Laminated electronic component

Abstract

To provide a laminated electronic component that improves the connection strength between a body part and an external electrode and reduces entry of a plating solution.SOLUTION: A capacitor has an effective part and a cover. The effective part has dielectric layers 7 and internal electrodes 9 alternately laminated in a lamination direction D3. The cover overlaps the effective part in the lamination direction, and has a plurality of insulating layers 17 laminated in the lamination direction and dummy electrodes 20 located between the plurality of insulating layers. The dummy electrode has at least one oxidation region 20x. On a cross section parallel to the lamination direction and a first direction D1 orthogonal to the lamination direction, the dummy electrodes are located on the end sides of the cover relative to a central line CL in the first direction. The area ratio of the oxidation region on the end sides of the dummy electrode is higher than the area ratio of the oxidation region on the center side.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to multilayer electronic components such as multilayer ceramic capacitors.

Background Art

[0002] As a multilayer electronic component, for example, a multilayer ceramic capacitor is known (for example, Patent Document 1 below). The multilayer ceramic capacitor has, for example, an active part, a cover, and an external electrode. The active part has alternately laminated dielectric layers and flat internal electrodes, and directly bears the function as a capacitor. The cover covers the active part in the lamination direction of the dielectric layers and the internal electrodes, and contributes to the protection of the active part. The external electrode is composed of a metal layer that covers the side surface of the main body part composed of the active part and the cover, and contributes to mounting the capacitor on a circuit board or the like. In Patent Document 1, a dummy electrode (auxiliary electrode) is provided on the cover. The dummy electrode contributes to depositing a metal that becomes the external electrode, for example, by electroplating.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] A stacked electronic component according to one aspect of the present disclosure includes an active part and a cover. The active part has dielectric layers and internal electrodes that are alternately stacked in a stacking direction. The cover overlaps the active part in the stacking direction. The cover has a plurality of insulating layers stacked in the stacking direction and dummy electrodes positioned between the plurality of insulating layers. The dummy electrode has at least one oxidized region. In a cross section parallel to the stacking direction and a first direction orthogonal to the stacking direction, the dummy electrode is positioned closer to an end than to the center of the cover in the first direction. The area ratio of the oxidized region on the end side of the dummy electrode is higher than the area ratio of the oxidized region on the center side.

Brief Description of the Drawings

[0005]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0006] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. Note that the drawings used in the following description are schematic. Therefore, for example, dimensional ratios and the like on the drawings do not necessarily match those in reality. Also, dimensional ratios and the like may not match between the drawings. Specific shapes and / or dimensions may be exaggerated or details may be omitted. However, the above does not deny that the actual shape and / or dimensions may be as shown in the drawings or that features of the shape and / or dimensions may be extracted from the drawings.

[0007] Regarding the aspects to be described later, basically, only the differences from the aspects described earlier will be stated. For matters not specifically mentioned, they may be the same as the aspects described earlier or inferred from the aspects described earlier. For constituent elements corresponding to each other among different aspects, for convenience, even if there are differences, the same reference numerals may be used.

[0008] In the following description, when referring to "rectangle" (or rectangular shape), "square" (or square shape), and "oblong" (or oblong shape), the corners thereof may be chamfered by a curved surface or the like as long as the concept of the above shape is established. For example, the corner formed by two sides may be chamfered with a length of 1 / 5 or less, 1 / 10 or less, or 1 / 20 or less of the length of the shorter of the two sides. Of course, when viewed microscopically, the corners may be rounded due to manufacturing accuracy (error). The same applies to other polygons and the like.

[0009] (Overview of the Embodiment) FIG. 1 is a perspective view showing a capacitor 1 (an example of a multilayer electronic component) according to the first embodiment. For convenience, a rectangular coordinate system D1D2D3 is attached to FIG. 1 and other figures described later. The capacitor 1 may be used with either side being the upper or lower side. However, in the description of the embodiment, for convenience, the +D3 side is regarded as the upper side, and terms such as the upper surface and the lower surface may be used.

[0010] The capacitor 1 is, for example, a multilayer ceramic capacitor. The capacitor 1 has a substantially rectangular parallelepiped main body 3 and four external electrodes 5 located at the four corners of the main body 3 in a plan view (viewed in the D3 direction). The external electrodes 5 contribute to the electrical connection between the capacitor 1 and other electronic components (for example, a circuit board not shown).

[0011] Figure 3 is a cross-sectional view taken along line III-III of Figure 1. Note that Figure 3 shows a D1D3 cross-section that cuts the external electrode 5 on the +D2 side. However, the D1D3 cross-section that cuts the external electrode 5 on the -D2 side, the D2D3 cross-section that cuts the external electrode 5 on the -D1 side, and the D2D3 cross-section that cuts the external electrode 5 on the +D1 side are basically the same. In the description of the embodiment, for the sake of convenience and without particular notice, the positional relationship between components etc. may be described using the terms D1, D2, and D3 on the premise of the cross-section shown in Figure 3.

[0012] The main body part 3 has, for example, an active part 11, two covers 13 that respectively overlap the upper and lower surfaces of the active part 11, and a base layer 15 that overlaps the surfaces of each cover 13 on the side opposite to the active part 11. The active part 11 has a plurality of dielectric layers 7 and a plurality of internal electrodes 9 that overlap alternately. The plurality of internal electrodes 9 includes a plurality of first internal electrodes 9A and a plurality of second internal electrodes 9B. Each base layer 15 has, for example, four base electrodes 16 at positions corresponding to the positions of the four external electrodes 5.

[0013] The active part 11 directly bears the function as a capacitor. The cover 13 contributes, for example, to the protection of the main body part 3 and the improvement of strength. The base electrode 16 contributes, for example, to depositing the metal that becomes the external electrode 5 by electroplating and / or improving the adhesion of the external electrode 5 to the main body part 3.

[0014] Each cover 13 has, for example, a plurality (two in the example of Figure 3) of insulating layers 17 and at least one (one in the example of Figure 3) dummy layer 19 located between the plurality of insulating layers 17. Each dummy layer 19 has, for example, four dummy electrodes 20 at positions corresponding to the positions of the four external electrodes 5. The dummy electrode 20 contributes, for example, to the reinforcement of the cover 13 and / or the improvement of the connection strength between the main body part 3 and the external electrode 5, and also functions as a base in the mode of forming the external electrode 5 by electroplating.

[0015] Figure 4 is an enlarged view of region IV in Figure 3. The dummy electrode 20 has at least one (three in Figure 4) oxidation region 20x.

