Mold processing device, mold processing method, and mold

Abstract

To form a liquid repellent layer with high accuracy in a desired region of a mold for molding a curable composition.SOLUTION: A mold processing device has a base body having a main surface and a projection unit provided on the main surface, and forms a liquid repellent layer having liquid repellency relative to a material to be molded on a part of a mold in which an uneven pattern for molding the material to be molded is formed on a surface of the projection unit. The mold processing device includes: a protective layer forming unit that applies a protective material to at least a part of the uneven pattern surface of the projection unit to form a protective layer that protects the uneven pattern surface; and a liquid-repellent layer formation unit that applies a liquid-repellent material to at least a part of a side surface of the projection unit to form a liquid-repellent layer. The liquid repellent layer formation unit has an air flow generation mechanism for generating an air flow flowing from the uneven pattern in an end portion direction of the projection unit in a processing space.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a mold processing apparatus, a mold processing method, and a mold.

Background Art

[0002] As a technique for forming a fine pattern (concavo-convex structure) of nano size (for example, 1 nm or more and 1000 nm or less), the optical nanoimprint technique has attracted attention. In the optical nanoimprint technique, an imprint mold (mold) having a concavo-convex pattern formed thereon and transparent to light (for example, ultraviolet light) is brought into contact with a curable composition (resist) applied on a substrate. After the curable composition is cured to form a cured film, the mold is separated from the cured film, whereby a pattern is formed on the cured film on the substrate. Then, by processing the substrate using the pattern of the cured film as a mask, a fine pattern is formed on the substrate. In the imprint method, for each of a plurality of positions (shot regions) on the substrate, a process of forming a cured film pattern (that is, an imprint process) is repeated.

[0003] Molds used in photonic nanoimprint technology are generally formed by processing quartz glass. More specifically, the mold can be produced by forming a convex mesa portion on the quartz glass and forming a fine uneven pattern on the end face of the mesa portion, which is the contact surface (imprint surface) that contacts the curable composition on the substrate. This uneven pattern will be pressed against the curable composition on the substrate. However, when the end face of the mesa portion of the mold is pressed against the curable composition on the substrate, since the curable composition has fluidity, the curable composition may overflow from the end face (contact surface) of the mesa portion to the outside and climb up the side surface of the mesa portion. This phenomenon is sometimes called "bleeding out". After the mold cures the curable composition on the substrate, it is separated from the cured film of the curable composition, but the curable composition that has climbed up the side surface of the mesa portion may remain attached to the side surface. Therefore, if the imprint process of pressing the mold against the curable composition is repeated, the amount of the curable composition attached to the side surface of the mesa portion gradually increases, and eventually, this curable composition may fall onto the substrate at an unintended timing, causing large defects on the substrate. Patent Document 1 proposes a method for manufacturing an imprint template having a protective layer.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 discloses a technique for making only the mesa sidewall repellent to the curable composition by protecting the uneven pattern surface with a protective material in advance. By making the mesa sidewall repellent, that is, increasing the contact angle with respect to the curable composition, bleeding out can be suppressed. As the region to be made repellent, it is desirable to make it repellent up to the end in the direction toward the uneven pattern surface of the mesa sidewall because bleeding out can be most effectively suppressed.

[0006] As methods for protecting the uneven pattern surface described in Patent Document 1, there are described a method of protecting by bringing a shielding plate close to the vicinity of the uneven pattern and a method of protecting by bringing a shaped material into contact with the uneven pattern surface. However, since the shielding plate does not completely adhere to the uneven pattern surface even when it is brought close to the vicinity of the uneven pattern, the liquid-repellent component will penetrate into the uneven pattern side. From this point, it is difficult to make only the mesa sidewall liquid-repellent with high precision by the method described in Patent Document 1.

[0007] For the purpose of illustration, the present invention provides a technique capable of forming a liquid-repellent layer with high precision in a desired region of a mold for molding a curable composition.

Means for Solving the Problems

[0008] In order to achieve the above object, a mold processing apparatus according to one aspect of the present invention includes a substrate having a main surface, and convex portions provided on the main surface, and an uneven pattern for molding a material to be molded is formed on the surface of the convex portions. A mold processing apparatus for forming a liquid-repellent layer having liquid-repellent properties with respect to the material to be molded on a part of the mold, the method comprising: applying a protective material to at least a part of the uneven pattern surface of the convex portion to form a protective layer for protecting the uneven pattern surface; and applying a liquid-repellent material to at least a part of the side surface of the convex portion to form the liquid-repellent layer. The liquid-repellent layer forming unit has an air flow generation mechanism for generating an air flow flowing from the uneven pattern toward the end of the convex portion in the processing space.

Effects of the Invention

[0009] According to the present invention, a liquid-repellent layer can be formed with high precision in a desired region of a mold for molding a curable composition.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0011] Hereinafter, a mold processing apparatus according to an embodiment of the present invention will be described in detail with appropriate reference to the drawings. However, the present invention is not limited to the embodiments described below. Also, in the present invention, within the scope not departing from the gist thereof, those obtained by appropriately making changes, improvements, etc. to the embodiments described below based on the ordinary knowledge of those skilled in the art are also included in the scope of the present invention.

[0012] In this specification and the accompanying drawings, unless otherwise specified, directions are indicated in an XYZ coordinate system with the direction parallel to the contact surface of the mold as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are denoted as θX, θY, and θZ, respectively. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive in the directions parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, control or drive with respect to the θX-axis, θY-axis, and θZ-axis means control or drive for rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis, respectively. Further, position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and orientation is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Note that the contact surface of the mold is the surface that contacts the curable composition on the substrate and can be the end face of the convex portion (mesa portion) formed on the mold. The contact surface of the mold may be understood as the surface (imprint surface) that is pressed against the curable composition on the substrate.

[0013] <mold> First, the configuration of the mold 10 according to an embodiment of the present invention will be described. FIG. 1 is a schematic diagram (cross-sectional view) showing a configuration example of the mold 10 according to the first embodiment. The mold 10 is used for a molding process of molding a curable composition on a substrate. The molding process is a process of molding the curable composition by pressing the mold 10 against the curable composition as the material to be molded on the substrate. Examples of the molding process include an imprint process. The imprint process is a process of forming (transferring) a pattern on the curable composition by bringing the mold 10 having an uneven pattern into contact with the curable composition (imprint material) on the substrate.

