Printed circuit board and method for manufacturing the same

Abstract

To provide a printed circuit board and a method for manufacturing the same, which can prevent recesses from being generated on the surface of the metal post and prevent alignment errors between the pad section and the metal post.SOLUTION: A printed circuit board according to the example can include an insulating layer, a wiring layer positioned in the insulating layer, a protective layer positioned above the insulating layer, a connection part including a first portion positioned within the insulating layer and the protective layer and a second portion protruding above the protective layer, and a connection part including a protective pattern positioned between the first portion of the connection part, and the protective layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a printed circuit board and a method for manufacturing the same.

Background Art

[0002] Electronic devices in the IT field such as mobile phones have been miniaturized, and the size of metal posts formed on printed circuit boards on which electronic components are mounted has also become smaller.

[0003] When forming metal posts so as to overlap with the pad portions of the printed circuit board after forming all of the plurality of wiring layers in the printed circuit board, the heat generated when forming the plurality of wiring layers may distort the positions and thicknesses of the pad portions of the printed circuit board, and an alignment error between the pad portions and the metal posts may occur.

[0004] On the other hand, when recesses or the like are generated on the surface of the metal posts, the bonding force between the printed circuit board and the electronic components may decrease.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An embodiment aims to provide a printed circuit board and a method for manufacturing the same that can prevent recesses from occurring on the surface of metal posts and prevent alignment errors between pad portions and metal posts.

[0006] However, the problems to be solved by the embodiment are not limited to the above-described problems, and can be variously extended within the scope of the technical idea included in the embodiment.

[0007] The printed circuit board according to the embodiment may include an insulating layer, a wiring layer located within the insulating layer, a protective layer located on the insulating layer, a connecting portion including a first portion located within the insulating layer and the protective layer, and a second portion protruding above the protective layer, and a protective pattern located between the first portion of the connecting portion and the protective layer.

[0008] The first portion of the connecting portion may include a pad portion located in the insulating layer and a first connecting portion located in the protective layer.

[0009] The pad portion and the first connecting portion can be directly connected.

[0010] The first connecting portion and the second portion can be integrally formed.

[0011] The connecting portion and the protective pattern can include different metals from each other.

[0012] The thickness of the protective pattern may be thinner than the thickness of the pad portion of the connecting portion and the thickness of the first connecting portion of the connecting portion.

[0013] The wiring layer can include a first wiring layer and a second wiring layer located on the first wiring layer.

[0014] The first wiring layer can include the same metal as the connecting portion.

[0015] The second wiring layer can include the same metal as the protective pattern.

[0016] The thickness of the second wiring layer may be thinner than the thickness of the first wiring layer.

[0017] Along the height direction, the first width of the second portion may be substantially constant.

[0018] Along the plane direction parallel to the surface of the insulating layer, the first width of the second portion and the second width of the first connecting portion can be different from each other.

[0019] Along the height direction, the second width of the first connecting portion may be substantially constant.

[0020] Along the planar direction, the first width of the second portion and the second width of the first connecting portion may be substantially the same as each other.

[0021] The method for manufacturing a printed circuit board according to an embodiment includes the steps of forming a dummy insulating layer having a first hole, laminating a protective layer on the dummy insulating layer, forming a second hole overlapping the first hole in the protective layer, laminating a protective metal layer on the protective layer and within the first hole and the second hole, integrally forming a first connecting portion and a second connecting portion within the first hole and the second hole covered by the protective metal layer, forming a pad portion and a wiring layer on the protective metal layer, removing the dummy insulating layer to expose the protective metal layer located on the second connecting portion, and removing the protective metal layer on the second connecting portion to form a protective pattern located between the pad portion, the first connecting portion, and the protective layer.

[0022] According to an embodiment, it is possible to provide a printed circuit board and a method for manufacturing the same that can prevent recesses from occurring on the surface of a metal post and prevent alignment errors between a pad portion and the metal post.

[0023] However, it is obvious that the effects of the embodiments are not limited to the above-described effects and can be variously extended without departing from the spirit and scope of the present invention.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

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Figure 4

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Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Mode for Carrying Out the Invention

[0025] Hereinafter, with reference to the accompanying drawings, various embodiments of the present invention will be described in detail so that those skilled in the art can easily implement them in the technical field to which the present invention pertains. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0026] To clearly explain the present invention, parts not related to the explanation are omitted, and the same reference numerals are used for the same or similar components throughout the specification.

[0027] In addition, the attached drawings are for the purpose of facilitating the understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings. It should be understood that the drawings include all modifications, equivalents, or alternatives included in the idea and technical scope of the present invention.

[0028] Also, the sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to what is shown in the drawings. In the drawings, the thickness is enlarged to clearly represent a plurality of layers and regions. And, in the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.

[0029] Also, when a part such as a layer, film, region, or plate is "on" or "above" another part, this includes not only the case where it is "directly above" the other part but also the case where there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in between. Also, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being "up" or "above" in the direction opposite to gravity.

[0030] Also, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0031] Throughout the specification, "on a plane" means when the target part is viewed from above, and "in a cross-section" means when the cross-section obtained by vertically cutting the target part is viewed from the side.

