Cutting device and inspection device

Abstract

To provide a cutting device having an inspection function capable of confirming a result of an inspection item that an operator wants to check for a short time.SOLUTION: A cutting device is constructed by containing: a chuck table 24 holding a wafer 10; cutting means 120 for executing a cutting processing to the wafer 10 to be held by the chuck table 24; feeding means 7 for relatively processing and feeding the chuck table 24 and the cutting means 120; imaging means 11 for imaging the wafer 10 to be held by the chuck table 24; a monitor 15 that displays an image to be imaged by the imaging means 11; and control means 100. The control means 100 comprises a function for inspecting a state of a processing by imaging the wafer by the imaging means 11 by a plurality of items. The plurality of items which has to be inspected is displayed onto the monitor 15, and a function corresponding to the item to be selected is only operated by selecting the item to be required.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a cutting device for cutting a wafer and an inspection device for imaging a processed wafer to inspect the processing state.

Background Art

[0002] A wafer on which a plurality of devices such as ICs and LSIs are partitioned by a dicing line and formed on the surface is diced into individual device chips by a cutting device and used in electrical devices such as mobile phones and personal computers.

[0003] The cutting device includes a chuck table for holding a wafer, a cutting means rotatably provided with a cutting blade for cutting a dicing line of the wafer held on the chuck table, a Y-axis feed means for relatively feeding the chuck table and the cutting means in a Y-axis direction orthogonal to the X-axis direction, an imaging means for imaging the wafer held on the chuck table and detecting an area to be cut, and a monitor for displaying an image captured by the imaging means, and is configured to be able to divide the wafer into individual device chips with high precision (see, for example, Patent Document 1).

[0004] Further, in the cutting device described in Patent Document 1 above, if there is wear or chipping of the cutting blade, etc., the dicing accuracy decreases and the quality of the device chip deteriorates. Therefore, after cutting the dicing line of the wafer, the cutting groove is imaged by the imaging means, and the width of the cutting groove, chipping (chipping) of the cutting groove, meandering of the cutting groove, the quality of the interval between the cutting grooves, etc. are judged.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] When conducting an inspection on the cutting device described in the above Patent Document 1, after performing processes related to inspections of all pre-registered items such as the width of the cutting groove, chipping of the cutting groove, meandering of the cutting groove, and the interval between cutting grooves, the inspection items desired by the operator are displayed on the monitor. However, there was a problem that it took a relatively long time until the results of the inspection items desired by the operator were displayed on the monitor after the operator instructed the start of the inspection.

[0007] The present invention has been made in view of the above facts, and its main technical problem is to provide a cutting device having an inspection function that can confirm the results of inspection items desired by an operator in a short time, and an inspection device that can confirm the results of inspection items desired by an operator in a short time.

Means for Solving the Problem

[0008] In order to solve the above main technical problem, according to the present invention, there is provided a cutting device for cutting a wafer, including a chuck table for holding the wafer, a cutting means for performing cutting on the wafer held by the chuck table, a feeding means for relatively feeding the chuck table and the cutting means, an imaging means for imaging the wafer held by the chuck table, a monitor for displaying an image captured by the imaging means, and a control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. A plurality of items to be inspected are displayed on the monitor, and by selecting necessary items, only the function of inspecting corresponding to the selected items is activated.

[0009] The plurality of items in the cutting device preferably include at least two or more of the width of the cutting groove subjected to the cutting process, chipping generated on both sides of the cutting groove, meandering of the cutting groove, index interval of the cutting groove, and contamination of the chip surrounded by the cutting groove.

[0010] Also, in order to solve the above main technical problem, according to the present invention, there is provided an inspection apparatus for imaging a processed wafer to inspect the processing state, including a chuck table for holding the wafer, an imaging means for imaging the wafer held by the chuck table, a feeding means for relatively feeding the chuck table and the imaging means, a monitor for displaying an image captured by the imaging means, and a control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. A plurality of items to be inspected are displayed on the monitor, and by selecting necessary items, only the functions corresponding to the items are activated, thereby providing an inspection apparatus.

[0011] The plurality of items in the inspection apparatus preferably include at least two or more of the width of the cutting groove subjected to cutting, chipping generated on both sides of the cutting groove, meandering of the cutting groove, index interval of the cutting groove, and contamination of the chip surrounded by the cutting groove.

