Laminate and reflection film

Abstract

To provide a laminate and a reflection film that enable a wrinkle at an end to be reduced.SOLUTION: A laminate 1 includes a resin film 2, an inorganic layer 3, and a curable resin layer 4 sequentially toward one side in a thickness direction. In addition, the inorganic layer 3 has a thickness T1 of 110 nm or more and 1000 nm or less. A ratio (T2 / T1) of a thickness T2 (nm) of the curable resin layer 4 to the thickness T1 (nm) of the inorganic layer 3 is 1.0 or more and less than 10.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laminate and a reflective film.

Background Art

[0002] A liquid crystal display device includes a liquid crystal panel having an image display surface, a backlight that emits light toward the back of the liquid crystal panel, and a housing that houses these components. The housing has a bezel portion as a frame around the image display surface. It is known to dispose a reflective film on the inner wall surface within the bezel portion in order to suppress the leakage of light from the backlight through the bezel portion. As such a reflective film, a laminate including a resin film, an inorganic layer, and a cured resin layer has been proposed (see, for example, Patent Document 1 below). The cured resin layer is a layer for protecting the surface of the laminate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The laminate described in Patent Document 1 has a problem in that wrinkles are generated at the ends when the cured resin layer is formed on the inorganic layer.

[0005] An object of the present invention is to provide a laminate and a reflective film capable of suppressing wrinkles at the ends.

Means for Solving the Problems

[0006] The present invention [1] includes a laminate including a resin film, an inorganic layer, and a cured resin layer, which are sequentially provided in this order toward one side in the thickness direction, where the thickness T1 of the inorganic layer is 110 nm or more and 1000 nm or less, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 or more and less than 10.

[0007] The present invention [2] includes the laminate according to [1], where the thickness of the resin film is 100 μm or less.

[0008] The present invention [3] includes the laminate according to [1] or [2], where the inorganic layer is at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer.

[0009] The present invention [4] includes the laminate according to any one of [1] to [3], where the inorganic layer includes a first inorganic layer and a second inorganic layer, which are sequentially provided in this order toward one side in the thickness direction.

[0010] The present invention [5] includes the laminate according to [4], where the first inorganic layer is a metal layer, and the second inorganic layer is a layer including a metal oxide and a simple metal.

[0011] The present invention [6] includes the laminate according to [4] or [5], where the inorganic layer further includes a third inorganic layer disposed on one side in the thickness direction of the second inorganic layer.

[0012] The present invention [7] includes the laminate according to [6], where the third inorganic layer is a metal oxide layer.

[0013] The present invention [8] includes the laminate according to any one of [1] to [7], where the inorganic layer includes a blackening layer.

[0014] The present invention [9] includes the laminate according to any one of [1] to [8], where the thickness T2 of the cured resin layer is 1000 nm or more.

[0015] The present invention

[10] includes a reflective film provided with the laminate according to any one of [1] to [9].

Effects of the Invention

[0016] In the laminate of the present invention, the thickness T1 of the inorganic layer is 110 nm or more and 1000 nm or less, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 or more and less than 10. Therefore, wrinkles at the ends can be suppressed.

[0017] Since the reflective film of the present invention includes the above-described laminate, wrinkles at the ends can be suppressed.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0019] 1. Laminate The laminate 1 of the present invention will be described with reference to FIGS. 1 and 2.

[0020] The laminate 1 includes a resin film 2, an inorganic layer 3, and a cured resin layer 4 in this order toward one side in the thickness direction. Specifically, the laminate 1 includes a resin film 2, an inorganic layer 3 disposed on one surface of the resin film 2 in the thickness direction, and a cured resin layer 4 disposed on one surface of the inorganic layer 3 in the thickness direction. The laminate 1 extends in a direction (plane direction) orthogonal to the thickness direction. The laminate 1 is used, for example, as a reflective film that suppresses light from a backlight of a liquid crystal display device from leaking out of the housing.

[0021] <Resin film> The resin film 2 is a base film that ensures the strength of the laminate 1. Further, the resin film 2 has flexibility.

[0022] Examples of the material of the resin film 2 include polyester resin, polyolefin resin, acrylic resin, polycarbonate resin, polyethersulfone resin, polyarylate resin, melamine resin, polyamide resin, polyimide resin, cellulose resin, and polystyrene resin. Preferably, polyester resin is mentioned.

[0023] Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate. Preferably, polyethylene terephthalate is mentioned.

[0024] Examples of the polyolefin resin include polyethylene, polypropylene, and cycloolefin polymer.

[0025] Examples of the acrylic resin include polymethacrylate.

[0026] From the viewpoint of excellent transparency and strength, the resin film 2 is preferably a polyester resin film, and more preferably a polyethylene terephthalate film.

[0027] The resin film 2 includes, for example, a transparent film and a white film. From the viewpoint of excellent light reflectivity, it is preferably a white film. The white film has, for example, fine particles that cause light scattering dispersed in the resin film. That is, as the resin film 2, preferably, a polyethylene terephthalate film containing fine particles is mentioned.

[0028] Examples of the fine particles include fine particles made of an inorganic filler. Examples of the inorganic filler include titanium oxide, calcium carbonate, barium sulfate, silica, and talc. Preferably, at least one selected from the group consisting of titanium oxide and silica is used.

[0029] The fine particles may be used alone or two or more kinds may be used in combination.

[0030] The average particle diameter of the fine particles is, for example, 0.05 μm to 2 μm, preferably 0.1 μm to 1 μm.

[0031] In the resin film 2 as a white film, the content ratio of the fine particles is, for example, 5 mass% to 50 mass%, preferably 10 mass% to 40 mass%.

[0032] The thickness of the resin film 2 is, for example, 5 μm to 200 μm, preferably 10 μm to 150 μm, more preferably 15 μm to 100 μm, still more preferably 20 μm to 70 μm, and particularly preferably 25 μm to 50 μm.

[0033] The thickness of the resin film 2 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, still more preferably 20 μm or more, and particularly preferably 25 μm or more. Also, for example, 200 μm or less, preferably 150 μm or less, more preferably 100 μm or less, still more preferably 70 μm or less, and particularly preferably 50 μm or less.