[0014] In FIG. 1, a pattern (cured film pattern 30a) of the cured film of the curable composition 30 formed on the substrate 20 through the imprint process using the mold 10 is also shown. The substrate 20 is a substrate to be processed and is, for example, a wafer.

[0015] The mold 10 shown in FIG. 1 is used for imprinting (nanoimprinting). The mold 10 is configured such that even when the contact surface (imprint surface) of the mold 10 and the surface of the substrate 20 are not parallel, the portion of the mold 10 other than the contact surface does not contact the substrate 20, and the contact surface of the mold 10 protrudes. Specifically, the mold 10 includes a base portion 11 (substrate) having a main surface 11a and a mesa portion 12 (protrusion) provided on the main surface 11a and protruding from the main surface 11a. And the end surface of the mesa portion 12 in the mold 10 functions as a contact surface that contacts the curable composition 30 on the substrate 20 (that is, an imprint surface pressed against the curable composition 30 on the substrate 20). When the mold 10 is used in the imprinting process, an uneven pattern 12b to be transferred to the curable composition on the substrate 20 is provided on the end surface (uneven pattern surface 12a) of the mesa portion 12 in the mold 10. With such a configuration, in the imprinting process, a certain clearance can be obtained between the portion of the mold 10 other than the mesa portion 12 and the substrate 20, so that direct contact between the mold 10 and the substrate 20 can be avoided.

[0016] In the imprint process, a mold 10 having a fine concavo-convex pattern 12b on the end face (contact surface) of the mesa portion 12 is pressed against a curable composition 30 on a substrate 20. As a result, the concavo-convex pattern 12b of the mold 10 is transferred to the curable composition 30 on the substrate 20, and a cured film pattern 30a of the curable composition 30 is formed on the substrate 20. Here, when the mold 10 (mesa portion 12) is pressed against the curable composition 30 on the substrate 20, the curable composition 30 may protrude outside the mesa portion 12 and crawl up the side surface 12c of the mesa portion 12 (hereinafter, this phenomenon may be referred to as "exudation"). In this case, the curable composition 30 adheres to the side surface 12c of the mesa portion 12 of the mold 10. The mold 10 is separated from the cured film of the curable composition 30 after curing the curable composition 30 on the substrate 20, but the curable composition 30 that has crawled up the side surface 12c of the mesa portion 12 remains attached to the side surface 12c. Therefore, when the imprint process is repeated, the amount of the curable composition 30 adhering to the side surface 12c of the mesa portion 12 of the mold 10 gradually increases, and eventually, this curable composition 30 may fall onto the substrate 20 at an unintended timing, causing large defects on the substrate 20.

[0017] Therefore, in the mold 10 of the present embodiment, in order to prevent the curable composition 30 from adhering to the side surface 12c of the mesa portion 12 of the mold 10 when the mold 10 is pressed against the curable composition 30, a liquid-repellent layer 13 is formed on at least a part of the side surface 12c of the mesa portion 12. This liquid-repellent layer 13 is a layer (film) having liquid repellency against organic substances, and is configured as a layer having higher liquid repellency against the curable composition 30 than the surface material (for example, quartz) of the mold 10.

[0018] The liquid-repellent layer 13 is preferably formed at least on a portion (that is, a portion on the concavo-convex pattern surface 12a side) that connects to the concavo-convex pattern surface 12a (contact surface) of the side surface 12c of the mesa portion 12, and may be formed on the entire side surface 12c of the mesa portion 12. In FIG. 1, an example is shown in which the liquid-repellent layer 13 is provided continuously on the entire side surface 12c of the mesa portion 12 and a part of the main surface 11a of the base portion 11 in the mold 10.

[0019] Further, the liquid-repellent layer 13 may be provided on at least a part of the main surface 11a of the base portion 11, or further, may be provided on at least a part of the side surface 11b of the base portion 11. More specifically, the base portion 11 of the mold 10 has a first surface (main surface 11a) connected to the side surface 12c of the mesa portion 12 and extending in a direction intersecting with the side surface 12c, and a second surface (side surface 11b) connected to the first surface and extending in a direction intersecting with the first surface. The liquid-repellent layer 13 may be formed on both the first surface (main surface 11a) and the second surface (side surface 11b) of the base portion 11 in the mold 10. Thus, the liquid-repellent layer 13 may be formed not only on the side surface 12c of the mesa portion 12 in the mold 10, but also on at least a part of the main surface 11a and / or the side surface 11b of the base portion 11.

[0020] When forming the liquid-repellent layer 13 on the surface of the mold 10 (particularly the side surface 12c of the mesa portion 12), it is necessary to prevent the liquid-repellent layer 13 from being formed on the uneven pattern surface 12a (contact surface) of the mesa portion 12. This is because if the liquid-repellent layer 13 is formed on the uneven pattern surface 12a of the mesa portion 12, there is a risk of unfilled defects occurring in the pattern of the curable composition (cured film) formed on the substrate 20 through the imprint process. Note that in the peripheral portion of the uneven pattern surface 12a of the mesa portion 12 (for example, in the range of several μm to several mm in width from the outer periphery), the liquid-repellent layer 13 may be allowed to be provided. Therefore, in the mold 10 of the present embodiment, in order to prevent the protective layer from being formed on the uneven pattern surface 12a of the mesa portion 12, the protective layer is formed on at least a part of the uneven pattern surface 12a of the mesa portion 12. Details of the protective layer will be described later.

[0021] The liquid-repellent material is preferably a material capable of forming a layer having liquid-repellent properties with respect to the curable composition, and particularly preferably a material for forming the liquid-repellent layer 13 by a wet method in which a liquid material is applied and dried. Specifically, for example, it is a liquid material (hereinafter sometimes referred to as a liquid-repellent material) containing a compound having a fluorocarbon chain and a volatile solvent for dissolving the compound. The method for forming the liquid-repellent layer 13 will be described later.

