Apparatus, magnet, and fabrication method

Abstract

To provide concepts, system, and techniques which provide means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization.SOLUTION: A field magnet assembly 100 comprises: a spiral grooved plate 110, an electrically conductive plate having a groove 135; and a high-temperature superconductor (HTS) tape stack 150 disposed in the groove, the HTS tape stack having a spiral shape. The groove also has a spiral shape and the electrically conductive plate comprises a metal or a metal alloy. The field magnet assembly additionally comprises a coolant channel.SELECTED DRAWING: Figure 1B

Description

Background Art

[0001]

[0001] As is known in the art, existing techniques for fabricating high-field superconducting magnetics include (1) low-temperature superconductor (LTS) cable-in-conduit conductor (CICC) designs such as those used for the toroidal field magnetics of ITER, and (2) high-temperature superconductor (HTS) designs based on HTS tapes that are wound directly into layer-wound coils or spiral-wound "pancake" coil assemblies. A technique similar to CICC based on HTS conductors is further sought.

[0002]

[0002] In the CICC technique, the conduit is electrically insulated from the winding pack. The coolant is constrained to flow inside the conduit. The shapes of the winding pack and the outer support shell define the shapes of the current path and the coolant path. For an example of an ITER toroidal field coil, the winding pack and the outer support shell are provided to have a D shape. The winding pack and the outer shell structure are mainly responsible for containing the Lorentz force generated by the high-field magnet (i.e., the winding pack and the shell must support the Lorentz load). In the case of a magnet quench event (which must be detected with high reliability and with sufficient lead time to reduce damage by an external protection system), the stored magnetic energy is dissipated into an external resistor at the magnet terminals. Thus, the current in the CICC avoids the normal regions in the superconductor and instead flows into the copper stabilizer.

[0003]

[0003] The need for copper stabilizers and coolant channels within the conduit, combined with the need for high voltage electrical insulation, complicates magnet design because these elements are structurally weak and yet they occupy a significant amount of volume within the winding. Additionally, the manufacturing process for CICC-based magnetic devices necessarily includes many steps, including stranding of the strands / tape, covering these sub-elements together, and bending and inserting the CICC into the winding, which is long and laborious.

Summary of the Invention

Means for Solving the Problem

[0004]

[0004] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key or essential features or combinations of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0005]

[0005] Described herein are means for constructing robust high magnetic field superconducting magnets using fabrication techniques that are relatively simple compared to conventional fabrication techniques, and concepts, systems, structures, and techniques that enable modular components that scale well towards commercialization. Utilizing non-insulated high temperature superconducting tape (HTS) enables enhanced (and ideally, optimized) coolant paths - the resulting magnet assemblies are inherently structurally strong. This allows for a high degree (and ideally, maximum utilization) of the high magnetic fields available by HTS tape technology. Additionally, the concepts described herein safely dissipate quench energy while at the same time obtaining an acceptable magnet charge time , enable the control of the quench-induced current distribution in the tape stack and the surrounding upper structure. The end result is a structurally and thermally robust high-field magnet assembly that is passively protected against quench failure situations.

[0006]

[0006] In embodiments, the concepts described can facilitate the commercialization of high-field magnets for use in fusion power facilities (e.g., small fusion power facilities) and in high-energy physics applications. However, after reading the description provided herein, one of ordinary skill in the art will readily appreciate that the disclosed concepts are generally applicable to use in a wide range of other applications where high-field magnets can be used (e.g., a wide range of industrial uses). Such applications include, but are not limited to, uses in the medical and life science fields (e.g., magnetic resonance imaging and spectroscopy); uses in the fields of chemistry, biochemistry, and biology (e.g., nuclear magnetic resonance (NMR), NMR spectroscopy, electron paramagnetic resonance (EPR), and Fourier transform ion cyclotron resonance (FT-ICR)); uses in particle accelerators and detectors (e.g., for use in healthcare applications such as in equipment for radiation therapy); uses in devices for the generation and control of high-temperature hydrogen plasmas; uses in the realm of transportation; uses in the realm of power generation and conversion; uses in heavy industry; uses in weapons and defense; and uses in the realm of high-energy particle physics.

[0007] According to one aspect of the concepts described herein, a high magnetic field magnet assembly includes a plurality of conductive plates, each of the plurality of conductive plates having a spiral groove provided therein, and the plurality of conductive plates are arranged (e.g., stacked) to form a one-piece pancake assembly having a first outermost surface and a second, oppositely oriented outermost surface. The high magnetic field magnet assembly further includes a non-insulated (NI) HTS tape stack disposed within a channel formed by the grooves of the first and second conductive plates. In embodiments, the HTS stack may include a co-wind material that may comprise one or a combination of non-insulating materials, insulating materials, or semiconductive materials. In embodiments, the channel may be sized to accommodate two or more stacks, and a separate structure optionally mechanically engageable with the plates is disposed between the stacks. The channel has a first opening on the first outermost surface of the pancake assembly and a second opening on the second, opposite outermost surface of the pancake assembly. The NI HTS tape (and co-wind stack when included) is continuously disposed within the channel such that the NI HTS tape (and co-wind stack) forms a path from the first outermost surface of the pancake assembly to the second, opposite outermost surface of the pancake assembly.

[0008]

[0008] In embodiments, a pair of spiral-grooved plates (e.g., an upper plate and a lower plate) are stacked to form a one-piece double pancake assembly.

[0009]

[0009] In embodiments, two identical spiral-grooved plates are assembled back-to-back, and an insulating material is inserted or otherwise disposed between the plates. One or more HTS tape stacks with co-winding are disposed into grooves that align an inward spiral on the upper plate, a helix to the lower plate, and an outward spiral on the lower plate.

[0010]

[0010] In an embodiment, the high magnetic field magnet assembly can include a co-wound material and a surface coating that are selected to provide a desired (and ideally, optimized) magnet quench behavior.

[0011]

[0011] In an embodiment, the high magnetic field magnet assembly is prepared from a composite of a base material that is selected to provide a desired (and ideally, optimized) magnet quench behavior and can include a spiral-grooved plate and a surface coating (electrically insulating, conductive, and / or semiconductive).

[0012]

[0012] In an embodiment, a bladder element can be included within the tape stack to preload the stack prior to soldering or to eliminate the need for soldering.

[0013]

[0013] In an embodiment, the bladder element can be filled with a material that is liquid during assembly but solid at the magnet operating temperature. The heat of fusion associated with this material can act as a large thermal reservoir to protect the HTS during a quench event.

[0014]

[0014] In an embodiment, a copper spiral lid can be soldered, otherwise joined, or affixed to the tape bundle to assist in facilitating heat removal to a coolant channel plate stacked on top of the spiral.

[0015]

[0015] In an embodiment, grooves can be machined into the copper spiral lid and the upper surface of the base plate along and / or across the path of the spiral winding to facilitate coolant passage.

[0016]

[0016] In an embodiment, a copper interconnect between a pancake with inwardly directed spiral grooves and a pancake with outwardly directed spiral grooves can be used. This copper interconnect can be used at both the inner diameter (ID) and outer diameter (OD) of each spiral groove winding plate. In this case, the magnet assembly is constructed by simply stacking on top of each other a series of plates filled with HTS with spiral grooves that are alternately arranged with coolant channel plates, and / or by using coolant channel grooves cut into the surface of the plates as described above, and simply stacking on top of each other a series of plates filled with HTS with spiral grooves.

[0017]

[0017] In an embodiment, the HTS and the co-wound stack are embedded within a matrix of copper or other high electrical conductivity material where it enters and exits the spiral groove winding plate, and where the stack transitions from one spiral groove winding plate to another. This helps to protect the HTS against overheating and damage during magnet charging and magnet quench situations.

[0018] In another aspect of the concepts described herein, the magnet assembly of stacked plates comprises a first plate, a second plate disposed above the first plate, an electrical insulating material disposed between the first plate and the second plate, and one or more HTS tape stacks, each of which may include co-wound material (conductive, electrically insulating, and / or semiconductive). The first plate is provided with at least one spiral-shaped groove provided therein. The second plate may further be provided with at least one spiral groove provided therein such that when the first surface of the first plate is disposed above the first surface of the second plate, the grooves form a channel having a spiral shape directed inward on the first plate, a helix to the second (or lower) plate, and a spiral directed outward on the lower plate. The electrical insulating material is disposed between the first plate and the second plate. The HTS tape stack with co-winding is disposed within the channel such that this enables a winding having a spiral shape. While the winding will generally be of a spiral shape, it should be appreciated that the magnet core may be provided having a D shape, a solenoid shape, a circular shape, or any other shape suitable for the application in which the magnet core is to be used. Similarly, the helical channel can be deformed into the shape required to facilitate a continuous channel that allows the HTS tape stack to pass from the first plate to the second plate. After reading the description provided herein, one of ordinary skill in the art will appreciate how to select the appropriate winding and magnet shape for the requirements of an individual application. It can be deformed into the shape required to facilitate a continuous channel that allows the HTS tape stack to pass from the first plate to the second plate. After reading the description provided herein, one of ordinary skill in the art will appreciate how to select the appropriate winding and magnet shape for the requirements of an individual application.

[0019]

[0019] In one embodiment, the grooves in the first and second plates are substantially the same. The first and second plates may further have substantially the same spiral-shaped grooves and may be assembled back-to-back.

[0020]

[0020] The channels form a spiral that goes inward on the upper plate, a helix to the lower plate, and a spiral that goes outward on the lower plate. An HTS tape stack that may include co-wound material can be inserted into the grooved channels. The co-wound material and the surface coating can be selected to optimize the magnet quench behavior.

[0021]

[0021] In an embodiment, a blada element can be included as co-wound material within the HTS tape stack. The blada element can be configured within the HTS tape stack to pre-load the HTS tape stack prior to soldering. In an embodiment, the blada element can further be configured within the HTS tape stack to eliminate the need for soldering. The blada element can further be configured to pre-compress the HTS tape stack against the load-bearing sidewalls of at least one spiral groove.

[0022]

[0022] In an embodiment, the blada element may be filled with a material that is liquid during assembly but solid at the magnet operating temperature. One such material includes, but is not limited to, gallium. The heat of fusion associated with this material can act as a large thermal reservoir to limit the temperature rise of the HTS during a quench event.

[0023]

[0023] In an embodiment, the number, size, and type of HTS tapes within the stack with optional co-wound material can be varied by location along the spiral path, if desired, to save cost and / or to optimize the magnet quench response, among other things.

[0024]

[0024] The magnet may further comprise at least one coolant channel. In embodiments, the at least one coolant channel may be provided in one or both of the first and second plates. In embodiments, the coolant channel may comprise one or more coolant paths extending along the HTS tape stack. In other embodiments, the at least one coolant channel may comprise one or more cooling channel plates interleaved with one or both of the first and second plates or interleaved within a stack of such plates that may comprise the magnet assembly. In such embodiments, the coolant channel path need not extend along the HTS tape stack. In some embodiments, the coolant channel is formed by cutting a groove into the surface of the plate, including the copper cap that is disposed above the HTS tape stack. Such coolant channel grooves need not extend along the HTS tape stack.

[0025]

[0025] The magnet may further comprise a conductive plate disposed between the first and second plates, or interleaved within a stack of such plates that may comprise the magnet assembly. The conductive plate may be prepared from any conductive material, including but not limited to copper. The conductive plate may further be prepared from a thermally conductive material and may be configured to provide conductive cooling.

[0026] Additionally, the magnet may include one or more electrical interconnects between the first plate and the second plate, such one or more electrical interconnects being adapted to provide electrical connection between the first plate and the second plate during magnet charging. The winding plates are configured to establish and maintain high electrical resistance in some areas to minimize the flow of bypass current between each of the winding plates.

[0027]

[0027] In another aspect, a method for constructing a high magnetic field magnet includes assembling a series of spiral-grooved plates filled with HTS, stacked between coolant channel plates, and forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having low electrical resistance characteristics. The step of forming one or more inter-pancake connections can include automatically forming the one or more inter-pancake connections.

[0028]

[0028] The method can further include applying a preload to the HTS tape stack within the spiral-grooved plate to eliminate the need for soldering.

[0029]

[0029] In another aspect of the concepts described herein, a magnet assembly includes a first conductive plate having a first surface with a plurality of grooves provided therein, the grooves defined by one or more walls, at least two of the plurality of grooves having different widths, and a non-insulated (NI) high temperature superconductor (HTS) tape stack having a predetermined length such that the NI HTS tape stack is disposed within the plurality of grooves to form a continuous path between the outermost groove in the first conductive plate and the innermost groove of the first conductive plate. In an embodiment, the HTS tape is configured within each groove such that in response to a generated force, the HTS tape stack distributes the force into the first and second conductive plates.

[0030]

[0030] In an embodiment, the magnet assembly further includes a second conductive plate such that when the first surface of the first plate is disposed above the first surface of the second plate, the grooves form channels having an opening at a first end of the channel, and the HTS tape is disposed above the first conductive plate to form a continuous path between the first conductive plate and the second conductive plate.

[0031]

[0031] In an embodiment, the HTS tape laminate is disposed in one of a plurality of grooves having a varying width and is wound around the HTS tape laminate itself so as to occupy the width of the groove.

[0032]

[0032] In an embodiment, the wall defining the groove in the first conductive plate is provided with a variable wall thickness such that the thickness of a first portion of the wall is different from the thickness of a second portion of the same wall.

[0033]

[0033] In an embodiment, the wall defining the groove in the first conductive plate is provided with different wall thicknesses.