[0032] Throughout the specification, "connected" does not only mean that two or more components are directly connected, but also means that two or more components are indirectly connected through other components, not only physically connected but also electrically connected, or can mean that they are integrated although called by different names according to their positions and functions.

[0033] Hereinafter, with reference to the drawings, various embodiments and modifications will be described in detail.

[0034] Referring to FIG. 1, a printed circuit board 100 according to an embodiment will be described. FIG. 1 is a cross-sectional view of a printed circuit board according to an embodiment.

[0035] Referring to FIG. 1, the printed circuit board 100 according to this embodiment can include an insulating layer (IL), a protective layer (CL) located on the insulating layer (IL), a plurality of wiring layers (ML) located in the insulating layer (IL), and a connecting portion (PL) that is partially located in the insulating layer (IL) and the protective layer (CL) and includes a portion protruding from the protective layer (CL).

[0036] The insulating layer (IL) and the protective layer (CL) can include different insulating materials. For example, the protective layer (CL) can include a multilayer including a PET film, a resin composition, and an OPP film, and the protective layer (CL) may be an ABF (Ajinomoto Build-up Film), but the embodiment is not limited thereto.

[0037] The plurality of wiring layers (ML) can include a first wiring layer (ML1) located within the insulating layer (IL) and a second wiring layer (MLA) located on the first wiring layer (ML1). The second wiring layer (MLA) can be in contact with the protective layer (CL). Along the height direction (DRH) perpendicular to the planar direction (DRW) parallel to the surface of the protective layer (CL), the thickness of the second wiring layer (MLA) can be thinner than the thickness of the first wiring layer (ML1).

[0038] The first wiring layer (ML1) and the second wiring layer (MLA) can include different metal layers. For example, the first wiring layer (ML1) can include copper, and the second wiring layer (MLA) can include nickel. However, the embodiments are not limited thereto.

[0039] The connection part (PL) can include a pad part (PL1) located within the insulating layer (IL), a first connection part (PL2) located on the pad part (PL1) and within the protective layer (CL), and a second connection part (PL3) located on the first connection part (PL2) and protruding above the protective layer (CL).

[0040] The protection pattern (PLA) can be located between the connection part (PL) and the protective layer (CL). More specifically, the protection pattern (PLA) can include a protection pattern (PLA) located between the pad part (PL1) and the protective layer (CL) and between the first connection part (PL2) and the protective layer (CL).

[0041] Along the height direction (DRH), the thickness of the protection pattern (PLA) can also be thinner than the thickness of the pad part (PL1), the thickness of the first connection part (PL2), and the thickness of the second connection part (PL3).

[0042] The pad part (PL1) of the connection part (PL) can include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) can include the same metal as the second wiring layer (MLA).

[0043] The first connecting portion (PL2) and the second connecting portion (PL3) of the connecting portion (PL) can contain the same metal as the pad portion (PL1) of the connecting portion (PL).

[0044] The pad portion (PL1) of the connecting portion (PL) can be directly connected to the first connecting portion (PL2) of the connecting portion (PL), and the second connecting portion (PL3) of the connecting portion (PL) can be directly connected to the first connecting portion (PL2) of the connecting portion (PL).

[0045] Along the height direction (DRH), the width of the first connecting portion (PL2) of the connecting portion (PL) can become wider towards the lower side and narrower towards the upper side. Therefore, the connection between the pad portion (PL1) of the connecting portion (PL) and the first connecting portion (PL2) of the connecting portion (PL) can be stably made.

[0046] Along the height direction (DRH), the width of the second connecting portion (PL3) of the connecting portion (PL) can be substantially constant.

[0047] By directly connecting the pad portion (PL1) of the connecting portion (PL) and the first connecting portion (PL2) of the connecting portion (PL) without an intermediate layer such as a seed layer in between, the connection characteristics between the pad portion (PL1) of the connecting portion (PL) and the first and second connecting portions (PL2, PL3) of the connecting portion (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0048] The protection pattern (PLA) is located between the pad portion (PL1) and the protection layer (CL), and between the first connecting portion (PL2) and the protection layer (CL). By protecting the second connecting portion (PL3) of the connecting portion (PL) during the manufacturing process, it is possible to prevent depressions or the like from occurring on the surface of the second connecting portion (PL3) of the connecting portion (PL) that protrudes above the protection layer (CL), thereby preventing a deterioration in the contact characteristics between the connecting portion (PL) and external electronic components.

[0049] In the illustrated embodiment, although it has been shown that the first connecting portion (PL2) and the second connecting portion (PL3) of the connecting portion (PL) are located above the central portion of the pad portion (PL1) of the connecting portion (PL), the embodiment is not limited thereto, and the embodiment can include all cases where the first connecting portion (PL2) and the second connecting portion (PL3) of the connecting portion (PL) are located on the pad portion (PL1) of the connecting portion (PL).

[0050] Although not shown, according to another embodiment, it can further include vias connected to at least one of the plurality of wiring layers (ML) within the insulating layer (IL), can further include an additional insulating layer located on the insulating layer (IL), can further include additional vias located within the additional insulating layer, and can further include an additional wiring layer embedded within the additional insulating layer.

[0051] Hereinafter, with reference to FIGS. 2 to 16 together with FIG. 1, a method for manufacturing a printed circuit board according to an embodiment will be described. FIGS. 2 to 16 are cross-sectional views showing a method for manufacturing a printed circuit board according to an embodiment.

