Electronic component device and manufacturing method of electronic component device

Abstract

To suppress the wrapping of a substrate in the case of attaching the substrate and a cooling member with an attachment member.SOLUTION: An electronic component device comprises: a substrate in which an electron component is assembled; a cooling member that is arranged in a state of facing the substrate, and cools the electron component; an attachment member that is arranged at a position on one side of the electron component in a second direction crossed to a first direction where the substrate and the cooling member face each other, and the other side position, respectively, and attaches the cooling member to the substrate; a contact member that comes into contact with the electron component and the cooling member in a state of being sandwiched between the electron component and the cooling member in the first direction; and a spacer that is arranged between the electron component and the attachment member in the second direction, is in contact with the substrate and the cooling member on both ends in the first direction, and limits an approach of the cooling member to the substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an electronic component device and a method for manufacturing an electronic component device. [Background technology]

[0002] Patent Document 1 discloses that the heat sink connector is composed of a printed circuit board, an electronic component, two layers of thermally conductive sheets, a ground member, a heat sink, and a spring screw. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-84599 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a configuration in which the substrate and the cooling member are attached with an attachment member, there is a risk that the substrate may warp due to the attachment of the cooling member using the attachment member.

[0005] The present disclosure aims to suppress warping of a substrate in a configuration in which a substrate and a cooling member are attached with an attachment member. [Means for solving the problem]

[0006] Means for solving the above problems include the following embodiments. <1> A substrate on which electronic components are mounted; a cooling member disposed opposite the substrate and configured to cool the electronic components; mounting members that are disposed on one side and the other side of the electronic component in a second direction intersecting a first direction in which the board and the cooling member face each other, and that mount the cooling member to the board; a contact member that is in contact with the electronic component and the cooling member while being sandwiched between the electronic component and the cooling member in the first direction; a spacer that is disposed between the electronic component and the mounting member in the second direction, that contacts the board and the cooling member at both ends in the first direction, and that limits the approach of the cooling member to the board; An electronic component device comprising: <2> The spacer is set to a height that exceeds the height of the electronic component in the first direction and does not exceed the height plus the thickness of the contact member. <1> The electronic component device according to claim 1 . <3> The spacer is sandwiched between the plurality of mounting members and the electronic component. <1> ~ <2> 13. An electronic component device according to claim 12, <4> The spacer has a first elastic portion along the first direction, and a second elastic portion aligned with the first elastic portion in the first direction and having a lower elastic modulus than the first elastic portion. <1> ~ <3> 13. An electronic component device according to claim 12, <5> Placing contact members on the electronic components on the substrate; A spacer is disposed on the substrate and horizontally outward of the electronic component; a cooling member is disposed in a state in which the contact member is sandwiched between the electronic component and the cooling member in a direction intersecting a horizontal direction; The substrate and the cooling member are attached to the spacer on the opposite side to the electronic component at a position where the spacer and the cooling member are brought close to each other until they come into contact with each other. A method for manufacturing an electronic component device. Effect of the Invention

[0007] According to the present disclosure, warping of the substrate is suppressed when the substrate and the cooling member are attached with an attachment member. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view of an electronic component device according to an embodiment of the present disclosure with a heat sink removed. [Diagram 2] FIG. 2 is a front view of an electronic component device according to an embodiment of the present disclosure. [Diagram 3] FIG. 1A is a front view of a package substrate according to an embodiment of the present disclosure; FIG. 1B is a front view of the package substrate of FIG. 1A in contact with a thermally conductive member; FIG. 1C is a front view of the package substrate of FIG. 1B in a state where a spacer is attached; and FIG. 1D is a front view of the package substrate of FIG. 1C in a state where a heat sink is attached to the thermally conductive member and spacer. [Figure 4] FIG. 13 is a front view of a comparative example in which a warp occurs in the substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] An electronic component device 10 according to an embodiment of the present disclosure will be described in detail with reference to Figures 1 to 3. Note that the arrow W shown in the figures indicates the width direction of the electronic component device 10 as an example of the second direction, and the arrow H indicates the up-down direction (height direction) of the electronic component device 10 as an example of the first direction. Also, the direction perpendicular to the arrows W and H, going from the front to the back, is indicated as the depth direction. The width direction, up-down direction, and depth direction are mutually perpendicular. Note that perpendicularity is an example of intersection. In this specification, the above directions will be used for the description, but the posture of the electronic component device is not limited to these directions.