[0034]

[0034] In an embodiment, the thickness of a first portion of the first wall in a first radial direction as measured from the center of the first conductive plate is different from the thickness of a first portion of a second different wall along the same first radial direction.

[0035]

[0035] In an embodiment, the first and second conductive plates have substantially the same spiral-shaped grooves.

[0036]

[0036] In an embodiment, the NI HTS tape laminate is composed of two or more NI HTS tape laminates joined by a low-resistance electrical connection.

[0037]

[0037] In an embodiment, the material comprising the NI HTS tape laminate in the first and second plates is continuous across the plates.

[0038]

[0038] In an embodiment, the NI HTS tape laminate further comprises a co-winding material disposed in the groove such that the HTS tape and the co-winding laminate follow a path between the outermost first groove of the first conductive plate and the innermost groove of the first conductive plate, and the HTS tape and the co-winding laminate are configured in the groove such that, in response to the forces generated, the HTS tape and the co-winding laminate distribute the forces into the first and second conductive plates.

[0039]

[0039] In an embodiment, the co-wound material is provided as one or more of a conductive material, an electrical insulating material, and / or a semiconductive material.

[0040]

[0040] In an embodiment, the co-wound material is selected to optimize the magnet quench behavior, or the magnet charging behavior, or both.

[0041]

[0041] In an embodiment, the HTS tape and the co-wound laminate pass between the plates on which they are stacked; the HTS tape and the co-wound laminate enter into and exit from the magnet assembly; and the electrical interconnects are embedded within the parent material of the high electrical conductivity material at locations where they are formed between the windings.

[0042]

[0042] In an embodiment, the co-wound material varies either in composition or thickness along the length of the NI HTS tape laminate.

[0043]

[0043] In an embodiment, the electrical insulating material is disposed in a selected area between the stacked plates.

[0044]

[0044] In an embodiment, the NI HTS tape laminate comprises one or more HTS tapes, and the number, size, and type of the HTS tapes within the NI HTS tape laminate vary along the length of the NI HTS tape laminate.

[0045]

[0045] In an embodiment, the groove defines a spiral that goes inward on the first conductive plate, the inward spiral has a first end and a second end, the first electrical plate has a helical opening provided therein, the helical opening has a first end and a second end, the first end of the helical opening is coupled to the second end of the inward spiral, and the second end of the helical opening leading to the second conductive plate is coupled to the first end of an outward spiral provided within the second conductive plate.

[0046] In an embodiment, a bladder element is included within the HTS tape stack. In an embodiment, the bladder element is configured to pre-compress the HTS tape stack against the load-bearing sidewall of the at least one spiral groove. In an embodiment, the bladder element contains a material that is liquid or gaseous during magnet assembly and is solid, liquid, or gaseous or expelled during magnet operation. In an embodiment, the bladder element contains a material that exhibits a phase change from solid to liquid and / or liquid to gas during magnet operation.

[0047] In an embodiment, the first conductive plate has at least one coolant channel disposed therein. In an embodiment, the coolant channel comprises one or more coolant paths disposed along the HTS tape stack. In an embodiment, the at least one coolant channel is interleaved with one or both of the first plate and the second conductive plate. In an embodiment, the at least one coolant channel includes one or more coolant paths disposed along a path different from the path of the HTS tape stack.

[0048] In an embodiment, a conductive plate may be interposed between the first conductive plate and the second conductive plate.

[0049] In embodiments, a high electrical conductivity coating may be disposed on selected locations of at least one of the first and second conductive plates.

[0050] In an embodiment, the conductive plate comprises, in whole or in part, copper.

[0051] Some embodiments relate to an apparatus that includes a conductive plate having a groove and a high temperature superconductor (HTS) tape stack disposed in the groove, the HTS tape stack having a spiral shape.

[0052]

[0052] The groove may have a spiral shape.

[0053]

[0053] The conductive plate may include a metal or a metal alloy.

[0054]

[0054] The device may further include a coolant channel.

[0055]

[0055] The coolant channel may be disposed within the groove.

[0056]

[0056] The coolant channel may be disposed outside the groove.

[0057]

[0057] The HTS tape stack may be a non-insulated HTS tape stack.

[0058]

[0058] The HTS tape stack may include a plurality of windings, and the conductive plate provides an electrical connection portion between each winding of the plurality of windings.

[0059]

[0059] The device may further include a shim or a blada within the groove.

[0060]

[0060] The conductive plate may be a first conductive plate, the groove may be a first groove, the HTS tape stack may be a first HTS tape stack, and the device may further include a second conductive plate having a second groove and a second HTS tape stack disposed within the second groove and having a spiral shape, and the first HTS tape stack is electrically coupled to the second HTS tape stack.

[0061]

[0061] The first conductive plate may be electrically insulated from the second conductive plate.

[0062]

[0062] The first and / or second conductive plates have one or more alignment structures for aligning the first and second conductive plates when the first and second conductive plates are grouped together.

[0063]

[0063] The device may further include a conductive connection portion between the first HTS tape stack and the second HTS tape stack.

[0064]

[0064] The conductive connection portion may include a high-temperature superconductor or a metal that is not a superconductor at a temperature above 30 Kelvin.

[0065]

[0065] The conductive connection portion may include copper.

[0066]

[0066] The conductive connection portion may be formed between the innermost windings of the first and second HTS tape stacks or between the outermost windings of the first and second HTS tape stacks.

[0067]

[0067] The first HTS tape stack and the second HTS tape stack may be the same HTS tape stack.

[0068]

[0068] The transition portion between the first HTS tape stack and the second HTS tape stack may be formed by a helical portion of the same HTS tape stack.

[0069]

[0069] The first groove may include at least the first and second windings, the first winding having a first width, the second winding having a second width, and the second width being greater than the first width.

[0070]

[0070] The second winding of the groove may include a plurality of windings of the HTS tape stack.

[0071]

[0071] The device may include a magnet.

[0072]

[0072] The HTS tape stack may include a rare earth oxide.​

[0073]

[0073] The HTS tape laminate may contain a rare earth barium copper oxide.

[0074]

[0074] The device may further include a conductive terminal block electrically coupled to the HTS tape laminate.

[0075]

[0075] Some embodiments relate to a manufacturing method including the steps of forming a conductive plate having a groove and disposing a high temperature superconductor (HTS) tape laminate in a spiral shape within the groove.

[0076]

[0076] The foregoing and other objects, features, and advantages will become apparent from the following more detailed description of embodiments, as illustrated in the accompanying drawings in which like reference numerals refer to the same parts throughout the different views. The drawings are not necessarily to scale, and instead emphasis is placed on illustrating the principles of the embodiments.

Brief Description of the Drawings

[0077]

Figure 1

[0077] An isometric view of a portion of a double pancake magnet assembly of stacked plates with spiral grooves, which may be the same as or similar to the double pancake magnet assembly of stacked plates with spiral grooves shown in FIG. 1C.

Figure 1A

[0078] An isometric view of a portion of a double pancake magnet assembly of stacked plates with spiral grooves, which may be the same as or similar to the double pancake magnet assembly of stacked plates with spiral grooves shown in FIG. 1C.

Figure 1B

[0079] An isometric view of a portion of a double pancake magnet assembly of stacked plates with spiral grooves, which may be the same as or similar to the double pancake magnet assembly of stacked plates with spiral grooves shown in FIG. 1C.

Figure 1C

[0080] An isometric view of a double pancake magnet assembly of stacked plates with spiral grooves.

Figure 2

[0081] A series of cross-sectional views of a plate with spiral grooves showing options for coolant channels extending along the HTS tape.

Figure 2A

Figure 3

[0082] A cross-sectional view of two plates having spiral grooves provided therein, the plates being stacked relative to a shared coolant channel plate or a conduction-cooled plate.

Figure 3A

[0083] A cross-sectional view of two plates having spiral grooves provided therein, the plates being stacked relative to a shared coolant channel plate or a conduction-cooled plate and having copper interconnects between the pancakes fabricated within regions of the two plates.

Figure 4

[0084] A cross-sectional view of a magnet having a hydraulic bladder.

Figure 5

[0085] A series of cross-sectional views of a magnet illustrating the selection of materials, coatings, and insulators in co-wound tape stacks and spiral grooves that can be used to control the heat application region of a magnet quench.

Figure 5A

Figure 6

[0086] A cross-sectional view of a spiral-grooved magnet plate assembly taken in the direction across line 6-6 of the spiral-grooved plate shown in FIG. 6A.

Figure 6A

[0087] A top view of the first spiral-grooved plate.

Figure 6B

[0088] Top view of a channel plate having an insulating radial coolant channel provided therein.

Figure 6C

[0089] Top view of a second plate with spiral grooves.

Figure 7

[0090] Top view of a double - pancake magnet assembly of stacked plates with variable - width spiral grooves.

Figure 7A

[0091] Cross - sectional view of the double - pancake magnet assembly of stacked plates with variable - width spiral grooves of FIG. 7 taken along line A - A of FIG. 7.

Figure 7B

[0092] Cross - sectional view of the double - pancake magnet assembly of stacked plates with variable - width spiral grooves of FIG. 7 taken along line B - B of FIG. 7.

Figure 7C

[0093] Cross - sectional view of the double - pancake magnet assembly of stacked plates with variable - width spiral grooves of FIG. 7 taken along line C - C of FIG. 7.

Figure 7D

[0094] Perspective view of a portion of the double - pancake magnet assembly 7 of stacked plates with variable - width spiral grooves taken along line A - A of FIG. 7.

Mode for Carrying Out the Invention

[0078]

[0095] Described herein are concepts and techniques for enabling high magnetic field magnets. Described herein are structures and techniques for the design and construction of high magnetic field magnets having a relatively small size and shape. The concepts, structures, and techniques described provide means for constructing robust high magnetic field superconducting magnets using fabrication techniques that are relatively simple compared to prior art high magnetic field magnet fabrication techniques. Further, the concepts, structures, and techniques described can utilize modular components that scale well towards commercialization. The high magnetic field magnet assemblies described can utilize stacked plates with spiral grooves and non-insulated high temperature superconducting (HTS) tape. The non-insulated tape allows current to flow from one winding to the outer winding of the tape of the superconductor and does not require, but may have, an insulating material. Such an approach can inherently result in a structurally strong magnet assembly, which allows for a high (and ideally, maximum) utilization of the high magnetic fields available by HTS technology. Further, the use of stacked plates with spiral grooves and non-insulated HTS tape stacks (or HTS tapes and co-wound stacks with conductive, non-conductive, and / or semiconductive materials) disposed within the spiral grooves can allow for the inclusion of coolant paths, which in some cases can be optimized coolant paths.

[0079]

[0096] The HTS tape includes an HTS material. As used herein, the phrase "HTS material" or "HTS superconductor" refers to a superconducting material having a critical temperature above 30K in its self-magnetic field. Examples of HTS superconductors include, but are not limited to, rare earth oxides such as rare earth barium copper oxides (REBCO).

[0080]

[0097] A pancake assembly is provided in which the HTS is self-wound. The HTS tapes themselves (including optional co-winds) associated with the grooved plate provide the mechanical strength required to generate a high magnetic field. In embodiments, a circular geometry is conveniently used for the spiral. As a result of the HTS tapes themselves providing the essential mechanical strength, such coils are easy to construct and mechanically strong. For example, an 8 Tesla double pancake non-insulated (NI) HTS tape coil was designed, constructed, and successfully operated within less than six months. In some embodiments, the NI HTS tape (and the co-wound stack when used) forms a continuous path from the first outermost surface of the pancake assembly to the second outermost surface on the opposite side of the pancake assembly. However, it should be appreciated that in some embodiments, the path of one material may be interrupted and not continuous. Thus, it should be appreciated that the grooved path is at least somewhat continuous, but the material disposed within the grooved path may not be continuous.

[0081]

[0098] The NI HTS pancakes are of particular interest because they have unique current shunting characteristics / phenomena during magnet quenches. Specifically, since the HTS tape (or tape stack) is not insulated or only partially insulated, Joule heating can be distributed somewhat uniformly throughout the winding. It is desirable to optimize and fully utilize this behavior by devising a robust, passively protected magnet design that can operate at high energy density. The spiral-grooved plate assembly configuration described herein can control the distributed quench drive current in the coil structure, reducing (and ideally minimizing) the magnitude and duration of the current shunting current and thus the Joule heating and temperature rise of the HTS tape stack itself. Furthermore, the current is electromagnetically coupled to the spiral-grooved plate and other surrounding structures, which, through careful selection of the magnet design, can further lead to a uniform current distribution and a reduced temperature rise due to Joule heating, because the magnetic field energy can be dissipated in a much larger volume of material compared to prior art techniques.

[0082]

[0099] In addition, the concepts, structures, and techniques described enable control of the quench-induced current distribution in the HTS tape stack and the surrounding upper structure to safely dissipate the quench energy while simultaneously obtaining an acceptable magnet charge time. The end result is a structurally and thermally robust high-field magnet assembly that is passively protected against quench failure situations.

[0083]

[0100] Fusion power plants (e.g., small fusion power plants) and fusion research experiments (e.g., Although references to the use of such high magnetic field magnet assemblies as being related to, e.g., SPARC, are sometimes made herein, such references are not intended to be limiting and should not be construed as limiting. The high magnetic field magnet assemblies enabled by the concepts described herein find use in a variety of applications, including, but not limited to, applications in the field of high energy physics, applications in the fields of medicine and life sciences, applications in the fields of chemistry, biochemistry, and biology, applications in the fields of particle accelerators and detectors, applications in the field of devices for the generation and control of high temperature hydrogen plasmas, applications in the field of transportation, applications in the field of power generation and conversion, applications in heavy industry, applications in weapons and defense, and it is recognized that they find use in a wide variety of applications, including, but not limited to, applications in the field of high energy particle physics.

