Chip type electronic component storage mount and chip type electronic component storage tape

Abstract

To provide a chip type electronic component storage mount in which jumping of a stored chip type electronic component does not generate when peeling a top cover tape and in which fluffing during peeling is also suppressed in the chip type electronic component storage mount, and also which has less time degradation of these performances.SOLUTION: At least at a part of at least one surface of a paper base material, a coating layer is provided. The coating layer includes polyvinyl alcohol resin and polyoxyethylene alkyl ether phosphate salt. The ratio between polyvinyl alcohol resin and polyoxyethylene alkyl ether phosphate salt in the coating layer is 91:9-99.8:0.2.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a carrier tape paper used when obtaining a taping package of chip-shaped electronic components such as ICs and LSIs.

Background Art

[0002] A chip-type electronic component storage tape is used for transporting chip-type electronic components. Usually, it is manufactured by processing a chip-type electronic component storage mount as follows and then used. (1) The chip-type electronic component storage mount is slit into a tape shape with a predetermined width. (2) Cavities and feed holes of a predetermined size are formed in the obtained tape to obtain a chip-type electronic component storage tape. The cavity is a space used for storing chip-type electronic components, and the feed hole is a hole used when transferring the chip-type electronic component storage tape by the rotation of a sprocket in an electronic component filling machine and an electronic component mounting machine. (3) In an electronic component filling machine, the cavities of the chip-type electronic component storage tape are filled with chip-type electronic components, and a top cover tape is thermally adhered and sealed to the surface (top side) of the chip-type electronic component storage tape. (4) The chip-type electronic component storage tape storing the chip-type electronic components and sealed by thermally adhering the top cover tape is shipped in a state of being wound around a cassette reel. (5) At the final user, a cassette reel wound with a chip-type electronic component storage tape is set in an electronic component mounting machine. The electronic component mounting machine continuously feeds out the chip-type electronic component storage tape, peels off the top cover tape from the surface, and takes out the chip-type electronic components stored in the cavities, and delivers them to the component mounting device (electronic equipment assembly device) in the next process. This process proceeds continuously in synchronization with the tape feeding.

[0003] When peeling the thermally bonded chip-type electronic component storage backing paper and the top cover tape, the value of the peeling strength fluctuates rather than remaining constant during the peeling process. If the range of this fluctuation is large, the backing paper storing the chip-type electronic components may vibrate, and the stored chip-type electronic components may bounce off. Therefore, it is necessary to suppress the fluctuation range of the value of the peeling strength of the thermal bond between the chip-type electronic component storage tape and the top cover tape. Also, if the minimum value of the peeling strength is too low, there is a risk that part or all of the top cover tape may peel off during transportation or work, causing the components to fall off. Moreover, if the average value of the peeling strength is too high, it may become an obstacle to smooth component mounting for the end user. Therefore, it is necessary that the average value of the peeling strength is adjusted within an appropriate range.

[0004] When peeling the top cover tape from the chip-type electronic component storage tape, lumps of pulp fibers on the surface of the storage backing paper may adhere to the top tape cover and lift off the paper surface. At this time, the lifted pulp fiber lumps may partially or completely separate from the paper surface with respect to the top cover tape, or may remain on the paper surface in a state where part or all of them are lifted off the paper surface. That is, it is a peeling snag. Depending on the residual state and size, this peeling snag may partially or completely block the cavity opening, which may become an obstacle to taking out the chip-type electronic components. Therefore, it is desirable that no peeling snag occurs or that the peeling snag that occurs is minute when peeling the top cover tape.

[0005] From the above, a method of applying a surface coating to the backing paper that is the raw material of the chip-type electronic component storage tape is often used to control the fluctuation range and average value of the peeling strength of the top cover tape to appropriate values, and also to suppress the snags that occur during peeling. At this time, the average value of the peeling strength can be controlled to some extent by the coating amount. When the coating amount is large and sufficiently covers the surface of the backing paper, the average value of the peeling strength decreases, and the peeling also becomes smooth, so the fluctuation range of the peeling strength is also suppressed. Patent Documents 1 and 2 disclose a paper base material for a chip-type electronic component storage backing paper on which a polyvinyl alcohol (hereinafter also referred to as PVA) - based resin coating layer is formed.

