Print processing system, information processing apparatus, printing apparatus, and information processing method

Abstract

To provide a print processing system capable of increasing possibility of achieving both improvement in the quality of printed solder and suppression of prolongation of tact time.SOLUTION: A print processing system 1000 is for forming printed solder by printing solder paste 18 on a substrate 17 through a mask 80 in which a mask opening 80a is formed, and includes: a second acquiring unit 210 that acquires material information d1 regarding the solder paste 18, mask information d2 regarding the mask 80, substrate information d3 regarding the substrate 17, and print condition information d4 indicating a condition regarding printing; a second evaluating unit 207 that evaluates a condition regarding the printing based on the acquired material information d1, the mask information d2, the substrate information d3, and the print condition information d4; and a second display unit 206 that displays evaluation results of the condition regarding the printing by the second evaluating unit 207.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a printing processing system for printing solder on a substrate and the like.

Background Art

[0002] In a mounting substrate manufacturing system for manufacturing a mounting substrate by mounting components on a substrate, a printing process, a component mounting process, and a reflow process are executed. In the printing process, a solder paste for component bonding is printed on the lands of the substrate. By this printing, printed solder is formed on the substrate. In the component mounting process, components are mounted on the substrate on which the printed solder is formed. In the reflow process, the substrate on which the components are mounted is heated to melt the printed solder, whereby the components are solder-bonded to the lands of the substrate. Here, the quality of the printed solder in the printing process greatly depends on the printing conditions. Therefore, in Patent Document 1, an information processing apparatus that sets printing conditions by using a learned model obtained by learning using the printing conditions actually used in the printing process and the inspection results of the printed solder has been proposed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, while the information processing apparatus of Patent Document 1 can set printing conditions for forming high-quality printed solder, there is a possibility that the tact time may become long.

[0005] Therefore, the present disclosure provides a printing processing system and the like that can enhance the possibility of achieving both an improvement in the quality of printed solder and suppression of an increase in tact time.

Means for Solving the Problem

[0006] A printing processing system according to an aspect of the present disclosure is a printing processing system for forming printed solder by printing solder paste onto a substrate through a mask having an opening, and includes an acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; an evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, the first mask information, the first substrate information, and the first printing condition information; and a display unit that displays an evaluation result by the evaluation unit of the conditions regarding the printing.

[0007] These general or specific aspects may be implemented in a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, method, integrated circuit, computer program, and recording medium. The recording medium may also be a non-transitory recording medium.

Advantages of the Invention

[0008] The printing processing system of the present disclosure can enhance the possibility of achieving both an improvement in the quality of printed solder and suppression of an increase in tact time.

[0009] Furthermore, additional advantages and effects in an aspect of the present disclosure will be apparent from the specification and the drawings. Such advantages and / or effects are provided by some embodiments and the configurations described in the specification and the drawings, but not necessarily all configurations are required.

Brief Description of the Drawings

[0010]

Figure 1

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DETAILED DESCRIPTION OF THE INVENTION

[0011] The printing processing system according to the first aspect of the present disclosure is a printing processing system for forming printed solder by printing solder paste onto a substrate through a mask having an opening, the system comprising: an acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; an evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information; and a display unit that displays an evaluation result of the conditions regarding the printing by the evaluation unit.

[0012] Accordingly, when the first material information, the first mask information, the first substrate information, and the first printing condition information are acquired, the conditions regarding the printing indicated by the first printing condition information are evaluated and displayed. For example, when printing of the solder paste is performed based on the first material information, the first mask information, the first substrate information, and the first printing conditions, if extremely high-quality printed solder is formed, the highest evaluation result is displayed for the conditions regarding the printing indicated by the first printing condition information. On the other hand, when the highest evaluation result is displayed, it is easily assumed that the tact time becomes long under the conditions regarding the printing indicated by the first printing condition information. Therefore, the user can find the conditions regarding the printing in which high-quality printed solder is formed without the tact time being too long by adjusting the conditions regarding the printing indicated by the first printing condition information while looking at the evaluation result. As a result, it is possible to increase the possibility of achieving both an improvement in the quality of the printed solder and suppression of an increase in the tact time.

[0013] In addition, the printing processing system according to the second aspect further includes a model storage unit that stores an evaluation model. The evaluation unit inputs the acquired first material information, the first mask information, the first substrate information, and the first printing condition information into the evaluation model to evaluate the conditions related to the printing. The evaluation model is generated by machine learning using the first performance information used in the printing, such that when input with the material information related to the solder paste, the mask information related to the mask, the substrate information related to the substrate, and the printing condition information indicating the conditions related to the printing, an evaluation result for the conditions related to the printing indicated by the printing condition information is output. The first performance information may include second material information related to the solder paste, second mask information related to the mask, second substrate information related to the substrate, second printing condition information indicating the conditions related to the printing, and first inspection result information indicating the inspection result of the printed solder. Note that the second aspect may be dependent on the first aspect.

[0014] As a result, since the evaluation result of the conditions related to the printing is displayed using the evaluation model generated by machine learning using the first performance information, an appropriate evaluation result based on the performance can be obtained.

[0015] In addition, the printing processing system according to the third aspect may further include a learning unit that generates the evaluation model by the machine learning and stores it in the model storage unit. Note that the third aspect may be dependent on the second aspect.

[0016] As a result, the user of the printing processing system can generate an evaluation model according to the printing processing system and obtain a more appropriate evaluation result.

[0017] Also, in the printing processing system according to the fourth aspect, the learning unit further updates the evaluation model stored in the model storage unit by performing re-learning of the machine learning. In the re-learning, second performance information used in the printing performed after the generation of the evaluation model is used. The second performance information may include third material information regarding the solder paste, third mask information regarding the mask, third substrate information regarding the substrate, third printing condition information indicating conditions regarding the printing, and second inspection result information indicating an inspection result of the printed solder. Note that the fourth aspect may be dependent on the third aspect.

[0018] Thereby, the evaluation model can be updated based on recent performance, and an even more appropriate evaluation result can be obtained.

[0019] Also, the printing processing system according to the fifth aspect further includes a printing device that forms the printed solder by the printing, and an information processing device connected to the printing device. The learning unit may be provided in the information processing device. Note that the fifth aspect may be dependent on the third aspect or the fourth aspect.

[0020] Thereby, the user of the printing processing system can perform machine learning based on the printing performance in the user's printing device by the information processing device, and can obtain an appropriate evaluation result based on the user's own performance.

[0021] Also, the printing processing system according to the sixth aspect further includes a printing device that forms the printed solder by the printing, and a control unit that controls the model storage unit. The control unit may acquire the evaluation model generated or updated by an information processing device owned by the manufacturer of the printing device from the information processing device and store it in the model storage unit. Note that the sixth aspect may be dependent on any one of the second aspect to the fifth aspect.

[0022] As a result, even if the printing device of the printing processing system cannot obtain printing results, or even if machine learning cannot be performed in the printing processing system, the evaluation model provided by the manufacturer of the printing device can be used. Therefore, the configuration of the printing processing system can be simplified and the processing load can be reduced. In addition, by using the evaluation model supplied by the manufacturer, general evaluation results can be obtained.

[0023] Further, in the printing processing system according to the seventh aspect, the evaluation model may include at least one of a solder volume evaluation model for evaluating the printing conditions based on the volume of the printed solder formed on the substrate, a solder shape evaluation model for evaluating the printing conditions based on the shape of the printed solder formed on the substrate, a printing position evaluation model for evaluating the printing conditions based on the position of the printed solder formed on the substrate, and a cleaning evaluation model for evaluating the cleaning conditions of the mask included in the printing conditions based on the productivity and quality of the printed solder formed on the substrate. Note that the seventh aspect may be dependent on any one of the second aspect to the sixth aspect.

[0024] As a result, the printing conditions can be appropriately evaluated from at least one of the viewpoints of the volume of the printed solder, the shape of the printed solder, the position of the printed solder, and the cleaning of the mask.

[0025] Further, in the printing processing system according to the eighth aspect, the evaluation unit may input one or more pieces of information among the first material information, the first mask information, the first substrate information, and the first printing condition information to each of at least one of the solder volume evaluation model, the solder shape evaluation model, the printing position evaluation model, and the cleaning evaluation model included in the evaluation model, derive a numerical value for the printing conditions, and calculate the evaluation result as an evaluation value based on the derived numerical value. Note that the eighth aspect may be dependent on the seventh aspect.

[0026] As a result, for example, when numerical values are derived from each of the solder volume evaluation model, the solder shape evaluation model, the printing position evaluation model, and the cleaning evaluation model, an evaluation value is calculated from those numerical values. In a more specific example, the evaluation value may be calculated by weighted addition of those numerical values. Thereby, a more appropriate evaluation result that comprehensively considers the volume, shape, etc. of the printed solder can be obtained as the evaluation value.

[0027] Further, in the printing processing system according to the ninth aspect, the printing apparatus includes a detection unit that detects parameters of an object used for the printing as detection values, and the learning unit may perform the machine learning using the detection values detected by the detection unit, which are shown in at least one of the second material information, the second mask information, the second substrate information, and the second printing condition information. Note that the ninth aspect may be dependent on any one of the fifth aspect to the eighth aspect.

[0028] As a result, since detection values are used for the machine learning, the detection values can be used as accurate information in the teacher data of the machine learning, and the possibility of generating a high-performance evaluation model can be increased.

[0029] Further, in the printing processing system according to the tenth aspect, when the learning unit uses the detection value shown in the second material information for the machine learning, the viscosity of the solder paste detected by the detection unit may be used as the detection value. Note that the tenth aspect may be dependent on the ninth aspect.

[0030] As a result, the accurate viscosity of the solder paste can be used in the teacher data, and the possibility of generating a high-performance evaluation model can be increased.

[0031] Further, in the printing processing system according to the eleventh aspect, when the learning unit uses the detection value shown in the second mask information for the machine learning, the value of the mask tension of the mask detected by the detection unit may be used as the detection value. Note that the eleventh aspect may be dependent on the ninth aspect or the tenth aspect.

[0032] As a result, accurate mask tension can be used for the teacher data, and the possibility of generating a high-performance evaluation model can be enhanced.