[0052] Referring to FIG. 2, a copper foil layer (MS) and a dummy pattern (DS) can be formed on a carrier substrate (CS) including a core portion (CL) and a thin film metal layer (TC) laminated on both sides of the core portion (CP).

[0053] The dummy pattern (DS) can be formed at a position where the second connecting portion (PL3) of the connecting portion (PL) is formed.

[0054] The dummy pattern (DS) can contain a photosensitive substance. The dummy pattern (DS) may be a dry film, but the embodiment is not limited thereto.

[0055] Referring to FIG. 3, a dummy layer (DP) can be laminated on the dummy pattern (DS), the dummy pattern (DS) can be removed, and a first via (HL1) can be formed in the dummy layer (DP). The first via (HL1) of the dummy layer (DP) can be formed in a portion where the dummy pattern (DS) has been removed.

[0056] The dummy layer (DP) can contain the same metal as the copper foil layer (MS). For example, the copper foil layer (MS) and the dummy layer (DP) can contain copper, but the embodiments are not limited thereto. The dummy layer (DP) may be formed by plating from the copper foil layer (MS), but the embodiments are not limited thereto.

[0057] According to other embodiments, the dummy layer (DP) can contain an insulating material. When the dummy layer (DP) contains an insulating material, the protective insulating layer (CLA) and the etching conditions described later can contain insulating materials that are different from each other.

[0058] Referring to FIG. 4, a protective insulating layer (CLA) can be laminated on the dummy layer (DP) including the first hole (HL1). The protective insulating layer (CLA) can be formed inside the first hole (HL1) and on the dummy layer (DP).

[0059] Referring to FIG. 5, a second hole (HL2) overlapping the first hole (HL1) is formed in the protective insulating layer (CLA), the copper foil layer (MS) overlapping the first hole (HL1) and the second hole (HL2) is removed, and a third hole (HL3) can be formed in the copper foil layer (MS). The protective insulating layer (CLA) having the second hole (HL2) can be used as the protective layer (CL).

[0060] Referring to FIG. 6, a first metal layer (PS) can be laminated on the protective layer (CL) and inside the first hole (HL1), the second hole (HL2), and the third hole (HL3). The thickness of the first metal layer (PS) can also be thinner than the thicknesses of the dummy layer (DP) and the protective layer (CL).

[0061] Referring to FIG. 7, a second metal layer (PLS) can be laminated on the first metal layer (PS). The second metal layer (PLS) can be formed on the first metal layer (PS) located on the protective layer (CL) and inside the first hole (HL1), the second hole (HL2), and the third hole (HL3) covered by the first metal layer (PS).

[0062] The second metal layer (PLS) can include a metal different from the first metal layer (PS). The second metal layer (PLS) can include copper, and the first metal layer (PS) can include nickel. However, the embodiments are not limited thereto.

[0063] Referring to FIG. 8, a portion of the second metal layer (PLS) located on the first metal layer (PS) located on the protective layer (CL) is removed, leaving the portions located within the first hole (HL1), the second hole (HL2), and the third hole (HL3) covered by the first metal layer (PS), and a connection pattern (PLP) can be formed within the first hole (HL1), the second hole (HL2), and the third hole (HL3).

[0064] The connection pattern (PLP) can correspond to the first connection portion (PL2) and the second connection portion (PL3).

[0065] Referring to FIG. 9, a photosensitive film (SR) having a first opening (HLA) and a second opening (HLB) can be formed on the first metal layer (PS) located on the protective layer (CL). The photosensitive film (SR) can include a photosensitive substance. For example, the photosensitive film (SR) can be a dry film, but the embodiments are not limited thereto.

[0066] The first opening (HLA) of the photosensitive film (SR) can overlap with the connection pattern (PLP) and can be formed at a position where the pad portion (PL1) is formed.

[0067] The second opening (HLB) of the photosensitive film (SR) can be formed at a position corresponding to the first wiring layer (ML1) of the plurality of wiring layers (ML).

[0068] Referring to FIG. 10, a third metal layer can be laminated within the first opening (HLA) and the second opening (HLB) of the photosensitive film (SR), a pad pattern (PLSA) can be formed within the first opening (HLA) of the photosensitive film (SR), and a wiring pattern (MLSA) can be formed within the second opening (HLB) of the photosensitive film (SR).

[0069] The pad pattern (PLSA) can correspond to the pad portion (PL1), and the wiring pattern (MLSA) can correspond to the first wiring layer (ML1).

[0070] Referring to FIG. 11, the photosensitive film (SR) can be removed.

[0071] Referring to FIG. 12, using the pad pattern (PLSA) and the wiring pattern (MLSA) as etching masks, the first metal layer (PS) is removed, a plurality of wiring layers (ML) including the first wiring layer (ML1) and the second wiring layer (MLA) are formed, and a dummy pattern (PLSB) that contacts the pad pattern (PLSA) and the connection pattern (PLP) can be formed.

[0072] Referring to FIG. 13, an insulating layer (IL) can be laminated on the plurality of wiring layers (ML) and the pad pattern (PLSA).

