Display device

Abstract

To provide a display device having both a touch detection function and a fingerprint imaging function.SOLUTION: The display device includes a light-emitting element, a light receiving element, a first conducting layer, a second conducting layer, and an insulator layer. The light-emitting element includes a first pixel electrode, a luminous layer, and a common electrode. The light receiving element includes a second pixel electrode, an active layer, and a common electrode. The first pixel electrode and the second pixel electrode are provided on the same plane. The common electrode includes a portion serving as the first pixel electrode via the luminous layer, and a portion serving as the second pixel electrode via the active layer. The first conducting layer, the second conducting layer, and the insulator layer are provided above the common electrode, the insulator layer is provided above the first conducting layer, and the second conducting layer is provided above the insulator layer, respectively. The light receiving element has a function of receiving light emitted by the light-emitting element.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An aspect of the present invention relates to a display device.An aspect of the present invention relates to an imaging device. TECHNICAL FIELD One aspect of the present invention relates to a touch panel. 1. Field of the Invention One aspect of the present invention relates to an authentication method for an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a storage device, and a , electronic device, lighting device, input device, input / output device, driving method thereof, or manufacturing method thereof A semiconductor device functions by utilizing the semiconductor properties. This refers to all devices that can do this. [Background technology]

[0003] In recent years, mobile phones such as smartphones, tablet-type information terminals, and notebook PCs (personal computers) have Information terminal devices such as personal computers (PCs) are becoming more and more common. However, as such information often contains personal information, various authentication technologies have been developed to prevent unauthorized use. It has been issued.

[0004] For example, Patent Document 1 discloses an electronic device equipped with a fingerprint sensor in a push button switch. has been disclosed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US Patent Application Publication No. 2014 / 0056493 Summary of the Invention [Problem to be solved by the invention]

[0006] When adding an authentication function such as fingerprint authentication to an electronic device that functions as an information terminal device, A module for capturing fingerprint images must be installed in the electronic device. As the number of devices increases, the cost of electronic devices also increases.

[0007] An object of one embodiment of the present invention is to reduce the cost of an electronic device having an authentication function. Another object of the present invention is to reduce the number of components in an electronic device. It is an object of the present invention to provide a display device capable of displaying a touch image. It is an object of the present invention to provide a display device having both a fingerprint capturing function and a fingerprint capturing function. One object is to provide an electronic device that has an authentication function and a high screen occupancy rate.

[0008] An object of one aspect of the present invention is to provide an authentication method with a high level of security. Another object of the present invention is to provide a user-friendly authentication method. The object of the present invention is to provide a novel display device, electronic device, authentication method, or program. It shall be one of the following.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary for one embodiment to solve all of these problems. The subject matter can be extracted from descriptions in the specification, drawings, claims, etc. [Means for solving the problem]

[0010] One embodiment of the present invention is a semiconductor device including a light-emitting element, a light-receiving element, a first conductive layer, a second conductive layer, and an insulating layer. The light-emitting element has a first pixel electrode, a light-emitting layer, and a common electrode. The light receiving element includes a second pixel electrode, an active layer, and a common electrode. The pixel electrode and the second pixel electrode are provided on the same surface. The common electrode is connected to the light emitting layer via the light emitting layer. A portion overlapping the first pixel electrode and a portion overlapping the second pixel electrode via an active layer. The first conductive layer, the second conductive layer, and the insulating layer are provided above the common electrode. The first conductive layer is provided above the first conductive layer, and the second conductive layer is provided above the insulating layer. The light receiving element has a function of receiving light emitted by the light emitting element.

[0011] Another embodiment of the present invention is a semiconductor device including a light-emitting element, a light-receiving element, a first conductive layer, and a second conductive layer. The display device has a first pixel electrode, an insulating layer, and a protective layer. The light receiving element has a second pixel electrode, an active layer, and a common electrode. The first pixel electrode and the second pixel electrode are provided on the same surface. The electrode has a portion overlapping the first pixel electrode via the light-emitting layer, and a portion overlapping the second pixel electrode via the active layer. The protective layer is provided above the common electrode. The first conductive layer has a protective layer. The insulating layer is provided above the first conductive layer and the protective layer. The conductive layer is provided above the insulating layer. The light receiving element receives light emitted by the light emitting element. It has the function of

[0012] In the above, it is preferable that the first conductive layer has a plurality of openings. The light emitting element overlaps one of the openings of the first conductive layer, and the light receiving element overlaps the other of the openings of the first conductive layer. It is preferable that the number of overlapping portions is one of the numbers.

[0013] In the above, it is preferable to have a common layer. In this case, the common layer is A portion located between the pixel electrode and the common electrode and a portion located between the second pixel electrode and the common electrode In addition, the light-emitting layer and the active layer preferably have different organic compounds. It is preferable that the material includes

[0014] Another embodiment of the present invention is a display device in which display elements and light receiving elements are arranged in a matrix. US20130232633A1 - Authentication of electronic device having a touch sensor, a display unit, and an authentication unit - Google Patents The method includes the steps of: detecting a position of a finger touching a display unit by a touch sensor; A step of acquiring information, the step of acquiring information from a display element located in a first region of the display unit including the position touched by the finger. A step of imaging the first area with a light receiving element and acquiring fingerprint information. and executing user authentication processing by an authentication unit using the fingerprint information.

[0015] Another embodiment of the present invention is a display device in which display elements and light receiving elements are arranged in a matrix. US20130232633A1 - Authentication of electronic device having a touch sensor, a display unit, and an authentication unit - Google Patents The method includes the following steps: displaying a screen for notifying a user of a touch position on a display unit; A step of displaying an image and detecting that the touch position is touched by a touch sensor. A step of lighting a display element located in a first area including the touch position of the display unit. Step 2: A step of capturing an image of the first area by the light receiving element and acquiring fingerprint information. , performing a user authentication process using the fingerprint information.

[0016] Another embodiment of the present invention is a display device in which display elements and light receiving elements are arranged in a matrix. The electronic device has a touch sensor for detecting a touch on a display unit, and an authentication unit. The program for causing the display to be displayed includes the following steps: acquiring position information of a finger touching the display unit; A step of lighting a display element located in the first area. A step of acquiring information, and performing user authentication processing using the fingerprint information by an authentication unit. Step.

[0017] Another embodiment of the present invention is a display device in which display elements and light receiving elements are arranged in a matrix. The electronic device has a touch sensor for detecting a touch on a display unit, and an authentication unit. The program for causing a user to touch the display unit includes the following steps: A step of displaying an image informing the touch position. A step of detecting that a display element located in a first area including the touch position of the display unit has been touched. A step of imaging the first area with a light receiving element and acquiring fingerprint information. and executing user authentication processing by an authentication unit using the fingerprint information. Effect of the Invention

[0018] According to one aspect of the present invention, it is possible to reduce the cost of electronic devices having authentication functions. Alternatively, the number of parts in an electronic device can be reduced. Alternatively, imaging a fingerprint or the like can be performed. Alternatively, a display device having both a touch detection function and a fingerprint image capturing function can be provided. A display device can be provided. Alternatively, an electronic device having a fingerprint authentication function and a high screen occupancy rate can be provided. We can provide it.

[0019] According to another aspect of the present invention, an authentication method with a high level of security can be provided. According to one aspect of the present invention, a novel display An apparatus, an electronic device, an authentication method, or a program can be provided.

[0020] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. can be extracted from descriptions in the specification, drawings, claims, etc. [Brief description of the drawings]

[0021] [Figure 1] 1A to 1C are diagrams showing configuration examples of a display device. [Diagram 2] 2A and 2B are diagrams showing a configuration example of a display device. [Diagram 3] 3A and 3B are diagrams showing a configuration example of a display device. [Figure 4] 4A to 4C are diagrams showing configuration examples of the display device. [Diagram 5] 5(A) and 5(B) are diagrams showing configuration examples of a display device. [Figure 6] 6A to 6C are diagrams showing configuration examples of a touch sensor. [Figure 7] FIG. 7 is a diagram illustrating a configuration example of a touch sensor and a pixel. [Figure 8] FIG. 8 is a diagram illustrating a configuration example of a touch sensor and a pixel. [Figure 9] 9A and 9B are diagrams showing configuration examples of a touch sensor and a pixel. [Figure 10] FIG. 10 is a diagram illustrating a configuration example of a touch sensor and a pixel. [Figure 11] FIG. 11 is a diagram showing a configuration example of a display device. [Figure 12]FIG. 12 is a diagram showing an example of the configuration of a display device. [Figure 13] 13A and 13B are diagrams showing configuration examples of a display device. [Figure 14] 14(A) and 14(B) are diagrams showing configuration examples of a display device. [Figure 15] FIG. 15 is a diagram showing a configuration example of a display device. [Figure 16] FIG. 16 is a diagram illustrating an example of a device configuration. [Figure 17] FIG. 17 is a flowchart illustrating an example of an authentication method. [Figure 18] 18A to 18C are diagrams showing examples of how electronic devices are used. [Figure 19] FIG. 19 is a flowchart illustrating an example of an authentication method. [Figure 20] 20(A) and 20(B) are diagrams showing examples of how the electronic device is used. [Figure 21] 21(A) and 21(B) are diagrams showing configuration examples of electronic devices. [Figure 22] 22A and 22B are diagrams showing configuration examples of pixel circuits. [Diagram 23] 23(A) and 23(B) are diagrams showing configuration examples of electronic devices. [Figure 24] 24A to 24D are diagrams showing configuration examples of electronic devices. [Diagram 25] 25A to 25F are diagrams showing configuration examples of electronic devices. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, the embodiments will be described with reference to the drawings. The present invention may be embodied in various different forms without departing from its spirit and scope. It will be readily understood by those skilled in the art that various modifications and changes may be made to the embodiments and details of the present invention. However, the present invention should not be construed as being limited to the description of the following embodiments.

[0023] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be used.

[0024] In each figure described in this specification, the size, layer thickness, or area of ​​each component may differ from that shown in the drawings. The figures may be exaggerated for clarity and are not necessarily limited to scale. I can't.

[0025] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0026] In the following, expressions indicating directions such as "up" and "down" basically correspond to the directions in the drawings. However, for ease of explanation and other purposes, The orientation of "up" or "down" may not be consistent with the drawings. When explaining the stacking order (or formation order) of a laminate, etc., The surface to be bonded (the surface to be formed, the supporting surface, the adhesive surface, the flat surface, etc.) is located above the laminate. Even if the object is placed in a certain position, the direction may be described as "down" and the opposite direction as "up."

[0027] In this specification, a display panel, which is one aspect of a display device, displays (outputs) images on a display surface. Therefore, the display panel is one aspect of an output device.

[0028] In the present specification, the substrate of the display panel is provided with, for example, an FPC (Flexible Printed Circuit). inted Circuit) or TCP (Tape Carrier Packa ge) or COG (Chip On Gauge) connectors attached to the board. Display module is a device that has ICs mounted using a method such as display glass. It may be called a display panel, a display unit, or simply a display panel.

[0029] In this specification and the like, a touch panel, which is one aspect of a display device, is a device for displaying images, etc. on a display surface. The function of displaying information and detecting when a detectable object such as a finger or stylus touches, presses, or approaches the display surface. The touch panel also functions as a touch sensor that detects the touch of the touch panel. A card is one form of input / output device.

[0030] The touch panel is, for example, a display panel (or display device) with a touch sensor, A touch panel can also be called a display panel (or display device) with touch function. Alternatively, the display panel may have a touch sensor panel. It may also be configured to have a touch sensor function inside or on its surface.

[0031] In addition, in this specification, a touch panel substrate on which a connector or IC is mounted is referred to as a touch panel. It may be called a touch panel module, a display module, or simply a touch panel. be.

[0032] (Embodiment 1) In this embodiment, a display device according to one embodiment of the present invention and an electronic device including the display device will be described. I will explain this in more detail.

[0033] A display device according to one embodiment of the present invention includes a plurality of display elements and a plurality of light receiving elements (also called light receiving devices). The display element includes a light-emitting element (also called a light-emitting device) and a touch sensor. It is preferable that the light receiving element is a photoelectric conversion element. A case where a light-emitting element is used as the display element will be described.

[0034] A display device is a device that displays images on a display surface by using display elements arranged in a matrix. Possesses the ability.

[0035] The display device can also capture images of objects that touch or approach the display surface. For example, a part of the light emitted by the light-emitting element is reflected by the object, and the reflected light is incident on the light-receiving element. In addition, the light receiving element can output an electrical signal according to the intensity of the incident light. Therefore, by having a display device with a plurality of light receiving elements arranged in a matrix, It is possible to obtain (or capture) the position and shape of the body as data. That is, the display device can function as an image sensor panel, etc. The device can capture an image of the fingerprint of a fingertip touching the display surface.

[0036] The display device also includes a touch sensor that acquires position information of an object touching or approaching the display surface. The touch sensor is a resistive type, a capacitive type, an infrared type, an electromagnetic type, Various methods can be used, such as an induction method or a surface acoustic wave method. It is preferable to use a capacitive touch sensor.

[0037] The capacitance type includes the surface capacitance type and the projected capacitance type. The shadow type capacitance method includes the self-capacitance method and the mutual capacitance method. This is preferable because it enables simultaneous multi-point detection.

[0038] Mutual capacitance type touch sensors are connected to electrodes to which a pulse potential is applied and a detection circuit. The touch sensor may have a plurality of electrodes, each of which is connected to a touch panel. When the touch sensor is placed close to the touch panel, the capacitance between the electrodes changes, allowing the sensor to detect the change. It is preferable that the electrodes constituting the sensor are disposed closer to the display surface than the light emitting element and the light receiving element. .

[0039] When using light-emitting elements as display elements, OLED (Organic Light Emitting Diode) is used. Emitting Diode) and QLED(Quantum-dot Light E) It is preferable to use an EL element such as a light-emitting diode. The luminescent materials that can be used include fluorescent materials, phosphorescent materials, and Substances that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence ed delayed fluorescence (TADF) materials), inorganic compounds (amount As light emitting devices, micro LEDs (Light Emitting Diodes) are also available. Alternatively, an LED such as a LED (High T Emitting Diode) can be used.

[0040] As the light receiving element, for example, a pn type or pin type photodiode can be used. The light receiving element acts as a photoelectric conversion element that detects the light incident on the light receiving element and generates an electric charge. The amount of charge generated by a photoelectric conversion element is determined according to the amount of incident light. As the light receiving element, it is preferable to use an organic photodiode having a layer containing an organic compound. Organic photodiodes are easy to make thin, lightweight, and large in area, and are also easy to fabricate. Since there is a high degree of freedom in shape and design, it can be applied to a variety of display devices.

[0041] The light-emitting element may have a laminated structure including a light-emitting layer between a pair of electrodes. The light receiving element may have a laminated structure including an active layer between a pair of electrodes. The active layer can be made of a semiconductor material. For example, an organic semiconductor material containing an organic compound can be used. For example, an inorganic semiconductor material such as silicon can be used.

[0042] In particular, it is preferable to use an organic compound for the active layer of the light receiving element. It is preferable that one electrode (also called a pixel electrode) of each of the light receiving element and the light receiving element is provided on the same surface. Furthermore, the other electrode of the light emitting element and the light receiving element is preferably formed from a single continuous conductive layer. It is more preferable that the light emitting element and the light receiving element are connected to each other through a common electrode. It is more preferable that the light emitting element and the light receiving element have a common layer. Since some of the manufacturing processes can be shared, the manufacturing process can be simplified and manufacturing costs can be reduced. This makes it possible to improve the manufacturing yield.

[0043] In addition, a metal or alloy material is used as a conductive layer that functions as an electrode of a touch sensor. In this case, the conductive layer preferably has an opening for transmitting light emitted from the light emitting element, and It is preferable that each of the light receiving elements has an opening through which the light received by the light receiving element passes. For example, The conductive layer has a top surface shape having a plurality of openings, preferably a lattice-like top surface shape, and the conductive It is preferable that one of the openings in the layer overlaps with the light emitting element and the other overlaps with the light receiving element. By adopting such a configuration, the light emitting area of ​​the light emitting element and the light receiving area of ​​the light receiving element are not impaired. This allows the conductive layer to be made of a low-resistance material such as a metal or alloy material. It combines high quality display, high quality image capture, and highly sensitive touch sensing. It is possible to realize a display device equipped with the above-mentioned.

