Semiconductor temperature control garment capable of being heated and cooled

Abstract

To provide a semiconductor temperature control garment capable of being heated and cooled, in which a semiconductor temperature control device is firmly fixed to the garment and can be easily disassembled.SOLUTION: A semiconductor temperature control garment capable of being heated and cooled comprises a garment (1) and at least one semiconductor temperature control device (2) assembled on the garment. The garment has at least one opening (11) for assembling the semiconductor temperature control device. The semiconductor temperature control device has a temperature controller (21), a clamp ring (22) sleeved on the peripheral wall of the temperature controller, and a clamping tooth (23) capable of locking the clamp ring to the temperature controller (21). On the peripheral wall of the temperature controller, an installation part (211) for mounting the clamp ring and a first extension wall (212) at the end thereof are formed. On one side of the clamp ring close to the first extension wall, a second extension wall (221) which is convex outward in the circumferential direction so as to correspond to the first extension wall is formed. The circumference of the opening of the garment is clamped between the first extension wall and the second extension wall.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor temperature control clothing, and particularly to semiconductor temperature control clothing that can be heated and refrigerated.

Background Art

[0002] The temperature of the earth is generally rising. Especially for outdoor workers, the summer heat is inescapable, making the work even more difficult. With the continuous improvement of people's quality of life, more attention is needed for the safety and humanization of outdoor work. "Cold-proof clothes and heating clothes" have become popular, and there are cooling clothes with refrigeration and heat preservation functions. However, since existing refrigeration and heating devices and clothes are integrally fixed, they are troublesome to disassemble and inconvenient to clean, which has been a problem.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0004] The invention described in Patent Document 1 is a mechanism for attaching a Peltier element to clothing. However, it is necessary to fold up the unevenness made of silicon rubber to fit them together, and it is not easy to disassemble, and it is not necessarily user-friendly.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Therefore, the technical problem is to provide a semiconductor temperature control clothing that can be heated and refrigerated, and an object is to provide a semiconductor temperature control device that is firmly fixed to the clothing and can be easily disassembled.

Means for Solving the Problems

[0006] Since the first extension wall and the second extension wall can firmly fix the periphery of the clothing near the opening, the entire semiconductor temperature control device is firmly fixed to the clothing. The fixing ring and the temperature control body can be easily disassembled and assembled by assembling and adjusting the removable connection part. At the same time, due to the setting of the clamp teeth, the clamping force of the assembly adjustment fixing snap ring of the temperature control body is not easily released, and the fixing property of the semiconductor temperature control device to the clothing is further guaranteed.

[0007] The present invention is a semiconductor temperature control clothing that can be heated and cooled, and includes clothing and at least one semiconductor temperature control device assembled to the clothing. The clothing is provided with at least one opening for assembling the semiconductor temperature control device. The semiconductor temperature control device includes a temperature control body, an assembly adjustment fixing clamp ring sleeved on the peripheral wall of the temperature control body, a clamp tooth capable of locking the assembly adjustment fixing clamp ring on the temperature control body, and an installation part for assembling, adjusting, and fixing the clamp ring is formed on the outer peripheral wall of the temperature control body. A circumferential part protruding outward is formed near the end of this installation part to form a first extension wall. Correspondingly, one side of the assembly adjustment fixing clamp ring close to the first extension wall is convex outward in the circumferential direction to form a second extension wall. The periphery of the clothing near the opening can be fixed between the first extension wall and the second extension wall.

[0008] Specifically, when the semiconductor temperature control device is assembled to the clothing, after the mounting part of the temperature control body passes through the opening, the assembly adjustment fixing clamp ring is locked to the temperature control body. At the same time, with the cooperation of the first extension wall and the second extension wall, the semiconductor temperature control device can be fixed to the clothing. That is, the peripheral part of the clothing near the opening is fixed between the first extension wall and the second extension wall.

[0009] When this scheme is adopted, the first extension wall and the second extension wall can firmly fix the periphery of the clothing near the opening and firmly fix the entire semiconductor temperature control device to the clothing. The fixing ring and the temperature control body can be easily disassembled and assembled by assembling and adjusting the detachable connection part. At the same time, by setting the clamp teeth, the clamping force of the assembly adjustment fixing clamp ring of the temperature control body is not easily released, and the fixity of the semiconductor temperature control device to the clothing is further guaranteed.