[0101] For example, in the fields of medicine and life sciences, the concepts described herein The high-field magnets enabled by [the technology] can find use in magnetic resonance imaging (MRI) and spectroscopy. In the fields of chemistry, biochemistry, and biology, the high-field magnets enabled by the concepts described herein can find use in nuclear magnetic resonance (NMR), NMR spectroscopy, electron paramagnetic resonance (EPR), and Fourier transform ion cyclotron resonance (FT-ICR). In the realm of particle accelerators and detectors, the high-field magnets enabled by the concepts described herein can find use in healthcare applications such as in equipment for radiation therapy and in charge particle beam transmission (e.g., from an accelerator to a target / patient). In the realm of transportation, the high-field magnets enabled by the concepts described herein can find use in high-power density motors, generators, and MHD propulsion (e.g., electric aircraft, maglev trains, hyperloop concepts, railway engines and transformers, ship propulsion and generators, and vehicles). In the realm of utilities and power applications, the high-field magnets enabled by the concepts described herein can find use in electromechanical machinery, power generation and power conversion systems (e.g., wind turbines, transformers, synchronous condensers, utility generators producing up to or greater than 300 MW, superconducting energy storage, and MHD energy generation). The high-field magnets enabled by the concepts described herein can find use in the realm of heavy industrial applications (e.g., large industrial motors, magnetic separation, disposable mixing systems, induction heaters). In the realm of weapons and defense applications, the high-field magnets enabled by the concepts described herein can find use in propulsion motors and generators, electromagnetic pulse (EMP) generation, power supplies for directed energy weapons, and railguns / coilguns.

[0084]

[0102] One or more HTS tes disposed within a spiral groove or channel References to laminates, or HTS laminates and co-winds, are sometimes made herein. As used herein, the term "HTS tape laminate" is to be understood to include a "laminate" having a plurality of layers of HTS tape, or only a single layer of HTS tape, and, optionally, one or more tapes made from non-HTS materials that are herein referred to as "co-wound" tapes. The number, size, and type of tape layers to be used in any individual HTS tape laminate are selected according to the needs of the individual application. For example, in applications that only require low current capabilities and can accept high inductance characteristics, a single layer tape laminate may be used. However, in high current / low inductance applications (e.g., small fusion applications), HTS tape laminates prepared from a single layer or multiple individual layers of HTS tape up to many individual layers (e.g., in the range of 10 to 1000 layers, or more) may be used. In cases where multiple HTS tape layers are included within an HTS tape laminate, the multiple layers of HTS tape are essentially joined in parallel to enable a structure having increased current carrying characteristics relative to a single HTS tape layer.

[0085]

[0103] Like elements are given like reference designations throughout several views. Referring now to FIGS. 1-1C, a series of views illustrate the use of a stacked plate concept with spiral grooves used to form a so-called one-piece "double pancake assembly" 100 (FIG. 1A). It should be appreciated that details of the current lead connections are omitted for clarity in the description and drawings. In general overview, FIGS. 1-1C illustrate an example of a spiral-grooved plate that can be stacked to form an integral so-called "double pancake"

[0086]

[0104] assembly 100. This In the illustrative example, two (optionally identical) plates with spiral grooves (Figure 1) are assembled back-to-back, and an insulating material is inserted between or otherwise disposed between those plates (Figure 1A). An HTS tape laminate that may include co-wound material is inserted into a grooved channel (Figure 1B) that can align an inward spiral on the upper plate, a helix to the lower plate, and an outward spiral on the lower plate. In some embodiments, the HTS tape laminate is wound continuously (i.e., without breaks or subdivisions) from the upper surface to the lower surface of the pancake assembly. In some embodiments, the NI HTS tape (and co-wound laminate when used) may be subdivided or otherwise have interruptions provided therein (e.g., the path of one material may be interrupted and not continuous). While the grooved path may be described as being at least somewhat continuous (even though the cross-sectional shape may vary throughout the length of the grooved path), it should thus be appreciated that the material packed or otherwise disposed within the grooved path may be continuous or may be provided in parts (e.g., subdivided). In some embodiments, two or more HTS tape laminates may be disposed into the grooves with material disposed between the laminates, and that material may mechanically engage the plates, such as by spiral grooves, either separately or in association with the tape laminate. In some embodiments, some or all of the co-wound material may be disposed to mechanically engage the plates, such as by spiral grooves, either separately or in association with the tape laminate.

[0087]

[0105] The co-wound material and surface coating are as desired (and ideally, optimized (which can be selected to result in magnet quench behavior. In an embodiment, the bladder element can further be included within the tape stack to apply a preload to the stack prior to soldering or to eliminate the need for soldering. A copper (or other high thermal conductivity material) spiral lid (FIG. 1C) can be soldered, otherwise joined, or affixed to the tape bundle to assist in facilitating heat removal to a coolant channel plate stacked on top of the spiral. (See FIGS. 3 and 6 which will be described in detail below). Another embodiment uses a copper interconnect between a pancake with inward spiral grooves and a pancake with outward spiral grooves (see FIG. 3). This copper interconnect can be used at both the inner diameter (ID) and outer diameter (OD) of each spiral-grooved winding plate. In this case, the magnet assembly can be constructed by simply stacking a series of plates filled with HTS with spiral grooves, arranged alternately with coolant channel plates, against each other (e.g., similar to that shown and described below in connection with FIG. 6, but without the external connections between the double pancakes). Depending on the application, the coolant channel plate can be replaced by a conduction cooling plate or eliminated altogether.)

[0088]

[0106] An exemplary stacked plate double pancake magnet assembly 100 (FIG. 1A) is the first It includes a first plate 105 (FIG. 1) having two opposite surfaces 105a, 105b and a groove 125. The first plate 105 includes, for example, any conductive material including a metal or an alloy, or can be formed from such a conductive material. Such materials include, but are not limited to, one or more of nickel-based superalloys such as Inconel 718 and Hastelloy C276, austenitic stainless steels, and dispersion-strengthened copper alloys. Factors influencing material selection include, but are not limited to, mechanical strength, electrical conductivity, thermal conductivity, and coefficient of thermal expansion. Composite materials of different materials can be used. The material can be selected to optimize the uniformity of quench energy imparted, the structural integrity under load and under unusual circumstances, and to minimize cost. Additive manufacturing techniques can be readily used to fabricate the plate geometries on which the magnets can be constructed.

[0089]

[0107] A groove 125 is provided, which is initially helical as the groove enters the plate The shape can be, and then, have a spiral shape within the plate. In this exemplary embodiment, the spiral is provided as a curved spiral (i.e., a substantially continuous and radially expanding or contracting curve either around a central point on a flat plane or around an axis so as to form a cylinder). In other embodiments, it should be appreciated that a shape similar to a spiral can be used (i.e., a winding body forming a path that is either overall expanding or contracting either around a central point on a flat plane or around an axis). As used herein, the term "spiral shape" includes "spiral-like" shapes. For example, in some embodiments, it may be desirable or necessary to utilize a shape similar to a rectangular spiral. Still in other embodiments, it may be desirable or necessary to utilize a shape similar to a triangular spiral. Still in other embodiments, it may be desirable or necessary to utilize a shape similar to an oval spiral. Other spiral-like shapes, including geometrically irregular shapes, can further be used. After reading the disclosure provided herein, one of ordinary skill in the art will appreciate how to select an individual spiral or spiral-like geometric form / shape for use in an individual application. It should further be appreciated that the spiral or spiral-like grooves can be provided with a constant pitch (i.e., the same pitch) or with a variable pitch. The variable pitch can, for example, provide significant design flexibility by providing space between the windings to accommodate coolant passages between the pancake plates and / or increasing the strength of the pancake in certain areas while reducing the overall magnet weight and / or enabling a more uniform quench energy deposition.

[0090]

[0108] The first plate 105, in this exemplary embodiment, the first plate 105 to the second Included to assist in attaching to a plate (e.g., the second plate 110 of FIG. 1A) are optional interface apertures 120a-N. In some embodiments, the attaching can be performed by conventional fasteners as is generally known. In embodiments, other fastening techniques can be used to join or otherwise attach two or more plates. Such techniques include, but are not limited to, welding, soldering, and brazing. Features including, but not limited to, weld lips, flanges, weld reliefs, screw holes, rivets, and special attachment points can be added to the plate to accommodate the fastening techniques used in a commercial production environment.

[0091]

[0109] As will become apparent from the description in the following specification, groove 125 (FIG. 1) is configured to receive a high temperature superconductor (HTS) tape stack (e.g., the HTS tape stack 150 of FIG. 1C) in this embodiment. The HTS tape stack may be composed entirely of HTS tapes, or may include "co-wound" tapes that are separately sandwiched and / or stacked on top of the stack of HTS tapes, i.e., tapes made entirely of non-HTS materials. The co-wound material can be conductive, insulating, or semiconductive. In some embodiments, the electrical properties of the co-wound material can be selected to be advantageous for optimizing the quench behavior. In other embodiments, two or more stacks can be arranged in a groove, and a separating material is disposed therebetween. In this case, the dimensions of the groove that may include secondary grooves for engaging the separating material are appropriately modified. The co-wound tape may further include a "bladder" as further described below. Some of the factors considered in selecting the characteristics of the HTS tape include, but are not limited to, the operating current of the individual tapes, the total current desired in the tape stack, the strain characteristics of the tapes, and other mechanical characteristics. In some applications, it may be desirable to vary the number, size, and / or type of HTS tapes in the stack depending on the location along the path, for any of a variety of reasons, such as to save cost, size, and / or weight. The current shunting attribute of the stacked non-insulated HTS tapes with optional co-winding takes this possibility into account. For example, in regions of low magnetic field strength, the number of HTS tapes in the stack can be reduced, taking advantage of the fact that the operating current in the remaining HTS tapes can be increased. Factors that influence the selection of the HTS tape width include, but are not limited to, the Lorentz loading on the tape stack and the reaction load on the sidewalls of the grooved channel. Thus, the dimensions of the spiral grooves in the plate are selected to accommodate the dimensions of the HTS tape stack that can vary in location.

[0092]

[0110] In an embodiment, the HTS tape stack has spiral grooves 130 (i.e., It is fed into the end of the so-called inward spiral groove 130 or otherwise arranged.

[0093]

[0111] In the embodiment shown here, the alignment pins 115a-N are connected at the interface with the second plate (for example, the plate 110 in FIG. 1A) and are used to maintain the orientation.

[0094]

[0112] Referring briefly to FIG. 1A, the double-pancake magnet assembly 10 0 of the second plate 110 is arranged above the first plate 105 such that the grooves 125 provided in each of the respective plates 105, 110 are aligned.

[0095]

[0113] The mating surfaces of the two spiral-grooved plates are electrically connected only across the contact area including the location where the H TS tape stack transfers from one plate to the other, 125, by application of an insulating coating and / or an insulating plate 140 (further depicted as 440 in FIG. 4), and can be partially electrically insulated from each other.

[0096]

[0114] The second plate 110 forms or otherwise provides a groove 135 that defines an inward channel 136 having an overall spiral shape. As touched upon above in connection with the groove 125, the groove 135 is shown here having an overall curved spiral shape, but other spiral shapes including, but not limited to, square, rectangular, triangular, or oval shapes can further be used. In the embodiment shown here, one end of the groove 135 connects to a helical channel 137 that passes between the plates 105 and 110.

[0097]

[0115] When the grooves in each plate are grouped together, those grooves form an inward s Channels such as the spiral channel 136 can be formed. The inward spiral channel 136 receives the HTS tape and the co-wound laminate (e.g., the HTS tape and the co-wound laminate 150 of FIG. 1C) that is fed into the helical channel 137. The helical channel 137 is coupled to the helical groove 125 of the first plate 105 such that the HTS tape laminate can be fed (or otherwise provided or oriented) through the helical channel 137 into the helical groove 125 of the first plate 105.

[0098]

[0116] In some embodiments, the material surrounding the helical channel is selected to have high thermal and electrical conductivity and can be, for example, copper. It should be appreciated that this concept allows for some flexibility in the selection of the material within this region, as well as the particular procedures by which the geometric form of the helical channel is formed and mechanically and electrically supported.

[0099]

[0117] In some embodiments, the HTS tape and the co-wound laminate include locations where the HTS tape and the co-wound laminate enter and exit the channels on each of the plates with spiral grooves and extend without interruption to the current feeder connection on the outside of the plates with spiral grooves over a wide area that is embedded in copper or other suitable high electrical conductivity material in other cases. This helps to protect the HTS from overheating and damage during magnet charging and magnet quench events.

[0100]

[0100]

[0118] Referring now to FIG. 1B, the HTS tape laminate 150 that may include co-wound material is disposed within the inwardly facing spiral groove channel 135. A coolant channel 155 or a thermally conductive elongate piece 155 (FIG. 1C) that contacts a separate coolant channel (not shown) is disposed on top of the HTS tape stack. The coolant channel or the thermally conductive elongate piece 155 (FIG. 1C) is configured to enable the magnet assembly 100 to be properly cooled during all stages of magnetic operation, including, but not limited to, magnet charging where local joule heating would occur from the bypass current. In some embodiments, the coolant channel 155 or the thermally conductive elongate piece 155 is omitted.