[0016] When the oxidation region 20x is formed, for example, the volume of the dummy electrode 20 increases. As a result, for example, the adhesion between the dummy electrode 20 and the insulating layer 17 is improved. In other words, the probability of forming a gap between the two is reduced. Due to the improvement of the above adhesion, for example, the strength of the cover 13 is improved. Also, for example, the probability that gas and / or liquid that has entered the gap for some reason affects the mechanical properties and / or electrical properties is reduced. In the aspect of forming the external electrode 5 by the plating method, the probability that the plating solution enters the gap and affects the mechanical properties and / or electrical properties is reduced.

[0017] The above is the outline of the embodiment. Specifically, the embodiment will be described in the following order in general. 1. Configuration of the capacitor according to the first embodiment (Figs. 1 to 3) 1.1. Overall configuration 1.2. Active part 1.3. Cover 1.4. Base electrode 1.5. External electrode 2. Oxidation region 2.1. Oxidation region of the dummy electrode 2.2. Comparison with the oxidation regions of other electrodes 3. Manufacturing method of the capacitor 4. Configuration of the capacitor according to other embodiments (Fig. 6) 5. Summary of the embodiment

[0018] (1. Configuration of the capacitor according to the first embodiment) (1.1. Overall configuration) The capacitor 1 shown in Fig. 1 is configured as, for example, a chip-type component to be surface-mounted. Specifically, for example, the capacitor 1 is arranged with the -D3 side or the +D3 side facing the circuit board (not shown). Then, the four pads of the circuit board and the four external electrodes 5 are joined by a conductive joining material (for example, solder) (not shown), respectively, and thus the capacitor is mounted on the circuit board.

[0019] The configuration (internal structure and external shape) of the capacitor 1 is, for example, generally symmetric with respect to a symmetric plane (not shown) that is parallel to the D1D2 plane and passes through the center in the thickness direction (D3 direction) of the capacitor 1. Also, the configuration of the capacitor 1 is, for example, rotationally symmetric by 180° when viewed in the D3 direction. Of course, the capacitor 1 may not have such symmetry.

[0020] The shape of the main body 3 is, for example, generally a thin rectangular parallelepiped shape. This rectangular parallelepiped may be a square (in the example shown in the figure) or a rectangle (excluding squares; the same shall apply hereinafter) in a plan view. In the description of the embodiment, for the sake of convenience, the description may be made on the premise of a square without particular notice.

[0021] The specific dimensions of the main body 3 (or the capacitor 1) are arbitrary. To give an example of the dimensions when the capacitor 1 is relatively small, in the main body 3 (or the capacitor 1), the lengths in the D1 direction and the D2 direction may each be 0.030 mm or more and 0.200 mm or less. When the length in the D1 direction is L and the length in the D2 direction is W, L / W may be 0.5 or more and 2.0 or less. The thickness in the D3 direction may be 0.030 mm or more and 0.200 mm or less. When the surface of the main body 3 is not planar, for example, the maximum values of various dimensions may satisfy the above ranges (hereinafter, the same shall apply to the various dimensions of other components as long as there is no contradiction).

[0022] Note that the examples of the dimensions of each component described later may also be those when the capacitor 1 is relatively small. Therefore, dimensions larger (or smaller) than the exemplified dimensions may be adopted.

[0023] A plurality of components of the same type (e.g., 5, 7, 9, 13, 15, 16, 17, 19, or 20, etc.) may be provided with the same (or corresponding) shape, size, material, and position, etc. basically (e.g., excluding relatively small differences. The same shall apply hereinafter), as long as there is no special notice and no contradiction occurs. Therefore, as long as there is no special notice and no contradiction occurs, the description of one component may be regarded as common to a plurality of components of the same type.

[0024] One layer-like (film-like) component (e.g., 5, 7, 9, 15, 17, or 19, etc.) may be entirely composed of one kind of material. However, it may also be composed of layers made of different materials stacked on each other.

[0025] (1.2. Effective part) The shape of the effective part 11 shown in FIG. 3 is, for example, generally a thin rectangular parallelepiped shape. Its planar shape is basically the same as the planar shape of the main body part 3. The specific thickness of the effective part 11 is arbitrary. For example, the thickness of the effective part 11 may be 30% or more, 40% or more, or 50% or more, and may also be 90% or less, 80% or less, or 70% or less, relative to the thickness of the main body part 3. Any combination of the above lower limit and upper limit may be used. Note that the thickness of the main body part 3 is, for example, the thickness from the upper surface of the lower electrode 16 on the upper surface side to the lower surface of the lower electrode 16 on the lower surface side. The thickness of the effective part 11 is, for example, the thickness from the upper surface of the uppermost internal electrode 9 to the lower surface of the lowermost internal electrode 9.

[0026] The dielectric layer 7 is basically a layered structure having a constant thickness (at least between the internal electrodes 9). The thickness of the dielectric layer 7 may be appropriately set according to the characteristics required for the capacitor 1 and the like. Taking an example of a relatively thin thickness, the thickness between adjacent internal electrodes 9 (between the first internal electrode 9A and the second internal electrode 9B) may be 0.1 μm or more or 0.5 μm or more, and may also be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined arbitrarily with each other. The shape and dimensions of the dielectric layer 7 in plan view are basically the same as those of the effective portion 11 in plan view. The material of the dielectric layer is, for example, ceramics, and its specific type is also arbitrary. The number of layers of the dielectric layer 7 (internal electrodes 9) is arbitrary. Taking an example, it is 10 layers or more and 30 layers or less.

[0027] The internal electrode 9 is a layered structure having a constant thickness. The thickness of the internal electrode 9 is arbitrary. For example, it may be thinner, the same, or thicker than the thickness of the region between the internal electrodes 9 in the dielectric layer 7. Taking an example of a relatively thin thickness, the thickness of the internal electrode 9 may be 0.3 μm or more or 0.5 μm or more, and may also be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined arbitrarily with each other. The material of the internal electrode 9 is, for example, metal. The specific type of metal is arbitrary. For example, all or the main component thereof (for example, a component of 60% by mass or more. The same applies hereinafter) is a base metal (for example, Ni and / or Cu).

[0028] FIG. 2 is an exploded perspective view of the capacitor 1. FIG. 2 is schematic for understanding the shape and relative position of the internal electrode 9 and the like. Therefore, in FIG. 2, the number of various layers shown is smaller compared to FIG. 3.

[0029] The internal electrode 9 has, for example, in a plan view, a rectangular (square in the illustrated example) electrode body 9a and a pair of lead electrodes 9b extending from a pair of opposite corner portions of the electrode body 9a. The internal electrode 9 is located inside the outer edge of the dielectric layer 7 and is not exposed from the side surface of the effective portion 11. The pair of lead electrodes 9b reach the outer edge of the dielectric layer 7 and are connected to a pair of external electrodes 5 located at a pair of opposite corner portions of the main body portion 3.

