Vapor deposition device

Abstract

To provide a vapor deposition device that can solve a problem of wafer breakage caused by the high elastic modulus of an elastic components in the prior art.SOLUTION: A vapor deposition device 1000 includes a base, a plurality of mounting bodies 2, a plurality of fixing members 3, and a plurality of clamping mechanisms 4, and the mounting bodies are detachably arranged on the base. The fixing members are arranged corresponding to the center positions of the mounting bodies, and penetrate the base to fix the mounting bodies. The clamping mechanisms are arranged on the mounting bodies, and when a wafer is held by each mounting body and clamped by each clamping mechanism, the wafer is clamped and fixed between a part of each mounting body and the clamping mechanism.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a vapor deposition apparatus, and more particularly to a vapor deposition apparatus in which a placement member for holding a wafer is fixed by a fixing member and the placement member has a recessed space.

Background Art

[0002] The vapor deposition process is a semiconductor process technology for depositing a thin film material on the surface of a wafer. In the vapor deposition process, a vapor deposition apparatus such as a vapor deposition pot is mainly used. The function of the vapor deposition pot is to accommodate a solid metal or other vapor deposition material for vapor deposition. The vapor deposition process is usually carried out in a vacuum environment. The vapor deposition pot is heated to evaporate the vapor deposition material therein. In chemical vapor deposition (CVD) or physical vapor deposition (PVD), vapor is generated when the vapor deposition material evaporates. The thin film material is deposited on the surface of the wafer or other substrate as atoms or molecules to form a desired thin film layer. By the way, at present when the demand for silicon wafers is increasing in many industries, how to improve the stability of the wafers and the product yield is one of the most important research topics.

[0003] In a general vapor deposition apparatus, usually, a dedicated placement member and a rotating base are used. A plurality of placement members are provided on the rotating base. These placement members are mainly used to hold the wafers and are arranged in the vapor deposition apparatus. However, such a conventional vapor deposition apparatus also has unavoidable drawbacks. First, in the conventional vapor deposition process, since the elastic component of the vapor deposition apparatus needs to sandwich the wafer and the placement member at the same time, it has a large elastic coefficient. As a result, a force is applied to the thin wafer by the elastic component, and cracks are likely to occur on the surface of the wafer. In addition, in the vapor deposition process, when the rotating base vibrates, the wafer and the placement member rub against each other, which may damage the surface of the wafer and have an adverse effect on the appearance yield of the product.

[0004] In view of the above circumstances, the present invention proposes a vapor deposition apparatus that can solve the problem of wafer breakage caused by the high elastic coefficient of the elastic component in the prior art.

Summary of the Invention

[0005] An object of the present invention is to provide a vapor deposition apparatus capable of reducing the possibility of wafer breakage during the vapor deposition process and reducing the contact between the wafer and the placement body. In the present invention, a placement body for holding a wafer is fixed to a base by a fixing member. Since the placement body is fixed by the fixing member, the elastic member does not require a high elastic coefficient to sandwich the wafer. According to this structure, cracks due to external forces are less likely to occur in the wafer, particularly a thin wafer. On the other hand, a recessed space is provided at the center of the placement body, and a plurality of convex portions are provided on the outer periphery of the placement body. With the above design, the contact area between the wafer and the placement body can be significantly reduced, the friction between the wafer and the placement body in the vapor deposition process can be reduced, the possibility of scratching the wafer surface can be reduced, and the appearance yield of the wafer can be improved.

[0006] To achieve the above object, the present invention discloses a vapor deposition apparatus including a base, a plurality of placement bodies, a plurality of fixing members, and a plurality of clamping mechanisms. The placement body is detachably arranged on the base. Each of the fixing members is arranged corresponding to the center position of each of the placement bodies. The fixing member penetrates the base to fix the placement body. The clamping mechanism is arranged on the placement body. When the wafer is held by each of the placement bodies and clamped by each of the clamping mechanisms, the wafer is clamped and fixed between a part of each of the placement bodies and the clamping mechanism.

[0007] In an embodiment of the present invention, each of the placement bodies has a main body and a plurality of convex portions formed on the outer periphery of the main body and contacting the wafer.

[0008] In an embodiment of the present invention, the main body has a first surface and a second surface, a first height difference exists between the convex portion and the first surface, and a second height difference exists between the first surface and the second surface.

[0009] In an embodiment of the present invention, the first surface and the second surface define a recessed space.

[0010] In an embodiment of the present invention, the clamping mechanism has elasticity and is vertically arranged at a position corresponding to the convex portion on the main body.

[0011] In an embodiment of the present invention, the clamping mechanism includes at least one first elastic member fixedly arranged on the main body and at least one second elastic member detachably arranged on the main body.

[0012] In an embodiment of the present invention, the number of the first elastic member and the second elastic member in the clamping mechanism is at least two respectively.

[0013] In an embodiment of the present invention, the base has a plurality of holes and a plurality of support pieces. The holes are formed on both sides of each support piece, and the support piece and the placement body are connected by the fixing member.