[0006] However, the chip-type electronic component storage backing paper having a PVA-based resin coating layer has a problem that the average value of the peel strength and the fluctuation range of the peel strength of the heat-sealed top cover tape increase during the storage of the chip-type electronic component storage backing paper.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0008] In view of the above circumstances, the present invention provides a chip-type electronic component storage backing paper having a coating layer mainly composed of a polyvinyl alcohol resin, in which the chip-type electronic components stored do not bounce off when the top cover tape is peeled off, and the fluffing during peeling is also suppressed, and a chip-type electronic component storage backing paper with little deterioration of these performances over time.

Means for Solving the Problems

[0009] The present invention has the following configuration. [1] A chip-type electronic component storage backing paper having a coating layer on at least a part of at least one surface of a paper substrate, the coating layer containing a polyvinyl alcohol resin and a polyoxyethylene alkyl ether phosphate salt, and the ratio of the polyvinyl alcohol resin: polyoxyethylene alkyl ether phosphate salt in the coating layer being 91:9 to 99.8:0.2. [2] The chip-type electronic component storage backing paper according to [1], wherein the coating amount of the coating layer is 0.1 to 3 g / m 2 2. [3] The polyvinyl alcohol resin is an ethylene-modified polyvinyl alcohol resin, and the chip-type electronic component storage backing paper and the chip-type electronic component storage tape described in [1] or [2]. [4] A chip-type electronic component storage tape using the chip-type electronic component storage backing paper according to any one of [1] to [3].

Effect of the Invention

[0010] According to the present invention, it is possible to provide a chip-type electronic component storage backing paper and a chip-type electronic component storage tape that appropriately control the peel strength of the top cover tape and suppress the average value, variation width, and change over time of the peel strength.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, an embodiment of the chip-type electronic component storage backing paper (hereinafter abbreviated as "storage backing paper") of the present invention will be described. The storage backing paper of this embodiment includes a paper base material and a coating layer applied to at least one surface.

[0012] (Paper base material) The paper base material is made by papermaking pulp, and it may be single-layered or multi-layered. The basis weight of the paper base material is preferably 100 to 1500 g / m 2 in order to easily obtain the physical properties required for the storage backing paper. In order to be within such a basis weight range, a multi-layered one is preferable because it is easy to handle.

[0013] Examples of the pulp constituting the paper base material include chemical pulp, mechanical pulp, waste paper pulp, non-wood fiber pulp, and the like. These pulps may be used alone or in combination of a plurality. No matter which pulp is used, it is preferable that the fiber form is as uniform as possible. The pulp may be beaten or unbeaten. In the case of beaten pulp, it is preferably 250 to 560 ml in Canadian Standard Freeness (CSF). If the CSF of the pulp is equal to or higher than the lower limit value, a sufficient yield can be ensured and the loss in quantity due to densification can be prevented. If it is equal to or lower than the upper limit value, the strength, particularly the interlayer strength, will be high. The beater used for pulp beating is not particularly limited, and examples include beaters, Jordans, Deluxe Finishers (DF), Single Disk Refiners (SDR), Double Disk Refiners (DDR), and the like.

[0014] When the paper base material is multi-layered, the surface layer may be formed by papermaking with fresh pulp, and the layers other than the surface layer may be formed by papermaking with raw materials containing waste paper pulp.

[0015] The paper base material may contain internal additives used during papermaking. Examples of internal additives include internal sizing agents, various paper strength enhancers, drainage yield improvers, water resistance agents, defoaming agents, fillers such as talc, dyes, and the like.

[0016] (Surface Coating) The coating applied to the surface of the paper base material contains polyvinyl alcohol (hereinafter also referred to as PVA) resin and polyoxyethylene alkyl ether phosphate salt, and the ratio of PVA resin: polyoxyethylene alkyl ether phosphate salt in the coating is 91:9 to 99.8:0.2, more preferably 92:8 to 99.7:0.3, and even more preferably 93:7 to 99.5:0.5. When the ratio of polyoxyethylene alkyl ether phosphate salt is 0.2 or more, an effect of suppressing the variation range of the peel strength of the top cover tape can be obtained. When the ratio is 9 or less, an effect of suppressing the increase in the average value of the peel strength of the top tape cover due to changes over time without accompanying an increase in peeling can be exerted.

