Multilayer electronic component

Abstract

To provide a multilayer electronic component with an improved bending strength.SOLUTION: The multilayer electronic component according to an embodiment of the present invention includes: a body having a dielectric layer 111 and internal electrode layers alternately arranged in a first direction across the dielectric layer; and a first external electrode and a second external electrode arranged on the body. The internal electrode layers include internal electrodes 121a, 122a, 123a, and 124a and dummy electrodes 121b, 122b, 123b, and 124b arranged across separation parts 141 to 144, respectively. At least two of the separation parts include a region which overlaps in the first direction and a region which does not overlap in the first direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor mounted on the printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output power, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, the main body, which is a component of the multilayer ceramic capacitor, mainly contains a ceramic material that is a brittle substance, so it has a property that is vulnerable to tensile stress. Therefore, it may not be able to withstand the stress applied from the outside due to the manufacturing process or the use environment, and there may be a problem that cracks occur in the main body and the lifespan is shortened.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the problems to be solved by the present invention is to provide a laminated electronic component with improved bending strength.

[0007] However, some of the problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0008] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer, a first internal electrode layer, a second internal electrode layer, a third internal electrode layer, and a fourth internal electrode layer that are alternately arranged in a first direction with the dielectric layer interposed therebetween, a first surface and a second surface that face each other in the first direction, a third surface and a fourth surface that are connected to the first surface and the second surface and face each other in a second direction, and a fifth surface and a sixth surface that are connected to the first surface, the second surface, the third surface, and the fourth surface and face each other in a third direction, a first external electrode and a second external electrode that are respectively disposed on the third surface and the fourth surface, the first internal electrode layer includes a first internal electrode and a first dummy electrode that is disposed with a first separation portion interposed between the first internal electrode, the second internal electrode layer includes a second internal electrode and a second dummy electrode that is disposed with a second separation portion interposed between the second internal electrode, the third internal electrode layer includes a third internal electrode and a third dummy electrode that is disposed with a third separation portion interposed between the third internal electrode, the fourth internal electrode layer includes a fourth internal electrode and a fourth dummy electrode that is disposed with a fourth separation portion interposed between the fourth internal electrode, the first external electrode is connected to the first internal electrode, the third internal electrode, the second dummy electrode, and the fourth internal electrode, the second external electrode is connected to the second internal electrode, the fourth internal electrode, the first dummy electrode, and the third dummy electrode, the first separation portion includes a region that does not overlap with a region where the third separation portion overlaps in the first direction, and the second separation portion can include a region that does not overlap with a region where the fourth separation portion overlaps in the first direction.

Advantages of the Invention

[0009] One of the effects of the present invention is to improve the bending strength of the multilayer electronic component.

[0010] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shapes and sizes of elements in the drawings can be exaggerated for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0013] To clearly describe the present invention in the drawings, parts not relevant to the description are omitted, and the sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation. Therefore, the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the scope of the same concept, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part refers to a certain component as "including", this means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0014] In the figures, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0015] Stacked electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view of an internal electrode layer in an embodiment of the present invention. FIG. 3 schematically shows a cross-sectional view of an internal electrode layer in another embodiment of the present invention. FIG. 4 schematically shows a cross-sectional view of one internal electrode layer in another embodiment of the present invention. FIG. 5 schematically shows a cross-sectional view taken along line I-I' of FIG. 1. FIG. 6 schematically shows a cross-sectional view taken along line II-II' of FIG. 1. FIG. 7 schematically shows a cross-sectional view taken along line III-III' of FIG. 1.

[0016] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component according to an embodiment of the present invention will be described in detail. However, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention can also be applied to various electronic products using a dielectric composition, such as inductors, piezoelectric elements, varistors, or thermistors.

[0017] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, a first internal electrode layer 121, a second internal electrode layer 122, a third internal electrode layer 123, and a fourth internal electrode layer 124 that are alternately arranged in a first direction with the dielectric layer 111 interposed therebetween, a first surface 1 and a second surface 2 that face each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction. The first internal electrode layer 121 includes a first internal electrode 121a and a first dummy electrode 121b that is arranged with the first internal electrode 121a and a first separation portion 141 interposed therebetween. The second internal electrode layer 122 includes a second internal electrode 122a and a second dummy electrode 122b that is arranged with the second internal electrode 122a and a second separation portion 142 interposed therebetween. The third internal electrode layer 123 includes a third internal electrode 123a and a third dummy electrode 123b that is arranged with the third internal electrode 123a and a third separation portion 143 interposed therebetween. The fourth internal electrode layer 124 includes a fourth internal electrode 124a and a fourth dummy electrode 124b that is arranged with the fourth internal electrode 124a and a fourth separation portion 144 interposed therebetween. The first external electrode 131 is connected to the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b, and the fourth dummy electrode 124b. The second external electrode 124 is connected to the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b, and the third dummy electrode 123b. The first separation portion 141 includes a region that does not overlap with a region where the third separation portion 143 overlaps in the first direction. The second separation portion 142 can include a region that does not overlap with a region where the fourth separation portion 144 overlaps in the first direction.

[0018] The main body 110 may have the dielectric layer 111 and the internal electrode layers 121, 122, 123, and 124 alternately laminated.

