Processing method
The processing method addresses the inaccuracy in inspecting cutting grooves by using increased water volume or pressure to clean the groove before imaging, resulting in a more accurate assessment of the groove's state.
Patent Information
- Application Number
- JP2023198067
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-11-22
- Publication Date
- 2025-06-03
AI Technical Summary
Conventional methods for inspecting the state of a cutting groove in a workpiece are inaccurate due to the presence of cutting chips, which can obscure the groove's condition.
A processing method that includes holding the workpiece on a holding table, forming a cutting groove using a cutting blade with supplied cutting water, waiting for a predetermined time with the cutting blade in the groove to clean it with increased water volume or pressure, and then imaging the cleaned groove to determine its state.
This method allows for a more accurate assessment of the cutting groove's state by effectively removing cutting chips and providing a clearer image for inspection.
Smart Images

Figure 2025084283000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a processing method.
Background Art
[0002] In a processing method of forming a cutting groove in a workpiece, the state of the cutting groove may be inspected from an image obtained by imaging the cutting groove. The inspection of the state of the cutting groove is performed by holding an inspection piece on a processing table. Further, for more accurate inspection, there is provided an apparatus that processes an inspection piece held on an inspection table beside the processing table and rotates the inspection piece to image the cross-sectional shape of the cutting groove on the processing apparatus (see, for example, Patent Document 1 and Patent Document 2).
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] However, in a conventional method for processing a workpiece in which a cutting groove is formed in an object to be processed, when imaging the cutting groove to check the state of the cutting groove, if cutting chips are attached, there is a risk that the state of the cutting groove cannot be accurately grasped.
[0005] The present invention has been made in view of this point, and an object thereof is to provide a processing method for an object to be processed that can more accurately grasp the state of the cutting groove.
Means for Solving the Problems
[0006] The processing method of the present invention includes a holding step of holding an object to be processed on a holding table, a processing step of forming a cutting groove in the object to be processed held on the holding table by a cutting blade supplied with cutting water, a cleaning step of waiting for a predetermined time the cutting blade in the cutting groove with the cutting water supplied to the cutting blade and cleaning the cutting groove with the cutting water, an imaging step of imaging the cutting groove after the cleaning step, and a determination step of determining the state of the cutting groove from the captured image.
[0007] Further, the cutting water supplied in the cleaning step of the processing method of the present invention may have at least either a larger water volume or a higher water pressure than the cutting water supplied in the processing step.
[0008] Further, the holding table of the processing method of the present invention may be at least either a processing table having a processing holding surface for holding a workpiece or an inspection table adjacent to the processing table and having an inspection holding surface for holding an inspection piece.
[0009] Further, the inspection table of the processing method of the present invention has a rotation driving unit that rotates the inspection holding surface along a rotation axis parallel to the inspection holding surface, and the rotation driving unit moves the inspection holding surface between a processing position parallel to the processing holding surface and an imaging position that is orthogonal to the processing holding surface and images at least either a cross section on the processing start side or the processing end side of the cutting groove with an imaging unit. The processing step positions the inspection piece at the processing position and forms a cutting groove in the inspection piece such that a cross section is exposed at at least one end of the inspection piece in a direction orthogonal to the rotation axis. The imaging step may position the inspection holding surface at the imaging position and image the cross section of the cutting groove with the imaging unit.
[0010] Further, the inspection holding surface of the processing method of the present invention may include a first inspection holding surface capable of holding a first inspection piece and a second inspection holding surface orthogonal to the first inspection holding surface and capable of holding a second inspection piece.
Advantages of the Invention
[0011] According to the present invention, it is possible to provide a processing method for a workpiece that can more accurately grasp the state of a cutting groove.
Brief Description of the Drawings
[0012]
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Modes for Carrying Out the Invention
[0013] (Embodiment 1) The processing method according to Embodiment 1 of the present invention will be described with reference to the drawings. The processing method according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a processing apparatus for implementing the processing method according to Embodiment 1. FIG. 2 is a cross-sectional view showing an example of the chuck table and the inspection table of Embodiment 1. FIG. 3 is a cross-sectional view schematically showing the processing steps of the processing method of Embodiment 1. FIG. 4 is a cross-sectional view schematically showing the cleaning step of the processing method of Embodiment 1. FIG. 5 is a cross-sectional view schematically showing the imaging step of the processing method of Embodiment 1. FIG. 6 is a flowchart showing an example of the processing method of Embodiment 1.
[0014] The X-axis direction, Y-axis direction, and Z-axis direction shown in each figure are perpendicular to each other. The X-axis direction and the Y-axis direction are substantially horizontal directions, and the Z-axis direction is the vertical direction (up and down direction). In each figure, among the double-headed arrows indicating the X-axis direction, the +X side is the left side and the -X side is the right side. Among the double-headed arrows indicating the Y-axis direction, the -Y side is the front side and the +Y side is the rear side. Among the double-headed arrows indicating the Z-axis direction, the +Z side is the upper side and the -Z side is the lower side.
[0015] (Processing apparatus) The processing method according to Embodiment 1 is a method in which the processing apparatus 1 shown in FIG. 1 cuts the workpiece 200. The workpiece 200 is an example of a processing object. Cutting is an example of processing. In Embodiment 1, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer having a substrate 204 made of silicon, sapphire, gallium, or the like. In the workpiece 200, devices 203 are formed in regions partitioned in a grid pattern by a plurality of division planned lines 202 formed in a grid pattern on the surface 201 of the substrate 204.
[0016] Further, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer with a thinned central portion and a thick portion formed on the outer peripheral portion. In addition to the wafer, a rectangular package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, or a substrate containing at least one of nickel and iron may also be used. In Embodiment 1, a disk-shaped adhesive tape 210 having a diameter larger than that of the workpiece 200 is adhered to the back surface 205 of the substrate 204 of the workpiece 200, and an annular frame 211 is attached to the outer peripheral edge of the adhesive tape 210 and is supported by the annular frame 211.
[0017] The processing apparatus 1 shown in FIG. 1 is a cutting apparatus that holds the workpiece 200 on the chuck table 10 and cuts it with the cutting blade 21 along the division planned line 202 to divide it into individual chips 206. The chuck table 10 is an example of a holding table. Further, the chuck table 10 is an example of a processing table. The processing table is not limited to the chuck table 10, and may be a sub-chuck table for placing a small piece for dressing or a table for placing a silicon base for detecting the shape of the cutting groove.
[0018] The chip 206 includes a part of the substrate 204 and the device 203. As shown in FIG. 1, the processing apparatus 1 includes a table unit 2 having a chuck table 10 that clamps the workpiece 200 with an expansion drum 94 and a clamp portion 95 and sucks and holds it on the holding surface 11, a cutting unit 20 that cuts the workpiece 200 held by the chuck table 10 with the cutting blade 21, an imaging unit 30 that images the workpiece 200 held on the chuck table 10, and a control unit 100 that is a control means. The cutting unit 20 is an example of a processing unit. Although the cutting unit 20 that cuts with the cutting blade 21 is used as an example of the processing unit, it is not limited thereto, and a laser cutting unit (not shown) that cuts with a laser beam may be used.
[0019] Further, as shown in FIG. 1, the processing apparatus 1 includes at least an X-axis moving unit 31 that processes and feeds the chuck table 10, i.e., the table unit 2, in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 32 that indexes and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction, a Z-axis moving unit 33 that feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction, and a rotational moving unit 34 that rotates the chuck table 10 around an axis parallel to the Z-axis direction. As shown in FIG. 1, the processing apparatus 1 is a so-called facing dual-type cutting apparatus with two cutting units 20, i.e., a two-spindle dicing saw.
[0020] The chuck table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramic or the like. The holding surface 11 is an example of a processing holding surface. Further, the chuck table 10 is movably provided in the X-axis direction across the processing area below the cutting unit 20 by the X-axis moving unit 31 and the loading / unloading area where the workpiece 200 is loaded and unloaded away from below the cutting unit 20, and is rotatably provided around an axis parallel to the Z-axis direction by the rotational moving unit 34. The chuck table 10 has the holding surface 11 connected to a vacuum suction source (not shown), and sucks and holds the workpiece 200 placed on the holding surface 11 by being sucked by the vacuum suction source. In Embodiment 1, the chuck table 10 sucks and holds the back surface 205 side of the workpiece 200 via the adhesive tape 210.
[0021] In Embodiment 1, the chuck table 10 is provided on a table cover 3 that moves in the X-axis direction by the X-axis moving unit 31 of the table unit 2, and is rotatably supported around an axis by a rotational moving unit 34 that is movably provided in the X-axis direction by the X-axis moving unit 31. The upper surface of the table cover 3 is formed flat along the horizontal direction.
[0022] The cutting unit 20 is a cutting means detachably equipped with a cutting blade 21 for cutting a workpiece 200 held by a chuck table 10. The cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 32 and movable in the Z-axis direction by a Z-axis moving unit 33 with respect to the workpiece 200 held by the chuck table 10, respectively.