[0010] Also, in some embodiments, the temperature control body includes a housing and a temperature control assembly assembled in the housing. The assembly adjustment fixing clamp ring is sleeved on the outer peripheral wall of the housing.

[0011] Also, in some embodiments, the temperature control assembly includes a semiconductor cooling sheet, a thermally conductive silica gel pad closely attached to the cooling end of the semiconductor cooling sheet, and a heat sink closely attached to the heating end of the semiconductor cooling sheet.

[0012] Preferably, the semiconductor temperature control device is also connected to a temperature control switch, and the temperature control switch is electrically connected to a lithium battery.

[0013] Specifically, the semiconductor cooling sheet utilizes the Peltier effect of semiconductor materials, allowing a direct current to pass through a galvanic couple formed in series by two different semiconductor materials. Since heat can be absorbed and discharged at both ends of the galvanic couple, the semiconductor cooling sheet forms a cooling end and a heating end. The thermally conductive silica gel pad transmits the temperature of the cooling end of the semiconductor cooling sheet to cool the location where cooling is required. The heat sink transmits the temperature of the heating end of the semiconductor cooling sheet and can play a role in heat dissipation. When cooling is required during use, when a forward current flows, the working surface of the semiconductor cooling sheet is cooled, providing a cooling function to achieve the purpose of cooling the interior of the clothing. When the reverse current is turned on, the working surface of the semiconductor cooling sheet is heated, providing a heating function to achieve the purpose of heating the interior of the clothing. Thus, the semiconductor temperature-controlled clothing that can be heated and cooled has two functions of cooling and heating, is more widely used, and can meet various needs.

[0014] Also, in some embodiments, the temperature control assembly further includes a heat dissipation fan disposed on one side of the heat sink far from the semiconductor cooling sheet, whereby the heat generated by the operation of the semiconductor cooling sheet can be further dissipated.

[0015] Also, in some embodiments, a metal thermally conductive cold pad is provided on one surface of the housing near the thermally conductive silica gel pad, which can transmit the temperature to the outside.

[0016] Also, in some embodiments, an attachment portion is formed on one side of the first extension wall of the outer peripheral wall of the housing (shell), and the operation portion is formed on the other side of the first extension wall for the user to hold.

[0017] In some embodiments, the housing (shell) includes a bottom shell and an upper cover that are detachably connected. The outer peripheral wall of the bottom shell is formed with an operation part, and the outer peripheral wall of the upper cover is formed with an attachment part. Heat dissipation holes are provided in the bottom shell and the upper cover to enhance heat dissipation.

[0018] In some embodiments, the clamping teeth include at least one protrusion close to one side of the temperature control body. Accordingly, at least one recess capable of being aligned with the protrusion is provided on the peripheral wall of the temperature control body.

[0019] The assembly adjustment fixing clamping ring is provided with an opening for the protrusion to pass through, so as to realize locking and unlocking between the protrusion and the recess so that the protrusion can pass through the opening.

[0020] Specifically, through the cooperation between the protrusion and the recess, locking between the clamping teeth and the temperature control body can be realized, and fixing between the assembly adjustment fixing clamping ring and the temperature control body can be realized.

[0021] In some embodiments, the protrusion includes a first fitting surface extending along the longitudinal direction and a second fitting surface obliquely extending along the axial direction, and one end of the first fitting surface and the second fitting surface close to the temperature control body intersect with each other. Correspondingly, the recess includes a first opposing surface facing the first fitting surface and a second opposing surface facing the second fitting surface.

[0022] Specifically, after sandwiching the protrusion into the recess, by opposing the first opposing surface to the first opposing surface and opposing the second opposing surface to the second opposing surface, the axial movement of the protrusion can be restricted, thereby realizing a firm lock between the protrusion and the recess.

[0023] Also, in some embodiments, the clamp teeth are rotatably connected to the assembly adjustment fixing clamp ring via a rotating shaft. The clamp teeth are located at both ends of the rotating shaft and each have a locking end and a free end. The locking end and the free end can perform a rotational movement with respect to the rotating shaft.