Advantages of the Invention

[0012] The cutting apparatus of the present invention is a cutting apparatus for cutting a wafer, including a chuck table for holding the wafer, a cutting means for performing cutting on the wafer held by the chuck table, a feeding means for relatively feeding the chuck table and the cutting means, an imaging means for imaging the wafer held by the chuck table, a monitor for displaying an image captured by the imaging means, and a control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. A plurality of items to be inspected are displayed on the monitor, and by selecting necessary items, only the functions corresponding to the selected items are activated. Thereby, since only the functions corresponding to the inspection items that the operator wants to confirm are activated, the operation time of the functions that do not need to be confirmed can be omitted, and the operator can confirm the inspection items required in a relatively short time.

[0013] Further, the inspection apparatus of the present invention is an inspection apparatus that images a processed wafer to inspect the processing state, and includes a chuck table that holds the wafer, an imaging means that images the wafer held by the chuck table, a feeding means that relatively feeds the chuck table and the imaging means, a monitor that displays an image captured by the imaging means, and a control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. A plurality of items to be inspected are displayed on the monitor, and by selecting a necessary item, only the function corresponding to the item operates. As a result, since only the function corresponding to the inspection item that the operator wants to confirm operates, the operation time of the functions that do not require confirmation can be omitted, and the operator can confirm the inspection items required in a relatively short time.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments related to a cutting apparatus having a function of imaging a processed wafer to inspect the processing state and an inspection apparatus that images a processed wafer to inspect the processing state will be described in detail with reference to the accompanying drawings.

[0016] FIG. 1 shows an overall perspective view of a cutting apparatus 1 having a function of imaging a processed wafer to inspect the processing state. Note that the actual cutting apparatus 1 includes, in addition to the configuration shown in FIG. 1, a housing that covers the entire apparatus including the cutting area, a wafer cassette for loading a plate-shaped wafer 10 to be processed by the cutting apparatus 1 into the cutting apparatus 1, conveying means, etc., which are omitted for convenience of explanation.

[0017] The illustrated cutting apparatus 1 includes, for example, a chuck table 24 that holds a silicon wafer 10, a cutting means 120 that performs cutting on the wafer 10 held by the chuck table 24, a feeding means 7 that relatively feeds the chuck table 24 and the cutting means 120, an imaging means 11 that images the wafer 10 held by the chuck table 24, a monitor 15 that displays an image captured by the imaging means 11, and a control means 100. Note that the wafer 10 in the present embodiment is formed on the surface 10a with a plurality of devices 12 partitioned by a dicing line 14 and is supported by an annular frame F via an adhesive tape T as shown in the figure (see also FIG. 2(a)).

[0018] The feeding means 7 of the present embodiment includes an X-axis feeding means 30 that relatively moves the chuck table 24 and the cutting means 120 and the imaging means 11 in the X-axis direction indicated by the arrow X in the figure, and a Y-axis feeding means 50 that relatively moves the chuck table 24 in the Y-axis direction indicated by the arrow Y in the figure, which is orthogonal to the X-axis direction, with respect to the cutting means 120 and the imaging means 11. Note that the Y-axis feeding means 50 in the cutting apparatus 1 of the present embodiment is mounted on a spindle support mechanism 8. The spindle support mechanism 8 supports a spindle unit 9 including a cutting means 120 that is orthogonal to the X-axis direction and the Y-axis direction and is movably disposed in the Z-axis direction (vertical direction) indicated by the arrow Z in the figure.

[0019] The holding means 20 including the chuck table 24 described above includes a rectangular X-axis direction moving base 21 movably supported on a pair of guide rails 2a, 2a arranged in parallel along the X-axis direction on the stationary base 2, a cylindrical support member 22 arranged on the X-axis direction moving base 21 with the chuck table 24 disposed on the upper part thereof, a rectangular cover plate 23 covering the periphery of the upper part of the cylindrical support member 22, and a clamp mechanism 26 disposed between the cylindrical support member 22 and the chuck table 24 for gripping a frame F that supports the wafer 10 when the wafer 10 is supported on the chuck table 24. Inside the cylindrical support member 22, a motor that functions as a rotating means for rotating the chuck table 24 in the plane defined by the X-axis and Y-axis is also incorporated (illustration is omitted). On the lower surface of the X-axis direction moving base 21, a pair of guide grooves 21a, 21a that slidably contact the guide rails 2a, 2a are formed, and a sliding portion is formed by the guide rails 2a, 2a and the guide grooves 21a, 21a.