[0014] In an embodiment of the present invention, when the wafer is clamped and fixed by a part of each placement body and the clamping mechanism, the wafer comes into contact with the convex portion and the clamping mechanism simultaneously, and does not contact the first surface and the second surface.

[0015] In an embodiment of the present invention, the base is rotatable.

[0016] Those skilled in the art can understand other objects of the present invention, as well as the technical means and embodiments of the present invention, by referring to the drawings and the embodiments described below.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

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Mode for Carrying Out the Invention

[0018] Hereinafter, the content of the present invention will be described through examples. It should be noted that the examples of the present invention are examples of embodiments and are not intended to be limited to the environments, applications, or specific aspects as described in the examples. Therefore, the description of the examples is for explaining the present invention, but does not limit the present invention. In the embodiments and the drawings, components not directly related to the present invention are omitted and not shown. The dimensional relationships of the components in the drawings are for easy understanding and do not limit the actual dimensions.

[0019] This will be described with reference to FIGS. 1 to 3. FIGS. 1 and 2 are a front view and a rear view, respectively, showing the mounting body 2 of the vapor deposition apparatus 1000 according to the present invention. FIG. 3 is a partial cross-sectional view of the vapor deposition apparatus 1000 according to the present invention. The vapor deposition apparatus 1000 is a device that holds a plurality of wafers 2000 and performs a vapor deposition process on the wafers 2000. As shown in FIG. 6, in an embodiment of the present invention, the vapor deposition apparatus 1000 includes a base 1, a plurality of mounting bodies 2, a plurality of fixing members 3, and a plurality of clamping mechanisms 4. The mounting body 2 is detachably arranged on the base 1. The mounting body 2 holds the wafer 2000. The fixing member 3 and the clamping mechanism 4 are arranged corresponding to each mounting body 2.

[0020] The base 1 will be described with reference to FIGS. 4 and 5. FIG. 4 is a front view showing the vapor deposition apparatus 1000 according to an embodiment of the present invention. FIG. 5 is a rear view showing the vapor deposition apparatus 1000 according to an embodiment of the present invention. The base 1 has a plurality of holes 11 and a plurality of support pieces 12. The holes 11 are formed on both sides of each support piece 12. Each support piece 12 is provided with a lock hole. Each fixing member 3 fixes each placement body 2 to each support piece 12 through the lock hole. In this embodiment, when the wafer 2000 is held by the placement body 2, the user installs the clamping mechanism 4 on the placement body 2 by using the space of the holes 11. Thereby, the wafer 2000 is clamped and fixed to the placement body 2. On the other hand, the user can loosen a part of the clamping mechanism 4 from the holes 11 and remove the wafer 2000 held by the placement body 2. Since the base 1 of the vapor deposition apparatus 1000 of the present invention is rotatable, the user can easily install and remove the wafer 2000.

[0021] The description will be made with reference to FIGS. 1 and 2. The carrier 2 has a main body 21 and four convex portions 22. The convex portions 22 are formed on the outer periphery of the main body 21 and contact the wafer 2000. Specifically, the main body 21 has a first surface 211 and a second surface 212. As shown in FIG. 3, the convex portions 22 are arranged on the first surface 211. There is a first height difference H1 between the convex portion 22 and the first surface 211. On the other hand, there is a second height difference H2 between the first surface 211 and the second surface 212. The first surface 211 and the second surface 212 define a recessed space S. As shown in FIG. 3, when the wafer 2000 is held by each carrier 2 and clamped by each clamping mechanism 4, the wafer 2000 is clamped and fixed between a part of each carrier 2 and the clamping mechanism 4. Further, the wafer 2000 is clamped and fixed between the convex portion 22 and the clamping mechanism 4 by the convex portion 22 and the recessed space S. In other words, the wafer 2000 is in contact with the convex portion 22 and the clamping mechanism 4 at the same time. The wafer 2000 does not contact the first surface 211 and the second surface 212. Different from the conventional vapor deposition apparatus, the present invention can reduce the contact area between the wafer 2000 and the carrier 2 and avoid scratches that may occur during the vapor deposition process. FIGS. 4 and 5 show the vapor deposition apparatus 1000 according to an embodiment of the present invention, and FIGS. 6 and 7 show the vapor deposition apparatus 1000 according to another embodiment of the present invention. The difference between the two is only the number of carriers 2 arranged on the base 1. The arrangement position and number of the carriers 2 can be adjusted according to the actual size of the wafer to be held, and are not limited thereto.

[0022] Next, the fixing member 3 and the clamping mechanism 4 will be described in detail. As shown in FIGS. 3 and 6, each fixing member 3 is arranged corresponding to the central position of each carrier 2. The fixing member 3 passes through the base 1 to fix the carrier 2. In this embodiment, the case where the fixing member 3 is a combination of a screw and a nut is exemplified. The user can replace it with other types of fixing members according to actual needs, and is not limited thereto. The carrier 2 is fixed to the base 1 by the fixing member 3. By this fixing method, the elastic coefficient of the clamping mechanism 4 for clamping the wafer 2000 can be reduced, and it is possible to avoid cracks from occurring in the thin wafer 2000 during clamping.