[0034] If the thickness of the resin film 2 is equal to or greater than the above lower limit value, it is possible to suppress the intrusion of water vapor from the resin film 2 side of the laminate 1 into the inorganic layer 3. Further, a laminate 1 having excellent strength can be manufactured. If the thickness of the resin film 2 is equal to or less than the above upper limit value, the resin film 2 has excellent handleability in the roll-to-roll method. Further, the laminate 1 can be thinned.

[0035] One surface in the thickness direction of the resin film 2 (contact surface with the inorganic layer 3) may be surface-modified in order to improve the adhesion of the inorganic layer 3 to the resin film 2. Examples of the surface modification treatment include corona treatment, plasma treatment, ozone treatment, primer treatment, glow treatment, and coupling agent treatment.

[0036] <Inorganic layer> The inorganic layer 3 is disposed on one side in the thickness direction of the resin film 2, and preferably, on one surface in the thickness direction of the resin film 2. That is, the inorganic layer 3 preferably contacts one surface in the thickness direction of the resin film 2.

[0037] Examples of the inorganic layer 3 include a metal layer, a metal oxide layer, and a metal nitride layer. The inorganic layer 3 preferably contains at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer. More preferably, it contains at least one selected from the group consisting of a metal layer and a metal oxide layer. Even more preferably, it is a layer containing at least one selected from the group consisting of aluminum, indium oxide, copper, and indium tin composite oxide. Further, the inorganic layer 3 preferably contains a blackening layer.

[0038] The inorganic layer 3 may be a single layer or a plurality of layers. The inorganic layer 3 is preferably a plurality of layers.

[0039] The inorganic layer 3 is, for example, a layer (dry coating layer) formed by a dry coating method. Examples of the dry coating layer include a sputtered layer formed by a sputtering method and a vapor deposition layer formed by a vapor deposition method, and preferably, a sputtered layer.

[0040] The inorganic layer 3 includes, for example, a first inorganic layer 31 and a second inorganic layer 32 in this order toward one side in the thickness direction. More specifically, the inorganic layer 3 includes a first inorganic layer 31 and a second inorganic layer 32 disposed on one surface of the first inorganic layer 31 in the thickness direction. The inorganic layer 3 further includes a third inorganic layer 33 disposed on one side in the thickness direction of the second inorganic layer 32 as needed. More specifically, the inorganic layer 3 further includes a third inorganic layer 33 disposed on one surface of the second inorganic layer 32 in the thickness direction.

[0041] In the laminate 1 shown in FIG. 1, the inorganic layer 3 includes a first inorganic layer 31, a second inorganic layer 32, and a third inorganic layer 33 in this order toward one side in the thickness direction. On the other hand, in the laminate 1 shown in FIG. 2, the inorganic layer 3 includes a first inorganic layer 31 and a second inorganic layer 32 in this order toward one side in the thickness direction, and does not include the third inorganic layer 33.

[0042] [First Inorganic Layer] The first inorganic layer 31 is disposed on one side in the thickness direction of the resin film 2, and preferably, on one surface of the resin film 2 in the thickness direction. That is, the first inorganic layer 31 preferably contacts one surface of the resin film 2 in the thickness direction. Also, the first inorganic layer 31 is the lowermost layer of the inorganic layer 3.

[0043] Examples of the first inorganic layer 31 include a metal layer, a metal oxide layer, and a metal nitride layer, and preferably, a metal layer. The metal layer as the first inorganic layer 31 is formed of, for example, a metal having light reflectivity.

[0044] Examples of the metal for forming the first inorganic layer 31 include aluminum (Al), silver (Ag), titanium (Ti), and alloys thereof. From the viewpoint of having good light reflectivity for visible light, the metal of the first inorganic layer 31 is preferably aluminum and silver, and more preferably aluminum. That is, examples of the first inorganic layer 31 include an aluminum layer (Al layer) and a silver layer (Ag layer), and preferably an aluminum layer.

[0045] The thickness t1 of the first inorganic layer 31 is, for example, 10 nm to 700 nm, preferably 30 nm to 500 nm, more preferably 50 nm to 400 nm, and still more preferably 70 nm to 350 nm.

[0046] The thickness t1 of the first inorganic layer 31 is, for example, 10 nm or more, preferably 30 nm or more, more preferably 50 nm or more, still more preferably 70 nm or more, and, for example, 700 nm or less, preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 350 nm or less.

[0047] If the thickness t1 of the first inorganic layer 31 is equal to or greater than the above lower limit value, the light reflectivity is excellent. Also, if the thickness t1 of the first inorganic layer 31 is equal to or less than the above upper limit value, the adhesion to the resin film 2 is excellent.

[0048] [Second Inorganic Layer] The second inorganic layer 32 is disposed on one side in the thickness direction of the first inorganic layer 31, and preferably on one surface in the thickness direction of the first inorganic layer 31. That is, the second inorganic layer 32 preferably contacts one surface in the thickness direction of the first inorganic layer 31.

[0049] The second inorganic layer 32 is, for example, an inorganic layer having high light absorptivity, and preferably a blackening layer.

[0050] The second inorganic layer 32 is, for example, a layer containing a metal compound and a simple substance metal, preferably a layer composed of a metal compound and a simple substance metal. Note that the second inorganic layer 32 may contain a plurality of metal compounds or a plurality of simple substance metals.

[0051] A metal compound is a compound of a metal and a non-metal. Examples of the metal compound include metal oxides, metal nitrides, and metal carbides, and preferably metal oxides. Examples of the metal (first metal) in the metal compound include indium (In), copper (Cu), molybdenum (Mo), and iron (Fe). The first metal is preferably at least one selected from the group consisting of In, Cu, Mo, and Fe, and more preferably In. That is, examples of the metal compound include metal oxides, and preferably indium oxide. The first metal may be used alone or in combination of two or more.

[0052] Examples of the simple substance metal (second metal) include In, Cu, Mo, and Fe. The second metal is preferably at least one selected from the group consisting of In, Cu, Mo, and Fe, and more preferably Cu. The second metal is preferably a metal other than the first metal. The second metal may be used alone or in combination of two or more.

