Multiplexer and array antenna module

Abstract

To provide a multiplexer advantageous for signal conduction wiring of an array antenna module, and an array antenna module.SOLUTION: A multiplexer 40 includes one first end 41, at least two second ends 42, a conductive portion 44, and a conductive portion 45. The at least two second ends 42 and the first end 41 are arranged on a same layer of a circuit board. A connecting portion 43 included in the multiplexer 40 is connected between the first end 41 and the at least two second ends 42, the first end 41 and the at least two second ends 42 are arranged on both sides of the connecting portion 43, respectively, and the connecting portion 43, and the first end 41 and the at least two second ends 42 are arranged on a different layer of the circuit board. The connecting portion 43 is connected to the first end 41 and the at least two second ends 42, respectively, through the conductive portion 44 and the conductive portion 45. One of the first end 41 and the at least two second ends 42 is connected to the array antenna for conducting signals of the array antenna.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and more particularly, to a multiplexer and an array antenna module.

Background Art

[0002] A low-orbit satellite system (LEO) is a large satellite system composed of multiple satellites capable of real-time information processing. Low-orbit satellites are also used for communication of mobile terminals such as mobile phones. Because of the low orbit height, mobile terminals adopting low-orbit satellite communication have the advantages of short transmission delay and low path loss. A mobile communication system composed of multiple low-orbit satellites can achieve true global coverage and is more effective in frequency multiplexing. Technologies such as cellular communication, multi-connection, spot beam, and frequency multiplexing also provide technical guarantees for the application of low-orbit satellites in mobile communication. In short, low-orbit satellites are mobile communication systems that are currently highly evaluated.

[0003] However, the array antenna module applied to conventional low-orbit satellites has a reduced overall area of antenna design, a short wiring distance between the transmitting antenna and the receiving antenna, and difficult signal transmission wiring between antennas, and much consideration is required for the design of the array antenna.

Summary of the Invention

[0004] The present invention has been made in view of the above, and provides a multiplexer and an array antenna module.

[0005] The first aspect of the present application provides a multiplexer applicable to an array antenna module including a circuit board and an array antenna. The multiplexer includes one first terminal, at least two second terminals, and a plurality of conductive parts. The at least two second terminals and the first terminal are provided on the same layer of the circuit board. The multiplexer further includes a connection part, and the connection part is connected between the first terminal and the at least two second terminals. The first terminal and the at least two second terminals are respectively provided on both sides of the connection part. The connection part, the first terminal, and the at least two second terminals are provided on different layers of the circuit board. The connection part is respectively connected to the first terminal and the at least two second terminals through the plurality of conductive parts. One of the first terminal or at least two second terminals is connected to the array antenna to transmit the signal of the array antenna.

[0006] The second aspect of the present application provides an array antenna module including a circuit board, an array antenna, and a plurality of the above multiplexers. The array antenna is arranged in a predetermined arrangement on the surface layer of the circuit board, and the plurality of multiplexers and the array antenna are distributed and arranged on different layers of the circuit board.

[0007] The multiplexer provided by the present application is connected to the array antenna through one of the first terminal or at least two second terminals, and the multiplexer can transmit the signal of the array antenna. The connection part, the first terminal, and the at least two second terminals are provided on different layers on the circuit board, which saves the design space on the plane of the multiplexer without placing the multiplexer flat on the same plane, and is advantageous for the signal transmission wiring of the array antenna module.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present invention will be further described with reference to the drawings.

[0010] Hereinafter, with reference to the drawings of the embodiments of the present invention, the technical aspects in the embodiments of the present invention will be clarified and fully described. However, it is clear that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

[0011] When an element is referred to as being "electrically connected" to another element, it may be directly present in the other element or may be connected to the other element via other elements. When components are considered to be "electrically connected", it can be a contact connection, for example, a wire connection, or a non-contact connection, for example, a non-contact coupling.

[0012] All technical terms and scientific terms used in this specification have the same meaning as generally understood by those skilled in the technical field to which the present invention belongs, unless specifically defined otherwise. The terms used in the specification of the present invention are for specifically explaining the embodiments and do not limit the present invention.

[0013] Hereinafter, some embodiments of the present application will be described in detail with reference to the above drawings. If there is no conflict, the following examples and the features in the examples can be combined with each other.