[0010] (Electronic component device 10) The electronic component device 10 includes a package substrate 12, a bolt 20, a heat sink 30, a spacer 40, and a thermally conductive member 50, and is configured to allow the package substrate 12 to exhibit a predetermined performance.

[0011] (Package substrate 12) As shown in FIG. 1, the package substrate 12 includes a substrate 14 and an electronic component 16 , and the substrate 14 and the electronic component 16 are connected with solder 18 .

[0012] The substrate 14 is a square with a side length of LP in a plan view, and has a predetermined thickness from the top surface 14a to the bottom surface 14b. The substrate 14 has a plurality of holes (not shown), lands (not shown), and mounting holes (not shown). The holes penetrate the substrate 14 from the top surface 14a to the bottom surface 14b, and terminals (not shown) of the electronic components 16 described below are inserted into the holes. The lands (not shown) are metal plates or films arranged on the top surface 14a, and a portion of the lands is arranged around the holes, and the lands of the substrate 14 and the terminals of the electronic components 16 are electrically and mechanically connected via solder 18. The mounting holes (not shown) are holes formed in the four corners of the substrate 14, and bolts 20 described below are inserted into the holes.

[0013] The electronic component 16 is rectangular in plan view and is mounted on the substrate 14 via solder 18. When an input signal is input to the electronic component 16, the electronic component 16 outputs an output signal in a state where a function predetermined for each electronic component 16 is exerted, for example, in a state where a current flows through an IC chip. In this embodiment, nine electronic components 16 are mounted in a lattice shape centered on the intersection of two diagonal lines DG in the substrate 14. The diagonal lines DG are imaginary lines arranged on the upper surface 14a of the substrate 14. Each terminal (not shown) of the electronic component 16 extends from the lower surface 16b of the electronic component 16 and is inserted into a plurality of holes (not shown) of the substrate 14. As shown in FIG. 2, the electronic component 16 has a height (thickness) HE from the upper surface 14a of the substrate 14 to the upper surface 16a of the electronic component 16 in a state where it is mounted on the substrate 14.

[0014] The package substrate 12 is configured as described above, and is traded on the market as a product.

[0015] (Thermal conductive member 50) As shown in FIG. 1, the thermally conductive member 50 is in a sheet shape and is disposed in a heat generating portion (not shown) of the upper surface 16a of the electronic component 16 in a plan view. The thermally conductive member 50 is an example of a contact member. In this embodiment, the thermally conductive member 50 is disposed in a position that is smaller than the upper surface 16a of the electronic component 16 in a plan view and does not protrude from the upper surface 16a, and is disposed on nine electronic components 16. The thermally conductive member 50 contacts the upper surface 16a of the electronic component 16 at the lower surface 50b, and contacts the heat sink 30 (described later) at the upper surface 50a. In other words, the thermally conductive member 50 contacts the electronic component 16 and the heat sink 30 in a state where it is sandwiched between the electronic component 16 and the heat sink 30 in the vertical direction.

[0016] Here, "sandwiching" refers to a relative arrangement between two objects and an object, and refers to an arrangement or arrangement in which the object is located between two objects when viewed from two of three mutually perpendicular directions. In this embodiment, since the thermally conductive member 50 is located between the electronic component 16 and the heat sink 30 when viewed from two directions, the depth direction and the width direction, it can be said that the thermally conductive member 50 is sandwiched between the electronic component 16 and the heat sink 30.

[0017] The thermal conductivity of the thermally conductive member 50 is, for example, in the range of 10 W / mK to 100 W / mK. The thermally conductive member 50 has a height (thickness) HT from the lower surface 50b to the upper surface 50a. For example, the thermally conductive member 50 is a graphite sheet with a thickness of 0.25 mm.