[0044] In addition, a transparent electrode that transmits light emitted by the light-emitting element is used as the electrode of the touch sensor. In this case, the light-transmitting electrode is arranged so as to overlap the light-emitting element and the light-receiving element. It can be done.

[0045] The light emitting element and the light receiving element can be provided between a pair of substrates. A substrate having rigidity such as a glass substrate may be used, or a flexible film may be used. In this case, the electrodes of the touch sensor can be formed on the substrate located on the display surface side. Alternatively, the electrodes of the touch sensor may be formed on another substrate and attached to the display surface side. .

[0046] In addition, it is preferable that the electrodes of the touch sensor are disposed between the pair of substrates. A protective layer is provided to cover the light emitting element and the light receiving element, and an electrode of the touch sensor is provided on the protective layer. This can reduce the number of parts and simplify the manufacturing process. In addition, the thickness of the display device can be reduced, and this is particularly advantageous for flexible displays that use flexible films as substrates. This is suitable for use as a flexible display.

[0047] The display device according to one embodiment of the present invention has a function of capturing an image of a fingerprint for fingerprint authentication or the like. There is no need to provide an imaging module, and the number of electronic components can be reduced. Since fingerprints can be captured by touch, a fingerprint capture unit is installed separately on the housing of the electronic device. There is no need to install a screen, and the screen occupancy rate of the electronic device (the ratio of the screen area to the surface area of ​​the electronic device) Therefore, it is easy to make the screen larger without increasing the size of the housing.

[0048] A more specific configuration example will be described below with reference to the drawings.

[0049] [Display device configuration example 1] FIG. 1A shows a configuration example of a display device 10. The display device 10 includes a substrate 11, a substrate 12, Light emitting element 21R, light emitting element 21B, light emitting element 21G, light receiving element 22, functional layer 15, conductive layer 31, a conductive layer 32, etc.

[0050] The light emitting element 21R, the light emitting element 21B, the light emitting element 21G, and the light receiving element 22 are connected to the substrate 11. The conductive layer 31 and the conductive layer 32 are disposed between the light emitting element 21R and the substrate 12. It is provided above the element 21B, the light emitting element 21G, and the light receiving element 22.

[0051] The light emitting element 21R, the light emitting element 21B, and the light emitting element 21G are red (R), blue (B), ) or green (G) light.

[0052] The display device 10 has a plurality of pixels arranged in a matrix. The pixel has the above sub-pixels. Each sub-pixel has one light-emitting element. For example, the pixel has A configuration with three sub-pixels (three colors of R, G, and B, or yellow (Y), cyan (C), and magenta (M), or a four-subpixel configuration (R, G, B, white (W ) or R, G, B, Y). The light receiving element 22 may be provided in all pixels, or may be provided in only some pixels. Furthermore, one pixel may have a plurality of light receiving elements 22.

[0053] The conductive layer 31 and the conductive layer 32 function as electrodes of the touch sensor. In the case of using the mutual capacitance method, a pulse potential is applied to one of the conductive layers 31 and 32. On the other hand, an analog-to-digital (AD) conversion circuit and a detection circuit such as a sense amplifier are provided. Roads etc. are connected.

[0054] In FIG. 1A, the conductive layer 31 and the conductive layer 32 are disposed between the substrate 11 and the substrate 12, and are light-emitting. The element 21R, the light-emitting element 21B, the light-emitting element 21G, and the light-receiving element 22 are disposed closer to the substrate 12. In FIG. 1A, the light emitting element 21R, the light emitting element 21B, or the light emitting element 21G is emitted to the outside via the conductive layer 31 or the conductive layer 32. At this time, the conductive layer 31 and the conductive layer 32 are made of a material having a light transmitting property, such as a conductive metal oxide. It is preferable to use a conductive material that has a high conductivity.

[0055] FIG. 1B shows a state in which a finger 60 is in close proximity to the surface of the substrate 12. A capacitance 35 is formed between the sensor 1 and the conductive layer 32. When a finger 60 or the like approaches, the capacitance 35 The magnitude of the capacitance of the conductive layer 31 changes (specifically, the capacitance decreases). and the magnitude of the amplitude of the signal generated on one of the conductive layers 32 when a pulse potential is applied to the other. This appears as a change in the surface area of ​​the sensor 14. This makes it possible to detect the contact and proximity of a finger 60 or the like.

[0056] FIG. 1C shows a state in which a finger 60 is touching the surface of the substrate 12. A part of the light emitted by 1G is reflected or scattered at the contact area between the substrate 12 and the finger 60. The light 36, which is a part of the reflected light or scattered light, is incident on the light receiving element 22, and the light 36 is detected as a signal. 60 contact surfaces can be imaged.

[0057] The surface of the finger 60 has a fingerprint formed of concave and convex parts. When the fingerprint sensor 12 is touched, the raised portion of the fingerprint touches the substrate 12, and light is reflected or reflected at the contact surface. The light is reflected or scattered in the recesses of the fingerprint, but the light is not reflected or scattered in the recesses of the fingerprint. Therefore, the intensity of the reflected or scattered light by the finger is lower than that of the convex portion. A difference in contrast occurs between the top and bottom of the fingerprint, allowing a clear image of the fingerprint to be captured.

[0058] The intensity distribution of the scattered light scattered at the contact surface between the finger 60 and the substrate 12 is approximately perpendicular to the contact surface. The intensity is highest at this angle, and the intensity distribution becomes lower as the angle becomes larger in the oblique direction. Therefore, the intensity of the light received by the light receiving element 22 located directly under the contact surface (overlapping the contact surface) In addition, the scattered light having a scattering angle of a predetermined angle or more is scattered by the other side of the substrate 12. The light is totally reflected at the surface (the surface opposite to the contact surface) and does not pass through to the light receiving element 22. Therefore, it is possible to capture a clear image of the fingerprint shape.

[0059] The smaller the arrangement interval of the light receiving elements 22, the higher the resolution of the captured image. For example, the arrangement interval of the light receiving elements 22 is set to the distance between two convex portions of a fingerprint, preferably the distance between adjacent convex portions. By making the distance smaller than the distance between the concave and convex parts, a clear fingerprint image can be obtained. The distance between the ridges and valleys of a human fingerprint is approximately 200 μm. The arrangement interval of 22 is 400 μm or less, preferably 200 μm or less, and more preferably 150 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less, It is set to 1 μm or more, preferably 10 μm or more, and more preferably 20 μm or more.

[0060] The display device 10 can capture not only fingerprints but also various objects that come into contact with the surface of the substrate 12. Therefore, the display device 10 can also be used as an image sensor panel. For example, the light emitting elements 21R, 21B, and 21G can be sequentially illuminated. Each time, an image is captured by the light receiving element 22, and the three images obtained are synthesized. In other words, the electronic device to which the display device 10 is applied is a color image. It can also be used as an image scanner capable of color imaging.

[0061] In addition, the display device 10 can function as a touch panel or a pen tablet using the light receiving element 22. By using the light receiving element 22, it is possible to realize a capacitive touch sensor or Unlike magnetic induction type touch sensors, even highly insulating objects can be detected. Since position detection is possible, the material of the object to be detected, such as the stylus, does not matter, and it can be used with various writing instruments. (e.g., brush, glass pen, feather pen, etc.) can also be used.

[0062] In FIG. 1C, the light for imaging the finger 60 is emitted from the light emitting element 21G. However, the present invention is not limited to this, and the light emitting element 21R, the light emitting element 21G may be used. , and the light emitting element 21B, one or more of which can be used as a light source to capture an image of a finger 60 or the like. The light receiving element 22 includes at least the light emitting element 21R, the light emitting element 21G, and the light emitting element 21B. A photoelectric conversion element that receives one or more of the emitted lights can be used. is emitted by at least one of the light emitting elements 21R, 21G, and 21B. A photoelectric conversion element that receives light in a wavelength range including the wavelength of the light to be detected may be used as the light receiving element 22. can.

[0063] In addition to the light emitting elements 21R, 21G, and 21B, a light emitting element emitting infrared light is A light-emitting element capable of receiving the infrared light is provided as the light-receiving element 22. Alternatively, a photoelectric conversion element capable of receiving visible light and a photoelectric conversion element capable of receiving infrared light may be provided. Infrared light is invisible to humans, so it is possible to use a structure in which two photoelectric conversion elements are provided. By capturing fingerprints and other images using external light as a light source, the displayed image is not affected. Even if display and imaging are performed simultaneously, a clear image can be obtained.

[0064] [Display device configuration example 2] A more specific example of the configuration of the display device will be described below.

[0065] [Configuration Example 2-1] FIG. 2A shows a schematic cross-sectional view of the display device 100A.

[0066] The display device 100A includes a light receiving element 110 between a pair of substrates (substrate 151 and substrate 152). The display device includes a light-emitting element 190, a transistor 131, and a transistor 132. The display device 100A includes another pair of substrates (substrate 255 and substrate 258) and a conductive layer 251, The substrate 152 and the substrate 255 are connected to each other by a conductive layer 252 and an insulating layer 253. It is pasted together by.

[0067] The light receiving element 110 includes a pixel electrode 111, a common layer 112, an active layer 113, a common layer 114, and The light-emitting element 190 includes a pixel electrode 191, a common layer 112, a light-emitting layer 193 , a common layer 114 , and a common electrode 115 .

[0068] Pixel electrode 111, pixel electrode 191, common layer 112, active layer 113, light-emitting layer 193, common The layer 114 and the common electrode 115 may each have a single-layer structure or a laminated structure. This is also fine.

[0069] The pixel electrode 111 and the pixel electrode 191 are located on the insulating layer 214. The pixel electrode 191 can be formed using the same material and in the same process. For example, one or both of a hole injection layer and a hole transport layer may be formed.

[0070] The layers used in common for the light receiving element and the light emitting element have different functions depending on whether they are light emitting elements or light receiving elements. In this specification, the function of the light-emitting element may differ from that of the light-emitting element. For example, a hole injection layer functions as a hole injection layer in a light-emitting device. In the light receiving element, the electron injection layer functions as a hole transport layer. In the photodiode, it functions as an electron injection layer, and in the photodiode, it functions as an electron transport layer. The transport layer functions as a hole transport layer in both the light emitting device and the light receiving device. The electron transport layer functions as an electron transport layer in both the light-emitting device and the light-receiving device.

[0071] The common layer 112 is located on the pixel electrode 111 and the pixel electrode 191. , which is a layer commonly used by the light receiving element 110 and the light emitting element 190.

[0072] The active layer 113 overlaps with the pixel electrode 111 via the common layer 112. The active layer 113 overlaps with the pixel electrode 191 via the common layer 112. and the light-emitting layer 193 has a second organic compound different from the first organic compound.

[0073] Common layer 114 is located on common layer 112 , on active layer 113 , and on light emitting layer 193 . The common layer 114 is a layer that is used in common by the light receiving element 110 and the light emitting element 190. As the layer 114, for example, one or both of an electron injection layer and an electron transport layer may be formed. can.

[0074] The common electrode 115 is connected to the pixel electrode via the common layer 112, the active layer 113, and the common layer 114. The common electrode 115 has a portion overlapping with the electrode 111. The common electrode 115 is connected to the common layer 112 and the light-emitting layer 193. , and has a portion overlapping with the pixel electrode 191 via the common layer 114. The common electrode 115 , which is a layer commonly used by the light receiving element 110 and the light emitting element 190.

[0075] In the display device of the present embodiment, an organic compound is used for the active layer 113 of the light receiving element 110. The light receiving element 110 has layers other than the active layer 113 in common with the light emitting element 190 (EL element). Therefore, in the process of manufacturing the light emitting device 190, the active layer 113 is formed. By simply adding a process, the light receiving element 110 can be formed in parallel with the formation of the light emitting element 190. In addition, the light emitting element 190 and the light receiving element 110 can be formed on the same substrate. Therefore, the light receiving element 110 can be built into the display device without significantly increasing the number of manufacturing steps. It is possible.

[0076] In the display device 100A, the active layer 113 of the light receiving element 110 and the light emitting layer 1 of the light emitting element 190 are 93 and 94 are separately manufactured, but the light receiving element 110 and the light emitting element 190 have the same configuration. However, the configuration of the light receiving element 110 and the light emitting element 190 is not limited to this. The light emitting element 110 and the light emitting element 190 are fabricated separately from each other in addition to the active layer 113 and the light emitting layer 193. The display device 100 may have a light receiving element. It is preferable that the light emitting element 110 and the light emitting element 190 have one or more layers that are used in common (common layers). This makes it possible to incorporate the light receiving element 110 into the display device without significantly increasing the number of manufacturing steps. It is possible.

[0077] In the light receiving element 110, the pixel electrodes 111 and the common electrode 115 are disposed The common layer 112, the active layer 113, and the common layer 114 are called organic layers (layers containing an organic compound). It is preferable that the pixel electrode 111 has a function of reflecting visible light. The end of the electrode 111 is covered with a partition wall 216. The common electrode 115 is transparent to visible light. It has the function of

[0078] The light receiving element 110 has a function of detecting light. A photoelectric conversion element that receives light 122 incident from the outside via 152 and converts it into an electrical signal. He is a child.

[0079] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at positions overlapping the optical element 110 and the light-emitting element 190. By providing this, the range in which the light receiving element 110 detects light can be controlled.

[0080] The light-shielding layer BM can be made of a material that blocks light emitted from the light-emitting element. It is preferable that M absorbs visible light. The light-shielding layer BM is made of, for example, a metal material or A black matrix is ​​created by using a resin material containing a pigment (such as carbon black) or a dye. The light-shielding layer BM can be formed with a red color filter, a green color filter, and The transparent electrode may have a laminated structure in which two or more of a black matrix and a blue color filter are laminated.

[0081] Here, a part of the light emitted from the light emitting element 190 is reflected within the display device 100A and is incident on the light receiving element 1 The light shielding layer BM can suppress the influence of such stray light. For example, if the light-shielding layer BM is not provided, the light emitted by the light-emitting element 190 is The light is reflected by the substrate 152 and may enter the light receiving element 110. By providing the reflector 112, it is possible to prevent the reflected light from being incident on the light receiving element 110. This can reduce noise and increase the sensitivity of the sensor using the light receiving element 110.

[0082] In the light emitting element 190, the pixel electrode 191 and the common electrode 115 are disposed between the pixel electrode 191 and the common electrode 115. The common layer 112, the light-emitting layer 193, and the common layer 114 may be referred to as an EL layer. The pixel electrode 191 preferably has a function of reflecting visible light. The pixel electrodes 111 and 191 are covered with the partition wall 216. They are electrically insulated from each other. The common electrode 115 has a function of transmitting visible light.

[0083] The light emitting element 190 has a function of emitting visible light. By applying a voltage between the element electrode 191 and the common electrode 115, light 121 is emitted to the substrate 152 side. It is an electroluminescent element that emits light.

[0084] The light-emitting layer 193 is preferably formed so as not to overlap the light-receiving region of the light-receiving element 110. This can prevent the light emitting layer 193 from absorbing the light 122, and the light receiving element 110 This allows for a larger amount of light to be irradiated onto the target object.

[0085] The pixel electrode 111 is connected to the insulating layer 214 via an opening in which the transistor 131 is enabled. The source or drain of the first insulating film is electrically connected to the first insulating film.

[0086] The pixel electrode 191 is connected to the transistor 132 via an opening provided in the insulating layer 214. The transistor 132 is electrically connected to the source or drain of the light-emitting element 19. It has the function of controlling the drive of 0.

[0087] The transistors 131 and 132 are formed in the same layer (substrate 151 in FIG. 2A). ) on top.

[0088] At least a part of the circuit electrically connected to the light receiving element 110 is electrically connected to the light emitting element 190. It is preferable that the circuit is formed of the same material and in the same process as the circuit to which it is electrically connected. This allows the display device to be thinner than when the two circuits are formed separately. In addition, the manufacturing process can be simplified.

[0089] Here, the common electrode 115 provided in common to the light emitting element 190 and the light receiving element 110 is a first It is preferable that the first potential is electrically connected to a wiring to which a common potential is applied. A fixed potential such as a potential (common potential), a ground potential, or a reference potential can be used. The first potential to be applied to the common electrode 115 is not limited to a fixed potential, but may be selected from two or more different potentials. You can also give selectively.

