Component imaging device and component mounting device

Abstract

To provide a component imaging device and a component mounting device that can suppress unevenness in brightness at an imaging location of a component in an image captured by a component imaging unit.SOLUTION: A component imaging device 7 includes: an imaging portion 72 that images a component E mounted on a board Sb; and a plurality of line laser irradiation portions 75 (76) that each irradiate an imaging location Pim of the component E imaged by the imaging portion 72 with a first line laser La1 (La2) extending in a straight line. Each of the plurality of line laser irradiation portions 75 (76) is disposed such that the plurality of first line lasers La1 (La2) respectively irradiated from the plurality of line laser irradiation portions 75 (76) are overlapped at the imaging location Pim.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a component imaging device and a component mounting device, and more particularly to a component imaging device and a component mounting device including an imaging unit that images a component to be mounted on a substrate.

Background Art

[0002] Conventionally, a component imaging device including an imaging unit that images a component to be mounted on a substrate has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a component imaging device including a camera (imaging unit) that images a component to be mounted on a substrate.

[0004] The component imaging device of Patent Document 1 includes a camera and a laser illumination unit. The camera is configured to image a component adsorbed by a suction nozzle from below. The laser illumination unit is configured to irradiate a linear laser when the component is imaged by the camera.

[0005] The component imaging device of Patent Document 1 performs imaging by the camera while moving a component adsorbed by a suction nozzle above the camera and irradiating a linear laser from the laser illumination unit toward the tip of the lead wire of the component. Based on the image of the tip of the lead wire of the imaged component, inspections such as displacement of the tip of the lead wire of the component and bending of the lead wire are performed.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, in the component imaging device of Patent Document 1 described above, it is considered that in the linear laser irradiated from the laser illumination unit, the light intensity at the center part is high and the light intensity at the end part is low, resulting in unevenness in the light intensity. In this case, it is considered that unevenness occurs in the luminance of the imaging location such as the tip of the lead wire of the component in the image captured by the camera. Therefore, by suppressing the unevenness in the light intensity of the linear laser (line laser) irradiated from the laser illumination unit (line laser irradiation unit) toward the component, it is desired to suppress the occurrence of unevenness in the luminance of the imaging location of the component in the image captured by the camera (imaging unit).

[0008] This invention has been made to solve the above-described problems, and one object of this invention is to provide a component imaging device and a component mounting device capable of suppressing the occurrence of unevenness in the luminance of the imaging location of a component in an image captured by a component imaging unit.

Means for Solving the Problems

[0009] The component imaging device according to the first aspect of this invention includes an imaging unit that images a component to be mounted on a substrate, and a plurality of line laser irradiation units that each irradiate a line laser extending linearly toward the imaging location of the component imaged by the imaging unit. Each of the plurality of line laser irradiation units is arranged so that the plurality of line lasers irradiated from each of the plurality of line laser irradiation units are superimposed at the imaging location.

[0010] In the component imaging device according to the first aspect of the present invention, as described above, each of the plurality of line laser irradiation units is arranged so as to overlap the plurality of line lasers irradiated from each of the plurality of line laser irradiation units at the imaging location. As a result, by overlapping the line lasers irradiated from each of the plurality of line laser irradiation units, the unevenness in the light intensity of one line laser can be compensated for by other line lasers, so that the occurrence of unevenness in the light intensity of the line lasers can be suppressed. As a result, by suppressing the unevenness in the light intensity of the line laser irradiated from the line laser irradiation unit toward the component, it is possible to suppress the occurrence of unevenness in the luminance of the imaging location of the component in the image captured by the imaging unit. Further, by overlapping the line lasers irradiated from each of the plurality of line laser irradiation units, the light intensity can be increased by the amount of overlap, so that it is possible to suppress a decrease in the luminance value of the imaging location (for example, the tip of the lead wire of the component, etc.) in the image captured by the imaging unit.

[0011] In the component imaging device according to the first aspect, preferably, the plurality of line lasers are overlapped with each other in a state where the peak positions of the luminance of each of the plurality of line lasers are shifted in the direction in which the line lasers extend linearly. With this configuration, the portion where the light intensity of one of the plurality of line lasers is maximum can be overlapped with the portion where the light intensity of the other line lasers is low, so that it is possible to suppress the occurrence of unevenness in the light intensity of the overlapped line lasers.

[0012] In the component imaging device according to the first aspect, preferably, a lighting unit that emits illumination light from below toward the component is further provided separately from the plurality of line laser irradiation units. When the imaging unit images the component, the imaging unit is disposed at a position below the lighting unit in order to image the component from below, and each of the plurality of line laser irradiation units is disposed between the imaging unit and the lighting unit in the vertical direction. With this configuration, since the lighting unit is disposed above the plurality of line laser irradiation units, the illumination light emitted from the lighting unit can be prevented from being obstructed by each of the plurality of line laser irradiation units.

[0013] In this case, preferably, the plurality of line laser irradiation units are arranged such that their height positions are aligned between the imaging unit and the lighting unit. With this configuration, it is possible to suppress an increase in the vertical space for arranging the plurality of line laser irradiation units, and thus it is possible to suppress an increase in the size of the imaging device in the vertical direction.

[0014] In the component imaging device according to the first aspect, preferably, the plurality of line laser irradiation units are arranged to be line-symmetric in a plan view with respect to an axis extending along the direction in which the line laser scans the component. With this configuration, since the line lasers emitted from each of the plurality of line laser irradiation units are irradiated in a position relationship that is line-symmetric with respect to the axis extending along the direction in which the line laser scans the component with respect to the component in a plan view, an operator can easily recognize the method of overlapping the plurality of line lasers. As a result, the operator can easily perform the adjustment of overlapping the plurality of line lasers.

[0015] In the component imaging device according to the first aspect, preferably, each of the plurality of line laser irradiation units includes a cylindrical rod lens that irradiates the laser irradiated from a light source as a line laser, a mirror that is disposed together with the rod lens on the central axis of each of the plurality of line laser irradiation units and reflects the line laser irradiated from the rod lens, and a relative rotation position adjustment unit that includes the rod lens and the mirror and is configured to be able to adjust the relative rotation between the rod lens and the mirror around the central axis of each of the plurality of line laser irradiation units. With this configuration, the inclination of the line laser reflected by the mirror can be adjusted by the relative rotation position adjustment unit. Therefore, by adjusting the inclination in accordance with the direction in which the imaging elements of the imaging unit are arranged, the reflected light reflected from the imaging location can be received by the entire imaging elements of the imaging unit.

[0016] In this case, preferably, the cylindrical rod lens is arranged such that the central axis of each of the plurality of line laser irradiation units is orthogonal to the central axis of the cylindrical rod lens, and the reflection surface on the rod lens side of the mirror is configured to be able to reflect the line laser irradiated from the rod lens after adjustment using the relative rotation position adjustment unit. With this configuration, since the line laser is irradiated within the reflection surface of the mirror regardless of the relative rotation position of the rod lens after adjustment, all the line lasers after adjustment can be reflected. As a result, it is possible to suppress a decrease in the reflected light traveling toward the imaging unit due to the line laser irradiated from the rod lens after adjustment deviating from the mirror, and thus it is possible to suppress a decrease in the luminance of the imaging location of the component in the image captured by the imaging unit.