[0023] As shown in FIG. 1, one cutting unit 20 is provided on one column portion of a portal-shaped support frame 5 erected from the apparatus main body 4 via a Y-axis moving unit 32, a Z-axis moving unit 33, etc. The other cutting unit 20 is provided on the other column portion of the support frame 5 via a Y-axis moving unit 32, a Z-axis moving unit 33, etc. as shown in FIG. 1. The support frame 5 connects the upper ends of the column portions with a horizontal beam. For the drawings after FIG. 2, the description will be based on one cutting unit 20.
[0024] The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 32 and the Z-axis moving unit 33.
[0025] The cutting unit 20 is provided so as to be movable in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 32 and the Z-axis moving unit 33, and includes a mount 22 connected to a spindle 23, a spindle 23 rotatably provided around its axis within the mount 22, an annular cutting blade 21 mounted on the spindle 23 and fixed to the mount 22, and a cutting fluid supply nozzle 27 for supplying cutting fluid W to the cutting blade 21.
[0026] The cutting blade 21 is an extremely thin grinding wheel having a substantially ring shape. In Embodiment 1, the cutting blade 21 is a so-called hub blade, and includes an annular circular base made of a conductive metal and an annular cutting edge disposed on the outer peripheral edge of the circular base and cutting the workpiece 200. The cutting edge is formed to have a predetermined thickness from abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material (binder) such as metal or resin. The spindle 23 is rotated by a spindle motor (not shown) and is attached to the cutting blade 21 at its tip. Note that the axes of the spindle 23 of the cutting unit 20 and the cutting blade 21 are set parallel to the Y-axis direction.
[0027] When the workpiece 200 is cut with the cutting blade 21, cutting chips and machining heat are generated from the grinding wheel portion and the workpiece 200. Therefore, during the cutting of the workpiece 200 with the cutting blade 21 in the machining step described later, cutting water W composed of pure water or the like is sprayed from the cutting water supply nozzle 27 onto the cutting blade 21 and the workpiece 200. The cutting water W supplied from the cutting water supply nozzle 27 removes the cutting chips scattered on the workpiece 200 and removes the machining heat generated in the cutting blade 21 and the workpiece 200. The cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting blade 21 to wash the cutting blade 21 and contacts the cutting groove 45 to wash the cutting groove 45.
[0028] Furthermore, immediately after the workpiece 200 is cut by the cutting blade 21, cutting chips are generated from the grinding wheel portion and the workpiece 200. Even if the cutting groove 45 is imaged in this state to check the state of the cutting groove 45, if cutting chips are attached, it may be impossible to accurately grasp the state of the cutting groove 45. Therefore, in the first embodiment, after cutting the workpiece 200 with the cutting blade 21 in the cleaning step executed after the processing steps described later, with the cutting blade 21 waiting upward for a predetermined time, cutting water W composed of pure water or the like is sprayed from the cutting water supply nozzle 27 onto the cutting groove 45 cut in the workpiece 200. The cutting water W supplied from the cutting water supply nozzle 27 removes the cutting chips scattered in the cutting groove 45 of the workpiece 200. The cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting groove 45 and cleans the cutting groove 45. Thereby, the cutting chips attached to the cutting groove 45 can be washed, and the imaging unit 30 can more accurately grasp the state of the cutting groove 45.
[0029] The imaging unit 30 is fixed to one cutting unit 20 so as to move integrally with the one cutting unit 20. The imaging unit 30 includes an imaging element that images a region to be divided of the workpiece 200 before cutting held on the chuck table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element.
[0030] The imaging unit 30 images the workpiece 200 held on the chuck table 10 to obtain an image. The obtained image is used to perform alignment for aligning the workpiece 200 and the cutting blade 21. Further, the obtained image is used to determine whether the cutting blade 21 needs to be replaced when the workpiece 200 is cut by the cutting blade 21. The imaging unit 30 outputs the obtained image to the control unit 100.
[0031] In addition, the imaging unit 30 captures an image of the test piece 70 held on the inspection table 60 to obtain an image. The inspection table 60 is an example of a holding table. Specifically, the imaging unit 30 is orthogonal to the inspection holding surface 61 and captures a cross-section on either the machining start side or the machining end side of the cutting groove. The acquired image is used to determine whether the cutting blade 21 needs to be replaced when the test piece 70 is cut by the cutting blade 21. The imaging unit 30 outputs the acquired image to the control unit 100.
[0032] The X-axis movement unit 31 relatively feeds the chuck table 10 and the cutting unit 20 along the X-axis direction by moving the chuck table 10 of the table unit 2 in the X-axis direction, which is the machining feed direction. The Y-axis movement unit 32 relatively feeds the chuck table 10 and the cutting unit 20 along the Y-axis direction by moving the cutting unit 20 in the Y-axis direction, which is the indexing feed direction. The Z-axis movement unit 33 relatively feeds the chuck table 10 and the cutting unit 20 along the Z-axis direction by moving the cutting unit 20 in the Z-axis direction, which is the cutting feed direction.
[0033] The X-axis movement unit 31, the Y-axis movement unit 32, and the Z-axis movement unit 33 include a well-known ball screw rotatably provided around an axis, a well-known motor that rotates the ball screw around the axis of the rotating shaft 55, and a well-known guide rail that movably supports the chuck table 10 or the cutting unit 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction.
[0034] In addition, the processing apparatus 1 includes an X-axis direction position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, a Y-axis direction position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulses of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the positions of the chuck table 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. In the first embodiment, the positions of the components of the processing apparatus 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown).
[0035] In addition, the processing apparatus 1 includes a cassette elevator 40 on which a cassette (not shown) for accommodating the workpiece 200 before and after cutting is placed and which moves the cassette in the Z-axis direction, a cleaning unit 50 for cleaning the workpiece 200 after cutting, and a conveying unit (not shown) for taking the workpiece 200 in and out of the cassette and conveying the workpiece 200 between the cassette, the chuck table 10, and the cleaning unit 50.
[0036] In addition, the processing apparatus 1 includes an inspection table 60. The inspection table 60 is provided on the table cover 3 of the table unit 2 and is formed in a rectangular shape and composed of a metal material with a flat inspection holding surface 61 as shown in FIG. 2.
[0037] The inspection table 60 is installed adjacent to the chuck table 10. The inspection table 60 does not necessarily have to be installed adjacent to the chuck table 10, and it may be installed within a range where both the workpiece 200 held by the chuck table 10 and the inspection piece 70 held by the inspection table 60 can be processed by the cutting unit 20. Therefore, the inspection table 60 may be arranged independently of the chuck table 10, or may be connected to each other at the lower end of the apparatus main body 4.
[0038] In Embodiment 1, as shown in FIG. 2, the inspection table 60 includes an extension plate 51 extending leftward (+X-axis direction) below (-Z-axis direction) the chuck table 10, a support base 52 installed above (+Z-axis direction) the extension plate 51, a fixing base 53 placed above (+Z-axis direction) the support base 52, a holding portion 54 pivotally supported rotatably with respect to the fixing base 53, and a rotating shaft 55. The rotating shaft 55 is arranged along the Y-axis direction. The holding portion 54 is pivotally supported by the fixing base 53 by the rotating shaft 55 and is fixed rotatable about the Y-axis direction. The holding portion 54 is formed in an L-shaped cross section. An inspection holding surface 61 is arranged on the holding portion 54. The inspection table 60 is rotatably supported about an axis parallel to the Y-axis direction by a rotation drive unit 63 attached to the table cover 3. That is, the rotation drive unit 63 rotates the inspection holding surface 61 of the inspection table 60 along the rotating shaft 55 parallel to the inspection holding surface 61.
[0039] The rotation drive unit 63 rotates the inspection table 60 based on the driving force supplied from a drive source supply unit (not shown). The rotation drive unit 63 is formed by a motor and can rotate the inspection table 60 to an arbitrary rotation position. The rotation drive unit 63 formed by a motor can rotate the inspection table 60 to at least arbitrary three positions (3 positions). The rotation drive unit 63 is not limited to being formed by a motor and may be formed by an air cylinder. When the rotation drive unit 63 is formed by an air cylinder, the inspection table 60 can be rotated to at least arbitrary two positions (2 positions).
[0040] In Embodiment 1, the longitudinal direction of the inspection table 60 is parallel to the Y-axis direction. The inspection table 60 has an inspection piece 70 shown in FIG. 2 placed on the inspection holding surface 61. The inspection piece 70 is made of the same material as the substrate 204 of the workpiece 200 and is formed in a flat plate shape with a rectangular plane shape that is the same as the inspection holding surface 61.
[0041] The inspection table 60 has suction grooves (not shown) formed on the inspection holding surface 61 and connected to a vacuum suction source (not shown). The suction grooves are formed recessed from the inspection holding surface 61. The inspection table 60 sucks and holds the inspection piece 70 placed on the inspection holding surface 61 by being sucked by the vacuum suction source.