[0053] The proportion of the first metal in the second inorganic layer 32 is, for example, 10 atomic% to 90 atomic%, preferably 20 atomic% to 80 atomic%.

[0054] The proportion of the first metal in the second inorganic layer 32 is, for example, 10 atomic% or more, preferably 20 atomic% or more, and, for example, 90 atomic% or less, preferably 80 atomic% or less.

[0055] If the proportion of the first metal in the second inorganic layer 32 is within the above range, the light-shielding property is excellent.

[0056] The proportion of the second metal in the second inorganic layer 32 is, for example, 10 atomic % to 90 atomic %, preferably 20 atomic % to 80 atomic %.

[0057] The proportion of the second metal in the second inorganic layer 32 is, for example, 10 atomic % or more, preferably 20 atomic % or more, and, for example, 90 atomic % or less, preferably 80 atomic % or less.

[0058] If the proportion of the second metal in the second inorganic layer 32 is within the above range, the light-shielding property is excellent.

[0059] The second inorganic layer 32 is, for example, a layer containing a metal compound and a simple metal, preferably a layer containing a metal oxide and a simple metal, more preferably a layer containing indium oxide and copper. More specifically, the second inorganic layer 32 is, for example, a layer composed of a metal compound and a simple metal, preferably a layer composed of a metal oxide and a simple metal, more preferably a layer composed of indium oxide and copper.

[0060] If the second inorganic layer 32 contains the above metal compound and simple metal, the light-shielding property is further excellent.

[0061] When the second inorganic layer 32 contains indium oxide and copper, the proportion of In in the second inorganic layer 32 is, for example, 40 atomic % to 90 atomic %, preferably 50 atomic % to 80 atomic %.

[0062] When the second inorganic layer 32 contains indium oxide and copper, the proportion of In in the second inorganic layer 32 is, for example, 40 atomic % or more, preferably 50 atomic % or more, and, for example, 90 atomic % or less, preferably 80 atomic % or less.

[0063] If the proportion of In in the second inorganic layer 32 is within the above range, the light-shielding property is excellent.

[0064] When the second inorganic layer 32 contains indium oxide and copper, the proportion of Cu in the second inorganic layer 32 is, for example, 5 atomic% to 50 atomic%, preferably 10 atomic% to 40 atomic%.

[0065] When the second inorganic layer 32 contains indium oxide and copper, the proportion of Cu in the second inorganic layer 32 is, for example, 5 atomic% or more, preferably 10 atomic% or more, and, for example, 50 atomic% or less, preferably 40 atomic% or less.

[0066] When the proportion of Cu in the second inorganic layer 32 is within the above range, the light-shielding property is excellent.

[0067] The thickness t2 of the second inorganic layer 32 is, for example, 5 nm to 300 nm, preferably 10 nm to 200 nm, more preferably 15 nm to 150 nm, and even more preferably 20 nm to 120 nm.

[0068] The thickness t2 of the second inorganic layer 32 is, for example, 5 nm or more, preferably 10 nm or more, more preferably 15 nm or more, and even more preferably 20 nm or more, and, for example, 300 nm or less, preferably 200 nm or less, more preferably 150 nm or less, and even more preferably 120 nm or less.

[0069] When the thickness t2 of the second inorganic layer 32 is equal to or greater than the above lower limit value, the light-shielding property is excellent. Also, when the thickness t2 of the second inorganic layer 32 is equal to or greater than the above upper limit value, the adhesion to the first inorganic layer 31 is excellent.

[0070] The visual transmittance (Y value) of the second inorganic layer 32 in the wavelength range of 380 nm to 780 nm in the CIE-XYZ color system is, for example, 0.001% to 0.1%, preferably 0.005% to 0.05%, and more preferably 0.01% to 0.03%. The visual transmittance can be measured, for example, by a spectrophotometer (product name: U-4100, manufactured by Hitachi High-Technologies Corporation).

[0071] [Third Inorganic Layer] The third inorganic layer 33 is disposed, for example, on one side in the thickness direction of the second inorganic layer 32, and preferably on one surface in the thickness direction of the second inorganic layer 32. That is, the third inorganic layer 33 is in contact with one surface in the thickness direction of the second inorganic layer 32.

[0072] Examples of the third inorganic layer 33 include a metal layer, a metal oxide layer, and a metal nitride layer, and preferably a metal oxide layer. Examples of the metal of the metal oxide forming the third inorganic layer 33 include indium (In), zinc (Zn), tin (Sn), magnesium (Mg), nickel (Ni), cobalt (Co), and chromium (Cr). From the viewpoint of improving the water vapor barrier property of the third inorganic layer 33, the metal of the metal oxide forming the third inorganic layer 33 is preferably at least one selected from the group consisting of In, Zn, Sn, Mg, Ni, Co, and Cr. More preferably, the third inorganic layer 33 is an indium tin composite oxide (ITO) layer.

[0073] When an ITO layer is used as the third inorganic layer 33, the ratio of tin oxide to the total content of indium oxide (In2O3) and tin oxide (SnO2) in the ITO is, for example, 1.0% by mass to 20.0% by mass, preferably 3.0% by mass to 18.0% by mass, more preferably 5.0% by mass to 15.0% by mass, and still more preferably 7.0% by mass to 12.0% by mass.

[0074] When an ITO layer is used as the third inorganic layer 33, the ratio of tin oxide to the total content of indium oxide (In2O3) and tin oxide (SnO2) in the ITO is, for example, 1.0% by mass or more, preferably 3.0% by mass or more, more preferably 5.0% by mass or more, still more preferably 7.0% by mass or more, and also, for example, 20.0% by mass or less, preferably 18.0% by mass or less, more preferably 15.0% by mass or less, and still more preferably 12% by mass or less.

[0075] If the ratio of tin oxide to the total content of indium oxide (In2O3) and tin oxide (SnO2) in ITO is within the above range, it has excellent water vapor barrier properties.

