System including a plurality of die heads with releasably coupled die chucks and method of using the same

Abstract

To provide a system including die heads capable of disposing dies with high throughput and accurately, and a method of using the system.SOLUTION: A system includes a plurality of die heads 511. Each die head in the plurality of die heads includes a device head 540 configured to be releasably coupled to a die chuck 560 to allow the die chuck to be at different positions within a die chuck mounting region 564 at different times. The system is used when moving die chucks to achieve a different pitch for die holding regions of the die chucks. A method includes: coupling a die chuck to a docking station; moving the docking station from a first location along a support structure to a second location along the support structure; and decoupling the first die chuck from the docking station.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a system including a plurality of die heads having releasably coupled die chucks and a method of using the system.

Background Art

[0002] Advanced packaging techniques require high throughput and accurate placement of dies. Hybrid bonding can be particularly difficult when the tolerance for misalignment is small. Single die transfer techniques can achieve high precision but have low throughput. Multi-die transfer techniques can achieve high throughput, but accurate placement of the dies can be difficult. There is a need to place dies with high throughput while still meeting the specifications for die placement.

Summary of the Invention

[0003] In one aspect, the system can include a plurality of die heads. Each die head within the plurality of die heads can include a device head configured to be releasably coupled to a die chuck such that the die chuck can be at different positions within a die chuck mounting area at different times relative to each other.

[0004] In one embodiment, each of the plurality of die heads further includes a mounting plate and the die chuck including a die holding area. The mounting plate is disposed between the device head and the die chuck, and the mounting plate defines the die chuck mounting area.

[0005] In certain embodiments, the mounting plate includes vacuum channels for holding the die chuck at the different positions relative to each other.

[0006] In a more specific implementation form, the die chuck has a distal side and a proximal side, the device head is closer to the proximal side than the distal side, the die chuck has a chucking vacuum receiving zone along the proximal side of the die chuck, and the chucking vacuum receiving zone is configured to enable the die chuck to be held by vacuum.

[0007] In another specific implementation form, the die chuck has a distal side and a proximal side, the device head is closer to the proximal side than the distal side, the die chuck includes a vacuum receiving zone along the proximal side of the die chuck, a die vacuum receiving zone along the distal side of the die chuck, and a vacuum connection within the die chuck and between the vacuum receiving zone and the die vacuum receiving zone.

[0008] In a more specific embodiment, the die chuck includes a modulation receiving zone along the proximal side of the die chuck, a die modulation zone along the distal side of the die chuck, and a modulation connection within the die chuck and between the modulation receiving zone and the die modulation zone.

[0009] In another specific implementation form, the device head has a device head mass, and the die chuck has a die chuck mass that is less than half of the device head mass.

[0010] In yet another specific implementation form, the center of the die holding region is offset from the center of the die chuck mounting region when the die chucks are at their respective different positions.

[0011] In a further specific implementation form, the die head is configured to enable movement of the die chuck while the die chuck is coupled to the device head.

[0012] In a further implementation form, the system further includes a docking station configured to move the die chuck relative to a corresponding device head, a first coupler configured to couple the die chuck to the corresponding device head and separate the die chuck from the corresponding device head, and a second coupler configured to couple the die chuck to the docking station and separate the die chuck from the docking station.

[0013] In a specific implementation form, the second coupler is configured such that the docking station does not contact the die holding region of the die chuck.

[0014] In another implementation form, the system further includes a controller configured to transmit a signal for moving a first die chuck of a first die head from a first position along the first device head of the first die head to a second position along the first device head, and the plurality of die heads includes the first die head.

[0015] In yet another implementation form, the system includes a bridge coupled to the plurality of die heads that are a plurality of bonding heads, a source substrate chuck, a base spaced apart from the bridge, a positioning stage coupled to the base, a plurality of pickup heads coupled to the positioning stage, and a docking station coupled to the positioning stage.

[0016] In a further embodiment, each of the plurality of die heads further includes one of a first mounting plate and a second mounting plate. The first mounting plate defines a first location of the die holding region of the die chuck on the device head, the second mounting plate defines a second location of the die holding region of the die chuck on the device head, and the second location is different from the first location.

[0017] In another aspect, the method can include coupling a first die chuck to the docking station by activating a first coupler associated with the docking station. The plurality of die heads includes the first die head, the first die head includes a first device head and the first die chuck, the first die chuck has a first die holding region, and the first die chuck is coupled to the first device head at a first position within a first die chuck mounting region. The method includes separating the first die chuck from the first device head by deactivating a second coupler associated with the first device head, moving the first docking station from a first location along a support structure to a second location along the support structure, and coupling the first die chuck to the first device head by activating the second coupler. After coupling the first die chuck to the first device head, the first die chuck is at a second position within the first die chuck mounting region, the second position being different from the first position. The method can include separating the first die chuck from the docking station by deactivating the first coupler.

[0018] In one implementation form, the method further includes coupling a second die chuck to the docking station by activating the first coupler or the third coupler associated with the third coupler docking station. The plurality of die heads includes a second die head, the second die head includes a second device head and the second die chuck, the second die chuck has a second die holding area, and the second die chuck is coupled to the second device head at a third position within the second die chuck mounting area. The method includes separating the second die chuck from the second device head by deactivating a fourth coupler associated with the second device head, moving the docking station from a third location along the support structure to the fourth location along the support structure, and activating the fourth coupler to couple the second die chuck to the second device head. After coupling the second die chuck to the second device head, the second die chuck is at a fourth position within the second die chuck mounting area, and the fourth position is different from the third position. The method further includes separating the second die chuck from the docking station by deactivating the third coupler or the first coupler. When the first die chuck is at the first position and the second die chuck is at the third position, the first die holding area and the second die holding area are at a first pitch. When the first die chuck is at the second position and the second die chuck is at the fourth position, the first die holding area and the second die holding area are at a second pitch, and the second pitch is different from the first pitch.

[0019] In a specific implementation form, the method further includes mounting a destination substrate on a destination substrate chuck coupled to a positioning stage. The destination substrate has a plurality of destination locations at a destination location pitch, the destination location pitch is closer to a second pitch than to a first pitch, and the docking station is coupled to the positioning stage.

[0020] In a more specific implementation form, the method further includes picking up a set of dies from a source substrate using a plurality of pickup heads, and transferring the set of dies from the plurality of pickup heads to the plurality of die heads. The plurality of die heads are a plurality of bonding heads, and the transfer is performed after coupling the first die chuck to the first device head and coupling the second die chuck to the second device head. The method further includes measuring an alignment error of the set of dies held by the plurality of bonding heads, adjusting the position of the first die of the set of dies with respect to the destination substrate on the destination substrate chuck based on the alignment error associated with the first die, and bonding the set of dies to the destination substrate using the plurality of bonding heads.

[0021] In another more specific implementation form, the method further includes receiving a destination location pitch including a first destination location pitch in a first direction and a second destination location pitch in a second direction, and positioning die holding regions for four die heads of a first cell such that they are integer multiples of the first destination location pitch and integer multiples of the second destination location pitch. The first cell includes the first die head and the second die head.

[0022] In an even more specific implementation form, the method further includes positioning a die holding region for four die heads of a second cell having the same pitch as the die holding region for the four die heads of the first cell.

[0023] In another embodiment, moving the docking station is performed during a pair of transfer operations, the plurality of die heads include a first die head, the first device head is coupled to the support structure, and does not move when the first die chuck is moved.

[0024] In a further aspect, the method can include separating a first die chuck from a first device head. The plurality of die heads includes the first die head, and the first die head includes a first device head and a first die chuck. Before separation, the first die chuck has a first die holding region at a first position with respect to the first device head. The method further includes separating a second die chuck from a second device head. The plurality of die heads includes the second die head, and the second die head includes a second device head and a second die chuck. Before separation, the second die chuck has a second die holding region at a second position with respect to the second device head. The method further includes coupling a third die chuck to the first device head. The third die chuck has a third die holding region at a third position with respect to the first device head. The method can include coupling a fourth die chuck to the second device head. The fourth die chuck has a fourth die holding region at a fourth position with respect to the second device head. Before the separation of the first die chuck and the separation of the second die chuck, the first die holding region and the second die holding region are at a first pitch, and after the coupling of the third die chuck and the coupling of the fourth die chuck, the third die holding region and the fourth die holding region are at a second pitch different from the first pitch.

[0025] In one implementation, the method further includes bonding a first die to a first destination substrate using the first die chuck, bonding a second die to the first destination substrate using the second die chuck, bonding a third die to a second destination substrate using the third die chuck, and bonding a fourth die to the second destination substrate using the fourth die chuck. Before the separation of the first die chuck and the separation of the second die chuck, the bonding of the first die and the bonding of the second die are performed, and after the coupling of the third die chuck and the coupling of the fourth die chuck, the bonding of the third die and the bonding of the fourth die are performed.

Brief Description of the Drawings

[0026] The embodiments are illustrated by way of example and are not limited to the accompanying drawings.

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DETAILED DESCRIPTION OF THE INVENTION

[0027] The following description, in combination with the drawings, is provided to assist in understanding the teachings disclosed herein. The following discussion focuses on particular implementations and implementations of the teachings. This focus is provided to assist in explaining the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The materials, methods, and examples are illustrative only and not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing acts are conventional and can be found in textbooks and other sources in the art.

[0029] The system can include a plurality of die heads (such as bonding heads). Each die head within the plurality of die heads can include a device head that is releasably coupled to a die chuck and configured to enable the die chuck to be at different positions within the die chuck mounting area at different times.

[0030] The change in die head pitch for an array of die heads can be done by repositioning the die chuck of the die head rather than repositioning the die head itself. The die chuck has a substantially lower mass compared to the device head. The die chuck can be moved more easily and accurately compared to moving the entire die head. A coupling system for holding the die chuck can be more robust because the die chuck has a lower mass compared to the die head. When using a docking station to move the die chuck, tubes, cables, or other mechanical features within the device head or the die head support structure for the device head, such as a bridge, carriage, or base, are not required. Such a configuration can simplify the design of the die head and its corresponding support structure and can reduce the likelihood of particle generation when changing the pitch of the die holding area. The pitch of the die holding area can be an integer multiple of the destination pitch. The pitch of the destination can be changed between 0.5 mm and 100 mm depending on the purpose of assembly.

[0031] The system and method of using the device can be better understood with the following description in conjunction with the corresponding figures. Although much of the description is directed to repositioning the bonding head, the concepts described herein can also be used to reposition the pick-up head.

[0032] Referring to FIGS. 1-4, in one implementation, the system 100 can include a device 110 that includes a bridge 120, components coupled to the bridge 120 (shown in FIG. 3), a base 140, components coupled to the base 140 (shown in FIGS. 2-4), a controller 160, and a memory 162. The controller 160 can be coupled to the bridge 120, the base 140, one or more components coupled to the bridge 120 or the base 140, or a combination thereof. Each of the bridge 120 and the base 140 can be a support structure.

[0033] FIG. 2 includes a top view of the base 140 for showing a general position of the carriage 146, a region 244 corresponding to a region occupied by an array of die transfer seats 144 and optical components 150 (shown in FIG. 3), a destination substrate chuck 148, and a docking station 272. FIG. 3 includes a cross-sectional view taken along the cut line 3-3 of FIG. 2, and FIG. 4 includes a cross-sectional view taken along the cut line 4-4 of FIG. 2.

[0034] In FIGS. 3 and 4, the bridge 120, the base 140, and components physically coupled to the bridge 120 or the base 140 can be arranged along the X direction, the Y direction, the Z direction, or combinations thereof. For FIGS. 3, 4, and other cross-sectional or side views in the figures, the X direction is between the left and right sides of the figure, the Z direction is between the top and bottom of the figure, and the Y direction is into and out of the plane of the drawing. Unless otherwise specified, rotation occurs along the X-Y plane defined by the X and Y directions.

[0035] FIGS. 3 and 4 include components coupled to the bridge 120 or the base 140. Components coupled to the bridge 120 can include a source substrate chuck 122, an array of bonding heads 124, an alignment reference 128, and optical components 130. Components coupled to the base 140 can include an array of die transfer seats 144, a carriage 146, a destination substrate chuck 148, optical components 150, and a docking station 272. Components coupled to the bridge 120 are described before components coupled to the base 140.

[0036] FIG. 3 includes a source substrate chuck 122 which can be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The source substrate chuck 122 can be coupled to the bridge 120 by being directly attached to the bridge 120, or can be coupled to the bridge 120 via a carriage (not shown). The source substrate chuck 122 has a source substrate holding surface facing the base 140, or components coupled to the base 140.