[0090] When the light receiving element 110 receives light and converts it into an electrical signal, the pixel electrode 111 is It is preferable to apply a second potential that is lower than the first potential applied to the conducting electrode 115. The potential of 2 is determined depending on the configuration, optical characteristics, and electrical characteristics of the light receiving element 110. In other words, the light receiving element 110 can be supplied with a potential that optimizes the following: Assuming that the photodiode is a photodiode, the cathode is A first potential is applied to the common electrode 115 which functions as anode, and a second potential is applied to the pixel electrode 115 which functions as an anode. The second potential to be applied to the electrode 191 can be selected. In the case where the pixel electrode 111 is not driven, a potential equal to or approximately equal to the first potential is applied to the pixel electrode 111, or A potential higher than the first potential may be applied.

[0091] On the other hand, when the light emitting element 190 is made to emit light, the pixel electrode 191 is provided with a voltage Vp given to the common electrode 115. It is preferable to apply a third potential higher than the first potential applied to the light emitting element. The required luminance and brightness are determined according to the configuration of the element 190, the threshold voltage, and the current-brightness characteristics. In other words, the light emitting element 190 can be made to function as a light emitting diode. When viewed as a diode, it functions as a cathode so that a forward bias voltage is applied. A first potential is applied to the common electrode 115 which functions as an anode, and a second potential is applied to the pixel electrode 191 which functions as an anode. In addition, when the light emitting element 190 is not caused to emit light, In the pixel electrode 191, a potential equal to or approximately equal to the first potential or a potential higher than the first potential is applied. A potential lower than the potential at the first potential may be applied.

[0092] In this embodiment, the light receiving element 110 and the light emitting element 190 are formed in such a manner that the common electrode 115 is a cathode. The above description is of an example in which each pixel electrode functions as an anode and each pixel electrode functions as an anode. Instead, the common electrode 115 functions as an anode and each pixel electrode functions as a cathode. In this case, when the light receiving element 110 is driven, the second potential may be set to When driving the light emitting element 190, a potential higher than the first potential is applied to the light emitting element 190 as the third potential. All that is required is to apply a potential lower than potential 1.

[0093] The light receiving element 110 and the light emitting element 190 are each covered with a protective layer 195. In FIG. 2A, the protective layer 195 is provided on and in contact with the common electrode 115. By providing the protective layer 195, impurities such as water are prevented from entering the light receiving element 110 and the light emitting element 190. This can suppress the intrusion of foreign matter, thereby improving the reliability of the light receiving element 110 and the light emitting element 190. In addition, the protective layer 195 and the substrate 152 are bonded together by the adhesive layer 142.

[0094] The conductive layer 251 is provided on a substrate 255. The insulating layer 253 is formed between the conductive layer 251 and the substrate 255. The conductive layer 252 is disposed on the insulating layer 253. and substrate 258 are bonded together by adhesive layer 257.

[0095] Either the conductive layer 251 or the conductive layer 252, or both of them, are used as electrodes of the touch sensor. Here, the conductive layer 251 and the conductive layer 252 are formed with the insulating layer 253 interposed therebetween. 4 shows an example of a touch sensor.

[0096] FIG. 2A also shows a portion where the conductive layer 251 and the conductive layer 252 overlap with each other. For example, it can be applied to the portion where the conductive layer 251 and the conductive layer 252 intersect. The configuration of the connection portion where the conductive layer 251 and the conductive layer 252 are electrically connected is shown. In the above, the conductive layer 251 and the conductive layer 252 are electrically connected to each other through an opening provided in the insulating layer 253. The connection portion is, for example, a conductive layer 251 that is electrically connected to the island-shaped conductive layer 251. This can be applied to the part electrically connected by 52.

[0097] In FIG. 2A, the conductive layer 251 and the conductive layer 252 form a light-emitting region of the light-emitting element 190 and The conductive layer 251 and the conductive layer 252 are provided so as to avoid the light receiving region of the light receiving element 110. The conductive layer 252 is disposed between two adjacent light emitting elements 190 or between the light emitting element 190 and the light emitting element 190 in a plan view. 90 and the light receiving element 110. The conductive layer 251 and the conductive layer 252 are provided at positions overlapping the light-shielding layer BM. For the conductive layer 251 and the conductive layer 252, a light-transmitting conductive material is not used, and a metal or Since low-resistance conductive materials such as alloys can be used, the sensitivity of the touch sensor can be increased. This can be done.

[0098] In FIG. 2A, the conductive layer 251 and the insulating layer 255 are formed on the surface of the substrate 255 facing the substrate 258. 3 and the conductive layer 252 are formed in this order, but the present invention is not limited to this. A conductive layer 251 is formed on one surface of the insulating layer 55, a conductive layer 252 is formed on the other surface of the insulating layer 55, and an insulating layer 253 is formed on the insulating layer 55. A configuration without 253 is also possible.

[0099] In addition, when a conductive material such as a metal or an alloy is used for the conductive layer 251 and the conductive layer 252, When viewed from the display surface side (the substrate 258 side in FIG. 2(A)), the conductive layer 251 and the conductive layer 2 Therefore, the circularly polarized light is applied to the substrate 258. It is preferable to provide a plate (not shown) to suppress reflection of external light.

[0100] [Configuration Example 2-2] FIG. 2B is a schematic cross-sectional view of the display device 100B. The second embodiment is different from the first embodiment in that it does not have a substrate 258 and the orientation of the substrate 255 is different. The main differences are:

[0101] The conductive layer 251, the conductive layer 252, and the insulating layer 253 are formed on the surface of the substrate 255 facing the substrate 152. The substrate 255 and the substrate 152 are bonded together by an adhesive layer 256. is.

[0102] The display device 100B has a substrate 258 and an adhesive layer 257, as compared with the display device 100A. This not only reduces manufacturing costs but also allows the thickness to be reduced.

[0103] [Configuration Example 2-3] FIG. 3A is a schematic cross-sectional view of the display device 100C. The main difference compared to the device 100B is that the device 100 does not have a substrate 152.

[0104] A conductive layer 251, a conductive layer 252, and an insulating layer 253 are formed on the surface of the substrate 255 facing the substrate 151. In addition, an insulating layer is provided to cover the conductive layer 251, the conductive layer 252, and the insulating layer 253. A light-shielding layer BM is provided on the surface of the insulating layer 254 on the substrate 151 side. The substrate 255 and the substrate 151 are bonded together by an adhesive layer 142 .

[0105] With this configuration, between the pair of substrates (substrate 151 and substrate 255 in this example), , a light receiving element 110, a light emitting element 190, a transistor 131, a transistor 132, and A conductive layer 251 and a conductive layer 252 that constitute a touch sensor can be provided. As a result, a thinner display device is realized compared to the display device 100A and the display device 100B. It is possible.

[0106] [Configuration Example 2-4] FIG. 3B is a schematic cross-sectional view of the display device 100D. Compared to the device 100A, etc., the conductive layer 251, etc. are provided on the upper surface of the protective layer 195. , mainly differ.

[0107] In the display device 100D, the protective layer 195 includes an inorganic insulating layer 195a and an organic insulating layer 195b. b, and the inorganic insulating layer 195c are laminated in this order from the substrate 151 side. .

[0108] The conductive layer 251 is provided on the inorganic insulating layer 195c. The conductive layer 252 is provided on the insulating layer 253. The substrate 255 and the substrate 151 are bonded together by an adhesive layer 142. do.

[0109] The inorganic insulating layer 195a prevents impurities such as water from diffusing into the light receiving element 110 and the light emitting element 190. The organic insulating layer 195b functions as a protective film to prevent the organic insulating layer 195 from being damaged. The inorganic insulating layer 195c has a function as a protective film similar to the inorganic insulating layer 195a, and is conductive. This forms the surface on which layer 251 is formed.

[0110] Each of the inorganic insulating layers 195a and 195c preferably contains an inorganic insulating material. For example, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide, Examples of oxides or nitrides include aluminum oxide, aluminum oxynitride, and hafnium oxide. Can be obtained.

[0111] The organic insulating layer 195b preferably contains an organic insulating material, such as an acrylic resin. Polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin Examples of the resin include resins such as benzocyclobutene resins, phenol resins, and precursors of these resins. do.

[0112] By forming the protective layer 195 in such a laminated structure, it is possible to prevent pinning to the inorganic insulating layer 195a, for example. Even if there is a defect such as a hole, the defect is covered by the organic insulating layer 195b with high step coverage. Furthermore, an inorganic insulating layer 195c is formed on the flat upper surface of the organic insulating layer 195b. By forming the inorganic insulating layer 195c, an insulating film with few defects can be formed. In addition, by using a film containing an inorganic insulating material as the inorganic insulating layer 195c, the conductive layer 25 It functions as an etching stopper when etching the organic insulating layer 195 This can prevent b from being scraped off.

[0113] The conductive layer 251 and the conductive layer 252 constituting the touch sensor are formed directly on the protective layer 195. This allows the thickness of the display device 100D to be extremely thin. In the case of 100D, the conductive layer 251 and the conductive layer 252 are not provided on the substrate 255 side. Since high accuracy is not required for bonding the substrate 151 to the substrate 151, the manufacturing yield can be increased. In addition, the substrate 255 may be a substrate having light-transmitting properties, and is therefore This allows for extremely high freedom in material selection.

[0114] FIG. 3B shows an example in which the light-shielding layer BM is not provided. As a result, the area of ​​the light emitting region of the light emitting element 190 and the area of ​​the light receiving region of the light receiving element 110 are Since the substrate 255 can be enlarged, a brighter display and high-sensitivity imaging can be achieved. Since alignment with the substrate 151 becomes extremely easy, the manufacturing yield can be increased. .

[0115] [Variation 1] In the above, an example in which the light emitting element and the light receiving element have two common layers has been shown, but this is not limited thereto. In the following, an example in which the common layer has a different configuration will be described.

[0116] The display device 100E, the display device 100F, and the display device 100G described below are In this example, the light receiving element 110 and the light emitting element 190 of the display device 100D are configured differently. The configurations of the light receiving element 110 and the light emitting element 190 illustrated below are the display device 100A and the display It goes without saying that the present invention can be applied to the display device 100B and the display device 100C.

[0117] FIG. 4A shows a schematic cross-sectional view of a display device 100E. 100D does not have the common layer 114, and the buffer layer 184 and the buffer layer 194 are The buffer layer 184 and the buffer layer 194 are each a single It may have a layered structure or a laminated structure.

[0118] In the display device 100E, the light receiving element 110 includes a pixel electrode 111, a common layer 112, an active layer 113, and a The light-emitting element 190 includes a layer 113, a buffer layer 184, and a common electrode 115. A pixel electrode 191, a common layer 112, a light-emitting layer 193, a buffer layer 194, and a common electrode 115. has.

[0119] In the display device 100E, a buffer layer 184 between the common electrode 115 and the active layer 113, An example of separately forming the buffer layer 194 between the common electrode 115 and the light-emitting layer 193 will be described. The layer 184 and the buffer layer 194 may be, for example, one of an electron injection layer and an electron transport layer. Or both can be formed.

[0120] FIG. 4B is a schematic cross-sectional view of the display device 100F. 100D does not have the common layer 112, and the buffer layer 182 and the buffer layer 192 are The buffer layer 182 and the buffer layer 192 are each a single It may have a layered structure or a laminated structure.

[0121] In the display device 100F, the light receiving element 110 includes a pixel electrode 111, a buffer layer 182, The light emitting element 190 includes an active layer 113, a common layer 114, and a common electrode 115. A pixel electrode 191, a buffer layer 192, a light-emitting layer 193, a common layer 114, and a common electrode 115. has.

[0122] In the display device 100F, a buffer layer 182 between the pixel electrode 111 and the active layer 113, An example of forming a buffer layer 192 between a pixel electrode 191 and a light-emitting layer 193 separately will be described. The layer 182 and the buffer layer 192 may be, for example, a hole injection layer or a hole transport layer. Or both can be formed.

[0123] FIG. 4C is a schematic cross-sectional view of the display device 100G. In comparison with 100D, the common layer 112 and the common layer 114 are not included, and the buffer layer 182 and the buffer layer 183 are not included. The main difference is that the first and second layers 184, 192, and 194 are included. do.

[0124] In the display device 100G, the light receiving element 110 includes a pixel electrode 111, a buffer layer 182, The light emitting element 190 includes an active layer 113, a buffer layer 184, and a common electrode 115. The pixel electrode 191, the buffer layer 192, the light-emitting layer 193, the buffer layer 194, and the common electrode 196 are arranged in a pixel electrode 191, a buffer layer 192, a light-emitting layer 193, a buffer layer 194, and a common electrode 196. It has poles 115.

[0125] In the process of manufacturing the light receiving element 110 and the light emitting element 190, the active layer 113 and the light emitting layer 193 are Not only can you create different layers, but you can also create different layers.

[0126] The display device 100G includes a light receiving element 110 and a light emitting element 190, and a pair of electrodes (pixel electrodes 1 11 or between the pixel electrode 191 and the common electrode 115. The light receiving element 110 and the light emitting element 190 of the device 100G have pixel electrodes on the insulating layer 214. The pixel electrode 111 and the pixel electrode 191 are formed of the same material and in the same process. The buffer layer 182, the active layer 113, and the buffer layer 184 are disposed on the pixel electrode 191. After the layer 192, the light-emitting layer 193, and the buffer layer 194 are formed, the buffer layer The common electrode 115 is formed so as to cover the insulating layer 184 and the buffer layer 194. .

[0127] The laminated structure of the buffer layer 182, the active layer 113, and the buffer layer 184 and the buffer The order of forming the laminated structure of the light emitting layer 192, the light emitting layer 193, and the buffer layer 194 is not particularly limited. For example, after the buffer layer 182, the active layer 113, and the buffer layer 184 are formed, The buffer layer 192, the light-emitting layer 193, and the buffer layer 194 may be formed. Prior to deposition of the GaN layer 182, the active layer 113, and the buffer layer 184, a buffer layer 192 is formed. , a light-emitting layer 193, and a buffer layer 194 may be formed. Alternatively, the buffer layer 192, the active layer 113, the light emitting layer 193, etc. may be formed alternately in this order.

[0128] [Modification 2] In the following, an example in which a light-transmitting conductive film is used as an electrode of a touch sensor will be described. do.

[0129] FIG. 5A is a schematic cross-sectional view of a display device 100H. The main difference compared to 100A is that the electrodes of the touch sensor have a different configuration.

[0130] The display device 100H includes a conductive layer 251t and a conductive layer 252 between a substrate 255 and a substrate 258. 2t, and an insulating layer 253. The conductive layer 251t is provided on a substrate 255, and the insulating layer 2 53 is provided to cover the conductive layer 251t and the upper surface of the substrate 255, and the conductive layer 252t is an insulating 5A, an opening is provided in a part of the insulating layer 253. The conductive layer 251t and the conductive layer 252t are electrically connected to each other through the opening. This is shown.

[0131] The conductive layer 251t and the conductive layer 252t include a conductive material that transmits visible light. The conductive layer 251t and the conductive layer 252t are configured to transmit at least the light emitted by the light emitting element 190 and the light received by the light emitting element 190. A material that is transparent to the light received by the optical element 110 can be used.

[0132] Since the conductive layers 251t and 252t are light-transmitting, they are The light emitting element 190 can be disposed on the substrate 255. Since high precision is not required in the process of bonding the display device 100H, The yield can be increased.

[0133] In FIG. 5A, the conductive layer 251t and the insulating layer 252 are formed on the surface of the substrate 255 facing the substrate 258. 53 and the conductive layer 252t are formed in this order, but the present invention is not limited to this. A conductive layer 251t is formed on one surface of the plate 255, and a conductive layer 252t is formed on the other surface. Alternatively, a structure in which the insulating layer 253 is not provided may be used.

[0134] FIG. 5B is a schematic cross-sectional view of the display device 100J. The main difference compared to 100B is that the electrodes of the touch sensor have a different configuration.

[0135] The display device 100J has a conductive layer 251t instead of the conductive layer 251 of the display device 100B. , a conductive layer 252t is provided instead of the conductive layer 252. The conductive layers 251t and 252t are Each of them has a portion overlapping with the light receiving region of the light receiving element 110 or the light emitting region of the light emitting element 190. It is okay to do so.

[0136] The display device 100J, like the display device 100H, has a structure that can increase the manufacturing yield. It is a completion.