[0076] The thickness t3 of the third inorganic layer 33 is, for example, 1 nm to 200 nm, preferably 5 nm to 100 nm, more preferably 10 nm to 50 nm, and even more preferably 15 nm to 30 nm.

[0077] The thickness t3 of the third inorganic layer 33 is, for example, 1 nm or more, preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 15 nm or more. Also, for example, 200 nm or less, preferably 100 nm or less, more preferably 50 nm or less, and even more preferably 30 nm or less.

[0078] If the thickness t3 of the third inorganic layer 33 is equal to or greater than the above lower limit value, it has excellent water vapor barrier properties. Also, if the thickness t3 of the third inorganic layer 33 is equal to or less than the above upper limit value, the adhesion of the third inorganic layer 33 to the second inorganic layer 32 is excellent.

[0079] The total thickness (thickness of the inorganic layer 3) T1 of the inorganic layer 3 is 110 nm to 1000 nm, preferably 110 nm to 700 nm, more preferably 115 nm to 500 nm, even more preferably 115 nm to 400 nm, particularly preferably 120 nm to 300 nm, and most preferably 120 nm to 200 nm.

[0080] The total thickness (thickness of the inorganic layer 3) T1 of the inorganic layer 3 is 110 nm or more, preferably 115 nm or more, and more preferably 120 nm or more. Also, the total thickness (thickness of the inorganic layer 3) T1 of the inorganic layer 3 is 1000 nm or less, preferably 700 nm or less, more preferably 500 nm or less, even more preferably 400 nm or less, particularly preferably 300 nm or less, and most preferably 200 nm or less.

[0081] If the thickness T1 of the inorganic layer 3 is equal to or greater than the above lower limit value, wrinkles at the ends in the laminate 1 can be suppressed. Specifically, if the total thickness (thickness of the inorganic layer 3) T1 of the inorganic layer 3 is equal to or greater than the above lower limit value, the internal stress of the inorganic layer 3 can be ensured, and thus, wrinkles at the ends in the laminate 1 can be suppressed. Further, if the thickness T1 of the inorganic layer 3 is equal to or less than the above upper limit value, the adhesion to the resin film 2 is excellent, and furthermore, the manufacturability is excellent.

[0082] In addition, if the thickness T1 of the inorganic layer 3 is within the above range, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer described later can be set within a suitable range, and thus, wrinkles at the ends in the laminate 1 can be suppressed.

[0083] <Cured resin layer> The cured resin layer 4 is disposed on one side in the thickness direction of the inorganic layer 3, and preferably, is disposed on one surface in the thickness direction of the inorganic layer 3. That is, the cured resin layer 4 is in contact with one surface in the thickness direction of the inorganic layer 3.

[0084] In the laminate 1 shown in FIG. 1, the cured resin layer 4 is disposed on one surface in the thickness direction of the third inorganic layer 33. That is, it is in contact with one surface in the thickness direction of the third inorganic layer 33. Further, in the laminate 1 shown in FIG. 2, the cured resin layer 4 is disposed on one surface in the thickness direction of the second inorganic layer 32. That is, it is in contact with one surface in the thickness direction of the second inorganic layer.

[0085] The cured resin layer 4 is, for example, a hard coat layer for making it difficult to form scratches on the laminate 1.

[0086] The cured resin layer 4 is a cured product of a curable resin composition. The curable resin composition contains a curable resin. Examples of the curable resin include polyester resin, acrylic urethane resin, acrylic resin (excluding acrylic urethane resin), urethane resin (excluding acrylic urethane resin), amide resin, silicone resin, epoxy resin, and melamine resin. These curable resins may be used alone or in combination of two or more. From the viewpoint of having excellent hardness, as the curable resin, at least one selected from the group consisting of acrylic urethane resin and acrylic resin is preferably used, and more preferably, acrylic urethane resin is used.

[0087] Also, examples of the curable resin include ultraviolet curable resin and thermosetting resin. From the viewpoint of improving the production efficiency of the laminate 1, the curable resin is preferably an ultraviolet curable resin that can be cured without high-temperature heating.

[0088] The curable resin composition may contain particles. Examples of the particles include inorganic particles and organic particles. Examples of the inorganic particles include inorganic oxide particles. Examples of the material of the inorganic oxide particles include silica, alumina, titania, zirconia, calcium oxide, tin oxide, indium oxide, cadmium oxide, and antimony oxide. Examples of the material of the organic particles include polymethyl methacrylate, polystyrene, polyurethane, acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate. The particles may be used alone or in combination of two or more. As the particles, inorganic particles are preferably mentioned, more preferably inorganic oxide particles are mentioned, and still more preferably, at least one selected from silica particles and zirconia particles is mentioned.

[0089] The average particle diameter (D50) of the particles is, for example, 20 nm to 300 nm, preferably 25 nm to 200 nm, and more preferably 30 nm to 100 nm.

[0090] If the average particle diameter (D50) of the particles is equal to or greater than the above lower limit value, the cured resin layer 4 is excellent in hardness. Also, if the average particle diameter (D50) of the particles is equal to or less than the above upper limit value, the dispersibility of the particles in the cured resin layer 4 is excellent.

[0091] Note that the average particle diameter (D50) of the particles is the median diameter (the particle diameter at which the volume cumulative frequency reaches 50% from the smaller diameter side) in the volume-based particle size distribution, and is obtained, for example, based on the particle size distribution obtained by the laser diffraction / scattering method.

[0092] The proportion of the particles in the cured resin layer 4 is, for example, 5% by mass to 30% by mass, preferably 8% by mass to 20% by mass, more preferably 10% by mass to 15% by mass.

[0093] If the proportion of the particles in the cured resin layer 4 is equal to or greater than the above lower limit value, the cured resin layer 4 is excellent in hardness. Also, if the proportion of the particles in the cured resin layer 4 is equal to or less than the above upper limit value, the particles can be uniformly dispersed in the cured resin layer 4.

[0094] The thickness T2 of the cured resin layer 4 is, for example, 100 nm to 5000 nm, preferably 300 nm to 3000 nm, more preferably 500 nm to 2000 nm, still more preferably 700 nm to 1500 nm, and particularly preferably 900 nm to 1200 nm.