[0101]

[0119] Referring now to FIG. 1C, the second plate 110 has an HTS tape stack 150 disposed therein. The HTS tape stack 150 is inserted into or otherwise disposed within the spiral groove channels 135 and the helical grooves 137 (most clearly visible in FIG. 1B), which direct or otherwise orient the HTS tape stack 150 into the spiral groove channels 135 of the first plate 105.

[0102]

[0120] In embodiments, the first and second plates 105, 110 include, but are not limited to, superalloys such as Inconel 7 18, Hastelloy C276, as well as a variety of structural materials including, but not limited to, stainless steels such as 316, and dispersion strengthened copper alloys such as GRCop-84, or may be formed from them. In embodiments, it may be desirable to coat or otherwise dispose a material layer within the channels 130, 135. Such materials may include, but are not necessarily limited to, electrodeposited solder to aid in fabrication, semiconductor coatings of various thicknesses to control quench current distribution, copper plating / coatings, and / or ceramic coatings.

[0103]

[0121] In some embodiments, the channels 130, 135, and / or the overall The plate assemblies 105, 110 can be formed by additive manufacturing techniques such as three-dimensional (3-D) printing. Such techniques have already demonstrated the ability to fabricate structures of the required size and shape using a variety of structural materials, such as superalloys like Inconel 718, Inconel 625, as well as 316 stainless steel and dispersion-strengthened copper alloy GRCop-84. Suffice it to say that a variety of additive manufacturing techniques can be used for fabrication using a variety of different materials.

[0104]

[0122] Significantly, in embodiments, the HTS tape stack and the co-winding 15 0 may not be insulated, may be partially insulated, and / or may enclose a semiconductive material.

[0105]

[0123] The HTS tape stack may be composed entirely of HTS tape, or may include a "co-winding" tape that is separately sandwiched and / or stacked on top of the stack of HTS tapes, i.e., a tape made entirely of a non-superconducting material. The co-winding material may be conductive, insulating, or semiconductive, with electrical properties selected to be advantageous for optimizing the quench behavior. The co-winding tape may further include a "bladder" as further described below. In some embodiments, the HTS tape stack 150 may be formed outside the channel and then disposed within the channel. In other embodiments, elements of the HTS tape stack 150, including but not limited to the co-winding material, may be formed directly into the channels 13 0, 155, for example, by 3D printing techniques. 0, 155 can be formed directly.

[0106]

[0124] In some embodiments, the cross-sectional shape of the grooves in the first and second plates may be substantially the same. In other embodiments, the cross-sectional shape of the grooves in the first and second plates may be different (e.g., to accommodate features such as structural elements that may be specific to the plate).

[0107]

[0125] Furthermore, in some embodiments, the first and second plates may further have substantially the same spiral-shaped grooves, and when the plates are assembled, the grooves may be assembled back-to-back, i.e., in a manner such that the grooves are on opposite-facing surfaces, so as to form channels. In other embodiments, the spiral shapes within each plate may be different. Furthermore, in some embodiments, the first and second plates may further have substantially the same spiral-shaped grooves, and when the plates are assembled, the grooves may be assembled back-to-back, i.e., in a manner such that the grooves are on opposite-facing surfaces, so as to form channels. In other embodiments, the spiral shapes within each plate may be different.

[0108]

[0126] In an embodiment, the channels form an inward spiral on the upper plate, a helix to the lower plate, and an outward spiral on the lower plate. The HTS tape stack and the co-winding can be inserted into the channels. The co-winding material and the surface coating can be selected to safely distribute the magnet quench energy within the volume of the structure. In an embodiment, the channels form an inward spiral on the upper plate, a helix to the lower plate, and an outward spiral on the lower plate. The HTS tape stack and the co-winding can be inserted into the channels. The co-winding material and the surface coating can be selected to safely distribute the magnet quench energy within the volume of the structure.

[0109]

[0127] In some applications (e.g., the proposed toroidal field coil for the SPARC experiment), it may be necessary to remove heat (e.g., neutron-induced heating, copper joints) generated from a volume source within the region of the tape stack in order to maintain the operating temperature. The stacked plate approach with spiral grooves can readily accommodate this in several ways. FIGS. 2 and 2A illustrate two different embodiments with coolant channels disposed along the tape stack. Overall, the coolant channels are arranged beside (e.g., adjacent to, next to, or in the vicinity of) the main load path (e.g., the superconductor). The HTS tape plane coated with copper can be oriented orthogonal to the coolant channels, which maximizes heat transfer. FIG. 3 illustrates an alternative approach using coolant channel plates within the stack that are shared between opposite-facing pancakes. In some applications (e.g., the proposed toroidal field coil for the SPARC experiment), it may be necessary to remove heat (e.g., neutron-induced heating, copper joints) generated from a volume source within the region of the tape stack in order to maintain the operating temperature. The stacked plate approach with spiral grooves can readily accommodate this in several ways. FIGS. 2 and 2A illustrate two different embodiments with coolant channels disposed along the tape stack. Overall, the coolant channels are arranged beside (e.g., adjacent to, next to, or in the vicinity of) the main load path (e.g., the superconductor). The HTS tape plane coated with copper can be oriented orthogonal to the coolant channels, which maximizes heat transfer. FIG. 3 illustrates an alternative approach using coolant channel plates within the stack that are shared between opposite-facing pancakes.

[0110]

[0128] FIGS. 2 and 2A show cross-sections of the plates with the grooves seated in recesses within the plates. This plate , in contrast to the plates of FIGS. 1-1C, where the walls of the grooves are above the main surface of the plate. Referring now to FIG. 2, the plate 205a with spiral grooves includes a groove or channel 230. In this exemplary embodiment, the channel 230 is provided with a rectangular cross-sectional shape. In other embodiments, the channel 230 may be provided with other cross-sectional shapes (i.e., other than rectangular) including, but not limited to, square, triangular, oval, or rounded, or other regular geometric shapes. The cross-sectional shape of the channel may be selected to be complementary to the shape of the HTS tape and vice versa. Ideally, but optionally, the HTS tape (or the HTS tape, as well as the combination of co-wound and / or shim and / or bladed device) substantially occupies the cross-section of the channel. Generally, it is desirable but optional that the channel 230 be filled with a material having as high a mechanical strength, high thermal heat capacity, high thermal conductivity, and electrical properties optimized for magnet quench response as possible (e.g., to the extent possible given the material properties, as well as / or mechanical and / or manufacturing tolerances, as well as / or manufacturing techniques).

[0111]

[0129] In this exemplary embodiment, the plate 205a has a width 233 of about 15 mm. The channel 230 has a depth of about 11 mm into the plate 205a. The channel further has a length 234 of about 9 mm. Inserted into or otherwise disposed within the channel 230 is an HTS tape stack 250 having a width 231 of about 6 mm and a length 232 of about 8.33 mm. Here, a wedge-shaped shim 235 is provided for the HT The S tape stack 250 is inserted or otherwise arranged into the groove 230 such that it is pressed against the sidewalls of the groove. In this illustrative embodiment, one of the channels is formed or otherwise provided at a distance 239 of about 4.25 mm from the surface of the plate 205a. However, these dimensions are merely illustrative as the structures described herein can have any of a variety of suitable dimensions.

[0112]

[0130] In an embodiment, the magnet assembly further comprises one or more coolant channels. In embodiments, the one or more coolant channels may be provided in one or both of the first and second plates. In embodiments, the one or more coolant channels may include one or more coolant passages disposed proximate to the HTS tape stack. In other embodiments, the one or more coolant channels may include one or more cooling channel plates interleaved or otherwise distributed between the plates that make up the high field magnet assembly.

[0113]

[0131] A coolant channel 215 is provided adjacent the HTS tape stack 250. In this illustrative embodiment, the coolant channel 215 is formed or otherwise defined by a thermally conductive member 210 having a C-shape (e.g., a C-shaped channel member 210) positioned on top of the HTS tape stack 250. In this illustrative embodiment, the coolant channel is approximately 30 mm long. 2It is provided with an area. However, this area is merely illustrative, because any suitable coolant channel area can be used. The thermally conductive member 210 can include one or more of copper, copper alloy, and a material with high thermal conductivity. The coolant channel 215 is covered or otherwise closed (or capped) using a lid 220 that is fixed (e.g., welded or otherwise fixed) onto the plate 205a. The lid 220 is configured to enclose the HTS tape stack 250 and the coolant channel 215 within the groove 230. In one embodiment, a tape stack having a length of about 8 mm can be prepared from about 190 HTS tapes each 6 mm wide. In an embodiment, a superalloy (e.g., Hastelloy) can be used as a co-wound material to achieve the above 8 mm length with a reduced number of HTS tapes.

[0114]

[0132] In an embodiment, a plurality of plates with spiral grooves can be used, and high A method for constructing a high magnetic field magnet includes assembling a series of spiral-grooved plates filled with HTS that are stacked between coolant channel plates, and forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having low electrical resistance characteristics such that the resulting Joule heating can be received by the coolant system. In an embodiment, the step of forming one or more inter-pancake connections can include automatically forming one or more other inter-pancake connections.

[0115]

[0133] Figure 2A is a cross-sectional view of the spiral-grooved plate 205b. The spiral-grooved The plate 205b can be substantially similar to the plate 205a. In this embodiment, the welding lid is not used to enclose the HTS tape stack 250 and the coolant channel 215. The coolant channel 215 is encapsulated by a rectangular coolant tube 240. The rectangular coolant tube can include one or more of copper, copper alloy, or any other material having thermal conductivity characteristics similar to or greater than those of the materials described previously.

[0116]

[0134] In the example illustrated by FIGS. 2 - 2A, the HTS tape stack 250 is oriented orthogonal to the coolant channel 215. This orientation can be selected to increase (and ideally, maximize) heat transfer. Those skilled in the art will understand that other orientations can be used. and preferably, maximize) heat transfer. Those skilled in the art will understand that other orientations can be used. This orientation can be selected to increase (and preferably, maximize) heat transfer. Those skilled in the art will understand that other orientations can be used.

[0117]

[0135] As touched upon above, FIGS. 3 and 3A illustrate an alternative approach using a shared coolant channel 340 between two oppositely - oriented pancakes 330, 335. In an embodiment, this can be achieved by a coolant channel plate within the stack that is shared between two oppositely - oriented pancakes 330, 335. In some embodiments, grooves are machined into the surfaces of two oppositely - oriented pancakes 330 and 335 so as to form the coolant channel (FIG. 3A). FIGS. 3 and 3A are cross - sectional views showing the option of stacking two grooved plates with respect to a shared coolant channel (by, for example, a shared coolant channel plate, or by a conduction - cooled plate, or by machining matching grooves into the surface of the grooved plate, as well as into the copper lid covering the HTS stack and the co - winding). If desired, the copper interconnect between the pancakes can be fabricated within this region. It should be noted that elements similar to those in FIGS. 3 and 3A are given similar reference numerals. As touched upon above, FIGS. 3 and 3A illustrate an alternative approach using a shared coolant channel 340 between two oppositely - oriented pancakes 330, 335. In an embodiment, this can be achieved by a coolant channel plate within the stack that is shared between two oppositely - oriented pancakes 330, 335. In some embodiments, grooves are machined into the surfaces of two oppositely - oriented pancakes 330 and 335 so as to form the coolant channel (FIG. 3A). FIGS. 3 and 3A are cross - sectional views showing the option of stacking two grooved plates with respect to a shared coolant channel (by, for example, a shared coolant channel plate, or by a conduction - cooled plate, or by machining matching grooves into the surface of the grooved plate, as well as into the copper lid covering the HTS stack and the co - winding). If desired, the copper interconnect between the pancakes can be fabricated within this region. It should be noted that elements similar to those in FIGS. 3 and 3A are given similar reference numerals.

[0118]

[0136] This "coolant channel plate" concept provides significant flexibility for improving (and ideally, optimizing) the coolant path. This can be a useful feature in some applications such as SPARC toroidal field coils. As an alternative, a conduction-cooled plate can be employed to accept designs and applications with low levels of internal volume heating, replacing or even eliminating the coolant channel plate altogether.

[0119]

[0137] To control the quench dynamics and to help reduce the temperature rise of the HTS tape during a quench, a conduction plate (e.g., copper) can be inserted between the double pancakes. One finding is that quench-induced eddy currents will be preferentially induced within these structures, which localizes the magnetic energy deposition to regions thermally and electrically isolated from the HTS tape. Such structures are naturally accommodated by the stacked plate design concept with spiral grooves, and those structures can be directly incorporated into the coolant channel plate design that is electrically isolated from the pancakes and in good thermal contact with the coolant.

[0120]

[0120]

[0138] To control the quench dynamics and to help reduce the temperature rise of the HTS tape during a quench, a high electrical conductivity coating (e.g., copper) and / or an insulating coating (e.g., alumina) can be applied to selected regions of the spiral grooved plate, including but not limited to the grooved and non-grooved sides of the plate. One finding is that the quench-induced current density, distribution, and resulting Joule heating can be controlled by tailoring the resistance of the major electrical paths within the magnet structure.

[0121]

[0121]

[0139] This stacked plate geometry, furthermore, and of course, in Fig. 3A As shown, if desired, it receives the copper interconnects between the pancakes. At the same time, the grooved plate / coolant channel plate assembly can be designed by a suitable choice of materials to maintain a relatively high resistance electrical connection between adjacent pancake windings, which can be used to reduce the magnet charge time in this non-insulated superconducting magnet design.