[0037] FIG. 3 shows an array of bonding heads 124. The array of bonding heads 124 can be configured as a vector (a row or column of bonding heads), or as a matrix (at least two rows and at least two columns of bonding heads), or as a staggered array. The number of bonding heads within the array of bonding heads 124 can vary between rows, between columns, or between rows and columns. Some array configurations can be 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or another rectangular shape, where the first number corresponds to the number of bonding heads along a row or column, and the second number corresponds to the number of bonding heads along the other row or column. The array of bonding heads 124 can be a particular implementation of a plurality of bonding heads. In another implementation, a plurality of bonding heads 124 need not be organized as an array.

[0038] The die chucks can be releasably coupled to their corresponding device heads. Different pitches for the die holding areas can be achieved by moving the die chucks to different positions relative to each other within their corresponding die chuck mounting areas. In another implementation, different pitches for the die holding areas can be achieved by removing a particular set of die chucks from the device heads and coupling a different set of die chucks to those device heads.

[0039] Each die chuck can be a vacuum chuck, a pin chuck, a groove chuck, an electrostatic chuck, an electromagnetic chuck, etc. Alternatively, the die chuck can be a non-contact chuck, for example, a Bernoulli chuck, or a die chuck that contacts the die on its side rather than on the device side or the back side of the die. The device side is the side of the die on which the electrical components are formed, the back side of the die is the side opposite to the device side, and the side surface is disposed between the device and the back side of the die. When the die includes through-silicon vias (TSVs), the TSVs can be exposed along the back side of the die. The non-contact chuck can help reduce the likelihood that the activation surface for bonding contacts the bonding head. In one implementation, the device side, the back side, or both the device side and the back side can have an activation surface. The side surface may not be activated for bonding.

[0040] When the die is transferred from an array of bonding heads 124 to a destination substrate (not shown in FIGS. 1-4) coupled to the destination substrate chuck 148, the die chuck can be configured to have a limited range of motion with respect to their corresponding device heads to provide better positioning. Each bonding head can include a positioning stage that independently moves each bonding head in one or more of the X direction, Y direction, Z direction, tip, tilt, and rotation in the Z direction. Details of the bonding head will be described later in this specification.

[0041] The alignment reference 128 can include marks or other features that can assist in the proper positioning of the carriage 146 with respect to the bridge 120 or components coupled to the bridge 120. The alignment reference 128 and the optical component 150 can be used during the alignment operation. Further details regarding the optical component 150 will be described below with respect to the components coupled to the base 140.

[0042] The optical component 130 can be used to determine the pitch of the array of die transfer seats 144. The optical component 130 can also be used to confirm the presence or identification of a die (e.g., a die of a part number or type) coupled to a die transfer seat within the array of die transfer seats 144 or to a destination substrate coupled to the destination substrate chuck 148. If necessary or desired, two or more optical components 130 can be coupled to the bridge 120. The optical component 130 can also be used to determine the position of the destination location of the destination substrate coupled to the destination substrate chuck 148.

[0043] The carriage 146 can be a positioning stage and can provide translational movement in the X, Y, or Z directions along the base 140, or rotational movement about the Z axis, e.g., rotation about the Z axis, and rotational movement along a plane along the X and Y directions.

[0044] The array of die transfer seats 144 is coupled to the carriage 146. The array of die transfer seats 144 has a device head and a die chuck. The body is coupled to the carriage 146. The bridge 120 or a component coupled to the bridge 120 is closer to the die chuck than to the device head of the die transfer seat within the array of die transfer seats 144. In one implementation, any one or more of the die transfer seats can have a die chuck that can be of any type described with respect to the array of bonding heads 124. The array of die transfer seats 144 can have a die chuck that is releasably or non-releasably coupled to the corresponding device head. The die transfer seat and the bonding head can be of the same type or different types. In one embodiment, the die transfer seats within the array of die transfer seats 144 can be pickup heads.

[0045] The array of die transfer seats 144 can be coupled to the carriage 146 and can be configured as a vector (a row or column of die transfer seats), or as a matrix (at least two rows and at least two columns of die transfer seats), or as a staggered array. With respect to the matrix, the number of die transfer seats within the array of die transfer seats 144 can vary between rows, between columns, or between rows and columns. Some array configurations can be 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or another rectangular shape, where the first number corresponds to the number of die transfer seats along a row or column, and the second number corresponds to the number of die transfer seats along the other row or column. The array of die transfer seats 144 can be a particular implementation of a plurality of die transfer seats. In another implementation, a plurality of die transfer seats 144 need not be organized as an array.

[0046] Theoretically, all the dice from the entire source wafer can be transferred at once. From the top view, in such a configuration, the array of die transfer seats 144 has fewer die transfer seats along the rows closer to the top and bottom of the array compared to the row or pair of rows closest to the center of the array, and the array of die transfer seats 144 has fewer die transfer seats along the columns closer to the left and right sides of the array compared to the column or pair of columns closest to the center of the array. After reading this specification, one of ordinary skill in the art will be able to determine the array configuration of the array of die transfer seats 144 that meets the needs or desires of a particular application.

[0047] The array of die transfer seats 144 can be configured to have an adjustable pitch that can be reversibly changed between a source alignment pitch and a bonding head alignment pitch. The array of die transfer seats 144 or carriage 146 can include motors, electrical components, etc. that can be operated to move the die transfer seats to achieve a desired pitch. In one implementation, the array of die transfer seats 144 can be at the source alignment pitch when picking up a set of dies coupled to the source substrate chuck 122, and can be at the bonding head alignment pitch when transferring the set of dies to the array of bonding heads 124. After the dies are transferred to the array of bonding heads 124, the pitch of the array of die transfer seats 144 can be returned to the source alignment pitch before picking up more dies.

[0048] In one implementation, the die transfer seats within the array of die transfer seats 144 may or may not be pickup heads. The die transfer seats within the array of die transfer seats 144 may or may not be able to extend in the Z direction (towards the bridge 120 or components coupled to the bridge 120). Dies can be loaded onto the die transfer seats within the array of die transfer seats 144 by a die loading machine. Alternatively, the dies can be manually loaded by a human operator.

[0049] The optical component 150 is coupled to the carriage 146 and can be used during the alignment operation. The optical component 150 can be part of the registration and registration hardware used when registering the carriage 146 to the alignment reference 128, identifying the dies that will be coupled to the source substrate chuck 122 or held by the array of bonding heads 124, positioning the bonding heads 124, measuring misalignment errors of the dies that will be held by the array of bonding heads 124, etc. The optical component 150 can include mirrors, prisms, gratings, light sources, optical fiber cables, apertures, tubes, cameras, or lenses optically coupled to combinations thereof.

[0050] The destination substrate chuck 148 can be coupled to the carriage 146. In one implementation, the destination substrate chuck 148 is attached to the carriage 146. The destination substrate chuck 148 can hold a destination substrate including a destination die having a destination location. The destination substrate chuck 148 can be a vacuum chuck, a pin type chuck, a groove type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The destination substrate chuck 148 can be heated, cooled, or both heated and cooled. The destination substrate chuck 148 can include a heater (not shown). In the same or different implementations, a fluid (not shown) can flow through the destination substrate chuck 148 to raise or lower the temperature of the destination substrate chuck 148.

[0051] FIG. 4 includes a side view of the docking station 272. The docking station 272 can be coupled to the carriage 146 and can be used to move the die chuck within the array of bonding heads 124. The carriage 146 can translate the docking station 272 in the X direction, the Y direction, rotate along the X-Y plane, or a combination thereof. The system 100 can be configured to allow the die chuck to move away from or closer to the bridge 120 before the docking station 272 is translated in the X direction, the Y direction, rotated, or a combination thereof. The system 100 may include one or more docking stations. Further details regarding the docking station 272 will be described in more detail later in this specification.

[0052] In an alternative embodiment, the docking station 272 includes one or more of the hand, arm, and robot. The docking station 272 can also include an end effector capable of holding the die chuck 560. The end effector can be adapted to hold the die chuck 560 without contacting the die holding area 564. The end effector may use a vacuum, pins, fingers, magnets, etc., which may or may not be coupled to the die chuck 560, such as an electromagnet or a gripper. In an alternative embodiment, the docking station 272 is not attached to the carriage. In an alternative implementation, the docking station 272 can be designed to relocate multiple die chucks at once. In an alternative implementation, the docking station 272 can remove the first die chuck 560 from the mounting plate 550 and transfer the second die chuck 560 from the die chuck library to the mounting plate 550. The docking station 272 can include a pneumatic loading mechanism, an electrostatic mechanism, an electromagnetic loading mechanism, or a combination thereof.

[0053] Referring to FIGS. 1-4, system 100 can operate using a controller 160 that communicates with a bridge 120, any component coupled to the bridge 120, a base 140, any component coupled to the base 140, or any combination thereof. The controller 160 can operate using a computer-readable program optionally stored in a memory 162. The controller 160 can include a processor (e.g., a central processing unit of a microprocessor or a microcontroller), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc. The controller 160 can be within the device 110. In another implementation (not shown), the controller 160 can be at least part of an external computer of the device 110, and such a computer is coupled bi-directionally to the system 100. The memory 162 can include a non-transitory computer-readable medium that includes instructions associated with a transfer operation or for performing operations between transfer operations. In another implementation, the bridge 120, a component coupled to the bridge 120, the base 140, or a component coupled to the base 140 can include a local controller that provides part of the functionality otherwise provided by the controller 160. The controller 160 can include a plurality of processors that cooperate and communicate with each other.

[0054] The terms "transfer operation" and "transfer cycle" are addressed to assist in understanding the implementations described herein. A transfer operation begins when loading the first set of dies for the destination substrate onto the array of die transfer seats 144 and ends with the last set of dies coupled to the destination location of the destination substrate on the destination substrate chuck 148. A transfer cycle begins when loading a set of dies for the destination substrate onto the array of die transfer seats 144 and ends when the same specific set of dies is coupled to the transfer destination location of the destination substrate coupled to the destination substrate chuck 148. A transfer operation can include one or more transfer cycles.

[0055] The die head can be designed such that the die chucks can be repositioned relative to their corresponding device heads or by exchanging sets of die chucks to achieve different pitches for the die holding areas for the die head. FIGS. 5-21 include designs for the die head and the docking station 272. Much of the following description relates to the array of bonding heads 124. In the same or alternative implementations, the design can also be used with respect to the array of die transfer seats 144.

[0056] FIG. 5 includes a side view of a die head 511 that can be a bonding head within the array of bonding heads 124. The die head 511 includes a device head 540, a mounting plate 550, and a die chuck 560. The device head 540 holds the mounting plate 550 and controls the movement of everything coupled to the mounting plate 550, including the mounting plate 550, the die chuck 560, and any die or device coupled to the die chuck 550. The device head 540 also provides connections such as pneumatic connections, optical connections, electrical connections, or combinations thereof to the mounting plate, the die chuck, and any components attached thereto. The device head 540 and the mounting plate 550 can each have a center located along a centerline 526. The device head 540 is coupled to a bridge 120 (not shown in FIG. 5) and can fluidly connect the mounting plate 550 and the die chuck 560 to provide vacuum, pressurized fluid, or both to the mounting plate 550, the die chuck 560, or both. Each of the mounting plate 550 and the die chuck 560 can include a metal, a metal alloy, glass, a ceramic material, a polymer compound, etc. The mounting plate 550 and the die chuck 560 can be made of the same material or different materials.

[0057] The mounting plate 550 is disposed between the device head 540 and the die chuck 560. The mounting plate 550 defines a die chuck mounting area to which the die chuck 560 can be coupled. The mounting plate 550 can be coupled to the device head 540 by vacuum, electrostatic charge, electromagnetic force, mechanical coupling, etc. Increasing the area of the die chuck mounting area provides greater flexibility when positioning the die chuck 560. In FIG. 5, the mounting plate 550 has a proximal side along the device head 540 and a distal side along the die chuck 560. The size of the area occupied by the die chuck mounting area can be limited by the size of the device head 540. The die chuck mounting area can be at least 80%, at least 90%, or at least 95% of the area along the distal side of the mounting plate 550. The mounting plate 550 may or may not have the same lateral dimensions (in the X direction, Y direction, or both) as the device head 540. In one implementation, the mounting plate 550 can have lateral dimensions in the X and Y directions, each of which is within 5% of the corresponding lateral dimension of the device head 540. In an alternative implementation, the mounting plate 550 may be an integral part of the device head 540 and is the surface of the device head 540 that interfaces with the die chuck 560. In alternative embodiments, different mounting plates 550 that provide different ranges of mounting locations for the die chuck are available and can be switched.