[0042] The cutting blade 21 cuts the inspection piece 70 from one end 71 in the leftward direction of the X-axis (+X-axis direction) to the other end 72 in the rightward direction (-X-axis direction) across the inspection piece 70 to form a cutting groove 80 in the inspection piece 70. One end 71 in the leftward direction of the X-axis (+X-axis direction) is called the machining start side, and the other end 72 in the rightward direction of the X-axis (-X-axis direction) is called the machining end side. The cutting groove 80 is an example of a cutting groove.
[0043] The chuck table 10 holds the back surface 205 side of the substrate 204 via the adhesive tape 210 by the holding surface 11. The clamp portion 95 clamps the annular frame 211 attached to the substrate 204 by the expansion drum 94.
[0044] As shown in FIGS. 1, 3 to 5, the processing apparatus 1 includes a spindle 23 that is generally parallel to the holding surface 11 and has a rotation axis that is generally perpendicular to the processing feed direction (X-axis direction). An annular cutting blade 21 in which abrasive grains are fixed with a binder is mounted on one end side (-Y-axis direction side) of the spindle 23. A rotation drive source (not shown) such as a motor is connected to the other end side (+Y-axis direction side) of the spindle 23, and the cutting blade 21 mounted on one end side of the spindle 23 rotates by the power of this rotation drive source.
[0045] The control unit 100 also controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.
[0046] The control unit 100 is connected to a display unit (not shown) constituted by a liquid crystal display device or the like that displays the state, image, etc. of the processing operation, an input unit used when an operator registers processing content information or the like, and the notification unit 101. The input unit is constituted by at least one of a touch panel provided on the display unit and an external input device such as a keyboard. The notification unit 101 emits at least one of sound and light to notify the operator.
[0047] As shown in FIG. 1, the control unit 100 of Embodiment 1 includes a normal image storage unit 102 and a determination unit 103. The normal image storage unit 102 stores a normal image (not shown) obtained by imaging, with an imaging unit 30, a cutting groove 45 (see FIGS. 3 to 5) formed in the workpiece 200 by cutting the workpiece 200 from one end to the other end along the X-axis direction with a normal cutting blade 21, as viewed from above from one end to the other end side of both ends in the X-axis direction. The mechanism of the normal image storage unit 102 is realized by the storage device.
[0048] The determination unit 103 determines whether the shape of the cutting groove 45 (see FIGS. 3 to 5) formed in the workpiece 200 is normal based on the captured image captured by the imaging unit 30. The determination unit 103 determines whether it is necessary to replace the cutting blade 21 or dress based on the cutting groove 45 formed by cutting the workpiece 200 with the cutting blade 21. The determination unit 103 determines whether it is necessary to replace the cutting blade 21 based on the shape of the cutting groove 45 in the captured image obtained by the imaging unit 30 that looks down on the cutting groove 45 formed by cutting the workpiece 200 with the cutting blade 21 from the upper side from one end side to the other end side. The function of the determination unit 103 is realized by the arithmetic processing unit executing the computer program stored in the storage device.
[0049] (Processing method) The processing method according to Embodiment 1 is a processing operation in which the processing apparatus 1 cuts the workpiece 200. In the processing method, an operator registers processing content information in the control unit 100 and places the workpiece 200 before cutting on the holding surface 11 facing upward above the chuck table 10. This is performed by the processing apparatus 1 when receiving an instruction to start the processing operation from the operator. When starting the processing operation, the processing apparatus 1 sucks and holds the workpiece 200 on the holding surface 11 of the chuck table 10. Before starting the processing operation, the workpiece 200 may be sucked and held on the holding surface 11 of the chuck table 10.
[0050] The processing method of Embodiment 1 is a processing method for the workpiece 200, and as shown in the flowchart of FIG. 6, includes a holding step ST11, a processing step ST12, a cleaning step ST13, an imaging step ST14, and a determination step ST15.
[0051] The timing at which the processing method is started is determined by the workpiece 200 to be cut, the material of the cutting edge of the cutting blade 21, and the like. The timing for determining whether or not the cutting blade 21 needs to be replaced is, for example, every time a single workpiece 200 is cut, or every time a predetermined number of workpieces 200 are cut, and is stored in the storage device of the control unit 100 as part of the processing content information. Further, in the present invention, the timing for determining whether or not the cutting blade 21 needs to be replaced may be every time a predetermined number of division planned lines 202 are cut, that is, even during the cutting process of the workpiece 200 held on the chuck table 10. In this case, the timing for determining whether or not the cutting blade 21 needs to be replaced may be every time all of one of the division planned lines 202 parallel to each other are cut.
[0052] When the control unit 100 of the processing apparatus 1 determines that it is the timing for determining whether or not the cutting blade 21 needs to be replaced, the processing method by the processing apparatus 1 according to Embodiment 1 is started.
[0053] (Holding step) FIG. 2 is a cross-sectional view schematically showing the holding step ST11 of the processing method shown in FIG. 6. In the holding step ST11 of Embodiment 1, when the processing method is started, the chuck table 10 of the processing apparatus 1 clamps the workpiece 200 by the clamp portion 95 and the expansion drum 94, and sucks it onto the holding surface 11 to hold the workpiece 200, which is the object to be processed, on the chuck table 10. Thereby, the workpiece 200 can be stably held on the chuck table 10, and the processing on the workpiece 200 can be accurately performed.
[0054] (Processing step) FIG. 3 is a cross-sectional view schematically showing the processing step ST12 of the processing method of Embodiment 1 shown in FIG. 6. In the processing step ST12 of Embodiment 1, the cutting water supply nozzle 27 of the processing apparatus 1 injects the cutting water W, and the cutting water W is supplied to the cutting blade 21. The processing apparatus 1 moves downward (-Z-axis direction) so that the cutting blade 21 supplied with the cutting water W contacts the workpiece 200. Then, the processing apparatus 1 forms a cutting groove 45 in the workpiece 200 held on the chuck table 10 by moving the cutting blade 21 supplied with the cutting water W in parallel along the X-axis direction from the +X-axis side to the -X-axis side.
[0055] (Cleaning Step) FIG. 4 is a cross-sectional view schematically showing the cleaning step ST13 of the processing method of Embodiment 1 shown in FIG. 6. In the cleaning step ST13 of Embodiment 1, the processing apparatus 1 waits for a predetermined time at a position where the cutting blade 21 is separated from the cutting groove 45 by a predetermined distance with the cutting water W supplied to the cutting blade 21, and cleans the cutting groove 45 with the cutting water W. At this time, the cutting blade 21 may or may not be rotating.
[0056] As shown in FIG. 4, in the cleaning step ST13, the cutting blade 21 used for cutting in the processing step ST12 is retracted upward (+Z-axis direction) from the cutting groove 45 for a predetermined time. The predetermined time can be arbitrarily set by the operator of the processing apparatus 1. For example, an arbitrary value such as from 0.1 second to 10.0 seconds can be set in advance. Also, although the cutting blade 21 is retracted upward, this is not limiting, and it may be retracted to the right, left, or below the cutting groove 45. In the embodiment of FIG. 4, the cutting water supply nozzle 27 moves upward following when the cutting blade 21 is retracted upward. Note that the cutting water supply nozzle 27 is not limited to the embodiment of FIG. 4, and may be arranged at a position where the cutting groove 45 formed in the workpiece 200 can be cleaned when the cutting blade 21 is retracted upward, and does not have to move upward following the cutting blade 21.
[0057] Even when the cutting blade 21 is retracted above the cutting groove 45, the supply of the cutting water W to the cutting blade 21 continues. Therefore, the cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting blade 21 and also contacts the cutting groove 45 formed in the workpiece 200. For this reason, the cutting water W supplied from the cutting blade 21 can wash the cutting blade 21 and also can wash the cutting groove 45 formed in the workpiece 200. In the cleaning step ST13, only the cutting groove 45 formed in the workpiece 200 may be cleaned without cleaning the cutting blade 21 with the cutting water W supplied from the cutting blade 21. By cleaning the cutting groove 45 with the cutting water W, contamination (hereinafter also referred to as "contami") can be reduced.
[0058] After cutting, since the cutting chips scatter around, contamination occurs, which is not preferable. By the way, during cutting, since the cutting water W supplied from the cutting water supply nozzle 27 hits the cutting blade 21 rotating at high speed, the contaminated cutting water W is likely to scatter around. When the scattered cutting water W adheres to the surface 201 of the substrate 204 of the workpiece 200, the substrate 204 and the like are contaminated by the cutting chips. In particular, when the contaminated cutting water W dries after adhesion, it becomes difficult to remove the cutting chips from the workpiece 200. Therefore, when cutting chips are attached to the cutting water W during cutting, there is a risk that the state of the cutting groove 45 cannot be accurately recognized. Therefore, in the first embodiment, the cleaning step ST13 is carried out after the processing step ST12 and before the imaging step ST14. Thereby, adhesion of cutting chips to the workpiece 200 can be prevented, and an imaging image can be formed in a state without contamination, so that the state of the cutting groove 45 can be grasped more accurately.