[0122]

[0140] It may be advantageous to apply a preload to the tape stack in the groove before soldering, or to use a preloading mechanism that eliminates the need for soldering altogether. Figures 2 and 5 illustrate the use of a "wedge shim" to accommodate this, although the use of a hydraulic bladder is also possible (Figure 4) and preferred in many instances.

[0123]

[0123]

[0141] Figure 3 shows two plates 330, 335 having spiral grooves 320 provided therein is a cross-sectional view. Plates 330, 335 have a shared coolant assembly 340 therebetween, which assembly can be a coolant channel (e.g., provided within a coolant channel plate and / or made easy by cutting grooves into the upper surface of the spirally grooved plate and into the copper covering the HTS stack and co-winding, as touched upon above), or a conduction-cooled plate. The double-pancake structure prepared from the spirally grooved plates 330, 335 and the coolant assembly 340 can have a width 341 of about 20 mm, but this width is merely illustrative. In the exemplary embodiment of FIG. 3, the spiral groove 320 includes an HTS tape stack 305 with an optional co-winding material and a cover plate 310 that can be composed of copper or other thermally conductive material. In other embodiments, the cover plate 310 can be eliminated so as to expose the HTS stack and co-winding directly to the coolant or directly to the conduction plate. In this exemplary embodiment, the plate has a length 336 of about 14 mm, the tape and channel 320 are provided with a width 337 of about 4 mm and a length 338 of about 4.5 mm, and one of the channels (here illustrated as channel 320a) is formed or otherwise provided at a distance 339 of about 2.5 mm from the surface of plate 335. However, these dimensions are merely illustrative because the structures described herein can have any of a variety of suitable dimensions.

[0124]

[0142] One embodiment where the coolant assembly 340 is the coolant channel between plates 330, 335 In a configuration, the coolant path established by the channels is not constrained to flow along the HTS stack, and can therefore be optimized for heat removal. For example, short radial paths across the HTS stack that more effectively spread heat across the winding can be used. This can be useful for applications where a high level of internal volume heating of the magnet winding may occur (e.g., toroidal field magnets for SPARC). Additionally, multiple coolant annuli can be used to reduce coolant velocity and drive pressure requirements. Ultimately, the coolant passages can have variable sizes and can be implemented by diverting more volume into the winding section within the structural elements only when those passages are needed. In embodiments with a lower level of internal volume heating, conduction cooling techniques may be appropriate. In this case, the coolant channel plates may be replaced by, or even eliminated by, conduction-cooled plates.

[0125]

[0143] To control the quench dynamics and to help reduce the temperature rise of the HTS tape stack 305 during a quench, a conduction plate (e.g., copper) can be inserted between plates 330, 335 within the coolant channel region 340. Thus, the quench-induced eddy currents will be preferentially induced within the conduction plate, which localizes the dissipation of the stored magnetic energy to a region thermally and electrically isolated from the HTS tape 305.

[0126]

[0144] FIG. 3A is a cross-sectional view of two plates 330, 335 having grooves 320 provided therein FIG. The plates 330, 335 are stacked with respect to a shared coolant assembly 340, which can be a coolant channel plate, a groove in the upper surface of the plate, or a conduction-cooled plate. An interconnect 350 is disposed in the region between the plates 330, 335. This interconnect serves to bridge the current path between the innermost windings of adjacent plates in the magnetic assembly (see 621 in FIG. 6, 621a in FIG. 6A, and 720b in FIG. 6C). In an exemplary embodiment, the interconnect 350 can include copper (e.g., high thermal and electrical conductivity copper) that is soldered to the HTS stack by an interfacial layer (e.g., using an indium or indium alloy interfacial layer) to bridge the connection. Connections soldered at a suitable low melting temperature can further be used. The interconnect 350 combined with the overall electrical connection between the plates 3 30, 335 is configured to receive the bypass current flowing during magnetic charging, while further increasing (and ideally, maximizing) the electrical resistance between the plates 330, 335, which reduces (and ideally, minimizes) the magnet charging time.

[0127]

[0145] FIG. 4 is a cross-sectional view of a magnet 400 including a first plate 430 and a second plate 435 is. An insulator 440 is disposed between the plates 430, 445. In this embodiment, the insulator 440 inhibits (and ideally, prevents) the bypass current generated from magnetic charging from flowing directly across the plates 430 and 435. Instead, such current is forced to flow along the plates and propagate (or jump) across the plates only in the vicinity of the inter-plate interconnect in that embodiment (e.g., interconnect 350 in FIG. 3A) or in the vicinity of the helical HTS tape stack interconnect in that embodiment (e.g., groove 125 in FIG. 1). The insulator can be composed of, but is not limited to, fiber glass composites, mineral insulators (e.g., mica), alumina, or insulating coatings such as alumina.

[0128]

[0146] A spiral groove 420 is provided in plates 430, 435. The co-wound material is included The obtained HTS tape stack 405 is inserted into the groove 420, and a lid assembly 410 (which can be provided as a copper lid assembly, for example) is disposed on top of the HTS tape stack and the co-winding 405.

[0129]

[0147] A bladder element 415 (or, more simply, bladder 415) is disposed within the groove (or channel) to compress the stack 405 against the sidewall 411 of the groove 420. In an embodiment, the bladder 415 can be a hydraulic bladder to which hydraulic fluid can be applied to effect compression. In some embodiments, the bladder 415 is positioned such that the tape stack 405 is compressed against the main load-bearing sidewall. In this example, the tape stack is provided with a width 412 of about 4 mm and a length 413 of about 4.5 mm, and the direction of the main load (i.e., the main Lorentz force (IxB) load) in FIG. 4 is designated by reference numeral 416, which consequently indicates that the sidewall 411 corresponds to the main load-bearing sidewall. The bladder 415 compresses the HTS tape stack 405 such that the impact of the Lorentz force (IxB) load being cyclically applied and released can be reduced (and ideally, minimized). In this illustrative embodiment, one of the channels (here, channel 420a) is formed or otherwise provided at a distance 439 of about 2.5 mm from the surface of the plate 435. However, these dimensions are merely illustrative, because the structures described herein can have any of a variety of suitable dimensions.

[0130]

[0148] In an embodiment, the bladder element is a co-winding element within the HTS tape stack (That is, it may be included as part of the HTS tape laminate.) The bladder element may be configured within the HTS tape laminate to facilitate the soldering process by applying a preload to the HTS tape laminate prior to soldering so as to fix the HTS tape laminate at a desired position. In an embodiment, the bladder element may further be configured within the HTS tape laminate so as to eliminate the need for soldering. The bladder element may further be configured to pre-compress the HTS tape laminate against the load-bearing sidewalls of at least one spiral groove.

[0131]

[0149] In some examples, after the HTS tape laminate 405 is soldered, the hydraulic fluid can be removed and further replaced by an inert gas. In the case where the bladder 415 is empty, the bladder serves as a spring to accommodate the differential thermal contraction of the soldered HTS laminate 405 relative to the grooved plates 430, 435 during magnet cooling and warm-up periods, in order to reduce the risk of HTS laminate and co-winding peel damage.

[0132]

[0150] In other examples, if the hydraulic fluid is retained, the compression force on the HTS tape laminate 405 can be maintained such that the laminate is fully immobilized. The hydraulic fluid can be selected such that it freezes at the magnet operating temperature, eliminating the need to actively maintain the hydraulic pressure.

[0133]

[0151] In some cases, the bladder element is liquid during assembly, but at the magnet operating temperature ​There may be materials that are solid at a certain temperature and enclose (e.g., filled with the material or otherwise disposed of within the material). One such material includes, but is not limited to, gallium. The heat of fusion associated with this material can act as a large thermal reservoir to limit the temperature rise of the tape laminate 405 during a quench event, i.e., to limit the HTS laminate temperature to below the melting temperature of 29.8 degrees Celsius in the case of gallium.

[0134]

[0152] In all of these embodiments, the selection of materials, coatings, conductors , semiconductors, and insulators in the assembly can be used to improve (and ideally optimize) the current shunting and eddy current paths in response to a magnet quench event, and to safely distribute the magnet quench energy over a large volume.

[0135]

[0153] Similar elements are given similar reference names. Now refer to FIGS. 5 - 5A Then, shown is a cross-sectional view of a magnet illustrating an example of how the selection of materials, coatings, conductors, semiconductors, and insulators in a co-wound tape stack and a plate with spiral grooves can be used to control the region of magnet quench energy thermalized quench according to the embodiments described herein. The arrow designated by reference numeral 510 in FIGS. 5-5A represents the flow of a current shunt current driven by a quench event. In this example, current is driven from a first (or lower) HTS tape stack 505a to a second HTS stack 505b (here, the closest neighbor 505b of stack 505a). Taking up the configuration of tape stack 505b as illustrative for tape stack 505a, tape stack 505b is disposed within a groove 506 provided within a plate 530. A wedge shim 508 (or alternatively, a blada) is disposed within the groove 506 adjacent to tape stack 505b. A coolant channel 515 defined by a C-shaped member 520 is disposed in thermal contact with tape stack 505b. A lid 525 is disposed above the coolant channel. The wedge shim 508, coolant channel 515, C-shaped member 520, and lid 525 can be the same or similar (both in structure and function) to the wedge shim (or blada), coolant channel, C-shaped member, and lid described hereinabove in connection with FIGS. 2-4.

[0136]

[0154] The rate of volumetric heat generation in the plate with spiral grooves due to the quench current is ηj 2can be quantified, where j is the current shunt current density and η is the electrical resistivity of the material through which the current flows. In FIG. 5A, an insulator 540 is inserted as a co-wound material at the base of the HTS stack, while in FIG. 5, such an insulator does not exist. Since the insulator exists in FIG. 5A, the quench current flows deeper and over a longer distance into the backbone of the grooved plate 530 compared to the embodiment in FIG. 5. Thus, the volume in which the quench energy is dissipated is larger in FIG. 5A compared to FIG. 5. Alternatively, or in addition, the non-grooved side portions of the spiral grooved plate can be coated with a high electrical conductivity material (e.g., copper) to facilitate the deeper flow of the current shunt current into the backbone of the spiral grooved plate, thereby increasing the volume of the material in which the quench energy is dissipated. can be done.

[0137]

[0155] In overview, FIGS. 6-6C show how a spiral grooved, HTS-filled The interleaved stack of the plates to be embedded and the coolant channel plates (improved by coolant channel grooves machined into the surface of the spiral groove plate, according to some) can be assembled to form a high magnetic field magnet. It should be appreciated that in these illustrations, options for interconnects between the pancakes (such as the copper interconnects described in FIG. 3, for example) are shown. However, it should be understood that the helical tape interconnect option, as described above in connection with FIG. 1, can also be used and is preferred for some applications (such as small fusion applications). In one embodiment, a magnet with a radial build of H = 160 mm, a width W = 140 mm, and a clear bore diameter S = 100 mm is expected to produce approximately 20 Tesla axially using commercially available HTS tape. The spiral grooved plates can be fabricated by additive manufacturing techniques (such as 3D printing) in superalloys such as Inconel 625 using commercially available methods. The stress in the support plates is expected to be well within acceptable limits for 3D printed parts made from Inconel 625.

[0138]

[0156] FIG. 6 is a cross-sectional view of a high magnetic field coil 600 comprising a stack of six spiral grooved double pancakes 605a - 605f, generally represented as 605, each of the double pancakes being associated with coolant channel plates 606a - 606f inserted therebetween or otherwise disposed. As touched upon above, in one embodiment, the high magnetic field coil 600 is expected to achieve approximately 20 Tesla axially using commercially available HTS tape according to the embodiments described herein. FIG. 6 is a cross-sectional view of a high magnetic field coil 600 comprising a stack of six spiral grooved double pancakes 605a - 605f, generally represented as 605, each of the double pancakes being associated with coolant channel plates 606a - 606f inserted therebetween or otherwise disposed. As touched upon above, in one embodiment, the high magnetic field coil 600 is expected to achieve approximately 20 Tesla axially using commercially available HTS tape according to the embodiments described herein.

[0139]

[0157] In this embodiment, the current passes through the external feed-in portion 615 to the top of FIG. 6 flows into and out of each double pancake 605 therein. The current wraps around the spiral grooves of each plate and alternately passes through the cross-sectional views of 635 and 630. In this case, an internal interconnect (represented generally as 621) is used to connect the electrical path across the innermost winding, the spiral winding, similar to the internal connection 350 described above in connection with FIG. 3A. Thus, the pairs of connected spiral-grooved plates effectively form six double pancake sub-assemblies 605a - 605f.

[0140]

[0158] In this embodiment, a feeding portion represented generally as 620 is configured to send and receive coolant into coolant channels 622a - 622f disposed in the middle of the double pancake assembly.

[0141]

[0159] FIG. 6A is a top view of an exemplary magnet assembly 600, the cross-sectional view of which is shown in FIG. 6, of a first spiral-grooved plate 705a. The plate 705a can be provided from any conductive material 706 including a metal or an alloy. Such materials include, but are not limited to, one or more of nickel-based superalloys such as Inconel 718 and Hastelloy C276, austenitic stainless steels, and dispersion-strengthened copper alloys. Factors influencing material selection include, but are not limited to, mechanical strength, electrical conductivity, thermal conductivity, and the coefficient of thermal expansion. In an embodiment, the plate material 706 can include a composite of different materials. The material can be selected to optimize the uniformity of quench energy imparted, structural integrity under load and under off-normal situations, as well as to minimize cost. As touched upon above, additive manufacturing techniques can be readily used to fabricate the plate geometries upon which the magnets can be built.