[0018] (Heat sink 30) 2, the heat sink 30 is a plate on which a plurality of fins for heat dissipation are arranged, and is arranged to face the upper surface 14a of the substrate 14 in the vertical direction. The heat sink 30 is an example of a cooling member. The heat sink 30 has a plate 32 and fins 34, and cools the electronic components 16 transmitted from the thermally conductive member 50 with outside air. The heat sink 30 can be made of any material, for example, copper, as long as it has excellent heat dissipation performance.

[0019] The plate 32 is a plate that extends in the width direction and the depth direction and is rectangular in plan view. The plate 32 has a hole that penetrates in the plate thickness direction from the upper surface 32a to the lower surface 32b. In this embodiment, the plate 32 has a square shape in plan view, and one hole is formed in each of the four corners. A female thread is formed on the hole wall (the side surface inside the hole).

[0020] A plurality of fins 34 are arranged on the upper surface 32a of the plate 32 and stand upright from the upper surface 32a in a front view. In this embodiment, the fins 34 are eleven wall-shaped fins that extend in the depth direction and are spaced apart from one another in the width direction, and are integrally molded with the plate 32. The fins 34 are arranged on the plate 32 in correspondence with the positions of the thermally conductive members 50.

[0021] As described above, the heat sink 30 is disposed on the electronic components 16 of the package substrate 12 via the thermally conductive member 50, thereby forming a heat dissipation path.

[0022] (Spacer 40) The spacer 40 limits the approach of the plate 32 of the heat sink 30 to the substrate 14. As shown in Figures 1 and 2, the spacer 40 is a rectangular column that is disposed between the electronic component 16 and a bolt 20 (described later) in the width direction, and contacts the upper surface 14a of the substrate 14 and the lower surface 32b of the plate 32 of the heat sink 30 at both ends in the vertical direction. Here, the term "end" refers to a concept that includes the end face and its surrounding area.

[0023] Here, "disposing between" is a higher-level concept of "sandwiching" in this specification, and refers to a relative arrangement between two objects and an object, and means an arrangement or disposition in which an object is located between two objects when viewed from at least one of three mutually perpendicular directions. In this embodiment, the spacer 40 is disposed between the electronic component 16 and a bolt 20 described later when viewed from the depth direction, so it can be said that the spacer 40 is disposed between the electronic component 16 and the bolt 20. Note that the electronic component 16 is disposed between a first spacer 41 and a second spacer 42 described later when viewed from the depth direction, so it can be said that the electronic component 16 is disposed between the first spacer 41 and the second spacer 42 described later. On the other hand, the electronic component 16 is disposed between the first spacer 41 and the third spacer 43 when viewed from the depth direction and the width direction, so it can be said that the first spacer 41 and the third spacer 43 sandwich the electronic component 16.

[0024] The upper limit of the height HS of the spacer 40 in the vertical direction is set to a height that exceeds the height HE of the electronic component 16 but does not exceed the height HE of the electronic component 16 plus the height (thickness) HT of the thermally conductive member 50, and the lower limit of the height HS is equal to the height HE of the electronic component 16. In this embodiment, the spacer 40 is a regular square prism having a length LS of one side in the depth direction and width direction and having a height HS that is equal to the height HE of the electronic component 16 plus the height (thickness) HT of the thermally conductive member 50. The height HS of the spacer 40 is, for example, the height from the lower surface 41b to the upper surface 41a in the case of a first spacer 41 described later, and the height from the lower surface 42b to the upper surface 42a in the case of a second spacer 42.

[0025] The spacer 40 is made of resin. For example, the spacer 40 is made of polyimide resin. Both of the vertical end surfaces of the spacer 40 are formed flat. Both vertical end portions of the spacer 40 are attached to the upper surface 14a of the substrate 14 and the lower surface 32b of the plate 32 of the heat sink 30 by sticky adhesive parts (not shown), respectively. Note that when the spacer 40 does not have an adhesive part, for example, when a double-sided tape (not shown) is used separately from the spacer 40, the height HS of the spacer 40 is made thinner by the thickness of the double-sided tape.

[0026] Spacer 40 is positioned on substrate 14 such that its center is on diagonal DG of substrate 14 in a plan view, is located inside mounting holes (not shown) formed in the four corners of substrate 14, and is spaced apart from electronic components 16.