[0030] The first internal electrode 9A and the second internal electrode 9B face each other with the dielectric layer 7 interposed therebetween. The pair of lead electrodes 9b of the first internal electrode 9A and the pair of lead electrodes 9b of the second internal electrode 9B are located on different diagonals in a plane perspective view. And both are connected to a pair of different external electrodes 5.

[0031] The various dimensions of the electrode body 9a and the lead electrode 9b are arbitrary. For example, the length of the lead electrode 9b on one side of the dielectric layer 7 is substantially the same as the length along the one side of the external electrode 5.

[0032] (1.3. Cover) The cover 13 shown in FIG. 3 is, for example, generally a layer having a shape and dimensions that overlap the effective portion 11 without excess or deficiency. The thickness of the cover 13 is substantially constant in each of the disposed region and the non-disposed region of the base electrode 16. The ratio of the thickness of the cover 13 to the thickness of the main body portion 3 may be substantially the inverse of the ratio of the thickness of the effective portion 11 to the thickness of the main body portion 3 (described above). For example, in an aspect where the covers 13 are provided on both sides in the D3 direction, the thickness of one cover 13 may be, for example, 5% or more, 10% or more, or 15% or more with respect to the thickness of the main body portion 3, and may also be 35% or less, 30% or less, or 25% or less. The above lower limit and upper limit may be combined arbitrarily with each other. The thickness of the cover 13 is, for example, the thickness in a region that overlaps the internal electrode 9 and does not overlap the base electrode 16 (is not crushed by the base electrode 16).

[0033] The insulating layer 17 and the dummy layer 19 overlap one by one alternately. In other words, the dummy layer 19 is provided at the boundary of all the insulating layers 17. Different from the illustrated example, the dummy layer 19 may be provided only at a part of a plurality of boundaries. For example, the dummy layer 19 may not be provided at one or more boundaries relatively close to the effective part 11, and may be provided only at one or more boundaries relatively far from the effective part 11. However, in such a case, two or more insulating layers 17 that are in close contact with each other without interposing the dummy layer 19 may be regarded as one insulating layer 17.

[0034] The insulating layer 17 is a layer having a substantially constant thickness except for the change in thickness caused by the difference in the presence or absence of overlap with the conductor layers (9, 15, and 19). The planar shape of the insulating layer 17 is, for example, basically the same as the planar shape of the dielectric layer 7. The material of the insulating layer 17 is arbitrary. For example, the material of the insulating layer 17 may be the same as or different from the material of the dielectric layer 7. Also, the material of the insulating layer 17 may be, for example, ceramics or a material other than ceramics.

[0035] The thickness of the insulating layer 17 is arbitrary. For example, the thickness of the insulating layer 17 may be thicker (illustrated example), equivalent, or thinner than the thickness of the dielectric layer 7 (both are the thickness between conductor layers or the thickness of a region not overlapping with the conductor layers. In this paragraph, the same applies hereinafter). For example, the thickness of the insulating layer 17 may be set to 2 times or more, 3 times or more, or 5 times or more the thickness of the dielectric layer 7, and may also be set to 20 times or less, 10 times or less, or 5 times or less. Any combination of the above lower limit and upper limit may be used. Also, for example, the thickness of the insulating layer 17 may be set to 1.0 μm or more or 2.0 μm or more, and may also be set to 10.0 μm or 5.0 μm or less. Any combination of the above lower limit and upper limit may be used. Note that the insulating layer overlapping the topmost internal electrode 9 may be regarded as the insulating layer 17 instead of the dielectric layer 7 regardless of its material and thickness. The same applies to the insulating layer overlapping the lowermost internal electrode 9.

[0036] The dummy electrode 20 is, for example, a layered structure having a substantially constant thickness. The material of the dummy electrode 20 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). The material of the dummy electrode 20 may be the same as or different from the material of the internal electrode 9. In plan view, the position, shape, and dimensions of the dummy electrode 20 are arbitrary. In the examples of FIGS. 2 and 3, the position, shape, and dimensions of the dummy electrode 20 are substantially the same as those of the external electrode 5 without excess or deficiency in plan perspective (however, the external electrode 5 is slightly wider). The dummy electrode 20 is exposed, for example, on the side surface of the main body 3. This exposed portion is fixed to the external electrode 5.

[0037] The thickness of the dummy electrode 20 is arbitrary. For example, the thickness of the dummy electrode 20 may be thicker (in the illustrated example), the same, or thinner than the thickness of the internal electrode 9. For example, the thickness of the dummy electrode 20 may be 1 time or more, 1.5 times or more, or 2 times or more the thickness of the internal electrode 9, and may also be 10 times or less, 5 times or less, or 2 times or less. Any combination of the above lower and upper limits may be used. Also, for example, the thickness of the dummy electrode 20 may be 0.3 μm or more, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, and may also be 10.0 μm or less, 5.0 μm or less, 3.0 μm or less, or 2.0 μm or less. Any combination of the above lower and upper limits may be used. Also, the thickness of the dummy electrode 20 may be thinner (in the illustrated example), equal to, or thicker than the thickness of the insulating layer 17.

[0038] (1.4. Underlying electrode) The underlying electrode 16 is, for example, basically a layered structure having a constant thickness. The material of the underlying electrode 16 is, for example, a metal. The specific type of metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). The material of the underlying electrode 16 may be the same as or different from the material of the internal electrode 9 and / or the dummy electrode 20. In plan view, the position, shape, and dimensions of the underlying electrode 16 are arbitrary. In the examples of FIGS. 2 and 3, the position, shape, and dimensions of the underlying electrode 16 are, in a plane perspective view, generally the same as those of the external electrode 5 without excess or deficiency (however, the external electrode 5 is slightly wider).

[0039] The thickness of the underlying electrode 16 is arbitrary. For example, the thickness of the underlying electrode 16 may be thicker (in the illustrated example), the same, or thinner than the thickness of the internal electrode 9 and / or the dummy electrode 20. For example, the thickness of the underlying electrode 16 may be 2 times or more, 3 times or more, or 5 times or more the thickness of the internal electrode 9 and / or the dummy electrode 20, and may also be 20 times or less, 10 times or less, or 5 times or less. Any combination of the above lower and upper limits may be used. Also, for example, the thickness of the underlying electrode 16 may be 2.0 μm or more, 3.0 μm or more, or 5.0 μm or more, and may also be 20.0 μm or less, 10.0 μm or less, or 5.0 μm or less. Any combination of the above lower and upper limits may be used. Further, the thickness of the underlying electrode 16 may be thinner, equal to, or thicker than the thickness of the insulating layer 17 (in the illustrated example).