[0019] More specifically, the main body 110 can be arranged inside the main body 110 and include a first internal electrode layer 121, a second internal electrode layer 122, a third internal electrode layer 123, and a fourth internal electrode layer 124 that are alternately arranged with a dielectric layer 111 interposed therebetween.

[0020] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0021] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0022] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0023] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO 3 )-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can contain BaTiO 3 -based ceramic particles. As examples of the ceramic particles, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0024] Also, as raw materials for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO 3 ) according to the object of the present invention.

[0025] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0026] In order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the thickness of the dielectric layer 111 can be 10.0 μm or less. Also, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 may be 3.0 μm or less, and in order to more easily achieve ultra - miniaturization and high capacitance, the thickness of the dielectric layer 111 may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0027] Here, the thickness td of the dielectric layer 111 can mean the thickness td of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0028] On the other hand, the thickness td of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness td of the dielectric layer 111 can mean the average thickness td of the dielectric layer 111, and can mean the average size of the dielectric layer 111 in the first direction.

[0029] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 10 equally spaced points can be specified by the capacitance forming portion Ac. Also, when the measurement of such an average value is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0030] The internal electrode layers 121, 122, 123, 124 may be alternately laminated with the dielectric layer 111.

[0031] The internal electrode layers 121, 122, 123, 124 can include internal electrodes 121a, 122a, 123a, 124a that form capacitance, and dummy electrodes 121b, 122b, 123b, 124b that are arranged with separation portions 141, 142, 143, 144 interposed therebetween and do not form capacitance.

[0032] In the present invention, unless there is an explanation of special circumstances, the description of the internal electrode layers 121, 122, 123, 124 can include the description of the internal electrodes 121a, 122a, 123a, 124a and the dummy electrodes 121b, 122b, 123b, 124b.

[0033] More specifically, the first internal electrode layer 121 includes a first internal electrode 121a and a first dummy electrode 121b disposed with the first isolation portion 141 interposed therebetween. The second internal electrode layer 122 includes a second internal electrode 122a and a second dummy electrode 122b disposed with the second isolation portion 142 interposed therebetween. The third internal electrode layer 123 includes a third internal electrode 123a and a third dummy electrode 123b disposed with the third isolation portion 143 interposed therebetween. The fourth internal electrode layer 124 can include a fourth internal electrode 124a and a fourth dummy electrode 124b disposed with the fourth isolation portion 144 interposed therebetween.

[0034] In other words, the internal electrodes 121a, 122a, 123a, 124a and the dummy electrodes 121b, 122b, 123b, 124b may be electrically insulated from each other. More specifically, the first internal electrode 121a may be electrically insulated from the first dummy electrode 121b, the second internal electrode 122a may be electrically insulated from the second dummy electrode 122b, the third internal electrode 123a may be electrically insulated from the third dummy electrode 123b, and the fourth internal electrode 124a may be electrically insulated from the fourth dummy electrode 124b.

[0035] More specifically, the first internal electrode 121a is spaced apart from the fourth surface 4 and can be exposed through the third surface 3. The second internal electrode 122a is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The third internal electrode 123a is spaced apart from the fourth surface 4 and can be exposed through the third surface 3. The fourth internal electrode 124a is spaced apart from the third surface 3 and can be exposed through the fourth surface 4.

[0036] Also, the first dummy electrode 121b is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The second dummy electrode 122b is spaced apart from the fourth surface 4 and can be exposed through the third surface 3. The third dummy electrode 123b is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. The fourth dummy electrode 124b is spaced apart from the fourth surface 4 and can be exposed through the third surface 3.

[0037] The first separation portion 141 can mean the region between the first internal electrode 121a and the first dummy electrode 121b that is separated from the third surface 3 and the fourth surface 4 and is separated in the second direction. The second separation portion 142 can mean the region between the second internal electrode 122a and the second dummy electrode 122b that is separated from the third surface 3 and the fourth surface 4 and is separated in the second direction. The third separation portion 143 can mean the region between the third internal electrode 123a and the third dummy electrode 123b that is separated from the third surface 3 and the fourth surface 4 and is separated in the second direction. The fourth separation portion 144 can mean the region between the fourth internal electrode 124a and the fourth dummy electrode 124b that is separated from the third surface 3 and the fourth surface 4 and is separated in the second direction.

[0038] At this time, the first separation portion 141 can include a region that does not overlap with a region that overlaps with the third separation portion 143 in the first direction, and the second separation portion 142 can include a region that does not overlap with a region that overlaps with the fourth separation portion 144 in the first direction.

[0039] By arranging the first separation portion 141 and the third separation portion 143 in an intersecting manner so as to include a region where they overlap each other and a region where they do not overlap each other in the first direction, and arranging the second separation portion 142 and the fourth separation portion 144 in an intersecting manner so as to include a region where they overlap each other and a region where they do not overlap each other in the first direction, it is possible to effectively prevent cracks from being generated even when bending stress is applied to the main body 110.

[0040] That is, when the first separation part 141 and the third separation part 143 are arranged in a crossed manner so as to include an overlapping region and a non-overlapping region with each other in the first direction, and the second separation part 142 and the fourth separation part 144 are arranged in a crossed manner so as to include an overlapping region and a non-overlapping region with each other in the first direction, when the stacked electronic component 100 including the main body 110 receives a bending stress in the first direction, by minimizing the overlapping region between the first separation part 141, the second separation part 142, the third separation part 143, and the fourth separation part 144 where the internal electrodes 121a, 122a, 123a, 124a and the dummy electrodes 121b, 122b, 123b, 124b are not arranged with respect to the first direction, the occurrence of cracks can be prevented, and the mechanical characteristics of the stacked electronic component 100 can be improved.