[0058] FIG. 6 includes a bottom view of the mounting plate 550 and includes channels 652, 654, and 656 that extend through the thickness of the mounting plate 550. Channel 652 allows vacuum to hold the die chuck 560 in place, channel 654 allows vacuum to reach the die to hold the die chuck 560, and channel 656 allows pressurized fluid to reach different locations within the die holding area of the die chuck 560. The significance of the locations of channels 652, 654, and 656 will be better understood after addressing the design of the die chuck 560.

[0059] The die chuck 560 includes a main body 562 and a die holding region 564. The die chuck 560 has a proximal side along the mounting plate 550 and a distal side opposite the proximal side of the die chuck 560. The center of the die holding region 564 may or may not be located directly below the centers of the device head 540 and the mounting plate 550 (when the die chuck 560 is part of an array of bonding heads 124), and may or may not be located directly above the centers of the device head 540 and the mounting plate 550 (when the die chuck 560 is part of an array of die transfer seats 144). Being located directly above and being located directly below refer to components that exist along a vertical line including or parallel to the center line 526. Components that are located directly above or below each other may or may not be in contact with each other.

[0060] FIG. 7 includes a top view of the die chuck 560 along the cut line 7-7 of FIG. 5. The die chuck 560 can include a chuck vacuum receiving zone 762, a die vacuum receiving zone 764, a die modulation receiving zone 766, and an auxiliary device zone 768. The lands can include portions of the main body 562 that are between the zones 762, 764, 766, and 768 and between the outer peripheral edge of the main body 562 and the zone 762. Each of the zones 762, 764, 766, and 768 may or may not include lands or pins within such zones. Any or all of the lands and, if present, the pins can contact the mounting plate 550 when coupled to the mounting plate 550. Each of the zones 762, 764, and 766 is a recess within the main body 562 of the die chuck 560. Each of the zones 764 and 766 can have a relatively large rectangular portion and a relatively narrow and long portion. The importance of these portions is explained when dealing with exhausting or pressurizing the zones when the die chuck is in different positions. The auxiliary device zone 768 is dealt with later in this specification.

[0061] FIG. 8 includes a bottom view of the die chuck 560 as seen by the base 140, or components coupled to the base 140. The die holding region 564 extends from the body 562 of the die chuck 560. The die holding region 564 includes a die vacuum zone 864 and a die modulation zone 866 that are recesses within the die holding region 564. Lands are between zone 864 and zone 866 and between the periphery of the die holding region 564 and zone 864. Each of zones 864 and 866 may or may not include lands or pins within such zones. When a die is coupled to the die holding region, any or all of the lands and, if present, pins can make contact. In subsequent figures, for simplicity of understanding the design and use of the system 100, the lands within the die holding region 564 are not shown. In another implementation, the die holding region 564 can be a Bernoulli chuck or another non-contact chuck.

[0062] FIG. 8 includes FIG. A along cutting line A-A through channel 876 as shown in FIGS. 7 and 8, showing how channel 876 connects die modulation receiving zone 766 to die modulation zone 866. FIG. 8 includes, in an alternative embodiment, FIG. Alt A along cutting line A-A through channel 876 as shown in FIGS. 7 and 8, showing how channel 876 connects die modulation receiving zone 766 to die modulation zone 866 within die chuck 560. FIG. 8 includes FIG. B along cutting line B-B through channel 874 as shown in FIGS. 7 and 8, showing how channel 874 connects die vacuum zone 864 to vacuum receiving zone 764. The following description is based on the die holding region 564 as shown in the figures.

[0063] FIG. 9 is a bottom view of the die chuck 560 along the distal side of the die chuck 560 and further includes features (shown in dashed lines) along the proximal side of the die chuck 560. The channel 874 is disposed between and fluidly couples the die vacuum zone 864 and the vacuum receiving zone 764. The channel 876 is disposed between and fluidly couples the die modulation zone 866 and the die modulation receiving zone 766. In certain implementations, the channels 874 and 876 may be respectively directly below the narrow and long portions of the zones 764 and 766.

[0064] FIG. 10 includes a bottom view of the die head 511 including the mounting plate 550 and the die chuck 560. A portion of the device head 540 may or may not be visible along the periphery of the mounting plate 550. Such a portion of the device head 540 is not shown in FIG. 10 to simplify the understanding of the relationship between the mounting plate 550 and the die chuck 560.

[0065] The mounting plate 550 includes channels 652, 654, and 656. The channels 652, 654, and 656 are not visible from the bottom view but are shown in solid lines to better illustrate their positional relationships with respect to the zones 762, 764, and 766, respectively. The die chuck 560 includes a body 562 and a die holding region 564. The body 562 includes zones 762, 764, 766, and 768 disposed along the proximal side of the die chuck 560. The zones 762, 764, 766, and 768 are not visible from the bottom view and are shown in dashed lines. The die holding region 564 may be on the distal side of the die chuck 560.

[0066] Zone 762 of the die chuck 560 is in fluid communication with channel 652 of the mounting plate 550. A vacuum line (not shown) can be routed through the device head 540 and coupled to channel 652. When the vacuum line is evacuated by a vacuum source, channel 652 and zone 762 are evacuated, and the die chuck 560 can be held in place relative to the mounting plate 550. Zone 764 of the die chuck is in fluid communication with channel 654 of the mounting plate 550. Another vacuum line (not shown) can be routed through the device head 540 and coupled to channel 654. When the vacuum line is evacuated by a vacuum source, channel 654, zone 764, channel 874, and the die vacuum zone 864 are evacuated, and the die can be held in the die holding region 564. Zone 766 of the die chuck 560 is in fluid communication with channel 656 of the mounting plate 550. A pressure line (not shown) can be routed through the device head 540 and coupled to channel 656. When the pressure line is pressurized with fluid, channel 656, zone 766, channel 876, and the die modulation zone 866 are pressurized, enabling the die held by the die holding region 562 to curve away from the die holding region 564. The fluid can be a liquid or a gas. The gas can be air such as clean dry air (CDA), or a relatively inert gas such as N 2 , CO 2 , or a noble gas such as Ar or He.

[0067] Figures 10 to 13 show different positions of the die chuck 560 relative to the mounting plate 550. The die chuck 560 can be at a position closest to the lower right corner of the mounting plate 550 in Figure 10. The die chuck 560 can be at a position closest to the upper right corner of the mounting plate 550 in Figure 11. The die chuck 560 can be at a position closest to the lower left corner of the mounting plate 550 in Figure 12. The die chuck 560 can be at a position closest to the upper left corner of the mounting plate 550 in Figure 13. Figures 10 to 13 may or may not represent the entire range of positions of the die chuck 560. In Figures 10 to 13, the channel 652 remains in fluid communication with the zone 762, the channel 654 remains in fluid communication with the zone 764, and the channel 656 remains in fluid communication with the zone 766. The range of the X and Y positions of the die chuck 560 can be the X and Y dimensions of any relatively large rectangular portion (excluding relatively narrow and long portions) of the zones 762, 764, and 766 or in the vicinity thereof. Referring to Figures 5 and 10 to 13, the center of the die holding region 564 may or may not be along the center line 526. In the specific illustrated embodiment, the center of the die holding region 564 is not located along the center line 526 for the entire range of positions of the die chuck 560 relative to the mounting plate 550.

[0068] Referring to FIGS. 5 and 7, the auxiliary device zone 768 can be one of several different forms. The mass of the die chuck 560 can be less than half of the mass of the device head 540. In another implementation, the die chuck 560 can be up to 40%, 30%, or 20% of the mass of the device head 540. As the mass of the die chuck 560 decreases, the force required to hold the die chuck 560 in a predetermined position relative to the mounting plate 550 decreases. Similar to zones 762, 764, and 766, the zone 768 can be recessed within the body 562 of the die chuck 560 to further reduce the mass of the die chuck 560. The zone 768 may or may not be coupled to any one or more of zones 762, 764, and 766 along the proximal side of the die chuck 560. In a particular implementation, the zone 768 can be fluidly coupled to the zone 762 to allow more area to be evacuated when the zone 768 holds the die chuck 560 to the mounting plate 550. In FIG. 7, a portion of the land between the zones 762 and 768 may not be present to achieve such a fluid connection. In another implementation, the zone 768 may not be recessed and can be a portion of the land between the zones 766 and 764. This implementation may be easier to manufacture compared to the zone 768 recessed within the body 562. After reading this specification, one of ordinary skill in the art can select the design of the auxiliary device zone 768 to meet the requirements or desires of a particular application.

[0069] The docking station 272 can be used to move the die chuck 560 to different positions relative to the mounting plate 550. FIGS. 14 and 15 include a top view and a side view of the docking station 272. The chucking vacuum receiving zone 1462 can be a recess within the docking station 272 along the distal side of the docking station 272. The channel 1452 is fluidly coupled to the zone 1462. A vacuum line (not shown) can be routed through the carriage 146 and coupled to the channel 1452. As shown in FIG. 14, the region 1462 is surrounded by lands. The die chuck can contact the lands when the die chuck is held by the docking station 272. The zone 1462 may or may not include lands or pins within such zone. Any or all of the lands, and, if present, the pins, can contact the mounting plate 550 when coupled to the mounting plate 550.

[0070] The recess 1424 allows the docking station 272 to hold a die chuck, such as the die chuck 560, without contacting the die holding region of the die chuck, such as the die holding region 564 of the die chuck 560. The recess 1424 may have a depth such that it is not required or such that the die holding region contacts the die chuck. For a die chuck having its distal side along a single plane, the recess 1424 may not be present and the zone 1462 may be extended to occupy at least a portion of the region of the docking station 272 that would otherwise be occupied by the recess 1424, or may not be extended.

[0071] Each of the device head 540 and the docking station 272 can be coupled to a die chuck, such as die chuck 560, using a vacuum-based coupler. Referring to FIGS. 13-15, a vacuum source can be coupled to zone 762 of die chuck 560 and zone 1452 of docking station 272. System 100 can have a common vacuum source for zones 762 and 1452, or different vacuum sources for zones 762 and 1462. Vacuum lines can be routed through bridge 120 and device head 540 to channel 652 that is fluidly coupled to zone 762 of die chuck 524. Another vacuum line can be routed through base 140 and carriage 146 to channel 1452 that is fluidly coupled to zone 1462 of docking station 272.

[0072] Each of the vacuum lines can include one or more components along the vacuum line. A pressure regulator, a pressure control valve, or both may or may not be used. Each of the pressure regulator or the pressure control valve can limit how much vacuum can be drawn within the zone coupled to the corresponding vacuum line. The pressure regulator, the pressure control valve, or both can be controlled manually by controller 160, a local controller, or a human operator.

[0073] Each vacuum line within system 100 can have a coupling control valve that can be disposed between the corresponding zone and the vacuum source. The coupling control valve can be controlled by controller 160 or a local controller. The coupling control valve can be actuated by a signal from controller 160 or a local controller such that the corresponding vacuum source is fluidly connected to the corresponding zone. The coupling control valve can be deactivated by a signal from controller 160 or a local controller such that the vacuum source is not fluidly connected to the corresponding zone.

[0074] In certain embodiments, the coupling control valve can be a three-way valve that can also be coupled to an atmosphere or a pressurized gas source via a gas line. When a pressurized gas source is used within the system 100 (as opposed to the atmosphere), a pressure regulator, a pressure control valve, or both may or may not be used. Each of the pressure regulator and the pressure control valve can limit the pressure of the gas supplied to the coupling control valve. When the coupling control valve is deactivated with respect to the vacuum source or after that time, the control value can be such that the atmosphere or the pressurized gas can be fluidly connected to the zone to refill the zone so that the die chuck 560 can be removed. In another embodiment, another coupling control valve can be coupled between the zone and the atmosphere or the pressurized gas. The other coupling control valve can be activated when the zone is refilled and deactivated before the coupling control valve coupled to the vacuum source is activated. The other coupling control valve for refilling can be coupled to the controller 160 or a local controller and can operate in a manner similar to the coupling control valve coupled to the vacuum source.

[0075] In further implementations, the vacuum coupling to the device head 540 and the die chuck 560 can be replaced with an electrostatic coupling, an electromagnetic coupling, or a mechanical coupling. After reading this specification, one of ordinary skill in the art can design a die head for a particular type of coupling that meets the needs or desires of a particular application.

[0076] In the case of an electrostatic coupler, the electrical circuit can be within the device head 540 or the mounting plate 550. The electrical circuit can be activated when the electrical circuit is turned on and stopped when the electrical circuit is turned off. In another implementation, the electromagnetic material may be within the die chuck 560 and the electrical circuit may be within the device head 540 or the mounting plate 550. The magnetic force from the electromagnetic material within the die chuck 560 is sufficient to hold the die chuck 560 in place. Thus, coupling can be performed by activating the electrical circuit and separation can be performed by deactivating the electrical circuit controlled by the controller 160 or the local controller. The electrostatic or electromagnetic coupler for the docking station 272 can be configured and operate substantially as described for the electrostatic or electromagnetic coupler for the die head 511.

