Grooved die peeling apparatus and method

Abstract

To provide a grooved die peeling device that relatively gently separates a die from a die mounting area of a carrier film.SOLUTION: A groove-shaped die peeling device includes a main body and a vacuum device, the main body 10 includes a film peeling groove 11 arranged on the upper surface, a comb-shaped structure 12 arranged at a first end of the film peeling groove, and a groove 122 formed between a tooth portion 121 and two adjacent teeth portions, a passage arranged inside, and a through hole 14 each connected to the passage, at least one of which is connected to the first end of the film peeling groove. The vacuum device is connected to the passage. As a result, the groove-shaped die peeling device can separate the target die from the carrier film relatively gently by combining the negative pressure between the film peeling groove and the comb-shaped structure, and there is no problem of stress concentration, and it is possible to avoid the target die being damaged or the carrier film being damaged and remaining on the surface of the target die.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a die peeling device and method, and particularly to a grooved die peeling device and method.

Background Art

[0002] After a wafer is divided into a plurality of dies, these dies are transferred from a carrier film onto a substrate. In the transfer process, first, a support device supports the die placement area of the carrier film. Next, ideally, a plurality of pressing members rise from the inside of the support device to the outside of the support device, and by pressing and raising the target die through the die placement area of the carrier film, the periphery of the target die is separated from around the die placement area of the carrier film, and the center of the target die is also separated from the center of the die placement area of the carrier film. During the rising process of the target die, the target die contacts a die fixing device, and the die fixing device adsorbs the target die. Finally, these pressing members descend to the inside of the support device, and at the same time, the die fixing device moves the target die onto the substrate.

[0003] However, when these pressing members press and raise the target die through the die placement area of the carrier film, the tips of these pressing members are relatively sharp, and stress is likely to concentrate excessively. Therefore, the target die is often damaged, or the carrier film is damaged and remains on the surface of the target die.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The main object of the present invention is to provide a grooved die peeling device and method capable of relatively gently separating a target die from a die placement area of a carrier film.

Means for Solving the Problems

[0005] To achieve the above object, the present invention provides a tank-shaped die peeling device including a main body and a vacuum device. The main body includes a film peeling groove disposed on the upper surface, a comb-shaped structure installed at a first end of the film peeling groove and including a plurality of tooth portions and a plurality of grooves respectively formed between two adjacent tooth portions, a passage disposed inside, and a plurality of through holes respectively communicating with the passage and at least one of which communicates with the first end of the film peeling groove. The vacuum device is connected to the passage.

[0006] In some embodiments, at the bottom of the film peeling groove, there is a slope extending upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove, and the width of the film peeling groove is larger than the width of the die.

[0007] In some embodiments, the slope is a flat surface.

[0008] In some embodiments, at least two of the plurality of through holes are respectively located on at least one side of at least two of the plurality of tooth portions.

[0009] In some embodiments, the groove-shaped die peeling device further includes an image capture unit and a processing unit. The image capture unit is disposed above the center of the main body and is electrically connected to the processing unit.

[0010] To achieve the above object, the present invention provides a grooved die peeling method comprising: (a) moving a carrier film onto the main body of a grooved die peeling device; (b) moving the main body such that a first end of a target die on a die placement area of the carrier film protrudes from a plurality of tooth portions of a comb-shaped structure of the main body; (c) evacuating a passage of the main body by a vacuum device to generate a vacuum state and supply a negative pressure, the negative pressure passing through the passage of the main body, a plurality of through holes, and a plurality of grooves of the comb-shaped structure in sequence, adsorbing the die placement area of the carrier film and fixing the target die, and at the same time, bending another die placement area of the carrier film to enter a film peeling groove of the main body to separate the first end of the target die from the die placement area of the carrier film; (d) stopping the evacuation of the passage by the vacuum device to stop the supply of the negative pressure, returning the other die placement area of the carrier film to the original state by atmospheric pressure to separate from the film peeling groove, and maintaining the separation of the first end of the target die from the die placement area of the carrier film; (e) repeating steps (b) to (d) to gradually separate the target die from the die placement area of the carrier film in a direction from its first end to its second end; (f) when the second end of the target die is positioned above the plurality of tooth portions, evacuating the passage by the vacuum device to generate a vacuum state and supply a negative pressure, the negative pressure passing through the passage, at least one of the plurality of through holes, and the plurality of grooves, adsorbing the die placement area of the carrier film and fixing the second end of the target die; and (g) moving the main body such that the second end of the target die protrudes from the plurality of tooth portions, and at the same time, stopping the evacuation of the passage by the vacuum device to stop the supply of the negative pressure, and completely separating the target die from the die placement area of the carrier film.

