the region to be shielded. Specifically, for example, the shielding portions 134 and 135 have a shape that sandwiches the illumination light L10 from both sides in the α-axis direction. The length of the opening 139 in the α-axis direction changes depending on the position in the β-axis direction between the shielding portions 134 and 135. In the shielding portion 134 of FIG. 5, the width of the opening 139 in the α-axis direction changes stepwise. On the other hand, in the shielding portion 135 of FIG. 6, the width of the opening 139 in the α-axis direction changes smoothly in a slope shape. The adjustment unit 130 varies the width of the opening 139 through which the illumination light L10 passes by moving the shielding portion 134 or the shielding portion 135 in the β-axis direction. For example, when the length between the moving end portions 620a and 620b in the moving path 620 is large, the adjustment unit 130 varies the position of the shielding portion 134 or the shielding portion 135 in the -β-axis direction so that the width of the opening 139 of the shielding portion 134 or the shielding portion 135 expands. Also, when the length between the moving end portions 620a and 620b in the moving path 620 is small, the adjustment unit 130 varies the position of the shielding portion 134 or the shielding portion 135 in the +β-axis direction so that the width of the opening 139 of the shielding portion 134 or the shielding portion 135 narrows.

[0068] When the shielding portions 131, 132, etc. are formed of a member that does not transmit the illumination light L10 at all, the shielding portions 131, 132, etc. shield the illumination light L10. On the other hand, when the shielding portions 133, etc. are formed of a member that transmits the illumination light L10 even slightly, the shielding portions 133, etc. reduce the energy of the illumination light L10. In this way, the shielding portions 131 to 135 limit the transmission of the illumination light L10 located at the moving end portions 620a and 620b in the moving path 620 of the illumination light L10 that moves in the α-axis direction on the orthogonal plane 610. Here, restricting the transmission of the illumination light L10 includes not only completely blocking the illumination light L10, but also weakening it slightly and transmitting it, and reflecting the illumination light L10 to restrict the transmission. By providing the shielding portions 131 to 135, etc., it is possible to reduce the damage given to the sample 500 and improve the throughput of inspecting the sample 500 with a simpler configuration.

[0069] In the present embodiment, the optical elements 113a and 115a each include a galvanometer mirror X113 that moves the illumination light L10 in the α-axis direction and a galvanometer mirror Y115 that moves the illumination light L10 in the β-axis direction. The galvanometer mirror Y115 is disposed between the sample 500 and the galvanometer mirror X113 on the optical path L11 of the illumination light L10. The shielding portions 131, 132, etc. are disposed at the condensing point IF2 between the sample 500 and the galvanometer mirror Y115 as shown in FIG. 1. The orthogonal plane 610 includes the condensing point IF2. The control unit 120 controls the drive unit KD to move the illumination light L10, for example, to the moving end portions 620a and 620b in the α-axis direction and then move it in the β-axis direction. The illumination light L10 moves two-dimensionally in the α-axis direction and the β-axis direction on the orthogonal plane 610. The adjustment unit 130 may adjust the positions of the shielding portions 131 to 135, etc. according to the length between the moving end portions 620a and 620b in the moving path 620 after the illumination light L10 has moved in the β-axis direction.

[0070] FIG. 7 is a configuration diagram illustrating an inspection apparatus 1a according to another example of Embodiment 1. As shown in FIG. 7, the shielding portions 131, 132, etc. are disposed at the condensing point IF1 between the galvanometer mirror X113 and the galvanometer mirror Y115. In this case, the orthogonal plane 610 includes the condensing point IF1. The illumination light L10 moves only in one dimension in the α-axis direction on the orthogonal plane 610. Therefore, in the case of such a configuration, the length of the shielding portions 131, 132, etc. in the β-axis direction can be reduced. Thus, the inspection apparatus 1a can be made compact.