[0059] Note that the cutting fluid W supplied in the cleaning step ST13 of Embodiment 1 is controlled so that at least one of the amount of water or the water pressure is greater than that of the cutting fluid W supplied in the machining step ST12. Increasing the amount of water or the water pressure in the machining step ST12 may cause contaminants to scatter easily, chips to move easily, and may have an adverse effect on the machining quality, or may increase the water consumption by supplying more water than necessary. On the other hand, if the amount of water or the water pressure is suitable for the machining step ST12, there is a risk that it may be insufficient for cleaning. In Embodiment 1 of the present invention, in the cleaning step ST13, with the amount of water or the water pressure being larger than that in the machining step ST12, contaminants are more easily removed. As a result, the machining quality can be improved without reducing the machining quality and without increasing the machining cost, and the efficiency of removing contaminants in the cleaning step ST13 can be improved.
[0060] (Imaging step) FIG. 5 is a cross-sectional view schematically showing the imaging step of the machining method of Embodiment 1 shown in FIG. 6. The imaging step ST14 of Embodiment 1 is a step of imaging the upper surface of the workpiece 200 with the imaging unit 30 after performing the cleaning step ST13 to form an imaging image including the cutting groove 45.
[0061] In Embodiment 1, in the imaging step ST14, the machining apparatus 1 moves on the XY plane composed of the X-axis direction and the Y-axis direction so that the imaging unit 30 is disposed at a position above the cutting groove 45 (+Z-axis direction). By disposing the imaging unit 30 at a position above the cutting groove 45, it is possible to image the upper surface shape overlooking the cutting groove 45 including from one end to the other end of the cutting groove 45 of the workpiece 200. The imaging unit 30 can image the upper surface of the workpiece 200 overlooking from one end to the other end to obtain an imaging image. When the imaging step ST14 is completed, the process proceeds to the determination step ST15.
[0062] (Determination step) The determination step ST15 in Embodiment 1 is a step of determining the state of the cutting blade 21 based on the shape of the cutting groove 45 such as the inclination, tip shape, width, and tip position detected by image-processing the captured image captured in the imaging step ST14. For example, based on the determination result of the determination step ST15, it is possible to determine whether or not the cutting blade 21 needs to be replaced. Note that the determination is not limited to determining whether or not the cutting blade 21 needs to be replaced based on the determination result of the determination step ST15. For example, based on the determination result of the determination step ST15, it may be determined whether or not the dressing of the cutting blade 21 is necessary.
[0063] In Embodiment 1, in the determination step ST15, a normal image of the cutting groove 45 (not shown) is superimposed on the captured image captured in the imaging step ST14. In Embodiment 1, the upper end of the cutting groove 45 in the normal image is superimposed on the upper end of the cutting groove 45 in the captured image. In Embodiment 1, in the determination step ST15, the control unit 100 detects the distance between the inner surface of the cutting groove 45 in the captured image captured in the imaging step ST14 and the inner surface of the cutting groove 45 in the normal image, and if it is determined that the detected distance is equal to or less than a predetermined allowable value, it is determined that replacement of the cutting blade 21 is unnecessary, and the process returns to the holding step ST11. Thus, in Embodiment 1, in the determination step ST15, the control unit 100 determines whether or not the cutting blade 21 needs to be replaced based on the inclination of the inner surface of the cutting groove 45 detected from the captured image captured in the imaging step ST14.
[0064] In Embodiment 1, in determination step ST15, when the control unit 100 determines that the detected distance exceeds a predetermined allowable value, it determines that the replacement of the cutting blade 21 is necessary, operates the notification unit 101 to give a notification, and ends the machining operation, that is, the machining method according to Embodiment 1. In the present invention, the method for determining whether or not to replace the cutting blade 21 in determination step ST15 is not limited to that described in Embodiment 1, and the contour of the cutting groove 45 in the normal image may be compared with the contour of the cutting groove 45 in the captured image captured in imaging step ST14, or the inner surface of the cutting groove 45 in the captured image captured in imaging step ST14 may be compared with the virtual line of the inner surface of the ideal cutting groove 45. In the determination step, instead of comparing with the normal image, a threshold value may be set for each measurement item, and the quality may be determined by comparing with the threshold value.
[0065] As described above, the machining method of the machining apparatus 1 according to Embodiment 1 forms a cutting groove 45 in the workpiece 200 held on the chuck table 10 by the cutting blade 21 supplied with the cutting water W in machining step ST12, and in cleaning step ST13, with the cutting water W supplied to the cutting blade 21, the cutting blade 21 is made to wait at a position a predetermined distance away from the cutting groove 45 for a predetermined time, and the cutting groove 45 is cleaned with the cutting water W. After cleaning step ST13, an imaging step of imaging the cutting groove 45 is carried out. Then, based on the shape and position including the inclination, tip shape, and width of the inner surface of the cutting groove 45 detected from the captured image captured and formed in imaging step ST14, it is determined whether or not to replace the cutting blade 21 and whether or not dressing is necessary. As a result, it is possible to confirm the entire image including one end to the other end of the cutting groove 45. As a result, by carrying out cleaning step ST13 after machining step ST12 and before imaging step ST14, the machining method of the machining apparatus 1 can prevent the adhesion of cutting chips to the workpiece 200 and form a captured image in a contamination-free state, so that the state of the cutting groove 45 can be grasped more accurately, and it is possible to suppress the situation of continuously manufacturing defective chips 206 by determining the replacement timing of the cutting blade 21 more easily than in the past.
[0066] In the above-described Embodiment 1, the processing apparatus 1 performs the determination step ST15, but this is not the only case. The processing apparatus 1 may perform a cutting edge position detection step instead of the determination step ST15. In the cutting edge position detection step, the position of the cutting edge of the current cutting blade 21 (hereinafter also referred to as the "cutting edge position") can be accurately measured and detected. For example, based on the cutting edge position detected in the cutting edge position detection step, the processing apparatus 1 can perform measurement of the cutting edge position, that is, measurement of the wear amount of the cutting blade 21, such as correcting to increase the cutting depth corresponding to the wear of the cutting edge of the cutting blade 21.
[0067] (Embodiment 2) The processing method according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 7 is a cross-sectional view schematically showing the processing steps of the processing method of Embodiment 2. FIG. 8 is a cross-sectional view schematically showing the cleaning step of the processing method of Embodiment 2. FIG. 9 is a cross-sectional view schematically showing the imaging step of the processing method of Embodiment 2. FIG. 10 is a diagram showing an example of the determination step of the processing method of Embodiment 2. The processing method of the processing apparatus 1 according to Embodiment 2 is a method in which the processing apparatus 1 shown in FIG. 1 cuts the test piece 70. The test piece 70 is an example of an object to be processed. Note that FIGS. 7, 8, and 9 are given the same reference numerals as the same parts in Embodiment 1, and the description thereof is omitted.
[0068] (Processing Apparatus) When the test piece 70 is cut with the cutting blade 21, cutting chips and processing heat are generated from the grindstone portion and the test piece 70. Therefore, while the test piece 70 is being cut with the cutting blade 21 in the processing step ST12, cutting water W composed of pure water or the like is sprayed from the cutting water supply nozzle 27 onto the cutting blade 21 and the test piece 70. The cutting water W supplied from the cutting water supply nozzle 27 removes the cutting chips scattered on the test piece 70 and removes the processing heat generated in the cutting blade 21 and the test piece 70. The cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting blade 21 to clean the cutting blade 21 and contacts the cutting groove 80 to clean the cutting groove 80.
[0069] Furthermore, immediately after the inspection piece 70 is cut by the cutting blade 21, cutting chips are generated from the grinding wheel portion and the inspection piece 70. Even if the cutting groove 80 is imaged in this state to check the state of the cutting groove 80, if cutting chips are attached, it may be impossible to accurately grasp the state of the cutting groove 80. Therefore, in the second embodiment, after the inspection piece 70 is cut by the cutting blade 21 in the cleaning step ST13 executed after the processing step ST12, with the cutting blade 21 waiting upward for a predetermined time, cutting water W composed of pure water or the like is sprayed from the cutting water supply nozzle 27 onto the cutting groove 80 cut in the inspection piece 70. The cutting water W supplied from the cutting water supply nozzle 27 removes the cutting chips scattered in the cutting groove 80 of the inspection piece 70. The cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting groove 80 and cleans the cutting groove 80. Thereby, the cutting chips attached to the cutting groove 80 can be washed, and the imaging unit 30 can more accurately grasp the state of the cutting groove 80.
[0070] As shown in FIG. 1, the control unit 100 of the second embodiment includes a normal image storage unit 102 and a determination unit 103. The normal image storage unit 102 stores the normal image shown in FIG. 10 obtained by imaging, with the imaging unit 30, the cutting groove 80 formed in the inspection piece 70 by cutting the inspection piece 70 across from one end 71 to the other end 72 in the X-axis direction by a normal cutting blade 21, from the side surface on one end 71 side of the both ends 71, 72. In the normal image, the inner surface 81, which is the side wall of the cutting groove 80, is orthogonal to the surface 73 of the inspection piece 70. Further, the normal image storage unit 102 stores a predetermined distance 301 from the surface 201 to the bottom of the inspection piece 70 of the cutting groove 80 in the normal image. The predetermined distance 301 is the distance from the deepest part of the cutting groove 80 to the surface 201. The predetermined distance 301 is the distance that defines a determination position 302 for determining whether the cutting blade 21 needs to be replaced when the inspection piece 70 is cut by the cutting blade 21. The mechanism of the normal image storage unit 102 is realized by a storage device. Although the processing device 1 makes a determination based on the normal image, this is not the only case. The processing device 1 may determine whether the cutting blade 21 needs to be replaced by comparing a predetermined threshold value with the predetermined distance 301.