[0024] Specifically, three of the above-described convex portions are arranged on one side of the locking end facing the temperature control body and are arranged at equal intervals along the axial direction.

[0025] Preferably, the rotating shaft is fixed to the assembly adjustment fixing clamp ring. The assembly adjustment fixing clamp ring is arranged on both sides of the rotating shaft and is provided with an opening to ensure the normal rotation of the locking end and the free end. One side of the locking end far from the free end protrudes to form a protrusion. Accordingly, a groove capable of restricting the protrusion is provided on the outer wall of the assembly adjustment fixing clamp ring. Next, when the protrusion is fixed to the recess, the convex block pierces into the groove.

[0026] Also, in some embodiments, the free end and the locking end are integrally connected along the circumferential direction of the assembly adjustment fixing clamp ring and can perform a rotational movement around the rotating shaft.

[0027] Specifically, when the clamping teeth rotate around the rotation axis and the locking end moves in a direction close to the temperature control body, when the protrusion of the locking end is clamped in the recess of the temperature control body, the locking end can be locked to the temperature control body, thus realizing a fixed connection between the assembly adjustment fixing clamp ring and the temperature control body, and the semiconductor temperature control device is fixed to the clothes. Also, when the locking end moves in a direction close to the temperature control body, the free end synchronously moves in a direction far away from the temperature control body. Similarly, when pushing the free end to move in a direction close to the temperature adjustment body, the locking end is driven to synchronously move in a direction away from the housing, the protrusion is separated from the recess of the temperature control body, and unlocking between the locking end and the temperature control body is realized, and the assembly adjustment fixing clamp ring is unlocked between the temperature control bodies. Since the temperature control body and the assembly adjustment fixing clamp ring can be separated, the semiconductor temperature control device can be removed from the clothes, enabling the clothes to be cleaned.

[0028] In some embodiments, the elastic member (elastic piece) is disposed between the free end and the assembly adjustment fixing clamp ring, and the elastic member (elastic piece) can always apply a force to move outward to the free end.

[0029] Specifically, after rotating the protrusion of the clamping teeth to the locking end and locking the recess of the temperature control body together, since the elastic member (elastic piece) applies an outward thrust to the free end, the protrusion can be firmly fixed in the depression without falling off. Next, after pushing the free end, the locking end moves far away from the temperature control body, separating the protrusion from the recess to realize unlocking. After releasing the hand, the elastic member (elastic piece) can apply an outward thrust to the free end to realize the tendency of the locking end to move in the direction of the temperature control body.

[0030] In some embodiments, two clamping teeth are included to lock the assembly adjustment and fixing clamp ring on the temperature-controlled body. The free ends of the two clamping teeth are arranged close to each other. The locking end of any one clamping tooth is located at one end of its free end away from the other clamping tooth. The free ends of the two clamping teeth are connected to an elastic member (elastic piece).

[0031] Preferably, four clamping teeth are arranged on the assembly adjustment and fixing clamp ring, and further include two symmetrically arranged elastic members (elastic pieces). Also, for every two of the clamping teeth, one of the elastic members (elastic pieces) is used in combination. It realizes that the assembly adjustment and fixing clamp ring is firmly locked to the temperature-controlled body, and ensures the attachment and fixation of the semiconductor temperature control device to the clothing.

[0032] In some embodiments, the assembly adjustment and fixing clamp ring includes a clamping groove for clamping the elastic member (elastic piece), and the free end includes a connecting portion connected to the elastic member (elastic piece).

[0033] Preferably, the connecting portion is formed on one side of the free end facing the shell. The free ends of the two clamping teeth are provided together with the connecting portion and fixed to the elastic member (elastic piece). Therefore, the clamping teeth are connected on the elastic member and cannot come off.

Advantages of the Invention

[0034] It discloses the design of a heatable and refrigeratable semiconductor temperature control clothing. The present invention discloses the peripheral area near the opening through the cooperation of the first extension wall and the second extension wall, so that the whole semiconductor temperature control device is firmly fixed to the clothing. The fixing ring and the temperature control body can be easily disassembled and assembled by assembling and adjusting the detachable connection part. At the same time, due to the setting of the clamping teeth, the clamping force of the assembly adjustment and fixing clamp ring on the temperature control body is not easily separated, and the fixity of the semiconductor temperature control device to the clothing is further guaranteed.