[0077] In the case of a mechanical coupler, hooks, clips, a pair of protrusions, etc. can be used to hold the device head 540 or the mounting plate 550 and the die chuck 560 in place relative to each other. The mechanical coupler can be manually set for the device head 540 or activated by an electrical circuit within the mounting plate 550. For the electrical circuit, coupling can be performed by activating the electrical circuit and separation can be performed by deactivating the electrical circuit, and such activation / deactivation can be controlled by the controller 160 or the local controller. The mechanical coupler for the docking station 272 can be substantially configured and operate as described for the mechanical coupler for the die head 511.

[0078] Figures 16 and 17 include bottom views of portions of an array of bonding heads 124 including the bonding head 511 and other bonding heads 512, 521, 522, 551, 552, 561, 563, 571, 572, 581, and 582. The structures of the other heads 512, 521, 522, 551, 552, 561, 563, 571, 572, 581, and 582 are substantially the same as that of the bonding head 511.

[0079] The array 124 of bonding heads can be organized into groups such as cells. Cell 1610 (Figs. 16 and 17) is composed of bonding heads 511, 512, 521, and 522. Cell 1620 (Fig. 16) is composed of bonding heads 571, 572, 581, and 582. Cell 1710 (Fig. 17) consists of bonding heads 551, 552, 561, and 563. Cells 1610, 1620, and 1710 are indicated by dashed lines. Cells 1610, 1620, and 1710 may or may not be identical to each other. The array of bonding heads 124 can include more or fewer cells. Cell 1610 can be the cell immediately adjacent to cell 1620 (in the Y direction) and the cell immediately to the left of cell 1710 (in the X direction).

[0080] The bonding head 511 in cell 1610, the bonding head 571 in cell 1620, and the bonding head 551 in cell 1710 can be identical to each other. The bonding head 512 in cell 1610, the bonding head 572 in cell 1620, and the bonding head 552 in cell 1710 can be identical to each other. The bonding head 521 in cell 1610, the bonding head 581 in cell 1620, and the bonding head 561 in cell 1710 can be identical to each other. The bonding head 522 in cell 1610, the bonding head 582 in cell 1620, and the bonding head 563 in cell 1710 can be identical to each other.

[0081] The designs of bonding heads 512 and 521 can be mirror images of bonding head 511. The design of bonding head 522 can be a mirror image of either or both of bonding heads 512 and 521. The bonding heads 552 and 561 can be mirror images of bonding head 551. The bonding head 563 can be a mirror image of either or both of bonding heads 552 and 561. The bonding heads 572 and 581 can be mirror images of bonding head 571. The bonding head 582 can be a mirror image of either or both of bonding heads 572 and 581.

[0082] Bonding heads 512, 521, 522, 551, 552, 561, 563, 571, 572, 581, and 582 can have channels 652, 654, and 656 and zones 762, 764, 766, and 768 as described above with respect to bonding head 511. Exhaust and pressurization of channels 652, 654, and 656 and zones 762, 764, 766 for bonding heads 512, 521, 522, 551, 552, 561, 563, 571, 572, 581, and 582 may or may not be the same as those described above with respect to bonding head 511.

[0083] The pitch of the destination locations on the destination substrate can include an X-direction pitch and a Y-direction pitch. The X-direction pitch and the Y-direction pitch of the die holding region 564 within cell 1610 can be the same as or within the allowable range of the X-direction pitch and the Y-direction pitch of the die holding region 564 within cells 1620 and 1710. As will be described in the method described later in this specification, the die chuck 560 can be positioned such that the pitch of the die holding regions 564 having any combination of cells 1610, 1620, 1710, or cells 1610, 1620, and 1710 is the same as an integer multiple of the destination location pitch or within its allowable range. The integer can be 1, 2, 3, 4, or another value and can depend on the size and number of the bonding heads within the array of bonding head 124. The allowable range can be ±10% of the pitch of the destination locations, including the X-direction pitch and the Y-direction pitch.

[0084] The die holding regions 564 within one cell can be separated from the die holding regions 564 within directly adjacent cells. The distance between the die holding regions 564 in the nearest cell may be an integer multiple of the X-direction pitch or the Y-direction pitch of the destination location or within the allowable range. The allowable range can be ±0.10% of the X-direction pitch, the Y-direction pitch, or both the X-direction pitch and the Y-direction pitch of the destination location.

[0085] For example, the destination substrate can have destination locations along rows (in the X direction of FIG. 16) including rows 1 to 8. Cell 1610 can be used to bond the source die to the destination locations of rows 1 and 2, and cell 1620 can be used to bond the source die to the destination locations of rows 7 and 8. A portion of the destination substrate can be located between the die holding regions 564 for cells 1610 and 1620 and corresponds to rows 3 to 6 of the destination substrate. The source die coupled to the die holding regions 564 of cells 1610 and 1620 can be bonded to the destination locations of rows 1, 2, 7, and 8 without having to move the carriage 146 to different positions. In this particular example, the integer multiple is 3.

[0086] DC 511_571 =5xYP DS , where DC 511_571 is the center-to-center distance of the die holding regions 564 for the bonding heads 511 and 571, YP DS is the Y-direction pitch of the destination locations of the destination substrate.

[0087] When the Y-direction pitch of the destination locations is 20 mm, the center-to-center distance of the die holding regions 564 of the bonding heads 511, 571 is 100 mm. In practice, slight differences can result from the apparatus or reproducibility of the manufacturing process. The tolerance range is YP DScan be ±0.1%. The tolerance range may depend on the size of the contact pads, the overlay requirements when connecting these contacts, and the positioning range of the device head positioning system for moving the die chuck. Accordingly, the center-to-center distance of the die holding regions 564 for the bonding heads 511 and 571 is 100 mm ± 0.05 mm. This relationship can be the same for other corresponding pairs of bonding heads within the cells 1610 and 1620. The center-to-center distance of the die holding regions 564 of the bonding heads 512 and 572 is 100 mm ± 0.05 mm, the center-to-center distance of the die holding regions 564 of the bonding heads 521 and 581 is 100 mm ± 0.05 mm, and the center-to-center distance of the die holding regions 564 of the bonding heads 522 and 582 is 100 mm ± 0.05 mm. The tolerance range may be less than ±10% of YP DS and may be less than ±10% of YP DS ±5% of YP DS ±2% of YP, or DS ±10% of YP. The tolerance range of the die chuck placement accuracy can be determined by the lateral positioning range of the device head positioning system. For example, when the device head positioning stage has a movement range of ±50 μm, ±100 μm, ±200 μm, ±500 μm, the tolerance requirement for die chuck placement should be 50% or less or 75% or more of the movement range.

[0088] The same principle can be applied in the X direction. For example, the destination substrate can have destination locations along rows (in the X direction of FIG. 17) including columns 1 to 6. The cell 1610 can be used to bond source dies to the destination locations of columns 1 and 2, and the cell 1710 can be used to bond source dies to the destination locations of columns 5 and 6. A part of the destination substrate can be located between the die holding regions 564 for the cells 1610 and 1710 and corresponds to columns 3 and 4 of the destination substrate. The source dies coupled to the die holding regions 564 of the cells 1610 and 1710 can be coupled to the destination locations of columns 1, 2, 5, and 6 without the need to move the carriage 146 to different positions. In this particular example, the integer multiple is 2.

[0089] DC 511_551 = 2xXP DS Here, DC 511_551 is the center - to - center distance of the die - holding regions 564 of the bonding heads 511, 551, X PDS is the X - direction pitch of the destination location on the destination substrate.

[0090] When the X - direction pitch of the destination is 15 mm, the center - to - center distance of the die - holding regions 564 of the bonding heads 511, 551 is 30 mm. In practice, slight differences may result from the equipment or reproducibility of the manufacturing process. The tolerance range is ±0.10% of XP DS . Therefore, the center - to - center distance of the die - holding regions 564 for the bonding heads 511 and 551 is 30 mm ± 0.05 mm. This relationship may be the same for other corresponding pairs of bonding heads within the cells 1610 and 1710. The center - to - center distance of the die - holding regions 564 of the bonding heads 512 and 552 is 30 mm ± 0.05 mm, the center - to - center distance of the die - holding regions 564 of the bonding heads 521 and 561 is 30 mm ± 0.05 mm, and the center - to - center distance of the die - holding regions 564 of the bonding heads 522 and 562 is 30 mm ± 0.05 m. YP DS Similarly, the tolerance range, considering other factors, may be less than ±0.1% of XP DS , the tolerance range may be ±5% of XP DS , ±2% of XP DS , or ±10% of XP DS . As described above, the size of the contact pads for the source die, the destination location, or both may be as small as 4 μm. The tolerance range can be ±2 μm to ensure sufficient physical contact between the contact pads for the source die and the destination location. When each of the bonding heads has a positioning stage, the tolerance range can be relaxed up to 50% or 75% of the range of the positioning head.

[0091] Two or more channels can be coupled to zones within the die chuck. FIG. 18 includes a cross-sectional view of a die head 1811 including a device head 1840, a mounting plate 1850, and a die chuck 1860. The device head 1840 and the mounting plate 1850 have two or more channels for the mounting plate 1850 to hold the die chuck 1860, and the device head 1840 is modified to support two or more channels that can be coupled to specific zones within the die chuck 1860, except that they can have any of the designs as described above with respect to the device head 540 and the mounting plate 550. In particular, the mounting plate 1850 includes channels 1877 and 1977 that perform the same function as the channel 652 illustrated and described with respect to FIG. 6. The arrows above the channels 1877 and 1977 represent the connections within the device head that couple the channels 1877 and 1977 to a vacuum source. The die chuck 1860 can include a body 1862 and a die holding region 1864. The body 1862 includes a chucking vacuum receiving zone 1867 that performs the same function as the chucking vacuum receiving zone 762 of FIG. 7. The die chuck 1860 can have dimensions that are smaller in the X direction, the Y direction, or both directions compared to the die chuck 560 as described above.

[0092] When the die chuck 1860 is in the position shown in FIG. 18, the zone 1867 can be coupled to a vacuum source via the channel 1877. When the control coupling valve coupled to the channel 1877 is activated, the channel 1877 and the zone 1867 are evacuated (shown shaded), and the die chuck 1860 is held in place by the vacuum illustrated by the shaded arrow above the channel 1877. Another control coupling valve is coupled to the channel 1977. The control coupling valve associated with the channel 1977 is deactivated. Thus, the channel 1977 (shown without shading) is at atmospheric pressure, and its corresponding arrow is clear (without shading).

[0093] The die chuck 1860 can be moved towards the left side of FIG. 19. The control coupling valve associated with channel 1877 can be deactivated, allowing the die chuck 1860 to be moved, and the control coupling valve associated with channel 1977 can be activated. Channel 1977 and zone 1867 are evacuated (shown shaded), and the die chuck 1860 is held in place by the vacuum illustrated by the shaded arrow above channel 1977. Channel 1877 (shown without shading) is at atmospheric pressure, and its corresponding arrow is clear (without shading).

[0094] FIGS. 20 and 21 show alternative embodiments where the die chuck can be replaced to achieve different pitches for the die holding area. FIG. 20 includes side views of die heads 2011 and 2012. Die head 2011 includes a device head 2040 coupled to a bridge 120 (not shown in FIGS. 20 and 21). Die chuck 2060 is coupled to the device head 2040 and includes a body 2062 and a die holding area 2064. A mounting plate may or may not be disposed between any device head and the body of its corresponding die chuck. Die head 2012 includes a device head 2041 coupled to a bridge 120. Die chuck 2061 is coupled to the device head 2041 and includes a body 2063 and a die holding area? 2065.

[0095] FIG. 21 includes side views of die heads 2011 and 2012 after replacing die chucks 2060 and 2061 with die chucks 2160 and 2161. Die chuck 2160 is coupled to device head 2040 and includes a body 2162 and a die holding region 2164. Die head 2012 includes a device head 2041 coupled to bridge 120. Die chuck 2161 is coupled to device head 2041 and includes a body 2163 and a die holding region 2165. Other die heads may be present but are not shown. Die chucks 2060, 2061, 2160, and 2161 can be vacuum-coupled, electrostatically coupled, or magnetically coupled to bodies 2040 and 2041.