[0073] Although not shown, according to another embodiment, via holes and vias connected to at least one of the plurality of wiring layers (ML) can be formed in the insulating layer (IL), an additional insulating layer can be formed on the insulating layer (IL), additional via holes and vias can be formed in the additional insulating layer, and an additional wiring layer embedded in the additional insulating layer can be further formed.

[0074] Next, as shown in FIG. 14, the substrate portion (SUB) is peeled off from both sides of the carrier substrate (CS).

[0075] Hereinafter, one substrate portion (SUB) peeled off from the carrier substrate (CS) will be described.

[0076] Referring to FIG. 15, the copper foil layer (MS) and the dummy layer (DP) can be removed. By removing the copper foil layer (MS) and the dummy layer (DP), the dummy pattern (PLSB) located on the connection pattern (PLP) protruding from the protective layer (CL) can be exposed.

[0077] In the illustrated embodiment, both the copper foil layer (MS) and the dummy layer (DP) are removed. However, according to other embodiments, the copper foil layer (MS) and the dummy layer (DP) can also be removed separately.

[0078] According to other embodiments, the dummy layer (DP) may be an insulating layer instead of a metal layer. When the dummy layer (DP) is an insulating layer, the protective layer (CL) and the etching conditions may be different, and the dummy layer (DP) can be removed without removing the protective layer (CL).

[0079] Next, the dummy pattern (PLSB) located on the connection pattern (PLP) protruding from the protective layer (CL) can be removed to form the printed circuit board 100 shown in FIG. 1.

[0080] According to the method for manufacturing a printed circuit board according to the embodiment, by forming the pad pattern (PLSA) corresponding to the pad portion (PL1) directly above the connection pattern (PLP) corresponding to the first connection portion (PL2) and the second connection portion (PL3), the contact characteristics between the pad portion (PL1) and the first connection portion (PL2) and the second connection portion (PL3) can be enhanced.

[0081] According to the method for manufacturing a printed circuit board according to the embodiment, by covering and protecting with the dummy pattern (PLSB) during the formation of the pad portion (PL1) and the first connection portion (PL2) and the second connection portion (PL3), it is possible to prevent the occurrence of recesses or the like in the second connection portion (PL3) of the connection portion (PL) protruding from the protective layer (CL) during the manufacturing process, and it is possible to prevent the bonding force between the connection portion (PL) of the printed circuit board and the electronic component connected to the printed circuit board from decreasing.

[0082] According to the method for manufacturing a printed circuit board according to the embodiment, by forming the connection portions (PL) together during the formation of the plurality of wiring layers (ML) located in the insulating layer (IL), the occurrence of alignment errors between the pad portion and the connection portion of the printed circuit board can be reduced.

[0083] Referring to FIG. 16, a printed circuit board 101 according to another embodiment will be described. FIG. 16 is a cross-sectional view of a printed circuit board according to another embodiment.

[0084] Referring to FIG. 16, the printed circuit board 101 according to this embodiment is similar to the printed circuit board 100 according to the embodiment described above with reference to FIG. 1. Specific descriptions of the same components will be omitted.

[0085] Referring to FIG. 16, the printed circuit board 101 according to this embodiment can include an insulating layer (IL), a protective layer (CL) located on the insulating layer (IL), a plurality of wiring layers (ML) located within the insulating layer (IL), and a connection portion (PL) that is partially located within the insulating layer (IL) and the protective layer (CL) and includes a portion protruding from the protective layer (CL).

[0086] The plurality of wiring layers (ML) can include a first wiring layer (ML1) located within the insulating layer and a second wiring layer (MLA) located on the first wiring layer (ML1).

[0087] The connection portion (PL) can include a pad portion (PL1) located within the insulating layer (IL), a first connection portion (PL2) located on the pad portion (PL1) and within the protective layer (CL), and a second connection portion (PL3) located on the first connection portion (PL2) and protruding above the protective layer (CL).

[0088] The protection pattern (PLA) can be located between the connection portion (PL) and the protective layer (CL). More specifically, the protection pattern (PLA) can include protection patterns (PLA) located between the pad portion (PL1) and the protective layer (CL) and between the first connection portion (PL2) and the protective layer (CL).

[0089] The first wiring layer (ML1) and the second wiring layer (MLA) can include different metal layers. The pad portion (PL1) of the connection portion (PL) can include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) can include the same metal as the second wiring layer (MLA). For example, the first wiring layer (ML1) can include copper, and the second wiring layer (MLA) can include nickel. However, the embodiments are not limited thereto.

[0090] The pad portion (PL1) of the connection portion (PL) can be directly connected to the first connection portion (PL2) of the connection portion (PL), and the second connection portion (PL3) of the connection portion (PL) can be directly connected to the first connection portion (PL2) of the connection portion (PL).

[0091] The printed circuit board 101 according to this embodiment is different from the printed circuit board 100 according to the previously described embodiment. Along the planar direction (DRW), the first width (W1) of the second connection portion (PL3) of the connection portion (PL) can be made narrower than the narrowest width among the second widths (W2) of the first connection portion (PL2) of the connection portion (PL). The width of the first connection portion (PL2) of the connection portion (PL) located within the protective layer (CL) is wider than the second connection portion (PL3) of the connection portion (PL) protruding above the protective layer (CL). Even if an external force is applied to the second connection portion (PL3) of the connection portion (PL), the influence of the external force is diffused to the first connection portion (PL2) of the connection portion (PL) having a relatively wide width, preventing the stress caused by the external force from concentrating on the second connection portion (PL3) of the connection portion (PL), and preventing damage to the connection portion (PL) due to external stress.