[0071] The energy of the illumination light L10 incident on the movement path 620 may be substantially constant over the movement path 620 including the movement end portions 620a and 620b. That is, the energy of the illumination light L10 when illuminating the sample 500 through between the shielding portions 131 and 132 and the energy of the illumination light L10 when illuminating the shielding portions 131 and 132 are substantially constant. Thereby, the adjustment of the illumination light L10 can be performed by the shielding portion 131 or the like. Thus, it is possible to eliminate the need to adjust the output of the light source 400 or the like based on the position of the illumination light L10 on the movement path 620.

[0072] Note that the adjustment unit 130 is not limited to adjusting the illumination light L10 by the shielding portions 131 to 135 or the like described above. The control unit 120 may drive the galvanometer mirror X113 and the galvanometer mirror Y115 so that the illumination light L10 located at the movement end portions 620a and 620b illuminates the outside of the end portion of the sample 500 (for example, the stage surface on which the sample 500 is placed). The adjustment unit 130 adjusts so that the illumination light L10 located at the movement end portions 620a and 620b illuminates the outside of the end portion of the sample 500. In this case, the adjustment unit 130 may not block the illumination light L10 with the shielding portion 131 or the like. Even with such a configuration, it is possible to observe the sample 500 with high throughput while reducing the damage to the sample 500.

[0073] Further, the adjustment unit 130 may include a mechanism for reducing the output of the illumination light L10 when it is located at the moving end portions 620a and 620b. That is, the adjustment unit 130 may adjust the output of the illumination light L10 so that the output of the illumination light L10 located at the moving end portions 620a and 620b is smaller than the output of the illumination light L10 located on the moving path 620 other than the moving end portions 620a and 620b. Thereby, the adjustment unit 130 can adjust the illumination light L10 located at the moving end portions 620a and 620b without using the shielding portions 131 and 132.

[0074] For example, the adjustment unit 130 may adjust the illumination light L10 located at the moving end portions 620a and 620b by controlling at least any one of the light source 400, the attenuator 111, and the mirror 112. For example, the adjustment unit 130 may reduce the energy of the illumination light L10 by controlling at least any one of the light source 400, the attenuator 111, and the mirror 112 at the timing when the illumination light L10 is located at the moving end portions 620a and 620b.

[0075] For example, the adjustment unit 130 may control the light source 400 of the illumination light L10 so that the output of the illumination light L10 generated by the light source 400 is different between the moving end portions 620a and 620b and the moving path 620 other than the moving end portions 620a and 620b. Further, the adjustment unit 130 may use the attenuator 111 to control the output of the illumination light L10 transmitted through the attenuator 111 to be different between the moving end portions 620a and 620b and the moving path 620 other than the moving end portions 620a and 620b.

[0076] FIG. 8 is a diagram illustrating the attenuator 111 in the inspection apparatus 1 according to Embodiment 1. As shown in FIG. 8, the attenuator 111 may include a disk-shaped output attenuator 111a. The output attenuator 111a includes a plurality of fan-shaped attenuation portions having different transmittances of the illumination light L10. The attenuator 111 changes the output of the illumination light L10 transmitted through the output attenuator 111a by rotating the output attenuator 111a. By synchronizing the rotation period of the output attenuator 111a with the driving of the galvanometer mirrors X113 and Y115, the output of the illumination light L10 can be controlled to be different between the moving end portions 620a and 620b and the moving path 620 other than the moving end portions 620a and 620b.

[0077] Further, the adjustment unit 130 may control the output of the illumination light L10 reflected by the mirror 112, which includes a mirror 112 such as a polarization beam splitter, to be different between the moving end portions 620a and 620b and the moving path 620 other than the moving end portions 620a and 620b. For example, by synchronizing the timing of reflecting the illumination light L10 in a predetermined polarization state with the driving of the galvanometer mirrors X113 and Y115, the output of the illumination light L10 in the predetermined polarization state can be controlled to be different between the moving end portions 620a and 620b and the moving path 620 other than the moving end portions 620a and 620b.

[0078] As shown in FIG. 1, the detection optical system 200 includes an optical member 210 and a detection unit 220. Note that the detection optical system 200 may further include a spectroscopic unit 230 and a spectrum detection unit 240.

