Laminated electronic component

Abstract

To improve reliability of an external electrode of a laminated electronic component when plating is formed directly on a side face of a body or when a conductive resin layer is formed first and consequently a sintered electrode is formed.SOLUTION: A laminated electronic component 100 has a dielectric layer 111, a body 110 in which first and second internal electrode layers 121, 122 are alternately arranged, and first and second external electrodes 130, 140 extending to portions of the surface of the body facing the second direction and the surface facing the first direction. The first and second external electrodes include first and second electrode layers 131, 141 connected to first and second internal electrodes, respectively, and first and second conductive resin layers 132, 142 arranged on the first and second electrode layers on the surface facing the first direction. The first and second conductive resin layers are not arranged on the surface facing the second direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, and information entertainment systems, and plays a role in charging or discharging electricity.

[0003] Conventionally, in order to thin the external electrodes of a multilayer electronic component and improve the bending strength of the multilayer electronic component, there has been a case where a conductive resin layer is formed on the upper and lower surfaces of the main body, and direct plating on the side surface of the main body has been attempted.

[0004] When a sintered electrode is formed on the side surface of the main body after first forming a conductive resin layer on the upper and lower surfaces of the main body, there may occur a problem that the conductive resin layer burns at the sintering temperature of the sintered electrode. On the other hand, when direct plating is applied directly to the side surface of the main body instead of the sintered electrode, there is a possibility that the acidic solution contained in the plating solution penetrates into the inside of the main body and the reliability of the multilayer electronic component deteriorates.

[0005] Also, when direct plating is applied directly to the side surface of the main body, in the region where one end of the internal electrode is exposed, the growth of the plating layer can proceed smoothly. However, in the case of the cover portion, which is the side surface region of the main body where the internal electrode is not exposed, the plating layer may not grow smoothly, resulting in a problem that it is difficult to form a thin and uniform plating layer.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of several objects of the present invention is to solve the problem that when a conductive resin layer is first formed on the upper and lower surfaces of the main body to form an external electrode, it becomes difficult to form a sintered electrode on the side surface of the main body.

[0007] One of several objects of the present invention is to solve the problem that when a conductive resin layer is first formed on the upper and lower surfaces of the main body and plating is directly performed on the side surface of the main body, the plating layer does not grow smoothly in the cover portion, which is a side surface region of the main body where the internal electrode is not exposed.

[0008] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0009] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body, a first connection portion disposed on the third surface, and a first external electrode including a first band portion extending from the first connection portion to a part of the first surface and the second surface, a second connection portion disposed on the fourth surface, and a second external electrode including a second band portion extending from the second connection portion to a part of the first surface and the second surface. The first external electrode includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer in the first band portion and including a second conductive metal and a thermosetting resin. The second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer in the second band portion and including a second conductive metal and a thermosetting resin. The first electrode layer and the second electrode layer include a first conductive metal and glass. The first conductive resin layer is not disposed on the first connection portion, and the second conductive resin layer can be not disposed on the second connection portion.

[0010] A multilayer electronic component according to still another embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body including the above, and external electrodes arranged on the main body. The external electrodes include a conductive resin layer arranged on the first surface and the second surface, and an electrode layer arranged on the third surface and the fourth surface and extending from the third surface and the fourth surface onto the conductive resin layer and not containing glass. The main body portion includes a capacitance forming portion which is a region where the first and second internal electrodes overlap in the first direction, and cover portions arranged on one surface and the other surface of the capacitance forming portion in the first direction. The cover portion can include a first cover electrode and a second cover electrode spaced apart from each other in the second direction.

Advantages of the Invention

[0011] One of the several advantages of the present invention is to enable the electrode layer to contain glass by including a conductive resin layer in which the external electrode is arranged on the electrode layer in the band portion and not arranging the conductive resin layer on the connection portion.

[0012] One of the several advantages of the present invention is to enable the plating layer to grow smoothly in the cover portion even when plating is directly performed on the side surface of the main body by including a cover electrode layer connected to the external electrode in the cover portion.