[0095] The thickness T2 of the cured resin layer 4 is, for example, 100 nm or more, preferably 300 nm or more, more preferably 500 nm or more, still more preferably 700 nm or more, and particularly preferably 900 nm or more. Also, for example, 5000 nm or less, preferably 3000 nm or less, more preferably 2000 nm or less, still more preferably 1500 nm or less, and particularly preferably 1200 nm or less.

[0096] If the thickness T2 of the cured resin layer 4 is equal to or greater than the above lower limit value, it is excellent in scratch resistance. Also, if the thickness T2 of the cured resin layer 4 is equal to or less than the above upper limit value, it is excellent in adhesion to the inorganic layer 3.

[0097] In addition, if the thickness T2 of the cured resin layer 4 is within the above range, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the thickness T1 (nm) of the inorganic layer 3 described later can be set within a suitable range, and thus, the end wrinkles in the laminate 1 can be suppressed.

[0098] The visual reflectance (Y value) of the laminate 1 in the wavelength range of 380 nm to 780 nm in the CIE-XYZ color system is, for example, 80% to 100%, preferably 82% to 100%, more preferably 85% to 100%. Note that the visual reflectance (Y value) of the laminate 1 is defined as the reflectance of light irradiated from the resin film 2 side to the laminate 1.

[0099] The visual transmittance (Y value) of the laminate 1 in the wavelength range of 380 nm to 780 nm in the CIE-XYZ color system is, for example, 0.001% to 0.10%, preferably 0.005% to 0.05%, more preferably 0.01% to 0.02%. Note that the visual transmittance (Y value) of the laminate 1 is defined as the transmittance of light irradiated from the resin film 2 side to the laminate 1.

[0100] <Relationship of the thickness of each layer> The ratio (t1 / T1×100) (%) of the thickness t1 (nm) of the first inorganic layer 31 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 40% to 99%, preferably 45% to 95%, more preferably 50% to 93%.

[0101] The ratio (t1 / T1×100) (%) of the thickness t1 (nm) of the first inorganic layer 31 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 40% or more, preferably 45% or more, more preferably 50% or more, and, for example, 99% or less, preferably 95% or less, more preferably 93% or less.

[0102] The ratio (t2 / T1×100) (%) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% to 60%, preferably 3% to 55%, more preferably 5% to 50%.

[0103] When the ratio (t2 / T1×100)(%) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% or more, preferably 3% or more, more preferably 5% or more, and also, for example, 60% or less, preferably 55% or less, more preferably 50% or less.

[0104] When the inorganic layer 3 includes a third inorganic layer 33, the ratio (t3 / T1×100)(%) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% to 30%, preferably 5% to 25%, more preferably 10% to 20%.

[0105] When the inorganic layer 3 includes a third inorganic layer 33, the ratio (t3 / T1×100)(%) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness T1 (nm) of the inorganic layer 3 is, for example, 1% or more, preferably 5% or more, more preferably 10% or more, and also, for example, 30% or less, preferably 25% or less, more preferably 20% or less.

[0106] The ratio (t2 / t1) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.01 to 1.00, preferably 0.03 to 0.90, more preferably 0.05 to 0.85.

[0107] The ratio (t2 / t1) of the thickness t2 (nm) of the second inorganic layer 32 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.01 or more, preferably 0.03 or more, more preferably 0.05 or more, and also, for example, 1.00 or less, preferably 0.90 or less, more preferably 0.85 or less.

[0108] When the inorganic layer 3 includes a third inorganic layer 33, the ratio (t3 / t1) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.10 to 0.80, preferably 0.15 to 0.50, more preferably 0.20 to 0.35.

[0109] When the inorganic layer 3 includes the third inorganic layer 33, the ratio (t3 / t1) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t1 (nm) of the first inorganic layer 31 is, for example, 0.10 or more, preferably 0.15 or more, more preferably 0.20 or more, and, for example, 0.80 or less, preferably 0.50 or less, more preferably 0.35 or less.

[0110] When the inorganic layer 3 includes the third inorganic layer 33, the ratio (t3 / t2) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t2 (nm) of the second inorganic layer 32 is, for example, 0.3 to 1.2, preferably 0.5 to 1.0, more preferably 0.7 to 0.9.

[0111] When the inorganic layer 3 includes the third inorganic layer 33, the ratio (t3 / t2) of the thickness t3 (nm) of the third inorganic layer 33 to the thickness t2 (nm) of the second inorganic layer 32 is, for example, 0.3 or more, preferably 0.5 or more, more preferably 0.7 or more, and, for example, 1.2 or less, preferably 1.0 or less, more preferably 0.9 or less.

[0112] The ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness (thickness of the inorganic layer 3) T1 (nm) of the inorganic layer 3 is, for example, 1.0 to 10.0, preferably 1.5 to 9.9, more preferably 2.0 to 9.0, still more preferably 2.5 to 8.5.

[0113] The ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness (thickness of the inorganic layer 3) T1 (nm) of the inorganic layer 3 is 1.0 or more, preferably 1.5 or more, more preferably 2.0 or more, still more preferably 2.5 or more, and less than 10.0, preferably 9.9 or less, more preferably 9.0 or less, still more preferably 8.5 or less.

[0114] If the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness (thickness of the inorganic layer 3) T1 (nm) of the inorganic layer 3 is equal to or greater than the above lower limit value, while ensuring the scratch resistance by the cured resin layer 4, the total thickness of the laminate 1 can be reduced. If the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness (thickness of the inorganic layer 3) T1 (nm) of the inorganic layer 3 is equal to or less than the above upper limit value, the end wrinkles in the laminate 1 can be suppressed.

[0115] That is, if the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer 4 to the total thickness (thickness of the inorganic layer 3) T1 (nm) of the inorganic layer 3 is within the above range, since the inorganic layer 3 has sufficient internal stress, the end wrinkles in the laminate 1 can be suppressed.