[0017] In the component imaging device in which the plurality of line laser irradiation units include a relative rotation position adjustment unit, preferably, a clamping unit is further provided that is provided corresponding to each of the plurality of line laser irradiation units and is configured to be able to sandwich the outer peripheral portions of each of the plurality of line laser irradiation units so as to be switchable between a holding state and a holding release state. With this configuration, since the holding state and the holding release state can be easily switched by the clamping unit, each of the plurality of line laser irradiation units can be easily held after adjustment of each of the plurality of line laser irradiation units.

[0018] In this case, preferably, a relative position adjustment unit is further provided corresponding to each of the plurality of line laser irradiation units, and the relative position adjustment unit individually moves each of the plurality of line laser irradiation units relative to the imaging unit in each of the direction approaching the imaging unit and the direction away from the imaging unit. With this configuration, the relative position adjustment unit can relatively bring one line laser and another line laser closer to the position of the imaging element of the first imaging unit, so that the plurality of line lasers can be superimposed on each other at the position of the imaging element of the first imaging unit.

[0019] In the component mounting apparatus in which the plurality of line laser irradiation units include a relative rotational position adjustment unit, preferably, each of the plurality of line laser irradiation units is arranged such that the lens center of the imaging unit is located on the central axis of each of the plurality of line laser irradiation units in a plan view. With this configuration, by arranging each of the plurality of line laser irradiation units at a position away from the lens center of the imaging unit by at least the radius of the lens of the imaging unit, in a plan view, each of the plurality of line laser irradiation units can be prevented from overlapping the lens of the imaging unit. As a result, while suppressing the overlap between each of the plurality of line laser irradiation units and the lens of the imaging unit, each of the plurality of line laser irradiation units can be arranged at a relatively close position to the lens, so that an increase in the size of the component imaging apparatus in the radial direction of the lens center can be suppressed.

[0020] The component mounting apparatus according to the second aspect of the present invention includes a head unit including a head to which a nozzle for holding a component to be mounted on a substrate is attached, an imaging unit for imaging a component to be mounted on the substrate, and a plurality of line laser irradiation units each irradiating a line laser extending linearly toward an imaging location imaged by the imaging unit among the components. Each of the plurality of line laser irradiation units is arranged such that the plurality of line lasers irradiated from each of the plurality of line laser irradiation units are superimposed at the imaging location.

[0021] In the component mounting apparatus according to the second aspect of the present invention, as described above, each of the plurality of line laser irradiation units is arranged so as to overlap the plurality of line lasers irradiated from each of the plurality of line laser irradiation units at the imaging location. As a result, by overlapping the line lasers irradiated from each of the plurality of line laser irradiation units, the unevenness in the light intensity of one line laser can be compensated for by other line lasers, so that the occurrence of unevenness in the light intensity of the line lasers can be suppressed. As a result, by suppressing the unevenness in the light intensity of the line laser irradiated from the line laser irradiation unit toward the component, it is possible to provide a component mounting apparatus capable of suppressing the occurrence of unevenness in the luminance of the imaging location of the component in the image captured by the imaging unit.

Effect of the Invention

[0022] According to the present invention, as described above, it is possible to suppress the occurrence of unevenness in the luminance of the imaging location of the component in the image captured by the component imaging unit.

Brief Description of the Drawings

[0023]

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Mode for Carrying Out the Invention

[0024] Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

[0025] With reference to FIGS. 1 to 25, the configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described.

[0026] (Component mounting apparatus) As shown in FIG. 1, the component mounting apparatus 100 is an apparatus that performs a mounting operation of mounting a component E on a substrate Sb on which solder is printed.

[0027] Here, in the component mounting apparatus 100, the conveyance direction for conveying the substrate Sb is defined as the X1 direction, the reverse direction of the conveyance direction for conveying the substrate Sb is defined as the X2 direction, and the combined direction of the X1 direction and the X2 direction is defined as the X direction. Also, the direction orthogonal to the X direction among the horizontal directions is defined as the Y direction, one side of the Y direction is defined as the Y1 direction, and the other side of the Y direction is defined as the Y2 direction. Further, the vertical direction orthogonal to the X direction and the Y direction is defined as the Z direction, the upward direction is defined as the Z1 direction, and the downward direction is defined as the Z2 direction.

[0028] The component mounting apparatus 100 includes a base 1, a feeder arrangement section 2, a substrate conveyance section 3, a support section 4, a pair of rail sections 5, a head unit 6, a component imaging section 7, a substrate imaging section 8, a control section 9, and a display section 10. Note that the component imaging section 7 is an example of the "component imaging device" in the claims.

[0029] The base 1 is a base that serves as the foundation for arranging each component in the component mounting apparatus 100. The feeder arrangement section 2 is provided on each of the Y1 direction side and the Y2 direction side of the base 1.

[0030] A plurality of tape feeders 200 can be arranged in the feeder arrangement section 2. The tape feeder 200 is configured to supply the component E to be mounted on the substrate Sb.

[0031] The substrate conveyance section 3 is configured to carry the substrate Sb into the component mounting apparatus 100 from the outside and convey the substrate Sb in the conveyance direction (X1 direction). The substrate conveyance section 3 includes a pair of conveyors 31 and a drive section (not shown).

[0032] The support section 4 is configured to support the head unit 6 so as to be movable in the X direction. The support section 4 includes a ball screw shaft 41 and a drive section 42.

[0033] The pair of rail sections 5 is configured to support the support section 4 so as to be movable in the Y direction. The rail section 5 includes a ball screw shaft 51, a guide rail 52, and a drive section 53.

[0034] As shown in FIG. 2, the head unit 6 is a head unit for component mounting, configured to move in the Z1 direction (upward) of the substrate Sb and perform mounting operations on the substrate Sb. That is, the head unit 6 is configured to mount the component E on the substrate Sb fixed at the substrate working position W.

[0035] Specifically, the head unit 6 includes a mounting head 61, a Z-axis motor 62, and an R-axis motor (not shown). The mounting head 61 is configured to adsorb the component E supplied by the tape feeder 200 with the suction nozzle 63 and mount it on the substrate Sb. The component E is mounted at a predetermined mounting position (not shown) on the substrate Sb. A plurality (five) of the mounting heads 61 are arranged in a row in the X direction. In this way, the head unit 6 is an in-line head with the mounting heads 61 arranged in a row in the X direction. Note that one or more and four or less, or six or more of the mounting heads 61 may be arranged side by side.

[0036] A detachable suction nozzle 63 is attached to the tip of each of the plurality of mounting heads 61. Each of the plurality of mounting heads 61 is connected to a negative pressure generating device (not shown), and is configured to adsorb the component E to the suction nozzle 63 by the negative pressure generated by the negative pressure generating device. Also, each of the plurality of mounting heads 61 is connected to a positive pressure generating device, and is configured to mount the component E on the substrate Sb by the positive pressure generated by the positive pressure generating device.

[0037] Each of the plurality of mounting heads 61 is configured to be movable in the Z direction (vertical direction) by the Z-axis motor 62. Also, each of the plurality of mounting heads 61 is configured to be rotatable about the rotation axis by the R-axis motor.

[0038] As shown in FIG. 1, the component imaging unit 7 is configured to image the component E mounted on the substrate Sb. That is, the component imaging unit 7 is a camera for component imaging that images the component E adsorbed by the suction nozzle 63 prior to mounting the component E on the substrate Sb. The component imaging unit 7 is fixed on the base 1 and is configured to image the component E adsorbed by the suction nozzle 63 from below (in the Z2 direction) of the component E. Note that the component imaging unit 7 will be described in detail later.