[0013] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0016] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part says that a certain component "includes", this means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0017] FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1, FIG. 3 is an enlarged view of the P region of FIG. 2, FIG. 4 is a cross-sectional view taken along line II-II' of FIG. 1, and FIG. 5 is an exploded perspective view showing the main body according to an example in an exploded manner.

[0018] In the figures, the first direction is the direction in which the first and second internal electrodes are alternately arranged with the dielectric layer interposed therebetween or the thickness T direction, and among the second and third directions which are perpendicular to the first direction, the second direction can be defined as the length L direction and the third direction can be defined as the width W direction.

[0019] Hereinafter, with reference to FIGS. 1 to 5, an embodiment of the present invention, a multilayer electronic component according to another embodiment, and various examples thereof will be described in detail.

[0020] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface 5 and 6 connected to the first surface to the fourth surface and facing each other in a third direction, a main body 110, a first connection portion A1 disposed on the third surface, and a first external electrode 130 including a first band portion B1 extending from the first connection portion to a part of the first surface and the second surface, a second connection portion A2 disposed on the fourth surface, and a second external electrode 140 including a second band portion B2 extending from the second connection portion to a part of the first surface and the second surface. The first external electrode includes a first electrode layer connected to the first internal electrode, and a first conductive resin layer 132 disposed on the first electrode layer in the first band portion and including a second conductive metal and a thermosetting resin. The second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer 142 disposed on the second electrode layer in the second band portion and including a second conductive metal and the thermosetting resin. The first electrode layer and the second electrode layer include a first conductive metal and glass. The first conductive resin layer is not disposed on the first connection portion, and the second conductive resin layer may not be disposed on the second connection portion.

[0021] Referring to FIG. 2, the main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction.

[0022] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0023] The main body 110 can include a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the third surface 3 and the fourth surface 4 and face each other in a third direction.

[0024] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0025] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include BaTiO 3 -based ceramic powder. As examples of the ceramic powder, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0026] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO 3 ), according to the purpose of the present invention.

[0027] The average thickness td of the dielectric layer 111 is not particularly limited.

[0028] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less, and when improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be 3 μm or more.

[0029] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross-section (L-T cross-section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0030] For example, the average thickness td of the dielectric layer 111 is extracted from the dielectric layer scanned by a scanning electron microscope (SEM) of a cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110. Among the dielectric layers, based on one dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, for a total of five dielectric layers including two upper layers and two lower layers, with the point where the central line in the length direction of the main body and the central line in the thickness direction meet as a reference, after determining five points including two points on the left side and two points on the right side at equal intervals around one reference point, the thickness at each point can be measured and the average value can be measured.

[0031] The internal electrodes 121 and 122 can play a role in forming capacitance together with the dielectric layer 111 by being alternately arranged with the dielectric layer 111 interposed therebetween.

[0032] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be connected to the third and fourth surfaces 3 and 4 of the main body 110, respectively. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface.

[0033] As shown in FIG. 2, the first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 130 is disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 140 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0034] That is, the first internal electrode 121 is connected to the first external electrode 130 without being connected to the second external electrode 140, and the second internal electrode 122 is connected to the second external electrode 140 without being connected to the first external electrode 130. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3. At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0035] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0036] Further, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0037] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary depending on the purpose. For miniaturization of the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less, and for improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 may be 3 μm or more.

[0038] The average thickness te of the internal electrodes 121 and 122 is extracted from the internal electrode layers scanned by a scanning electron microscope (SEM) of the length cut at the central portion in the width direction of the main body 110 and the cross section in the thickness direction (L-T). Among the internal electrode layers, based on one internal electrode layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, for a total of five internal electrode layers of two upper layers and two lower layers, with the point where the central line in the length direction of the main body and the central line in the thickness direction meet as a reference, after determining five points, two on the left side and two on the right side, at equal intervals around one reference point, the thickness at each point can be measured and the average value can be measured.