[0022] The curable composition is a composition that cures upon irradiation with light or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photoinitiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0023] The protective layer is dissolved by a material capable of dissolving the protective layer together with the liquid repellent layer 13 formed on the protective layer after the formation of the liquid repellent layer 13, and is removed from the uneven pattern surface 12a. The protective layer is preferably formed at least at a portion (i.e., the outer peripheral edge of the uneven pattern surface 12a) that connects to the side surface 12c of the mesa portion 12 in the uneven pattern surface 12a. For example, it is formed along the four sides of the rectangular uneven pattern surface 12a. Further, it may be formed over the entire uneven pattern surface 12a. In the present embodiment, an example of being formed along the four sides of the rectangular uneven pattern surface 12a will be used for explanation.

[0024] <First Embodiment> Next, a mold processing apparatus 1 according to an embodiment of the present invention will be described. The mold processing apparatus 1 is an apparatus that performs a process of forming a liquid repellent layer 13 on a part of the mold 10, and may be understood as a liquid repellency apparatus that makes a part of the mold 10 liquid repellent. Further, it may be understood as a layer forming apparatus that forms a liquid repellent layer 13 on a part of the mold 10. FIG. 2 is a schematic diagram showing a configuration example of the mold processing apparatus 1 of the first embodiment. As shown in FIG. 2, the mold processing apparatus 1 includes a protective layer forming unit 100 that forms a protective layer on a part of the mold 10, a liquid repellent layer forming unit 200 that forms a liquid repellent layer 13 on a part of the mold 10, and a protective layer removing unit 300 that removes the protective layer. Further, each unit is connected by a transport unit 400 that transports the mold 10, and the operation contents and operation timings of each unit and the transport unit 400 are controlled by a control unit 111.

[0025] FIG. 3 is a schematic diagram showing a configuration example of the protective layer forming unit 100 of the first embodiment. The protective layer forming unit 100 is a unit that applies a protective material to a part of the mold 10 to form a protective layer. The protective layer forming unit 100 includes a stage 102 that holds the mold 10, a supply head 103 (supply unit) that supplies the protective material to a part of the mold 10, and a moving mechanism 104 that moves the supply head 103. The protective layer forming unit 100 may further include an imaging unit 110 that images the mold 10 on the stage 102 and a control unit 111. The stage 102, the supply head 103, the moving mechanism 104, and the imaging unit 110 are arranged in a processing chamber 109 (chamber). Inside the processing chamber 109, a process of forming a protective layer on a part of the mold 10 (protective layer forming process) is performed. That is, the inside of the processing chamber 109 can be said to be a processing space. Here, a part of the mold 10 includes at least a part of the uneven pattern surface 12a of the mold 10.

[0026] The stage 102 holds the mold 10 by vacuum suction or the like. In the case of this embodiment, the stage 102 is in a state where its position in the processing chamber 109 is fixed, but it may be configured to be movable in the processing chamber 109. That is, the stage 102 may be configured to be relatively movable in the X, Y, and Z directions with respect to the supply head 103 for the mold 10.

[0027] The supply head 103 is a dispenser that discharges a liquid protective material. The supply head 103 stores the liquid protective material supplied from a tank or the like outside the processing chamber 109, and discharges the stored liquid protective material toward the mold 10 on the stage 102 at a predetermined timing. The supply head 103 discharges the protective material at a predetermined timing under the control of the control unit 111.

[0028] The moving mechanism 104 supports the supply head 103 and relatively moves the supply head 103 with respect to the stage 102. The moving mechanism 104 includes mechanisms for moving the supply head 103 in the X direction, Y direction, and Z direction respectively, and each mechanism can be configured to operate independently. As the moving mechanism 104, various moving mechanisms such as a linear motor type moving mechanism, an air stage type moving mechanism, and a feed screw type moving mechanism can be used.

[0029] The processing chamber 109 is formed in a box shape so as to be able to accommodate the stage 102, the supply head 103, the moving mechanism 104, the imaging unit 110, and the like. A filter unit 112 with a filter for removing foreign substances in the air is provided above this processing chamber, and an exhaust port 113 is provided at the lower part (bottom surface) of the processing chamber 109. Inside the processing chamber 109, air flows from the filter in the filter unit to the exhaust port 113, and the inside of the processing chamber 109 is kept clean by downflow (vertical laminar flow). As the filter, for example, a ULPA filter or a HEPA filter can be used.

[0030] The imaging unit 110 is attached to the upper surface of the processing chamber 109 and images the mold 10 on the stage 102, particularly the mesa portion 12 and its periphery. The imaging unit 110 is controlled by the control unit 111 and transmits the captured image (for example, a planar image of the mesa portion 12) to the control unit 111.

[0031] The control unit 111 can be constituted by a computer having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. The control unit 111 comprehensively controls each part of the protective layer forming unit 100 according to various programs stored in the storage unit. The various programs include a program for controlling the supply process, and in addition, may include a program for controlling the process of transporting the mold 10 onto the stage 102 by a transport mechanism (not shown).

[0032] The control unit 111 of this embodiment controls the supply process of supplying the protective material to a part of the mold 10 by controlling each part of the protective layer forming unit 100. Specifically, the control unit 111 supplies the protective material to a part of the mold 10 by discharging the protective material from the supply head 103 at a predetermined timing while relatively moving the supply head 103 and the mold 10. In this embodiment, the relative movement between the supply head 103 and the mold 10 in the supply process is performed by moving the supply head 103 with the moving mechanism 104, but it is not limited thereto. For example, when the stage 102 holding the mold 10 is configured to be movable in the XY directions, the relative movement between the supply head 103 and the mold 10 in the supply process may be performed by moving the mold 10 with the stage 102. Further, it may be performed by relatively moving the mold 10 and the supply head 103 with the stage 102 and the moving mechanism 104.

[0033] Note that the protective layer forming unit 100 only needs to be able to form a protective layer in a desired region of the uneven pattern surface 12a of the mold 10, and is not limited to the above-described configuration.