[0011] In some embodiments, in step (c), the other die placement area of the carrier film abuts against a slope at the bottom of the film peeling groove, the slope extends upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove, the width of the film peeling groove is larger than the width of the die, and the method further includes positioning other dies on the other die placement area of the carrier film in the film peeling groove.

[0012] In some embodiments, in step (c), the bottom surface of the other die placement area of the carrier film is flatly attached to the slope, and the method further includes flatly attaching the bottom surface of the other die to the other die placement area of the carrier film.

[0013] In some embodiments, in step (c), at least two of the plurality of through holes are respectively located on one side of at least two of the plurality of tooth portions, the negative pressure passes through at least two of the plurality of through holes to uniformly adsorb the die placement area of the carrier film, and the method further includes completely detaching the first end of the target die from the die placement area of the carrier film.

[0014] In some embodiments, between step (a) and step (b), the method further includes: (h) capturing an image of the target die by an image capture unit of the grooved die peeling device, receiving the image of the target die by a processing unit of the grooved die peeling device, calculating a distance between the target die and the center of the main body based on the image of the target die, controlling the carrier film by the processing unit based on the distance between the target die and the center of the main body, moving the target die to the center of the main body, and aligning the target die with the film peeling groove.

Advantages of the Invention

[0015] The effect of the present invention is that the film peeling groove and the comb-shaped structure can relatively gently separate the target die from the carrier film by combining negative pressures, there is no problem of stress concentration, and it is possible to avoid the target die being damaged or the carrier film being damaged and remaining on the surface of the target die.

Brief Description of the Drawings

[0016]

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Mode for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described in more detail based on the drawings and reference numerals so that those skilled in the art can implement them after studying this specification.

[0018] FIG. 1 is a perspective view of a groove-shaped die peeling device according to the present invention. FIG. 2 is a plan view of the groove-shaped die peeling device according to the present invention. FIG. 3 is a cross-sectional view of the groove-shaped die peeling device according to the present invention. FIG. 4A is a schematic diagram of the connection relationship between the vacuum device 20 and the passage 13 of the present invention. FIG. 4B is a schematic diagram of the connection relationship between the image capture unit 30 and the processing unit 40 of the present invention. As shown in FIGS. 1 to 4B, the present invention provides a trough-shaped die peeling device including a main body 10, a vacuum device 20, an image capture unit 30, and a processing unit 40.

[0019] The main body 10 includes a film peeling groove 11, a comb-shaped structure 12, a passage 13, and a plurality of through holes 14. The film peeling groove 11 is disposed on the upper surface of the main body 10. The comb-shaped structure 12 is installed at the first end of the film peeling groove 11 and includes a plurality of tooth portions 121 and a plurality of grooves 122 respectively formed between two adjacent tooth portions 121. The passage 13 is disposed inside the main body 10. These through holes 14 are respectively communicated with the passage 13, and three of these through holes 14 are communicated with the first end of the film peeling groove 11. The vacuum device 20 is connected to the passage 13. The image capture unit 30 is disposed above the center of the main body 10 and is electrically connected to the processing unit 40.