[0039] Referring to FIGS. 2 and 4, the main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and in which the first and second internal electrodes 121 and 122 overlap in the first direction.

[0040] The capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and as shown in FIG. 6, it can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 interposed therebetween.

[0041] An upper cover portion 112 can be disposed on one surface of the capacitance forming portion Ac in the first direction, and a lower cover portion 113 can be disposed on the other surface of the capacitance forming portion Ac in the first direction.

[0042] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0043] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0044] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0045] On the other hand, the average thickness tc of the cover portions 112, 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness tc of the cover portions 112, 113 may be 15 μm or less. Here, the average thickness of the cover portions 112, 113 can mean the respective average thicknesses of the first cover portion 112 and the second cover portion 113.

[0046] The average thickness tc of the cover portions 112, 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112, 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0047] Referring to FIG. 4, margin portions 114, 115 can be arranged on one surface and the other surface in the third direction of the capacitance forming portion Ac.

[0048] The margin portions 114, 115 can include a margin portion 114 arranged on the fifth surface 5 of the main body 110 and a margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114, 115 can be arranged on both side surfaces in the width direction of the ceramic main body 110.

[0049] As shown in FIG. 4, the margin portions 114 and 115 can mean the regions between the interfaces of both ends of the first and second internal electrodes 121 and 122 and the main body 110 in a cross section obtained by cutting the main body 110 in the width - thickness (W - T) direction.

[0050] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0051] The margin portions 114 and 115 may be formed by applying a conductive paste to form internal electrodes except for the locations where the margin portions are formed on the ceramic green sheet.

[0052] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes after lamination are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the width direction on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0053] On the other hand, the width of the margin portions 114 and 115 does not particularly need to be limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less.

[0054] The average width of the margin portions 114 and 115 can mean the average size of the margin portions 114 and 115 in the third direction, and can be a value obtained by averaging the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0055] The external electrodes 130 and 140 are disposed on the main body 110.

[0056] The external electrodes 130 and 140 are disposed on the third surface 3 and the fourth surface 4 which are surfaces facing each other in a second direction perpendicular to the first direction of the main body 110, and can be connected to the internal electrodes 121 and 122. Specifically, the first external electrode 130 is disposed on the third surface 3 which is one surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the first internal electrode 121. The second external electrode 140 is disposed on the fourth surface 4 which is the other surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the second internal electrode 122.

[0057] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 130 and 140 is described. However, the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0058] Referring to FIG. 2, the first external electrode 130 can include a first connection portion A1 disposed on the third surface 3, and a first band portion B1 extending from the first connection portion A1 to a part of the first surface and the second surfaces 1 and 2. The second external electrode 140 can include a second connection portion A2 disposed on the fourth surface, and a second band portion B2 extending from the second connection portion A2 to a part of the first surface and the second surfaces 1 and 2.

[0059] Referring to FIGS. 2 and 3, the first connection portion A1 can mean the region where the first external electrode 130 is disposed on the third surface 3, and the second connection portion A2 can mean the region where the second external electrode 140 is disposed on the fourth surface 4.

[0060] Referring to FIGS. 2 and 3, the first band portion B1 can mean the region of the first external electrode 130 extending from the first connection portion A1 to a part of the first surface and the second surfaces 1 and 2, and the second band portion B2 can mean the region of the second external electrode 140 extending from the second connection portion A2 to a part of the first surface and the second surfaces 1 and 2.

[0061] On the one hand, in one embodiment, the first external electrode 130 may include a first corner portion C1, and the second external electrode 140 may include a second corner portion C2. Referring to FIG. 2, the first corner portion C1 may mean the region of the first external electrode 130 that connects the first connection portion A1 and the first band portion B1, and the second corner portion C2 may mean the region of the second external electrode 140 that connects the second connection portion A2 and the second band portion B2.

[0062] Also, in FIG. 2, it shows that the first and second band portions B1, B2 extend from the first and second connection portions A1, A2 to a part of the first and second surfaces 1, 2, but it is not limited thereto. The first and second band portions B1, B2 may extend from the first and second connection portions A1, A2 to a part of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6.

