Dielectric coating

Abstract

To provide a dielectric coating, a system for coating a substrate, a method for coating a substrate, and a coated substrate.SOLUTION: A coated substrate material including a coating layer and an adhesive formed on at least a portion of the coating layer is disclosed herein. The coating layer can be deposited from a powder coating composition and has a dielectric strength of at least 50 kV / mm as measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) and thermal conductivity of at least 0.3 W / K.m as measured according to ASTM D5470 (steady state method). The adhesive can be formed from an adhesive composition and includes a thermal conductivity of at least 1.0 W / K.m as measured according to ASTM D5470.SELECTED DRAWING: None

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims priority to PCT Application No. PCT / CN2022 / 113045, filed on August 17, 2022, entitled "Dielectric Coatings", the entire content of which is incorporated herein by reference.

[0002] Field The present disclosure is directed to dielectric coatings, systems for coating substrates, methods for coating substrates, and coated substrates.

Background Art

[0003] Background Coatings, including those formed from powder coating compositions, and adhesives are utilized in a variety of applications, including use as interface materials for managing structural integrity and thermal management in heat transfer systems.

Summary of the Invention

Means for Solving the Problems

[0004] Summary A coated substrate comprising a coating layer and an adhesive formed on at least a part of the coating layer, wherein the coating layer is deposited from a powder coating composition and has a dielectric strength of at least 50 kV / mm, for example at least 60 kV / mm, for example 120 kV / mm or less, for example 100 kV / mm or less, for example 50 kV / mm to 120 kV / mm, for example 60 kV / mm to 100 kV / mm, measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and a thermal conductivity of at least 0.3 W / K·m, for example at least 0.35 W / K·m, for example 0.5 W / K·m or less, for example 0.45 W / K·m or less, for example 0.3 W / K·m to 0.5 W / K·m, for example 0.35 W / K·m to 0.45 W / K·m, measured according to ASTM D5470 (steady state method); and the adhesive is formed from an adhesive composition and has a thermal conductivity of at least 0.7 W / K·m, for example at least 0.8 W / K·m, for example at least 0.9 W / K·m, for example at least 1.0 W / K·m, for example at least 1.5 W / K·m, for example 2.5 W / K·m or less, for example 2.0 W / K·m or less, for example 0.7 W / K·m to 2.5 W / K·m, for example 0.8 W / K·m to 2.5 W / K·m, for example 0.9 W / K·m to 2.5 W / K·m, for example 1.0 W / K·m to 2.5 W / K·m, for example 1.5 W / K·m to 2.5 W / K·m, for example 0.7 W / K·m to 2.0 W / K·m, for example 0.8 W / K·m to 2.0 W / K·m, for example 0.9 W / K·m to 2.0 W / K·m, for example 1.0 W / K·m to 2.0 W / K·m, for example 1.5 W / K·m to 2.0 W / K·m, measured according to ASTM D5470, is disclosed herein.

[0005] A system for coating a substrate comprising a powder coating composition comprising an electrically insulating filler and an adhesive coating composition comprising a thermally conductive filler, wherein when the two layers are deposited on the substrate and cured, they have a thermal resistance of 2.0 °C / W or less, for example 0.5 °C / W to 2.0 °C / W, as measured using a TIM thermal resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method), is also disclosed herein.