[0039] The substrate imaging unit 8 is attached to the head unit 6 and is a camera for mark imaging that images the FI mark (Fiducial Mark) F attached to the upper surface of the substrate Sb prior to mounting the component E on the substrate Sb. The FI mark F is a mark for confirming the position of the substrate Sb.

[0040] (Control Unit) The control unit 9 controls the component mounter 100. The control unit 9 includes a CPU (Central Processing Unit), a storage unit having an SSD (Solid State Drive) and an HDD (Hard Disk Drive), etc., and a memory having a ROM (Read Only Memory) and a RAM (Random Access Memory), etc. A component mounting program for mounting the component E on the substrate Sb is stored in the storage unit.

[0041] The display unit 10 is composed of a liquid crystal screen or the like. The display unit 10 is configured to display on the screen an image captured by the component imaging unit 7 received from the control unit 9.

[0042] (Detailed Configuration of Component Imaging Unit) As shown in FIG. 3, the component imaging unit 7 includes a base portion 71, a first imaging unit 72, a second imaging unit 73, an illumination unit 74, a first line laser irradiation unit 75, a second line laser irradiation unit 76, and a mounting member 77. Note that the first imaging unit 72 is an example of the "imaging unit" in the claims.

[0043] The base 71 is a member for fixing the configuration of the component imaging unit 7 to the base 1. Each of the first imaging unit 72, the second imaging unit 73, and the mounting member 77 is fixed to the base 71. The base 71 has a first frame 71a, a second frame 71b, and a third frame 71c. The first frame 71a is fixed to the base 1. The first imaging unit 72, the second frame 71b, and the third frame 71c are fixed to the first frame 71a. The second frame 71b is a member for fixing the second imaging unit 73 and the mounting member 77 to the first frame 71a. The third frame 71c is a member for fixing a lens unit 72b, which will be described later, of the first imaging unit 72 to the first frame 71a.

[0044] (First imaging unit) As shown in FIG. 4, the first imaging unit 72 is configured to image a component E mounted on a substrate Sb. The first imaging unit 72 is arranged at a position in the Z2 direction closer than the illumination unit 74 in order to image the component E from the Z2 direction side. The first imaging unit 72 has a camera unit 72a, a lens unit 72b, and a shielding unit 72c. The camera unit 72a has a plurality of imaging elements 721a arranged in a matrix. The lens unit 72b has a lens 721b for adjusting the focusing distance Df of the camera unit 72a. The shielding unit 72c is a plate member surrounding the periphery of the lens unit 72b.

[0045] The first imaging unit 72 has an area sensor camera function having a plurality of imaging elements 721a arranged in a matrix. When the first imaging unit 72 is used as an area sensor camera, the entire portion of the component E on the Z2 direction side is imaged from the Z2 direction side by the non-directional illumination light irradiated from the illumination unit 74.

[0046] The first imaging unit 72 has a line sensor camera function using a plurality of imaging elements 7211a arranged linearly along the Y direction among a plurality of imaging elements 721a arranged in a matrix. When the first imaging unit 72 is used as a line sensor camera, it is configured to image the tip of the lead wire E1 of the component E by the first line laser La1 irradiated from the first line laser irradiation unit 75 and the second line laser La2 irradiated from the second line laser irradiation unit 76 (see FIG. 3).

[0047] Here, when the first imaging unit 72 is used as a line sensor camera, the first imaging unit 72 is configured to image an imaging location Pim (the tip of the lead wire E1 of the component E in FIG. 4) among the imaging targets. The imaging location Pim is set based on the focusing distance Df of the first imaging unit 72 and the Pse position of the imaging element 7211a. That is, the focusing distance Df indicates the distance to the focal point of the lens 721b. The Pse position is the XY-direction position of the plurality of imaging elements 7211a arranged linearly in the Y direction. Due to these, the imaging location Pim is the location where the straight line extended in the Z1 direction from the Pse position intersects the plane at a position Df away from the lens 721b. In FIG. 4, as an example, when the first imaging unit 72 is used as a line sensor camera, a plurality of imaging elements 7211a arranged in the Y direction in the central portion in the X direction among the plurality of imaging elements 721a arranged in a matrix are used for imaging the imaging location Pim.

[0048] The first imaging unit 72 has a function as a line sensor camera in order to acquire a composite image used for inspecting the lead wire E1 of the component E. Specifically, in the component mounting apparatus 100, with the height position of the mounting head 61 adjusted so that the tip position of the lead wire E1 of the component E matches the imaging location Pim, the component E is moved in the X direction above the first imaging unit 72 by the head unit 6. This movement in the X direction is the direction in which the component E is scanned. At this time, in the component mounting apparatus 100, imaging of the tips of the lead wires E1 of the component E is performed multiple times based on the movement position of the head unit 6 in the XY directions. Also, in the component mounting apparatus 100, when the component E is too large in the Y direction to fit within the imaging range of the first imaging unit 72, after scanning the component E by moving it in the X direction, the component E may be moved again in the X direction from the position where it was moved in the Y direction and scanned again. In the component mounting apparatus 100, imaging images of the tips of the lead wires E1 of a plurality of components E are combined to obtain a composite image showing the tips of all the lead wires E1 of the component E. Based on this composite image, misalignment of the tip positions of the lead wires E1 of the component E and bending of the lead wires E1 are inspected.

[0049] Whether to perform inspection by the illumination unit 74 using the first imaging unit 72 as an area sensor camera or to perform inspection by the first line laser irradiation unit 75 and the second line laser irradiation unit 76 using the first imaging unit 72 as a line sensor camera is preset for each component E.

[0050] (Second imaging unit) The second imaging unit 73 is configured to image the component E to be mounted on the substrate Sb. The second imaging unit 73 is configured to image the component E obliquely from the Z2 direction while irradiating the component E with illumination light from the illumination unit 74 from the Z2 direction side. The second imaging unit 73 is a camera for acquiring an inspection image used for inspecting the Z-direction variation of the lead wire E1 of the component E. The second imaging unit 73 is disposed between the first line laser irradiation unit 75 and the second line laser irradiation unit 76 in the Y direction.

[0051] (Illumination unit) The illumination unit 74 is configured to irradiate the component E with non-directional illumination light from the Z2 direction side. The illumination unit 74 is provided separately from the first line laser irradiation unit 75 and the second line laser irradiation unit 76. The illumination unit 74 is configured to emit illumination light from the Z2 direction side toward the component E when the component E is imaged by the second imaging unit 73. The illumination unit 74 includes a light source unit 74a and an illumination frame 74b. The light source unit 74a includes a plurality of LEDs (Light Emitting Diodes) and an illumination substrate. The illumination frame 74b has a surface for mounting the light source unit 74a with the LEDs directed obliquely upward. The illumination frame 74b is attached to the end portion on the Z1 direction side of the shielding unit 72c. A through hole 741b is formed in the illumination frame 74b to expose both the camera unit 72a and the lens unit 72b. The light source unit 74a is arranged so as to surround the through hole 741b.