[0023] Further, the clamping mechanism 4 has elasticity and is vertically arranged at a position corresponding to the convex portion 22 on the main body 21. Specifically, the clamping mechanism 4 has at least one first elastic member 41 and at least one second elastic member 42. The first elastic member 41 is fixedly arranged on the main body 21. The second elastic member 42 is detachably arranged on the main body 21. In this embodiment, the number of the first elastic member 41 and the second elastic member 42 in each clamping mechanism 4 is at least two respectively. Preferably, the number of the first elastic member 41 and the second elastic member 42 is two respectively. In this way, the wafer 2000 can be fixed to the convex portion 22 of the placement body 2 with four-corner positioning. Specifically, in this embodiment, the first elastic member 41 and the second elastic member 42 are the same spring member. As shown in FIG. 6, the first elastic member 41 is fixedly arranged at a position facing the outer periphery of the base 1 on the placement body 2. The second elastic member 42 is detachably arranged at a position facing the inner periphery of the base 1 on the placement body 2. Further, the procedure for clamping the wafer 2000 using the clamping mechanism 4 includes the following steps. First, the first elastic member 41 is fixedly installed. Next, a part of the wafer 2000 is clamped by the first elastic member 41 and a part of the convex portion 22. Finally, the wafer 2000 is clamped by the detachable second elastic member 42 and the other convex portion 22 of the placement body 2. On the other hand, when it is desired to take out the wafer 2000, the wafer 2000 is taken out after removing the second elastic member 42.

[0024] As described above, the vapor deposition apparatus according to the present invention includes a base, a placement body, a fixing member, and a clamping mechanism. Different from the conventional vapor deposition apparatus, in the present invention, since each placement body is fixed to the base by a corresponding fixing member, it is not necessary to use an elastic component having a high elastic coefficient to clamp the placement body and the wafer. Further, by providing a recessed space in the placement body and contacting and supporting the wafer with the convex portion provided on the placement body, the contact area between the wafer and the placement body can be significantly reduced. Thereby, the possibility of scratches and cracks occurring on the wafer during the vapor deposition process can be reduced, and the appearance yield of the wafer can be improved.

[0025] The above embodiments illustrate the embodiments of the present invention and explain the characteristic configurations of the present invention. The present invention is not limited to the above embodiments. Modifications or equivalent arrangements that can be easily made by those skilled in the art are also within the scope of the present invention. The scope of protection of the rights of the present invention shall be based on the scope of the claims.

Explanation of Reference Numerals

[0026] 1000 Evaporation apparatus 2000 Wafer 1 Base 11 Hole portion 12 Support piece 2 Mounting body 21 Main body 211 First surface 212 Second surface 22 Protrusion 3 Fixing member 4 Clamping mechanism 41 First elastic member 42 Second elastic member H1 First height difference H2 Second height difference S Recessed space

Claims

1. 1. A deposition apparatus comprising: With the base, A plurality of mounting bodies detachably disposed on the base; a plurality of fixing members disposed corresponding to central positions of the respective mounting bodies and penetrating the base to fix the mounting bodies; A plurality of clamping mechanisms are disposed on the mounting body, a deposition apparatus, wherein when a wafer is held on each of the holders and clamped by each of the clamping mechanisms, the wafer is clamped and fixed between a part of each of the holders and the clamping mechanisms.

2. 2. The deposition apparatus according to claim 1, wherein each of the holders has a main body and a plurality of protrusions formed on an outer periphery of the main body and adapted to come into contact with the wafer.

3. 3. The deposition apparatus of claim 2, wherein the main body has a first surface and a second surface, a first height difference exists between the convex portion and the first surface, and a second height difference exists between the first surface and the second surface.

4. 4. The deposition apparatus of claim 3, wherein the first surface and the second surface define a recessed space.

5. The deposition apparatus according to claim 2 , wherein the clamping mechanism has elasticity and is disposed vertically at a position on the main body corresponding to the protrusion.

6. 3. The deposition device according to claim 2, wherein the clamping mechanism includes at least one first elastic member fixedly arranged on the main body, and at least one second elastic member detachably arranged on the main body.

7. The deposition apparatus according to claim 6 , wherein the number of the first elastic members and the number of the second elastic members in the clamping mechanism are at least two each.

8. 2. The deposition device according to claim 1, wherein the base has a plurality of holes and a plurality of support pieces, the holes being formed on both sides of each of the support pieces, and the support pieces and the mounting body are connected by the fixing member.

9. 4. The deposition apparatus according to claim 3, wherein when the wafer is clamped and fixed between a portion of each of the holders and the clamping mechanism, the wafer contacts the convex portion and the clamping mechanism simultaneously, but does not contact the first surface or the second surface.

10. The deposition apparatus according to claim 1 , wherein the base is rotatable.

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