[0027] In this embodiment, there are a plurality of spacers 40, including a first spacer 41, a second spacer 42, a third spacer 43, and a fourth spacer 44. When a center 41c of the first spacer 41, a center 42c of the second spacer 42, a center 43c of the third spacer 43, and a center 44c of the fourth spacer 44 are connected, they form a square with these as vertices in a plan view.

[0028] Next, the first spacer 41 and the third spacer 43 of the spacer 40 will be described. As shown in FIG. 1, the first spacer 41 and the third spacer 43 are arranged on a common diagonal line DG. In addition, three electronic components 16 are arranged on the diagonal line DG. The bolt 20 (the bolt 20 at the lower right in the figure) closest to the first spacer 41 and the bolt 20 (the bolt 20 at the upper left in the figure) closest to the third spacer 43 are arranged on the diagonal line DG. Therefore, the first spacer 41 and the third spacer 43 are sandwiched between the multiple bolts 20 (the bolt 20 at the lower right in the figure and the bolt 20 at the upper left in the figure) and the electronic component 16. Similarly, the second spacer 42 and the fourth spacer 44 are also sandwiched between the multiple bolts 20 (the bolt 20 at the lower left in the figure and the bolt 20 at the upper right in the figure) and the electronic component 16.

[0029] In FIG. 1, the bolts 20 are disposed on one side of the electronic components 16 in the width direction (the lower right side of the first spacer 41 and the upper right side of the fourth spacer 44 in the figure) and the other side (the lower left side of the second spacer 42 and the upper left side of the third spacer 43 in the figure). The bolts 20 attach the heat sink 30 to the board 14. The bolts 20 are an example of an attachment member. In this embodiment, the bolts 20 are arranged in a total of four, divided into an odd-numbered group that sandwiches the first spacer 41 and the third spacer 43 together with three electronic components 16 on one diagonal line DG, and an even-numbered group that sandwiches the second spacer 42 and the fourth spacer 44 together with three electronic components 16 on the other diagonal line DG. The bolts 20 have heads 20a, and are inserted into attachment holes in the board 14 so that the heads 20a are in contact with the lower surface 14b of the board 14, and are screwed into holes in the plate 32 of the heat sink 30.

[0030] (summary) The electronic component device 10 is configured as described above.

[0031] (Method of Manufacturing Electronic Component Device 10) Next, a description will be given of a method for manufacturing the electronic component device 10. Note that, in this embodiment, the first spacer 41 and the second spacer 42 are illustrated and described, but a combination with any other spacer 40 may also be used.

[0032] As shown in FIG. 3A, the package substrate 12 is placed on a base (not shown) such that the lower surface 14b of the substrate 14 is positioned on the base (not shown) when viewed from the front.

[0033] As shown in FIG. 3B, a thermally conductive member 50 is disposed on the top surface 16a of the electronic component 16 on the substrate 14 of the package substrate 12.

[0034] As shown in Figure 3(C), on the substrate 14, outside the width direction (horizontal direction) of the electronic component 16 in a planar view, a first spacer 41 and a fourth spacer 44 (not shown) are arranged on one side, and a second spacer 42 and a third spacer 43 (not shown) are arranged on the other side.

[0035] As shown in FIG. 3(D), the heat sink 30 is disposed with the thermally conductive member 50 sandwiched between the electronic component 16 in the vertical direction.

[0036] 2, the bolt 20 is inserted into the mounting hole from the lower surface 14b side of the substrate 14 using a tool that can access the mounting hole, and the bolt 20 is attached to the through hole of the plate 32 of the heat sink 30. More specifically, the substrate 14 and the heat sink 30 are screwed with the bolt 20 on the side opposite the electronic component 16 (right side in the figure) relative to the first spacer 41 and the fourth spacer 44 (not shown) until the first spacer 41 and the fourth spacer 44 come into contact with the heat sink 30. Also, the substrate 14 and the heat sink 30 are screwed with the bolt 20 on the side opposite the electronic component 16 (left side in the figure) relative to the second spacer 42 and the third spacer 43 until the second spacer 42 and the third spacer 43 come into contact with the heat sink 30. Here, the side opposite the electronic component 16 with respect to the spacer 40 refers to the side on which the bolt 20 is located, with the spacer 40 being disposed between the bolt 20 and the electronic component 16, or more narrowly, the side on which the bolt 20 is located, sandwiching the spacer 40 between the electronic component 16. In this state, the heat sink 30 is placed on the package substrate 12 so that the lower surface 32b of the plate 32 of the heat sink 30 contacts the upper surface of the spacer 40 and the upper surface 50a of the thermally conductive member 50.