[0020] FIG. 5 is a flowchart of a groove-shaped die peeling method according to the present invention. FIG. 6A is a plan view of step S10 of the groove-shaped die peeling method according to the present invention. FIG. 6B is a cross-sectional view of step S10 of the groove-shaped die peeling method according to the present invention. FIG. 7A is a plan view of step S20 of the groove-shaped die peeling method according to the present invention. FIG. 7B is a cross-sectional view of step S20 of the groove-shaped die peeling method according to the present invention. FIG. 8A is a plan view of step S30 of the groove-shaped die peeling method according to the present invention. FIG. 8B is a cross-sectional view of step S30 of the groove-shaped die peeling method according to the present invention. FIG. 9 is a cross-sectional view of step S40 of the groove-shaped die peeling method according to the present invention. FIG. 10 is a cross-sectional view of step S50 of the groove-shaped die peeling method according to the present invention. FIG. 11 is a cross-sectional view of step S60 of the groove-shaped die peeling method according to the present invention. FIG. 12A is a plan view of step S70 of the groove-shaped die peeling method according to the present invention. FIG. 12B is a cross-sectional view of step S70 of the groove-shaped die peeling method according to the present invention. FIG. 13A is a plan view of step S80 of the groove-shaped die peeling method according to the present invention. FIG. 13B is a cross-sectional view of step S80 of the groove-shaped die peeling method according to the present invention. The groove-shaped die peeling method according to the present invention includes the following steps.

[0021] In step S10, as shown in FIGS. 5, 6A, and 6B, the carrier film 50 is moved onto the main body 10.

[0022] In step S20, as shown in FIGS. 5, 7A, and 7B, the image capturing unit 30 captures an image of the target die 60 on the die placement area 51 of the carrier film 50, the processing unit 40 (see FIG. 4B) receives the image of the target die 60, calculates the distance between the target die 60 and the center of the main body 10 based on the image of the target die 60, controls the carrier film 50 based on the distance between the target die 60 and the center of the main body 10 by the processing unit 40, moves the target die 60 to the center of the main body 10, and aligns the target die 60 with the film peeling groove 11.

[0023] In step S30, as shown in FIGS. 5, 8A, and 8B, the main body 10 is moved so that the first end of the target die 60 protrudes from these tooth portions 121.

[0024] In step S40, as shown in FIGS. 5 and 9, the passage 13 is evacuated by the vacuum device 20 to generate a vacuum state and supply a negative pressure 21. The negative pressure 21 passes through the passage 13, these through-holes 14, and these grooves 122 in sequence, adsorbing the die placement area 51 of the carrier film 50 and fixing the target die 60. At the same time, the other die placement area 52 of the carrier film 50 is bent and enters the film peeling groove 11, causing the first end of the target die 60 to be detached from the die placement area 51 of the carrier film 50.

[0025] In step S50, as shown in FIGS. 5 and 10, the evacuation of the passage 13 by the vacuum device 20 is stopped to stop the supply of the negative pressure, and the other die placement area 52 of the carrier film 50 is returned to the atmospheric pressure and separated from the film peeling groove 11, and the first end of the target die 60 is maintained to be detached from the die placement area 51 of the carrier film 50.

[0026] In step S60, as shown in FIGS. 5 and 11, steps S30, S40, and S50 are repeated to gradually detach the target die 60 from the die placement area 51 of the carrier film 50 in the direction from its first end to its second end. Specifically, steps S30, S40, and S50 are repeated with 15 milliseconds as one cycle. In each cycle, the carrier film 50 has a moving time of 5 milliseconds and a moving distance of 0.2 centimeters, and the negative pressure 21 has a switching time of 3 milliseconds.

[0027] In step S70, as shown in FIGS. 5, 12A, and 12B, when the second end of the target die 60 is positioned above these tooth portions 121, the passage 13 is evacuated by the vacuum device 20 to generate a vacuum state and supply a negative pressure 21. The negative pressure 21 passes through the passage 13, three of these through-holes 14, and these grooves 122, adsorbing the die placement area 51 of the carrier film 50 and fixing the second end of the target die 60.