[0142]

[0160] The first plate 705a is configured to receive an HTS tape stack 710a. It includes an inlet 715a. The HTS tape stack 710a is fed into the groove channels (e.g., the groove or channel 130 in FIG. 1) of the first plate 705a. In this embodiment, the first plate 705a includes the electrical interconnect 621a in the innermost winding, similar to 350 illustrated in FIG. 3A. In this case, the electrical interconnect components are in the shape of a circular ring. The first plate 705a is stacked on a second plate (e.g., the second plate 705b in FIG. 6C), and a cooling plate 730 (e.g., the insulating radial coolant channel plate shown in FIG. 6B) is inserted between the two spiral-grooved plates 705a, 705b. Thus, in this exemplary embodiment, the spiral-grooved plates 705a, 705b and the cooling plate 730 form a double-pancake structure.

[0143]

[0161] In some embodiments, the HTS tape and the co-wound stack include locations where the HTS tape and the co-wound stack enter (715a) and exit (715b) the channels on each of the spiral-grooved plates, and are embedded in copper, or in other cases a suitable high electrical conductivity material, over a wide area that extends without interruption to the current feed connection on the outside of the spiral-grooved plates. This helps protect the HTS from overheating and damage during magnet charging and magnet quench events.

[0144]

[0162] In some embodiments, two or more HTS tape stacks can be disposed within the grooved channels, and separate structures and / or co-wound materials are disposed between the tape stacks, and the dimensions of the channel grooves are appropriately modified to receive these materials and / or to mechanically engage these materials, such as by secondary spiral grooves. In some embodiments, some or all of the co-wound materials can be disposed to mechanically engage the plates, such as by spiral grooves.

[0145]

[0163] The internal electrical interconnect, which perhaps takes the shape of a circular ring in this example case, ​Furthermore, it should be noted that it may be used on the outermost turn to connect between double pancake assemblies.

[0146]

[0164] If the double pancake embodiment of FIGS. 1-1C is used, as shown here It should be noted that there would be no need to use internal interconnects at the innermost turns. Instead, the HTS tape stack and co-wrap would be continuously connected from spiral groove plate 705a to plate 705c. In this case, the coolant channel plates would be placed beside each double pancake assembly, rather than between the two plates that form the double pancake assembly as depicted here.

[0147]

[0165] FIG. 6B shows a tubular coolant passage 735 having radially insulating coolant channels 735 disposed therein. 7 is a top view of the cooling channel plate 730. The cooling channel plate 730 is configured to receive cooling fluid via the coolant inlet assemblies 745a-N. In this embodiment, four separate flow paths of coolant into and out of the cooling channel plate are depicted by arrows. The cooling channel plate is constructed such that it is electrically isolated from the spiral groove plates 705a and 705b when it is placed in the assembly. This feature prevents bypass currents resulting from magnet charging from flowing through the coolant channel plate between the plates 705a and 705b. This function can be accomplished by fabricating the plate from a non-conductive material, such as, but not limited to, a fiberglass composite; applying an insulating coating to an otherwise conductive base material, or by some other suitable means. In some embodiments, the coolant channel plate forms only the side walls of the coolant channels, with the adjacent HTS stack and spiral groove plate forming the remaining walls. In this case, the coolant is in direct contact with the HTS stack and co-windings. In other embodiments, grooves can be cut into the surfaces of adjacent spiral grooved plates and into the copper lid material to serve as coolant channels. The grooves can extend along or across the HTS stack as needed to facilitate cooling, optimize coolant passage length, and minimize pressure drop.

[0148]

[0166] Please note that the coolant paths shown in FIG. 6B are for illustration only. It should be understood that these paths can be tailored by the needs and constraints in magnet design, such as heat removal and structural integrity considerations of the magnet assembly. The coolant channel plate can be replaced by a conductively cooled plate, or eliminated altogether, replaced by a simple insulating material. In the latter case, the coolant channel passages can be formed by cutting grooves into the surface of the spiral grooved plate and into the copper lid material.

[0149]

[0167] FIG. 6C is a top view of the second spiral grooved plate 705b. 1A )。 In this embodiment, the second plate 705b includes an inlet 715b configured to receive an HTS tape stack 710b. The HTS tape stack 710b is fed into the groove channel (e.g., groove channel 135 of FIG. 1A ) of the second plate 705b. The HTS tape stack 710a is fed into the groove channel (e.g., groove channel 135 of FIG. 1A ) of the second plate 705b. In this embodiment, the second plate 705b includes electrical interconnects 720b that align with and mate with the electrical interconnects 720a of the first plate 715a.

[0150]

[0168] In overview, Figures 7-7D show that the HTS tape stack is directly An alternative embodiment of a double pancake assembly of stacked plates with spiral grooves wound within some intervals or grooves with respect to the stack itself is illustrated. FIGS. 7 - 7D further illustrate a portion of the periphery of the outer diameter of the coil and a conductive terminal block spanning the entire periphery of the inner diameter of the coil. In some embodiments, the inner and outer conductive terminal blocks span only a portion of their respective peripheries or the entire periphery of the coil. In an embodiment, the conductive terminal block is provided as a copper terminal block, although any material having a suitable electrical conductivity may be used. The plate with spiral grooves can be fabricated by the techniques described above. In the embodiment of FIGS. 7 - 7D, the HTS stack may include a co-wound material as described above, and it is perceived that the thickness and composition of the stack can be varied along the length of the stack so as to optimize for current density, magnetic field concentration, and quench behavior.

[0151]

[0169] It is perceived that the use of variable-width spiral grooves has several advantages . By varying the width of the grooves, the HTS stack (and co-winding) can be directly wound within each radial groove a given number of times on itself. Doing so enables fine control over the current density distribution within the winding, which can be used to reduce magnetic field strength variations and concentration within the HTS tape due to self-magnetic fields. Under the assumption that the magnetic field will decrease in magnitude with increasing distance from the center of the assembly 800, it is perceived that the HTS stack can withstand a larger number of self-winds within each groove with increasing radial distance from the center of the assembly.

[0152]

[0170] Moreover, the use of variable-width spiral grooves is for the entire length of the HTS tape stack This eliminates the need to cut (or otherwise form or provide) "thin grooves" in the plate. For purposes of this disclosure, a groove is considered "thin" when its depth is more than twice its width. Thus, using plates with variable width spiral grooves provided therein allows for the production of thin HTS tape stacks without the need for using thin grooves. The design further allows the coil and its structure to be separately optimized with respect to magnetic field generation, self-field experienced by the HTS tape, and mechanical loading, i.e., structural stiffness, location for welds and fasteners, location for coolant channels including channels between plates.

[0153]

[0171] Similar elements are given similar reference designations throughout the several views. 7-7D, in which a variable width spiral grooved stacked plate double pancake magnet assembly 800 includes a plate 802 and disposed within the plate is a conductive (e.g., copper) terminal block 804 and an HTS tape stack 806 that is contained within several grooves of varying widths and wound on itself to occupy (and ideally completely occupy - i.e., "fill") the space of each such groove. In particular, magnet assembly 800 includes walls 810, 812, 814, 816, and 818 that define various grooves that are filled by HTS stack 806 (and any co-windings). Magnet assembly 800 further includes a second optional copper terminal block 820 along an inner diameter of the assembly. The magnet assembly 800 further includes an outer structural member 822 and an inner structural member 824, which may be made from the same material as the stacked plates 802.

[0154]

[0172] Grooves in a Double Pancake Magnet Assembly of Stacked Plates with Variable Width Spiral Grooves It is appreciated that the number (and thus the number of walls) can vary depending on the intended use. It is further appreciated that the number of HTS tape stacks and / or co-wound turns in each groove can likewise vary depending on the intended use. Thus, FIG. 7 is merely illustrative, and after reading the description provided herein, one of ordinary skill in the art will appreciate how to adapt the concepts, techniques, and structures described herein to form other embodiments.

[0155]

[0173] Each of the walls 810, 812, 814, 816, and 818 can include cooling means as described above, or provide structural support against the magnetic forces experienced by the HTS tape stack 806, or both.

[0156]

[0174] Each of the walls 810, 812, 814, 816, and 818 can be substantially wound around the magnet assembly 80 0 one or more times (i.e., a portion of those walls). Further, as can be most clearly seen in FIG. 7D, a portion (or even all) of a wall can have a varying (i.e., tapered) thickness at different angular positions (e.g., see wall 818 including wall portions 818a, 818b). Thus, the same continuous wall can appear to have some portion of a varying wall thickness at any given cross-section.

[0157]

[0175] The overall width of a given wall along a given cross-section can be calculated as the sum of the radial extents of each portion of that wall that appears in the cross-section. This overall width can be equal or unequal for different walls in different embodiments, and the overall width of a given wall can vary as a function of the angular position of each cross-section.

[0158]

[0158]

[0176] FIGS. 7A - 7C are, respectively, of the magnet assembly 800 of FIG. 7, along lines A - A, B - B, and a cross-sectional view taken along C-C, while FIG. 7D shows a perspective view of a portion of the magnet assembly 800.

[0159]

[0177] Referring now to FIG. 7A, the plate 802 is shown with the outer diameter of the magnet assembly 800 (adjacent reference number 822) at the lower left side, and the inner diameter of the magnet assembly 800 (adjacent reference number 824) at the upper right side. The copper terminal block 804 is shown at the lower left enclosing a portion 806a of the HTS tape stack 806 on two sides. The third inner surface side of the tape stack portion 806a abuts the wall 810, while the fourth side of the tape stack portion 806a may abut another spiral-grooved magnet assembly (not shown) stacked with respect to its fourth side according to the concepts, techniques, and structures disclosed herein. of the magnet assembly 800, and the inner diameter (adjacent reference number 824) of the magnet assembly 800 at the upper right side. The copper terminal block 804 is shown at the lower left enclosing a portion 806a of the HTS tape stack 806 on two sides. The third inner surface side of the tape stack portion 806a abuts the wall 810, while the fourth side of the tape stack portion 806a may abut another spiral-grooved magnet assembly (not shown) stacked with respect to its fourth side according to the concepts, techniques, and structures disclosed herein. Referring now to FIG. 7A, the plate 802 is shown with the outer diameter of the magnet assembly 800 (adjacent reference number 822) at the lower left side, and the inner diameter of the magnet assembly 800 (adjacent reference number 824) at the upper right side. The copper terminal block 804 is shown at the lower left enclosing a portion 806a of the HTS tape stack 806 on two sides. The third inner surface side of the tape stack portion 806a abuts the wall 810, while the fourth side of the tape stack portion 806a may abut another spiral-grooved magnet assembly (not shown) stacked with respect to its fourth side according to the concepts, techniques, and structures disclosed herein.

[0160]

[0178] Referring to FIGS. 7 and 7A, in the individual cross-section A-A of the magnet assembly 800, four layers of the HTS tape stack 806 are defined by the wall 810 and a portion 812a of the wall 812 and are wound within the groove running between those wall 810 and portion 812a with respect to themselves. Two such layers 806b and 806c of the HTS tape stack 806 are shown in FIG. 7A. It is perceived that making the HTS tape stack 806 layered with respect to itself (e.g., in the form of layers 806b and 806c) can advantageously distribute the self-magnetic field strength within the magnet assembly 800 as desired by individual applications. Referring to FIGS. 7 and 7A, in the individual cross-section A-A of the magnet assembly 800, four layers of the HTS tape stack 806 are defined by the wall 810 and a portion 812a of the wall 812 and are wound within the groove running between those wall 810 and portion 812a with respect to themselves. Two such layers 806b and 806c of the HTS tape stack 806 are shown in FIG. 7A. It is perceived that making the HTS tape stack 806 layered with respect to itself (e.g., in the form of layers 806b and 806c) can advantageously distribute the self-magnetic field strength within the magnet assembly 800 as desired by individual applications.

[0161]

[0179] The layers of the HTS tape stack 806 are with a portion 812a and a portion 81 of the wall 812 2b. As noted above, wall 812 wraps around magnet assembly 800 two or more times, such that two portions 812a and 812b of the wall appear at separate cross sections AA. A channel between these portions 812a and 812b is provided to permit adjacent winding of a single HTS tape stack 806 between the larger groove defined by walls 810 and 812a and the larger groove defined by walls 812b and 814a. Thus, it is seen that an embodiment of magnet assembly 800 may include a single thin stack and still permit high inductance windings.

[0162]

[0180] According to the pattern described above, a portion 812b of the wall 812 is HT 8. The six layers of the stack are wound relative to one another in a groove defined by the portion 812b and a portion 814a of the wall 814. A channel is provided between the portion 814a and a portion 814b of the same wall 814, through which a layer of the HTS tape stack 806 emerges on the other side of the wall 814 as layer 806e. The three layers of the stack are wound relative to one another in a groove defined by the portion 814b of the wall 814 and a portion 816a of the wall 816. A channel is provided between the portion 816a and a portion 816b of the same wall 816, through which a layer of the HTS tape stack 806 emerges on the other side of the wall 816 as layer 806f. The three layers of the stack are wound relative to one another within a groove defined by a portion 816b of wall 816 and a portion 818a of wall 818. A channel is provided between portion 818a and a portion 818b of the same wall 818, and wound through the channel is a layer of HTS tape stack 806.