[0035] In addition, the present invention discloses a thermally conductive silica gel pad, which can transfer the temperature of the cooling end of the semiconductor cooling sheet and cool the places that need cooling. The heat sink can transfer the temperature of the heating end of the semiconductor cooling sheet and play a role in heat dissipation. And when cooling is required during use, when a direct current is passed, the working surface of the semiconductor cooling sheet is cooled, and a cooling function is provided to achieve the purpose of cooling the inside of the clothing. When the reverse current is turned on, the working surface of the semiconductor cooling sheet is heated, providing a heating function to achieve the purpose of heating the inside of the clothing. Thereby, the semiconductor temperature control clothing that can be heated and cooled has two functions of cooling and heating, is more widely used, and can meet various needs.

Brief Description of the Drawings

[0036]

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Embodiments for Carrying Out the Invention

[0037] Specific embodiments of the present invention will be described in more detail below in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0038] In the description of the present embodiment, unless otherwise explicitly specified or limited, the terms "attached", "connected", and "connected" should be interpreted broadly. For example, it should be noted that they may be fixed, removable, or integrally connected. They can be mechanically or electrically connected. This can be either a direct connection or an indirect connection through an intermediate medium, or a communication between two components. For those skilled in the art, the specific meanings of the above terms in the present embodiment can be understood on a case-by-case basis.

[0039] By showing specific examples of the present embodiment below, those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. The present application may also be implemented or applied by different specific embodiments, and the details in this specification can also be modified or changed without departing from the spirit of the present application based on different views and applications. Note that, without contradiction, the features in the following embodiments and embodiments may be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0040] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be clear that the aspects described in this specification can be embodied in a variety of forms, and any specific structure and / or function described in this specification is for illustrative purposes only. Based on the present application, those skilled in the art should recognize that one of the aspects described in this specification can be implemented independently of other aspects, and two or more of these aspects can be combined in various ways. As an example, any of the numerical values and aspects described in this article can be used to implement devices and practices. Further, the device may be implemented and / or carried out using other structures and / or functions other than one or more of the aspects described in this specification.

[0041] Note that the figures shown in the following embodiments only schematically show the basic concept of the present application, and are not diagrammed according to the number, shape, and size of parts during actual implementation. Instead, only the parts related to the present application are shown in the schematic diagram. The type, quantity, and ratio of each part during actual implementation may be freely changed, and the layout type of the parts may become more complex in some cases.

[0042] Furthermore, in the following description, specific details are provided to make the examples easier to understand completely. However, those skilled in the art will understand that these specific details are not necessary for implementation.

[0043] The technical solutions provided by each embodiment of the present application are shown below in conjunction with the accompanying drawings.

[0044] As shown in FIGS. 1 to 18, this embodiment discloses a semiconductor temperature-controlled clothing that can be heated and cooled, comprising a piece of clothing 1 and a plurality of semiconductor temperature control devices 2 assembled to the clothing 1. The clothing 1 is provided with a plurality of openings 11 for assembling the semiconductor temperature control devices 2. The semiconductor temperature control device 2 includes a temperature control body 21, an assembly adjustment fixing clamp ring 22 sleeved on the peripheral wall of the temperature control body 21, a clamp tooth 23 capable of locking the assembly adjustment fixing clamp ring 22 to the temperature control body 21. On the peripheral wall of the temperature control body 21, there is an installation portion 211 for installing the assembly adjustment fixing clamp ring 22, and a first extension wall 212 is formed on a circumferential protrusion near the end of the installation portion 211. Correspondingly, one surface of the assembly adjustment fixing clamp ring 22 close to the first extension wall 212 is convex outward in the circumferential direction, forming a second extension wall 221. The periphery of the clothing 1 near the opening 11 can be sandwiched between the first extension wall 212 and the second extension wall 221. Specifically, when assembling the semiconductor temperature control device 2 to the clothing 1, after the installation portion 211 of the temperature control body 21 passes through the opening 11, the assembly adjustment fixing clamp ring 22 is locked to the temperature control body 21. At the same time, through the cooperation of the first extension wall 212 and the second extension wall 221, the semiconductor temperature control device 2 can be fixed to the clothing 1, that is, the peripheral edge portion of the clothing 1 near the opening 11 can be sandwiched between the first extension wall 212 and the second extension wall 221. By adopting this method, the first extension wall 212 and the second extension wall 221 can firmly fix the periphery of the clothing 1 near the opening 11, and as a result, the entire semiconductor temperature control device 2 is firmly fixed to the clothing 1. Also, due to the assembly of removable connections, the assembly adjustment fixing clamp ring 22 and the temperature control body 21 can be adjusted, so they can be easily disassembled and assembled. At the same time, by setting the clamp tooth 23, the clamping force of the assembly for adjusting the assembly adjustment fixing clamp ring 22 on the temperature control body 21 is made difficult to detach, and the fixing degree of the semiconductor temperature control device 2 to the clothing 1 is further guaranteed.