[0040] (1.5. External Electrode) The external electrode 5 is, for example, basically a layered structure having a constant thickness. The material of the external electrode 5 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). Further, the external electrode 5 may be configured by laminating mutually different materials as necessary. For example, the external electrode 5 may be configured by laminating Cu, Ni, and Sn from the side of the base electrode 16. The material of the external electrode 5 may be the same as or different from the material of the internal electrode 9, the dummy electrode 20, and / or the base electrode 16.

[0041] As shown in FIG. 1, for example, the external electrode 5 generally covers four surfaces (the upper surface, the lower surface, and two side surfaces) of the main body portion 3 at the corner portion in the plan view of the main body portion 3. Thereby, the connection between one external electrode 5 and one lead-out electrode 9b is made on two side surfaces of the main body portion 3, and it is also possible to perform surface mounting on either the upper surface or the lower surface of the capacitor 1. The shape and dimensions of the portions on each surface of the external electrode 5 are arbitrary. Among the external electrodes 5, the planar shape of the portion located on the upper surface or the lower surface of the main body portion 3 is, for example, a rectangular shape (a square shape in the illustrated example). Further, the planar shape and dimensions of the portion of the external electrode 5 located on the side surface of the main body portion 3 are, for example, a rectangular shape having the same lateral length as the portion located on the upper surface or the lower surface.

[0042] The thickness of the external electrode 5 is arbitrary. For example, the thickness of the external electrode 5 may be made thicker than the thicknesses of the internal electrode 9, the dummy electrode 20, and the base electrode 16. For example, the thickness of the external electrode 5 may be 1.2 times or more, 2 times or more, or 3 times or more the thickness of the base electrode 16, and may also be 10 times or less, 5 times or less, or 3 times or less. The above lower limit and upper limit may be combined with any others. Further, for example, the thickness of the external electrode 5 may be 3 μm or more, 5 μm or more, or 10 μm or more, and may also be 30 μm or less, 20 μm or less, or 10 μm or less. The above lower limit and upper limit may be combined with any others.

[0043] (2. Oxidation region) (2.1. Oxidation region of dummy electrode) In the oxidized region 20x (FIG. 4), the metal contained in the dummy electrode 20 is oxidized. That is, the oxidized region 20x is configured to contain a metal oxide. The specific type of the metal oxide is arbitrary. For example, when the entire or main component of the dummy electrode 20 (before oxidation) is Ni, the oxidized region 20x contains NiO.

[0044] The oxidized region 20x can be observed, for example, by a scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS). Specifically, when the oxidized region 20x is observed by an SEM at an appropriate magnification, it is observed as a region (hereinafter referred to as a different hue region) that exhibits a different hue from the region of the dummy electrode 20 other than the oxidized region 20x. Furthermore, if the presence of the element that is the main component of the dummy electrode 20 and the oxygen element is confirmed by EDS for the spot where the different hue region identified by SEM is located, the different hue region can be said to be the oxidized region 20x in which the dummy electrode 20 is oxidized. Note that by identifying the range of the different hue region by SEM, it is possible to identify the range of the oxidized region 20x and measure the dimensions of the range.

[0045] Methods for confirming the presence of oxygen element by EDS include, for example, point analysis or mapping analysis. For example, the presence of oxygen element in the different hue region may be confirmed by confirming the spectrum of oxygen element from the spot where the different hue region is located by point analysis. Also, the presence of oxygen element in the different hue region may be confirmed by confirming, for example, by mapping analysis, that the oxygen element concentration in the spot where the different hue region is located is higher than the oxygen element concentration in the region other than the different hue region in the dummy electrode 20. This is because it is unreasonable to consider the oxidized region 20x as publicly known based on the unavoidable and extremely small presence of oxygen in the publicly known technology.

[0046] As a method for confirming the presence of elements that are the main components of the dummy electrode 20, the above-described point analysis or mapping analysis can be used. In this paragraph, Ni will be described as an example of an element that is the main component of the dummy electrode 20. For example, by point analysis, by confirming the spectrum of the Ni element from the spot where the heterochromatic region is located, it may be confirmed that the Ni element is present in the heterochromatic region. Also, for example, by mapping analysis, by confirming that the Ni element concentration of the spot where the heterochromatic region is located is higher compared to the Ni element concentration in the insulating layer 17, it may be confirmed that the Ni element is present in the heterochromatic region.

[0047] In the above-described mapping analysis, the width when calculating the concentration of oxygen element may be set appropriately. For example, in a cross-section parallel to the D3 direction as shown in FIG. 4 (for example, the D1D3 cross-section), the concentration of oxygen may be calculated for each predetermined unit area. The unit area may be of an appropriate size. For example, the unit area may be 0.01 μm 2 (or an even smaller area). Note that depending on the situation, the unit area may be made larger than the above (that is, the accuracy may be lowered). The shape of each unit area may be, for example, a square (for example, a square of 0.1 μm × 0.1 μm).

[0048] As an SEM-EDS analyzer for observing the oxidized region 20x, for example, JSM-6010LV manufactured by JEOL Ltd. can be used.

[0049] In a cross-section parallel to the D3 direction as shown in FIG. 4 (for example, the D1D3 cross-section), the number, distribution pattern, area ratio (volume ratio), size, and shape, etc. of the oxidized regions 20x of one dummy electrode 20 are arbitrary.

[0050] For example, the dummy electrode 20 may have a plurality of oxidation regions 20x (example shown in the figure), the entire dummy electrode 20 may be an oxidation region 20x, or one oxidation region 20x may be provided as a part of the dummy electrode 20. The plurality of oxidation regions 20x may be distributed in the D1 direction, for example, as in the example shown in the figure. And / or, the plurality of oxidation regions 20x may have, for example, a layered oxidation region 20x that constitutes the upper surface of the dummy electrode 20 and a layered oxidation region 20x that constitutes the lower surface of the dummy electrode 20. One oxidation region 20x as a part of the dummy electrode 20 may be, for example, a part of the region in the D1 direction as in the example shown in the figure, or may be a part of the region that constitutes the upper surface or the lower surface of the dummy electrode 20.

[0051] Further, for example, in a mode where one or more oxidation regions 20x are formed as a part of the dummy electrode 20, the ratio of the total area of the oxidation regions 20x to the area of the dummy electrode 20 is arbitrary. For example, the ratio may be 3% or more, 5% or more, 7% or more, 10% or more, 50% or more, or 80% or more, and may also be 80% or less, 50% or less, 20% or less, 15% or less, or 10% or less. The above lower limit and upper limit may be combined with any other arbitrary values so as not to cause a contradiction.