[0006] A method of coating a substrate, comprising applying a powder composition onto the surface of the substrate to form a coating, and applying an adhesive composition onto at least a portion of the coating to form an adhesive, is also disclosed. In one embodiment, for example, the following items are provided. (Item 1A) A coated substrate comprising a coating layer and an adhesive formed on at least a part of the coating layer, wherein the coating layer is deposited from a powder coating composition and has a dielectric strength of at least 50 kV / mm, for example at least 60 kV / mm, for example 120 kV / mm or less, for example 100 kV / mm or less, for example 50 kV / mm to 120 kV / mm, for example 60 kV / mm to 100 kV / mm, measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and a thermal conductivity of at least 0.3 W / K·m, for example at least 0.35 W / K·m, for example 0.5 W / K·m or less, for example 0.45 W / K·m or less, for example 0.3 W / K·m to 0.5 W / K·m, for example 0.35 W / K·m to 0.45 W / K·m, measured according to ASTM D5470 (steady-state method); and the adhesive is formed from an adhesive composition and has a thermal conductivity of at least 0.7 W / K·m, for example at least 0.8 W / K·m, for example at least 0.9 W / K·m, for example at least 1.0 W / K·m, for example at least 1.5 W / K·m, for example 2.5 W / K·m or less, for example 2.0 W / K·m or less, for example 0.7 W / K·m to 2.5 W / K·m, for example 0.8 W / K·m to 2.5 W / K·m, for example 0.9 W / K·m to 2.5 W / K·m, for example 1.0 W / K·m to 2.5 W / K·m, for example 1.5 W / K·m to 2.5 W / K·m, for example 0.7 W / K·m to 2.0 W / K·m, for example 0.8 W / K·m to 2.0 W / K·m, for example 0.9 W / K·m to 2.0 W / K·m, for example 1.0 W / K·m to 2.0 W / K·m, for example 1.5 W / K·m to 2.0 W / K·m, measured according to ASTM D5470. (Item 2A) The coating includes dielectric breakdown of at least 12 kV / mm, for example, at least 15 kV / mm, for example, at least 20 kV / mm, for example, at least 25 kV / mm, for example, at least 30 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and the adhesive includes dielectric breakdown of at least 6 kV / mm, for example, at least 10 kV / mm, for example, 20 kV / mm or less, for example, 17 kV / mm or less, for example, 6 kV / mm to 20 kV / mm, for example, 10 kV / mm to 17 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and / or the adhesive includes lap shear strength of at least 3 MPa, for example, at least 8 MPa, for example, 30 MPa or less, for example, 12 MPa or less, for example, 3 MPa to 30 MPa, for example, 8 MPa to 12 MPa measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min. The coated substrate according to the preceding item. (Item 3A) The coated substrate according to any one of the preceding items, wherein the coating layer has a dry film thickness of 50 microns, for example, at least 75 microns, for example, at least 100 microns, for example, 300 microns or less, for example, 250 microns or less, for example, 220 microns or less, for example, 200 microns or less, for example, 50 microns to 300 microns, for example, 75 microns to 250 microns, for example, 100 microns to 220 microns, for example, 100 microns to 200 microns. (Item 4A) The coated substrate according to any one of the preceding items, wherein the adhesive layer has a dry film thickness of at least 0.2 mm, for example, at least 0.3 mm, for example, at least 0.4 mm, for example, 3.0 mm or less, for example, 1.5 mm or less, for example, 1.0 mm or less, for example, 0.2 mm to 3.0 mm, for example, 0.3 mm to 1.5 mm, for example, 0.4 mm to 1.0 mm. (Item 5A) The coated substrate according to any one of the preceding items, wherein the adhesive composition contains a thermally conductive filler in an amount of at least 60% by weight, for example, at least 75% by weight, for example, 90% by weight or less, for example, 86% by weight or less, for example, 60% by weight to 90% by weight, for example, 75% by weight to 86% by weight, based on the total weight of the adhesive composition. (Item 6A) The coated substrate according to any one of the preceding items, wherein the powder composition contains an electrically insulating filler in an amount of at least 30% by weight, for example, at least 45% by weight, for example, at least 50% by weight, for example, 60% by weight or less, for example, 55% by weight or less, for example, 50% by weight or less, for example, 30% by weight to 60% by weight, for example, 45% by weight to 55% by weight, for example, 45% by weight to 55% by weight, for example, 45% by weight to 50% by weight, for example, 50% by weight to 55% by weight, based on the total weight of the powder composition. (Item 7A) The coated substrate according to any one of the preceding items, wherein the adhesive composition further contains a non-thermally conductive filler, an electrically insulating filler, a flame retardant filler, or any combination thereof. (Item 8A) The coated substrate according to any one of the preceding items, wherein the powder composition further contains a thermally conductive filler, a non-thermally conductive filler, a flame retardant filler, or any combination thereof. (Item 9A) The coated substrate according to any one of the preceding items, wherein the adhesive composition further contains a compound containing an electrophilic functional group, a thiol-terminated compound, a thermoplastic polymer, or any combination thereof. (Item 10A) The coated substrate according to any one of the preceding items, wherein the powder composition further comprises a film-forming resin comprising (meth)acrylate resin, polyurethane, polyester, polyamide, polyether, polysiloxane, epoxy resin, vinyl resin, copolymers thereof, or any combination thereof. (Item 11A) The coated substrate according to any one of the preceding items, wherein the substrate is part of an electrical energy storage device. (Item 12A) The coated substrate according to any one of the preceding items, wherein the electrical energy storage device comprises a battery or battery component. (Item 13A) The coated substrate according to any one of the preceding items, wherein the battery or battery component comprises a battery cell, battery case, battery module, battery pack, battery box, battery cell casing, pack case, battery cover and tray, thermal management system, battery housing, module housing, module racking, battery side plate, battery cell enclosure, cooling module, cooling pipe, cooling fins, cooling plate, bus bar, battery frame, electrical connection, wire, copper or aluminum conductor or cable, or any combination thereof. (Item 14A) The coated substrate according to any one of the preceding items, further comprising a second substrate in contact with the adhesive. (Item 15A) The coated substrate according to any one of the preceding items, wherein the first substrate is a cooling plate and the second substrate is a battery cell. (Item 16A) The coated substrate according to any one of the preceding items, having a heat resistance of 2.0 °C / W or less, for example, 0.5 °C / W to 2.0 °C / W, when measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method). (Item 17A) A system for coating a substrate comprising a powder coating composition containing an electrically insulating filler and an adhesive coating composition containing a thermally conductive filler, wherein when the two layers are deposited and cured on the substrate and measured using a TIM heat resistance and conductivity measuring device (model LW-9389) according to ASTM D5470 (steady state method), the system has a heat resistance of 2.0 °C / W or less, for example, 0.5 °C / W to 2.0 °C / W. (Item 18A) The system according to the preceding item, wherein when the adhesive layer is deposited and cured, it has a lap shear strength of at least 3 MPa, for example, 3 MPa to 30 MPa, for example, 8 MPa to 12 MPa, measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min. (Item 19A) The system according to any one of the preceding items, wherein the adhesive composition contains 60% to 90% by weight, for example, 75% to 86% by weight, of the thermally conductive filler based on the total weight of the adhesive composition. (Item 20A) The system according to any one of the preceding items, wherein the powder composition contains 30% to 90% by weight, for example, 45% to 55% by weight, of an electrically insulating filler based on the total weight of the powder composition. (Item 21A) The system according to any one of the preceding items, wherein the adhesive composition further contains a non-thermally conductive filler, an electrically insulating filler, and / or a flame retardant filler. (Item 22A) The system according to any one of the preceding items, wherein the powder composition further contains a thermally conductive filler, a non-thermally conductive filler, and / or a flame retardant filler. (Item 23A) The system according to any one of the preceding items, wherein the adhesive composition further contains a compound containing an electrophilic functional group, a thiol-terminated compound, a thermoplastic polymer, or any combination thereof. (Item 24A) The system according to any one of the preceding items, wherein the powder composition further comprises a film-forming resin comprising (meth)acrylate resin, polyurethane, polyester, polyamide, polyether, polysiloxane, epoxy resin, vinyl resin, copolymers thereof, or any combination thereof. (Item 25A) A method of coating a substrate, comprising: applying a powder composition onto the surface of the substrate to form a coating; and applying an adhesive composition onto at least a part of the coating to form an adhesive. (Item 26A) The method according to the preceding item, wherein the coating layer is formed via a multi-application process. (Item 27A) The method according to any one of the preceding items, wherein the powder composition is at least partially cured before the application of the adhesive composition. (Item 28A) The method according to any one of the preceding items, wherein the resulting coated substrate comprises any coated substrate according to any one of the preceding items. (Item 29A) A battery comprising a battery cell and a coated substrate according to any one of the preceding items. (Item 30A) The battery according to the preceding item, wherein the battery cell and the coating are stored in a module. (Item 31A) The battery according to any one of the preceding items, wherein the battery and the coating are stored in a pack. (Item 32A) The battery according to any one of the preceding items, wherein the module is stored in a pack. (Item 33A) The battery according to any one of the preceding items, adjacent to a vehicle chassis. (Item 34A) The battery according to any one of the preceding items, further comprising battery components. (Item 35A) A vehicle comprising a battery according to any one of the preceding items. (Item 36A) The vehicle according to the preceding item, wherein the vehicle includes a land vehicle, an aircraft, or a bicycle such as an electric bicycle. In another embodiment, for example, the following items are provided. (Item 1B) A coated substrate comprising a coating layer and an adhesive formed on at least a part of the coating layer, wherein the coating layer is deposited from a powder coating composition and has an insulation resistance of at least 50 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and a thermal conductivity of at least 0.3 W / K . m measured according to ASTM D5470 (steady state method), and the adhesive is formed from an adhesive composition and has a thermal conductivity of at least 0.7 W / K . m measured according to ASTM D5470. A coated substrate. (Item 2B) The coated substrate according to the preceding item, wherein the coating includes an insulation breakdown of at least 12 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), the adhesive includes an insulation breakdown of at least 6 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall), and / or the adhesive includes a lap shear strength of at least 3 MPa measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw speed of 1 mm / min. (Item 3B) The coated substrate according to any one of the preceding items, wherein the adhesive composition includes a thermal conductive filler and / or the powder composition includes an electrically insulating filler. (Item 4B) The coated substrate according to any one of the preceding items, wherein the substrate is part of an electrical energy storage device. (Item 5B) The coated substrate according to any one of the preceding items, wherein the electrical energy storage device includes a battery or battery component. (Item 6B) The coated substrate according to any one of the preceding items, further including a second substrate in contact with the adhesive. (Item 7B) The coated substrate according to any one of the preceding items, having a heat resistance of 2.0 °C / W or less, for example, 0.5 °C / W to 2.0 °C / W, when measured using a TIM heat resistance and conductivity measurement device (model LW-9389) according to ASTM D5470 (steady state method). (Item 8B) A system for coating a substrate including a powder coating composition containing an electrically insulating filler and an adhesive coating composition containing a thermally conductive filler, wherein when the two layers are deposited and cured, they have a heat resistance of 2.0 °C / W or less, for example, 0.5 °C / W to 2.0 °C / W, when measured using a TIM heat resistance and conductivity measurement device (model LW-9389) according to ASTM D5470 (steady state method). (Item 9B) The system according to the preceding item, wherein the adhesive layer has a lap shear strength of at least 3 MPa, for example, 3 MPa to 30 MPa, for example, 8 MPa to 12 MPa, when measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min when deposited and cured. (Item 10B) The adhesive composition (a) contains 60% to 90% by weight of the thermally conductive filler based on the total weight of the adhesive composition, (b) further includes a non-thermally conductive filler, an electrically insulating filler, and / or a flame retardant filler, and / or (c) The system according to any one of the preceding items, further comprising an electronic functional group, a thiol-terminated compound, a thermoplastic polymer, or any combination thereof. (Item 11B) wherein the powder composition (a) contains 30% to 90% by weight of an electrically insulating filler based on the total weight of the powder composition, (b) further contains a non-thermally conductive filler, an electrically insulating filler, and / or a flame retardant filler, (c) The system according to any one of the preceding items, further comprising a film-forming resin containing a (meth)acrylate resin, a polyurethane, a polyester, a polyamide, a polyether, a polysiloxane, an epoxy resin, a vinyl resin, a copolymer thereof, or any combination thereof (Item 12B) A method of coating a substrate, comprising applying a powder composition onto the surface of the substrate to form a coating, and applying an adhesive composition to at least a part of the coating to form an adhesive. (Item 13B) The method according to the preceding item, wherein the coating layer is formed through a multi-application process. (Item 14B) The method according to any one of the preceding items, wherein the powder composition is at least partially cured before the application of the adhesive composition. (Item 15B) A battery comprising a battery cell and a coated substrate according to any one of the preceding items. (Item 16B) The battery according to the preceding item, wherein the battery cell and the coating are stored in a module. (Item 17B) The battery according to any one of the preceding items, wherein the battery and the coating are stored in a pack. (Item 18B) The battery according to any one of the preceding items, wherein the module is stored in a pack. (Item 19B) A battery according to any one of the preceding items, adjacent to the chassis of the vehicle. (Item 20B) A battery according to any one of the preceding items, further comprising battery components. (Item 21B) A vehicle comprising a battery according to any one of the preceding items. (Item 22B) The vehicle according to the preceding item, wherein the vehicle includes a land vehicle, an aircraft, or a bicycle. Summary Disclosed herein is a coated substrate comprising a coating layer and an adhesive formed on at least a portion of the coating layer. The coating layer can be deposited from a powder coating composition and has an insulation resistance of at least 50 kV / mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second lamp, 20-second dwell, 2-second fall) and a thermal conductivity of at least 0.3 W / K·m measured according to ASTM D5470 (steady state method). The adhesive can be formed from an adhesive composition and has a thermal conductivity of at least 1.0 W / K·m measured according to ASTM D5470. Also disclosed herein is a system for coating a substrate. A method for coating a substrate is also disclosed.

Brief Description of the Drawings

[0007]

Figure 1

[0008]

Figure 2

[0009]

Figure 3

[0010]

Figure 4

[0011]

Figure 5

[0012]

Figure 6A

Figure 6B

Figure 6C

[0013]

Figure 7

[0014]

Figure 8

[0015]

Figure 9

Mode for Carrying Out the Invention

[0016] Detailed Description For the purposes of this detailed description, it will be understood that the present disclosure may assume alternative variations and step sequences unless the contrary is expressly stated. Further, unless otherwise indicated by way of an operative example or the like, all numerical values representing amounts of ingredients used herein in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless the contrary is indicated, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present disclosure. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the claims, each numerical parameter should at least be construed in light of the reported number of significant digits and by applying ordinary rounding techniques.