[0092] According to this embodiment, similar to the previously described embodiment, by directly connecting the pad portion (PL1) of the connection portion (PL) and the first connection portion (PL2) of the connection portion (PL) without an intermediate layer such as a seed layer, the connection characteristics between the pad portion (PL1) of the connection portion (PL), the first connection portion (PL2), and the second connection portion (PL3) of the connection portion (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0093] Further, the protection pattern (PLA) is located between the pad portion (PL1) and the protection layer (CL), and between the first connection portion (PL2) and the protection layer (CL), and protects the second connection portion (PL3) of the connection portion (PL) during the manufacturing process, so that no recesses or the like are generated on the surface of the second connection portion (PL3) of the connection portion (PL) protruding on the protection layer (CL), thereby preventing a decrease in the contact characteristics between the connection portion (PL) and external electronic components.

[0094] Many features of the printed circuit board according to the previously described embodiments are all applicable to the printed circuit board according to this embodiment.

[0095] Referring to FIG. 17, a printed circuit board 102 according to another embodiment will be described. FIG. 17 is a cross-sectional view of a printed circuit board according to another embodiment.

[0096] Referring to FIG. 17, the printed circuit board 102 according to this embodiment is similar to the printed circuit boards 100 and 101 according to the previously described embodiments. Specific descriptions of the same components will be omitted.

[0097] Referring to FIG. 17, the printed circuit board 102 according to this embodiment can include an insulating layer (IL), a protection layer (CL) located on the insulating layer (IL), a plurality of wiring layers (ML) located within the insulating layer (IL), and a connection portion (PL) that is partially located within the insulating layer (IL) and the protection layer (CL) and includes a portion protruding from the protection layer (CL).

[0098] The plurality of wiring layers (ML) can include a first wiring layer (ML1) located within the insulating layer and a second wiring layer (MLA) located on the first wiring layer (ML1).

[0099] The connection portion (PL) can include a pad portion (PL1) located within the insulating layer (IL), a first connection portion (PL2) located on the pad portion (PL1) and within the protection layer (CL), and a second connection portion (PL3) located on the first connection portion (PL2) and protruding on the protection layer (CL).

[0100] The protection pattern (PLA) can be located between the connection part (PL) and the protection layer (CL). More specifically, the protection pattern (PLA) can include a protection pattern (PLA) located between the pad part (PL1) and the protection layer (CL) and between the first connection part (PL2) and the protection layer (CL).

[0101] The first wiring layer (ML1) and the second wiring layer (MLA) can include different metal layers. The pad part (PL1) of the connection part (PL) can include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) can include the same metal as the second wiring layer (MLA). For example, the first wiring layer (ML1) can include copper, and the second wiring layer (MLA) can include nickel. However, the embodiments are not limited to this.

[0102] The pad part (PL1) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL), and the second connection part (PL3) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL).

[0103] Different from the printed circuit boards 100 and 101 according to the previously described embodiments, in the printed circuit board 102 according to this embodiment, along the planar direction (DRW), the first width (W1) of the second connection part (PL3) of the connection part (PL) can be wider than the second width (W2) of the first connection part (PL2) of the connection part (PL). Even when the width of the first connection part (PL2) of the connection part (PL) located in the protection layer (CL) is narrow, the second connection part (PL3) of the connection part (PL) can be formed wider, and a decrease in the contact characteristics with external electronic components can be prevented.

[0104] According to this embodiment, similar to the previously described embodiments, by directly connecting the pad part (PL1) of the connection part (PL) and the first connection part (PL2) of the connection part (PL) without an intermediate layer such as a seed layer, the connection characteristics between the pad part (PL1) of the connection part (PL) and the first connection part (PL2) and the second connection part (PL3) of the connection part (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0105] Also, the protection pattern (PLA) is located between the pad portion (PL1) and the protection layer (CL), and between the first connection portion (PL2) and the protection layer (CL). By protecting the second connection portion (PL3) of the connection portion (PL) during the manufacturing process, recesses and the like do not occur on the surface of the second connection portion (PL3) of the connection portion (PL) protruding on the protection layer (CL), thereby preventing a decrease in the contact characteristics between the connection portion (PL) and external electronic components.

[0106] Many features of the printed circuit board according to the previously described embodiments are all applicable to the printed circuit board according to this embodiment.

[0107] Referring to FIG. 18, a printed circuit board 103 according to another embodiment will be described. FIG. 18 is a cross-sectional view of a printed circuit board according to another embodiment.

[0108] Referring to FIG. 18, the printed circuit board 103 according to this embodiment is similar to the printed circuit boards 100, 101, and 102 according to the previously described embodiments. Specific descriptions of the same components will be omitted.

[0109] Referring to FIG. 18, the printed circuit board 103 according to this embodiment can include an insulating layer (IL), a protection layer (CL1) located on the insulating layer (IL), a plurality of wiring layers (ML) located within the insulating layer (IL), and a connection portion (PL) that is partially located within the insulating layer (IL) and the protection layer (CL1) and includes a portion protruding from the protection layer (CL1).