[0163]

[0181] The innermost portion of the magnet assembly 800, as shown in FIG. It can be occupied by a second optional copper terminal block 820. This non-superconducting terminal block 820 can be used, in some embodiments, to transfer current from (or into) the superconducting HTS tape stack 806. It should be noted that the terminal block 820 can extend completely through the plate 802 to provide an external point of electrical contact. Alternatively, the HTS tape stack 806 can continue the winding of its stack, from the innermost layer 806g, into the adjacent stacked magnet assembly, according to the concepts, techniques, and structures described above. It is perceived that other configurations of the space between the inner wall (e.g., wall 818) and the inner diameter (e.g., member 824) can be used in various embodiments.

[0164]

[0182] Figure 7B is a cross-section of Figure 7 taken along line B-B, showing a similar pattern with the outer diameter of the magnet assembly 80 0 on the left, and the inner diameter on the right. Thus, as described above, the outer member 822 is shown, then the terminal block 804 above the plate 802, and then the layer 806a of the HTS tape stack 806 that wraps through the channel between the terminal block 804 and the wall 810. Next shown are four layers of the stack in the groove between the wall 810 and the outer portion 812a of the wall 812, and then the layer of the stack in the channel between the portions 812a and 812b of the wall 812.

[0165]

[0183] Of particular note is that the portion 812a, as shown in Figure 7B, is in Figure 7A is thicker radially than a corresponding portion 812a of the same wall 812 as shown in FIG. 7A. Thus, the difference between the cross-sections of these figures illustrates how the wall 812 has a varying thickness in different angular directions in the magnet assemblies 800, and in particular, illustrates the tapered shape of the wall 812. Conversely, a portion 812b as shown in FIG. 7B is thinner radially than a corresponding portion 812b of the same wall 812 as shown in FIG. 7A. However, the sum of the radial thicknesses of portions 812a and 812b - i.e., the "overall thickness" of the wall 812 along this cross-section - is the same in both figures and does not vary with the angular direction of the cross-section.

[0166]

[0184] Having a constant overall thickness can be advantageous in some embodiments such that, for example, to the extent that each of portions 812a and 812b provides some structural support to which the magnetic force is directed, this structural support is uniform and does not vary with the angular direction. However, as explained above, in some embodiments, the overall thickness of the wall 812 can vary with the angular direction. Moreover, in some embodiments, the width of the tape laminate can vary with the distance along the laminate, which requires that the wall thickness be adjusted accordingly.

[0167]

[0185] Continuing radially inwards with respect to the description of FIG. 7B, a portion 81 of the wall 812 2b is in contact with the boundary of layer 806d of the HTS tape laminate 806. Six layers of the laminate are wound around each other within a groove defined by a portion 812b and a portion 814a of a wall 814. A channel is provided between a portion 814a and a portion 814b of the same wall 814, and through which is wound the layer of the HTS tape laminate 806 that appears on the other side of the wall 814 as layer 806e. It should be noted that, for the reasons precisely described above, portion 814a is thicker in FIG. 7B than in FIG. 7A, while portion 814b is thinner in FIG. 7B than in FIG. 7A, but the combined thickness of these portions is the same.

[0168]

[0186] Three layers of the laminate are wound around each other within a groove defined by a portion 814b of a wall 814 and a portion 816a of a wall 816. A channel is provided between a portion 816a and a portion 816b of the same wall 816, and through which is wound the layer of the HTS tape laminate 806 that appears on the other side of the wall 816 as layer 806f. Portion 816a is thicker in FIG. 7B than in FIG. 7A, while portion 816b is thinner in FIG. 7B than in FIG. 7A, but the combined thickness of these portions is the same.

[0169]

[0187] Three layers of the laminate are wound around each other within a groove defined by a portion 816b of a wall 816 and a portion 818a of a wall 818. A channel is provided between a portion 818a and a copper terminal block 820, and through which is wound the layer of the HTS tape laminate 806. It should be noted that the terminal block 820 can extend completely through the plate 802 to provide an external point of electrical contact. Further note should be taken that the wall 818 encloses only a single portion 818a in the cross-section B - B illustrated in FIG. 7B. Finally, the material 824 appears along the innermost diameter of the magnet assembly 800. Inner diameter.

[0170]

[0188] Figure 7C is a cross-section of Figure 7 along line C-C, showing the magnet assembly 8 at the top with an outer diameter of 00 and a similar pattern with an inner diameter at the bottom. Thus, the outer member 822 is shown, and then a portion 810a of the wall 810 is shown. Note that the terminal block 804 is not present in this cross-section for reasons discussed below. Next, the layer 806a of the HTS tape laminate 806 wraps through the channel between the portion 810a and a portion 810b of the same wall 810.

[0171]

[0189] Next shown are four layers of the HTS tape laminate 806 in the groove between the wall 810 and an outer portion 812a of the wall 812, including the layers 806b and 806c. Shown below that are the layers of the laminate in the channel between portions 812a and 812b of the wall 812.

[0172]

[0190] Note that a portion 812a as shown in Figure 7C is thicker radially than the corresponding portion 812a of the same wall 812 as shown in Figures 7A and 7B. Thus, the difference between the cross-sections of these figures illustrates how the wall 812 has a varying thickness in different angular directions in the magnet assemblies 800, and in particular, illustrates the tapered shape of the wall 812. Conversely, a portion 812b as shown in Figure 7C is thinner radially than the corresponding portion 812b of the same wall 812 as shown in Figures 7A and 7B. However, the overall thickness of the wall 812 along the cross-section C-C is the same in all three figures and does not vary with the angular direction of the cross-section.

[0173]

[0191] Continuing radially inward (i.e., downward) with respect to the description of Figure 7C , a portion 812b of the wall 812 is in border contact with the layer 806d of the HTS tape laminate 806. Six layers of the laminate are wound relative to each other within a groove defined by the portion 812b and a portion 814a of the wall 814. A channel is provided between the portion 814a and a portion 814b of the same wall 814, and the layer of the HTS tape laminate 806 that appears on the other side of the wall 814 as the layer 806e is wound through that channel. Again, it should be noted that, as described above, the portion 814a is thicker in FIGS. 7A and 7B, while the portion 814b is thinner in FIGS. 7A and 7B, but the combined thickness of these portions is the same.

[0174]

[0192] Three layers of the laminate are wound relative to each other within a groove defined by a portion 814b of the wall 814 and a portion 816a of the wall 816. A channel is provided between the portion 816a and a portion 816b of the same wall 816, and the layer of the HTS tape laminate 806 that appears on the other side of the wall 816 as the layer 806f is wound through that channel. The portion 816a is thicker in FIG. 7C than in FIGS. 7A and 7B, while the portion 816b is thinner in FIG. 7C than in FIGS. 7A and 7B, but the combined thickness of these portions is the same.

[0175]

[0193] Three layers of the laminate are wound relative to each other within a groove defined by a portion 816b of the wall 816 and a portion 818a of the wall 818. An interference channel is provided between the portion 818a (by the material removed from the copper terminal block 820) and the copper terminal block 820, and the layer of the HTS tape laminate 806 is wound through that channel. It should be noted that the terminal block 820 can extend completely through the plate 802 to provide an external point of electrical contact. Further note that the wall 818 encloses only a single portion 818a in the cross-section C-C illustrated in FIG. 7C. Finally, the material 824 appears along the innermost diameter of the magnet assembly 800.

[0176]

[0194] The inlaid conductive strip or plate 804 includes, among other things, a conductive terminal and a backing. This provides a large contact area between the relatively low conductivity material that comprises the plate 802 and between the HTS tape stack 806 and the conductive terminals. In an embodiment, the conductive terminals are provided as copper terminals and the inlaid conductive strips 804 are provided as inlaid copper strips 804. The use of such conductive strips facilitates achieving low joint resistance between the HTS stack tape 806 and the copper terminals.

[0177]

[0195] This feature occurs when the magnet is being charged and during unusual events. It may be useful to have the contact area be large enough to ensure that the current density at the interface between the copper and backplate material 802 is within acceptable limits (e.g., acceptable Joule heating), both for the materials themselves and for the contact resistance between the materials. This includes design considerations of potential damage from overheating during out-of-the-ordinary events, as well as consideration of the Joule heating distribution within the backplate 802 during charging and the impact of that Joule heating distribution on cooling requirements.

[0178]

[0196] Copper plate 804 is an additional plate for receiving the stack and distributing localized heating effects along it. 7A, portion 806a contacts copper plate 804 along two of its sides, and in FIG.

[0179]

[0197] Various embodiments of the concepts disclosed herein are illustrated in the accompanying drawings. It should be understood that the reference is being described. Alternative embodiments can be devised without departing from the broad concept scope described herein. It is noted that various connections and positional relationships (e.g., above, below, adjacent, etc.) will be discussed among elements in the subsequent description and in the drawings. These connections and / or positional relationships can be direct or indirect unless otherwise specified, and the present invention is not intended to be limiting in this regard. Thus, a physical connection can refer to either a direct connection or an indirect connection, and the positional relationship between entities can be a direct positional relationship or an indirect positional relationship. As an example of an indirect positional relationship, a reference in this description to disposing layer or element "A" above layer or element "B" includes the situation where one or more intermediate layers or elements (e.g., layer or element "C") are between layer / element "A" and layer / element "B", provided that the important characteristics and functionality of layer / element "A" and layer / element "B" are not substantially changed by the intermediate layer.

[0180]

[0198] The following definitions and abbreviations will be used for the interpretation of the claims and this specification. As used herein, the terms "comprises (third-person singular present tense)", "comprising (present participle)", "includes (third-person singular present tense)", "including (present participle)", "has (third-person singular present tense)", "having (present participle)", "contains (third-person singular present tense)", or "containing (present participle)", or any other variations thereof, are intended to be non-exclusive inclusion. For example, a composition, mixture, process, method, article, or apparatus that comprises the recited elements is not necessarily limited to only those elements, and can include other elements not expressly recited or that are inherent to such composition, mixture, process, method, article, or apparatus.

[0181]

[0199] In addition, the term "exemplary" means "serving as an example, instance, or illustration". Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. The terms "one or more" and "one or more" are used herein to refer to any embodiment or design. The term "or a plurality" is understood to include any integer number greater than or equal to 1, i.e., 1, 2, 3, 4, etc. The term "plurality" is understood to include any integer number greater than or equal to 2, i.e., 2, 3, 4, 5, etc. The term "connected" can include indirect "connected" and direct "connected."

[0182]

[0200] The present disclosure relates to "one embodiment," "one embodiment," "example embodiment," etc. References in the specification imply that the described embodiment may include a particular feature, structure, or characteristic, but that any and all embodiments may include that particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described as being related to one embodiment, it is submitted that it is within the knowledge of one of ordinary skill in the art to preferentially use such feature, structure, or characteristic as being related to other embodiments, whether or not expressly described.

[0183]

[0201] For purposes of the description provided herein, the terms "upper," "lower," The terms "right", "left", "vertical", "horizontal", "upper", "lower", and their derivatives shall relate to the structures and methods described as being oriented in the figures of the drawings. The terms "above", "atop", "on top of", "positioned above", or "positioned atop" mean that a first element, such as a first structure, exists on a second element, such as a second structure, where intervening elements, such as interfacial structures, can exist between the first and second elements. The term "direct contact" means that a first element, such as a first structure, and a second element, such as a second structure, are connected at the interface of the two elements without any intermediate conductive, insulating, or semiconductor layer.

[0184]

[0202] Those skilled in the art will realize that the concepts, structures, devices, and techniques described herein can be implemented in other specific forms without departing from their spirit, or essential concepts or characteristics. The foregoing embodiments are, therefore, to be considered illustrative rather than restrictive of the broad concepts sought to be protected in all respects. The scope of the concept is thus indicated rather by the appended claims than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are, therefore, intended to be embraced therein.

Claims

1. a conductive plate having a groove; a high temperature superconductor (HTS) tape stack disposed within the groove, the HTS tape stack having a spiral shape; An apparatus comprising:

2. The apparatus of claim 1 , wherein the groove has a spiral shape.

3. The apparatus of claim 1 or 2, wherein the conductive plate comprises a metal or a metal alloy.

4. The apparatus of claim 1 , further comprising a coolant channel.

5. The apparatus of claim 4 , wherein the coolant channel is disposed within the groove.

6. The apparatus of claim 4 , wherein the coolant channel is disposed outside the groove.

7. 7. The apparatus of claim 1, wherein the HTS tape stack is a non-insulating HTS tape stack.

8. 8. The apparatus of claim 1, wherein the HTS tape stack includes a plurality of turns, and the conductive plate provides electrical connections between each turn of the plurality of turns.

9. The apparatus of claim 1 , further comprising a shim or bladder within the groove.

10. the conductive plate is a first conductive plate, the groove is a first groove, the HTS tape stack is a first HTS tape stack, and the apparatus comprises: a second conductive plate having a second groove; a second HTS tape stack disposed in the second groove, the second HTS tape stack having a spiral shape; and Further equipped with the first HTS tape stack is electrically coupled to the second HTS tape stack; 10. Apparatus according to any one of claims 1 to 9.

11. The apparatus of claim 10 , wherein the first conductive plate is electrically isolated from the second conductive plate.

12. 12. The apparatus of claim 10 or 11, wherein the first and / or second conductive plates have one or more alignment structures for aligning the first and second conductive plates when the first and second conductive plates are assembled together.

13. 13. The apparatus of claim 10, further comprising a conductive connection between the first HTS tape stack and the second HTS tape stack.

14. 14. The apparatus of claim 13, wherein the conductive connection comprises a high temperature superconductor or a metal that is not a superconductor at temperatures above 30 degrees Kelvin.

15. 15. The apparatus of claim 13 or 14, wherein the conductive connection comprises copper.