[0079] The optical member 210 includes an objective lens 119, a dichroic mirror 118, lenses 211a and 211b, a mirror 212, and a filter 213. The objective lens 119 and the dichroic mirror 118 are also optical members of the illumination optical system 100 and optical members of the detection optical system 200. Note that the optical member 210 may further include other optical members 210, or some of these optical members 210 may be omitted.

[0080] The objective lens 119 condenses the illumination light L10 onto the sample 500. PL light PL is generated from the sample 500 illuminated with the illumination light L10 including excitation light. The PL light PL generated from the sample 500 and the reflected light L20 from which the illumination light L10 is reflected by the sample 500 enter the objective lens 119. The objective lens 119 condenses the incident PL light PL and reflected light L20. The PL light PL and reflected light L20 condensed by the objective lens 119 enter the dichroic mirror 118. The dichroic mirror 118 may transmit the PL light PL and reflect the reflected light L20.

[0081] The PL light PL transmitted through the dichroic mirror 118 enters the lens 211a. The lens 211a condenses the incident PL light PL. The PL light PL condensed by the lens 211a is condensed at the condensing point IF3. A mirror 212 is disposed near the condensing point IF3. The mirror 212 is, for example, a half mirror, and transmits a part of the incident PL light PL and reflects a part of it. The PL light PL transmitted through the mirror 212 spreads while advancing after being condensed at the condensing point IF3 and enters the lens 211b. Note that the PL light PL reflected by the mirror 212 may spread while advancing after being condensed at the condensing point IF3 and enter the lens 211b.

[0082] The lens 211b converts the incident PL light PL into parallel light. The parallel PL light PL transmitted through the lens 211b enters the filter 213. The filter 213 includes, for example, a short-pass filter. The filter 213 transmits the PL light PL. The PL light PL transmitted through the filter 213 enters the detection unit 220.

[0083] The detection unit 220 detects the PL light generated from the sample 500. The detection unit 220 may include a sensor such as a PMT (Photomultiplier Tube). Note that the detection unit 220 may include a sensor other than a PMT as long as it detects the PL light generated from the sample 500. The detection unit 220 detects defects and the like of the sample 500 from the PL light PL detected by the sensor.

[0084] On the one hand, the PL light PL reflected by the mirror 212 is incident on the spectroscopic unit 230. Note that the PL light PL transmitted through the mirror 212 may be incident on the spectroscopic unit 230, and the PL light PL reflected by the mirror 212 may be incident on the detection unit 220. The spectroscopic unit 230 spectroscopies the incident PL light PL. The PL light PL spectroscopied by the spectroscopic unit 230 is incident on the spectrum detection unit 240. The spectrum detection unit 240 is arranged at the position where the PL light PL is condensed. The spectrum detection unit 240 detects the spectroscopied PL light PL.

[0085] The control unit 120 may move the condensing position of the illumination light L10 in the thickness direction of the sample 500. For example, the control unit 120 moves the condensing position of the illumination light L10 in the thickness direction of the sample 500 by controlling the stage STG. Also, the control unit 120 may move the condensing position of the illumination light L10 in the thickness direction of the sample 500 by controlling the optical member 110.

[0086] The illumination light L10 including the excitation light may have a larger spot of the illumination light L10 toward the inside of the sample 500, for example, due to the influence of the spherical aberration of the objective lens 119. Therefore, the PL light PL from the inside of the sample 500 may decrease due to a decrease in the excitation efficiency inside the sample 500. Thus, the adjustment unit 130 may increase the intensity of the illumination light L10 toward the inside of the sample 500 in order to correct such a decrease in the excitation light rate inside the sample 500.

[0087] The adjustment unit 130 makes the energy of the illumination light L10 when the condensing position is located at the first depth from the sample surface 510 different from the energy of the illumination light when the condensing position is located at a second depth shallower than the first depth from the sample surface 510. For example, the adjustment unit 130 makes the energy of the illumination light L10 when the condensing position is located at the first depth larger than the energy of the illumination light when the condensing position is located at the second depth.