[0017] The degree of polymerization of the PVA resin used as the main agent is preferably 300 to 2,000. When it is at or above this lower limit, the coating film can obtain sufficient strength, and when it is at or below this upper limit, it has a viscosity suitable for coating. The saponification degree of the PVA resin is preferably 95 mol% or more. When it is at or above this lower limit, the coating film has excellent strength and it is easier to suppress the variation range of the peel strength. The PVA resin may be a modified PVA resin having functional groups other than hydroxyl groups and acetate groups. Among the modified PVA resins, ethylene-modified PVA resin is preferable because it can increase the peel strength from the top cover tape.

[0018] Polyoxyethylene alkyl ether phosphate salt is available as a commercial product. Examples of commercial products of polyoxyethylene alkyl ether phosphate salt include the Electro Stripper series of Kao Corporation, the Pricerf series of Dai-ichi Kogyo Seiyaku Co., Ltd., and the Take Surf series of Takemoto Yushi Co., Ltd.

[0019] The coating may contain a water-soluble polymer or an aqueous emulsion other than the PVA resin. Examples of the water-soluble polymer or the aqueous emulsion include starch, polyacrylamide, acrylic resin, styrene-butadiene copolymer resin, styrene-isoprene copolymer resin, styrene-(meth)acrylic copolymer resin, styrene-maleic anhydride copolymer resin, polyester resin, ethylene-vinyl acetate copolymer resin, vinyl acetate-vinyl alcohol copolymer resin, urethane resin, paraffin wax, and the like. Also, as other components, various additives such as antioxidants, heat stabilizers, antifouling agents, and rust preventives may be included.

[0020] The surface coating amount of the coating is preferably 0.1 to 3 g / m 2 in terms of dry coating amount, and more preferably 0.4 to 2.0 g / m 2 If the dry coating amount is 0.1 g / m 2 or more, the surface of the paper substrate can be coated so as to fully exhibit the peeling performance, and if the dry coating amount is 3.0 g / m 2 or less, the adhesive force with the top cover tape can be sufficiently ensured.

[0021] As a coating device for applying a coating material to the surface of a paper substrate, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a roll coater (e.g., a gate roll coater, a size press, a calendar coater, etc.), a bill blade coater, etc. are used. Among these, since it is easy to deeply penetrate the coating material into the paper substrate by nip pressure, it is preferable to use a size press or a calendar coater.

[0022] The chip-type electronic component storage paper of the present invention is thermally adhered to a top cover tape to form a chip-type electronic component storage tape. The top cover tape thermally adhered to the chip-type electronic component storage paper of the present invention is composed of a base material sheet and a heat seal layer provided on one side of the base material sheet. The base material sheet of the top cover tape is composed of a plastic film such as polyester, polypropylene, or polyethylene.

[0023] The heat seal layer is composed of a thermoplastic resin, an adhesion-imparting auxiliary agent, etc. Examples of the thermoplastic resin used in the heat seal layer include polyester resin, polyethylene resin, polyacrylic resin, polyurethane resin, ethylene-vinyl acetate copolymer resin, etc.

Example

[0024] Hereinafter, the present invention will be described in more detail by showing examples and comparative examples, but the present invention is not limited to the following examples and is not limited thereto.

[0025] <Production Example 1> A multilayer paper substrate composed of a surface layer, a middle layer, and a back layer was produced by the following method. The hardwood kraft pulp was beaten with a double disk refiner to obtain pulp for forming the surface layer adjusted to a Canadian Standard Freeness (CSF) of 450 ml. To the pulp for forming the surface layer, a rosin sizing agent (AL1200, manufactured by Starlight PMC) was added at 0.2% by mass based on the pulp weight, aluminum sulfate was added to adjust the pH to 4.5, and a polyacrylamide paper strengthening agent (Polystron 1250, manufactured by Arakawa Chemical Industries, Ltd.) was added at 1.0% by mass based on the pulp weight as an internal paper strengthening agent to obtain a pulp slurry for forming the surface layer.

[0026] The hardwood kraft pulp was beaten with a double disk refiner to obtain pulp for forming the middle layer adjusted to a Canadian Standard Freeness (CSF) of 400 ml. To the pulp for forming the middle layer, a rosin sizing agent (AL1200, manufactured by Starlight PMC) was added at 0.2% by mass based on the pulp weight, aluminum sulfate was added to adjust the pH to 4.5, and a polyacrylamide paper strengthening agent (Polystron 1250, manufactured by Arakawa Chemical Industries, Ltd.) was added at 1.0% by mass to obtain a pulp slurry for forming the middle layer.