[0017] Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the present disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in its respective testing measurements.

[0018] Also, it should be understood that any numerical range recited herein is intended to include all subranges subsumed therein. For example, a range of "1 to 10" is intended to include all subranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value equal to or less than 10.

[0019] As used herein, terms such as "including", "containing", etc. are understood to be synonymous with "comprising" in the context of this application and are thus open-ended and do not exclude the presence of additional unrecited or unenumerated elements, materials, components, or method steps.

[0020] As used herein, "consisting of" is understood to exclude the presence of any unspecified element, ingredient, or method step in the context of this application.

[0021] As used herein, "consisting essentially of" is understood to include a particular element, material, ingredient, or method step "and those that do not materially affect the basic and novel characteristic(s) described" in the context of this application. As used herein, open-ended terms include closed terms such as "consisting essentially of" and "consisting of".

[0022] In this application, the use of the singular includes the plural and the use of the plural includes the singular, unless specifically stated otherwise. For example, reference is made herein to "a" coating or "an" filler material, but combinations (i.e., plural) of these components may be used.

[0023] In addition, in this application, the use of "or" means "and / or" unless specifically stated otherwise, even though "and / or" may be explicitly used in certain instances.

[0024] As used herein, terms such as "on", "onto", "applied on", "applied onto", "formed on", "deposited on", "deposited onto" mean formed, overlaid, deposited, or provided on a substrate surface, but not necessarily in contact with the substrate surface. For example, a composition "applied onto" a substrate surface does not exclude the presence of one or more other intervening coating layers or films of the same or different compositions located between the composition and the substrate surface.

[0025] As used herein, "coating composition" refers to a composition, such as a mixture or dispersion, that can produce a film, layer, etc. on at least a portion of a substrate surface.

[0026] As used herein, "powder coating composition" refers to a coating composition embodied in the form of solid particles as opposed to a liquid form.

[0027] As used herein, the term "adhesive" means an adhesive that produces a load-bearing joint having a lap shear strength of greater than 3.0 MPa, measured in accordance with ASTM D1002-10 using a 2024-T3 aluminum substrate having a thickness of 1.6 mm and measured by an INSTRON 5567 machine in tensile mode with a draw rate of 1.3 mm / min.

[0028] As defined herein, a "1K" or "1-component" coating composition is a composition in which all components can be pre-mixed and stored, and the reactive components do not readily react under ambient or mild heat conditions, but instead react only upon activation by an external energy source. In the absence of activation from an external energy source, the composition remains largely unreacted (maintaining sufficient workability in the uncured state and maintaining more than 70% of the initial lap shear strength of the composition in the cured state after storage at 25°C for 8 months). External energy sources that can be used to promote the curing reaction (i.e., cross-linking of the epoxy component and the curing agent) include, for example, radiation (i.e., actinic rays) and / or heat.

[0029] "Ambient" conditions generally refer to room temperature and humidity conditions, which can be 10°C to 32°C and 20% relative humidity to 80% relative humidity, although mild heat conditions are slightly above ambient temperature (e.g., 32°C to 35°C), but in the case of 1K compositions, generally below the curing temperature of the coating composition, i.e., generally below what would cause the reactive components to readily react and cure.

[0030] As used herein, the terms "2-component" or "2K" refer to a composition in which at least a portion of the reactive components readily associate and interact to form, or react to form, an adhesion (physically or chemically), and which cures at least partially without activation from an external energy source such as ambient or mild heat conditions when mixed. One of ordinary skill in the art will understand that the two components of the composition are stored separately from each other and are mixed immediately prior to application of the composition. The 2-component composition may be heated or baked as required, as described below.

[0031] As used herein, the terms "cure" or "curing" mean that the components forming the composition are crosslinked to form materials such as coatings, layers, potting compounds, pads, etc. As used herein, the term "at least partially cured" means that at least some of the components forming the composition interact, react, and / or crosslink to form a material. The composition is at least partially cured or cured when the components of the composition are mixed, resulting in at least partial reaction of the reactive functional groups of the components of the composition.

[0032] For example, the term "curable" as used in connection with a curable composition means that the indicated composition is polymerizable or crosslinkable via functional groups by means including, but not limited to, curing and / or catalyst exposure under ambient or mild thermal conditions.

[0033] "Curable under ambient conditions" means that the composition undergoes a thermosetting reaction under room temperature and humidity conditions without the aid of, for example, heat or other energy, such as baking in an oven or use of forced air.

[0034] As used herein, unless otherwise indicated, the term "substantially free of" means that a particular material is not intentionally added to the mixture or composition, respectively, and is present only as a trace impurity of less than 5% by weight based on the total weight of the mixture or composition, respectively. As used herein, unless otherwise indicated, the term "essentially free of" means that a particular material is present only in an amount of less than 2% by weight based on the total weight of the mixture or composition, respectively. As used herein, unless otherwise indicated, the term "completely free of" means that the mixture or composition, respectively, does not contain a particular material, i.e., the mixture or composition contains 0% by weight of such material.

[0035] Coatings and Coated Substrates Disclosed herein is a coated substrate comprising a coating layer and an adhesive formed on at least a part of the coating layer. As will be described in more detail below, the coating layer can be deposited from a powder coating composition and the adhesive can be deposited from an adhesive composition.

[0036] The coating layer can include an insulation resistance of at least 50 kV / mm, for example, at least 60 kV / mm, measured using a Sefelec insulation resistance tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09. The coating layer can include an insulation resistance of 120 kV / mm or less, for example, 100 kV / mm or less, measured using a Sefelec insulation resistance tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09. The coating layer can include an insulation resistance of 50 kV / mm to 120 kV / mm, for example, 60 kV / mm to 100 kV / mm, measured using a Sefelec insulation resistance tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09.

[0037] The coating layer can include a thermal conductivity of at least 0.3 W / K·m, for example, at least 0.35 W / K·m, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method). The coating layer can include a thermal conductivity of 0.5 W / K·m or less, for example, 0.45 W / K·m or less, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method). The coating layer can include a thermal conductivity of 0.3 W / K·m to 0.5 W / K·m, for example, 0.35 W / K·m to 0.45 W / K·m, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method).

[0038] The coating layer may include dielectric breakdown of at least 12 kV / mm, for example at least 15 kV / mm, for example at least 20 kV / mm, for example at least 25 kV / mm, for example at least 30 kV / mm, measured using a Sefelec dielectric strength tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09.

[0039] The powder coating composition can be applied by any standard means in the art such as spraying, electrostatic spraying, fluidized bed processes, etc. The powder coating composition can also be applied to multiple applications on a substrate (a "multi-application process"). For example, a first powder coating composition can be applied to at least a portion of the substrate. A second powder coating composition can be applied to at least a portion of the first coating composition. The first powder coating composition can be cured or at least partially cured as needed before the second powder coating composition is applied. Alternatively, the second powder coating composition can be applied to at least a portion of the first coating composition. Then, the first and second powder coating compositions can be cured together simultaneously.

[0040] It is understood that the powder coating composition can be cured with multiple types of heat sources such as both convection heating and infrared radiation. For example, the powder coating composition can be partially cured with convection heating or infrared radiation and then fully cured with a different heat source selected from convection heating and infrared radiation.

[0041] In some examples, the powder coating composition can be cured with heat, and such convection heating can be cured for 1 minute to 40 minutes within a range of 120°C to 260°C, for example, 160°C to 240°C, for example, 180°C to 200°C. The powder coating composition can also be cured by infrared radiation where the peak metal temperature can reach 200°C to 260°C in about 10 seconds. Infrared high-temperature lamping enables rapid curing times. In some examples, the powder coating composition is cured by infrared radiation to heat the composition within a range of 140°C to 180°C for 1 to 20 minutes.

[0042] A coating formed from a single powder coating composition can be applied at any desired dry film thickness. For example, the dry film thickness can be at least 50 microns, for example, at least 75 microns, for example, at least 100 microns, and for example, the dry film thickness can be 300 microns or less, for example, 250 microns or less, for example, 200 microns or less. The dry film thickness can be 50 microns to 300 microns, for example, 75 microns to 250 microns, for example, 100 microns to 200 microns, for example, 100 microns to 220 microns. When applying multiple powder coating compositions, it is understood that each composition can be applied separately to provide any of the aforementioned dry film thicknesses. For example, when applying two separate powder coating compositions, each individual powder coating composition can be applied at any of the aforementioned dry film thicknesses.

[0043] The adhesive may include a thermal conductivity of at least 0.7 W / K·m, for example, at least 0.8 W / K·m, for example, at least 0.9 W / K·m, for example, at least 1.0 W / K·m, for example, at least 1.5 W / K·m, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method). The coating layer may include a thermal conductivity of 2.5 W / K·m or less, for example 2.0 W / K·m or less, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method). The coating layer may include a thermal conductivity of 0.7 W / K·m to 2.5 W / K·m, for example, 0.8 W / K·m to 2.5 W / K·m, for example, 0.9 W / K·m to 2.5 W / K·m, for example, 1.0 W / K·m to 2.5 W / K·m, for example, 1.5 W / K·m to 2.5 W / K·m, for example, 0.7 W / K·m to 2.0 W / K·m, for example 0.8 W / K·m to 2.0 W / K·m, for example, 0.9 W / K·m to 2.0 W / K·m, for example, 1.0 W / K·m to 2.0 W / K·m, for example, 1.5 W / K·m to 2.0 W / K·m, measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method).