[0052] For example, when the ratio of the total area of the oxidation regions 20x to the area of the dummy electrode 20 is 3% or more, the adhesion between the dummy electrode 20 and the insulating layer 17 is improved as the volume of the oxidation regions 20x increases, and the intrusion of the plating solution is significantly reduced. On the other hand, if the total area of the oxidation regions 20x in the area of the dummy electrode 20 becomes excessively large, the possibility of cracks occurring due to stress applied inside the capacitor as the volume increases is improved. For example, when the ratio of the total area of the oxidation regions 20x to the area of the dummy electrode 20 is 20% or less, it is possible to reduce the excessive increase in the volume of the dummy electrode 20 and reduce the possibility of cracks occurring.

[0053] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a part of the region of the dummy electrode 20, the oxidized regions 20x may be distributed evenly or unevenly in the dummy electrode 20. An example of the latter will be given. The dummy electrode 20 is divided into a region on the -D1 side and a region on the +D1 side with the center in the D1 direction (see the center line CL) as a boundary. In FIG. 4, the -D1 side is the end side of the cover 13, and the +D1 side is the center side of the cover 13. In this case, for example, the total area of ​​the oxidized regions 20x in the region on the -D1 side may be made larger than the total area of ​​the oxidized regions 20x in the region on the +D1 side. In other words, the area ratio of the oxidized regions 20x on the end side of the cover 13 may be made higher than that on the center side of the cover 13. In this case, the difference between the areas (or ratios) of the two is arbitrary. For example, the area of ​​the former may be 1.2 times or more or 2 times or more than the area of ​​the latter.

[0054] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, as can be understood from the above description, each oxidized region 20x may extend over the entire thickness of the dummy electrode 20 (in the illustrated example), or may occupy only a part of the thickness. In the latter mode, the oxidized region 20x is not limited to the layer shape already mentioned, but may be in a block shape. Also, the specific size of the diameter of the oxidized region 20x in the D3 direction is also arbitrary. For example, the diameter of the oxidized region 20x in the D3 direction (or the maximum length in the D3 direction) may be 1 / 2 or more or 1 / 2 or less of the thickness of the dummy electrode 20.

[0055] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, as can be understood from the above explanation, the diameter in the D1 direction of each oxidized region 20x is also arbitrary. For example, the diameter in the D1 direction of the oxidized region 20x (or the maximum length in the D1 direction) may be ½ or more or ½ or less of the length in the D1 direction of the dummy electrode 20. Also, the diameter in the D1 direction of the oxidized region 20x (or the maximum length in the D1 direction) may be ½ or more or ½ or less of the thickness of the dummy electrode 20.

[0056] Also, for example, in an embodiment where one or more oxidation regions 20x are formed as part of the dummy electrode 20, as understood from the above description, the aspect ratio of each oxidation region 20x is arbitrary. For example, the diameter in the D1 direction (or the maximum length in the D1 direction) may be 1 / 2 or more, or 1 / 2 or less, with respect to the diameter in the D3 direction (or the maximum length in the D3 direction). Also, the shape of the oxidation region 20x is arbitrary and may be, for example, circular, elliptical, oval (illustrated example), or rectangular.

[0057] Also, for example, as understood from the above description, the diameter (minimum diameter, maximum diameter, equivalent circle diameter, etc.) of the oxidation region 20x is arbitrary. The diameter is a span passing through the geometric center (centroid) of the oxidation region 20x. For example, the minimum diameter of the oxidation region 20x may be 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more. Also, the minimum diameter may be the same as the thickness of the dummy electrode 20 and be the diameter in the D3 direction, or not.

[0058] Focus on one dummy electrode 20. The dummy electrode 20 has a length in the D2 direction. Therefore, there are innumerable D1D3 cross-sections as shown in FIG. 4 in the D2 direction. When the configuration (oxygen concentration, distribution pattern, area ratio, size, and / or shape, etc.) related to the oxidation region 20x in the above-described D1D3 cross-section is established, it is not necessary for the above configuration related to the oxidation region 20x to be established in all cross-sections. For example, the above configuration may be established in 1 / 3 or more, 1 / 2 or more, or 2 / 3 or more of the length of the dummy electrode 20 in the D2 direction. Of course, the above configuration may be established over the entire length of the dummy electrode 20 in the D2 direction.

[0059] Whether the configuration related to the oxidation region 20x is established within the above length range may be determined, for example, based on images of a predetermined number (e.g., 3, 5, or 10) of D1D3 cross-sections set at equal distances with respect to the length of the dummy electrode 20 in the D2 direction. When it is difficult to extract images of a plurality of cross-sections from one capacitor 1, images of a plurality of cross-sections may be extracted from a plurality of capacitors 1 of the same type.

[0060] In the examples of FIGS. 1 to 3, a plurality of dummy electrodes 20 are provided. The above-described configuration related to the oxidation region 20x does not necessarily hold for all of the plurality of dummy electrodes 20. For example, in an embodiment where one cover 13 has a plurality of dummy layers 19, only the dummy layer 19 close to or far from the effective portion 11 may have the above-described configuration related to the oxidation region 20x. Further, in each dummy electrode 20, the above-described configuration related to the oxidation region 20x may hold in each of the D1 direction and the D2 direction, but it is not necessary for the configuration to hold in both directions. Of course, the above-described configuration related to the oxidation region 20x may hold for all dummy electrodes 20 and in all directions.

[0061] (2.2. Comparison with the Oxidation Regions of Other Electrodes) The presence or absence of an oxidation region in other electrodes (internal electrode 9, base electrode 16, and external electrode 5), and the specific mode when the oxidation region exists are arbitrary. The above description regarding the oxidation region 20x (concentration threshold, distribution mode, area ratio, size, shape, etc.) may be applied to other electrodes as long as there is no contradiction.

[0062] Also, for example, in the same cross-section, the area ratio of the oxidation region 20x in the dummy electrode 20 may be larger, equal to, or smaller than the area ratio of the oxidation region in other electrodes. Examples are shown below.

[0063] Note that the examples described below do not necessarily hold for all dummy electrodes 20 (or other electrodes), similar to the configuration related to the oxidation region 20x, and do not necessarily hold for all D1D3 cross-sections existing infinitely in the D2 direction. Regarding this point as well, the above description regarding the oxidation region 20x may be applied.

[0064] In the internal electrode 9, the region where the metal is oxidized is defined as the oxidation region 9x. The ratio of the total area of all the oxidation regions 20x in the area of the dummy electrode 20 (hereinafter referred to as the "first ratio") may be larger than the ratio of the total area of all the oxidation regions 9x in the area of the internal electrode 9 (hereinafter referred to as the "second ratio"). When described in this way, the internal electrode 9 may or may not have the oxidation region 9x. When the oxidation region 9x exists, the degree of the difference between the first ratio and the second ratio is arbitrary. For example, the first ratio may be 1.2 times or more or 2 times or more with respect to the second ratio.