[0033] Further, in the printing processing system according to the twelfth aspect, when the learning unit uses the detection value indicated in the second printing condition information for the machine learning, the discharge amount of the solvent used for cleaning the mask detected by the detection unit may be used as the detection value. Note that the twelfth aspect may be dependent on any one of the ninth aspect to the eleventh aspect.

[0034] As a result, accurate discharge amount of the solvent can be used for the teacher data, and the possibility of generating a high-performance evaluation model can be enhanced.

[0035] The information processing apparatus according to the first aspect is an information processing apparatus for forming printed solder by printing solder paste onto a substrate through a mask having an opening, and includes an acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; an evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, the first mask information, the first substrate information, and the first printing condition information; and a display unit that displays an evaluation result of the conditions regarding the printing by the evaluation unit.

[0036] As a result, the same operational effects as those of the printing processing system according to the first aspect described above can be achieved.

[0037] The printing apparatus according to the first aspect is a printing apparatus that forms printed solder by printing solder paste onto a substrate through a mask having an opening, and includes an acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; an evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, the first mask information, the first substrate information, and the first printing condition information; and a display unit that displays an evaluation result by the evaluation unit of the conditions regarding the printing.

[0038] As a result, the same operational effects as those of the printing processing system according to the first aspect described above can be achieved.

[0039] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0040] Note that each of the embodiments described below shows general or specific examples. Numerical values, shapes, materials, components, the arrangement positions and connection forms of the components, steps, the order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components not described in the independent claims indicating the most general concept are described as optional components.

[0041] Each drawing is a schematic diagram and is not necessarily precisely illustrated. Also, in each drawing, the same constituent members are denoted by the same reference numerals.

[0042] (Embodiment) FIG. 1 is a diagram showing an example of the configuration of a printing processing system in the present embodiment.

[0043] The printing processing system 1000 in the present embodiment is a system for forming printed solder by printing solder paste onto a substrate through a mask having openings. Note that this printing is also called screen printing, and the openings are also called mask openings. Such a printing processing system 1000 includes an information processing apparatus 100, a printing apparatus 200, and an inspection apparatus 300 that are connected to each other via a communication network Nt.

[0044] The printing apparatus 200 forms printed solder by printing solder paste onto the lands of a substrate set on a printing stage using a mask. In a subsequent process, components are soldered to those lands. Note that the printing apparatus 200 is also called a screen printing apparatus.

[0045] The inspection apparatus 300 inspects the state of the printed solder formed on the substrate by the printing by the printing apparatus 200.

[0046] The information processing apparatus 100 controls the printing apparatus 200 and the inspection apparatus 300. Also, since the information processing apparatus 100 manages the printing apparatus 200 and the inspection apparatus 300, it is also called a management apparatus.

[0047] Such an information processing apparatus 100, printing apparatus 200, and inspection apparatus 300 communicate with each other via the communication network Nt. The communication is either wireless communication or wired communication. The wireless communication may be performed using Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark), or specific low-power radio.

[0048] FIG. 2 is a diagram for explaining an example of the configuration of the printing apparatus 200.

[0049] As shown in FIG. 2, the printing apparatus 200 includes a base 61, a printing stage 62, a printing stage moving mechanism 63, a loading conveyor 66a, an unloading conveyor 66c, a pair of support frames 71, a head support beam 72, a camera X-axis moving mechanism 76x, a camera Y-axis moving mechanism 76y, a first camera 78, a second camera 79, a mask 80, a printing control unit 202, a printing head 212, a mask cleaning mechanism 215, and a clamp mechanism 216. In the present embodiment, the substrate conveyance direction for conveying the substrate 17 to be worked on is defined as the X direction, and among the directions along the surface of the substrate 17, the direction orthogonal to the X direction is defined as the Y direction. Further, the direction orthogonal to the X direction and the Y direction is defined as the Z direction. For example, the Z direction is the vertical direction, and the X direction and the Y direction are the horizontal directions.

[0050] The pair of support frames 71 are erected at both ends in the X direction of the base 61.

[0051] The printing control unit 202 is built into the base 61. For example, the printing control unit 202 controls other components included in the printing apparatus 200. Thereby, the printing control unit 202 performs the conveyance operation of the substrate 17, the printing operation on the substrate 17, the recognition process of the images acquired by the first camera 78 and the second camera 79, the cleaning operation of the lower surface of the mask 80 used for the printing operation, and the like.

[0052] The loading conveyor 66a is located upstream of the printing stage conveyor 66b of the printing stage 62 and is arranged to penetrate an opening provided in the upstream support frame 71. When the substrate 17 is loaded in the direction along the arrow a in Fig. 2, such a loading conveyor 66a conveys the substrate 17 and delivers it to the printing stage conveyor 66b. When printing (i.e., screen printing) is performed on the substrate 17 delivered to the printing stage conveyor 66b, the printing stage conveyor 66b conveys the substrate 17 and delivers it to the unloading conveyor 66c. The unloading conveyor 66c is located downstream of the printing stage conveyor 66b and is arranged to penetrate an opening provided in the downstream support frame 71. When such an unloading conveyor 66c receives the substrate 17 from the printing stage conveyor 66b, it conveys the substrate 17 and unloads it outside the printing apparatus 200.

[0053] The printing stage moving mechanism 63 is arranged on the upper surface of the base 61 and moves the printing stage 62 disposed thereon. The printing stage moving mechanism 63 includes a printing table 63a and a second lifting mechanism 63z stacked on the printing table 63a. By driving the printing table 63a, the second lifting mechanism 63z is moved in the X direction and the Y direction (i.e., the horizontal direction) and rotated about an axis along the Z direction. Thereby, the printing stage 62 moves and rotates horizontally together with the second lifting mechanism 63z. The second lifting mechanism 63z drives to raise and lower the printing stage 62 in the Z direction.

[0054] The printing stage 62 supports the substrate 17 to be printed, which is loaded from the upstream side. Specifically, the printing stage 62 includes a lifting table 64, a first lifting mechanism 65b, a plurality of support members 64a, a substrate support portion 65, a plurality of support pins 65a, and a printing stage conveyor 66b.

[0055] The elevating table 64 is coupled to the upper surface of the second elevating mechanism 63z. A plurality of support members 64a are erected on the elevating table 64 and support the printing stage conveyor 66b. The printing stage conveyor 66b conveys the substrate 17 by a driving belt. Alignment of the substrate 17 with respect to the mask 80 is performed by such conveyance by the printing stage conveyor 66b, movement and rotation by the printing stage moving mechanism 63. Further, by driving the second elevating mechanism 63z, the substrate 17 is brought into contact with the lower surface of the mask 80.

[0056] The first elevating mechanism 65b is disposed on the upper surface of the elevating table 64 and elevates the substrate support portion 65 in the Z direction. A plurality of support pins 65a are arranged on the upper surface of the substrate support portion 65 according to the substrate support layout. The first elevating mechanism 65b elevates the substrate support portion 65 in a state where the substrate 17 is carried into the printing stage conveyor 66b. Thereby, the first elevating mechanism 65b brings the plurality of support pins 65a into contact with the lower surface of the substrate 17 and lifts the substrate 17. Then, the first elevating mechanism 65b supports the substrate 17 by the plurality of support pins 65a from the side of the base 61 in the Z direction so that the substrate 17 is maintained at the printing height position. After printing on the substrate 17 is completed, the first elevating mechanism 65b lowers the substrate support portion 65 and returns the substrate 17 to the printing stage conveyor 66b.

[0057] The printing head 212 performs a squeegeeing operation on the mask 80 in which a mask opening for printing is formed. Thereby, solder paste is printed on the substrate 17 supported by the plurality of support pins 65a from the upper surface of the mask 80 through the mask opening by the printing head 212. That is, the printing apparatus 200 shown in the present embodiment supports the substrate 17 on which lands for soldering components are formed from below by the support pins 65a, and prints solder paste on the lands in that state to form printed solder.

[0058] The head support beam 72 is disposed at the upper ends of a pair of support frames 71 and supports the print head 212. Specifically, the head support beam 72 is disposed on the pair of support frames 71 so as to be movable in the Y direction via a linear guide mechanism 72a. One end of the head support beam 72 is coupled to one of the support frames 71 via a head movement mechanism 74. By driving the head movement mechanism 74, the print head 212 supported by the head support beam 72 reciprocates in the Y direction (i.e., the direction perpendicular to the paper surface) which is the squeegeeing direction, thereby performing the above-described squeegeeing operation.

[0059] The camera X-axis movement mechanism 76x and the camera Y-axis movement mechanism 76y move a moving member 77 to which the first camera 78 and the second camera 79 are attached in the X direction and the Y direction. The camera X-axis movement mechanism 76x moves the moving member 77 in the X direction along a camera X-axis beam 75. Such a camera X-axis movement mechanism 76x includes a camera X-axis motor 75a, a feed screw 75b, and a nut portion (not shown). By driving the camera X-axis motor 75a, the moving member 77 coupled to the nut portion moves in the X direction. The camera Y-axis movement mechanism 76y moves the camera X-axis movement mechanism 76x and the camera X-axis beam 75 in the Y direction. The movement of the camera X-axis beam 75 in the Y direction is guided by a linear guide mechanism 75c disposed on the inner surface of the pair of support frames 71. The camera Y-axis movement mechanism 76y includes a camera Y-axis motor, a feed screw 75b, and a nut portion coupled to the camera X-axis beam 75. By driving the camera Y-axis motor, the camera X-axis beam 75 moves in the Y direction together with the nut portion.

[0060] The first camera 78 is arranged with its imaging direction facing downward, and images the substrate 17 held on the printing stage 62. Recognition marks (not shown), lands, etc. formed on the substrate 17 are imaged. The second camera 79 is arranged with its imaging direction facing upward, and images a mask recognition mark (not shown) formed on the mask 80. By performing recognition processing on the image obtained by this imaging, the position of the mask center and the mask opening in the mask 80 is recognized. When performing screen printing, the printing control unit 202 causes the printing stage movement mechanism 63 to execute a position correction operation based on the displacement of the substrate 17 and the displacement of the mask 80 detected by the recognition by the first camera 78 and the second camera 79 described above. Thereby, alignment of the substrate 17 with respect to the mask 80 is performed.