16. 16. The apparatus of claim 13, wherein the conductive connection is formed between an innermost turn of the first and second HTS tape stacks or between an outermost turn of the first and second HTS tape stacks.

17. 17. The apparatus of claim 13, 14, or 16, wherein the first HTS tape stack and the second HTS tape stack are the same HTS tape stack.

18. 20. The apparatus of claim 17, wherein a transition between the first HTS tape stack and the second HTS tape stack is formed by a spiral portion of the same HTS tape stack.

19. 19. The apparatus of claim 1, wherein the first groove includes at least first and second turns, the first turn having a first width and the second turn having a second width, the second width being greater than the first width.

20. 20. The apparatus of claim 19, wherein the second turn of the groove comprises a plurality of turns of the HTS tape stack.

21. 21. The apparatus of claim 1 , wherein the apparatus includes a magnet.

22. 22. The apparatus of claim 1, wherein the HTS tape stack comprises a rare earth oxide.

23. 23. The apparatus of any of claims 1 to 22, wherein the HTS tape stack comprises rare earth barium copper oxide.

24. 24. The apparatus of any of claims 1 to 23, further comprising a conductive terminal block electrically coupled to the HTS tape stack.

25. forming a conductive plate having a groove; disposing a high temperature superconductor (HTS) tape stack in a spiral configuration into the groove; A manufacturing method including:

26. a first conductive plate having at least one groove therein having a spiral shape; a second conductive plate disposed above the first plate, the second plate being provided with at least a groove having a spiral shape such that when a first surface of the first plate is disposed above a first surface of the second plate, the groove forms a spiral channel having an opening at a first end of the spiral channel on the first plate, a spiral shaped path into the second plate, and an outward path on the second conductive plate; an electrically insulating material disposed between the first plate and the second plate; a non-insulated (NI) high temperature superconductor (HTS) tape stack having a predetermined length such that the NI HTS tape stack may be disposed within the channel formed by the grooves of the first and second conductive plates to form a continuous path from a first outermost surface of the first conductive plate to a second outermost surface of the second conductive plate, the HTS tape being configured within the channel such that in response to an applied force, the HTS tape stack distributes forces into the first and second conductive plates; 1. A stacked plate magnet assembly comprising:

27. 27. The stacked plate magnet assembly of claim 26, wherein the NI HTS tape stack further comprises a co-wound material disposed within the channel such that the NI HTS tape and co-wound stack follow a path from a first outermost surface of the first conductive plate to a second outermost surface of the second conductive plate, the HTS tape and co-wound stack configured within the channel such that in response to an generated force, the HTS tape and co-wound stack distributes a force into the first and second conductive plates, and the co-wound material may be provided as one or more of an electrically conductive material, an electrically insulating material, and / or a semi-conductive material.

28. 27. The stacked plate magnet assembly of claim 26, wherein two or more HTS tape stacks are disposed into the groove with material disposed between the stacks.

29. 30. The magnet assembly of claim 28, wherein material disposed between the stacks is mechanically connected to the plates.

30. 30. The magnet assembly of stacked plates of claim 29, wherein the material disposed between the stacks is disposed in a spiral groove in the plates, separate from or in association with the tape stacks.

31. 28. The stacked plate magnet assembly of claim 27, wherein the material comprising the NI HTS tape stack in the first and second plates is continuous across the plates.

32. The NI HTS tape stack comprises two or more NI HTS tape stacks joined by low resistance electrical connections.

32. The stacked plate magnet assembly of claim 31 constructed from HTS tape stacks.

33. 27. The stacked plate magnet assembly of claim 26, wherein the NI HTS tape stack comprises one or more HTS tapes, and the number, size, and type of HTS tapes in the NI HTS tape stack vary along the length of the NI HTS tape stack.

34. 27. The stacked plate magnet assembly of claim 26, wherein said grooves in said first and second conductive plates are substantially identical.

35. 33. The stacked plate magnet assembly of claim 32, wherein the first and second conductive plates have substantially identical spiral shaped grooves, and the first and second plates are assembled back-to-back or front-to-front.

36. 34. The stacked plate magnet assembly of claim 33, wherein the channel defines an inward spiral on the first conductive plate, the inward spiral having a first end and a second end, a spiral opening having a first end and a second end, the first end of the spiral opening being coupled to the second end of the inward spiral and a second end leading to the second conductive plate being coupled to a first end of an outward spiral disposed in the second conductive plate.

37. 37. The stacked plate magnet assembly of claim 36, further comprising a bladder disposed within said channel with said HTS tape stack.

38. 28. The stacked plate magnet assembly of claim 27, wherein the co-wound materials and surface coatings are selected to optimize magnet quench behavior.

39. The HTS tape and the co-wound stack are stacked.

28. The stacked plate magnet assembly of claim 27, wherein the HTS tape and co-wound stack pass between the stacked plates; the HTS tape and co-wound stack enter and exit the magnet assembly; and electrical interconnects are embedded in a matrix of high electrical conductivity material at the locations where the spiral windings are formed between the stacked plates.

40. 27. The stacked plate magnet assembly of claim 26 further comprising a bladder contained within said HTS tape stack.

41. 41. The stacked plate magnet assembly of claim 40, wherein the bladder is configured within the HTS tape stack to preload the HTS tape stack prior to soldering or to eliminate the need for soldering.

42. 41. The stacked plate magnet assembly of claim 40, wherein said bladder element is configured within said HTS tape stack to eliminate the need for soldering.

43. 41. The stacked plate magnet assembly of claim 40, wherein said bladder element is configured to pre-compress said HTS tape stack against a load-bearing sidewall of said at least one spiral groove.

44. 41. The stacked plate magnet assembly of claim 40, wherein the bladder element contains a material that is liquid or gaseous during magnet assembly and is solid, liquid or gaseous or expelled during magnet operation.

45. 40. The stacked plate magnet assembly of claim 38, wherein said bladder element contains a material that exhibits a solid to liquid and / or liquid to gas phase change during magnet operation.

46. 27. The stacked plate magnet assembly of claim 26 further comprising at least one coolant channel.

47. 47. The stacked plate magnet assembly of claim 46, wherein said coolant channel comprises one or more coolant passages disposed along said HTS tape stack.

48. 47. The stacked plate magnet assembly of claim 46, wherein said at least one coolant channel comprises one or more cooling channel plates interleaved with one or both of said first plate and second plate.

49. 47. The stacked plate magnet assembly of claim 46, wherein said at least one coolant channel comprises one or more coolant paths disposed along a path different from a path of said HTS tape stack.

50. 27. The stacked plate magnet assembly of claim 26, further comprising a conductive plate interposed between said first plate and said second plate.

51. 27. The stacked plate magnet assembly of claim 26, further comprising high electrical conductivity coatings on said plates at selected locations.

52. 27. The stacked plate magnet assembly of claim 26, wherein said conductive plates comprise, in whole or in part, copper.

53. 51. The stacked substrate of claim 50, wherein the conductive plate comprises, in whole or in part, copper. Plate magnet assembly.

54. 51. The stacked plate magnet assembly of claim 50, wherein said conductive plates are configured to provide conductive cooling.

55. 27. The stacked plate magnet assembly of claim 26, further comprising one or more low resistance electrical interconnects between said NI HTS stacks in said first and second plates configured to maintain a high resistance electrical connection between said stacked plates.

56. 1. A method for constructing a high field stacked plate magnet assembly, comprising: assembling a series of identical non-insulated (NI) high temperature superconductor (HTS) packed spiral grooved plates stacked between coolant channel plates, conduction cooled plates, or insulating plates, the NI HTS tape stack forming a continuous path from a first end to a second end, or a low electrical resistance path from the first end to the second through the use of interconnects; forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having low resistance characteristics; A method comprising:

57. 57. The method of claim 56, wherein forming one or more pancake-to-pancake connections comprises automatically forming one or more pancake-to-pancake connections.

58. 58. The method of claim 57, further comprising the step of preloading the HTS tape stack within the spiral grooved plate.

59. a first conductive plate having a first surface with a plurality of spiral-shaped grooves disposed therein, the spiral-shaped grooves being defined by one or more spiral-shaped walls, at least two grooves of the plurality of grooves having different widths; a second conductive plate disposed above the first plate such that when the first surface of the first plate is disposed above the first surface of the second plate, the groove forms a spiral channel, the spiral channel having an opening at a first end of the spiral channel; a non-insulated (NI) high temperature superconductor (HTS) tape stack having a predetermined length such that the NI HTS tape stack can be disposed within the plurality of spiral shaped grooves of the first conductive plate and such that the NI HTS tape stack forms a continuous path between an outermost groove in the first conductive plate and an innermost groove of the first conductive plate, the HTS tape being configured within each groove such that in response to an applied force, the HTS tape stack distributes forces into the first and second conductive plates; 1. A stacked plate magnet assembly comprising:

60. 60. The stacked plate magnet assembly of claim 59, wherein the HTS tape stack is disposed in one of the plurality of grooves of varying width and is wound on itself to occupy the width of the groove.

61. 60. The stacked plate magnet assembly of claim 59, wherein the walls defining the groove in the first conductive plate are provided with a variable wall thickness such that a thickness of a first portion of a wall is different from a thickness of a second portion of the same wall.

62. 60. The stacked plate magnet assembly of claim 59, wherein the walls defining the groove in the first conductive plate are provided having different wall thicknesses.

63. 63. The stacked plate magnet assembly of claim 62, wherein a thickness of a first portion of a first wall in a first radial direction as measured from a center of the first conductive plate is different from a thickness of a first portion of a second, different wall along the same first radial direction.

64. 60. The stacked plate magnet assembly of claim 59, wherein said first and second conductive plates have substantially identical spiral shaped grooves.

65. The NI HTS tape stack comprises two or more NI HTS tape stacks joined by low resistance electrical connections.

65. The stacked plate magnet assembly of claim 64 constructed from HTS tape stacks.

66. 65. The stacked plate magnet assembly of claim 64, wherein the material comprising said NI HTS tape stack in said first and second plates is continuous across said plates.

67. 60. The stacked plate magnet assembly of claim 59, wherein said NI HTS tape stack further comprises a co-wound material disposed within said grooves such that said NI HTS tape and co-wound stack follow a path between a first outermost groove of said first conductive plate and an innermost groove of said first conductive plate, said HTS tape and co-wound stack configured within said grooves such that in response to an applied force, said HTS tape and co-wound stack distributes force into said first and second conductive plates.

68. 68. The stacked plate magnet assembly of claim 67, wherein said co-wound material is provided as one or more of an electrically conductive material, an electrically insulating material, and / or a semi-conductive material.

69. 68. The stacked plate magnet assembly of claim 67, wherein said co-wound materials are selected to optimize magnet quenching behavior, or magnet charging behavior, or both.

70. The HTS tape and the co-wound stack are The HTS tape and co-wound stack are passed between the stacked plates; the HTS tape and co-wound stack entering and exiting the magnet assembly; and Electrical interconnections are formed between the spiral windings.

68. The stacked plate magnet assembly of claim 67, embedded within a matrix of high electrical conductivity material at locations.

71. 68. The stacked plate magnet assembly of claim 67, wherein said co-wound material varies in either composition or thickness along the length of said NI HTS tape stack.

72. 60. The stacked plate magnet assembly of claim 59, wherein electrically insulating material is disposed in selected areas between said stacked plates.

73. 60. The stacked plate magnet assembly of claim 59, wherein the NI HTS tape stack comprises one or more HTS tapes, and the number, size, and type of HTS tapes within the NI HTS tape stack vary along the length of the NI HTS tape stack.

74. The groove defines an inward spiral on the first conductive plate, the inward spiral having a first end and a second end, the first conductive plate having a spiral opening disposed therein, the spiral opening having a first end and a second end, 74. The stacked plate magnet assembly of claim 73, wherein said first end of a shear opening is coupled to said second end of said inward spiral and said second end of said helical opening leading to said second conductive plate is coupled to a first end of an outward spiral provided in said second conductive plate.

75. 60. The stacked plate magnet assembly of claim 59 further comprising a bladder contained within said HTS tape stack.

76. 76. The stacked plate magnet assembly of claim 75, wherein said bladder element is configured to pre-compress said HTS tape stack against a load-bearing sidewall of said at least one spiral groove.

77. 76. The stacked plate magnet assembly of claim 75, wherein said bladder element contains a material that is liquid or gaseous during magnet assembly and is solid, liquid or gaseous or expelled during magnet operation.

78. 76. The stacked plate magnet assembly of claim 75, wherein said bladder element contains a material that exhibits a solid to liquid and / or liquid to gas phase change during magnet operation.

79. 60. The stacked plate magnet assembly of claim 59, wherein said first conductive plate has at least one coolant channel provided therein.

80. 80. The stacked plate magnet assembly of claim 79, wherein said coolant channel comprises one or more coolant passages disposed along said HTS tape stack.

81. 81. The stacked plate magnet assembly of claim 80, wherein said at least one coolant channel comprises one or more cooling channel plates interleaved with one or both of said first plate and second conductive plate.

82. 81. The stacked plate magnet assembly of claim 80, wherein said at least one coolant channel comprises one or more coolant paths disposed along a path different from a path of said HTS tape stack.

83. 60. The stacked plate magnet assembly of claim 59, further comprising a conductive plate interposed between said first conductive plate and said second conductive plate.

84. 60. The stacked plate magnet assembly of claim 59, further comprising a high electrical conductivity coating disposed on selected locations of at least one of said first and second conductive plates.

85. 85. The stacked plate magnet assembly of claim 84, wherein said conductive plates comprise, in whole or in part, copper.

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