[0096] Referring to FIG. 20, die heads 2011 and 2012 can have die chucks 2060 and 2061 having die holding regions 2064 and 2065 at an X-direction pitch and a Y-direction pitch used for a destination location of a destination substrate. Referring to FIG. 21, die heads 2011 and 2012 can have die holding regions 2164, 2165 at a different X-direction pitch and a different Y-direction pitch used for a destination location of a different destination substrate. Accordingly, by replacing the die chuck, the X-direction pitch, the Y-direction pitch, or both the X-direction pitch and the Y-direction pitch can be changed.

[0097] Note the method of using system 100. FIG. 22 includes a high-level process flow for bonding dies to different destination substrates having different pitches for the destination locations. The method includes, at block 2222, bonding some of the plurality of dies to the destination substrate, at block 2242, changing the pitch of the die holding regions associated with the plurality of die heads without moving the body, and at block 2262 of FIG. 22, bonding other dies within the plurality of dies to a second destination substrate. The bonding of some of the dies at block 2222 is performed using a process flow as shown in the figure. Refer to FIGS. 23 and 24 and the text described in the text corresponding to such figures. The change in the pitch of the die holding regions is shown in the figure. Refer to FIGS. 25 and 26 and the text described in the text corresponding to such figures. The bonding of the other dies at block 2262 is performed using a process flow as shown in the figure. Refer to FIGS. 23 and 24 and the text described in the text corresponding to such figures. The method is described with respect to the bonding heads 511, 512, 521, and 522 of cell 1610 in FIGS. 16 and 17. Other source dies can be bonded to other destination locations using other bonding heads present in the array of bonding heads 124, such as the bonding heads within the cell within the cell 1620 in FIG. 16, the bonding heads within the cell 1710 in FIG. 17, or other cells within the array of bonding heads 124, but are not shown for the purpose of understanding the concepts described herein.

[0098] This method can include mounting the destination substrate on the destination substrate chuck at block 2322 and mounting the source substrate on the source substrate chuck at block 2324 and in FIG. 23. Referring to FIG. 27, the carriage 146 can be moved to allow easier access to the source substrate chuck 122 and the destination substrate chuck 148. The operations at blocks 2322 and 2324 can be performed in either order. Referring to FIG. 27, the destination substrate 2748 is mounted on the destination substrate chuck 148 and the source substrate 2722 is mounted on the source substrate chuck 122.

[0099] The destination substrate 2748 can include a semiconductor wafer, a package substrate, a printed wiring board, a circuit board, an interposer, etc. The microelectronic device may be a part of the destination substrate 2748 such as a semiconductor wafer. The package substrate, the printed wiring board, the circuit board, or the interposer may or may not have a die mounted thereon. A part or all of the side portion of the destination substrate 2748 can be activated for hybrid bonding. In one implementation form, the activation surface for hybrid bonding is shown as a dark band along the exposed surface of the destination substrate 2748.

[0100] FIG. 28 includes a top view of the destination substrate chuck 148 and the destination substrate 2748. The destination substrate 2748 includes destination dies 2820. Any or all of the dies 2820 can include a microprocessor, a microcontroller, a graphics processing unit, a digital signal processor, a memory die (e.g., level 2 or level 3 cache, flash memory, etc.), a field programmable gate array (FPGA), a power transistor die, a power circuit die, a charge coupled device (CCD), an image sensor, a semiconductor circuit element, a die bonding location of the destination substrate, etc.

[0101] Each of the destination dies 2820 can be a known good die (KGD) 2824 or a bad die (BD) 2834. The KGD passes one or more tests and is acceptable for bonding to another die. The bad die fails at least one test, and the tests include electrical open, electrical short, other functional tests (e.g., the processing operation is not executed (the implant is missing, the insulating layer is not formed, the etching operation is missing, etc.), the processing operation is inadvertently executed more than once, etc.), or the die operates too slowly for a specific application (e.g., the operating frequency is too low, the read access time is too long, etc.). Each of the destination dies 2820 can include a destination location 2830 indicated by a dashed line. At this point, the destination location 2830 is not coupled to the die, and thus, the destination location (DS) 2830 is not occupied.

[0102] Information regarding the KGD2824, defective die 2834, destination location 2830, and their locations with respect to the destination substrate 2748 can be stored in an external memory 162 of the system 100 or another data storage unit (e.g., hard disk, database, etc.) for later use when the source is to determine the location where it is to be bonded to the destination substrate 2748. Such information can include the X-direction pitch, Y-direction pitch, or both the X-direction pitch and the Y-direction pitch of the destination location 2830. The controller 160 or the local controller can receive information related to the destination substrate 2748, which can be used, for example, to move the die chuck to a position that matches the X-direction pitch and the Y-direction pitch during the transfer operation. In one implementation, whether all the destination dies 2820 are KGD2824 or defective die 2834, they can have electrical circuit elements and electrical circuits including a plurality of electrical circuit elements.

[0103] Focus on the source substrate 2722 and the plurality of dies 2724. Refer to the figure. Referring to FIGS. 27 and 28, the dies from the plurality of dies 2724 are bonded to the destination locations 2830 within the destination dies 2820 of the destination substrate 2748. The source substrate 2722 can be attached along the source substrate chuck 122. The plurality of dies 2724 can be attached to the source substrate 2722. The plurality of dies 2724 can include a plurality of production source dies. As used herein, a production source is a die formed during a microelectronics manufacturing process and including electrical circuit elements. A production source die can include a single electrical circuit element or an electrical circuit including a plurality of electrical circuit elements. A production source die can be a KGD or a defective die. All or only some, and not all, of the plurality of dies 2724 are transferred to the destination substrate 2748. The source substrate 2722 can be, for example, an adhesive tape that can be in the form of a tape frame or a tape reel, or a container having a grid that defines a matrix of regions for holding the plurality of dies 2724.

[0104] Any or all of the dies within the plurality of dies 2724 can include a microprocessor, a microcontroller, a graphics processing unit, a digital signal processor, a memory die (e.g., level 2 or level 3 cache, flash memory, etc.), a field programmable gate array (FPGA), a power transistor die, a power circuit die, a charge coupled device (CCD), an image sensor, a semiconductor circuit element, etc. All of the dies within the plurality of dies 2724 can include the same electrical circuit elements, and when an electrical circuit exists, can include the same electrical circuit.

[0105] Information regarding the KGDs, defective dies, and their positions with respect to the source substrate 2722 can be stored in an external memory 162 of the system 100 or another data storage unit (e.g., hard disk, database, etc.) for later use when loading the sources onto the array of die transfer seats 144. Such information can include the X-direction pitch, the Y-direction pitch, or both the X-direction pitch and the Y-direction pitch of the plurality of sources 2724. The controller 160 or a local controller can receive information regarding the plurality of sources 2724 that can be used in the transfer operation.

[0106] Each of the sources within the plurality of dies 2724 has a device side having most or all of the electrical circuit elements of the die and a back side opposite the device side. In the embodiment shown in FIG. 27, the back sides of the sources within the plurality of dies 2724 are disposed between the source substrate chuck 122 and the device side of the sources. In another mounting configuration, the device sides of the sources within the plurality of dies 2724 are disposed between the source substrate chuck 122 and the back sides of the sources. The side surfaces of the die facing the base 140 or the components coupled to the base 140 are activated for hybrid bonding to the destination substrate 2748, and the dark bands along the bottom of the sources within the plurality of dies 2724 are used to indicate the activated surfaces. Any one or more of the sources can have TSVs or electrical components along the back side, and such dies can also include back side bonding locations that can function as future destination substrate bonding locations to be used later.

[0107] This method includes performing registration and measurement on a plurality of dies and a plurality of die transfer seats on a source substrate at block 2342 of FIG. 23. Referring to FIG. 27, the registration and measurement operations can be performed on the plurality of dies 2724 and the array of die transfer seats 144. The optical component 150 can be used to collect information regarding the plurality of dies 2724. Information from the optical component 150 is transmitted and received to the controller 160 or local controller and can be used to determine the source pitch of the plurality of dies 2724 coupled to the source substrate chuck 122. The source pitch can include the X-direction source pitch, the Y-direction source pitch, or both the X-direction source pitch and the Y-direction source pitch. If necessary or desired, the information can be used to identify or verify that the dies within the plurality of dies 2724 are in the correct relative positions at the destination locations on the destination substrate 2748. The plurality of dies 2724 can be production source KGDs that are coupled to the KGD 2824 of the destination substrate 2748. The plurality of dies 2724 can include defective dies that can be bonded to the defective dies 2834 of the destination substrate 2748.

[0108] This method can further include, at block 2344 of FIG. 23, changing the pitch of the array of die transfer seats to a source alignment pitch. The controller 160 or the local controller can send signals for the array of die transfer seats 144 that are moved to achieve the source alignment pitch. The source alignment pitch may be the same as the source pitch or may be within an acceptable range of the source pitch. Similar to the source pitch, the source alignment pitch can include an X-direction source alignment pitch, a Y-direction source alignment pitch, or both an X-direction and a Y-direction source alignment pitch. The acceptable range can account for minor differences that may result from the reproducibility of the device or manufacturing process. As used herein, the acceptable range can be within 2.0%, 1.0%, 0.5%, or 0.1% of the desired value. For example, the source alignment pitch can be within 2.0%, 1.0%, 0.5%, or 0.1% of the source pitch.

[0109] This method can include, at block 2346 of FIG. 23, loading a set of dies onto the array of die transfer seats. The set can be as few as one die or any number of dies up to the number of die transfer seats within the plurality of die transfer seats 144. Referring to FIG. 29, the controller 160 or the local controller can send signals for the array of die transfer seats 144 that extend towards the source substrate 2722, pick up a set of dies 2924, and retract the die chuck from the source substrate 2722. When the set of dies is less than the number of die transfer seats within the array of die transfer seats 144, only the die transfer seats that will pick up a source during the current transfer cycle can be extended. Picking up a die is a specific type of loading. Another type of loading for the system 100 can be loading any or all of the die transfer seats using a die loader (not shown). Within the plurality of dies 2724, the dies that are not picked up remain coupled to the source substrate chuck 122 as shown in FIG. 29.

[0110] In one implementation form, the array of die transfer seats 144 does not contact the activation surface of the set of dies 2924. The die chucks of the array of die transfer seats 144 may be Bernoulli chucks. A set of dies 2924 is held by corresponding die chucks, but in FIG. 29, the set of dies 2924 is depicted as being separated from its corresponding die transfer seat within the array of die transfer seats 144, indicating that the activation surface of the set of dies 2924 does not contact its corresponding die transfer seat. The array of die transfer seats 144 can have a design that enables it to pick up the die along the side surface of the die, and the side surface is between the device and the back surface of the die.

[0111] If the die is too thin to be held by its side surface, a backing plate can be coupled to the die. For example, the die can have a thickness of less than 50 μm. The thickness of the backing plate, or the combined thickness of the backing plate and the die, is sufficient to enable the pickup head to pick up the backing plate or the combination of the backing plate and the die without having an activation surface of the die that contacts the pickup head. The backing plate can have a thickness in the range of 100 micrometers to 500 micrometers.

[0112] The backing plate can be coupled to the set of dies 2924 using an adhesive compound. The backing plate may be removed later, or may remain coupled to the die within the completed electrical device. The backing plate may be removed after the die is bonded to the destination substrate 2748. In one embodiment, the adhesive compound may be inactivated by exposure to actinic rays. The actinic rays may be in the range of 100 nm to 10 μm. In such an embodiment, at least 70% of the actinic rays pass through the backing plate. In another embodiment, a solvent can be used to remove the adhesive compound from between the set of dies 2924 and the backing plate.

[0113] In another implementation, the die may not have an activation surface, but may have relatively fragile components along the surface that is to be bonded to the destination substrate 2748, and such a surface should not contact the die transfer seats within the array of die transfer seats 144. Die transfer seats such as those described for dies having an activated surface can be used for dies having fragile components along the surface facing the die transfer seats.

[0114] In a further implementation, the die chuck for the array of die transfer seats 144 can have a design in which it contacts the bottom surfaces of a set of dies 2924. After reading the entire specification, one of ordinary skill in the art can determine whether the array of die transfer seats 144 should contact the device side or the back side of the die and can determine a design that meets the needs or desires of a particular application.

[0115] The method can further include, at block 2348 of FIG. 23, changing the pitch of the array of die transfer seats to a bonding head alignment pitch. The controller 160 or the local controller can send signals for the array of die transfer seats 144 that are moved to achieve the bonding head alignment pitch. The bonding head alignment pitch may be the same as the bonding head pitch of the array of bonding heads 124 or may be within an acceptable range. As used herein, the bonding head pitch is the pitch of the die holding regions of the bonding heads. The bonding head alignment pitch and the bonding head pitch can include an X-direction bonding head alignment pitch, a Y-direction bonding head alignment pitch, or both an X-direction and a Y-direction bonding head alignment pitch.