[0071] The determination unit 103 determines whether the shape of the cutting groove 80 formed in the test piece 70 is normal based on the captured image captured by the imaging unit 30. The determination unit 103 determines whether it is necessary to replace the cutting blade 21 based on the cutting groove 80 formed by cutting the test piece 70 with the cutting blade 21. The determination unit 103 determines whether it is necessary to replace the cutting blade 21 based on the inclination of the inner surface 81 of the cutting groove 80 in the captured image 300 obtained by the imaging unit 30 capturing the cutting groove 80 formed by cutting the test piece 70 with the cutting blade 21 from the side surface on the one end 71 side. The function of the determination unit 103 is realized by the arithmetic processing unit executing a computer program stored in the storage device.
[0072] In the second embodiment, the inspection table 60 is rotatably supported about an axis parallel to the Y-axis direction by a rotation drive unit 63 attached to the table cover 3. In the second embodiment, the rotation drive unit 63 rotates the inspection table 60 by 90 degrees each between the machining position shown in FIGS. 7 and 8 where the inspection holding surface 61 faces upward (+Z-axis direction) and the imaging position shown in FIG. 9 where one end 71 of the inspection holding surface 61 faces upward (+Z-axis direction).
[0073] At the machining position, the inspection holding surface 61 is in a position parallel to the holding surface 11. At the imaging position, it is orthogonal to the holding surface 11 and is in a position where the imaging unit 30 can image the cross-section on the machining end side of the cutting groove 80. One end 71 and the other end 72 of the inspection holding surface 61 are arranged at positions facing each other.
[0074] As shown in FIG. 7, the rotation drive unit 63 positions the inspection holding surface 61 at the machining position and lowers the cutting blade 21 of the cutting unit 20 downward (-Z-axis direction). Then, the machining apparatus 1 forms a cutting groove 80 in the test piece 70 held on the inspection table 60 with the cutting blade 21 supplied with cutting water W by the cutting water supply nozzle 27.
[0075] As shown in FIG. 8, with the cutting fluid W supplied to the cutting blade 21, the cutting blade 21 is retracted from the cutting groove 80 for a predetermined time, and the cutting groove 80 is washed with the cutting fluid W. The predetermined time is an arbitrarily set time. The operator of the processing apparatus 1 can perform the washing with the cutting fluid W more accurately and reduce contamination by increasing the predetermined time. On the other hand, the operator of the processing apparatus 1 can shorten the time for implementing the processing method and improve the operating efficiency of the processing apparatus 1 by shortening the predetermined time. The retraction of the cutting blade 21 can be retracted above the cutting groove 80 (+Z-axis direction). The retraction of the cutting blade 21 may be retracted not only above the cutting groove 80 but also to the left (+X-axis direction), right (-X-axis direction), and below (-Z-axis direction). Therefore, in the second embodiment, even when the inspection piece 70 is not being cut by the cutting blade 21, the cutting fluid supply nozzle 27 supplies the cutting fluid W to the cutting blade 21 to wash the cutting groove 80.
[0076] As shown in FIG. 8, after washing the cutting groove 80, the rotation drive unit 63 rotates the inspection holding surface 61 90 degrees clockwise to the imaging position, and the imaging unit 30 images the cutting groove 80.
[0077] By rotating the inspection holding surface 61 from the processing position to the imaging position rotated 90 degrees clockwise, the rotation drive unit 63 can direct the processing start side of the inspection piece 70 upward (+Z-axis direction). Thereby, the cross-sectional shape of the cutting groove 80 on the processing start side of the inspection piece 70 can be imaged by the imaging unit 30 arranged above. The processing start side is the cutting-in side of the cutting blade 21.
[0078] Depending on the material and processing method of the inspection piece 70, there are some cases where burrs, cracks, or chipping are likely to occur on the processing start side. Therefore, depending on the material and processing method of the inspection piece 70, there may be a case where it is desired to confirm the cross-sectional shape of the processing start side. Thus, in Embodiment 2, by rotating the inspection holding surface 61 clockwise by 90 degrees by the rotation driving unit 63, the cross-sectional shape of the cutting groove 80 on the processing start side of the inspection piece 70 is imaged by the imaging unit 30, so that the cross-sectional shape of the processing start side can be confirmed.
[0079] (Processing method) The processing method according to Embodiment 2 is a processing operation in which the processing device 1 cuts the inspection piece 70. In the processing method, an operator registers processing content information in the control unit 100 and places the inspection piece 70 before cutting on the inspection holding surface 61 facing above the inspection table 60. This is carried out when the processing device 1 receives an instruction to start the processing operation from the operator. When starting the processing operation, the processing device 1 sucks and holds the inspection piece 70 on the inspection holding surface 61 of the inspection table 60. Before starting the processing operation, the inspection piece 70 may be sucked and held on the inspection holding surface 61 of the inspection table 60.
[0080] The processing method of Embodiment 2 is a processing method of the inspection piece 70, and as shown in the same flowchart of FIG. 6 in Embodiment 1, it includes a holding step ST11, a processing step ST12, a cleaning step ST13, an imaging step ST14, and a determination step ST15.
[0081] When the control unit 100 of the processing device 1 determines that it is the timing to determine whether the cutting blade 21 needs to be replaced, the processing method by the processing device 1 in Embodiment 1 is started.
[0082] (Holding step) In the holding step ST11 of Embodiment 2, when the processing method is started, the inspection table 60 of the processing device 1 sucks on the inspection holding surface 61 and holds the inspection piece 70, which is the object to be processed, on the inspection table 60. Thereby, the inspection piece 70 can be stably held on the inspection table 60, and the processing on the inspection piece 70 can be accurately performed.
[0083] (Processing step) FIG. 7 is a cross-sectional view schematically showing a processing step ST12 of the processing method according to Embodiment 2 shown in FIG. 6. In the processing step ST12 of Embodiment 2, the cutting fluid supply nozzle 27 of the processing apparatus 1 injects the cutting fluid W, and the cutting fluid W is supplied to the cutting blade 21. The processing apparatus 1 moves downward (-Z-axis direction) so that the cutting blade 21 supplied with the cutting fluid W contacts the test piece 70. Then, the processing apparatus 1 forms a cutting groove 80 in the test piece 70 held on the inspection table 60 by moving the cutting blade 21 supplied with the cutting fluid W in the X-axis direction from the +X-axis side to the -X-axis side in parallel. In the processing step ST12 of Embodiment 2, the test piece 70 is positioned at the processing position, and a cutting groove 80 is formed in the test piece 70 such that at least one end of the test piece 70 has a cross section exposed in a direction (X-axis direction) orthogonal to the rotation axis 55 of the inspection table 60.
[0084] In the processing step ST12 of Embodiment 2, the rotation drive unit 63 rotates to the processing position shown in FIG. 7 where the inspection holding surface 61 faces upward (+Z-axis direction). In the processing step ST12, the inspection table 60 is sucked and held, and the test piece 70 and the cutting edge of the cutting blade 21 are aligned. As shown in FIG. 7, the processing apparatus 1 cuts the test piece 70 with the cutting blade 21 while supplying the cutting fluid W from the cutting fluid supply nozzle 27 to the cutting blade 21, and relatively moves the test piece 70 and the cutting unit 20 along the X-axis direction, and cuts from one end 71 on the left side (+X-axis direction) to the other end 72 on the right side (-X-axis direction) in the X-axis direction to form a cutting groove 80 in the test piece 70. In Embodiment 2, the cutting groove 80 is formed from one end 71 to the other end 72 of the test piece 70 in the X-axis direction. However, in the present invention, the cutting may not be completed from one end 71 to the other end 72, but may be cut halfway from one end 71 toward the other end 72 side, and the cutting blade 21 may be raised. Also, in Embodiment 2, the cutting groove 80 is formed from one end 71 to the other end 72 of the test piece 70 in the X-axis direction. However, the cutting groove 80 may be formed from the other end 72 to the one end 71 of the test piece 70 in the X-axis direction. When the processing step ST12 is completed, the process proceeds to the cleaning step ST13.
[0085] (Washing step) FIG. 8 is a cross-sectional view schematically showing the washing step ST13 of the processing method of Embodiment 2 shown in FIG. 6. In the washing step ST13 of Embodiment 2, the processing apparatus 1 waits for a predetermined time with the cutting water W supplied to the cutting blade 21 in the cutting groove 80, and washes the cutting groove 80 with the cutting water W.