[0014] A low-orbit satellite system (LEO) is a large satellite system composed of multiple satellites capable of real-time information processing. Low-orbit satellites are also used for the communication of mobile terminals such as mobile phones. Because of the low orbital altitude, mobile terminals adopting low-orbit satellite communication have the advantages of short transmission delay and low path loss. A mobile communication system composed of multiple low-orbit satellites can achieve true global coverage and more effective frequency multiplexing. Technologies such as cellular communication, multi-connection, spot beam, and frequency multiplexing also provide technical guarantees for the application of low-orbit satellites in mobile communication. In short, low-orbit satellites are mobile communication systems that are currently highly evaluated.

[0015] However, the array antenna module applied to conventional low-orbit satellites reduces the overall area of antenna design, has a short wiring distance between the transmitting antenna and the receiving antenna, makes it difficult for signal transmission wiring between antennas, and requires a lot of consideration in the design of the array antenna.

[0016] Therefore, referring to FIG. 1, the present application provides an array antenna module 1 applicable to a wireless communication device (not shown), and can realize wireless communication of the wireless communication device by a low-orbit satellite. Among them, the array antenna module 1 is for transmitting or receiving a wireless signal for performing wireless communication.

[0017] Referring to FIG. 1, in some embodiments of the present application, the array antenna module 1 includes an array antenna 10, a low noise amplifier (LNA) 20, a beamforming module 30, a multiplexer 40, and a circuit board 50.

[0018] The circuit board 50 may have a multilayer circuit board structure. The array antenna 10, the LNA 20, the beamforming module 30, and the multiplexer 40 are sequentially electrically connected and provided on the circuit board 50. In some embodiments, the array antenna 10, the LNA 20, the beamforming module 30, and the multiplexer 40 may be provided on different layers of the circuit board 50.

[0019] The array antenna 10 can be used for receiving and transmitting wireless communication signals. The LNA 20 acquires a wireless communication signal from the array antenna 10, amplifies it, and outputs it to the beamforming module 30, or acquires a wireless communication signal from the beamforming module 30, amplifies it, and outputs it to the array antenna 10. The beamforming module 30 acquires a wireless communication signal from the array antenna 10 via the LNA 20 and performs analysis, or compiles the wireless communication signal and transmits it to the array antenna 10 via the LNA 20. The multiplexer 40 outputs the wireless communication signal received from the array antenna 10 analyzed by the beamforming module 30, or compiles the input wireless communication signal by the beamforming module 30 and transmits it via the array antenna 10.

[0020] Referring to FIG. 2, the multiplexer 40 includes a first end 41, at least two second ends 42, a connection portion 43, a first conduction portion 44, and a second conduction portion 45.

[0021] One of the first terminal 41 or at least two second terminals 42 is connected to the array antenna 10 via the beamforming module 30 and the LNA 20 in sequence, and transmits the wireless communication signal of the array antenna 10. In some embodiments, the first terminal 41 and the at least two second terminals 42 together form a substantially linear metal segment structure, and may be provided substantially parallel or non-parallel. The first terminal 41 and the at least two second terminals 42 may be provided flush, and are provided on the same layer of the circuit board 50, for example, the third layer. In some embodiments, the at least two second terminals 42 may have a symmetric or asymmetric structure. For example, the second terminal 42 is arranged symmetrically or asymmetrically with respect to the first terminal 41. When the at least two second terminals 42 are provided in parallel or symmetrically, the at least two second terminals 42 can have substantially the same signal transmission path, and can have a better signal transmission effect.

[0022] In some embodiments, when at least two second terminals 42 are connected to the array antenna 10 via the beamforming module 30 and the LNA 20 in sequence, the multiplexer 40 is a power combiner, and receives the wireless communication signal of the array antenna 10 via the at least two second terminals 42, and can output a combined signal via the first terminal 41. Alternatively, when the first terminal 41 is connected to the array antenna 10 via the beamforming module 30 and the LNA 20 in sequence, the multiplexer 40 may be a power divider, receives the wireless communication signal via the first terminal 41, and outputs distribution signals respectively via the at least two second terminals 42.