[0020] The X-axis feed means 30 includes, for example, a drive source 31 composed of a pulse motor, and a ball screw 32 that converts the rotation of the drive source 31 into linear motion and transmits it to an internal thread portion (illustration omitted) formed on the lower surface of the X-axis direction moving base 21. By driving the ball screw 32 forward and backward by the drive source 31, the X-axis direction moving base 21 is moved in the X-axis direction along the guide rails 2a, 2a. The Y-axis feed means 50 includes, for example, a drive source 51 composed of a pulse motor, and a ball screw 52 that converts the rotation of the drive source 51 into linear motion and transmits it to an internal thread portion (illustration omitted) formed on the lower surface of the support portion 42 of the Y-axis direction moving base 40. By driving the ball screw 52 forward and backward by the drive source 51, the Y-axis direction moving base 40 is moved in the Y-axis direction along the guide rails 2c, 2c.

[0021] The spindle unit 9 is mounted on the vertical wall 43 of the Y-axis direction moving base 40, and includes a Z-axis direction moving base 121, a spindle housing 122 supported by the Z-axis direction moving base 121, and a cutting means 120 supported by the spindle housing 122 and having a rotation axis 122a in the Y-axis direction, and rotatably supporting a cutting blade 123 at the tip of the rotation axis 122a.

[0022] A spindle motor 125 for rotationally driving the rotation axis 122a is disposed on the rear end side of the spindle housing 122. The Z-axis direction moving base 121 is movably supported along a pair of guide rails 44, 44 disposed in the Z-axis direction (cutting feed direction) on the vertical wall 43 of the Y-axis direction moving base 40. The Y-axis direction moving base 40 is provided with a pair of guide grooves 121a (only one is shown in the figure) that slidably contact the guide rails 44, 44.

[0023] The Y-axis direction moving base 40 includes a drive source 124 composed of a pulse motor and a ball screw (not shown) that converts the rotation of the drive source 124 into a linear motion and transmits it to an internal thread portion (not shown) formed on the Z-axis direction moving base 121. The drive source 124 and the ball screw constitute a Z-axis feed means for cutting the cutting means 120 in the Z-axis direction, thereby moving the cutting means 120 and the imaging means 11 in the Z-axis direction. As shown in the figure, the imaging means 11 is integrally formed with the spindle housing 122, and the cutting blade 123 of the cutting means 120 is positioned in the X-axis direction at a predetermined position (usually the central position) of the area imaged by the imaging means 11.

[0024] The cutting device 1 is provided with control means 100. Connected to the control means 100 are the above-described imaging means 11, a spindle motor 125 disposed at the rear end of the spindle housing 122, a drive source 31 of the X-axis feed means 30, a drive source 51 of the Y-axis feed means 50, a drive source 124 constituting the Z-axis feed means, a monitor 15, and the above-described rotating means for rotating the chuck table 24 in the plane defined by the X-axis and Y-axis. The monitor 15 displays machining conditions and machining states and has a touch panel function. By touching the screen displayed on the monitor 15, an operator can issue a predetermined command to the control means 100.

[0025] The control means 100 is constituted by a computer and includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program and the like, a readable and writable random access memory (RAM) for temporarily storing the results calculated by the control means 100, image information captured by the imaging means 11, etc., an input interface, and an output interface (illustrations of details are omitted). Also, although not shown, position detection means is disposed on the X-axis direction movement base 21, the Y-axis direction movement base 40, the Z-axis direction movement base 121, and the rotating means for rotating the above-described chuck table 24. Based on a signal instructed from the control means 100, the above-described drive source 31, drive source 51, drive source 124, and the rotating means are controlled so that the rotational positions of the X-axis direction movement base 21, the Y-axis direction movement base 40, the Z-axis direction movement base 121, and the chuck table 24 are accurately controlled to desired positions.