[0041] For example, the first separation part 141, the second separation part 142, the third separation part 143, and the fourth separation part 144 can have a substantially parallelogram shape, and the first separation part 141 and the third separation part 143 of the parallelogram can be arranged so as to cross each other in the first direction, and the second separation part 142 and the fourth separation part 144 of the parallelogram can be arranged so as to cross each other in the first direction.

[0042] The first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a can include a first side and a second side that face each other in the third direction, and the lengths of the first side and the second side of each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a can be different from each other.

[0043] In other words, when the lengths of one side and the other side of the internal electrodes facing each other in the third direction are L1 and L2 respectively, L1 and L2 do not have to be the same.

[0044] More specifically, the first internal electrode 121a can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the first internal electrode 121a in the second direction can be larger than the size of the second side of the first internal electrode 121a in the second direction. The second internal electrode 122a can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the second internal electrode 122a in the second direction can be larger than the size of the first side of the second internal electrode 122a in the second direction. The third internal electrode 123a can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the third internal electrode 123a in the second direction can be larger than the size of the first side of the third internal electrode 123a in the second direction. The fourth internal electrode 124a can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the fourth internal electrode 124a in the second direction can be larger than the size of the second side of the fourth internal electrode 124a in the second direction.

[0045] Also, the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b can include a first side and a second side that face each other in the third direction, and the lengths of the first side and the second side of each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b can be different from each other.

[0046] In other words, when the lengths of one side and the other side of the dummy electrode that face each other in the third direction are L3 and L5, respectively, L3 and L5 do not have to be the same.

[0047] More specifically, the first dummy electrode 121b can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the first dummy electrode 121b in the second direction can be larger than the size of the first side of the first dummy electrode 121b in the second direction. The second dummy electrode 122b can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the second dummy electrode 122b in the second direction can be larger than the size of the second side of the second dummy electrode 122b in the second direction. The third dummy electrode 123b can include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the third dummy electrode 123b in the second direction can be larger than the size of the second side of the third dummy electrode 123b in the second direction. The fourth dummy electrode 124d can include a second side adjacent to the fifth surface 5 and a first side adjacent to the sixth surface 6, and the size of the second side of the fourth dummy electrode 124b in the second direction can be larger than the size of the first side of the fourth dummy electrode 124b in the second direction.

[0048] Since the lengths of the first sides and the second sides of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a are different from each other, and the lengths of the first sides and the second sides of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b are different from each other, the bending stress of the multilayer electronic component can be further improved.

[0049] On the other hand, the average size in the second direction of each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a may be larger than the average size in the second direction of each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b.

[0050] The average size in the second direction of each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a is larger than the average size in the second direction of each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b, so that sufficient capacitance formation can be ensured, and furthermore, sufficient bending strength can be ensured.

[0051] The average size in the second direction of each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a can be obtained by measuring the size in the second direction at the center in the third direction of each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a, measuring the size in the second direction at points separated from the center in the third direction to both sides in the third direction, and averaging the sizes in the second direction.

[0052] Similarly, the average size in the second direction of each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b can be obtained by measuring the size in the second direction at the center in the third direction of each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b, measuring the size in the second direction at points separated from the center in the third direction to both sides in the third direction, and averaging the sizes in the second direction.

[0053] On the other hand, the sizes in the second direction of each of the first separation part 141, the second separation part 142, the third separation part 143, and the fourth separation part 144 may be substantially constant.

[0054] Since the sizes in the second direction of each of the first separation part 141, the second separation part 142, the third separation part 143, and the fourth separation part 144 are substantially constant, the bending stress applied in the first direction can be more preferably absorbed, and the bending strength of the multilayer electronic component can be improved.

[0055] Taking FIGS. 5 and 6 as examples for specific description, in a cross-sectional view along the line I-I' corresponding to the cross-sections in the first and second directions at the center of the stacked electronic component 100 in the third direction, it can be confirmed that the first separation part 141 and the third separation part 143 overlap in the first direction, and the second separation part 142 and the fourth separation part 144 overlap in the first direction. Further, in a cross-sectional view along the line II-II' corresponding to the cross-sections in the first and second directions separated from the center of the stacked electronic component 100 in the third direction by a certain interval in the third direction, it can be confirmed that the first separation part 141 and the third separation part 143 do not overlap in the first direction, and the second separation part 142 and the fourth separation part 144 do not overlap in the first direction.

[0056] Thereby, even when the stacked electronic component 100 is mounted on a substrate and bending stress is applied in the first direction, there may be regions where other internal electrode layers 121, 122, 123, 124 are arranged in the adjacent regions in the first direction of the separation parts 141, 142, 143, 144 where the internal electrode layers 121, 122, 123, 124 are not arranged, so that it can be more excellent in bending stress.

[0057] Also, the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a can be arranged separated from the fifth surface 5 and the sixth surface 6.

[0058] More specifically, the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a may be separated from the fifth surface 5 by W3 in the third direction, and the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a may be separated from the sixth surface 6 by W4 in the third direction.

[0059] Here, the region separated by W3 can be referred to as a first side margin region to be described later, and the region separated by W4 can be referred to as a second side margin region to be described later. Specific descriptions of W3 and W4 will be given later.