[0063] The first external electrode 130 includes a first electrode layer 131 connected to the first internal electrode 121 and a first conductive resin layer 132 disposed on the first electrode layer 131 in the first band portion B1, and includes the first conductive resin layer 132 containing a second conductive metal and a thermosetting resin. The second external electrode 140 includes a second electrode layer 141 connected to the second internal electrode 122 and a second conductive resin layer 142 disposed on the second electrode layer 141 in the second band portion B2, and may include the second conductive resin layer 142 containing a second conductive metal and a thermosetting resin.

[0064] The first electrode layer 131 is connected to the first internal electrode 121, and the second electrode layer 142 is connected to the second internal electrode 122 and can play a role in ensuring electrical conduction. For example, the first electrode layer 131 may be in contact with the first internal electrode 121, and the second electrode layer 142 may be in contact with the second internal electrode 122.

[0065] The first electrode layer 131 may be continuously arranged on the first connection portion A1, the first corner portion C1, and the first band portion B1 of the first external electrode 130, but it is not necessarily arranged on the first corner portion C1 and the second band portion B1. Similarly, the second electrode layer may be continuously arranged on the second connection portion A2, the second corner portion C2, and the second band portion B2 of the second external electrode 140, but it is not necessarily arranged on the second corner portion C2 and the second band portion B2.

[0066] The first electrode layer 131 and the second electrode layer 141 can include a first conductive metal and glass. As the first conductive metal, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the first conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0067] The method for forming the first electrode layer 131 and the second electrode layer 141 is not particularly limited. For example, a conductive paste containing a first conductive metal and glass can be dipped on the third surface 3 and the fourth surface 4 of the main body 110, or a sheet containing a first conductive metal and glass can be transferred and fired on the third surface 3 and the fourth surface 4 of the main body 110 to form them.

[0068] The first conductive resin layer 132 and the second conductive resin layer 142 can include a second conductive metal and a thermosetting resin. The type of the second conductive metal contained in the first conductive resin layer 132 and the second conductive resin layer 142 is not particularly limited, and it can be composed of at least one or two or more alloys of Cu, Ag, and Sn. The second conductive metal contained in the first conductive resin layer 132 and the second conductive resin layer 142 can be formed in a spherical or flake shape.

[0069] The thermosetting resin contained in the first conductive resin layer 132 and the second conductive resin layer 142 has bonding properties and shock absorption properties, and is not particularly limited as long as it can be mixed with the second conductive metal powder to form a paste. For example, it can include an epoxy resin.

[0070] The method for forming the first conductive resin layer 132 and the second conductive resin layer 142 is not particularly limited, but it can be formed on the first and second electrode layers 131 and 142 in the band portions B1 and B2 after forming the first electrode layer 131 and the second electrode layer 142.

[0071] On the other hand, the method for adjusting the regions where the first conductive resin layer 132 and the second conductive resin layer 142 are formed is not particularly limited. For example, after forming the first electrode layer 131 and the second electrode layer 142, the regions where the first conductive resin layer 132 and the second conductive resin layer 142 are not formed can be adjusted by a separate masking process.

[0072] In a multilayer electronic component, in order to thin the external electrodes, when forming an electrode layer on the third and fourth surfaces 3 and 4 of the main body 110 after forming a conductive resin layer on the first and second surfaces 1 and 2 of the main body 110, if an electrode layer is formed as a sintered electrode containing glass, there may be a problem that the conductive resin layer burns due to the sintering of the electrode layer.

[0073] On the other hand, in order to prevent such combustion of the conductive resin layer, when forming a conductive resin layer on the first and second surfaces 1 and 2 of the main body 110 after forming a plating layer on the third and fourth surfaces 3 and 4 of the main body 110, as a result of directly forming a plating layer on the third and fourth surfaces 3 and 4 of the main body 110 where the ceramic component contained in the dielectric layer exists, it may be difficult to form a thin and uniform plating layer, and there may be damage to the main body 110 due to the acidic solution contained in the plating solution.