[0088] Specifically, the adjustment unit 130 may increase the output of the light source 400 in synchronization with the timing when the condensing position is located at the first depth. Further, the adjustment unit 130 may adjust the rotation of the output attenuator 111a in the attenuator 111 in synchronization with the timing when the condensing position is located at the first depth. Furthermore, the adjustment unit 130 may adjust the polarization state reflected and transmitted by the mirror 112 in synchronization with the timing when the condensing position is located at the first depth. With such a configuration, the excitation light rate can be improved, and the PL light PL from inside the sample 500 can be increased.

[0089] The control unit 120 is connected to the drive unit KD and the detection unit 220 and the spectrum detection unit 240 in a state where information can be transmitted by wireless or wired communication means. The control unit 120 acquires detection results from the detection unit 220 and the spectrum detection unit 240, respectively.

[0090] The control unit 120 controls the drive unit KD so that the condensing point of the illumination light L10 is located at the position of the defect detected by the detection unit 220. When a specific defect is detected, it may be desired to observe the spectrum of the PL light PL of the defect. Therefore, the amplitudes of the galvanometer mirror X113 and the galvanometer mirror Y115 are narrowed, or the driving of the galvanometer mirror X113 and the galvanometer mirror Y115 is stopped, and only the portion of the detected defect is illuminated. Thereby, the PL light PL of the detected defect can be observed. Further, the PL light PL of the detected defect may be detected by the spectroscopic unit 230 and the spectrum detection unit 240.

[0091] In this way, when the detection unit 220 detects a defect in the sample 500, the control unit 120 may control the drive unit KD to illuminate the illumination light L10 at the position of the defect for a predetermined time. When a defect in the sample 500 is detected during the process of the drive unit KD driving the galvanometer mirror X113 and the galvanometer mirror Y115 in the α-axis direction and the β-axis direction (hereinafter referred to as the sample surface scanning process), the control unit 120 may illuminate the illumination light L10 at the position of the defect for a predetermined time. Further, after the sample surface scanning process is completed, when a defect in the sample 500 is detected, the control unit 120 may illuminate the illumination light L10 at the position of the defect for a predetermined time.

[0092] When the detection unit 220 detects a specific defect, the adjustment unit 130 may form a marking in the vicinity of the defect with the illumination light L10. Note that the timing of forming the marking may be during the sample surface scanning process or after the sample surface scanning process is completed. When observing the PL light PL, the intensity of the illumination light L10 may be reduced so as not to damage the sample 500. However, when a specific defect is found, considering taking it to another device, there is a desire to mark the periphery of the defect. Therefore, for example, the swing widths of the galvanometer mirror X113 and the galvanometer mirror Y115 are narrowed, and the intensity of the illumination light L10 is increased. Thereby, a marking can be formed in the vicinity of the defect.

[0093] <Inspection method> Next, an inspection method using the inspection apparatus 1 will be described. In the inspection method of the present embodiment, the sample 500 is placed on the stage STG, and the inspection area of the sample 500 is adjusted by moving the stage STG in the X-axis direction, the Y-axis direction, and the Z-axis direction. When the inspection area does not fit within the field of view of the inspection apparatus 1, the inspection area is further moved and enlarged in the X-axis direction and the Y-axis direction as appropriate. FIG. 9 is a flowchart illustrating an inspection method using the inspection apparatus 1 according to Embodiment 1.

[0094] As shown in step S11 of FIG. 9, the optical elements 113a and 115a (for example, the galvanometer mirror X113 and the galvanometer mirror Y115) are driven by the driving unit KD. Specifically, the optical elements 113a and 115a are driven by the driving unit KD so as to move the illumination light L10 for exciting the sample 500 in the X-axis direction within a plane parallel to the sample surface 510 of the sample 500. In step S11, after moving the illumination light L10 to the moving end portions 620a and 620b in the α-axis direction, the illumination light L10 may be moved in the β-axis direction. Also, the condensing position of the illumination light L10 in the thickness direction of the sample 500 may be moved.