[0116] FIG. 31 includes a bottom view of a portion of the array of bonding heads 124 and includes a cell 1610 that includes bonding heads 511, 512, 521, and 522. The bodies 540 (not separately shown in FIG. 31) are arranged in proximity to each other. The die chuck 560 can have a range of positions as previously described with respect to FIGS. 10-13.

[0117] The bonding head pitch is the pitch of the die holding regions 564 of the bonding heads 511, 512, 521, and 522. The die chuck 560 is arranged to achieve an appropriate bonding head pitch that is the pitch of the destination location 2830 of the destination substrate 2748 or near it as shown in FIG. 28. In the specific example shown in FIG. 31, in the X direction, the die chuck 560 is arranged near the center of the die chuck mounting region of each bonding head. Along the upper row, the die chuck 560 is near the bottom of the die chuck mounting region for each of the bonding heads 511 and 512, and along the lower row, the die chuck is near the top of the die chuck mounting region for each of the bonding heads 521 and 522. Compared with the X direction, the Y directions of the die chucks in different rows are closer to each other. Therefore, the array of bonding heads 124 has an intermediate value for the X direction pitch and a relatively small value for the Y direction pitch. Information regarding the X direction pitch and the Y direction pitch can be stored in an external memory 162, database, or memory of the system 100 and can be received by the controller 160 or the local controller when setting the value of the bonding head alignment pitch for the array of die transfer seats 144.

[0118] The tolerance between the bonding head pitch and the bonding head alignment pitch can account for a slight difference due to the reproducibility of the device or manufacturing process. For example, the bonding head alignment pitch can be within 2.0%, 1%, or 0.5% of the bonding head pitch. The tolerance of the bonding head pitch is determined by the size of the interconnect pads on each die. For example, the tolerance of the bonding head pitch can be 0.1% to 10% of the size of the smallest interconnect contact pad. The tolerance may be relaxed when each of the bodies of the bonding heads includes or is attached to an independent positioning stage. In this case, the tolerance may be relaxed up to a part of the range of the positioning stage. The positioning stage may be a six-axis positioning stage.

[0119] This method can include moving the carriage to the alignment position at block 2422 of FIG. 24. In FIG. 32, the carriage 146 is moved such that the alignment reference 128 is over the optical component 150. Information collected from the optical component 150 can be received by the controller 160 or a local controller. The controller 160 or local controller can use the information regarding subsequent movement of the carriage 146 to a desired location.

[0120] The method can further include moving the carriage 146 such that a set of dies 2924 can be transferred from an array of die transfer seats 144 to an array of bonding heads 124. The controller 160 or local controller can send a signal to move the carriage 146 to a desired position. In the embodiment shown in FIG. 32, the carriage 146 is moved such that the array of bonding heads 124 is over the set of dies 2924. The movement can include moving the carriage 146 in the X direction, Y direction, rotating the carriage along the X - Y plane, or a combination thereof.

[0121] The method can further include transferring a set of dies from an array of die transfer seats to an array of bonding heads at block 2424 of FIG. 24. The controller 160 or local controller can send a signal for a set of dies 2924 to be transferred from the array of die transfer seats 144 to the array of bonding heads 124. The die chuck for the array of die transfer seats 144 can extend towards the array of bonding heads 124, the die chuck for the bonding heads within the array of bonding heads 124 can extend towards the array of die transfer seats 144, or both. FIG. 33 shows a set of dies 2924 after being transferred from the array of die transfer seats 144 to the array of bonding heads 124.

[0122] This method can include measuring the alignment of a set of dies using optical components at block 2442 of FIG. 24. The optical component 150 coupled to the carriage 146 can be used for positioning a set of dies 2924, measuring the alignment error of a set of dies 2924, or both, as shown in FIG. 34. The position of each die on each die holding area 564 can be measured relative to one or more alignment marks on one or more of the die chuck 560, the mounting plate 550, and the device head 540. Better measurement of the dies can be achieved by measuring the alignment error as the position of each die on each bonding head relative to the ideal position of the die on the bonding head. The position of each die can be adjusted using one or more positioning stages that are part of or connected to the device head 540. Information from the optical component 150 is sent to and can be received by the controller 160 or a local controller. The controller 160 or the local controller can receive and use the information to determine the alignment error and the amount of die positioning, such that the dies are more closely aligned with their corresponding destination locations on the destination substrate 2748. The controller 160 or the local controller can send a signal, such that the position of each die is adjusted by moving the die chuck of the bonding head using the limited range of movement of the die chuck relative to the corresponding body. Thus, in one implementation, it becomes possible to adjust the position of the die relative to the destination substrate 2748 held by the destination substrate chuck 148 by moving the die chuck. Positioning and measurement of the alignment error can be performed iteratively until the alignment error is zero or an acceptably low value. The alignment error is determined by, at least, the pitch of the dies on all bonding heads relative to the destination pitch.

[0123] This method further includes moving the carriage such that the bonding head is over the destination substrate at block 2444 of FIG. 24. The controller 160 or the local controller can send a signal for the carriage 146 to move to the desired position. The carriage 146 is moved such that the die set 2924 is over the corresponding destination location of the destination substrate?2748.

[0124] The method can further include bonding the die set to the corresponding destination location of the destination substrate at block 2446 of FIG. 24. The controller 160 or the local controller can send a signal for a set of dies 2924 to be bonded to the destination location of the destination substrate 2748. The die chuck for the bonding head within the array of bonding heads 124 can extend towards the destination substrate 2748, the destination substrate chuck 148 can extend towards the array of bonding heads 124, or both can be done. Pressure is applied to bond a set of dies 2924 to their corresponding destination locations on the destination substrate 2748 of FIG. 35. In one embodiment, the bond can be an oxide-oxide bond. The pressure during bonding can be in the range of 0.5 N / cm 2 ~20 N / cm 2 The bonding can be performed at room temperature (e.g., a temperature in the range of 20°C to 25°C) or at a higher temperature. The bonding is performed at a temperature lower than a subsequent anneal to expand the conductive metal within the die and at the destination location. The temperature and pressure can be limited depending on the film present during bonding or the components within the device 110. For example, the temperature can be about 200°C or less. After reading this specification, one of ordinary skill in the art can determine the pressure and temperature used for the bonding.

[0125] FIG. 36 includes a top view of the destination substrate chuck 148 and the destination substrate 2748 after a set of dies 2924 have been bonded to the corresponding destination locations of the destination substrate 2748. The destination locations 2830 not bonded to the source die are shown by dashed lines in FIG. 36.

[0126] This method includes determining, in decision step 2462 of FIG. 24, whether another set of dies should be transferred to the destination substrate. If more dies should be transferred (a branch to "YES" from decision step 2462 of FIG. 24), the method continues from block 2344 of FIG. 23. In an implementation as shown in FIG. 37, more sources are bonded to the destination locations of the destination substrate 2748. The dies include source KGDs 3724 within a plurality of dies 2724 that are bonded to the destination locations of the destination KGDs 2824. The source KGDs 3724 include a set of dies 2924, although the set of dies 2924 is not labeled in FIG. 37.

[0127] The source die may or may not be bonded to the defective destination die 2834. In the implementation shown in FIG. 37, the defective source die 3734 may be bonded to the defective destination die 2834. The defective source die 3734 may be part of the plurality of dies 2724, or may be bonded to a different source substrate that is coupled to a different source substrate chuck. The defective source die 3734 may be processed in the same manner as the set of dies 2924. In another implementation, the defective source die 3734 may be loaded onto the plurality of die transfer seats 144 by a die loading machine.

[0128] In another implementation, some or all of the defective source die 3734 can be replaced with dummy source dies. The dummy source dies may have X, Y, and Z dimensions that are the same as, or within the tolerance ranges of, the respective X, Y, and Z dimensions of the KGDs 3724. For example, the X, Y, and Z dimensions can be within 2.0%, 1%, or 0.5% of the X, Y, and Z dimensions of the KGDs 3724. When the KGDs 3724 are bonded to the backing plate, the Z dimension of the dummy source may be the same as, or within the tolerance range of, the combined thickness of the KGDs 3724 and the backing plate.

[0129] The dummy source die may be within a plurality of dies 2724 or may be coupled to different source substrates coupled to different source substrate chucks. The dummy source die may be processed in the same manner as the set of dies 2924. In another implementation, the dummy source die may be loaded onto the plurality of die transfer seats 144 by a die loader.

[0130] Returning to the method of FIG. 24, when a further set of source dies should not be transferred to the destination substrate (branch to "no" in decision step 2462 of FIG. 24), the method can include determining whether a new destination substrate is being processed in decision step 2522 of FIG. 25. If no further destination substrate is being processed (branch to "no"), the method for the transfer operation regarding the destination substrate 2748 can end.

[0131] To complete the hybrid bonding process of the source die to the destination location of the destination substrate 2748, further processing can be performed. The hybrid bonding process can include three steps including a bonding operation corresponding to the transfer operation, a first anneal that causes the metals to expand and contact each other within the die and at the destination site, and a second anneal that causes metal atoms to cross the metal-metal interface and reduce contact resistance. The destination substrate can be removed from the apparatus 110 or moved to a different part or different tool of the apparatus 110 to perform the anneal operation. This method may also be used in conjunction with other processes for die bonding to a substrate, such as tape automated bonding, pre-attachment for wire bonding, solder bump bonding, ball bonding, etc.

[0132] When returning to the method for another transfer operation and a new destination substrate is being processed (branching to "YES" from decision step 2522), the method can further include determining, at decision step 2524, whether the new substrate has a different pitch relative to the destination location of the new substrate. The new substrate can have a destination die having the same electrical circuit and destination location as the previous substrate. The pitches of the preceding substrate and the new substrate may be the same or within an acceptable range of each other.

[0133] If the pitches are not significantly different (branching to "NO" from decision step 2524), the method proceeds to block 2322 of FIG. 23, where the new destination substrate is loaded onto the destination substrate chuck. The actions in blocks 2324 and 2342 may or may not be performed. For example, the plurality of dies 2724 can include source dies that are bonded to the new destination substrate. In this case, the operations in blocks 2324 and 2342 are not performed. In another example, the plurality of dies 2724 may not have a sufficient number of source dies for the new destination substrate. A new source substrate coupled to a new plurality of source dies can be loaded onto the source substrate chuck (block 2322), and registration and measurement can be performed (block 2342). Whether the new source substrate and the new plurality of dies are processed or not, the method can continue by changing the pitch of the array of die transfer seats at block 2344.

[0134] If the new destination substrate has a different pitch relative to its destination location (branching to "YES" from decision step 2524), the die chuck for the array of bonding heads 124 needs to be moved for the different pitch. Referring to FIG. 31, the die chuck 560 for the array of bonding heads 124 including bonding heads 511, 512, 521, and 522 is moved such that the die holding region 564 is at the pitch of the destination location of the new destination substrate.

[0135] FIG. 38 is a top view of a destination substrate 3848 coupled to a destination substrate chuck 148. The destination substrate 3848 includes destination dies 3820. Any or all of the dies 3820 can include a microprocessor, a microcontroller, a graphics processing unit, a digital signal processor, a memory die (e.g., level 2 or level 3 cache, flash memory, etc.), a field programmable gate array (FPGA), a power transistor die, a power circuit die, a charge coupled device (CCD), an image sensor, a semiconductor circuit element, a die bonding location of the destination substrate, and the like. Each of the destination dies 3820 can be a KGD 3824 or a bad die 3834. In one implementation, all of the destination dies 3820, whether they are KGDs 3824 or bad dies 3834, can have electrical circuit elements and electrical circuits including a plurality of electrical circuit elements.

[0136] Each of the destination dies 3820 can include a destination location 3830 indicated by a dashed line. At this point in the method, the destination location 3830 is not bonded to the die, and thus the destination location 3830 is not occupied in FIG. 38. Comparing with the destination locations 2830 of the destination substrate 2748 in FIG. 28, the destination locations 3830 along a single row are closer to each other, and the destination locations 3830 along a single column are farther apart. The X-direction pitch of the destination locations 3830 is smaller than the X-direction pitch of the destination locations 2830, and the Y-direction pitch of the destination locations 3830 is larger than the Y-direction pitch of the destination locations 2830. The position of the die chuck for the array of bonding heads 124 can be moved to achieve the X-direction pitch and the Y-direction pitch for the destination locations 3830 of the destination substrate.