[0044] The adhesive may include dielectric breakdown of at least 6 kV / mm, for example, at least 6 kV / mm, as measured using a Sefelec dielectric strength tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09. The adhesive may include dielectric breakdown of 20 kV / mm or less, for example, 17 kV / mm or less, as measured using a Sefelec dielectric strength tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09. The adhesive may include dielectric breakdown of 6 kV / mm to 20 kV / mm, for example, 10 kV / mm to 17 kV / mm, as measured using a Sefelec dielectric strength tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax limit 0.1 mA, 19-second ramp, 20-second dwell, 2-second fall) in accordance with ASTM D149-09.

[0045] The adhesive may include lap shear strength of at least 3 MPa, for example, at least 8 MPa, as measured in accordance with ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min. The adhesive may include lap shear strength of 30 MPa or less, for example, 12 MPa or less, as measured in accordance with ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min. The adhesive may include lap shear strength of 3 MPa to 30 MPa, for example, 8 MPa to 12 MPa, as measured in accordance with ASTM D1002-10 using an Instron 5567 machine in tensile mode with a draw rate of 1 mm / min.

[0046] The adhesive composition can be applied by any means standard in the art, such as a brush, roller, film, pellet, spatula, trowel, dip, spray gun, and applicator gun, to form a coating on at least a portion of the above coating. An adhesive is typically formed when a composition deposited on at least a portion of the substrate surface is at least partially dried or cured by methods known to those skilled in the art (e.g., under ambient conditions or by exposure to heat).

[0047] For example, the adhesive composition may be allowed to cure at room temperature or mild thermal conditions, and / or the composition may be heated, for example, to a temperature below 180 °C, for example, 130 °C or below, for example, 110 °C or below, for example, 100 °C or below, for example, 90 °C or below, for example, 80 °C or below, for example, 70 °C or below, but greater than ambient, for example, above 40 °C, for example, above 50 °C, for any desired time (e.g., 5 minutes to 1 hour) sufficient to at least partially cure the composition on the substrate(s) and / or cured by baking and / or curing at ambient conditions or conditions slightly above ambient conditions and, if desired, further cured by heating as described above.

[0048] The adhesive formed from the adhesive composition can be applied with any desired dry film thickness. For example, the dry film thickness may be at least 0.2 mm, for example, at least 0.3 mm, for example, at least 0.4 mm. The dry film thickness may be 3.0 mm or less, for example, 1.5 mm or less, for example, 1.0 mm or less. The dry film thickness may be from 0.2 mm to 3.0 mm, for example, from 0.3 mm to 1.5 mm, for example, from 0.4 mm to 1.0 mm.

[0049] System A system for coating a substrate comprising a powder coating composition and an adhesive composition is also disclosed herein. As will be described in more detail below, the powder coating composition may include an electrically insulating filler, and the adhesive composition may include a thermally conductive filler.

[0050] Powder coating composition The coating may comprise, consist essentially of, or consist of an electrically insulating filler and a powder coating composition comprising a (meth)acrylate resin, polyurethane, polyester, polyamide, polyether, polysiloxane, epoxy resin, vinyl resin, copolymers thereof, and / or combinations thereof, and may be deposited from the powder coating composition.

[0051] The powder coating composition includes a binder. The binder includes one or more film-forming resins that can be used to form a coating layer. The powder coating composition includes any of a variety of thermosetting powder coating compositions known in the art. The powder coating composition can also include a thermoplastic powder coating composition.

[0052] Non-limiting examples of suitable film-forming resins that form at least a portion of the binder of the powder coating composition include (meth)acrylate resins, polyurethanes, polyesters, polyamides, polyethers, polysiloxanes, epoxy resins, vinyl resins, copolymers thereof, and combinations thereof. As used herein, the terms "(meth)acrylate" and similar terms refer to both acrylates and the corresponding methacrylates. Further, the film-forming resin can have any of a variety of functional groups including, but not limited to, carboxylic acid groups, amine groups, epoxide groups, hydroxyl groups, thiol groups, carbamate groups, amide groups, urea groups, isocyanate groups (including blocked isocyanate groups), ethylenically unsaturated groups, and combinations thereof.

[0053] Thermosetting coating compositions typically include a crosslinking agent that can be selected from any of the crosslinking agents known in the art to react with the functionality of one or more film-forming resins used in powder coating compositions. Non-limiting examples of crosslinking agents include phenolic resins, amino resins, epoxy resins, triglycidyl isocyanurate, beta-hydroxy(alkyl)amides, alkylated carbamates, (meth)acrylates, salts of polycarboxylic acids with cyclic amidines, o-tolyl biguanide, isocyanates, blocked isocyanates, polyacids, anhydrides, organometallic acid-functional materials, polyamines, polyamides, aminoplasts, carbodiimides, oxazolines, and combinations thereof.

[0054] Suitable examples of resins useful in powder coating compositions are discussed in PCT Publication No. 2021 / 173941 (A1), paragraphs

[0006] -

[0042] ,

[0057] -

[0068] ,

[0088] -

[0105] , and

[0128] -

[0139] , and are incorporated herein by reference.

[0055] The electrically insulating filler may be a thermally conductive filler or a non-thermally conductive filler. As used herein, the term "electrically insulating filler" means a pigment, filler, or inorganic powder having a volume resistivity (measured according to ASTM D257, C611, or B193) of at least 10 Ω·m. For example, the electrically insulating filler may have a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193), for example, at least 20 Ω·m, for example, at least 30 Ω·m, for example, at least 40 Ω·m, for example, at least 50 Ω·m, for example, at least 60 Ω·m, for example, at least 60 Ω·m, for example, at least 70 Ω·m, for example, at least 80 Ω·m, for example, at least 80 Ω·m, for example, at least 90 Ω·m, for example, at least 100 Ω·m.

[0056] The electrically insulating filler may include a thermally conductive electrically insulating filler material. As used herein, the term "thermally conductive electrically insulating filler" or "TC / EI filler" means a pigment, filler, or inorganic powder having a thermal conductivity (measured in accordance with ASTM D7984) of at least 5 W / m·K at 25 °C and a volume resistivity (measured in accordance with ASTM D257, C611, or B193) of at least 10 Ω·m. The TC / EI filler material may include an organic or inorganic material, may include particles of a single type of filler material, or may include particles of two or more types of TC / EI filler materials. That is, the TC / EI filler material may include particles of a first TC / EI filler material and may further include particles of at least a second (i.e., a second, third, fourth, etc.) TC / EI filler material different from the first TC / EI filler material. As used herein with respect to the type of filler material, references to "first," "second," etc. are for convenience only and do not refer to an order of addition or the like.

[0057] The TC / EI filler material may have a thermal conductivity of at least 5 W / m·K at 25 °C (measured in accordance with ASTM D7984), for example, at least 18 W / m·K, at least 55 W / m·K. The TC / EI filler material may have a thermal conductivity of at most 3,000 W / m·K at 25 °C (measured in accordance with ASTM D7984), for example, at most 1,400 W / m·K, for example, at most 450 W / m·K. The TC / EI filler material may have a thermal conductivity of 5 W / m·K to 3,000 W / m·K at 25 °C (measured in accordance with ASTM D7984), for example, 18 W / m·K to 1,400 W / m·K, for example, 55 W / m·K to 450 W / m·K.

[0058] The TC / EI filler material can have a volume resistivity of at least 10 Ω·m (measured in accordance with ASTM D257, C611, or B193), for example, at least 20 Ω·m, for example, at least 30 Ω·m, for example, at least 40 Ω·m, for example, at least 50 Ω·m, for example, at least 60 Ω·m, for example, at least 60 Ω·m, for example, at least 70 Ω·m, for example, at least 80 Ω·m, for example, at least 80 Ω·m, for example, at least 90 Ω·m, for example, at least 100 Ω·m.