[0027] The hardwood kraft pulp was beaten with a double disk refiner until the Canadian Standard Freeness (CSF) reached 500 ml to obtain pulp for forming the back layer. To the pulp for forming the back layer, a rosin sizing agent (AL1200, manufactured by Starlight PMC) was added at 0.27% by mass based on the pulp weight, aluminum sulfate was added to adjust the pH to 4.5, and a polyacrylamide paper strengthening agent (Polystron 1250, manufactured by Arakawa Chemical Industries, Ltd.) was added at 1.0% by mass as an internal paper strengthening agent to obtain a pulp slurry for forming the back layer.

[0028] Using a six-layer multi-form paper machine, the above three types of pulp slurries were used to form a wet sheet at a mass ratio of surface layer: middle layer: back layer = 1:4:1. After drying with the dryer of the paper machine, the coating shown in the following examples was applied to the surface (the exposed surface of the surface layer) of the paper base material using a calendar installed in the paper machine and dried to produce a paper base material with a basis weight of 620 g / m 2 , and a thickness of 0.75 mm.

[0029] <Example 1> Completely saponified PVA resin "PVA-117" (saponification degree 98-99 mol%, degree of polymerization 1700) manufactured by Kuraray Co., Ltd. and antistatic agent "Electro Stripper F" manufactured by Kao Corporation as potassium salt of polyoxyethylene alkyl ether phosphate were mixed at a solid content ratio of 99.0 mass% / 1.0 mass%, diluted to a concentration of 8.0%, and used as the paint for calendar coating in Production Example 1 above, 1.52 g / m 2 Coated to obtain a chip-type electronic component storage backing paper.

[0030] <Example 2> Completely saponified PVA resin "PVA-117" (saponification degree 98-99 mol%, degree of polymerization 1700) manufactured by Kuraray Co., Ltd. and antistatic agent "Electro Stripper F" manufactured by Kao Corporation as potassium salt of polyoxyethylene alkyl ether phosphate were mixed at a solid content ratio of 97.0 mass% / 3.0 mass%, diluted to a concentration of 6.7%, and used as the paint for calendar coating in Production Example 1 above, 1.18 g / m 2 Coated to obtain a chip-type electronic component storage backing paper.

[0031] <Example 3> Completely saponified PVA resin "PVA-117" (saponification degree 98-99 mol%, degree of polymerization 1700) manufactured by Kuraray Co., Ltd. and antistatic agent "Electro Stripper F" manufactured by Kao Corporation as potassium salt of polyoxyethylene alkyl ether phosphate were mixed at a solid content ratio of 95.0 mass% / 5.0 mass%, diluted to a concentration of 5.5%, and used as the paint for calendar coating in Production Example 1 above, 0.95 g / m 2 Coated to obtain a chip-type electronic component storage backing paper.

[0032] <Example 4> Completely saponified ethylene-modified PVA resin "RS-2117" (saponification degree 97.5-99 mol%, degree of polymerization 1700) manufactured by Kuraray Co., Ltd. and antistatic agent "Electro Stripper F" manufactured by Kao Corporation as potassium salt of polyoxyethylene alkyl ether phosphate were mixed at a solid content ratio of 95.0 mass% / 5.0 mass%, diluted to a concentration of 6.0%, and used as the paint for calendar coating in Production Example 1 above, 1.05 g / m2 It was applied to obtain a chip-type electronic component storage backing sheet.

[0033] <Comparative Example 1> Completely saponified PVA resin "PVA-117" (saponification degree: 98 - 99 mol%, polymerization degree: 1700) manufactured by Kuraray Co., Ltd. was diluted to a concentration of 2.0% and used as the coating material for calendar coating in Production Example 1 above, with 0.24 g / m 2 It was applied to obtain a chip-type electronic component storage backing sheet.