[0137] Information regarding KGD3824, defective die 3834, destination location 3830, and their positions relative to destination substrate 3848 can be stored in an external memory 162 or another data storage unit (e.g., hard disk, database, etc.) outside of system 100 for later use when repositioning the die chuck for the array of bonding heads 124 and determining where the source is to be bonded to destination substrate 3848. Such information can include the X-direction pitch, Y-direction pitch, or both the X-direction pitch and Y-direction pitch of destination location 3830. The information can be received by controller 160 or a local controller to enable proper positioning of die chuck 560.

[0138] Referring to FIG. 25, since the bonding head pitch is different (to “YES” in decision step 2524), the method can include moving the docking station to the die chuck that is moved in block 2542. Controller 160 or a local controller can send a signal for carrier 146 to be moved to a desired position. FIG. 39 includes a side view of a portion of system 100 including bridge 120, bonding heads 521 and 522 of the array of bonding heads 124, docking station 272, carrier 146, and base 140. The array of bonding heads 124 can include more or fewer bonding heads compared to the implementation shown in FIG. 39. Many details of bonding heads 521 and 522 and docking station 272 have been described above. Since die chuck 560 is coupled to bridge 120, the bridge-side coupling is shown by shading mounting plate 550 of bonding heads 521 and 522. Controller 160 or a local controller can send a signal for carrier 146 to move such that docking station 272 is under bonding head 521.

[0139] This method can further include coupling the die chuck to the docking station at block 2544 of FIG. 25. Referring to FIG. 40, docking station 272 extends to contact a die chuck 560 coupled to die chuck 560 of bonding head 521. Docking station 272 can contact body 562 of die chuck 560. Data from the sensors can be provided to controller 160 or local controller information as to whether docking station 272 and die chuck 560 are approaching each other or are in proximity to each other. Controller 160 or the local controller transmits a signal for the docking side coupler for die chuck 560 that is activated to couple die chuck 560 to docking station 272. The docking side coupling of docking station 272 is indicated by shielding channels 1452 and zone 1462 within docking station 272.

[0140] The die holding area 564 is within recess 1424 of docking station 272. In the embodiment shown in FIG. 40, docking station 272 is spaced from the surface along the distal side of die holding area 564 and does not contact the surface. Such a surface may contact the source die during the transfer cycle. The possibility that particles contact such a surface or damage such a surface by docking station 272 is eliminated or substantially reduced. In another embodiment, the surface may contact docking station 272. Care may be used to reduce the amount of particles transmitted to the surface or other portions of die holding area 564 or the amount of damage to the surface when die chuck 560 is coupled to docking station 272.

[0141] This method can include separating the die chuck from the device head at block 2546 of FIG. 25. The controller 160 or the local controller can send a signal for the bridge side coupler to deactivate and separate the die chuck 560 from the device head 540 of the bonding head 521 of FIG. 41. The docking station 272 can be separated from the remaining portion of the die head 521. The docking station 272 can fully retract or partially retract, not fully, before the docking station moves in the X direction, the Y direction, or both the X and Y directions.

[0142] This method can further include moving the docking station from a first position to a second position at block 2622 of FIG. 26. The controller 160 or the local controller can send a signal for the carriage 146 to move so that the docking station 272 is under the desired location along the bridge 120. Referring to FIG. 38, the destination locations 3830 are closer to each other in the X direction and farther apart in the Y direction. The carriage 146 can move the die chuck 560 to the right side of FIG. 42 in the X direction and to the front side of FIG. 42 in the Y direction.

[0143] This method can further include coupling the die chuck to the device head at block 2642 of FIG. 26. Referring to FIG. 43, the docking station 272 is extended to bring the die chuck 560 into contact with the device head 540 of the bonding head 521. The docking station 272 can contact the body 540 of the bonding head 521. Data from the sensor can be provided to the controller 160 or local controller information as to whether the docking station 272 and the device head 540 of the bonding head 521 are approaching each other or are in proximity to each other. The controller 160 or local controller transmits a signal of the bridge side coupler for actuating the bonding head 521, as shown by the mounting plate 550 shaded in FIG. 43, and can couple the die chuck 560 to the remainder of the bonding head 521.

[0144] This method can include detaching the die chuck from the docking station at block 2644 of FIG. 26. The controller 160 or local controller can transmit a signal of the docking side coupler for the docking station 272 to deactivate and separate the die chuck 560 from the docking station 272 of FIG. 44. The docking station 272 can be moved away from the bonding head 521. At this point in the process, the die holding area 564 for the bonding head 521 is in the desired position corresponding to the destination location 3830 for the destination substrate 3848 (FIG. 38).

[0145] In the determination step 2662 of FIG. 26, it is determined whether it is necessary to move a further bonding head. If it is necessary to move another bonding head (branch to "YES"), the operations corresponding to blocks 2542, 2544, and 2546 of FIG. 25 and blocks 2622, 2642, and 2644 of FIG. 26 are repeated for another die chuck. One, several, or all of the die chucks 560 can be moved along the rows (X direction) of the bonding heads in the array of the bonding heads 124, and one, several, or all of the die chucks 560 can be moved along the columns (Y direction) of the bonding heads in the array of the bonding heads 124.

[0146] FIG. 45 includes a side view of the system after the die chuck 560 for the bonding head 522 has moved towards the left side of FIG. 45 and approached the front part of FIG. 45. FIG. 46 includes a bottom view of a part of the array of the bonding heads 511, 512, 521, 522, 571, 572, 581, and 582 of the cells 1610 and 1620 after the die chuck 560 has been moved to a different position. Comparing FIGS. 31 and 46, in the X direction, for a pair of bonding heads 511, 512, a pair of bonding heads 521, 522, a pair of bonding heads 571, 572, and a pair of bonding heads 581, 582, the die holding regions 564 are close to each other. In the Y direction, the die holding regions 564 are separated from each other with respect to a pair of bonding heads 511, 521, a pair of bonding heads 512, 522, a pair of bonding heads 571, 581, and a pair of bonding heads 582, 582.

[0147] The bonding heads in other cells such as the cell 1710 are moved as described above for the bonding heads in the cell 1610 so that the die holding regions 564 of the bonding heads in the other cells are properly positioned for the destination location 3830 for the destination substrate 3848.

[0148] If there is no need to move the additional bonding head (branch to "no"), the method proceeds to block 2322 in FIG. 23, where the destination substrate 3848 is mounted on the destination substrate chuck 148. The method continues as shown in FIG. 47 until the source die is bonded to the destination location on the destination substrate 3848. The source KGD 3724 can be coupled to the destination KGD 3824. The destination location of the defective destination die 3834 can be bonded to the defective source die 3734, to a dummy source die, or to a combination of the defective source die 3734 and the dummy source die. In another implementation, not all of the destination locations of some, but not all, of the destination locations are occupied and may not be coupled to any die.

[0149] This method can continue until all desired target substrates are processed. The method can end (branch to "NO" in decision step 2522 of FIG. 25). Additional processing can be performed to complete the hybrid bonding process of the source die to the destination location 3830 on the destination substrate 3848. The hybrid bonding process can include three steps: a bonding operation corresponding to the transfer operation, a first anneal that expands and contacts the metals with each other within the die and at the destination site, and a second anneal that causes metal atoms to cross the metal-metal interface and reduce the contact resistance. The destination substrate can be removed from the apparatus 110 or moved to a different part of the apparatus 110 or a different tool to perform the anneal operation.

[0150] Figures 16, 17, and 46 show cells, and within each cell, the die chuck is positioned on immediately adjacent rows and columns such that the source die can be coupled to a destination location for the destination die. Within the cell, the die chuck can be arranged such that the die holding area is at an integer multiple of the pitch of the destination location or a pitch near thereto. FIG. 48 includes a bottom view of a portion of cells 1610 and 1620. Compared with FIG. 46, in FIG. 48, the die chuck 560 is arranged such that the die holding area 564 along the row (X direction) is more separated. A configuration as shown in FIG. 48 can be beneficial when the X dimension, Y dimension, or both dimensions of the body for the bonding head are larger than the X direction pitch, Y direction pitch, or both pitches of the destination locations of the destination substrate.

[0151] For example, the device head 50 can have X and Y dimensions of 40 mm to 120 mm respectively. The X direction pitch of the destination location can be 0.5 mm to 100 mm. For example, the X direction pitch can be 15 mm. Thus, after positioning of the carriage 146, without further movement, the array of bonding heads 124 can bond the source die to every other row of the destination locations. Using the left - hand bonding heads (bonding heads 511, 521, 571, and 581) within cells 1610 and 1620, the source can be bonded to the destination locations along column 1, and using the right - hand bonding heads (bonding heads 512, 522, 572, and 582) within cells 1610 and 1620, the source die can be bonded to the destination locations corresponding to column 3.

[0152] A portion of the destination substrate can be positioned between the die holding areas 564 for the left - hand and right - hand bonding heads along the same row within each of cells 1610 and 1720, and such a portion corresponds to column 2 of the destination die. The source die coupled to the die holding areas 564 of cells 1610 and 1620 can be bonded to the destination locations of columns 1 and 3 without the need to move the carriage 146 to different positions. In this particular example, the integer multiple is 2.

[0153] DC 511_512= 2xXP DS , where DC 511_512 is the center - to - center distance of the die - holding regions 564 for the bonding heads 511 and 512, XP DS is the X - direction pitch of the destination locations on the destination substrate.

[0154] When the X - direction pitch of the destination is 15 mm, the center - to - center distance of the die - holding regions 564 of the bonding heads 511, 512 is 30 mm. In practice, slight differences may result from the equipment or reproducibility of the manufacturing process. The tolerance range can be set to ±0.1% of XP DS . Therefore, the center - to - center distance of the die - holding regions 564 for the bonding heads 511 and 512 is 30 mm ± 0.05 mm. This relationship can be the same for other corresponding pairs of bonding heads within the cells 1610 and 1620. The center - to - center distance of the die - holding regions 564 of the bonding heads 521 and 552 is 30 mm ± 0.05 mm, the center - to - center distance of the die - holding regions 564 of the bonding heads 551 and 561 is 30 mm ± 0.05 mm, and the center - to - center distance of the die - holding regions 564 of the bonding heads 552 and 562 is 30 mm ± 0.05 mm. The tolerance range, taking other considerations into account, may be less than ±10% of XP DS , and the tolerance range may be ±5% of XP DS , ±2% of XP DS , or ±10% of XP DS . As described above, the size of the contact pads for the source die, the destination location, or both may be as small as 4 μm. The tolerance range may be between ±1 μm to ensure sufficient physical contact between the contact pads for the source and the destination location. In embodiments where each of the bonding heads includes a positioning stage, the tolerance range may be relaxed to a part of the movement range of the positioning head.

[0155] In the Y direction, since the Y-direction pitch is the same as or greater than the Y-direction dimension of the device head, the positions of the bonding heads within cells 1610 and 1620 are not affected. Within each cell, the source die can be bonded to the destination locations of the destination die along directly adjacent rows such as rows 1 and 2, and rows 7 and 8. The integer multiple within each of cells 1610 and 1620 is 1. Thus, within each of cells 1610 and 1620, the Y-direction pitch between different rows of the bonding head is the same as or within the tolerance range of the Y-direction pitch of the destination location. The tolerance range may be less than ±10% of the Y-direction pitch of the destination location, considering other considerations, and the tolerance range may be ±5%, ±2%, or ±10% of the Y-direction pitch of the destination location. As described above, the size of the contact pads for the source die, the destination location, or both may be as small as 4 μm. The tolerance range can be set to ±1 μm to ensure sufficient physical contact between the contact pad for the source die and the destination location. In embodiments where each of the bonding heads includes a positioning stage, the tolerance may be relaxed up to a part of the movement range of the positioning head.

[0156] The die chuck 560 within cell 1710 (FIG. 17) can be moved such that the die chuck 560 within cell 1710 is at or near the same position as the die chuck within cell 1610 as shown in FIG. 48.

[0157] Figures 49-55 disclose additional alternative embodiments. As shown in the figures, referring to FIGS. 49-51, the additional alternative implementation forms include a plurality of device heads 4940a and 4940b. Each of the device heads 4940 includes device head channels 4952a, 4952b, and 4952c. Each of the device head channels 4952 is connected to a vacuum source or a pressurized fluid source. The vacuum and fluid sources each may include one or more of a valve, a tank, a pump, a mass flow controller, an external source, etc., which are used to control both the pressure, timing, or both the pressure and timing of the vacuum and the fluid from the fluid source. The removable mounting plate 4950 is coupled to the device head 4940, receives vacuum and pressurized fluid from each channel of the device head 4940, and supplies the vacuum and pressurized fluid to one of a plurality of possible die chucks 4960. FIG. 49 is a diagram of die chuck 4960a coupled together such that the centers of each of the two device heads 4940a and 4940b, mounting plates 4950a and 4950b, and die holding region 5564 have a pitch DC49.