[0116] The ratio (thickness of resin film 2 / T2) of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 is, for example, 5.0 to 90.0, preferably 10.0 to 80.0, more preferably 15.0 to 70.0, still more preferably 20.0 to 60.0, and particularly preferably 30.0 to 50.0.

[0117] The ratio (thickness of resin film / T2) of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 is, for example, 5.0 or more, preferably 10.0 or more, more preferably 15.0 or more, still more preferably 20.0 or more, and particularly preferably 30.0 or more. Also, for example, 90.0 or less, preferably 80.0 or less, more preferably 70.0 or less, still more preferably 60.0 or less, and particularly preferably 50.0 or less.

[0118] If the ratio (thickness of resin film / T2) of the thickness (nm) of the resin film 2 to the thickness T2 (nm) of the cured resin layer 4 is within the above range, by adjusting the thicknesses of the inorganic layer 3 and the cured resin layer 4, the end wrinkles in the laminate 1 can be suppressed.

[0119] 2. Method for manufacturing a laminate Next, a method for manufacturing the laminate 1 will be described with reference to FIG. 3. The laminate 1 is manufactured as follows, for example, in a roll-to-roll method.

[0120] (Preparation step) First, as shown in FIG. 3A, a resin film 2 is prepared.

[0121] (Inorganic layer formation step) Next, as shown in FIG. 3B, an inorganic layer 3 is formed on one surface in the thickness direction of the resin film 2. Specifically, a first inorganic layer 31 is formed on one surface in the thickness direction of the resin film 2, and then, a second inorganic layer 32 is formed on one surface in the thickness direction of the first inorganic layer 31, and further, a third inorganic layer 33 is formed on one surface in the thickness direction of the second inorganic layer 32.

[0122] The inorganic layer 3 (the first inorganic layer 31, the second inorganic layer 32, and the third inorganic layer 33) is formed by, for example, a dry coating method. Examples of the dry coating method include a sputtering method and a vapor deposition method, and preferably, the sputtering method is used.

[0123] In the sputtering method, for example, a sputtering film forming apparatus is used. The sputtering film forming apparatus can perform a film forming process in a roll-to-roll method. In the inorganic layer formation step, while a long resin film 2 is run from a pay-off roll to a take-up roll as a work film, each material is formed into a film on one surface in the thickness direction of the resin film 2 to form an inorganic layer. The running speed of the work film is, for example, 0.5 m / min to 10.0 m / min.

[0124] In the sputtering method, a sputtering film forming apparatus having one film forming chamber may be used, or a sputtering film forming apparatus having a plurality of film forming chambers arranged in order along the running path of the work film may be used. In the step of forming the inorganic layer 3 (the first inorganic layer 31, the second inorganic layer 32, and the third inorganic layer 33), preferably, a sputtering film forming apparatus having a plurality of film forming chambers arranged in order along the running path of the work film is used. By setting a series of processes for forming the first inorganic layer 31, the second inorganic layer 32, and the third inorganic layer 33 as one pass line, the work film is not exposed to the atmosphere during the process. Therefore, the adhesion of the second inorganic layer 32 to the first inorganic layer 31 and the adhesion of the third inorganic layer 33 to the second inorganic layer 32 can be improved.

[0125] Specifically, in the sputtering method, while introducing a sputtering gas (inert gas) under vacuum conditions into the film forming chamber of the sputtering film forming apparatus, a negative voltage is applied to the target arranged on the cathode in the film forming chamber. Thereby, glow discharge is generated to ionize gas atoms, and these gas ions are made to collide with the target surface at high speed, ejecting the target material from the target surface, and depositing the ejected target material on the resin film 2.

[0126] Examples of the sputtering gas include argon, krypton, xenon, and mixed gases thereof, and preferably, argon is included.

[0127] Examples of the material of the target disposed on the cathode in the film formation chamber include the above-described metals, metal oxides, metal nitrides, metal carbides, and combinations thereof. Specifically, examples of the target material for forming the first inorganic layer 31 include metals having light reflectivity, preferably aluminum (Al), silver (Ag), titanium (Ti), and alloys thereof, and more preferably aluminum (Al). Further, examples of the target material for forming the second inorganic layer 32 include, for example, a combination of a metal compound and a simple metal, preferably a combination of a metal oxide and a simple metal, and more preferably a combination of indium oxide and copper. Furthermore, examples of the target material for forming the third inorganic layer 33 include, for example, metal oxides, and preferably indium tin composite oxide (ITO).

[0128] The atmospheric pressure in the film formation chamber during film formation by sputtering (sputtering film formation) (the atmospheric pressure in the film formation chamber when the sputtering gas is introduced) is, for example, 0.02 Pa to 1 Pa, preferably 0.1 Pa to 0.6 Pa. Examples of the power source for applying voltage to the target include a DC power source, an AC power source, an MF power source, and an RF power source, and preferably a DC power source.

[0129] (Hardened Resin Layer Formation Step) Next, as shown in FIG. 2C, a hardened resin layer 4 is formed on the inorganic layer 3 (the third inorganic layer 33). The hardened resin layer 4 can be formed by applying the above-described curable resin composition on the inorganic layer 3 to form a coating film and then curing the coating film. When the curable resin composition contains an ultraviolet curable resin, the coating film is cured by ultraviolet irradiation. When the curable resin composition contains a thermosetting resin, the coating film is cured by heating.

[0130] The laminate 1 can be manufactured as described above.

[0131] As described above, the laminate 1 includes a resin film 2, a first inorganic layer 31 disposed on one surface in the thickness direction of the resin film 2, a second inorganic layer 32 disposed on one surface in the thickness direction of the first inorganic layer 31, a third inorganic layer 33 disposed on one surface in the thickness direction of the second inorganic layer 32, and a cured resin layer 4 disposed on one surface in the thickness direction of the third inorganic layer 33.

[0132] 3. Reflective Film Although not shown, the reflective film includes, for example, the above laminate 1 and preferably consists of the above laminate 1.

[0133] If the reflective film includes the above laminate 1, it is excellent in reflectivity while suppressing end wrinkles.

[0134] Further, the reflective film may include any layer other than the above laminate 1. Examples of the arbitrary layer include an adhesive layer.