[0086] As shown in FIG. 8, in the washing step ST13, the cutting blade 21 used for cutting in the processing step ST12 is retracted above the cutting groove 80 (+Z-axis direction) and waits for a predetermined time. Also, although the cutting blade 21 is retracted upward, this is not the only case, and it may be retracted to the right, left, or below the cutting groove 80. In the embodiment of FIG. 8, the cutting water supply nozzle 27 moves upward following the retraction of the cutting blade 21 upward. Note that the cutting water supply nozzle 27 is not limited to the embodiment of FIG. 8, and may be arranged at a position where the cutting groove 80 formed in the inspection piece 70 can be washed when the cutting blade 21 is retracted upward, and does not have to move upward following the cutting blade 21.
[0087] Even in a state where the cutting blade 21 is retracted above the cutting groove 80, the supply of the cutting water W to the cutting blade 21 is continuously performed. Therefore, the cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting blade 21 and also contacts the cutting groove 80 formed in the inspection piece 70. For this reason, the cutting blade 21 can be washed with the cutting water W supplied from the cutting blade 21, and the cutting groove 80 formed in the inspection piece 70 can be washed. Note that in the washing step ST13, only the cutting groove 80 formed in the inspection piece 70 may be washed without washing the cutting blade 21 with the cutting water W supplied from the cutting blade 21. By washing the cutting groove 80 with the cutting water W, contamination can be reduced.
[0088] After cutting, if the scattered cutting fluid W adheres to the surface of the inspection piece 70, the inspection piece 70 will be contaminated by the cutting chips. In particular, if the contaminated cutting fluid W dries after adhesion, it will be difficult to remove the cutting chips from the inspection piece 70. Therefore, if cutting chips are attached to the cutting fluid W during cutting, there is a risk that the state of the cutting groove 80 cannot be accurately recognized. Therefore, in the second embodiment, after the processing step ST12 and before the imaging step ST14, a cleaning step ST13 is implemented. As a result, adhesion of cutting chips to the inspection piece 70 can be prevented, and an imaging image 300 can be formed in a contamination-free state, so that the state of the cutting groove 80 can be grasped more accurately.
[0089] (Imaging Step) FIG. 9 is a cross-sectional view schematically showing the imaging step ST14 of the processing method of the second embodiment shown in FIG. 6. The imaging step ST14 of the second embodiment is a step of imaging the side surface of one end 71 side or the other end 72 side of the inspection piece 70 after performing the cleaning step ST13 to form an imaging image 300 including the cutting groove 80.
[0090] In the second embodiment, in the imaging step ST14, the processing apparatus 1 rotates the inspection table 60 90 degrees clockwise around the axis of the rotation shaft 55 from the state of the processing position, so that one end 71 of the inspection holding surface 61 faces upward (+Z-axis direction) as shown in FIG. 9. By positioning the inspection table 60 at the imaging position, the processing start side of the inspection piece 70 can be directed upward (+Z-axis direction). Thereby, the cross-sectional shape of the cutting groove 80 on the processing start side of the inspection piece 70 can be imaged by the imaging unit 30 arranged above. An imaging image 300 shown in FIG. 10 can be obtained by imaging the side surface of the processing start side of the inspection piece 70 with the imaging unit 30.
[0091] When checking the cross-sectional shape of the end side of the cutting groove 80, the positions of one end 71 and the other end 72 of the inspection table 60 in the X-axis direction may be rotated 180 degrees and swapped in the X-axis direction. The method of rotating 180 degrees and swapping the positions of one end 71 and the other end 72 of the inspection table 60 in the X-axis direction may be executed by a robot hand (not shown) or manually.
[0092] Also, although not shown, in Embodiment 2, in the imaging step ST14, the processing apparatus 1 may rotate the inspection table 60 counterclockwise by 90 degrees around the axis of the rotation drive unit 63 from the state of the imaging position to an imaging position (second imaging position) where the other end 72 of the inspection holding surface 61 faces upward (+Z-axis direction). By setting the inspection table 60 to the second imaging position, the end side of the inspection piece 70 where processing is completed can be directed upward (+Z-axis direction). Thereby, the cross-sectional shape of the cutting groove 80 on the end side where processing of the inspection piece 70 is completed can be imaged by the imaging unit 30 arranged above. An imaging image 300 shown in FIG. 4 can be obtained by imaging the side surface of the end side where processing of the inspection piece 70 is completed with the imaging unit 30. When the imaging step ST14 ends, the process proceeds to the determination step ST15.
[0093] (Determination step) FIG. 10 is a diagram showing an example of the determination step ST15 of the processing method according to Embodiment 2 shown in FIG. 6. The determination step ST15 is a step of determining the quality of the cutting groove 80 detected by image processing the imaging image 300. The determination step ST15 is a step of determining whether or not to replace the cutting blade 21 or whether or not dressing is required based on, for example, the inclination, tip shape, width, position, etc. of the inner surface 81 of the cutting groove 80 based on the determination result.
[0094] In Embodiment 2, in determination step ST15, a cutting groove 80 of a normal image (not shown) is superimposed on the captured image 300. In Embodiment 2, the upper end of the cutting groove 80 of the normal image is superimposed on the upper end of the cutting groove 80 of the captured image 300. In Embodiment 2, in determination step ST15, the control unit 100 detects the distance between the inner surface 81 of the cutting groove 80 of the captured image 300 at the determination position 302 and the inner surface 81 of the cutting groove 80 of the normal image. When it is determined that the detected distance is equal to or less than a predetermined allowable value, it is determined that replacement of the cutting blade 21 is unnecessary, and the process returns to holding step ST11. Thus, in Embodiment 2, in determination step ST15, the control unit 100 determines whether or not to replace the cutting blade 21 based on the inclination of the inner surface 81 of the cutting groove 80 detected from the captured image 300.
[0095] In Embodiment 2, in determination step ST15, when the control unit 100 determines that the detected distance exceeds a predetermined allowable value, it is determined that replacement of the cutting blade 21 is necessary, the notification unit 101 is operated to give a notification, and the machining operation, that is, the machining method according to Embodiment 2, is terminated. Note that in the present invention, the method for determining whether or not to replace the cutting blade 21 in determination step ST15 is not limited to that described in Embodiment 2, and the contour of the cutting groove 80 of the normal image may be compared with the contour of the cutting groove 80 of the captured image 300, or the inner surface 81 of the cutting groove 80 of the captured image 300 may be compared with a virtual line of the inner surface of an ideal cutting groove 80. Further, instead of the normal image or the virtual line, comparison may be made with a threshold value of each measurement item.
[0096] As described above, the machining method and the machining apparatus 1 according to Embodiment 2 form a cutting groove 80 in the test piece 70 and image the side surfaces of the test piece 70 on the machining start side and the machining end side. Whether or not to replace the cutting blade 21 is determined based on the inclination of the inner surface 81 of the cutting groove 80 detected from the captured image 300 that has been imaged and formed. Thereby, it is possible to confirm the cross-sectional shape of either the machining start side or the machining end side of the cutting groove 80. As a result, the machining method and the machining apparatus 1 have the effect of being able to more easily determine the replacement timing of the cutting blade 21 than in the past and suppressing the continuous production of defective chips 206.
[0097] In addition, since the rotary drive unit 63 can be configured by an air cylinder that can be positioned at only two positions, cost reduction can be achieved compared to a configuration using a motor. Further, since the direction of rotating the inspection table 60 only needs to be 90 degrees and the moving range is narrow, it can be realized in a small installation space, and the processing apparatus 1 can be downsized.
[0098] (Embodiment 3) The processing method according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 11 is a cross-sectional view schematically showing the processing steps of the processing method of Embodiment 3. FIG. 12 is a cross-sectional view schematically showing the cleaning steps of the processing method of Embodiment 3. FIG. 13 is a cross-sectional view schematically showing the imaging steps of the processing method of Embodiment 3. Note that the same reference numerals are given to the same parts as in Embodiments 1 and 2, and the description thereof will be omitted.
[0099] In Embodiment 3, the inspection table 60 is rotatably supported by a rotary drive unit 63 about an axis parallel to the Y-axis direction. The inspection table 60 of Embodiment 3 includes a first inspection holding surface 611 and a second inspection holding surface 612. The first inspection holding surface 611 and the second inspection holding surface 612 are examples of inspection holding surfaces. The first inspection holding surface 611 and the second inspection holding surface 612 are orthogonal to each other. The first inspection holding surface 611 holds the first inspection piece 701. The second inspection holding surface 612 holds the second inspection piece 702. The first inspection piece 701 is an example of a first inspection piece. The second inspection piece 702 is an example of a second inspection piece. The first inspection holding surface 611 is arranged along the X-axis direction, the second inspection holding surface 612 is arranged along the Z-axis direction, and is orthogonal to the first inspection holding surface 611.
[0100] In Embodiment 3, the rotation drive unit 63 rotates the inspection table 60 by 90 degrees between the first position shown in FIG. 13 where the first inspection holding surface 611 faces upward (+Z-axis direction) and the second inspection holding surface 612 faces leftward (+X-axis direction), and the second position shown in FIGS. 11 and 12 where the second inspection holding surface 612 faces upward (+Z-axis direction) and the second inspection holding surface 612 faces rightward (-X-axis direction).