[0095] Next, as shown in step S12, the illumination light L10 is adjusted by the adjustment unit 130. In step S12, the illumination light L10 located at the moving end portions 620a and 620b in the moving path 620 that moves in the α-axis direction on the orthogonal plane 610 is adjusted by the adjustment unit 130. Specifically, in step S12, the adjustment unit 130 arranges the shielding portions 131 and 132 at conjugate positions conjugate to the sample surface 510 on the optical path of the illumination light L10, and performs at least one of shielding the illumination light L10 located at the moving end portions 620a and 620b and reducing the energy of the illumination light L10. Note that the adjustment unit 130 may vary the positions of the shielding portions 131 and 132 according to the positions of the moving end portions 620a and 620b. Further, in step S12, the shielding portions 131 to 135 and the like may be arranged so as to sandwich the illumination light L10 from both sides in the α-axis direction, or may have a shape that sandwiches the illumination light L10 from both sides in the α-axis direction.

[0096] Next, as shown in step S13, the PL light PL generated from the sample 500 is detected by the detection unit 220. In step S13, it may further include a step of splitting the PL light PL by the spectroscopic unit 230 and a step of detecting the split PL light PL by the spectrum detection unit 240. And when a defect is detected by the detection unit 220, the driving unit KD may be driven so that the condensing point of the illumination light L10 is located at the position of the detected defect.

[0097] Also, when the detection unit 220 detects a specific defect, the illumination light L10 may be made to illuminate the vicinity of the defect, and the illumination light L10 may be made to form a marking in the vicinity of the defect. In this way, the sample 500 can be inspected.

[0098] Next, the effects of the present embodiment will be described. In the inspection apparatus 1 of the present embodiment, the adjustment unit 130 adjusts the illumination light L10 located at the moving end portions 620a and 620b in the moving path 620 of the illumination light L10 that moves in the α-axis direction on the orthogonal plane 610. Therefore, the sample 500 can be observed with high throughput while reducing the damage to the sample 500. Specifically, when scanning the irradiation point on the sample 500 while promoting the excitation of the sample 500 at the irradiation point of the illumination light L10 including the excitation light, it is possible to suppress applying excitation light having a relatively high energy wavelength to the sample 500 at the moving end portions 620a and 620b where the illumination light L10 stays on the sample 500.

[0099] For example, the adjustment unit 130 arranges the shielding portions 131 and 132 at conjugate positions conjugate to the sample surface 510 on the optical path L11 of the illumination light L10. The shielding portions 131 and 132 perform at least one of shielding the illumination light L10 located at the moving end portions 620a and 620b and reducing the energy of the illumination light L10 located at the moving end portions 620a and 620b. Thereby, the damage to the sample 500 can be further reduced.

[0100] Since the adjustment unit 130 varies the positions of the shielding portions 131 and 132 according to the positions of the moving end portions 620a and 620b, it can cope with samples and inspection regions of any shape.

[0101] The inspection apparatus 1 may reduce the output of the illumination light L10 located at the moving end portions 620a and 620b to be smaller than the output of the illumination light L10 located on the moving path 620 other than the moving end portions 620a and 620b without using the shielding portions 131 to 135 and the like. Further, the inspection apparatus 1 may drive the optical elements 113a and 115a so that the illumination light L10 illuminates the outside of the end portion of the sample 500. Even with such a configuration, damage to the sample 500 can be reduced. Other effects are included in the description of the first embodiment.

[0102] As described above, the embodiments of the present disclosure have been described. However, the present disclosure includes appropriate modifications that do not impair its object and advantages, and is not limited by the above embodiments. Further, combinations and omissions of the respective configurations of the first embodiment as appropriate are also within the scope of the technical idea of the present disclosure. Further, the following configurations are also within the scope of the technical idea of the embodiment.