[0135] The reflective film including the above laminate 1 is suitably used for a liquid crystal display device or the like.

[0136] (Function and Effect) In the laminate of the present invention, the thickness T1 of the inorganic layer is 110 nm or more and 1000 nm or less, and the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 or more and less than 10. Therefore, wrinkles at the ends can be suppressed.

[0137] Since the reflective film of the present invention includes the above-described laminate, wrinkles at the ends can be suppressed.

Example

[0138] Examples and comparative examples are shown below to explain the present invention more specifically. Note that the present invention is not limited to any examples and comparative examples. Also, specific numerical values such as the blending ratio (content ratio), physical property values, parameters, etc. used in the following description can be replaced with the upper limit (numerical values defined as "below" and "less than") or lower limit (numerical values defined as "above" and "exceeding") of the corresponding blending ratio (content ratio), physical property values, parameters, etc. described in the above "Mode for Carrying Out the Invention".

[0139] Example 1 First, as a base film, a white polyethylene terephthalate (PET) film (product name: Lumirror E20, thickness: 38 μm, manufactured by Toray Industries, Inc.) was prepared.

[0140] Next, an inorganic layer was formed on one surface (the first surface) of the PET film by sputtering (sputtering film formation process). Specifically, the first inorganic layer, the second inorganic layer, and the third inorganic layer were formed in order. In this sputtering film formation process, a roll-to-roll type sputtering film formation apparatus (DC magnetron sputtering film formation apparatus) was used. This sputtering film formation apparatus includes a feeding chamber, a first film formation chamber, a second film formation chamber, a third film formation chamber, and a winding chamber. The feeding chamber is provided with feeding rollers. On the feeding rollers, a roll of the above base film was set as a work film. The winding chamber is provided with winding rollers capable of winding the work film. In the first film formation chamber, the second film formation chamber, and the third film formation chamber, the film formation process can be carried out while the work film is running in a roll-to-roll manner from the feeding chamber to the winding chamber.

[0141] In the sputtering film formation process, specifically, the first sputtering film formation in the first film formation chamber, the second sputtering film formation in the second film formation chamber, and the third sputtering film formation in the third film formation chamber were sequentially performed. Then, the work film (substrate film / first inorganic layer / second inorganic layer / third inorganic layer) was wound around the winding roller in the winding chamber. In the first sputtering film formation, a first inorganic layer (Al layer) with a thickness of 75 nm was formed on one side in the thickness direction of the PET film. Next, in the second sputtering film formation, a second inorganic layer (In2O3 + Cu layer) with a thickness of 25 nm was formed on the first inorganic layer. Next, in the third sputtering film formation, a third inorganic layer (ITO layer) with a thickness of 20 nm was formed. Each sputtering film formation is specifically as follows.

[0142] In the first sputtering film formation, after evacuating the inside of the sputtering film formation apparatus (unwinding chamber, first film formation chamber, second film formation chamber, third film formation chamber, winding chamber) to vacuum, argon (Ar) as a sputtering gas was introduced into the first film formation chamber, and the atmospheric pressure in the first film formation chamber was set to 0.3 to 0.4 Pa. As the target, an Al target (manufactured by Mitsui Kinzoku Co., Ltd.) was used. As the power source for applying voltage to the target, a DC power source was used. The film formation temperature (the temperature of the substrate film on which the Al layer is laminated) was set to 40°C. The type of power source and the film formation temperature are the same for the second sputtering film formation and the third sputtering film formation as well.

[0143] In the second sputtering film formation, after evacuating the inside of the sputtering film formation apparatus to vacuum, Ar as a sputtering gas was introduced into the second film formation chamber, and the atmospheric pressure in the second film formation chamber was set to 0.3 to 0.4 Pa. Also, as the target, a mixed target of indium oxide (In2O3) and copper (Cu) (In2O3:Cu = 81.2 mass%:18.8 mass%, manufactured by Mitsui Kinzoku Co., Ltd.) was used.

[0144] In the third sputtering film formation, after evacuating the inside of the sputtering film formation apparatus to vacuum, Ar as a sputtering gas was introduced into the third film formation chamber, and the atmospheric pressure in the third film formation chamber was set to 0.3 to 0.4 Pa. Also, as the target, an ITO target (a composite oxide of indium oxide and tin oxide, tin oxide concentration 10 mass%, manufactured by Mitsui Kinzoku Co., Ltd.) was used.

[0145] Next, a curable resin composition was applied onto the inorganic layer (specifically, the third inorganic layer) to form a coating film. The curable resin composition contains an ultraviolet curable acrylic urethane resin (product name: Aica Iron Z844, manufactured by Aica Kogyo Co., Ltd.) and methyl ethyl ketone as a solvent. Next, after drying the coating film, the coating film was cured by ultraviolet irradiation to form a cured resin layer with a thickness of 1 μm.

[0146] The laminate of Example 1 was produced as described above. The laminate of Example 1 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In2O3 + Cu layer, thickness 25 nm), a third inorganic layer (ITO layer, thickness 20 nm), and a cured resin layer (thickness 1 μm).

[0147] Example 2 The laminate of Example 2 was produced in the same manner as the laminate of Example 1, except for the following. In the second sputter film formation process of the sputter film formation, the thickness of the second inorganic layer (In2O3 + Cu layer) to be formed was set to 50 nm, and the third sputter film formation was not performed. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Example 2 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In2O3 + Cu layer, thickness 50 nm), and a cured resin layer (thickness 1 μm).

[0148] Example 3 A laminate of Example 3 was produced in the same manner as the laminate of Example 2, except for the following. In the second sputter film formation of the sputter film formation process, the thickness of the first inorganic layer (Al layer) to be formed was 125 nm, and in the second sputter film formation, the thickness of the second inorganic layer (In2O3+Cu layer) to be formed was 100 nm, and the third sputter film formation was not carried out. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Example 3 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 125 nm), a second inorganic layer (In2O3+Cu layer, thickness 100 nm), and a cured resin layer (thickness 1 μm).