[0034] Next, the liquid repellent layer forming unit 200 will be described. FIG. 4 is a schematic diagram showing a configuration example of the liquid repellent layer forming unit 200 according to the first embodiment. FIG. 4(A) is a schematic diagram of the liquid repellent layer forming unit 200 viewed from the side. FIG. 4(B) is a schematic diagram of the liquid repellent layer forming unit 200 viewed from above. The liquid repellent layer forming unit 200 is a unit that forms a liquid repellent layer 13 on a part of the mold 10 on which the protective layer 151 is formed. Inside the processing chamber 109, a process of forming a liquid repellent layer (liquid repellent layer forming step) on a part of the mold 10 is performed. Here, a part of the mold 10 includes at least a part of the side surface 12c of the mesa portion 12 of the mold 10. Since the protective layer forming unit 100 and the liquid repellent layer forming unit 200 include the same configuration, the same reference numerals are given to the same configurations, the description thereof is omitted, and only the differences from the protective layer forming unit 100 will be described in detail.

[0035] The supply head 103 is a dispenser that discharges a liquid repellent material. This supply head 103 stores the liquid repellent material supplied from a tank or the like outside the processing chamber 109, and discharges the stored liquid repellent material toward the mold 10 on the stage 102 at a predetermined timing. The supply head 103 discharges the repellent material at a predetermined timing under the control of the control unit 111.

[0036] The control unit 111 controls the supply process of supplying the repellent material to a part of the mold 10 by controlling each part of the repellent layer forming unit 200. Specifically, the control unit 111 controls the supply process of supplying the repellent material to a part of the mold 10 by causing the supply head 103 to discharge the repellent material at a predetermined timing while relatively moving the supply head 103 and the mold 10.

[0037] The repellent layer forming unit 200 further includes a supply nozzle 120 (gas supply nozzle) as an air flow generation mechanism. The supply nozzle 120 is disposed above the processing chamber 109 and supplies gas toward the uneven pattern 12b of the mold 10 coated with the protective layer, generating an air flow 120a that flows from the uneven pattern 12b to the end (outer peripheral edge) of the mesa portion 12 in the processing chamber 109 (processing space). Note that the air flow generation mechanism is not limited to this configuration, and may be configured to be able to form an air flow 120a that goes from the inside of the uneven pattern surface 12a where the protective layer is formed to the outside of the uneven pattern surface 12a where the repellent material is applied.

[0038] The gas supplied by the supply nozzle 120 is preferably nitrogen or air. Further, in order to remove particles in the pipe, it is desirable that the gas supplied from the supply nozzle 120 is supplied through the filter of the filter unit 112.

[0039] In the liquid repellent layer forming unit 200 described above, a wet method is adopted. A liquid repellent material is supplied from the supply head 103, and the liquid repellent material is applied to a predetermined region including the side surface 12c (also referred to as the side wall) of the mesa portion 12 of the mold 10. Note that the liquid repellent layer forming unit 200 only needs to be able to form the liquid repellent layer 13 on the side surface 12c of the mesa portion 12 of the mold 10, and is not particularly limited in configuration, and a dry method may be adopted. In the case of the dry method, for example, it includes a chamber, a liquid repellent material holding portion, and a liquid repellent material heating portion such as a heater. The liquid repellent material is evaporated and gasified by heating the liquid repellent material in the liquid repellent material heating portion to form the liquid repellent layer 13 on the mold 10.

[0040] Next, the protective layer removing unit 300 will be described. The protective layer removing unit 300 is a unit that dissolves the protective layer 151 in a material capable of dissolving the protective layer (protective layer removing material) and removes the protective layer 151 from the mold 10. The protective layer removing unit 300 includes, for example, a supply head that supplies a protective layer removing material (also simply referred to as a removing material) and a rotating stage that holds and can rotate the mold 10. By supplying the protective layer removing material from the supply head and rotating the mold 10 on the rotating stage, the protective material dissolved in the protective layer removing material and the protective layer removing material can be removed (spin method). Further, the protective layer removing unit 300 may include, for example, an immersion mechanism filled with the protective layer removing material in a container. By repeatedly immersing and pulling up the mold 10 in the protective layer removing material a plurality of times by the immersion mechanism, the protective material can be dissolved in the protective layer removing material and the protective material can be removed (immersion method).

[0041] In this embodiment, a configuration example of the protective layer removing unit 300 that adopts the spin method will be described. FIG. 5 is a schematic diagram showing a configuration example of the protective layer removing unit 300 according to the first embodiment. Since the protective layer forming unit 100, the liquid repellent layer forming unit 200, and the protective layer removing unit 300 include the same configuration, the same components will be denoted by the same reference numerals and the description thereof will be omitted, and only the differences from the protective layer forming unit 100 and the like will be described in detail. The protective layer removing unit 300 may include a supply head 118 (supply unit) that supplies a removing material to a part of the mold 10, and a moving mechanism 104 that moves the supply head 118. The protective layer removing unit 300 may further include a rotating stage 108 that holds and rotates the mold 10, a rotating mechanism 119 that rotates the rotating stage 108, and a control unit 111. The supply head 118, the moving mechanism 104, the rotating stage 108, and the rotating mechanism 119 are disposed in the processing chamber 109 (chamber). Inside the processing chamber 109, a removing process (protective layer removing step) for removing the protective layer from the mold 10 is performed.

[0042] The rotating stage 108 holds the mold 10 by vacuum adsorption or the like. The rotating stage 108 can rotate about the rotation axis by the rotating mechanism 119. The mold 10 on which the liquid repellent layer 13 is formed is disposed on the rotating stage 108 such that the center of the mold 10, the rotating stage 108, and the rotation center coincide. At this time, the mold 10 is fixed to the rotating stage 108 by a method such as vacuum adsorption, and then the rotating stage 108 and the mold 10 are rotated at a low speed by the rotating mechanism 119.

[0043] The supply head 118 is a dispenser that discharges the removing material. The supply head 118 stores the liquid removing material supplied from a tank or the like outside the processing chamber 109, and discharges the stored liquid removing material toward the mold 10 on the rotating stage 108 at a predetermined timing. The supply head 103 discharges the removing material at a predetermined timing under the control of the control unit 111.