[0059] Suitable non-limiting examples of the TC / EI filler materials include nitrides, metal oxides, metalloid oxides, metal hydroxides, hydrides, carbides, minerals, ceramics, and diamond. For example, the TC / EI filler material can include, consist essentially of, or consist of boron nitride, silicon nitride, aluminum nitride, boron hydride, aluminum oxide, magnesium oxide, dead-burned magnesium oxide, beryllium oxide, silicon dioxide, titanium oxide, zinc oxide, nickel oxide, copper oxide, tin oxide, aluminum hydroxide (i.e., aluminum trihydrate), magnesium hydroxide, boron hydride, silicon carbide, agate, emery, ceramic microspheres, diamond, or any combination thereof. Non-limiting examples of commercially available TC / EI filler materials of boron nitride include, for example, CarboTherm from Saint-Gobain, CoolFlow and PolarTherm from Momentive, and hexagonal boron nitride powder available from Panadyne; non-limiting examples of aluminum nitride include, for example, aluminum nitride powder available from Micron Metals Inc., and Toyalnite from Toyal; non-limiting examples of aluminum oxide include, for example, Microgrit from Micro Abrasives, Nabalox from Nabaltec, Aeroxide from Evonik, and Alodur from Imerys; non-limiting examples of dead-burned magnesium oxide include, for example, MagChem® P98 from Martin Marietta Magnesia Specialties; non-limiting examples of aluminum hydroxide include, for example, APYRAL from Nabaltec GmbH and aluminum hydroxide from Sibelco, and non-limiting examples of ceramic microspheres include, for example, ceramic microspheres from Zeeospheres Ceramics or 3M. These fillers can also be surface-modified. For example, surface-modified magnesium oxide available as PYROKISUMA 5301K from Kyowa Chemical Industry Co., Ltd.Alternatively, the TC / EI filler material may not include any surface modification.

[0060] As used herein, the term "dead-burned magnesium oxide" refers to magnesium oxide that is calcined at a high temperature (e.g., in the range of 1500 °C to 2000 °C in a high-temperature shaft kiln) to obtain a material with very low reactivity compared to uncalcined magnesium oxide.

[0061] The TC / EI filler material may be included as a single TC / EI filler material or as a combination of two or more of the above-described TC / EI filler materials.

[0062] The electrical insulating filler may include a non-thermally conductive electrical insulating filler material. As used herein, the term "non-thermally conductive electrical insulating filler" or "NTC / EI filler" means a pigment, filler, or inorganic powder having a thermal conductivity of at least 5 W / m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) at 25 °C. For example, the NTC / EI filler may have a thermal conductivity of less than 5 W / m·K (measured according to ASTM D7984), e.g., 3 W / m·K or less, e.g., 1 W / mK or less, e.g., 0.1 W / mK or less, e.g., 0.05 W / mK or less at 25 °C. For example, the NTC / EI filler may have a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193), e.g., at least 20 Ω·m, e.g., at least 30 Ω·m, e.g., at least 40 Ω·m, e.g., at least 50 Ω·m, e.g., at least 60 Ω·m, e.g., at least 60 Ω·m, e.g., at least 70 Ω·m, e.g., at least 80 Ω·m, e.g., at least 80 Ω·m, e.g., at least 90 Ω·m, e.g., at least 100 Ω·m. The NTC / EI filler material can be organic or inorganic.

[0063] Suitable non-limiting examples of NTC / EI filler materials include, but are not limited to, mica, silica, wollastonite, barium sulfate, calcium carbonate, glass microspheres, clay, or any combination thereof.

[0064] As used herein, the term "mica" generally refers to layered silicate (phyllosilicate) minerals. Mica can include muscovite mica. Muscovite mica includes aluminum and potassium phyllosilicate minerals of the formula KAl2(AlSi3O 10 )(F,OH)2 or (KF)2(Al2O3)3(SiO2)6(H2O). Exemplary non-limiting commercially available muscovite micas include products sold under the trade name DakotaPURE™ available from Pacer Minerals, e.g., DakotaPURE™ 700, DakotaPURE™ 1500, DakotaPURE™ 2400, DakotaPURE™ 3000, DakotaPURE™ 3500, and DakotaPURE™ 4000.

[0065] Silica (SiO2) can include fumed silica, which includes silica treated with flame to form a three-dimensional structure. Fumed silica can be untreated or surface-treated with a siloxane such as polydimethylsiloxane, for example. Exemplary non-limiting commercially available fumed silicas include products sold under the trade name AEROSIL® available from Evonik Industries, e.g., AEROSIL® R104, AEROSIL® R106, AEROSIL® R202, AEROSIL® R208, AEROSIL® R972, and products sold under the trade name HDK® commercially available from Wacker Chemie AG, e.g., HDK® H17 and HDK® H18.

[0066] Wollastonite contains calcium inosilicate minerals (CaSiO3) which may contain small amounts of iron, aluminum, magnesium, manganese, titanium, and / or potassium. For example, wollastonite has a BET surface area of 1.5 to 2.1 m 2 / g, for example 1.8 m 2 / g, and a median particle size of 6 to 10 microns, for example 8 microns. Non-limiting examples of commercially available wollastonite include NYAD 400 available from NYCO Minerals, Inc.

[0067] Calcium carbonate (CaCO3) may include precipitated calcium carbonate or ground calcium carbonate. Calcium carbonate may or may not be surface-treated with stearic acid. Non-limiting examples of commercially available precipitated calcium carbonate include Ultra-Pflex®, Albafil®, and Albacar HO® available from Specialty Minerals, and Winnofil® SPT available from Solvay. Non-limiting examples of commercially available ground calcium carbonate include Duramite™ available from IMERYS and Marblewhite™ available from Specialty Minerals.

[0068] Useful clay minerals include non-ionic plate-like fillers such as talc, pyrophyllite, chlorite, vermiculite, or combinations thereof.

[0069] The glass microspheres can be hollow borosilicate glass. Non-limiting examples of commercially available glass microspheres include 3M Glass Bubbles types VS, K series, and S series available from 3M.

[0070] The electrically insulating filler material can have any particle shape or geometry. For example, the electrically insulating filler material may have a regular or irregular shape, such as spherical, ellipsoidal, cubic, plate-like, needle-like (elongated or fibrous), rod-like, disc-like, prism-like, flake-like, rock-like, aggregates thereof, and any combination thereof.

[0071] The particles of the electrically insulating filler material can have an average particle size reported in at least one dimension of at least 0.01 micron, for example, at least 2 microns, for example, at least 10 microns, as reported by the manufacturer. The particles of the electrically insulating filler material can have an average particle size reported in at least one dimension of 500 microns or less, for example, 300 microns or less, 200 microns or less, 150 microns or less, as reported by the manufacturer. The particles of the electrically insulating filler material can have an average particle size reported in at least one dimension of 0.01 micron to 500 microns, for example 0.1 micron to 300 microns, for example, 2 microns to 200 microns, for example, 10 microns to 150 microns, as reported by the manufacturer. Suitable methods for measuring the average particle size include measurements using an instrument such as a Quanta 250 FEG SEM or an equivalent instrument.

[0072] The particles of the electrically insulating filler material of the powder coating composition can have a reported Mohs hardness of at least 1 (based on the Mohs hardness scale), for example, at least 2, for example, at least 3. The particles of the electrically insulating filler material of the powder coating composition can have a reported Mohs hardness of 10 or less, for example, 8 or less, for example, 7 or less. The particles of the electrically insulating filler material of the powder coating composition can have a reported Mohs hardness of 1 to 10, for example, 2 to 8, for example, 3 to 7.

[0073] The powder coating composition may contain an electrically insulating filler material in an amount of at least 30% by weight, for example, at least 45% by weight, for example, at least 50% by weight, based on the total weight of the powder coating composition. The powder coating composition may contain an electrically insulating filler material in an amount of 60% by weight or less, for example, 55% by weight or less, for example, 50% by weight or less, based on the total weight of the powder coating composition. The powder coating composition may contain an electrically insulating filler material in an amount of 30% to 60% by weight, for example, 45% to 55% by weight, for example, 45% to 50% by weight, for example, 50% to 55% by weight, based on the total weight of the powder coating composition.

[0074] The powder coating composition can include a flame retardant or a combination of flame retardants. For example, the above-mentioned specific TC materials such as aluminum hydroxide and magnesium hydroxide can also be flame retardants. As used herein, "flame retardant" refers to a material that delays or stops the spread of a fire or reduces its intensity. The flame retardant can be utilized as a powder that can be mixed with a composition, foam, or gel. In an example, when the powder coating composition contains a flame retardant, such a composition can form a coating on the surface of a substrate, and such a coating can function as a flame retardant.

[0075] As described in more detail below, the flame retardant can include minerals, organic compounds, organic halogen compounds, organic phosphorus compounds, or combinations thereof. Suitable examples of minerals include huntite, hydro magnesite, various hydrates, red phosphorus, boron compounds such as borates, carbonates such as calcium carbonate and magnesium carbonate, and combinations thereof. Suitable examples of organic halogen compounds include organic chlorine, such as chlorendic acid derivatives and chlorinated paraffins, organic bromine, such as decabromodiphenyl ether (decaBDE), decabromodiphenylethane (an alternative to decaBDE), polymeric brominated compounds, such as brominated polystyrene, brominated carbonate oligomer (BCO), brominated epoxy oligomer (BEO), tetrabromophthalic anhydride, tetrabromobisphenol A (TBBPA), and hexabromocyclododecane (HBCD). Such halogenated flame retardants can be used in combination with synergists to enhance their efficiency. Other suitable examples include antimony trioxide, antimony pentoxide, and sodium antimonate. Suitable examples of organic phosphorus compounds include triphenyl phosphate (TPP), resorcinol bis(diphenyl phosphate) (RDP), bisphenol A diphenyl phosphate (BADP), and tricresyl phosphate (TCP); phosphonates, such as dimethyl methylphosphonate (DMMP); and phosphinates, such as aluminum diethylphosphinate. In one important class of flame retardants, the compounds contain both phosphorus and halogen. Such compounds include tris(2,3-dibromopropyl) phosphate (brominated tris) and chlorinated organic phosphates, such as tris(1,3-dichloro-2-propyl) phosphate (chlorinated tris or TDCPP) and tetrakis(2-chloroethyl) dichloroisopentyl diphosphate (V6). Suitable examples of organic compounds include carboxylic acids, dicarboxylic acids, melamine, and organic nitrogen compounds. Other suitable flame retardants include ammonium polyphosphate and barium sulfate.