[0052] (First line laser irradiation unit and second line laser irradiation unit) As shown in FIG. 5, the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are configured to irradiate the imaging location Pim of the component E imaged by the first imaging unit 72 with the first line laser La1 and the second line laser La2 that linearly extend. The first line laser La1 is irradiated from the tip of the first line laser irradiation unit 75 toward the imaging location Pim obliquely upward. The irradiation direction of the first line laser La1 as viewed from the Y2 direction side is the direction in which the first line laser La1 intersects the imaging location Pim. The second line laser La2 is irradiated from the tip of the second line laser irradiation unit 76 toward the imaging location Pim obliquely upward. The irradiation direction of the second line laser La2 as viewed from the Y2 direction side is the direction in which the second line laser La2 intersects the imaging location Pim.

[0053] Each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 of the present embodiment is arranged so as to overlap the first line laser La1 irradiated from the first line laser irradiation unit 75 and the second line laser La2 irradiated from the second line laser irradiation unit 76 at the imaging location Pim.

[0054] Specifically, as shown in FIG. 6, the first line laser La1 and the second line laser La2 are overlapped with each other in a state where the peak positions Pe1 and Pe2 of the luminance of the first line laser La1 and the second line laser La2 are shifted in the linearly extending direction (Y direction) of the first line laser La1 (or the second line laser La2).

[0055] The graph in FIG. 6 shows the relationship between the position from the lens center Lec (see FIG. 7) of the lens 721b and the luminance value of the image captured by the first imaging unit 72. The position from the lens center Lec is a position away from the lens center Lec in the Y1 direction and the Y2 direction.

[0056] In the line laser shown as a comparative example in FIG. 6, the peak position Pec is the lens center Lec. The peak position Pe1 of the first line laser La1 is a position shifted in the Y2 direction from the lens center Lec. The peak position Pe2 of the second line laser La2 is a position shifted in the Y1 direction from the lens center Lec. The peak position Pe1 of the first line laser La1 and the peak position Pe2 of the second line laser La2 are shifted by a predetermined distance De. The peak position Pe of the line laser La0 obtained by overlapping the first line laser La1 and the second line laser La2 is the lens center Lec. The luminance value at the peak position Pe of the overlapped line laser La0 is larger than any of the luminance value at the peak position Pec of the line laser of the comparative example, the luminance value Bri1 at the peak position Pe1 of the first line laser La1, and the luminance value Bri2 at the peak position Pe2 of the second line laser La2.

[0057] The luminance value Bri1 at the peak position Pe1 of the first line laser La1 is the same as the luminance value Bri2 at the peak position Pe2 of the second line laser La2. Also, the illuminance distribution of the luminance values at positions other than the peak position Pe1 of the first line laser La1 is an illuminance distribution symmetric to the distribution of the luminance value Bri2 at positions other than the peak position Pe2 of the second line laser La2. Here, the symmetric illuminance distribution means the illuminance distribution on one side and the illuminance distribution on the other side that are symmetric about the lens center Lec of the lens 721b.

[0058] The difference Di between the luminance value at the peak position Pe of the superimposed line laser La0 and the minimum value of the luminance values of the superimposed line laser La0 is smaller than the difference Dic between the luminance value at the peak position Pec of the line laser in the comparative example and the minimum value of the luminance values of the line laser in the comparative example.

[0059] In this way, the superimposed line laser La0 is a laser obtained by superimposing the first line laser La1 and the second line laser La2 in a state where the peak position Pe1 of the first line laser La1 and the peak position Pe2 of the second line laser La2 are shifted.

[0060] Also, as shown in FIG. 4, the first line laser irradiation unit 75 is disposed between the first imaging unit 72 and the illumination unit 74. Similarly, the second line laser irradiation unit 76 is disposed between the first imaging unit 72 and the illumination unit 74. The tip of each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is inserted into the space between the end on the Z1 direction side of the lens unit 72b of the first imaging unit 72 and the end on the Z2 direction side of the illumination frame 74b of the illumination unit 74.

[0061] As shown in FIG. 5, the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are arranged so that their height positions are aligned between the first imaging unit 72 and the illumination unit 74. The first line laser irradiation unit 75 and the second line laser irradiation unit 76 are adjacent to each other in the Y direction.

[0062] As shown in FIG. 7, when the first line laser irradiation unit 75 and the second line laser irradiation unit 76 image the imaging location Pim of the component E by the first imaging unit 72, the first line laser La1 and the second line laser La2 are arranged to be line-symmetrical with respect to the axis Axs extending along the scanning direction with respect to the component E in a state where they are overlapped with each other, in a plan view. The first line laser irradiation unit 75 and the second line laser irradiation unit 76 are arranged to be line-symmetrical with respect to the axis Axs in a region on the X2-direction side of the lens center Lec in a plan view. The scanning direction is the direction of movement perpendicular to the X direction with respect to a plurality of imaging elements 7211a arranged linearly in the Y direction when imaging the component E by the first imaging unit 72. In FIG. 7, the axis Axs extends parallel to the X direction in a plan view and is an axis passing through the lens center Lec.

[0063] The first line laser irradiation unit 75 and the second line laser irradiation unit 76 are arranged such that the lens center Lec of the first imaging unit 72 is located on the central axis Axc1 of the first line laser irradiation unit 75 and on the central axis Axc2 of the second line laser irradiation unit 76, respectively, in a plan view. Each of the central axis Axc1 of the first line laser irradiation unit 75 and the central axis Axc2 of the second line laser irradiation unit 76 extends along the radial direction of the lens center Lec in a plan view. The tip portions of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are each exposed from the through hole 741b in a plan view. The tip of the first line laser irradiation unit 75 and the tip of the second line laser irradiation unit 76 are each arranged inside the edge of the lens 721b and outside the imaging range of the first imaging unit 72 in a plan view.

[0064] (Detailed structure of the first line laser irradiation unit and the second line laser irradiation unit) With reference to FIGS. 8 to 13, the detailed structure of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 will be described. Since each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 has a similar structure, only the first line laser irradiation unit 75 will be described.

[0065] As shown in FIG. 8, the first line laser irradiation unit 75 includes a power supply unit 751, a cable 752, a laser oscillator 753, a rod lens mounting member 754 (see FIG. 9), a mirror mounting member 755, a rod lens 756, and a mirror 757. The laser oscillator 753 is an example of the "light source unit" in the claims.

[0066] The power supply unit 751 is configured to convert power necessary for the laser oscillator 753. The cable 752 connects the power supply unit 751 and the laser oscillator 753 to supply the power generated in the power supply unit 751 to the laser oscillator 753. The laser oscillator 753 is a light source that irradiates a laser La toward the rod lens 756 based on the power of the power supply unit 751 supplied via the cable 752. The laser oscillator 753 has a laser diode.

[0067] 〈Rod lens mounting member〉 As shown in FIG. 9, the rod lens mounting member 754 is a member for mounting the rod lens 756 at the tip portion on the side opposite to the laser oscillator 753 side. A through hole through which the laser La irradiated from the laser oscillator 753 passes is formed in the rod lens mounting member 754. This through hole penetrates the rod lens mounting member 754 along the direction from the laser oscillator 753 toward the rod lens 756.

[0068] The rod lens mounting member 754 has a first cylindrical portion 754a, a second cylindrical portion 754b, and a third cylindrical portion 754c. Each of the first cylindrical portion 754a, the second cylindrical portion 754b, and the third cylindrical portion 754c is provided in this order from the laser oscillator 753 side toward the rod lens 756 side.