[0061] The mask cleaning mechanism 215 is attached to the moving member 77 together with, for example, the first camera 78 and the second camera 79, and moves in the X direction along the camera X-axis beam 75 as the moving member 77 moves. The mask cleaning mechanism 215 includes a cleaning head 215a to which a cleaning paper (not shown) supplied in a wound state is attached. The mask cleaning mechanism 215 moves with the cleaning head 215a pressed against the lower surface of the mask 80. Thereby, the mask 80 is cleaned, and as a result, foreign substances such as solder paste adhering to the lower surface of the mask 80 are removed. The mask cleaning mechanism 215 may wipe off the foreign substances with the cleaning paper and further suck and remove the foreign substances by the suction function provided in the cleaning head 215a. Thereby, the lower surface of the mask 80 is cleaned, and printing defects caused by contamination of the lower surface of the mask 80 can be improved. Further, when performing wet cleaning on the mask 80, the mask cleaning mechanism 215 may discharge a solvent. In this case, the mask cleaning mechanism 215 cleans the mask 80 using the solvent.

[0062] The clamping mechanism 216 clamps the substrate 17 in the horizontal direction. Thereby, the horizontal displacement of the substrate 17 during printing is suppressed.

[0063] FIG. 3 is a diagram showing an example of a partial cross section of the printing apparatus 200.

[0064] As shown in FIG. 3, a squeegee 73b is held by a squeegee holding portion 73a provided on the printing head 212. The squeegee holding portion 73a is driven to move up and down by a squeegee elevating mechanism (not shown), and thereby the lower end portion of the squeegee 73b comes into contact with and separates from the upper surface of the mask 80. A mask opening 80a is formed at a part of the mask 80, specifically, at a position corresponding to the land 17a of the substrate 17 to be printed. In a state where the substrate 17 is in contact with the lower surface of the mask 80, the mask opening 80a is located above the upper surface of the land 17a.

[0065] In screen printing on the substrate 17, with the solder paste 18 supplied to the upper surface of the mask 80, the printing head 212 moves in the squeegeeing direction (the direction of arrow b in FIG. 3). That is, the printing head 212 performs a squeegeeing operation. In this squeegeeing operation, the squeegee 73b slides while scraping the solder paste 18 on the upper surface of the mask 80. Thereby, the mask opening 80a is filled with the solder paste 18. Next, a separation from the mask 80 is executed with the substrate 17 being separated from the lower surface of the mask 80. Thereby, the solder paste 18 in the mask opening 80a is transferred to the land 17a of the substrate 17. As a result, the solder paste 18 is printed on the substrate 17 to be printed in a predetermined printing pattern through the mask opening 80a. That is, printed solder is formed.

[0066] In the process where the squeegeeing operation is repeated, the remaining amount of the solder paste 18 scraped by the squeegee 73b gradually decreases. To detect the remaining amount of this solder paste 18, the print head 212 is provided with a distance sensor 81. The distance sensor 81 is a reflection-type optical sensor, and detects the position of the surface of the solder paste 18 scraped by the squeegee 73b on the upper surface of the mask 80 by receiving reflected light (the light indicated by the dashed arrow c in FIG. 3).

[0067] The solder paste detection unit 82 receives the detection result by the distance sensor 81. Thereby, the solder paste detection unit 82 measures the height h of the solder paste 18 moving on the upper surface of the mask 80 or the rolling diameter d of the solder paste 18 flowing on the upper surface of the mask 80 by the squeegee 73b. Based on the height h or the rolling diameter d measured in this way, the solder paste detection unit 82 determines the remaining amount of the solder paste 18 on the mask 80.

[0068] FIG. 4 is a diagram for explaining an example of the configuration of the inspection apparatus 300.

[0069] As shown in FIG. 4, the inspection apparatus 300 includes a base 91, a pair of support frames 91a, a top plate 91b, an inspection stage moving mechanism 93, an inspection stage 92, a loading conveyor 96a, an unloading conveyor 96c, an imaging unit 97, and an inspection control unit 302.

[0070] A pair of support frames 91a are erected at both ends in the X direction of the base 91. The top plate 91b is attached to the upper ends of the pair of support frames 91a in a state along the horizontal direction.

[0071] The inspection control unit 302 is built in the base 91. For example, the inspection control unit 302 controls other components included in the inspection apparatus 300. Thereby, the inspection control unit 302 performs the conveyance operation of the substrate 17 and the inspection of the substrate 17.

[0072] The loading conveyor 96a is located upstream of the inspection stage conveyor 96b of the inspection stage 92 and is arranged to penetrate an opening provided in the upstream support frame 91a. When the substrate 17 is loaded in the direction along the arrow d in FIG. 4, such a loading conveyor 96a conveys the substrate 17 and delivers it to the inspection stage conveyor 96b. When an inspection is performed on the substrate 17 delivered to the inspection stage conveyor 96b, the inspection stage conveyor 96b conveys the substrate 17 and delivers it to the unloading conveyor 96c. The unloading conveyor 96c is located downstream of the inspection stage conveyor 96b and is arranged to penetrate an opening provided in the downstream support frame 91a. When such an unloading conveyor 96c receives the substrate 17 from the inspection stage conveyor 96b, it conveys the substrate 17 and unloads it outside the inspection apparatus 300.

[0073] The inspection stage moving mechanism 93 is arranged on the upper surface of the base 91 and moves the inspection stage 92 disposed thereon. The inspection stage moving mechanism 93 includes an inspection table 93a and a moving member 93b stacked on the inspection table 93a. By driving the inspection table 93a, the moving member 93b is moved in the X direction and the Y direction (i.e., the horizontal direction) and rotated about an axis along the Z direction. Thereby, the inspection stage 92 moves and rotates in the horizontal direction together with the moving member 93b.

[0074] The inspection stage 92 supports the substrate 17 to be inspected loaded from the upstream side and aligns the position of the substrate 17 with respect to the imaging unit 97. Specifically, the inspection stage 92 includes a backup lifting mechanism 94, a plurality of support members 93c, a substrate backup portion 95, a plurality of support pins 95a, and an inspection stage conveyor 96b.

[0075] A plurality of support members 93c are erected on the moving member 93b and support the inspection stage conveyor 96b. The inspection stage conveyor 96b conveys the substrate 17 by a driving belt. Alignment of the substrate 17 with respect to the imaging unit 97 is performed by such conveyance by the inspection stage conveyor 96b and movement and rotation by the inspection stage movement mechanism 93.

[0076] The backup lifting mechanism 94 is coupled to the upper surface of the moving member 93b and raises and lowers the substrate backup portion 95 in the Z direction. A plurality of support pins 95a are arranged on the upper surface of the substrate backup portion 95 according to the substrate support layout. The backup lifting mechanism 94 raises the substrate backup portion 95 in a state where the substrate 17 is loaded onto the inspection stage conveyor 96b. Thereby, the backup lifting mechanism 94 causes the plurality of support pins 95a to contact the lower surface of the substrate 17 and lift the substrate 17. Then, the backup lifting mechanism 94 supports the substrate 17 on the plurality of support pins 95a from the base 91 side in the Z direction so that the substrate 17 is maintained at the imaging height position. After the inspection of the substrate 17 is completed, the backup lifting mechanism 94 lowers the substrate backup portion 95 to return the substrate 17 to the inspection stage conveyor 96b.

[0077] The imaging unit 97 includes a lens barrel portion 97a, a camera 98, an illumination unit 97b, and a half mirror 97c. The lens barrel portion 97a is above the inspection stage 92 and is attached in a state of hanging down with respect to the top plate 91b. The camera 98 is built in the upper part of the lens barrel portion 97a so that the imaging direction is downward. The half mirror 97c is built in the lens barrel portion 97a at a position lower than the camera 98. The illumination unit 97b is attached to the lower end portion of the lens barrel portion 97a and incorporates upper-stage illumination 99a and lower-stage illumination 99b.

[0078] When the camera 98 takes an image, at least one of the upper-stage illumination 99a and the lower-stage illumination 99b lights up according to the illumination conditions suitable for the imaging target. Further, the coaxial illumination 99c provided on the side surface of the lens barrel portion 97a lights up. As a result, the light of the coaxial illumination 99c hits the substrate 17 from the same direction as the imaging direction of the camera 98 through the half mirror 97c in the lens barrel portion 97a. Thereby, the substrate 17 is illuminated. The inspection control unit 302 controls the inspection of the state of the printed solder based on the image obtained by the imaging by the imaging unit 97, that is, the image of the substrate 17 on which the printed solder is formed.

[0079] FIG. 5 is a block diagram showing an example of the functional configuration of the information processing apparatus 100.

[0080] The information processing apparatus 100 is an apparatus for forming printed solder by printing solder paste 18 onto a substrate 17 through a mask 80 in which a mask opening 80a is formed, and manages a printing apparatus 200 and an inspection apparatus 300. Such an information processing apparatus 100 includes a first communication unit 101, a management control unit 102, a learning unit 103, a first model storage unit 104, a first input unit 105, a first display unit 106, a first evaluation unit 107, and a first storage unit 108.

[0081] The first communication unit 101 is a communication interface for communicating with each of the printing apparatus 200 and the inspection apparatus 300 via a communication network Nt.

[0082] The first input unit 105 receives input information according to an input operation by the user and outputs the input information to the management control unit 102. Such a first input unit 105 is configured as, for example, a keyboard, a touch sensor, a touch pad, or a mouse, but is not limited thereto.

[0083] The first display unit 106 is a display that displays, for example, an image or characters according to the control by the management control unit 102. Such a first display unit 106 is configured as, for example, a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, etc., but is not limited thereto.

[0084] The first storage unit 108 is a recording medium for storing material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5. The material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 are performance information indicating the mode of printing already executed by the printing apparatus 200. Further, when the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 are used for generating the evaluation model m described later, these information are also respectively referred to as second material information, second mask information, second substrate information, second printing condition information, and first inspection result information. Further, when the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 are used for updating the evaluation model m, these information are also respectively referred to as third material information, third mask information, third substrate information, third printing condition information, and second inspection result information.

[0085] The material information d1 is information regarding the solder paste 18, and indicates physical properties, particle size, etc. of the solder paste 18. The mask information d2 is information regarding the mask 80, and indicates the thickness of the mask 80, the area of the mask opening 80a, the mask tension, etc. The substrate information d3 is information regarding the substrate 17, and indicates the configuration, material, shape, size, etc. of the substrate 17. The printing condition information d4 is information indicating conditions regarding printing, and indicates printing pressure value, printing speed, cleaning speed, etc. Further, the inspection result information d5 indicates, as an inspection result, the state of the printed solder formed by the printing by the printing apparatus 200 based on the material information d1, mask information d2, substrate information d3, and printing condition information d4.