[0023] The connection part 43 is connected between the first end 41 and at least two second ends 42, and the first end 41 and at least two second ends 42 are respectively provided on opposite sides of the connection part 43. The connection part 43 may include a first connection segment 432 and a second connection segment 434. In some embodiments, the first connection segment 432 is a substantially linear metal segment, and the second connection segment 434 is a substantially rectangular ring-shaped metal segment structure. One end of the first connection segment 432 is connected to the first end 41, and the other end of the first connection segment 432 is connected to a substantially middle position of one long side of the second connection segment 434. The other long side of the second connection segment 434 may be respectively connected corresponding to at least two second ends 42. In some embodiments, the connection part 43 may not be flush with the first end 41 and at least two second ends 42, and may be provided on different layers of the circuit board 50. For example, the connection part 43 may be provided on the second layer of the circuit board 50. In some embodiments, the connection part 43 is provided on the second layer of the circuit board 50, and wiring can be easily performed with other multiplexers 40. In some embodiments, the second connection part 434 has other symmetric regular shapes such as circular, elliptical, rectangular, etc., and the second connection part 434 may have a symmetric structure with respect to the first connection segment 432.

[0024] In some embodiments, the first end 41 and at least two second ends 42 have a first resistance value, the connection part 43 has a second resistance value, and the first resistance value may be less than or equal to the second resistance value. The first resistance value may be 50 ohms (ohm, Ω), and the second resistance value may be 70.7 ohms, but not limited thereto. In some embodiments, one signal transmission path at the first end 41 is divided into two signal transmission paths at at least two second ends 42. In order to equalize the energy, the connection part 43 connecting the first end 41 and at least two second ends 42 satisfies the following formula.

[0025]

Number

[0026] Here, Z 0 is the first resistance value of the first terminal 41 and at least two second terminals 42, where Z 0 = 50 ohms, and Z is the second resistance value of the connection part 43, and through calculation, Z = 70.7 ohms. Since the first terminal 41 and at least two second terminals 42 are provided with the same predetermined resistance value, and the connection part 43 is set with a different predetermined resistance value, the energy transmitted by the first terminal 41, the connection part 43, and at least two second terminals 42 becomes substantially equal, and the loss of transmission is reduced. The first connection segment 432 is used to convert from the first resistance value of the first terminal 41 to the second resistance value of the connection part 43, or from the second resistance value of the connection part 43 to the first resistance value of the first terminal 41 during energy transmission. In some embodiments, according to the arrangement of the circuit board 50, the connection part 43, the first terminal 41, and at least two second terminals 42 may have different line widths from each other, or the connection part 43, the first terminal 41, and at least two second terminals 42 may have substantially equal signal transmission powers from each other.

[0027] The first conduction part 44 is connected between the first terminal 41 and the connection part 43, and connects the layer or plane where the first terminal 41 is located and the layer or plane where the connection part 43 is located. That is, the first conduction part 44 connects the second layer and the third layer of the circuit board 50. In some embodiments, the first conduction part 44 may be a metal post, one end of the metal post is connected to the first terminal 41, and the other end of the metal post is connected to the first connection segment 432. The first conduction part 44 is not limited to a metal post.

[0028] The second conduction part 45 is connected between at least two second ends 42 and the connection part 43, and connects the layer or plane where at least two second ends 42 are located and the layer or plane where the connection part 43 is located, that is, connects the second layer and the third layer of the circuit board 50. In some embodiments, the second conduction part 45 is two metal posts. One end of each of the two metal posts is connected to at least two second ends 42 respectively, and the other ends of the two metal posts are connected to one end of the second connection segment 434 away from the first connection segment 432. The second conduction part 45 is not limited to two metal posts. In some embodiments, the extension line of the first connection segment 432 is substantially perpendicular to the connection line of the two second conduction parts 45 (that is, the two metal posts).

[0029] In some embodiments, each of at least two second ends 42 includes a connection point 422 connected to the second conduction part 45, and the second end 42 is formed by the connection point 422 extending outward from the second conduction part 45. In some embodiments, the angle θ formed by the direction in which the second end 42 extends outward from the connection point 422 and the direction perpendicular to the second connection part 434 is in the range of 0 degree to 90 degrees, but not limited thereto.