[0137] In the display device 100H and the display device 100J, the conductive layer 251t and the conductive layer 2 Either of the layers 52t may be replaced with a conductive layer containing a metal or an alloy. A light-transmitting conductive layer is disposed so as to overlap the light receiving element 110 and the light emitting element 190, and a metal or or an alloy-containing conductive layer is disposed at a position not overlapping the light receiving element 110 and the light emitting element 190. A low-resistance conductive layer can be used as a part of the conductive layer constituting the touch sensor. This can reduce the electrical resistance and improve the sensitivity.

[0138] [Touch sensor configuration example] An example of the configuration of a touch sensor will be described below. The sensor will now be described.

[0139] Representative types of capacitive touch sensors are the self-capacitance type and the mutual capacitance type. do.

[0140] In the self-capacitance method, the electrodes to which the capacitance is connected form a segment, and the segment In the self-capacitance method, a finger or other object to be detected is placed on the electrode. A method of obtaining location information by detecting an increase in the capacitance of the electrode when the object approaches. Formula.

[0141] In the mutual capacitance method, a plurality of first wirings and a plurality of second wirings are arranged in a direction that crosses each other. The mutual capacitance method uses a configuration in which a capacitance is formed at the intersection of the first wiring and the second wiring. By detecting the change in capacitance when a detected object approaches, position information is obtained. It is a method.

[0142] The configuration of a touch sensor that can be used in the mutual capacitance method will be described below.

[0143] [Touch sensor configuration example] FIG. 6A is a schematic top view illustrating an example of a conductive layer that constitutes a touch sensor. The touch sensor shown in (A) has a conductive layer 251 and a conductive layer 252.

[0144] The touch sensor includes a plurality of wirings (wires X1 to X2) extending in the X direction and arranged in the Y direction. 4) and a plurality of wirings (wirings Y1 to Y8) extending in the Y direction and arranged in the X direction. In the following, when describing matters common to the wirings X1 to X4, they will be written as wiring Xn. When describing matters common to the wirings Y1 to Y8, the wirings will be referred to as wiring Ym.

[0145] The wiring Xn is formed of a conductive layer 251. The wiring Xn has a long and thin portion in the X direction. The rectangular shape is formed by alternatingly connecting rectangular and diamond-shaped portions.

[0146] The wiring Ym includes a conductive layer 251 and a conductive layer 252. The wiring Ym includes a plurality of diamond-shaped a conductive layer 252 that connects the conductive layers 251 and is long and thin in the Y direction; It is composed of:

[0147] The wiring Xn and the wiring Ym are a thin portion of the wiring Xn formed of the conductive layer 251 and a thin portion of the wiring Ym The conductive layer 252 intersects with the thin portion formed by the conductive layer 252.

[0148] As shown in FIG. 6B, the wiring Xn is formed by a conductive layer 251, and the wiring Ym is formed by a conductive layer 252. The conductive layer 252 may be formed.

[0149] In FIG. 6(A) and FIG. 6(B), an example is shown in which there are four wirings Xn and eight wirings Ym. However, the number is not limited to this, and may vary depending on the size of the display unit of the display device and the required arrangement of the touch sensors. This can be set appropriately depending on the linear density.

[0150] FIG. 6C shows a circuit diagram for explaining the configuration of the touch sensor. Because of capacitive coupling, a capacitance Cp is formed between them. This is sometimes called the mutual capacitance between the line Xn and the wiring Ym. Here, a pulse potential is applied to the wiring Xn. A circuit that receives the voltage from the line Ym is connected to the line Ym, and an AD conversion circuit for acquiring the voltage from the line Ym is connected to the line Ym. Circuits such as a gate and a sense amplifier are connected to the input / output terminals.

[0151] Since a capacitive coupling is formed between the wires Xn and Ym, a pulse potential is applied to the wire Xn. When the potential is applied, a pulse potential is generated on the wire Ym. The amplitude of the pulse potential generated on the wire Ym is It is proportional to the strength of the capacitive coupling between the wires Xn and Ym (i.e., the magnitude of Cp). Here, When a detection object such as a finger approaches the intersection of the wires Xn and Ym, the wire Xn and the detection object A capacitance is formed between the wire Xn and the wire Ym and between the wire Ym and the object to be detected. m becomes relatively weak. Therefore, when a pulse potential is applied to the wiring Xn, When this is achieved, the amplitude of the pulse potential generated on the wiring Ym becomes smaller.

[0152] When a pulse potential is applied to the wiring X1, the pulse potentials generated in the wirings Y1 to Y8 are taken. Similarly, a pulse potential is applied to the wires X2, X3, and X4 in that order. The pulse potentials of the wires Y1 to Y8 are obtained. It can be obtained.

[0153] [Electrode shape configuration example 1] In the following, a more specific example of the top surface shape of the electrodes of the wirings Xn and Ym will be described. do.

[0154] FIG. 7 shows an enlarged view of the region Q in FIG. 6(A). The region Q is the rhombus-shaped portion of the wiring Xn and This is the area including the diamond-shaped portions of the wiring Ym and their boundaries.

[0155] In FIG. 7, the top surface shape of the conductive layer 251X forming the wiring Xn and the conductive layer 251Y forming the wiring Ym is The conductive layer 251X and the conductive layer 251Y each have a lattice-like upper surface shape. In other words, the conductive layer 251X and the conductive layer 251Y each have a plurality of openings. The conductive layer 251X and the conductive layer 251Y are formed on different surfaces. In particular, the conductive layer 251X and the conductive layer 251Y are located on the same plane and are It is preferable that the conductive film is processed.

[0156] 7 also shows a pixel 20. The pixel 20 includes a light emitting element 21R, a light emitting element 21 The light emitting element 21R and the light emitting element 21B are The light emitting elements 21G and the light receiving elements 22 are arranged alternately in the X direction. The light emitting elements 21R and the light emitting elements 21G are arranged alternately in the Y direction. In the light emitting element 20, the light emitting element 21R, the light emitting element 21B, the light emitting element 21G, and the light receiving element 22 The positions are not limited to these and any two of the four can be swapped.

[0157] The conductive layer 251X and the conductive layer 251Y are disposed between adjacent light emitting elements and between adjacent light emitting elements in a plan view. It is provided between the adjacent light emitting element and the light receiving element 22. In other words, the light emitting element 21R The light emitting element 21B, the light emitting element 21G, and the light receiving element 22 are each formed of a conductive layer 251X or The opening is provided at a position overlapping with the opening of the conductive layer 251Y. Then, one emission layer is formed at a position overlapping one of the openings of the conductive layer 251X or the conductive layer 251Y. In this example, a light-emitting element or a light-receiving element 22 is provided. At a position overlapping with the opening, a plurality of light emitting elements, or one or more light emitting elements and one or more light receiving elements 22 are provided. may be provided.

[0158] The conductive layer 251X and the conductive layer 251Y each have a portion extending in the X direction and a portion extending in the Y direction. The conductive portions and the intersections of these portions form a lattice-like upper surface. The layer 251X and the conductive layer 251Y are connected by a cutout provided in a portion of the lattice-shaped conductive layer extending in the X direction. The notch Sx and the notch Sy provided in the portion extending in the Y direction are separated from each other. With this configuration, the distance between the conductive layer 251X and the conductive layer 251Y is The capacitance between them can be increased.

[0159] The notches can be provided at the intersections of the lattice, but as shown in FIG. The cutouts Sx and Sy are disposed in the portion extending in the Y direction and the portion extending in the Y direction, respectively. By doing so, when viewed from the display surface side, the patterns of the conductive layer 251X and the conductive layer 251Y can be more clearly seen. This is preferable because it can make the mark less visible.

[0160] As shown in FIG. 7, a light emitting element 21R, a light emitting element 21B, a light emitting element 21G, and a receiving A part of the conductive layer 251X or the conductive layer 251Y is always provided adjacent to the periphery of the optical element 22. As a result, when viewed from the display surface side, the conductive layer 251X and the conductive layer In particular, the light receiving element 22 is made difficult to see. The difference is between the case where the conductive layer 251X or the conductive layer 251Y is provided around the Therefore, as shown in Figure 7, A part of the conductive layer 251X or the conductive layer 251Y is always provided around the element 22. As a result, unevenness in the captured image occurs due to variations in the amount of light received by the light receiving element 22. This can suitably prevent the deterioration of the suction cup 14.

[0161] In addition, in FIG. 7, the light receiving element 22 is surrounded on all four sides by the conductive layer 251X or the conductive layer 251Y. 1 shows an example in which the light receiving element 22 adjacent to the notch portion Sx or the notch portion Sy is mixed. However, the present invention is not limited to this, and may be applied to a light receiving element surrounded on all four sides by the conductive layer 251X or the conductive layer 251Y. It may be configured to have only the element 22, or adjacent to the notch portion Sx or the notch portion Sy. A configuration having only the light receiving element 22 may also be used.

[0162] [Electrode shape configuration example 2] The configuration shown in Fig. 8 is an example in which the arrangement direction of the pixels 20 shown in Fig. 7 is tilted by 45 degrees. The conductive layer 251X and the conductive layer 251Y are connected to, for example, the contour line or pixels of the display unit of the display device. The upper surface of the substrate has a lattice-like shape that is inclined at an angle with respect to the extending direction of the wiring.

[0163] The conductive layer 251X and the conductive layer 251Y are arranged in a portion of the lattice-shaped conductive layer extending from the lower left to the upper right. The cutout Sa is provided on the upper left side of the plate, and the cutout Sb is provided on the portion extending from the upper left to the lower right. are separated from each other.

[0164] Here, when the conductive layer 251X and the conductive layer 251Y are separated, the cutout portion Sa and the cutout portion It is also possible to separate linearly using only one of S and Sb. As shown in FIG. 1, the cutout portion Sa or the cutout portion Sb is combined to form the conductive layer 251X and the conductive layer 2 By separating them so that the boundary with 51Y is zigzag, When the conductive layer 251X and the conductive layer 251Y are exposed, the patterns of the conductive layer 251X and the conductive layer 251Y are less likely to be visible. In addition, the boundary between the conductive layer 251X and the conductive layer 251Y is preferably formed in a zigzag shape. By doing so, the boundary line between the conductive layer 251X and the conductive layer 25 It also has the effect of increasing the capacity between 1Y.

[0165] [Electrode Shape Configuration Example 3] The configuration shown in FIG. 9(A) and FIG. 9(B) includes a light-emitting element 21R and a light-emitting element 21G, the light emitting element 21B, and the light receiving element 22 are arranged in the X direction.

[0166] In FIG. 9A, the conductive layer 251X and the conductive layer 251Y each have a vertically elongated opening. The light emitting element 21R, the light emitting element 21G, the light emitting element 21B, and The light receiving element 22 is disposed so as to overlap one of the openings.

[0167] In FIG. 9B, a light-emitting element is provided in one opening of the conductive layer 251X and the conductive layer 251Y. 21R, light emitting element 21G, light emitting element 21B, and light receiving element 22 are arranged one on top of the other.

[0168] With this configuration, the light emitting elements 21R, 21G, and 21B are used. This can improve the display quality of images displayed.

[0169] In the pixel 20 shown in FIG. 10, the light emitting element 21R, the light emitting element 21G, and the light emitting element 21B are X The light receiving elements 22 are arranged below them.

[0170] This configuration is preferred because it is possible to further improve the display quality of the image. It is.

[0171] [Display device configuration example 3] A more specific example of the display device will be described below.

[0172] [Configuration Example 3-1] FIG. 11 shows a perspective view of the display device 200A.

[0173] The display device 200A has a configuration in which a substrate 151 and a substrate 152 are bonded together. 11, the substrate 152 and the substrate 255 are bonded to each other. 55 is shown in dashed lines. Substrate 255 includes the touch sensor described above.

[0174] The display device 200A includes a display unit 162, a circuit 164, wiring 165, and the like. In FIG. 1 shows an example in which an IC (integrated circuit) 173 and an FPC 172 are mounted on a display device 200A. Therefore, the configuration shown in FIG. 11 includes a display device 200A, an IC 173, and an FPC It can also be called a display module having 172.

[0175] The circuit 164 can be a scanning line driver circuit.

[0176] The wiring 165 has a function of supplying signals and power to the display portion 162 and the circuit 164 . The signal and power are input from the outside via FPC172 or from IC173. The signal is input to wiring 165.

[0177] In Figure 11, the COG (Chip On Glass) method or the COF (Chip On In this example, an IC 173 is provided on a substrate 151 by a method such as an I C173 can be applied to an IC having, for example, a scanning line driving circuit and a signal line driving circuit. The display device 200A and the display module may be configured without the IC 173. Also, the IC 173 may be mounted on the FPC 172 by a COF method or the like.

[0178] FIG. 12 shows a part of the area including the FPC 172, the circuit A part of the area including the display unit 162, and a part of the area including the end portion. 1 shows an example of a cross section of each of the above.

[0179] The display device 200A shown in FIG. 12 includes a transistor 20 between a substrate 151 and a substrate 152. 1, a transistor 205, a transistor 206, a light emitting element 190, a light receiving element 110, etc. do.

[0180] The substrate 152 and the insulating layer 214 are bonded to each other via an adhesive layer 142. A solid sealing structure or a hollow sealing structure can be used to seal the light receiving element 110. In FIG. 2, the space 143 surrounded by the substrate 152, the adhesive layer 142, and the insulating layer 214 is inactive. It is filled with gas (nitrogen, argon, etc.) and a hollow sealing structure is applied. The light-emitting element 190 may be overlapped with the substrate 152 and the adhesive layer 142. 42 and the space 143 surrounded by the insulating layer 214 is filled with a resin different from that of the adhesive layer 142. This is also fine.

[0181] The light emitting element 190 is made up of a pixel electrode 191, a common layer 112, and a light emitting layer 193 from the insulating layer 214 side. The pixel electrode 19 has a laminated structure in which the pixel electrode 19 is laminated in this order. 1 is connected to a conductive layer 22 of a transistor 206 through an opening in an insulating layer 214. The transistor 206 has a function of controlling the driving of the light emitting element 190. The edge of the pixel electrode 191 is covered with a partition wall 216. The common electrode 115 comprises a material that reflects visible light, and the common electrode 115 comprises a material that transmits visible light.

[0182] The light receiving element 110 is made up of a pixel electrode 111, a common layer 112, an active layer 113, and a common layer 114. The pixel electrode 11 has a laminated structure in which the pixel electrode 11 is laminated in this order. 1 is connected to a conductive layer 22 of a transistor 205 through an opening in an insulating layer 214. The end of the pixel electrode 111 is covered with a partition wall 216. The pixel electrode 111 includes a material that reflects visible light, and the common electrode 115 includes a material that transmits visible light. Contains materials that

[0183] The light emitted by the light emitting element 190 is emitted toward the substrate 152. The light is incident on the substrate 152 through the space 143. It is preferable to use a material that is highly transparent.

[0184] The pixel electrode 111 and the pixel electrode 191 can be manufactured using the same material and the same process. The common layer 112, the common layer 114, and the common electrode 115 are connected to the light receiving element 110 and the light emitting element 110. The light receiving element 110 and the light emitting element 190 are both formed of an active layer 113 and a light emitting layer. The structure of the layer 193 is different, but the structure can be the same. The light receiving element 110 can be built into the display device 200A without significantly increasing the amount of work required. .

[0185] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at positions overlapping the optical element 110 and the light-emitting element 190. By providing the shield, the range in which the light receiving element 110 detects light can be controlled. By providing the optical layer BM, light from the light emitting element 190 is directly incident on the light receiving element 110. Therefore, a sensor with low noise and high sensitivity can be realized.

[0186] The transistor 201, the transistor 205, and the transistor 206 are all substrate These transistors are formed on the same substrate 151 using the same materials and processes. It can be made.

[0187] On the substrate 151, an insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are formed. The insulating layer 211 is provided in this order. A part of the insulating layer 211 serves as a gate insulating layer for each transistor. A part of the insulating layer 213 functions as a gate insulating layer for each transistor. An insulating layer 215 is provided over the transistor. The gate insulating layer is provided to cover the gate electrodes and functions as a planarization layer. The number of insulating layers covering the transistor is not limited, and each may be a single layer or two or more layers. .

[0188] At least one of the insulating layers covering the transistors is designed to prevent impurities such as water and hydrogen from diffusing. It is preferable to use a material that can function as a barrier layer. This structure effectively prevents impurities from diffusing into the transistor from the outside. This can effectively suppress the noise and improve the reliability of the display device.