[0044] The processing chamber 109 is formed in a box shape so as to be able to accommodate a supply head 118, a transfer mechanism 104, a rotating stage 108, a rotating mechanism 119, and the like. A filter unit 112 with a filter for removing foreign substances in the air is provided above the processing chamber 109, and an exhaust port 113 is provided at the lower part (bottom surface) of the processing chamber 109. Inside the processing chamber 109, air flows from the filter in the filter unit to the exhaust port 113, and the inside of the processing chamber 109 is kept clean by downflow (vertical laminar flow). As the filter, for example, a ULPA filter, a HEPA filter, or the like can be used.

[0045] In the protective layer removing unit 300, while maintaining the supply head 118 at a predetermined height, the transfer mechanism 104 moves it above the central part on the uneven pattern surface 12a, and then a removing material is discharged from the supply head 118 onto the mold 10. The removing material is discharged onto the central part of the uneven pattern surface 12a, spreads toward the outer peripheral part due to the centrifugal force of rotation, dissolves the components of the protective layer 151, and flows out of the mold 10. As the protective layer 151 is dissolved and removed, a part of the liquid repellent layer 13 formed on the protective layer 151 is also removed from the uneven pattern surface 12a. By continuously discharging the removing material from the supply head 118, when all the components of the protective layer 151 are dissolved in the removing material and the protective layer is removed from the uneven pattern surface 12a, the discharge of the removing material is stopped, and the surface of the mold is dried. Note that the protective layer removing unit 300 only needs to be able to remove the protective layer from the mold 10, and is not particularly limited to the above-described configuration.

[0046] Hereinafter, a method for making the side surface 12c of the mesa portion 12 of the mold 10 liquid repellent using the mold processing apparatus 1 described above will be described with reference to FIGS. 6 and 7. FIG. 6 is a flowchart for explaining the processing by the mold processing apparatus 1 according to the first embodiment. The operations of each step of the flowchart in FIG. 5 can be performed by a computer in the control unit 111 executing a computer program stored in the memory. FIG. 7 is a schematic diagram for explaining the steps of the flowchart in FIG. 6.

[0047] First, the type 10 to be processed is transported to the protective layer forming unit 100 by the transport unit 400. The protective layer forming unit 100 applies a protective material to a part of the type 10 to form a protective layer (protective layer forming step S1). In FIG. 7, the protective layer forming step S1 will be illustrated and described. In the protective layer forming step S1, a protective material 106 is applied to the outer peripheral portion (outer peripheral region) of the uneven pattern surface 12a on the type 10 to form a protective layer 151.

[0048] Specifically, while maintaining the supply head 103 at a predetermined height, it is moved by the moving mechanism 104, and the liquid protective material 106 is continuously supplied to the uneven pattern surface 12a on the type 10. The movement path of the supply head 103 at this time is shown in FIG. 7. The supply head 103 of the protective layer forming unit 100 moves along the application paths P1-1 to P5-1 on the uneven pattern surface 12a, and continuously supplies the liquid protective material 106 to the uneven pattern surface 12a on the type 10. The application paths P1-1 to P5-1 are separated from the outer peripheral portion of the uneven pattern surface 12a by a predetermined distance L-1 (for example, 0.2 mm). P1-1 is the discharge start position and P5-1 is the discharge stop position. Only the protective material is applied to the outer peripheral portion of the uneven pattern surface 12a by this application path. The liquid protective material 106 applied by this application path spreads over the uneven pattern surface 12a due to wetting spread by surface energy and reaches the outer peripheral edge 105h of the uneven pattern surface 12a.

[0049] Thereafter, the type 10 with the protective layer 151 formed is transported from the protective layer forming unit 100 to the liquid repellent layer forming unit 200 by the transport unit 400. The liquid repellent layer forming unit 200 applies a liquid repellent material to a part of the type 10 to form a liquid repellent layer (liquid repellent layer forming steps S2 to S5).

[0050] In the liquid repellent layer forming step, first, the liquid repellent material 107 is applied to a part of the mold 10 by the supply head 103 (S2). Specifically, while maintaining the supply head 103 at a predetermined height, it is moved by the moving mechanism 104, and the liquid repellent material 107 is continuously supplied to a predetermined surface 105e (shown in FIG. 7) on the mold 10. The movement path of the supply head 103 at this time is shown in FIG. 7. The application paths P1-2 to P5-2 are along the outer periphery of the uneven pattern surface 12a. The supply head 103 moves in the order of P1-2, P2-2, P3-2, P4-2, and P5-2, and supplies the liquid repellent material 107 onto the surface 105e. The application path is separated from the uneven pattern surface 12a by a predetermined distance L-2 (for example, 1 mm). P1-2 is the discharge start position and P5-2 is the discharge stop position. The area coated by this application path becomes, for example, a frame shape surrounding the uneven pattern surface 12a. The liquid repellent material 107 coated by this application path spreads due to wettability and reaches the side surface 12c of the mesa portion 12, and further reaches the protective layer 151 formed on the outer periphery of the uneven pattern surface 12a.

[0051] When the application of the liquid repellent material is completed, gas is supplied toward the uneven pattern surface 12a by the supply nozzle 120 to generate an air flow 120a flowing from the uneven pattern 12b to the end of the mesa portion 12 in the processing chamber 109 (S3). The generation of the air flow 120a by the supply nozzle 120 is continued until the volatile solvent contained in the liquid repellent material 107 volatilizes and the drying of the liquid repellent material is completed (S4). Then, when the drying of the liquid repellent material 107 is completed, the generation of the air flow by the supply nozzle 120 is stopped (S5). The determination of whether the drying of the liquid repellent material 107 is completed may be made, for example, based on whether a predetermined time has elapsed. Then, a liquid repellent layer 13 is formed on the side surface 12c of the mesa portion 12 and a part of the protective layer 151.

[0052] The start of the airflow generation (S3) is preferably started after at least the liquid repellent material 107 reaches a predetermined region, specifically, the portion of the side surface 12c of the mesa portion 12 that connects to the uneven pattern surface 12a. This is because if the start of the airflow generation is too early, the liquid repellent material may dry before spreading to the desired region. The airflow generation may be started, for example, after a predetermined time has elapsed after the supply process of the liquid repellent material is completed.