[0110] The plurality of wiring layers (ML) can include a first wiring layer (ML1) located within the insulating layer and a second wiring layer (MLA) located on the first wiring layer (ML1).

[0111] The connection part (PL) can include a pad part (PL1) located within the insulating layer (IL), a first connection part (PL2) located on the pad part (PL1) and within the protective layer (CL), and a second connection part (PL3) located on the first connection part (PL2) and protruding above the protective layer (CL).

[0112] The protection pattern (PLA) can be located between the connection part (PL) and the protective layer (CL). More specifically, the protection pattern (PLA) can include a protection pattern (PLA) located between the pad part (PL1) and the protective layer (CL) and between the first connection part (PL2) and the protective layer (CL).

[0113] The first wiring layer (ML1) and the second wiring layer (MLA) can include different metal layers. The pad part (PL1) of the connection part (PL) can include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) can include the same metal as the second wiring layer (MLA). For example, the first wiring layer (ML1) can include copper, and the second wiring layer (MLA) can include nickel. However, the embodiments are not limited thereto.

[0114] The pad part (PL1) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL), and the second connection part (PL3) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL).

[0115] Different from the printed circuit boards 100, 101, and 102 according to the embodiments described above, the protective layer (CL1) of the printed circuit board 103 according to this embodiment can have photosensitivity. For example, the protective layer (CL1) can include a PID (Photo-Imageable Dielectric) that can serve as an insulating layer and at the same time enable a photoresist process. However, the embodiments are not limited thereto.

[0116] Further, the printed circuit board 103 according to this embodiment is different from the printed circuit boards 100, 101, and 102 according to the embodiments described above. Along the planar direction (DRW), the first width (W1) of the second connecting portion (PL3) of the connecting portion (PL) and the second width (W2) of the first connecting portion (PL2) of the connecting portion (PL) can be substantially the same. Along the height direction (DRH), the second width (W2) of the first connecting portion (PL2) of the connecting portion (PL) can be substantially constant.

[0117] According to this embodiment, similar to the embodiments described above, by directly connecting the pad portion (PL1) of the connecting portion (PL) and the first connecting portion (PL2) of the connecting portion (PL) without an intermediate layer such as a seed layer, the connection characteristics between the pad portion (PL1) of the connecting portion (PL) and the first connecting portion (PL2) and the second connecting portion (PL3) of the connecting portion (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0118] Also, the protection pattern (PLA) is located between the pad portion (PL1) and the protection layer (CL) and between the first connecting portion (PL2) and the protection layer (CL). By protecting the second connecting portion (PL3) of the connecting portion (PL) during the manufacturing process, it is possible to prevent the occurrence of recesses or the like on the surface of the second connecting portion (PL3) of the connecting portion (PL) protruding on the protection layer (CL), thereby preventing a decrease in the contact characteristics between the connecting portion (PL) and external electronic components.

[0119] Many features of the printed circuit boards according to the embodiments described above are all applicable to the printed circuit board according to this embodiment.

[0120] Referring to FIG. 19, a printed circuit board 104 according to another embodiment will be described. FIG. 19 is a cross-sectional view of a printed circuit board according to another embodiment.

[0121] Referring to FIG. 19, the printed circuit board 104 according to this embodiment is similar to the printed circuit boards 100, 101, 102, and 103 according to the embodiments described above. Specific descriptions of the same components are omitted.

[0122] Referring to FIG. 19, the printed circuit board 104 according to this embodiment may include an insulating layer (IL), a protective layer (CL1) located on the insulating layer (IL), a plurality of wiring layers (ML) located within the insulating layer (IL), and a connecting portion (PL) that is partially located within the insulating layer (IL) and the protective layer (CL1) and includes a portion protruding from the protective layer (CL1).

[0123] The plurality of wiring layers (ML) may include a first wiring layer (ML1) located within the insulating layer and a second wiring layer (MLA) located on the first wiring layer (ML1).

[0124] The connecting portion (PL) may include a pad portion (PL1) located within the insulating layer (IL), a first connecting portion (PL2) located on the pad portion (PL1) and within the protective layer (CL), and a second connecting portion (PL3) located on the first connecting portion (PL2) and protruding above the protective layer (CL).

[0125] The protection pattern (PLA) may be located between the connecting portion (PL) and the protective layer (CL). More specifically, the protection pattern (PLA) may include a protection pattern (PLA) located between the pad portion (PL1) and the protective layer (CL) and between the first connecting portion (PL2) and the protective layer (CL).

[0126] The first wiring layer (ML1) and the second wiring layer (MLA) may include different metal layers. The pad portion (PL1) of the connecting portion (PL) may include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) may include the same metal as the second wiring layer (MLA). For example, the first wiring layer (ML1) may include copper, and the second wiring layer (MLA) may include nickel. However, the embodiments are not limited thereto.

[0127] The pad portion (PL1) of the connecting portion (PL) may be directly connected to the first connecting portion (PL2) of the connecting portion (PL), and the second connecting portion (PL3) of the connecting portion (PL) may be directly connected to the first connecting portion (PL2) of the connecting portion (PL).