[0158] FIG. 50 is a diagram of two device heads 4940a and 4940b, different mounting plates 4950c and 4950d, and die chuck 4960a coupled to each other such that the centers of each of the die holding regions 5564 have a pitch DC50 that is different from pitch DC49. The pitch is adjusted by changing the mounting plate 4950 that changes the location of the mounting plate channels on the distal side of the mounting plate facing the proximal side of the die chuck. Each mounting plate or group of mounting plates in the library may have different locations of the channels on the distal side of the mounting plate, but may have the same location of the channels on the proximal side of the mounting plate. The system 100 can include a library of mounting plates coupled onto the device head 4940 using, for example, the docking station described above. The mounting plate is coupled to the device head using one or more coupling mechanisms selected from vacuum coupling, electrostatic coupling, electromagnetic coupling, and mechanical coupling.

[0159] FIG. 51 shows a device head and a different mounting plate 4950d with a die chuck 4960b of a size different from that of the die chuck 4960a. Accordingly, dies of various shapes (shape and size) can be placed and bonded to a substrate using various combinations of mounting plates and die chucks. The mounting plate enables adjustment of the die placement pitch, and the die chuck enables adjustment of the die shape. This implementation makes it possible to reduce the size of the die head or the device head / mounting plate and still handle a wide range of pitches on the destination substrate. The device head / mounting plate needs to be large enough to cover both the minimum and maximum pitches on the destination substrate for which the mounting plate is used in the system, so it can potentially be made smaller. This can enable a smaller pitch to be achieved for the destination locations on the destination substrate.

[0160] FIGS. 52-55 are views of an exemplary die chuck 4960a. FIG. 52 is a proximal view of the die chuck 4960a. FIG. 53 is a cross-sectional view of the die chuck 4960a along cut line 53-53. FIG. 54 is a cross-sectional view of the die chuck 4960a along cut line 54-54. FIG. 55 is a distal view of the die chuck 4960a. The die chuck 4960a includes a chucking vacuum receiving zone 5262 that is fluidly coupled to a vacuum from a device head channel 4952a that moves through the mounting plate. The die chuck 4960a includes a die vacuum zone 5564 on the distal side of the die chuck and a channel that couples a vacuum from a device head channel 4952c that moves through the mounting plate. The die chuck 4960a includes a die modulation zone 5566 on the distal side of the die chuck or inside the die chuck and a channel that couples fluid from a device head channel 4952b that moves through the mounting plate.

[0161] A plurality of device heads 4940 are arranged at fixed positions relative to each other on the bridge. Each of the device heads 4940 may include or be attached to a positioning stage used to adjust the position of the die on its corresponding die chuck. Thus, the device heads 4940 can position the dies such that the relative pitch of the dies is an integer multiple of the pitch of the destination locations on the destination substrate. The range of the positioning stage is part of the adjustment available by exchanging the mounting plate. For example, by changing the mounting plate, adjustment of the pitch from 100 mm to 0.5 mm is possible, while each of the positioning stages can provide an adjustment range of 0.05 μm to 0.5 mm depending on the application. The die chucks and die holding areas shown herein are square, but may be any shape (square, rectangular, circular, hexagonal, etc.) that matches the die.

[0162] The embodiments described herein may be useful when bonding a source to different destination substrates having different pitches for the destination locations. The die chuck can be moved to different positions such that the die holding area can be at an integer multiple tolerance of the pitch of the destination locations, or within the tolerance range of that pitch. The body can be arranged at a very small pitch and remains stationary when the die chuck is moved for different pitches at the location of the destination. In another example, a set of die chucks can be replaced with another set of die chucks while the body remains fixed. The die chucks are smaller and have less mass, and can be moved more easily and held more easily by the body compared to moving the entire die head. When using a docking station to move the die chuck, no tubes, cables, or other mechanical features within the device head or die head support structure such as a bridge, carriage, or base are required. Such a configuration simplifies the design of the die head and its corresponding support structure and can reduce the likelihood of particle generation when the die chuck is moved or a set of die chucks is exchanged.

[0163] Note that in a general description or example, not all of the activities described above are required, some of the specific activities may not be required, and one or more additional activities may be performed in addition to those described. Further, the order in which the activities are listed is not necessarily the order in which they are performed.

[0164] Benefits, other advantages, and solutions to problems are described above with respect to specific implementations. However, benefits, advantages, solutions to problems, and any features that may give rise to or make more prominent any benefit, advantage, or solution should not be construed as critical, required, or essential features of any or all of the claims.

[0165] The specification and examples of the implementations described herein are intended to provide a general understanding of the structure of the various implementations. The specification and examples do not comprehensively and inclusively describe all of the elements and features of the apparatus and systems that use the structures or methods described herein. Separate implementations may also be provided in combination in a single implementation, and conversely, for the sake of brevity, the various features described in the context of a single implementation may be provided separately or in any sub-combination. Further, references to values described in ranges include each and every value within that range. Many other implementations may become apparent to those of ordinary skill in the art after reading this specification. Other implementations may be used and derived from this disclosure so that structural substitutions, logical substitutions, or other changes may be made without departing from the scope of this disclosure. Therefore, this disclosure should be regarded as illustrative rather than restrictive.

Claims

1. 1. A system comprising: A plurality of die heads, each of the plurality of die heads comprising: a device head configured to be releasably coupled to the die chuck to allow the die chuck to be in different positions within the die chuck mounting region at different times. A system characterized by:

2. Each of the plurality of die heads is A mounting plate; the die chuck including a die holding area; the mounting plate is disposed between the device head and the die chuck; the mounting plate defines the die chuck mounting area; 2. The system of claim 1 .

3. the mounting plate including vacuum channels for holding the die chuck in the different positions.

3. The system of claim 2.

4. the die chuck having a distal side and a proximal side, the device head being closer to the proximal side than to the distal side; the die chuck comprising a chucking vacuum receiving zone along the proximal side of the die chuck, the chucking vacuum receiving zone configured to allow the die chuck to be held by a vacuum.

4. The system of claim 3.

5. the die chuck having a distal side and a proximal side, the device head being closer to the proximal side than to the distal side; The die chuck includes: a vacuum receiving zone along the proximal side of the die chuck; a die vacuum receiving zone along the distal side of the die chuck; a vacuum connection in the die chuck and between the vacuum receiving zone and the die vacuum receiving zone; The system of claim 3, further comprising:

6. The die chuck includes: a modulated receiving zone along the proximal side of the die chuck; a die modulation zone along the distal side of the die chuck; a modulation connection in the die chuck and between the modulation receiving zone and the die modulation zone; The system of claim 5, further comprising:

7. the device head having a device head mass; the die chuck having a die chuck mass that is less than half of the device head mass.

3. The system of claim 2.

8. a center of the die holding area is offset from a center of the die chuck mounting area when the die chuck is in each of the different positions; 3. The system of claim 2.

9. the die head is configured to permit movement of the die chuck while the die chuck is coupled to the device head.

3. The system of claim 2.

10. a docking station configured to move the die chuck relative to its corresponding device head; a first coupler configured to couple the die chuck to the corresponding device head and to decouple the die chuck from the corresponding device head; a second coupler configured to couple the die chuck to the docking station and to decouple the die chuck from the docking station; 2. The system of claim 1, further comprising:

11. the second coupler is configured to prevent the docking station from contacting a die holding area of ​​the die chuck. The system of claim 10.

12. a controller configured to send a signal to move a first die chuck of a first die head from a first position along a first device head of the first die head to a second position along the first device head, the plurality of die heads including the first die head; 2. The system of claim 1 .

13. a bridge coupled to the plurality of die heads, the die heads being a plurality of joining heads; a source substrate chuck; a base spaced from the bridge; a positioning stage coupled to the base; a plurality of pickup heads coupled to the positioning stage; a docking station coupled to the positioning stage; 2. The system of claim 1, further comprising:

14. each of the plurality of die heads further comprising one of a first mounting plate and a second mounting plate; the first mounting plate defines a first location of a die holding area of ​​the die chuck on the device head; the second mounting plate defines a second location of the die holding area of ​​the die chuck on the device head; the second location is different from the first location; 2. The system of claim 1 .

15. coupling a first die chuck to the docking station by activating a first coupler associated with the docking station, where the plurality of die heads includes a first die head, the first die head including a first device head and the first die chuck, the first die chuck having a first die holding area, the first die chuck coupled to the first device head at a first location within a first die chuck mounting area; decoupling the first die chuck from the first device head by deactivating a second coupler associated with the first device head; moving a first docking station from a first location along a support structure to a second location along the support structure; coupling the first die chuck to the first device head by activating the second coupler, where after the first die chuck is coupled to the first device head, the first die chuck is in a second position within the first die chuck mounting area, the second position being different from the first position; deactivating the first coupler to separate the first die chuck from the docking station. The method according to claim 1, further comprising:

16. coupling a second die chuck to the docking station by activating the first coupler or a third coupler associated with the docking station, where the plurality of die heads includes a second die head, the second die head including a second device head and the second die chuck, the second die chuck having a second die holding area, the second die chuck coupled to the second device head at a third location within a second die chuck mounting area; decoupling the second die chuck from the second device head by deactivating a fourth coupler associated with the second device head; moving the docking station from a third location along the support structure to a fourth location along the support structure; coupling the second die chuck to the second device head by activating the fourth coupler, wherein after coupling the second die chuck to the second device head, the second die chuck is in a fourth position within the second die chuck mounting area, the fourth position being different from the third position; decoupling the second die chuck from the docking station by deactivating the third coupler or the first coupler; wherein when the first die chuck is in the first position and the second die chuck is in the third position, the first die holding area and the second die holding area are at a first pitch; when the first die chuck is in the second position and the second die chuck is in the fourth position, the first die retaining area and the second die retaining area are at a second pitch; the second pitch is different from the first pitch; 16. The method of claim 15 .

17. mounting a destination substrate on a destination substrate chuck coupled to a positioning stage, wherein the destination substrate has a plurality of destination sites at a destination site pitch, the destination site pitch being closer to the second pitch than the first pitch; the docking station is coupled to the positioning stage; 17. The method of claim 16.

18. picking up a set of dies from a source substrate using a plurality of pick-up heads; transferring the set of dies from the plurality of pick-up heads to the plurality of die heads, where the plurality of die heads are a plurality of bonding heads, the transfer occurring after coupling the first die chuck to the first device head and coupling the second die chuck to the second device head; measuring alignment errors of the set of dies held by the plurality of bond heads; adjusting a position of a first die in the set of dies relative to the destination substrate on the destination substrate chuck based on an alignment error associated with a first die; bonding the set of dies to the destination substrate using the plurality of bonding heads; 20. The method of claim 17, comprising:

19. receiving destination location pitches including a first destination location pitch in a first direction and a second destination location pitch in a second direction; positioning die holding areas for four die heads of a first cell to be a first integer multiple of the first destination location pitch and a second integer multiple of the second destination location pitch; The first cell includes the first die head and the second die head.

20. The method of claim 17 .

20. positioning die holding areas for the four die heads of a second cell with the same pitch as the die holding areas for the four die heads of the first cell.

20. The method of claim 19 .

21. The step of moving the docking station is performed during a pair of transfer movements; the plurality of die heads includes a first die head; the first device head is coupled to the support structure and is not moved when the first die chuck is moved; 16. The method of claim 15 .

22. separating a first die chuck from a first device head, where the plurality of die heads includes a first die head, the first die head including a first device head and a first die chuck, and prior to separation, the first die chuck has a first die holding area at a first position relative to the first device head; separating a second die chuck from a second device head, wherein the plurality of die heads includes a second die head, the second die head including a second device head and a second die chuck, and prior to separation, the second die chuck has a second die holding area at a second position relative to the second device head; coupling a third die chuck to the first device head, the third die chuck having a third die holding area at a third position relative to the first device head; coupling a fourth die chuck to the second device head, the fourth die chuck having a fourth die holding area at a fourth position relative to the second device head; prior to separation of the first die chuck and separation of the second die chuck, the first die retaining area and the second die retaining area have a first pitch; After coupling of the third die chuck and coupling of the fourth die chuck, the third die retaining area and the fourth die retaining area are at a second pitch different from the first pitch. A method comprising:

23. bonding a first die to a first destination substrate using the first die chuck; bonding a second die to the first destination substrate using the second die chuck; bonding a third die to a second destination substrate using the third die chuck; bonding a fourth die to the second destination substrate using the fourth die chuck; Here, before the separation of the first die chuck and the separation of the second die chuck, the first die is joined and the second die is joined; After the third die chuck is joined and the fourth die is joined, the third die is joined and the fourth die is joined.

23. The method of claim 22.

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