[0037] Then, the combination of the heat sink 30 and the package substrate 12 attached with the bolts 20 is heated for a predetermined time and temperature by a heater (not shown). For example, the combination of the heat sink 30 and the package substrate 12 fastened with the bolts 20 is heated to 80° C. by using the heater.

[0038] Furthermore, if necessary, the bolts 20 are tightened with a predetermined torque, thereby completing the manufacture of the electronic component device 10.

[0039] (Action and Effects) The action and effect of the electronic component device 10 according to the present embodiment will be described with reference to a comparative example that does not have the spacer 40. The electronic component device 10 according to the present embodiment and the electronic component device according to the comparative example have a common configuration except for the spacer 40.

[0040] 4, the electronic component device according to the comparative example does not include spacers 40, and therefore when bolts 20 are fastened to female screws (not shown) of heat sink 30, substrate 14 of package substrate 12 warps in plan view. Specifically, the center of package substrate 12 in the width direction is deformed into a convex shape extending downward in the vertical direction, and both ends of package substrate 12 in the width direction are deformed so as to approach heat sink 30. In this state, upper surface 50a of thermally conductive member 50 is at least partially separated from lower surface 32b of plate 32 of heat sink 30, and therefore heat from electronic component 16 is not sufficiently transmitted to heat sink 30.

[0041] On the other hand, as shown in FIG. 2, in the electronic component device 10 and the manufacturing method for the electronic component device 10 of this embodiment, in a configuration in which the substrate 14 and the heat sink 30 are attached with bolts 20, the spacer 40 of this embodiment suppresses warping of the substrate 14.

[0042] More specifically, the electronic component device 10 according to the present embodiment includes a substrate 14 incorporating an electronic component 16, a heat sink 30 arranged facing the substrate 14 and cooling the electronic component 16, bolts 20 arranged on one side and the other side of the electronic component 16 in the width direction and attaching the heat sink 30 to the substrate 14, a thermally conductive member 50 that is sandwiched between the electronic component 16 and the heat sink 30 in the vertical direction and contacts the electronic component 16 and the heat sink 30, and a spacer 40 arranged between the electronic component 16 and the bolts 20 in the width direction, contacts the substrate 14 and the heat sink 30 at both ends in the vertical direction, and limits the approach of the heat sink 30 to the substrate 14. This configuration suppresses warping of the substrate 14.

[0043] Furthermore, in the electronic component device 10 according to this embodiment, the spacer 40 is set to a height that exceeds the electronic component 16 in the vertical direction but does not exceed the height plus the thickness of the thermally conductive member 50. With this configuration, overload on the thermally conductive member 50 and the electronic component 16 due to attachment is suppressed.

[0044] Furthermore, in the electronic component device 10 according to this embodiment, the spacer 40 is sandwiched between the multiple bolts 20 and the electronic component 16, so warping of the substrate 14 is suppressed compared to a configuration in which only one spacer 40 is used.

[0045] In the manufacturing method of the electronic component device 10 according to this embodiment, the combination of the heat sink 30 and the package substrate 12 attached with the bolts 20 is heated with a heater (not shown), and then the bolts 20 are tightened with a predetermined torque, thereby suppressing warping of the substrate 14 of the electronic component device 10.

[0046] (Modification) Although the present disclosure has been described in detail with respect to specific embodiments, it will be apparent to those skilled in the art that the present disclosure is not limited to such embodiments, and that the present disclosure can take on various other embodiments within the scope of the present disclosure.

[0047] Although the package substrate 12 is assumed to be traded as a product in the market, this is not limiting. For example, after everything from the package substrate 12 to the electronic component device 10 is manufactured in one factory, the electronic component device 10 may be traded as a product in the market.