[0034] <Comparative Example 2> Completely saponified PVA resin "PVA-117" (saponification degree: 98 - 99 mol%, polymerization degree: 1700) manufactured by Kuraray Co., Ltd. and potassium salt of polyoxyethylene alkyl ether phosphate "Electro Stripper F" manufactured by Kao Corporation as an antistatic agent were mixed at a solid content ratio of 90.0 mass% / 10.0 mass%, diluted to a concentration of 4.0%, and used as the coating material for calendar coating in Production Example 1 above, with 0.63 g / m 2 It was applied to obtain a chip-type electronic component storage backing sheet.

[0035] <Comparative Example 3> Completely saponified ethylene-modified PVA resin "RS-2117" (saponification degree: 97.5 - 99 mol%, polymerization degree: 1700) manufactured by Kuraray Co., Ltd. was diluted to a concentration of 2.2% and used as the coating material for calendar coating in Production Example 1 above, with 0.27 g / m 2 It was applied to obtain a chip-type electronic component storage backing sheet.

[0036] <Comparative Example 4> Completely saponified ethylene-modified PVA resin "RS-2117" (saponification degree: 97.5 - 99 mol%, polymerization degree: 1700) manufactured by Kuraray Co., Ltd. and potassium salt of polyoxyethylene alkyl ether phosphate "Electro Stripper F" manufactured by Kao Corporation as an antistatic agent were mixed at a solid content ratio of 90.0 mass% / 10.0 mass%, diluted to a concentration of 4.3%, and used as the coating material for calendar coating in the above Production Example, with 0.72 g / m 2 It was applied to obtain a chip-type electronic component storage backing sheet.

[0037] (Test Method) (Average value and variation range test of peel strength) As the top cover tape, the top tape for paper carrier "Chip Cover Tape MF" (5 mm width) manufactured by Nippon Matai Co., Ltd. was prepared. For the chip-type electronic component storage base papers obtained in Examples 1 to 4 and Comparative Examples 1 to 4, three samples were cut out in the MD direction with a length of 10 cm and in the CD direction with a width of 2 cm. Using a heat seal tester TP-701-B manufactured by Tester Sangyo Co., Ltd., the top cover tape was heat-sealed using a spatula tip with a width of 0.5 mm. The heat-sealing conditions were an upper spatula temperature of 140°C, a pressure of 2.4 MPa, and an adhesion time of 0.2 seconds. After heat-sealing, the temperature and humidity were adjusted to 23°C and 50% RH. The heat adhesion of the same top cover tape was further performed on three samples for each example. As an acceleration of the change over time, the samples were treated in a thermo-hygrostat at 45°C and 90% RH for 3 days, taken out, and the temperature and humidity were adjusted to 23°C and 50% RH. For the three samples in the temperature and humidity adjustment state of each example prepared as above and the three samples after the accelerated change over time treatment, a 180-degree peel test was performed at a tensile speed of 300 mm / min using a tensilon universal material testing machine RTC-1210A manufactured by Orientec Co., Ltd. Excluding the vicinity of the start of peeling and the vicinity of the end of peeling from the obtained tensile strength data series, the data for a peeling distance of 5 cm was adopted as the peel strength data series. This data series was averaged to obtain the average value of the peel strength, and the difference between the maximum value and the minimum value of the peel strength within the interval was defined as the variation range of the peel strength. The above was performed for three samples for each example and each condition, and the average of the obtained values was taken. The obtained average value and variation range of the peel strength are shown in Table 1.

[0038] (Peel keva test) For the chip-type electronic component storage base papers obtained in Examples 1 to 4 and Comparative Examples 1 to 4, three samples were cut out in the MD direction with a length of 10 cm and in the CD direction with a width of 2 cm in the same manner as in the previous section, and the top cover tape was heat-sealed over the entire width. The heat-sealing conditions were an upper spatula temperature of 140°C, a pressure of 0.4 MPa, and an adhesion time of 1 second. After heat-sealing, the temperature and humidity were adjusted to 23°C and 50% RH. Perform the heat adhesion of the same top cover tape for each of the three samples in each example, subject them to a 3-day treatment in a constant temperature and humidity chamber at 45°C and 90% RH to accelerate the change over time, take them out, and condition the temperature and humidity at 23°C and 50% RH. For the three samples in the temperature and humidity conditioning state and the three samples after the accelerated change over time treatment for each example created as described above, perform a 180° peel test at a peel rate of 300 mm / min in the same manner as in the previous section. Excluding the vicinity of the start of peeling and the vicinity of the end of peeling, count the number of Kevas with a major axis of 2 mm or more taken from the tape side from the peeling mark for a peeling distance of 5 cm. The above was performed for three samples for each example and each condition, and the average of the obtained numbers was taken. However, when there are 10 or more Kevas per piece, or when peeling is continuous and difficult to count as a number, it was regarded as "many". The peel Kev test is shown in Table 1.