[0101] In FIG. 13, the first position is an example of the machining position of the first inspection holding surface 611. At the first position, the first inspection holding surface 611 is in a position parallel to the holding surface 11, and the second inspection holding surface 612 is in a position orthogonal to the holding surface 11. In FIG. 12, the second position is an example of the imaging position of the first inspection holding surface 611. At the second position, it is orthogonal to the holding surface 11 and is in a position where the imaging unit 30 can image the cross-section on the machining start side of the first cutting groove 801 of the first inspection piece 701. The first cutting groove 801 is an example of a cutting groove.
[0102] In FIG. 11, the second position is an example of the machining position of the second inspection holding surface 612. At the second position, the second inspection holding surface 612 is in a position parallel to the holding surface 11, and the first inspection holding surface 611 is in a position orthogonal to the holding surface 11. In FIG. 13, the first position is an example of the imaging position of the second inspection holding surface 612. At the first position, it is orthogonal to the holding surface 11 and is in a position where the imaging unit 30 can image the cross-section on the machining end side of the second cutting groove 802 of the second inspection piece 702. The second cutting groove 802 is an example of a cutting groove. One end 71 and the other end 72 of the first inspection holding surface 611 are arranged at positions facing each other.
[0103] By setting the first inspection holding surface 611 to the first position, the rotation drive unit 63 can cause the cutting blade 21 of the cutting unit 20 to cut the first inspection piece 701 held on the first inspection holding surface 611.
[0104] The rotation drive unit 63 can direct the machining start side of the first inspection piece 701 upward (+Z-axis direction) by rotating the first inspection holding surface 611 from the first position to the second position 90 degrees clockwise. Thereby, the imaging unit 30 disposed above can image the cross-sectional shape of the first cutting groove 801 on the machining start side of the first inspection piece 701. The machining start side is the side where the cutting blade 21 enters.
[0105] Also, as shown in FIG. 11, the rotation drive unit 63 can cut the second inspection piece 702 held on the second inspection holding surface 612 with the cutting blade 21 of the cutting unit 20 by setting the second inspection holding surface 612 to the second position.
[0106] The rotation drive unit 63 can direct the machining end side of the second inspection piece 702 upward (+Z-axis direction) by rotating the second inspection holding surface 612 from the second position to the first position 90 degrees counterclockwise. Thereby, the imaging unit 30 disposed above can image the cross-sectional shape of the second cutting groove 802 on the machining end side of the second inspection piece 702. The machining end side is the side where the cutting blade 21 exits.
[0107] Depending on the material and machining method of the first inspection piece 701 and the second inspection piece 702, there are those where burrs, cracks, or chipping are likely to occur on the machining start side, and those where burrs, cracks, or chipping are likely to occur on the machining end side. Therefore, depending on the material and machining method of the inspection piece, there may be a case where it is desired to confirm the cross-sectional shape of the machining start side and / or the cross-sectional shape of the machining end side. Therefore, in Embodiment 3, the rotation drive unit 63 rotates the first inspection holding surface 611 and the second inspection holding surface 612 between the first position and the second position, so that the imaging unit 30 images the cross-sectional shape of the first cutting groove 801 on the machining start side of the first inspection piece 701 and the cross-sectional shape of the second cutting groove 802 on the machining end side of the second inspection piece 702, thereby enabling confirmation.
[0108] (Machining Method) The processing method according to Embodiment 3 is a processing operation in which the processing apparatus 1 performs cutting on the first inspection piece 701 and the second inspection piece 702. In the processing method, an operator registers processing content information in the control unit 100, and places the first inspection piece 701 before cutting on the first inspection holding surface 611 facing upward above the inspection table 60. Also, the second inspection piece 702 before cutting is placed on the second inspection holding surface 612 facing upward above the inspection table 60. When receiving an instruction to start the processing operation from the operator, the processing apparatus 1 performs the operation. When starting the processing operation, the processing apparatus 1 sucks and holds the first inspection piece 701 on the first inspection holding surface 611 of the inspection table 60, and sucks and holds the second inspection piece 702 on the second inspection holding surface 612 of the inspection table 60. Before starting the processing operation, the first inspection piece 701 may be sucked and held on the first inspection holding surface 611 of the inspection table 60, and the second inspection piece 702 may be sucked and held on the second inspection holding surface 612 of the inspection table 60.
[0109] The processing method of Embodiment 3 is a processing method for the first inspection piece 701 and / or the second inspection piece 702, and as shown in the flowchart of FIG. 6, includes a holding step ST11, a processing step ST12, a cleaning step ST13, an imaging step ST14, and a determination step ST15. Since the description would be repetitive, in Embodiment 3, the description of the first inspection piece 701 is omitted, and the processing method for the second inspection piece 702 will be described.
[0110] When the control unit 100 of the processing apparatus 1 determines that it is the timing to determine whether replacement of the cutting blade 21 is necessary, the processing method by the processing apparatus 1 of Embodiment 3 is started.
[0111] (Holding Step) In the holding step ST11 of Embodiment 3, when the processing method is started, the inspection table 60 of the processing apparatus 1 sucks on the second inspection holding surface 612 and holds the second inspection piece 702, which is the object to be processed, on the inspection table 60. Thereby, the second inspection piece 702 can be stably held on the inspection table 60, and processing on the second inspection piece 702 can be accurately performed.
[0112] (Processing Step) FIG. 11 is a cross-sectional view schematically showing the processing steps of the processing method of Embodiment 3 shown in FIG. 6. In the processing step ST12 of Embodiment 3, the second inspection piece 702 is positioned at the processing position, and a second cutting groove 802 is formed in the second inspection piece 702 such that at least one end of the second inspection piece 702 has a cross-section exposed in a direction (X-axis direction) orthogonal to the rotation axis 55 of the inspection table 60.
[0113] In the processing step ST12 of Embodiment 3, the rotation drive unit 63 rotates to the second position shown in FIG. 11 where the second inspection holding surface 612 faces upward (+Z-axis direction). In the processing step ST12 of Embodiment 3, the cutting water supply nozzle 27 of the processing device 1 injects cutting water W, and the cutting water W is supplied to the cutting blade 21. The processing device 1 moves the cutting blade 21 to which the cutting water W is supplied downward (-Z-axis direction) so as to contact the second inspection piece 702. In the processing step ST12, the inspection table 60 is sucked and held, and the second inspection piece 702 and the cutting edge of the cutting blade 21 are aligned. As shown in FIG. 11, the processing device 1 inserts the cutting blade 21 to which the cutting water W is supplied into the second inspection piece 702, and while relatively moving the second inspection piece 702 and the cutting unit 20 along the X-axis direction, cuts from one end on the left side in the X-axis direction (+X-axis direction) to the other end on the right side (-X-axis direction) to form the second cutting groove 802 in the second inspection piece 702.
[0114] In Embodiment 3, the second cutting groove 802 is formed from one end to the other end of the second inspection piece 702 in the X-axis direction. However, in the present invention, instead of cutting all the way from one end to the other end, it may be cut partway from one end toward the other end side, and the cutting blade 21 may be raised. Also, in Embodiment 3, the second cutting groove 802 is formed from one end to the other end of the second inspection piece 702 in the X-axis direction, but the second cutting groove 802 may be formed from the other end to one end of the second inspection piece 702 in the X-axis direction. When the processing step ST12 is completed, the process proceeds to the cleaning step ST13.
[0115] (Cleaning Step) FIG. 12 is a cross-sectional view schematically showing the cleaning step ST13 of the processing method of Embodiment 3 shown in FIG. 6. In the cleaning step ST13 of Embodiment 3, the processing apparatus 1 waits for a predetermined time with the cutting water W supplied to the cutting blade 21 from the second cutting groove 802, and cleans the second cutting groove 802 with the cutting water W.
[0116] As shown in FIG. 12, in the cleaning step ST13, the cutting blade 21 used for cutting in the processing step ST12 is retracted upward (+Z-axis direction) above the second cutting groove 802 for a predetermined time. Also, although the cutting blade 21 is retracted upward, this is not the only case, and it may be retracted to the right, left, or below the second cutting groove 802. In the embodiment of FIG. 12, the cutting water supply nozzle 27 moves upward following the retraction of the cutting blade 21 upward. Note that the cutting water supply nozzle 27 is not limited to the embodiment of FIG. 12, and may be arranged at a position where the second cutting groove 802 formed in the second inspection piece 702 can be cleaned when the cutting blade 21 is retracted upward, and does not have to move upward following the cutting blade 21.
[0117] Even in a state where the cutting blade 21 is retracted above the second cutting groove 802, the supply of the cutting water W to the cutting blade 21 is continuously performed. Therefore, the cutting water W supplied from the cutting water supply nozzle 27 contacts the cutting blade 21 and also contacts the second cutting groove 802 formed in the second inspection piece 702. For this reason, the cutting water W supplied from the cutting blade 21 can clean the cutting blade 21 and also can clean the second cutting groove 802 formed in the second inspection piece 702. Note that in the cleaning step ST13, only the second cutting groove 802 formed in the second inspection piece 702 may be cleaned without cleaning the cutting blade 21 with the cutting water W supplied from the cutting blade 21. By cleaning the second cutting groove 802 with the cutting water W, contamination can be reduced.