[0069] The first cylindrical portion 754a is integrally provided on the side of the rod lens 756 of the laser oscillator 753. The second cylindrical portion 754b is integrally provided on the first cylindrical portion 754a. The outer diameter of the second cylindrical portion 754b is smaller than the outer diameter of the first cylindrical portion 754a. The third cylindrical portion 754c is integrally provided on the second cylindrical portion 754b. The outer diameter of the third cylindrical portion 754c is smaller than the outer diameter of the second cylindrical portion 754b. The third cylindrical portion 754c has an elongated shape extending along the direction from the laser oscillator 753 toward the rod lens 756.

[0070] 〈Mirror mounting member〉 As shown in FIG. 9, the mirror mounting member 755 is a member for mounting the mirror 757 at the tip portion on the side opposite to the laser oscillator 753 side. The mirror mounting member 755 is formed with accommodation holes for accommodating each of the second cylindrical portion 754b and the third cylindrical portion 754c of the rod lens mounting member 754. These accommodation holes penetrate the mirror mounting member 755 along the direction from the laser oscillator 753 toward the rod lens 756.

[0071] The mirror mounting member 755 has a first cylindrical portion 755a, a second cylindrical portion 755b, and a mirror mounting portion 755c. The first cylindrical portion 755a, the second cylindrical portion 755b, and the mirror mounting portion 755c are provided in this order side by side from the laser oscillator 753 side toward the mirror 757 side.

[0072] The first cylindrical portion 755a has an accommodation hole for accommodating one side portion on the laser oscillator 753 side of the second cylindrical portion 754b therein. The end face on the laser oscillator 753 side of the first cylindrical portion 755a is a face for abutting against the stepped face between the first cylindrical portion 754a and the second cylindrical portion 754b of the rod lens mounting member 754.

[0073] The second cylindrical portion 755b is integrally provided on the first cylindrical portion 755a. The second cylindrical portion 755b has a receiving hole for receiving the other side portion on the mirror 757 side of the second cylindrical portion 754b therein. The outer diameter of the second cylindrical portion 755b is smaller than the outer diameter of the first cylindrical portion 755a. A screw hole 7551b for inserting a screw (not shown) for pressing the outer peripheral surface of the second cylindrical portion 754b is formed in the second cylindrical portion 755b. The screw hole 7551b penetrates the second cylindrical portion 755b in a direction orthogonal to the direction from the laser oscillator 753 side toward the mirror 757 side.

[0074] The mirror mounting portion 755c is integrally provided on the second cylindrical portion 755b. The mirror mounting portion 755c has a receiving hole for receiving the third cylindrical portion 754c therein. The mirror mounting portion 755c has a pair of protruding portions 7551c. Each of the pair of protruding portions 7551c protrudes in the direction from the laser oscillator 753 side toward the mirror 757 side. A mirror 757 is mounted between the pair of protruding portions 7551c.

[0075] A space is formed between the pair of protruding portions 7551c for the laser La irradiated from the laser oscillator 753 to enter the rod lens 756. Also, a space is formed between the pair of protruding portions 7551c for the first line laser La1 irradiated from the rod lens 756 to enter the mirror 757. Also, a space is formed between the pair of protruding portions 7551c for the first line laser La1 irradiated from the mirror 757 to exit outside the first line laser irradiation portion 75.

[0076] 〈Relative Rotation Position Adjusting Portion〉 As shown in FIG. 9, the first line laser irradiation portion 75 includes a relative rotation position adjusting portion capable of adjusting the relative rotation of the rod lens 756 and the mirror 757 relative to each other around the central axis Axc1 of the first line laser irradiation portion 75. The relative rotation position adjusting portion has a rod lens mounting member 754, a mirror mounting member 755, and a screw (not shown).

[0077] That is, after attaching the mirror mounting member 755 to the rod lens mounting member 754 such that the end face of the first cylindrical portion 755a of the mirror mounting member 755 on the laser oscillator 753 side abuts against the stepped surface between the first cylindrical portion 754a and the second cylindrical portion 754b of the rod lens mounting member 754, an operator rotates the rod lens mounting member 754 relative to the mirror mounting member 755 in the R1 direction or the R2 direction. Then, at a desired relative rotation position, the operator inserts a screw (not shown) into the screw hole 7551b and presses the outer peripheral surface of the second cylindrical portion 754b, so that the screw presses the mirror mounting member 755 against the rod lens mounting member 754, thereby fixing the relative rotation position between the mirror mounting member 755 and the rod lens mounting member 754. As a result, the relative rotation position of the rod lens 756 with respect to the mirror 757 in the circumferential direction around the direction in which the central axis Axc1 extends is fixed in an adjusted state.

[0078] 〈Rod lens〉 As shown in FIG. 10, the rod lens 756 is configured to irradiate the laser La irradiated from the laser oscillator 753 as the first line laser La1. That is, the rod lens 756 is configured to emit the laser La along the direction in which the central axis Axc1 extends from the laser oscillator 753 as the first line laser La1 linearly expanded along the direction orthogonal to the direction in which the central axis Axc1 extends. The rod lens 756 has a cylindrical shape. The cylindrical rod lens 756 is arranged such that the central axis Axc1 of the first line laser irradiation unit 75 and the central axis Axr of the cylindrical rod lens 756 are orthogonal to each other.

[0079] 〈Mirror〉 The mirror 757 is a member that reflects the first line laser La1 irradiated from the rod lens 756. The mirror 757 is arranged side by side with the rod lens 756 on the central axis Axc1. The mirror 757 and the rod lens 756 are arranged together with the rod lens 756 on the central axis Axc1. Here, the central axis Axc1 is the optical axis of the laser La irradiated from the laser oscillator 753.

[0080] Also, as shown in FIGS. 11 to 13, the reflecting surface 757a on the rod lens 756 side of the mirror 757 is configured to be able to reflect the first line laser La1 irradiated from the rod lens 756 after adjustment using the relative rotation position adjustment unit.

[0081] That is, as shown in FIG. 11, the reflecting surface 757a has a vertical width and a horizontal width such that the first line laser La1 irradiated from the rod lens 756 fits within the plane in a state of a first angle in which the relative rotation position of the rod lens 756 with respect to the mirror 757 is adjusted. As shown in FIG. 12, the reflecting surface 757a has a vertical width and a horizontal width such that the first line laser La1 irradiated from the rod lens 756 fits within the plane in a state of a second angle in which the relative rotation position of the rod lens 756 with respect to the mirror 757 is adjusted. As shown in FIG. 13, the reflecting surface 757a has a vertical width and a horizontal width such that the first line laser La1 irradiated from the rod lens 756 fits within the plane in a state of a third angle in which the relative rotation position of the rod lens 756 with respect to the mirror 757 is adjusted.

[0082] (Mounting member) As shown in FIG. 14, the mounting member 77 is a member for attaching each of the first line laser irradiation unit 75 and the first line laser irradiation unit 75 to the base 71. A plurality (two) of them are provided corresponding to each of the first line laser irradiation unit 75 and the first line laser irradiation unit 75. Since the structures of the plurality of mounting members 77 have the same structure, only the mounting member 77 to which the first line laser irradiation unit 75 is attached will be described.

[0083] The mounting member 77 has a first mounting portion 77a and a second mounting portion 77b. The first mounting portion 77a is a member for attaching the second mounting portion 77b to the base 71. The first mounting portion 77a is attached to the base 71 by a fastening member 771a.