[0028] In step S80, as shown in FIGS. 5, 13A, and 13B, the main body 10 is moved so that the second end of the target die 60 protrudes from these tooth portions 121. At the same time, the evacuation of the passage 13 by the vacuum device 20 is stopped to stop the supply of the negative pressure 21, and the target die 60 is completely detached from the die placement area 51 of the carrier film 50.

[0029] Thereby, in the present invention, the film peeling groove 11 and the comb-shaped structure 12 can relatively gently separate the target die 60 from the carrier film 50 by combining the negative pressures 21, there is no problem of stress concentration, and it is possible to avoid the target die 60 being damaged or the carrier film 50 being damaged and remaining on the surface of the target die 60.

[0030] Note that, by the cooperation of the image capture unit 30 and the processing unit 40, it is ensured that the target die 60 is aligned with the film peeling groove 11, and it is possible to prevent one side of the target die 60 from shifting outside the film peeling groove 11 and the target die 60 from being unable to be separated from the carrier film 50.

[0031] As shown in FIGS. 1 and 3, in a preferred embodiment, at the bottom of the film peeling groove 11, there is a slope 111 extending upward in the direction from the first end of the film peeling groove 11 to the second end of the film peeling groove 11, and the width of the film peeling groove 11 is larger than the width of the die. In other words, for the film peeling groove 11, the first end is the lowest point of the slope 111, and the second end is the highest point of the slope 111. In step S40, as shown in FIG. 9, in a preferred embodiment, the other die placement area 52 of the carrier film 50 is abutted on the slope 111, and the other die 61 on the other die placement area 52 of the carrier film 50 is positioned within the film peeling groove 11 so as to prevent the other die 61 from being folded.

[0032] Preferably, the width of the film peeling groove 11 is about 240 - 260 μm larger than the width of the die. In this width range, it is possible to ensure that the other die 61 does not fold. Among them, the difference in the width is preferably 250 μm.

[0033] Preferably, the slope 111 is a plane. In other words, there are no protrusions on the slope 111. Step S40 further includes that the bottom surface of the other die placement area 52 of the carrier film 50 is flatly attached to the slope 111, and the bottom surface of the other die 61 is flatly attached to the other die placement area 52 of the carrier film 50.

[0034] As shown in FIGS. 1, 2, and 3, in a preferred embodiment, three of these through holes 14 are located on one side of three of these tooth portions 121. As shown in FIG. 9, in a preferred embodiment, step S40 further includes that the negative pressure 21 passes through three of these through holes 14 to uniformly adsorb the die placement area 51 of the carrier film 50, and the first end of the target die 60 can be completely detached from the die placement area 51 of the carrier film 50. More specifically, the bending surface of the other die placement area 52 of the carrier film 50 is quite flat and there is no drop in height, so the first end of the target die 60 can be completely detached from the die placement area 51 of the carrier film 50, and the problem that the first end of the target die 60 only partially detaches from the die placement area 51 of the carrier film 50 while the other part of the first end of the target die 60 adheres to the die placement area 51 of the carrier film 50 does not occur.

[0035] What is described above is only a preferred embodiment for explaining the present invention, and it is not intended to impose any formal restrictions on the present invention. Therefore, any modification or change made to the present invention with the same gist of the invention should be included in the intended protection scope of the present invention.

Explanation of Reference Numerals

[0036] 10 Main body 11 Film peeling groove 111 Slope 12 Comb-shaped structure 121 Tooth portion 122 Groove 13 Passage 14 Through hole 20 Vacuum device 21 Negative pressure 30 Image capture unit 40 Processing unit 50 Carrier film 51 Die placement area 52 Other die placement area 60 Target die 61 Other die Steps S10 to S80

Claims

1. a main body including: a film peeling groove disposed on an upper surface; a comb structure disposed at a first end of the film peeling groove, the comb structure including a plurality of teeth and a plurality of grooves each formed between two adjacent teeth; a passage disposed therein; and a plurality of through holes each connected to the passage, at least one of which is connected to the first end of the film peeling groove; a vacuum device connected to the passageway. Grooved die peeling device.