[0053] In addition, it is preferable to stop the airflow after the drying of the liquid repellent material 107 is completed (S5) because the amount of gas supplied into the processing chamber 109 can be saved by the supply nozzle 120. However, the gas may be continuously supplied from the supply nozzle 120 until the mold 10 is carried out from the liquid repellent layer forming unit 200.

[0054] Thereafter, the mold 10 on which the liquid repellent layer 13 is formed is conveyed from the liquid repellent layer forming unit 200 to the protective layer removing unit 300 by the conveying unit 400, and the protective layer of the mold 10 is removed by the protective layer removing unit 300 (protective layer removing step S6).

[0055] In the protective layer removing step, first, the mold 10 on which the liquid repellent layer 13 is formed is placed on the rotating stage 108 so that the rotating stage 108 and the rotation center coincide. Thereafter, the mold 10 is fixed to the rotating stage 108 by a method such as vacuum adsorption, and the rotating stage 108 and the mold 10 are rotated at a low speed by the rotation mechanism 119. Then, while maintaining the supply head 118 at a predetermined height, the moving mechanism 104 moves it to the upper part of the central portion on the uneven pattern surface 12a, and the removing material is discharged from the supply head 103 to the mold 10. The removing material is discharged to the central portion of the uneven pattern surface 12a and spreads toward the outer peripheral portion by the centrifugal force of rotation, dissolving the components of the protective layer and flowing out of the mold 10. As a result, the protective layer 151 is dissolved and removed, and a part of the liquid repellent layer 13 formed on the protective layer 151 is also removed from the uneven pattern surface 12a. By continuously discharging the removing material, when all the components of the protective layer 151 are dissolved in the removing material and removed from the uneven pattern surface 12a (when the removal of the protective layer is completed), the discharge of the removing material is stopped, and the surface of the mold 10 is dried. Then, the formation process of the liquid repellent layer 13 is completed.

[0056] Here, in the liquid-repellent layer forming step, the reason for generating the airflow 120a that flows from the concavo-convex pattern 12b to the end of the mesa portion 12 in the processing chamber 109 will be described. FIG. 8 is a diagram for explaining the balance of surface tension. When the liquid-repellent material 107 is applied and the volatile solvent material contained in the liquid-repellent material 107 volatilizes, as shown in FIG. 8, the surface tension between the protective material 106 (protective layer 151) and the gas increases. The horizontal components of the surface tension γLG between the pattern surface and the gas, the surface tension γSL between the protective material 106 and the pattern surface, and the surface tension γLG between the protective material 106 and the gas are in balance. Therefore, when the surface tension γLG between the pattern surface and the gas increases, the contact angle of the protective material 106 increases, the thickness of the protective material 106 increases, and the end of the protective material 106 retreats. As a result, the liquid-repellent material 107 penetrates up to the concavo-convex pattern surface 12a of the mold 10.

[0057] The gas supplied by the supply nozzle 120 flows from the concavo-convex pattern 12b toward the end of the mesa portion 12. Then, it flows from the vicinity of the region where the protective layer 151 is formed (the outer peripheral portion of the concavo-convex pattern surface 12a) to the vicinity of the region where the liquid-repellent material 107 is applied (the side surface 12c of the mesa portion 12). For this reason, the volatile solvent material evaporated from the outer peripheral edge 105h of the outer peripheral portion of the concavo-convex pattern surface 12a does not flow into the protective layer 151 side. Therefore, the change in the surface tension between the protective material 106 and the gas can be suppressed, and the retreat of the protective material 106 can be suppressed.

[0058] The supply nozzle 120 continues to flow the gas until the liquid-repellent material 107 dries, and stops the gas supply after the liquid-repellent material 107 dries. After the liquid-repellent material 107 dries, no vapor of the liquid-repellent material 107 is generated, so the retreat of the protective material 106 does not occur.

[0059] As described above, according to the present embodiment, it is possible to form a liquid-repellent layer with high precision only on the side surface 12c of the mesa portion 12.

[0060] Note that all or part of the protective layer forming unit 100, the liquid repellent layer forming unit 200, and the protective layer removing unit 300 may be integrated into one unit. In this case, dedicated supply nozzles are required for the protective material, the liquid repellent material, and the removing material respectively. When all of the protective layer forming unit 100, the liquid repellent layer forming unit 200, and the protective layer removing unit 300 are integrated into one unit, the transport unit 400 for transporting the mold 10 to each unit becomes unnecessary.

[0061] <Second Embodiment> FIG. 9 is a schematic diagram showing a configuration example of the liquid repellent layer forming unit 500 according to the second embodiment. FIG. 9(A) is a schematic diagram of the liquid repellent layer forming unit 500 viewed from the side. FIG. 9(B) is a schematic diagram of the liquid repellent layer forming unit 500 viewed from above. The air flow generation mechanism of the liquid repellent layer forming unit 500 includes a gas recovery unit 121 located (arranged) around the mold 10 disposed on the stage 102, and an opening 122 disposed above the uneven pattern surface 12a of the mold 10.

[0062] When the opening 122 is disposed above the uneven pattern surface 12a of the mold 10, the air that has passed through the filter unit 112 passes through the opening 122, passes through the surface of the uneven pattern surface 12a, and is recovered by the gas recovery unit 121. As a result, the air flows from the vicinity of the region where the protective layer 151 is formed (the outer peripheral portion of the uneven pattern surface 12a) to the vicinity of the region where the liquid repellent material 107 is applied (the side surface 12c of the mesa portion 12). For this reason, the volatile solvent material evaporated from the outer peripheral edge 105h of the uneven pattern surface 12a does not flow into the protective layer 151 side.

[0063] Note that the opening 122 is preferably disposed at a position facing the uneven pattern surface 12a, but it may be disposed on the upper surface of the processing chamber 109. Further, the opening 122 may be configured so that the vapor of the liquid repellent material 107 can be recovered by the gas recovery unit 121.

[0064] In addition, in this embodiment, the opening 122 is provided, but instead of the opening 122, a supply nozzle 120 may be provided as shown in FIG. 4. Nitrogen or air may be supplied from the supply nozzle 120, and the gas supplied by the supply nozzle 120 may be recovered by the gas recovery unit 121 disposed on the outer periphery of the mold 10.