[0026] The control means 100 includes a control program that images the processed wafer 10 by the imaging means 11 described above and implements a function of inspecting the processing state in a plurality of items based on the captured image. The inspection items provided in the control means 100 are, for example, as follows. According to the content of each inspection item, the X-axis feed means 30 and the Y-axis feed means 50 are operated, and the imaging means 11 is operated to image a predetermined position (XY coordinates) on the wafer 10 corresponding to each inspection item at a magnification corresponding to each inspection item, and each inspection is executed by a predetermined operation of an operator described later. Note that the inspection items shown below are examples, and the present invention is not limited to having the inspection items shown below. However, the inspection items provided in the control means 100 implemented based on the present invention are at least two or more. (1) The width of the cutting groove formed by performing cutting along the planned dividing line (2) The chipping shape of the cutting groove formed by performing cutting along the planned dividing line (3) The meandering state of the cutting groove formed along the planned dividing line (4) The index interval of the cutting grooves formed in adjacent planned dividing lines (5) The contamination state of the device chip

[0027] The cutting device 1 generally has the configuration as described above. An aspect of imaging the wafer 10 subjected to the processing implemented based on the present invention and inspecting the processing state will be described below.

[0028] In the cutting device 1 shown in FIG. 1, the wafer whose processing state is inspected is the wafer 10 subjected to cutting by the cutting device 1. First, the cutting of the unprocessed wafer 10 performed by the cutting device 1 will be described.

[0029] When performing cutting on the wafer 10, an unprocessed wafer 10 supported by a frame F via an adhesive tape T is carried out from a wafer cassette (not shown) by conveying means (not shown), conveyed to the chuck table 24 described above, placed on the holding surface, the frame F is held by a clamp 26, and at the same time, suction means (not shown) is operated to generate a negative pressure on the holding surface for suction holding.

[0030] Next, the X-axis feed means 30 is operated to position the chuck table 24 holding the wafer 10 below the imaging means 11 described above, and the surface 10a of the wafer 10 on which the device 12 is formed is imaged. Based on the image of the surface 10a of the imaged wafer 10, a predetermined division line 14 of the wafer 10 is aligned in the X-axis direction, and alignment with the cutting blade 123 described above is performed.

[0031] Next, as shown in Fig. 2(a), the cutting blade 123 rotated at high speed is positioned on the division line 14 aligned in the X-axis direction, cut into at a predetermined depth from the surface 10a side, and the chuck table 24 is fed in the X-axis direction for machining to form a cutting groove 16. Further, the cutting blade 123 of the cutting means 120 is indexed and fed onto the division line 14 adjacent in the Y-axis direction to the division line 14 where the cutting groove 16 is formed and on which the cutting groove 16 is not formed, and the same cutting groove 16 as above is formed. By repeating these operations, cutting grooves 16 are formed along all the division lines 14 along the X-axis direction.

[0032] Next, the chuck table 24 is rotated by 90 degrees, the direction orthogonal to the direction in which the cutting groove 16 was formed previously is aligned with the X-axis direction, the above-described cutting is performed on all the division lines 14 newly aligned in the X-axis direction, and cutting grooves 16 are formed along all the division lines 14 formed on the wafer 10. By performing the cutting in this way, as shown in Fig. 2(b), cutting grooves 16 are formed corresponding to the division lines 14 of the wafer 10 along the division lines 14, and the cutting of the wafer 10 is completed.

[0033] As described above, if the wafer 10 is processed, an operator issues a command to the control means 100 to shift to an inspection mode in order to inspect the state of the processing performed on the wafer 10. The command issued to the control means 100 is issued by selecting and touching a predetermined icon displayed on the monitor 15.

[0034] As described above, when a command to shift to an inspection mode for inspecting the state of processing of the wafer 10 is issued to the control means 100, as shown in FIG. 3, an inspection item screen A including a plurality of inspection items is displayed on the monitor 15, and the X-axis feed means 30 is operated to position the chuck table 24 directly below the imaging means 11. The inspection item screen A displayed on the monitor 15 includes, for example, the above-described inspection items (1) to (5).