[0086] The learning unit 103 generates an evaluation model m by performing machine learning using the information stored in the first storage unit 108, that is, the material information d1, the mask information d2, the substrate information d3, the printing condition information d4, and the inspection result information d5. The learning unit 103 stores the generated evaluation model m in the first model storage unit 104. The first model storage unit 104 is a recording medium for storing the evaluation model m. The evaluation model m includes a solder volume evaluation model m1, a solder shape evaluation model m2, a printing position evaluation model m3, and a cleaning evaluation model m4.

[0087] Specifically, the learning unit 103 generates the evaluation model m by performing machine learning so that an evaluation value is output from the evaluation model m for the input of the material information d1, the mask information d2, the substrate information d3, and the printing condition information d4 to the evaluation model m. The evaluation value is a value indicating the evaluation of the printing condition information d4 with respect to the material information d1, the mask information d2, and the substrate information d3. That is, the evaluation value is a value indicating how well the printing conditions indicated by the printing condition information d4 match the material information d1, the mask information d2, and the substrate information d3 in order to form high-quality printed solder. The higher the evaluation value, the more suitable the printing conditions are.

[0088] In the generation of such an evaluation model m, the parameters indicated by the material information d1, the mask information d2, the substrate information d3, and the printing condition information d4 are treated as explanatory variables, and the parameters indicated by the inspection result information d5 are treated as target variables. That is, the evaluation model m outputs information indicating the state of the printed solder for the input of the material information d1, the mask information d2, the substrate information d3, and the printing condition information d4. Machine learning is performed so that the output information approaches the inspection result information d5. Then, the evaluation model m finally outputs, as an evaluation value, a value indicating how close the state of the printed solder is to the ideal state.

[0089] The solder volume evaluation model m1 outputs a volume evaluation value for inputs of material information d1, mask information d2, substrate information d3, and printing condition information d4. The volume evaluation value indicates how close the volume of the printed solder formed by printing according to those pieces of information is to the ideal volume. The ideal volume is the product of the area of land 17a and the thickness of mask 80. For example, the volume evaluation value is a value within the range of 0 to 100, and the closer the volume of the printed solder is to the ideal volume, the larger the value indicates.

[0090] The solder shape evaluation model m2 outputs a shape evaluation value for inputs of material information d1, mask information d2, substrate information d3, and printing condition information d4. The shape evaluation value indicates how close the shape of the cross-section of the printed solder formed by printing according to those pieces of information is to the ideal shape. The ideal shape is a rectangle, not a trapezoid. Note that the cross-section of the printed solder is the cross-section in the direction perpendicular to the surface of substrate 17. For example, the shape evaluation value is a value within the range of 0 to 100, and the closer the shape of the cross-section of the printed solder is to the ideal shape, the larger the value indicates.

[0091] The printing position evaluation model m3 outputs a position evaluation value for inputs of material information d1, mask information d2, substrate information d3, and printing condition information d4. The position evaluation value indicates how close the center position or the centroid position of the printed solder formed by printing according to those pieces of information is to the ideal position. The ideal position is the center position or the centroid position of land 17a. For example, the position evaluation value is a value within the range of 0 to 100, and the closer the position of the printed solder is to the ideal position, the larger the value indicates.

[0092] The cleaning evaluation model m4 outputs a cleaning evaluation value for the inputs of material information d1, mask information d2, substrate information d3, and printing condition information d4. The cleaning evaluation value indicates the productivity of the printed solder formed by printing according to those pieces of information. When defective printed solder is formed, or when cleaning takes a long time, the productivity of the printed solder is low, and the lower the productivity, the smaller the cleaning evaluation value. For example, the cleaning evaluation value is a value within the range of 0 to 100.

[0093] When the first evaluation unit 107 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 by the first communication unit 101 and the first input unit 105, it evaluates the printing condition information d4. Note that these acquired material information d1, mask information d2, substrate information d3, and printing condition information d4 are information not stored in the first storage unit 108, and are also respectively referred to as first material information, first mask information, first substrate information, and first printing condition information. For example, the first communication unit 101 acquires, as detection values, some of the information or parameters of the material information d1, mask information d2, substrate information d3, and printing condition information d4 from the printing apparatus 200 and outputs them to the management control unit 102. The first input unit 105 receives all the remaining information of the material information d1, mask information d2, substrate information d3, and printing condition information d4 as input information by the user and outputs them to the management control unit 102. Then, the first evaluation unit 107 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 from the first communication unit 101 and the first input unit 105 via the management control unit 102, and evaluates the printing condition information d4. That is, the first evaluation unit 107 evaluates the conditions related to printing indicated by the printing condition information d4 with respect to the material information d1, mask information d2, and substrate information d3. The evaluation model m stored in the first model storage unit 104 is used for the evaluation of this printing condition information d4. The evaluation by the first evaluation unit 107 is performed in the same manner as the evaluation by the second evaluation unit 207 described later provided in the printing apparatus 200.

[0094] In addition, in the present embodiment, the functional unit including the first communication unit 101 and the first input unit 105 is configured as a first acquisition unit 110 that acquires material information d1, mask information d2, substrate information d3, and printing condition information d4.

[0095] The management control unit 102 controls other components included in the information processing apparatus 100 other than the management control unit 102 itself. For example, the management control unit 102 acquires the material information d1, the mask information d2, the substrate information d3, and the printing condition information d4 as actual performance information from the printing apparatus 200 via the communication network Nt and the first communication unit 101, respectively. Further, the management control unit 102 acquires inspection result information d5 as actual performance information from the inspection apparatus 300 via the communication network Nt and the first communication unit 101. Then, the management control unit 102 stores those actual performance information in the first storage unit 108. Further, when the management control unit 102 receives an operation to start learning as an input operation to the first input unit 105 by the user, the management control unit 102 causes the learning unit 103 to start the above-described machine learning. As a result, an evaluation model m is generated and stored in the first model storage unit 104. In addition, when the management control unit 102 receives a re-learning operation as an input operation to the first input unit 105 by the user, the management control unit 102 causes the learning unit 103 to start the re-learning of the above-described machine learning. As a result, the evaluation model m stored in the first model storage unit 104 is updated. Further, the management control unit 102 transmits the generated evaluation model m stored in the first model storage unit 104 or the updated evaluation model m stored in the first model storage unit 104 to the printing apparatus 200 via the first communication unit 101 and the communication network Nt. The evaluation model m transmitted in this way is stored in the printing apparatus 200. In addition, when the evaluation is performed by the first evaluation unit 107, the management control unit 102 displays the result of the evaluation on the first display unit 106.

[0096] Note that the management control unit 102, the learning unit 103, and the first evaluation unit 107 are realized, for example, by a CPU (Central Processing Unit) or a processor, etc., by reading and executing a program stored in a memory (not shown in FIG. 5).

[0097] FIG. 6 is a block diagram showing an example of the functional configuration of the printing apparatus 200.

[0098] The printing apparatus 200 is an apparatus that forms printed solder by printing solder paste 18 onto a substrate 17 through a mask 80 in which a mask opening 80a is formed. Such a printing apparatus 200 includes a second communication unit 201, a printing control unit 202, a second model storage unit 204, a second input unit 205, a second display unit 206, a second evaluation unit 207, a second storage unit 208, a substrate positioning unit 211, a printing head 212, a squeegee movement mechanism 213, a printing pressure applying mechanism 214, a mask cleaning mechanism 215, a clamping mechanism 216, and a detection unit 217.

[0099] The second communication unit 201 is a communication interface for communicating with each of the information processing apparatus 100 and the inspection apparatus 300 via a communication network Nt.

[0100] The second model storage unit 204 is a recording medium for storing an evaluation model m generated by the information processing apparatus 100, similar to the first model storage unit 104. The evaluation model m includes a solder volume evaluation model m1, a solder shape evaluation model m2, a printing position evaluation model m3, and a cleaning evaluation model m4.

[0101] The second input unit 205 receives input information in response to an input operation by the user and outputs the input information to the printing control unit 202. Such a second input unit 205 is configured, for example, as a keyboard, a touch sensor, a touch pad, or a mouse, but is not limited thereto.

[0102] The second display unit 206 is a display that displays, for example, an image or characters in response to control by the printing control unit 202. Such a second display unit 206 is configured, for example, as a liquid crystal display, a plasma display, an organic EL display, etc., but is not limited thereto.

[0103] The second storage unit 208 is a recording medium for storing material information d1, mask information d2, substrate information d3, and printing condition information d4. The material information d1, mask information d2, substrate information d3, and printing condition information d4 are information registered by the printing apparatus 200 or performance information indicating the mode of printing that has already been executed.

[0104] The substrate positioning unit 211 includes a printing stage moving mechanism 63 and a printing stage 62 shown in FIG. 2. The squeegee moving mechanism 213 includes a head support beam 72 and a head moving mechanism 74 shown in FIG. 2. The printing pressure applying mechanism 214 is a mechanism realized by a squeegee elevating mechanism that elevates and lowers a squeegee holding unit 73a shown in FIG. 3. The printing pressure applying mechanism 214 adjusts the pressure with which the squeegee 73b presses the mask 80 by elevating and lowering the squeegee 73b. Note that this pressure is also referred to as printing pressure or a printing pressure value.

[0105] The detection unit 217 detects the viscosity of the solder paste 18 shown in FIG. 3 as the solder viscosity. The detection unit 217 also detects the tension of the extended mask 80 as the mask tension. Further, the detection unit 217 may detect the discharge amount of the cleaning solvent. The discharge amount of the cleaning solvent is the discharge amount of the solvent used for wet cleaning by the mask cleaning mechanism 215. That is, the detection unit 217 includes sensors for detecting each of the solder viscosity, mask tension, and discharge amount of the cleaning solvent. Then, the detection unit 217 detects the solder viscosity, mask tension, and discharge amount of the cleaning solvent as detection values based on the outputs from those sensors, and outputs those detection values to the printing control unit 202.