[0065] In addition, a plurality of the openings 122 and supply nozzles 120 may be arranged. For example, they may be arranged so as to correspond to each of the gas recovery units 121 arranged on the four sides. Further, they may be arranged along the region where the protective layer 151 is formed inside the region where the protective layer 151 is formed (on the center side of the mold 10).

[0066] As described above, according to this embodiment, it is possible to generate an air flow 120a that flows from the uneven pattern 12b to the end portion (outer peripheral edge) of the mesa portion 12 in the processing chamber 109 with a configuration different from that of the first embodiment.

[0067] <Third Embodiment> FIG. 10 is a schematic diagram showing a modified example of the mold. In this embodiment, the shape of the mold for facilitating the formation of the liquid repellent layer 13 will be described with reference to FIG. 10.

[0068] FIG. 10(A) is a schematic diagram showing a first example of the mold 10 according to the third embodiment. In the first example, the side surface 12c of the mesa portion 12 of the mold 10 is the C surface 11k. The side surface 12c may also be an R surface. Thereby, the liquid repellent material is likely to spread on the side surface 12c, and it is possible to reduce the insufficient spread of the liquid repellent material.

[0069] FIG. 10(B) is a schematic diagram showing a second example of the mold 10 according to the third embodiment. In the second example, the mold 10 has cavities 11m (recesses) along the four sides of the uneven pattern 12b. The protective material is applied up to the cavities 11m, and further the liquid repellent material is applied up to the cavities 11m. Thereby, it is possible to reduce the insufficient spread of the protective material, and when applying the protective material, the protrusion from the uneven pattern surface 12a side to the side surface 12c of the mesa portion 12 is reduced.

[0070] Figure 10(C) is a schematic diagram showing a third example of the mold 10 according to the third embodiment. In the third example, the mold 10 has undercuts 11n (notches) along the four sides of the concavo-convex pattern 12b. The liquid repellent material is applied up to the undercuts 11n. Thereby, it is possible to reduce the accumulation of the liquid repellent material in the undercut 11n portion and the spread to the concavo-convex pattern surface 12a side, and to reduce the insufficient spread of the liquid repellent material on the side surface 12c.

[0071] Figure 10(D) is a schematic diagram showing a fourth example of the mold 10 according to the third embodiment. In the fourth example, the side surface 12c of the mesa portion 12 of the mold 10 is an inverse taper surface 11p. That is, the mesa portion 12 has an inverse taper shape that widens toward the concavo-convex pattern surface 12a. Thereby, when applying the protective material, the overhang from the concavo-convex pattern surface 12a side to the side surface 12c is reduced, and when applying the liquid repellent material, while reducing the overhang to the concavo-convex pattern surface 12a side, it is possible to form the liquid repellent layer 13 on the inverse taper 11p surface. <Embodiment of the article manufacturing method> The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include the mold manufactured by the above-described mold processing apparatus 1.

[0072] The pattern of the cured product is used as it is as at least a part of the constituent members of the above article, or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

[0073] Next, a specific manufacturing method of the article will be described. FIG. 11 is a diagram for explaining the manufacturing method of the article. As shown in FIG. 11(A), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared. Subsequently, an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped imprint materials 3z are applied on the substrate is shown.

[0074] As shown in FIG. 11(B), an imprint mold 10z is opposed with the side on which its concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 11(C), the substrate 1z to which the imprint material 3z is applied and the mold 10z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 10z and the workpiece 2z. When light is irradiated through the mold 10z as energy for curing in this state, the imprint material 3z cures.

[0075] As shown in FIG. 11(D), after the imprint material 3z is cured and the mold 10z and the substrate 1z are separated, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 10z is transferred to the imprint material 3z.

[0076] As shown in FIG. 11(E), when etching is performed using the pattern of the cured product as an etching mask, portions of the surface of the workpiece 2z where no cured product remains or where the cured product remains thinly are removed to form grooves 5z. As shown in FIG. 11(F), when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed after processing and may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a component of the article.

[0077] <Other Embodiments> As described above, the preferred embodiments of the present invention have been explained. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof. Also, the respective embodiments may be combined.

[0078] The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and causing one or more processors in the computer of the system or device to read and execute the program. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

[0079] The disclosure of the present embodiment includes the following configurations.

[0080] (Configuration 1) A mold processing apparatus for forming a liquid-repellent layer having liquid-repellent properties with respect to a material to be molded on a part of a mold having a base body having a main surface and a convex portion provided on the main surface, and having an uneven pattern for molding the material to be molded formed on the surface of the convex portion, a protective layer forming unit that applies a protective material to at least a part of the uneven pattern surface of the convex portion to form a protective layer that protects the uneven pattern surface; a liquid-repellent layer forming unit that applies a liquid-repellent material to at least a part of the side surface of the convex portion to form the liquid-repellent layer, and the liquid-repellent layer forming unit has an air flow generation mechanism that generates an air flow flowing from the uneven pattern toward the end of the convex portion in the processing space, and is characterized by the mold processing apparatus.

[0081] (Configuration 2) The mold processing apparatus according to Configuration 1, wherein the air flow generation mechanism starts generating the air flow at least when the application of the liquid-repellent material is completed.

[0082] (Configuration 3) The mold processing apparatus according to Configuration 1 or 2, wherein the air flow generation mechanism has a gas supply nozzle disposed so as to face the uneven pattern surface.

[0083] (Configuration 4) The airflow generation mechanism has a gas recovery part arranged around the mold of the type arranged in the treatment space, and the mold treatment apparatus according to any one of Configurations 1 to 3, characterized in that.

[0084] (Configuration 5) The airflow generation mechanism generates an airflow flowing from the vicinity of the region where the protective layer of the convex part is formed to the vicinity of the region where the liquid repellent material of the convex part is applied, and the mold treatment apparatus according to any one of Configurations 1 to 4, characterized in that.

[0085] (Configuration 6) The airflow generation mechanism supplies nitrogen or air into the treatment space, and the mold treatment apparatus according to any one of Configurations 1 to 5, characterized in that.

[0086] (Configuration 7) The airflow generation mechanism dries the liquid repellent material applied to the convex part by the airflow, and the mold treatment apparatus according to any one of Configurations 1 to 6, characterized in that.