[0149] Example 4 A laminate of Example 4 was produced in the same manner as the laminate of Example 1, except for the following. In the second sputter film formation of the sputter film formation process, the thickness of the first inorganic layer (Al layer) to be formed was 300 nm, and in the second sputter film formation, the thickness of the second inorganic layer (In2O3+Cu layer) to be formed was 25 nm, and the third sputter film formation was not carried out. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Example 4 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 300 nm), a second inorganic layer (In2O3+Cu layer, thickness 25 nm), and a cured resin layer (thickness 1 μm).

[0150] Comparative Example 1 A laminate of Comparative Example 1 was produced in the same manner as the laminate of Example 1, except for the following. In the sputter film formation process, the third sputter film formation was not carried out. That is, the cured resin layer was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Comparative Example 1 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In2O3+Cu layer, thickness 25 nm), and a cured resin layer (thickness 1 μm).

[0151] Comparative Example 2 A laminate of Comparative Example 2 was produced in the same manner as the laminate of Example 1, except as follows. In the sputtering film formation process, the third sputtering film formation was not performed, and further, a cured resin layer with a thickness of 3 μm was formed on the inorganic layer (specifically, the second inorganic layer). The laminate of Comparative Example 2 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In2O3+Cu layer, thickness 25 nm), and a cured resin layer (thickness 3 μm).

[0152] Comparative Example 3 A laminate of Comparative Example 3 was produced in the same manner as the laminate of Example 1, except as follows. In the sputtering film formation process, the second and third sputtering film formations were not performed, and further, a cured resin layer with a thickness of 0.5 μm was formed on the first inorganic layer (Al layer). The laminate of Comparative Example 3 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), and a cured resin layer (thickness 0.5 μm).

[0153] Comparative Example 4 A laminate of Comparative Example 4 was produced in the same manner as the laminate of Example 1, except as follows. A cured resin layer with a thickness of 3 μm was formed on the inorganic layer (specifically, the third inorganic layer). The laminate of Comparative Example 4 had a laminated structure of a base film (PET film, thickness 38 μm), a first inorganic layer (Al layer, thickness 75 nm), a second inorganic layer (In2O3+Cu layer, thickness 25 nm), a third inorganic layer (ITO layer, thickness 20 nm), and a cured resin layer (thickness 3 μm).

[0154] <Evaluation> [Thickness of each layer] The thicknesses of each layer (inorganic layer (specifically, the first inorganic layer, the second inorganic layer, and the third inorganic layer), cured resin layer) in the laminates of each example and each comparative example were measured by observation with a field emission transmission electron microscope (FE-TEM). Specifically, first, samples for cross-sectional observation of the laminates of each example and each comparative example were prepared by the FIB micro-sampling method. In the FIB micro-sampling method, an FIB apparatus (product name: FB2200, manufactured by Hitachi) was used, and the acceleration voltage was set to 10 kV. Next, the cross-section of the laminate in the cross-sectional observation sample was observed by FE-TEM, and in the observation image, the thicknesses of the inorganic layer (specifically, the first inorganic layer, the second inorganic layer, and the third inorganic layer) and the cured resin layer were measured. In the same observation, an FE-TEM apparatus (product name: JEM-2800, manufactured by JEOL) was used, and the acceleration voltage was set to 200 kV. The results are shown in Table 1. In Table 1, the total thickness of the first inorganic layer, the second inorganic layer, and the third inorganic layer is described as the thickness T1 (nm) of the inorganic layer, and the thickness of the cured resin layer is described as T2 (nm). Also, the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer was calculated. The results are also shown in Table 1 together.

[0155] [Edge wrinkle (appearance)] The laminates of each example and each comparative example were cut into 300 mm (width direction) × 1.5 m (flow direction (MD direction) of the work film (laminate)) to prepare samples for edge wrinkle evaluation. Next, both ends in the long side direction (flow direction (MD direction) of the work film (laminate)) of each prepared sample for edge wrinkle evaluation were held by hand, and the sample for edge wrinkle evaluation was hung so that the height difference between the center (the most sagging part) and both ends was about 30 cm. The state of the edge of the hung sample for edge wrinkle evaluation was visually confirmed and evaluated according to the following criteria. The results are shown in Table 1. {Criteria} ○: No wrinkle occurs at the edge. ×: Thin wrinkles occur throughout the edge, and the interval is about 50 mm. ××: Strong wrinkles occur throughout the edge, and the interval is about 100 mm.

[0156]

Table 1

Explanation of Symbols

[0157] 1 Laminate 2 Resin Film 3 Inorganic Layer 4 Cured Resin Layer 31 First Inorganic Layer 32 Second Inorganic Layer 33 Third Inorganic Layer

Claims

1. A laminate including a resin film, an inorganic layer, and a cured resin layer, which are provided in this order toward one side in the thickness direction. The thickness T1 of the inorganic layer is 110 nm or more and 1000 nm or less. A laminate in which the ratio (T2 / T1) of the thickness T2 (nm) of the cured resin layer to the thickness T1 (nm) of the inorganic layer is 1.0 or more and less than 10.

0.

2. The laminate according to claim 1, wherein the thickness of the resin film is 100 μm or less.

3. The laminate according to claim 1, wherein the inorganic layer contains at least one selected from the group consisting of a metal layer, a metal oxide layer, and a metal nitride layer.

4. The laminate according to claim 1, wherein the inorganic layer includes a first inorganic layer and a second inorganic layer, which are provided in this order toward one side in the thickness direction.

5. The first inorganic layer is a metal layer. The laminate according to claim 4, wherein the second inorganic layer is a layer containing a metal oxide and a simple metal.

6. The laminate according to claim 4, wherein the inorganic layer further includes a third inorganic layer disposed on one side in the thickness direction of the second inorganic layer.

7. The laminate according to claim 6, wherein the third inorganic layer is a metal oxide layer.

8. The laminate according to claim 1, wherein the inorganic layer includes a blackened layer.

9. The laminate according to claim 1, wherein the thickness T2 of the cured resin layer is 1000 nm or more.

10. A reflective film including the laminate according to any one of claims 1 to 9.

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