[0045] In some embodiments, the temperature control body 21 includes a housing 213 and a temperature control assembly 214 assembled to the housing 213; the assembly adjustment fixing clamping ring 22 is sleeved on the peripheral wall of the housing 213 in a sleeve shape. In some embodiments, the temperature control assembly 214 includes a semiconductor cooling sheet 214-1, a thermally conductive silica gel pad 214-2 closely attached to the cooling end of the semiconductor cooling sheet 214-1, and a heat sink 214-3 closely attached to the heating end of the semiconductor cooling sheet 214-1. Preferably, the semiconductor temperature control device 2 is also connected to a temperature control switch 3, and the temperature control switch 3 is electrically connected to a lithium battery 4. Specifically, the semiconductor cooling sheet 214-1 utilizes the Peltier effect of semiconductor materials to pass a direct current through a galvanic couple formed in series by two different semiconductor materials, and can absorb and discharge heat at both ends of the galvanic couple, so the semiconductor cooling sheet forms a cooling end and a heating end. The thermally conductive silica gel pad 214-2 can transfer the temperature of the cooling end of the semiconductor cooling sheet 214-1 and cool the place that needs to be cooled. The heat sink 214-3 can transfer the temperature of the heating end of the semiconductor cooling sheet 214-1 and play a role in heat dissipation. And during use; when cooling is required, when a forward current flows, the working surface of the semiconductor cooling sheet 214-1 is cooled, and a cooling function is provided to achieve the purpose of cooling the clothing 1. When the reverse current is turned on, the working surface of the semiconductor cooling sheet 214-1 is heated, and a heating function is provided to realize the purpose of heating the clothing 1. Next, the clothing 1 equipped with the semiconductor temperature control device 2 has two functions of cooling and heating, is more widely used, and can meet various needs. In some embodiments, the temperature control assembly 214 further includes a cooling fan 214-5 disposed on one side of the heat sink 214-3 far away from the semiconductor cooling sheet 214-1, whereby the heat generated by the operation of the semiconductor cooling sheet 214-1 can be further dissipated. In some embodiments, the metal heat conductive cold conduction sheet 213-4 is disposed on one side of the housing 213 close to the thermally conductive silica gel pad 214-2, whereby the temperature can be transmitted to the outside.

[0046] In some embodiments, on one side of the first extension wall 212, an installation part 211 is formed on the peripheral wall of the housing 213, and on the other side of the first extension wall 212, an operation part 215 is formed for the user to hold. In some embodiments, the housing 213 includes a bottom shell 213-1 and an upper cover 213-2 that are detachably connected. The operation part 215 is formed on the peripheral wall of the bottom shell 213-1, the installation part 211 is formed on the peripheral wall of the upper cover 213-2, and heat dissipation holes 213-3 are provided in the bottom shell 213-1 and the upper cover 213-2 to facilitate heat dissipation.