[0048] Although the substrate 14 has been described as having a square shape, the shape is not limited to this and may be, for example, a rectangle or a circle.

[0049] Although nine electronic components 16 are incorporated in the substrate 14 in a lattice pattern, this is not limiting. For example, the electronic components 16 may be appropriately incorporated in the substrate 14 according to a predetermined regularity or randomly, and fewer than nine or more than ten electronic components 16 may be incorporated in the substrate. In the first place, there may be only one electronic component 16. Although the electronic component 16 is incorporated with the intersection of the diagonal lines DG of the substrate 14 as the center, this is not limiting. For example, in cases where the substrate 14 and the heat sink 30 have different shapes, dimensions, etc., the electronic component 16 may be incorporated in the substrate 14 while avoiding the diagonal lines DG of the substrate.

[0050] The bolts 20 have been described as an example of the mounting members, but the present invention is not limited to this. Instead of combining the bolts 20 with the mounting holes of the heat sink 30, mounting using a combination of the bolts 20 and nuts, mounting using a clamp that grips the substrate 14 and the heat sink 30, mounting by pressing a press-fit pin into the mounting hole of the heat sink 30, or other mounting methods and mounting members can be used.

[0051] Although the thermally conductive member 50 has been described as being sheet-shaped, this is not limiting. For example, the thermally conductive member 50 may be a fluid such as grease. In this case, the thermally conductive member 50 preferably has a viscosity such that the thermally conductive member 50 has a thickness in the vertical direction that allows the thermally conductive member 50 to contact the upper surface 16a of the electronic component 16 and the lower surface 32b of the plate 32 of the heat sink 30 when the heat sink 30 is attached to the board 14 by the bolts 20. In addition, although the thermally conductive member 50 has been described as being smaller than the upper surface 16a of the electronic component 16, this is not limiting. For example, the thermally conductive member 50 may be configured to be the same size as the upper surface 16a of the electronic component or larger than the upper surface 16a.

[0052] The heat sink 30 is assumed to cool the heat of the electronic component 16 with outside air, but is not limited thereto. For example, the heat sink 30 may transmit the heat accumulated in the thermally conductive member 50 to the refrigerant by passing a liquid refrigerant through the heat sink 30. In addition, the plate 32 is assumed to be a rectangular plate in a plan view, but is not limited thereto. For example, the plate 32 may be a circular disk in a plan view. The fins 34 are assumed to be eleven wall-shaped extending in the depth direction, but is not limited thereto. The number and arrangement of the fins 34 may be changed, for example, based on the cooling performance. The fins 34 are assumed to be integrally molded with the plate 32, but is not limited thereto. For example, the fins 34 and the plate 32 may be molded separately, and then the fins 34 may be attached to the plate 32. In addition, the heat sink 30 is assumed to be made of, for example, copper, but is not limited thereto. For example, the heat sink 30 may be made of aluminum.

[0053] Although the spacer 40 is assumed to be a rectangular column, the spacer 40 is not limited to this. For example, the spacer 40 may be a circular column or a cylinder.

[0054] Although the spacer 40 is made of resin, this is not limiting. For example, the spacer 40 may be made of aluminum, stainless steel, or other metals. The material of the spacer 40 is not important as long as it does not deform significantly even after undergoing the heating process during processing. In particular, it is preferable to use the same resin as the electronic component 16 itself (dummy chip) that is not electrically connected to the substrate 14 or the resin that is used to seal the electronic component 16 as the spacer 40, because the spacer 40 has the same thermal expansion coefficient as the electronic component 16.

[0055] Although both ends of the spacer 40 are attached to the substrate 14 and the heat sink 30 with double-sided tape, the present invention is not limited to this. For example, both ends of the spacer 40 may be attached with solder. In addition, both ends of the spacer 40 are attached by a common attachment method, but the present invention is not limited to this. For example, one end of the spacer 40 may be attached by a different method.

