Electronic equipment

Abstract

To provide electronic equipment that can simplify the structure of heat sinks and effectively dissipate heat generating components.SOLUTION: Electronic equipment S100 comprises: a substrate 10 on which heat generating components 70 that generate heat when energized are mounted; a heat dissipating member 30 to dissipate heat from the heat generating components 70; a chassis 20 with bosses 23 formed to support the substrate 10; the bosses 23; and a coil spring 40 that is an elastic member provided between the substrate 10 and the side opposite the side on which the heat generating components 70 are mounted, and the substrate 10 is pressed toward the heat dissipating member 30 by the coil spring 40.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] Conventionally, a configuration in which a heat sink is biased against a substrate by a spring has been known (see, for example, Patent Document 1). In this configuration, a coil spring is provided on a rod-shaped member that extends through the heat sink.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The configuration of Patent Document 1 is a configuration in which a rod-shaped member is passed through the heat sink, and since it is necessary to form a through hole in a part of the heat sink, the shape of the heat sink becomes complicated, and there is a problem that the heat sink cannot be miniaturized.

[0005] Therefore, the present invention has been made in view of the above points, and an object thereof is to provide an electronic device capable of simplifying the structure of a heat sink and effectively dissipating heat from a heat-generating component.

Means for Solving the Problems

[0006] An electronic device according to one embodiment of the present invention includes a substrate on which a heat-generating component that generates heat when energized is mounted, a heat-dissipating member that dissipates heat from the heat-generating component, a chassis in which a boss for supporting the substrate is formed, and an elastic member provided between the boss and a surface of the substrate opposite to the surface on which the heat-generating component is mounted, and the substrate is pressed against the heat-dissipating member side by the elastic member.

[0007] The boss has a guide pin that extends in the axial direction of the boss and is inserted into a through hole formed in the substrate, and the elastic member may be a coil spring provided at a portion of the guide pin.

[0008] The substrate has a first region including a portion where the heat-generating component is mounted and a second region adjacent to the first region where the heat-generating component is not mounted, and in each of the first region and the second region, the substrate is pressed toward the heat dissipation member by the elastic member, and a spacer member that defines a distance between the substrate and the heat dissipation member may be provided in the second region.

[0009] The spacer member may be a protruding portion formed on a part of the heat dissipation member.

Advantages of the Invention

[0010] According to the present invention, there is an effect that the structure of the heat sink can be simplified and an electronic device capable of effectively dissipating heat from a heat-generating component can be provided.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the appearance of an electric device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the electronic device of FIG. 1. FIG. 3 is a cross-sectional view showing an enlarged part of FIG. 2.

[0013] As shown in FIG. 2, the electronic device S100 of this embodiment includes a substrate 10, a chassis 20, a heat dissipation member 30, and a coil spring 40.

[0014] The substrate 10 is a printed circuit board, and heat-generating components 70 are mounted on the upper surface. The heat-generating components 70 are components that generate heat when energized, such as integrated circuits. The heat-generating components 70 are in contact with the heat dissipation member 30 via a heat-conductive material 71. As shown in FIG. 2, the substrate 10 includes a first region 11 and a second region 12. The first region 11 is a region including the portion where the heat-generating components 70 are mounted. The second region 12 is a region adjacent to the first region 11 and on the side where the heat-generating components 70 are not mounted.

[0015] As shown in FIG. 2, the chassis 20 has a bottom surface 21 and a peripheral wall 22. As an example, the chassis 20 is a resin component in which the bottom surface 21 and the peripheral wall 22 are integrally formed.

[0016] A plurality of bosses 23 for supporting the substrate 10 are formed on the bottom surface 21. Specifically, bosses 23a and 23b are provided in the region corresponding to the first region 11, and bosses 23c and 23d are provided in the region corresponding to the second region 12. The specific structure in which the bosses 23 support the substrate 10 will be described later.

[0017] The heat dissipation member 30 is a heat sink for releasing the heat of the heat-generating components 70. The heat dissipation member 30 is made of metal and has a main body portion 31 and a fin portion 32. The main body portion 31 is formed to a size that covers the chassis 20 from the upper surface side. A plurality of fins are formed on the fin portion 32.

[0018] (Support structure of the substrate) The coil spring 40 is an elastic member in the present invention and is provided between the substrate 10 and the boss 23 as shown in FIG. 3. Specifically, the coil spring 40 is disposed on the surface of the substrate 10 opposite to the surface on which the heat generating component 70 is mounted. More specifically, the coil spring 40 is provided on the portion of the guide pin 24 of the boss 23. The guide pin 24 is a round bar-shaped portion extending in the axial direction of the boss 23, and the tip end side thereof is inserted into the through hole 10h formed in the substrate 10. The guide pin 24 may be provided by inserting a rod-shaped member into a hole of the boss 23, or may be provided integrally with the boss 23 as a part of the boss 23.

[0019] In the assembled state of the electronic device S100 (FIG. 3), the coil spring 40 is compressed between the upper surface of the boss 23 and the lower surface of the substrate 10. With such a configuration, the substrate 10 is pressed against the heat radiating member 30 side by the elastic force from the coil spring 40. As a result, the heat generating component 70 is in good contact with the contact surface 31a of the heat radiating member 30, and the heat dissipation performance is improved.

[0020] In the electronic device S100 of the present embodiment, since the coil spring 40 is not attached to the heat radiating member 30, the structure of the heat radiating member 30 does not become complicated. Further, in the configuration of the present embodiment, the coil spring 40 is fitted onto the guide pin 24, and the coil spring 40 is supported between the boss 23 and the substrate 10. According to such a configuration, for example, compared with a structure in which a fixing screw is screwed into the boss 23 from the side opposite to the boss 23 (the upper surface side in FIG. 3) with the substrate 10 interposed therebetween and the coil spring 40 is provided on the shaft portion of this fixing screw, the number of parts is reduced and the assembly work can also be simplified.