[0084] As shown in FIG. 15, the second mounting portion 77b has a relative position adjustment portion 771b, a fastening member 772b, a clamping portion 773b, and a fastening member 774b.

[0085] Here, the second attachment portion 77b is attached to the first attachment portion 77a via a relative position adjustment portion 771b by a plurality (two) of fastening members 772b. That is, as shown in FIG. 16, in the relative position adjustment portion 771b, a plurality (two) of adjustment long holes 7711b are formed in order to screw each of the fastening members 772b into each of the plurality (two) of female screw portions 772a of the first attachment portion 77a. The plurality (two) of adjustment long holes 7711b are arranged in accordance with the positions of each of the plurality (two) of female screw portions 772a.

[0086] Each of the plurality (two) of adjustment long holes 7711b is configured to move the first line laser irradiation unit 75 with respect to the first imaging unit 72 in each of the X1 direction (the direction approaching the first imaging unit 72) and the X2 direction (the direction away from the first imaging unit 72). That is, after an operator moves the second attachment portion 77b with respect to the first attachment portion 77a in the X1 direction (or the X2 direction) with the fastening member 772b loosened in the female screw portion 772a, the fastening member 772b is tightened to the female screw portion 772a through the adjustment long hole 7711b. As a result, with the height position of the second attachment portion 77b adjusted, the second attachment portion 77b moves in the X1 direction (or the X2 direction) with respect to the first attachment portion 77a by the length of the adjustment long hole 7711b in the X direction.

[0087] Also, as shown in FIG. 17, the first line laser irradiation unit 75 is attached to the second attachment portion 77b by a clamping portion 773b of the second attachment portion 77b. The clamping portion 773b is provided corresponding to the first line laser irradiation unit 75 and is configured to clamp the outer peripheral portion of the first line laser irradiation unit 75 so as to be switchable between a holding state Sth and a holding release state Str.

[0088] That is, when the fastening member 774b is tightened by the operator, the clamping portion 773b moves in a direction in which the tip portion of the clamping portion 773b approaches so that the gap Ma becomes smaller. As a result, the clamping portion 773b sandwiches the outer peripheral portion of the first line laser irradiation portion 75, so that the holding state Sth of the first line laser irradiation portion 75 is switched. Further, when the fastening member 774b is loosened by the operator, the clamping portion 773b moves in a direction in which the tip portion of the clamping portion 773b moves away so that the gap Ma becomes larger. As a result, the clamping portion 773b releases the sandwiching of the outer peripheral portion of the first line laser irradiation portion 75, so that the holding release state Str of the first line laser irradiation portion 75 is switched.

[0089] Here, in the holding state Sth, the first line laser irradiation portion 75 is supported by the clamping portion 773b. As a result, when the operator loosens the screw inserted into the screw hole 7551b and rotates the rod lens mounting member 754 in the R1 direction or the R2 direction with respect to the mirror mounting member 755, the height position of the first line laser irradiation portion 75 is held by the clamping portion 773b, and the rod lens mounting member 754 rotates relative to the mirror mounting member 755.

[0090] (Line laser irradiation unit position adjustment method) With reference to FIGS. 18 to 25, a method for adjusting the position of the line laser irradiation unit of the first imaging unit 72 having the above-described configuration will be described. The line laser irradiation unit position adjustment method is performed before the start of production of the substrate Sb on which the component E is mounted by the component mounting apparatus 100.

[0091] As shown in FIG. 18, in step S1, after the operator attaches the adjustment jig 300 to the adjustment jig attachment member 400, the operator turns on the power of the component imaging unit 7 (see FIGS. 19 and 20). At this time, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is attached to the base 71 via the attachment member 77 by the temporarily fixed fastening members 772b and 774b.

[0092] As shown in FIG. 21, in step S2, the operator rotates the rod lens 756 to adjust each of the first line laser La1 and the second line laser La2 to be parallel to the X-axis (see FIG. 18). Specifically, the operator loosens the screw inserted into the screw hole 7551b and rotates the rod lens mounting member 754 in the R1 direction or the R2 direction with respect to the mirror mounting member 755. At this time, the operator rotates the images of the first line laser La1 and the second line laser La2 on the adjustment jig 300, which are captured by the first imaging unit 72 functioning as an area sensor camera and displayed on the display unit 10, so as to be parallel to the X-axis displayed on the display unit 10. Then, after the operator makes the first line laser La1 and the second line laser La2 parallel to the X-axis on the display unit 10, the operator tightens the screw inserted into the screw hole 7551b.

[0093] As shown in FIG. 22, in step S3, the operator adjusts each of the first line laser La1 and the second line laser La2 to a position separated from the X-axis by a predetermined distance De (see FIG. 18). Specifically, after the operator loosens the fastening member 774b, the operator linearly moves each of the first line laser irradiation unit 75 supported by the clamping unit 773b and the second line laser irradiation unit 76 supported by the clamping unit 773b. At this time, the operator linearly moves the first line laser irradiation unit 75 so that the image of the first line laser La1 displayed on the display unit 10 coincides with the dotted line at a position separated from the X-axis displayed on the display unit 10 by a distance D1. Also, the operator linearly moves the second line laser irradiation unit 76 so that the image of the second line laser La2 displayed on the display unit 10 coincides with the dotted line at a position separated from the X-axis displayed on the display unit 10 by a distance D2. Here, the distance obtained by adding the distance D1 and the distance D2 is the predetermined distance De. Then, after the operator adjusts the first line laser La1 and the second line laser La2 to positions separated from the X-axis by the predetermined distance De on the display unit 10, the operator tightens the fastening member 774b.

[0094] As shown in Fig. 23, in step S4, the operator rotates the rod lens 756 to adjust each of the first line laser La1 and the second line laser La2 to be parallel to the Y-axis (see Fig. 18). Specifically, the operator loosens the screw inserted into the screw hole 7551b and rotates the rod lens mounting member 754 in the R1 direction or the R2 direction with respect to the mirror mounting member 755. At this time, the operator rotates each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 so that the images of the first line laser La1 and the second line laser La2 displayed on the display unit 10 are parallel to the Y-axis displayed on the display unit 10. Then, as shown in Fig. 24, after the operator adjusts the first line laser La1 and the second line laser La2 to be parallel to the Y-axis on the display unit 10, the operator tightens the screw inserted into the screw hole 7551b.

[0095] As shown in Fig. 25, in step S5, the operator moves the second mounting portion 77b to adjust each of the first line laser La1 and the second line laser La2 to be overlapped with the intersection point Pcr of the X-axis and the Y-axis (see Fig. 18). Specifically, after the operator loosens the fastening member 772b, the operator relatively linearly moves the second mounting portion 77b with respect to the first mounting portion 77a, thereby linearly moving each of the first line laser irradiation unit 75 attached to the second mounting portion 77b and the second line laser irradiation unit 76 attached to the second mounting portion 77b. At this time, the operator linearly moves and rotates the second mounting portion 77b so that the images of the first line laser La1 and the second line laser La2 displayed on the display unit 10 are aligned with the intersection point Pcr of the X-axis and the Y-axis displayed on the display unit 10. Then, after the operator overlaps the first line laser La1 and the second line laser La2 on the display unit 10, the operator tightens the fastening member 772b.