[0074] In one embodiment of the present invention, the first external electrode 130 includes a first electrode layer 131 connected to the first internal electrode 121, and a first conductive resin layer 132 disposed on the first electrode layer 131 in the first band portion B1 and containing a second conductive metal and a thermosetting resin. The second external electrode 140 includes a second electrode layer 141 connected to the second internal electrode 122, and a second conductive resin layer 142 disposed on the second electrode layer 141 in the second band portion B2 and containing a second conductive metal and a thermosetting resin. Therefore, even when the first and second electrode layers 131 and 141 contain a first conductive metal and glass, the phenomenon that the first and second conductive resin layers 132 and 142 burn due to the formation of the first and second electrode layers 131 and 141 can be suppressed.

[0075] On the other hand, the first conductive resin layer 132 may not be disposed on the first connection portion A1, and the second conductive resin layer 142 may not be disposed on the second connection portion A2. Thereby, while sufficiently improving the bending strength of the multilayer electronic component, an increase in equivalent series resistance (ESR) due to excessive formation of the first and second conductive resin layers 132 and 142 can be suppressed.

[0076] In one example, it is preferable that the first conductive resin layer 132 covers at least a part of the first electrode layer 131 at the first corner portion C1, and the second conductive resin layer 142 covers at least a part of the second electrode layer 142 at the second corner portion C2. Thereby, the bending strength of the multilayer electronic component 100 can be further improved.

[0077] In one example, the first conductive resin layer is disposed so as not to exceed the extension line E1 of the first surface and the extension line E2 of the second surface, and the second conductive resin layer is disposed so as not to exceed the extension line E2 of the second surface. Thereby, the bending strength of the multilayer electronic component 100 can be further improved, and the phenomenon that the equivalent series resistance (ESR) of the multilayer electronic component 100 increases can be suppressed.

[0078] In one embodiment, the first external electrode 130 may further include a first plating layer 133, and the second external electrode 140 may further include a second plating layer 143.

[0079] The first plating layer 133 contains Ni and can be disposed on the first conductive resin layer 132. The second plating layer 143 contains Ni and can be disposed on the second conductive resin layer 142.

[0080] At this time, the first external electrode 130 is disposed on the first plating layer 133 and may further include a third plating layer 134 containing Sn. The second external electrode 140 is disposed on the second plating layer 143 and may further include a fourth plating layer 144 containing Sn.

[0081] The first to fourth plating layers 133, 143, 134, and 144 can play a role in improving the mounting characteristics of the multilayer electronic component 100. In particular, the first plating layer 133 and the second plating layer 134 can play a role in improving heat resistance and sealing properties.

[0082] On the other hand, in order to further improve the mounting characteristics and heat resistance, the first and second plating layers 133 and 143 can cover the first and second electrode layers 131 and 141 and the first and second conductive resin layers 132 and 142. Specifically, the first plating layer 133 can cover the first electrode layer 131 and the first conductive resin layer 132, and the second plating layer 143 can cover the second electrode layer 141 and the second conductive resin layer 142.

[0083] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0084] However, in order to simultaneously achieve miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layer and the internal electrodes and increase the number of laminations. Therefore, in the multilayer electronic component 100 having a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less, it may be difficult to ensure moisture resistance reliability.

[0085] Therefore, considering manufacturing errors, the size of the external electrodes, etc., when the length of the multilayer electronic component 100 is 0.22 mm or less and the width is 0.11 mm or less, the effect of improving the reliability according to the present invention can become more remarkable. Here, the length of the multilayer electronic component 100 can mean the maximum size in the second direction of the multilayer electronic component 100, and the width of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.

[0086] FIG. 6 is a perspective view schematically showing a multilayer electronic component according to still another embodiment of the present invention, FIG. 7 is a cross-sectional view taken along line III-III' of FIG. 6, and FIG. 8 is a cross-sectional view of a multilayer electronic component according to an example corresponding to FIG. 7.