[0060] And the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b can be arranged at a distance from the fifth surface 5 and the sixth surface 6. However, it is not particularly limited thereto. As shown in FIG. 3, the first dummy electrode 221b, the second dummy electrode 222b, the third dummy electrode 223b, and the fourth dummy electrode 224b may be arranged so as to be in contact with a part of the fifth surface 5 and the sixth surface 6. Thereby, the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode can be arranged at a distance from at least one of the fifth surface 5 and the sixth surface 6.

[0061] More specifically, the first dummy electrode 221b can be in contact with a part of the fifth surface 5 and arranged at a distance from the sixth surface 6. The second dummy electrode 222b can be arranged at a distance from the fifth surface 5 and in contact with a part of the sixth surface 6. The third dummy electrode 223b can be arranged at a distance from the fifth surface 5 and in contact with a part of the sixth surface 6. The fourth dummy electrode 224b can be in contact with a part of the fifth surface 5 and arranged at a distance from the sixth surface 6.

[0062] On the third surface 3 of the main body 110, a first external electrode 131 is arranged and connected to the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b, and the fourth dummy electrode. On the fourth surface 4 of the main body 110, a second external electrode 132 is arranged and can be connected to the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b, and the third dummy electrode 123b.

[0063] That is, the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b, and the fourth dummy electrode 124b are connected to the first external electrode 131 without being connected to the second external electrode 132, and the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b, and the third dummy electrode 123b can be connected to the second external electrode 132 without being connected to the first external electrode 131. At this time, the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a among themselves and the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b among themselves can be electrically separated from each other by the dielectric layer 111 disposed in the middle of the first direction.

[0064] On the other hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with the first internal electrode layer 121, a second ceramic green sheet printed with the second internal electrode layer 122, a third ceramic green sheet printed with the third internal electrode layer 123, and a fourth ceramic green sheet printed with the fourth internal electrode layer 124, and then firing them.

[0065] Also, taking FIG. 4 which is a cross-section in the second direction and the third direction as an example, the shapes of the dielectric layer and the fourth internal electrode 224a and the fourth dummy electrode 224b will be described in more detail. However, it is not particularly limited thereto, and the description of the fourth internal electrode 224a can be similarly applied to the first internal electrodes 121a and 221a, the second internal electrodes 122a and 222a, the third internal electrodes 123a and 223a, and the fourth internal electrodes 124a and 224a, and the description of the fourth dummy electrode 224b can be similarly applied to the first dummy electrodes 121b and 221b, the second dummy electrodes 122b and 222b, the third dummy electrodes 123b and 223b, and the fourth dummy electrodes 124b and 224b.

[0066] The size of the dielectric layer 111 in the second direction can be L, and the size in the third direction can be W.

[0067] The fourth internal electrode 224a can include a first side, a second side, a third side, and a fourth side, and can be exposed through the fourth surface 4. Among the fourth internal electrode 224a, the size in the second direction of the first side adjacent to the fifth surface 5 is L1, the size in the second direction of the second side adjacent to the sixth surface 6 is L2, the size in the third direction of the third side in contact with the fourth surface 4 can be W1, and the length of the remaining fourth side can be determined by the first side, the second side, and the third side.

[0068] Here, L1 and L2 can satisfy 0.35×L≦L1≦0.98×L and 0.14×L1≦L2≦0.94×L1 for sufficient capacitance formation, and W1 can satisfy 0.42×W≦W1≦0.94×W for electrical connectivity with the second external electrode and sufficient capacitance formation.

[0069] Also, the first side of the fourth internal electrode 224a may be separated from the fifth surface 5 by W3 in the third direction, and the second side of the fourth internal electrode 224a may be separated from the sixth surface 6 by W4 in the third direction.

[0070] Here, W3 and W4 can satisfy 0.03×W≦W3≦0.29×W and 0.03×W≦W4≦0.29×W, and W3 can also have the same size as W4.

[0071] The fourth dummy electrode 224b can include a first side, a second side, a third side, and a fourth side, and can be exposed through the third surface 3. Among the fourth dummy electrode 224b, the size in the second direction of the first side in contact with or adjacent to the fifth surface 5 is L3, the size in the second direction of the second side adjacent to the sixth surface 6 is L5, the size in the third direction of the third side in contact with the third surface 3 can be W2, and the length of the remaining fourth side can be determined by the first side, the second side, and the third side.

[0072] Here, L3 and L5 can satisfy 0≦L3≦0.22×L and L5 = L - L4 - L2 to ensure sufficient bending strength, and W2 can satisfy W1≦W2≦0.97×W to ensure sufficient bending strength.

[0073] The size of the fourth isolation part 144 in the second direction can be L4, and can satisfy 15 μm ≤ L4 ≤ 200 μm, and the size of the fourth isolation part 144 in the second direction can be substantially constant.

[0074] By each of the sizes L4 of the first isolation part 141, the second isolation part 142, the third isolation part 143, and the fourth isolation part 144 in the second direction satisfying 15 μm ≤ L4 ≤ 200 μm, the bending strength of the multilayer electronic component can be made more excellent.