[0096] After step S5, the line laser irradiation unit position adjustment method ends.

[0097] (Effect of this embodiment) In this embodiment, the following effects can be obtained.

[0098] In this embodiment, as described above, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged so as to overlap the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 at the imaging location Pim. As a result, by overlapping the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76, the unevenness in the light intensity of the first line laser La1 can be compensated for by the second line laser La2, so that the occurrence of unevenness in the light intensity of the line laser can be suppressed. As a result, by suppressing the unevenness in the light intensity of the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 toward the component E, it is possible to suppress the occurrence of unevenness in the luminance at the imaging location Pim of the component E in the image captured by the component imaging unit 7. Further, by overlapping the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76, the light intensity can be increased by the amount of overlap, so that it is possible to suppress a decrease in the luminance value at the imaging location Pim (for example, the tip of the lead wire E1 of the component E, etc.) in the image captured by the component imaging unit 7.

[0099] Also, in this embodiment, as described above, the first line laser La1 and the second line laser La2 are overlapped with each other in a state where the peak positions Pe1 and Pe2 of the luminance of each of the first line laser La1 and the second line laser La2 are shifted in the direction in which the line laser extends linearly. As a result, the portion where the light intensity of the first line laser La1 is maximum can be overlapped with the portion where the light intensity of the second line laser La2 is low, so that the occurrence of unevenness in the light intensity of the overlapped line laser La0 is suppressed.

[0100] Also, in the present embodiment, as described above, the illumination unit 74 is provided separately from the first line laser irradiation unit 75 and the second line laser irradiation unit 76, and is configured to emit illumination light from below toward the component E when the component imaging unit 7 images the component E. The first imaging unit 72 is disposed at a position below the illumination unit 74 in order to image the component E from below. Each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is disposed between the component imaging unit 7 and the illumination unit 74 in the Z direction. Thereby, since the illumination unit 74 is disposed above the first line laser irradiation unit 75 and the second line laser irradiation unit 76, the illumination light emitted from the illumination unit 74 can be prevented from being obstructed by each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76.

[0101] Also, in the present embodiment, as described above, the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are arranged so that their height positions are aligned between the component imaging unit 7 and the illumination unit 74. Thereby, an increase in the space in the Z direction for arranging the first line laser irradiation unit 75 and the second line laser irradiation unit 76 can be suppressed, so that an increase in the size of the component imaging unit 7 in the vertical direction can be suppressed.

[0102] Also, in the present embodiment, as described above, the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are arranged to be line-symmetric in a plan view with respect to an axis Axs extending along the direction in which the line laser is scanned with respect to the component E. Thereby, the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 are irradiated in a line-symmetric positional relationship with respect to the axis Axs extending along the direction in which the line laser is scanned with respect to the component E in a plan view, so that an operator can easily recognize a method of overlapping the first line laser irradiation unit 75 and the second line laser irradiation unit 76. As a result, the operator can easily perform adjustment to overlap the first line laser irradiation unit 75 and the second line laser irradiation unit 76.

[0103] Also, in the present embodiment, as described above, the first line laser irradiation unit 75 (the second line laser irradiation unit 76) has a cylindrical rod lens 756 that irradiates the laser La irradiated from the laser oscillator 753 as the first line laser La1 (the second line laser La2). The first line laser irradiation unit 75 (the second line laser irradiation unit 76) is arranged together with the rod lens 756 on the central axis Axc1 of the first line laser irradiation unit 75 (the second line laser irradiation unit 76), and has a mirror 757 that reflects the first line laser La1 (the second line laser La2) irradiated from the rod lens 756. The first line laser irradiation unit 75 (the second line laser irradiation unit 76) has a relative rotation position adjustment unit (rod lens attachment member 754, mirror attachment member 755, and screw) that can adjust the positions of the rod lens 756 and the mirror 757 by rotating them relative to each other around the central axis Axc1 of the first line laser irradiation unit 75 (the second line laser irradiation unit 76). Thereby, since the inclination of the first line laser La1 (the second line laser La2) reflected by the mirror 757 can be adjusted by the relative rotation position adjustment unit, by adjusting the inclination in accordance with the direction in which the imaging elements 7211a of the component imaging unit 7 are arranged, the reflected light reflected from the imaging location Pim can be received by the entire imaging element 7211a of the imaging unit.

[0104] Also, in the present embodiment, as described above, the cylindrical rod lens 756 is arranged such that the central axis Axc1 of the first line laser irradiation unit 75 and the central axis Axc2 of the second line laser irradiation unit 76, the central axis Axr of the cylindrical rod lens 756, and the central axis (not shown, the same central axis as the central axis Axr) of the cylindrical rod lens (not shown) of the second line laser irradiation unit 76 are orthogonal to each other. The reflecting surface 757a on the rod lens 756 side of the mirror 757 is configured to be able to reflect the first line laser La1 (second line laser La2) irradiated from the rod lens 756 after adjustment using the relative rotation position adjustment unit (rod lens mounting member 754, mirror mounting member 755, and screw). Thereby, since the first line laser La1 (second line laser La2) is irradiated onto the reflecting surface 757a of the mirror 757 regardless of the relative rotation position of the rod lens 756 after adjustment, all the first line lasers La1 (second line lasers La2) after adjustment can be reflected by the mirror 757. As a result, it is possible to suppress a decrease in the reflected light traveling toward the component imaging unit 7 due to the first line laser La1 (second line laser La2) irradiated from the rod lens 756 after adjustment deviating from the mirror 757. As a result, it is possible to suppress a decrease in the luminance of the imaging location Pim of the component E in the image captured by the component imaging unit 7.

[0105] Also, in the present embodiment, as described above, the mounting member 77 is provided corresponding to each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76, and has a clamping portion 773b that can sandwich the outer peripheral portions of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 so as to be switchable between the holding state Sth and the holding release state Str. Thereby, since the holding state Sth and the holding release state Str can be easily switched by the clamping portion 773b, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 can be easily held after adjustment of each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76.

[0106] Also, in the present embodiment, as described above, the attachment member 77 is provided corresponding to each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76, and in each of the direction approaching the first imaging unit 72 and the direction away from the first imaging unit 72, it has a relative position adjustment unit 771b that individually moves each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 relative to the first imaging unit 72. Thereby, the relative position adjustment unit 771b can relatively bring the first line laser La1 and the second line laser La2 closer to the position of the imaging element 7211a of the first imaging unit 72, so that the first line laser La1 and the second line laser La2 can be overlapped with each other at the position of the imaging element 7211a of the first imaging unit 72.

[0107] Also, in the present embodiment, as described above, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged such that the lens center Lec of the first imaging unit 72 is located on the central axis line Axc1 and the central axis line Axc2 of each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 in a plan view. Thereby, by arranging each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 at a position away from the lens center Lec of the first imaging unit 72 by at least the radius of the lens 721b of the first imaging unit 72, in a plan view, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 can be prevented from overlapping the lens 721b of the first imaging unit 72. As a result, while suppressing the overlap between each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 and the lens 721b of the first imaging unit 72, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 can be arranged at a relatively close position to the lens 721b, so that the enlargement of the component imaging unit 7 in the radial direction of the lens center Lec can be suppressed.