[0035] The inspection items (1) to (5) displayed on the inspection item screen A of the monitor 15 indicate the items of inspection performed based on the image captured by the imaging means 11. Corresponding to the inspection items (1) to (5), inspection conditions including at least the XY coordinates on the wafer 10 suitable for executing the inspection and the appropriate magnification when the imaging means 11 captures an image of the wafer 10 are determined, and the inspection conditions are stored in advance in the control means 100.

[0036] Here, the operator touches any one of the "ON" icons Aa to Ae displayed as "ON" of the inspection items (1) to (5) to be confirmed on the inspection item screen A displayed on the monitors 15 of FIGS. 3(a) and 4.

[0037] The "ON" icon Aa on the inspection item screen A shown in the figure is an icon that instructs the execution of an inspection of the width of the cutting groove 16 formed along the division planned line 14. When the "ON" icon Aa is touched, in the control means 100, only the function of inspecting the width of the cutting groove 16 operates. Specifically, the chuck table 24 is moved by the X-axis feed means 30 and the Y-axis feed means 50, and the XY coordinates of the chuck table 24 suitable for detecting the width of the cutting groove 16 are positioned directly below the imaging means 11. The XY coordinates are set, for example, at the position where the cutting groove 16 is formed in the outer peripheral surplus area where the device 12 is not formed on the surface 10a of the wafer 10. Next, the imaging means 11 is operated to image the XY coordinates, and on the monitor 15, a cutting groove width screen B shown on the right side of FIG. 4 switched from the inspection item screen A is displayed. The magnification when imaging the wafer 10 by the imaging means 11 is set to a relatively large magnification suitable for detecting the width of the cutting groove 16, and the imaged image information is sent to the control means 100. Further, as shown in the figure, on the cutting groove width screen B, the groove width (49 μm) detected by the image processing program executed by the control means 100 is displayed. The information on the groove width is stored in a predetermined storage device of the control means 100, and the width of the cutting groove 16 can be confirmed at any time according to the operator's instruction. As described above, by touching the "ON" icon Aa on the inspection item screen A, only the function of inspecting the width of the cutting groove 16 operates, so the operation of functions that are unnecessary for the operator to confirm is omitted, and the width of the cutting groove 16 can be confirmed in a relatively short time.

[0038] As described above, if the inspection of the width of the cutting groove 16 is executed, by touching the "OFF" icon Ba displayed on the cutting groove width screen B, the display on the monitor 15 returns to the inspection item screen A described above. Next, on the inspection item screen A, by touching the "ON" icon Ab for executing the chipping inspection, only the function of inspecting the presence or absence of chipping generated on both sides of the cutting groove 16 is activated in the control means 100. Specifically, the chuck table 24 is moved by the X-axis feed means 30 and the Y-axis feed means 50, and the XY coordinate position suitable for detecting the chipping is positioned directly below the imaging means 11. The XY coordinates are set, for example, at the position where the cutting groove 16 is formed in the region where the device 12 is formed on the surface 10a of the wafer 10.

[0039] Next, the imaging means 11 is activated to image the XY coordinates, and a chipping screen C shown on the right side of FIG. 4 switched from the inspection item screen A is displayed on the monitor 15. At this time, the magnification when the wafer 10 is imaged by the imaging means 11 is set to a relatively large magnification suitable for detecting the chipping 16a generated on both sides of the cutting groove 16, and the imaged image information is sent to the control means 100. As shown in the figure, an image suitable for determining the presence or absence of chipping 16a is displayed on the chipping screen C. The chipping screen C is stored in a predetermined storage device of the control means 100, and the number of chippings generated in a predetermined range is counted by an image processing program. As described above, by touching the "ON" icon Ab on the inspection item screen A, only the function of inspecting the chipping generated on both sides of the cutting groove 16 is activated, so the activation of functions that are unnecessary for the operator to confirm is omitted, and the occurrence status of chipping can be confirmed in a relatively short time. By touching the "OFF" icon Ca displayed on the chipping screen C, the display on the monitor 15 returns to the inspection item screen A.

[0040] Furthermore, on the inspection item screen A, by touching the "ON" icon Ac for performing the inspection of the meandering of the cutting groove 16, only the function of inspecting the meandering state of the cutting groove 16 is activated in the control means 100. Specifically, the chuck table 24 is moved by the X-axis feed means 30 and the Y-axis feed means 50, and the XY coordinates suitable for detecting the meandering are positioned directly below the imaging means 11. The XY coordinates are set at a plurality of locations in a predetermined cutting groove 16, for example, one end side, the center, and the other end side of the predetermined cutting groove 16, and the images captured at the set locations are continuously or simultaneously displayed on the monitor 15, and the meandering state of the cutting groove 16 is inspected.