[0118] After cutting, if the scattered cutting fluid W adheres to the surface of the second inspection piece 702, the second inspection piece 702 will be contaminated by the cutting chips. In particular, if the contaminated cutting fluid W dries after adhesion, it will be difficult to remove the cutting chips from the second inspection piece 702. Therefore, if cutting chips are attached to the cutting fluid W during cutting, there is a risk that the state of the second cutting groove 802 cannot be accurately recognized. Therefore, in Embodiment 3, after the processing step ST12 and before the imaging step ST14, a cleaning step ST13 is to be performed. Thereby, adhesion of cutting chips to the second inspection piece 702 can be prevented, and an imaging image 300 can be formed in a contamination-free state, so that the state of the second cutting groove 802 can be grasped more accurately.
[0119] (Imaging step) FIG. 13 is a cross-sectional view schematically showing the imaging step of the processing method of Embodiment 3 shown in FIG. 6. The imaging step ST14 of Embodiment 3 is a step of imaging a side surface of one end side or the other end side of the second inspection piece 702 after performing the cleaning step ST13 to form an imaging image 300 including the second cutting groove 802.
[0120] In Embodiment 3, in the imaging step ST14, the processing apparatus 1 rotates the inspection table 60 counterclockwise by 90 degrees around the axis of the rotation shaft 55 from the state of the processing position, so that the second inspection holding surface 612 faces upward (+Z-axis direction) as shown in FIG. 13. By positioning the inspection table 60 at the imaging position, the processing end side of the second inspection piece 702 can be directed upward (+Z-axis direction). Thereby, the cross-sectional shape of the second cutting groove 802 on the processing end side of the second inspection piece 702 can be imaged by the imaging unit 30 disposed above. An imaging image 300 shown in FIG. 10 can be obtained by imaging the side surface of the processing end side of the second inspection piece 702 with the imaging unit 30. When the cleaning step ST13 is completed, the process proceeds to the imaging step ST14.
[0121] (Determination step) FIG. 10 is a diagram showing an example of the determination step ST15 of the processing method according to Embodiment 3 shown in FIG. 6. The determination step ST15 is a step of determining whether or not to replace the cutting blade 21 based on the inclination of the inner surface 81 of the second cutting groove 802 detected from the captured image 300. Note that the determination step ST15 is not limited to determining based on the inclination of the inner surface 81 of the second cutting groove 802. For example, the determination step ST15 may determine whether or not to replace the cutting blade 21 based on the tip shape, width, position, etc. of the second cutting groove 802. As the tip shape of the second cutting groove 802, for example, it may be determined based on whether or not there is uneven wear.
[0122] In Embodiment 3, in the determination step ST15, a normal image of the second cutting groove 802 (not shown) is superimposed on the captured image 300. Note that in Embodiment 3, the upper end of the second cutting groove 802 of the normal image is superimposed on the upper end of the second cutting groove 802 of the captured image 300. In Embodiment 3, in the determination step ST15, the control unit 100 detects the distance between the inner surface 81 of the second cutting groove 802 of the captured image 300 at the determination position 302 and the inner surface 81 of the second cutting groove 802 of the normal image. When it is determined that the detected distance is equal to or less than a predetermined allowable value, it is determined that the replacement of the cutting blade 21 is unnecessary, and the process returns to the holding step ST11. Thus, in Embodiment 3, in the determination step ST15, the control unit 100 determines whether or not to replace the cutting blade 21 based on the inclination of the inner surface 81 of the second cutting groove 802 detected from the captured image 300.
[0123] In Embodiment 3, in determination step ST15, when the control unit 100 determines that the detected distance exceeds a predetermined allowable value, it determines that replacement of the cutting blade 21 is necessary, operates the notification unit 101 to give a notification, and ends the machining operation, i.e., the machining method according to Embodiment 3. Note that in the present invention, the method for determining whether or not to replace the cutting blade 21 in determination step ST15 is not limited to that described in Embodiment 3, and the contour of the second cutting groove 802 in the normal image may be compared with the contour of the second cutting groove 802 in the captured image 300, or the inner surface 81 of the second cutting groove 802 in the captured image 300 may be compared with the virtual line of the inner surface of the ideal second cutting groove 802. Further, instead of the normal image or the virtual line, comparison may be made with the threshold values of each measurement item.
[0124] As described above, the machining method and the machining apparatus 1 according to Embodiment 3 form the first cutting groove 801 in the first inspection piece 701 at the first position, and rotate the inspection table 60 from the first position to the second position to image the side surface on the machining start side of the first inspection piece 701. Thereby, the cross-sectional shape of the machining start side of the first cutting groove 801 can be confirmed. When confirming the cross-sectional shape of the machining end side of the first cutting groove 801, the second cutting groove 802 of the second inspection piece 702 is formed at the second position, and the inspection table 60 is rotated from the second position to the first position to image the side surface on the machining end side of the second inspection piece 702. As a result, the first cutting groove 801 is formed in the first inspection piece 701, the side surface on the machining start side of the first inspection piece 701 is imaged, and the cross-sectional shape of the machining start side of the first cutting groove 801 can be confirmed. At the same time, the second cutting groove 802 is formed in the second inspection piece 702, the side surface on the machining end side of the second inspection piece 702 is imaged, and the cross-sectional shape of the machining end side of the second cutting groove 802 can be confirmed. Therefore, by simply rotating and moving the inspection table 60, it is possible to confirm the cross-sectional shape of either the machining start side or the machining end side of the first cutting groove 801 and the second cutting groove 802. Thereby, the state of the first cutting groove 801 and / or the second cutting groove 802 can be grasped more accurately.
[0125] In addition, since the rotational drive unit 63 can be configured by an air cylinder that can be positioned at only two positions, cost reduction can be achieved compared to being configured by a motor. Also, since the direction of rotating the inspection table 60 only needs to be 90 degrees and the movement range is narrow, it can be realized in a small installation space, and the processing apparatus 1 can be downsized.
[0126] Note that the embodiments of the present invention are not limited to the above-described embodiments and modification examples, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological progress or another derived technology, that method may be used for implementation. Therefore, the scope of the claims covers all embodiments that can be included within the scope of the technical idea of the present invention.
Industrial Applicability
[0127] As described above, the processing apparatus of the present invention can more accurately grasp the state of the cutting groove. Therefore, it is particularly useful in the field of forming cutting grooves.
Explanation of Reference Numerals
[0128] 1: Processing apparatus, 10: Chuck table, 11: Holding surface, 20: Cutting unit, 21: Cutting blade, 27: Cutting water supply nozzle, 30: Imaging unit, 45: Cutting groove, 60: Inspection table, 61: Inspection holding surface, 63: Rotational drive unit, 70: Inspection piece, 80: Cutting groove, 100: Control unit, 200: Workpiece, 300: Captured image, 611: First inspection holding surface, 612: Second inspection holding surface, 701: First inspection piece, 702: Second inspection piece, 801: First cutting groove, 802: Second cutting groove, W: Cutting water
Claims
1. A holding step of holding the object to be processed on a holding table; A processing step of forming a cutting groove in the object to be processed held on the holding table by a cutting blade supplied with cutting water; With the cutting water supplied to the cutting blade, Waiting for a predetermined time with the cutting blade in the cutting groove, A cleaning step of cleaning the cutting groove with the cutting water; An imaging step of imaging the cutting groove after the cleaning step; A determination step of determining the state of the cutting groove from the captured image, and A processing method characterized by comprising the above.
2. The cutting water supplied in the cleaning step, Compared with the cutting water supplied in the processing step, The processing method according to claim 1, characterized in that at least one of the water volume or water pressure is greater.
3. The holding table, A processing table having a processing holding surface for holding the workpiece, The processing method according to claim 1, characterized in that it is at least one of a processing table adjacent to the processing table and having an inspection holding surface for holding an inspection piece.
4. The inspection table, Has a rotation drive unit for rotating the inspection holding surface along a rotation axis parallel to the inspection holding surface, The rotation drive unit, The inspection holding surface, Rotating and moving between a processing position parallel to the processing holding surface and an imaging position orthogonal to the processing holding surface and imaging at least one of the cross sections on the processing start side or processing end side of the cutting groove with an imaging unit, The processing step, Positioning the inspection piece at the processing position, Forming a cutting groove in the inspection piece such that at least one end of the inspection piece has a cross section exposed in a direction orthogonal to the rotation axis, The imaging step, Positioning the inspection holding surface at the imaging position and imaging the cross section of the cutting groove with the imaging unit The processing method according to claim 3, characterized by the above.
5. The inspection holding surface, A first inspection holding surface capable of holding a first inspection piece, Orthogonal to the first inspection holding surface and including a second inspection holding surface capable of holding a second inspection piece The processing method according to claim 4, characterized by the above.
Citation Information
Patent Citations
Wafer cutting device
JP2007296604A
Processing method
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