[0106] When the second evaluation unit 207 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 by the detection unit 217 and the second input unit 205, it evaluates the printing condition information d4. Note that the acquired material information d1, mask information d2, substrate information d3, and printing condition information d4 are information that is not stored in the second storage unit 208, and are the first material information, first mask information, first substrate information, and first printing condition information. For example, the detection unit 217 detects some of the information or parameters among the material information d1, mask information d2, substrate information d3, and printing condition information d4 as detection values and outputs them to the print control unit 202. The second input unit 205 receives all the remaining information among the material information d1, mask information d2, substrate information d3, and printing condition information d4 as input information by the user and outputs it to the print control unit 202. Then, the second evaluation unit 207 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 from the detection unit 217 and the second input unit 205 via the print control unit 202, and evaluates the printing condition information d4 in the same manner as the first evaluation unit 107. That is, the second evaluation unit 207 evaluates the conditions related to printing indicated by the printing condition information d4 with respect to the material information d1, mask information d2, and substrate information d3. The evaluation model m stored in the second model storage unit 204 is used for the evaluation of the printing condition information d4. The evaluation by the second evaluation unit 207 is performed in the same manner as the evaluation by the first evaluation unit 107 provided in the information processing apparatus 100.

[0107] Note that in the present embodiment, the functional unit including the detection unit 217 and the second input unit 205 is configured as a second acquisition unit 210 that acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4.

[0108] The printing control unit 202 controls other components included in the printing apparatus 200 other than the printing control unit 202 itself. For example, the printing control unit 202 acquires the evaluation model m from the information processing apparatus 100 via the communication network Nt and the second communication unit 201 and stores it in the second model storage unit 204. Further, the printing control unit 202 transmits the detection value detected by the detection unit 217 to the information processing apparatus 100 via the second communication unit 201 and the communication network Nt. Thereby, the detection value is used for the evaluation by the first evaluation unit 107 of the information processing apparatus 100. Then, when the evaluation by the second evaluation unit 207 is performed and an instruction for registration is received, the printing control unit 202 stores the material information d1, mask information d2, substrate information d3, and printing condition information d4 used for the evaluation in the second storage unit 208. That is, the material information d1, mask information d2, substrate information d3, and printing condition information d4 are registered. Note that the registration instruction is received in response to an input operation by the user to the second input unit 205. Then, the printing control unit 202 causes printing based on the registered material information d1, mask information d2, substrate information d3, and printing condition information d4 to be executed by the substrate positioning unit 211, printing head 212, squeegee moving mechanism 213, printing pressure applying mechanism 214, mask cleaning mechanism 215, and clamp mechanism 216, etc. As a result, printed solder is formed on the substrate 17 by printing based on the material information d1, mask information d2, substrate information d3, and printing condition information d4. Further, inspection of the printed solder is performed by the inspection apparatus 300, and inspection result information d5 corresponding to the material information d1, mask information d2, substrate information d3, and printing condition information d4 is generated by the inspection apparatus 300. As a result, the material information d1, mask information d2, substrate information d3, and printing condition information d4 stored in the second storage unit 208 are each treated as performance information together with the inspection result information d5. Further, the printing control unit 202 transmits the material information d1, mask information d2, substrate information d3, and printing condition information d4 stored as performance information in the second storage unit 208 to the information processing apparatus 100 via the second communication unit 201 and the communication network Nt.

[0109] Note that the print control unit 202 and the second evaluation unit 207 are realized by, for example, a CPU or a processor, etc., by reading and executing a program stored in a memory (not shown in FIG. 6).

[0110] FIG. 7 is a block diagram showing an example of the functional configuration of the inspection apparatus 300.

[0111] The inspection apparatus 300 includes a third communication unit 301, an inspection control unit 302, a third storage unit 308, and an inspection execution unit 317.

[0112] The third communication unit 301 is a communication interface for communicating with each of the information processing apparatus 100 and the printing apparatus 200 via the communication network Nt.

[0113] The inspection execution unit 317 executes an inspection on the substrate 17 printed by the printing apparatus 200. For example, the inspection execution unit 317 acquires an image obtained by imaging the substrate 17 by the camera 98 of the imaging unit 97 shown in FIG. 4, and inspects the state of the printed solder formed on the substrate 17 by executing recognition processing or image analysis on the image. The inspection execution unit 317 generates inspection result information d5 indicating the inspection result by inspecting the state of the printed solder, and stores it in the third storage unit 308. The third storage unit 308 is a recording medium for storing the inspection result information d5.

[0114] The inspection control unit 302 controls other components included in the inspection apparatus 300 other than the inspection control unit 302 itself. For example, the inspection control unit 302 transmits the inspection result information d5 stored in the third storage unit 308 to the information processing apparatus 100 via the third communication unit 301 and the communication network Nt. The inspection control unit 302 is realized by, for example, a CPU or a processor, etc., by reading and executing a program stored in a memory (not shown in FIG. 7).

[0115] FIG. 8 is a diagram showing an example of the inspection result information d5 obtained by the inspection apparatus 300.

[0116] The inspection result information d5 indicates, for example, a solder inspection number, a mask opening number, a solder centroid coordinate X, a solder centroid coordinate Y, a solder size X, a solder size Y, a solder inspection result code, a reference height, an area ratio, a deviation amount X, a deviation amount Y, a volume ratio, a vertex height, a recognized solder size X, and a recognized solder size Y.

[0117] The solder inspection number is a number assigned to the printed solder to be inspected in order to identify the printed solder. The mask opening number is a number assigned to the mask opening 80a of the mask 80 used to form the printed solder to be inspected in order to identify the mask opening 80a. The solder centroid coordinate X is the coordinate position of the centroid of the printed solder to be inspected in the X direction. The solder centroid coordinate Y is the coordinate position of the centroid of the printed solder to be inspected in the Y direction. The solder size X is the size of the mask opening 80a in the X direction corresponding to the printed solder to be inspected. The solder size Y is the size of the mask opening 80a in the Y direction corresponding to the printed solder to be inspected. Note that the solder size X and the solder size Y are set values.

[0118] The solder inspection result code indicates whether the printed solder to be inspected is defective or abnormal and whether it is a defect code. More specifically, the solder inspection result code indicates whether the printed solder has a volume abnormality, a shape abnormality, a position abnormality, a cleaning abnormality, etc. A volume abnormality is a state where the volume of the printed solder is larger or smaller than the allowable range, and a shape abnormality is a state where the shape of the printed solder deviates from the allowable range of shapes. A position abnormality is a state where the position of the printed solder is shifted from the land 17a beyond the allowable range. A cleaning abnormality is an abnormality of the printed solder caused by inappropriate cleaning of the mask 80.

[0119] The reference height is the height of the position that serves as the reference for the printed solder to be inspected. Specifically, the reference height is the height of the upper surface of the substrate 17 on which the solder is applied. The area ratio is the ratio of the area of the printed solder in contact with the land 17a to the area of the land 17a to be inspected. The deviation amount X is the deviation amount in the X direction with respect to the land 17a of the printed solder to be inspected. The deviation amount Y is the deviation amount in the Y direction with respect to the land 17a of the printed solder to be inspected. The volume ratio is the ratio of the volume of the printed solder to be inspected to the volume of the mask opening 80a. The vertex height is the height of the vertex of the printed solder to be inspected. The recognized solder size X is the size in the X direction of the printed solder to be inspected. The recognized solder size Y is the size in the Y direction of the printed solder to be inspected.

[0120] FIG. 9 is a diagram showing an example of a screen displayed on the second display unit 206 of the printing apparatus 200.

[0121] The second evaluation unit 207 of the printing apparatus 200 displays, for example, the evaluation screen P shown in FIG. 9 on the second display unit 206. The evaluation screen P is a screen for receiving material information d1, mask information d2, substrate information d3, and printing condition information d4.

[0122] The material information d1 indicates, for example, solder viscosity, solder particle size, etc. The solder viscosity is the viscosity of the solder paste 18, and the solder particle size is the particle size of the solder paste 18. Note that the above-mentioned solder viscosity etc. indicated by the material information d1 are examples, and the material information d1 may indicate physical properties of the solder paste 18 other than those.

[0123] The mask information d2 indicates, for example, mask thickness, mask tension, minimum area of the opening, etc. The mask thickness is the thickness of the mask 80, and the mask tension is the tension of the mask 80. The minimum area of the opening is the area of the smallest mask opening 80a among one or more mask openings 80a formed in the mask 80. Note that the above-mentioned mask thickness etc. indicated by the mask information d2 are examples, and the mask information d2 may indicate parameters related to the mask 80 other than those.

[0124] The substrate information d3 indicates, for example, the resist thickness, the minimum component chip size, the minimum CSP (Chip Size Package) size, etc. The resist thickness is the thickness of the resist on the substrate 17, the minimum component chip size is the size of the smallest component mounted on the substrate 17, and the minimum CSP size is the size of the smallest CSP (Chip Size Package) mounted on the substrate 17. Note that the resist thickness and the like indicated by the substrate information d3 are just examples, and the substrate information d3 may indicate other parameters related to the substrate 17.

[0125] The printing condition information d4 indicates the conditions related to printing. Specifically, it indicates the conditions of printing settings and the conditions of cleaning settings. The conditions of printing settings include the mode of release speed switching, the descending speed, the descending stroke, the printing pressure, the printing speed, etc. The release speed switching is a mode related to the switching of the speed of the substrate 17 when it separates from the lower surface of the mask 80, and is, for example, any one of high-speed multi, constant speed, and multi-stage. The descending speed is the speed at which the substrate 17 descends and may also be called the release speed. The descending stroke is the distance that the substrate 17 descends. The printing pressure is the value of the pressure applied by the printing pressure applying mechanism 214 (i.e., the printing pressure value), and the printing speed is the speed at which the squeegee 73b moves in the Y direction (i.e., the squeegee speed).

[0126] The conditions of cleaning settings include the cleaning mode, the vacuum switching, the cleaning speed, the cleaning interval, etc. The cleaning mode is a mode related to the cleaning of the mask 80 and is expressed, for example, by a combination of single or double and wet or dry. The vacuum switching indicates whether there is suction removal of foreign matter. The cleaning speed is the moving speed of the mask cleaning mechanism 215. The cleaning interval indicates the number of substrates 17. That is, every time printing is performed on that number of substrates 17, the mask 80 used for that printing is cleaned.