[0189] The insulating layers 211, 213, and 215 are each made of an inorganic insulating film. As the inorganic insulating film, for example, a silicon nitride film or a silicon oxynitride film is preferable. film, silicon oxide film, silicon nitride oxide film, aluminum oxide film, aluminum nitride film, etc. In addition, a hafnium oxide film, an yttrium oxide film, Zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film Alternatively, a tantalum film, a cerium oxide film, a neodymium oxide film, or the like may be used. Two or more layers may be laminated.

[0190] Here, organic insulating films often have lower barrier properties than inorganic insulating films. It is preferable that the organic insulating film has an opening near the end of the display device 200A. It is possible to suppress the diffusion of impurities from the end portion of the display device 200A through the organic insulating film. Alternatively, the end of the organic insulating film may be positioned inside the end of the display device 200A. In this case, the organic insulating film is formed on the edge of the display device 200A so that the organic insulating film is not exposed at the edge of the display device 200A. good.

[0191] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used include acrylic resin, polyimide resin, epoxy resin, polyamide resin, etc. amide resin, polyimide amide resin, siloxane resin, benzocyclobutene resin, pheno Examples of the resin include polyvinyl chloride resins and precursors of these resins.

[0192] In the region 228 shown in FIG. 12, an opening is formed in the insulating layer 214. Even when an organic insulating film is used for the edge layer 214, the display unit 212 is exposed from the outside through the insulating layer 214. Therefore, the reliability of the display device 200A can be improved. It can be improved.

[0193] The transistors 201, 205, and 206 have gates A conductive layer 221 that functions as a gate insulating layer, an insulating layer 211 that functions as a source and drain The conductive layers 222a and 222b, which function as the semiconductor layer 231, and the gate insulating layer The insulating layer 213 functions as a gate, and the conductive layer 223 functions as a gate. In the figure, the same hatching pattern is applied to multiple layers obtained by processing the same conductive film. The insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231. The insulating layer 213 is It is located between the conductive layer 223 and the semiconductor layer 231 .

[0194] The structure of a transistor included in the display device of this embodiment is not particularly limited. Using transistors such as linear type, staggered type, and inverse staggered type In addition, the transistor structure can be either a top gate type or a bottom gate type. Alternatively, gates may be provided above and below the semiconductor layer in which the channel is formed. This is also fine.

[0195] The transistors 201, 205, and 206 have channels. The structure in which the semiconductor layer is sandwiched between two gates is applied. and driving the transistors by supplying the same signal to them. A potential is applied to one of the two gates to control the threshold voltage, and a potential is applied to the other to drive the other. By applying a potential to the transistor, the threshold voltage of the transistor may be controlled.

[0196] The crystallinity of the semiconductor material used in the transistor is not particularly limited. Single crystal semiconductor or semiconductor with crystallinity other than single crystal (microcrystalline semiconductor, polycrystalline semiconductor A single crystal semiconductor or a semiconductor having a crystal region in part may be used. It is preferable to use a crystalline semiconductor since this can suppress deterioration of transistor characteristics.

[0197] The semiconductor layer of the transistor preferably contains a metal oxide (also called an oxide semiconductor). Alternatively, the semiconductor layer of the transistor may include silicon. For this purpose, amorphous silicon, crystalline silicon (low-temperature polysilicon, single crystal silicon, etc.) etc.)

[0198] The semiconductor layer may be, for example, a combination of indium and M (where M is gallium, aluminum, silicon, Boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium Rumanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, one or more selected from tantalum, tungsten, and magnesium), zinc, In particular, M is aluminum, gallium, yttrium, and It is preferable that the metal oxide is one or more metals selected from tin.

[0199] In particular, indium (In), gallium (Ga), and zinc (Zn) are used as the semiconductor layer. It is preferable to use an oxide containing IGZO (also referred to as IGZO).

[0200] When the semiconductor layer is an In-M-Zn oxide, the In-M-Zn oxide is deposited. In the sputtering target, the atomic ratio of In is preferably equal to or greater than the atomic ratio of M. The atomic ratio of the metal elements in such a sputtering target is In:M:Zn. =1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:3, In: M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1 , In:M:Zn=5:1:3, In:M:Zn=5:1:6, In:M:Zn=5:1 :7, In:M:Zn=5:1:8, In:M:Zn=10:1:3, In:M:Zn= 6:1:6, In:M:Zn=5:2:5, etc.

[0201] When a sputtering target containing a polycrystalline oxide is used, This is preferable because it is easy to form a semiconductor layer having crystallinity. The atomic ratio is the plus or minus of the atomic ratio of the metal elements contained in the sputtering target. For example, the composition of the sputtering target used for the semiconductor layer is In the case of In:Ga:Zn=4:2:4.1 [atomic ratio], the composition of the semiconductor layer formed is The atomic ratio may be close to In:Ga:Zn=4:2:3.

[0202] In addition, when the atomic ratio is described as In:Ga:Zn=4:2:3 or in the vicinity, When Ga is 4, this includes the case where Ga is 1 or more and 3 or less, and Zn is 2 or more and 4 or less. In addition, when describing that the atomic ratio is In:Ga:Zn=5:1:6 or close to that, When n is 5, Ga is greater than 0.1 and is equal to or less than 2, and Zn is equal to or greater than 5 and is equal to or less than 7. Also, the atomic ratio is In:Ga:Zn=1:1:1 or in the vicinity. When mounting, when In is 1, Ga is greater than 0.1 and less than 2, and Zn is 0. Includes cases greater than 1 and less than or equal to 2.

[0203] The transistors in the circuit 164 and the transistors in the display portion 162 have the same structure. The circuit 164 may have a plurality of transistors, or may have a different structure. The structures may all be the same, or there may be two or more types. The structures of the multiple transistors may all be the same, or there may be two or more types.

[0204] A connection portion 204 is provided in an area of ​​the substrate 151 where the substrate 152 does not overlap. In the connection portion 204, the wiring 165 is electrically connected to the FPC 172 via the conductive layer 166 and the connection layer 242. The upper surface of the connection portion 204 is made of the same conductive film as the pixel electrode 191. The conductive layer 166 thus obtained is exposed. Electrical connection can be made via the connection layer 242 .

[0205] A substrate 255 is attached to the surface of the substrate 152 opposite to the substrate 151 via an adhesive layer 256. The substrate 255 has a conductive layer 251, an insulating layer 253, and a A conductive layer 252 is provided.

[0206] Here, a conductive film containing a metal or an alloy is used as the conductive layer 251 and the conductive layer 252. The conductive layer 251 and the conductive layer 252 are disposed in the light receiving region of the light receiving element 110. 12, the conductive layer 194 is disposed so as not to overlap with the light emitting region of the light emitting element 190. The layer 251 and the conductive layer 252 are provided at positions overlapping the light-shielding layer BM.

[0207] The conductive layers 251 and 252 may be made of, for example, aluminum, titanium, chromium, or nickel. Kel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten and conductive films containing metals such as these, as well as alloys mainly composed of these metals. Films containing these materials can be used in single layers or as laminate structures.

[0208] Note that a light-transmitting conductive film is used for one or both of the conductive layers 251 and 252. For example, indium oxide, indium tin oxide, indium zinc oxide Conductive oxides such as zinc oxide, zinc oxide containing gallium, or graphene are used. Alternatively, a conductive film that contains the above-mentioned metal or alloy and is thin enough to have light transmitting properties can be used. When a light-transmitting conductive film is used for the conductive layer 251 or the conductive layer 252, The conductive layer is disposed so as to overlap the light receiving region of the light receiving element 110 and the light emitting region of the light emitting element 190. It may be placed.

[0209] The insulating layer 253 may be an inorganic insulating film or an organic insulating film. For example, Resins such as acrylic resin, epoxy resin, silicon oxide, silicon oxynitride, silicon nitride oxide Examples of the insulating material include inorganic insulating materials such as silicon, silicon nitride, and aluminum oxide. The layer 3 may be a single layer or a laminated structure.

[0210] Various optical members can be arranged on the outside of the substrate 255. Examples include a retardation plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light collecting film. In addition, the outside of the substrate 255 is provided with an antistatic film to prevent dust from adhering, and a It also has a water-repellent film that makes it hard to damage the surface, a hard coat film that prevents scratches from occurring during use, and an impact absorbing layer. It may be placed.

[0211] The substrates 151, 152, and 255 are made of glass, quartz, and ceramic, respectively. , sapphire, resin, etc. can be used. If a flexible material is used for 5, the flexibility of the display device can be increased.

[0212] The adhesive layer may be a light-curing adhesive such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various curing adhesives such as viscoelastic adhesives, anaerobic adhesives, etc. can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E VA (ethylene vinyl acetate) resin, etc. In particular, the moisture permeability of epoxy resin, etc. A material with low adhesion is preferable. Two-part mixed resin may also be used. It may be used.

[0213] The connection layer 242 is an anisotropic conductive film (ACF). Inductive Film), Anisotropic Conductive Paste (ACP) Conductive Paste) can be used.

[0214] The light emitting element 190 may be a top emission type, a bottom emission type, a dual emission type, or a The electrode on the light extraction side uses a conductive film that transmits visible light. It is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted.

[0215] The light-emitting element 190 has at least a light-emitting layer 193. As the layer other than the above, a material having a high hole injection property, a material having a high hole transport property, a hole blocking material, A material with high electron transport properties, a material with high electron injection properties, or a bipolar material (electron transport properties and For example, the common layer 112 may further include a layer containing a material having a high hole transporting property. It is preferable that the layer has one or both of a hole injection layer and a hole transport layer. For example, 114 preferably has one or both of an electron transport layer and an electron injection layer.

[0216] The common layer 112, the light-emitting layer 193, and the common layer 114 are made of a low molecular weight compound and a high molecular weight compound. The common layer 112 and the light-emitting layer may be made of any of the above-mentioned materials, and may contain inorganic compounds. The layers constituting the common layer 114 and the layer 193 are formed by deposition (including vacuum deposition), transfer, The insulating layer can be formed by a method such as a copying method, a printing method, an ink-jet method, or a coating method.

[0217] The light-emitting layer 193 may contain an inorganic compound such as quantum dots as a light-emitting material.

[0218] The active layer 113 of the light receiving element 110 includes a semiconductor such as silicon. and organic semiconductors containing organic compounds. Here, an example is shown in which an organic semiconductor is used as the semiconductor of the conductive layer. By using an organic semiconductor, The light emitting layer 193 of the light emitting element 190 and the active layer 113 of the light receiving element 110 are formed by the same method (for example, For example, the film can be formed by a vacuum deposition method, which is preferable since the manufacturing equipment can be shared.

[0219] The active layer 113 is made of an n-type semiconductor material such as fullerene (e.g., C 60 , C 70 Examples of such materials include electron-accepting organic semiconductor materials such as fullerene derivatives. It has a soccer ball-like shape, which is energetically stable. has deep (low) HOMO and LUMO levels. Fullerene has a LUMO level Since the electron acceptor is deep, it has a very high electron acceptor. When the π-electron conjugation (resonance) spreads across the surface, the electron donating property (donor property) increases, but in fullerenes, Because of its spherical shape, the electron acceptability is high even though the π electrons are widely spread. High electron acceptance allows charge separation to occur quickly and efficiently, making it an effective light-receiving device. It is beneficial. 60 , C 70 Both have a wide absorption band in the visible light region, especially C 70 is C 60 It is preferred because it has a larger π-electron conjugated system and a broad absorption band in the long wavelength region as compared to the above.

[0220] The active layer 113 is made of an n-type semiconductor material such as a metal complex having a quinoline skeleton. metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, thiazo metal complexes having an oxadiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazoline derivatives, azole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline Derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, Lysine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, quinone derivatives, etc. can be done.

[0221] The p-type semiconductor material of the active layer 113 is copper (II) phthalocyanine (Cop per(II) phthalocyanine;CuPc), tetraphenyldibenzo Periflanthene (Tetraphenyldibenzoperiflanthene; DBP), Zinc Phthalocyanine (ZnPc) Examples of electron-donating organic semiconductor materials include tin phthalocyanine (SnPc) and quinacridone. Can be obtained.

[0222] As p-type semiconductor materials, carbazole derivatives, thiophene derivatives, and furan derivatives are used. Compounds having an aromatic amine skeleton and conductors are also included as p-type semiconductor materials. Examples of the derivatives include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, Fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, Indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazo derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, chiral derivatives, Nacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyf Examples of the derivatives include fluorene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives. .

[0223] For example, the active layer 113 is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor. Alternatively, the active layer 113 may be formed by laminating an n-type semiconductor and a p-type semiconductor.

[0224] In addition to the gates, sources and drains of transistors, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten Examples of the materials include metals such as zinc and alloys that contain the metals as the main components. The film containing the compound may be used as a single layer or as a laminate structure.

[0225] Examples of the conductive material having a light-transmitting property include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as gallium zinc oxide, zinc oxide, zinc oxide containing gallium, or graphite Alternatively, gold, silver, platinum, magnesium, nickel, tungsten, Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium Alternatively, a nitride of the metal material (e.g. For example, titanium nitride) may be used. Note that metal materials, alloy materials (or their nitrides) When using a material such as a fluoride, it is preferable to make it thin enough to have light transmission properties. A laminated film of a material can be used as the conductive layer. For example, a silver-magnesium alloy and an insulator can be used. It is preferable to use a laminated film of di- um tin oxide or the like because the electrical conductivity can be increased. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive layers of the display element. It is also used for the conductive layer that constitutes the touch sensor. There can be.

[0226] Examples of insulating materials that can be used for each insulating layer include acrylic resin, epoxy resin, and the like. Resins such as oils, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, acid Examples of suitable insulating materials include inorganic insulating materials such as aluminum oxide.

[0227] [Configuration Example 3-2] FIG. 13A shows a cross-sectional view of a display device 200B. The display device 200B includes a lens 14. 9 and a protective layer 195.

[0228] By providing a protective layer 195 that covers the light receiving element 110 and the light emitting element 190, The diffusion of impurities such as water into the light receiving element 110 and the light emitting element 190 is suppressed. The reliability of the optical element 190 can be improved.

[0229] In a region 228 near the end of the display device 200B, the insulating layer 214 is opened to expose the insulating layer 214. It is preferable that the edge layer 215 and the protective layer 195 are in contact with each other. It is preferable that the inorganic insulating film of the protective layer 195 and the inorganic insulating film of the protective layer 195 are in contact with each other. This makes it possible to suppress the diffusion of impurities from the outside into the display section 162 via the organic insulating film. This makes it possible to improve the reliability of the display device 200B.

[0230] FIG. 13B shows an example in which the protective layer 195 has a three-layer structure. The protective layer 195 is made up of an inorganic insulating layer 195a on the common electrode 115 and an organic insulating layer 195b on the inorganic insulating layer 195a. It has an insulating layer 195b and an inorganic insulating layer 195c on the organic insulating layer 195b.

[0231] The end of the inorganic insulating layer 195a and the end of the inorganic insulating layer 195c are aligned with the end of the organic insulating layer 195b. The inorganic insulating layer 195a extends outward from the insulating layer 214 and contacts each other. The insulating layer 215 (inorganic insulating layer) comes into contact with the insulating layer 215 through the opening of the insulating layer 215 (organic insulating layer). The border layer 215 and the protective layer 195 can surround the light receiving element 110 and the light emitting element 190. Therefore, the reliability of the light receiving element 110 and the light emitting element 190 can be improved.

[0232] In this manner, the protective layer 195 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends outward beyond the end of the organic insulating film. .

[0233] A lens 149 is provided on the surface of the substrate 152 facing the substrate 151. The lens 149 is The light receiving area of ​​the light receiving element 110 overlaps with the lens 149, and In addition, it is preferable that the light receiving element 110 does not overlap with the light emitting layer 193. This can increase the sensitivity and accuracy of the sensor.

[0234] The lens 149 has a refractive index of 1.3 or more and 2. The lens 149 is preferably made of at least one of an inorganic material and an organic material. For example, the lens 149 may be made of a material containing resin. In addition, a material containing at least one of an oxide and a sulfide can be used for the lens 149. This can be done.

[0235] Specifically, resins containing chlorine, bromine, or iodine, resins containing heavy metal atoms, resins containing aromatic rings, Resins containing sulfur, resins containing sulfur, etc. can be used for the lens 149. A material containing nanoparticles of a material having a higher refractive index than the resin can be used for the lens 149. Titanium oxide or zirconium oxide, for example, can be used for the nanoparticles.