[0128] The printed circuit board 104 according to this embodiment is different from the printed circuit boards 100, 101, and 102 according to the previously described embodiments in that the protective layer (CL1) can have photosensitivity. For example, the protective layer (CL1) can include a PID (Photo-Imageable Dielectric) that can serve as an insulating layer and at the same time enable a photoresist process. However, the embodiment is not limited to this.

[0129] Also, the printed circuit board 104 according to this embodiment is different from the printed circuit boards 100, 102, and 103 according to the previously described embodiments in that, along the planar direction (DRW), the second width (W2) of the first connection portion (PL2) of the connection portion (PL) can be made wider than the first width (W1) of the second connection portion (PL3) of the connection portion (PL). Even if an external force is applied to the second connection portion (PL3) of the connection portion (PL), the influence of the external force is diffused to the first connection portion (PL2) of the connection portion (PL) having a relatively wide width, preventing the stress due to the external force from concentrating on the second connection portion (PL3) of the connection portion (PL), and preventing damage to the connection portion (PL) due to external stress.

[0130] Along the height direction (DRH), the first width (W1) of the second connection portion (PL3) of the connection portion (PL) can also be substantially constant, and the second width (W2) of the first connection portion (PL2) of the connection portion (PL) can be substantially constant.

[0131] According to this embodiment, similar to the previously described embodiments, by directly connecting the pad portion (PL1) of the connection portion (PL) and the first connection portion (PL2) of the connection portion (PL) without an intermediate layer such as a seed layer, the connection characteristics between the pad portion (PL1) of the connection portion (PL) and the first connection portion (PL2) and the second connection portion (PL3) of the connection portion (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0132] Further, the protection pattern (PLA) is located between the pad portion (PL1) and the protection layer (CL), and between the first connection portion (PL2) and the protection layer (CL), and protects the second connection portion (PL3) of the connection portion (PL) during the manufacturing process, so that no recesses or the like are generated on the surface of the second connection portion (PL3) of the connection portion (PL) protruding on the protection layer (CL), thereby preventing a decrease in the contact characteristics between the connection portion (PL) and external electronic components.

[0133] Many features of the printed circuit board according to the previously described embodiments are all applicable to the printed circuit board according to this embodiment.

[0134] Referring to FIG. 20, a printed circuit board 105 according to another embodiment will be described. FIG. 20 is a cross-sectional view of a printed circuit board according to another embodiment.

[0135] Referring to FIG. 20, the printed circuit board 105 according to this embodiment is similar to the printed circuit boards 100, 101, 102, 103, 104 according to the previously described embodiments. Specific descriptions of the same components will be omitted.

[0136] Referring to FIG. 20, the printed circuit board 105 according to this embodiment can include an insulating layer (IL), a protection layer (CL1) located on the insulating layer (IL), a plurality of wiring layers (ML) located in the insulating layer (IL), and a connection portion (PL) that is partially located in the insulating layer (IL) and the protection layer (CL1) and includes a portion protruding from the protection layer (CL1).

[0137] The plurality of wiring layers (ML) can include a first wiring layer (ML1) located in the insulating layer and a second wiring layer (MLA) located on the first wiring layer (ML1).

[0138] The connection portion (PL) can include a pad portion (PL1) located in the insulating layer (IL), a first connection portion (PL2) located on the pad portion (PL1) and in the protection layer (CL), and a second connection portion (PL3) located on the first connection portion (PL2) and protruding on the protection layer (CL).

[0139] The protection pattern (PLA) can be located between the connection part (PL) and the protection layer (CL). More specifically, the protection pattern (PLA) can include the protection pattern (PLA) located between the pad part (PL1) and the protection layer (CL) and between the first connection part (PL2) and the protection layer (CL).

[0140] The first wiring layer (ML1) and the second wiring layer (MLA) can include different metal layers. The pad part (PL1) of the connection part (PL) can include the same metal as the first wiring layer (ML1), and the protection pattern (PLA) can include the same metal as the second wiring layer (MLA). For example, the first wiring layer (ML1) can include copper, and the second wiring layer (MLA) can include nickel. However, the embodiments are not limited thereto.

[0141] The pad part (PL1) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL), and the second connection part (PL3) of the connection part (PL) can be directly connected to the first connection part (PL2) of the connection part (PL).

[0142] Different from the printed circuit boards 100, 101, and 102 according to the previously described embodiments, the protection layer (CL1) of the printed circuit board 105 according to this embodiment can have photosensitivity. For example, the protection layer (CL1) can include a PID (Photo-Imageable Dielectric) that can perform a photoresist process while serving as an insulating layer. However, the embodiments are not limited thereto.

[0143] Further, the printed circuit board 104 according to this embodiment can have the first width (W1) of the second connecting portion (PL3) of the connecting portion (PL) wider than the second width (W2) of the first connecting portion (PL2) of the connecting portion (PL) along the planar direction (DRW), which is different from the printed circuit boards 100, 101, 103, 104 according to the embodiments described above. Even when the width of the first connecting portion (PL2) of the connecting portion (PL) located within the protective layer (CL) is narrow, the second connecting portion (PL3) of the connecting portion (PL) can be formed wider, preventing a decrease in the contact characteristics with external electronic components.

[0144] Along the height direction (DRH), the first width (W1) of the second connecting portion (PL3) of the connecting portion (PL) can also be substantially constant, and the second width (W2) of the first connecting portion (PL2) of the connecting portion (PL) can be substantially constant.