[0108] Also, in the present embodiment, as described above, in the component mounting apparatus 100, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged so as to overlap the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 at the imaging location Pim. Thereby, by overlapping the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76, the unevenness of the light intensity of the first line laser La1 can be compensated for by the second line laser La2, so that the occurrence of unevenness in the light intensity of each of the first line laser La1 and the second line laser La2 can be suppressed. As a result, by suppressing the unevenness in the light intensity of each of the first line laser La1 and the second line laser La2 irradiated from each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 toward the component E, it is possible to provide a component mounting apparatus 100 that can suppress the occurrence of unevenness in the luminance of the imaging location Pim of the component E in the image captured by the component imaging unit 7.

[0109] [Modification Example] It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is shown not by the description of the above-described embodiments but by the claims, and further includes all changes (modification examples) within the meaning and scope equivalent to the claims.

[0110] For example, in the above embodiment, an example is shown in which a second imaging unit 73 for acquiring an inspection image used for inspecting the Z-direction variation of the lead wire E1 of the component E is arranged between the first line laser irradiation unit 75 and the second line laser irradiation unit 76, but the present invention is not limited to this. In the present invention, other sensors for inspections other than the variation inspection may be attached between the first line laser irradiation unit and the second line laser irradiation unit.

[0111] Also, in the above embodiment, an example is shown in which each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged between the first imaging unit 72 (imaging unit) and the illumination unit 74 in the Z direction (vertical direction). However, the present invention is not limited to this. In the present invention, each of the plurality of line laser irradiation units may not be arranged between the imaging unit and the illumination unit.

[0112] Also, in the above embodiment, an example is shown in which each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged so that their height positions are aligned between the first imaging unit 72 (imaging unit) and the illumination unit 74. However, the present invention is not limited to this. In the present invention, each of the plurality of line laser irradiation units may not have aligned height positions between the imaging unit and the illumination unit.

[0113] Also, in the above embodiment, an example is shown in which each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is arranged to be line-symmetrical in a plan view with respect to the axis Axs. However, the present invention is not limited to this. In the present invention, the plurality of line laser irradiation units may not be arranged to be line-symmetrical in a plan view with respect to the axis.

[0114] Also, in the above embodiment, an example is shown in which the component imaging unit 7 includes the first line laser irradiation unit 75 and the second line laser irradiation unit 76. However, the present invention is not limited to this. In the present invention, the component imaging unit may include three or more odd or even line laser irradiation units. Here, when the component imaging unit includes an even number of line laser irradiation units, other configurations can be arranged between the plurality of line laser irradiation units. When the component imaging unit includes three or more odd line laser irradiation units, the plurality of line laser irradiation units are arranged side by side.

[0115] Also, in the above embodiment, each of the first line laser irradiation unit 75 and the second line laser irradiation unit 76 is shown as an example having a cylindrical rod lens 756 that irradiates the laser La irradiated from the laser oscillator 753 (light source) as the first line laser La1 (second line laser La2). However, the present invention is not limited to this. In the present invention, each of the plurality of line laser irradiation units may have a configuration other than a cylindrical rod lens as long as it can irradiate the laser irradiated from the light source as a line laser.

Explanation of Signs

[0116] 6 Head unit 7 Component imaging unit (component imaging device) 63 Nozzle 72 First imaging unit (imaging unit) 74 Lighting unit 75 First line laser irradiation unit 75 (line laser irradiation unit) 76 Second line laser irradiation unit 76 (line laser irradiation unit) 100 Component mounting device 721b Lens 753 Laser oscillator (light source) 754 Rod lens mounting member (relative rotation position adjustment unit) 755 Mirror mounting member (relative rotation position adjustment unit) 756 Rod lens 757 Mirror 757a Reflective surface 771b Relative position adjustment unit 773b Clamping unit Axc1 Central axis (of each of the plurality of line laser irradiation units) Axc2 Central axis (of each of the plurality of line laser irradiation units) Axr Central axis (of the rod lens) Axs Axis (extending along the direction in which the line laser is scanned) E Component La Laser La0 Overlapped line laser La1 First line laser La2 Second line laser Lec Lens center Pe1 Peak position Pe2 Peak position Pim Imaging location Sb Substrate Sth Holding state Str Release state

Claims

1. An imaging unit that images components mounted on a substrate, and a plurality of line laser irradiation units that each irradiate a line laser extending linearly toward an imaging location of the component imaged by the imaging unit. In each of the plurality of line laser irradiation units, the plurality of line lasers irradiated from each of the plurality of line laser irradiation units are arranged so as to be overlapped at the imaging location. A component imaging device.

2. The plurality of line lasers are overlapped with each other in a state where peak positions of luminances of the plurality of line lasers are shifted in a direction in which the line lasers extend linearly. The component imaging device according to claim 1.

3. Further provided is an illumination unit that is provided separately from the plurality of line laser irradiation units and emits illumination light from below toward the component when the imaging unit images the component. The imaging unit is disposed at a position below the illumination unit in order to image the component from below. In each of the plurality of line laser irradiation units, in the vertical direction, it is disposed between the imaging unit and the illumination unit. The component imaging device according to claim 1.

4. The plurality of line laser irradiation units are arranged so that their height positions are aligned between the imaging unit and the illumination unit. The component imaging device according to claim 3.

5. The plurality of line laser irradiation units are arranged to be line-symmetrical in a plan view with respect to an axis extending along a direction in which the line lasers are scanned with respect to the component. The component imaging device according to claim 1.

6. Each of the plurality of line laser irradiation units, A cylindrical rod lens that irradiates a laser irradiated from a light source as the line laser, disposed together with the rod lens on the central axis of each of the plurality of line laser irradiation units, and a mirror that reflects the line laser irradiated from the rod lens The component imaging device according to claim 1, further comprising a relative rotation position adjustment unit that can rotate the rod lens and the mirror relative to each other around the central axis of each of the plurality of line laser irradiation units for position adjustment.

7. The cylindrical rod lens is arranged such that the central axis of each of the plurality of line laser irradiation units is orthogonal to the central axis of the cylindrical rod lens. The component imaging device according to claim 6, wherein the reflecting surface on the rod lens side of the mirror is configured to be able to reflect the line laser irradiated from the rod lens after adjustment using the relative rotation position adjustment unit.

8. The component imaging device according to claim 6, further comprising a clamping unit provided corresponding to each of the plurality of line laser irradiation units, and configured to clamp the outer peripheral portions of each of the plurality of line laser irradiation units so as to be switchable between a holding state and a holding release state.

9. The component imaging device according to claim 8, further comprising a relative position adjustment unit provided corresponding to each of the plurality of line laser irradiation units, and configured to individually move each of the plurality of line laser irradiation units relative to the imaging unit in each of a direction approaching the imaging unit and a direction away from the imaging unit.

10. The component imaging device according to claim 6, wherein each of the plurality of line laser irradiation units is arranged such that the lens center of the imaging unit is located on the central axis of each of the plurality of line laser irradiation units in a plan view.

11. A head unit including a head to which a nozzle for holding a component to be mounted on a substrate is attached. An imaging unit that images the component to be mounted on the substrate, and a component imaging unit including a plurality of line laser irradiation units that each irradiate a line laser extending linearly toward an imaging location imaged by the imaging unit among the components. A component mounting apparatus, wherein each of the plurality of line laser irradiation units is arranged so that a plurality of the line lasers irradiated from each of the plurality of line laser irradiation units are superimposed at the imaging location.

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