[0076] Adhesive composition The adhesive can be deposited from an adhesive composition comprising, consisting essentially of, or consisting of a thermally conductive filler and a compound containing an electrophilic functional group, a thiol-terminated compound, a thermoplastic polymer, or any combination thereof.

[0077] The adhesive composition can be a one-component adhesive composition, a two-component composition, or a multi-component composition (i.e., more than two components).

[0078] Suitable electrophilic functional groups useful in the adhesive compositions disclosed herein include epoxide functional groups, carbonate functional groups, isocyanate functional groups, keto functional groups, aziridine functional groups, thiirane functional groups, cyclic lactone functional groups, and carbodiimide functional groups. The adhesive composition can further comprise a second compound containing a nucleophilic functional group. The second molecule can be monofunctional or polyfunctional. The second molecule can be a monomer, a small molecule, or a polymer. Suitable nucleophilic functional groups include amine functional groups, hydroxy functional groups, thiol functional groups, carboxy functional groups, anhydride functional groups, acetoacetate (ACAC) functional groups, and active hydrogen functional groups including combinations thereof. Suitable molecules containing nucleophilic functional groups can include amines, thiols, alcohols, polyols, carboxylic acids, anhydrides, or combinations thereof. The nucleophilic functional groups can be blocked or unblocked, encapsulated or unencapsulated.

[0079] Suitable thiol-terminated compounds that can be used in the adhesive composition include monomers, polymers, and / or oligomers.

[0080] The composition may include a thermoplastic polymer. Suitable thermoplastic polymers include polyamides such as nylon and aramid; polyolefins such as polybutadiene, polyisobutylene, polybutene, polymethylpentene, amorphous polypropylene, polyethylene terephthalate, polyethylene, polystyrene, ethylene-propylene copolymer, polyvinyl chloride, and vinyl chloride copolymer; polyurethanes; styrene block copolymers such as styrene-butadiene, styrene-isoprene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-ethylene / butylene-styrene, styrene-ethylene / propylene; polyethers such as polyethylene oxide, polypropylene oxide, polyoxymethylene, poly(p-phenylene ether); ethylene-vinyl acetate; polybenzimidazole; polyphenyl sulfide; polyether sulfone; polyether ether ketone; chloroprene; acrylonitrile butadiene; polycarbonate; polyacrylates such as poly(meth)acrylate, or combinations thereof. By way of example, useful non-reactive elastomers include Polyvest® polybutadiene available from Evonik. Examples of reactive elastomers include Hypro® ATBN amine-functional butadiene copolymer available from Emerald Performance Materials. Suitable examples of thermoplastic elastomers include olefinic thermoplastic elastomers, polyether block amide polybutadiene thermoplastic elastomers, polyester thermoplastic elastomers, styrene thermoplastic elastomers, and vinyl thermoplastic elastomers, and rubbers such as butadiene rubber, butyl rubber, bromobutyl rubber, chlorobutyl rubber, polyisobutylene rubber, chlorosulfonated polyethylene rubber, epichlorohydrin rubber, ethylene-propylene rubber, fluoroelastomer (vinylidene fluoride-hexafluoropropylene copolymer), natural rubber, neoprene rubber, nitrile rubber, polysulfide rubber, polyurethane rubber, silicone rubber, styrene-butadiene rubber.

[0081] The adhesive composition may contain a hydrolyzable component. The hydrolyzable component may include a silane-containing polymer, a silyl-containing polymer, an imine, or a combination thereof. The silane-containing polymer may include a polythioether, a polyester, a polyether, a polyisocyanate, a poly(meth)acrylate, a polyolefin, a polyurea, a polyurethane, or a combination thereof. The silane-containing polymer may include an alkoxy group, an acyloxy group, a halogen group, an amino group, or a combination thereof. The silyl-containing polymer may include an alkyl group, a phenyl group, or a combination thereof. The silyl-containing polymer may include a polythioether, a polysulfide, a thioester, a thiol polyacrylate, or a combination thereof. The imine may include a ketimine, an aldimine, or a combination thereof.

[0082] The adhesive composition may optionally contain any of various accelerators, elastomer particles, additives, plasticizers, solvents, etc. known in the art.

[0083] Suitable examples of compounds useful in the adhesive composition are described in PCT Publication No. 2021 / 211694 (A1), paragraphs

[0022] to

[0046] ,

[0055] to

[0059] ,

[0062] to

[0138] ,

[0204] , and

[0206] ; PCT Publication No. 2021 / 211184 (A1), paragraphs

[0019] to

[0035] ,

[0044] to

[0051] ,

[0056] ,

[0061] to

[0080] ,

[0110] to

[0127] ,

[0135] to

[0141] ,

[0144] to

[0146] , and

[0150] to

[0152] ; PCT Publication No. 2021 / 211183 (A1), paragraphs

[0017] to

[0030] ,

[0040] to

[0043] ,

[0046] to

[0050] ,

[0081] to

[0093] ,

[0101] to

[0107] , and

[0111] to

[0113] ; and PCT Publication No. 2021 / 211722 (A1), paragraphs

[0018] to

[0035] ,

[0044] to

[0056] ,

[0061] ,

[0062] ,

[0068] to

[0172] ,

[0203] to

[0225] ,

[0233] to

[0240] , and

[0245] , all of which are incorporated herein by reference.

[0084] The adhesive composition may include a thermally conductive filler. The thermally conductive filler may be an electrically insulating filler. Suitable TC / EI fillers include any of those described above with respect to the powder coating composition.

[0085] The thermally conductive filler may be present in the adhesive composition in an amount of at least 60% by weight, such as at least 75% by weight, based on the total weight of the adhesive composition. The thermally conductive filler may be present in the adhesive composition in an amount of 90% by weight or less, such as 86% by weight or less, based on the total weight of the composition. The thermally conductive filler may be present in the adhesive composition in an amount of 60% to 90% by weight, such as 75% to 86% by weight, based on the total weight of the adhesive composition.

[0086] The adhesive composition may further contain a non-thermally conductive electrical insulating filler. Suitable NTC / EI fillers useful in the adhesive composition include any of the NTC / EI fillers described above with respect to the powder coating composition.

[0087] The adhesive composition may further contain a flame retardant. Suitable flame retardants for use in the adhesive composition include any of the flame retardants described above with respect to the powder coating composition.

[0088] Substrate The substrate can be selected from a wide variety of substrates and combinations thereof. Non-limiting examples of substrates include vehicles including automotive substrates, industrial substrates, ships, large vessels, and marine substrates and components such as onshore and offshore equipment, storage tanks, packaging substrates, building substrates, aircraft and aerospace components, energy storage devices, batteries and battery components, busbars, metal wires, copper or aluminum conductors, nickel conductors, wooden flooring and furniture, fasteners, coiled metals, heat exchangers, vents, extrusions, roofing materials, wheels, gratings, belts, conveyors, silos for grains or seeds, wire meshes, bolts or nuts, screens or grids, HVAC equipment, frames, tanks, cords, wires, apparel, electronic devices and components including housings and circuit substrates, glass, sports equipment including golf balls, stadiums, buildings, bridges, containers such as food and beverage containers, etc.

[0089] The substrate containing any of the aforementioned substrates can be metallic or non-metallic. Examples of metallic substrates include, but are not limited to, tin, steel, cold-rolled 61 steel, hot-rolled steel, steel coated with zinc metal, zinc compounds, zinc alloys, electro-galvanized steel, hot-dip galvanized steel, galvanneal steel, gallium, steel plated with zinc alloy, stainless steel, zinc-aluminum-magnesium alloy-coated steel, zinc-aluminum alloy, aluminum, aluminum alloy, aluminum-plated steel, aluminum alloy-plated steel, steel coated with zinc-aluminum alloy, magnesium, magnesium alloy, nickel, nickel plating, bronze, tin plating, tin plating, clad, titanium, brass, copper, silver, gold, 3D printed metal, cast or forged metal and alloys, or combinations thereof.

[0090] As used herein, "vehicle" or variations thereof include, but are not limited to, civilian, commercial, and military aircraft, and / or airplanes, helicopters, automobiles, motorcycles, trucks, and / or bicycles, such as electric bicycles, which are land vehicles. The shape of the substrate may be in the form of a sheet, plate, bar, rod, or any desired shape.