[0075] When the size L4 of each of the first isolation part 141, the second isolation part 142, the third isolation part 143, and the fourth isolation part 144 in the second direction is less than 15 μm, the internal electrode and the dummy electrode may not be electrically insulated, and there is a risk of short - circuit occurring. When the size L4 of each of the first isolation part 141, the second isolation part 142, the third isolation part 143, and the fourth isolation part 144 in the second direction exceeds 200 μm, the bending strength of the multilayer electronic component is not improved, and there is a risk of crack occurring.

[0076] In the fourth internal electrode 224a, when the angle formed by the first side and the fourth side is θ1, it can satisfy 30° ≤ θ1 ≤ 80° for sufficient bending strength of the multilayer electronic component.

[0077] Also, in the fourth dummy electrode 224b, when the angle formed by the second side and the fourth side is θ2, it can satisfy 30° ≤ θ2 ≤ 80° for sufficient bending strength of the multilayer electronic component.

[0078] The materials for forming the internal electrode layers 121, 122, 123, 124 are not particularly limited, and materials excellent in electrical conductivity can be used. For example, the internal electrodes 121, 122 can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0079] In addition, the internal electrode layers 121, 122, 123, and 124 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As a printing method for the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0080] On the other hand, the thickness te of the internal electrode layers 121, 122, 123, and 124 does not need to be particularly limited.

[0081] In order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the thickness te of the internal electrode layers 121, 122, 123, and 124 may be 3.0 μm or less. Also, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the internal electrode layers 121, 122, 123, and 124 may be 1.0 μm or less. In order to more easily achieve ultra-miniaturization and high capacitance, the thickness of the internal electrode layers 121, 122, 123, and 124 may be 0.6 μm or less, and more preferably 0.4 μm or less.

[0082] Here, the thickness te of the internal electrode layers 121, 122, 123, and 124 can mean the size in the first direction of the internal electrodes 121a, 122a, 123a, 124a and the dummy electrodes 121b, 122b, 123b, 124b. Also, the thickness te of the internal electrode layers 121, 122, 123, and 124 can mean the average thickness te of the internal electrode layers 121, 122, 123, and 124, and can mean the average size in the first direction of the internal electrode layers 121, 122, 123, and 124.

[0083] The average size of the internal electrode layers 121, 122, 123, and 124 in the first direction can be measured by scanning an image of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one internal electrode layer in the first direction can be calculated by measuring the size in the first direction at five equally spaced points in the second direction for one internal electrode in the scanned image, and the average size of the internal electrode in the first direction can be obtained. The size in the first direction of one dummy electrode can be measured at five equally spaced points in the second direction to obtain the average size of the dummy electrode in the first direction. Thereafter, the average size of one internal electrode in the first direction and the average size of one dummy electrode in the first direction are averaged to obtain the average size of one internal electrode layer in the first direction. Further, when such measurement of the average value is extended to 10 internal electrode layers to measure the average value, the average size of the internal electrode layer in the first direction can be further generalized.

[0084] Here, the average size of the internal electrode in the first direction and the average size of the dummy electrode in the first direction may be substantially the same, but are not particularly limited thereto. Here, the fact that the average size of the internal electrode in the first direction and the average size of the dummy electrode in the first direction are substantially the same can mean that the difference between the larger value and the smaller value is 5% or less based on the larger value.

[0085] On the other hand, in one embodiment of the present invention, the average thickness td of at least one of the plurality of dielectric layers 111 and the average thickness te of at least one of the plurality of internal electrode layers 121, 122, 123, 124 can satisfy 2×te < td.

[0086] In other words, the average thickness td of one dielectric layer 111 can be greater than twice the average thickness te of one internal electrode layer 121, 122, 123, 124. Preferably, the average thickness td of the plurality of dielectric layers 111 may be greater than twice the average thickness te of the plurality of internal electrode layers 121, 122, 123, 124.

[0087] Generally, for electronic components used in high-voltage electrical equipment, the main issue is the reliability problem due to the decrease in breakdown voltage (BDV) in a high-voltage environment.

[0088] Therefore, in order to prevent the decrease in breakdown voltage in a high-voltage environment, by making the average thickness td of the dielectric layer 111 even larger than twice the average thickness te of the internal electrode layers 121, 122, 123, 124, the thickness of the dielectric layer, which is the distance between the internal electrodes, can be increased, and the breakdown voltage characteristics can be improved.

[0089] When the average thickness td of the dielectric layer 111 is less than or equal to twice the average thickness te of the internal electrode layers 121, 122, 123, 124, the average thickness of the dielectric layer, which is the distance between the internal electrodes, becomes thin, and the breakdown voltage may decrease, and there may be a possibility of a short circuit between the internal electrodes.

[0090] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end-surfaces in the first direction of the capacitance forming portion Ac.

[0091] Specifically, it can include a first cover portion 112 disposed on one surface in the first direction of the capacitance forming portion Ac, and a second cover portion 113 disposed on the other surface in the first direction of the capacitance forming portion Ac. More specifically, it can include an upper cover portion 112 disposed on the upper part in the first direction of the capacitance forming portion Ac, and a lower cover portion 113 disposed on the lower part in the first direction of the capacitance forming portion Ac.

[0092] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role in preventing damage to the internal electrode layers 121, 122, 123, 124 due to physical or chemical stress.

[0093] The upper cover part 112 and the lower cover part 113 do not include the internal electrode layers 121, 122, 123, 124, and can contain the same material as the dielectric layer 111. That is, the upper cover part 112 and the lower cover part 113 can contain a ceramic material. For example, they can contain a barium titanate (BaTiO 3 )-based ceramic material.