[0236] Also, cerium oxide, hafnium oxide, lanthanum oxide, magnesium oxide, niobium oxide , tantalum oxide, titanium oxide, yttrium oxide, zinc oxide, indium and tin containing oxide The lens 149 may be made of a material such as an oxide containing indium, gallium, and zinc, or an oxide containing indium, gallium, and zinc. Alternatively, zinc sulfide or the like can be used for the lens 149.

[0237] In the display device 200B, the protective layer 195 and the substrate 152 are bonded together by the adhesive layer 142. The adhesive layer 142 is laminated on the light receiving element 110 and the light emitting element 190. A solid sealing structure is applied to the display device 200B.

[0238] [Configuration Example 3-3] FIG. 14A shows a cross-sectional view of a display device 200C. The display device 200C includes a transistor. The structure of the touch sensor is different from that of the conventional touch sensor. The difference is mainly between the display device 200A and the display device 200B.

[0239] The display device 200C includes a light receiving element 110 and a light emitting element 19 between a substrate 151 and a substrate 152. 0, and a conductive layer 251 and a conductive layer 252 which function as electrodes of the touch sensor.

[0240] The display device 200C includes a transistor 208, a transistor 209, and a and transistor 210.

[0241] The transistors 208, 209, and 210 have gates A conductive layer 221 that functions as a gate insulating layer, an insulating layer 211 that functions as a gate insulating layer, a channel forming region 2 31i and a semiconductor layer having a pair of low resistance regions 231n, A conductive layer 222a connected to one of the pair of low resistance regions 231n, and a conductive layer 222 connected to the other of the pair of low resistance regions 231n. b, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, The insulating layer 211 is formed between the conductive layer 221 and the channel 223. The insulating layer 225 is located between the conductive layer 223 and the channel forming region 231i. It is located between area 231i.

[0242] The conductive layer 222a and the conductive layer 222b are provided on the insulating layer 225 and the insulating layer 215, respectively. The conductive layer 222a and the conductive layer 222b are connected to the low resistance region 231n through the opening. Of 2b, one functions as a source and the other functions as a drain.

[0243] The pixel electrode 191 of the light emitting element 190 is connected to one of the transistors 208 via the conductive layer 222b. It is electrically connected to one of the pair of low resistance regions 231n.

[0244] The pixel electrode 111 of the light receiving element 110 is connected to one side of the transistor 209 via the conductive layer 222b. It is electrically connected to the other of the pair of low resistance regions 231n.

[0245] FIG. 14A shows an example in which an insulating layer 225 covers the top and side surfaces of the semiconductor layer. On the other hand, in the transistor 202 shown in FIG. 14B, the insulating layer 225 is a transistor The conductive layer 231i overlaps the channel forming region 231i, but does not overlap the low resistance region 231n. By processing the insulating layer 225 using the insulating film 223 as a mask, the structure shown in FIG. 14(B) is obtained. In FIG. 14B, the insulating layer 215 is formed to cover the insulating layer 225 and the conductive layer 223. The conductive layer 222a and the conductive layer 222b are formed through the openings in the insulating layer 215. The transistor is connected to the low resistance region 231n. This is also fine.

[0246] In addition, the light receiving element 110 and the light emitting element 190 are covered with an inorganic insulating layer 195a and an organic insulating layer The inorganic insulating layer 195b and the inorganic insulating layer 195c are laminated. A conductive layer 251, an insulating layer 253, and a conductive layer 252 constituting a touch sensor are provided on the substrate 2. The conductive layer 251 and the conductive layer 252 are a light receiving region of the light receiving element 110 and a light emitting element. It is provided at a position that does not overlap with the light emitting region of the child 190.

[0247] [Configuration Example 3-4] FIG. 15 shows a cross-sectional view of a display device 200D. The display device 200D has a different substrate configuration. The main difference between the display device 200 and the display device 200C is that.

[0248] The display device 200D does not have the substrate 151 and the substrate 152, but has the substrates 153, 154, It has an adhesive layer 155 and an insulating layer 212 .

[0249] The substrate 153 and the insulating layer 212 are bonded together by an adhesive layer 155. and protective layer 195 are attached to each other by adhesive layer 142 .

[0250] The display device 200D includes an insulating layer 212, a transistor 208, and a transistor 209 formed on a fabrication substrate. The transistor 209, the light receiving element 110, the light emitting element 190, etc. are transferred onto the substrate 153. The substrate 153 and the substrate 154 are each flexible. This makes it possible to increase the flexibility of the display device 200D.

[0251] The insulating layer 212 can be used for the insulating layers 211, 213, and 215. Alternatively, the insulating layer 212 may be made of a combination of an organic insulating film and an inorganic insulating film. In this case, the film on the transistor 209 side is an inorganic insulating film. It is preferable that

[0252] The above is a description of the configuration example of the display device.

[0253] [About metal oxides] Metal oxides that can be used for the semiconductor layer will be described below.

[0254] In this specification, metal oxides containing nitrogen are also referred to as metal oxides. Metal oxides containing nitrogen are also called metal oxynitrides (MEs). For example, zinc oxynitride (ZnON) A nitrogen-containing metal oxide such as the above may be used for the semiconductor layer.

[0255] In this specification, CAAC (c-axis aligned crystal l), and CAC (Cloud-Aligned Composite) CAAC represents an example of a crystal structure, and CAC represents an example of a function or material configuration. .

[0256] For example, the semiconductor layer uses CAC (Cloud-Aligned Composite) OS (Oxide Semiconductor) can be used.

[0257] CAC-OS or CAC-metal oxide is a material that has a conductive function in some parts. The material has a function of insulating in part and a function of semiconductor in the whole material. Note that CAC-OS or CAC-metal oxide is used as the semiconductor of a transistor. When used in a dielectric layer, the conductive function is to allow the electrons (or holes) that serve as carriers to flow. The insulating function is to prevent the flow of electrons, which act as carriers. The function of switching (On / Off) is achieved by making the function of the sensor and the sensor's sensitivity work in a complementary manner. This function is added to CAC-OS or CAC-metal oxide. In the case of CAC-OS or CAC-metal oxide, By separating the functions, the functionality of both can be maximized.

[0258] In addition, CAC-OS or CAC-metal oxide is a conductive region and an insulating region. The conductive region has the above-mentioned conductive function, and the insulating region has the above-mentioned insulating function. In addition, the conductive region and the insulating region in the material are formed by nanoparticle layers. The conductive and insulating regions may be separated by a gap in the material. In addition, the conductive regions are observed as connected clouds with blurred edges. This may be the case.

[0259] In addition, in the CAC-OS or CAC-metal oxide, a conductive region and The insulating regions are each 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. They may be dispersed in the material at sizes of less than one millimeter.

[0260] In addition, CAC-OS or CAC-metal oxide has different band gaps For example, CAC-OS or CAC-metal ox The ide consists of a wide gap component due to the insulating region and a conductive region. In this configuration, when the carrier flows, In addition, carriers mainly flow in the narrow gap component. The component with a gap acts complementary to the component with a wide gap to produce a narrow gap. Carriers also flow to the wide gap component in conjunction with the component with a large gap. CAC-OS or CAC-metal oxide is used as the channel formation region of the transistor. When used in a transistor, it has a high current driving force in the on-state, i.e., a large on-current. , and high field effect mobility can be obtained.

[0261] That is, CAC-OS or CAC-metal oxide is a matrix composite. matrix composite, or metal matrix composite It can also be called a composite matrix.

[0262] Oxide semiconductors (metal oxides) are classified into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. As a non-single crystal oxide semiconductor, for example, CAAC-OS (c- axis aligned crystalline oxide semiconductor ctor), polycrystalline oxide semiconductor, nc-OS (nanocrystalline ox ide semiconductor), pseudo amorphous oxide semiconductor (a-like OS : amorphous-like oxide semiconductor), and non and amorphous oxide semiconductors.

[0263] CAAC-OS has a c-axis orientation and multiple nanocrystals are connected in the ab-plane direction. The nanocrystals are connected together to form a distorted crystal structure. In a region, a lattice arrangement is formed between a region having a uniform lattice arrangement and another region having a uniform lattice arrangement. This refers to the point where the direction of the

[0264] Nanocrystals are basically hexagonal, but are not limited to regular hexagons and may have non-regular hexagonal shapes. In addition, the distortion may have lattice arrangements such as pentagons and heptagons. In CAAC-OS, clear grain boundaries are not observed even in the vicinity of the strain. It is difficult to confirm the presence of the lattice distortion. This is because the CAAC-OS has a lattice structure in the ab-plane direction. The oxygen atoms are not densely packed, and the bond distance between atoms is shortened by the substitution of metal elements. This is because the distortion can be tolerated by changing the frequency band.

[0265] In addition, the CAAC-OS has a layer containing indium and oxygen (hereinafter, referred to as an In layer) and an element A layered crystal structure in which layers containing M, zinc, and oxygen (hereinafter, (M,Zn) layers) are stacked. (also called layered structure). Indium and element M are mutually substitutable. When the element M in the (M,Zn) layer is replaced with indium, the (In,M,Zn) layer Also, when the indium in the In layer is replaced with element M, (In,M) It can also be expressed as a layer.

[0266] CAAC-OS is a highly crystalline metal oxide. Since it is difficult to confirm the grain boundaries, the decrease in electron mobility caused by the grain boundaries is unlikely to occur. In addition, the crystallinity of metal oxides is reduced by the incorporation of impurities and the generation of defects. Therefore, CAAC-OS is designed to prevent impurities and defects (oxygen vacancies (V O :oxygen v It can also be said to be a metal oxide with low acancy. Metal oxides with CAAC-OS have stable physical properties. The metal oxides used are heat resistant and highly reliable.

[0267] nc-OS is a material that is used in microscopic regions (e.g., regions between 1 nm and 10 nm, especially regions between 1 nm and The atomic arrangement has periodicity in the region of 3 nm or less. There is no regularity in the crystal orientation between the crystals. Therefore, no orientation is observed throughout the film. Therefore, depending on the analysis method, nc-OS may be classified as a-like OS or amorphous oxide semiconductor. Sometimes it is indistinguishable from the body.

[0268] In addition, indium oxide, which is a type of metal oxide containing indium, gallium, and zinc, In the case of IGZO, the nanocrystals mentioned above make it stable. In particular, IGZO tends to have difficulty growing crystals in air. , small crystals (e.g., For example, the nanocrystals mentioned above may be structurally more stable.

[0269] The a-like OS is a metal oxide semiconductor that has a structure between the nc-OS and the amorphous oxide semiconductor. The a-like OS has voids or low density regions. The ke-OS has lower crystallinity than the nc-OS and CAAC-OS.

[0270] Oxide semiconductors (metal oxides) have a variety of structures, each with different properties. The oxide semiconductor of one embodiment of the present invention can be an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-li The ke-OS, nc-OS, and CAAC-OS may have two or more kinds.

[0271] The metal oxide film functioning as the semiconductor layer is heated with either an inert gas or an oxygen gas, or The metal oxide film can be formed by using both of the oxygen flow rate and the oxygen flow rate. There is no particular limitation on the ratio (oxygen partial pressure). However, in order to obtain a transistor with high field effect mobility, In this case, the flow rate ratio of oxygen (oxygen partial pressure) during the formation of the metal oxide film is 0% or more. 30% or less is preferable, 5% or more and 30% or less is more preferable, and 7% or more and 15% or less is even more preferable. Preferred.

[0272] The metal oxide preferably has an energy gap of 2 eV or more, and more preferably has an energy gap of 2.5 eV or less. More preferably, the electron energy is 3 eV or more, and even more preferably, the electron energy is 3 eV or more. The off-state current of a transistor is reduced by using a metal oxide with a wide energy gap. It is possible.

[0273] The substrate temperature during the deposition of the metal oxide film is preferably 350°C or less, and is preferably from room temperature to 200°C or less. More preferably, the temperature is from room temperature to 130° C., and even more preferably. The temperature is preferably room temperature, since the productivity can be increased.

[0274] The metal oxide film can be formed by a sputtering method. The LD method, the PECVD method, the thermal CVD method, the ALD method, the vacuum deposition method, etc. may also be used.

[0275] This concludes the explanation of metal oxides.

[0276] The configuration examples exemplified in this embodiment and the corresponding drawings are at least partially can be appropriately combined with other configuration examples or drawings, etc.

[0277] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0278] (Embodiment 2) In this embodiment, a device to which the display device of one embodiment of the present invention can be applied and a device This section explains authentication methods using the above.

[0279] A device to which the display device according to one embodiment of the present invention is applied detects the position of a finger or the like touching the display surface. It functions as a touch panel that displays images of objects on the display surface, and as an image sensor that captures images of objects on the display surface. For example, fingerprint authentication can be performed by capturing an image of a finger touching the display surface. One aspect of the present invention is a liquid crystal display having light receiving elements arranged in a matrix on a display surface. Therefore, imaging for fingerprint authentication can be performed at any position on the display surface. This makes it possible to realize authentication processing that does not cause stress to the user.

[0280] [Device configuration example] FIG. 16 shows a block diagram of a device 300 according to an embodiment of the present invention. The device 300 includes: The device includes a control unit 301, a display unit 302, and a storage unit 304. The control unit 301 includes an authentication unit 30 The display unit 302 includes a display element 305, a light receiving element 306, and a touch sensor 303. The device 300 is applicable to electronic devices such as mobile information terminals. can be done.

[0281] In the drawings attached to this specification, the components are classified by function and are divided into independent blocks. Although the block diagram shows a block diagram, the actual components are completely separated by function. It is difficult to realize that one component is related to multiple functions, and one function is related to multiple components. It may also be possible to achieve this without any effort.

[0282] The control unit 301 has a function of controlling the entire system of the device 300. The control unit 301 has a function of comprehensively controlling each component of the device 300. do.

[0283] The control unit 301 is, for example, a central processing unit (CPU). The control unit 301 has a function as a programmable unit (PMU). It performs various data processing and program control by interpreting and executing commands from the RAM. The programs that can be executed by the processor are stored in the memory area of ​​the processor. Alternatively, the information may be stored in the storage unit 304.

[0284] The control unit 301 also has a function of generating image data to be output to the display unit 302, A function for processing the captured image (captured image data) input from the light receiving element 306 of the touch sensor A function to process the position information of the detected object input from the sensor 307, and a function to control the lock state of the system. It has the function of controlling

[0285] The display unit 302 has a function of displaying an image, a function of detecting a touch, and a function of capturing an image. The display unit 302 captures an image of a finger touching the screen to obtain fingerprint information. The display unit 302 can also be called a touch panel with a fingerprint information acquisition function. Cut.

[0286] More specifically, the display unit 302 displays a display image based on image data input from the control unit 301. The display unit 302 has a function of displaying an image using a display element 305. 06 to capture an image of a fingerprint or the like and output the captured image data to the control unit 301. In addition, the display unit 302 uses a touch sensor 307 to acquire position information of a detected object such as a finger. and outputs it to the control unit 301.

[0287] The configuration of a display device that can be applied to the display unit 302 can be understood by referring to the first embodiment. can be done.

[0288] The display unit 302 can obtain fingerprint information of the finger that touches the screen regardless of the position on the screen. That is, the area where the touch sensor on the screen works and the fingerprint sensor can be used. It is preferable that the range in which information can be obtained coincides or roughly coincides with the range in which information can be obtained.

[0289] The storage unit 304 has a function of storing fingerprint information of a user that has been registered in advance. The storage unit 304 authenticates the fingerprint information in response to a request from the control unit 301 or the authentication unit 303. The signal can be output to unit 303.

[0290] The storage unit 304 stores fingerprint information of all fingers used by the user for authentication. For example, if two fingerprints, one for the index finger on the right hand and the other for the index finger on the left hand of a user, are collected, The user can hold the device with not only the index finger, but also the middle finger, ring finger, little finger, and thumb. That is, one or more pieces of fingerprint information can be freely registered, and the memory unit 304 stores all the registered The fingerprint information can be stored.

[0291] When the user is authenticated in the user authentication executed by the authentication unit 303, the control unit 301 The ability to transition a system from a locked state to an unlocked, usable state has.

[0292] In addition, the control unit 301 controls the display unit 302 to detect a touch operation when the system is in a locked state. When the position information is output, the display unit 302 is located at the touched position. The image data is generated and output to the display unit 302 so as to light up the display element. Furthermore, the display unit 302 is instructed to capture an image of the fingerprint while the display element is turned on. Has the required functionality.