[0087] (Configuration 8) It has a protective layer removal unit for removing the protective layer, The protective layer removal unit removes the protective layer after the liquid repellent layer is formed, and the mold treatment apparatus according to any one of Configurations 1 to 7, characterized in that.

[0088] (Method 1) A mold treatment method of forming a liquid repellent layer having liquid repellency to a material to be molded on a part of a mold having a convex part provided on a main surface of a substrate and having an uneven pattern for molding the material to be molded formed on the surface of the convex part, comprising: A first step of applying a protective material to at least a part of the uneven pattern surface of the convex part to form a protective layer for protecting the uneven pattern surface; A second step of applying a liquid repellent material to at least a part of the side surface of the convex part to form the liquid repellent layer. In the second step, a mold processing method characterized by generating an air current flowing from the concavo-convex pattern in the processing space in the direction of the end of the convex portion.

[0089] (Method 2) The mold processing method according to Method 1, characterized in that the generation of the air current starts at least when the application of the liquid repellent material is completed.

[0090] (Method 3) The mold processing method according to Method 1 or 2, characterized in that the air current flows from the vicinity of the region where the protective layer of the convex portion is formed to the vicinity of the region where the liquid repellent material of the convex portion is applied.

[0091] (Method 4) The mold processing method according to any one of Methods 1 to 3, characterized in that the air current is nitrogen or air.

[0092] (Method 5) The mold processing method according to any one of Methods 1 to 4, characterized in that the air current dries the liquid repellent material.

[0093] (Method 6) The mold processing method according to any one of Methods 1 to 5, further comprising a third step of removing the protective layer after the second step.

[0094] (Mold configuration 1) A mold in which a liquid repellent layer is partially formed by the mold processing method according to any one of Methods 1 to 9, A mold characterized in that the side surface of the convex portion is an R or C surface.

[0095] (Mold configuration 2) The mold according to Mold Configuration 1, characterized in that it has an undercut along four sides of the concavo-convex pattern surface.

[0096] (Mold configuration 3) The mold according to Configuration 1 or 2 of the mold, characterized by having cavities along four sides of the concavo-convex pattern surface.

[0097] (Configuration 4 of the mold) A mold in which a liquid-repellent layer is partially formed by the mold processing method according to claim 9, The mold according to any one of Configurations 1 to 3 of the mold, characterized in that the convex portion has an inverted taper shape.

Explanation of symbols

[0098] 1 Mold processing apparatus 10 Mold 11 Base portion 12 Mesa portion 12a Concavo-convex pattern surface 12b Concavo-convex pattern 12c Side surface 13 Liquid-repellent layer 100 Protection layer forming unit 109 Processing chamber 120 Supply nozzle 121 Gas recovery unit 200 Liquid-repellent layer forming unit 300 Protection layer removal unit

Claims

1. A mold processing apparatus for forming a liquid-repellent layer having liquid repellency against a material to be molded on a part of a mold having a base surface and a convex portion provided on the base surface, on which an uneven pattern for molding the material to be molded is formed on the surface of the convex portion, comprising: A protective layer forming unit that applies a protective material to at least a part of the uneven pattern surface of the convex portion to form a protective layer that protects the uneven pattern surface; A liquid-repellent layer forming unit that applies a liquid-repellent material to at least a part of the side surface of the convex portion to form the liquid-repellent layer, and The liquid-repellent layer forming unit has an air flow generation mechanism that generates an air flow flowing from the uneven pattern in the processing space toward the end of the convex portion, characterized in that it is a mold processing apparatus.

2. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism starts generating the air flow at least when the application of the liquid-repellent material is completed.

3. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism has a gas supply nozzle arranged to face the uneven pattern surface.

4. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism has a gas recovery part arranged around the mold arranged in the processing space.

5. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism generates an air flow flowing from the vicinity of the region where the protective layer of the convex portion is formed to the vicinity of the region where the liquid-repellent material of the convex portion is applied.

6. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism supplies nitrogen or air into the processing space.

7. The mold processing apparatus according to claim 1, wherein the air flow generation mechanism dries the liquid-repellent material applied to the convex portion by the air flow.

8. having a protective layer removing unit for removing the protective layer, The type processing apparatus according to claim 1, wherein the protective layer removing unit removes the protective layer after the liquid repellent layer is formed.

9. A mold processing method for forming a liquid repellent layer having liquid repellency with respect to a material to be molded on a part of a mold having a substrate having a main surface and a convex portion provided on the main surface, and having an uneven pattern for molding the material to be molded formed on the surface of the convex portion, A first step of applying a protective material to at least a part of the uneven pattern surface of the convex portion to form a protective layer for protecting the uneven pattern surface; A second step of applying a liquid repellent material to at least a part of the side surface of the convex portion to form the liquid repellent layer, The mold processing method according to claim 9, wherein in the second step, an air flow flowing from the uneven pattern in the processing space toward the end of the convex portion is generated.

10. The mold processing method according to claim 9, wherein the generation of the air flow starts at least when the application of the liquid repellent material is completed.

11. The mold processing method according to claim 9, wherein the air flow flows from the vicinity of the region where the protective layer of the convex portion is formed toward the vicinity of the region where the liquid repellent material of the convex portion is applied.

12. The mold processing method according to claim 9, wherein the air flow is nitrogen or air.

13. The mold processing method according to claim 9, wherein the air flow dries the liquid repellent material.

14. The mold processing method according to claim 9, further comprising a third step of removing the protective layer after the second step.

15. A mold in which a liquid repellent layer is partially formed by the mold processing method according to any one of claims 9 to 14, A mold characterized in that the side surface of the convex portion is an R or C surface.

16. A mold in which a liquid repellent layer is partially formed by the mold processing method according to any one of claims 9 to 14, characterized in that it has an undercut along the four sides of the uneven pattern surface.

17. A mold in which a liquid repellent layer is partially formed by the mold processing method according to any one of claims 9 to 14, characterized in that it has a cavity along the four sides of the uneven pattern surface.

18. A mold in which a liquid repellent layer is partially formed by the mold processing method according to any one of claims 9 to 14, characterized in that the convex portion has an inverted taper shape.

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