[0087] Hereinafter, with reference to FIGS. 6 to 8, the multilayer electronic component 101 according to still another embodiment of the present invention and various examples thereof will be described in detail. However, the content overlapping with the multilayer electronic component 100 according to an embodiment of the present invention and various examples thereof will be omitted.

[0088] The multilayer electronic component 101 according to still another embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately arranged with the dielectric layer in the first direction, a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 connected to the first surface and the second surface and facing each other in the second direction, a fifth surface and a sixth surface 5 and 6 connected to the first surface to the fourth surface and facing each other in the third direction, a main body 110, and external electrodes 130' and 140' disposed on the main body. The external electrodes include conductive resin layers 132' and 142' disposed on the first surface and the second surface, and electrode layers 131' and 141' disposed on the third surface and the fourth surface, extending from the third surface and the fourth surface onto the conductive resin layers and not containing glass. The main body includes a capacitance forming portion Ac which is a region where the first and second internal electrodes overlap in the first direction, and cover portions 112' and 113' disposed on one surface and the other surface of the capacitance forming portion in the first direction. The cover portions can include a first cover electrode 151 and a second cover electrode 152 spaced apart from each other in the second direction.

[0089] In yet another embodiment of the present invention, the external electrodes 130' and 140' of the multilayer electronic component 101 may include conductive resin layers 132' and 142 disposed on the first and second surfaces 1 and 2, and electrode layers 131' and 141 that are disposed on the third and fourth surfaces 3 and 4 and extend from the third and fourth surfaces 3 and 4 onto the conductive resin layers 132' and 142' and do not contain glass.

[0090] Referring to FIGS. 6 and 7, the external electrodes 130' and 140' are disposed on the first and second surfaces 1 and 2 of the main body 110, and may include conductive resin layers 132' and 142 containing a second conductive metal and a thermosetting resin.

[0091] The conductive resin layers 132' and 142 are disposed on the first and second surfaces 1 and 2 of the main body 110 and can play a role in improving the bending strength of the multilayer electronic component 101. Further, since the electrode layers 131' and 141' described later extend and are disposed on the conductive resin layers 132' and 142', even when the electrode layers 131' and 141' are plating layers that do not contain glass, the bending strength of the multilayer electronic component 101 can be sufficiently improved.

[0092] Further, the external electrodes 130' and 140' may be disposed on the third and fourth surfaces 3 and 4 and extend from the third and fourth surfaces 3 and 4 onto the conductive resin layers 132' and 142', and may include electrode layers 131' and 141 that do not contain glass.

[0093] The electrode layers 131' and 141' are disposed on the third and fourth surfaces 3 and 4 and are connected to the internal electrodes 121 and 122, and by extending and being disposed on the conductive resin layers 132' and 142', the mechanical strength of the external electrodes 130' and 140' can be improved, and the bending strength of the multilayer electronic component 101 can be improved. In one embodiment, the electrode layers 131' and 141' can cover the conductive resin layers 132' and 142', whereby the mechanical strength of the external electrodes 130' and 140' can be further improved.

[0094] The method for forming the electrode layers 131' and 141' is not particularly limited. For example, after forming the conductive resin layers 132' and 142', the first conductive metal can be plated on the third surface 3, the fourth surface 4 of the main body, and the conductive resin layers 132' and 142' to form the electrode layers 131' and 141'. Note that the plating method of the electrode layers 131' and 141' is not particularly limited.

[0095] On the other hand, when directly forming the electrode layers 131' and 141' without glass on the third surface and the fourth surface 3 and 4 of the main body 110, the formation may be smooth in the third direction of the main body 110, but the formation may not be smooth in the first direction of the main body 110. In particular, since there is a lack of conductive material in the cover portion where the internal electrode is not exposed, the formation of the electrode layers 131' and 141' without glass may become more difficult.