[0041] Next, the imaging means 11 is activated to image the XY coordinates, and a meandering state display screen D shown on the right side of FIG. 4 is displayed on the monitor 15. At this time, the magnification when the imaging means 11 images the wafer 10 is a magnification suitable for detecting the meandering of the cutting groove 16, more specifically, a magnification smaller than that of the cutting groove width screen B and the chipping screen C. The image information captured in this way is sent to the control means 100. As shown in the figure, the cutting groove meandering screen D displays an image of an area suitable for the inspection of the meandering state of the above-described cutting groove 16, for example, the state in which the cutting groove 16 is formed in the division line 14 adjacent to the device 12. The meandering state display screen D is stored in a predetermined storage device of the control means 100 and can be confirmed at any time according to the operator's instruction. Further, by an image processing program, the meandering state of the cutting groove 16 within a predetermined range may be evaluated as to how much it meanders with respect to the ideal cutting straight line, and the evaluation result may be displayed. As described above, by touching the "ON" icon Ac on the inspection item screen A, only the function of inspecting the meandering state of the cutting groove 16 is activated, so the activation of functions that are unnecessary for the operator to confirm is omitted, and the meandering state of the cutting groove 16 can be confirmed in a relatively short time. Then, by touching the "OFF" icon Da displayed on the meandering state display screen D, the display on the monitor 15 returns to the inspection item screen A.

[0042] On the inspection item screen A, by touching the "ON" icon Ad for inspecting the index interval of the cutting groove 16, only the function of inspecting the index interval of the cutting groove 16 is activated in the control means 100. Specifically, the chuck table 24 is moved by the X-axis feed means 30 and the Y-axis feed means 50, and the XY coordinate position suitable for detecting the index interval is positioned directly below the imaging means 11. The XY coordinates are set, for example, in a region where two adjacent cutting grooves 16 are formed in the outer peripheral surplus region of the wafer 10 where the device 12 is not formed on the surface 10a.

[0043] Next, the imaging means 11 is activated to image the XY coordinate position, and an index interval display screen E shown on the right side of FIG. 4 switched from the inspection item screen A is displayed on the monitor 15. At this time, the magnification when imaging the wafer 10 by the imaging means 11 is set to a small magnification suitable for detecting the index interval of the cutting groove 16, and the imaged image information is sent to the control means 100. As shown in the figure, the index interval display screen E displays an image suitable for measuring the index interval of the cutting groove 16, for example, two adjacent cutting grooves 16. The index interval display screen E is stored in a predetermined storage device of the control means 100 and can be confirmed at any time according to the operator's instruction. Also, as shown in the figure, the index interval may be measured by an image processing program and the result may be displayed. As described above, by touching the "ON" icon Ad on the inspection item screen A, only the function of inspecting the index interval of the cutting groove 16 is activated, so the activation of functions that are unnecessary for the operator to confirm is omitted, and the index interval of the cutting groove 16 can be confirmed in a relatively short time. By touching the "OFF" icon Ea displayed on the index interval display screen E, the display on the monitor 15 returns to the inspection item screen A.

[0044] On the inspection item screen A, by touching the "ON" icon Ae for performing the inspection of the dirt on the device 12 of the wafer 10 subjected to cutting, in the control means 100, only the function of inspecting the dirt of the device 12 is activated. Specifically, the chuck table 24 is moved by the X-axis feed means 30 and the Y-axis feed means 50, and the XY coordinate position suitable for detecting the dirt of the device 12 is positioned directly below the imaging means 11. The XY coordinates are, for example, in a region where at least one or more devices 12 are formed on the surface 10a of the wafer 10.