[0091] As described above, the substrate may include a battery or battery component. The battery may be, for example, a battery of an electric vehicle, and the battery component may be a battery component of an electric vehicle. The battery component may include, but is not limited to, battery cells, battery shells, battery modules, battery packs, battery boxes, battery cell casings, pack shells, battery covers and trays, thermal management systems, inverters, battery housings, module housings, module racking, battery side plates, battery cell enclosures, cooling modules, cooling pipes, cooling fins, cooling plates, busbars, battery frames, electrical connections, metal wires, copper or aluminum conductors or cables, any part of a stationary energy storage system, or any combination thereof.

[0092] As described above, the adhesive coating composition and the powder coating composition can be applied to any of these substrates to form an electrical insulating coating (i.e., a dielectric coating), a thermal conductive coating, or an electrical insulating and thermal conductive coating as described herein.

[0093] As shown in FIGS. 1-9, a coating layer can be deposited on the surface of a substrate from one of the powder coating compositions disclosed herein. An adhesive can be formed by applying one of the adhesive compositions disclosed herein to at least a portion of the coating layer such that the adhesive is between the coating layer and the surface of the second substrate.

[0094] FIGS. 1-9 show non-limiting examples of the application or use of battery assembly components and structures, and the compositions disclosed herein in such battery assemblies. FIGS. 1-9 show specific examples of cell shapes and cell arrangements, but the cells can be arranged in any configuration known to those skilled in the art. Additionally, the cured compositions can be used to form pads, adhesives, coatings, potting compounds, etc. to provide thermal protection between battery cells, within battery modules, and / or within battery packs. These materials can be used on any surface or in any space within such battery assemblies. For example, the compositions disclosed herein can be useful in battery assemblies including, but not limited to, from cell to module (FIGS. 3, 4, 6B), from module to pack (FIGS. 6C, 7), from cell to pack (FIG. 8), and from cell to chassis battery assembly (FIG. 9). Such battery assemblies can be used in any of the foregoing applications, but not limited to these applications.

[0095] A battery assembly can be any combination of one or more battery cells, interconnections that provide electrical conductivity between them, and, by way of non-limiting example, control electronics and components that ensure the structural, mechanical, and environmental requirements necessary for the operation of a particular battery (e.g., without limitation, cell interconnects such as wires, battery pack enclosures including trays and lids, module enclosures, module frames and frame plates, module racks, cooling and heating components including cooling plates, cooling fins, and cooling tubes, electrical busbars, battery management systems, battery thermal management systems, chargers, inverters, and converters).

[0096] Battery cell 10 is generally a single unit energy storage container that can be connected in series or in parallel. The battery cell can be of any suitable size or shape known to those skilled in the art, such as, but not limited to, cylindrical (Figs. 1, 4, and 9), prismatic (Figs. 2, 5 - 8), and / or pouch (Fig. 3). The battery cell 10 is surrounded to provide the desired mechanical protection and environmental isolation for the cell. For example, cylindrical and prismatic cells may be enclosed in a metal can, case, and lid, while pouch cells may be enclosed in a multilayer laminate foil. Battery terminals 1 connect the electrodes within the battery cell to an electrical circuit outside the battery cell, with one being the positive terminal and the other being the negative terminal. As shown in Fig. 4, the battery cell 10 can be connected by an interconnecting wire 5 in series or in parallel with other battery cells 10 to allow current to flow between the cells 10.

[0097] As shown in FIGS. 3, 4, 5, 6B, 6C, and 7, the battery cells 10 can be arranged in a module 100 that includes a plurality of cells 10 connected in series or in parallel. The module 100 can include a partial enclosure for the arranged cells 10. Auxiliary components such as those described above can be included. A void of any dimension can be located between the plurality of cells, auxiliary components, the base, and / or any inner surface of the module wall or other enclosure 120.

[0098] FIG. 1 shows a top-down view of a cylindrical battery cell 10 having a terminal 1. As shown, the cells are arranged in a row having either a cooling tube 3 or a dielectric and insulating paper (insulating sheet) 4 therebetween. As shown, materials such as a powder coating and an adhesive 6 formed from the compositions disclosed herein can be disposed between the cells 10, the cooling tube 3, and / or the insulating paper 4, respectively.

[0099] FIG. 2 shows an exploded isometric view of an array of prismatic battery cells 10. As shown, each prismatic cell 10 can include an upper portion 11, a bottom portion, and a wall 13 disposed between the upper and bottom portions, each having a surface. As shown, a coating (i.e., a powder coating and an adhesive) 8 formed from the compositions disclosed herein can be disposed between the surfaces of the cell walls 13 of adjacent cells 10.

[0100] FIG. 3 shows a cutaway front view of an array of pouch battery cells 10 within a module 100. The module wall 120 may partially enclose the cells 10. As shown, materials such as a coating (i.e., a powder coating and an adhesive) 8 formed from the compositions disclosed herein can be disposed between the surfaces of the cells 10.

[0101] FIG. 4 shows an isometric view of the cylindrical cell 10 within the battery module 100. Each cell may include an upper portion 11, a bottom portion 12, and a wall 13 disposed between the upper and bottom portions, each having a surface. The upper portion 11 and the bottom portion 12 may be oppositely charged terminals, one being the positive terminal 1 and the other being a negative terminal (not shown). The battery cells may be connected at their terminals by an interconnector such as wire 5 to enable current to flow between the electrical cells. The module 100 or the module wall 120 may form a void having a volume. The cells 10 may be disposed within the void so as to consume a portion of the volume. Materials such as a powder coating and an adhesive 7 formed from the compositions disclosed herein may be disposed within the void so as to consume a portion of the volume such that the material is adjacent to the surface of the cell wall 13 and / or the inner surface of one of the walls 120 of the module 100.

[0102] FIG. 5 shows an exploded perspective view of the battery module 100 composed of one or more arrays of the battery cell 10, the cooling fin 230, and / or the cooling plate 240. Materials such as a coating (i.e., a powder coating and an adhesive) 8 formed from the compositions disclosed herein may be disposed between the cells 10. Additional coatings 8 may be disposed between the cells 10, the cooling fins 230, and / or the cooling plates 240. The additional coating may be disposed between the battery cell array and the inner surface of the wall 120. Other coatings 8 may be disposed adjacent to the outer surface of the wall 120.

[0103] FIG. 6 shows an isometric view from the battery cell 10 (FIG. 6A) to the battery module 100 (FIG. 6B) to the battery pack 200 (FIG. 6C) battery assembly. The battery module 100 includes a plurality of battery cells 10, and the battery pack 200 includes a plurality of battery modules 100.

[0104] FIG. 7 shows a perspective view of a cutout of the battery pack 200. The battery pack includes a plurality of battery modules 100 and cells 10 within each module 100. The base of the battery pack 200 includes a cooling plate 240. Materials 9 such as powder coatings and adhesives formed from the compositions disclosed herein may be disposed between the cooling plate 240 and the inner surface of the wall of the battery pack 200. Materials such as powder coatings and adhesives 8 formed from the compositions disclosed herein may be disposed between the cells 10 within the module 100.

[0105] FIG. 8 shows an isometric view of the cell 10 into the battery pack 200 assembly. The cells 10 are arranged within the pack 200 (without being in separate modules).

[0106] In other cases, the battery cells may be arranged on or within an article, such as a chassis battery assembly as shown in FIG. 9, but not limited thereto, and one or more cells may be used to construct a battery assembly without pre-assembling the cells into modules and / or packs. FIG. 9 shows an isometric cutaway view of the cell into the chassis battery assembly 300. The cells 10 are arranged on a base including a lower structure 55 and are supported under the interior floor 35 of the vehicle by a vehicle frame 45.

[0107] Any battery assembly may further include a thermal management system (not shown) including an air or fluid circuit that can be liquid-based (e.g., glycol solution) or directly refrigerant-based. Flame retardant materials may be adjacent to any of these components of the battery assembly.

[0108] Surprisingly, it has been found that the coated substrate may have a heat resistance of 2.0 °C / W or less, e.g., 0.5 °C / W to 2.0 °C / W, when measured using a TIM heat resistance and conductivity measuring device (model LW-9389) in accordance with ASTM D5470 (steady state method).

[0109] The following examples are for illustrative purposes only and are not to be construed as limiting.

Example

[0110] Powder coating composition In Example 1, 0.6 grams of carbon black, 25.44 grams of barium sulfate, and 0.15 grams of aluminum oxide were added to an epoxy-containing powder coating composition crosslinked with a phenolic curing agent. In Example 2, 0.6 grams of carbon black, 50 grams of aluminum trihydroxide, and 0.15 grams of aluminum oxide were added to an epoxy-containing powder coating composition crosslinked with a phenolic curing agent.

[0111] An electrical insulating filler was incorporated into the chips of the powder coating composition. The chips were then ground in a Dongyuan ACM (registered trademark)-05 air classifier mill to obtain a fine powder, and subsequently sieved through a 160-mesh tapping sieve to achieve a final particle size in the range of 5 - 100 microns, with the majority of the particles being in the volume range of 30 - 52 microns. The coating compositions obtained for each of Examples 1 and 2 were free-flowing solid particulate powder coating compositions.