[0103] (Appendix 1) driving an optical element by a driving unit so as to move illumination light for exciting a sample in a first direction in a plane parallel to a sample surface of the sample; causing the illumination light to be adjusted by an adjustment unit; detecting, by a detection unit, PL light generated from the sample illuminated by the illumination light; comprising: when a direction in which the illumination light moves in an orthogonal plane orthogonal to an optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, in the step of causing the adjustment by the adjustment unit, causing the adjustment unit to adjust the illumination light located at a moving end portion in a moving path of the illumination light moving in the second direction in the orthogonal plane; An inspection method. (Appendix 2) In the step of causing the adjustment by the adjustment unit, The adjustment unit adjusts the intensity of the illumination light located at the moving end by performing at least one of shielding the illumination light located at the moving end and reducing the energy of the illumination light located at the moving end, by means of a shielding portion disposed at a conjugate position conjugate to the sample surface on the optical path of the illumination light. The inspection method according to Supplementary Note 1. (Supplementary Note 3) In the step of causing the adjustment unit to perform adjustment, the adjustment unit varies the position of the shielding portion according to the position of the moving end. The inspection method according to Supplementary Note 2. (Supplementary Note 4) In the step of causing the adjustment unit to perform adjustment, the shielding portion is disposed so as to sandwich the illumination light from both sides in the second direction, and the adjustment unit varies the width of the opening through which the illumination light passes by moving the shielding portion in the second direction so as to open and close the opening between the shielding portions. The inspection method according to Supplementary Note 3. (Supplementary Note 5) In the step of causing the adjustment unit to perform adjustment, the shielding portion has a shape that sandwiches the illumination light from both sides in the second direction, and the length of the opening between the shielding portions in the second direction changes according to the position in the third direction orthogonal to the second direction, and the adjustment unit varies the width of the opening through which the illumination light passes by moving the shielding portion in the third direction. The inspection method according to Supplementary Note 3. (Supplementary Note 6) In the step of causing the adjustment unit to perform adjustment, the adjustment unit adjusts the illumination light located at the moving end by causing the control unit to drive the optical element to the driving unit so that the illumination light located at the moving end illuminates the outside of the end of the sample. The inspection method according to Supplementary Note 1. (Supplementary Note 7) In the step of causing the adjustment unit to perform adjustment, The energy of the illumination light incident on the moving path is substantially constant across the moving path including the moving end portion. The inspection method according to any one of Appendices 2 to 5. (Appendix 8) In the step of causing the adjustment unit to make an adjustment, the adjustment unit adjusts the intensity of the illumination light located at the moving end portion by making the output of the illumination light located at the moving end portion smaller than the output of the illumination light located at the moving path other than the moving end portion. The inspection method according to Appendix 1. (Appendix 9) The illumination light includes a wavelength longer than the wavelength corresponding to the band gap of the material contained in the sample, and multi-photon excites the sample. The inspection method according to Appendix 1. (Appendix 10) The illumination light includes a wavelength corresponding to the energy for two-photon exciting the sample. The inspection method according to Appendix 4. (Appendix 11) The sample includes a semiconductor or a compound semiconductor. The inspection method according to Appendix 5. (Appendix 12) The light source that generates the illumination light includes a pulsed laser that generates the illumination light including wavelengths in the range of 500 nm to 600 nm. The inspection method according to Appendix 11. (Appendix 13) In the step of causing the driving unit to drive, when a defect of the sample is detected by the detection unit, the illumination light is made to stay at the position of the defect for a predetermined time by controlling the driving unit for illumination. The inspection method according to Appendix 1. (Appendix 14) The step of causing the detection unit to detect includes the step of splitting the PL light by a spectroscopic unit, and the step of causing the spectrum detection unit to detect the split PL light, and further includes. The inspection method described in Supplementary Note 1. (Supplementary Note 15) In the step of causing the spectrum detection unit to detect, The spectrum detection unit is disposed at a position where the PL light is condensed, The driving unit is driven so that the condensing point of the illumination light is located at the position of the defect detected by the detection unit. The inspection method described in Supplementary Note 14. (Supplementary Note 16) In the step of causing the driving unit to drive, After moving the illumination light in the second direction to the moving end portion, the illumination light is moved in a third direction orthogonal to the second direction. The inspection method described in Supplementary Note 1. (Supplementary Note 17) The optical element is, A first optical element that moves the illumination light in the second direction, A second optical element that moves the illumination light in a third direction orthogonal to the second direction, And includes, The second optical element is disposed between the sample and the first optical element on the optical path of the illumination light, The shielding portion is disposed between the first optical element and the second optical element. The inspection method described in Supplementary Note 2. (Supplementary Note 18) Further includes a step of moving the condensing position of the illumination light in the thickness direction of the sample, In the step of causing the adjustment unit to adjust, The energy of the illumination light when the condensing position is located at a first depth from the sample surface is made larger than the energy of the illumination light when the condensing position is located at a second depth shallower than the first depth from the sample surface. The inspection method described in Supplementary Note 1. (Supplementary Note 19) In the step of causing the detection unit to detect, When the detection unit detects a specific defect, In the step of causing the driving unit to drive, Cause the illumination light to illuminate the vicinity of the defect, In the step of causing the adjustment unit to make an adjustment, The adjustment unit causes the illumination light to form a marking in the vicinity of the defect. The inspection method according to Supplementary Note 1. (Supplementary Note 20) A step of driving an optical element by a driving unit so as to move illumination light for exciting a sample in a first direction in a plane parallel to a sample surface of the sample; A step of causing the adjustment unit to adjust the illumination light; A step of causing a detection unit to detect PL light generated from the sample illuminated by the illumination light; Comprising: When the direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, In the step of causing the adjustment unit to make an adjustment, Restrict the transmission of the illumination light located at a moving end portion in the moving path of the illumination light moving in the second direction in the orthogonal plane to a shielding portion disposed at a conjugate position conjugate to the sample surface. Inspection method.