[0021] Further, according to such a configuration, since the contact area between the guide pin 24 and the substrate 10 is small, heat from the heat generating component 70 is less likely to be transmitted to the chassis 20 side via the substrate 10 and the boss 23. Therefore, such a configuration is particularly preferable in the case of the electronic device S100 that needs to suppress the temperature rise of the chassis 20.

[0022] (Structure for preventing deformation of the substrate 10) As shown in FIG. 2, in the second region 12 of the substrate 10, a coil spring 40 is disposed on the lower surface side of the substrate 10, while no heat generating component 70 is mounted on the upper surface of the substrate 10. In such a configuration, the substrate 10 may be pushed toward the heat radiating member 30 by the elastic force of the coil spring 40, and the substrate 10 may be deformed. Therefore, in the electronic device S100 of the present embodiment, a spacer member 25 is provided.

[0023] The spacer member 25 is disposed between the substrate 10 and the heat radiating member 30 in the second region 12 of the substrate 10. The spacer member 25 is a spacer that defines the distance between the substrate 10 and the heat radiating member 30, and has, for example, the same height dimension as the distance between the substrate 10 and the heat radiating member 30. The spacer member 25 is, for example, a protruding portion such as a rib or a boss extending from the heat radiating member 30 toward the substrate 10. The spacer member 25 does not need to be a part of the heat radiating member 30, and may be a member provided separately from the heat radiating member 30 and disposed between the substrate 10 and the heat radiating member 30.

[0024] In this way, since the spacer member 25 that defines the distance between the substrate 10 and the heat radiating member 30 is provided, even if the elastic force of the coil spring 40 is applied to the lower surface side of the substrate 10, the substrate 10 is prevented from deforming toward the heat radiating member 30.

[0025] (Effect of the electronic device S100) As described above, in the electronic device S100 of the present embodiment, since the substrate 10 is urged by the coil spring 40 provided between the boss 23 and the substrate 10 to press the heat generating component 70 against the heat radiating member 30, it is not necessary to provide the coil spring 40 or the like on the heat radiating member 30, and the structure of the heat radiating member 30 is not complicated. Further, since the heat generating component 70 can be satisfactorily brought into close contact with the heat radiating member 30 by the coil spring 40, the heat generating component can be effectively cooled.

[0026] <Modification example> FIG. 4 is a cross-sectional view showing a modification of the electronic device according to an embodiment of the present invention. The electronic device S101 in FIG. 4 includes a first substrate 10-1 and a second substrate 10-2. Since other structures are the same as those in the above-described embodiment, the structures having the same functions are denoted by the same reference numerals, and redundant descriptions are omitted.

[0027] Similar to the substrate 10 in FIG. 2, the first substrate 10-1 has heat-generating components 70 mounted thereon and is pressed against the heat-radiating member 30 side by a plurality of coil springs 40.

[0028] The second substrate 10-2 is a substrate on which no heat-generating components 70 are mounted and is fixed by a boss 23A. The coil spring 40 is not provided on the boss 23A, and the second substrate 10-2 is arranged at a height different from that of the first substrate 10-1. The first substrate 10-1 and the second substrate 10-2 are connected to each other by a flexible substrate 17.

[0029] Since the first substrate 10-1 is pressed against the heat-radiating member 30 side by the coil spring 40, similar to the above-described embodiment, the heat-generating components 70 can be brought into good contact with the heat-radiating member 30, and heat can be effectively radiated.

[0030] As described above, the present invention has been described using embodiments. However, the technical scope of the present invention is not limited to the scope described in the above embodiments, and various modifications and changes are possible within the scope of the gist. For example, all or part of the device can be functionally or physically distributed and integrated in any unit. Also, new embodiments resulting from any combination of a plurality of embodiments are included in the embodiments of the present invention. The effects of the new embodiments resulting from the combination have the effects of the original embodiments combined.

Description of Reference Numerals

[0031] 10 Substrate 10-1 First Substrate 10-2 Second Substrate 10h Through-Hole 11 First Region 12 Second Region 17 Flexible substrate 20 Chassis 21 Bottom surface 22 Peripheral wall 23 Boss 23a Boss 23b Boss 23c Boss 23d Boss 24 Guide pin 25 Spacer member 30 Heat dissipation member 31 Main body part 31a Contact surface 32 Fin part 40 Coil spring 70 Heat generating component 71 Heat conductive material S100 Electronic device S101 Electronic device

Claims

1. A substrate on which a heat-generating component that generates heat when energized is mounted; A heat dissipation member that dissipates the heat of the heat-generating component; A chassis in which bosses for supporting the substrate are formed; An elastic member provided between the boss and the surface of the substrate opposite to the surface on which the heat-generating component is mounted; Comprising; The substrate is pressed against the heat dissipation member side by the elastic member, An electronic device.

2. The boss has a guide pin that extends in the axial direction of the boss and is inserted into a through hole formed in the substrate, The elastic member is a coil spring provided at a portion of the guide pin, The electronic device according to Claim 1.

3. The substrate is, A first region including the portion where the heat-generating component is mounted; A second region adjacent to the first region and where the heat-generating component is not mounted; Having; In each of the first region and the second region, the substrate is pressed against the heat dissipation member side by the elastic member, In the second region, a spacer member that defines the distance between the substrate and the heat dissipation member is provided, The electronic device according to Claim 1 or 2.

4. The spacer member is, A protruding portion formed on a part of the heat dissipation member, the electronic device according to Claim 3.

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