[0127] Note that the plate separation speed switching indicated by the printing condition information d4 is just an example, and the printing condition information d4 may indicate conditions related to printing other than those. For example, the printing condition information d4 may indicate the squeegee discharge amount, blower suction force, substrate clamping pressure, cleaning solvent discharge amount, and the like. The squeegee discharge amount is the length of the squeegee 73b protruding from the squeegee holding portion 73a shown in FIG. 3. The blower suction force is the suction force by the mask cleaning mechanism 215 shown in FIG. 2. The substrate clamping pressure is the pressure for sandwiching the substrate 17 by the clamping mechanism 216.

[0128] While viewing such an evaluation screen P, the user of the printing apparatus 200 operates the second input unit 205 to input a desired numerical value or mode into the frame provided for each piece of information and each parameter on the evaluation screen P. That is, the numerical value or mode is displayed in the frame. As a result, the second evaluation unit 207 acquires a numerical value or mode excluding a part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 in response to the input operation by the user to the second input unit 205 based on the evaluation screen P. The part thereof includes solder viscosity, mask tension, cleaning solvent discharge amount, and the like. For example, the second evaluation unit 207 acquires detection values indicating solder viscosity, mask tension, cleaning solvent discharge amount, and the like from the detection unit 217 via the printing control unit 202. Then, the second evaluation unit 207 displays the detection values on the evaluation screen P regardless of the input operation by the user to the second input unit 205. Thereby, the burden of the input operation by the user can be reduced, and accurate numerical values can be used for the evaluation by the second evaluation unit 207.

[0129] Here, the evaluation screen P has an evaluation value display frame p1, a calculation button p2, a registration button p3, and a cancel button p4.

[0130] The calculation button p2 is a button for calculating the evaluation value of the printing condition information d4 for the material information d1, mask information d2, and substrate information d3 received using the evaluation screen P. When the calculation button p2 is selected in response to an input operation by the user to the second input unit 205, the printing control unit 202 of the printing apparatus 200 causes the second evaluation unit 207 to execute the calculation of the evaluation value. As a result, the second evaluation unit 207 calculates the evaluation value of the printing condition information d4 and displays the evaluation value in the evaluation value display frame p1. That is, the evaluation of the printing conditions indicated by the printing condition information d4 is performed.

[0131] In a specific example, the second evaluation unit 207 obtains a volume evaluation value by inputting all or part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 into the solder volume evaluation model m1. Further, the second evaluation unit 207 obtains a shape evaluation value by inputting all or part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 into the solder shape evaluation model m2. Further, the second evaluation unit 207 obtains a position evaluation value by inputting all or part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 into the printing position evaluation model m3. Further, the second evaluation unit 207 obtains a cleaning evaluation value by inputting all or part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 into the cleaning evaluation model m4. Then, the second evaluation unit 207 calculates the evaluation value of the printing condition information d4 by weighted addition of the volume evaluation value, shape evaluation value, position evaluation value, and cleaning evaluation value. Note that all the weights for the weighted addition may be 1. In this case, the average value of the volume evaluation value, shape evaluation value, position evaluation value, and cleaning evaluation value is calculated as the evaluation value of the printing condition information d4. Note that each of the above evaluation values may be referred to as a correct answer rate.

[0132] The registration button p3 is a button for registering the material information d1, mask information d2, substrate information d3, and printing condition information d4 received using the evaluation screen P. When the registration button p3 is selected in response to an input operation by the user to the second input unit 205, the printing control unit 202 of the printing apparatus 200 causes the second evaluation unit 207 to execute the registration of the material information d1, mask information d2, substrate information d3, and printing condition information d4. As a result, the second evaluation unit 207 stores the material information d1, mask information d2, substrate information d3, and printing condition information d4 in the second storage unit 208.

[0133] The cancel button p4 is a button for canceling the material information d1, mask information d2, substrate information d3, and printing condition information d4 received using the evaluation screen P. When the cancel button p4 is selected in response to an input operation by the user to the second input unit 205, the printing control unit 202 of the printing apparatus 200 causes the second evaluation unit 207 to execute the cancellation of the material information d1, mask information d2, substrate information d3, and printing condition information d4. As a result, the second evaluation unit 207 deletes all or part of the material information d1, mask information d2, substrate information d3, and printing condition information d4 displayed on the evaluation screen P, specifically, numerical values or modes, etc.

[0134] FIG. 10 is a flowchart showing an example of the processing operation of the information processing apparatus 100.

[0135] The management control unit 102 of the information processing apparatus 100 first acquires the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5, and stores them in the first storage unit 108 (step S1). Specifically, the management control unit 102 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 from the printing apparatus 200 via the communication network Nt and the first communication unit 101 as information indicating the mode of printing executed by the printing apparatus 200. Further, the management control unit 102 acquires the inspection result information d5 from the inspection apparatus 300 via the communication network Nt and the first communication unit 101. This inspection result information d5 indicates the inspection result of the printed solder formed by the printing by the printing apparatus 200 based on the material information d1, mask information d2, substrate information d3, and printing condition information d4.

[0136] Next, the management control unit 102 causes the learning unit 103 to execute machine learning. As a result, the learning unit 103 generates or constructs an evaluation model m by performing machine learning using the material information d1, mask information d2, printing condition information d4, and inspection result information d5 stored in the first storage unit 108 (step S2). Then, the learning unit 103 stores the evaluation model m in the first model storage unit 104 (step S3).

[0137] Specifically, when constructing the solder volume evaluation model m1 included in the evaluation model m, the learning unit 103 may use, for machine learning, the printing pressure value, squeegee extrusion amount, cleaning speed, blower suction force, squeegee speed, and solder viscosity included in the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5. Also, the mask tension may be used for machine learning. The solder volume evaluation model m1 constructed in this way may be expressed by the mathematical formula "a1×(printing pressure value) + a2×(squeegee extrusion amount) + a3×(cleaning speed) + a4×(blower suction force) + a5×(squeegee speed) + a6×(solder viscosity) + a7×(mask tension)". Note that a1 to a7 are coefficients determined by machine learning.

[0138] Further, when constructing the solder shape evaluation model m2 included in the evaluation model m, the learning unit 103 may use, in machine learning, the release speed switching, release speed, printing pressure value, blower suction force, squeegee speed, vacuum switching, solder viscosity, and mask tension included in the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5. Even in this case, the solder shape evaluation model m2 may be expressed by weighted addition of each parameter as in the above-described mathematical formula.

[0139] Further, when constructing the printing position evaluation model m3 included in the evaluation model m, the learning unit 103 may use, in machine learning, the substrate clamping pressure and mask tension included in the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5. Even in this case, the printing position evaluation model m3 may be expressed by weighted addition of each parameter as in the above-described mathematical formula.

[0140] Further, when constructing the cleaning evaluation model m4 included in the evaluation model m, the learning unit 103 may use, in machine learning, the cleaning solvent discharge amount included in the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5. Even in this case, the cleaning evaluation model m4 may be expressed by weighted addition of each parameter as in the above-described mathematical formula.

[0141] Also, the machine learning algorithm may be a neural network (including deep learning using a multi-layer neural network), genetic programming, decision tree, Bayesian network, SVM (support vector machine), or the like.

[0142] FIG. 11 is a flowchart showing an example of the processing operation of the printing apparatus 200.

[0143] The second evaluation unit 207 of the printing apparatus 200 first displays an evaluation screen P on the second display unit 206 according to the control by the print control unit 202. Then, in response to the display of the evaluation screen P, the second acquisition unit 210 acquires material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 (step S11). Specifically, the second acquisition unit 210 acquires each of the above-mentioned pieces of information according to an input operation by the user to the second input unit 205 and detection by the detection unit 217. Then, those pieces of information are displayed on the evaluation screen P by the print control unit 202 and the second evaluation unit 207.

[0144] Next, the print control unit 202 determines whether it has received an instruction to calculate an evaluation value (step S12). That is, the print control unit 202 determines whether the calculation button p2 has been selected according to an input operation by the user to the second input unit 205. Here, if the print control unit 202 determines that it has not received an instruction to calculate an evaluation value (No in step S12), that is, if it determines that the calculation button p2 has not been selected, it causes the second evaluation unit 207 and the second acquisition unit 210 to continue executing the process of step S11. On the other hand, if the print control unit 202 determines that it has received an instruction to calculate an evaluation value (Yes in step S12), that is, if it determines that the calculation button p2 has been selected, it causes the second evaluation unit 207 to calculate an evaluation value (step S13). At this time, the second evaluation unit 207 calculates an evaluation value using the evaluation model m stored in the second model storage unit 204.

[0145] Next, the print control unit 202 determines whether or not an instruction to register has been received (step S14). That is, the print control unit 202 determines whether or not the registration button p3 has been selected in response to an input operation by the user to the second input unit 205. Here, if the print control unit 202 determines that an instruction to register has not been received (No in step S14), that is, if it determines that the registration button p3 has not been selected, it causes the processes in step S11 to be continuously executed by the second evaluation unit 207 and the second acquisition unit 210. On the other hand, if the print control unit 202 determines that an instruction to register has been received (Yes in step S14), that is, if it determines that the registration button p3 has been selected, it causes the second evaluation unit 207 to register the print condition information d4 (step S15). At this time, the second evaluation unit 207 stores the print condition information d4 received in step S11 together with the material information d1, mask information d2, and substrate information d3 received in that step S11 in the second storage unit 208. Thereby, the registration of the print condition information d4 is performed. In other words, the registration of all of the material information d1, mask information d2, substrate information d3, and print condition information d4 is performed.

[0146] FIG. 12 is a flowchart showing another example of the processing operation of the information processing apparatus 100. Specifically, the flowchart shows the process of re-learning the evaluation model m by the information processing apparatus 100.

[0147] First, the management control unit 102 of the information processing apparatus 100 acquires the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5, and stores them in the first storage unit 108 (step S21). Specifically, the management control unit 102 acquires the material information d1, mask information d2, substrate information d3, and printing condition information d4 from the printing apparatus 200 via the communication network Nt and the first communication unit 101 as information indicating the mode of printing executed by the printing apparatus 200. Further, the management control unit 102 acquires the inspection result information d5 from the inspection apparatus 300 via the communication network Nt and the first communication unit 101. This inspection result information d5 indicates the inspection result of the printed solder formed by the printing by the printing apparatus 200 based on the material information d1, mask information d2, substrate information d3, and printing condition information d4. Note that each piece of information acquired in step S21 is information obtained by the printing apparatus 200 and the inspection apparatus 300 after the evaluation model m is generated or after the evaluation model m is updated most recently. The material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 thus acquired are also referred to as the third material information, third mask information, third substrate information, third printing condition information, and second inspection result information as described above.