Explanation of Signs

[0104] 1, 1a Inspection apparatus 100 Illumination optical system 110 Optical member 111 Attenuator 111a Output attenuator 112 Mirror 113 Galvano mirror X 113a Optical element 114a, 114b Lenses 115 Galvano mirror Y 115a Optical element 116a, 116b Lenses 117 λ / 4 plate 118 Dichroic mirror 119 Objective lens 120 Control unit 130 Adjustment part 131, 132, 133, 134, 135 Shielding parts 139 Opening 200 Detection optical system 210 Optical member 211a, 211b Lenses 212 Mirror 213 Filter 220 Detection unit 230 Spectral splitting part 240 Spectrum detection unit 400 Light source 500 Sample 510 Sample surface 520, 521, 522, 523 Movement paths 610 Orthogonal plane 620, 621, 622, 623 Movement paths 620a, 620b, 621a, 621b, 622a, 622b Movement end parts 623a, 623b Movement end parts IF1, IF2, IF3 Focus points KD Driving part L10 Illumination light L11 Optical path L20 Reflected light PL PL light STG Stage

Claims

1. A drive unit that drives an optical element so as to move illumination light for exciting a sample in a first direction within a plane parallel to the sample surface of the sample; A detection unit that detects PL light generated from the sample illuminated by the illumination light; An adjustment unit that adjusts the illumination light; A control unit that controls the drive unit; Comprising: When the direction in which the illumination light moves in a plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, The adjustment unit adjusts the illumination light located at a moving end portion in the moving path of the illumination light that moves in the second direction in the orthogonal plane. Inspection apparatus.

2. The adjustment unit performs at least one of shielding the illumination light located at the moving end portion and reducing the energy of the illumination light located at the moving end portion by a shielding portion disposed at a conjugate position conjugate to the sample surface on the optical path of the illumination light, thereby adjusting the intensity of the illumination light located at the moving end portion. The inspection apparatus according to claim 1.

3. The adjustment unit varies the position of the shielding portion according to the position of the moving end portion. The inspection apparatus according to claim 2.

4. The shielding portion is disposed so as to sandwich the illumination light from both sides in the second direction. The adjustment unit varies the width of the opening through which the illumination light passes by moving the shielding portion in the second direction so as to open and close the opening between the shielding portions. The inspection apparatus according to claim 3.

5. The shielding portion has a shape that sandwiches the illumination light from both sides in the second direction. The length of the opening between the shielding portions varies depending on the position in a third direction orthogonal to the second direction. The adjustment unit varies the width of the opening through which the illumination light passes by moving the shielding portion in the third direction. The inspection apparatus according to claim 3.