[0047] In some embodiments, the clamping tooth 23 is provided with a protrusion 231 on one side close to the temperature control body 21. Accordingly, a recess 216 capable of being aligned with the protrusion 231 is provided on the peripheral wall of the temperature control body 21. Further, the assembly adjustment fixing clamping ring 22 is provided with an opening 222 through which the protrusion 231 passes. By enabling the protrusion 231 to pass through the opening 222, locking and unlocking between the protrusion 231 and the recess 216 are realized. Specifically, through the cooperation between the protrusion 231 and the recess 216, locking between the clamping tooth 23 and the temperature control body 21 can be realized, and fixing between the assembly adjustment fixing clamping ring 22 and the temperature control body 21 can be realized. In some embodiments, the protrusion 231 includes a first fitting surface 231-1 extending in the longitudinal direction and a second fitting surface 231-2 extending obliquely along the axial direction. The first fitting surface 231-1 and the second fitting surface 231-2 are close to one end of the temperature control body 21 where they intersect each other. Correspondingly, the recess 216 includes a first opposing surface 216-1 corresponding to the first fitting surface 231-1 and a second opposing surface 216-2 corresponding to the second fitting surface 231-2. Specifically, after sandwiching the protrusion 231 in the recess 216, the first fitting surface 231-1 and the first opposing surface 216-1 are opposed to each other, and the second fitting surface 231-2 and the second opposing surface 216-2 are opposed to each other, so as to restrict the axial movement of the protrusion 231, thereby firmly locking the protrusion 231 and the recess 216. In some embodiments, the clamping tooth 23 is rotatably connected to the assembly adjustment fixing clamping ring 22 via a rotating shaft 223. The clamping tooth 23 is located at both ends of the rotating shaft 223 and is provided with a locking end 232 and a free end 233 respectively. Further, the locking end 232 and the free end 233 can perform a rotational movement with respect to the rotating shaft 223. Specifically, three of the above-mentioned protrusions 231 are arranged toward the temperature control body 21 on one side of the locking end 232 and are arranged at equal intervals along the axial direction. Preferably, the rotating shaft 223 is fixed to the assembly adjustment fixing clamping ring 22. The assembly adjustment fixing clamping ring 22 is located on both sides of the rotating shaft 223, and openings 222 are provided to ensure the normal rotation of the locking end 232 and the free end 233.This locking end 232 has a convex shape on one side away from the free end 233 to form a protrusion 232-1. Correspondingly, a groove 225 capable of restricting the protrusion 232-1 is provided on the outer wall of the assembly adjustment fixing clamp ring 22. When the protrusion 231 is clamped between the recesses 216, the protrusion 232-1 exactly hits the groove 225. In some embodiments, the free end 233 and the locking end 232 are connected along the circumferential direction of the assembly adjustment fixing clamp ring 22 as a whole and can perform a rotational movement around the rotation axis 223. Specifically, when the clamp teeth 23 rotate around the rotation axis 223, the locking end 232 moves in a direction approaching the temperature control body 21. When it is clamped between the recesses 216 on the temperature control body 21, the locking end 232 can be locked to the temperature control body 21, thereby realizing the fixed connection between the assembly adjustment fixing clamp ring 22 and the temperature control body 21. After that, the fixing of the semiconductor temperature control device 2 to the clothing 1 is realized. When the locking end 232 moves in a direction close to the temperature control body 21, the free end 233 synchronously moves in a direction far away from the temperature control body 21. Similarly, when the free end 233 is pressed to move in a direction close to the temperature control body 21, the locking end 232 is driven to synchronously move in a direction away from the housing 213, the protrusion 231 is separated from the recess 216 of the temperature control body 21, and the locking between the locking end 232 and the temperature control body 21 is released, so that the assembly adjustment fixing clamp ring 22 and the temperature control body 21 are unlocked. Since the temperature control body 21 and the assembly adjustment fixing clamp ring 22 can be separated, the semiconductor temperature control device 2 can be removed from the clothing 1 to facilitate cleaning of the clothing 1.