[0030] Referring to FIG. 2, in some embodiments, the signal transmission direction of the first terminal 41 is substantially the same as the signal transmission directions of at least two second terminals 42. In some embodiments, the vector difference between the signal transmission direction of the first terminal 41 and the signal transmission directions of at least two second terminals 42 may be from 0 degrees to 90 degrees. Exemplarily, the signal transmission direction of the first terminal 41 is directed towards the first conduction portion 44, and the first conduction portion 44 transmits a signal to the first connection section 432. The signal transmission direction of the first connection segment 432 is from the first conduction portion 44 towards the second connection segment 434, but the signal transmission direction of the first terminal 41 coincides with the signal transmission direction of the first connection segment 432. Define the signal transmission direction between the first terminal 41 and the first connection segment 432 as the first vector. The second connection segment 434 acquires a signal from the first connection segment 432 and transmits it to the second conduction portion 45. At least two second terminals 42 are respectively connected to two second conduction portions 45 via connection points 422, serving as the endpoints of the signal transmission of at least two second terminals 42. The structure along at least two second terminals 42 becomes the signal transmission path at at least two terminals 42. When defining the signal transmission direction of at least two second terminals 42 as the second vector, the vector difference between the first vector and the second vector may be from 0 degrees to 90 degrees. Note that when at least two second terminals 42 are signal input terminals, the first terminal 41 may be a signal output terminal, and the signal transmission path may be as described above, but the signal transmission direction is reversed, and the description will not be repeated here.

[0031] Referring to FIG. 3, the multiplexer 40 may include a resistor 46. The resistor 46 may be in contact with the connection portion 43 via the second conduction portion 45. In some embodiments, the resistor 46, the first terminal 41, at least two second terminals 42, and the connection portion 43 may all be on different surfaces and may be provided on the first layer of the circuit board 50. In some embodiments, the second conduction portion 45 can be connected to each of the resistor 46, the second connection segment 434 of the connection portion 43, and at least two second terminals 42, that is, the second conduction portion 45 can be connected to the first layer, the second layer, and the third layer of the circuit board 50.

[0032] In some embodiments, the array antenna 10 may be provided on another layer of the circuit board 50, and may not be flush with the layer where the first end 41 and at least two second ends 42 are located, and the layer where the connection portion 43 is located. For example, it may be provided on the fifth layer of the circuit board 50. In some embodiments, the fifth layer where the array antenna 10 is located may be the surface layer of the array antenna module 1, and the first layer where the resistor 46 is located may be the inner layer of the array antenna module 1. In some other embodiments, the first layer where the resistor 46 is provided may be the surface layer of the array antenna module 1, and the fifth layer where the array antenna 10 is located may be the inner layer of the array antenna module 1.

[0033] In some embodiments, the array antenna module 1 may further include a first ground layer 60, a second ground layer 70, and a third ground layer 80.

[0034] The first ground layer 60 is provided on the first layer of the circuit board 50 and may be disposed close to the resistor 46. The second ground layer 70 is provided on the second layer of the circuit board 50 and may be provided close to the connection portion 43. The third ground layer 80 is provided on the fourth layer of the circuit board 50 and may be located between the layer where the array antenna 10 is located and the layer where the first end 41 and at least two second ends 42 are located. The first ground layer 60, the second ground layer 70, and the third ground layer 80 may be used for ground supply of the array antenna 10 and the multiplexer 30. The second ground layer 70 and the third ground layer 80 may serve as a reference for the first end 41 and at least two second ends 42, and the third ground layer 80 may also serve as a reference for the connection portion 43. In some embodiments, an opening 62 corresponding to the connection portion 43 is formed in the first ground layer 60 so that the routing width on the circuit board 50 becomes wider, reducing the loss of energy transmission when the connection portion 43 transmits a signal.

[0035] In some embodiments, a first through hole penetrating the second layer to the third layer is opened in the circuit board 50, and the first through hole is filled with a metal conductor to form a first conduction part 44. The first conduction part 44 penetrates from the second layer to the third layer of the circuit board 50 so as to connect the connection part 43 located in the second layer and the first end 41 located in the third layer respectively, and realizes the electrical connection and signal transmission between the connection part 43 and the first end 41. A second through hole penetrating the first layer to the third layer is opened in the circuit board 50, and the second through hole is filled with a metal conductor to form a second conduction part 45. The second conduction part 45 penetrates from the first layer to the third layer of the circuit board 50 and connects the resistor 46 located in the first layer, the connection part 43 located in the second layer, and at least two second ends 42 located in the third layer respectively, and realizes the electrical connection and signal transmission between the resistor 46, the connection part 43 and the at least two second ends 42. The first layer to the fifth layer of the circuit board 50 are spaced apart from each other and arranged in parallel.