[0293] In addition, when the system is in a locked state, the control unit 301 displays a message to the user on the display unit 302. Image data including an image showing the position to be touched (also called an image informing the touch position) and outputting it to the display unit 302.

[0294] The authentication unit 303 receives fingerprint information input from the display unit 302 and stores the fingerprint information stored in the storage unit 304. A function that performs a process (authentication process) to verify whether or not the fingerprint information matches the actual fingerprint. The authentication process performed by the authentication unit 303 can be performed using a method such as For example, template matching, which compares two images and uses the similarity between them, or pattern matching, which uses the similarity between two images and In addition, machine learning can be used to infer the Then, a fingerprint authentication process may be performed. In this case, the authentication process may be performed using a neural network. It is preferable that the above-mentioned calculation is performed by inference using the following formula:

[0295] [Authentication method example 1] An example of an authentication method using the device 300 will be described below. The operation relating to authentication will now be described.

[0296] FIG. 17 is a flowchart showing the operation of an authentication method using the device 300.

[0297] First, the process starts. At this time, the system of the device 300 is in a locked state. The functions that a user can execute are restricted (including the logged out and logged off states). (mmm).

[0298] In step S11, it is detected whether or not the display unit 302 has been touched. The touch detection is performed by the touch sensor 307. The process proceeds to S12. Step S11 is repeatedly executed until a touch is detected.

[0299] In step S12, position information of the touch position is acquired. The signal is output from the output 307 to the control unit 301.

[0300] In step S13, the touch position and the display area located in the vicinity of the touch position are detected based on the position information. At this time, the control unit 301 turns on the display element 305. Generates and displays image data in which the areas are bright (high gradation value) and the rest are dark (low gradation value). By outputting the image data to the display unit 302, an image based on the image data is displayed on the display unit 302. do.

[0301] The light emitted from the display element 305 is used as a light source when capturing an image with the light receiving element 306. Therefore, the light-emitting display element 305 emits light that the light-receiving element 306 can receive. For example, the display unit 302 may be a display element that emits light of three colors, R, G, and B. If it has children 305, then any one, any two, or all three of these tables The indicator 305 can be illuminated.

[0302] In step S13, the touch position and its vicinity are brightly displayed (lit up), and the rest are This allows the illuminated display element 305 to be turned off when it is hidden by a finger. This prevents the user from seeing the bright light. This makes it possible to prevent the user from directly viewing the light source for the purpose. In this case, if a user looks directly at the light source for fingerprint authentication, they will feel dazzled and in the worst case scenario, their eyes will be injured. To prevent the risk of damaging the touch panel, only the area hidden by the user's finger is lit up, reducing the burden on the user. can be reduced.

[0303] The area other than the touched position may be turned off or may display other images. This is also fine.

[0304] The brightness of the light-emitting display element 305 depends on the ambient light and the sensitivity of the light-receiving element 306. The brightness can be changed as needed, but it is preferable to light it as brightly as possible. When the brightness or grayscale value when the display element 305 is lit most brightly is taken as 100%, the brightness The degree or gradation value is 50% or more and 100% or less, preferably 70% or more and 100% or less, more preferably Preferably, it can be set to 80% or more and 100% or less.

[0305] It is also preferable that the area that is lit up is the area that is hidden by the finger. When the user touches the screen, the contact surface of the finger is located inside the outline of the finger as seen by the user, and The projection area of ​​the finger on the screen is larger than the contact area of ​​the finger. Therefore, the area that lights up is When the contact area is 100%, the contact area is 50% or more and 150% or less, preferably 70% or more and 1 The lighting area can be 30% or less, and more preferably, 80% or more and 120% or less. If it is less than 50%, the fingerprint information obtained by imaging will be insufficient, resulting in poor authentication accuracy. On the other hand, if the lighting area exceeds 150%, the light from the user may be reduced. There is a risk of direct line of sight to the source.

[0306] The range of lighting is a circle with a radius of r centered on the touch position, and the value of r is The size and shape of the finger may be determined based on the user's age, sex, and build. The radius r of the circle that defines the lighting range is set by the user. It may be possible.

[0307] Next, in step S14, fingerprint information is acquired. The captured image data is output from the display unit 302 to the control unit 301.

[0308] In step S15, authentication processing is performed by the authentication unit 303. The unit 303 compares the fingerprint information (image data) output from the display unit 302 with the fingerprint information (image data) registered in advance. The fingerprint information of the user stored in the storage unit 304 is compared with the fingerprint information of the user to determine whether they match. If the user is authenticated (i.e., if the two pieces of fingerprint information match), If the user is not authenticated (i.e., the two pieces of fingerprint information do not match), the process proceeds to step S16. If it is determined that the above is not the case, the process ends.

[0309] Here, if two or more pieces of fingerprint information are stored in the storage unit 304, all of the fingerprint information The above authentication process is executed for the above.

[0310] In step S16, the control unit 301 unlocks the system of the device 300. transition to a logged-in state (including being logged in).

[0311] This concludes the description of the flowchart shown in FIG.

[0312] A specific example of how the above authentication method is used will be described below. (C) shows the state of using an electronic device to which the above authentication method is applied.

[0313] FIG. 18(A) shows an electronic device 320 to which the device 300 is applied. The child device 320 has a housing 321 and a display unit 322. 01, and the display unit 322 has the above-mentioned display unit 302 applied thereto.

[0314] In FIG. 18A, a finger 330 is touched to the display unit 322 to capture an image of the fingerprint. It shows the situation.

[0315] FIG. 18B shows the finger 330 in FIG. 18A in a transparent manner, with only the outline shown by a dashed line. In FIG. 18B, a finger 330 is positioned in an area 325 including the touched portion. The display element is shown lit up. As shown in FIG. 18(A) and FIG. 18(B), The brightly lit area 325 is hidden by the finger 330 and is difficult for the user to see. This allows the user to perform fingerprint authentication without feeling any stress. Cut.

[0316] Furthermore, the electronic device 320 can perform fingerprint authentication at any position within the display unit 322 . In FIG. 18(C), a fingerprint was printed by touching a different position from those in FIG. 18(A) and FIG. 18(B). 13 shows a state in which imaging is being performed.

[0317] [Authentication method example 2] An example of an authentication method different from the above will be described below. FIG. 19 shows the device 300. 1 is a flowchart showing the operation of an authentication method using the present invention.

[0318] First, the process starts. At this time, the system of the device 300 is in a locked state. be.

[0319] In step S21, a user operation on the device 300 is detected. For example, the electronic device is turned on, a physical button is pressed, the display unit 302 is turned on, and so on. The device may respond to a variety of events, including when the device is touched, when the user's gaze is detected, when the ambient light becomes brighter, or when When an operation is detected, the step The process proceeds to step S22. Step S21 is repeatedly executed until an operation is detected.

[0320] Next, in step S22, the authentication position image is displayed on the display unit 302. The position image is an image that shows the position to be touched by the user, and an image that informs the user of the touch position. This includes images, text information encouraging the user to touch, etc.

[0321] Specifically, the control unit 301 generates image data including an authentication position image, and displays the image data on the display unit 302. , and an image based on the image data is displayed on the display unit 302.

[0322] Here, the position indicated by the authentication position image may be the same position each time the process is executed. It is preferable to set the position to a different position each time the process is executed. The user touches the randomly displayed locations to perform fingerprint authentication. This can be done.

[0323] For example, if a fingerprint image is captured at the same position every time, the surface that is lit as a light source for capturing the fingerprint image may be damaged. The display element 305 and the transistors constituting the pixels are more likely to deteriorate, and the display element 30 This may result in a decrease in the brightness of the LED 5 or problems such as image burn-in. As described above, the fingerprint authentication is performed at a different position each time the process is performed, so that the display element 305 This can suppress a decrease in brightness and image burn-in on the screen.

[0324] In addition, by performing fingerprint authentication in a different position each time a process is executed, the user is actively authenticating. This will improve users' security awareness because they need to perform actions to authenticate the user. It has the effect of being able to do so.

[0325] Here, the authentication position image can be an image that specifies not only the touch position but also the finger to be touched. Or you can display text information together. For example, "Touch with your middle finger." The system displays text information such as the above, and performs authentication using the fingerprint information of the middle finger in the subsequent authentication process. The finger to be specified is randomly changed for each processing, just like the touch position. It can be done.

[0326] In addition, a plurality of authentication position images are displayed on the display unit 302, and the images are touched simultaneously with two or more fingers. The authentication process can be based on two or more fingerprints. Or, it can be based on one finger. If the process is successful, a different finger is used for fingerprint authentication. Floor authentication may also be performed.

[0327] In this way, instead of performing authentication processing using only one fingerprint, multiple fingerprints are used. By randomly selecting and executing the authentication process, security can be made extremely high. For example, a malicious user can obtain the fingerprint information of the real user (owner) illegally. Even when using the device 300 after acquiring the fingertip, the fingertip of multiple fingers (preferably all fingers) may be used. Since the device 300 cannot be used without the fingerprint information, unauthorized use can be effectively prevented. do.

[0328] In step S23, it is determined whether or not a touch has been made at a position corresponding to the authentication position image. The touch is detected by the touch sensor 307. In this case, the process proceeds to step S24. If no touch is detected for a certain period of time, or if a touch is detected at a different position, If the position is touched, the process ends.

[0329] In step S24, the display elements 305 located at and near the touch position are turned on. Step S24 can be implemented by using step S13 in the above example 1 of the authentication method.

[0330] In step S25, fingerprint information is acquired. The fingerprint information is acquired by capturing an image of the fingerprint by the light receiving element 306. The image data is output from the display unit 302 to the control unit 301.

[0331] In step S26, authentication processing is performed by the authentication unit 303. If the user is not authenticated, the process proceeds to step S27. If the user is not authenticated, the process ends. For this, step S15 in the above example 1 of the authentication method can be used.

[0332] Here, in step S22, an image for designating a touching finger or When text information is displayed on the display unit 302 in accordance with the touch position, the fingerprint of the corresponding finger is displayed. The information is used to perform an authentication process.

[0333] Also, as described above, in step S22, a plurality of authentication position images corresponding to two or more fingers are When displayed on the display unit 302, authentication processing is performed using the fingerprint information of the corresponding multiple fingers. do.

[0334] In step S27, the control unit 301 unlocks the system of the device 300. transition to a logged-in state (including being logged in).

[0335] This concludes the description of the flowchart shown in FIG.

[0336] Here, in the case of performing the multi-step authentication described in step S22, The process up to step S26 may be executed multiple times. For example, when two-step authentication is executed, In the first process, the fingerprint of the middle finger of the right hand is used for authentication. If the fingerprint is successfully authenticated, In the second process, the fingerprint of the ring finger of the left hand is used for authentication. If the fingerprint is successfully authenticated, the system You can also perform operations such as unlocking the system. It is preferable that the finger designated in the process be changed randomly for each process.

[0337] In FIG. 20A, an image 32 is displayed on a display unit 322 of an electronic device 320 as an authentication position image. 6 is displayed, and the user is about to touch the part shown in the image 326 with a finger 330. It shows a child.

[0338] Image 326 shows an illustration of a fingerprint, as well as text to encourage users to touch the screen. The information on the screen is "Touch Here". By adding this information, the location can be clearly indicated to the user.

[0339] In FIG. 20B, an image 326 is displayed in a different position from that in FIG. 20A, and the image 326 is displayed with a finger 330. It shows that he is about to touch.

[0340] [Examples of electronic device configurations] FIG. 21A shows a schematic diagram of an electronic device 320. The electronic device 320 has a housing 321 and a display. 21A shows an enlarged view of one pixel in the display unit 322. The pixels provided in the display unit 322 are a light emitting element 21R, a light emitting element 21G, a light emitting element 2 1B and a light receiving element 22. Also, a conductive layer 251 having a lattice-shaped upper surface is provided. The light emitting elements 21R, 21G, and 21B are disposed on the openings of the conductive layer 251. , and a light receiving element 22 are disposed.

[0341] In the electronic device 320, the entire area of ​​the display unit 322 functions as a touch panel. The display 320 has pixels, each having a light receiving element 22, arranged across the entire area of ​​a display section 322. Therefore, no matter where on the display unit 322 is touched, an image of the fingerprint can be captured.

[0342] The electronic device 320A shown in FIG. 21B has a display unit 322 divided into two areas (area 322A 21B, the region 322B is located on the lower side of the display unit 322. The remaining area is area 322A.

[0343] FIG. 21B is an enlarged view of one pixel provided in the region 322A and the region 322B. The pixel provided in the region 322B is the same as that of the electronic device shown in FIG. Similarly to the pixels provided in the display unit 322 of 320, the light emitting element 21R, the light emitting element 21G, It has a photoelectric element 21B and a photodetector 22.

[0344] In addition, the pixels provided in the region 322A do not have the light receiving element 22 and are composed of only the light emitting element. In FIG. 21B, a pixel includes one light emitting element 21R and one light emitting element 21. In this example, the light emitting element 21B has two light emitting elements 21G and 21B. The pixel array may be different from that of the region 322B. For example, For example, the light emitting elements 21R, 21G, and 21B may be arranged in a stripe shape. If the pixel arrangement is the same in the area 322A and the area 322B, the boundary between them can be seen. This is preferable because it makes it less likely to be recognized.

[0345] Moreover, a lattice-shaped conductive layer 251 is provided in both the region 322A and the region 322B. As a result, the entire area of ​​the display unit 322 functions as a touch panel.

[0346] In FIG. 21B, fingerprint authentication can be performed by touching area 322B. This allows users to always perform fingerprint authentication in the same area of ​​the screen, making it easier to use. This makes the electronic device more user-friendly.

[0347] In FIG. 21B, the area 322B is located below the display unit 322, and the area 32 Although an example in which the shape of the region 322B is approximately circular has been shown, the position and shape of the region 322B are not limited to this. For example, it may be provided along a part of the outline of the display unit 322. The number of regions 322B is not limited to one, and a plurality of regions 322B may be arranged within the display unit 322.

[0348] The above is a description of the configuration example of the electronic device.

[0349] The authentication method, processing method, operation method, and operation method executed by the device according to one aspect of the present invention are The operation method, the display method, etc. can be described as, for example, a program. The authentication method, processing method, operation method, operation method, or the like executed by the device 300 shown in FIG. The program describing the display method is stored in a non-transitory storage medium and is written to the device 30. The program can be read and executed by the arithmetic unit or the like of the control unit 301 of the program. That is, a program for executing the above-mentioned authentication method, operation method, etc., by hardware. The program and the non-transitory storage medium on which the program is stored are aspects of the present invention.

[0350] The configuration examples exemplified in this embodiment and the corresponding drawings are at least partially can be appropriately combined with other configuration examples or drawings, etc.

[0351] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0352] (Embodiment 3) In this embodiment, a pixel structure that can be applied to a display device according to one embodiment of the present invention will be described. The following description will be given with reference to the drawings.

[0353] A display panel according to one embodiment of the present invention includes a first pixel circuit having a light-receiving element and a light-emitting element. and a second pixel circuit configured to receive the first pixel circuit and the second pixel circuit. The particles are arranged in a square shape.

[0354] FIG. 22(A) shows an example of a first pixel circuit having a light receiving element, and FIG. 22(B) shows an example of a first pixel circuit having a light emitting element. 3 shows an example of a second pixel circuit having a photoelement.

[0355] The pixel circuit PIX1 shown in FIG. 22A includes a light receiving element PD, a transistor M1, The transistor M2, the transistor M3, the transistor M4, and the capacitance element C1. 1 shows an example in which a photodiode is used as the light receiving element PD.

[0356] The cathode of the light receiving element PD is electrically connected to the wiring V1, and the anode of the transistor M1 The gate of the transistor M1 is electrically connected to either the source or drain of the TX, and the other of the source and drain is one electrode of the capacitance element C1. The source or drain of the transistor M2 is electrically connected to the gate of the transistor M3. The transistor M2 has a gate electrically connected to the wiring RES and a source or drain The other of the drains is electrically connected to the wiring V2. One of the sources or drains is electrically connected to the wiring V3, and the other of the source or drain is connected to the transistor M4. The gate of the transistor M4 is electrically connected to either the source or drain of the The other of the source and drain is electrically connected to the wiring OUT1. .