[0148] Next, the management control unit 102 causes the learning unit 103 to perform re-learning of machine learning. As a result, the learning unit 103 performs re-learning using the material information d1, mask information d2, substrate information d3, printing condition information d4, and inspection result information d5 stored in the first storage unit 108. Then, the learning unit 103 updates the evaluation model m stored in the first model storage unit 104 by the re-learning (step S22). The management control unit 102 transmits the updated evaluation model m to the printing apparatus 200 via the first communication unit 101 and the communication network Nt (step S23). As a result, the evaluation model m stored in the second model storage unit 204 of the printing apparatus 200 is also updated.

[0149] As described above, the printing processing system 1000 in the present embodiment includes an acquisition unit that acquires first material information regarding the solder paste 18, first mask information regarding the mask 80, first substrate information regarding the substrate 17, and first printing condition information indicating conditions regarding printing, an evaluation unit that evaluates the above-described conditions regarding printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information, and a display unit that displays the evaluation result by the evaluation unit of the conditions regarding printing. Note that the above-described acquisition unit is at least one of the first acquisition unit 110 and the second acquisition unit 210, the evaluation unit is at least one of the first evaluation unit 107 and the second evaluation unit 207, and the display unit is at least one of the first display unit 106 and the second display unit 206. Also, the first material information, first mask information, first substrate information, and first printing condition information are, for example, material information d1, mask information d2, substrate information d3, and printing condition information d4 acquired by the detection unit 217, the first input unit 105, or the second input unit 205.

[0150] Accordingly, when the first material information, first mask information, first substrate information, and first printing condition information are acquired, the conditions regarding printing indicated by the first printing condition information are evaluated and displayed. For example, when printing of the solder paste 18 is performed based on the first material information, first mask information, first substrate information, and first printing conditions, and extremely high-quality printed solder is formed, the highest evaluation result is displayed for the conditions regarding printing indicated by the first printing condition information. On the other hand, when the highest evaluation result is displayed, it is easily assumed that the tact time becomes long under the conditions regarding printing indicated by the first printing condition information. Therefore, the user can find the conditions regarding printing in which high-quality printed solder is formed without the tact time being too long by adjusting the conditions regarding printing indicated by the first printing condition information while looking at the evaluation result. As a result, it is possible to increase the possibility of achieving both an improvement in the quality of the printed solder and suppression of an increase in the tact time.

[0151] In addition, the printing processing system 1000 in the present embodiment further includes a model storage unit that stores the evaluation model m. Then, the above-described evaluation unit evaluates the conditions related to printing by inputting the acquired first material information, the first mask information, the first substrate information, and the first printing condition information into the evaluation model m. Here, the evaluation model m outputs an evaluation result for the printing conditions indicated by the printing condition information in response to the input of the material information related to the solder paste 18, the mask information related to the mask, the substrate information related to the substrate, and the printing condition information indicating the conditions related to printing. It is generated by machine learning using the first performance information used in printing. The first performance information includes second material information related to the solder paste 18, second mask information related to the mask 80, second substrate information related to the substrate 17, second printing condition information indicating the conditions related to printing, and first inspection result information indicating the inspection result of the printed solder. Note that the above-described model storage unit is at least one of the first model storage unit 104 and the second model storage unit 204. Also, the second material information, the second mask information, the second substrate information, the second printing condition information, and the first inspection result information included in the first performance information are the material information d1, the mask information d2, the substrate information d3, the printing condition information d4, and the inspection result information d5 stored in the first storage unit 108.

[0152] As a result, since the evaluation result of the conditions related to printing is displayed using the evaluation model m generated by machine learning using the first performance information, an appropriate evaluation result based on the performance can be obtained.

[0153] In addition, the printing processing system 1000 in the present embodiment further includes a learning unit 103 that generates the evaluation model m by machine learning and stores it in the first model storage unit 104.

[0154] As a result, the user of the printing processing system 1000 can generate an evaluation model m corresponding to the printing processing system 1000 and obtain a more appropriate evaluation result.

[0155] Further, the learning unit 103 in the present embodiment further updates the evaluation model m stored in the first model storage unit 104 by performing re-learning of machine learning. In the re-learning, the learning unit 103 uses the second performance information used in printing performed after the generation of the evaluation model m. The second performance information includes third material information regarding the solder paste 18, third mask information regarding the mask 80, third substrate information regarding the substrate 17, third printing condition information indicating the conditions regarding printing, and second inspection result information indicating the inspection result of the printed solder.

[0156] Thereby, the evaluation model m can be updated based on the recent performance, and a more appropriate evaluation result can be obtained.

[0157] Further, the printing processing system 1000 in the present embodiment further includes a printing apparatus 200 that forms printed solder by printing, and an information processing apparatus 100 connected to the printing apparatus 200. And the learning unit 103 is provided in the information processing apparatus 100.

[0158] Thereby, the user of the printing processing system 1000 can perform machine learning based on the printing performance in the user's printing apparatus 200 by the information processing apparatus 100, and can obtain an appropriate evaluation result based on the user's own performance.

[0159] Further, the printing processing system 1000 in the present embodiment may include a printing apparatus 200 that forms printed solder by printing, and a control unit that controls the model storage unit. The control unit may acquire the evaluation model m generated or updated by the information processing apparatus owned by the manufacturer of the printing apparatus 200 from the information processing apparatus of the manufacturer and store it in the model storage unit. Note that the model storage unit is at least one of the first model storage unit 104 and the second model storage unit 204. Also, the control unit is at least one of the management control unit 102 and the printing control unit 202.

[0160] As a result, even if the printing apparatus 200 of the printing processing system 1000 fails to obtain printing results, or even if machine learning cannot be performed in the printing processing system 1000, the evaluation model m provided by the manufacturer of the printing apparatus 200 can be used. Therefore, the configuration of the printing processing system 1000 can be simplified, and the processing load can be reduced. Also, by using the evaluation model m supplied by the manufacturer, general evaluation results can be obtained.

[0161] In addition, the evaluation model m in the present embodiment includes a solder volume evaluation model m1 that evaluates printing conditions based on the volume of the printed solder formed on the substrate 17, a solder shape evaluation model m2 that evaluates printing conditions based on the shape of the printed solder formed on the substrate 17, a printing position evaluation model m3 that evaluates printing conditions based on the position of the printed solder formed on the substrate 17, and a cleaning evaluation model m4 that evaluates the cleaning conditions of the mask 80 included in the printing conditions based on the productivity and quality of the printed solder formed on the substrate 17. Note that in the present embodiment, the evaluation model m includes all of the solder volume evaluation model m1, the solder shape evaluation model m2, the printing position evaluation model m3, and the cleaning evaluation model m4, but it may include at least one of these.

[0162] As a result, printing conditions can be appropriately evaluated from at least one of the viewpoints of the volume of the printed solder, the shape of the printed solder, the position of the printed solder, and the cleaning of the mask 80.

[0163] In addition, the evaluation unit in the present embodiment inputs one or more pieces of information from among the first material information, the first mask information, the first substrate information, and the first printing condition information to each of at least one of the models including the solder volume evaluation model m1, the solder shape evaluation model m2, the printing position evaluation model m3, and the cleaning evaluation model m4 included in the evaluation model m, derives a numerical value for the printing conditions, and calculates the evaluation result as an evaluation value based on the derived numerical value.

[0164] Thus, for example, when numerical values are derived from each of the solder volume evaluation model m1, the solder shape evaluation model m2, the printing position evaluation model m3, and the cleaning evaluation model m4, an evaluation value is calculated from those numerical values. In a more specific example, the evaluation value may be calculated by weighted addition of those numerical values. Thereby, a more appropriate evaluation result that comprehensively considers the volume, shape, etc. of the printed solder can be obtained as the evaluation value.

[0165] In addition, the printing apparatus 200 in the present embodiment includes a detection unit 217 that detects parameters of an object used for printing as detection values. Then, the learning unit 103 performs the above-described machine learning using the detection values detected by the detection unit 217, which are shown in at least one of the second material information, the second mask information, the second substrate information, and the second printing condition information.

[0166] Thereby, since the detection values are used for machine learning, the detection values can be used as accurate information in the teacher data of the machine learning, and the possibility of generating a high-performance evaluation model m can be increased.

[0167] In addition, when the learning unit 103 in the present embodiment uses the detection value shown in the second material information for machine learning, the viscosity of the solder paste 18 detected by the detection unit 217 is used as the detection value.

[0168] Thereby, the accurate viscosity of the solder paste 18 can be used in the teacher data, and the possibility of generating a high-performance evaluation model m can be increased.

[0169] In addition, when the learning unit 103 in the present embodiment uses the detection value shown in the second mask information for machine learning, the value of the mask tension of the mask 80 detected by the detection unit 217 is used as the detection value.

[0170] Thereby, the accurate mask tension can be used in the teacher data, and the possibility of generating a high-performance evaluation model m can be increased.

[0171] Further, when the learning unit 103 in the present embodiment uses the detection value indicated in the second printing condition information for machine learning, it uses the discharge amount of the solvent used for cleaning the mask 80 detected by the detection unit 217 as the detection value.

[0172] Thereby, an accurate discharge amount of the solvent can be used as teacher data, and the possibility of generating a high-performance evaluation model m can be increased.

[0173] Further, the information processing apparatus 100 in the present embodiment includes the above-described acquisition unit, evaluation unit, and display unit. In this case, the acquisition unit is the first acquisition unit 110, the evaluation unit is the first evaluation unit 107, and the display unit is the first display unit 106.

[0174] Therefore, the information processing apparatus 100 in the present embodiment can achieve the same operational effects as the above-described printing processing system 1000.

[0175] Further, the printing apparatus 200 in the present embodiment includes the above-described acquisition unit, evaluation unit, and display unit. In this case, the acquisition unit is the second acquisition unit 210, the evaluation unit is the second evaluation unit 207, and the display unit is the second display unit 206.

[0176] Therefore, the printing apparatus 200 in the present embodiment can achieve the same operational effects as the above-described printing processing system 1000.