[0039] (Evaluation Criteria) Evaluate based on the following criteria from the obtained data. (1) 180° Peel Strength, Average Peel Strength Value If the 180° peel strength between the top cover tape heat-sealed under the conditions of the above test and the chip-type electronic component storage mount is 8.0 N / 0.5 mm or more and 13 N / 0.5 mm or less under any conditions, it can be said to be excellent as a chip-type electronic component storage mount. For comparison of samples, the coating amount was selected so that the 180° peel strength in the temperature and humidity conditioning state is 11.5 N / 0.5 mm or more and less than 12.5 N / 0.5 mm.

[0040] (2) Peel Strength Variation Range If the value is less than 10.0 N / 0.5 mm under any conditions, it can be said to be excellent as a chip-type electronic component storage mount.

[0041] (3) Peel Kevas If the number is less than 1.0 piece / strand under any conditions, it can be said to be excellent as a chip-type electronic component storage mount.

[0042] (4) Average Peel Strength Value, Value after Accelerated Change over Time Treatment / Value before Accelerated Change over Time Treatment If the value of the average peel strength after the aging acceleration treatment / the average peel strength before the aging acceleration treatment is in the range of 1.0 ± 0.25, it can be said that it is excellent as a chip-type electronic component storage mount.

[0043] (5) Peel strength variation range Value after aging acceleration treatment / Value before aging acceleration treatment If the value of the peel strength variation range after the aging acceleration treatment / the peel strength variation range before the aging acceleration treatment is in the range of 1.0 ± 0.25, it can be said that it is excellent as a chip-type electronic component storage mount.

[0044] [Table 1] (Evaluation results of examples) In Examples 1, 2, 3, and 4, by adding polyvinyl alcohol resin and polyoxyethylene alkyl ether phosphate salt to the coating layer in appropriate blending ratios, it was shown that excellent chip-type electronic component storage mounts with good peel strength, and the average value, variation range, and change over time of the peel strength were suppressed were obtained.

[0045] (Evaluation results of comparative examples) For the chip-type electronic component storage mounts obtained in Comparative Examples 1 and 3 where polyoxyethylene alkyl ether phosphate salt was not added, the change ratio of the average peel strength before and after the aging acceleration test was large, and the average peel strength after the aging acceleration treatment exceeded the appropriate range. There were many frays even before the aging acceleration test, and a large number of frays occurred after the aging acceleration test.

[0046] For the chip-type electronic component storage mounts obtained in Comparative Examples 2 and 4 where polyoxyethylene alkyl ether phosphate salt was added in excess, many frays occurred after the aging acceleration treatment. For the chip-type electronic component storage mount obtained in Comparative Example 4, the average peel strength after the aging acceleration treatment exceeded the appropriate range. From the above, Comparative Examples 1, 2, 3, and 4 were inferior in performance as chip-type electronic component storage mounts.

[0047] The chip-type electronic component storage backing sheet of the present invention has an average value of the peel strength from the thermally fused top cover sheet within an appropriate range, a small variation range of the peel strength, and the change over time of these values is suppressed, and it is an excellent chip-type electronic component storage backing sheet without the occurrence of keba during peeling.

Claims

1. A chip-type electronic component storage paper sheet having a coating layer on at least a part of at least one surface of a paper substrate, wherein the coating layer contains a polyvinyl alcohol resin and a polyoxyethylene alkyl ether phosphate salt, and the ratio of the polyvinyl alcohol resin to the polyoxyethylene alkyl ether phosphate salt in the coating layer is 91:9 to 99.8:0.

2.

2. The coating amount of the coating layer is 0.1 to 3 g / m ２ The chip-type electronic component storage mount according to claim 1, wherein the coating amount is as described above.

3. The chip-type electronic component storage paper sheet according to claim 1 or 2, wherein the polyvinyl alcohol resin is an ethylene-modified polyvinyl alcohol resin.

4. A chip-type electronic component storage tape using the chip-type electronic component storage paper sheet according to any one of claims 1 to 3.