[0094] On the other hand, the thickness tc of the cover parts 112, 113 does not need to be particularly limited.

[0095] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover parts 112, 113 may be 100 μm or less, preferably 30 μm or less, and in the case of ultra-small products, more preferably 20 μm or less.

[0096] Here, the thickness tc of the cover parts 112, 113 can mean the size of the cover parts 112, 113 in the first direction. Note that the thickness tc of the cover parts 112, 113 means the average thickness tc of the cover parts 112, 113, and can mean the average size of the cover parts 112, 113 in the first direction.

[0097] The average size of the cover parts 112, 113 in the first direction can be measured by scanning an image of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in an image scanned of one cover part, it can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction.

[0098] Note that the average size of the cover part in the first direction measured by the above method can have substantially the same size as the average size of the cover part in the first direction in the cross-section of the main body 110 in the first and third directions.

[0099] On the one hand, the main body 110 can include side margin portions 114 and 115 disposed between the main body 110 and both sides of the internal electrode layers 121, 122, 123, 124 in the third direction.

[0100] More specifically, the side margin portions 114 and 115 can include a first side margin portion located between the fifth surface 5 of the main body 110 and one side of the internal electrode layers 121, 122, 123, 124 in the third direction, and a second side margin portion 115 located at least partially between the sixth surface 6 of the main body 110 and one side of the internal electrode layers 121, 122, 123, 124 in the third direction.

[0101] However, without being particularly limited thereto, when the dummy electrodes 221b, 222b, 223b, 224b are in contact with a part of either the fifth surface 5 or the sixth surface 6 of the main body 110 as shown in FIG. 3, the region disposed between the main body 110 and both sides of the internal electrode layers 221, 222, 223, 224 in the third direction, excluding the said region, can be referred to as the side margin portion.

[0102] For example, the side margin portions 114 and 115 can mean the side margin regions between the fifth surface 5 and the sixth surface 6 of the main body and both sides of the internal electrodes 121a, 122a, 123a, 124a.

[0103] More specifically, the region between the first internal electrode 121a and the fifth surface 5 is referred to as the first side margin region of the first internal electrode, the region between the first internal electrode 121a and the sixth surface 6 is referred to as the second side margin region of the first internal electrode, the region between the second internal electrode 122a and the fifth surface 5 is referred to as the first side margin region of the second internal electrode, the region between the second internal electrode 122a and the sixth surface 6 is referred to as the second side margin region of the second internal electrode, the region between the third internal electrode 123a and the fifth surface 5 can be referred to as the first side margin region of the third internal electrode, the region between the third internal electrode 123a and the sixth surface 6 can be referred to as the second side margin region of the third internal electrode, the region between the fourth internal electrode 124a and the fifth surface 5 can be referred to as the first side margin region of the fourth internal electrode, and the region between the fourth internal electrode 124a and the sixth surface 6 can be referred to as the second side margin region of the fourth internal electrode.

[0104] The side margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0105] In one embodiment of the present invention, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrode layers 121, 122, 123, 124 and other purposes.

[0106] The external electrodes 131 and 132 are disposed on the main body 110 and can be connected to the internal electrode layers 121, 122, 123, and 124.

[0107] More specifically, the first external electrode 131 is disposed on the third surface 3 of the main body 110 and connected to the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b, and the fourth dummy electrode 124b, and the second external electrode 132 is disposed on the fourth surface 4 of the main body 110 and can be connected to the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b, and the third dummy electrode 123b.

[0108] Further, the external electrodes 131 and 132 may be arranged to extend to a part on the first surface 1 and the second surface 2 of the main body 110, or may be arranged to extend to a part on the fifth surface 5 and the sixth surface 6 of the main body 110. That is, the first external electrode 131 can be arranged on a part on the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and on the third surface 3 of the main body 110. The second external electrode 132 can be arranged on a part on the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and on the third surface 3 of the main body 110.

[0109] On the other hand, when the dummy electrodes 221b, 222b, 223b, 224 are arranged to be in contact with a part of either the fifth surface 5 or the sixth surface 6 of the main body as shown in FIG. 3, the external electrodes 231 and 232 can be arranged to cover them.

[0110] For example, when the first dummy electrode 221b is arranged to be in contact with a part of the fifth surface 5, the size in the second direction of the part of the second external electrode 232 in contact with the fifth surface 5 can be larger than the size in the second direction of the part of the first dummy electrode 221b in contact with the fifth surface 5. When the second dummy electrode 222b is arranged to be in contact with a part of the sixth surface 6, the size in the second direction of the part of the first external electrode 231 in contact with the sixth surface 6 can be larger than the size in the second direction of the part of the second dummy electrode 222b in contact with the sixth surface 6. When the third dummy electrode 223b is in contact with a part of the sixth surface 6, the size in the second direction of the part of the second external electrode 232 in contact with the sixth surface 6 can be larger than the above-mentioned size in the second direction of the part of the third dummy electrode 223b in contact with the sixth surface 6. When the fourth dummy electrode 224b is in contact with a part of the fifth surface 5, the size in the second direction of the part of the first external electrode 231 in contact with the fifth surface 5 can be larger than the size in the second direction of the part of the fourth dummy electrode 224b in contact with the fifth surface 5.