[0065] The description of the comparison between the dummy electrode 20 and the internal electrode 9 above may be applied to the base electrode 16 by replacing the term of the internal electrode 9 with the term of the base electrode 16. FIG. 4 illustrates an aspect in which no oxidation region exists in the base electrode 16.

[0066] Also, the description of the comparison between the dummy electrode 20 and the internal electrode 9 above may be applied to the external electrode 5 by replacing the term of the internal electrode 9 with the term of the external electrode 5. FIG. 4 illustrates an aspect in which no oxidation region exists in the external electrode 5. Further, when the external electrode 5 includes a plurality of metal layers, the description of the comparison between the dummy electrode 20 and the internal electrode 9 may be applied to some of the plurality of metal layers.

[0067] (3. Method for manufacturing a capacitor) The method for manufacturing the capacitor 1 may be various methods. For example, the general procedure thereof may be the same as a known procedure. An example is shown below.

[0068] First, a ceramic green sheet that becomes the dielectric layer 7 and the insulating layer 17 is produced. Next, a conductive paste that becomes the internal electrode 9, the dummy electrode 20, or the base electrode 16 is applied (for example, printed) to the ceramic green sheet. Next, the ceramic green sheets are laminated to produce a laminate that becomes the main body 3. Note that the lamination of the laminate that becomes the effective part 11 and the lamination of the part that becomes the cover 13 for the laminate may be performed together or separately.

[0069] Up to the production of the above laminate, for example, it is carried out with the size of a mother substrate on which a large number of the plurality of main body parts 3 are taken. After the production of the laminate, the mother substrate including the laminate is fragmented (for example, cut) into a size generally corresponding to the size of the main body part 3. Next, the laminate having the size of the main body part 3 is fired. Thereafter, a metal film is formed on the main body part 3 to form the external electrode 5.

[0070] Debinding may be performed before firing. The firing may be carried out, for example, in a reducing atmosphere. A re-oxidation heat treatment may be performed after firing. Before and / or after firing, polishing (for example, barrel polishing) of the main body part 3 may be performed. In polishing, for example, the ridge line part of the main body part 3 may be chamfered or the side surface of the main body part 3 may be polished.

[0071] The external electrode 5 may be formed by various methods. For example, metal may be deposited on the surface of the base electrode 16 and the edges exposed to the outside of the internal electrode 9 and the dummy electrode 20 by electroless plating and / or electrolytic plating. Also, for example, a thin film forming method such as a dip method, a printing method, CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) may be adopted. Note that, as understood from the above, the base electrode 16 and the dummy electrode 20 may or may not contribute to the deposition of metal.

[0072] The method for forming the oxidation region 20x (and other oxidation regions) and the method for adjusting the area ratio and the like are arbitrary. For example, by adjusting the amount of oxygen contained in the conductive paste before coating and / or the time for which the ceramic green sheet before lamination coated with the conductive paste is exposed to an oxidizing atmosphere, the degree of oxidation in the internal electrode 9 and the dummy electrode 20 may be adjusted. Also, for example, an oxidizing agent or a reducing agent may be used at an appropriate time. By making the whole or a part of the dummy electrode 20 have a thickness of a certain degree or more, the dummy electrode 20 is made more likely to come into contact with oxygen during or after firing, and thereby, the degree of oxidation may be made absolutely or relatively larger with respect to the internal electrode 9. The same may be applied to the base electrode 16. Also, since the base electrode 16 is exposed to the outside before the formation of the external electrode 5, the degree of oxidation may be adjusted by an oxygen atmosphere, an oxidizing agent, or a reducing agent after firing.

[0073] (4. Configuration of Capacitor According to Another Embodiment) FIG. 5 is a perspective view of a capacitor 201 according to the second embodiment. FIGS. 3 and 4 according to the first embodiment may be referred to as cross-sectional views of the capacitor 201.

[0074] Generally speaking, the capacitor 201 is different from the capacitor 1 of the four-terminal type in that it is of the two-terminal type. Also in such a capacitor 201, as described with reference to FIGS. 3 and 4, an oxidation region 20x may be formed in the dummy electrode 20.

[0075] The specific shape and dimensions of each part of the capacitor 201 may be different from those of the capacitor 1 according to the fact that it is of the two-terminal type. Specifically, it is as follows.

[0076] The shape of the main body portion 203 (or the capacitor 201) is, for example, generally rectangular parallelepiped. This rectangular parallelepiped may have, for example, a height (length in the D3 direction) equal to the width (length in the D2 direction) (example shown in the figure), or may be smaller. The length of the rectangular parallelepiped in the D1 direction is, for example, larger than the width. The dimensions of the main body portion 203 are arbitrary. As long as the length in the D1 direction is longer than the length in the D2 direction, the specific examples of the dimensions of the main body portion 3 of the first embodiment may be applied to the dimensions of the main body portion 203. The external electrode 5 is generally a layered structure that covers the end portions in the longitudinal direction of the main body portion 203 over five surfaces of the rectangular parallelepiped.

[0077] The planar shape of the internal electrode 9 is, for example, generally a rectangle having four sides parallel to the four sides of the rectangle of the main body portion 203 (dielectric layer 7). Among the four sides of the internal electrode 9, two long sides and one short side are, for example, located inside the side surface of the main body portion 203 (not exposed). The remaining one short side is exposed from the side surface of the main body portion 203 on the +D1 side or -D1 side. The region of the internal electrode 9 that overlaps with other internal electrodes 9 in a planar perspective is the electrode body 9a. The portion extending from the electrode body 9a to the external electrode 5 is the lead-out electrode 9b.

[0078] Each dummy layer 19 has, for example, two dummy electrodes 20 at both ends in the longitudinal direction of the main body portion 203. The planar shape of the dummy electrode 20 is, for example, a rectangular shape extending over the entire width (length in the D2 direction) of the main body portion 203, and is, for example, exposed from the side surface of the main body portion 203 on the +D1 side or -D1 side, and is also exposed from the side surfaces on the +D2 side and -D2 side. The description of the configuration of the above dummy layer 19 (dummy electrode 20) in a plan view may be applied to the configuration of the underlayer 15 (underlying electrode 16) in a plan view.

[0079] Although not particularly shown, further examples of the configuration of the capacitor will be given.

[0080] The capacitor may have an outer packaging resin that covers the entire structure illustrated in FIG. 1 or FIG. 5, and lead wires that are connected to the external electrodes 5 and extend out from the outer packaging resin. From another perspective, the capacitor may be of the through-hole mounting type rather than the surface mounting type. In such an embodiment, one external electrode 5 may only cover one side surface.