2. a bottom of the film peeling groove having a slope extending upward in a direction from the first end of the film peeling groove to the second end of the film peeling groove, the width of the film peeling groove being greater than the width of the die; 2. The groove die peeling apparatus of claim 1.

3. The slope is a plane.

3. The groove die peeling apparatus of claim 2.

4. At least two of the plurality of through holes are located on one side of at least two of the plurality of teeth, respectively.

2. The groove die peeling apparatus of claim 1.

5. Further comprising an image capture unit and a processing unit, the image capture unit being disposed above the center of the body and electrically connected to the processing unit.

2. The groove die peeling apparatus of claim 1.

6. (a) moving a carrier film onto a body of a groove-shaped die peeling device; (b) moving the body such that a first end of a target die on the die mounting area of ​​the carrier film protrudes from a plurality of teeth of a comb structure of the body; (c) evacuating the passage of the body by a vacuum device to generate a vacuum state and supply negative pressure, the negative pressure sequentially passing through the passage of the body, the plurality of through holes, and the plurality of grooves of the comb structure, adsorbing the die mounting area of ​​the carrier film and fixing the target die, and at the same time, bending another die mounting area of ​​the carrier film to enter the film peeling groove of the body, so as to separate the first end of the target die from the die mounting area of ​​the carrier film; (d) stopping the supply of negative pressure by stopping the bleed of air from the passage by the vacuum device, and returning the other die mounting area of ​​the carrier film to its original position by atmospheric pressure and away from the film peeling groove, and holding the first end of the target die away from the die mounting area of ​​the carrier film; (e) repeating steps (b) to (d) to gradually remove the target die from the die mounting area of ​​the carrier film in a direction from the first end of the target die to the second end of the target die; (f) when the second end of the target die is positioned above the teeth, the vacuum device evacuates the passage to generate a vacuum and applies negative pressure, the negative pressure passing through the passage, at least one of the through holes, and the grooves to adsorb the die mounting area of ​​the carrier film and fix the second end of the target die; (g) moving the body so that the second end of the target die protrudes from the plurality of teeth, and at the same time, stopping the supply of negative pressure by stopping the bleed of air into the passage by the vacuum device, thereby completely removing the target die from the die mounting area of ​​the carrier film. Grooved die release method.

7. step (c) further comprises: the other die mounting area of ​​the carrier film is abutted against a slope at the bottom of the film peeling groove, the slope extending upward in a direction from the first end of the film peeling groove to a second end of the film peeling groove; a width of the film peeling groove is greater than a width of a die; and another die on the other die mounting area of ​​the carrier film is positioned in the film peeling groove. The die peeling method according to claim 6.

8. Step (c) further comprises: attaching a bottom surface of the other die mounting area of ​​the carrier film flat to the slope; and attaching a bottom surface of the other die flat to the other die mounting area of ​​the carrier film. The die peeling method according to claim 7.

9. Step (c) further includes: at least two of the plurality of through holes are respectively positioned on one side of at least two of the plurality of teeth portions; and the negative pressure passes through at least two of the plurality of through holes to uniformly adsorb the die mounting area of ​​the carrier film, and completely separates the first end of the target die from the die mounting area of ​​the carrier film. The die peeling method according to claim 6.

10. Between step (a) and step (b), the method further includes the steps of: (h) capturing an image of the target die by an image capture unit of the groove-shaped die peeling device; receiving the image of the target die by a processing unit of the groove-shaped die peeling device; calculating a distance between the target die and the center of the body based on the image of the target die; and controlling the carrier film by the processing unit based on the distance between the target die and the center of the body to move the target die to the center of the body and align the target die with the film peeling groove. The die peeling method according to claim 6.

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