[0096] Therefore, in still another embodiment of the present invention, by including the cover electrodes 151 and 152 connected to the electrode layers 131' and 141' in the cover portions 112' and 113' disposed on one surface and the other surface of the capacitance forming portion Ac in the first direction, the electrode layers 131' and 141' can be smoothly formed over the entire third surface 3 and the fourth surface 4 of the main body 110, and thereby the thinning of the external electrodes 130' and 140' can be easily achieved.

[0097] In one embodiment, the cover electrodes 151 and 152 can include a first cover electrode 151 and a second cover electrode 152 spaced apart from each other in the second direction. Thereby, even when the cover electrodes 151 and 152 are connected to the electrode layers 131' and 141', the phenomenon of short - circuiting of the cover electrodes 151 and 152 can be prevented.

[0098] At this time, the first cover electrode 151 can be in contact with the first electrode layer 131', and the second cover electrode 152 can be in contact with the second electrode layer 141'. As a result, the area where the first cover electrode 151 and the second cover electrode 152 are in contact with the first electrode layer 131' and the second electrode layer 141' is improved, and thus the effect of smoothly forming the electrode layers 131' and 141' over the entire third surface 3 and the fourth surface 4 of the main body 110 can be enhanced.

[0099] In one embodiment, the first cover electrode 151 may be entirely included in the upper cover portion 112 and the lower cover portion 113, and the second cover electrode 152 may be entirely included in the lower cover portion 113. Thereby, the effect of being smoothly formed over the entire third surface 3 and fourth surface 4 of the main body 110 can be improved.

[0100] On the other hand, it is not necessary to particularly limit the lengths of the cover electrodes 151 and 152.

[0101] Referring to FIG. 7, the cover electrodes 151 and 152 may be longer than the conductive resin layers 132' and 142'. Thereby, the phenomenon in which cracks generated at the boundaries between the main body 110 and the external electrodes 130' and 140' propagate to the capacitance forming portion Ac can be suppressed. Specifically, when the distance between the ends of the conductive resin layers 132' and 142' in the second direction is Lr, and the distance between the ends of the cover electrodes 151 and 152 in the second direction is Lc, Lr < Lc can be satisfied.

[0102] On the other hand, referring to FIG. 8, in the multilayer electronic component 101' according to one embodiment, the cover electrodes 151 and 152 may be shorter than the conductive resin layers 130' and 140'. In this case, although the effect of suppressing the phenomenon in which cracks generated at the boundaries between the main body 110 and the external electrodes 130' and 140' propagate to the capacitance forming portion Ac may be somewhat weak, since the penetration path of moisture from the outside can be reduced, the moisture resistance reliability of the multilayer electronic component 101' can be improved. Specifically, when the distance between the ends of the conductive resin layers 132' and 142' in the second direction is Lr', and the distance between the ends of the cover electrodes 151 and 152 in the second direction is Lc', Lr' > Lc' can be satisfied.

[0103] In one embodiment, the external electrodes 130' and 140' are disposed on the electrode layers 131' and 141', and may further include plating layers 133' and 143' containing Ni.

[0104] At this time, the external electrodes 130' and 140' are arranged on the plating layers 133' and 143' containing Ni, and may further include plating layers 134' and 144' containing Sn.

[0105] The plating layers 133' and 143' containing Ni and the plating layers 134' and 144' containing Sn can play a role in improving the mounting characteristics of the multilayer electronic component 101. In particular, the plating layers 133' and 143' containing Ni can play a role in improving heat resistance and sealing properties.

[0106] On the other hand, the plating layers 133' and 143' containing Ni can cover the electrode layers 131' and 141' in order to further improve the mounting characteristics and heat resistance.

[0107] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

[0108] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain the respective unique features that are different from each other. However, it does not exclude that the above-presented one embodiment can be realized in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, as long as there is no description contrary to or inconsistent with that matter in another one embodiment, it can be understood as a description related to another one embodiment.

[0109] The terms used in the present invention are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes a plural expression unless the context clearly indicates a different meaning.