[0111] The first dummy electrode 221b, the second dummy electrode 222b, the third dummy electrode 223b, and the fourth dummy electrode 224b are arranged so as to be in contact with a part of either the fifth surface or the sixth surface. Even if they are exposed on either the fifth surface or the sixth surface, the first external electrode 231 and the second external electrode 232 are arranged to cover them, thereby preventing moisture penetration from the outside and improving moisture resistance reliability.

[0112] On the other hand, the external electrodes 131 and 132 may be formed of any material as long as it has electrical conductivity such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc., and it may further have a multilayer structure.

[0113] For example, the external electrodes 131 and 132 can include an electrode layer disposed on the main body 110 and a plating layer disposed on the electrode layer.

[0114] As a more specific example of the electrode layer, the electrode layer can include the first electrode layers 131a and 132a which are fired electrodes containing a first conductive metal and glass, or the second electrode layers 131b and 132b which are resin-based electrodes containing a second conductive metal and resin.

[0115] Here, the conductive metal contained in the first electrode layers 131a and 132a can be referred to as the first conductive metal, and the conductive metal contained in the second electrode layers 131b and 132b can be referred to as the second conductive metal. At this time, the first conductive metal and the second conductive metal may be the same as or different from each other. When including a plurality of conductive metals, only a part may contain the same conductive metal, but it is not particularly limited thereto.

[0116] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0117] Also, the electrode layer may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0118] As the conductive metal contained in the electrode layers 131a, 132a, 131b, and 132b, a material having excellent electrical conductivity can be used. For example, the conductive metal can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0119] In one embodiment of the present invention, the electrode layers 131a, 132a, 131b, and 132b can have a two-layer structure including a first electrode layer 131a, 132a and a second electrode layer 131b, 132b. Thus, the external electrodes 131 and 132 can include the first electrode layers 131a and 132a including a first conductive metal and glass and disposed on the first electrode layers 131a and 132a, and the second electrode layers 131b and 132b including a second conductive metal and a resin.

[0120] The first electrode layers 131a and 132a play a role of improving the bonding property with the main body 110 by including glass, and the second electrode layers 131b and 132b can play a role of improving the bending strength by including a resin.

[0121] The first conductive metal contained in the first electrode layers 131a and 132a is not particularly limited as long as it can be electrically connected to the internal electrodes 121a, 122a, 123a, and 124a for capacitance formation. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0122] The first electrode layers 131a and 132a can be formed by applying a conductive paste provided by adding glass frit to first conductive metal particles and then firing.

[0123] The second conductive metals contained in the second electrode layers 131b and 132b can serve to be electrically connected to the first electrode layers 131a and 132a.

[0124] The conductive metals contained in the second electrode layers 131b and 132b are not particularly limited as long as they can be electrically connected to the electrode layers 131a and 132a, and can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0125] The second conductive metals contained in the second electrode layers 131b and 132b can include one or more of spherical particles and flake-like particles. That is, the second conductive metals can consist only of flake-like particles, or only of spherical particles, or may be in a form in which flake-like particles and spherical particles are mixed. Here, the spherical particles can also include forms that are not completely spherical. For example, it can include forms in which the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-like particles mean particles having a flat and elongated form, and are not particularly limited. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be 1.95 or more. The lengths of the major axis and the minor axis of the above spherical particles and flake-like particles can be measured from an image obtained by scanning the cross-sections in the first direction and the second direction cut at the central part in the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0126] The resin contained in the second electrode layers 131b and 132b can serve to ensure bonding properties and absorb shock. The resin contained in the second electrode layers 131b and 132b has bonding properties and shock absorbency, and is not particularly limited as long as it can be mixed with the second conductive metal particles to produce a paste. For example, it can include an epoxy resin.

[0127] In addition, the second electrode layers 131b and 132b can include a plurality of second conductive metal particles, an intermetallic compound, and a resin. By including the intermetallic compound, the electrical connectivity with the first electrode layers 131a and 132a can be further improved. The intermetallic compound can play a role in connecting a plurality of metal particles to improve electrical connectivity and can also play a role in surrounding and connecting the plurality of metal particles to each other.

[0128] At this time, the intermetallic compound can include a metal having a melting point lower than the curing temperature of the resin. That is, since the intermetallic compound includes a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing processes, forms a part of the metal particles and the intermetallic compound, and comes to surround the metal particles. At this time, the intermetallic compound can preferably include a low melting point metal of 300°C or lower.

[0129] For example, it can include Sn having a melting point of 213 to 220°C. During the drying and curing processes, Sn melts, and the melted Sn wets high melting point metal particles such as Ag, Ni, or Cu by capillary action and reacts with a part of the Ag, Ni, or Cu metal particles to form 3 Sn, Ni 3 Sn 4 , Cu 6 Sn 5 , Cu 3 intermetallic compounds such as Sn. Ag, Ni, or Cu that did not participate in the reaction remain in the form of metal particles.

[0130] Therefore, the plurality of second conductive metal particles include one or more of Ag, Ni, and Cu, and the intermetallic compound can include one or more of 3 Sn, Ni 3 Sn 4 , Cu 6 Sn 5 and Cu 3 Sn.

[0131] The plating layers 131c and 132c can play a role in improving the mounting characteristics.

[0132] The types of the plating layers 131c and 132c are not particularly limited, and they may be single-layer plating layers 131c and 132c containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, or may be formed of a plurality of layers.