[0145] According to this embodiment, similar to the embodiments described above, by directly connecting the pad portion (PL1) of the connecting portion (PL) and the first connecting portion (PL2) of the connecting portion (PL) without an intermediate layer such as a seed layer, the connection characteristics between the pad portion (PL1) of the connecting portion (PL), the first connecting portion (PL2), and the second connecting portion (PL3) of the connecting portion (PL) can be enhanced, and the occurrence of alignment errors can be reduced.

[0146] Further, the protection pattern (PLA) is located between the pad portion (PL1) and the protective layer (CL) and between the first connecting portion (PL2) and the protective layer (CL). By protecting the second connecting portion (PL3) of the connecting portion (PL) during the manufacturing process, it is possible to prevent the occurrence of recesses or the like on the surface of the second connecting portion (PL3) of the connecting portion (PL) protruding above the protective layer (CL), thereby preventing a decrease in the contact characteristics between the connecting portion (PL) and external electronic components.

[0147] Many features of the printed circuit boards according to the embodiments described above are all applicable to the printed circuit board according to this embodiment.

[0148] The preferred embodiments of the present invention have been described above. However, the present invention is not limited thereto, and various modifications can be made and implemented within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and it is natural that these also belong to the scope of the present invention.

Description of Reference Numerals

[0149] 100, 101, 102, 103, 104, 105 Printed Circuit Board IL Insulation Layer ML Wiring Layer PL Connection Port PL1 Pad Port PL2, PL3 Connection Port

Claims

1. Insulating layer, a wiring layer located within the insulating layer; a protective layer overlying the insulating layer; a connecting portion including a first portion located within the insulating layer and the protective layer and a second portion protruding above the protective layer; and a printed circuit board including a protection pattern located between the first portion of the connecting portion and the protection layer;

2. The printed circuit board according to claim 1 , wherein the first portion of the connecting portion includes a pad portion located in the insulating layer and a first connecting portion located in the protective layer.

3. The printed circuit board according to claim 2 , wherein the pad portion and the first connection portion are directly connected to each other.

4. The printed circuit board of claim 3 , wherein the first connecting portion and the second portion are integrally formed.

5. The printed circuit board of claim 4 , wherein the connecting portion and the protection pattern comprise different metals.

6. The printed circuit board of claim 5 , wherein the protection pattern has a thickness smaller than a thickness of the pad portion of the connecting portion and a thickness of the first connecting portion of the connecting portion.

7. the wiring layer includes a first wiring layer and a second wiring layer located on the first wiring layer; the first wiring layer includes the same metal as the coupling portion; The printed circuit board according to claim 1 , wherein the second wiring layer includes the same metal as the protection pattern.

8. The printed circuit board according to claim 7 , wherein the second wiring layer is thinner than the first wiring layer.

9. The printed circuit board of claim 3 , wherein the first width of the second portion is substantially constant along a height direction.

10. The printed circuit board of claim 3 , wherein a first width of the second portion and a second width of the first connecting portion are different from each other along a plane direction parallel to a surface of the insulating layer.

11. The printed circuit board according to claim 10 , wherein the second width of the first connecting portion is substantially constant along a height direction perpendicular to the planar direction.

12. The printed circuit board according to claim 3 , wherein the first width of the second portion and the second width of the first connecting portion are substantially the same along a planar direction parallel to a surface of the insulating layer.

13. forming a dummy insulating layer having a first hole; laminating a protective layer on the dummy insulating layer and forming a second hole in the protective layer so as to overlap the first hole; depositing a protective metal layer over the protective layer and within the first and second holes; forming a first connecting portion and a second connecting portion integrally in the first hole and the second hole covered with the protective metal layer; forming a pad portion and a wiring layer on the protective metal layer; laminating an insulating layer on the pad portion and the wiring layer; removing the dummy insulating layer to expose the protective metal layer located on the second connecting portion; and A method for manufacturing a printed circuit board, comprising the steps of removing the protective metal layer on the second connecting portion, and forming a protective pattern located between the pad portion and the first connecting portion and the protective layer.

14. The method of claim 13 , wherein the pad portion and the first connection portion are directly connected to each other.

15. the first connection portion and the protection pattern include different metals, The method of claim 14 , wherein the protection pattern has a thickness smaller than a thickness of the pad portion and a thickness of the first connection portion.

16. the wiring layer includes a first wiring layer and a second wiring layer located on the first wiring layer; the first wiring layer includes the same metal as the first coupling portion, the second wiring layer includes the same metal as the protection pattern; The method for manufacturing a circuit board according to claim 13 , wherein the second wiring layer is thinner than the first wiring layer.

17. The method for manufacturing a printed circuit board according to claim 14 , wherein the first width of the second connecting portion is substantially constant along a height direction perpendicular to a planar direction parallel to a surface of the insulating layer.

18. The method of claim 14 , wherein the first width of the second connection portion and the second width of the first connection portion are different from each other along a planar direction parallel to a surface of the insulating layer.

19. The method of claim 18 , wherein the second width of the first connection portion is substantially constant along a height direction perpendicular to the plane direction.

20. The method of claim 14 , wherein the first width of the second connecting portion and the second width of the first connecting portion are substantially the same along a planar direction parallel to a surface of the insulating layer.

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