Explanation of Symbols

[0110] 100: Multilayer Electronic Component 110: Body 111: Dielectric Layer 112, 113: Cover Part 114, 115: Margin Part 121, 122: Internal Electrode 130, 140: External Electrode 131, 141: Electrode Layer 132, 142: Conductive Resin Layer 133, 143: First and Second Plating Layers 134, 144: Third and Fourth Plating Layers

Claims

1. a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer, the body including first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to the first surface and a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface and a portion of the second surface, the first external electrode includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer in the first band portion, the first conductive resin layer including a second conductive metal and a thermosetting resin; the second external electrode includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer in the second band portion, the second conductive resin layer including a second conductive metal and a thermosetting resin; the first electrode layer and the second electrode layer include a first conductive metal and a glass; the first conductive resin layer is not disposed on the first connection portion, The multilayer electronic component, wherein the second conductive resin layer is not disposed on the second connection portion.

2. 2. The multilayer electronic component according to claim 1, wherein the first electrode layer is in contact with the first internal electrode, and the second electrode layer is in contact with the second internal electrode.

3. When a region connecting the first connection portion and the first band portion is defined as a first corner portion, and a region connecting the second connection portion and the second band portion is defined as a second corner portion, 2. The multilayer electronic component according to claim 1, wherein the first conductive resin layer covers at least a portion of the first electrode layer at the first corner portion, and the second conductive resin layer covers at least a portion of the second electrode layer at the second corner portion.

4. the first conductive resin layer is disposed so as not to extend beyond an extension line of the first surface and an extension line of the second surface; The multilayer electronic component according to claim 1 , wherein the second conductive resin layer is disposed so as not to extend beyond an extension line of the first surface and an extension line of the second surface.

5. the first external electrode is disposed on the first conductive resin layer and further includes a first plating layer including Ni; 2 . The multilayer electronic component according to claim 1 , wherein the second external electrode is disposed on the second conductive resin layer and further includes a second plating layer containing Ni.

6. the first plating layer covers the first electrode layer and the first conductive resin layer; The multilayer electronic component according to claim 5 , wherein the second plating layer covers the second electrode layer and the second conductive resin layer.

7. the first external electrode further includes a third plating layer disposed on the first plating layer and including Sn; The multilayer electronic component according to claim 5 , wherein the second external electrode further includes a fourth plating layer disposed on the second plating layer and containing Sn.

8. a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer, the body including a first surface and a second surface facing the first direction, a third surface and a fourth surface connected to the first surface and facing the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and facing the third direction; an external electrode disposed on the body; The external electrodes include a conductive resin layer disposed on the first surface and the second surface and including a second conductive metal and a thermosetting resin; and an electrode layer that is disposed on the third surface and the fourth surface and extends from the third surface and the fourth surface onto the conductive resin layer, the electrode layer not including glass; the main body includes a capacitance forming portion that is a region where the first and second internal electrodes overlap in the first direction, and cover portions that are disposed on one surface and the other surface of the capacitance forming portion in the first direction, The cover portion includes a first cover electrode and a second cover electrode spaced apart from each other in the second direction.

9. The multilayer electronic component according to claim 8 , wherein the electrode layer covers the conductive resin layer.

10. the electrode layer includes a first electrode layer disposed on the third surface and a second electrode layer disposed on the fourth surface; 10. The multilayer electronic component according to claim 9, wherein the first cover electrode is in contact with the first electrode layer, and the second cover electrode is in contact with the second electrode layer.

11. The multilayer electronic component according to claim 8 , wherein the first and second cover electrodes are longer than the conductive resin layer.

12. 9. The multilayer electronic component according to claim 8, wherein the first and second cover electrodes are shorter in length than the conductive resin layer.

13. 9. The multilayer electronic component according to claim 8, wherein the external electrodes are disposed on the electrode layers and further include plating layers containing Ni.

14. The multilayer electronic component according to claim 13 , wherein the external electrodes further include a plating layer containing Sn disposed on the plating layer containing Ni.

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