[0177] As described above, the printing processing system 1000 and the information processing method according to one or more aspects have been described based on the embodiments. However, the present disclosure is not limited to these embodiments. Various modifications conceived by those skilled in the art may also be included in the present disclosure as long as they do not depart from the spirit of the present disclosure.

[0178] For example, in the above embodiment, each of the information processing apparatus 100 and the printing apparatus 200 evaluates conditions related to printing, but only one of them may evaluate the conditions. In this case, one of the first evaluation unit 107 and the second evaluation unit 207 may not be provided in the printing processing system 1000.

[0179] Also, in the above embodiment, the information processing apparatus 100 includes the learning unit 103, but it may not include the learning unit 103. In this case, the management control unit 102 of the information processing apparatus 100 acquires the evaluation model m from another information processing apparatus owned by the manufacturer of the printing apparatus 200 via the first communication unit 101 and stores it in the first model storage unit 104 as described above.

[0180] Also, in the above embodiment, the printing apparatus 200 does not include the learning unit 103, but it may include the learning unit 103.

[0181] Also, the recording media such as the first storage unit 108, the first model storage unit 104, the second storage unit 208, and the second model storage unit 204 in the above embodiment are a hard disk drive, a RAM (Random Access Memory), a ROM (Read Only Memory), or a semiconductor memory, etc. Note that such a recording medium may be volatile or non-volatile.

[0182] Note that in the above embodiment, one or more components included in the printing processing system 1000 may be configured by dedicated hardware or may be realized by executing a software program suitable for those components. One or more components may be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software for realizing each apparatus in the above embodiment causes a computer to execute each step of the flowcharts shown in FIGS. 10 to 12, for example.

[0183] In addition, the following cases are also included in the present disclosure.

[0184] (1) The above one or more components may specifically be a computer system composed of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or the hard disk unit. When the microprocessor operates according to the computer program, the one or more components achieve their functions. Here, the computer program is composed of a combination of a plurality of instruction codes indicating instructions to the computer in order to achieve a predetermined function.

[0185] (2) The above one or more components may be composed of a single system LSI (Large Scale Integration). A system LSI is a super multi-functional LSI manufactured by integrating a plurality of components on one chip, and specifically, is a computer system including a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. When the microprocessor operates according to the computer program, the system LSI achieves its function.

[0186] (3) The above one or more components may be composed of a detachable IC card or a single module. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above super multi-functional LSI. When the microprocessor operates according to the computer program, the IC card or module achieves its function. This IC card or this module may have tamper resistance.

[0187] (4) The present disclosure may be the method described above. It may also be a computer program for realizing these methods by a computer, or a digital signal consisting of a computer program.

[0188] In addition, the present disclosure may be a computer program or a digital signal recorded on a computer-readable recording medium, such as a flexible disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. It may also be a digital signal recorded on these recording media.

[0189] In addition, the present disclosure may be a computer program or a digital signal transmitted via a telecommunication line, a wireless or wired communication line, a network represented by the Internet, data broadcasting, etc.

[0190] In addition, it may be implemented by another independent computer system by recording and transferring the program or digital signal to a recording medium, or by transferring the program or digital signal via a network or the like.

Industrial Applicability

[0191] The present disclosure can be used, for example, in a system for printing solder on a substrate.

Explanation of Signs

[0192] 17 Substrate 17a Land 18 Solder paste 61 Base 62 Printing stage 63 Printing stage moving mechanism 63a Printing table 63z Second elevating mechanism 64 Elevating table 64a Support member 65 Substrate support part 65a Support pin 65b First lifting mechanism 66a Loading conveyor 66b Printing stage conveyor 66c Unloading conveyor 71 Support frame 72 Head support beam 72a Linear guide mechanism 73a Squeegee holding part 73b Squeegee 74 Head movement mechanism 75 Camera X-axis beam 75a Camera X-axis motor 75b Feed screw 75c Linear guide mechanism 76x Camera X-axis movement mechanism 76y Camera Y-axis movement mechanism 77 Moving member 78 First camera 79 Second camera 80 Mask 80a Mask opening 81 Distance sensor 82 Solder paste detection part 91 Base 91a Support frame 91b Top plate 92 Inspection stage 93 Inspection stage movement mechanism 93a Inspection table 93b Moving member 93c Support member 94 Backup lifting mechanism 95 Substrate backup part 95a Support pin 96a Loading conveyor 96b Inspection stage conveyor 96c Unloading conveyor 97 Imaging part 97a Lens barrel part 97b Lighting part 97c Half mirror 98 Camera Upper-stage illumination 99a Lower-stage illumination 99b Coaxial illumination 99c Information processing device 100 First communication unit 101 Management and control unit 102 Learning unit 103 First model storage unit 104 First input unit 105 First display unit 106 First evaluation unit 107 First storage unit 108 First acquisition unit 110 Printing device 200 Second communication unit 201 Printing control unit 202 Second model storage unit 204 Second input unit 205 Second display unit 206 Second evaluation unit 207 Second storage unit 208 Second acquisition unit 210 Substrate positioning unit 211 Printing head 212 Squeegee movement mechanism 213 Printing pressure application mechanism 214 Mask cleaning mechanism 215 Clamping mechanism 216 Detection unit 217 Inspection device 300 Third communication unit 301 Inspection control unit 302 Third storage unit 308 Inspection execution unit 317 Printing processing system 1000 Rolling diameter d Material information d1 Mask information d2 Substrate information d3 Printing condition information d4 Inspection result information d5 Height h Evaluation model m Solder volume evaluation model m1 Solder shape evaluation model m2 m3 Printing Position Evaluation Model m4 Cleaning Evaluation Model

Claims

1. A printing process system for forming printed solder by printing solder paste onto a substrate through a mask having an opening, an acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; an evaluation unit that evaluates conditions regarding the printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information; a display unit that displays an evaluation result by the evaluation unit of the conditions regarding the printing; A printing process system comprising:

2. The printing process system further comprises: a model storage unit that stores an evaluation model; The evaluation unit: evaluates conditions regarding the printing by inputting the acquired first material information, first mask information, first substrate information, and first printing condition information into the evaluation model; The evaluation model: is generated by machine learning using first performance information used in the printing, such that an evaluation result for the conditions regarding the printing indicated by the printing condition information is output in response to input of material information regarding the solder paste, mask information regarding the mask, substrate information regarding the substrate, and printing condition information indicating conditions regarding the printing; The first performance information: includes second material information regarding the solder paste, second mask information regarding the mask, second substrate information regarding the substrate, second printing condition information indicating conditions regarding the printing, and first inspection result information indicating an inspection result of the printed solder; The printing process system according to claim 1.

3. The printing process system further comprises: A learning unit that generates the evaluation model by the machine learning and stores the evaluation model in the model storage unit. The printing processing system according to claim 2.

4. The learning unit further updates the evaluation model stored in the model storage unit by performing re-learning of the machine learning, In the re-learning, using the second performance information used in the printing performed after the generation of the evaluation model, The second performance information includes third material information regarding the solder paste, third mask information regarding the mask, third substrate information regarding the substrate, third printing condition information indicating conditions regarding the printing, and second inspection result information indicating an inspection result of the printed solder. The printing processing system according to claim 3.

5. The printing processing system further includes a printing device that forms the printed solder by the printing, and an information processing device connected to the printing device, The learning unit is provided in the information processing device. The printing processing system according to claim 4.

6. The printing processing system further includes a printing device that forms the printed solder by the printing, and a control unit that controls the model storage unit, The control unit acquires the evaluation model generated or updated by an information processing device owned by the manufacturer of the printing device from the information processing device and stores the evaluation model in the model storage unit. The printing processing system according to claim 2.

7. The evaluation model is a solder volume evaluation model that evaluates conditions regarding the printing based on the volume of the printed solder formed on the substrate, A solder shape evaluation model that evaluates the conditions related to the printing based on the shape of the printed solder formed on the substrate, A printing position evaluation model that evaluates the conditions related to the printing based on the position of the printed solder formed on the substrate, A cleaning evaluation model that evaluates the cleaning conditions of the mask included in the conditions related to the printing based on the productivity and quality of the printed solder formed on the substrate, including at least one of The printing processing system according to claim 2.

8. The evaluation unit By inputting one or more pieces of information among the first material information, the first mask information, the first substrate information, and the first printing condition information into each of at least one of the models including the solder volume evaluation model, the solder shape evaluation model, the printing position evaluation model, and the cleaning evaluation model included in the evaluation model, a numerical value for the conditions related to the printing is derived, Based on the derived numerical value, the evaluation result is calculated as an evaluation value. The printing processing system according to claim 7.

9. The printing device includes a detection unit that detects the parameters of the object used for the printing as detection values, The learning unit performs the machine learning using the detection values detected by the detection unit, which are shown in at least one of the second material information, the second mask information, the second substrate information, and the second printing condition information. The printing processing system according to claim 5.

10. The learning unit When using the detection value shown in the second material information for the machine learning, uses the viscosity of the solder paste detected by the detection unit as the detection value. The printing processing system according to claim 9.

11. When the learning unit uses the detection value indicated in the second mask information for the machine learning, the value of the mask tension of the mask detected by the detection unit is used as the detection value. The printing processing system according to claim 9.

12. When the learning unit uses the detection value indicated in the second printing condition information for the machine learning, the discharge amount of the solvent used for cleaning the mask detected by the detection unit is used as the detection value. The printing processing system according to claim 9.

13. An information processing apparatus for forming printed solder by printing solder paste onto a substrate through a mask having openings, comprising: An acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; An evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information; A display unit that displays an evaluation result by the evaluation unit of the conditions regarding the printing. The information processing apparatus comprising the above.

14. A printing apparatus for forming printed solder by printing solder paste onto a substrate through a mask having openings, comprising: An acquisition unit that acquires first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing; An evaluation unit that evaluates the conditions regarding the printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information; A display unit that displays an evaluation result by the evaluation unit of the conditions regarding the printing. ​​A printing apparatus comprising

15. An information processing method performed by a computer for forming printed solder by printing solder paste onto a substrate through a mask having an opening, acquiring first material information regarding the solder paste, first mask information regarding the mask, first substrate information regarding the substrate, and first printing condition information indicating conditions regarding the printing, evaluating the conditions regarding the printing based on the acquired first material information, first mask information, first substrate information, and first printing condition information, displaying an evaluation result of the conditions regarding the printing on a display, an information processing method.

Images