[0357] A constant potential is supplied to the wiring V1, the wiring V2, and the wiring V3. When driving the transistor with a reverse bias, a potential lower than the potential of the wiring V1 is supplied to the wiring V2. The transistor M2 is controlled by a signal supplied to the wiring RES. A function that resets the potential of the node connected to the gate of M3 to the potential supplied to wiring V2. The transistor M1 is controlled by a signal supplied to the wiring TX, and the light receiving element P It has the function of controlling the timing at which the potential of the above node changes depending on the current flowing through D. The transistor M3 functions as an amplifier transistor that outputs an output according to the potential of the node. The transistor M4 is controlled by a signal supplied to the line SE, and A selection transistor that connects the output according to the potential to the wiring OUT1 and reads it out with an external circuit. It functions as:

[0358] The pixel circuit PIX2 shown in FIG. 22B includes a light-emitting element EL, a transistor M5, a transistor Here, the light-emitting element EL includes a transistor M6, a transistor M7, and a capacitance element C2. In particular, an organic EL element is used as the light-emitting element EL. It is preferable to use:

[0359] The transistor M5 has a gate electrically connected to the wiring VG and a source or drain The other of the source and drain is electrically connected to one of the capacitor elements C2. The source of the transistor M6 is electrically connected to the gate of the transistor M7. One of the drain and the anode of the light-emitting element EL is electrically connected to the wiring V4, and the other of the drain and the anode of the light-emitting element EL is electrically connected to the wiring V5. and electrically connected to either the source or the drain of the transistor M7. 7, the gate is electrically connected to the wiring MS, and the other of the source and drain is connected to the wiring OUT2 The cathode of the light-emitting element EL is electrically connected to a wiring V5.

[0360] A constant potential is supplied to the wiring V4 and the wiring V5. The transistor M can be set to a high potential and the cathode side can be set to a lower potential than the anode side. 5 is controlled by a signal supplied to the wiring VG to control the selection state of the pixel circuit PIX2. The transistor M6 also functions as a select transistor for selecting the It functions as a driving transistor that controls the current flowing through the light-emitting element EL according to the potential applied to the When the transistor M5 is in a conductive state, the potential supplied to the wiring VS is The potential is supplied to the gate, and the luminance of the light emitted from the light-emitting element EL can be controlled according to the potential. The transistor M7 is controlled by a signal supplied to the wiring MS, and together with the transistor M6, the light emitting The potential between the element EL and the transistor EL is output to the outside via a wiring OUT2.

[0361] In the display panel of this embodiment, an image is displayed by making the light emitting element emit light in a pulsed manner. By shortening the driving time of the light emitting element, the power consumption of the display panel can be reduced. In addition, heat generation can be suppressed. In particular, organic EL elements have excellent frequency characteristics. The frequency can be, for example, 1 kHz or more and 100 MHz or less. do.

[0362] Here, the pixel circuit PIX1 includes a transistor M1, a transistor M2, A transistor M3 and a transistor M4, and a transistor M5 of the pixel circuit PIX2, The transistors M6 and M7 each have a semiconductor layer in which a channel is formed. It is preferable to use a transistor including a metal oxide (oxide semiconductor) for the semiconductor device.

[0363] Using metal oxides that have a wider band gap than silicon and a lower carrier density The transistor can realize an extremely small off-state current. The off-state current causes the charge stored in the capacitor connected in series with the transistor to be discharged for a long period of time. Therefore, it is possible to hold the capacitance in series with the capacitance element C1 or the capacitance element C2. The transistors M1, M2, and M5 connected to the It is preferable to use a transistor in which a semiconductor is applied. Similarly, by using a transistor including an oxide semiconductor, the manufacturing cost of the It is possible.

[0364] In addition, the transistors M1 to M7 are made of a semiconductor having a channel formed therein. In particular, transistors using single crystal silicon or polycrystalline silicon can be used. By using highly crystalline silicon such as silicon nitride, it is possible to achieve high field effect mobility. This is preferable because it enables faster operation.

[0365] In addition, an oxide semiconductor is used for at least one of the transistors M1 to M7. In addition, a transistor using silicon is used. Good too.

[0366] In addition, in FIG. 22(A) and FIG. 22(B), the transistor is an n-channel transistor. Although the transistors are shown as p-channel transistors, p-channel transistors can also be used.

[0367] The transistors included in the pixel circuit PIX1 and the transistors included in the pixel circuit PIX2 are It is preferable that they are formed side by side on the same substrate. The transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are mixed in one area and periodically It is preferable to adopt a configuration in which the electrodes are arranged in an array.

[0368] In addition, a transistor and a capacitance element are provided at a position overlapping with the light receiving element PD or the light emitting element EL. It is preferable to provide one or more layers having one or both of these. This allows the effective occupation area of ​​the path to be reduced, and a high-definition light receiving section or display section can be realized.

[0369] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0370] (Embodiment 4) In this embodiment, drawings of electronic devices to which the display device of one embodiment of the present invention can be applied are shown. Please refer to the following for explanation.

[0371] The electronic device of this embodiment includes a display device according to one embodiment of the present invention. It has the function of displaying the user's ID, so it can perform biometric authentication on the display and can also recognize the user's ID by touch or near touch. The electronic device according to one embodiment of the present invention is difficult to be illegally used and has a high security. It is an electronic device with an extremely high reliability. It also improves the functionality and convenience of electronic devices. It is possible.

[0372] Examples of electronic devices include television sets, desktop or notebook computers, etc. Personal computers, computer monitors, digital signage, pachinko machines In addition to electronic devices with relatively large screens such as large game consoles, digital cameras, Digital video cameras, digital photo frames, mobile phones, portable game consoles, portable information Examples of the device include terminals, audio playback devices, etc.

[0373] The electronic device of this embodiment is a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, ,distance, light, liquid, magnetic, temperature, chemical, sound, time, hardness, electric field, current, voltage, power, (including the ability to measure radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays) It is okay to do so.

[0374] The electronic device of the present embodiment can have various functions. For example, Still images, videos, text images, etc.) on the display, touch panel function, calendar Functions such as displaying date, time, etc., and running various software (programs) function, wireless communication function, and function to read out programs or data recorded on a recording medium. They may have the following abilities:

[0375] The electronic device 6500 shown in FIG. 23(A) is a mobile device that can be used as a smartphone. It is a portable information terminal.

[0376] The electronic device 6500 includes a housing 6501, a display unit 6502, a power button 6503, and a button 6 504, a speaker 6505, a microphone 6506, a camera 6507, and a light source 6508. The display unit 6502 has a touch panel function.

[0377] The display device of one embodiment of the present invention can be applied to the display portion 6502.

[0378] FIG. 23B is a schematic cross-sectional view including the end portion of the housing 6501 on the microphone 6506 side.

[0379] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501. A display panel 6511, an optical member 6512, a display unit 6513, and a protective member 6510 are disposed in a space surrounded by the display panel 6511 and the protective member 6510. The touch sensor panel 6513, the printed circuit board 6517, the battery 6518, etc. are arranged. do.

[0380] The protective member 6510 includes a display panel 6511, an optical member 6512, and a touch sensor panel. The panel 6513 is secured in place by an adhesive layer (not shown).

[0381] In the area outside the display portion 6502, a part of the display panel 6511 is folded back. The folded part is connected to the FPC6515. IC6516 is mounted on the FPC6515. is connected to the terminal.

[0382] The flexible display of one embodiment of the present invention can be applied to the display panel 6511. This allows for extremely lightweight electronic devices. Because it is extremely thin, it is possible to mount a large-capacity battery (6518) while keeping the thickness of the electronic device to a minimum. Also, a part of the display panel 6511 can be folded back and an FPC 6515 can be attached to the back of the pixel area. By providing a connection portion with the above, an electronic device with a narrow frame can be realized.

[0383] FIG. 24A shows an example of a television device. A television device 7100 includes a housing 7 A display unit 7000 is built into the housing 101. 101 is shown as a supported configuration.

[0384] The display device of one embodiment of the present invention can be applied to the display portion 7000.

[0385] The television device 7100 shown in FIG. 24A is operated by an operation switch provided in the housing 7101. This can be done by a separate remote control 7111 or the display unit 70. The display unit 7000 may be provided with a touch sensor, and the television The remote control device 7111 may operate the application device 7100. The remote control 7111 may have a display unit for displaying information output from the remote control 7111. You can control the channel and volume using the operation keys or touch panel. By doing so, it is possible to operate the image displayed on the display unit 7000.

[0386] The television device 7100 includes a receiver and a modem. The receiver can receive general television broadcasts. It can also receive TV broadcasts by wire or by modem. By connecting to a wireless communication network, one-way (sender to receiver) or It is also possible to communicate information in both directions (between sender and receiver, or between receivers). be.

[0387] FIG. 24B shows an example of a notebook personal computer. The computer 7200 includes a housing 7211, a keyboard 7212, a pointing device, The housing 7211 includes a display unit 7000 and an external connection port 7213. It is included.

[0388] The display device of one embodiment of the present invention can be applied to the display portion 7000.

[0389] 24(C) and 24(D) show an example of digital signage.

[0390] The digital signage 7300 shown in FIG. 24C includes a housing 7301, a display unit 7000, and a speaker 7303. In addition, LED lamps, operation keys (power switch, It may have a variety of functions, including a control switch, connection terminals, various sensors, a microphone, etc. Cut.

[0391] FIG. 24(D) shows a digital signage 7400 attached to a cylindrical pole 7401. The digital signage 7400 is a display unit 700 provided along the curved surface of a pillar 7401. 0.

[0392] In FIG. 24C and FIG. 24D, the display device of one embodiment of the present invention is included in the display portion 7000. The position can be applied.

[0393] The larger the display unit 7000, the more information can be displayed at one time. The wider the display unit 7000 is, the more easily it will catch people's attention, and the more effective it will be for advertising, for example. can.

[0394] By applying a touch panel to the display unit 7000, images or videos can be displayed on the display unit 7000. It is preferable because it not only displays the route information but also allows users to operate it intuitively. When used for purposes such as providing information such as road safety or traffic information, This can further improve usability.

[0395] Also, as shown in FIG. 24(C) and FIG. 24(D), the digital signage 7300 Digital Signage 7400 is a system that displays information on smartphones and other information terminals owned by users. It is preferable that the device can be connected to the information terminal 7311 or the information terminal 7411 via wireless communication. For example, advertising information displayed on the display unit 7000 may be displayed on the information terminal 7311 or The information can be displayed on the screen of the information terminal 7311 or the information terminal By operating 7411, the display on the display unit 7000 can be changed.

[0396] In addition, the Digital Signage 7300 or Digital Signage 7400 can be equipped with an information terminal. A game is played using the screen of the information terminal 7311 or the information terminal 7411 as the operation means (controller). This allows an unspecified number of users to participate in the game at the same time and have fun. You can enjoy it.

[0397] The electronic device shown in FIG. 25A to FIG. 25F includes a housing 9000, a display portion 9001, a switch A speaker 9003, an operation key 9005 (including a power switch or an operation switch), and a connection Terminal 9006, sensor 9007 (force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance , light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, power, radiation , flow, humidity, gradient, vibration, odor or infrared measurement capabilities), micro 9008, etc.

[0398] The electronic devices shown in FIG. 25(A) to FIG. 25(F) have various functions. Function to display various information (still images, videos, text images, etc.) on the display unit, touch panel function , calendar, date or time display functions, various software (programs) a function for controlling processing by a wireless communication function, a program recorded on a recording medium, or The electronic device can have the function of reading and processing data, etc. The electronic device may have a variety of functions, but is not limited to these. Also, a camera or the like may be provided in the electronic device to take still images or videos and store them on a recording medium (external It has the functions of storing the captured image on a memory card (built into the camera or the internal memory) and displaying the captured image on the display. It is okay to do so.

[0399] The electronic devices shown in FIGS. 25A to 25F will be described in detail below.

[0400] FIG. 25A is a perspective view showing a portable information terminal 9101. For example, the mobile information terminal 9101 can be used as a smartphone. A speaker 9003, a connection terminal 9006, a sensor 9007, etc. may be provided. The terminal 9101 can display text and image information on multiple surfaces. In the example shown in FIG. 9, three icons 9050 are displayed. 051 can be displayed on another surface of the display unit 9001. , notifications of incoming e-mails, SNS, phone calls, etc., subject of e-mails and SNS, sender Name, date and time, battery level, antenna reception strength, etc. An icon 9050 or the like may be displayed in the position where the number 1 is displayed.

[0401] FIG. 25B is a perspective view showing a portable information terminal 9102. , and has a function of displaying information on three or more faces of the display unit 9001. An example is shown in which information 9053 and information 9054 are displayed on different sides. The user holds the mobile information terminal 9102 in the breast pocket of his / her clothes. You can also check the information 9053 displayed in a position that can be observed from above 02. The user can check the display without taking the mobile information terminal 9102 out of his / her pocket, and can, for example, You can decide whether to accept the offer or not.

[0402] FIG. 25C is a perspective view showing a wristwatch-type portable information terminal 9200. The display surface of the display device 9001 is curved, and the display can be performed along the curved display surface. In addition, the mobile information terminal 9200 can communicate with, for example, a headset capable of wireless communication. By doing so, it is possible to make a call hands-free. A connection terminal 9006 is used to transmit data to and from other information terminals and to charge the device. The charging operation may be performed by wireless power supply.

[0403] 25(D), 25(E), and 25(F) show a foldable portable information terminal 92. FIG. 25(D) shows the mobile information terminal 9201 in an unfolded state. Figure 25(F) shows the folded state, and Figure 25(E) shows the folded state from either Figure 25(D) or Figure 25(F). The portable information terminal 9201 is in a folded state. The is highly portable, and when unfolded, the seamless, wide display area makes it easy to see what is displayed. The display unit 9001 of the portable information terminal 9201 is connected by a hinge 9055. For example, the display unit 9001 has a radius of curvature of 0.1 m. It can be bent from 150 mm to 150 mm.

[0404] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0405] X1 to X4: wiring, Y1 to Y8: wiring, 10: display device, 11: board, 12: board, 14 : memory unit, 15: functional layer, 20: pixel, 21R, G, B: light emitting element, 22: light receiving element, 3 1, 32: conductive layer, 35: capacitance, 36: light, 60: finger 100A to H, J: display device, 110: light receiving element, 111: pixel electrode, 112: common layer, 113: Active layer, 114: Common layer, 115: Common electrode, 121, 122: Light, 131, 1 32: transistor, 142: adhesive layer, 143: space, 149: lens, 151-154 : Substrate, 155: Adhesive layer, 162: Display section, 164: Circuit, 165: Wiring, 166: Conductive layer, 172: FPC, 173: IC, 182, 184: buffer layer, 190: light emitting element, 191: pixel electrode, 192, 194: buffer layer, 193: light-emitting layer, 195: protective layer, 1 95a: inorganic insulating layer, 195b: organic insulating layer, 195c: inorganic insulating layer, 200A to 200D: surface Display device, 201, 205, 208, 209, 210: transistor, 204: connection part, 2 11 to 215: insulating layer, 216: partition wall, 218: insulating layer, 221: conductive layer, 222a, b : Conductive layer, 223: Conductive layer, 225: Insulating layer, 228: Region, 231: Semiconductor layer, 231 i: channel formation region, 231n: low resistance region, 242: connection layer, 251, 251t, 2 51X, Y, 252, 252t: conductive layer, 253, 254: insulating layer, 255, 258: substrate Board, 256, 257: Adhesive layer 300: device, 301: control unit, 302: display unit, 303: authentication unit, 304: storage unit , 305: display element, 306: light receiving element, 307: touch sensor, 320: electronic device, 3 20A: Electronic device, 321: Housing, 322: Display unit, 322A, B, 325: Area, 32 6:Image, 330:Finger

Claims

[Claim 1] A light emitting element and a light receiving element are included, the light-emitting element includes a first pixel electrode, a first common layer having a region disposed above the first pixel electrode, a light-emitting layer having a region disposed above the first common layer, a second common layer having a region disposed above the light-emitting layer, and a common electrode having a region disposed above the second common layer; the light receiving element has a second pixel electrode, the first common layer having a region disposed above the second pixel electrode, an active layer having a region disposed above the first common layer, the second common layer having a region disposed above the active layer, and the common electrode having a region disposed above the second common layer; the first pixel electrode and the second pixel electrode have a region disposed so as to be in contact with an upper surface of a first insulating film; the common electrode has a region overlapping with the first pixel electrode via the second common layer, the light emitting layer, and the first common layer, and a region overlapping with the second pixel electrode via the second common layer, the active layer, and the first common layer. Display device.

Images