[0056] A total of four spacers 40 are arranged between the bolts 20 and the electronic components 16 at the four corners of the substrate 14 corresponding to the four bolts 20, but this is not limited thereto. For example, additional spacers 40 may be arranged in addition to the four corners of the substrate 14. Also, the number of spacers 40 may be set according to the shape of the substrate 14. Also, when the center 41c of the first spacer 41, the center 42c of the second spacer 42, the center 43c of the third spacer 43, and the center 44c of the fourth spacer 44 are connected, they form a square in plan view with these as the vertices, but this is not limited thereto. For example, a plurality of spacers 40 may be arranged to form the vertices of a rectangle or a triangle in plan view. Also, the spacer 40 may be located in the center of the heat sink 30 as long as the spacer 40 is located between the bolt 20 and the electronic component 16 .

[0057] The spacer 40 may be a square pillar made of aluminum, but may have a partly modified configuration. Specifically, the spacer according to the modified example may have a first elastic portion along the vertical direction, and a second elastic portion aligned with the first elastic portion in the vertical direction and having a lower elastic modulus than the first elastic portion. The first elastic portion is, for example, aluminum, and the second elastic portion is, for example, natural rubber, which has a lower elastic modulus than aluminum. The spacer according to the modified example may have a plurality of second resin portions sandwiching the first resin portion from above and below. According to this configuration, when the bolt 20 attaches the heat sink 30 to the substrate 14, even if there is a manufacturing variation in the second elastic portion in the vertical direction, the first elastic portion elastically deforms in the vertical direction, so that the manufacturing variation in the spacer according to the modified example in the vertical direction is absorbed.

[0058] In addition, in the spacer according to the modified example, the second resin parts are configured to sandwich the first resin part from above and below, but this is not limited to this. For example, the second resin part may be configured on the lower side in the vertical direction, and the first resin part may be configured on the second resin part.

[0059] The manufacturing method of the electronic component device 10 is not limited to the manufacturing method according to the present embodiment. For example, the spacer 40 may be arranged on the substrate 14 on the outer side of the electronic component 16 in the width direction, and then the thermally conductive member 50 may be arranged on the electronic component 16. Alternatively, the thermally conductive member 50 may be arranged on the electronic component 16 on the substrate 14, the heat sink 30 may be arranged with the thermally conductive member 50 sandwiched between the electronic component 16 in the vertical direction, and then the spacer 40 may be arranged between the substrate 14 and the heat sink 30 using a jig that is accessible from the outer side in the width direction. [Explanation of symbols]

[0060] 10 Electronic component equipment 12 Package substrate 14 Substrate 16 Electronic Components 20 Bolts (Example of mounting parts) 30 Heat sink (an example of a cooling component) 32 Plate 34 Finn 40 Spacer 50 Thermally conductive member (an example of a contact member) DG Diagonal

Claims

1. A substrate on which electronic components are mounted; a cooling member disposed opposite the substrate and configured to cool the electronic components; mounting members that are disposed on one side and the other side of the electronic component in a second direction intersecting a first direction in which the board and the cooling member face each other, and that mount the cooling member to the board; a contact member that is in contact with the electronic component and the cooling member while being sandwiched between the electronic component and the cooling member in the first direction; a spacer that is disposed between the electronic component and the mounting member in the second direction, contacting the board and the cooling member at both ends in the first direction and limiting the approach of the cooling member to the board; An electronic component device comprising:

2. The spacer is set to a height that exceeds the height of the electronic component in the first direction and does not exceed a height including a thickness of the contact member. The electronic component device according to claim 1 .

3. The spacer is sandwiched between the plurality of mounting members and the electronic component. The electronic component device according to claim 1 .

4. The spacer has a first elastic portion along the first direction, and a second elastic portion aligned with the first elastic portion in the first direction and having a lower elastic modulus than the first elastic portion. The electronic component device according to claim 1 .

5. Placing contact members on the electronic components on the substrate; A spacer is disposed on the substrate and horizontally outward of the electronic component; a cooling member is disposed in a state in which the contact member is sandwiched between the electronic component and the cooling member in a direction intersecting a horizontal direction; The substrate and the cooling member are attached to the spacer on the opposite side to the electronic component at a position where the spacer and the cooling member are brought close to each other until they come into contact with each other. A method for manufacturing an electronic component device.

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