[0133] As a more specific example of the plating layers 131c and 132c, the plating layers 131c and 132c may be Ni plating layers or Sn plating layers, or may be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Also, the plating layers 131c and 132c may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0134] The size of the stacked electronic component 100 does not need to be particularly limited.

[0135] However, in order to simultaneously achieve miniaturization and high capacity, since the thicknesses of the dielectric layer and the internal electrodes need to be reduced and the number of stacked layers needs to be increased, the effects according to the present invention can be more remarkable in the stacked electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or less.

[0136] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the art without departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

[0137] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific one embodiment is not described in other embodiments, it can be understood as an explanation related to other embodiments as long as there is no explanation contrary to or conflicting with that matter in other embodiments.

[0138] The terms used in the present invention are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes plural expressions unless the context clearly indicates a different meaning.

Description of Reference Numerals

[0139] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Side margin part 121a, 122a, 123a, 124a: Internal electrode 121b, 122b, 123b, 124b: dummy electrode 131, 132: External electrode

Claims

1. a main body including a dielectric layer, and first, second, third and fourth internal electrode layers alternately disposed in a first direction with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposing each other in the third direction; a first external electrode and a second external electrode disposed on the third surface and the fourth surface, respectively; the first internal electrode layer includes a first internal electrode and a first dummy electrode arranged with a first separation portion sandwiched between the first internal electrode and the first dummy electrode, the second internal electrode layer includes a second internal electrode and a second dummy electrode arranged with a second separation portion sandwiched between the second internal electrode and the second dummy electrode, the third internal electrode layer includes a third internal electrode and a third dummy electrode arranged with a third separation portion sandwiched between the third internal electrode and the third dummy electrode, and the fourth internal electrode layer includes a fourth internal electrode and a fourth dummy electrode arranged with a fourth separation portion sandwiched between the fourth internal electrode and the fourth dummy electrode, the first external electrode is connected to the first internal electrode, the third internal electrode, the second dummy electrode, and the fourth dummy electrode, and the second external electrode is connected to the second internal electrode, the fourth internal electrode, the first dummy electrode, and the third dummy electrode; the first separated portion includes a region that overlaps with the third separated portion in the first direction and a region that does not overlap with the third separated portion, and the second separated portion includes a region that overlaps with the fourth separated portion in the first direction and a region that does not overlap with the fourth separated portion.

2. the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode each include a first side and a second side facing each other in the third direction, The multilayer electronic component according to claim 1 , wherein the first side and the second side of each of the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode are different in length from each other.

3. the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode each include a first side and a second side facing each other in the third direction, 2 . The multilayer electronic component according to claim 1 , wherein the first side and the second side of the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode are different in length from each other.

4. The multilayer electronic component according to claim 1 , wherein the first spaced portion, the second spaced portion, the third spaced portion, and the fourth spaced portion are substantially parallelogram-shaped.

5. 2 . The multilayer electronic component according to claim 1 , wherein the first separated portion, the second separated portion, the third separated portion, and the fourth separated portion have a substantially constant size in the second direction.

6. 2 . The multilayer electronic component according to claim 1 , wherein an average size in the second direction of each of the first isolated portion, the second isolated portion, the third isolated portion, and the fourth isolated portion is not less than 15 μm and not more than 200 μm.

7. 2 . The multilayer electronic component according to claim 1 , wherein the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode are disposed apart from the fifth surface and the sixth surface.

8. 2 . The multilayer electronic component according to claim 1 , wherein the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode are disposed apart from at least one of the fifth surface and the sixth surface.

9. 2. The multilayer electronic component according to claim 1, wherein the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode are arranged so as to be in contact with a part of either one of the fifth surface or the sixth surface.

10. 10. The multilayer electronic component according to claim 9, wherein the first dummy electrode and the fourth dummy electrode are arranged so as to be in contact with a portion of the fifth surface, and the second dummy electrode and the third dummy electrode are arranged so as to be in contact with a portion of the sixth surface.

11. the first external electrode and the second external electrode are arranged so as to be in contact with a part of the fifth surface and a part of the sixth surface, a size in the second direction of the first external electrode in contact with a portion of the fifth surface is larger than a size in the second direction of the fourth dummy electrode in contact with a portion of the fifth surface, a size in the second direction of the first external electrode in contact with a portion of the sixth surface is larger than a size in the second direction of the second dummy electrode in contact with a portion of the sixth surface, a size in the second direction of the second external electrode that is in contact with a portion of the fifth surface is larger than a size in the second direction of the first dummy electrode that is in contact with a portion of the fifth surface, a size in the second direction of the second external electrode in contact with a portion of the sixth surface is larger than a size in the second direction of the third dummy electrode in contact with a portion of the sixth surface; The multilayer electronic component according to claim 10.

12. 12. The multilayer electronic component according to claim 1, wherein, based on cross sections in the second direction and the third direction, the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode include interior angles that satisfy θ1, the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode include interior angles that satisfy θ2, and the θ1 and θ2 are 30° or more and 80° or less.

13. 12. The multilayer electronic component according to claim 1, wherein an average size in the second direction of each of the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode is larger than an average size in the second direction of each of the first dummy electrode, the second dummy electrode, the third dummy electrode, and the fourth dummy electrode.

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