[0045] Next, the imaging means 11 is activated to image the XY coordinate position, and on the monitor 15, the device dirt display screen F shown on the right side of FIG. 4 switched from the inspection item screen A is displayed. At this time, the magnification when imaging the wafer 10 by the imaging means 11 is set to a small magnification suitable for inspecting the dirt over the entire area of the device 12, and the imaged image information is sent to the control means 100. As shown in the figure, the device dirt display screen F is displayed at a magnification suitable for inspecting the dirt on the device 12. The device dirt display screen F is stored in a predetermined storage device of the control means 100 and can be confirmed at any time according to the operator's instruction. Also, the number of dirt 12a on one device 12 may be counted by an image processing program and the number may be displayed. As described above, by touching the "ON" icon Ae on the inspection item screen A, only the function of inspecting the dirt on the device 12 is activated, so the operation of functions that are unnecessary for the operator is omitted, and the dirt state on the device 12 can be inspected in a relatively short time. By touching the "OFF" icon Fa displayed on the device dirt display screen F, the display on the monitor 15 returns to the inspection item screen A.

[0046] As described above, according to the present embodiment, even when there are a plurality of inspection items, only the function corresponding to the inspection item that the operator wants to confirm is activated, so the operation time of functions that are unnecessary for confirmation is omitted, and the operator can confirm the inspection items required in a relatively short time.

[0047] In the above-described embodiment, an example in which the cutting device 1 is provided with a function of imaging the processed wafer 10 to inspect the processing state has been shown. However, the function of imaging the processed wafer 10 to inspect the processing state may be separated from the cutting device 1 to configure an inspection device having only the function of inspecting the processing state. More specifically, a chuck table 24 for holding the wafer 10 disposed in the above-described cutting device 1, an imaging means 11 for imaging the wafer 10 held by the chuck table 24, a feeding means 7 for relatively feeding the chuck table 24 and the imaging means 11, a monitor 15 for displaying the image captured by the imaging means 11, and a control means 100 are independently provided to configure an inspection device. The control means 100 disposed in the inspection device can image the processed wafer 10 by the imaging means 11 according to the above-described inspection procedure to inspect the processing state by a plurality of items.

Explanation of Signs

[0048] 1: Cutting device 2: Stationary base 2a: Guide rail 7: Feeding means 8: Spindle support mechanism 9: Spindle unit 10: Wafer 11: Imaging means 12: Device 14: Division planned line 15: Monitor 16: Cutting groove 16a: Chipping 20: Holding means 21: X-axis direction moving base 22: Cylindrical support member 23: Cover plate 24: Chuck table 30: X-axis feeding means 40: Y-axis direction moving base 50: Y-axis feeding means 100: Control means 120: Cutting means 121: Z-axis direction moving base 122: Spindle housing 123: Cutting blade 124: Drive source A: Inspection item screen B: Cutting groove width screen C: Chipping screen D: Cutting groove meandering screen E: Index interval display screen F: Device dirt display screen

Claims

1. A cutting device for cutting a wafer, comprising: a chuck table for holding the wafer; cutting means for performing cutting on the wafer held by the chuck table; feeding means for relatively feeding the chuck table and the cutting means; imaging means for imaging the wafer held by the chuck table; a monitor for displaying an image captured by the imaging means; and control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. A cutting device in which a plurality of items to be inspected are displayed on the monitor, and only the function of inspecting corresponding to the selected item is activated by selecting a necessary item.

2. The cutting device according to claim 1, wherein the plurality of items include at least two or more of the width of the cutting groove subjected to the cutting process, chipping generated on both sides of the cutting groove, meandering of the cutting groove, index interval of the cutting groove, and contamination of the chip surrounded by the cutting groove.

3. An inspection device for imaging a processed wafer and inspecting the processing state, comprising: a chuck table for holding the wafer; imaging means for imaging the wafer held by the chuck table; feeding means for relatively feeding the chuck table and the imaging means; a monitor for displaying an image captured by the imaging means; and control means. The control means has a function of imaging the wafer by the imaging means and inspecting the processing state by a plurality of items. An inspection device in which a plurality of items to be inspected are displayed on the monitor, and only the function corresponding to the item is activated by selecting a necessary item.

4. The inspection device according to claim 3, wherein the plurality of items include at least two or more of the width of the cutting groove subjected to the cutting process, chipping generated on both sides of the cutting groove, meandering of the cutting groove, index interval of the cutting groove, and contamination of the chip surrounded by the cutting groove.

Images