[0081] The two types of internal electrodes 9 connected to different external electrodes 5 may be alternately laminated two by two instead of one by one. In this case, for example, the thickness of the dielectric layer 7 between the internal electrodes 9 that are connected to the same external electrode 5 and face each other may be made thinner than the thickness of the dielectric layer 7 between the internal electrodes 9 that are connected to different external electrodes 5 and face each other. As can be understood from this, the plurality of dielectric layers 7 do not necessarily have the same shape and size as each other.

[0082] Also, the two types of internal electrodes 9 connected to different external electrodes 5 do not have to face each other. For example, the two types of internal electrodes 9 connected to different external electrodes 5 are provided in the same layer, and by providing internal electrodes 9 facing the two types of internal electrodes 9, a circuit in which two parallel plate capacitors are connected in series may be configured. Also, a circuit in which three or more parallel plate capacitors are connected in series may be configured.

[0083] In the example of FIG. 5, among the edges of the internal electrode 9, for example, the portions other than the -D1 side or the +D1 side (referred to as "non-exposed edges" in this paragraph) are not exposed from the side surface of the main body portion 203. This non-exposed edge is covered by a portion of the dielectric layer 7 and the insulating layer 17 that extends outward from the non-exposed edge. However, the non-exposed edge may be covered by stacking another dielectric layer on the side surface of the laminate composed of the dielectric layer 7 and the insulating layer 17 so as not to be exposed. From another perspective, the entire main body portion 203 does not necessarily have a laminated structure.

[0084] (5. Summary of the Embodiment) In the following description, for convenience, the reference numerals of the first embodiment are used. However, the matters described below are the same for other embodiments as long as there is no contradiction or the like.

[0085] The multilayer electronic component (capacitor 1) has an active part 11 and a cover 13. The active part 11 has dielectric layers 7 and internal electrodes 9 that are alternately laminated in the lamination direction (D3 direction). The cover 13 overlaps the active part 11 in the D3 direction. The cover 13 has a plurality of insulating layers 17 laminated in the D3 direction and dummy electrodes 20 located between the plurality of insulating layers 17. The dummy electrode 20 has at least one oxidized region 20x.

[0086] Therefore, for example, as described in the outline of the embodiment, for example, the volume of the dummy electrode 20 increases, the gap between the dummy electrode 20 and the insulating layer 17 is reduced, and various effects are achieved thereby.

[0087] The thickness of the dummy electrode 20 may be thicker than the thickness of the internal electrode 9.

[0088] In this case, for example, the dummy electrode 20 has a relatively large shrinkage amount due to firing, and the probability of generating a gap is relatively high. Since the oxidized region 20x is formed in such a dummy electrode 20 to reduce the gap, the effect of the oxidized region 20x is useful. Although shrinkage due to firing has been described, the same can be said for shrinkage according to temperature changes after production and / or during use.

[0089] In a cross section parallel to the lamination direction (D3 direction), the ratio (first ratio) of the total area of the oxidized regions 20x in the dummy electrode 20 to the area of the dummy electrode 20 may be larger than the ratio (second ratio, which may be 0) of the total area of the oxidized regions 9x in the internal electrode 9 to the area of the internal electrode 9.

[0090] Here, when the degree of oxidation of the internal electrode 9 increases, for example, the electrical resistivity increases and the electrical characteristics of the capacitor 1 deteriorate. On the other hand, since the dummy electrode 20 is not a part that directly contributes to the electrical characteristics of the capacitor 1, its electrical resistivity may increase due to oxidation. Therefore, by making the degree of oxidation of the dummy electrode 20 larger than that of the internal electrode 9, it becomes easier to obtain the effect of reducing the gap related to the dummy electrode 20 described above while maintaining the electrical characteristics of the capacitor 1.

[0091] In a cross-section parallel to the stacking direction (D3 direction), the dummy electrode 20 may have an oxidation region 20x with a minimum diameter of 0.5 μm or more.

[0092] In this case, for example, since the oxidation region 20x is relatively large, the effect of reducing the above-described gap is improved. In particular, in the small capacitor 1, the thickness of the internal electrode 9 may be 1 μm or less than 1 μm, and the dummy electrode 20 may also be made relatively thin. In such a configuration, the oxidation region 20x having a diameter of 0.5 μm or more functions effectively.

[0093] In a cross-section parallel to the stacking direction (D3 direction), the dummy electrode 20 may have an oxidation region 20x having a size over the entire thickness of the dummy electrode 20.

[0094] In this case, the volume of the dummy electrode 20 increases maximally in the thickness direction in at least a part of the D1 direction (or D2 direction) (however, excluding the influence of the oxygen concentration in the oxidation region 20x). Thereby, the effect of reducing the above-described gap is improved.

[0095] In a cross-section parallel to the stacking direction (D3 direction) and the first direction (for example, D1 direction) orthogonal to the D3 direction, the dummy electrode 20 may be located on the side of the end rather than the center in the D1 direction with respect to the cover 13 (the dummy electrode 20 shown in FIG. 4 is on the -D1 side). In the dummy electrode 20, the total area of the oxidation region 20x in the half on the end side of the cover 13 may be made larger than the total area of the oxidation region 20x in the half on the center side of the cover 13.

[0096] In this case, for example, the gap is reduced more towards the side of the end portion of the cover 13. As a result, for example, the probability that unintended gas and / or liquid intrusion into the gap is blocked at the side of the end portion of the cover 13 is increased. Therefore, it is possible to efficiently reduce the intrusion of gas and / or liquid deep into the dummy electrode 20 with respect to the degree of oxidation in the entire dummy electrode 20. As a result, for example, the probability that the electrical characteristics of the capacitor 1 are maintained is increased.

[0097] The capacitor 1 may further have a base electrode 16 that overlaps from the side opposite to the effective portion 11 of the cover 13. In a cross-section parallel to the stacking direction (D3 direction), the ratio of the total area of the oxidation regions 20x in the dummy electrode 20 to the area of the dummy electrode 20 may be larger than the ratio of the total area of the oxidation regions (not shown) in the base electrode 16 to the area of the base electrode 16.

[0098] Here, when the degree of oxidation of the base electrode 16 increases, for example, the adhesion of the external electrode 5 to the base electrode 16 decreases. On the other hand, although the dummy electrode 20 contributes to the improvement of the adhesion of the external electrode 5, the influence on the peeling of the external electrode 5 is smaller than that of the base electrode 16. Therefore, by making the degree of oxidation of the dummy electrode 20 larger than the degree of oxidation of the base electrode 16, it is facilitated to obtain the effect of reducing the gap related to the dummy electrode 20 while maintaining the peeling strength of the external electrode 5.

[0099] The base electrode 16 may not have an oxidation region.