[0048] In some embodiments, the elastic piece 24 is disposed between the free end 233 and the assembly adjustment fixing clamp ring 22, and the elastic piece 24 can always apply a force to move outward to the free end 233. Specifically, after clamping the clamping teeth 23 with the protrusion 231 of its locking end 232 and the recess 216 of the temperature control body 21 integrally, the elastic piece 24 applies an outward thrust to the free end 233 so that the protrusion 231 is firmly clamped in the recess 216 and does not come off. Then, after pushing the free end 233, the locking end 232 moves far away from the temperature control body 21, separating the protrusion 231 from the recess 216 to realize unlocking. After releasing the hand, the elastic piece 24 can apply an outward thrust to the free end 233 so that the locking end 232 can move in the direction of the temperature control body 21. In some embodiments, the two clamping teeth 23 include an assembly adjustment fixing clamp ring 22 on the temperature control body 21 that locks, adjusts, and temperature-controls the assembly. Here, the free ends 233 of the two clamping teeth 23 are arranged close to each other, and the locking end 232 of any clamping tooth 23 is located at one end of its free end 233 that is far away from the other clamping tooth 23. The free ends 233 of the two clamping teeth 23 are connected to the elastic piece 24. Preferably, four clamping teeth 23 are arranged on the assembly adjustment and assembly adjustment fixing clamp ring 22, and further include two symmetrically arranged elastic pieces 24. And for every two clamping teeth 23, one elastic piece 24 is used in combination. It is realized that the assembly adjustment fixing clamp ring 22 is firmly locked to the temperature control body 21 to ensure the installation and fixing stability of the semiconductor temperature control device 2 to the clothing 1. In some embodiments, the assembly, adjustment, fixing, and assembly adjustment fixing clamp ring 22 includes a clamping groove 224 for clamping the elastic piece 24, and the free end 233 includes a connecting portion 233-1 connected to the elastic piece 24. Preferably, the connecting portion 233-1 is formed on one side of the free end 233 facing the housing 213, and the free ends 233 of the two clamping teeth 23 are provided with the connecting portion 233-1, so that the clamping teeth 23 are connected to the elastic piece 24 and fastened to the elastic piece 24 so as not to come off.

[0049] This embodiment discloses the operating principle. The semiconductor temperature control device 2 is attached to the clothing 1, the human body wears the semiconductor temperature control device 2 and is in contact with it, the temperature control switch 3 is supplied with power via the lithium battery 4, the temperature control switch 3 is connected to the semiconductor temperature control device 2 via a wire to supply power, the temperature control switch 3 controls the size of the output voltage, and thus controls the semiconductor cooling effect. The semiconductor temperature control device 2 is equipped with an NTC. When the set temperature is reached, the NTC is fed back to the temperature control switch 3 via a wire to adjust the real-time temperature of the semiconductor temperature control device 2. Since the temperature control switch 3 adjusts the driving voltage required for the semiconductor temperature control device 2, a closed-loop temperature control is formed.

[0050] The same and similar parts among various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments.

[0051] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Modifications or exchanges that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present application shall fall within the protection scope of the present application. Therefore, the protection scope of this application shall follow the protection scope of the claims.

Explanation of Reference Numerals

[0052] 1... Clothing, 11... Opening, 2... Semiconductor temperature control device, 21... Temperature control body, 211... Installation part, 212... First extension wall, 213... Housing (shell), 213-1... Bottom shell, 213-2... Upper cover, 213-3... Heat dissipation hole, 213-4... Metal heat conduction and cold conduction sheet, 214... Temperature control assembly, 214-1... Semiconductor cooling sheet, 214-2... Thermally conductive silica gel pad, 214-3... Heat sink, 214-5... Cooling fan, 215... Operation part, 216... Concave part, 216-1... First opposing surface, 216-2... Second opposing surface, 22… Assembly adjustment fixing clamp ring, 221… Second extension wall, 222… Opening, 223… Rotation axis, 224… Clamp groove, 225… Groove part, 23… Clamp tooth, 231… Protrusion part, 231-1… First fitting surface, 231-2… Second fitting surface, 232… Lock end, 232-1… Protrusion part, 233… Free end, 233-1… Connecting part, 24… Elastic piece, 3… Temperature control switch, 4… Lithium battery.