6. The adjustment unit adjusts the illumination light located at the moving end portion by causing the control unit to drive the optical element of the drive unit so that the illumination light located at the moving end portion illuminates the outside of the end portion of the sample. The inspection apparatus according to claim 1.

7. The energy of the illumination light incident on the moving path is substantially constant over the moving path including the moving end portion. The inspection apparatus according to any one of claims 1 to 5.

8. The adjustment unit adjusts the intensity of the illumination light located at the moving end by making the output of the illumination light located at the moving end smaller than the output of the illumination light located on the moving path other than the moving end. The inspection apparatus according to claim 1.

9. The illumination light includes the wavelength longer than the wavelength corresponding to the bandgap of the material contained in the sample, and multi-photon excites the sample. The inspection apparatus according to claim 1.

10. The illumination light includes a wavelength corresponding to the energy for two-photon exciting the sample. The inspection apparatus according to claim 9.

11. The sample includes a semiconductor or a compound semiconductor. The inspection apparatus according to claim 10.

12. The light source that generates the illumination light includes a pulsed laser that generates the illumination light including wavelengths of 500 nm to 600 nm. The inspection apparatus according to claim 11.

13. When a defect of the sample is detected by the detection unit, the control unit controls the driving unit to illuminate the illumination light at the position of the defect for a predetermined time. The inspection apparatus according to claim 1.

14. A spectroscopic unit that spectroscopies the PL light, a spectrum detection unit that detects the spectroscopied PL light, and further includes The inspection apparatus according to claim 1.

15. The spectrum detection unit is disposed at a position where the PL light is condensed, and the control unit controls the driving unit so that the condensing point of the illumination light is located at the position of the defect detected by the detection unit. The inspection apparatus according to claim 14.

16. After moving the illumination light to the moving end in the second direction by controlling the driving unit, the control unit moves it in a third direction orthogonal to the second direction. The inspection apparatus according to claim 1.

17. The optical element includes a first optical element that moves the illumination light in the second direction, and a second optical element that moves the illumination light in a third direction orthogonal to the second direction, and includes The second optical element is disposed between the sample and the first optical element on the optical path of the illumination light, and the shielding portion is disposed between the first optical element and the second optical element. The inspection apparatus according to claim 2.

18. The control unit moves the condensing position of the illumination light in the thickness direction of the sample. The adjustment unit makes the energy of the illumination light when the condensing position is located at a first depth from the sample surface greater than the energy of the illumination light when the condensing position is located at a second depth shallower than the first depth from the sample surface. The inspection apparatus according to claim 1.

19. When the detection unit detects a specific defect, the control unit controls the driving unit so that the illumination light illuminates the vicinity of the defect, and the adjustment unit forms a marking in the vicinity of the defect with the illumination light. The inspection apparatus according to claim 1.

20. A step of driving an optical element to the driving unit so as to move illumination light for exciting a sample in a first direction in a plane parallel to the sample surface of the sample; a step of causing the adjustment unit to adjust the illumination light; a step of causing a detection unit to detect PL light generated from the sample illuminated with the illumination light; comprising when the direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, in the step of causing the adjustment unit to adjust, the adjustment unit adjusts the illumination light located at a moving end portion in the moving path of the illumination light moving in the second direction in the orthogonal plane. Inspection method.

21. A driving unit that drives an optical element so as to move illumination light for exciting a sample in a first direction in a plane parallel to the sample surface of the sample; a detection unit that detects PL light generated from the sample illuminated with the illumination light; a control unit that controls the driving unit; a shielding unit disposed at a conjugate position conjugate to the sample surface; comprising when the direction in which the illumination light moves in an orthogonal plane orthogonal to the optical path of the illumination light is defined as a second direction corresponding to the first direction in which the illumination light moves on the sample surface, the shielding unit restricts the transmission of the illumination light located at a moving end portion in the moving path of the illumination light moving in the second direction in the orthogonal plane. Inspection apparatus.

Images