[0100] In this case, for example, while maintaining the peeling strength of the external electrode 5 described above, the effect of reducing the gap related to the dummy electrode 20 is improved.

[0101] As described above, in the aspect where the area ratio of the oxidation region 20x in the dummy electrode 20 is larger than the area ratio of the oxidation region in the base electrode 16, the dummy electrode 20 may be thinner than the base electrode 16.

[0102] In this case, for example, since the base electrode 16 having a relatively high adhesion to the external electrode 5 is relatively thick, the adhesion of the external electrode 5 to the capacitor 1 can be efficiently improved.

[0103] The technology according to the present disclosure is not limited to the above embodiments and may be implemented in various modes.

[0104] For example, the multilayer electronic component is not limited to a capacitor. For example, in a multilayer electronic component, a part of the plurality of internal electrodes may be configured to form a capacitor, and the other part of the plurality of internal electrodes may be configured to form an inductor or a resistor. Then, the multilayer electronic component may form an appropriate circuit (for example, a resonance circuit) as a whole. Further, the cover, the base electrode, and the external electrode may be provided on only one of the upper surface and the lower surface of the effective portion.

[0105] The following concepts can be extracted from the present disclosure. (Concept 1) An effective portion having dielectric layers and internal electrodes alternately laminated in a lamination direction, A cover overlapping the effective portion in the lamination direction, having, The cover has, A plurality of insulating layers laminated in the lamination direction, A dummy electrode located between the plurality of insulating layers, and The dummy electrode has at least one oxidized region Multilayer electronic component. (Concept 2) The thickness of the dummy electrode is thicker than the thickness of the internal electrode The multilayer electronic component according to Concept 1. (Concept 3) In a cross section parallel to the lamination direction, the ratio of the total area of the oxidized regions in the dummy electrode to the area of the dummy electrode is larger than the ratio of the total area of the oxidized regions in the internal electrode to the area of the internal electrode The multilayer electronic component according to Concept 1 or 2. (Concept 4) In a cross-section parallel to the stacking direction, the dummy electrode has an oxidized region with a minimum diameter of 0.5 μm or more. The stacked electronic component according to any one of Concepts 1 to 3. (Concept 5) In a cross-section parallel to the stacking direction, the dummy electrode has an oxidized region with a size that extends over the entire thickness of the dummy electrode. The stacked electronic component according to any one of Concepts 1 to 4. (Concept 6) In a cross-section parallel to the stacking direction and a first direction orthogonal to the stacking direction, the dummy electrode is located on the side of the end rather than the center in the first direction with respect to the cover, in the dummy electrode, the total area of the oxidized region in the half on the side of the end is larger than the total area of the oxidized region in the half on the side of the center. The stacked electronic component according to any one of Concepts 1 to 5. (Concept 7) The cover further has a base electrode that overlaps from the side opposite to the effective portion, in a cross-section parallel to the stacking direction, the ratio of the total area of the oxidized region in the dummy electrode to the area of the dummy electrode is larger than the ratio of the total area of the oxidized region in the base electrode to the area of the base electrode. The stacked electronic component according to any one of Concepts 1 to 6. (Concept 8) The base electrode does not have an oxidized region The stacked electronic component according to Concept 7. (Concept 9) The dummy electrode is thinner than the base electrode The stacked electronic component according to Concept 7 or 8. (Concept 10) In a cross-section parallel to the stacking direction, the ratio of the total area of the oxidized region in the dummy electrode to the area of the dummy electrode is 5% or more The stacked electronic component according to any one of Concepts 1 to 9. (Concept 11) In a cross section parallel to the stacking direction, the ratio of the total area of the oxidation regions in the dummy electrode to the area of the dummy electrode is 20% or less. The stacked electronic component according to any one of Concepts 1 to 10.

Explanation of Signs

[0106] 1... Capacitor, 5... External electrode, 7... Dielectric layer, 9... Internal electrode, 11... Effective part, 13... Cover, 17... Insulating layer, 20... Dummy electrode, 20x... Oxidation region (of the dummy electrode).

Claims

1. an effective portion having dielectric layers and internal electrodes alternately stacked in a stacking direction; a cover overlapping the effective portion in the stacking direction; It has The cover is A plurality of insulating layers stacked in the stacking direction; a dummy electrode located between the insulating layers; the dummy electrode has at least one oxidized region; In a cross section parallel to the stacking direction and a first direction perpendicular to the stacking direction, the dummy electrode is located closer to an end than to a center of the cover in the first direction, an area ratio of the oxidized region on the end side of the dummy electrode is higher than an area ratio of the oxidized region on the central side of the dummy electrode; Multilayer electronic components.

2. an area ratio of the oxidized region on the end side of the dummy electrode is 1.2 times or more of an area ratio of the oxidized region on the central side of the dummy electrode; The multilayer electronic component according to claim 1 .

3. The thickness of the dummy electrode is greater than the thickness of the internal electrode. The multilayer electronic component according to claim 1 or 2.

4. In a cross section parallel to the lamination direction, a ratio of a total area of ​​the oxidized regions of the dummy electrodes to an area of ​​the dummy electrodes is larger than a ratio of a total area of ​​the oxidized regions of the internal electrodes to an area of ​​the internal electrodes. The multilayer electronic component according to claim 1 or 2.

5. In a cross section parallel to the lamination direction, the dummy electrode has an oxidized region having a minimum diameter of 0.5 μm or more. The multilayer electronic component according to claim 1 or 2.

6. In a cross section parallel to the stacking direction, the dummy electrode has an oxidized region having a size that extends across the entire thickness of the dummy electrode. The multilayer electronic component according to claim 1 or 2.

7. The cover further includes a base electrode overlapping the cover from the opposite side to the effective portion, In a cross section parallel to the stacking direction, a ratio of a total area of ​​the oxidized region of the dummy electrode to an area of ​​the dummy electrode is larger than a ratio of a total area of ​​the oxidized region of the base electrode to an area of ​​the base electrode. The multilayer electronic component according to claim 1 or 2.

8. The dummy electrode is thinner than the base electrode. The multilayer electronic component according to claim 7 .

9. In a cross section parallel to the stacking direction, a ratio of a total area of ​​an oxidized region in the dummy electrode to an area of ​​the dummy electrode is 5% or more. The multilayer electronic component according to claim 1 or 2.

10. In a cross section parallel to the stacking direction, a ratio of a total area of ​​an oxidized region in the dummy electrode to an area of ​​the dummy electrode is 20% or less. The multilayer electronic component according to claim 1 or 2.

11. The device further includes four external electrodes at four corners of a main body portion including the effective portion and the cover portion when viewed in a plan view. The multilayer electronic component according to claim 1 or 2.

Images