Claims

1. A solid-state temperature-controlled garment capable of being heated and cooled, comprising a garment (1) and at least one solid-state temperature control device (2) assembled on said garment (1); The garment (1) has at least one opening (11) for assembling the semiconductor temperature control device (2); The semiconductor temperature control device (2) comprises a temperature control body (21), an assembly-adjustable-fixed clamp ring (22) sleeved around the peripheral wall of the temperature control body (21), and clamp teeth (23) capable of locking the assembly-adjustable-fixed clamp ring (22) to the temperature control body (21), The peripheral wall of the temperature control body (21) is formed with a mounting portion (211) for mounting the assembly adjustment fixing clamp ring (22), and a first extension wall (212) is formed at an end of the mounting portion (211); One side of the assembly adjustment fixed clamp ring (22) close to the first extension wall (212) forms a second extension wall (221) that is convex outward in the circumferential direction in correspondence with the first extension wall (212); A semiconductor temperature-controlled garment capable of being heated and cooled, characterized in that the periphery of an opening of the garment (1) is sandwiched between the first extension wall (212) and the second extension wall (221).

2. The temperature control unit (21) has a housing (213) and a temperature control assembly (214) assembled to the housing (213), 2. The heatable and coolable semiconductor temperature-controlled garment according to claim 1, wherein the assembly adjustable fixed clamp ring (22) is sleeved in a sleeve-like manner on the peripheral wall of the housing (213).

3. 3. The heatable and coolable semiconductor temperature controlled garment of claim 2, wherein the temperature control assembly (214) comprises a semiconductor cooling sheet (214-1), a thermally conductive silica gel pad (214-2) closely attached to the refrigerated end of the semiconductor cooling sheet (214-1), a heat sink (214-3) closely attached to the heated end of the semiconductor cooling sheet (214-1), the heat sink (214-3) positioned away from the semiconductor cooling sheet (214-1), and a cooling fan (214-5) on one side of the heatable and coolable semiconductor temperature controlled garment.

4. 4. The heatable and coolable semiconductor temperature-controlled garment according to claim 3, characterized in that a metal heat-conducting and cold-conducting sheet (213-4) is provided on one side of the housing (213) close to the heat-conducting silica gel pad (214-2).

5. The heating and cooling semiconductor temperature-controlled garment according to claim 2, characterized in that the outer peripheral wall of the housing (213) forms the installation portion (211) on one side of a first extension wall (212), and an operating portion (215) is formed on the other side of the first extension wall (212).

6. The heating and cooling semiconductor temperature-controlled garment according to claim 5, characterized in that the housing (213) comprises a detachable connected bottom shell (213-1) and an upper cover (213-2), the operation unit (215) is formed on the outer peripheral wall of the bottom shell (213-1), the installation unit (211) is formed on the outer peripheral wall of the upper cover (213-2), and the bottom shell (213-1) and the upper cover (213-2) are provided with heat dissipation holes (213-3).

7. The heatable and coolable semiconductor temperature-controlled garment according to claim 1, characterized in that the clamp teeth (23) include at least one protrusion (231) on one side adjacent to the temperature control body (21), and the peripheral wall of the temperature control body (21) is provided with at least one recess (216) corresponding to the clamp teeth (23) and capable of matching with the protrusion (231).

8. The heatable and coolable semiconductor temperature-controlled garment according to claim 7, characterized in that the assembly adjustable fixed clamp ring (22) is provided with an opening (222) for the projection (231) to pass through.

9. The heatable and coolable semiconductor temperature-controlled garment according to claim 8, characterized in that the clamp teeth (23) are rotatably connected to the assembly adjustable fixed clamp ring (22) via a rotating shaft (223), the clamp teeth (23) are located at both ends of the rotating shaft (223) and respectively have a lock end (232) and a free end (233), and the lock end (232) and the free end (233) can perform rotational movement relative to the rotating shaft (223).

10. 10. The heatable and coolable semiconductor temperature-controlled garment of claim 9, wherein an elastic piece (24) is disposed between the free end (233) and the assembly adjustment fixed clamp ring (22), and the elastic piece (24) can apply a force to the free end (233) to constantly move it outward.

11. The heatable and coolable semiconductor temperature-controlled garment of claim 10, characterized in that the assembly adjustable fixed clamp ring (22) has a clamp groove (224) for clamping the elastic piece (24), and the free end (233) has a connecting portion (233-1) connected to the elastic piece (24).

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