[0112] Evaluation of dielectric properties Each of the powder coating compositions of Examples 1 and 2 was electrostatically applied onto an aluminum substrate (alloy 3003 of AQT-412 panel, bare mill finish from Q-LAB) using an Encore Nordson powder coating cup gun equipped with a 3mm flat spray nozzle with the following parameters: a voltage of 60 kV, an ampere limit of 20 μA, a spray of 10 psi, and a carrier air flow of 10 psi.

[0113] To test the breakdown voltage, a coating having a dry film thickness of 150 - 200 μm was formed on an aluminum panel from the powder coating composition of Example 1 or 2. The panel was baked at 190 °C for 20 minutes and then cooled to room temperature to obtain the final sample. The breakdown voltage of each sample was measured using a Sefelec Dielectric Strength Tester RMG12AC-DC according to ASTM D149-09 Dielectric Breakdown Voltage and Dielectric Strength Test. The measurements were carried out with the following parameters: voltage limit 12.0 kV DC, Imax limit: 0.1 mA, 10 s ramp, 20 s dwell, and 2 s fall.

[0114] Specifically, the measurements included the following steps: (1) placing the sample (coated aluminum panel) in the electrical insulation box of the dielectric strength tester, on a flat upper cylinder electrical contact of brass, with the coated side of the sample facing the contact, (2) lowering the convex tip of brass onto the back side of the sample (opposite to the coated side) and then sealing the box, (3) running the dielectric strength tester three times and averaging the values (reported in Table 2).

[0115] Evaluation of Thermal Conductivity Each of the powder coating compositions of Example 1 and 2 was electrostatically applied onto an aluminum substrate (alloy 3003 of AQT-412 panel, bare mill finish from Q-LAB) using an Encore Nordson powder coating cup gun equipped with a 3 mm flat spray nozzle with the following parameters: voltage of 60 kV, ampere number limit of 20 μA, spray of 10 psi, and carrier air flow of 10 psi.

[0116] To test the thermal conductivity, powder coatings having a dry film thickness of 100 μm, 160 μm, or 220 μm were formed on aluminum panels from the powder coating compositions of Example 1 or 2. The powder coatings having a thickness of either 160 μm or 220 μm were formed using a two-step coating process to finally reach the desired coating thickness. All panels were baked at 190 °C for 20 minutes and then cooled to room temperature. The formed coatings were removed from the panels to obtain "free" films, which were cut into 26 mm * 26 mm square samples for measurement.

[0117] The thermal conductivity of each sample was measured by a TIM heat resistance and conductivity measuring device (model LW-9389) according to ASTM D5470 (steady state method). The test results of the breakdown voltage and thermal conductivity of Example 1 and 2 are summarized in Table 2.

Table 2

[0118] Thermally Conductive Adhesive (TCA) In Example 3, 194.65 grams of aluminum oxide was added to Part A (isocyanate-containing component) of a two-component polyurethane-based adhesive composition. Part B consisted of a polyol and an accelerator. In Example 4, 40 grams of aluminum oxide and 40 grams of aluminum hydroxide were added to Part A (isocyanate-containing component) of a two-component polyurethane-based adhesive composition. Part B consisted of a polyol and an accelerator.

[0119] The method for preparing the TCA composition included the following:

[0120] (i) Dehydration of the thermally conductive filler: The thermally conductive fillers S403Z and APYRAL 20X were dehydrated before use: S403Z and APYRAL 20X were weighed and placed in an oven at 105 °C until the water content of each filler was less than 1000 ppm.

[0121] (ii) Mixing process of part A: The adhesive component and the thermal conductive filler were weighed in a planetary stirring kettle. The speed of the stirring paddle was set at 35 RPM and the speed of the dispersion plate was set at 359 RPM, and they were mixed in the kettle for 25 minutes. From 5 minutes of stirring, the kettle was evacuated to a vacuum degree of -0.99 to 1 through a vacuum pump. After stirring, the vacuum pump was turned off, and nitrogen gas was introduced into the kettle to compensate for the air pressure balance. Then, mixture A was taken out of the kettle and packed into cartridges by a press.

[0122] (iii) Mixing process of part B: The adhesive component was weighed in a planetary stirring kettle. The speed of the stirring paddle was set at 35 RPM and the speed of the dispersion plate was set at 359 RPM, and they were mixed in the kettle for 25 minutes. From 5 minutes of stirring, the kettle was evacuated to a vacuum degree of -0.99 to 1 through a vacuum pump. After stirring, the vacuum pump was turned off, and nitrogen gas was introduced into the kettle to compensate for the air pressure balance. Then, mixture B was taken out of the kettle and packed into cartridges by a press.

[0123] Evaluation of thermal conductivity The cartridges of part A and part B were coated on a PET film at an air pressure of 3 to 6 bar using a SULZER DP2X400 glue gun and covered with another PET film. The samples were put into a tablet press and pressured, and the thickness was controlled with a frame of 0.2 to 3.0 mm thickness as a spacer. After the film was completely cured, they were removed and the thermal conductivity was tested with a thermal conductivity tester according to ASTM D5470.

[0124] Two-layer system The powder coatings of Examples 1 and 2 were applied to a substrate (Al3003 panel) according to the same procedure as above, and the thermal conductive adhesive coatings of Examples 3 and 4 were applied on the powder coatings according to the same procedure as above. During the application of the thermal conductive adhesive coating, a stainless steel ball with a diameter of 0.5 mm was used as a spacer to control the thickness of the thermal conductive adhesive coating. Another Al3003 panel was covered with the thermal conductive adhesive coating, and a clamp was used to firmly bond the two Al3003 panels until the coating was completely cured.

[0125] The lap shear strength of the thermally conductive adhesive was measured in accordance with ASTM D1002-10 using a 2024-T3 aluminum substrate with a thickness of 1.6 mm as measured by an INSTRON 5567 machine in a tensile mode with a tensile speed of 1.3 mm / min. The adhesion strength was measured in accordance with GB / T5210 using an aluminum column of 100*10*10 mm by a universal tensile testing machine with a tensile speed of 5 mm / min.

[0126] The heat resistance of the two-layer system was measured in accordance with ASTM D5470 (steady-state method) by a TIM heat resistance and conductivity measuring device (model LW-9389).

Table 3

[0127] These data demonstrate that a combination of a thermally conductive dielectric powder coating and a lower thermal conductivity adhesive results in a coating stack having good adhesion performance (lap shear and adhesion strength) and low heat resistance (i.e., Examples 2+3), as compared to a more highly filled system (Examples 2+4), and having lower lap shear performance.

[0128] Specific examples of the present disclosure have been described above for purposes of illustration, but it will be apparent to those skilled in the art that numerous variations of the details of the present disclosure can be made without departing from what is defined in the appended claims.

Claims

1. 1. A system for coating a substrate comprising a powder coating composition including an electrically insulating filler and an adhesive coating composition including a thermally conductive filler, wherein the two layers, when deposited on a substrate and cured, have a heat resistance of 2.0° C. / W or less, e.g., 0.5° C. / W to 2.0° C. / W, as measured using a TIM Heat Resistance and Conductivity Measuring Instrument (Model LW-9389) according to ASTM D5470 (Steady State Method).

2. 2. The system of claim 1, wherein the adhesive layer, when deposited and cured, has a lap shear strength of at least 3 MPa, e.g., 3 MPa to 30 MPa, e.g., 8 MPa to 12 MPa, measured according to ASTM D1002-10 using an Instron 5567 machine in tension mode with a pull-up rate of 1 mm / min.

3. The adhesive coating composition comprises: (a) from 60% to 90% by weight of said thermally conductive filler, based on the total weight of said adhesive coating composition; (b) further comprising a non-thermally conductive filler, an electrically insulating filler, and / or a flame retardant filler; and / or 10. The system of claim 1, further comprising: (c) an electrophilic functional group, a thiol-terminated compound, a thermoplastic polymer, a hydrolyzable component, or any combination thereof.

4. The powder composition comprises: (a) comprising 30% to 90% by weight of an electrically insulating filler, based on the total weight of the powder composition; (b) further comprising a non-thermally conductive filler, an electrically insulating filler, and / or a flame retardant filler; 10. The system of claim 1, further comprising: (c) a film-forming resin comprising a (meth)acrylate resin, a polyurethane, a polyester, a polyamide, a polyether, a polysiloxane, an epoxy resin, a vinyl resin, a copolymer thereof, or any combination thereof.

5. 1. A method of coating a substrate, comprising: applying a powder composition onto a surface of the substrate to form a coating; and applying an adhesive composition to at least a portion of the coating to form an adhesive, the adhesive composition comprising: (1) a thermally conductive filler; and (2) a compound containing an electrophilic functional group, a thiol-terminated compound, a thermoplastic polymer, a hydrolyzable component, or any combination thereof, and the adhesive has a thermal conductivity of at least 0.7 W / K.m measured according to ASTM D5470.

6. The method of claim 5 , wherein the coating layer is formed via a multi-application process.

7. The method of claim 5 , wherein the powder composition is at least partially cured prior to application of the adhesive composition.

Images