[0036] Referring to FIGS. 4 and 5, the array antenna 10 may include a plurality of antennas 12.

[0037] The plurality of antennas 12 are arranged in a matrix, and in each row, the distance between two adjacent antennas 12 is provided at a predetermined distance interval. The adjacent antennas 12 are arranged offset every two rows, and an array arrangement, that is, the array antenna 10 is formed. As an example, in the (N + 1)-th row, each antenna 12 is arranged offset between two adjacent antennas 12 in the N-th row. Here, N is a positive integer of 1 or more.

[0038] The multiplexer 40 is provided with a positional shift between the antennas 12. In some embodiments, the array antenna module 1 has a plurality of multiplexers 40 to which two antennas 12 are respectively connected by the beamforming module 30 and the LNA 20. For example, each multiplexer 40 may have two antennas 12 respectively connected via at least two second terminals 42. When the array antenna 10 has a predetermined array arrangement, one multiplexer 40 is connected for every two antennas 12. The multiplexer 40 inputs the wireless communication signals of the two antennas 12 via at least two second terminals 42 and outputs a single set of signals via the first terminal 41. The plurality of multiplexers 40 connected to the antennas 12 are connected in parallel and located at the same stage. After these multiplexers 40 output a single set of signals, they are output again to at least two second terminals 42 of the multiplexers 40 in the next stage, and the first terminals 41 of the multiplexers 40 in the next stage output a single set of signals again. In this way, they are connected in series by multiple stages of multiplexers 40, and finally a single set of signals is output from the multiplexer 40 in the final stage. In the signal transmission of the multiple stages of multiplexers 40, the multiplexers 40 located at the same stage are connected in parallel, and the multiplexers 40 in different stages are connected in series. Note that in some cases, "one" or "a plurality" is meant.

[0039] As an example, in a 4×4 array antenna, four antennas 12 are arranged in each row, and a total of 16 antennas 12 are arranged. One multiplexer 40 is connected to every two antennas 12, and eight multiplexers 40 are connected to the 16 antennas 12. The eight multiplexers 40 are located in the first stage. The eight multiplexers 40 can transmit the wireless communication signals of the 16 antennas 12 into eight signals for output. When these eight signals are connected to one multiplexer 40 for every two signals, the eight signals are further connected to four multiplexers 40, and the four multiplexers 40 are located in the second stage. The four multiplexers 40 transmit and output the eight signals from the previous stage into four signals. When the four signals are connected to one multiplexer 40 for every two signals, the four signals are further connected to two multiplexers 40, and the two multiplexers 40 are located in the third stage. The two multiplexers 40 transmit and output the four signals from the previous stage into two signals. These two signals are further connected to one multiplexer 40, and this multiplexer 40 is located in the fourth stage and can transmit the signals from the previous stage to finally output one signal. The array antenna module 1 finally outputs the signal output by the multiplexer 40 to other modules and components of the wireless communication device to realize the wireless communication of the wireless communication device.

[0040] Referring to FIGS. 6 and 7, FIG. 6 shows a graph of S-parameters when the first end 41 of the multiplexer 40 and at least two second ends 42 are provided on the same layer, i.e., the third layer, of the circuit board 50, and the connection portion 43 is provided on another layer, i.e., the second layer, of the circuit board 50. In this case, the overall loss of the multiplexer 40 is from about 3.34 decibels (dB) to 3.41 decibels (dB). FIG. 7 shows a graph of S-parameters when the first end 41 of the multiplexer 40, at least two second ends 42, and the connection portion 43 are provided on the same layer, e.g., the third layer, of the circuit board 50. In this case, the overall loss of the multiplexer 40 is from about 4.91 decibels (dB) to 5.18 decibels (dB). As described above, the loss is relatively larger in the inner layer. Compared with the two types of installations in FIGS. 6 and 7, the first end 41, at least two second ends 42, and the connection portion 43 of the multiplexer 40 according to the embodiment of the present application are provided on different layers of the circuit board 50 (in particular, the connection portion 43 is provided on the outermost side of the circuit board 50). Compared with the configuration in which the first end 41, at least two second ends 42, and the connection portion 43 of the multiplexer 40 are provided on the same layer of the circuit board 50, the multiplexer 40 of the embodiment of the present application has a lower signal transmission loss, which is more advantageous for the multiplexer 40 to be used for signal transmission of the array antenna 10.

[0041] The multiplexer 40 provided by the present application is connected to the array antenna through one of the first end 41 or at least two second ends 42, and the multiplexer 40 can transmit the signal of the array antenna 10. The connection portion 43, the first end 41, and at least two second ends 42 are provided on different layers on the circuit board 50, saving the design space on the plane of the multiplexer 40 without placing the multiplexer 40 flat on the same plane, which is advantageous for the signal transmission wiring of the array antenna module 1. The multiplexer 40 has a low loss during signal transmission, which is more advantageous for the multiplexer 40 to be used for signal transmission of the array antenna 10.

[0042] Each of the above embodiments is merely for explaining the technical solution of the present invention and is not intended to be limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the present invention. Those skilled in the art can make other changes, etc. within the spirit of the present invention in the design of the present invention as long as the technical effects of the present invention are not deviated from. These changes based on the spirit of the present invention are included within the scope of the claims of the present invention. Explanation of reference numerals

[0043] 1... Array antenna module, 10... Array antenna, 12... Antenna, 20... LNA, 30... Beamforming module, 40... Multiplexer, 41... First end, 42... Second end, 422... Connection point, 43... Connection part, 432... First connection segment, 434... Second connection segment, 44... First conduction part, 45... Second conduction part, 46... Resistor, 50... Circuit board, 60... First ground layer, 62... Opening, 70... Second ground layer, 80... Third ground layer.

Claims

1. A multiplexer applied to an array antenna module including a circuit board and an array antenna, The multiplexer includes a first end, at least two second ends, a connection portion, and a plurality of conductive portions; the at least two second ends and the first end are provided on the same layer of a circuit board; the connection portion is connected between the first end and the at least two second ends, the first end and the at least two second ends are provided on opposite sides of the connection portion, and the connection portion, the first end, and the at least two second ends are provided on different layers of the circuit board; the connection portion is connected to the first end and the at least two second ends via the plurality of conductive portions, A multiplexer, wherein one of the first end or the at least two second ends is connected to the array antenna to transmit a signal of the array antenna.

2. 2. The multiplexer according to claim 1, further comprising a resistor connected to the connection portion via the plurality of conductive portions.

3. 3. The multiplexer according to claim 2, wherein the resistor, the connection portion, the first end, and the at least two second ends are sequentially arranged on different layers of the circuit board, and the resistor is arranged on one surface layer of the circuit board.

4. When the at least two second ends are connected to the array antenna, the multiplexer is a power combiner that receives signals of the array antenna via the at least two second ends and outputs a combined signal via the first end; or 2. The multiplexer of claim 1, wherein when the first end is connected to the array antenna, the multiplexer is a power divider that receives a signal through the first end and outputs a divided signal through the at least two second ends, respectively.

5. 2. The multiplexer of claim 1, wherein the first end and the at least two second ends have the same first resistance value, and the connection portion has a second resistance value smaller than the first resistance value.

6. 1. An array antenna module, comprising: A circuit board; an array antenna arranged in a predetermined arrangement on a surface layer of the circuit board; and a plurality of multiplexers according to any one of claims 1 to 5, An array antenna module, characterized in that the multiple multiplexers and the array antenna are distributed and arranged on different layers of the circuit board.

7. 7. The array antenna module according to claim 6, wherein the multiplexers located at the same stage among the plurality of multiplexers are connected in parallel.

8. The array antenna includes a plurality of antennas arranged in a matrix, In each row, two adjacent antennas are spaced apart by a predetermined distance, and adjacent antennas are shifted every two rows to form an array; 7. The array antenna module according to claim 6, wherein the multiplexer is offset between the antennas.

9. 7. The array antenna module according to claim 6, wherein when the multiplexer further includes a resistor, the resistor and the array antenna are distributed and disposed on two opposing surfaces of the circuit board.

10. The array antenna module of claim 6, further comprising a ground layer provided between a layer on which the first end and the at least two second ends are located and a layer on which the array antenna is located.

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